The servicing instructions are for use by
qualified personnel only. To avoid personal
injury, do not perform any servicing unless you
are qualified to do so. Refer to all safety
summaries prior to performing service.
Copyright E T ektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and are
protected by United States copyright laws and international treaty provisions.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the
Rights in T echnical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software – Restricted Rights clause at F AR 52.227-19, as applicable.
T ektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
Printed in the U.S.A.
T ektronix, Inc., P.O. Box 1000, Wilsonville, OR 97070–1000
TEKTRONIX and TEK are registered trademarks of T ektronix, Inc.
SOFTWARE WARRANTY
T ektronix warrants that the media on which this software product is furnished and the encoding of the programs on
the media will be free from defects in materials and workmanship for a period of three (3) months from the date of
shipment. If a medium or encoding proves defective during the warranty period, T ektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
T ektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If T ektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.
HARDWARE WARRANTY
T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by T ektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the T ektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
To Avoid Fire or
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly . Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to the
input or output terminals of the product, ensure that the product is properly
grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings
information before making connections to the product.
The common terminal is at ground potential. Do not connect the common
terminal to elevated voltages.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Use Proper AC Adapter. Use only the AC adapter specified for this product.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
TMS 440 SH-3 7708 Microprocessor Support
v
General Safety Summary
Keep Product Surfaces Clean and Dry .
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Symbols and Terms
T erms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
T erms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear onthe product:
vi
WARNING
High Voltage
Protective Ground
(Earth) T erminal
CAUTION
Refer to Manual
Double
Insulated
TMS 440 SH-3 7708 Microprocessor Support
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TMS 440 SH-3 7708 Microprocessor Support
vii
Service Safety Summary
viii
TMS 440 SH-3 7708 Microprocessor Support
Preface
This instruction manual contains specific information about the TMS 440
SH-3 7708 microprocessor support package and is part of a set of information on
how to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating microprocessor support packages on the logic
analyzer for which the TMS 440 SH-3 7708 support was purchased, you will
only need this instruction manual to set up and run the support.
If you are not familiar with operating microprocessor support packages, you will
need to supplement this instruction manual with information on basic operations
to set up and run the support.
Information on basic operations of microprocessor support packages is included
with each product. Each logic analyzer includes basic information that describes
how to perform tasks common to support packages on that platform. This
information can be in the form of online help, an installation manual, or a user
manual.
This manual provides detailed information on the following topics:
HConnecting the logic analyzer to the system under test
Manual Conventions
HSetting up the support to acquire data from the system under test
HAcquiring and viewing disassembled data
This manual uses the following conventions:
HThe term “disassembler” refers to the software that disassembles bus cycles
into instruction mnemonics and cycle types.
HThe phrase “information on basic operations” refers to online help, an
installation manual, or a user manual covering the basic operations of
microprocessor supports.
HIn the information on basic operations, the term “XXX” or “P54C” appearing
in field selections and file names must be replaced with SH-3. This term is
the name of the microprocessor in field selections and file names you must
use to operate the SH-3 7708 support.
HThe term “SUT” (system under test) refers to the microprocessor-based
system from which data will be acquired.
TMS 440 SH-3 7708 Microprocessor Support
ix
Preface
HThe term “logic analyzer” refers to the Tektronix logic analyzer for which
this product was purchased.
HThe term “module” refers to an acquisition module.
HThe term “HI module” refers to the module in the higher-numbered slot, and
the term “LO module” refers to the module in the lower-numbered slot.
HSH-3 refers to all supported variations of the SH-3 7708 microprocessor
unless otherwise noted.
HA tilde (~) following a signal name indicate an active low signal.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic
analyzer is located in the user manual of the corresponding module. The manual
set provides the information necessary to install, operate, maintain, and service
the logic analyzer and its associated products.
Contacting Tektronix
Product
Support
Service
Support
For other
information
To write us
For questions about using Tektronix measurement products, call
toll free in North America:
1-800-TEK-WIDE (1-800-835-9433 ext. 2400)
6:00 a.m. – 5:00 p.m. Pacific time
Or contact us by e-mail:
tm_app_supp@tektronix.com
For product support outside of North America, contact your
local Tektronix distributor or sales office.
Tektronix offers extended warranty and calibration programs as
options on many products. Contact your local Tektronix
distributor or sales office.
For a listing of worldwide service centers, visit our web site.
In North America:
1-800-TEK-WIDE (1-800-835-9433)
An operator will direct your call.
Tektronix, Inc.
P.O. Box 1000
Wilsonville, OR 97070-1000
USA
Website
x
Tektronix.com
TMS 440 SH-3 7708 Microprocessor Support
Getting Started
Getting Started
This chapter contains information on the following topics and tasks:
HA description of the TMS 440 microprocessor support package
HLogic analyzer software compatibility
HSupport restrictions
HHow to connect to the system under test (SUT)
HYour system under test requirements
HHow to apply power to and remove power from the probe adapter
Support Package Description
The TMS 440 microprocessor support package displays disassembled data from a
system based on the Hitachi Micro Systems, Inc SH-3 7708 microprocessor.
The support runs on a TLA 700 Series logic analyzer equipped with a 102-channel module.
Refer to information on basic operations to determine how many modules and
probes your logic analyzer needs to meet the minimum channel requirements for
the TMS 440 microprocessor support.
A complete list of standard and optional accessories is provided at the end of the
parts list in the Replaceable Parts chapter.
To use this support efficiently, you need to have the items listed in the information on basic operations as well as the following documents:
HSH7700 Series Programming Manual, Hitachi Micro Systems, Inc 8/8/95
ADE–602–096
HSH7708 Hardware User Manual, Hitachi Micro Systems, Inc 9/10/96
ADE–602–105A
HSH–3 Series Memory Interfacing, Hitachi Micro Systems, Inc 11/22/96
Information on basic operations also contains a general description of support.
Contact Tektronix for the availability of SH-3 7702 Support.
TMS 440 SH-3 7708 Microprocessor Support
1–1
Getting Started
Logic Analyzer Software Compatibility
The floppy disk label on the microprocessor support states which version of logic
analyzer software this support is compatible with.
Logic Analyzer Configuration
To use the SH-3 7708 support, the TLA 700 Series logic analyzer must be
equipped with a 102-channel module at a minimum. The module must be
equipped with enough probes to acquire channel and clock data from signals in
your SH-3 7708-based system.
Refer to information on basic operations to determine how many modules and
probes the logic analyzer needs to meet the channel requirements.
For the TLA 700 Series logic analyzer, the TMS 440 channel assignments follow
the standard channel mapping and labeling scheme for P6434 probes. Follow the
procedure to apply labels, using the standard method as described in the P6434Mass Termination Probe Instructions.
Requirements and Restrictions
You should review the general requirements and restrictions of microprocessor
support packages in the information on basic operations as they pertain to your
SUT.
You should also review electrical, environmental, and mechanical specifications
in Specifications in this manual as they pertain to your system under test, as well
as the following descriptions of other SH-3 7708 support requirements and
restrictions.
System Clock Rate. The SH-3 7708 microprocessor support can acquire data from
the SH-3 7708 microprocessor operating at tested speeds of up to 60 MHz. This
specification is valid at the time this manual was printed. Please contact your
Tektronix Sales Representative for current information on the fastest devices
supported.
