Tektronix TMS809 Instruction Manual
Instruction Manual
TMS809 AGP 3.0 Bus Support
071-1084-00
Warning
The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
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TEKTRONIX and TEK are registered tradem arks of Tektronix, Inc.
SOFTWARE WARRANTY
Tektronix warrants that the media on which thi s software product is furnished and the encoding of the programs on
the media will be free from defects in materials and workmanship for a period of three (3) months from the dat e of
shipment. If a medium or encoding proves defective during the warranty period, Tektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
Tektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninte rrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If Tektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
HARDWARE WARRANTY
Tektronix warrants that the products that it m anufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defect ive during this
warranty period, Tektronix, at its option, ei ther will repa ir the defec tive product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment i s to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defe ct, fail ure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Getting Started
Operating Basics
General Safety Summary vii..........................................
Service Safety Summary ix..........................................
Manual Conventions xi..............................................
Contacting Tektronix xii.............................................
Probe Adapter Description 1--1.........................................
Logic Analyzer Software Compatibility 1--1..............................
Logic Analyzer Configuration 1--2......................................
Probe Adapter Review 1--4............................................
Components and Standard Accessories 1--5...............................
Configuring the Probe Adapter 1--6....................................
Connecting the Logic Analyzer to a Target System 1--7.....................
Verifying Probe Operation 1--23........................................
Replacing the Pogo Pin Assembly (Backside Board) 1--25....................
Storage 1--26........................................................
Care and Maintenance 1--27............................................
Shipping the Probe Adapter 1--28.......................................
Reference
Specifications
Maintenance
Installing the Software 2-- 1............................................
Support Package Setups 2--2...........................................
Channel Group Definitions 2--2.........................................
Symbol Tables 2--2..................................................
Acquiring and Viewing Disassembled Data 2--3............................
Viewing an Example of Disassembled Data 2--7...........................
Symbol Tables 3-- 1............................................
Channel Group Definition Tables 3-- 5............................
Channel Assignment Tables 3-- 25.................................
Signals Required for Clocking and Disassembly 3--43........................
Load Models 4--4....................................................
Fuses 5--1..........................................................
Fan Removal and Installation Procedure 5--3......................
Removing and Instaling a Fan 5--3......................................
TMS809 AGP 3.0 Bus Support
i
Table of Contents
Replaceable Parts List
Index
Parts Ordering Information 6--1.........................................
Using the Replaceable Parts List 6--2....................................
TMS809 AGP 3.0 Bus Support
ii
List of Figures
Table of Contents
Figure 1--1: Configuration of the slave 2, master, and
slave modules 1--3..........................................
Figure 1--2: Switch for AGP8X or AGP4X mode 1--6................
Figure 1-- 3: Connect the Interposer probe adapter to the
AGP 3.0 bus connector 1-- 9..................................
Figure 1--4: Preprocessor unit and access panel 1--10.................
Figure 1--5: Attach the power cables 1--10..........................
Figure 1--6: Attaching the mounting plate to the target system 1--14....
Figure 1--7: Attaching the Front End board assembly 1--16............
Figure 1--8: Assembled Backside probe head 1--17...................
Figure 1--9: Attach the power cables 1--18..........................
Figure 1--10: Preprocessor unit and access panel 1--18................
Figure 1--11: Configuration of the slave 2, master, and slave modules 1--20
Figure 1--12: Operating the P6434 probe latches 1--21................
Figure 1--13: Probes with mictor adapters 1--22.....................
Figure 1--14: Preprocessor unit and access panel 1--24................
Figure 1--15: Replacing the Pogo pin assembly on the
Backside board 1--25........................................
TMS809 AGP 3.0 Bus Support
Figure 2--1: Select these definitions for AGP8X 2--4.................
Figure 3--1: Configuration for slave 2, master, and slave modules 3--25..
Figure 4--1: Strobe separation 4--2...............................
Figure 4-- 2: Interposer source sync load model 4-- 4.................
Figure 4--3: Backside source sync load model 4--4...................
Figure 4--4: Dimensions of the AGP 3.0 Interposer probe head 4--7....
Figure 4--5: Dimensions of the AGP 3.0 Backside probe head 4--8.....
Figure 4-- 6: Dimensions of the preprocessor unit 4--9................
Figure 5--1: Power switch and AC power cord locations 5--4..........
