The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(i i) of the
Rights in Technical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software -- Restricted Rights clause at FAR 52.227-19, as applicable.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077
TEKTRONIX and TEK are registered tradem arks of Tektronix, Inc.
SOFTWARE WARRANTY
Tektronix warrants that the media on which thi s software product is furnished and the encoding of the programs on
the media will be free from defects in materi als and workmanship for a period of three (3) months from the date of
shipment. If a medium or encoding proves defective during the warranty period, Tektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
Tektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninte rrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If Tektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER W ARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
HARDWARE WARRANTY
Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair da mage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modific ation or integration increases the time
or difficulty of servicing the product.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER W ARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Getting Started
General Safety Summaryv...................................
Service Safety Summaryvii....................................
Table 3--3: Lossy delay line values3--6............................
TMS808 AGP4X Bus State Support
iii
Table of Contents
iv
TMS808 AGP4X Bus State Support
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to the
input or output terminals of the product, ensure that the product is properly
grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings
information before making connections to the product.
Connect the ground lead of the probe to earth ground only.
Use Proper AC Adapter. Use only the AC adapter specified for this product.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
TMS808 AGP4X Bus State Support
v
General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
WARNING
High Voltage
Protective Ground
(Earth) Terminal
CAUTION
Refer to Manual
Double
Insulated
vi
TMS808 AGP4X Bus State Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMS808 AGP4X Bus State Support
vii
Service Safety Summary
viii
TMS808 AGP4X Bus State Support
Preface
This instruction manual contains specific information about the
TMS 808 AGP4X bus support package and is part of a set of information on how
to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating bus support packages on the logic analyzer for
which the TMS 808 AGP4X support was purchased, you will probably only
need this instruction manual to set up and run the support package.
If you are not familiar with operating bus support packages, you will need to
supplement this instruction manual with information on basic operations to set
up and run the support package.
Information on basic operations of bus support packages is included with each
product. Each logic analyzer includes basic information that describes how to
perform tasks common to support packages on that platform. This information
can be in the form of online help, an installation manual, or a user manual.
This manual provides detailed information on the following topics:
HConnecting the logic analyzer to the system under test
HSetting up the logic analyzer to acquire data from the system under test
HAcquiring and viewing data
Manual Conventions
This manual uses the following conventions:
HThe phrase “information on basic operations” refers to the logic analyzer
online help, an installation manual, or a user manual covering the basic
operations of bus support.
HThe term “logic analyzer” refers to the Tektronix logic analyzer for which
this product was purchased.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic
analyzer is located in the user manual of the corresponding module. The manual
set provides the information necessary to install, operate, maintain, and service
the logic analyzer and its associated products.
TMS808 AGP4X Bus State Support
ix
Preface
Contacting Tektronix
Phone1-800-833-9200*
AddressTektronix, Inc.
Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web sitewww.tektronix.com
Sales support1-800-833-9200, select option 1*
Service support1-800-833-9200, select option 2*
Technical supportEmail: techsupport@tektronix.com
1-800-833-9200, select option 3*
6:00 a.m. -- 5:00 p.m. Pacific time
*This phone number is toll free in North America. After office hours, pl ease leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
x
TMS808 AGP4X Bus State Support
Getting Started
Getting Started
This chapter contains information on the TMS 808 AGP4X bus support and
information on connecting your logic analyzer to your system under test.
Probe Adapter Description
The probe adapter is nonintrusive hardware that allows the logic analyzer to
acquire data from a bus in its own operating environment with little effect, if any,
on the target system. Information on basic operations in your online help contains
a figure showing the logic analyzer connected to a typical probe adapter. Refer to
that figure while reading the following description.
The probe adapter consists of an extender board and an interface board. The
extender board includes a straddle-mount AGP4X connector that accepts the
original AGP4X card. The extender board has signal conditioning circuitry on it
which extracts proper digital signals from the composite wave on the
transmission lines. The extender board also includes a 114-pin Mictor connector
that transfers the conditioned signals to the interface board. For more detailed
information on the probe adapter refer to the Circuit description on page 3--1.
The interface board contains digital logic which processes the AGP signals for
the logic analyzer to acquire. Mictor connectors on the interface board accept
P6434 probes from the logic analyzer.
The probe adapter accommodates the AGP4X bus and is powered with an
external supply.
Support Package Description
The TMS 808 bus support package acquires and displays data from systems
based on the Intel AGP4X bus.
To use this support efficiently, refer to information on basic operations, in your
online help, and the following documents:
HAccelerated Graphics Port Interface Specification, Intel, Version 2.0, 1998
The AGP interface specification uses the 66 MHz PCI (PCI Local Bus Specification) as an operational baseline and provides four significant performance
extensions or enhancements to the PCI specification which are intended to
optimize the AGP for high performance 3D graphics applications. These AGP
extensions are not described in, or required by, the PCI Local Bus Specification.
TMS808 AGP4X Bus State Support
1--1
Getting Started
These extensions are:
HDeeply pipelined memory read and write operations, fully hiding memory
access latency.
HDemultiplexing of address and data on the bus, allowing almost 100% bus
efficiency.
HNew AC timing in the 3.3 V electrical specification that provides for one,
two, or four data transfers per 66 MHz clock cycle, allowing for real data
throughput in excess of 500 MB/s.
HA new low voltage electrical specification that allows four data transfers per
66--MHz clock cycle, providing real data throughput of up to 1 GB/s.
These enhancements are realized through the use of sideband signals. The PCI
specification has not been modified in any way, and the AGP interface specification has specifically avoided the use of any of the reserved fields, encodings,
pins, and so on, in the PCI specification. The intent is to utilize the PCI design
base while providing a range of graphics-oriented performance enhancements
with varying complexity/performance tradeoffs available to the component
provider.
AGP neither replaces nor diminishes the necessity of PCI in the system. This
high speed port (AGP) is physically, logically, and electrically independent of the
PCI bus. It is an additional connection point in the system. It is intended for the
exclusive use of visual display devices; all other I/O devices will remain on the
PCI bus. The add-in slot defined for AGP uses a new connector body (for
electrical signaling reasons) which is not compatible with the PCI connector; PCI
and AGP boards are not mechanically interchangeable.
Logic Analyzer Software Compatibility
The label on the TMS 808 support floppy disk states which version of logic
analyzer software the support is compatible with.
Logic Analyzer Configuration
For use with a TLA 700 Series, the TMS 808 support requires a minimum of two
102-channel modules that are merged. Modules must be 200 MHz minimum.
Merged modules must be of the same memory depth. If not, the shallower
module will determine the depth of the merged module pair. The modules must
be merged before microprocessor support is loaded. The TLA 700 does not retain
micro support when a merged configuration is unmerged.
1--2
TMS808 AGP4X Bus State Support
Requirements and Restrictions
Review the electrical specifications in the Specifications chapter in this manual
as they pertain to your system under test, as well as the following descriptions of
other AGP4X support requirements and restrictions.
The AGP4X support does not have the ability to connect transferred data and the
requests that generated them.
Hardware Reset. If a hardware reset occurs in your AGP4X system during an
acquisition, the application may acquire an invalid sample.
System Clock Rate. The AGP4X support can acquire data from the bus operating
atspeedsofupto66MHz.
Nonintrusive Acquisition. The AGP4X microprocessor support will not intercept,
modify, or present signals back to the system under test, with the exception noted
under Use of TYPEDET#.
Getting Started
1.5V Operation Only. The AGP4X support can be used with only AGP4X and
AGP2X 1.5 V systems. The AGP2X support will not work with 3.3 V systems.
The AGP4X support will not work with 1X AGP systems. Contact Tektronix for
1X and 2X 3.3V support.
Data Transfer Rate. The AGP4X support will not work with 1X AGP systems.
