Teledyne RCP2-1100, HPAC-3300, HPAC-2005 Operation Manual

3 RU Chassis

Solid State Power Amplifier

Operations Manual

Teledyne Paradise Datacom Phone: [phone]
328 Innovation Blvd., Suite 100 Fax: [phone]
State College, PA 16803 USA Web: www.paradisedata.com
Email: [e-mail]

205356 REV T ECO 18284 08/09/2017

Teledyne Paradise Datacom, a division of Teledyne Wireless LLC, is a single source for high power
solid state amplifiers (SSPAs), Low Noise Amplifiers (LNAs), Block Up Converters (BUCs), and Modem
products. Operating out of two primary locations, Witham, United Kingdom, and State College, PA, USA,
Teledyne Paradise Datacom has a more than 20 year history of providing innovative solutions to enable
satellite uplinks, battlefield communications, and cellular backhaul.

Teledyne Paradise Datacom Teledyne Paradise Datacom Ltd.

328 Innovation Blvd., Suite 100 2&3 The Matchyns, London Road, Rivenhall End
State College, PA 16803 USA Witham, Essex CM8 3HA England
[phone] (switchboard) [phone]
[phone] (fax) [phone] (fax)

Information in this document is subject to change without notice. The latest revision of this document
may be downloaded from the company web site: http://www.paradisedata.com.

Use and Disclosure of Data

The items described herein are controlled by the U.S. Government and authorized for export only to the
country of ultimate destination for use by the ultimate consignee or end-user(s) herein identified. They
may not be resold, transferred, or otherwise disposed of, to any other country or to any person other
than the authorized ultimate consignee or end-user(s), either in their original form or after being
incorporated into other items, without first obtaining approval from the U.S. government or as otherwise
authorized by U.S. law and regulations.

Proprietary and Confidential

The information contained in this document is the sole property of Teledyne Paradise Datacom. Any
reproduction in part or as a whole without the written permission of Teledyne Paradise Datacom is
prohibited.

All other company names and product names in this document are property of the respective
companies.

© 2017 Teledyne Paradise Datacom

Printed in the USA

2 205356 REV T 3 RU SSPA Chassis Operations Manual

Table of Contents

Section 1: General Information ............................................................................................. 11

1.0 Introduction ............................................................................................................. 11

1.1 Description .............................................................................................................. 11

1.2 Specifications .......................................................................................................... 12

1.3 Equipment Supplied ................................................................................................ 12

1.4 Inspection ................................................................................................................ 12

1.5 Rack Mounting ........................................................................................................ 12

1.6 Shipment ................................................................................................................. 12

1.7 Safety Considerations ............................................................................................. 12

1.7.1 High Voltage Hazards .............................................................................. 13

1.7.2 High Current Hazards .............................................................................. 13

1.7.3 RF Transmission Hazards ........................................................................ 14

1.7.4 Electrical Discharge Hazards ................................................................... 14

1.7.5 High Potential for Waveguide Arcing ....................................................... 14

1.8 Waveguide Pressurization and Dehydration ........................................................... 15

Section 2: Operation of Stand-Alone Unit ............................................................................ 19

2.0 Introduction ............................................................................................................. 19

2.1 Description of Controls, Indicators and Connectors ................................................ 19

2.1.1 Front Panel Features ............................................................................... 19

2.1.1.1 Fault Condition LEDs................................................................. 19

2.1.1.2 Standby Select Key .................................................................. 19

2.1.1.3 Front Panel Display ................................................................... 20

2.1.1.4 Navigation Keys ........................................................................ 20

2.1.1.5 Main Menu Key ........................................................................ 20

2.1.1.6 Local/Remote Key .................................................................... 20

2.1.1.7 Mute/Unmute Key ..................................................................... 20

2.1.1.8 Input Sample Port (Optional) [N-type (F)] .................................. 20

2.1.1.9 Output Sample Port (N-type (F)) ............................................... 20

2.1.1.10 Removable Fan Assembly ...................................................... 20

2.1.1.11 Removable Power Supply Modules......................................... 21

2.1.1.12 Front Panel Power Switch (Optional) ...................................... 21

2.1.2 Rear Panel Features ................................................................................ 21

2.1.2.1 AC Input Port (J10) [IEC 6100-3300 (F)] ................................... 21

2.1.2.2 DC Input with N+1 External Power Supply (J10) (Option) ......... 22

2.1.2.3 R3 Input Port (J1) [Type N (F)] .................................................. 24

2.1.2.4 RF Output Port (J2) [Band specific] ........................................... 24

2.1.2.5 Switch Port (J3) [6-pin MS-type] ................................................ 24

2.1.2.6 Serial Main (J4) [DB9 (F)] .......................................................... 25

2.1.2.7 Serial Local (J5) [DB9 (M)] ........................................................ 25

2.1.2.8 Program Port (J6) [DB25 (M)] .................................................... 25

2.1.2.9 Parallel I/O (J7) [DB37 (F)] ........................................................ 25

2.1.2.9.1 Hardware Mute (Tx Enable) ........................................ 27

2.1.2.10 Link Port (J8) [DB9 (M)] ........................................................... 27

2.1.2.11 Ethernet Port (J9) [RJ45] ......................................................... 27

2.1.2.12 Removable Fan Assembly ...................................................... 28

3 RU SSPA Chassis Operations Manual 205356 REV T 3

2.2 Menus ..................................................................................................................... 28

