Instruction Manual
TMS808
AGP4X Bus State Support
071-0560-03
Warning
The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
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TEKTRONIX and TEK are registered tradem arks of Tektronix, Inc.
SOFTWARE WARRANTY
Tektronix warrants that the media on which thi s software product is furnished and the encoding of the programs on
the media will be free from defects in materi als and workmanship for a period of three (3) months from the date of
shipment. If a medium or encoding proves defective during the warranty period, Tektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
Tektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninte rrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If Tektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER W ARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
HARDWARE WARRANTY
Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair da mage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modific ation or integration increases the time
or difficulty of servicing the product.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER W ARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Getting Started
General Safety Summary v...................................
Service Safety Summary vii....................................
Preface ix...................................................
Manual Conventions ix..............................................
Logic Analyzer Documentation ix.....................................
Contacting Tektronix x..............................................
Probe Adapter Description 1--1.........................................
Support Package Description 1--1.......................................
Logic Analyzer Software Compatibility 1--2...............................
Logic Analyzer Configuration 1--2......................................
Requirements and Restrictions 1--3......................................
Connecting the Logic Analyzer to a System Under Test 1--4..................
Channel Assignments 1--9.............................................
Channel Charts 1--21..................................................
Standard Accessories 1--28.............................................
Options 1--28........................................................
Troubleshooting Guide 1--28............................................
Operating Basics
Specifications
Diagrams
Replaceable Parts List
Index
Setting Up the Support 2--1.....................................
Channel Group Definitions 2--1.........................................
Symbols 2--1.......................................................
HowDataisAcquired 2--6.............................................
Custom Clocking 2--6.............................................
Clocking Options 2--6.............................................
Setup/Hold Adjustment Procedure 2--7...............................
Signals Not On the Probe Adapter 2--11................................
Extra Channels 2--11...............................................
Circuit Description 3--1...............................................
Specifications 3--4..................................................
Loading and Equivalent Circuits 3--6.....................................
Symbols 4--1.......................................................
Component Values 4--1...............................................
Graphic Items and Special Symbols Used in This Manual 4--1.................
Component Locator Diagrams 4--1......................................
TMS808 AGP4X Bus State Support
i
Table of Contents
List of Figures
Figure 1--1: Connecting the probe adapter boards together 1--5.......
Figure 1--2: Connecting the graphics card to the probe adapter 1--6...
Figure 1--3: Connecting the probe adapter and graphics card
to the system 1--7...........................................
Figure 1--4: Connecting the probes to the probe adapter 1--8.........
Figure 1--5: Selecting the data transfer rate 1--9....................
Figure 2--1: Examples of sufficient setup/hold times 2--9.............
Figure 2--2: Setup:AGP4X window 2--9...........................
Figure 2--3: Custom option window 2--10...........................
Figure 2--4: Setup/hold time violation examples 2--10.................
Figure 3--1: Block diagram for AD bus 3--2........................
Figure 3--2: Block diagram for the SBA bus 3--3....................
Figure 3--3: Qualifier generation 3--4.............................
Figure 3--4: Equivalent circuit loads for the probe adapter 3--7.......
Figure 3--5: Probe adapter dimensions 3--8........................
Figure 5--1: AGP4X probe adapter exploded view 5--4...............
ii
TMS808 AGP4X Bus State Support
List of Tables
Table of Contents
Table 1--1: AD[31:0] group assignments 1--10.......................
Table 1--2: AGP_Data_Hi channel group assignments 1--11...........
Table 1--3: AGP_Data_Lo channel group assignments 1--12...........
Table 1--4: BE_Hi channel group assignments 1--13..................
Table 1--5: BE_Lo channel group assignments 1--13.................
Table 1--6: Command channel group assignments 1--13..............
Table 1--7: Status group assignments 1--14.........................
Table 1--8: SBA[7:0] group assignments 1--14.......................
Table 1--9: SBA_Hi channel group assignments 1--15................
Table 1--10: SBA_Lo channel group assignments 1--15...............
Table 1--11: Control channel group assignments 1--16................
Table 1--12: Misc channel group assignments 1--16..................