Contact Tektronix for 1X and 2X, 3.3V support.
Use of TYPEDET#. The TYPEDET# signal is connected to ground on the
motherboard and is unconnected on the AGP4X connector. This will force the
motherboard logic to use 1.5 V signaling.
AGP Modes not Verified. PIPE# mode and AGP fast writes are not tested, so
Tektronix cannot guarantee functionality.
State Mode Display. The state mode waveform display must not be used to
observe signals that have a repetition rate greater than the sampling frequency.
For example, the AD[31:0], Strobes, SBA[7:0], and BE signals will yield
incorrect values in the State mode waveform window. This is because the
sampling rate is 133 MHz, where as these signals; AD[31:0], Strobes, SBA[7:0],
and BE, can change at a rate of 266 MHz and may not show a steady state.
TMS808 AGP4X Bus State Support
1--3
Getting Started
MagniVu. Timing signals displayed in groups AD[31:0] and SBA[7:0] should not
be used for accurate timing measurements.
Threshold. The AGP4X support hardware uses GND-based threshold for
detecting the levels, rather than using Vrefgc or Vrefcg. So a change in interface
voltage levels may appear as changes in timings.
Connecting the Logic Analyzer to a System Under Test
To connect the probes to AGP4X signals in the system under test, follow these
steps:
1. Power off your system under test. It is not necessary to power off the logic
analyzer.
CAUTION. Static discharge can damage the bus, the probes, and the logic
analyzer module. To prevent static damage, handle these components only in a
static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the bus.
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer.
3. Place the system under test on a horizontal, static-free surface.
4. Plug the probe interface board into the graphics card extender as shown in
Figure 1--1 on page 1--5.
5. Secure the two boards together with the hardware provided.
1--4
TMS808 AGP4X Bus State Support
Spacers (4)
Getting Started
Screws (8)
Probe interface board
Graphics card extender
Figure 1--1: Connecting the probe adapter boards together
TMS808 AGP4X Bus State Support
1--5
Getting Started
6. Plug the graphics card into the probe adapter. The video out silk-screen
symbol on the probe interface board should point to the same side as the
XGA video connector on the graphics card, as shown in Figure 1--2.
CAUTION. To prevent damaging the graphics card, probe adapter, or system
under test when power is applied, be sure to connect the AGP graphics card to
the probe adapter properly .
NOTE. The TMS 808 product only supports 1.5V graphics cards.
XGA video connector (typical)
Both facing
same side
Graphics card
Probe interface board
Graphics card extender
1--6
Figure 1--2: Connecting the graphics card to the probe adapter
TMS808 AGP4X Bus State Support
Getting Started
NOTE. The graphics card must be plugged into the probe adapter for proper
operation.
7. Plug the probe adapter into the system under test as shown in Figure 1--3.
CAUTION. To prevent damaging the graphics card, probe adapter, or system
under test when power is applied, be sure to connect the probe adapter to the
system under test properly .
XGA video connector (typical)
Graphics card
Power supply
connector
Probe interface board
Pin 1
Graphics card extender
Index key
(not present
on all system
boards)
System
under test
Figure 1--3: Connecting the probe adapter and graphics card to the system
TMS808 AGP4X Bus State Support
1--7
Getting Started
8. Connect the power supply to J0290 on the probe adapter. See Figure 1--4.
Plug the power supply into the appropriate AC power source.
9. Use the P6434 probes to connect to the Mictor connectors on the probe
interface board. See Figure 1--4. These are connected to the signal pins as
shown in Table 1--1 through Table 1--12.
10. Connect the module ends of the P6434 probes to the corresponding connectors (match label colors) on the logic analyzer. The probe module ends are
keyed.
11. Apply forced air cooling across the probe adapter and AGP graphics card
consistent with the recommendations of the manufacturer.
Graphics card
To power supply
Probe interface board
Graphics card extender
System
under test
Figure 1--4: Connecting the probes to the probe adapter
P6434 probes (5)
1--8
TMS808 AGP4X Bus State Support
Getting Started
12. The data transfer rate (2X or 4X) must be selected using J0590 on the probe
interface board. See Figure 1--5 for jumper location and settings.
2X
J0590
J0590
4X
Figure 1--5: Selecting the data transfer rate
Channel Assignments
Channel assignments listed in Table 1--1 through Table 1--12 use the following
conventions:
HAll signals are required by the support unless indicated otherwise.
HChannels are listed starting with the most significant bit (MSB), descending
to the least significant bit (LSB).
HA pound sign (#) following a signal name indicates an active low signal.
HChannel group assignments are for all modules unless otherwise noted.
HThe module in the higher-numbered slot is referred to as the HI module and
the module in the lower-numbered slot is referred to as the LO module.
The TLA 704 logic analyzer has the lower-numbered slots on the top and the
TLA 711 logic analyzer has the lower-numbered slots on the left.
TMS808 AGP4X Bus State Support
1--9
Getting Started
Table 1--1 lists the probe section and channel assignments for the AD[31:0] group
and the bus signal for each channel connect. By default, this channel group is
displayed in hexadecimal.
Table 1--1: AD[31:0] group assignments
Bit orderSection:channel AGP4X signal name
31Lo_A3:7AD31
30Lo_A3:6AD30
29Lo_A3:5AD29
28Lo_A3:4AD28
27Lo_A3:3AD27
26Lo_A3:2AD26
25Lo_A3:1AD25
24Lo_A3:0AD24
23Lo_A2:7AD23
22Lo_A2:6AD22
21Lo_A2:5AD21
20Lo_A2:4AD20
19Lo_A2:3AD19
18Lo_A2:2AD18
17Lo_A2:1AD17
16Lo_A2:0AD16
15Lo_A1:7AD15
14Lo_A1:6AD14
13Lo_A1:5AD13
12Lo_A1:4AD12
11Lo_A1:3AD11
10Lo_A1:2AD10
9Lo_A1:1AD9
8Lo_A1:0AD8
7Lo_A0:7AD7
6Lo_A0:6AD6
5Lo_A0:5AD5
4Lo_A0:4AD4
3Lo_A0:3AD3
2Lo_A0:2AD2
1Lo_A0:1AD1
0Lo_A0:0AD0
1--10
TMS808 AGP4X Bus State Support
Getting Started
Table 1--2 lists the probe section and channel assignments for the AGP_Data_Hi
group and the bus signal for each channel connect. By default, this channel group
is displayed in hexadecimal.
Table 1--2: AGP_Data_Hi channel group assignments
Bit orderSection:channel AGP4X signal name
31Hi_D3:7D_D63
30Hi_D3:6D_D62
29Hi_D3:5D_D61
28Hi_D3:4D_D60
27Hi_D3:3D_D59
26Hi_D3:2D_D58
25Hi_D3:1D_D57
24Hi_D3:0D_D56
23Hi_D2:7D_D55
22Hi_D2:6D_D54
21Hi_D2:5D_D53
20Hi_D2:4D_D52
19Hi_D2:3D_D51
18Hi_D2:2D_D50
17Hi_D2:1D_D49
16Hi_D2:0D_D48
15Hi_D1:7D_D47
14Hi_D1:6D_D46
13Hi_D1:5D_D45
12Hi_D1:4D_D44
11Hi_D1:3D_D43
10Hi_D1:2D_D42
9Hi_D1:1D_D41
8Hi_D1:0D_D40
7Hi_D0:7D_D39
6Hi_D0:6D_D38
5Hi_D0:5D_D37
4Hi_D0:4D_D36
3Hi_D0:3D_D35
2Hi_D0:2D_D34
1Hi_D0:1D_D33
0Hi_D0:0D_D32
TMS808 AGP4X Bus State Support
1--11
Getting Started
Table 1--3 lists the probe section and channel assignments for the AGP_Data_Lo
group and the bus signal for each channel connect. By default, this channel group
is displayed in hexadecimal.
