TC1072
3
PRELIMINARY INFORMATION
TC1072-01 6/16/97
50mA CMOS LDO WITH SHUTDOWN,
ERROR OUTPUT AND V
REF
BYPASS
Pin No.
(SOT-23A-6) Symbol Description
1VINUnregulated supply input.
2 GND Ground terminal.
3 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this
input. The regulator enters shutdown when a logic low is applied to this input. During
shutdown, output voltage falls to zero and supply current is reduced to 0.05 microamp
(typical).
4 ERROR Out-of-Regulation Flag. (Open drain output). This output goes low when V
OUT
is out-of-
tolerance by approximately – 5%.
5 Bypass Reference bypass input. Connecting a 470pF to this input further reduces output noise.
6V
OUT
Regulated voltage output.
ELECTRICAL CHARACTERISTICS:
V
IN
= V
OUT
+ 1V, IL = 0.1mA, CL = 3.3µF, SHDN > VIH, T
A
= 25°C, unless otherwise noted.
Symbol Parameter Test Conditions Min Typ Max Units
ERROR Open Drain Output
V
MIN
Minimum Operating Voltage 1.0 — — V
V
OL
Output Logic Low Voltage 1mA Flows to ERROR — — 400 mV
V
TH
ERROR Threshold Voltage See Figure 2 — 0.95 x V
R
—V
V
HYS
ERROR Positive Hysteresis Note 8 — 50 — mV
NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.2V, 3.3V, 3.8V 5.0V.
2. TC V
OUT
= (V
OUT
MAX –
V
OUT
MIN)
x 10
6
V
OUT
x ∆T
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load
current, ground current and supply current (i.e. IIN = I
SUPPLY
+ I
GND
+ I
LOAD
).
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to I
LMAX
at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see
Thermal Considerations
section of this data sheet for more details.
8. Hysteresis voltage is referenced by VR.
PIN DESCRIPTION