2.2.1 System Information Sub-Menu ................................................................. 29

2.2.1.1 Sys Info Page 1 ......................................................................... 30

2.2.1.1.1 Clear Faults Menu ...................................................... 30

2.2.1.2 Sys Info Page 2 ......................................................................... 31

2.2.1.3 Sys Info Page 3 ......................................................................... 31

2.2.1.4 Sys Info Page 4 ......................................................................... 31

2.2.1.5 Sys Info Page 5 ......................................................................... 32

2.2.1.6 Sys Info Page 6 ......................................................................... 32

2.2.1.7 Sys Info Page 7 ......................................................................... 32

2.2.1.8 Sys Info Page 8 ......................................................................... 33

2.2.1.9 Sys Info Page 9 (version 6.00) .................................................. 33

2.2.1.10 Sys Info Page 10 (version 6.00) .............................................. 34

2.2.1.11 IP Info Page 1 .......................................................................... 35

2.2.1.12 IP Info Page 2 .......................................................................... 35

2.2.1.13 IP Info Page 3 .......................................................................... 35

2.2.1.14 IP Info Page 4 .......................................................................... 36

2.2.1.15 Firmware Info Page 1 .............................................................. 36

2.2.1.16 Firmware Info Page 2 (version 4.0) ......................................... 36

2.2.1.17 Firmware Info Pages 3, 4, 5, 6 and 7 (version 4.0) ................. 36

2.2.1.18 Hardware Info Page 8 (version 6.00)....................................... 36

2.2.1.19 HPA Local Time Page 9 (version 6.00) ................................... 36

2.2.1.20 HPA Run Time Page 10 (version 6.00) ................................... 37

2.2.1.21 N+1 Master Info Page 1 .......................................................... 37

2.2.1.21.1 Clear Faults Menu .................................................... 38

2.2.1.22 N+1 Slave Info Page ............................................................... 38

2.2.1.22.1 Clear Faults Menu .................................................... 38

2.2.1.23 N+1 Master Info Page 2 .......................................................... 39

2.2.1.24 N+1 Master Info Page 3 .......................................................... 39

2.2.2 Communication Setup Sub-Menu ............................................................ 40

2.2.2.1 Protocol ..................................................................................... 40

2.2.2.2 Baud Rate ................................................................................. 40

2.2.2.3 System Address ........................................................................ 41

2.2.2.4 Interface .................................................................................... 41

2.2.2.5 IP Setup ..................................................................................... 41

2.2.2.5.1 More (SNMP, IP and Web Settings) ....................................... 42

2.2.2.5.2 More (Traps and Time Settings) ............................................. 43

2.2.2.6 N+1 Control (Floating Master Mode) ......................................... 44

2.2.3 Operation Setup Sub-Menu ..................................................................... 46

2.2.3.1 Info ............................................................................................ 46

2.2.3.2 Buzzer ....................................................................................... 46

2.2.3.3 Mute .......................................................................................... 46

2.2.3.4 Sys. Mode ................................................................................. 46

2.2.3.5 Attenuation ................................................................................ 47

2.2.3.6 RF Units .................................................................................... 47

2.2.4 Fault Monitoring Setup Sub-Menu ........................................................... 48

2.2.4.1 BUC Fault .................................................................................. 48

2.2.4.2 Auxiliary Faults .......................................................................... 48

2.2.4.3 RF Switch Faults ....................................................................... 49

2.2.4.4 Fault Latch ................................................................................. 49

4 205356 REV T 3 RU SSPA Chassis Operations Manual

2.2.4.5 Forward RF / Automatic Level Control ...................................... 49

2.2.4.5.1 Disable ........................................................................ 49

2.2.4.5.2 Low RF ....................................................................... 49

2.2.4.5.3 High RF....................................................................... 50

2.2.4.5.4 ALC On (Automatic Level Control) ............................. 50

2.2.4.5.5 Set Level ..................................................................... 51

2.2.4.5.6 Back ............................................................................ 51

2.2.5 Options Sub-Menu ................................................................................... 52

2.2.5.1 Backup User Settings ................................................................ 52

2.2.5.2 Restore ...................................................................................... 52

2.2.5.3 Lamp Test ................................................................................. 53

2.2.5.4 Password ................................................................................... 53

2.2.5.5 Fan Speed ................................................................................. 53

2.2.5.6 Reset ......................................................................................... 54

2.2.6 Redundancy Sub-Menu ........................................................................... 55

2.2.6.1 Switching ................................................................................... 55

2.2.6.2 Standby Select .......................................................................... 55

2.2.6.3 Standby Mode ........................................................................... 55

2.2.6.4 Status ........................................................................................ 55

2.2.6.5 Priority ....................................................................................... 56

2.2.6.6 N+1 System Operation Parameters .......................................... 56

2.2.6.6.1 N+1 Array Size ........................................................... 56

2.2.6.6.2 N+1 Address ............................................................... 56

2.2.6.6.3 Auto Gain Control ....................................................... 56

2.2.6.6.4 N+1 Info ...................................................................... 57

2.2.6.6.5 Module Eject ............................................................... 58

2.2.6.6.6 Back ............................................................................ 58

2.3 N+1 Operational Basics (Single Unit) ..................................................................... 59

2.4 N+1 Operational Basics (Two or More Units) ......................................................... 59

2.4.1 Selecting the Master Module .................................................................... 59

2.4.2 Controlling System Operation .................................................................. 60

2.4.3 N+1 Addressing ........................................................................................ 61

2.4.4 Adjust System Gain .................................................................................. 61

2.4.5 N+1 Automatic Gain Control Option ......................................................... 61

2.4.6 N+1 RF Power Measurements ................................................................. 62

2.4.7 N+1 Fault Detection ................................................................................. 62

2.5 Reflected Power Option .......................................................................................... 64

2.5.1 Reflected Power Alarm ............................................................................ 64

Section 3: Troubleshooting and Maintenance ..................................................................... 65

3.0 Troubleshooting Faults ........................................................................................... 65

3.0.1 Summary Fault ......................................................................................... 65

3.0.2 Voltage Fault ............................................................................................ 65

3.0.3 Temperature Fault .................................................................................... 65

3.0.4 Current Fault ............................................................................................ 66

3.0.5 Power Supply Fault .................................................................................. 66

3.0.6 Fan Fault .................................................................................................. 66

3.0.7 Low RF Fault ............................................................................................ 67

3.1 Modular SSPA Architecture .................................................................................... 68

3.1.1 Removable Fans (Intake and Exhaust) .................................................... 68

3 RU SSPA Chassis Operations Manual 205356 REV T 5

3.1.1.1 Fan and Heatsink Maintenance ................................................. 69

3.1.2 SSPA Module Removal ............................................................................ 70

3.1.3 Power Supply Module Removal ............................................................... 71

3.1.3.1 External N+1 Redundant Power Supply .................................... 71

3.1.4 Removable Controller Card (Rear Panel) ................................................ 72

3.1.3 Firmware Upgrade Procedure .................................................................. 73

3.1.3.1 Required Hardware ................................................................... 73

3.1.3.2 Required Software ..................................................................... 73

3.1.3.3 Web Upgrade Procedure ........................................................... 74

3.1.3.4 USB Port Upgrade Procedure ................................................... 76

3.2 Changing N+1 Hierarchy ......................................................................................... 77

3.2.1 Changing Hierarchical Order of Slave Units............................................. 77

3.2.2 Exchange N+1 Privileges Between Master and Slave Units .................... 77

3.2.3 Add an SSPA Unit to the System ............................................................. 78

Section 4: Operation of a 1:1 Redundant System .............................................................. 79

4.0 Introduction ............................................................................................................. 79

4.1 Hardware ................................................................................................................ 80

4.1.1 Power Supply ........................................................................................... 81

4.1.2 RF Switch ................................................................................................. 81

4.1.3 Switch Connector ..................................................................................... 81

4.1.4 Link Cable ................................................................................................ 82

4.2 Installation and SSPA configuration ....................................................................... 83

4.2.1 Configuring HPA to Work in 1:1 Redundant Mode (Internal Control) ....... 83

4.2.1.1 Setting SSPA1 to Work in 1:1 Mode .......................................... 83

4.2.1.2 Setting SSPA1 Switching Mode ................................................ 84

4.2.1.3 Setting SSPA1 Unit Status ........................................................ 84

4.2.2 Online / Standby Amplifier Selection ........................................................ 84

4.2.3 Auto Versus Manual Switching Mode ...................................................... 85

4.2.4 Physically Rotating Transfer Switch ......................................................... 85

4.2.5 Switchover Muting .................................................................................... 85

4.2.6 Parallel Port Special Functions ................................................................ 86

Section 5: Operation of a 1:2 Internal Redundant System ................................................ 87

5.0 Introduction ............................................................................................................. 87

5.1 Required Hardware ................................................................................................. 88

5.2 Power Supply .......................................................................................................... 89

5.3 RF Switches ............................................................................................................ 89

5.4 Switch Connector .................................................................................................... 89

5.5 Link Cable ............................................................................................................... 90

5.6 Installation and SSPA Configuration ....................................................................... 92

5.6.1 Installation ................................................................................................ 92

5.6.1.1 Configuring HPA to Work in 1:2 Mode (Internal Control) ........... 92

5.6.1.2 Setting HPA1 Switching Mode................................................... 92

5.6.1.3 Setting HPA1 Unit Status .......................................................... 92

5.6.2 Setting SSPA’s Polarization Priority ......................................................... 93

5.7 Online/Standby Amplifier Selection ......................................................................... 93

5.8 Auto Versus Manual Switching Mode ..................................................................... 94

5.9 Physically Rotating Transfer Switch ........................................................................ 94

5.10 Parallel Port Special Functions ............................................................................. 94

6 205356 REV T 3 RU SSPA Chassis Operations Manual

Section 6: L-Band Operation ................................................................................................. 95

6.0 Block Up Converter Overview ................................................................................. 95

6.1 ZBUC Converter Features ...................................................................................... 97

6.2 ZBUC Converter Theory of Operation .................................................................... 97

6.3 Smart Reference Technology ................................................................................. 98

6.3.1 Specifications for Internal Crystal Reference ........................................... 98

6.4 Typical System Configuration ................................................................................. 99

6.5 IFL Cable Considerations ....................................................................................... 99

Section 7: Remote Control Interface ................................................................................... 101