1–2
TMS 440 SH-3 7708 Microprocessor Support
Getting Started
Channel groups. The following table lists the SH-3 signals not required by the
Clocking State Machine (CSM) or disassembler. SH-3 signals may be removed
from their default connections and reattached to other signals of interest. Channel
groups not required for clocking and disassembly are:
Signal nameSection:channel
CKEC3–5
IOIS16~C3–1
WAIT~C0–2
IRQOUT~C2–5
NMI~C2–4
IRL0~C0–3
IRL1~C0–7
IRL2~C3–0
IRL3~C3–4
SUT Power. Whenever the SUT is powered off, remove power from the probe
adapter. Refer to Applying and Removing Power on page 1–9 for information on
how to remove power from the probe adapter.
Alternate Bus Master. Alternate bus master transactions are not processed in the
disassembly.
Data Disassembly . For correct data display disassembly turn off (disable) the
cache and the MMU address translation.
When the Address translation is enabled flushing could be incorrect (MMU page
breaks interpreted as address breaks).
Byte Invalidation. Invalid bytes cannot be dashed out for reads from SRAM/
PSRAM/ROM/PCMCIA interfaces.
Opcode Fetch/Data Read. SH-3 7708 does not provide a signal to distinguish
between “Data Read” and “Opcode Fetch”. The TMS 440 does make a reasonable estimate at looking a few sequences ahead at the address values yet in some
instances you may need to use the “Mark Opcode” function.
TMS 440 SH-3 7708 Microprocessor Support
1–3
Getting Started
Configuring the Probe Adapter
There are six jumpers on the probe adapter. The default position for all six
jumpers is between pin 1 and pin 2 (See Figure 1–1). The custom clocking and
acquisition software-setup choices function correctly when the jumpers are in the
default position. Pin 2 of each jumper is connected to the logic analyzer through
the Mictor connectors. These six jumpers are intended for future use.
J241
J145
J144
J143
Default position for jumpers
J142
J141
Figure 1–1: Jumper locations on the probe adapter
Connecting to a System Under Test With A Probe Adapter
Before you connect to the SUT (System Under Test), connect the probes to the
module. Your SUT must also have a minimum amount of clear space surrounding the microprocessor to accommodate the probe adapter.
To connect the logic analyzer to a SUT using a probe adapter, follow these steps:
1. Turn off the power to your SUT. It is not necessary to turn off the logic
analyzer.
CAUTION. Static discharge can damage the microprocessor, the probe adapter,
the probes, and the module. To prevent static damage, handle these components
only in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor and probe adapter.
1–4
TMS 440 SH-3 7708 Microprocessor Support
Getting Started
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer. Then, touch any of the ground pins of the
probe adapter to discharge stored static electricity from the probe adapter.
Connect the P6434
Probes to the Probe
Adapter
3. Connect the P6434 probes to the probe adapter as shown in Figure 1–2.
Match the channel groups and numbers on the probe labels to the corresponding pins on the probe adapter. Match the ground pins on the probes to
the corresponding pins on the probe adapter.
Pin 1
Figure 1–2: Connecting probes to a probe adapter
TMS 440 SH-3 7708 Microprocessor Support
1–5
Getting Started
Connect the Test Clip to
the Probe Adapter
4. Carefully seat the test clip on the PGA socket pins on the underside of the
probe adapter as shown in Figure 1–3. Refer to the Converter Clip Instruc-tions included with the probe adapter for more information about the test
clip.
Hold the probe adapter
in one hand, align the
QFP test clip with the
pins, and press on by
applying even pressure
on all sides of the clip;
be sure the clip is
completely seated.
QFP144 test clip
Connect the Probe
Adapter Assembly to the
System Under Test
Figure 1–3: Seating the test clip on the probe adapter
5. Inspect the microprocessor on your SUT for bent or broken leads. Verify that
the leads on the microprocessor are clean and free from dirt, dust, or any
foreign material.
6. Inspect the pins of the test clip for bent or broken contacts. Verify that the
leads on the test clip are clean and free from dirt, dust or any foreign
material.
7. Verify that the locking devise on the test clip is not locked by pushing and
turning the locking device counterclockwise.
CAUTION. Failure to correctly place the probe adapter assembly onto the
microprocessor can permanently damage all electrical components when power
is applied.
Center the clip on the microprocessor and apply an equal downward force on all
four sides of the clip, slightly rocking the probe adapter in a clockwise circle.
Do not apply leverage to the probe adapter when installing or removing it.
1–6
TMS 440 SH-3 7708 Microprocessor Support
8. Place the probe adapter onto the SUT as shown in Figure 1–4.
Pin 1
Probe
Adapter
Getting Started
Test clip
Pin 1
SUT
Figure 1–4: Placing the probe adapter assembly onto the SUT
9. Lock the test clip to the microprocessor by pushing and turning the locking
device clockwise.
CAUTION. The test clip was designed to be used on one and only one microprocessor. Because of the tight tolerances required for QFP test clip connectivity, the
test clip that attaches to the microprocessor has a soft plastic collar that
conforms to the unique shape of the target microprocessor.
To avoid faulty and unreliable connections, it is highly recommended that the test
clip is not used on any other microprocessor then the one it was originally
connected to.
The test clip has a manufacturer’s stated life expectancy of 8–10 connections.
TMS 440 SH-3 7708 Microprocessor Support
1–7
Getting Started
CAUTION. The probe adapter board might slip off or slip to one side of the
microprocessor because of the extra weight of the probes. This can damage the
microprocessor
adapter by placing a nonconductive object (such as foam) between the probe
adapter and the SUT.
and the SUT. To prevent this from occurring, stabilize the probe
Removing the Probe
Adapter from the SUT
10. Unlock the test clip from the microprocessor by pushing and turning the
locking device counterclockwise.
11. Gently lift and pull the probe adapter off of the microprocessor.
Connecting to a System Under Test Without A Probe Adapter
You can use channel probes, clock probes, and leadsets with a commercial test
clip (or adapter) to make connections between the logic analyzer and your SUT.
To connect the probes to SH-3 7708 signals in the SUT using a test clip, follow
these steps:
1. Turn off power to your SUT. It is not necessary to turn off power to the logic
analyzer.
CAUTION. Static discharge can damage the microprocessor, the probes, and the
logic analyzer module. To prevent static damage, handle these components only
in a static-free environment.
Always wear a grounding wrist strap, heel strap, or similar device while
handling the microprocessor.
1–8
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer. If you are using a test clip, touch any of the
ground pins on the clip to discharge stored static electricity from it.
CAUTION. Failure to place the SUT on a horizontal surface before connecting the
test clip can permanently damage the pins on the microprocessor.
3. Place the SUT on a horizontal static-free surface.
4. Use Table 1–1 through Table 1–8 to connect the channel probes to
SH-3 7708 signal pins on the test clip or in the SUT.
Use leadsets to connect at least one ground lead from each channel probe and
the ground lead from each clock probe to ground pins on your test clip.
TMS 440 SH-3 7708 Microprocessor Support
Applying and Removing Power
A power supply for the SH-3 7708 probe adapter is included with this microprocessor support. The power supply provides +5 volts power to the probe adapter.
To apply power to the SH-3 7708 probe adapter and SUT, follow these steps:
CAUTION. Failure to use the +5 V power supply provided by Tektronix can
permanently damage the probe adapter and SH-3 7708 microprocessor. Do not
use any otherpower supply for the +5 V power supply.
