Tektronix TMS501 Instruction Manual

Instruction Manual
TMS 501 Z80 Microprocessor Support
070-9828-00
There are no current European directives that apply to this product. This product provides cable and test lead connections to a test object of electronic measuring and test equipment.
The servicing instructions are for use by qualified personnel only. To avoid personal injury, do not perform any servicing unless you are qualified to do so. Refer to all safety summaries prior to performing service.
Copyright T ektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and are protected by United States copyright laws and international treaty provisions.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the Rights in T echnical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the Commercial Computer Software – Restricted Rights clause at F AR 52.227-19, as applicable.
T ektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes that in all previously published material. Specifications and price change privileges reserved.
Printed in the U.S.A.
T ektronix, Inc., P.O. Box 1000, Wilsonville, OR 97070–1000 TEKTRONIX and TEK are registered trademarks of T ektronix, Inc.
SOFTWARE WARRANTY
T ektronix warrants that the media on which this software product is furnished and the encoding of the programs on the media will be free from defects in materials and workmanship for a period of three (3) months from the date of shipment. If a medium or encoding proves defective during the warranty period, T ektronix will provide a replacement in exchange for the defective medium. Except as to the media on which this software product is furnished, this software product is provided “as is” without warranty of any kind, either express or implied. T ektronix does not warrant that the functions contained in this software product will meet Customer’s requirements or that the operation of the programs will be uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period. If T ektronix is unable to provide a replacement that is free from defects in materials and workmanship within a reasonable time thereafter, Customer may terminate the license for this software product and return this software product and any associated materials for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
HARDWARE WARRANTY
T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by T ektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the T ektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Table of Contents

Getting Started
Operating Basics
General Safety Summary v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Service Safety Summary vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Preface: Microprocessor Support Documentation ix. . . . . . . . . . . . . . . .
Manual Conventions ix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Documentation x. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contacting T ektronix x. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Support Description 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Software Compatibility 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Configuration 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Requirements and Restrictions 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuring the Probe Adapter 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connecting to a System Under T est 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DIP Probe Adapter 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DIP Probe Adapter
with a DIP Clip 1–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Without a Probe Adapter 1–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specifications
Setting Up the Support 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Group Definitions 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking Options 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Symbols 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acquiring and Viewing Disassembled Data 2–3. . . . . . . . . . . . . . . . . . . . .
Acquiring Data 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing Disassembled Data 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Display Format 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Display Format 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Flow Display Format 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Subroutine Display Format 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Changing How Data is Displayed 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking Cycles 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing an Example of Disassembled Data 2–7. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Probe Adapter Description 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specifications 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Assignments 3–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
How Data is Acquired 3–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Custom Clocking 3–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking Options 3–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TMS 501 Z80 Microprocessor Support Instruction Manual
i
Table of Contents
Alternate Microprocessor Connections 3–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signals On the Probe Adapter 3–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Extra Channels 3–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maintenance
Probe Adapter Circuit Description 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing Signal Leads 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing Protective Sockets 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing the Fuse 4–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replaceable Electrical Parts
Parts Ordering Information 5–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Using the Replaceable Electrical Parts List 5–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replaceable Mechanical Parts
Parts Ordering Information 6–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Using the Replaceable Mechanical Parts List 6–1. . . . . . . . . . . . . . . . . . . . . . . . . . .
Index
ii
TMS 501 Z80 Microprocessor Support Instruction Manual
List of Figures
List of Tables
Table of Contents
Figure 1–1: Jumper location 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 1–2: Placing a microprocessor into a DIP probe adapter 1–5. . . .
Figure 1–3: Connecting probes to a DIP probe adapter 1–6. . . . . . . . . . .
Figure 1–4: Placing a DIP probe adapter onto the SUT 1–7. . . . . . . . . . .
Figure 1–5: Connecting to the SUT using a DIP converter clip 1–8. . . . .
Figure 2–1: Hardware display format 2–5. . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 3–1: Dimensions of the probe adapter 3–4. . . . . . . . . . . . . . . . . . . .
Figure 3–2: M1 cycle (opcode fetch or interrupt acknowledge) 3–8. . . . .
Figure 3–3: Read or Write cycle (memory or I/O, but not M1) 3–8. . . . .
Table 1–1: Disassembly/Timing jumper information 1–3. . . . . . . . . . . . .
Table 1–2: Z80 signal connections for channel probes 1–9. . . . . . . . . . . .
Table 1–3: Z80 signal connections for clock channels 1–9. . . . . . . . . . . . .
Table 2–1: Control group symbol table definitions 2–2. . . . . . . . . . . . . . .
Table 2–2: Meaning of special characters in the display 2–4. . . . . . . . . .
Table 2–3: Cycle type definitions 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–1: Electrical specifications 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–2: Environmental specifications 3–3. . . . . . . . . . . . . . . . . . . . . . .
Table 3–3: Certifications and compliances 3–3. . . . . . . . . . . . . . . . . . . . . .
Table 3–4: Address group channel assignments 3–5. . . . . . . . . . . . . . . . . .
Table 3–5: Data group channel assignments 3–5. . . . . . . . . . . . . . . . . . . . .
Table 3–6: Control group channel assignments 3–6. . . . . . . . . . . . . . . . . .
Table 3–7: Misc group channel assignments 3–6. . . . . . . . . . . . . . . . . . . .
Table 3–8: Clock channel assignments 3–7. . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–9: Extra module sections and channels 3–10. . . . . . . . . . . . . . . . .
TMS 501 Z80 Microprocessor Support Instruction Manual
iii

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the system.
To Avoid Fire or Personal Injury
Connect and Disconnect Properly . Do not connect or disconnect probes or test
leads while they are connected to a voltage source. Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings information before making connections to the product.
Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal.
Do Not Operate Without Covers. Do not operate this product with covers or panels removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product. Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present. Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions. Do Not Operate in an Explosive Atmosphere. Keep Product Surfaces Clean and Dry . Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Symbols and Terms
TMS 501 Z80 Microprocessor Support Instruction Manual
T erms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.
v
General Safety Summary
CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.
T erms on the Product. These terms may appear on the product: DANGER indicates an injury hazard immediately accessible as you read the
marking. WARNING indicates an injury hazard not immediately accessible as you read the
marking. CAUTION indicates a hazard to property including the product. Symbols on the Product. The following symbols may appear on the product:
WARNING
High Voltage
Protective Ground
(Earth) T erminal
CAUTION
Refer to Manual
Double
Insulated
vi
TMS 501 Z80 Microprocessor Support Instruction Manual

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service
procedures. Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is present.
Disconnect Power. To avoid electric shock, disconnect the main power by means of the power cord or, if provided, the power switch.
Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
TMS 501 Z80 Microprocessor Support Instruction Manual
vii