7.0 Overview ............................................................................................................... 101

7.1 Remote Control - Parallel ..................................................................................... 103

7.1.1 Control Outputs ..................................................................................... 103

7.1.2 Control Inputs ........................................................................................ 103

7.2 Serial Communication Protocol ............................................................................. 104

7.2.1 Header Sub-Packet ................................................................................ 104

7.2.1.1 Frame Sync Word ................................................................... 104

7.2.1.2 Destination Address ................................................................ 104

7.2.1.3 Source Address ....................................................................... 104

7.2.2 Data Packet ............................................................................................ 105

7.2.2.1 Protocol ID ............................................................................... 105

7.2.2.2 Request ID .............................................................................. 105

7.2.2.3 Command ................................................................................ 105

7.2.2.4 Data Tag .................................................................................. 106

7.2.2.5 Error Status / Data Address..................................................... 106

7.2.2.6 Data Length ............................................................................. 107

7.2.2.7 Data Field ................................................................................ 107

7.2.3 Trailer Packet ......................................................................................... 108

7.2.3.1 Frame Check ........................................................................... 108

7.2.4 Timing issues ......................................................................................... 108

7.2.5 Serial Communications Protocol ............................................................ 109

7.3 Access SSPA Subsystem through Packet Wrapper Technique ........................... 115

7.4 Example 1 Check SSPA settings .......................................................................... 116

7.5 Terminal Mode Serial Protocol for Paradise Datacom SSPA ............................... 118

7.6 Ethernet Interface ................................................................................................. 120

7.6.1 IPNet Interface ....................................................................................... 120

7.6.1.1 General Concept ..................................................................... 120

7.6.1.2 Setting IPNet Interface ............................................................ 122

7.6.1.3 Using the Rack Mount Web Interface ...................................... 123

7.6.2 SNMP Interface ...................................................................................... 125

7.6.2.1 Interface .................................................................................. 125

7.6.2.2 SNMP V3 Issues in Teledyne Paradise Datacom SSPAs ....... 125

7.6.2.3 SNMP MIB tree ....................................................................... 128

7.6.2.4 Description of MIB Entities ...................................................... 129

7.6.2.5 Configuring SSPA to Work with SNMP Protocol ..................... 134

7.6.2.6 Connecting to a MIB Browser .................................................. 135

7.6.3 Extended SNMP Operation .................................................................... 137

7.6.3.1 Extended SNMP MIB Tree ...................................................... 138

7.6.3.2 Extended SNMP MIB Tree Elements in Detail ........................ 140

3 RU SSPA Chassis Operations Manual 205356 REV T 7

Appendix A: Ethernet Interface Quick Set-Up ................................................................... 141

Appendix B: Proper 10/100 Base-T Ethernet Cable Wiring .............................................. 145

Appendix C: RM SSPA Control with Paradise Datacom Universal M&C ......................... 149

Appendix D: Automatic Level Control ................................................................................ 153

Appendix E: Documentation ................................................................................................ 155

List of Figures

Figure 1-1: Degradation of Breakdown Power by VSWR ............................................. 17

Figure 2-1: 3RU SSPA Chassis Front Panel ................................................................ 19

Figure 2-2: C-Band SSPA Rear Panel .......................................................................... 21

Figure 2-3: 3RU SSPA Chassis with 1RU N+1 Redundant Power Supply ................... 22

Figure 2-4: Terminal Block ............................................................................................ 23

Figure 2-5: Power Supply Alarm Cable Connection ..................................................... 23

Figure 2-6: Front Panel Menu Structure ....................................................................... 28

Figure 2-7: System Information Menu Structure ........................................................... 29

Figure 2-8: Slave Unit Display ...................................................................................... 38

Figure 2-9: Communication Setup Sub-Menu ............................................................... 40

Figure 2-10: Operation Setup Sub-Menu ...................................................................... 46

Figure 2-11: Fault Monitoring Setup Sub-Menu ............................................................ 48

Figure 2-12: Options Sub-Menu .................................................................................... 52

Figure 2-13: Redundancy Sub-Menu ............................................................................ 55

Figure 2-14: N+1 Info Menu .......................................................................................... 57

Figure 2-15: Front Panel Display, Master Unit (Online Indicator Illuminated) ............... 60

Figure 2-16: Front Panel Display, Slave Unit (Online Indicator Dark) ........................... 60

Figure 3-1: Front Panel Fault Display ........................................................................... 65

Figure 3-2: Unscrew Thumb Screws on Fan Tray and Slide Tray from Chassis .......... 68

Figure 3-3: Unplug Quick Connector ............................................................................ 68

Figure 3-4: Unscrew Four Thumb Screws on Rear Panel Fan Assembly .................... 68

Figure 3-5: Disconnect Power Connector to Remove Fan Tray ................................... 68

Figure 3-6: Example of Dust Blocking Heatsink Fins .................................................... 69

Figure 3-7: Heatsink Fins Cleared of Debris ................................................................. 70

Figure 3-8: Module Placement ...................................................................................... 70

Figure 3-9: Remove Power Supply Module .................................................................. 71

Figure 3-10: Loosen Retaining Thumb Screws ............................................................. 72

Figure 3-11: Remove Card to Access Programming Connectors ................................. 72

Figure 3-12: Web Upgrade Authentication Window ...................................................... 74

Figure 3-13: Firmware Upload Form ............................................................................. 74

Figure 3-14: Proceed With Upgrade Prompt ................................................................. 75

Figure 3-15: Upload Process Message ......................................................................... 75

Figure 3-16: Upload Completed Message .................................................................... 75

Figure 3-17: Windows Device Manager > Ports ........................................................... 76

Figure 3-18: Command Window Showing Program Prompts ....................................... 76

Figure 4-1: Block Diagram, 1:1 Redundant System ...................................................... 79

Figure 4-2: RM SSPA 1:1 Redundant Systems ............................................................ 80

Figure 4-3: Outline Drawing, Switch Connector Cable ................................................. 81

Figure 4-4: Outline Drawing, Link Port Cable ............................................................... 82

Figure 4-5: Cable Connection Between SSPAs and Waveguide Switch ...................... 83

Figure 4-6: “Unit 1” Indicator from Front Panel ............................................................. 84

Figure 5-1: Block Diagram, 1:2 Redundant System ...................................................... 87

Figure 5-2: Outline Drawing, Switch Connector Cable ................................................. 89

8 205356 REV T 3 RU SSPA Chassis Operations Manual

Figure 5-3: Outline Drawing, Link Port Cable ............................................................... 90

Figure 5-4: 1:2 System Wiring Diagram ........................................................................ 91

Figure 5-5: “Unit 1” Indicator from Front Panel ............................................................. 93

Figure 6-1: Configurator, 3RU Rack Mount SSPA, BUC Options ................................. 95

Figure 6-2: Schematic, Optional Block Up Converter ................................................... 96

Figure 6-3: Block Diagram of Block Up Converter / SSPA System............................... 96

Figure 6-4: SSPB Chassis with Evolution Series Modem ............................................ 99

Figure 8-1: Remote Control Interface Stack ............................................................... 101

Figure 7-2: Parallel I/O Form C Relay ........................................................................ 103

Figure 7-3: Basic Communication Packet ................................................................... 104

Figure 7-4: Header Sub-Packet .................................................................................. 104

Figure 7-5: Data Sub-Packet ...................................................................................... 105

Figure 7-6: Trailer Sub-Packet .................................................................................... 108

Figure 7-7: Packet Wrapper Technique ...................................................................... 115

Figure 7-8: Terminal Mode Session Example ............................................................. 119

Figure 7-9: UDP Redirect Frame Example ................................................................. 121

Figure 7-10: Web Interface Login Window .................................................................. 123

Figure 7-11: RM SSPA Web Interface, Status Tab ..................................................... 124

Figure 7-12: GetIF Application Parameters Tab ......................................................... 135

