Datasheet TC428EOA, TC428CPA, TC428COA, TC427MJA, TC427IJA Datasheet (TelCom Semiconductor)

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1.5A DUAL HIGH-SPEED POWER MOSFET DRIVERS
TC426
1
TC427 TC428

FEATURES

High-Speed Switching (CL = 1000pF)...........30nsec
High Peak Output Current................................. 1.5A
High Output Voltage Swing .................. V
Low Input Current (Logic "0" or "1") ................ 1µA
TTL/CMOS Input Compatible
Available in Inverting and Noninverting
Configurations
Wide Operating Supply Voltage ............4.5V to 18V
Current Consumption
— Inputs Low .................................................. 0.4mA
— Inputs High .................................................... 8mA
Single Supply Operation
Low Output Impedance ........................................ 6
Pinout Equivalent of DS0026 and MMH0026
Latch-Up Resistant: Withstands > 500mA
Reverse Current
ESD Protected......................................................2kV

PIN CONFIGURATIONS (DIP and SOIC)

NC
IN A
NC
NC
TC426
TC427
TC428
GND
IN B
IN A
GND
IN B
IN A
GND
IN B
NC = NO INTERNAL CONNECTION
8
NC OUT A
7
V
6 5
OUT B
8
NC OUT A
7
V
6 5
OUT B
8
NC OUT A
7
V
6 5
OUT B
DD
DD
DD
2, 4 7, 5
INVERTING
2, 4 7, 5
NONINVERTING
27
45
COMPLEMENTARY

FUNCTIONAL BLOCK DIAGRAM

+
V
TC426
500µA
2.5mA
INPUT
Note: The TC428 has one inverting and one noninverting
driver. Ground any unused driver input.
TC427 TC428
NONINVERTING
OUTPUT
TELCOM SEMICONDUCTOR, INC.
– 25mV
DD
GND + 25mV
INVERTING
OUTPUT
(TC426)(TC427)

GENERAL DESCRIPTION

The TC426/TC427/TC428 are dual CMOS high-speed drivers. A TTL/CMOS input voltage level is translated into a rail-to-rail output voltage level swing. The CMOS output is within 25 mV of ground or positive supply.
The low impedance, high-current driver outputs swing a 1000pF load 18V in 30nsec. The unique current and voltage drive qualities make the TC426/TC427/TC428 ideal power MOSFET drivers, line drivers, and DC-to-DC converter building blocks.
Input logic signals may equal the power supply volt­age. Input current is a low 1µA, making direct interface to CMOS/bipolar switch-mode power supply control ICs pos­sible, as well as open-collector analog comparators.
Quiescent power supply current is 8mA maximum. The TC426 requires 1/5 the current of the pin-compatible bipo­lar DS0026 device. This is important in DC-to-DC con­verter applications with power efficiency constraints and high-frequency switch-mode power supply applications. Qui­escent current is typically 6mA when driving a 1000pF load 18V at 100kHz.
The inverting TC426 driver is pin-compatible with the bipolar DS0026 and MMH0026 devices. The TC427 is noninverting; the TC428 contains an inverting and non­inverting driver.
Other pin compatible driver families are the TC1426/ 27/28, TC4426/27/28, and TC4426A/27A/28A.

ORDERING INFORMATION

Temperature
Part No. Package Configuration Range
TC426COA 8-Pin SOIC Inverting 0°C to +70°C TC426CPA 8-Pin PDIP Inverting 0°C to +70°C TC426EOA 8-Pin SOIC Inverting –40°C to +85°C TC426EPA 8-Pin SOIC Complementary –40°C to +85°C TC426IJA 8-Pin CerDIP Inverting –25°C to +85°C TC426MJA 8-Pin CerDIP Inverting –55°C to +125°C TC427COA 8-Pin SOIC Noninverting 0°C to +70°C TC427CPA 8-Pin PDIP Noninverting 0°C to +70°C TC427EOA 8-Pin SOIC Noninverting –40°C to +85°C TC427EPA 8-Pin SOIC Complementary –40°C to +85°C TC427IJA 8-Pin CerDIP Noninverting –25°C to +85°C TC427MJA 8-Pin CerDIP Noninverting –55°C to +125°C TC428COA 8-Pin SOIC Complementary 0°C to +70°C TC428CPA 8-Pin PDIP Complementary 0°C to +70°C TC428EOA 8-Pin SOIC Complementary –40°C to +85°C TC428EPA 8-Pin SOIC Complementary –40°C to +85°C TC428IJA 8-Pin CerDIP Complementary –25°C to +85°C TC428MJA 8-Pin CerDIP Complementary –55°C to +125°C
TC426/7/8-7 10/11/96
4-169
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3
4
5
6
7
8
TC426 TC427 TC428
1.5A DUAL HIGH-SPEED
POWER MOSFET DRIVERS