1. Connect the +5 V power supply to the jack on the probe adapter. Figure 1–5
shows the location of the jack on the adapter board.
CAUTION. Failure to apply power to the probe adapter before applying power to
your SUT can permanently damage the SH-3 7708 microprocessor and SUT.
Getting Started
2. Plug the power supply for the probe adapter into an electrical outlet. When
power is present on the probe adapter, an LED lights near the power jack.
3. Power on the SUT.
Power
Jack
Figure 1–5: Location of the power jack
To remove power from the SUT and SH-3 7708 probe adapter, follow these
steps:
TMS 440 SH-3 7708 Microprocessor Support
1–9
Getting Started
CAUTION. Failure to power down your SUT before removing the power from the
probe adapter might permanently damage the SH-3 7708 microprocessor and
SUT.
1. Power off the SUT.
2. Unplug the power supply for the probe adapter from the electrical outlet.
Functionality Not Supported
Microprocessor. The cache must be turned off (disabled) for proper disassembly.
MMU address translation. The MMU address translation must be turned off for
proper disassembly. When Address translation is enabled Flushing could be
incorrect(MMU page breaks are interpreted as address breaks).
Channel Assignments
Channel assignments shown in Table 1–1 through Table 1–8 use the following
conventions:
HAll signals are required by the support unless indicated otherwise.
HChannels are shown starting with the most significant bit (MSB), descending
to the least significant bit (LSB).
HChannel group assignments are for all modules unless otherwise noted.
HA tilde (~) following a signal name indicates an active low signal.
HAn equals sign (=) following a signal name indicates that it is double probed.
HThe module in the higher-numbered slot is referred to as the HI module and
the module in the lower-numbered slot is referred to as the LO module.
Table 1–1 shows the probe section and channel assignments for the Address
group and the microprocessor signal to which each channel connects. By default
the Address channel group assignments are displayed in hexadecimal.
T able 1–1: Address channel group assignments
1–10
Bit orderSection:channel SH-3 7708 signal name
31A3:7CS6~/CE1B~
30A3:6CS5~/CE1A~
TMS 440 SH-3 7708 Microprocessor Support
T able 1–1: Address channel group assignments (cont.)
Table 1–2 shows the probe section and channel assignments for the Data group
and the microprocessor signal to which each channel connects. By default the
Data channel group assignments are displayed in hexadecimal.
Table 1–3 shows the probe section and channel assignments for the Control
group and the microprocessor signal to which each channel connects. By default
the Control channel group assignments are displayed as symbols. The symbol
table file name is SH–3_Ctrl.
Table 1–4 shows the probe section and channel assignments for the CHip_Sel
group and the microprocessor signal to which each channel connects. By default,
this channel group is not displayed.
Table 1–5 shows the probe section and channel assignments for the Control2
group and the microprocessor signal to which each channel connects. By default,
this channel group is not displayed.
Table 1–6 shows the probe section and channel assignments for the WEN group
and the microprocessor signal to which each channel connects. By default, this
channel group is not displayed.
Table 1–7 shows the probe section and channel assignments for the Misc group
and the microprocessor signal to which each channel connects. By default, this
channel group is not displayed.
T able 1–7: Misc channel group assignments
Bit orderSection:channel SH-3 7708 signal name
15C1–6ST ATUS1
14C1–2ST ATUS0
13C0–6BACK~
12C2–1DL_ST AT
11C0–2WAIT~
10C3–1IOIS16~
9C3–5CKE
1–14
TMS 440 SH-3 7708 Microprocessor Support
T able 1–7: Misc channel group assignments (cont.)
Nonintrusive Acquisition. The SH-3 7708 will not intercept, modify, or return
signals to the system under test.
Acquisition Setup. The
submenus) by modifying existing fields and adding micro-specific fields.
TMS 440 SH-3 7708 Microprocessor Support
TMS 440 will affect the logic analyzer setup menus (and
1–15
Getting Started
The TMS 440 will add the selection “SH-3” to the Load Support Package dialog
box, located under the File pull-down menu. Once that “SH-3 support” has been
loaded, the “Custom” clocking mode selection in the module Setup menu is also
enabled.
CPU To Mictor Connections
To probe the microprocessor you will need to make connections between the
CPU and the Mictor pins of the P6434 Mass Termination Probe. Refer to the
P6434 Mass Termination Probe manual, Tektronix part number 070-9793-xx, for
more information on mechanical specifications. Tables 1–9 through 1–11 show
the CPU pin to Mictor pin connections.
Tektronix uses a counter-clockwise pin assignment. Pin-1 is located at the top
left, and pin-2 is located directly below it. Pin-20 is located on the bottom right,
and pin-21 is located directly above it.
AMP uses an odd side-even side pin assignment. Pin-1 is located at the top left,
and pin-3 is located directly below it. Pin-2 is located on the top right, and pin-4
is located directly below it.
NOTE. When designing Mictor connectors into your SUT, always follow the
Tektronix pin assignment.
Tektronix PinoutAMP Pinout
Pin 1
Pin 19
Pin 38
Pin 20
Pin 1
Pin 37
Pin 2
Pin 38
Figure 1–6: Pin assignments for a Mictor connector (component side)
Please pay close attention to the caution below.
CAUTION. To protect the CPU and the inputs of the module, it is recommended
that a 180W resistor is connected in series between each ball pad of the CPU and
each pin of the Mictor connector. The resistor must be no farther away from the
ball pad of the CPU than 1/2-inch.
1–16
TMS 440 SH-3 7708 Microprocessor Support
T able 1–9: CPU to Mictor connections for Mictor A pins
The information in this section is specific to the operations and functions of the
TMS 440 SH-3 7708 support on any Tektronix logic analyzer for which it can be
purchased.
Before you acquire and display disassembled data, you need to load the support
and specify the setups for clocking and triggering as described in the information
on basic operations. The microprocessor support provides default values for each
of these setups as well as user-definable settings.
Channel Group Definitions
The software automatically defines channel groups for the support. The channel
groups for the SH-3 7708 support are Address, Data, Control, Chip_Sel,
Control2, WEN, and Misc. If you want to know which signal is in which group,
refer to the channel assignment tables beginning on page 1–10.
Clocking Options
Custom Clocking
The TMS 440 support offers a microprocessor-specific clocking mode for the
SH-3 7708 microprocessor. This clocking mode is the default selection whenever
you load the SH-3 support.
Disassembly will not be correct with the Internal or External clocking modes.
Information on basic operations describes how to use these clock selections for
general-purpose analysis.
A special clocking program is loaded to the module every time you load the
SH-3 support. This special clocking is called Custom.
In Custom clocking, the CSM (Clocking State Machine) generates one master
sample for each microprocessor bus cycle, no matter how many clock cycles are
contained in the bus cycle.
The Custom clocking for the SH-3 7708 processor has a Clock_option to take
your input from the memory type connected to physical space areas 2 and 3.
The memory types for which the SH-3 7708 can provide Control signals are
SRAM, Burst ROM, PCMCIA, DRAM, EDO DRAM, Puesdo-SRAM, and
SDRAM.