Figure 7-13: Getif MBrowser Window, With Update Data in Output Data Box ........... 135

Figure 7-14: Getif MBrowser Window, Setting settingValue.5 to a Value of ‘1’ .......... 136

Figure A-1: TCP/IP Properties Window ...................................................................... 141

Figure B-1: Modular Plug Crimping Tool ..................................................................... 145

Figure B-2: Transmission Line .................................................................................... 145

Figure B-3: Ethernet Cable Pin-Outs .......................................................................... 147

Figure B-4: Ethernet Wire Color Code Standards ....................................................... 147

Figure B-5: Wiring Using 568A Color Codes .............................................................. 147

Figure B-6: Wiring Using 568A and 568B Color Codes .............................................. 147

Figure C-1: New Rack Mount SSPA Dialog Window .................................................. 149

Figure C-2: SSPA Status Window .............................................................................. 150

Figure C-3: SSPA Faults Window ............................................................................... 150

Figure C-4: SSPA Settings Window ............................................................................ 151

Figure C-5: IP Setup Window ..................................................................................... 151

Figure C-6: N+1 Settings and Conditions Window ...................................................... 152

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List of Tables

Table 1-1: Recommended Output Power Thresholds for Waveguide Pressurization ... 16

Table 1-2: De-rating of Waveguide Components Relative to Straight Waveguide ....... 16

Table 2-1: Switch Port (J3) Pin Outs ............................................................................. 24

Table 2-2: Serial Main (J4) Pin Outs ............................................................................. 25

Table 2-3: Parallel Connector (37 socket D connector) Pin Outs ................................. 26

Table 2-4: Ethernet Port (J9) Pin Outs .......................................................................... 27

Table 4-1: RF Switch Connector Wiring ........................................................................ 81

Table 4-2: Link Port (J8) Pin Outs ................................................................................. 82

Table 4-3: Parallel connector (37 socket D connector), Highlighting 1:1 Functions ..... 86

Table 5-1: RF Switch Connector Wiring ........................................................................ 89

Table 5-2: Link Cable Wiring ......................................................................................... 90

Table 6-1: ZBUC Converter Frequency Bands ............................................................. 97

Table 6-2: ZBUC Converter Local Oscillator Phase Noise ........................................... 97

Table 6-3: Common Coaxial Cable Characteristics ...................................................... 99

Table 8-1: Interfaces Enabled Based on Chosen Interface Setting Selection ............ 102

Table 7-2: Command Byte Values .............................................................................. 105

Table 7-3: Data Tag Byte Values ................................................................................ 106

Table 7-4: Error Status Byte Values ........................................................................... 107

Table 7-5: Request Frame Structure .......................................................................... 108

Table 7-6: Response Frame Structure ........................................................................ 108

Table 7-7: System Setting Details ............................................................................... 109

Table 7-8: System Threshold Addressing Details (Read Only) .................................. 112

Table 7-9: System Conditions Addressing Details ...................................................... 113

Table 7-10: OSI Model for RM SSPA Ethernet IP Interface ....................................... 121

Table 7-11: Detailed SNMP Settings .......................................................................... 130

Table 7-12: Detailed SNMP Thresholds ..................................................................... 132

Table 7-13: Detailed SNMP Conditions ...................................................................... 133

10 205356 REV T 3 RU SSPA Chassis Operations Manual

Section 1: General Information

1.0 Introduction

This section provides the general information for the Teledyne Paradise Datacom
Compact Rack Mount (CRM) Series Solid State Power Amplifier (SSPA) Chassis. This
includes a description of the unit and safety precautions for operation of the unit.

1.1 Description

The Teledyne Paradise Datacom Compact Rack Mount (CRM) Series SSPA Chassis
was specially designed to accommodate applications where rack space is at a
premium. At only 3RU in height and a depth of 24 inches (610 mm) the CRM Series
SSPA Chassis is perfect for use in Satellite News Gathering or flyaway applications.

A rich feature set has been maintained, despite the small size of the chassis. For field
maintainability, this chassis features:

• Front and rear panel removable fan trays

• Front panel removable power supply modules

• Rear panel removable controller card assembly

• Front panel RF output sample port

This chassis includes a wide array of standard interfaces:

• Front Panel Local Interface and Status Indicators

• RS232/RS485 (4-wire) Serial Communication (with either Windows-

based M&C or third-party M&C drivers available)

• Ethernet Port (SNMP, UDP Serial Programming, Web Browser Interface)

• Parallel I/O (Form C Contact Outputs, Opto Isolated Inputs)

Optional interfaces include:

• Remote Control Panel (using the optional 1RU RCP2-1000-RM)

The chassis’ microprocessor monitors various voltages, currents and temperatures
within the unit for a full fault analysis. The user also may select additional faults related
to the RF output level, an optional reflected RF power level and operating temperature.

An internal attenuator allows up to 20.0 dB of attenuation to be applied to the RF
signal. Temperature compensation limits the amplifier’s output response from varying
significantly over the operating temperature. Also, the system contains input and
output sample ports.

3 RU SSPA Chassis Operations Manual 205356 REV T 11

1.2 Specifications

Refer to the specification sheet in Appendix E for complete specifications.

1.3 Equipment Supplied

The following equipment is supplied with each unit:

• SSPA Chassis RM (3 RU high)

• Power Cord

• Rack Slides

• Operations Manual, 3RU Solid State Power Amplifier Chassis [205356]

1.4 Inspection

When the unit is received, an initial inspection should be completed. First ensure that
the shipping container is not damaged. If it is, have a representative from the shipping
company present when the container is opened. Perform a visual inspection of the
equipment to make sure that all items on the packing list are enclosed. If any damage
has occurred or if items are missing, contact:

Teledyne Paradise Datacom LLC
328 Innovation Blvd., Suite 100
State College, PA 16803 USA
Phone: [phone]
Fax: [phone]

1.5 Rack Mounting

The SSPA Chassis is designed to fit in a standard 19” (483 mm) wide EIA rack. The
unit is 3 rack units or 5.22 inches (133 mm) high by 24.13 inches (613 mm) deep.

1.6 Shipment

To protect the SSPA Chassis during shipment, use high quality commercial packing
methods. When possible, use the original shipping container and its materials. Reliable
commercial packing and shipping companies have facilities and materials to adequate­ly repack the instrument.

1.7 Safety Considerations

Potential safety hazards exist unless proper precautions are observed when working
with this unit. To ensure safe operation, the user must follow the information, cautions
and warnings provided in this manual as well as the warning labels placed on the unit
itself.

12 205356 REV T 3 RU SSPA Chassis Operations Manual

1.7.1 High Voltage Hazards

High Voltage, for the purpose of this section, is any voltage in excess of 30V. Voltages
above this value can be hazardous and even lethal under certain circumstances. Care
should be taken when working with devices that operate at high voltage.

• All probes and tools that contact the equipment
should be properly insulated to prevent the operator
from coming in contact with the voltage.

• The work area should be secure and free from non­essential items.

• Operators should never work alone on high voltage
devices. There should always be another person pre­sent in the same work area to assist in the event of
an emergency.

• Operators should be familiar with procedures to employ in the event of an
emergency, i.e., remove all power, CPR, etc.

• An AC powered unit will have 115 VAC or 230 VAC entering through the
AC power connector. Caution is required when working near this con­nector, the AC circuit breaker, or the internal power supply.

1.7.2 High Current Hazards

Many high power devices are capable of producing large
surges of current. This is true at all voltages, but needs to
be emphasized for low voltage devices. Low voltage
devices provide security from high voltage hazards, but also
require higher current to provide the same power. High
current can cause severe injury from burns and explosion.
The following precautions should be taken on devices
capable of discharging high current:

• Remove all conductive personal items (rings, watches, medals, etc.)

• The work area should be secure and free of non-essential items.

• Wear safety glasses and protective clothing.