Preface: Microprocessor Support Documentation

This instruction manual contains specific information about the TMS 501 Z80 microprocessor support package and is part of a set of information on how to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating microprocessor support packages on the logic analyzer for which the TMS 501 Z80 support was purchased, you will probably only need this instruction manual to set up and run the support.
If you are not familiar with operating microprocessor support packages, you will need to supplement this instruction manual with information on basic operations to set up and run the support.
Information on basic operations of microprocessor support packages is included with each product. Each logic analyzer has basic information that describes how to perform tasks common to support packages on that platform. This information can be in the form of online help, an installation manual, or a user manual.
This manual provides detailed information on the following topics: H Connecting the logic analyzer to the system under test
Manual Conventions
H Setting up the logic analyzer to acquire data from the system under test H Acquiring and viewing disassembled data H Using the probe adapter
This manual uses the following conventions: H The term disassembler refers to the software that disassembles bus cycles
into instruction mnemonics and cycle types.
H The phrase “information on basic operations” refers to online help, an
installation manual, or a basic operations of microprocessor supports user manual.
H In the information on basic operations, the term XXX or P54C used in field
selections and file names must be replaced with Z80A. This is the name of the microprocessor in field selections and file names you must use to operate the Z80 support.
H The term system under test (SUT) refers to the microprocessor-based system
from which data will be acquired.
TMS 501 Z80 Microprocessor Support Instruction Manual
ix
Preface: Microprocessor Support Documentation
H The term logic analyzer refers to the Tektronix logic analyzer for which this
product was purchased.
H The term module refers to a 68/102/136-channel or a 96-channel module. H Z80A refers to all supported variations of the Z80 microprocessor unless
otherwise noted.
H A tilde (~) following a signal name indicates an active low signal.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic analyzer is located in the corresponding module user manual. The manual set provides the information necessary to install, operate, maintain, and service the logic analyzer and associated products.
Contacting Tektronix
Product Support
Service Support
For other information
To write us Tektronix, Inc.
For application-oriented questions about a Tektronix measure­ment product, call toll free in North America: 1-800-TEK-WIDE (1-800-835-9433 ext. 2400) 6:00 a.m. – 5:00 p.m. Pacific time
Or, contact us by e-mail: tm_app_supp@tek.com
For product support outside of North America, contact your local Tektronix distributor or sales office.
Contact your local Tektronix distributor or sales office. Or, visit our web site for a listing of worldwide service locations.
http://www.tek.com In North America:
1-800-TEK-WIDE (1-800-835-9433) An operator will direct your call.
P.O. Box 1000 Wilsonville, OR 97070-1000
x
TMS 501 Z80 Microprocessor Support Instruction Manual

Getting Started

Support Description
This chapter provides information on the following topics and tasks:
H A description of the TMS 501 microprocessor support package H Logic analyzer software compatibility H Your system under test requirements H Support restrictions H How to configure the probe adapter H How to connect to the system under test (SUT)
The TMS 501 microprocessor support package disassembles data from systems that are based on the Zilog Z80 microprocessor. The support runs on a compat­ible Tektronix logic analyzer equipped with a 68/102/136-channel module or a 96-channel module.
Refer to information on basic operations to determine how many modules and probes your logic analyzer needs to meet the minimum channel requirements for the TMS 501 microprocessor support.
The TMS 501 supports the Z80 microprocessor in a 40-pin DIP package. A complete list of standard and optional accessories is provided at the end of the
parts list in the Replaceable Mechanical Parts chapter. To use this support efficiently, you need to have the items listed in the informa-
tion on basic operations as well as the following manuals:
H Z80-CPU/Z80A-CPU Technical Manual, Zilog (03-0029-00) H Z80 Microcomputer System Programming Manual, Mostek (MK78515)
Information on basic operations also contains a general description of supports.
Logic Analyzer Software Compatibility
The label on the microprocessor support floppy disk states which version of logic analyzer software the support is compatible with.
TMS 501 Z80 Microprocessor Support Instruction Manual
1–1
Getting Started
Logic Analyzer Configuration
To use the Z80 support, the Tektronix logic analyzer must be equipped with either a 68/102/136-channel module, or a 96-channel module at a minimum. The module must be equipped with enough probes to acquire channel and clock data from signals in your Z80-based system.
Refer to information on basic operations to determine how many modules and probes the logic analyzer needs to meet the channel requirements.
Requirements and Restrictions
You should review the general requirements and restrictions of microprocessor supports in the information on basic operations as they pertain to your SUT.
You should also review electrical, environmental, and mechanical specifications in the Specifications chapter in this manual as they pertain to your system under test, as well as the following descriptions of other Z80 support requirements and restrictions.
System Clock Rate. The microprocessor support product supports the Z80 microprocessor at speeds of up to 20 MHz DIP testclip adapter, the maximum supported clock speed is reduced to 6 MHz.
Configuring the Probe Adapter
There is one jumper on the probe adapter used to configure the probe adapter for disassembler operation or to acquire timing data.
The Disassembly/Timing jumper (J1203) should be placed in the NORMAL position to acquire disassembled data, and in the TIMING position to acquire timing data. Table 1–1 shows how to position this jumper depending on the type of clocking you’re using and the type of window you want to view.
1
. However, if you use the optional
1–2
1
Specification at time of printing. Contact your Tektronix sales representative for
current information on the fastest devices supported.
TMS 501 Z80 Microprocessor Support Instruction Manual
Getting Started
T able 1–1: Disassembly/T iming jumper information
J1203 position Clocking Data window
NORMAL (Disassembly)
TIMING Internal Waveform window , or
Custom Listing window or
Disassembly or State displays
Timing display
External Waveform window ,
Listing window, or Timing display
Figure 1–1 shows the location of the Disassembly/Timing jumper.
J1203
Figure 1–1: Jumper location
Connecting to a System Under Test
Before you connect to the SUT, you must connect the probes to the module. Your SUT must also have a minimum amount of clear space surrounding the microprocessor to accommodate the probe adapter. Refer to the Specifications chapter in this manual for the required clearances.
The channel and clock probes shown in this chapter are for a 68/102/136-channel module. The probes will look different if you are using a 96-channel module.
The general requirements and restrictions of microprocessor supports in the information on basic operations shows the vertical dimensions of a channel or clock probe connected to square pins on a circuit board.
TMS 501 Z80 Microprocessor Support Instruction Manual
1–3
Getting Started
DIP Probe Adapter
To connect the logic analyzer to a SUT using a DIP probe adapter, follow these steps:
1. Turn off power to your SUT. It is not necessary to turn off the logic analyzer.
CAUTION. Static discharge can damage the microprocessor, the probe adapter, the probes, or the module. To prevent static damage, handle all of the above only in a static-free environment.
Always wear a grounding wrist strap or similar device while handling the microprocessor and probe adapter.
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer. Then, touch any of the ground pins of the probe adapter to discharge stored static electricity from the probe adapter.
3. Place the probe adapter onto the antistatic shipping foam to support the probe
as shown Figure 1–2. This prevents the circuit board from flexing and the socket pins from bending.
4. Remove the microprocessor from your SUT.
5. Line up pin 1 on the microprocessor with the pin 1 indicator on the probe
adapter board.
CAUTION. Failure to correctly place the microprocessor into the probe adapter might permanently damage all electrical components once power is applied.
6. Place the microprocessor into the probe adapter as shown in Figure 1–2.
1–4
TMS 501 Z80 Microprocessor Support Instruction Manual
Foam
Getting Started
Microprocessor
Probe adapter
Figure 1–2: Placing a microprocessor into a DIP probe adapter
7. Connect the channel and clock probes to the probe adapter as shown in
Figure 1–3. Match the channel groups and numbers on the probe labels to the corresponding pins on the probe adapter. Match the ground pins on the probes to the corresponding pins on the probe adapter.
TMS 501 Z80 Microprocessor Support Instruction Manual
1–5
Getting Started
Channel probe
Hold the channel probes by the podlet holder when connecting them to the probe adapter. Do not hold them by the cables or necks of the podlets.
Foam
Figure 1–3: Connecting probes to a DIP probe adapter
Clock probe
Probe adapter
8. Place the probe adapter onto the SUT as shown in Figure 1–4.
NOTE. You might need to stack one or more replacement sockets between the SUT and the probe adapter to provide sufficient vertical clearance from adjacent components. However, keep in mind that this might increase loading, which can reduce the electrical performance of your probe adapter.
1–6
TMS 501 Z80 Microprocessor Support Instruction Manual
Pin 1
Getting Started
SUT socket
DIP Probe Adapter
with a DIP Clip
Figure 1–4: Placing a DIP probe adapter onto the SUT
If your microprocessor is soldered to a circuit board, you will need to use the DIP converter clip with the probe adapter.
One end of the converter clip connects to square pins on the probe adapter. The other end connects to the microprocessor in your SUT. To connect the logic analyzer to your SUT using a DIP probe adapter with a clip, refer to Figure 1–5 and follow these steps:
1. Follow steps 1 through 7 in the previous procedure.
2. Connect the cable end to the square pins on the probe adapter.
NOTE. The red stripe along the side of the cable indicates that it connects to pin 1 on the probe adapter and pin 1 of the microprocessor.
3. Connect the clip end to the microprocessor.
TMS 501 Z80 Microprocessor Support Instruction Manual
1–7
Getting Started
Red stripe
Pin 1
Without a Probe Adapter
Figure 1–5: Connecting to the SUT using a DIP converter clip
You can use channel probes, clock probes, and leadsets with a commercial test clip (or adapter) to make connections between the logic analyzer and your SUT.
To connect the probes to Z80 signals in the SUT using a test clip, follow these steps:
1. Turn off power to your SUT. It is not necessary to turn off power to the logic
analyzer.
CAUTION. Static discharge can damage the microprocessor, the probes, or the module. To prevent static damage, handle all of the above only in a static-free environment.
Always wear a grounding wrist strap or similar device while handling the microprocessor.
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer. If you are using a test clip, touch any of the ground pins on the clip to discharge stored static electricity from it.
1–8
3. Use Table 1–2 to connect the channel probes to Z80 signal pins on the test
clip or in the SUT. Use leadsets to connect at least one ground lead from each channel probe and
the ground lead from each clock probe to ground pins on your test clip.
TMS 501 Z80 Microprocessor Support Instruction Manual
Getting Started
T able 1–2: Z80 signal connections for channel probes
Section:channel Z80 signal Section:channel Z80 signal
A1:7 A15 D1:7 Not connected A1:6 A14 D1:6 Not Connected A1:5 A13 D1:5 RFSH~* A1:4 A12 D1:4 RESET~* A1:3 A1 1 D1:3 NMI~* A1:2 A10 D1:2 INT~* A1:1 A9 D1:1 BUSREQ~* A1:0 A8 D1:0 WAIT~* A0:7 A7 D0:7 D7 A0:6 A6 D0:6 D6 A0:5 A5 D0:5 D5 A0:4 A4 D0:4 D4 A0:3 A3 D0:3 D3 A0:2 A2 D0:2 D2 A0:1 A1 D0:1 D1 A0:0 A0 D0:0 D0 C2:7 CLK_B* C2:3 BUSACK_L~ C2:6 HALT_L~ C2:2 WR_L~ C2:5 IORQ_L~ C2:1 RD_L~ C2:4 MREQ_L~ C2:0 M1_L~
* Signal not required for disassembly.
Table 1–3 shows the clock probes and the Z80 signal to which they must connect for disassembly to be correct.
T able 1–3: Z80 signal connections for clock channels
Section:channel Z80 signal name
CK:2 HALT_L~ CK:0 CLK
4. Align pin 1 of your test clip with the corresponding pin 1 of the Z80
microprocessor in your SUT and attach the clip.
TMS 501 Z80 Microprocessor Support Instruction Manual
1–9