The Control signals for these memories share pins. For example,
WE3~/DQMUU/ICIOWR~ is used for SRAM, Puesdo-SRAM, and SDRAM and
TMS 440 SH-3 7708 Microprocessor Support
2–1
Setting Up the Support
is also used for the PCMCIA memories. Also, some qualifiers are latched on the
rising edge of CKIO and some on the falling edge of CKIO. The qualifiers
latched on the rising edge of CKIO are:
L_BS~, L_RAS~, L_CAS~ and DL_STAT
The qualifiers latched on the falling edge of CKIO are:
DL_RASD~, DL_CASD~ and DL_WER~
TMS 440 has four modes of acquisition clocking. There is one select field
The
with the following label:
Memory Type:
that will contain the following selections:
DRAM/PSRAM/NORMAL
1
Cycles from those memories are acquired.
(default)
SDRAM/NORMAL
EDODRAM/NORMAL
1
1
Cycles from those memories are acquired.
Cycles from those memories are acquired.
A2–DRAM/
A3–EDODRAM/NORMAL
1
Cycles from Physical area2 – DRAM
and area3 – EDODRAM are acquired.
1
NORMAL means SRAM/ROM/PCMCIA interfaces
2–2
TMS 440 SH-3 7708 Microprocessor Support
Setting Up the Support
SRAM/ROM/PCMCIA Access. SRAM/ROM/PCMCIA accesses are handled by all
four clocking options. The Address, Data, and Control signals are logged-in
every trailing CKIO edge when the DL_WER~ qualifier is low, until the
DL_WER~ goes high. When the DL_WER~ is high at the next rising CKIO edge
it is mastered. The DL_WER~ for these cycles will go from low to high after a
trailing edge of CKIO and before the rising edge of CKIO see figure 2–1.
CKIO
Address
Data
M ;
A ; D ; C
Address A25–A0
RD~ (Asserted for Read )
Data
WEn~ (Asserted for Write)
DL_WER~(Asserted for
both Read and Write)
L_BS~
Figure 2–1: SRAM/ROM/PCMCIA Access bus timing
TMS 440 SH-3 7708 Microprocessor Support
2–3
Setting Up the Support
DRAM Access. DRAM accesses are handled by DRAM/PSRAM/NORMAL or
A2–DRAM/A3–EDODRAM/NORMAL clocking options. The Address, Data,
and Control signals are logged-in every trailing CKIO edge when the
DL_CASD~ and DL_RASD~ qualifiers are low. When the DL_CASD~ is high
at the next rising CKIO edge it is mastered. The DL_CASD~ for these cycles
will go from low to high after a trailing edge of CKIO before the rising edge of
CKIO see Figure 2–2.
CKIO
Row address
Row address
Column address
Data
M ;
A ; D ; C
Figure 2–2: DRAM Access bus timing
Address A25–A16
Address A15–A0
RD/WR~
DL_RASD~
DL_CASD~
Data
L_BS~
2–4
TMS 440 SH-3 7708 Microprocessor Support
Setting Up the Support
EDO DRAM. EDO DRAM accesses are handled by EDODRAM/NORMAL or
A2–DRAM/A3–EDODRAM/NORMAL clocking options. The Address, Data
and Control signals are logged-in every rising CKIO edge after the DL_CASD~
qualifier is low. In the next trailing edge of CKIO, if DL_CASD~ is high, it is
mastered, if DL_CASD~ is low Address, Data, and Control signals are logged-in
the next rising edge of CKIO. The DL_CASD~ for these cycles will go from
low to high after a trailing edge of CKIO before the rising edge of CKIO see
Figure 2–3.
CKIO
Row address
Row address
Column address
A ;
Data
D ; C;
Address A25 - A16
Address A15 - A0
RD/WR~
L_RAS~
DL_RASD~
DL_CASD~
Data
L_BS~
M ;
Figure 2–3: EDO DRAM Access bus timing
SDRAM Read. SDRAM accesses are handled by the SDRAM/NORMAL clocking
options. The Row Address and Control signals are logged-in and mastered at the
rising CKIO edge if the L_RAS~ is low and if DL_CASD~ and L_CAS~ is high
see Figure 2–4.
In the coming rising edges of CKIO:
a. If the L_CAS~ is low, the Column Address and Control signals are
logged-in and mastered.
TMS 440 SH-3 7708 Microprocessor Support
2–5
Setting Up the Support
b. If L_CAS~ and L_BS~ are low, the Column Address, Data and Control
signals are logged-in and mastered.
If the Column address is mastered and data has not been acquired, as in the case
of example b, then in the coming rising edges of CKIO if L_BS~ is low,
the Data and Control signals are logged-in and mastered. It is possible to have
L_RAS~, L_CAS~, and L_BS~ deasserted between Row Address and Column
Address and between Column Address and Data. One of the main differences in
the SDRAM Read cycles and SDRAM Write cycles shown below, is the
RD/WR~ behavior.
CKIO
Row Address
Row Address
A ; C ; M ;
Row address
Row Address
Read
Command
Column Address
A ; C ;M ;
address
Col
Data
D; M ;
Data
Address A25 - A16
Address A12 - A10
Address A15 - A0
RD/WR~
L_RAS~
L_CAS~
L_BS~
Data
2–6
Figure 2–4: SDRAM Read bus timing
TMS 440 SH-3 7708 Microprocessor Support
CKIO
Setting Up the Support
Row Address
Row Address
A ; C ; M ;
Row address
Row Address
Write
Command
Column
Address
Data
A ; D; C ; M ;
Column address
and Data
Address A25-A16
Address A12 or A10
Address A15-A0
RD/WR~
L_RAS~
L_CAS~
L_BS~
Data
Figure 2–5: SDRAM Write bus timing
PSRAM Access. PSRAM accesses are handled by DRAM/PSRAM/NORMAL
clocking option. In PSRAM Read, the Address, Data and Control signals are
logged-in every trailing CKIO edge when the DL_CASD~ AND DL_RASD~
qualifiers are low. When the DL_CASD~ is high at the next rising CKIO edge, it
is mastered. The DL_CASD~ for these cycles will go from low to high after a
trailing edge of CKIO before the rising edge of CKIO.
In PSRAM Write, the Address, Data and Control signals are logged-in every
trailing CKIO edge when the DL_WER~ AND DL_RASD~ qualifiers are low.
When the DL_WER~ is high at the next rising CKIO edge, it is mastered.
DL_WER~ for these cycles will go from low to high after a trailing edge of
CKIO before the rising edge of CKIO see Figure 2–6.
TMS 440 SH-3 7708 Microprocessor Support
2–7
Setting Up the Support
CKIO
Row Address
Data
M ;
A ; D ; C ;
Figure 2–6: PSRAM Access bus timing
Address A25-A0
RD/WR~
DL_RASD~
DL_CASD~
(Asserted for Read)
Data
DL_WER~
(Asserted for Write)
L_BS~
2–8
SDRAM Mode Register Accesses. SDRAM Mode Register Accesses are handled
by the SDRAM/NORMAL clocking options. This access is marked mainly by
L_RAS~ and L_CAS~ signals both going low together which does not happen
for normal or burst in Read or Write Cycle types. When L_RAS~ AND L_CAS~
are both low at a rising CKIO edge, the Address, Data, and Control signals are
logged-in and mastered see Figure 2–7.
