Tektronix TMS163 Instruction Manual

Instruction Manual
TMS 163 i960 Jx Microprocessor Support
070-9817-00
There are no current European directives that apply to this product. This product provides cable and test lead connections to a test object of electronic measuring and test equipment.
The servicing instructions are for use by qualified personnel only. To avoid personal injury, do not perform any servicing unless you are qualified to do so. Refer to all safety summaries prior to performing service.
Copyright T ektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and are protected by United States copyright laws and international treaty provisions.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the Rights in T echnical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the Commercial Computer Software – Restricted Rights clause at F AR 52.227-19, as applicable.
T ektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes that in all previously published material. Specifications and price change privileges reserved.
Printed in the U.S.A.
T ektronix, Inc., P.O. Box 1000, Wilsonville, OR 97070–1000 TEKTRONIX and TEK are registered trademarks of T ektronix, Inc.
SOFTWARE WARRANTY
T ektronix warrants that the media on which this software product is furnished and the encoding of the programs on the media will be free from defects in materials and workmanship for a period of three (3) months from the date of shipment. If a medium or encoding proves defective during the warranty period, T ektronix will provide a replacement in exchange for the defective medium. Except as to the media on which this software product is furnished, this software product is provided “as is” without warranty of any kind, either express or implied. T ektronix does not warrant that the functions contained in this software product will meet Customer’s requirements or that the operation of the programs will be uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period. If T ektronix is unable to provide a replacement that is free from defects in materials and workmanship within a reasonable time thereafter, Customer may terminate the license for this software product and return this software product and any associated materials for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
HARDWARE WARRANTY
T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by T ektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the T ektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Table of Contents

Getting Started
Operating Basics
General Safety Summary v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Service Safety Summary vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Preface: Microprocessor Support Documentation ix. . . . . . . . . . . . . . . .
Manual Conventions ix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Documentation x. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contacting T ektronix x. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Support Description 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Software Compatibility 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Configuration 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Requirements and Restrictions 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuring the Probe Adapter 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connecting to a System Under T est 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Probe Adapter with a High-Density Probe 1–4. . . . . . . . . . . . . . . . . . . . . . . . . .
With a PGA-to-QFP Converter Clip 1–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Without a Probe Adapter 1–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applying and Removing Power 1–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specifications
Setting Up the Support 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Group Definitions 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking Options 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternate Bus Master Cycles 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Symbols 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acquiring and Viewing Disassembled Data 2–7. . . . . . . . . . . . . . . . . . . . .
Acquiring Data 2–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing Disassembled Data 2–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Display Format 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Display Format 2–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Flow Display Format 2–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Subroutine Display Format 2–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Changing How Data is Displayed 2–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Optional Display Selections 2–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking Cycles 2–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Displaying Exception Vectors 2–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing an Example of Disassembled Data 2–14. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Probe Adapter Description 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specifications 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Assignments 3–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
How Data is Acquired 3–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Custom Clocking 3–11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TMS 163 i960 Jx Microprocessor Support Instruction Manual
i
Table of Contents
Clocking Options 3–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternate Microprocessor Connections 3–14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signals On the Probe Adapter 3–14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signals Not On the Probe Adapter 3–15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Extra Channels 3–15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maintenance
Probe Adapter Circuit Description 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing the Fuse 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replaceable Electrical Parts
Parts Ordering Information 5–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Using the Replaceable Electrical Parts List 5–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replaceable Mechanical Parts
Parts Ordering Information 6–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Using the Replaceable Mechanical Parts List 6–1. . . . . . . . . . . . . . . . . . . . . . . . . . .
Index
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TMS 163 i960 Jx Microprocessor Support Instruction Manual

List of Figures

Table of Contents
Figure 1–1: Power Source jumper location 1–3. . . . . . . . . . . . . . . . . . . . . .
Figure 1–2: Placing a microprocessor into the probe adapter 1–5. . . . . .
Figure 1–3: Placing a PGA probe adapter onto the SUT 1–6. . . . . . . . . .
Figure 1–4: Connecting channel and clock probes to a
high-density probe 1–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 1–5: Connecting the cable to a high-density probe 1–8. . . . . . . . .
Figure 1–6: Placing the converter clip onto the probe adapter 1–9. . . . .
Figure 1–7: Placing the probe adapter onto the SUT 1–9. . . . . . . . . . . . .
Figure 1–8: Location of the power jack 1–13. . . . . . . . . . . . . . . . . . . . . . . . .
Figure 2–1: Hardware display format 2–9. . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 3–1: Jumper location on the probe adapter 3–2. . . . . . . . . . . . . . .
Figure 3–2: Dimensions of the probe adapter 3–5. . . . . . . . . . . . . . . . . . . .
Figure 3–3: Dimensions of the PGA-to-QFP converter clip 3–6. . . . . . . .
Figure 3–4: i960 Jx bus timing 3–12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4–1: Location of the fuse 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TMS 163 i960 Jx Microprocessor Support Instruction Manual
iii
Table of Contents