Table 1--3: AGP_Data_Lo channel group assignments
Bit orderSection:channel AGP4X signal name
31Lo_D3:7D_D31
30Lo_D3:6D_D30
29Lo_D3:5D_D29
28Lo_D3:4D_D28
27Lo_D3:3D_D27
26Lo_D3:2D_D26
25Lo_D3:1D_D25
24Lo_D3:0D_D24
23Lo_D2:7D_D23
22Lo_D2:6D_D22
21Lo_D2:5D_D21
20Lo_D2:4D_D20
19Lo_D2:3D_D19
18Lo_D2:2D_D18
17Lo_D2:1D_D17
16Lo_D2:0D_D16
15Lo_D1:7D_D15
14Lo_D1:6D_D14
13Lo_D1:5D_D13
12Lo_D1:4D_D12
11Lo_D1:3D_D11
10Lo_D1:2D_D10
9Lo_D1:1D_D9
8Lo_D1:0D_D8
7Lo_D0:7D_D7
6Lo_D0:6D_D6
5Lo_D0:5D_D5
4Lo_D0:4D_D4
3Lo_D0:3D_D3
2Lo_D0:2D_D2
1Lo_D0:1D_D1
0Lo_D0:0D_D0
1--12
TMS808 AGP4X Bus State Support
Getting Started
Table 1--4 lists the probe section and channel assignments for the BE_Hi group
and the bus signal for each channel connect. By default, this channel group is
displayed as binary.
Table 1--4: BE_Hi channel group assignments
Bit orderSection:channel AGP4X signal name
3Lo_C0:7D_BE7
2Lo_C0:6D_BE6
1Lo_C0:5D_BE5
0Lo_C0:4D_BE4
Table 1--5 lists the probe section and channel assignments for the BE_Lo group
and the bus signal for each channel connect. By default, this channel group is
displayed as binary.
Table 1--5: BE_Lo channel group assignments
Bit orderSection:channel AGP4X signal name
3Lo_C0:3D_BE3
2Lo_C0:2D_BE2
1Lo_C0:1D_BE1
0Lo_C0:0D_BE0
Table 1--6 lists the probe section and channel assignments for the Command
group and the bus signal for each channel connect. The symbol table file name is
AGP4X_Command. By default, this channel group is displayed as symbols.
Table 1--6: Command channel group assignments
Bit orderSection:channel AGP4X signal name
6Lo_C1:7IRDY#
5Lo_C2:3FRAME#
4CLK:0PIPE#
3Lo_C1:5C/BE3#
2Lo_C1:4C/BE2#
1Lo_C1:3C/BE1#
0Lo_C1:2C/BE0#
TMS808 AGP4X Bus State Support
1--13
Getting Started
Table 1--7 lists the probe section and channel assignments for the Status group
and the bus signal for each channel connect. The symbol table file name is
AGP4X_Status. By default, this channel group is displayed as symbols.
Table 1--7: Status group assignments
Bit orderSection:channel AGP4X signal name
3Lo_C2:1GNT#
2Hi_A0:2ST2
1Hi_A0:1ST1
0Hi_A0:0ST0
Table 1--8 lists the probe section and channel assignments for the SBA[7:0] group
and the bus signal for each channel connect. By default, this channel group is
displayed as hexadecimal.
Table 1--8: SBA[7:0] group assignments
Bit orderSection:channel AGP4X signal name
7Lo_C3:7SBA7
6Lo_C3:6SBA6
5Lo_C3:5SBA5
4Lo_C3:4SBA4
3Lo_C3:3SBA3
2Lo_C3:2SBA2
1Lo_C3:1SBA1
0Lo_C3:0SBA0
1--14
TMS808 AGP4X Bus State Support
Getting Started
Table 1--9 lists the probe section and channel assignments for the SBA_Hi group
and the bus signal for each channel connect. By default, this channel group is
displayed as hexadecimal.
Table 1--9: SBA_Hi channel group assignments
Bit orderSection:channel AGP4X signal name
7Hi_A3:7D_SBA15
6Hi_A3:6D_SBA14
5Hi_A3:5D_SBA13
4Hi_A3:4D_SBA12
3Hi_A3:3D_SBA11
2Hi_A3:2D_SBA10
1Hi_A3:1D_SBA9
0Hi_A3:0D_SBA8
Table 1--10 lists the probe section and channel assignments for the SBA_Lo
group and the bus signal for each channel connect. By default, this channel group
is displayed as hexadecimal.
Table 1--10: SBA_Lo channel group assignments
Bit orderSection:channel AGP4X signal name
7Hi_A2:7D_SBA7
6Hi_A2:6D_SBA6
5Hi_A2:5D_SBA5
4Hi_A2:4D_SBA4
3Hi_A2:3D_SBA3
2Hi_A2:2D_SBA2
1Hi_A2:1D_SBA1
0Hi_A2:0D_SBA0
TMS808 AGP4X Bus State Support
1--15
Getting Started
Table 1--11 lists the probe section and channel assignments of the Control group
and the bus signal for each channel connect. The symbol table file name is
AGP4X_Control. By default, this channel group is displayed as symbols.
Table 1--11: Control channel group assignments
Bit orderSection:channel AGP4X signal name
13CLK:1RST#
12Hi_A0:5PME#
11Hi_A0:3RBF#
10Hi_A1:3SERR#
9Hi_A1:7PERR#
8Hi_A1:6PAR
7Hi_A1:5REQ#
6Lo_C2:1GNT#
5CLK:0PIPE#
4Lo_C2:3FRAME#
3Lo_C1:7IRDY#
2Lo_C1:6TRDY#
1Hi_A1:4DEVSEL#
0Lo_C2:0STOP#
Table 1--12 lists the probe section and channel assignments for the Misc group
and the bus signal for each channel connect. By default, this channel group is
displayed as hexadecimal.
Table 1--12: Misc channel group assignments
Bit orderSection:channel AGP4X signal name
10Lo_C2:7AD_STB0
9Lo_C2:6AD_STB0#
8Lo_C2:5AD_STB1
7Lo_C2:4AD_STB1#
6Lo_C1:1SB_STB
5Lo_C1:0SB_STB#
4Hi_A1:2OVRCNT#
3Hi_A0:4WBF#
2Hi_A0:7INTA#
1Hi_A0:6INTB#
0CLK:3CLK
1--16
TMS808 AGP4X Bus State Support
Getting Started
Table 1--13 lists the probe section and channel assignments for the D_AD_Strobe
group and the bus signal for each channel connect. The default radix of this
channel group is binary.
Table 1--13: D_AD_Strobe channel group assignments
Bit orderSection:channel AGP4X signal name
1Lo_C2:2D_AD_STB
1
The prefix D_ indicates that the signal is derived on the probe adapter.
1
Table 1--14 lists the probe section and channel assignments for the D_SB_Strobe
group and the bus signal for each channel connect. The default radix of this
channel group is binary.
Table 1--14: D_SB_Strobe channel group assignments
Bit orderSection:channel AGP4X signal name
1Qual:0D_SB_STB
1
The prefix D_ indicates that the signal is derived on the probe adapter.
1
Table 1--15 lists the probe section and channel assignments for the clock probes
(not part of any group) and the AGP4X signal to which each channel connects.
Table 1--15: Clock and qualifier channel assignments
LA section and probeAGP4X signal name
CLK:0PIPE#
CLK:1RST#
CLK:2D_PCI_STATUS#
CLK:3CLK
Lo_C2:0STOP#
Lo_C2:1GNT#
Lo_C2:2D_AD_STB
Lo_C2:3FRAME#
QUAL:0D_SB_STB
QUAL:1NC
TMS808 AGP4X Bus State Support
1--17
Getting Started
Table 1--16 lists the AGP4X bus signals required by the Clocking State Machine (CSM) to properly strobe and log in the bus bus cycles into acquisition
memory. Signals required for any probe adapter circuitry, if that circuitry is
required for custom acquisition, must also be included.