TMS 440 SH-3 7708 Microprocessor Support
Setting Up the Support
CKIO
A13 or A11
A12 or A10
Address A25-A16
A ; C ; M;
SDMR ROW Addr
A ; D ; C ;
SDMR ROW Write
M:
Figure 2–7: SDRAM Mode Register Write Cycles bus timing
A11 or A2
or A9 to A2
CSn~
RD/WR~
L_RAS~
L_CAS~
D31–D0
TMS 440 SH-3 7708 Microprocessor Support
2–9
Setting Up the Support
Symbols
The TMS 440 support supplies one symbol table file. The SH-3_Ctrl file replaces
specific Control channel group values with symbolic values when Symbolic is
the radix for the channel group.
Symbol tables are generally not for use in timing or SH-3_T support disassembly.
Table 2–1 shows the name, bit pattern, and meaning for the symbols in the file
SH-3_Ctrl, which contains the Control-channel group symbol table.
T able 2–1: Control group symbol table definitions
Control group value
L_BS~DL_CASD~CASHL~
Symbol
”NORMAL READ”
”NORMAL WRITE”
”SDRAM COL ADDR”
”SDRAM DATA READ”
”SDRAM COL ADDR & DATA
Memory read from SRAM/ROM/PCMCIA
Memory write to SRAM/ROM/PCMCIA
SDRAM Column Address
SDRAM Data Read
SDRAM Column Address access and
SDRAM Data Read done simultaneously
SDRAM Data Write
SDRAM Column Address access and
SDRAM Data Write done simultaneously
SDRAM Mode Register Row Address
SDRAM Row Address
PSRAM Data Write
EDO_DRAM Data Write or SDRAM Mode
Register Write
DRAM Data Write or SDRAM Mode
Register Write
SDRAM Mode Register Write
EDO_DRAM Data Write
EDO_DRAM Data Read
DRAM Data Write
PSRAM Data Read or DRAM Data Read
Read Cycle
Write Cycle
2–10
TMS 440 SH-3 7708 Microprocessor Support
Setting Up the Support
NOTE. NORMAL indicates SRAM/ROM/PCMCIA memory types; SDMR is
SDRAM Mode Registe; SDRAM is Synchronous DRAM; PSRAM is Pseudo
SRAM.
Information on basic operations describes how to use symbolic values for
triggering and for displaying other channel groups symbolically, such as for the
Address channel group.
TMS 440 SH-3 7708 Microprocessor Support
2–11
Setting Up the Support
2–12
TMS 440 SH-3 7708 Microprocessor Support
Acquiring and Viewing Disassembled Data
Acquiring Data
Once you load the SH-3 support, choose a clocking mode, and specify the
trigger, you are ready to acquire and disassemble data.
If you have any problems acquiring data, refer to information on basic operations
in your online help or Appendix A: Error Messages and Disassembly Pr oblems in
the basic operations user manual.
Viewing Disassembled Data
You can view disassembled data in four display formats: Hardware, Software,
Control Flow, and Subroutine. The information on basic operations describes
how to select the disassembly display formats.
NOTE. Selections in the Disassembly property page (the Disassembly Format
Definition overlay) must be set correctly for your acquired data to be disassembled correctly. Refer to Changing How Data is Displayed on page 2–16.
The default display format shows the Address, Data, and Control channel group
values for each sample of acquired data.
If a channel group is not visible, you must use the Disassembly property page to
make the group visible.
The disassembler displays special characters and strings in the instruction
mnemonics to indicate significant events. Table 2–2 lists these special characters
and strings and gives a definition of what they represent.
T able 2–2: Meaning of special characters in the display
Character or string displayedDefinition
>>Fetch cycle has been manually marked by you.
Indicates there is insufficient data available for complete
disassembly of the instruction; the number of asterisks
indicates the width of the data that is unavailable. Each two
asterisks represent one byte.
Indicates an immediate value
TMS 440 SH-3 7708 Microprocessor Support
2–13
Acquiring and Viewing Disassembled Data
T able 2–2: Meaning of special characters in the display (cont.)
Character or string displayedDefinition
t
Indicates the number shown is in decimal, such as #12t
Hardware Display Format
>
There is insufficient room on the screen to show all available
data.
In Hardware display format, the disassembler displays certain cycle type labels in
parentheses. Table 2–3 lists these cycle type labels and gives a definition of the
cycle they represent. Reads to interrupt and exception vectors will be labeled
with the vector name.
T able 2–3: Cycle type definitions
Cycle typeDefinition
( ROW ADDR )
( COL ADDR )
( DATA READ )
( DATA WRITE )
( SDMR WRITE )
( UNKNOWN )
( EXTENSION )
( FLUSH )
1
1
Computed cycle types.
1
Row Address for an SDRAM access
Column Address for an SDRAM access
Read Cycle
Write Cycle
SDRAM Mode Register Write Cycle
Unexpected and/or unrecognized.
A fetch cycle computed to be an opcode extension
A fetch cycle computed to be an opcode flush
2–14
TMS 440 SH-3 7708 Microprocessor Support
Acquiring and Viewing Disassembled Data
Software Display Format
Control Flow Display
Format
Figure 2–8: Hardware display format
The Software display format shows only the first fetch of executed instructions.
Flushed cycles and extensions are not shown, even though they are part of the
executed instruction. Read extensions will be used to disassemble the instruction,
but will not be displayed as a separate cycle in the Software display format. Data
reads and writes are not displayed.
The Control Flow display format shows only the first fetch of instructions that
change the flow of control. Branches not taken will not be displayed.
Instructions that generate a change in the flow of control in the SH-3 7708
microprocessor are as follows:
BRABRAFJMPBSRBSRF
JSRRTSRTETRAPA
Instructions that may generate a change in the flow of control in the SH-3 7708
microprocessor are as follows:
BFBF/SBTBT/S
TMS 440 SH-3 7708 Microprocessor Support
2–15
Acquiring and Viewing Disassembled Data
Subroutine Display
Format
The Subroutine display format shows only the first fetch of subroutine call and
return instructions. It will display conditional subroutine calls if they are
considered to be taken.
Instructions that generate a subroutine call or a return in the SH-3 7708 microprocessor are as follows:
BSRBSRFJSRRTS
RTETRAPA
Changing How Data is Displayed
There are common fields and features that allow you to further modify displayed
data to suit your needs. You can make common and optional display selections in
the Disassembly property page (the Disassembly Format Definition overlay).
You can make selections unique to the SH-3 7708 support to do the following
tasks:
HChange how data is displayed across all display formats
HChange the interpretation of disassembled cycles
HDisplay exception vectors
Optional Display
Selections
You can make optional selections for acquired disassembled data. In addition to
the common selections (described in the information on basic operations), you
can change the displayed data in the following ways:
Show:Hardware (Default)
Software
Control Flow
Subroutine
Highlight:Software (Default)
Control Flow
Subroutine
None
Disassemble Across Gaps:Yes (Default)
No
VBR. If you relocate the vector table, the disassembler can be informed of the
new location by entering a Hex base address of eight digits in the fill in field. The
default value for VBR (Vector Based Register) is 00000000.
2–16
TMS 440 SH-3 7708 Microprocessor Support
Acquiring and Viewing Disassembled Data
NOTE. The reset exception vector addresses can not be relocated, only the
general and interrupt exception vectors can be relocated.
Byte Order. You can select the byte ordering for the predominant instruction
fetches as Little-Endian (default) or Big-Endian.