List of Tables

Table 1–1: Supported microprocessors 1–1. . . . . . . . . . . . . . . . . . . . . . . .
Table 1–2: i960 Jx signal connections for channel probes 1–11. . . . . . . . .
Table 1–3: i960 Jx signal connections for clock probes 1–12. . . . . . . . . . . .
Table 2–1: Control group symbol table definitions 2–2. . . . . . . . . . . . . . .
Table 2–2: IBR symbol table definitions for the Address group 2–3. . . .
Table 2–3: PRCB symbol table definitions for the Address group 2–3. . Table 2–4: Control Table symbol table definitions for the
Address group 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2–5: INT symbol table definitions for the Address group 2–4. . . .
Table 2–6: FAULT symbol table definitions for the Address group 2–5.
Table 2–7: Meaning of special characters in the display 2–8. . . . . . . . . .
Table 2–8: Cycle type definitions 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2–9: Exception vectors 2–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 2–10: Fault vectors 2–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–1: Electrical specifications 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–2: Environmental specifications 3–3. . . . . . . . . . . . . . . . . . . . . . . .
Table 3–3: Certifications and compliances 3–4. . . . . . . . . . . . . . . . . . . . . .
Table 3–4: Address group channel assignments 3–7. . . . . . . . . . . . . . . . . .
Table 3–5: Data group channel assignments 3–8. . . . . . . . . . . . . . . . . . . . .
Table 3–6: TMS 163 Control group channel assignments 3–9. . . . . . . . .
Table 3–7: TMS 163 ByteEnbl group channel assignments 3–9. . . . . . . .
Table 3–8: TMS 163 Aux group channel assignments 3–10. . . . . . . . . . . . .
Table 3–9: TMS 163 Intr group channel assignments 3–10. . . . . . . . . . . . .
Table 3–10: TMS 163 Misc group channel assignments 3–10. . . . . . . . . . .
Table 3–11: Clock channel assignments 3–11. . . . . . . . . . . . . . . . . . . . . . . . .
Table 3–12: i960 Jx signals available on C0 and C1 (92A96 only) 3–15. .
Table 3–13: Extra module sections and channels 3–15. . . . . . . . . . . . . . . .
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TMS 163 i960 Jx Microprocessor Support Instruction Manual

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the system.
To Avoid Fire or Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use. Connect and Disconnect Properly . Do not connect or disconnect probes or test
leads while they are connected to a voltage source. Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and marking on the product. Consult the product manual for further ratings information before making connections to the product.
Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal.
Use Proper AC Adapter. Use only the AC adapter specified for this product. Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product. Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present. Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions. Do Not Operate in an Explosive Atmosphere. Keep Product Surfaces Clean and Dry . Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
v
General Safety Summary
Symbols and Terms
T erms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.
T erms on the Product. These terms may appear on the product: DANGER indicates an injury hazard immediately accessible as you read the
marking. WARNING indicates an injury hazard not immediately accessible as you read the
marking. CAUTION indicates a hazard to property including the product. Symbols on the Product. The following symbols may appear on the product:
WARNING
High Voltage
Protective Ground
(Earth) T erminal
CAUTION
Refer to Manual
Double
Insulated
vi
TMS 163 i960 Jx Microprocessor Support Instruction Manual

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service
procedures. Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is present.
Disconnect Power. To avoid electric shock, disconnect the main power by means of the power cord or, if provided, the power switch.
Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
vii
Service Safety Summary
viii
TMS 163 i960 Jx Microprocessor Support Instruction Manual

Preface: Microprocessor Support Documentation

This instruction manual contains specific information about the TMS 163 i960 Jx microprocessor support package and is part of a set of information on how to operate this product on compatible Tektronix logic analyzers.
If you are familiar with operating microprocessor support packages on the logic analyzer for which the TMS 163 i960 Jx support was purchased, you will probably only need this instruction manual to set up and run the support.
If you are not familiar with operating microprocessor support packages, you will need to supplement this instruction manual with information on basic operations to set up and run the support.
Information on basic operations of microprocessor support packages is included with each product. Each logic analyzer has basic information that describes how to perform tasks common to supports on that platform. This information can be in the form of online help, an installation manual, or a user manual.
This manual provides detailed information on the following topics: H Connecting the logic analyzer to the system under test
Manual Conventions
H Setting up the logic analyzer to acquire data from the system under test H Acquiring and viewing disassembled data H Using the probe adapter
This manual uses the following conventions: H The term disassembler refers to the software that disassembles bus cycles
into instruction mnemonics and cycle types.
H The phrase “information on basic operations” refers to online help, an
installation manual, or a basic operations of microprocessor supports user manual.
H In the information on basic operations, the term XXX or P54C used in field
selections and file names must be replaced with 960JX. This is the name of the microprocessor in field selections and file names you must use to operate the i960 Jx support.
H The term system under test (SUT) refers to the microprocessor-based system
from which data will be acquired.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
ix
Preface: Microprocessor Support Documentation
H The term logic analyzer refers to the Tektronix logic analyzer for which this
product was purchased.
H The term module refers to a 102/136-channel or a 96-channel module. H 960JX refers to all supported variations of the i960 Jx microprocessor unless
otherwise noted. H An asterisk (*) following a signal name indicates an active low signal.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic analyzer is located in the corresponding module user manual. The manual set provides the information necessary to install, operate, maintain, and service the logic analyzer and associated products.
Contacting Tektronix
Product Support
Service Support
For other information
To write us Tektronix, Inc.
For application-oriented questions about a Tektronix measure­ment product, call toll free in North America: 1-800-TEK-WIDE (1-800-835-9433 ext. 2400) 6:00 a.m. – 5:00 p.m. Pacific time
Or, contact us by e-mail: tm_app_supp@tek.com
For product support outside of North America, contact your local Tektronix distributor or sales office.
Contact your local Tektronix distributor or sales office. Or, visit our web site for a listing of worldwide service locations.
http://www.tek.com In North America:
1-800-TEK-WIDE (1-800-835-9433) An operator will direct your call.
P.O. Box 1000 Wilsonville, OR 97070-1000
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TMS 163 i960 Jx Microprocessor Support Instruction Manual
Getting Started