Figure 5--2: Remove the attaching screws 5--5......................
Figure 5--3: Remove the bottom cover 5--6.........................
Figure 5--4: Removing the fan pin connector 5--7...................
Figure 5-- 5: Back of the preprocessor unit 5-- 8.....................
Figure 5--6: Location of fan connector 5--9.........................
Figure 6--1: Interposer probe head exploded view 6--4...............
iii
Table of Contents
Figure 6--2: Backside probe head exploded view 6--6................
Figure 6-- 3: Preprocessor unit exploded view 6-- 9...................
TMS809 AGP 3.0 Bus Support
iv
List of Tables
Table of Contents
Table 2--1: Waveform displays 2--5..............................
Table 2--2: Default display radix 2-- 6............................
Table 3--1: AGP3_Command symbol table definitions 3--1...........
Table 3--2: AGP3_Status symbol table definitions 3--2...............
Table 3--3: AGP3_Control symbol table definitions 3--2.............
Table 3--4: AGP3_SBA_Cmd symbol table definitions 3--4...........
Table 3--5: 7_AD[31:0] channel group definitions 3--5...............
Table 3--6: 6_AD[31:0] channel group definitions 3--6...............
Table 3--7: 5_AD[31:0] channel group definitions 3--8...............
Table 3--8: 4_AD[31:0] channel group definitions 3--9...............
Table 3--9: 3_AD[31:0] channel group definitions 3--10...............
Table 3--10: 2_AD[31:0] channel group definitions 3--11..............
Table 3--11: 1_AD[31:0] channel group definitions 3--13..............
Table 3--12: 0/PCI_AD[31] channel group definitions 3--14...........
Table 3--13: 7_C#_BE[3:0]channel group definitions 3--15............
Table 3--14: 6_C#_BE[3:0]channel group definitions 3--15............
Table 3--15: 5_C#_BE[3:0] channel group definitions 3--16...........
Table 3--16: 4_C#_BE[3:0] channel group definitions 3--16...........
Table 3--17: 3_C#_BE[3:0]channel group definitions 3--16............
Table 3--18: 2_C#_BE[3:0] channel group definitions 3--17...........
Table 3--19: 1_C#_BE[3:0] channel group definitions 3--17...........
Table 3--20: 0/PCI_C#_BE[3:0] channel group definitions 3--17.......
Table 3--21: 7_SBA[7:0]# channel group definitions 3-- 18.............
Table 3--22: 6_SBA[7:0]# channel group definitions 3-- 18.............
Table 3--23: 5_SBA[7:0]# channel group definitions 3-- 19.............
Table 3--24: 4_SBA[7:0]# channel group definitions 3-- 19.............
Table 3--25: 3_SBA[7:0]# channel group definitions 3-- 20.............
Table 3--26: 2_SBA[7:0]# channel group definitions 3-- 20.............
Table 3--27: 1_SBA[7:0]# channel group definitions 3-- 21.............
Table 3--28: 0/PCI_SBA[7:0]# channel group definitions 3-- 21.........
Table 3--29: Command channel group definitions 3-- 22...............
Table 3--30: Control channel group definitions 3-- 22.................
Table 3--31: Status channel group definitions 3-- 23..................
Table 3--32: Misc channel group definitions 3--23...................
TMS809 AGP 3.0 Bus Support
v
Table of Contents
Table 3--33: Clock channel assignments 3-- 26.......................
Table 3--34: Qual channel assignments 3--26........................
Table 3--35: Master Address Module 32-channel assignments 3-- 27.....
Table 3--36: Master Control Module 32-channel assignments 3-- 28.....
Table 3--37: Master Data Module 32-channel assignments 3--29.......
Table 3--38: Master Extend Module 32-channel assignments 3-- 31.....
Table 3--39: Slave Address Module 32-channel assignments 3 --32......
Table 3--40: Slave Control Module 32-channel assignments 3--33......
Table 3--41: Slave Data Module 32-channel assignments 3--35.........
Table 3--42: Slave Extend Module 32-channel assignments 3-- 36.......
Table 3--43: Slave2 Address Module 32-channel assignments 3 --37.....
Table 3--44: Slave2 Control Module 32-channel assignments 3--39.....
Table 3--45: Slave2 Data Module 32-channel assignments 3--40........
Table 3--46: Slave2 Extend Module 32-channel assignments 3--41......