MMU Address Translation. Specify if the MMU (Memory Management Unit)
address translation is disabled (default) or enabled on your system.
Bus Widths (CS0 – CS6). Select the Bus Width (Memory Size) of the memory
areas CS0 to CS6 using the following notation:
BBYTE ( 8-bit bus )
WWORD ( 16-bit bus )
LLONG ( 32-bit bus )
The left most character corresponds to CS0 area and the right most one corresponds to CS6. The character corresponding to an unused area can have any
value B, W or L. The available selections are:
BBBBBBB All areas of CS0 to CS6 are a BYTE wide
BBBBBBL CS0 to CS5 have an 8-bit bus width. A bus width of CS7 is 16 bits.
BBBBBBW CS0 to CS5 have an 8-bit bus width. Bus width of CS7 is 32 bits.
.
.
.
WLLLLLLCS0:16-bit, CS1 to CS6:32-bit
.
.
.
LLLLLLLAll areas are 32-bit width
Below is an example of the CS0 area having a 16-bit bus width and CS1 and CS2
control areas with a 32-bit bus width. Areas CS3 to CS6 are not used.
The first character is a W, since area CS0 is 16 bit, the second and third character
is an L. since they are 32 bit. The rest of the characters are not used and can have
any value. So the selection should be:
WLLBBBB
and the default selection is:
LLLLLLL
Memory Type in Area 3. Select the type of memory in Area 3 on your SUT:
TMS 440 SH-3 7708 Microprocessor Support
2–17
Acquiring and Viewing Disassembled Data
Normal (default)
DRAM
SDRAM
PSRAM
Memory Type in Area 2. Select here the type of memory in Area 2 on your SUT:
Normal (default)
DRAM
SDRAM
AMX Bits in MCR. Select from the following possible combinations according to
your MCR register setting for the SUT:
00
01
10
11
Marking Cycles
The disassembler has a Mark Opcode function that allows you to change the
interpretation of a cycle type. Using this function, you can select a cycle and
change it to one of the following cycle types:
HExtension – an extension to an instruction opcode
HFlush – a flushed cycle
HOpcode – an instruction opcode
HUndo Mark – removes all marks from the current sequence
HData Read – mark cycle as data read
Mark selections for a 32-bit bus are as follows:
Data Read
OpcodeOpcode
OpcodeFlush
FlushOpcode
FlushFlush
Undo Mark
2–18
TMS 440 SH-3 7708 Microprocessor Support
Acquiring and Viewing Disassembled Data
Mark selections for a 16-bit bus are as follows:
Data Read
Opcode
Flush
Undo Mark
Mark selections for an 8-bit bus are as follows:
Data Read
Opcode
Extension
Flush
Undo Mark
Displaying Exception
Vectors
The disassembler can display exception vectors.
You can relocate the table by entering the starting address in the VBR field. The
VBR field provides the disassembler with the base address; enter an eight-digit
hexadecimal value corresponding to the base address of the exception table.
You can make these selections in the Disassembly property page (the Disassembly Format Definition overlay).
T able 2–4: Exception vectors for Addressing mode
Location in interrupt
Exception
number
00000
10100
20400
30600
vector table
(in hexadecimal)
Viewing an Example of Disassembled Data
Displayed exception name
( RESET EXCEPTION )
( GENERAL EXCEPTION )
( TLB MISS EXCEPTION )
( INTERRUPT )
A demonstration system file (or demonstration reference memory) is provided so
you can see an example of how your SH-3 7708 microprocessor bus cycles and
instruction mnemonics look when they are disassembled. Viewing the system file
is not a requirement for preparing the module for use, and you can view it
without connecting the TLA 700 Series logic analyzer to your SUT.
TMS 440 SH-3 7708 Microprocessor Support
2–19
Acquiring and Viewing Disassembled Data
2–20
TMS 440 SH-3 7708 Microprocessor Support
Specifications
Specifications
These specifications are for a probe adapter connected between a compatible
Tektronix logic analyzer and a SUT.
Table 3–1 lists the electrical requirements the SUT must produce for the SH-3
probe adapter to acquire correct data. Table 3–2 lists the environmental specifications.
T able 3–1: Electrical specifications
CharacteristicsRequirements
Probe adapter DC power requirements
Voltage4.75 – 5.25 VDC
CurrentI
AC adapter
Input Voltage rating90 – 265 V
Input Frequency Rating47 – 63 Hz
Output Voltage Rating5 V
Output Current Rating5 V
Output Power Rating25 W
SUT clock rate
Maximum specified clock rate60 MHz
Tested clock rate60 MHz
Minimum setup time required
TLA 700 logic analyzer2.5 ns
Minimum hold time required
TLA 700 logic analyzer0 ns
Typical signal loading
TLA 700 MICTOR load (ML) w20 kW in parallel with 2 pF
TLA 700 podlet load (CL) w20 kW in parallel with 2 pF
Measured typical SUT signal loadingAC loadDC load
CKIO35 pF + ML
I
max
typ
400 mA
210 mA
1
2 PALCE22V10 + 1 CL
1
RAS~/CE~25 pF + ML2 PALCE22V10 + 1 ML
CASLL~/CAS~/OE~30 pF + ML2 PALCE22V10 + 1 ML
BS~24 pF + ML1 PALCE22V10 + 1 ML
TMS 440 SH-3 7708 Microprocessor Support
3–1
Specifications
T able 3–1: (Cont.) Electrical specifications
CharacteristicsRequirements
Measured typical SUT signal loadingAC loadDC load
ST ATUS022 pF + ML1 PALCE22V10 + 1 ML
BACK~20 pF + ML1 P ALCE22V10 + 1 ML
WE3~/DQMUU~/ICIOWR~17 pF + ML1 PALCE22V10 + 1 ML
CASHH~/CAS2H~, CASHL~/CAS2L~16 pF + ML1 PALCE22V10 + 1 ML
WE1~/DQMLU~, RD~, STATUS115 pF + ML1 PALCE22V10 + 1 ML
MD5/RAS2~14 pF + ML1 PALCE22V10 + 1 ML
CASLH~, WE2~/DQMUL~/ICIORD~10 pF + ML1 PALCE22V10 + 1 ML
WE0~/DQMLL~, MD4/CE2B~9 pF + ML1 PALCE22V10 + 1 ML
IRL1~6 pF + ML1 PALCE22V10 + 1 ML
CKE14 pF + ML1 ML
D31, D411 pF + 1 ML1 ML
RD/WR~6pF + 1 ML1 ML
CS6~/CE1B~, CS4~, CS3~, CS2~,
Non-operating–55 °C to +75 °C (–67 to +167 °F)
Humidity10 to 95% relative humidity
Altitude
Operating4.5 km (15,000 ft) maximum
Non-operating15 km (50,000 ft) maximum
Electrostatic immunityThe probe adapter is static sensitive
1
Designed to meet Tektronix standard 062-2847-00, class 5.
2
Not to exceed SH-3 7708 microprocessor thermal considerations. Forced air cooling
might be required across the CPU.
TMS 440 SH-3 7708 Microprocessor Support
3–3
Specifications
Figure 3–1 shows the dimensions of the probe adapter and test clip.