Getting Started

Support Description
This chapter provides information on the following topics and tasks:
H A description of the TMS 163 microprocessor support package H Logic analyzer software compatibility H Your system under test requirements H Support restrictions H How to configure the probe adapter H How to connect to the system under test (SUT) H How to apply power to and remove power from the probe adapter
The TMS 163 microprocessor support package disassembles data from systems that are based on the Intel i960 Jx microprocessor. The support runs on a compatible Tektronix logic analyzer equipped with a 102/136-channel module or a 96-channel module.
Refer to information on basic operations to determine how many modules and probes your logic analyzer needs to meet the minimum channel requirements for the TMS 163 microprocessor support.
Table 1–1 shows which microprocessors, packages, and clock rates the TMS 163 product supports.
T able 1–1: Supported microprocessors
Microprocessor Package* Clock rate
i960 JA PGA, QFP 16, 25, & 33 MHz
i960 JD PGA, QFP 16 & 25 MHz
i960 JF PGA, QFP 16, 25, & 33 MHz
A complete list of standard and optional accessories is provided at the end of the parts list in the Replaceable Mechanical Parts chapter.
To use this support efficiently, you need to have the items listed in the informa­tion on basic operations as well as the i960 Jx Microprocessor User’s Manual, Intel, 1994.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–1
Getting Started
Information on basic operations also contains a general description of supports.
Logic Analyzer Software Compatibility
The label on the microprocessor support floppy disk states which version of logic analyzer software the support is compatible with.
Logic Analyzer Configuration
To use the i960 Jx support, the Tektronix logic analyzer must be equipped with either a 102/136-channel module, or a 96-channel module at a minimum. The module must be equipped with enough probes to acquire channel and clock data from signals in your i960 Jx-based system.
Refer to information on basic operations to determine how many modules and probes the logic analyzer needs to meet the channel requirements.
Requirements and Restrictions
You should review the general requirements and restrictions of microprocessor supports in the information on basic operations as they pertain to your SUT.
You should also review electrical, environmental, and mechanical specifications in the Specifications chapter in this manual as they pertain to your system under test, as well as the following descriptions of other i960 Jx support requirements and restrictions.
System Clock Rate. The TMS 163 support can acquire data from the i960 Jx microprocessor at speeds of up to 33 MHz for 960 JA/JF 960 JD; it has been tested to 33 MHz for 960 JF microprocessor.
Disabling the Instruction Cache, Data Cache, and Vector Cache. To disassemble acquired data, you must disable the internal Instruction cache, the internal Data cache. Disabling the caches makes all instruction prefetches visible on the bus so they can be acquired and disassembled.
Vector caching has to be disabled so that microprocessor fetches the interrupt vector entries from external RAM and not from internal RAM. This will reflect the vector reads to external bus.
1
and 25 MHz for
1–2
1
Specification at time of printing. Contact your Tektronix sales representative for current information on the fastest devices supported.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Configuring the Probe Adapter
If your system under test (SUT) has a +3 V i960 Jx microprocessor or you do not want the SUT to provide power to the probe adapter when the probe adapter is in an SUT with a +5 V microprocessor, you can use an alternate power source. If you use an alternate power source, you need to place the Power Source jumper on pins 1 and 2.
If your SUT has a +5 V i960 Jx microprocessor, and the probe adapter will be powered from the SUT, you need to place the Power Source jumper on pins 2 and 3.
For more information on using an alternate power source, refer to Applying and Removing Power Using an Alternate Source in this chapter.
Figure 1–1 shows the location of the Power Source jumper.
Getting Started
Figure 1–1: Power Source jumper location
Connecting to a System Under Test
Before you connect to the SUT, you must connect the probes to the module. Your SUT must also have a minimum amount of clear space surrounding the microprocessor to accommodate the probe adapter. Refer to the Specifications chapter in this manual for the required clearances.
Power Source jumper
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–3
Getting Started
The channel and clock probes shown in this chapter are for a 102/136-channel module. The probes will look different if you are using a 96-channel module.
The general requirements and restrictions of microprocessor supports in the information on basic operations shows the vertical dimensions of a channel or clock probe connected to square pins on a circuit board.
Probe Adapter with a
High-Density Probe
To connect the logic analyzer to an SUT using the PGA probe adapter and a high-density probe, follow these steps:
1. Turn off power to your SUT. It is not necessary to turn off power to the logic
analyzer.
CAUTION. Static discharge can damage the microprocessor, the low-profile probe adapter, the probes, or the module. To prevent static damage, handle all of the above only in a static-free environment.
Always wear a grounding wrist strap or similar device while handling the microprocessor and low-profile probe adapter.
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer. Then, touch the black foam on the
underside of the probe adapter to discharge stored static electricity from the
probe adapter.
3. Remove the microprocessor from the SUT.
4. Line up the pin A1 indicator on the probe adapter board with the pin A1
indicator on the microprocessor.
1–4
CAUTION. Failure to correctly place the microprocessor into the probe adapter might permanently damage the microprocessor once power is applied.
5. Place the microprocessor into the probe adapter as shown in Figure 1–2.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Microprocessor
Getting Started
Pin A1
Figure 1–2: Placing a microprocessor into the probe adapter
6. Remove the black foam from the underside of the probe adapter.
7. Line up the pin A1 indicator on the probe adapter board with the pin A1
indicator on the SUT.
8. Place the probe adapter onto the SUT as shown in Figure 1–3.
NOTE. You might need to stack one or more replacement sockets between the SUT and the probe adapter to provide sufficient vertical clearance from adjacent components. However, keep in mind this might increase loading, which can reduce the electrical performance of the probe adapter.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–5
Getting Started
Pin A1
SUT socket
Pin A1
Figure 1–3: Placing a PGA probe adapter onto the SUT
9. Connect the channel and clock probes to the high-density probe as shown in
Figure 1–4. Match the channel groups and numbers on the probe labels to the
corresponding pins on the high-density probe. Match the ground pins on the