Table 1--13: D_AD_Strobe channel group assignments 1--17..........
Table 1--14: D_SB_Strobe channel group assignments 1--17...........
Table 1--15: Clock and qualifier channel assignments 1--17...........
Table 1--16: Channel groups required for clocking 1--18..............
Table 1--17: Channel groups not required for clocking 1--20...........
Table 1--18: Signals on the probe adapter that are not acquired 1--21...
Table 1--19: Clock channels 1--21.................................
Table 1--20: Qual channels 1--21.................................
Table 1--21: 32 Channel Address_Lo section on the lower module 1--22.
Table 1--22: 32 Channel Address_Hi Section on the Lower Module 1--23
Table 1--23: 32 Channel Data_Hi section on the higher module 1--24...
Table 1--24: 32 Channel Data_Lo section on the lower module 1--25....
Table 1--25: 32 Channel Control section (sorted by channel number)
on the lower module 1--26...................................
Table 1--26: 32 Channel Control Section (sorted by login group) on the lower
module 1--27...............................................
Table 2--1: Command group symbol table definitions 2--1............
Table 2--2: Status group symbol table definitions 2--3...............
Table 2--3: Control group symbol table definitions 2--4..............
Table 2--4: SBA_Hi Command group symbol table definitions 2--5....
Table 3--1: Electrical specifications 3--4...........................
Table 3--2: Environmental specifications1 3--5.....................
Table 3--3: Lossy delay line values 3--6............................
TMS808 AGP4X Bus State Support
iii
Table of Contents
iv
TMS808 AGP4X Bus State Support
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to the
input or output terminals of the product, ensure that the product is properly
grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings
information before making connections to the product.
Connect the ground lead of the probe to earth ground only.
Use Proper AC Adapter. Use only the AC adapter specified for this product.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
TMS808 AGP4X Bus State Support
v
General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
WARNING
High Voltage
Protective Ground
(Earth) Terminal
CAUTION
Refer to Manual
Double
Insulated
vi
TMS808 AGP4X Bus State Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMS808 AGP4X Bus State Support
vii
Service Safety Summary
viii
TMS808 AGP4X Bus State Support
Preface
This instruction manual contains specific information about the
TMS 808 AGP4X bus support package and is part of a set of information on how
to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating bus support packages on the logic analyzer for
which the TMS 808 AGP4X support was purchased, you will probably only
need this instruction manual to set up and run the support package.
If you are not familiar with operating bus support packages, you will need to
supplement this instruction manual with information on basic operations to set
up and run the support package.
Information on basic operations of bus support packages is included with each
product. Each logic analyzer includes basic information that describes how to
perform tasks common to support packages on that platform. This information
can be in the form of online help, an installation manual, or a user manual.
This manual provides detailed information on the following topics:
H Connecting the logic analyzer to the system under test
H Setting up the logic analyzer to acquire data from the system under test
H Acquiring and viewing data
Manual Conventions
This manual uses the following conventions:
H The phrase “information on basic operations” refers to the logic analyzer
online help, an installation manual, or a user manual covering the basic
operations of bus support.
H The term “logic analyzer” refers to the Tektronix logic analyzer for which
this product was purchased.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic
analyzer is located in the user manual of the corresponding module. The manual
set provides the information necessary to install, operate, maintain, and service
the logic analyzer and its associated products.
TMS808 AGP4X Bus State Support
ix
Preface
Contacting Tektronix
Phone 1-800-833-9200*
Address Tektronix, Inc.
Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web site www.tektronix.com
Sales support 1-800-833-9200, select option 1*
Service support 1-800-833-9200, select option 2*
Technical support Email: techsupport@tektronix.com
1-800-833-9200, select option 3*
6:00 a.m. -- 5:00 p.m. Pacific time
* This phone number is toll free in North America. After office hours, pl ease leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
x
TMS808 AGP4X Bus State Support
Getting Started
Getting Started
This chapter contains information on the TMS 808 AGP4X bus support and
information on connecting your logic analyzer to your system under test.
Probe Adapter Description
The probe adapter is nonintrusive hardware that allows the logic analyzer to
acquire data from a bus in its own operating environment with little effect, if any,
on the target system. Information on basic operations in your online help contains
a figure showing the logic analyzer connected to a typical probe adapter. Refer to
that figure while reading the following description.