56 mm
(2.200 in)
39 mm
(1.550 in)
29 mm
(1.150 in)
46 mm
(1.800 in)
89 mm
(3.500 in)
Pin 1
99 mm
(3.900 in)
Test clip
46 mm
(1.800 in)
7. mm (.26 in)
Pin 1
34. mm
(1.325 in) TYP
19 mm (.750 in)
3–4
Figure 3–1: Dimensions of the probe adapter assembly and test clip
TMS 440 SH-3 7708 Microprocessor Support
WARNING
The following servicing instructions are for use only by qualified personnel. To
avoid injury, do not perform any servicing other than that stated in the operating
instructions unless you are qualified to do so. Refer to all Safety Summaries
before performing any service.
Maintenance
Maintenance
This chapter contains information on the following topics:
HProbe adapter circuit description
HHow to replace a fuse
Probe Adapter Circuit Description
The probe adapter is nonintrusive hardware that allows the logic analyzer to
acquire data from a microprocessor in its own operating environment with little
or no effect on that system. Information on basic operations contains a figure
showing the logic analyzer connected to a typical probe adapter. Refer to that
figure while reading the following description.
The probe adapter assembly consists of a circuit board, a sacrificial socket, and a
test clip for the SH-3 7708 microprocessor. The probe adapter connects to the
microprocessor on the SUT. Signals from the microprocessor-based system flow
from the probe adapter to the channel groups and through the probe signal leads
to the module.
Replacing Signal Leads
The probe adapter accommodates the Hitachi Micro Systems, Inc SH-3 7708
microprocessor in a 144-pin QFP package.
A number of the SH-3 7708 signals are used to generate qualifiers by using the
hardware on the probe adapter. These signals along with other SH-3 7708 signals
go to the module through the Mictor connectors.
The SH-3 7708 support acquires all bus activity, as long as the SH-3 7708 is in
normal operation. It does not acquire when the SH-3 7708 is in Reset, Sleep, and
Standby Modes, or under Bus arbitration. Use the Status1, Status0, and Back~
signals in the Misc group for SH-3 7708 troubleshooting. To know the processor
activity that puts the SH-3 7708 out of normal operation, you could trigger on the
Status1 goes high or Status0 goes high or Back~ goes low and acquire in Internal
Mode.
Information on basic operations describes how to replace signal leads (individual
channel and clock probes).
TMS 440 SH-3 7708 Microprocessor Support
4–1
Maintenance
Replacing Protective Sockets
Information on basic operations describes how to replace protective sockets.
Replacing the Fuse
If the fuse on the SH-3 7708 probe adapter opens (burns out), you can replace it
with a 5 A, 125 V fuse. Figure 4–1 shows the location of the fuse on the probe
adapter.
Fuse
4–2
Figure 4–1: Location of the fuse
TMS 440 SH-3 7708 Microprocessor Support
Replaceable Electrical Parts
Replaceable Electrical Parts
This chapter contains a list of the replaceable electrical components for the
TMS 440 SH-3 7708 microprocessor support.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or
representative.
Changes to Tektronix products are sometimes made to accommodate improved
components as they become available and to give you the benefit of the latest
improvements. Therefore, when ordering parts, it is important to include the
following information in your order:
HPart number
HInstrument type or model number
HInstrument serial number
HInstrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your
local Tektronix field office or representative will contact you concerning any
change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Electrical Parts List
The tabular information in the Replaceable Electrical Parts List is arranged for
quick retrieval. Understanding the structure and features of the list will help you
find all of the information you need for ordering replacement parts. The
following table describes each column of the electrical parts list.
TMS 440 SH-3 7708 Microprocessor Support
5–1
Replaceable Electrical Parts
Parts list column descriptions
ColumnColumn nameDescription
1Component numberThe component number appears on diagrams and circuit board illustrations, located in the diagrams
section. Assembly numbers are clearly marked on each diagram and circuit board illustration in the
Diagrams section, and on the mechanical exploded views in the Replaceable Mechanical Parts list
section. The component number is obtained by adding the assembly number prefix to the circuit
number (see Component Number illustration following this table).
The electrical parts list is arranged by assemblies in numerical sequence (A1, with its subassemblies
and parts, precedes A2, with its subassemblies and parts).
Chassis-mounted parts have no assembly number prefix, and they are located at the end of the
electrical parts list.
2Tektronix part numberUse this part number when ordering replacement parts from Tektronix.
3 and 4Serial numberColumn three indicates the serial number at which the part was first effective. Column four indicates
the serial number at which the part was discontinued. No entry indicates the part is good for all serial
numbers.
5Name & descriptionAn item name is separated from the description by a colon (:). Because of space limitations, an item
name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1 for
further item name identification.
6Mfr. codeThis indicates the code number of the actual manufacturer of the part.
7Mfr. part numberThis indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Component Number
List of Assemblies
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Component number
A23A2R1234 A23 R1234
Assembly numberCircuit number
Read: Resistor 1234 (of Subassembly 2) of Assembly 23
A2
Subassembly number
(optional)
A list of assemblies is located at the beginning of the electrical parts list. The
assemblies are listed in numerical order. When a part’s complete component
number is known, this list will identify the assembly in which the part is located.
Chassis-mounted parts and cable assemblies are located at the end of the
Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of
manufacturers or vendors of components listed in the parts list.
5–2
TMS 440 SH-3 7708 Microprocessor Support
Replaceable Electrical Parts
Manufacturers cross index
Mfr.
code
04222AVX/KYOCERAPO BOX 867MYRTLE BEACH, SC 29577
00779AMP INC.CUSTOMER SERVICE DEPT
01KV9MERIX CORP1521 POPLAR LANE
26742METHODE ELECTRONICS INCBACKPLAIN DIVISION
50434HEWLETT PACKARD370 W TRIMBLE ROADSAN JOSE, CA 95131–1008
50579SIEMENS COMPONENTS INCOPTOELECTRONICS DIVISION
60381PRECISION INTERCONNECT CORP.16640 SW 72ND A VEPORTLAND, OR 97224
61857SAN–O INDUSTRIAL CORP91–3 COLIN DRIVEHOLBROOK, NY 11741
63058BERG ELECTRONICS INC.MCKENZIE SOCKET DIV
80009TEKTRONIX INC14150 SW KARL BRAUN DR
85480BRADY USANAMEPLATE DIVISION
TK0198HAMILTON HALLMARK9750 SW NIMBUS AVEBEA VERTON, OR 97005
TK0875MATSUO ELECTRONICS2134 MAIN STREET
TK2449SINGATRON ENTERPRISE CO LTD13925 MAGNOLIA AVECHINO, CA 91710
This section contains the troubleshooting procedures, block diagrams, circuit board
illustrations, component locator tables, waveform illustrations, and schematic diagrams.
Symbols
Graphic symbols and class designation letters are based on ANSI Standard Y32.2-1975.
Abbreviations are based on ANSI Y1.1-1972.
Logic symbology is based on ANSI/IEEE Standard 91-1984 in terms of positive logic.
Logic symbols depict the logic function performed and can differ from the manufacturer’s
data.
The tilde (~) preceding a signal name indicates that the signal performs its intended
function when in the low state.