ABSOLUTE MAXIMUM RATINGS*

Supply Voltage ......................................................... +20V
Input Voltage, Any Terminal.... V
Power Dissipation (TA 70°C)
Plastic ...............................................................730mW
CerDIP ..............................................................800mW
SOIC .................................................................470mW
Derating Factor
Plastic ............................................................. 8mW/°C
ELECTRICAL CHARACTERISTICS: T
+ 0.3V to GND – 0.3V
DD
= +25°C with 4.5V V
A
CerDIP ......................................................... 6.4mW/°C
SOIC ............................................................... 4mW/°C
Operating Temperature Range
C Version .................................................0°C to +70°C
I Version..............................................– 25°C to +85°C
E Version ............................................ – 40°C to +85°C
M Version..........................................– 55°C to +125°C
Maximum Chip Temperature.................................+150°C
Storage Temperature Range ................– 65°C to +150°C
Lead Temperature (Soldering, 10 sec) .................+300°C
18V, unless otherwise specified.
DD
Symbol Parameter Test Conditions Min Typ Max Unit
Input
V
IH
V
IL
I
IN
Logic 1, High Input Voltage 2.4 V Logic 0, Low Input Voltage 0.8 V Input Current 0V VIN V
DD
–1 1 µA
Output
V
OH
V
OL
R
OH
R
OL
I
PK
High Output Voltage V
– 0.025 V
DD
Low Output Voltage 0.025 V High Output Resistance I Low Output Resistance I
= 10 mA, VDD = 18V 10 15
OUT
= 10 mA, VDD = 18V 6 10
OUT
Peak Output Current 1.5 A
Switching Time (Note 1)
t
R
t
F
t
D1
t
D2
Rise Time Test Figure 1/2 30 nsec Fall Time Test Figure 1/2 30 nsec Delay Time Test Figure 1/2 50 nsec Delay Time Test Figure 1/2 75 nsec
Power Supply
I
S
Power Supply Current VIN = 3V (Both Inputs) 8 mA
VIN = 0V (Both Inputs) 0.4 mA
ELECTRICAL CHARACTERISTICS:
Input
V
IH
V
IL
I
IN
Output
V
OH
V
OL
R
OH
R
OL
Switching Time (Note 1) t
R
t
F
t
D1
t
D2
Power Supply
I
S
NOTE: 1. Switching times guaranteed by design.
4-170
Logic 1, High Input Voltage 2.4 V Logic 0, Low Input Voltage 0.8 V Input Current 0V VIN V
High Output Voltage V Low Output Voltage 0.025 V High Output Resistance I Low Output Resistance I
Rise Time Test Figure 1/2 60 nsec Fall Time Test Figure 1/2 30 nsec Delay Time Test Figure 1/2 75 nsec Delay Time Test Figure 1/2 120 nsec
Power Supply Current VIN = 3V (Both Inputs) 12 mA
Over Operating Temperature Range with 4.5V V
DD
= 10 mA, VDD = 18V 13 20
OUT
= 10 mA, VDD = 18V 8 15
OUT
–10 10 µA
– 0.025 V
DD
18V, unless otherwise specified.
DD
VIN = 0V (Both Inputs) 0.6 mA
TELCOM SEMICONDUCTOR, INC.
1.5A DUAL HIGH-SPEED POWER MOSFET DRIVERS
1
TC426 TC427 TC428
*Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under "Absolute Maximum Ratings" may cause perma­nent damage to the device. These are stress ratings only, and functional

SUPPLY BYPASSING

Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 1000-pF load to18V in 25nsec requires an 0.72A current from the device power supply.
To guarantee low supply impedance over a wide fre­quency range, a parallel capacitor combination is recom­mended for supply bypassing. Low-inductance ceramic disk capacitors with short lead lengths (< 0.5 in.) should be used. A 1 µF film capacitor in parallel with one or two
0.1 µF ceramic disk capacitors normally provides adequate bypassing.