Setting Up the Support

This section provides information on how to set up the support. Information covers the following topics:
H Channel group definitions H Clocking options H Symbol table files
Remember that the information in this section is specific to the operations and functions of the TMS 501 Z80 support on any Tektronix logic analyzer for which it can be purchased. Information on basic operations describes general tasks and functions.
Before you acquire and disassemble data, you need to load the support and specify setups for clocking and triggering as described in the information on basic operations. The support provides default values for each of these setups, but you can change them as needed.
Channel Group Definitions
Clocking Options
The software automatically defines channel groups for the support. The channel groups for the Z80 support are Address, Data, Control, and Misc. If you want to know which signal is in which group, refer to the channel assignment tables beginning on page 3–4.
The TMS 501 support offers a microprocessor-specific clocking mode for the Z80 microprocessor. This clocking mode is the default selection whenever you load the Z80A support.
A description of how cycles are sampled by the module using the support and probe adapter is found in the Specifications chapter.
Disassembly will not be correct with the Internal or External clocking modes. Information on basic operations describes how to use these clock selections for general purpose analysis.
The clocking option for the TMS 501 support is DMA Cycles. A DMA cycle is defined as the cycle in which the Z80 microprocessor gives up the bus to an alternate device (a DMA device or another microprocessor). These types of cycles are acquired when you select Included.
TMS 501 Z80 Microprocessor Support Instruction Manual
2–1
Setting Up the Support
Symbols
The TMS 501 support supplies one symbol table file. The Z80A_Ctrl file replaces specific Control channel group values with symbolic values when Symbolic is the radix for the channel group.
Table 2–1 shows the name, bit pattern, and meaning for the symbols in the file Z80A_Ctrl, the Control channel group symbol table.
T able 2–1: Control group symbol table definitions
Control group value
RD_L~ MREQ_L~
Symbol
  
  
  
  
  
  
  
  
  
  
WR_L~ BUSACK_L
IORQ_LN~ M1_L~
HALT_L~
Meaning
Non-opcode fetch memory read cycle Any memory write Read from an I/O port Write to an I/O port DMA read cycle DMA write cycle DMA cycle Responding to an interrupt Memory code read (Opcode Fetch) Halt cycle
2–2
Information on basic operations describes how to use symbolic values for triggering and for displaying other channel groups symbolically, such as the Address channel group.
TMS 501 Z80 Microprocessor Support Instruction Manual