Table 1--16: Channel groups required for clocking
TLA 700 channelAGP4X signal name
Lo_A3:7--0AD[31:0]
Lo_A2:7--0(AD[31:0] Group)
Lo_A1:7--0
Lo_A0:7--0
Hi_D3:7--0D_D[63:32]
Hi_D2:7--0(AGP_Data_Hi Group)
Hi_D1:7--0
Hi_D0:7--0
Lo_D3:7--0D_D[31:0]
Lo_D2:7--0(AGP_Data_Lo Group)
Lo_D1:7--0
Lo_D0:7--0
Lo_C0:7--4D_BE[7--4]
(BE_Hi Group)
Lo_C0:3--0D_BE[3--0]
(BE_Lo Group)
Lo_C1:7IRDY#
Lo_C2:3FRAME#
CLK:1RST#
Lo_C1:5C/BE3#
Lo_C1:4C/BE2#
Lo_C1:3C/BE1#
Lo_C1:2C/BE0#
(Command Group)
Lo_C2:1GNT#
1--18
Hi_A0:2--0ST[2--0]
(Status Group)
Hi_A3:7--0D_SBA[15--8]
(SBA_Hi Group)
TMS808 AGP4X Bus State Support
Table 1--16: Channel groups required for clocking (Cont.)
TLA 700 channelAGP4X signal name
Hi_A2:7--0D_SBA[7--0]
(SBA_Lo Group)
QUAL:0D_SB_STB
Hi_A0:5PME#
Hi_A0:3RBF#
Hi_A1:3SERR#
Hi_A1:7PERR#
Hi_A1:6PAR
Hi_A1:5REQ#
Lo_C2:1GNT#
CLK:1RST#
Lo_C2:3FRAME#
Getting Started
Lo_C1:7IRDY#
Lo_C1:6TRDY#
Hi_A1:4DEVSEL#
Lo_C2:0STOP#
(Control Group)
CLK:0PIPE#
CLK:1RST#
CLK:2D_PCI_STATUS#
CLK:3CLK
(Clock and Qualifiers)
Lo_C2:0STOP#
Lo_C2:1GNT#
Lo_C2:2D_AD_STB
Lo_C2:3FRAME#
(Qualifiers)
TMS808 AGP4X Bus State Support
1--19
Getting Started
Table 1--17 lists channel groups not required for clocking by the AGP4X support.
Table 1--17: Channel groups not required for clocking
TLA 700 channelAGP4X signal name
Hi_A1:2OVRCNT#
Hi_A0:7INTA#
Hi_A0:6INTB#
Hi_A0:4WBF#
Lo_C2:7AD_STB0
Lo_C2:6AD_STB0#
Lo_C2:5AD_STB1
Lo_C2:4AD_STB1#
Lo_C1:1SB_STB
Lo_C1:0SB_STB#
Lo_C3:7-0SBA[7-0]
Acquisition Setup. The AGP4X support will affect the logic analyzer setup menus
and submenus by modifying existing fields and adding micro-specific fields.
The AGP4X support will add the selections AGP4X and AGP2X to the Load
Support Package dialog box, located under the File pulldown menu. Once the
AGP4X support has been loaded, the Custom clocking mode selection in the
module Setup menu is also enabled.
1--20
TMS808 AGP4X Bus State Support
Getting Started
Table 1--18 lists the signals that are available on test pads on the probe adapter,
but not connected to the Mictor connectors.
Table 1--18: Signals on the probe adapter that are not acquired
AGP4X pin numberAGP4X signal name
B4USB+
A4USB--
A66Vrefgc
B66Vrefcg
A34Vddq1.5
A28Vcc3.3
B243.3Vaux
B25.0V
A112.0V
Channel Charts
Tables 1--19 through 1--26 identify the signal names assigned to the acquisition
channel numbers on the logic analyzer.
Table 1--19: Clock channels
CLK or
TLA clock channel
CLK:3CLKBothCLK
CLK:2QUALD_PCI_STATUS#
CLK:1QUALRST#
CLK:0QUALPIPE#
Qual
Active
CLK edge
AGP4X signal name
Table 1--20: Qual channels
TLA Qual channelAGP4X signal name
QUAL:1NC
QUAL:0D_SB_STB
TMS808 AGP4X Bus State Support
1--21
Getting Started
Table 1--21: 32 Channel Address_Lo section on the lower
module
TLA acquisition
channel
Lo_A3:7LOGA7AD31
Lo_A3:6LOGA7AD30
Lo_A3:5LOGA7AD29
Lo_A3:4LOGA7AD28
Lo_A3:3LOGA6AD27
Lo_A3:2LOGA6AD26
Lo_A3:1LOGA6AD25
Lo_A3:0LOGA6AD24
Lo_A2:7LOGA5AD23
Lo_A2:6LOGA5AD22
Lo_A2:5LOGA5AD21
Lo_A2:4LOGA5AD20
Lo_A2:3LOGA4AD19
Lo_A2:2LOGA4AD18
Lo_A2:1LOGA4AD17
Lo_A2:0LOGA4AD16
Lo_A1:7LOGA3AD15
Lo_A1:6LOGA3AD14
Lo_A1:5LOGA3AD13
Lo_A1:4LOGA3AD12
Lo_A1:3LOGA2AD11
Lo_A1:2LOGA2AD10
Lo_A1:1LOGA2AD9
Lo_A1:0LOGA2AD8
Lo_A0:7LOGA1AD7
Lo_A0:6LOGA1AD6
Lo_A0:5LOGA1AD5
Lo_A0:4LOGA1AD4
Lo_A0:3LOGA0AD3
Lo_A0:2LOGA0AD2
Lo_A0:1LOGA0AD1
Lo_A0:0LOGA0AD0
Login
group
AGP4X signal name
1--22
TMS808 AGP4X Bus State Support
Table 1--22: 32 Channel Address_Hi Section on the lower
module
Getting Started
TLA acquisition
channel
Hi_A3:7LOGA7D_SBA15
Hi_A3:6LOGA7D_SBA14
Hi_A3:5LOGA7D_SBA13
Hi_A3:4LOGA7D_SBA12
Hi_A3:3LOGA6D_SBA11
Hi_A3:2LOGA6D_SBA10
Hi_A3:1LOGA6D_SBA9
Hi_A3:0LOGA6D_SBA8
Hi_A2:7LOGA5D_SBA7
Hi_A2:6LOGA5D_SBA6
Hi_A2:5LOGA5D_SBA5
Hi_A2:4LOGA5D_SBA4
Hi_A2:3LOGA4D_SBA3
Hi_A2:2LOGA4D_SBA2
Hi_A2:1LOGA4D_SBA1
Hi_A2:0LOGA4D_SBA0
Hi_A1:7LOGA3PERR#
Hi_A1:6LOGA3PAR
Hi_A1:5LOGA3REQ#
Hi_A1:4LOGA3DEVSEL#
Hi_A1:3LOGA2SERR#
Hi_A1:2LOGA2OVRCNT#
Hi_A1:1LOGA2NC
Hi_A1:0LOGA2NC
Hi_A0:7LOGA1INTA#
Hi_A0:6LOGA1INTB#
Hi_A0:5LOGA1PME#
Hi_A0:4LOGA1WBF#
Hi_A0:3LOGA0RBF#
Hi_A0:2LOGA0ST2
Hi_A0:1LOGA0ST1
Hi_A0:0LOGA0ST0
Login
group
AGP4X signal name
TMS808 AGP4X Bus State Support
1--23
Getting Started
Table 1--23: 32 Channel Data_Hi section on the higher