T able 4--1: Electrical specifications 4--1...........................
Table 4--2: Timing Support Channel--to--Channel Skew 4--2.........
Table 4--3: Electrical specifications for the AC input 4-- 3............
T able 4--4: Environmental specifications 4--3......................
Table 4--5: Certifications and compliances 4--5....................
TMS809 AGP 3.0 Bus Support
vi
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Ground the Product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
Connect the ground lead of the probe to earth ground only.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
TMS809 AGP 3.0 Bus Support
Do Not Operate Without a Fan. Before operating this product, direct a fan at the
probe head for proper cooling.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
vii
General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
CAUTION
Refer to Manual
WARNING
High Voltage
Protective Ground
(Earth) Terminal
Mains Disconnected
OFF (Power)
Mains Connected
ON (Power)
viii
TMS809 AGP 3.0 Bus Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMS809 AGP 3.0 Bus Support
ix
Service Safety Summary
TMS809 AGP 3.0 Bus Support
x
Preface
Manual Conventions
This instruction manual contains specific information about the
TMS809 AGP 3.0 Bus support package and is part of a set of information on
how to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating bus support packages on the logic analyzer,
you only need this instruction manual to set up and run the TMS809 support
package.
If you are not familiar with operating bus support packages, you need to
supplement this instruction manual with information on basic operations of the
logic analyzer to set up and run the TMS809 support package. See Manual
Conventions below for more information.
This manual uses the following conventions:
H The term “disassembler” refers to the software that decodes bus cycles into
instruction mnemonics and cycle types.
H The phrase “information on basic operations” refers to your logic analyzer
online help or logic analyzer user manual covering the basic operations of a
bus support.
H The phrase “probe adapter” refers to the TMS809 support package software
and hardware.
H The phrase “Front End board” refers to the circuit board that is used with
both probe heads.
TMS809 AGP 3.0 Bus Support
xi
Preface
Contacting Tektronix
Phone 1-800-833-9200*
Address Tektronix, Inc.
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web site www.tektronix.com
Sales support 1-800-833-9200, select option 1*
Service support 1-800-833-9200, select option 2*
Technical support Email: techsupport@tektronix.com
1-800-833-9200, select option 3*
6:00 a.m. -- 5:00 p.m. Pacific time
* This phone number is toll free in North America. After office hours, pl ease leave a
voice mail message.
Outside North America, contact a Tektronix sal es office or distributor; see the
Tektronix web site for a list of offices.
xii
TMS809 AGP 3.0 Bus Support
Getting Started
Getting Started
This section contains a description of the probe adapter, and how to connect the
logic analyzer to the target system.
Probe Adapter Description
The probe adapter allows the logic analyzer to acquire data from an Accelerated
Graphics Port (AGP) bus (version 3.0) within the operating environment in the
target system.
The probe adapter connects to the target system using the AGP 3.0 card
connector. Signals from the bus flow from the probe adapter to the P6434 probes
and through the probe cables to the logic analyzer.
The probe adapter package provides two probe heads:
H Interposer probe head (recommended for ease of use)
H Backside probe head (to use for lower target-system loading, if needed)
NOTE. When debugging an AGP Pro 1.5 V compatible graphic card, we
recommend that you use the backside probe adapter.
The probe adapter support package installs software that displays timing and
state information from systems based on the AGP 3.0 bus. The software supports
two AGP 3.0 modes of operation, AGP8X and AGP4X, along with the PCI
Local Bus Specification (PCI) operations.
To use this probe adapter package efficiently, you may also refer to Draft AGP
V3.0 Interface Specification, Revision 0.95R, original date: May 2001 document
(Intel web site).
Logic Analyzer Software Compatibility
The label on the floppy disk states which version of logic analyzer software the
probe adapter package is compatible with.
TMS809 AGP 3.0 Bus Support
1- 1
Getting Started
Logic Analyzer Configuration
To use the probe adapter you need a logic analyzer equipped with the minimum
module configuration of three 136-channel, 100 MHz modules. For timing you
need one 102 channel, 100 MHz module.
You can take state and asynchronous timing acquisitions simultaneously if four
modules and 15 probes are available.
The probe adapter requires a minimum of twelve Mass Termination Probes.
