Tektronix TMS560 Instruction Manual
Instruction Manual
TMS 560
MPC860 Microprocessor Support
071-0071-02
Warning
The servicing instructions are for use by
qualified personnel only. To avoid personal
injury, do not perform any servicing unless you
are qualified to do so. Refer to all safety
summaries prior to performing service.
Copyright E T ektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and are
protected by United States copyright laws and international treaty provisions.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the
Rights in T echnical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software – Restricted Rights clause at F AR 52.227-19, as applicable.
T ektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
Printed in the U.S.A.
T ektronix, Inc., P.O. Box 1000, Wilsonville, OR 97070–1000
TEKTRONIX and TEK are registered trademarks of T ektronix, Inc.
SOFTWARE WARRANTY
T ektronix warrants that the media on which this software product is furnished and the encoding of the programs on
the media will be free from defects in materials and workmanship for a period of three (3) months from the date of
shipment. If a medium or encoding proves defective during the warranty period, T ektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
T ektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If T ektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
HARDWARE WARRANTY
T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by T ektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the T ektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Getting Started
Operating Basics
General Safety Summary iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Service Safety Summary v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Preface vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Manual Conventions vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Documentation viii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contacting T ektronix viii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Support Package Description 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Software Compatibility 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Configuration 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Requirements and Restrictions 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functionality Not Supported 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DAS Mass T ermination Interface (MTIF) Probes 1–3. . . . . . . . . . . . . . . . . . . . . . . .
Labeling P6434 Probes 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Assignments 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CPU To Mictor Connections 1–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Setting Up the Support 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Group Definitions 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Show Cycles 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternate Bus Master Cycles 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Custom Clocking 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking Options 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Symbols 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acquiring and Viewing Disassembled Data 2–5. . . . . . . . . . . . . . . . . . . . .
Acquiring Data 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing Disassembled Data 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Display Format 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Display Format 2–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Flow Display Format 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Subroutine Display Format 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Changing How Data is Displayed 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Optional Display Selections For the
TLA 700 2–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Optional Display Selections For the
DAS 9200 2–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking Cycles 2–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Displaying Exception Vectors 2–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TMS 560 MPC860 Microprocessor Support Instruction Manual
i
Table of Contents
Specifications
Replaceable Parts
Index
List of Tables
Specification Tables 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts Ordering Information 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 1–1: Custom P6434 probe section and label combinations 1–3. . .
Table 1–2: Address group channel assignments 1–4. . . . . . . . . . . . . . . . .
Table 1–3: Data group channel assignments 1–6. . . . . . . . . . . . . . . . . . . .
Table 1–4: Control group channel assignments 1–7. . . . . . . . . . . . . . . . . .
Table 1–5: Tsiz group channel assignments 1–7. . . . . . . . . . . . . . . . . . . . .
Table 1–6: Misc group channel assignments 1–7. . . . . . . . . . . . . . . . . . . .
Table 1–7: Clock channel assignments 1–8. . . . . . . . . . . . . . . . . . . . . . . . .
Table 1–8: CPU to Mictor connections for Mictor A pins 1–10. . . . . . . . .
Table 1–9: CPU to Mictor connections for Mictor C pins 1–11. . . . . . . . .
Table 1–10: CPU to Mictor connections for Mictor D pins 1–12. . . . . . . .
Table 2–1: Control group symbol table definitions 2–3. . . . . . . . . . . . . . .
Table 2–2: Tsiz group symbol table definitions 2–4. . . . . . . . . . . . . . . . . .
Table 2–3: Meaning of special characters in the display 2–5. . . . . . . . . .
Table 2–4: Cycle type definitions 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2–5: Exception vectors 2–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–1: Electrical specifications 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . .
ii
TMS 560 MPC860 Microprocessor Support Instruction Manual
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
To Avoid Fire or
Personal Injury
Connect and Disconnect Properly . Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings
information before making connections to the product.
The common terminal is at ground potential. Do not connect the common
terminal to elevated voltages.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry .
TMS 560 MPC860 Microprocessor Support Instruction Manual
iii
General Safety Summary
Symbols and Terms
T erms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
T erms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
WARNING
High Voltage
Protective Ground
(Earth) T erminal
CAUTION
Refer to Manual
Double
Insulated
iv
TMS 560 MPC860 Microprocessor Support Instruction Manual
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, disconnect the main power by means
of the power cord or, if provided, the power switch.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMS 560 MPC860 Microprocessor Support Instruction Manual
v
Service Safety Summary
vi
TMS 560 MPC860 Microprocessor Support Instruction Manual
Preface
This instruction manual contains specific information about the TMS 560
MPC860 microprocessor support package and is part of a set of information on
how to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating microprocessor support packages on the logic
analyzer for which the TMS 560 MPC860 support was purchased, you will
probably only need this instruction manual to set up and run the support.
