TelCom Semiconductor Inc TC1411NCPA, TC1411NCOA, TC1411EPA, TC1411EOA, TC1411CPA Datasheet

...
1A HIGH-SPEED MOSFET DRIVERS
1
TC1411
TC1411N

FEATURES

Latch-Up Protected: Will Withstand 500mA
Reverse Current
Input Will Withstand Negative Inputs Up to 5V
ESD Protected....................................................4 kV
High Peak Output Current .................................. 1A
Wide Operating Range ..........................4.5V to 16V
High Capacitive Load
Drive Capability .......................... 1000pF in 25nsec
Short Delay Time .................................. 30nsec Typ
Consistent Delay Times With Changes in
Supply Voltage
Matched Delay Times
Low Supply Current
— With Logic “1” Input ................................. 500µA
— With Logic “0” Input ................................. 150µA
Low Output Impedance ....................................... 8
Pinout Same as TC1410/12/13

PIN CONFIGURATIONS

V
DD
IN
NC
GND
1 2
TC1411
3 4
2 6, 7
INVERTING
8
V
DD
OUT
7 6
OUT
5
GND
NC = NO INTERNAL CONNECTION
NOTE: SOIC pinout is identical to DIP.

FUNCTIONAL BLOCK DIAGRAM

V
NC
GND
1
DD
2
IN
3 4
TC1411N
2 6, 7
NONINVERTING
8
V
DD
OUT
7 6
OUT
5
GND

GENERAL DESCRIPTION

The TC1411/1411N are 1A CMOS buffer/drivers. They will not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge.
As MOSFET drivers, the TC1411/1411N can easily switch 1000 pF gate capacitance in 25nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET’s intended state will not be affected, even by large transients. The rise and fall time edges are matched to allow driving short-duration inputs with greater accuracy.
Part No. Package Temp. Range
TC1411COA 8-Pin SOIC 0°C to +70°C TC1411CPA 8-Pin Plastic DIP 0°C to +70°C TC1411EOA 8-Pin SOIC – 40°C to +85°C TC1411EPA 8-Pin Plastic DIP – 40°C to +85°C
TC1411NCOA 8-Pin SOIC 0°C to +70°C TC1411NCPA 8-Pin Plastic DIP 0°C to +70°C TC1411NEOA 8-Pin SOIC – 40°C to +85°C TC1411NEPA 8-Pin Plastic DIP – 40°C to +85°C
V
TC1411
INVERTING
OUTPUTS
DD
2
3
4
5
6
INPUT
4.7V
GND
EFFECTIVE
INPUT
C = 10pF
TELCOM SEMICONDUCTOR, INC.
300mV
NONINVERTING
OUTPUTS
TC1411N
OUTPUT
7
8
TC1411/N-10 10/11/96
4-189
TC1411 TC1411N
1A HIGH-SPEED MOSFET DRIVERS

ABSOLUTE MAXIMUM RATINGS*

Operating Temperature Range
C Version............................................... 0°C to +70°C
Supply Voltage ......................................................... +20V
Input Voltage, IN A or IN B ..(V
+ 0.3V) to (GND – 5.0V)
DD
Maximum Chip Temperature.................................+150°C
Storage Temperature Range ................– 65°C to +150°C
Lead Temperature (Soldering, 10 sec) .................+300°C
Package Thermal Resistance
CerDIP R CerDIP R PDIP R PDIP R SOIC R SOIC R
................................................ 150°C/W
θJ-A
.................................................. 50°C/W
θJ-C
................................................... 125°C/W
θJ-A
..................................................... 42°C/W
θJ-C
................................................... 155°C/W
θJ-A
..................................................... 45°C/W
θJ-C
ELECTRICAL CHARACTERISTICS: Over operating temperature range with 4.5V V
E Version ..........................................– 40°C to +85°C
Power Dissipation (TA 70°C)
Plastic .............................................................730mW
CerDIP............................................................800mW
SOIC...............................................................470mW
*Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under "Absolute Maximum Ratings" may cause perma­nent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
16V, unless other-
DD
wise specified.
Symbol Parameter Test Conditions Min Typ Max Unit Input
V
IH
V
IL
I
IN
Logic 1 High Input Voltage 2.0 V Logic 0 Low Input Voltage 0.8 V Input Current –5V VIN V
DD
TA = 25°C– 11µA – 40°C TA ≤ 85°C
– 10 10
Output
V
OH
V
OL
R
O
I
PK
I
REV
High Output Voltage DC Test V
– 0.025 V
DD
Low Output Voltage DC Test 0.025 V Output Resistance VDD = 16V, IO = 10mA TA = 25°C—811
0°C T – 40°C TA ≤ 85°C
70°C 10 14
A
—1014 Peak Output Current VDD = 16V 1.0 A Latch-Up Protection Duty Cycle 2% 0.5 A
Withstand Reverse Current t 300 µsec
VDD = 16V
Switching Time (Note 1)
t
R
t
F
t
D1
t
D2
Rise Time Figure 1 TA = 25°C 25 35 nsec
0°C T – 40°C TA ≤ 85°C
70°C 27 40
A
—2940 Fall Time Figure 1 TA = 25°C 25 35 nsec
0°C T – 40°C TA ≤ 85°C
70°C 27 40
A
—2940 Delay Time Figure 1 TA = 25°C 30 40 nsec
0°C T – 40°C TA ≤ 85°C
70°C 33 45
A
—3545 Delay Time Figure 1 TA = 25°C 30 40 nsec
0°C T – 40°C TA ≤ 85°C
70°C 33 45
A
—3545
Power Supply
I
S
NOTE: 1. Switching times are guaranteed by design.
Power Supply Current VIN = 3V
VIN = 0V 0.1 0.15
V
DD
= 16V
0.5 1.0 mA
4-190
TELCOM SEMICONDUCTOR, INC.
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