Acquiring and Viewing Disassembled Data

This section describes how to acquire data and view it disassembled. Information covers the following topics and tasks:
H Acquiring data H Viewing disassembled data in various display formats H Cycle type labels H Changing the way data is displayed H Changing disassembled cycles with the mark cycles function
Acquiring Data
Once you load the Z80A support, choose a clocking mode, and specify the trigger, you are ready to acquire and disassemble
If you have any problems acquiring data, refer to information on basic operations in your online help or Appendix A: Error Messages and Disassembly Problems in the basic operations user manual.
data.
Viewing Disassembled Data
You can view disassembled data in four display formats: Hardware, Software, Control Flow, and Subroutine. The information on basic operations describes how to select the disassembly display formats.
NOTE. Selections in the Disassembly property page (the Disassembly Format Definition overlay) must be set correctly for your acquired data to be disas­sembled correctly. Refer to Changing How Data is Displayed on page 2–6.
The default display format shows the Address, Data, and Control channel group values for each sample of acquired data.
The disassembler displays special characters and strings in the instruction mnemonics to indicate significant events. Table 2–2 shows these special characters and strings, and gives a definition of what they represent.
TMS 501 Z80 Microprocessor Support Instruction Manual
2–3
Acquiring and Viewing Disassembled Data
T able 2–2: Meaning of special characters in the display
Character or string displayed Meaning
or m
The instruction was manually marked as a program fetch
Hardware Display Format
****
Indicates there is insufficient data available for complete disassembly of the instruction; the number of asterisks indicates the width of the data that is unavailable. Each two asterisks represent one byte.
In Hardware display format, the disassembler displays certain cycle type labels in parentheses. Table 2–3 shows these cycle type labels and gives a definition of the cycle they represent. Reads to interrupt and exception vectors will be labeled with the vector name.
T able 2–3: Cycle type definitions
Cycle type Definition
( HALT )
( MEM_READ )
( MEM_WRITE )
( I/O_READ )
( I/O_WRITE )
A halt cycle. The Z80 is awaiting an interrupt before resuming operation. While halted, the Z80 executes NOPs to maintain memory refresh activity.
A read from memory that is not an opcode fetch Any write to memory A read from an I/O port A write to an I/O port
2–4
( DMA READ )
( DMA WRITE )
( INTACK RD )
( 2ND FETCH )
( READ EXTENSION )
(*?*)
* Computed cycle types.
A read from a DMA device A write to a DMA device An interrupt acknowledge cycle A second opcode fetch * A read extension to an opcode fetch* An illegal opcode*
Figure 2–1 shows an example of the Hardware display.
TMS 501 Z80 Microprocessor Support Instruction Manual
Acquiring and Viewing Disassembled Data
1 2 3 4 5
Sample Address Data Mnemonics Timestamp
-------------------------------------------------------------------------------­T Ă0 0000-----F3----DI--------------------------------------------0 ns
1 0001 ED IM 1 1.250 us 2 0002 56 ( 2ND FETCH ) 1.250 us 3 0003 C3 JP 115F 1.250 us 4 0004 5F ( READ EXTENSION ) 1.500 us 5 0005 11 ( READ EXTENSION ) 1.000 us 6 115F 3E LD A,02 750 ns 7 1160 02 ( READ EXTENSION ) 1.500 us 8 1161 32 LD (3049),A 750 ns
9 1162 49 ( READ EXTENSION ) 1.500 us 10 1163 30 ( READ EXTENSION ) 1.000 us 11 3049 02 ( MEM WRITE ) 1.250 us 12 1164 31 LD SP,306C 750 ns 13 1165 6C ( READ EXTENSION ) 1.500 us 14 1166 30 ( READ EXTENSION ) 1.000 us 15 1167 CD CALL 0455 750 ns 16 1168 55 ( READ EXTENSION ) 1.500 us 17 1169 04 ( READ EXTENSION ) 1.000 us 18 306B 11 ( MEM WRITE ) 1.500 us 19 306A 6A ( MEM WRITE ) 1.250 us 20 0455 3E LD A,3C 750 ns
Software Display Format
Control Flow Display
Format
Figure 2–1: Hardware display format
1
Sample Column. Lists the memory locations for the acquired data.
2
Address Group. Lists data from channels connected to the Z80 address bus.
3
Data Group. Lists data from channels connected to the Z80 data bus.
4
Mnemonics Column. Lists the disassembled instructions and cycle types.
5
Timestamp. Lists the timestamp values when a timestamp selection is made. Information on basic operations describes how you can select a timestamp.
The Software display format shows only the first fetch of executed instructions. Flushed cycles and extensions are not shown, even though they are part of the executed instruction.
The Control Flow display format shows only the first fetch of instructions that change the flow of control.
TMS 501 Z80 Microprocessor Support Instruction Manual
2–5
Acquiring and Viewing Disassembled Data
Instructions that generate a change in the flow of control in the Z80 microprocessor are as follows:
JP JR DJNZ CALL RETI RETN RST RET
Subroutine Display
Format
The Subroutine display format shows only the first fetch of subroutine call and return instructions. It will display conditional subroutine calls if they are considered to be taken.
Instructions that generate a subroutine call or a return in the Z80 microprocessor are as follows:
CALL RET RETI RETN RST
Changing How Data is Displayed
There are common fields and features that allow you to further modify displayed data to suit your needs. You can make common and optional display selections in the Disassembly property page (the Disassembly Format Definition overlay).
You can make selections unique to the Z80 support to do the following tasks:
H Change how data is displayed across all display formats H Change the interpretation of disassembled cycles
There are no optional fields for this support package. Refer to the information on basic operations for descriptions of common fields.
2–6
Marking Cycles
The disassembler has a Mark Opcode function that allows you to change the interpretation of a cycle type. Using this function, you can select a cycle and change it to one of the following cycle types:
H Opcode (the first word of an instruction) H 2nd Fetch (the second byte of a two-byte instruction) H Extension (a subsequent word of an instruction) H Read (marks a memory reference read as data)
Mark selections for opcode fetches are as follows:
OPCODE 2nd FETCH
Undo marks on this cycle
TMS 501 Z80 Microprocessor Support Instruction Manual
Mark selections for reads or extensions are as follows:
Extension Read
Undo marks on this cycle
Information on basic operations contains more details on marking cycles.
Viewing an Example of Disassembled Data
A demonstration system file (or demonstration reference memory) is provided so you can see an example of how your Z80 microprocessor bus cycles and instruction mnemonics look when they are disassembled. Viewing the system file is not a requirement for preparing the module for use and you can view it without connecting the logic analyzer to your SUT.
Information on basic operations describes how to view the file.
Acquiring and Viewing Disassembled Data
TMS 501 Z80 Microprocessor Support Instruction Manual
2–7