module
TLA acquisition
channel
Hi_D3:7LOGD7D_D63
Hi_D3:6LOGD7D_D62
Hi_D3:5LOGD7D_D61
Hi_D3:4LOGD7D_D60
Hi_D3:3LOGD6D_D59
Hi_D3:2LOGD6D_D58
Hi_D3:1LOGD6D_D57
Hi_D3:0LOGD6D_D56
Hi_D2:7LOGD5D_D55
Hi_D2:6LOGD5D_D54
Hi_D2:5LOGD5D_D53
Hi_D2:4LOGD5D_D52
Hi_D2:3LOGD4D_D51
Hi_D2:2LOGD4D_D50
Hi_D2:1LOGD4D_D49
Hi_D2:0LOGD4D_D48
Hi_D1:7LOGD3D_D47
Hi_D1:6LOGD3D_D46
Hi_D1:5LOGD3D_D45
Hi_D1:4LOGD3D_D44
Hi_D1:3LOGD2D_D43
Hi_D1:2LOGD2D_D42
Hi_D1:1LOGD2D_D41
Hi_D1:0LOGD2D_D40
Hi_D0:7LOGD1D_D39
Hi_D0:6LOGD1D_D38
Hi_D0:5LOGD1D_D37
Hi_D0:4LOGD1D_D36
Hi_D0:3LOGD0D_D35
Hi_D0:2LOGD0D_D34
Hi_D0:1LOGD0D_D33
Hi_D0:0LOGD0D_D32
Login
group
AGP4X signal name
1--24
TMS808 AGP4X Bus State Support
Table 1--24: 32 Channel Data_Lo section on the lower
module
Getting Started
TLA acquisition
channel
Lo_D3:7LOGD7D_D31
Lo_D3:6LOGD7D_D30
Lo_D3:5LOGD7D_D29
Lo_D3:4LOGD7D_D28
Lo_D3:3LOGD6D_D27
Lo_D3:2LOGD6D_D26
Lo_D3:1LOGD6D_D25
Lo_D3:0LOGD6D_D24
Lo_D2:7LOGD5D_D23
Lo_D2:6LOGD5D_D22
Lo_D2:5LOGD5D_D21
Lo_D2:4LOGD5D_D20
Lo_D2:3LOGD4D_D19
Lo_D2:2LOGD4D_D18
Lo_D2:1LOGD4D_D17
Lo_D2:0LOGD4D_D16
Lo_D1:7LOGD3D_D15
Lo_D1:6LOGD3D_D14
Lo_D1:5LOGD3D_D13
Lo_D1:4LOGD3D_D12
Lo_D1:3LOGD2D_D11
Lo_D1:2LOGD2D_D10
Lo_D1:1LOGD2D_D9
Lo_D1:0LOGD2D_D8
Lo_D0:7LOGD1D_D7
Lo_D0:6LOGD1D_D6
Lo_D0:5LOGD1D_D5
Lo_D0:4LOGD1D_D4
Lo_D0:3LOGD0D_D3
Lo_D0:2LOGD0D_D2
Lo_D0:1LOGD0D_D1
Lo_D0:0LOGD0D_D0
Login
group
AGP4X signal name
TMS808 AGP4X Bus State Support
1--25
Getting Started
Table 1--25: 32 Channel Control section (sorted by channel
number) on the lower module
TLA acquisition
channel
Lo_C3:7LOGC7SBA7
Lo_C3:6LOGC6SBA6
Lo_C3:5LOGC5SBA5
Lo_C3:4LOGC4SBA4
Lo_C3:3LOGC7SBA3
Lo_C3:2LOGC6SBA2
Lo_C3:1LOGC5SBA1
Lo_C3:0LOGC4SBA0
Lo_C2:7LOGC7AD_STB0
Lo_C2:6LOGC6AD_STB0#
Lo_C2:5LOGC5AD_STB1
Lo_C2:4LOGC4AD_STB1#
Lo_C2:3%
Lo_C2:2%*LOGC6D_AD_STB
Lo_C2:1%*LOGC5GNT#
Lo_C2:0%
Lo_C1:7LOGC3IRDY#
Lo_C1:6LOGC2TRDY#
Lo_C1:5LOGC1C/BE3#
Lo_C1:4LOGC0C/BE2#
Lo_C1:3LOGC3C/BE1#
Lo_C1:2LOGC2C/BE0#
Lo_C1:1LOGC1SB_STB
Lo_C1:0LOGC0SB_STB#
Lo_C0:7LOGC3D_BE7
Lo_C0:6LOGC2D_BE6
Lo_C0:5LOGC1D_BE5
Lo_C0:4LOGC0D_BE4
Lo_C0:3LOGC3D_BE3
Lo_C0:2LOGC2D_BE2
Lo_C0:1LOGC1D_BE1
Lo_C0:0LOGC0D_BE0
*Indicates the channel is a qualifier
*
*
Login
group
LOGC7FRAME#
LOGC4STOP#
AGP4X signal name
1--26
TMS808 AGP4X Bus State Support
Table 1--26: 32 Channel Control Section (sorted by login
group) on the lower module
Getting Started
TLA acquisition
channel
Lo_C3:7LOGC7SBA7
Lo_C3:3LOGC7SBA3
Lo_C2:7LOGC7AD_STB0
Lo_C2:3*LOGC7FRAME#
Lo_C3:6LOGC6SBA6
Lo_C3:2LOGC6SBA2
Lo_C2:6LOGC6AD_STB0#
Lo_C2:2*LOGC6D_AD_STB
Lo_C3:5LOGC5SBA5
Lo_C3:1LOGC5SBA1
Lo_C2:5LOGC5AD_STB1
Lo_C2:1*LOGC5GNT#
Lo_C3:4LOGC4SBA4
Lo_C3:0LOGC4SBA0
Lo_C2:4LOGC4AD_STB1#
Lo_C2:0*LOGC4STOP#
Lo_C1:7LOGC3IRDY#
Lo_C1:3LOGC3C/BE1#
Lo_C0:7LOGC3D_BE7
Lo_C0:3LOGC3D_BE3
Lo_C1:6LOGC2TRDY#
Lo_C1:2LOGC2C/BE0#
Lo_C0:6LOGC2D_BE6
Lo_C0:2LOGC2D_BE2
Lo_C1:5LOGC1C/BE3#
Lo_C1:1LOGC1SB_STB
Lo_C0:5LOGC1D_BE5
Lo_C0:1LOGC1D_BE1
Lo_C1:4LOGC0C/BE2#
Lo_C1:0LOGC0SB_STB#
Lo_C0:4LOGC0D_BE4
Lo_C0:0LOGC0D_BE0
*Indicates the channel is a qualifier
Login
group
AGP4X signal name
TMS808 AGP4X Bus State Support
1--27
Getting Started
Standard Accessories
Options
The TMS 808 Support is shipped with the following standard accessories:
HTMS 808 Support SW Disk
HTMS 808 Support Instruction Manual
HTLA 700 Series Micro Installation Sheet
The following options are available when ordering the TMS 808 Support:
HOption 11--Add Probe Adapter
HOption 21--Add P6434 Mass-Termination Probes (5)
HOption A1 Power Cord
Troubleshooting Guide
HOption A2 Power Cord
HOption A3 Power Cord
HOption A5 Power Cord
HOption A99 Delete Power Cord
This Troubleshooting Guide is provided to ensure that the probe adapter is
functioning correctly. It is recommended that you read the following bullets.
CAUTION. Ensure that the probe adapter is properly plugged in the correct
orientation. Please note that it is possible to insert the probe adapter in a
universal socket in an incorrect orientation, which may damage the probe
adapter and the system under test (see Figure 1--2 on page 1--6). The label
‘video out’ on the probe adapter indicates the direction in which a normal
display adapter would have its video out connector.