probes to the corresponding pins on the probe adapter.
Since the data bus is multiplexed with the address bus, acquisition probes
D3:7-0, D2:7-0, D1:7-0, and D0:7-4, do not have to be connected. Even if
the probes are not connected, the Data channel group will still acquire data
through the address bus. Since data is being acquired, these probes are not
considered to be extra channels that you can use to connect to other signals in
your SUT.
1–6
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Clock probe
Getting Started
Hold the channel probes by the podlet holder when connecting them to the high-density probe. Do not hold them by the cables or necks of the podlets.
Channel probe and podlet holder
Channels connect to
the logic analyzer
High-density probe
Figure 1–4: Connecting channel and clock probes to a high-density probe
10. Align pin 1 on the LO cable connector, the end on the narrowest cable strip
of the cable, with pin 1 on the LO connector on the high-density probe. Connect the cable to the connector as shown in Figure 1–5.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–7
Getting Started
Pin 1 side
High-density probe
Figure 1–5: Connecting the cable to a high-density probe
With a PGA-to-QFP
Converter Clip
To connect the logic analyzer to a SUT using the probe adapter, a PGA-to-QFP converter clip, and ahigh-density probe, follow these steps:
1. Line up the pin A1 indicator on the probe adapter board with the pin E1
indicator on the converter clip as shown in Figure 1–6.
1–8
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Figure 1–6: Placing the converter clip onto the probe adapter
Getting Started
Pin A1
Pin A1
2. Line up the pin A1 indicator on the probe adapter board with the pin E1
indicator on the SUT.
3. Place the probe adapter onto the SUT as shown in Figure 1–7.
Pin A1
Microprocessor
Pin E1
Figure 1–7: Placing the probe adapter onto the SUT
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–9
Getting Started
4. Press down on the probe adapter to secure the clip on the microprocessor.
5. Continue with steps 9 and 10 from the previous procedure.
Without a Probe Adapter
You can use channel probes, clock probes, and leadsets with a commercial test clip (or adapter) to make connections between the logic analyzer and your SUT.
To connect the probes to i960 Jx signals in the SUT using a test clip, follow these steps:
1. Turn off power to your SUT. It is not necessary to turn off power to the logic
analyzer.
CAUTION. Static discharge can damage the microprocessor, the probes, or the module. To prevent static damage, handle all of the above only in a static-free environment.
Always wear a grounding wrist strap or similar device while handling the microprocessor.
2. To discharge your stored static electricity, touch the ground connector located
on the back of the logic analyzer. If you are using a test clip, touch any of the
ground pins on the clip to discharge stored static electricity from it.
CAUTION. Failure to place the SUT on a horizontal surface before connecting the test clip might permanently damage the pins on the microprocessor.
1–10
3. Place the SUT on a horizontal static-free surface.
4. Use Table 1–2 to connect the channel probes to i960 Jx signal pins on the test
clip or in the SUT.
Use leadsets to connect at least one ground lead from each channel probe and
the ground lead from each clock probe to ground pins on your test clip.
NOTE. Since the microprocessor multiplexes the Address and Data buses, the D3:7-0, D2:7-0, D1:7-0 and D0:7-0 channel probes do not need to be connected. Although they are not connected, they are not considered to be extra channels. Do not use them to make connections to other signals in your SUT.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Getting Started
T able 1–2: i960 Jx signal connections for channel probes
Section:channel i960 Jx signal Section:channel i960 Jx signal
A3:7 AD31 D3:7 AD31
A3:6 AD30 D3:6 AD30
A3:5 AD29 D3:5 AD29
A3:4 AD28 D3:4 AD28
A3:3 AD27 D3:3 AD27
A3:2 AD26 D3:2 AD26
A3:1 AD25 D3:1 AD25
A3:0 AD24 D3:0 AD24
A2:7 AD23 D2:7 AD23
A2:6 AD22 D2:6 AD22
A2:5 AD21 D2:5 AD21
A2:4 AD20 D2:4 AD20
A2:3 AD19 D2:3 AD19
A2:2 AD18 D2:2 AD18
A2:1 AD17 D2:1 AD17
A2:0 AD16 D2:0 AD16
A1:7 AD15 D1:7 AD15
A1:6 AD14 D1:6 AD14
A1:5 AD13 D1:5 AD13
A1:4 AD12 D1:4 AD12
A1:3 AD11 D1:3 AD11
A1:2 AD10 D1:2 AD10
A1:1 AD9 D1:1 AD9
A1:0 AD8 D1:0 AD8
A0:7 AD7 D0:7 AD7
A0:6 AD6 D0:6 AD6
A0:5 AD5 D0:5 AD5
A0:4 AD4 D0:4 AD4
A0:3 A3 D0:3 AD3
A0:2 A2 D0:2 AD2
A0:1 GND D0:1 AD1
A0:0 GND D0:0 AD0
C3:7 CLKIN C1:7 XINT7*
C3:6 BE3* C1:6 XINT3*
C3:5 BE1* C1:5 ALE
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–11
Getting Started
T able 1–2: i960 Jx signal connections for channel probes (cont.)
Section:channel i960 Jx signalSection:channeli960 Jx signal
C3:4 W/R* C1:4 BSTAT C3:3 RESET* C1:3 XINT6* C3:2 BE2* C1:2 XINT2* C3:1 BE0* C1:1 DT/R* C3:0 WIDTH1 C1:0 FAIL* C2:7 LOCK* C0:7 XINT5* C2:6 D/C* C0:6 XINT1* C2:5 BLAST* C0:5 NMI* C2:4 WIDTH0 C0:4 TDI C2:3 HOLDA C0:3 XINT4* C2:2 RDYRCV* C0:2 XINT0* C2:1 DEN* C0:1 HOLD C2:0 ADS* C0:0 TDO
Table 1–3 shows the clock probes and the i960 Jx signal to which they must connect for disassembly to be correct.
T able 1–3: i960 Jx signal connections for clock probes
Section:channel i960 Jx signal
CK:1 BLAST*= CK:0 CLKIN=
5. Align pin 1 or A1 of your test clip with the corresponding pin 1 or A1 of the
i960 Jx microprocessor in your SUT and attach the clip.
Applying and Removing Power
If your microprocessor system cannot supply power to the i960 Jx probe adapter or your system has a +3 V i960 Jx microprocessor (probe adapters need +5 V), you must use an alternate power source. A +5 V power supply is included with this support product.
1–12
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Getting Started
The alternate power supply provides +5 volts to the i960 Jx probe adapter. The center connector of the power jack connects to Vcc.
To use the power supply, you need to position the Power Source jumper on pins 1 and 2.
To apply power to the i960 Jx probe adapter and SUT, follow these steps:
CAUTION. Failure to use the +5 V power supply provided by Tektronix might permanently damage the probe adapter and i960 Jx microprocessor. Do not mistake another power supply that looks similar for the +5 V power supply.
1. Connect the +5 V power supply to the jack on the probe adapter. Figure 1–8
shows the location of the jack on the adapter board.
CAUTION. Failure to apply power to the probe adapter before applying power to your SUT might permanently damage the i960 Jx microprocessor and SUT.
2. Plug the power supply for the probe adapter into an electrical outlet.
3. Power on the SUT.
Power jack
Figure 1–8: Location of the power jack
TMS 163 i960 Jx Microprocessor Support Instruction Manual
1–13
Getting Started
To remove power from the SUT and i960 Jx probe adapter, follow these steps:
CAUTION. Failure to power down your SUT before removing the power from the probe adapter might permanently damage the i960 Jx microprocessor and SUT.
1. Power down the SUT.
2. Unplug the power supply for the probe adapter from the electrical outlet.
1–14
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Operating Basics