Other standards used in the preparation of diagrams by Tektronix, Inc., include the
following:
HTektronix Standard 062-2476 Symbols and Practices for Schematic Drafting
HANSI Y14.159-1971 Interconnection Diagrams
HANSI Y32.16-1975 Reference Designations for Electronic Equipment
Locator Grid
Function Block Title
Internal Screw Adjustment
Onboard Jumper
Digital Ground
Refer to Assembly
& Diagram Number
Offboard Connector
Active Low Signal
Signal From
Another Diagram,
Same Board
A
B
12 3
Component Locator Diagrams
The schematic diagram and circuit board component location illustrations have grids
marked on them. The component lookup tables refer to these grids to help you locate a
component. The circuit board illustration appears only once; its lookup table lists the
diagram number of all diagrams on which the circuitry appears.
Some of the circuit board component location illustrations are expanded and divided into
several parts to make it easier for you to locate small components. To determine which
part of the whole locator diagram you are looking at, refer to the small locator key shown
below. The gray block, within the larger circuit board outline, shows where that part fits
in the whole locator diagram. Each part in the key is labeled with an identifying letter that
appears in the figure titles under component locator diagrams.
4
Power Termination
Component on back of board
Strap
Panel Control
Female Coaxial
Connector
Heat Sink
Decoupled Voltage
Diagram Number
Assembly Number
Diagram Name
HMIL-HDBK-63038-1A Military Standard Technical Manual Writing Handbook
Component Values
Electrical components shown on the diagrams are in the following units unless noted
otherwise:
Capacitors:Values one or greater are in picofarads (pF).
Values less than one are in microfarads (mF).
Resistors:Values are in Ohms (W).
Graphic Items and Special Symbols Used in This Manual
Each assembly in the instrument is assigned an assembly number (for example A5). The
assembly number appears in the title on the diagram, in the lookup table for the schematic
diagram, and corresponding component locator illustration. The Replaceable Electrical
Parts list is arranged by assembly in numerical sequence; the components are listed by
component number.
This chapter contains a list of the replaceable mechanical components for the
TMS 440 SH-3 7708 microprocessor support.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or
representative.
Changes to Tektronix products are sometimes made to accommodate improved
components as they become available and to give you the benefit of the latest
improvements. Therefore, when ordering parts, it is important to include the
following information in your order:
HPart number
HInstrument type or model number
HInstrument serial number
HInstrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your
local Tektronix field office or representative will contact you concerning any
change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Mechanical Parts List
The tabular information in the Replaceable Mechanical Parts List is arranged for
quick retrieval. Understanding the structure and features of the list will help you
find all of the information you need for ordering replacement parts. The
following table describes the content of each column in the parts list.
TMS 440 SH-3 7708 Microprocessor Support
7–1
Replaceable Mechanical Parts
Parts list column descriptions
ColumnColumn nameDescription
1Figure & index numberItems in this section are referenced by figure and index numbers to the exploded view illustrations
that follow.
2Tektronix part numberUse this part number when ordering replacement parts from Tektronix.
3 and 4Serial numberColumn three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entries indicates the part is
good for all serial numbers.
5QtyThis indicates the quantity of parts used.
6Name & descriptionAn item name is separated from the description by a colon (:). Because of space limitations, an
item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1
for further item name identification.
7Mfr. codeThis indicates the code of the actual manufacturer of the part.
8Mfr. part numberThis indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Chassis-mounted parts and cable assemblies are located at the end of the
Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of
manufacturers or vendors of components listed in the parts list.
7–2
TMS 440 SH-3 7708 Microprocessor Support
Replaceable Mechanical Parts
Manufacturers cross index
Mfr.
code
00779AMP INC.CUSTOMER SERVICE DEPT
05276ITT POMONA ELECTRONICS1500 E NINTH STPOMONA, CA 91766–3835
0KB05NORTH ST AR NAMEPLATE INC5750 NE MOORE COURTHILLSBORO, OR 97124–6474
14310AULT INC7300 BOONE AVE NORTH
26742METHODE ELECTRONICS INCBACKPLAIN DIVISION
60381PRECISION INTERCONNECT CORP.16640 SW 72ND A VEPORTLAND, OR 97224
61857SAN–O INDUSTRIAL CORP91–3 COLIN DRIVEHOLBROOK, NY 11741
63058BERG ELECTRONICS INC.MCKENZIE SOCKET DIV
80009TEKTRONIX INC14150 SW KARL BRAUN DR
S3109FELLER U.S. CORPORATION72 VERONICA AVE
TK1943NEILSEN MANUFACTURING INC3501 PORTLAND RD NESALEM, OR 97303
TK2449SINGATRON ENTERPRISE CO LTD13925 MAGNOLIA AVECHINO, CA 91710
TK2548XEROX CORPORATION14181 SW MILLIKAN WAYBEAVERTON, OR 97005
Area 3, 2–16
memory types, Control signals, 2–1
microprocessor, specific clocking and how data is
acquired, 2–1
Mictor to CPU connections, 1–16
MMU Address, 2–15
module, definition, x
O
Optional Display Selections
AMX Bits in MCR, 2–16
Bus Widths (CS0 – CS6), 2–15
Byte Order, 2–15
Memory T ype
Area 2, 2–16
Area 3, 2–16
MMU, 2–15
VBR, 2–14
I
inspection and cleaning
microcontroller, 1–6
QFP test clip, 1–6
installing hardware. See connections
L
leads (podlets). See connections
Little-Endian byte order, 2–15
LO module, definition, x
loading, 3–1
signal, 3–1
logic analyzer
configuration for disassembler, 1–2
configuration for the application, 1–2
definition, x
software compatibility, 1–2
M
manual
conventions, ix
how to use the set, ix
Mark Cycle function, 2–16
Mark Opcode function, 2–16
P
P54C, definition, ix
P6434 probes, labeling, 1–2
power
for the probe adapter
applying, 1–9
removing, 1–10
SUT, 1–3
power adapter, 1–9
power jack, 1–9
power requirements
probe adapter, 3–1
SUT, 3–1
Prefetch Byte Ord field, 2–15
probe adapter
circuit description, 4–1
clearance, 1–4
configuring, 1–4
connecting leads, 1–5
hardware description, 4–1
how to unlock test clip, 1–8
inspection and cleaning, 1–6
not using one, 1–8
removing, 1–8
replacing the fuse, 4–2
PSRAM Access, 2–7
Index–2
TMS 440 SH-3 7708 Microprocessor Support
Index
Q
QFP test clip, inspection and cleaning, 1–6
R
reference memory, 2–17
restrictions, 1–2
without a probe adapter, 1–8
S
SDRAM Mode Register Accesses, 2–8
SDRAM Read, 2–5
service information, 4–1
set up time, minimum, 3–1
setups
disassembler, 2–1
support, 2–1
signal loading, 3–1
signals, active low sign, x
Software display format, 2–13
special characters displayed, 2–11
specifications, 3–1
channel assignments, 1–10
electrical, 3–1
environmental, 3–3
SRAM/ROM/PCMCIA access, 2–3
Subroutine display format, 2–14
support, setup, 2–1
support setup, 2–1
SUT, definition, ix
SUT power, 1–3
symbol table, Control channel group, 2–9
system file, demonstration, 2–17
T
T ektronix, how to contact, x
terminology, ix
test clip
how to lock, 1–7
how to unlock, 1–8
inspection and cleaning, 1–6
removing, 1–8
typical signal loading, 3–1
V
VBR, 2–14
viewing disassembled data, 2–11
X
XXX, definition, ix
TMS 440 SH-3 7708 Microprocessor Support
Index–3
Index
Index–4
TMS 440 SH-3 7708 Microprocessor Support
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