• Operators should never work alone on high risk devices. There should

always be another person present in the same area to assist in the event
of an emergency.

• Operators should be familiar with procedures to employ in the event of an
emergency, i.e., remove all power, CPR, etc.

Large DC currents are generated to operate the RF Module inside of the enclosure.
Extreme caution is required when the enclosure is open and the amplifier is operating.
Do not touch any of the connections on the RF modules when the amplifier is operat-

ing. Current in excess of 60 Amperes may exist on any one connector.

3 RU SSPA Chassis Operations Manual 205356 REV T 13

1.7.3 RF Transmission Hazards

RF transmissions at high power levels may cause eyesight damage and skin burns.
Prolonged exposure to high levels of RF energy has been linked to a variety of health
issues. Please use the following precautions with high levels of RF power.

• Always terminate the RF input and output connector
prior to applying prime AC input power.

• Never look directly into the RF output waveguide

• Maintain a suitable distance from the source of the

transmission such that the power density is below
recommended guidelines in ANSI/IEEE C95.1. The
power density specified in ANSI/IEEE C95.1-1992 is
10 mW/cm2. These requirements adhere to OSHA
Standard 1910.97.

• When a safe distance is not practical, RF shielding should be used to
achieve the recommended power density levels.

1.7.4 Electrical Discharge Hazards

An electric spark can not only create ESD reliability problems, it can also cause serious
safety hazards. The following precautions should be followed when there is a risk of
electrical discharge:

• Follow all ESD guidelines

• Remove all flammable material and solvents from the

area.

• All probes and tools that contact the equipment
should be properly insulated to prevent electrical dis­charge.

• The work area should be secure and free from non­essential items.

• Operators should never work alone on hazardous equipment. There
should always be another person present in the same work area to assist
in the event of an emergency.

• Operators should be familiar with procedures to employ in the event of an
emergency, i.e., remove all power, CPR, etc.

1.7.5 High Potential for Waveguide Arcing

As with all systems which utilize high power signals within
waveguide, the potential exists for an electric arc to form.
To minimize this risk, Teledyne Paradise Datacom re­quires all waveguide be pressurized and dehydrated.

14 205356 REV T 3 RU SSPA Chassis Operations Manual

1.8 Waveguide Pressurization and Dehydration

When working with high power amplifier systems that operate into waveguide, the in­advertent creation of arcs is always a concern. An arc in waveguide is the air discharge
breakdown due to the ionization of the air molecules by electrons. This breakdown in
waveguide occurs when the rate of electron production becomes greater than the loss
of electrons to diffusion to the surrounding walls.

It is extremely difficult to precisely predict the power levels at which the breakdown oc­curs. It is dependent on a variety of factors but the primary factors are:

• Waveguide temperature and atmospheric pressure

• Components in the Waveguide Transmission System such as: Flanges,

Bends, Tees, Combiners, Filters, Isolators, etc.

• Load VSWR presented to the amplifier.

When operating such a high power amplifier system it is imperative that the waveguide
transmission system be dehydrated and pressurized. Operation with an automatic air
dehydrator will provide dry pressurized air to ensure that condensation cannot form in
the waveguide. Also the higher the pressure that can be maintained in the waveguide;
the higher the power handling is in the waveguide system. Most commonly available
air dehydrators are capable of providing pressures of 0.5 to 7.0 psig (25-362 mmHg).

At low power levels (uniform field distribution), low pressure can give good results. For
non-uniform conditions, highly localized breakdown can occur. In this case the wave­guide system will require much higher pressure. This occurs with bends, waveguide
flange joints. If line currents flow across a small gap introduced by poor tolerances,
flange mismatch, poorly soldered bends, field strengths in excess of that in the main
line can occur in the gap. Pressurization with air or high dielectric gases can increase
the power handling by factors of 10 to 100.

In High Power Amplifier systems an arc will travel from where it is ignited back to the
amplifier. Typical arc travel speed is on the order of 20 ft/sec. Increasing the wave­guide pressure can reduce the speed of arc travel. It is difficult to get an accurate cal­culation of the amount of pressurization needed, but it is a good practice to get as
much pressure as your system can handle. All high power systems that meet the crite-

ria of Table 1-1 are pressure tested at the factory to 1.5 psig. As a guide we recom­mend using the power levels in Table 1-1 as the threshold levels where special atten-

tion should be given to dehydration and the overall simplification of waveguide system
design.

3 RU SSPA Chassis Operations Manual 205356 REV T 15

Table 1-1: Recommended Output Power Thresholds

for Waveguide System Pressurization

Satcom Band Frequency Range Amplifier Output Power Waveguide

S Band 1.7-2.6 GHz > 10 kW WR430

C-Band 5.7 - 6.7 GHz > 2 kW WR137

X-Band 7.9-8.4 GHz > 1kW WR112

Ku-Band 13.75-14.5 GHz > 500W WR75

Ka-Band 27-31 GHz > 100W WR28

It is a common misconception to look up the maximum theoretical power handling of a
particular type of waveguide and assume that this is the maximum power handling.
This may be the case for a straight waveguide tube with ideal terminations but these
values must be significantly de-rated in practical systems. Phase combined amplifier
systems can be particularly sensitive to the potential for waveguide arcing. This is due
to the numerous bends, magic tees, multiple waveguide flange joints, and other wave-

guide components. Table 1-2 shows the power handling capability of some popular

waveguide components normalized to the waveguide power rating. From this table, we
can see how a practical waveguide system’s power handling will de-rate significantly.

Table 1-2: Relative De-rating of Popular Waveguide

Components Relative to Straight Waveguide

Waveguide Component Relative Power Rating

H Plane Bend 0.6 to 0.9

E Plane Bend 0.97

90o Twist 0.8 to 0.9

Magic Tee 0.80

E-Plane Tee 0.06

H-Plane Tee 0.80

Cross Guide Coupler 0.21

Most waveguide systems have many of these components integrated before reaching
the antenna feed. It is not uncommon for a Satcom waveguide network to de-rate to
5% of the straight waveguide power rating.

The load VSWR also has an impact on the breakdown threshold in waveguide net­works. Standing waves degrade the power handling of any transmission line network.

The graph of Figure 1-1 shows the rapid degradation of waveguide breakdown vs.

load VSWR. The chart shows that for a 2.0:1 load VSWR, the breakdown potential will
be half of what it would be with a perfectly matched load. This can degrade even more
when high Q elements such as band pass filters are included in the waveguide net­work.

16 205356 REV T 3 RU SSPA Chassis Operations Manual

DegradationofBreakdownPowerbyVSWR

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20

PowerDegradation Ratio

0.10

0.00

1

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

Load VSWR

Figure 1-1: Degradation of Breakdown Power by VSWR

There are many factors to consider with high power amplifier systems in terms of the
output waveguide network. Especially when using HPA systems with output power

levels of Table 1-1, it is imperative to ensure that the output waveguide network is

pristinely clean and dry. An appropriate dehydrator should be used with capability of
achieving adequate pressure for the system’s output power. Take extra precaution to
make sure that any waveguide flange joints that are not already in place at the factory
are properly cleaned, gasket fitted, and aligned. A properly designed and maintained
waveguide network will ensure that no arcing can be supported and will provide many
years of amplifier service life.

3 RU SSPA Chassis Operations Manual 205356 REV T 17

THIS PAGE LEFT INTENTIONALLY BLANK

18 205356 REV T 3 RU SSPA Chassis Operations Manual

Section 2: Operation of Stand-Alone Unit

2.0 Introduction

This section contains operating information including a description of the front panel
indicators and controls, and I/O connectors and their functions.

2.1 Description of Controls, Indicators and Connectors

2.1.1 Front Panel Features
Figure 2-1 shows an illustration of the front panel view of a standard 3RU Rack Mount

chassis. The front panel features the prime power connection, a removable Monitor &
Control Card Assembly, removable fan assemblies, and the RF input and output ports.