HMake sure that power is reaching the probe adapter. To verify this, look at the
green LED near the heat sink on the extender board of the probe adapter. It
will be on; if it is not, it may indicate that the power adapter is not properly
plugged in or powered on. If the LED is still not on, the probe adapter may
have a problem that needs servicing.
1--28
TMS808 AGP4X Bus State Support
Getting Started
HMake sure that all the Mictor connectors are plugged in correctly. The
activity window (select the Show Activity button on the Setup panel) may be
used to verify this. Run a test program on the system under test and verify
that the signals are showing activity (toggling) as expected.
HThe Show Activity window can also be used to detect which mode of AGP
the system is running. When a program that uses AGP transfers is being run
on the system under test, the following can be observed:
HAD_STB0 (C2:7) toggles in the case of any AGP activity
HSB_STB (C1:1) toggles if the system uses side band for address queuing
HThe complementary strobes AD_STB0# (C2:6) and SB_STB# (C1:0)
toggle when the transfer rate is 4X (but not in 2X).
HPlease note when using an AGP 2X system that you must change the jumper
(J0590) on the adapter board (see Figure 1--5 on page 1--9 for J0590
location) and load the separate support package named AGP 2X. Also, the
TMS 808 supports only 1.5V signaling.
HWhile triggering on data being transferred by AGP protocol, avoid triggering
on AD bus signals. Since AD bus signals change faster than the custom
sampling rate, there are chances of false triggering. Instead use
AGP_Data_Hi or AGP_Data_Lo groups. Normally, the first and third data in
a cycle appear on the Data_hi group.
HSignals that change state faster than the custom sampling rate when observed
in the state waveform window, may appear as incorrect representations.
These include the AD bus, SBA bus and the strobes.
TMS808 AGP4X Bus State Support
1--29
Getting Started
1--30
TMS808 AGP4X Bus State Support
Operating Basics
Setting Up the Support
This section provides information on how to set up the support. The information
covers the following topics:
HSymbol table files
HClocking options
The information in this section is specific to the operations and functions of the
TMS 808 AGP4X support on any Tektronix logic analyzer for which it can be
purchased.
Before you acquire and display disassemble data, you need to load the support
and specify the setups for clocking and triggering as described in the information
on basic operations. The support provides default values for each of these setups,
but you can change them as needed.
Channel Group Definitions
The software automatically defines channel groups for the support. The channel
groups for the AGP4X support are AD[31:0], AGP_Data_Hi, AGP_Data_Lo,
BE_Hi, BE_Lo, Command, Status, SBA_Hi, SBA_Lo, Control, Misc,
D_AD_Strobe and D_SB_Strobe. If you want to know which signal is in which
group, refer to the channel assignment tables beginning on page 1--10.
Symbols
The TMS 808 support supplies four symbol table files. Each file replaces specific
channel group values with symbolic values when Symbolic is the radix for the
channel group.
Table 2--1 shows the name, bit pattern, and meaning for the symbols in the file
AGP4X_Command, the Command channel group symbol table.
Table 2--1: Command group symbol table definitions
Command group value
IRDY#C/BE2#
Symbol
-X11XXXX
Bus_FaultX00XXXX
FRAME#C/BE1#
PIPE#C/BE0#
TMS808 AGP4X Bus State Support
C/BE3#
Meaning
Not an AGP or PCI command
Bus Fault
2--1
Setting Up the Support
Table 2--1: Command group symbol table definitions (cont.)
This part of the chapter explains how the module acquires AGP4X signals using
the TMS 808 software and probe adapter. This part also provides additional
information on bus signals accessible on or not accessible on the probe adapter,
and on extra probe channels available for you to use for additional connections, if
any.
Custom Clocking
Clocking Options
A special clocking program is loaded to the module every time you load the
AGP4X or AGP2X support. This special clocking is called Custom.
With Custom clocking, the module logs in signals from multiple groups of
channels at different times as they become valid on the AGP4X bus. The module
then sends all the logged-in signals to the trigger machine and to the memory of
the module for storage.
Although all cycle types are acquired, there are too many to illustrate in this
manual. Refer to the AGP4X Interface Specifications for descriptions of the other
cycle types.
There are two field settings in the clocking options for the AGP4X and AGP2X:
Address Enqueuing and Acquisition Edge. The first field is called Address
Enqueuing, and its selections are as follows:
HOn AD Bus Only
HOn SBA Bus OnlyDefault
The selection On AD Bus Only is used to indicate the enqueuing of the addresses
using the PIPE# signal. The addresses are now available on the AD[31..0] bus in
this mode. The On AD Bus Only is used whenever the AGP master (AGP4X
connector) uses the AD bus in a multiplexed manner for transferring and data
information.
2--6
The selection On SBA Bus Only is used to indicate the enqueuing of the
addresses using the Side Band strobe signals. The addresses are now available on
the SBA[7..0] bus in this mode. The On SBA Bus Only selection is used
whenever the AGP master (AGP4X connector) has implemented side band
signals and uses them to enqueue requests. The On SBA Bus Only selection is
potentially the higher performance method; therefore, its defined as the default.
The second field is called Acquisition Edge, and its selections are as follows:
HActive Cycles OnlyDefault
HRising Only
HFalling Only
TMS808 AGP4X Bus State Support
Setting Up the Support
HRising & Falling
The selection Active Cycles Only clocks in only those cycles which have valid
data on the AD[31..0], SBA[7..0], C/BE[3-0]#, and the ST[2..0] buses. The
Active Cycles Only selection is used to acquire data. In this mode the AGP4X
support will correctly identify valid cycles and display them. Active Cycles Only
is defined as the default.
The selection Rising Only CLK Edge clocks in all the channels on the rising
edge of the AGP CLK signal. The Rising Only selection will not acquire AGP
cycles correctly, but can acquire PCI type cycles, even if qualifying signals are
not present.
The following selections Falling Only and Rising & Falling are used only if data
capture at the particular edge of AGP clock is important, even if the qualifying
signals are not present.
The selection Falling Only CLK Edge clocks in all the channels on the falling
edge of the AGP CLK signal.
Setup/Hold Adjustment
Procedure
The selection Rising & Falling CLK Edge clocks in all the channels on both the
rising and falling edges of the AGP CLK signal.
The purpose of this Setup/Hold adjustment procedure is to determine if the
Setup/Hold values need to be adjusted to remove timing violations, so that the
state data will be accurately displayed on the logic analyzer. The minimum
Setup/Hold requirement for logic analyzer using merged modules is 2.5 ns/0 ns
typical (3.5 ns/0 ns worst case).
The AGP4X support uses CLK edges to log in both the CLK synchronous and
source synchronous signals. The source synchronous signals can be shifted in
time with respect to the CLK according to the AGP specifications. Therefore, the
D_AD_STB or the D_SB_STB may not be stable within the Setup/Hold time
period required by the logic analyzer with respect to the rising or falling AGP
CLK edge. This may cause a Setup/Hold violation in the logic analyzer.
The signal D_AD_STB is a derived signal which is used to do the Setup/Hold
adjustment of the D_AD_Strobe, AGP_Data_Hi, AGP_Data_Lo, BE_Hi and
BE_Lo groups. The D_AD_STB signal is in the D_AD_Strobe group.
Similarly, the signal D_SB_STB is a derived signal which is used to do the
Setup/Hold adjustment of the D_SB_Strobe, SBA_Hi and SBA_Lo groups. The
D_SB_STB signal is in the D_SB_Strobe group.
Follow all steps, review the case studies and Figures 2--1 through 2--4 to
determine if the Setup/Hold adjustments are required. You may also want to
review the previous Setup/Hold statements.