The probe adapter consists of an extender board and an interface board. The
extender board includes a straddle-mount AGP4X connector that accepts the
original AGP4X card. The extender board has signal conditioning circuitry on it
which extracts proper digital signals from the composite wave on the
transmission lines. The extender board also includes a 114-pin Mictor connector
that transfers the conditioned signals to the interface board. For more detailed
information on the probe adapter refer to the Circuit description on page 3--1.
The interface board contains digital logic which processes the AGP signals for
the logic analyzer to acquire. Mictor connectors on the interface board accept
P6434 probes from the logic analyzer.
The probe adapter accommodates the AGP4X bus and is powered with an
external supply.
Support Package Description
The TMS 808 bus support package acquires and displays data from systems
based on the Intel AGP4X bus.
To use this support efficiently, refer to information on basic operations, in your
online help, and the following documents:
H Accelerated Graphics Port Interface Specification, Intel, Version 2.0, 1998
The AGP interface specification uses the 66 MHz PCI (PCI Local Bus Specification) as an operational baseline and provides four significant performance
extensions or enhancements to the PCI specification which are intended to
optimize the AGP for high performance 3D graphics applications. These AGP
extensions are not described in, or required by, the PCI Local Bus Specification.
TMS808 AGP4X Bus State Support
1--1
Getting Started
These extensions are:
H Deeply pipelined memory read and write operations, fully hiding memory
access latency.
H Demultiplexing of address and data on the bus, allowing almost 100% bus
efficiency.
H New AC timing in the 3.3 V electrical specification that provides for one,
two, or four data transfers per 66 MHz clock cycle, allowing for real data
throughput in excess of 500 MB/s.
H A new low voltage electrical specification that allows four data transfers per
66--MHz clock cycle, providing real data throughput of up to 1 GB/s.
These enhancements are realized through the use of sideband signals. The PCI
specification has not been modified in any way, and the AGP interface specification has specifically avoided the use of any of the reserved fields, encodings,
pins, and so on, in the PCI specification. The intent is to utilize the PCI design
base while providing a range of graphics-oriented performance enhancements
with varying complexity/performance tradeoffs available to the component
provider.
AGP neither replaces nor diminishes the necessity of PCI in the system. This
high speed port (AGP) is physically, logically, and electrically independent of the
PCI bus. It is an additional connection point in the system. It is intended for the
exclusive use of visual display devices; all other I/O devices will remain on the
PCI bus. The add-in slot defined for AGP uses a new connector body (for
electrical signaling reasons) which is not compatible with the PCI connector; PCI
and AGP boards are not mechanically interchangeable.
Logic Analyzer Software Compatibility
The label on the TMS 808 support floppy disk states which version of logic
analyzer software the support is compatible with.
Logic Analyzer Configuration
For use with a TLA 700 Series, the TMS 808 support requires a minimum of two
102-channel modules that are merged. Modules must be 200 MHz minimum.
Merged modules must be of the same memory depth. If not, the shallower
module will determine the depth of the merged module pair. The modules must
be merged before microprocessor support is loaded. The TLA 700 does not retain
micro support when a merged configuration is unmerged.
1--2
TMS808 AGP4X Bus State Support
Requirements and Restrictions
Review the electrical specifications in the Specifications chapter in this manual
as they pertain to your system under test, as well as the following descriptions of
other AGP4X support requirements and restrictions.
The AGP4X support does not have the ability to connect transferred data and the
requests that generated them.
Hardware Reset. If a hardware reset occurs in your AGP4X system during an
acquisition, the application may acquire an invalid sample.
System Clock Rate. The AGP4X support can acquire data from the bus operating
atspeedsofupto66MHz.
Nonintrusive Acquisition. The AGP4X microprocessor support will not intercept,
modify, or present signals back to the system under test, with the exception noted
under Use of TYPEDET#.
Getting Started
1.5V Operation Only. The AGP4X support can be used with only AGP4X and
AGP2X 1.5 V systems. The AGP2X support will not work with 3.3 V systems.