Specifications

This chapter contains the following information:
H Probe adapter description H Specification tables H Dimensions of the probe adapter H Channel assignment tables H Description of how the module acquires Z80 signals H List of other accessible microprocessor signals and extra probe channels
Probe Adapter Description
The probe adapter is nonintrusive hardware that allows the logic analyzer to acquire data from a microprocessor in its own operating environment with little effect, if any, on that system. Information on basic operations contains a figure showing the logic analyzer connected to a typical probe adapter. Refer to that figure while reading the following description.
Configuration
The probe adapter consists of a circuit board and a socket for a Z80 microprocessor. The probe adapter connects to the microprocessor in the SUT. Signals from the microprocessor-based system flow from the probe adapter to the channel groups and through the probe signal leads to the module.
All circuitry on the probe adapter is powered from the SUT. The probe adapter accommodates the Zilog Z80 microprocessor in a 40-pin DIP
package.
There is one jumper on the probe adapter. The probe adapter jumper J1203 needs to be in the NORMAL position (pins 1 and 2 connected) for proper disassembly.
TMS 501 Z80 Microprocessor Support Instruction Manual
3–1
Specifications
Specifications
These specifications are for a probe adapter connected between a compatible Tektronix logic analyzer and a SUT. Table 3–1 shows the electrical requirements the SUT must produce for the support to acquire correct data.
In Table 3–1, for the 68/102/136-channel module, one podlet load is 20 k in parallel with 2 pF. For the 96-channel module, one podlet load is 100 k in parallel with 10 pF.
T able 3–1: Electrical specifications
Characteristics Requirements
SUT DC power requirements
Voltage 5.0 V ± .25 V Current Maximum: 400 mA
Nominal: 170 mA
SUT clock
Clock rate DC – 20 MHz
Minimum setup time required with respect to rising edge of CLK
A15:0 5.0 ns D7:0 1.0 ns RD~, WR~, IORQ~, MREQ~, BUSACK~, HALT~ 1.0 ns
Minimum hold time required with respect to rising edge of CLK
A15:0 0 D7:0 & M1~ 6.5 ns RD~, WR~, IORQ~, MREQ~, BUSACK~, HALT~ 8.0 ns
Specification
Measured typical SUT signal loading AC load DC load
CLK 12 pF + 1 podlet 16L8 in parallel
with 1 podlet Address 9 pF + 1 podlet 1 podlet Data 20 pF (2) 74FCT652A T RD~, WR~, IORQ~, MREQ~, BUSACK~, HALT~ 11 pF 74F373 M1~ 15 pF 74FCT652AT RESET~, NMI~ 17 pF +1 podlet 1 podlet
3–2
TMS 501 Z80 Microprocessor Support Instruction Manual
Table 3–2 shows the environmental specifications.
T able 3–2: Environmental specifications*
Characteristic Description
Temperature
Specifications
Maximum operating Minimum operating 0° C (+32° F)
Non-operating –55° C to +75° C (–67° to +167° F) Humidity 10 to 95% relative humidity Altitude
Operating 4.5 km (15,000 ft) maximum
Non-operating 15 km (50,000 ft) maximum Electrostatic immunity The probe adapter is static sensitive
* Designed to meet Tektronix standard 062-2847-00 class 5.
[
Not to exceed Z80 microprocessor thermal considerations. Forced air cooling might be required across the CPU.
+50° C (+122° F)[
Table 3–3 shows the certifications and compliances that apply to the probe adapter.
T able 3–3: Certifications and compliances
EC Compliance There are no current European Directives that apply to this product.
TMS 501 Z80 Microprocessor Support Instruction Manual
3–3
Specifications
Figure 3–1 shows the dimensions of the probe adapter. Information on basic operations shows the vertical clearance of the channel and clock probes when connected to a probe adapter.
Pin 1
48 mm
(1.90 in)
21 mm
(.825 in)
Channel Assignments
14 mm
(.55 in)
76 mm
(3.00 in)
7 mm (.26 in)
Figure 3–1: Dimensions of the probe adapter
Channel assignments shown in Table 3–4 through Table 3–8 use the following conventions:
H All signals are required by the support unless indicated otherwise. H Channels are shown starting with the most significant bit (MSB) descending
to the least significant bit (LSB).
H Channel group assignments are for all modules unless otherwise noted.
3–4
H A tilde (~) following a signal name indicates an active low signal. Table 3–4 shows the probe section and channel assignments for the Address
group and the microprocessor signal to which each channel connects. By default, this channel group is displayed in hexadecimal.
TMS 501 Z80 Microprocessor Support Instruction Manual
T able 3–4: Address group channel assignments
Bit order
15 A1:7 A15 14 A1:6 A14 13 A1:5 A13 12 A1:4 A12 11 A1:3 A11 10 A1:2 A10 9 A1:1 A9 8 A1:0 A8 7 A0:7 A7 6 A0:6 A6 5 A0:5 A5 4 A0:4 A4 3 A0:3 A3 2 A0:2 A2 1 A0:1 A1 0 A0:0 A0
Section:channel Z80 signal name
Specifications
Table 3–5 shows the probe section and channel assignments for the Data group and the microprocessor signal to which each channel connects. By default, this channel group is displayed in hexadecimal.
T able 3–5: Data group channel assignments
Bit order
7 D0:7 D7 6 D0:6 D6 5 D0:5 D5 4 D0:4 D4 3 D0:3 D3 2 D0:2 D2 1 D0:1 D1 0 D0:0 D0
Section:channel Z80 signal name
TMS 501 Z80 Microprocessor Support Instruction Manual
3–5
Specifications
Table 3–6 shows the probe section and channel assignments for the Control group and the microprocessor signal to which each channel connects. By default, this channel group is displayed symbolically.
T able 3–6: Control group channel assignments
Bit order
6 C2:1 RD_L~ 5 C2:2 WR_L~ 4 C2:5 IORQ_L~
3 C2:6 HALT_L~ 2 C2:4 MREQ_L~ 1 C2:3 BUSACK_L~ 0 C2:0 M1_L~
Section:channel Z80 signal name
Table 3–7 shows the probe section and channel assignments for the Misc group and the microprocessor signal to which each channel connects. By default, this channel group is not visible.
T able 3–7: Misc group channel assignments
Bit order
6 C2:7 CLK_B* 5 D1:5 RFSH~* 4 D1:4 RESET~*
3 D1:3 NMI~* 2 D1:2 INT~* 1 D1:1 BUSREQ~* 0 D1:0 W AIT~*
* Signal not required for disassembly.
Section:channel Z80 signal name
Table 3–8 shows the probe section and channel assignments for the clock probes (not part of any group) and the Z80 signal to which each channel connects.
3–6
TMS 501 Z80 Microprocessor Support Instruction Manual
How Data is Acquired
Specifications
T able 3–8: Clock channel assignments
Section:channel Z80 signal name
CK:3 Not connected CK:2 HALT_L~ CK:1 Not connected CK:0 CLK
This part of this chapter explains how the module acquires Z80 signals using the TMS 501 software and probe adapter. This part also provides additional information on microprocessor signals accessible on or not accessible on the probe adapter, and on extra probe channels available for you to use for additional connections.
Custom Clocking
A special clocking program is loaded to the module every time you load the Z80A support. This special clocking is called Custom.
With Custom clocking, the module logs in signals from multiple groups of channels at different times as they become valid on the Z80 bus. The module then sends all the logged-in signals to the trigger machine and to the memory of the module for storage.
In Custom clocking, the module clocking state machine (CSM) generates one master sample for each microprocessor bus cycle, no matter how many clock cycles are contained in the bus cycle.
Figure 3–2 shows the sample points and the master sample point for an M1 cycle.
TMS 501 Z80 Microprocessor Support Instruction Manual
3–7
Specifications
T1 T2 T3 T4 T1
Clock
Address
Data in
C3(7:0)*
D7:0, A15:0, M1~, CLK_B, RFSH~, RESET~, NMI~, INT~, BUSREQ~, WAIT~, D1(7:6)*, A3(7:0)*, A2(7:0)*, D3(7:0)*, D2(7:0)*, C1(7:0), C0(7:0)
* Unused Logic Analyer channels
RD~, WR~, IORQ~, HALT~, MREQ~, BUSACK~
Figure 3–2: M1 cycle (opcode fetch or interrupt acknowledge)
Figure 3–3 shows the sample points and the master sample point for a Read or Write cycle.
T1 T2 T3 T4 T1
Clock
Address
Data in
Data out
C3(7:0)*
A15:0, M1~, CLK_B, RFSH~, RESET~, NMI~, INT~, BUSREQ~, WAIT~, D1(7:6)*, A3(7:0)* A2(7:0)*, D3(7:0)*, D2(7:0)*, C1(7:0), C0(7:0)
D7:0, RD~, WR~, IORQ~,
* Unused Logic Analyer channels
HALT~, MREQ~, BUSACK~
Figure 3–3: Read or Write cycle (memory or I/O, but not M1)
3–8
Clocking Options
The clocking algorithm for the Z80 support is DMA cycles.
TMS 501 Z80 Microprocessor Support Instruction Manual
Specifications
DMA Cycles Excluded. When BUSACK~ is inactive, a bus cycle starts when M1~, RD~, or WR~ become active. The bus cycle ends when the signal becomes inactive. The nature of the bus cycle depends on the following:
H M1~ is active. The bus cycle is either an opcode fetch or interrupt acknowl-
edge cycle. Figure 3–2 shows when the various signals and unused channels are logged.
H WR~ or RD~ are active while M1~ is inactive. The bus cycle is a data write
or read cycle with either memory or I/O. Figure 3–3 shows when the various signals and unused channels are logged.
When BUSACK~ is active, the bus cycle is considered a DMA cycle and nothing is logged in. No record is made of the bus cycle taking place.
HALT cycles are a special M1 cycles. The only exit from HALT cycles is an interrupt or reset. This can result in a contiguous string of HALT cycles (hundreds long). However, only the first HALT cycle is stored.
DMA Cycles Included. All bus cycles are logged, including those bus cycles with BUSACK~ signal active.
When BUSACK~ is active, any bus cycle logged in is considered a DMA cycle. A DMA cycle can be logged in two different ways:
H BUSACK~ becomes active, then inactive, without RD~ or WR~ becoming
active. The information on the bus immediately before BUSACK~ became inactive is logged in as the bus cycle.
H RD~ or WR~ become active while BUSACK~ is active. The cycle is logged
in the same manner as a memory read or write cycle (except that BUSACK~ is active.)
When logging in DMA cycles the data bus and control signals are logged in on the falling clock edge as shown in Figure 3–3.
TMS 501 Z80 Microprocessor Support Instruction Manual
3–9
Specifications
Alternate Microprocessor Connections
You can connect to microprocessor signals that are not required by the support so that you can do more advanced timing analysis. These signals might or might not be accessible on the probe adapter board.
For a list of signals required or not required for disassembly, refer to the channel assignment tables beginning on page 3–4. Remember that these channels are already included in a channel group. If you do connect these channels to other signals, you should set up another channel group for them.
Signals On the Probe
Adapter
Extra Channels
All Z80 microprocessor signals are accessible on the probe adapter.
Table 3–9 lists extra sections and channels that are left after you have connected all the probes used by the support. You can use these extra channels to make alternate SUT connections.
These channels are not defined in any channel group and data acquired from them is not displayed. To display data, you will need to define a channel group.
Channels not defined in a channel group by the TMS 501 software are logged in according to Figures 3–2 and 3–3.
T able 3–9: Extra module sections and channels
Module Section: channels
68-channels C3:7-0, A3:7-0, A2:7-0, D1:7, D1:6 102-channels C3:7-0, C1:7-0, C0:7-0, A3:7-0, A2:7-0, D3:7-0, D2:7-0, D1:7, D1:6, Qual:1,
Qual:0
136-channels C3:7-0, C1:7-0, C0:7-0, A3:7-0, A2:7-0, D3:7-0, D2:7-0, D1:7, D1:6, E3:7-0,
E2:7-0, E1:7-0, E0:7-0, Qual:3-0
96-channels C3:7-0, C1:7-0, C0:7-0, A3:7-0, A2:7-0, D3:7-0, D2:7-0, D1:7, D1:6
3–10
TMS 501 Z80 Microprocessor Support Instruction Manual