2.1.1.1 Fault Condition LEDs

The RM SSPA has five fault condition LEDs on left side of the front panel which reflect
some of the HPA major faults plus the summary fault state.

2.1.1.2 Standby Select Key

The LED in this key illuminates when an HPA in a redundant system is Online, and
otherwise acts as a power ON indicator for a standalone HPA. Pressing this key will
put the Online HPA in a redundant system into Standby mode. Pressing this key has
no effect on a standalone HPA, and on the Standby HPA in a redundant system.

Fault Condition LEDs

Power Switch
(optional)

PARADISE
DATACOM

HPAC3-250

250W C-BAND

RF INPUT

RF INPUT

SAMPLE

SAMPLE

RF Input Sample Port (optional)

Removable Power Supply

40x2 Display Local/Remote key

Standby Select key

Mute/Unmute key

Removable Fan Assembly

RF Output Sample Port

Main Menu key

Navigation keys

RF OUTPUT

RF OUTPUT

SAMPLE

SAMPLE

Removable Power Supply

(in higher power units)

Figure 2-1: 3RU SSPA Chassis Front Panel

3 RU SSPA Chassis Operations Manual 205356 REV T 19

2.1.1.3 Front Panel Display

The front panel 40x2 character display allows the user to get detailed information
about state of the HPA and provides easy customization of operation through an
interactive menu structure.

2.1.1.4 Navigation Keys

The Up, Down, Left, Right and Enter keys on the right side of the front panel allow the
user to navigate through the menu selections displayed on the front panel display.

2.1.1.5 Main Menu Key

Provides a shortcut to the SSPA main menu.

2.1.1.6 Local/Remote Key

Allows the user to disable or enable the local control keypad console. If the SSPA is in
“Remote Only” mode, the unit will not react on any keystrokes except the “Local/
Remote” key.

2.1.1.7 Mute/Unmute Key

Provides an easy way to change the Mute state of the SSPA. Muting the amplifier via

the front panel requires 100 msec maximum (50 msec minimum). See Section

2.1.2.9.1 for a description of alternative muting methods.

2.1.1.8 Input Sample Port (Optional) [N-type (F)]

An optional RF input sample port is located on the lower left corner of the SSPA front
panel. This provides a -10 dBc coupled sample of the RF input signal. It is a N-type (f)
connector.

2.1.1.9 Output Sample Port (N-type (F))

The Output RF Sample Port connector is located on the right lower corner of the HPA
front Panel. This provides a -40 dBc coupled sample of the RF output signal. A
calibration sticker is located above the N-type (f) connector.

2.1.1.10 Removable Fan Assembly

The front panel fan assembly can be removed for maintenance. See Section 3. The

three-fan assembly operates at 20 VDC.

20 205356 REV T 3 RU SSPA Chassis Operations Manual

2.1.1.11 Removable Power Supply Modules

For units not using the external power supply, and depending on the power level of the
HPA, either one or two removable power supply modules are housed in the chassis.

Each module is a 1200W power supply, which has a single phase universal AC input
ranging from 90-265 VAC, 47-63 Hz and is power factor corrected to 0.99.

2.1.1.12 Front Panel Power Switch (Optional)

The 3RU SSPA Chassis has an optional front panel power switch which allows easy
access. This switch is illuminated when in the ‘on’ position.

2.1.2 Rear Panel Features
Figure 2-2 shows an illustration of the rear panel view of a standard AC input Rack

Mount chassis. The rear panel features the prime power connection, a removable Mon­itor & Control Card Assembly, removable fan assemblies, and the RF input and output
ports.

M&C Card Assembly RF Output RF Input

J1

RF IN

AC IN

MODEL: XXXXXXXXXXXX
S/N: XXXX

RF OUT

J2

J10

P/N: LXXXXXX-X

Ground stud AC Input Power Toggle

Removable Fan Assemblies

Figure 2-2: C-Band SSPA Rear Panel

2.1.2.1 AC Input Port (J10) [IEC 6100-3300 (F)]

The prime power connector, J10, provides universal AC input by using auto-sensing
power supplies. The AC input can operate over a range of 90-265 VAC, at 47 to 63 Hz.
The power supply is also power factor corrected, enabling the unit to achieve a power
factor greater than 0.93. An IEC 6100-3300 (F) connector is used and a connecting
cable is included with the amplifier.

3 RU SSPA Chassis Operations Manual 205356 REV T 21

2.1.2.2 DC Input with N+1 Redundant External Power Supply (J10) (Option)

The combination of a separate +12 VDC output, fully redundant power supply is an
excellent means of obtaining the ultimate system reliability. The power supply is an
N+1 redundant configuration, meaning that a failure of a single power supply module
will not take the amplifier off the air.

In addition, the power supply modules are removable from the front panel while in
operation. There is never a need to remove the power supply from the equipment bay.

Weighing only 9 lbs. (4 kg) and occupying only 1 rack unit of cabinet space, the
redundant power supply chassis is an excellent companion to the SSPA chassis.
Power connection to the SSPA is via quick-snap connectors to the input power
bulkhead at Port J10.

Each power supply has a single phase, universal AC input ranging from 90-265 VAC,
47-63 Hz and is power factor corrected to 0.99. Depending on the power requirements
of the SSPA, the power supply is configured with up to four (4) 1200W hot-swappable
modules, each of which weigh approximately 5 lbs. (2.3 kg).

Figure 2-3 shows a 3RU SSPA chassis with a N+1 Redundant External Power Supply.

Note the blanking panels in place of the power supplies normally integral to the SSPA
chassis.

Figure 2-3: 3RU SSPA Chassis with 1RU N+1 Redundant Power Supply

It should be noted that if a power module is removed from the chassis during normal
operation, it will trigger a power supply fault. The operator must wait 30 seconds before

re-inserting the module or the fault will not clear.

The power supply chassis has a dual feed AC architecture. Power module slots 0 & 1
are supplied via AC Feed 1 and power module slots 2 & 3 are supplied via AC Feed 2.

22 205356 REV T 3 RU SSPA Chassis Operations Manual

The AC connections on the shelf are made via rear accessed

compression style terminal blocks. See Figure 2-4. Connect

the first line/hot to L1, the second line or neutral to L2/N and
the AC ground to GND. These terminal blocks will accept up
to a maximum of 10 AWG wire, and should be torqued to
6 in-lbs.

The power supply is connected to the SSPA via an alarm
cable, part number L205676-1, supplied with the unit. This
cable connects between the Alarm port of the power supply

and the PS M&C Port (J12) of the SSPA. See Figure 2-5.

Figure 2-4:

Terminal block

Each power supply module has an alarm output. For logic reporting purposes, the
alarm outputs for power supply modules 1 and 2 are linked, as are those for power
supply modules 3 and 4. The power supply alarms are monitored by the SSPA Chassis
monitor and control system. This provides local and remote alarm reporting in the
event of a power supply module failure.

J12

PS M&C RF IN

RF OUT

J2

P/N: LXXXXXX-X

S/N: XXXX

MODEL: XXXXXXXXXXXX

+12VDC

IN

J1

Figure 2-5: Power Supply Alarm Cable Connection

The module alarms are open-collector signals with a high impedance state = fault logic
level. Under normal operation, the alarm outputs are in an open collector logic low
state.

The alarm connection from each power supply chassis is parallel connected by
supplied cable L206406-1. This cable also contains a current sharing line between the
two power supply chassis.

3 RU SSPA Chassis Operations Manual 205356 REV T 23

The power supply alarms may be monitored via the SSPA Chassis front panel menu.

See Section 2.2.1.2. In the event that one or more power supply modules enter a fault

condition, the SSPA Chassis will report a major (Summary) fault and will mute until the
fault conditions are cleared.

2.1.2.3 R3 Input Port (J1) [Type N (F)]

The type N female connector on the right side of the rear panel is used as the RF
input.