The AGP4X support will not work with 1X AGP systems. Contact Tektronix for
1X and 2X 3.3V support.
Data Transfer Rate. The AGP4X support will not work with 1X AGP systems.
Contact Tektronix for 1X and 2X, 3.3V support.
Use of TYPEDET#. The TYPEDET# signal is connected to ground on the
motherboard and is unconnected on the AGP4X connector. This will force the
motherboard logic to use 1.5 V signaling.
AGP Modes not Verified. PIPE# mode and AGP fast writes are not tested, so
Tektronix cannot guarantee functionality.
State Mode Display. The state mode waveform display must not be used to
observe signals that have a repetition rate greater than the sampling frequency.
For example, the AD[31:0], Strobes, SBA[7:0], and BE signals will yield
incorrect values in the State mode waveform window. This is because the
sampling rate is 133 MHz, where as these signals; AD[31:0], Strobes, SBA[7:0],
and BE, can change at a rate of 266 MHz and may not show a steady state.
TMS808 AGP4X Bus State Support
1--3
Getting Started
MagniVu. Timing signals displayed in groups AD[31:0] and SBA[7:0] should not
be used for accurate timing measurements.
Threshold. The AGP4X support hardware uses GND-based threshold for
detecting the levels, rather than using Vrefgc or Vrefcg. So a change in interface
voltage levels may appear as changes in timings.
Connecting the Logic Analyzer to a System Under Test
To connect the probes to AGP4X signals in the system under test, follow these
steps:
1. Power off your system under test. It is not necessary to power off the logic
analyzer.
CAUTION. Static discharge can damage the bus, the probes, and the logic
analyzer module. To prevent static damage, handle these components only in a
static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the bus.
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer.
3. Place the system under test on a horizontal, static-free surface.
4. Plug the probe interface board into the graphics card extender as shown in
Figure 1--1 on page 1--5.
5. Secure the two boards together with the hardware provided.
1--4
TMS808 AGP4X Bus State Support
Spacers (4)
Getting Started
Screws (8)
Probe interface board
Graphics card extender
Figure 1--1: Connecting the probe adapter boards together
TMS808 AGP4X Bus State Support
1--5
Getting Started
6. Plug the graphics card into the probe adapter. The video out silk-screen
symbol on the probe interface board should point to the same side as the
XGA video connector on the graphics card, as shown in Figure 1--2.
CAUTION. To prevent damaging the graphics card, probe adapter, or system
under test when power is applied, be sure to connect the AGP graphics card to
the probe adapter properly .
NOTE. The TMS 808 product only supports 1.5V graphics cards.
XGA video connector (typical)
Both facing
same side
Graphics card
Probe interface board
Graphics card extender
1--6
Figure 1--2: Connecting the graphics card to the probe adapter
TMS808 AGP4X Bus State Support
Getting Started
NOTE. The graphics card must be plugged into the probe adapter for proper
operation.
7. Plug the probe adapter into the system under test as shown in Figure 1--3.
CAUTION. To prevent damaging the graphics card, probe adapter, or system
under test when power is applied, be sure to connect the probe adapter to the
system under test properly .
XGA video connector (typical)
Graphics card
Power supply
connector
Probe interface board
Pin 1
Graphics card extender
Index key
(not present
on all system
boards)
System
under test
Figure 1--3: Connecting the probe adapter and graphics card to the system
TMS808 AGP4X Bus State Support
1--7
Getting Started
8. Connect the power supply to J0290 on the probe adapter. See Figure 1--4.
Plug the power supply into the appropriate AC power source.
9. Use the P6434 probes to connect to the Mictor connectors on the probe
interface board. See Figure 1--4. These are connected to the signal pins as
shown in Table 1--1 through Table 1--12.
10. Connect the module ends of the P6434 probes to the corresponding connectors (match label colors) on the logic analyzer. The probe module ends are
keyed.
11. Apply forced air cooling across the probe adapter and AGP graphics card
consistent with the recommendations of the manufacturer.
