TelCom Semiconductor Inc TCM680EPA, TCM680CPA, TCM680EOA, TCM680COA Datasheet

+5V TO ± 10V VOL T AGE CONVERTER

FEATURES

EV ALUATION
KIT
A V AILABLE

GENERAL DESCRIPTION

1
TCM680
2
99% Voltage Conversion Efficiency
85% Power Conversion Efficiency
Only 4 External Capacitors Required
Space Saving 8-Pin SOIC Design

APPLICATIONS

±10V From +5V Logic Supply
±6V From a 3V Lithium Cell
Handheld Instruments
Portable Cellular Phones
LCD Display Bias Generator
Panel Meters
Operational Amplifier Power Supplies

PIN CONFIGURATIONS (DIP AND SOIC)

8 7 6 5
V
C
V
GND
+
V
OUT
+
C
1
V
IN
GND
+
OUT
+
1
IN
V
C
C C
OUT
V
1
1
+
2
2
2
C
C C
OUT
1
+
2
2
TCM680CPA
3
TCM680EPA
4
18 2
TCM680COA
3
TCM680EOA
4
7 6
5
The TCM680 is a dual charge pump voltage converter that develops output voltages of +2VIN and – 2VIN from a single input voltage of +2.0V to +5.5V. Common applica­tions include ±10V from a single +5V logic supply, and ±6V from a +3V lithium battery.
The TCM680 is packaged in a space-saving 8-pin SOIC package and requires only four inexpensive external capacitors. The charge pumps are clocked by an on-board 8kHz oscillator. Low output source impedances (typically 150) provides maximum output currents of 10mA for each output. Typical power conversion efficiency is 85%.
High efficiency, small installed size and low cost make the TCM680 suitable for a wide variety of applications that need both positive and negative power supplies derived from a single input voltage.

ORDERING INFORMATION

Part No. Package Temperature
TCM680COA 8-Pin SOIC 0°C to +70°C TCM680CPA 8-Pin Plastic DIP 0°C to +70°C TCM680EOA 8-Pin SOIC – 40°C to +85°C TCM680EPA 8-Pin Plastic DIP – 40°C to +85°C
TC7660EV Charge Pump Family
Evaluation Kit
3
4
5
6

TYPICAL OPERATING CIRCUIT

+5V
C1
4.7µF
C2
4.7µF
GND
2.0V<V
+
+
C
C
C
C
+
1
1
+
TCM680
2
2
IN
V
IN
GND
< +5.5V
+
V
OUT
V
OUT
TELCOM SEMICONDUCTOR, INC.
4.7µFC4
+
+
V
OUT
V
OUT
4.7µF
C3
+
GND
7
= (2xVIN)
= (– 2 x VIN)
8
TC660-2 9/4/96
4-13
TCM680
C
1
C
1
C
2
C
3
C
2
V
IN
V
IN
V
OUT
V
OUT
V
OUT
GND
GND
TCM680
4.7µF
4.7µF
10µF
C
4
10µF
8
7
6
54
3
2
1
V
OUT
C
2
R
L
R
L
C
1
+
+
+
+
+
+5V TO
±10V VOLT AGE CONVERTER
ABSOLUTE MAXIMUM RATINGS*
V
.....................................................................................................+6.0V
IN +
V
.............................................................................................. +12.0V
OUT
V
.............................................................................................– 12.0V
OUT
V
Short-Circuit Duration ............................Continuous
OUT
+
V
Current ............................................................75mA
OUT
V
dV/dT.............................................................. 1V/µsec
IN
Power Dissipation (TA 70°C)
Plastic DIP ......................................................730mW
Small Outline ..................................................470mW
Storage Temperature ............................– 65°C to +150°C
Lead Temperature (Soldering, 10 sec) .................+300°C
*Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or other conditions above those indicated in the operation section of the specification is not implied. Exposure to the Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
ELECTRICAL CHARACTERISTICS: V
= +5V, TA = +25°C, test circuit Figure 1, unless otherwise indicated.
IN
Symbol Parameter Test Conditions Min Typ Max Unit
Supply Voltage Range MIN. TA MAX., RL = 2k 2.0 1.5 to 5.5 5.5 V Supply Current VIN = 3V, RL = 0.5 1 mA
= 5V, RL = —1 2
V
IN
V
= 5V, 0°C TA +70°C, RL = 2.5
IN
VIN = 5V, – 40°C TA +85°C, RL = ——3
Negative Charge Pump Output I Source Resistance I
= 10mA, I
L
= 5mA, I
L
= 10mA, I
I
L
0°C T – 40°C TA +85°C 250
Positive Charge Pump Output I Source Resistance I
+
= 10mA, I
L
+
= 5mA, I
L
+
I
= 10mA, I
L
0°C T – 40°C TA +85°C 250
F
OSC
P
EFF
V
OUT EFF
TelCom Semiconductor reserves the right to make changes in the circuitry or specifications detailed in this manual at any time without notice. Minimums and maximums are guaranteed. All other specifications are intended as guidelines only. TelCom Semiconductor assumes no responsibility for the use of any circuits described herein and makes no representations that they are free from patent infringement.
Oscillator Frequency 21 kHz Power Efficiency RL = 2k —85—%
V
+ OUT
OUT
Voltage Conversion Efficiency V
+
= 0mA, VIN = 5V 140 180
L
+
= 0mA, VIN = 2.8V 180 250
L
+
= 0mA, VIN = 5V:
L
+70°C 220
A
= 0mA, VIN = 5V 140 180
L
= 0mA, VIN = 2.8V 180 250
L
= 0mA, VIN = 5V:
L
+70°C 220
A
, RL = 97 99 %
, RL = 97 99