You can connect probes as desired based on the following configurations:
H 12 mictor connectors for disassembly
H 3 mictor connectors for timing only
Labeling Probes
P6860 Probes
The probe adapter relies on the default channel mapping and labeling scheme for
the probes. Apply labels using the instructions described in the following
manuals. These manuals can be accessed from the Tektronix.com web site or
these topics can be located in the logic analyzer online help:
H P6434 Mass Termination Probe Instructions
H P6860 High Density Logic Analyzer Probe Label Instructions
You can use the TLA7AXX 120 MHz logic analyzer module and the P6860
probes with the Compression-on-PCB to P6860 Mictor adapter to connect to the
AGP 3.0 probe adapter package.
Refer to the P6810, P6860, and P6880 Logic Analyzer Probes Instruction
manual, 071-1059-XX, for more information. This manual can be accessed from
the Tektronix.com web site or these topics can be located in the logic analyzer
online help.
NOTE. When using the TLA7Axx modules with the TMS809 probe adapter, the
analog outputs display the outputs of the digital buffers of the TMS809 and do
not directly reflect the analog attributes of the AGP bus.
1- 2
TMS809 AGP 3.0 Bus Support
Getting Started
Module Configuration
You must configure and merge the modules as shown in Figure 1--1. The
memory depth is automatically chosen based on the shallowest memory depth of
the merged modules.
The term “master module” refers to the middle module of a 3-wide merge. The
term “slave module” refers to the module in the higher numbered slot than the
master module. The term “slave 2” module refers to the module in the lower
numbered slot than the master module.
Slave 2 Master Slave
Acquisition Setup
TMS809 AGP 3.0 Bus Support
Figure 1- 1: Configuration of the slave 2, master, and slave modules
The probe adapter software affects the logic analyzer setup menus (and submenus) by modifying existing fields and adding bus-specific fields.
The probe adapter software adds the following selections to the Load Support
dialog box, located under the File pulldown menu:
H AGP3_8X Disassembly mode
H AGP3_4X Disassembly mode
H AGP3_T Timing mode
After you load the software, the Custom Clocking mode selection in the module
Setupmenuisalsoenabled(seeCustom Clocking Mode on page 2--3).
To use the AGP4X mode, refer to Configuring the Probe Adapteronpage1--6.
The AGP 3.0 probe adapter is shipped configured for the AGP8X mode.
1- 3
Getting Started
Probe Adapter Review
Requirements and
Restrictions
Functionality Not
Supported
Review the electrical specifications in the Specifications section in this manual
as they pertain to the target system, as well as the following descriptions of other
AGP 3.0 probe adapter package requirements and restrictions.
Hardware Reset. If a hardware reset occurs in the AGP 3.0 system during an
acquisition, the application may acquire invalid samples until voltage levels
stabilize.
System Clock Rate. The probe adapter can acquire data from the bus operating at
speeds of up to 66 MHz. The AGP 3.0 probe adapter has been tested to a
maximum Clock Rate of 66.625 MHz.
Review the functionalities that are not supported by the probe adapter package in
the following descriptions:
Acquisition Channels. Extra acquisition channels are not available, since this
probe adapter uses P6434 mictor connectors.
Sticky Address Bits. Sticky address bits are not tracked, stored, or displayed in
TMS809 software package.
1- 4
AGP 2.0 Bus. Although the probe adapter supports the AGP4X mode of operation
on an AGP3.0 bus, the probe adapter does not support AGP4X on the AGP2.0
bus.
Dynamic Switching. Dynamic switching modes between AGP8X and AGP4X
modes are not supported. To set up the AGP4X mode, refer to Configuring the
Probe Adapter on page 1--6. The probe adapter is shipped from the factory in
the AGP8X mode configuration.
Nonintrusive Acquisition. The probe adapter will not present signals back to the
target system.
TMS809 AGP 3.0 Bus Support
Components and Standard Accessories
The probe adapter is shipped with the following components and standard
accessories:
H Probe adapter: Preprocessor unit, cables, Interposer probe head (attached),
and Backside probe head
H Hardware
H Positioning block and mounting plate with adhesive strips (one-time use
and curing advised — seepage1--12)
H Screws and washers (2 ea)
H Extension nuts (4)
H AC power cord
H Document and software package: Includes the probe adapter manual, license
agreement envelope with software disc, registration card, and statement of
compliance envelope
Getting Started
For optional accessories, see the Replaceable Parts List on page 6--8.