Graphics card
To power supply
Probe interface board
Graphics card extender
System
under test
Figure 1--4: Connecting the probes to the probe adapter
P6434 probes (5)
1--8
TMS808 AGP4X Bus State Support
Getting Started
12. The data transfer rate (2X or 4X) must be selected using J0590 on the probe
interface board. See Figure 1--5 for jumper location and settings.
2X
J0590
J0590
4X
Figure 1--5: Selecting the data transfer rate
Channel Assignments
Channel assignments listed in Table 1--1 through Table 1--12 use the following
conventions:
H All signals are required by the support unless indicated otherwise.
H Channels are listed starting with the most significant bit (MSB), descending
to the least significant bit (LSB).
H A pound sign (#) following a signal name indicates an active low signal.
H Channel group assignments are for all modules unless otherwise noted.
H The module in the higher-numbered slot is referred to as the HI module and
the module in the lower-numbered slot is referred to as the LO module.
The TLA 704 logic analyzer has the lower-numbered slots on the top and the
TLA 711 logic analyzer has the lower-numbered slots on the left.
TMS808 AGP4X Bus State Support
1--9
Getting Started
Table 1--1 lists the probe section and channel assignments for the AD[31:0] group
and the bus signal for each channel connect. By default, this channel group is
displayed in hexadecimal.
Table 1--1: AD[31:0] group assignments
Bit order Section:channel AGP4X signal name
31 Lo_A3:7 AD31
30 Lo_A3:6 AD30
29 Lo_A3:5 AD29
28 Lo_A3:4 AD28
27 Lo_A3:3 AD27
26 Lo_A3:2 AD26
25 Lo_A3:1 AD25
24 Lo_A3:0 AD24
23 Lo_A2:7 AD23
22 Lo_A2:6 AD22
21 Lo_A2:5 AD21
20 Lo_A2:4 AD20
19 Lo_A2:3 AD19
18 Lo_A2:2 AD18
17 Lo_A2:1 AD17
16 Lo_A2:0 AD16
15 Lo_A1:7 AD15
14 Lo_A1:6 AD14
13 Lo_A1:5 AD13
12 Lo_A1:4 AD12
11 Lo_A1:3 AD11
10 Lo_A1:2 AD10
9 Lo_A1:1 AD9
8 Lo_A1:0 AD8
7 Lo_A0:7 AD7
6 Lo_A0:6 AD6
5 Lo_A0:5 AD5
4 Lo_A0:4 AD4
3 Lo_A0:3 AD3
2 Lo_A0:2 AD2
1 Lo_A0:1 AD1
0 Lo_A0:0 AD0
1--10
TMS808 AGP4X Bus State Support
Getting Started
Table 1--2 lists the probe section and channel assignments for the AGP_Data_Hi
group and the bus signal for each channel connect. By default, this channel group
is displayed in hexadecimal.
Table 1--2: AGP_Data_Hi channel group assignments
Bit order Section:channel AGP4X signal name
31 Hi_D3:7 D_D63
30 Hi_D3:6 D_D62
29 Hi_D3:5 D_D61
28 Hi_D3:4 D_D60
27 Hi_D3:3 D_D59
26 Hi_D3:2 D_D58
25 Hi_D3:1 D_D57
24 Hi_D3:0 D_D56
23 Hi_D2:7 D_D55
22 Hi_D2:6 D_D54
21 Hi_D2:5 D_D53
20 Hi_D2:4 D_D52
19 Hi_D2:3 D_D51
18 Hi_D2:2 D_D50
17 Hi_D2:1 D_D49
16 Hi_D2:0 D_D48
15 Hi_D1:7 D_D47
14 Hi_D1:6 D_D46
13 Hi_D1:5 D_D45
12 Hi_D1:4 D_D44
11 Hi_D1:3 D_D43
10 Hi_D1:2 D_D42
9 Hi_D1:1 D_D41
8 Hi_D1:0 D_D40
7 Hi_D0:7 D_D39
6 Hi_D0:6 D_D38
5 Hi_D0:5 D_D37
4 Hi_D0:4 D_D36
3 Hi_D0:3 D_D35
2 Hi_D0:2 D_D34
1 Hi_D0:1 D_D33
0 Hi_D0:0 D_D32
TMS808 AGP4X Bus State Support
1--11
Getting Started
Table 1--3 lists the probe section and channel assignments for the AGP_Data_Lo
group and the bus signal for each channel connect. By default, this channel group
is displayed in hexadecimal.