PIN DESCRIPTION

8-Pin DIP/SOIC
1C 2C 3C 4V 5 GND Input. Device ground. 6VINInput. Power supply voltage. 7C 8V
4-14
Symbol Description
1
+
2
2
OUT
+
1 + OUT
Input. Capacitor C1 negative terminal. Input. Capacitor C2 positive terminal. Input. Capacitor C2 negative terminal. Output. Negative output voltage (–2VIN).
Input. Capacitor C1 positive terminal. Output. Positive output voltage (+2VIN)
Figure 1. Test Circuit
TELCOM SEMICONDUCTOR, INC.
+5V TO
±10V VOLT AGE CONVERTER
1
TCM680
DETAILED DESCRIPTION Phase 1
VSS charge storage – The positive side of capacitors C and C2 are connected to +5V at the start of this phase. C then switched to ground and the charge in C to C
. Since C
2
+
is connected to +5V, the voltage potential
2
is transferred
1
across capacitor C2 is now 10V.
V
= +5V
IN
C
4
+
V
SW1
+
C
1
SW2
–5V
Figure 2. Charge Pump – Phase 1
SW3
+
C
2
SW4
DD
V
SS
C
3
+
+
is
1

Phase 2

VSS transfer – Phase two of the clock connects the negative terminal of C2 to the VSS storage capacitor C3 and the positive terminal of C2 to ground, transferring the gener­ated –10V to C3. Simultaneously, the positive side of capaci­tor C1 is switched to +5V and the negative side is connected to ground.
V
= +5V
IN
C
4
+
V
1
SW1
+
C
1
SW2
–5V
Figure 4. Charge Pump – Phase 3
SW3
+
C
2
SW4
DD
V
SS
C
3
+

Phase 4

VDD transfer – The fourth phase of the clock connects the negative terminal of C2 to ground, and transfers the generated 10V across C2 to C4, the VDD storage capacitor. Again, simultaneously with this, the positive side of capaci­tor C1 is switched to +5V and the negative side is connected to ground, and the cycle begins again.
+5V
C
4
SW1 SW3
+
C
1
SW4SW2
+
+
C
2
–10V
V V
C
3
+
2
3
4
DD SS
5
+5V
C
4
SW1 SW3
+
C
Figure 3. Charge Pump – Phase 2
+
C
1
2
SW4SW2
–10V
+
V
DD
V
SS
C
3
+

Phase 3

VDD charge storage – The third phase of the clock is identical to the first phase – the charge transferred in C produces –5V in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C voltage potential across C2 is 10V.
TELCOM SEMICONDUCTOR, INC.
+
is at +5V, the
2
Figure 5. Charge Pump – Phase 4

MAXIMUM OPERATING LIMITS

The TCM680 has on-chip zener diodes that clamp V
to 5.8V, V
+
to 11.6V, and V
OUT
the maximum supply voltage or excessive current will be shunted by these diodes, potentially damaging the chip. The TCM680 will operate over the entire operating temperature range with an input voltage of 2V to 5.5V.
1
to –11.6V. Never exceed
OUT
6
IN
7
8
4-15
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