1. Check that your graphics card is programmed for 4X mode.
TMS808 AGP4X Bus State Support
2--7
Setting Up the Support
2. Start a looping graphics program.
3. Load the AGP4X software from the disk to the logic analyzer.
4. To load the AGP4X support package from the logic analyzer System
window, select the File menu > Load Support Package.
5. From the Load Support Package window, select AGP4X, select load, and
then select Yes.
Setup MagniVu. Follow these steps to set up a MagniVu window:
1. From the logic analyzer System window, select the Window menu > New
Data Window.
2. From the New Data Window, select Waveform, select Next, select AGP4X
MagniVu, and then select Next.
3. Select finish. The New Data Window disappears and a waveform window is
displayed.
Set Up the Trigger. Follow these steps to set up the Trigger to capture the
D_AD_STB signal:
1. Select the System window, and then select Trig.
2. From the Trigger: AGP4X window, select If and fill in the four displayed
fields with the following information.
First fieldChannel
Second fieldAD_STB_0
Third field=
Fourth fieldLow
3. Select OK.
4. Select the Waveform window, and then select Run. Wait for the TLA to
capture and display the D_AD_STB waveform.
2--8
TMS808 AGP4X Bus State Support
Setting Up the Support
Consider the following case:
In Figure 2--1, the D_AD_STB signal has sufficient Setup/Hold time with respect
to the CLK edge. In this case, no adjustment is required.
2.5 ns
CLK
D_AD_STB
Signal change occurs greater than 2.5 ns
before a rising or falling CLK edge
2.5 ns
Figure 2--1: Examples of sufficient setup/hold times
Consider the next case:
In Figure 2--4, the D_AD_STB signal is changing within 2.5 ns of the CLK edge.
You will need to modify the default Setup/Hold values by following these steps:
1. In the System window, click Setup. In the Setup:AGP4X window, click More
(see Figure 2--2).
Figure 2--2: Setup:AGP4X window
TMS808 AGP4X Bus State Support
2--9
Setting Up the Support
2. In the Custom Options window, under the Setup/Hold Window, scroll down
and click on the Support Package Default heading for D_AD_Strobe.
3. Select --500 ps/2.5 ns. Click OK (see Figure 2--3).
Figure 2--3: Custom option window
In this case, the Setup/Hold value is --0.5 ns Setup/2.5ns Hold. Each case may
require different values. Be sure to select Setup/Hold values that are not violated
by D_AD_STB.
2.5 ns
CLK
D_AD_STB
2.5 ns
Signal change occurs within
2.5 ns of rising CLK edge
Signal change occurs within
2.5 ns of falling CLK edge
Figure 2--4: Setup/hold time violation examples
Once the Setup/Hold values for the D_AD_STB signal (that is, the
D_AD_Strobe group) are determined, the same values must be entered in the
AGP_Data_Hi, AGP_Data_Lo, BE_Hi and BE_Lo groups.
2--10
TMS808 AGP4X Bus State Support
Setting Up the Support
NOTE. Since the AD_STB timings with respect to CLK can be different for READs
and WRITEs, the Setup/Hold time should satisfy the condition in both cases so
that data can be accurately logged for AGP READs and AGP WRITEs.
Similarly, the Setup/Hold values for the D_SB_STB signal (that is, D_SB_Strobe
group) are determined and the same values are to be entered in the SBA_Hi and
SBA_Lo groups.
Signals Not On the Probe
Adapter
Extra Channels
The TMS 808 probe adapter provides access for all of the AGP4X signals.
The following channels on the logic analyzer are left free for you to connect to
other signals of interest:
HHi_E3:7-0 (for 136 channel module only)
HHi_E2:7-0 (for 136 channel module only)
HHi_E1:7-0 (for 136 channel module only)
HHi_E0:7-0 (for 136 channel module only)
HHi_C3:7-0
HHi_C1:7-0
HHi_C0:7-0
HHi_A1:1-0
TMS808 AGP4X Bus State Support
2--11
Setting Up the Support
2--12
TMS808 AGP4X Bus State Support
Specifications
Specifications
Circuit Description
This chapter contains information regarding the specifications of the support.
AGP4X support uses two distinctive types of transactions on the same physical
bus, depending on which of the signals the transaction is synchronized to. The
first set is synchronized to the 66 MHz AGP clock, and the second set is
synchronized to the strobe signals. The timing relationship of the Strobe signals
to the Clock is described in detail in the Accelerated Graphics Port Interface
Specification, Intel, Version 2.0, 1998.
The AGP bus is a point to point bus and its behavior with an added third load is
not specifified. If a third load (like the probe adapter) is added, it is the responsibility of the user to ensure that the system meets the AGP Interface specifications. The loading information and equivalent circuits for the probe adapter is
provided on page 3--6. The critical timing constraints are mainly in the form of
skew budget, which are separately allocated for the motherboard and the AGP4X
connector.
The interface point between the motherboard and the AGP4X connector comes
on the transmission line of the signals. So when probing the signals at the
connector, you will encounter a composite signal made of the ongoing transmission and the reflection from the receiving end, as the AGP bus is source
terminated. As the signaling period reduces and approaches the transit time over
the bus length, it becomes very difficult to extract valid data from the composite
waveform. In the case of TMS 808 support, circuitry on the extender board
performs the task of extracting digital signals from the composite wave present
on the bus.
Once the digital signals are extracted, the transactions need to be captured by the
Logic Analyzer. The two issues involved are a high data rate (266 MHz), that is
more than the logic analyzer module can handle and two types of synchronization, as mentioned previously.
The first issue, high data rate, is handled by demultiplexing the data, reducing the
rate to 133 MHz. At this rate, the logic analyzer is able to directly acquire the
data presented. The respective Strobe signals are used to latch data in latches, and
both edges of the AGP clock are used to log these latched outputs.
The second issue, two types of synchronization, are shown in the block diagram
of the logic circuit, which implements demultiplexing the data (see Figure 3--1).
TMS808 AGP4X Bus State Support
3--1
Specifications
AD [31--0]
AD_STB0
RST~
AD_STB0#
AD [31--0]
Figure 3--1: Block diagram for AD bus
The first data value on the 32-bit bus is latched into latch D1 by the falling edge
of AD_STB0. In fact, the lower significant 16 bits uses AD_STB0 and the upper
significant 16 bits uses AD_STB1, but for simplicity, the block diagram shows
only a single 32 bit latch. The falling edge of the complementary strobe
AD_STB0# latches the second data in D2, at the same time moving the data at
the output of D1 into another latch D3. This is done to avoid the D1 data being
overwritten by the next edge of the AD_STB0. More than three strobe edges
cannot be accommodated in one half cycle of AGP clock, so the TLA always
gets a chance to acquire the data before it gets overwritten. When lower speed
(1X, PCI for example) cycles are being run, TLA picks up the AD bus information directly from the bus rather than from the latched output. On the user
interface, the latched AD bus data appears as AGP_Data_Hi and AGP_Data_Lo.
D1
D2
CLK
CLK
MR
MR
Q1
Q2
D3
CLK
32 bits
MR
Q3
32 bits32 bits
To TL A
64 bits
3--2
The same principle is applied on the side band signals, using another set of
latches (see Figure 3--2).
TMS808 AGP4X Bus State Support
Specifications
SBA [7--0]
SB_STB
RST~
SB_STB#
SBA [7--0]
Figure 3--2: Block diagram for the SBA bus
The 32-bit AD bus splits into a 64-bit bus at the logic analyzer input, and the
8-bit SBA bus splits into 16 bits. After this, latched data is valid up to 7.5 ns, in
most cases it will provide the necessary setup time for the logic analyzer, even if
the AGP clock is used for logging in data. In rare instances, the clock-edge-tostrobe timing may have a setup/hold violation in the logic analyzer. In this case,
the adjustable Setup/Hold values of the logic analyzer can be used to make
accurate data acquisitions.