Table 1--3: AGP_Data_Lo channel group assignments
Bit order Section:channel AGP4X signal name
31 Lo_D3:7 D_D31
30 Lo_D3:6 D_D30
29 Lo_D3:5 D_D29
28 Lo_D3:4 D_D28
27 Lo_D3:3 D_D27
26 Lo_D3:2 D_D26
25 Lo_D3:1 D_D25
24 Lo_D3:0 D_D24
23 Lo_D2:7 D_D23
22 Lo_D2:6 D_D22
21 Lo_D2:5 D_D21
20 Lo_D2:4 D_D20
19 Lo_D2:3 D_D19
18 Lo_D2:2 D_D18
17 Lo_D2:1 D_D17
16 Lo_D2:0 D_D16
15 Lo_D1:7 D_D15
14 Lo_D1:6 D_D14
13 Lo_D1:5 D_D13
12 Lo_D1:4 D_D12
11 Lo_D1:3 D_D11
10 Lo_D1:2 D_D10
9 Lo_D1:1 D_D9
8 Lo_D1:0 D_D8
7 Lo_D0:7 D_D7
6 Lo_D0:6 D_D6
5 Lo_D0:5 D_D5
4 Lo_D0:4 D_D4
3 Lo_D0:3 D_D3
2 Lo_D0:2 D_D2
1 Lo_D0:1 D_D1
0 Lo_D0:0 D_D0
1--12
TMS808 AGP4X Bus State Support
Getting Started
Table 1--4 lists the probe section and channel assignments for the BE_Hi group
and the bus signal for each channel connect. By default, this channel group is
displayed as binary.
Table 1--4: BE_Hi channel group assignments
Bit order Section:channel AGP4X signal name
3 Lo_C0:7 D_BE7
2 Lo_C0:6 D_BE6
1 Lo_C0:5 D_BE5
0 Lo_C0:4 D_BE4
Table 1--5 lists the probe section and channel assignments for the BE_Lo group
and the bus signal for each channel connect. By default, this channel group is
displayed as binary.
Table 1--5: BE_Lo channel group assignments
Bit order Section:channel AGP4X signal name
3 Lo_C0:3 D_BE3
2 Lo_C0:2 D_BE2
1 Lo_C0:1 D_BE1
0 Lo_C0:0 D_BE0
Table 1--6 lists the probe section and channel assignments for the Command
group and the bus signal for each channel connect. The symbol table file name is
AGP4X_Command. By default, this channel group is displayed as symbols.
Table 1--6: Command channel group assignments
Bit order Section:channel AGP4X signal name
6 Lo_C1:7 IRDY#
5 Lo_C2:3 FRAME#
4 CLK:0 PIPE#
3 Lo_C1:5 C/BE3#
2 Lo_C1:4 C/BE2#
1 Lo_C1:3 C/BE1#
0 Lo_C1:2 C/BE0#
TMS808 AGP4X Bus State Support
1--13
Getting Started
Table 1--7 lists the probe section and channel assignments for the Status group
and the bus signal for each channel connect. The symbol table file name is
AGP4X_Status. By default, this channel group is displayed as symbols.
Table 1--7: Status group assignments
Bit order Section:channel AGP4X signal name
3 Lo_C2:1 GNT#
2 Hi_A0:2 ST2
1 Hi_A0:1 ST1
0 Hi_A0:0 ST0
Table 1--8 lists the probe section and channel assignments for the SBA[7:0] group
and the bus signal for each channel connect. By default, this channel group is
displayed as hexadecimal.
Table 1--8: SBA[7:0] group assignments
Bit order Section:channel AGP4X signal name
7 Lo_C3:7 SBA7
6 Lo_C3:6 SBA6
5 Lo_C3:5 SBA5
4 Lo_C3:4 SBA4
3 Lo_C3:3 SBA3
2 Lo_C3:2 SBA2
1 Lo_C3:1 SBA1
0 Lo_C3:0 SBA0
1--14
TMS808 AGP4X Bus State Support
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