Maintenance

This chapter contains information on the following topics:
H Probe adapter circuit description H How to replace a fuse
Probe Adapter Circuit Description
The probe adapter board uses active circuitry to guarantee the state of various signals for the clocking state machine (CSM) to properly log in the signals. The CSM uses the rising edge of CLK to determine when to log the signals in. Schematic diagrams for the probe adpater board are located in chapter 5.
The control channels that can be active on the falling edge of CLK go through U1302. They are held until the next rising edge of CLK clocks them into U1301. U1301 is configured to behave as a D type flip-flop in order to latch all of the control lines into the module. U1301 is clocked on a buffered version of CLK.
Data channels D7-D0 drive U2291 and U2391. U2291 is clocked on the rising edge of a buffered version of CLK (CLK_BH). U2391 is clocked on the rising edge of the inverted version of CLK (CLK_B~). This clocking scheme allows D7-D0 to be stored on both edges of the clock.
The outputs of U2291 and U2391 are wire ORed together. However, only one is enabled at a time. Signals M1_L~, BUSACK_L, and TIMING~ are used to determine which one is enabled. M1 cycles, and the interrupt acknowledgment enables U2291. I/O reads and writes, and DMA cycles enables U2391. U2391 is also enabled when the probe adapter is configured for timing mode (J1203 to pins 2 and 3). U1201 generates clocks and the output-enables used by U2291 and U2293.
Replacing Signal Leads
Information on basic operations describes how to replace signal leads (individual channel and clock probes).
Replacing Protective Sockets
Information on basic operations describes how to replace protective sockets.
TMS 501 Z80 Microprocessor Support Instruction Manual
4–1
Maintenance
Replacing the Fuse
If the fuse on the Z80 probe adapter opens (burns out), you can replace it with a 3 A, 125 V fuse. Refer to the Replaceable Mechanical Parts List for information on ordering a replacement fuse.
4–2
TMS 501 Z80 Microprocessor Support Instruction Manual