If you are not familiar with operating microprocessor support packages, you will
need to supplement this instruction manual with information on basic operations
to set up and run the support.
Information on basic operations of microprocessor support packages is included
with each product. Each logic analyzer has basic information that describes how
to perform tasks common to support packages on that platform. This information
can be in the form of online help, an installation manual, or a user manual.
This manual provides detailed information on the following topics:
H Connecting the logic analyzer to the system under test
Manual Conventions
H Setting up the logic analyzer to acquire data from the system under test
H Acquiring and viewing disassembled data
This manual uses the following conventions:
H The term “disassembler” refers to the software that disassembles bus cycles
into instruction mnemonics and cycle types.
H The phrase “information on basic operations” refers to online help, an
installation manual, or a basic operations of microprocessor supports user
manual.
H In the information on basic operations, the term “XXX” or “P54C” used in
field selections and file names must be replaced with MPC860. This is the
name of the microprocessor in field selections and file names you must use
to operate the MPC860 support.
H The term “SUT” (system under test) refers to the microprocessor-based
system from which data will be acquired.
TMS 560 MPC860 Microprocessor Support Instruction Manual
vii
Preface
H The term “logic analyzer” refers to the Tektronix logic analyzer for which
this product was purchased.
H The term “module” refers to a 102/136-channel or a 96-channel module.
H The term “HI module” refers to the module in the higher-numbered slot and
the term “LO module” refers to the module in the lower-numbered slot.
H MPC860 refers to all supported variations of the MPC860 microprocessor
unless otherwise noted.
H An asterisk (*) following a signal name indicates an active low signal.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic
analyzer is located in the corresponding module user manual. The manual set
provides the information necessary to install, operate, maintain, and service the
logic analyzer and associated products.
Contacting Tektronix
Product
Support
Service
Support
For other
information
To write us
For questions about using Tektronix measurement products, call
toll free in North America:
1-800-TEK-WIDE (1-800-835-9433 ext. 2400)
6:00 a.m. – 5:00 p.m. Pacific time
Or contact us by e-mail:
tm_app_supp@tek.com
For product support outside of North America, contact your
local Tektronix distributor or sales office.
Tektronix offers extended warranty and calibration programs as
options on many products. Contact your local Tektronix
distributor or sales office.
For a listing of worldwide service centers, visit our web site.
In North America:
1-800-TEK-WIDE (1-800-835-9433)
An operator will direct your call.
Tektronix, Inc.
P.O. Box 1000
Wilsonville, OR 97070-1000
USA
viii
Website
Tektronix.com
TMS 560 MPC860 Microprocessor Support Instruction Manual
Getting Started
Getting Started
This chapter contains information on the TMS 560 microprocessor support, and
information on connecting your logic analyzer to your system under test.
Support Package Description
The TMS 560 microprocessor support package displays disassembled data from
systems based on the Motorola MPC860/MPC821 microprocessor.
Refer to information on basic operations to determine how many modules and
probes your logic analyzer needs to meet the minimum channel requirements for
the TMS 560 microprocessor support.
To use this support efficiently, you need to have the items listed in the information on basic operations as well as the MPC860 User’s Manual, Motorola, 1996,
or the MPC821 User’s Manual, Motorola, 1996.
Logic Analyzer Software Compatibility
The label on the microprocessor support floppy disk states which version of logic
analyzer software the support is compatible with.
Logic Analyzer Configuration
For use with a TLA 700 Series the TMS 560 support requires a minimum of
one 100-channel module.
For use with a DAS 9200 Series the TMS 560 support requires a minimum of
one 96-channel module.
Requirements and Restrictions
Review electrical specifications in the Specifications chapter in this manual as
they pertain to your system under test, as well as the following descriptions of
other MPC860 support requirements and restrictions.
Hardware Reset. If a hardware reset occurs in your MPC860 system during an
acquisition, the application disassembler might acquire an invalid sample.
TMS 560 MPC860 Microprocessor Support Instruction Manual
1–1
Getting Started
System Clock Rate. The MPC860 microprocessor support can acquire data from
1
1
.