2.1.2.4 RF Output Port (J2) [Band specific]

L- and S-Band units have a coaxial output using a type N (f) connector. Higher fre­quency units utilize waveguide output flanges.

• C-Band: WR137 with a CPR-137 grooved flange;

• X-Band: WR112 with a CPRG112 grooved flange;

• Ku-Band: WR75 with a circular grooved flange.

Note: Do not operate the amplifier without having a termination or mating

connection on the RF Output Port. RF Hazard warnings apply.

2.1.2.5 Switch Port (J3) [6-pin MS-type]

A 6 pin Molex connector header with blind insertion system guides (mates with Molex
P/N 39-01-2060) is used in a 1:1 Redundancy System to provide switching for the

waveguide transfer switch (RF Switch). Table 2-1 shows the pin outs for the Switch

Port (J3).

Table 2-1: Switch Port (J3) Pin Outs

Pin # Function / Description

1 +28V Switch Drive Output. 3 Amp over current protection.

2 Switch 1 Position 2 drive

3 Switch 1 Position 1 drive

4 +28V Switch Drive Output. 3 Amp over current protection.

5 Switch 2 Position 2 drive

6 Switch 2 Position 1 drive

24 205356 REV T 3 RU SSPA Chassis Operations Manual

2.1.2.6 Serial Main (J4) [DB9 (F)]

A DB9 female connector serves as primary remote control interface connector. The
interface is re-configurable through the front panel or can be used as a RS-232 or
RS-485 interface (2 or 4 wires). The RS-485 TX and RX pairs must be twisted for max­imum transmission distance. A user-configurable 120-ohm termination resistor is pro-

vided on the same connector. Table 2-2 shows the Serial Main (J4) connector pin outs.

Table 2-2: Serial Main (J4) Pin Outs

Pin # Function / Description

1 RS-485 TX+ (HPA Transmit +)
2 RS-485 TX- (HPA Transmit -)/RS-232 TX
3 RS-485 RX- (HPA Receive -)/RS-232 RX
4 RS-485 RX+ (HPA Receive +)
5 GND
6 Service Request 1 Form C relay NC contact (Closed on HPA Summary Fault)
7 Service Request Common Form C relay common contact
8 Service Request 2 Form C relay NO contact (Opened on HPA Summary Fault)
9 120 ohm termination (must be connected to pin 4 to enable termination)

2.1.2.7 Serial Local (J5) [DB9 (M)]

This DB9 male connector is used in advanced system integration and for system
debugging purposes. Leave unconnected unless specified otherwise.

2.1.2.8 Program Port (J6) [DB25 (M)]

A DB25 male connector is used to provide on field flash re-programmability for the
HPA controller card. In order to reload controller board firmware, connect this port to a

PC Parallel port through straight through cable. For a full description, see Section 3,
Troubleshooting and Maintenance.

2.1.2.9 Parallel I/O (J7) [DB37 (F)]

A DB37 female type connector, the Parallel I/O port contains a series of contact
closures for monitoring HPA faults as well as opto-isolated inputs for controlling some
HPA functions. Inputs react on the closure to ground. The minimal closure time is

50mS. See Table 2-3 for a description of the pin-outs for this connector.

3 RU SSPA Chassis Operations Manual 205356 REV T 25

Table 2-3: Parallel Connector (37 socket D connector) Pin Outs

Pin # Function / Description

1 Closed on Power Supply Fault Form C relay NC

2 Open on Power Supply Fault Form C relay NO

20 Power Supply Fault Common

21

22

3 Auxiliary Fault\Auto-Manual Common

4 Open on Mute. Form C Relay NC

5 Closed on Mute. Form C Relay NO

23 Mute Status Common

24 Closed on BUC Fault. Form C Relay NC

25 Open on BUC Fault. Form C Relay NO

6 BUC Fault Common

7 Closed on High Temperature Fault. Form C Relay NC

8 Open on High Temperature Fault. Form C Relay NO

26 High Temperature Fault Common

27

28

9 Regulator Low Voltage Fault\Standby-Online Common

10 Closed on DC Current Low Fault. Form C Relay NC

11 Open on DC Current Low Fault. Form C Relay NO

29 DC Current Low Fault Common

30 Closed on Low Forward RF Fault. Form C Relay NC

31 Open on Low Forward RF Form C Relay NO

12 Low Forward RF Fault Common

16 Auto/Manual toggle input. 50mS Closure to isolated ground to activate

17 Mute/Unmute toggle input. 50mS Closure to isolated ground to activate

18

35 HPA Standby input. 50mS Closure to isolated ground to activate

36 Local/Remote toggle. 50mS Closure to isolated ground to activate

37 Fault clear. 50mS Closure to isolated ground to activate

19 Isolated Signal Ground

15 +5V Isolated Power 20 mA

13, 32 +28V Auxiliary Power 1A

14, 33 Chassis Ground

1. Standalone mode. Closed on Auxiliary Fault

2. 1:1 Redundancy Mode. Closed on Automatic switchover mode. Form C relay NC

1. Standalone Mode. Open on Auxiliary Fault

2. 1:1 Redundancy Mode. Closed on Manual switchover mode. Form C relay NO

1. Standalone mode. Closed on Regulator Low Voltage Fault

2. 1:1 Redundancy Mode. Closed on HPA Standby. Form C relay NC

1. Standalone Mode. Open on Regulator Low Voltage Fault.

2. 1:1 Redundancy Mode. Closed on HPA Online Mode. Form C relay NO

Auxiliary Fault & Auxiliary Mute Input (See Section 2.1.2.9.1). 50 ms min. response

26 205356 REV T 3 RU SSPA Chassis Operations Manual

2.1.2.9.1 Hardware Mute (Tx Enable)

There are three ways to mute the amplifier via hardware input:

1. A 50 ms closure to ground on Port J7, Pin 17 toggles Mute/Unmute states;

2. Press the Main Menu key on the front panel; select 4.Fault Setup and press

the Enter key; select 2.Auxiliary Faults and press the Enter key; select

1.Action and press the Enter key; select 4.Alert+Mute and press the Enter
key; select 4.Fault Setup and press the Enter key; select 2.Auxiliary Faults
and press the Enter key; select 2.Fault Logic and press the Enter key; se­lect 2.Fault on Low and press the Enter key. A continuous closure to
ground on Port J7, Pin 18 will then mute the amplifier. See Section 2.2.4.2;

3. Press the Main Menu key on the front panel; select 4.Fault Setup and press

the Enter key; select 2.Auxiliary Faults and press the Enter key; select

1.Action and press the Enter key; select 4.Alert+Mute and press the Enter
key; select 4.Fault Setup and press the Enter key; select 2.Auxiliary Faults
and press the Enter key; select 2.Fault Logic and press the Enter key; se­lect 2.Fault on High. A continuous open to ground on Port J7, Pin 18 will
mute the amplifier. See Section 2.2.4.2.

2.1.2.10 Link Port (J8) [DB9 (M)]

The 9-pin male connector J8 Link Port is used to link a SSPA with other units in a
redundant system in order to pass online/standby status information between them.

Leave unconnected unless specified otherwise. See Section 4.1.4 and Section 5.5.

2.1.2.11 Ethernet Port (J9) [RJ45]

This is a RJ45 connector with integrated magnetics and LEDs. This port becomes the
primary remote control interface when the Interface is selected to “IPNet” as described

in Section 7.8. This feature allows the user to connect the unit to a 10/100 Base-T net­work and have full-featured M&C functions through a web interface. See Table 2-4.

Table 2-4: Ethernet Port (J9) Pin Outs

Note: IP address, Gateway address, Subnet mask, IP port and IP Lock

address need to be properly selected prior to first use (see Appendix A).

LED lamps on the connector indicate network status. A steady Green light indicates a
valid Ethernet link; a flashing Yellow LED indicates data transfer activity (on either the
Transmit and Receive paths).