Replaceable Electrical Parts

This chapter contains a list of the replaceable electrical components for the TMS 501 Z80 microprocessor support. Use this list to identify and order replacement parts.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or representative.
Changes to Tektronix products are sometimes made to accommodate improved components as they become available and to give you the benefit of the latest improvements. Therefore, when ordering parts, it is important to include the following information in your order:
H Part number H Instrument type or model number H Instrument serial number H Instrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your local Tektronix field office or representative will contact you concerning any change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Electrical Parts List
The tabular information in the Replaceable Electrical Parts List is arranged for quick retrieval. Understanding the structure and features of the list will help you find all of the information you need for ordering replacement parts. The following table describes each column of the electrical parts list.
TMS 501 Z80 Microprocessor Support Instruction Manual
5–1
Replaceable Electrical Parts
Parts list column descriptions
Column Column name Description
1 Component number The component number appears on diagrams and circuit board illustrations, located in the diagrams
section. Assembly numbers are clearly marked on each diagram and circuit board illustration in the Diagrams section, and on the mechanical exploded views in the Replaceable Mechanical Parts list section. The component number is obtained by adding the assembly number prefix to the circuit number (see Component Number illustration following this table).
The electrical parts list is arranged by assemblies in numerical sequence (A1, with its subassemblies and parts, precedes A2, with its subassemblies and parts).
Chassis-mounted parts have no assembly number prefix, and they are located at the end of the
electrical parts list. 2 Tektronix part number Use this part number when ordering replacement parts from Tektronix. 3 and 4 Serial number Column three indicates the serial number at which the part was first effective. Column four indicates
the serial number at which the part was discontinued. No entry indicates the part is good for all serial
numbers. 5 Name & description An item name is separated from the description by a colon (:). Because of space limitations, an item
name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1 for
further item name identification. 6 Mfr. code This indicates the code number of the actual manufacturer of the part. 7 Mfr. part number This indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Component Number
List of Assemblies
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Component number
A23A2R1234 A23 R1234
Assembly number Circuit number
Read: Resistor 1234 (of Subassembly 2) of Assembly 23
A2
Subassembly number
(optional)
A list of assemblies is located at the beginning of the electrical parts list. The assemblies are listed in numerical order. When a part’s complete component number is known, this list will identify the assembly in which the part is located.
Chassis-mounted parts and cable assemblies are located at the end of the Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of manufacturers or vendors of components listed in the parts list.
5–2
TMS 501 Z80 Microprocessor Support Instruction Manual
Replaceable Electrical Parts
Manufacturers cross index
Mfr. code
01295 TEXAS INSTRUMENTS INC SEMICONDUCTOR GROUP
04222 A VX/KYOCERA PO BOX 867 MYRTLE BEACH, SC 29577 04713 MOTOROLA INC SEMICONDUCTOR PRODUCTS SECTOR
61772 INTEGRA TED DEVICE TECHNOLOGY 2975 STENDER WA Y SANTA CLARA, CA 95054 61857 SAN–O INDUSTRIAL CORP 91–3 COLIN DRIVE HOLBROOK, NY 1 1741 63058 BERG ELECTRONICS INC. MCKENZIE SOCKET DIV
80009 TEKTRONIX INC 14150 SW KARL BRAUN DR
91637 DALE ELECTRONIC COMPONENTS 1122 23RD ST COLUMBUS, NE 68601 TK0875 MATSUO ELECTRONICS 2134 MAIN STREET
Manufacturer Address City , state, zip code
13500 N CENTRAL EXPRESSWA Y PO BOX 655303
5005 E MCDOWELL ROAD
910 PAGE AVE
PO BOX 500
SUITE 200
DALLAS, TX 75272–5303
PHOENIX, AZ 85008–4229
FREMONT , CA 94538–7340
BEAVERT ON, OR 97077–0001
HUNTINGTON BEACH, CA 92648
TMS 501 Z80 Microprocessor Support Instruction Manual
5–3
Replaceable Electrical Parts
Replaceable electrical parts list
Component number
A01 671–2361–00 CIRCUIT BD ASSY:Z80,DIP40,SOCKETED,PROBE
A01C1202 283–5004–00 CAP,FXD,CERAMIC:MLC,0.1UF,10%,25V,X7R,1206,SMD,8MM
A01C1210 290–5005–00 CAP,FXD,TANT:47UF,10%,10V,5.8MM X 4.6MM,5846,SMD,T&R TK0875 267M–1002–476–K
A01C1211 283–5004–00 CAP,FXD,CERAMIC:MLC,0.1UF,10%,25V,X7R,1206,SMD,8MM
A01C1212 283–5004–00 CAP,FXD,CERAMIC:MLC,0.1UF,10%,25V,X7R,1206,SMD,8MM
A01C1301 283–5004–00 CAP,FXD,CERAMIC:MLC,0.1UF,10%,25V,X7R,1206,SMD,8MM
A01C2291 283–5004–00 CAP,FXD,CERAMIC:MLC,0.1UF,10%,25V,X7R,1206,SMD,8MM
A01C2292 283–5004–00 CAP,FXD,CERAMIC:MLC,0.1UF,10%,25V,X7R,1206,SMD,8MM
A01F1201 159–0204–00 FUSE,WIRE LEAD:3.0A,125V,5 SECONDS,T&R, 61857 SP7–3A A01J1201 131–5267–00 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X 0.110
A01J1202 131–5267–00 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X 0.110
A01J1203 131–5267–00 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X 0.110
A01J1211 131–5267–00 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X 0.110
A01J1302 131–5267–00 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X 0.110
A01J1311 131–5267–00 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X 0.110
A01P1230 131–4530–00 CONN,HDR:PCB,MALE,STR,1 X 3,0.1 CTR,0.230 MLG X 0.120
A01R2281 307–5002–00 RES NTWK,FXD,FI:8,51 OHM,2%,ISOLATED,0.16W EA,1.28W
A01U1201 160–8768–00 IC,DIGITAL:STTL,PLD,P AL,16L8,5NS,180MA,16L8–5,PLCC20,PRG
A01U1211 136–0916–00 SOCKET,DIP:PCB,FEMALE,STR,2 X 20,0.1 X 0.6 CTR,0.173 H X
A01U1211 136–1193–00 SOCKET,DIP:PCB,MPC,FEMALE,STR,40,2 X 20,0.1 X 0.6
A01U1301 156–6176–00 IC,DIGITAL:FCTCMOS,TRANSCEIVER,OCTAL
A01U1302 156–5059–00 IC,DIGITAL:FTTL,LATCH,OCTAL
A01U2291 156–6176–00 IC,DIGITAL:FCTCMOS,TRANSCEIVER,OCTAL
Tektronix part number
Serial no. effective
Serial no. discont’d
Name & description
ADAPTER(LASI III),389–1337–XX WIRED
T&R
T&R
T&R
T&R
T&R
T&R
TAIL,30GOLD, HIGH TEMP,
TAIL,30GOLD, HIGH TEMP,
TAIL,30GOLD, HIGH TEMP,
TAIL,30GOLD, HIGH TEMP,
TAIL,30GOLD, HIGH TEMP,
TAIL,30GOLD, HIGH TEMP,
TAIL,30 GOLD,BD RETENTION,
PKG,SMD,SO16.200,TUBE
M 156–6225–00
0.183 TAIL,GOLD/GOLD,OPEN FRAME,
CTR,0.173H X 0.273L,0.020 DIA TAIL,GOLD
REGISTERED,3–STATE,74FCT652AT,SO24.300,TUBE
D–TYPE,3–STATE,74F373,SO20.300,TUBE
REGISTERED,3–STATE,74FCT652AT,SO24.300,TUBE
Mfr. code
80009 671–2361–00
04222 12063C104KAT3A
04222 12063C104KAT3A
04222 12063C104KAT3A
04222 12063C104KAT3A
04222 12063C104KAT3A
04222 12063C104KAT3A
00779 104326–4
00779 104326–4
00779 104326–4
00779 104326–4
00779 104326–4
00779 104326–4
00779 104344–1
91637 SOMC–1603–510G
80009 160–8768–00
63058 DIP–640–101B
63058 MPC
61772 IDT74FCT652ATSO
01295 SN74F373DW
61772 IDT74FCT652ATSO
Mfr. part number
R–533
2SIP–640–115B–R
5–4
TMS 501 Z80 Microprocessor Support Instruction Manual
Replaceable electrical parts list (cont.)
Replaceable Electrical Parts
Component number
A01U2391 156–6176–00 IC,DIGITAL:FCTCMOS,TRANSCEIVER,OCTAL
A01UXXX 156–6225–00 IC,DIGITAL:STTL,PLD,PAL,16L8,5NS,180MA,16L8–5,PLCC20,
Tektronix part number
Serial no. effective
Serial no. discont’d
Name & description
REGISTERED,3–STATE,74FCT652AT,SO24.300,TUBE
TUBE
Mfr. code
61772 IDT74FCT652ATSO
01295 TIBPAL16L8–5CFN
Mfr. part number
TMS 501 Z80 Microprocessor Support Instruction Manual
5–5