, and the
the MPC860 microprocessor operating at speeds of up to 40 MHz
MPC821 microprocessor operating at speeds of up to 50 MHz
Disabling the Instruction Cache. To display acquired data, you must disable the
internal instruction cache. Disabling the cache makes all instruction prefetches
visible on the bus so that they can be acquired and displayed.
Disabling the Data Cache. To display acquired data, you must disable the data
cache. Disabling the data cache makes all of the loads and stores to memory,
including data reads and writes, visible on the bus so the software can acquire
and display them.
Programming the UPMs.
The MPC860 has an on chip memory controller that supports the DRAM
interface. The on chip memory controller has three machines: the GPCM
(general purpose chip select machine), and two UPMs (user programmable
machines): UPM A and UPM B.
To acquire correct column addresses when DRAM is used for burst access,
program the UPM to have the waveforms so that on assertion of TA* (on the
falling clock edge), the corresponding column address appears on the bus.
The UPM has flexibility in its programming, and an example of programmed
UPM words for the UPM controlled burst accesses to 32-bit DRAM with a speed
of 60 ns is shown below. The words must be placed at the UPM start address
0x08 for burst read, and at the UPM start address 0x20 for burst write. There are
many examples of different patterns of words that will achieve the same result.
8fffec24
0fffec04
08ffec00
00ffec0c
03ffec04
00ffec40
00ffcc0c
0cffcc44
00ffec00
03ffec0c
00ffec44
00ffcc00
3fffc847
1
Specification at time of printing. Contact your Tektronix sales representative for
current information on the fastest device supported.
1–2
TMS 560 MPC860 Microprocessor Support Instruction Manual
Functionality Not Supported
Interrupt Signals. All of the interrupt signals are not acquired by the TMS 560
support software. The interrupts can be identified by the TMS 560 support
software by looking at the address that is displayed for the interrupt service.
Show Cycle. The Show Cycle signals are not acquired by the TMS 560 support
software.
CPM Related Information. The CPM related information of the protocols that
appears on the serial bus is not acquired by the TMS 560 support software.
DAS Mass Termination Interface (MTIF) Probes
The MTIF probes are already labeled since the probe sections for each probe are
permanent. The TMS 560 channel assignments follow the standard channel
mapping.
Getting Started
Labeling P6434 Probes
For the 102/136-channel module, the TMS 560 channel assignments follow the
standard channel mapping and labeling scheme for P6434 probes. Follow the
procedure to apply labels using the standard method as described in the P6434
Mass Termination Probe Instructions.
The TMS 560 channel assignments do not comply with the standard channel
mapping and labeling scheme for P6434 probes. You can follow the procedure to
apply labels using the custom method as described in the P6434 Mass Termina-
tion Probe Instructions. Table 1–1 lists the label combinations you must use with
this support package.
T able 1–1: Custom P6434 probe section and label combinations
Probe Pin 1 side Color Pin 38 side Color
1 CK:0, A3:7-0, A2:7-0 Tan
2 QUAL:0, D3:7-0, D2:7-0 Blue
3 CK:3, C3:7-0, C2:7-0 White
4 QUAL:3, E3:7-0, E2:7-0 Green
TMS 560 MPC860 Microprocessor Support Instruction Manual
1–3
Getting Started
Channel Assignments
T able 1–1: Custom P6434 probe section and label combinations (cont.)
Probe ColorPin 38 sideColorPin 1 side
5 CK:1, A1:7-0, A0:7-0 Orange
6 CK:2, D1:7-0, D0:7-0 Y ellow
7 QUAL:1, C1:7-0, C0:7-0 Gray
8 QUAL:2, E1:7-0, E0:7-0 Violet
Channel assignments shown in Table 1–2 through Table 1–7 use the following
conventions:
H All signals are required by the support unless indicated otherwise.
H Channels are shown starting with the most significant bit (MSB) descending
to the least significant bit (LSB).
H Channel group assignments are for all modules unless otherwise noted.
H An asterisk following a signal name indicates an active low signal.
H An equals sign (=) following a signal name indicates that it is double probed.
H The module in the higher-numbered slot is referred to as the HI module and
the module in the lower-numbered slot is referred to as the LO module.
Table 1–2 lists the probe section and channel assignments for the Address group.
By default the Address channel group is displayed in hexadecimal.
T able 1–2: Address group channel assignments
Bit order Section:channel MPC860 signal name
31 A3:7 A0
30 A3:6 A1
29 A3:5 A2
28 A3:4 A3
27 A3:3 A4
26 A3:2 A5
25 A3:1 A6
24 A3:0 A7
1–4
TMS 560 MPC860 Microprocessor Support Instruction Manual
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