3 RU SSPA Chassis Operations Manual 205356 REV T 27

Pin # Function / Description

1 TX+

2 TX-

3 RX+

6 RX-

4,5,7,8 GND

2.1.2.12 Removable Fan Assembly

The rear panel fan assemblies can be removed for maintenance or replacement. See

Section 3, Troubleshooting and Maintenance, for more details. Each of the two rear

fans operate at 24 VDC.

2.2 Menus

Figure 2-6 shows the Front Panel Menu Structure hierarchy. There are six main levels

of menu selections.

1. Sys.Info - System Information menu sublevel (See Section 2.2.1)

2. Com.Setup - Serial Communication related settings (See Section 2.2.2)

3. Operation Setup - System operation related settings (See Section 2.2.3)

4. Fault Monitoring Setup - Fault handling settings (See Section 2.2.4)

5. Options - Backup/restore and password settings (See Section 2.2.5)

6. Redundancy - Switching and standby settings (See Section 2.2.6)

Main Menu

2.Com Setup1.Sys Info 3.Operation 4.F l t. Se tu p 5.Options

To Sys Info Page 1

6.Redundancy

Figure 2-6: Front Panel Menu Structure

The menu tree is accessed by pressing the Main Menu key on the front panel of the
SSPA. Navigation through the menu structure is handled by using the Up Arrow [▲],
Down Arrow [▼], Left Arrow [◄], and Right Arrow [►] keys and the Enter key to

select from the items shown in the front panel display.

For menus where an actual numerical value must be entered, the Up Arrow [▲] and

Down Arrow [▼] keys change the number by factors of 10; the Left Arrow [◄] and
Right Arrow [►] keys change the number in increments of 1.

Note: If the Local/Remote key is toggled so that the Remote LED is

illuminated, the Main Menu key, Arrow keys and Enter key are disabled.
To regain local control, press the Local/Remote key so that the Local

LED is illuminated.

28 205356 REV T 3 RU SSPA Chassis Operations Manual

2.2.1 System Information Sub-Menu
The informative sublevel menu structure contains several pages, shown in Figure 2-7.

Unit operation under system c ontr ol

Enter

1.Clear Faults

2.Back

Enter

N+1 Slave unit system info

N+1 Slave Unit

S

l

a

v

e

U

System Info Menus

Atten.(dB):XX.X FrwrdRF(dBm):XX.X

Alarms:XXXXXX Ref.RF(dBm):XX.X

PS:XXXXXX LowRF:XXXXXX Fan:XXXXXX

AU X:XXXXXX VSWR:XXXXXX BUC: XXXXXX

RFSW1:XXXXXX State:XXXXXX Prior:XXXX
RFSW2:XXXXXX Mute:XXXXXX PolSel:XXXX

Prtcl:XXXXXX Intrfc :XXXXX Buzzer:XXX

Baud:XXXXX Addrs.:XXX Latch:XXX

Main
Menu

n

i

t

s

1.Sys.Info

N+1 Master unit system info

Cabinet Temp(C):XXX N+1Stbys ::XXXXXX
Cabinet Fan:XXXXXX

N+1 Arr.Size:XXX N+1 Alarms:XXXXXX

N+1 Address :XXX N+1 State:XXXXXX

Atten.(dB):XX.X SysRFOut(dBm):XX.X

AutoGain(dB):XX.X Ref.RF(dBm):XX.X

y

l

n

o

t

i

n

U

r

e

t

s

a

M

Enter

1.Clear Faults

2.Back

Non N+ 1 Un its

Main

Menu

IPAddr:XXX.XXX.XXX.XXX MAC:XXXXXXXXXX

CommunityGet:XXXXXXXXXXXXXXXXXXXXX
CommunitySet:XXXXXXXXXXXXXXXXXXXXX

Web Password:XXXXXXXXXXXXXXXXXXXXX

TrapNM SIP: XXX.XXX.XXX.XXX

Main

Menu

Digicore X Version X.XX (XX) Built YYYY.MM.DD

2.Com Setup 5.IPSetup

1.IPInfo

IP Setup Menus

Subnet:XXX.XXX.XXX.XXX Port:XXXXX

Gateway:XXX.XXX.XXX.XXX

LockIP:XXX.XXX.XXX.XXX

3.Operation

SSPA Firmw are Info

Teledyne Paradise Datacom LLC

SSPAID:XXXXXXXXXXXXXXXXXXXX
UserInfo:XXXXXXXXXXXXXXXXXXXX

1.Info

Mode:XXXXXXX Ctrl:XXXXXX Unit:XXXX
Stby:XXXX Switch:XXXXX FSpeed:XXX

PS1(V):XX.X Boost1( V):XX.X DC(A):XX.X
PS2(V):XX.X Boost2(V):XX.X

Regulator:XXXXXX Temperatu r e:XXXXXX
DCCurrent:XXXXXX Temp . ( C) :XXX

Mod1:XXXXX Mod3:XXXXX PreAmp:XXXXX
Mod2:XXXXX Mod4:XXXXX PSModFlts:XXX

Chssy T em p( C) :XXX BUCPS1(V): XX.X
RecordHigh(C):XXX BUC PS2(V):XX.X

MuteFault:XXXXX LastFault:XXXXX
MFaultCause:XXXXX MasterN1IP:XXX

Figure 2-7: System Information Menu Structure

Firmware:XXXXXXXXXX M odul e 1

ID:XXXXXXXXXXXXXXXXXXXXXX

Firmware:XXXXXXXXXX Module2

ID:XXXXXXXXXXXXXXXXXXXXXX

Firmware:XXXXXXXXXX Module3

ID:XXXXXXXXXXXXXXXXXXXXXX

Firmware:XXXXXXXXXX Module4

ID:XXXXXXXXXXXXXXXXXXXXXX

Firmware:XXXXXXXXXX PreAmp

ID:XXXXXXXXXXXXXXXXXXXXXX

PSType:XXX DigicoreID:XXX

I/OBoardID:XXX

Current Date/Time:

YY/MM/DD HH :MM:SS

HPA R u n T im e :

Days:DDDD Hrs:HH Min:MM Sec:SS

3 RU SSPA Chassis Operations Manual 205356 REV T 29

The user can also browse among these pages by navigating the cursor around the

menu fields and pressing the Enter button on the keypad. Note that this function will

not work if the “Fault Latch” option is selected.

In a N+1 configuration, the Master unit default System Information page is as de-

scribed in Section 2.2.1.21; the default page for Slave units is as described in Section

2.2.1.22. In non-N+1 configurations, the default page is as described in Section

2.2.1.1.

2.2.1.1 Sys Info Page 1

This is the HPA main status information page. The page shows:

• Atten.(dB) — HPA attenuation measured in dB, with accuracy of 0.1 dB;

• FrwrdRF(###) — Forward RF Power, measured in either dBm with reso-

lution of 0.1 dBm, or Watts with a resolution of 0.1 Watts, with a 20 dBm
dynamic range from the maximum rated output power;

• Alarms — Will display “FAULT!” if a fault is present on the HPA, or

“None” if no fault is present.

• Ref.RF(###) — Reflected RF Power, measured in either dB with resolu-

tion of 0.1 dBm, or Watts with a resolution of 0.1 Watts. Displays “N/A” if

unavailable. See Section 2.5 for further discussion.

When on this page, pressing the Enter key will open the Clear Faults Menu. The Clear

Faults Menu is also available from the N+1 Master Page 1 and N+1 Slave Info Page.

2.2.1.1.1 Clear Faults Menu

This page allows user to clear latched faults conditions, if the Fault Latch option is ena­bled.

• 1.Clear Faults — When selected, all latched fault conditions are cleared.

Also Master N+1 unit fault history and SNMP trap history will be cleared
when “Clear Faults” function is selected.

• 2.Back — When selected, navigates back to System Info page without

clearing fault state holders.

30 205356 REV T 3 RU SSPA Chassis Operations Manual