GROUNDING

The TC426 and TC428 contain inverting drivers. Ground potential drops developed in common ground impedances from input to output will appear as negative feedback and degrade switching speed characteristics.
Individual ground returns for the input and output circuits or a ground plane should be used.
operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may effect device reliability.
The TC426/427/428 CMOS drivers have greatly re­duced quiescent DC power consumption. Maximum quies­cent current is 8 mA compared to the DS0026 40 mA specification. For a 15V supply, power dissipation is typi­cally 40 mW.
Two other power dissipation components are:
• Output stage AC and DC load power.
• Transition state power.
Output stage power is:
Po = PDC + PAC
= Vo (IDC) + f CL V
Where:
Vo = DC output voltage
IDC = DC output load current
f = Switching frequency
Vs = Supply voltage
S
2
3
4

INPUT STAGE

The input voltage level changes the no-load or quies­cent supply current. The N-channel MOSFET input stage transistor drives a 2.5mA current source load. With a logic "1" input, the maximum quiescent supply current is 8 mA. Logic "0" input level signals reduce quiescent current to
0.4 mA maximum. Minimum power dissipation occurs for logic "0" inputs for the TC426/427/428. Unused driver inputs must be connected to VDD or GND.
The drivers are designed with 100 mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresh­olds are approximately 1.5V, making the device TTL com­patible over the 4.5V to 18V supply operating range. Input current is less than 1 µA over this range.
The TC426/427/428 may be directly driven by the TL494, SG1526/1527, SG1524, SE5560, and similar switch­mode power supply integrated circuits.

POWER DISSIPATION

The supply current vs frequency and supply current vs capacitive load characteristic curves will aid in determining power dissipation calculations.
In power MOSFET drive applications the PDC term is negligible. MOSFET power transistors are high imped­ance, capacitive input devices. In applications where resis­tive loads or relays are driven, the PDC component will normally dominate.
The magnitude of PAC is readily estimated for several cases:
A. B.
1. f = 20kHZ 1. f = 200kHz
2. CL=1000pf 2. CL=1000pf
3. Vs = 18V 3. VS =15V
4. PAC= 65mW 4. PAC= 45mW
During output level state changes, a current surge will flow through the series connected N and P channel output MOSFETS as one device is turning "ON" while the other is turning "OFF". The current spike flows only during output transitions. The input levels should not be maintained be­tween the logic "0" and logic "1" levels. Unused driver
inputs must be tied to ground and not be allowed to float. Average power dissipation will be reduced by mini-
mizing input rise times. As shown in the characteristic curves, average supply current is frequency dependent.
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6
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TELCOM SEMICONDUCTOR, INC.
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4-171
TC426 TC427 TC428

TYPICAL CHARACTERISTICS

Rise and Fall Times vs
70
60
50
40
30
TIME (nsec)
20
10
0
100
90
80
70
60
50
DELAY TIME (nsec)
40
30
–25 50 100 150
30
20
10
SUPPLY CURRENT (mA)
Supply Voltage
C
= 1000pF
L
T
= +25
°C
A
5
10 15 20
SUPPLY VOLTAGE (V)
Delay Times vs Temperature
C
= 1000pF
L
V
= 18V
DD
25 75 125
0
TEMPERATURE (°C)
t
D2
t
D1
Supply Current vs Frequency
T
= +25
A
C
L
°C
= 1000pF
V
= 18V
DD
10V
t
R
t
F
5V
Delay Times vs Supply Voltage
90
80
70
60
50
40
DELAY TIME (nsec)
30
0
5101520
SUPPLY VOLTAGE (V)
Supply Current vs
Capacitive Load
80
T
= +25°C
A
70
V
= 18V
DD
60 50 40
30 20
SUPPLY CURRENT (mA)
10
0
10
100 1000 10K
CAPACITIVE LOAD (pF)
200kHz
High Output vs Voltage
2.20 T
= +25
°C
A
1.76
1.32
0.88
DD OUT
V – V (V)