TMS809 AGP 3.0 Bus Support
1- 5
Getting Started
Configuring the Probe Adapter
The probe adapter is configured for the AGP8X mode from the factory. To use
either the AGP8X or the AGP4X modes, follow these steps:
1. Change the mode switch on the front of the preprocessor unit to AGP4X
mode or AGP8X mode (see Figure 1--2).
2. Power the probe adapter off and on.
3. Reset the target system while in the chosen mode.
NOTE. The AGP4X mode is available only for AGP3.0 target systems.
8X mode
i
4X mode
The “i” indicates a reminder to
reset the target system.
Figure 1- 2: Switch for AGP8X or AGP4X mode
1- 6
TMS809 AGP 3.0 Bus Support
Connecting the Logic Analyzer to a Target System
We recommend that you use the Interposer probe head to connect the logic
analyzer to the target system. If the target system functions improperly using the
Interposer board, use the Backside probe head. If you use the B ackside probe
head, you need to remove the target system from the case that houses it.
NOTE. For storage and shipping, retain the cardboard cartons and packing
material that is shipped with the probe adapter.
WARNING. To prevent harm to yourself or damage to the preprocessor unit, do
not open the preprocessor unit. There are no operator serviceable parts inside
the preprocessor unit. Refer servicing of internal parts in the preprocessor unit
to Tektronix authorized personnel only. External parts may be replaced by
qualified service personnel.
Getting Started
Tools Required. Following is a list of required tools:
H Nut driver (1/4 in) to remove the extension nuts from the Backside board
assembly
H Phillips screwdriver (P2) to remove a probe head and to secure the Backside
probe head
H Flat blade screwdriver to install the probe heads
Optional Tools. A torque wrench helps to ensure reliable connections by meeting
the nominal torque values listed in these instructions.
See the following pages for these procedures:
H Interposer probe head installation (see page 1--8)
H Probe-head removal (see page 1--11)
H Backside probe head installation (see page 1--12)
WARNING. To prevent burns, forced air cooling is required across the probe
adapter to maintain a temperature below 105
temperature for the components and the probe adapter.
°C (220 °F). You must verify this
TMS809 AGP 3.0 Bus Support
1- 7
Getting Started
CAUTION. To prevent static damage to the power pod, probe adapter, probes, and
module, handle components only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the bus and probe adapter.
Connecting the Interposer
Probe Head
For the first-time connection of the Interposer probe head to the AGP 3.0 signals
in the target system, follow these steps:
NOTE. If you are reconnecting the Interposer probe head, see Reconnecting the
Interposer Probe Head on page 1--9.
1. Power off the target system. It is not necessary to power off the logic
analyzer.
2. Power off any probe adapters that may be attached to your target system. If
the Backside probe head is attached, follow the instructions for Removing a
Probe Head on page 1--11.
3. To discharge any stored static electricity, touch the ground connector located
on the back of the logic analyzer.
4. Place the preprocessor unit on a horizontal, static free surface.
NOTE. When debugging an AGP Pro 1.5 V compatible graphic card, we
recommend that you use the backside probe adapter.
5. Remove the AGP 3.0 bus card from the target system.
1- 8
6. Connect the Interposer probe head to the target system as shown in
Figure 1--3.
7. Connect the AGP 3.0 bus card to the Interposer probe head.
CAUTION. To prevent damage to the probe adapter or target system when pow er
is applied, connect the target system to the probe adapter properly.
TMS809 AGP 3.0 Bus Support
AGP 3.0 bus card
AGP 3.0 Interposer probe
head (includes Front End
board and Backside board)
Getting Started
AGP 3.0 bus connector
Reconnecting the
Interposer Probe Head
Target system
Figure 1- 3: Connect the Interposer probe adapter to the AGP 3.0 bus connector
WARNING. To prevent burns, forced air cooling is required across the probe
adapter to maintain a temperature below 105
°C (220 °F). You must verify this
temperature for the components and the probe adapter.
8. Apply forced air cooling across the probe head.
Before you begin to reconnect the Interposer probe head, check that no probe
adapters are attached to the preprocessor unit and that the access panel on top of
the preprocessor unit has been removed.
NOTE. When debugging an AGP Pro 1.5 V compatible graphic card, we
recommend that you use the backside probe adapter.
1. Power off the preprocessor unit.
TMS809 AGP 3.0 Bus Support
2. Power off the target system. You do not need to power off the logic analyzer.
3. Discharge the stored static electricity by touching the ground connector
located on the back of the logic analyzer.