Setting Up the Support

This section provides information on how to set up the support. Information covers the following topics:
H Channel group definitions H Clocking options H Symbol table files
Remember that the information in this section is specific to the operations and functions of the TMS 163 i960 Jx support on any Tektronix logic analyzer for which it can be purchased. Information on basic operations describes general tasks and functions.
Before you acquire and disassemble data, you need to load the support and specify setups for clocking and triggering as described in the information on basic operations. The support provides default values for each of these setups, but you can change them as needed.
Channel Group Definitions
Clocking Options
The software automatically defines channel groups for the support. The channel groups for the i960 Jx support are Address, Data, Control, Intr, ByteEnbl, Aux, and Misc. If you want to know which signal is in which group, refer to the channel assignment tables beginning on page 3–6.
The TMS 163 support offers a microprocessor-specific clocking mode for the i960 Jx microprocessor. This clocking mode is the default selection whenever you load the 960JX support.
A description of how cycles are sampled by the module using the TMS 163 support and probe adapter is found in the Specifications chapter.
Disassembly will not be correct with the Internal or External clocking modes. Information on basic operations describes how to use these clock selections for general purpose analysis.
The clocking option for the TMS 163 application is Alternate Bus Master Cycles. Alternate Bus Master Cycles are acquired when you select Included.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
2–1
Setting Up the Support
Alternate Bus Master
Symbols
Cycles
An alternate bus master cycle is defined as the cycle in which the i960 Jx microprocessor gives up the bus to an alternate device (a DMA device or another microprocessor). These types of cycles are acquired when you select Included.
The TMS 163 support supplies one symbol table file. The 960JX_Ctrl file replaces specific Control channel group values with symbolic values when Symbolic is the radix for the channel group.
Table 2–1 shows the name, bit pattern, and meaning for the symbols in the file 960JX_Ctrl, the Control channel group symbol table.
T able 2–1: Control group symbol table definitions
Control group value
LOCK* DEN*
HOLDA BLAST*
Symbol
  
  
  
  
  
  
  
  
BURST_RD BURST_WR UNDEFINED
WIDTH1 W/R*
WIDTH0 D/C*
 
 
 
Meaning
Memory code read (Opcode Fetch) Non-Burst memory read cycle; also
indicates the last cycle in a Burst read access
Non-Burst memory write cycle; also indicates the last cycle in a Burst write access
Microprocessor halted Read cycle of the atomic memory
access Write cycle of the atomic memory
access DMA read from memory DMA write to memory Burst read from memeory Burst write to memory None of the above
2–2
The TMS 163 software also supplies several range symbol table files for the Address channel group. The range symbol files replace specific ranges of Address channel group values with symbolic values when the symbolic display is selected for the group.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Setting Up the Support
Table 2–2 shows the name, lower and upper bounds, and meaning for the symbols in the file 960JX_IBR, the Initialization Boot Record symbol table for the Address group.
T able 2–2: IBR symbol table definitions for the Address group
Address group value
Symbol Lower bound Upper bound Meaning
IBR_BCON2 FEFF FF38 FEFF FF3B
IBR_BCON3 FEFF FF3C FEFF FF3F
IBR_FSTIP FEFF FF40 FEFF FF43
IBR_PRCB FEFF FF44 FEFF FF47
IBR_CHK_W FEFF FF48 FEFF FF5F
PMCON14_15, byte 2 PMCON14_15, byte 3 First instruction point PRCB pointer Bus confidence self test check words
Table 2–3 shows the name, lower and upper bounds, and meaning for the symbols in the file 960JX_PCRB, the Process Control Block symbol table for the Address group.
T able 2–3: PRCB symbol table definitions for the Address group
Address group value
Symbol Lower bound Upper bound Meaning
PRCB_FTB 0 3
PRCB_CTB 4 7
PRCB_ACR 8 B
PRCB_FCW C F
PRCB_ITB 10 13
PRCB_SPB 14 17
PRCB_ISP 1C 1F
PRCB_ICC 20 23
PRCB_RCC 24 27
Fault table base address Control table base address AC register initial image Fault configuration word Interrupt table base address System procedure table base address Interrupt stack pointer Instruction cache configuration word Register cache configuration word
TMS 163 i960 Jx Microprocessor Support Instruction Manual
2–3
Setting Up the Support
Table 2–4 shows the name, lower and upper bounds, and meaning for the symbols in the file 960JX_CTBL, the Control Table symbol table for the Address group.
T able 2–4: Control Table symbol table definitions for the Address group
Address group value
Symbol Lower bound Upper bound Meaning
IMAP0 10 13
IMAP1 14 17
IMAP2 18 1B
ICON 1C 1F
PMCON01 20 23
PMCON23 28 2B
PMCON45 30 33
PMCON67 38 3B
PMCON88 40 43
PMCON1011 48 4B
PMCON1213 50 53
PMCON1415 58 5B
TC 68 6B
BCON 6C 6F
Interrupt Map 0 Interrupt Map 1 Interrupt Map 2 Interrupt Configuration Physical memory region 0:1 Configuration Physical memory region 2:3 Configuration Physical memory region 4:5 Configuration Physical memory region 6:7 Configuration Physical memory region 8:9 Configuration Physical memory region 10:11 Configuration Physical memory region 12:13 Configuration Physical memory region 14:15 Configuration Trace Controls Bus configuration word
Table 2–5 shows the name, lower and upper bounds, and meaning for the symbols in the file 960JX_INT, the Interrupt Table symbol table for the Address group.
2–4
T able 2–5: INT symbol table definitions for the Address group
Address group value
Symbol Lower bound Upper bound Meaning
PEND_PRI 0 3
PEND_INT 4 23
INT_VECT 24 403
Pending priority Pending interrupts Vector entry
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Setting Up the Support
Table 2–6 shows the name, lower and upper bounds, and meaning for the symbols in the file 960JX_FAULT, the Fault Table symbol table for the Address group.
T able 2–6: FAULT symbol table definitions for the Address group
Address group value
Symbol Lower bound Upper bound Meaning