0.44
C
L
T
= +25
A
V
DD
= 1000pF
°C
t
D2
t
D1
400kHz
20kHz
= 8V
13V
18V
1.5A DUAL HIGH-SPEED
POWER MOSFET DRIVERS
Rise and Fall Times vs
Temperature
40
C
= 1000 pF
L
V
= 18V
35
DD
30
25
20
TIME (nsec)
15
10
0
–25 0 25 150
Rise and Fall Times vs
1K
T
= +25°C
A
V
DD
100
10
TIME (nsec)
1
10
Low Output vs Voltage
1.20 T
= +25
A
0.96
0.72
0.48
OUTPUT VOLTAGE (V)
0.24
50 75 100 125
TEMPERATURE (
°C)
Capacitive Load
= 18V
100
CAPACITIVE LOAD (pF)
°C
1000 10K
V
= 5V
DD
15V
t
t
10V
R
F
t
R
t
F
4-172
0
1
10 100 1000
FREQUENCY (kHz)
Supply Voltage vs
Quiescent Supply Current
20
NO LOAD BOTH INPUTS LOGIC "1" T = +25°C
A
15
10
5
SUPPLY VOLTAGE (V)
0
123456
SUPPLY CURRENT (mA)
10
0
20 30 40 50 60 708090 100
CURRENT SOURCED (mA)
Supply Voltage vs
Quiescent Supply Current
20
NO LOAD BOTH INPUTS LOGIC "0" T = +25°C
A
15
10
5
SUPPLY VOLTAGE (V)
0
0
50 100 150 200 250 300
SUPPLY CURRENT (µA)
10
0
20 30 40 50 60 70 80 90 100
CURRENT SUNK (mA)
1600
1400
1200
1000
800
600
MAX. POWER (mW)
400 200
0
0
8 Pin CerDIP
8 Pin SOIC
10 20
Thermal Derating Curves
8 Pin DIP
30 40
50 60
AMBIENT TEMPERATURE (°C)
70
80 90 100 110 120
TELCOM SEMICONDUCTOR, INC.
1.5A DUAL HIGH-SPEED POWER MOSFET DRIVERS
V
= 18V
DD
1
TC426 TC427 TC428
= 18V
V
DD
1µF
INPUT
INPUT: 100kHz,
square wave,
t
RISE
OUTPUT
Test Figure 1. Inverting Driver Switching Time Test Circuit Test Figure 2. Noninverting Driver Switching Time Test Circuit
= tF
ALL
+5V
INPUT
0V
18V
0V
10nsec
10%
(1/2 TC428)
t
D1
90%
10%
1
2
TC426
t
F
µF
0.1
OUTPUT
C = 1000pF
L
90%
t
D2
t
R
10%
90%
INPUT: 100kHz,
square wave,
t
= tF
RISE
+5V
INPUT
0V
18V
OUTPUT
0V
ALL
INPUT
10nsec
10%
TC427
(1/2 TC428)
90%
t
D1
1
2
10%
1µF
t
R
0.1
µF
OUTPUT
C = 1000pF
L
90%
t
D2
10%

VOLTAGE DOUBLER

0.1µF
f = 10kHz
IN
2
+ 15V
1/2
TC426
+
4.7µF
6
7
3
10µF
+
1N4001
1N4001
V
OUT
+
47µF
30.
29.
28.
27.
26.
OUT
25.
V (V)
24.
23.
22.
0
10 20 30 40 50 60 70 80 90
I (mA)
OUT
90%
100
2
3
4
t
F
5
6

VOLTAGE INVERTER

+ 15V
+–
0.1µF 4.7µF
6
2
1/2
TC426
f = 10kHz
IN
TELCOM SEMICONDUCTOR, INC.
7
3
+–
10µF
1N4001
1N4001
-5
-6
-7
-8
-9
OUT
-10
V (V)
V
OUT
47µF
+
-11
-12
-13
-14
10 20 30 40 50 60 70 80 90
0
I (mA)
OUT
100
4-173
7
8
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