1- 9
Getting Started
4. Connect the three small boards (attached to the probe-head cables), matching
A to A, B to B, and C to C, to the Logic board. Access to the small board
connections is through the access panel on top of the preprocessor unit (see
Figure 1--4).
S2_E_DIS
S2_C_DIS
S2_A_DIS
S2_D_DIS
M_C_DIS
M_A_DIS
S_C_DIS
S2_D_DIS
S2_E_DIS
S2_A_DIS
M_E_DIS
M_D_DIS
M_A_TMG
M_C_TMG
Access panel
M_D_TMG
Screws (6)
Figure 1- 4: Preprocessor unit and access panel
5. Using a Phillips screwdriver, install the six screws into the three small
boards (torque to 4 in-in/lb).
6. Using a Phillips screwdriver, attach the three power cables and the three
screws (torque to 6 in/lb) to the Front End board (see Figure 1--5).
CAUTION. To prevent damage to the probe adapter, check that the power cables
are reattached to the Front End board correctly.
Front End board
1- 10
Black to GND
Yellow to --5 V
Redto+5V
Figure 1- 5: Attach the power cables
7. Hand start the screws that attach the access panel to the top of the preproces-
sor unit.
TMS809 AGP 3.0 Bus Support
Getting Started
8. Using a Phillips screwdriver, tighten the screws (torque to 4 in/lb) in the
access panel (see Figure 1--4).
9. Connect the Interposer probe head to the target system (go to step 6 on
page 1--8 and complete the steps).
Removing a Probe Head
If you need to remove a probe head, follow these steps:
CAUTION. To prevent static damage, handle these components only in a
static-free environment. Static discharge can damage the probe adapter, the
probes, and the logic analyzer module.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the probe adapter.
1. Power off the probe adapter and unplug the AC power cord on the preproces-
sor unit from the wall. The probe adapter power switch is located on the
back of the preprocessor unit. It is not necessary to power off the logic
analyzer.
2. Using a Phillips screwdriver, remove the screws from the access panel
located on top of the preprocessor unit (see Figure 1--4). Set the access panel
aside.
3. Using a Phillips screwdriver, remove the screws from the three small boards
(attached to the probe-head cables). Access to the small boards is through the
access panel on top of the preprocessor unit.
4. Disconnect the small boards from the Logic board.
TMS809 AGP 3.0 Bus Support
NOTE. Do not remove the power cables from the preprocessor unit.
5. Remove the three screws and the three power cables from the Front End
board. Set the screws aside for use later.
Interposer probe head only — Disconnect the Interposer probe head from the
target system. To properly store the Interposer probe head for use later, see
Storage on page 1--26. To store the AGP 3.0 bus card, refer to the AGP 3.0
bus card information from the manufacturer. To reinstall the Interposer probe
head, go to Reconnecting the Interposer Probe Head on page 1--9.
Backside probe head only — To complete the removal procedure for the
Backside probe head, follow these steps:
6. Using a Phillips screwdriver, remove the two screws from the center two
holes on the Front End board assembly (see Figure 1--8 on page 1--17).
1- 11
Getting Started
7. Remove the Front End board assembly from the Backside board assembly.
8. Using a nut driver, carefully remove the four extension nuts from the
Backside board assembly (see Figure 1--7 on page 1--16).
9. Remove the Backside board from the mounting plate on the target system.
NOTE. We recommend that you do not remove the mounting plate after it is
attached to the target system.
To properly store the Backside probe head for use later, see Storage on
page 1--26.
Connecting the Backside
Probe Head
To connect the Backside probe head to the signals on the target system, follow
these steps:
1. Power off the target system. It is not necessary to power off the logic
analyzer.
CAUTION. To prevent static damage, handle these components only in a
static-free environment. Static discharge can damage the probe adapter, the
probes, and the logic analyzer module.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the bus.
2. To discharge the stored static electricity, touch the ground connector located
on the back of the logic analyzer.
3. Disconnect any attached probe adapters. See Removing a Probe Head on
page 1--11.
NOTE. Use an antistatic cushion to protect the components on the underside of
the target system, because you will be applying pressure to the AGP 3.0 board.
1- 12
4. Place the target system on a horizontal, static-free surface (the back of the
AGP 3.0 connector must be visible).
TMS809 AGP 3.0 Bus Support
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