  
  
  
  
  
Overide/Parallel Fault Trace Fault Operation Fault Arithmetic Fault Constraint Fault Protection Fault Type Fault
Information on basic operations describes how to use symbolic values for triggering and for displaying other channel groups symbolically, such as the Address channel group.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
2–5
Setting Up the Support
2–6
TMS 163 i960 Jx Microprocessor Support Instruction Manual

Acquiring and Viewing Disassembled Data

This section describes how to acquire data and view it disassembled. Information covers the following topics and tasks:
H Acquiring data H Viewing disassembled data in various display formats H Cycle type labels H Changing the way data is displayed H Changing disassembled cycles with the mark cycles function
Acquiring Data
Once you load the 960JX support, choose a clocking mode, and specify the trigger, you are ready to acquire and disassemble
If you have any problems acquiring data, refer to information on basic operations in your online help or Appendix A: Error Messages and Disassembly Problems in the basic operations user manual.
data.
Viewing Disassembled Data
You can view disassembled data in four display formats: Hardware, Software, Control Flow, and Subroutine. The information on basic operations describes how to select the disassembly display formats.
NOTE. Selections in the Disassembly property page (the Disassembly Format Definition overlay) must be set correctly for your acquired data to be disas­sembled correctly. Refer to Changing How Data is Displayed on page 2–10.
The default display format shows the Address, Data, and Control channel group values for each sample of acquired data.
The disassembler displays special characters and strings in the instruction mnemonics to indicate significant events. Table 2–7 shows these special characters and strings, and gives a definition of what they represent.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
2–7
Acquiring and Viewing Disassembled Data
T able 2–7: Meaning of special characters in the display
Character or string displayed Meaning
>> or m The instruction was manually marked as a program fetch **** Indicates there is insufficient data available for complete
disassembly of the instruction; the number of asterisks indicates the width of the data that is unavailable. Each two asterisks represent one byte.
Hardware Display Format
In Hardware display format, the disassembler displays certain cycle type labels in parentheses. Table 2–8 shows these cycle type labels and gives a definition of the cycle they represent. Reads to interrupt and exception vectors will be labeled with the vector name.
T able 2–8: Cycle type definitions
Cycle type Definition
( READ ) Basic read from memory ( WRITE ) Basic write to memory ( BURST_READ ) Burst read from memory ( BURST_WRITE ) Burst write to memory ( LOCKED_READ ) Read cycle of an atomic memory access ( LOCKED_WRITE ) Write cycle of an atomic memory access ( DMA_READ ) DMA read from memory ( DMA_WRITE ) DMA write to memory ( HALT ) Processor halt ( STEST FAIL ) Processor has failed in self test ( RESET LOCATION ) Processor reset and started fetching at address FEFF FF38
2–8
( FLUSH )* Instruction fetch not executed by the processor ( EXTENSION )[ ( PREFETCH BYTE )[ ( PREFETCH HALF-
WORD )[ * ILLEGAL INSTRUC-
TION *[ ( UNKNOWN ) Unrecognized cycle type
* Computed cycle types.
The second word of an extended opcode fetched from memory 8-bit instruction fetch 16-bit instruction fetch
Not a valid instruction
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Acquiring and Viewing Disassembled Data
Figure 2–1 shows an example of the Hardware display.
1 2 3 4 5 6
Sample Address Data Mnemonics Control Tim>
-------------------------------------------------------------------------------­T 255 A0008044--3201A020--CMPOBE-00,-R6,-A0008064------------FETCH-------60>
256 A0008048 8C801400 ( FLUSH ) FETCH 70> 257 A000804C 00000000 ( FLUSH ) FETCH 60> 258 A0011368 00000000 ( WRITE ) WRITE 19> 259 A001136C 00000000 ( WRITE ) WRITE 18> 260 A000E4B0 00000000 ( READ ) READ 19> 261 A0008060 86019000 ( FLUSH ) FETCH 38> 262 A0008064 8C803000 LDA 3B001000, G0 FETCH 60> 263 A0008068 3B001000 ( EXTENSION ) FETCH 60> 264 A000806C 09003610 CALL A000B67C FETCH 60> 265 A000B678 0A000000 ( FLUSH ) FETCH 44> 266 A000B67C 59881901 SUBO 01, 00, G1 FETCH 60> 267 A000B680 64A40291 MODAC G1, G0, G4 FETCH 38> 268 A000B684 90883000 LD 00000100, G1 FETCH 60> 269 A000B688 00000100 ( EXTENSION ) FETCH 70> 270 A000B68C 8C903000 LDA FF1F0000, G2 FETCH 60> 271 A000B690 FF1F0000 ( EXTENSION ) FETCH 43> 272 A000B694 65A44012 MODIFY G2, G1, G4 FETCH 70> 273 A000B698 588C0092 AND G2, G0, G1 FETCH 60> 274 A000B69C 92883000 ST G1, 00000100 FETCH 60> 275 A000B6A0 00000100 ( EXTENSION ) FETCH 34> 276 A000B6A4 5C801614 MOV G4, G0 FETCH 70>
Software Display Format
Figure 2–1: Hardware display format
1
Sample Column. Lists the memory locations for the acquired data.
2
Address Group. Lists data from channels connected to the i960 Jx address bus.
3
Data Group. Lists data from channels connected to the i960 Jx data bus.
4
Mnemonics Column. Lists the disassembled instructions and cycle types.
5
Control Group. Lists data from channels connected to i960 Jx microprocessor control signals (shown symbolically).
6
Timestamp. Lists the timestamp values when a timestamp selection is made. Information on basic operations describes how you can select a timestamp.
The Software display format shows only the first fetch of executed instructions. Read extensions will be used to disassemble the instruction, but will not be displayed as a separate cycle in the Software display format. Data reads and writes are not displayed.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
2–9
Acquiring and Viewing Disassembled Data
Control Flow Display
Format
The Control Flow display format shows only the first fetch of instructions that change the flow of control.
Instructions that generate a change in the flow of control in the i960 Jx microprocessor are as follows:
B BX CALLX
BAL CALL FMARK
BALX CALLS RET
Instructions that might generate a change in the flow of control in the i960 Jx microprocessor are as follows:
BBC BO CMPOBE FAULTL
BBS CMPIBE CMPOBG FAULTLE
BE CMPIBG CMPOBGE FAULTNE
BG CMPIBGE CMPOBL FAULTNO