D1Q1
CLK
D2
CLK
MR
Q2
MR
D3Q3
CLK
MR
8 bits
8 bits8 bits
To TL A
16 bits
For the logic analyzer to detect the availability of fresh data, a qualifier is
required that can be reliably acquired at the same acquisition speed. Since no
signal from the AGP bus can be used for this purpose, two signals are derived
from the strobe. A single-toggle flip-flop is used to generate the common
qualifier D_AD_STB. Data is always logged in as 64 bits into the logic analyzer.
Only when the second set of data arrives on the falling edge of the AD_STB0#,
is the data logged in as 64 bits. Also, the support makes use of the fact that there
are always 4 falling edges occurring in the AGP4x; irrespective, of whether the
data is valid or not. Similarly another qualifier is derived for the SBA signals (see
Figure 3--3).
TMS808 AGP4X Bus State Support
3--3
Specifications
TQ
AD_ STB0#
MR
RST~
D_AD_STB
Figure 3--3: Qualifier generation
The AGP 2X support included with this package operates in a similar manner.
The only difference is that the derived qualifiers get replaced by the corresponding strobe signals themselves.
The support masters all signals in all three cases; when an AGP transfer is on the
AD bus, there is activity on the side band strobes, and the system is running PCI
cycles. This means, except for the bus whose activity caused the master point,
other buses may have invalid data. The disassembler locates such invalid data on
the various buses and marks them as invalid with dashes. In the SBA mode, the
side band strobe is active even when there is no data to be passed. So, if the data
being queued is NOPs, and there is no valid data on any other buses, such
samples are suppressed by the disassembler.
Specifications
3--4
These specifications are for a probe adapter connected between a compatible
Tektronix logic analyzer and a System Under Test (SUT). Table 3--1 shows the
electrical requirements the SUT must produce for the support to acquire correct
data.
Table 3--1: Electrical specifications
CharacteristicsRequirements
SUT DC power requirementsThe support uses an external power
supply and does not draw any current
from the SUT.
Probe adapter: DC power requirements
Voltage, VCC4.75 -- 5.25 VDC
Current, VCCI
typical
4.0 A
TMS808 AGP4X Bus State Support
Specifications
Table 3--1: Electrical specifications (cont.)
CharacteristicsRequirements
I
maximum
AC adapter
Input Voltage rating90 -- 265 V CAT II
Input Frequency Rating47 -- 63 Hz
Output Voltage Rating5 V
Output Current Rating8 A
Output Power Rating40 W
SUT clock rateMaximum 66 MHz
Set up and hold time requirementsSUT should meet AGP 2.0
specifications
Note; All Reserved pins are connected through the probe adapter. All VCC3.3 pins are shorted
together on the probe adapter. All Vddq3.3 pins are shorted together on the probe adapter. All
5.0 V pins are shorted together on the probe adapter.
4.2 A
Table 3--2 shows the environmental specifications.
Table 3--2: Environmental specifications
CharacteristicDescription
Temperature
Maximum operating+50 °C (+122 °F)
Minimum operating0 °C (+32 °F)
Non operating-- 5 5 °Cto+75°C(--67° to +167 °F)
Humidity10 to 95% relative humidity
Altitude
Operating4.5 km (15,000 ft) maximum
Non operating15 km (50,000 ft) maximum
Electrostatic immunityThe probe adapter is static sensitive
1
Designed to meet Tektronix standard 062-2847-00 class 5.
2
Not to exceed AGP4X bus thermal considerations. Forced air cooling might be
required.
1
2
TMS808 AGP4X Bus State Support
3--5
Specifications
Loading and Equivalent Circuits
The load presented to the SUT by the AGP probe adapter is low. The following
approximation of the probe adapter loading is sufficient for most circuit-simulation calculations.
Table 3--3 shows the values you can use to calculate characteristics of the lossy
delay lines shown in Figure 3--4 on page 3--7.
Table 3--3: Lossy delay line values
CharacteristicValue
C (capacitance)3 pF per inch
L (inductance)10.8 nH per inch
R (resistance)
Z0(impedance)
.067 Ω per inch
60 Ω
3--6
TMS808 AGP4X Bus State Support
Mother
board
5pF
Specifications
1 H
1ns60Ω
AGP board
1pF
3 Ω
High-speed conditioned lines
Mother
board
1pF
10 KΩ
1ns60Ω
FRAME#, STOP#, GNT#, IRDY#, TRDY#,
RST#, PME#, INTA#, and INTB# lines
Mother
board
1pF
10 pF
20 KΩ
1ns60Ω
10 KΩ
CLK line
Figure 3--4: Equivalent circuit loads for the probe adapter
AGP board
1pF
AGP board
1pF
Figure 3--5 shows the dimensions of the probe adapter.
TMS808 AGP4X Bus State Support
3--7
Specifications
Graphics card extender
185.42 mm
(7.730 in)
120.65 mm
(4.750 in)
Graphics
card
extender
board
Probe
interface
board
Probe interface board
152.40 mm
(6.000 in)
153.03 mm
(6.025 in)
13.97 mm
(0.550 in)
44.45 mm
(1.750 in)
129.54 mm
(5.100 in)
Figure 3--5: Probe adapter dimensions
3--8
TMS808 AGP4X Bus State Support
Diagrams
Diagrams and Circuit Board Illustrations
This section contains the troubleshooting procedures, block diagrams, circuit board illustrations,
component locator tables, waveform illustrations, and schematic diagrams.
Graphic Items and Special Symbols Used in This Manual
Each assembly in the instrument is assigned an assembly number (for example A5). The
assembly number appears in the title on the diagram, in the lookup table for the schematic
diagram, and corresponding component locator illustration. The Replaceable Electrical Parts
list is arranged by assembly in numerical sequence; the components are listed by component
number.
Symbols
Graphic symbols and class designation letters are based on ANSI Standard Y32.2-1975.
Abbreviations are based on ANSI Y1.1-1972.
Logic symbology is based on ANSI/IEEE Standard 91-1984 in terms of positive logic. Logic
symbols depict the logic function performed and can differ from the manufacturer’s data.
The tilde (~) preceding a signal name indicates that the signal performs its intended function
when in the low state.
Other standards used in the preparation of diagrams by Tektronix, Inc., include the following:
HTektronix Standard 062-2476 Symbols and Practices for Schematic Drafting
HANSI Y14.159-1971 Interconnection Diagrams
HANSI Y32.16-1975 Reference Designations for Electronic Equipment
HMIL-HDBK-63038-1A Military Standard Technical Manual Writing Handbook
Locator Grid
Function Block Title
Internal Screw Adjustment
Onboard Jumper
Digital Ground
Refer to Assembly
& Diagram Number
Offboard Connector
Active Low Signal
Signal From
Another Diagram,
Same Board
A
B
12 3
Component Locator Diagrams
The schematic diagram and circuit board component location illustrations have grids marked
on them. The component lookup tables refer to these grids to help you locate a component.
The circuit board illustration appears only once; its lookup table lists the diagram number of
all diagrams on which the circuitry appears.
Some of the circuit board component location illustrations are expanded and divided into
several parts to make it easier for you to locate small components. To determine which part
of the whole locator diagram you are looking at, refer to the small locator key shown below.
The gray block, within the larger circuit board outline, shows where that part fits in the
whole locator diagram. Each part in the key is labeled with an identifying letter that appears
in the figure titles under component locator diagrams.
4
SYNC GENERATOR A5
SYNC BOARD
Power Termination
Component on back of board
Strap
Panel Control
Female Coaxial
Connector
Heat Sink
Decoupled Voltage
Diagram Number
Assembly Number
Diagram Name
Component Values
Electrical components shown on the diagrams are in the following units unless noted
otherwise:
Capacitors:Values one or greater are in picofarads (pF).