Replaceable Mechanical Parts

This chapter contains a list of the replaceable mechanical components for the TMS 501 Z80 microprocessor support. Use this list to identify and order replacement parts.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or representative.
Changes to Tektronix products are sometimes made to accommodate improved components as they become available and to give you the benefit of the latest improvements. Therefore, when ordering parts, it is important to include the following information in your order:
H Part number H Instrument type or model number H Instrument serial number H Instrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your local Tektronix field office or representative will contact you concerning any change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Mechanical Parts List
The tabular information in the Replaceable Mechanical Parts List is arranged for quick retrieval. Understanding the structure and features of the list will help you find all of the information you need for ordering replacement parts. The following table describes the content of each column in the parts list.
TMS 501 Z80 Microprocessor Support Instruction Manual
6–1
Replaceable Mechanical Parts
Parts list column descriptions
Column Column name Description
1 Figure & index number Items in this section are referenced by figure and index numbers to the exploded view illustrations
that follow. 2 Tektronix part number Use this part number when ordering replacement parts from Tektronix. 3 and 4 Serial number Column three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entries indicates the part is
good for all serial numbers. 5 Qty This indicates the quantity of parts used. 6 Name & description An item name is separated from the description by a colon (:). Because of space limitations, an
item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1
for further item name identification. 7 Mfr. code This indicates the code of the actual manufacturer of the part. 8 Mfr. part number This indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Chassis-mounted parts and cable assemblies are located at the end of the Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of manufacturers or vendors of components listed in the parts list.
6–2
TMS 501 Z80 Microprocessor Support Instruction Manual
Replaceable Mechanical Parts
Manufacturers cross index
Mfr. code
00779 AMP INC. CUSTOMER SERVICE DEPT
26742 METHODE ELECTRONICS INC BACKPLAIN DIVISION
53387 3M COMPANY ELECTRONICS PRODUCTS DIV
61857 SAN–O INDUSTRIAL CORP 91–3 COLIN DRIVE HOLBROOK, NY 1 1741 63058 BERG ELECTRONICS INC. MCKENZIE SOCKET DIV
80009 TEKTRONIX INC 14150 SW KARL BRAUN DR
TK2548 XEROX CORPORATION 14181 SW MILLIKAN WAY BEAVERTON, OR 97005
Manufacturer Address City , state, zip code
PO BOX 3608
7444 WEST WILSON AVE
3M AUSTIN CENTER
910 PAGE AVE
PO BOX 500
HARRISBURG, PA 17105–3608
CHICAGO, IL 60656–4548
AUSTIN, TX 78769–2963
FREMONT , CA 94538–7340
BEAVERT ON, OR 97077–0001
TMS 501 Z80 Microprocessor Support Instruction Manual
6–3
Replaceable Mechanical Parts
Replaceable mechanical parts list
Fig. & index number
1–0 010–0536–00 1 PROBE ADAPTER,Z80,DIP40,TMS 501 80009 010–0536–00
–1 131–4356–00 1 CONN,SHUNT:SHUNT/SHORTING,FEMALE,1 X 2,0.1
–2 131–4530–00 1 CONN,HDR:PCB,MALE,STR,1 X 3,0.1 CTR,0.230 MLG X
–3 131–5267–00 2 CONN,HDR:PCB,MALE,STR,2 X 40,0.1 CTR,0.235 MLG X
–4 671–2361–00 1 CIRCUIT BD ASSY:Z80,DIP40,SOCKETED,PROBE
–5 136–0916–00 2 SOCKET,DIP:PCB,FEMALE,STR,2 X 20,0.1 X 0.6 CTR,0.173
–6 015–0646–00 1 TEST CLIP ASSY:RIBBON,32DMXX,MXD,40,28 A WG,4.0
Tektronix part number
070–9828–00 1 MANUAL,TECH:INSTRUCTION,Z80,DISSASEMBLER,
070–9803–00 1 MANUAL, TECH:TLA 700 SERIES MICRO SUPPORT
070–9802–00 1 MANUAL, TECH:BASIC OPS MICRO SUP ON DAS/TLA 500
159–0204–00 1 FUSE,WIRE LEAD:3.0A,125V,5 SECONDS,T&R, 61857 SP7–3A
Serial no. ef­fective
Serial no. dis­cont’d
Qty Name & description
CTR,0.63 H,BLK,W/HANDLE,JUMPER,
0.120 TAIL,30 GOLD,BD RETENTION,
0.110 TAIL,30GOLD, HIGH TEMP,
ADAPTER(LASI III),389–1337–XX WIRED
H X 0.183 TAIL,GOLD/GOLD,OPEN FRAME,
STANDARD ACCESSORIES
TMS 501
INSTALLATION
OPTIONAL ACCESSORIES
SERIES LOGIC ANALYZERS
L,40 POS DIP CLIP X 2X20 0.1 CTR RCPT W/CTR PLZ,
Mfr. code
26742 9618–302–50
00779 104344–1
00779 104326–4
80009 671–2361–00
63058 DIP–640–101B
80009 070–9828–00
80009 070–9803–00
80009 070–9802–00
53387 015–0646–00
Mfr. part number
6–4
TMS 501 Z80 Microprocessor Support Instruction Manual
Replaceable Mechanical Parts
1
2
6
3
4
5
Figure 1: Z80 probe adapter exploded view
TMS 501 Z80 Microprocessor Support Instruction Manual
6–5

Index

A
about this manual set, ix acquiring data, 2–3 Address group
channel assignments, 3–4
display column, 2–5 Alternate Bus Master Cycles, clocking option, 2–1 alternate connections
extra channel probes, 3–10
to other signals, 3–10
B
basic operations, where to find information, ix bus cycles, displayed cycle types, 2–4 bus timing, 3–8
C
certifications, 3–3 channel assignments
Address group, 3–4
clocks, 3–6
Control group, 3–6
Data group, 3–5
Misc group, 3–6 channel groups, 2–1 clock channel assignments, 3–6 clock rate, 1–2 clocking, Custom, 2–1
how data is acquired, 3–7 clocking options
Alternate Bus Master Cycles, 2–1
field names, 2–1
how data is acquired, 3–8 compliances, 3–3 connections
no probe adapter, 1–8
channel probes, 1–8
clock probes, 1–9 other microprocessor signals, 3–10 probe adapter to SUT, DIP, 1–4
using converter clip, 1–7
Control Flow display format, 2–5 Control group
channel assignments, 3–6
symbol table, 2–2
Custom clocking, 2–1
Alternate Bus Master Cycles, 2–1 how data is acquired, 3–7
cycle types, 2–4
D
data
acquiring, 2–3 disassembly formats
Control Flow, 2–5 Hardware, 2–4 Software, 2–5 Subroutine, 2–6
how it is acquired, 3–7 data display , changing, 2–6 Data group
channel assignments, 3–5
display column, 2–5 demonstration file, 2–7 dimensions, probe adapter, 3–4 disassembled data
cycle type definitions, 2–4
viewing, 2–3
viewing an example, 2–7 disassembler
definition, ix
logic analyzer configuration, 1–2
setup, 2–1 display formats
Control Flow, 2–5
Hardware, 2–4
Software, 2–5
special characters, 2–3
Subroutine, 2–6
E
electrical specifications, 3–2 environmental specifications, 3–3
F
fuse, replacing, 4–2
TMS 501 Z80 Microprocessor Support Instruction Manual
Index–1
Index
H
Hardware display format, 2–4
cycle type definitions, 2–4
I
installing hardware. See connections
J
jumpers, Disassembly/Timing, 1–2
L
leads (podlets). See connections logic analyzer
configuration for disassembler, 1–2 software compatibility, 1–1
M
manual
conventions, ix
how to use the set, ix Mark Cycle function, 2–6 Mark Opcode function, 2–6 marking cycles, definition of, 2–6 microprocessor
package types supported, 1–1
specific clocking and how data is acquired, 3–7 Misc group, channel assignments, 3–6 Mnemonics display column, 2–5
hardware description, 3–1 jumper positions, 1–2, 3–1 not using one, 1–8 placing the microprocessor in, 1–4 replacing the fuse, 4–2
R
reference memory, 2–7 restrictions, 1–2
without a probe adapter, 1–8
S
service information, 4–1 setups, disassembler, 2–1 signals
active low sign, x alternate connections, 3–10
extra channel probes, 3–10 Software display format, 2–5 special characters displayed, 2–3 specifications, 3–1
certifications, 3–3
channel assignments, 3–4
compliances, 3–3
electrical, 3–2
environmental, 3–3
mechanical (dimensions), 3–3 Subroutine display format, 2–6 support setup, 2–1 SUT, definition, ix symbol table, Control channel group, 2–2 system, clock rate, 1–2 system file, demonstration, 2–7
P
probe adapter
alternate connections, 3–10 circuit description, 4–1 clearance, 1–3
adding sockets, 1–6
dimensions, 3–4 configuring, 1–2, 3–1 connecting leads, 1–5
Index–2
T
terminology, ix Timestamp display column, 2–5
V
viewing disassembled data, 2–3
TMS 501 Z80 Microprocessor Support Instruction Manual
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