BGE CMPIBL CMPOBLE FAULTO
BL CMPIBLE CMPOBNE MARK
BLE CMPIBNE FAULTE
BNE CMPIBNO FAULTG
BNO CMPIBO FAULTGE
Subroutine Display
Format
The Subroutine display format shows only the first fetch of subroutine call and return instructions. It will display conditional subroutine calls if they are considered to be taken.
Instructions that generate a subroutine call or a return in the i960 Jx micropro­cessor are as follows:
CALL CALLS CALLX RET
Changing How Data is Displayed
There are common fields and features that allow you to further modify displayed data to suit your needs. You can make common and optional display selections in the Disassembly property page (the Disassembly Format Definition overlay).
You can make selections unique to the i960 Jx support to do the following tasks:
H Change how data is displayed across all display formats H Change the interpretation of disassembled cycles H Display exception vectors
2–10
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Acquiring and Viewing Disassembled Data
Optional Display
Selections
You can make optional selections for disassembled common selections (described in the information on basic operations), you can change the displayed data in the following ways:
H Specify the starting address of the exception vector table. H Specify the starting address of the fault vector table.
The i960 Jx microprocessor support product has two additional fields: Interrupt Table Base, and Fault Table Base. These fields appear in the area indicated in the basic operations user manual.
NOTE. Do not enter an address that resides in the internal RAM in these fields. Do not enter the same value in both fields. If you enter an address value that resides in the internal RAM, is outside the range, or is the same in both fields, the default value is used. With the default value, interrupts and faults will not be identified.
Interrupt Table Base. You can specify the starting address of the interrupt table in hexadecimal. The address range is 00000400-FEFFFFFF and the default starting address is 0x00000500.
data. In addition to the
Fault Table Base. You can specify the starting address of the fault table in hexadecimal. The address range is 00000400-FEFFFFFF and the default starting address is 0x00000600.
NOTE. The default values are arbitrary, but should be greater than 3FF.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
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Acquiring and Viewing Disassembled Data
Marking Cycles
The disassembler has a Mark Opcode function that allows you to change the interpretation of a cycle type. Using this function, you can select a cycle and change it to one of the following cycle types:
H Opcode (the first word of an instruction) H Extension (a subsequent word of an instruction) H Flush (an opcode or extension that is fetched but not executed)
You can mark word aligned address sequences, but not the second, third, or fourth bytes in an 8-bit memory region, or the second byte in a 16-bit region. If you mark the word aligned sequence in an 8- or 16-bit region, the same mark is applied to the next three or one bytes, respectively.
When an instruction is missed, two or four words of instructions are fetched and only valid bits corresponding to the fetched words are set in the buffer. No external instruction fetches are generated until there is a “miss” within the buffer, even in the presence of forward and backward branches.
If the target of the branch is not double word aligned, the word previous to the target will also be fetched but not executed. You can use the Mark Cycles function to correct disassembled data.
Mark selections are as follows:
Displaying Exception
Vectors
Opcode
Extension
Flush
Undo mark
Information on basic operations contains more details on marking cycles.
The disassembler can display exception vectors (interrupts and faults). The interrupt and fault tables must reside in external memory for the accesses to be visible on the bus and to the disassembler.
You can relocate the interrupt table by entering the starting address in the Interrupt Table Base field. The Interrupt Table Base field provides the disassem­bler with the base address; enter an eight-digit hexadecimal value corresponding to the base of the base address of the interrupt table.
You can relocate the fault table by entering the starting address in the Fault Table Base field. The Fault Table Base field provides the disassembler with the base address; enter an eight-digit hexadecimal value corresponding to the base address of the fault table.
You can make these selections in the Disassembly property page (the Disassem­bly Format Definition overlay).
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TMS 163 i960 Jx Microprocessor Support Instruction Manual
Acquiring and Viewing Disassembled Data
Table 2–9 lists i960 Jx exception vectors.
T able 2–9: Exception vectors
Exception
number
8 024 ( INT 8 VECTOR )
9 028 ( INT 9 VECTOR )
10 02C ( INT 10 VECTOR )
... ... ...
243 3D0 ( INT 243 VECTOR )
244-247 3D4-3E0 ( RESERVED )
248 3E4 ( NMI PROCEDURE )
249-251 3E8-3F0 ( RESERVED )
252 3F4 ( INT 252 VECTOR )
253 3F8 ( INT 253 VECTOR )
254 3FC ( INT 254 VECTOR )
255 400 ( INT 255 VECTOR )
* IV means interrupt vector.
Location in IV* table (in hexadecimal)
Displayed exception name
Table 2–10 lists i960 Jx fault vectors.
T able 2–10: Fault vectors
Fault
number
0 00 ( OVERRIDE/P’LL FAULT )
1 08 ( TRACE FAULT )
2 10 ( OPERATION FAUL T )
3 18 ( ARITHMETIC FAULT )
4 20 ( RESER VED )
5 28 ( CONSTRAINT FAULT )
6 30 ( RESER VED )
7 38 ( PROTECTION FAULT )
8-9 40 ( RESERVED )
Ah 50 ( TYPE FAULT )
Bh-Fh 58 ( RESERVED )
Location in Fault table (in hexadecimal)
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Displayed fault name
2–13
Acquiring and Viewing Disassembled Data
Viewing an Example of Disassembled Data
A demonstration system file (or demonstration reference memory) is provided so you can see an example of how your i960 Jx microprocessor bus cycles and instruction mnemonics look when they are disassembled. Viewing the system file is not a requirement for preparing the module for use and you can view it without connecting the logic analyzer to your SUT.
Information on basic operations describes how to view the file.
2–14
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications

Specifications

This chapter contains the following information:
H Probe adapter description H Specification tables H Dimensions of the probe adapter H Channel assignment tables H Description of how the module acquires i960 Jx signals H List of other accessible microprocessor signals and extra probe channels
Probe Adapter Description
The probe adapter is nonintrusive hardware that allows the logic analyzer to acquire data from a microprocessor in its own operating environment with little effect, if any, on that system. Information on basic operations contains a figure showing the logic analyzer connected to a typical probe adapter. Refer to that figure while reading the following description.
Configuration
The probe adapter consists of a circuit board and a socket for a i960 Jx microprocessor. The probe adapter connects to the microprocessor in the SUT. Signals from the microprocessor-based system flow from the probe adapter to the channel groups and through the probe signal leads to the module.
Circuitry on the probe adapter can be powered from either the SUT or an external power source. Refer to Applying and Removing Power in the Getting Started chapter on page 1–12 for information on using an external power source.
The probe adapter accommodates the Intel i960 Jx microprocessor in a 132-pin PGA package. The probe adapter with the optional PGA-to-QFP converter clip accommodates the Intel i960 Jx microprocessor in a 132-pin PQFP package.
There is one jumper on the probe adapter. The Power Source jumper is set to power the probe adapter from the system under test (SUT) or from an alternate power supply.
To power the probe adapter from an alternate power supply, place the jumper on pins 1 and 2. To power the probe adapter from the SUT, place the jumper on pins 2 and 3.
Figure 3–1 shows the Power Source jumper location on the probe adapter.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–1
Specifications
J301
Figure 3–1: Jumper location on the probe adapter
Specifications
These specifications are for a probe adapter connected between a compatible Tektronix logic analyzer and a SUT. Table 3–1 shows the electrical requirements the SUT must produce for the support to acquire correct data.
In Table 3–1, for the 102/136-channel module, one podlet load is 20 k in parallel with 2 pF. For the 96-channel module, one podlet load is 100 k in parallel with 10 pF.
T able 3–1: Electrical specifications
Characteristics Requirements
Adapter DC power requirements
Voltage 4.75 – 5.25 VDC Current I max (calculated) 110 mA
Probe adapter power supply requirements
Voltage 90-265 VAC Current 1.1 A maximum at 100 VAC Frequency 47 – 63 Hz Power 25 W maximum
SUT clock
Clock rate
i960 JA/JF Max. 33 MHz*
3–2
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications
T able 3–1: Electrical specifications (cont.)
Characteristics Requirements
i960 JD Max. 25 MHz*
Minimum setup time required
All signals 5 ns
Minimum hold time required
All signals 0 ns
Specification
Measured typical SUT signal loading AC load DC load
AD31-A4, A3-A2, D3-D0, BE3-BE0, LOCK*, D/C*, W/R*, WIDTH1-WIDTH0, HOLDA, RDYRCV*, DEN*, ADS*, XINT7*-XINT0*, NMI*, DT/R*, FAIL*, HOLD, RESET*, ALE, BSTAT, TDI, TDO
CLKIN, BLAST* 3.5 PF 2 74FCT16244s
* Tested to 33 MHz.
3.5 pF 74FCT16244
Table 3–2 shows the environmental specifications.
T able 3–2: Environmental specifications*
Characteristic Description
Temperature
Maximum operating Minimum operating 0° C (+32° F)
Non-operating –55° C to +75° C (–67° to +167° F) Humidity 10 to 95% relative humidity Altitude
Operating 4.5 km (15,000 ft) maximum
Non-operating 15 km (50,000 ft) maximum Electrostatic immunity The probe adapter is static sensitive
* Designed to meet Tektronix standard 062-2847-00 class 5.
[
Not to exceed i960 Jx microprocessor thermal considerations. Forced air cooling might be required across the CPU.
+50° C (+122° F)[
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–3
Specifications
Table 3–3 shows the certifications and compliances that apply to the probe adapter.
T able 3–3: Certifications and compliances
EC Compliance There are no current European Directives that apply to this
product.
3–4
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications
Figure 3–2 shows the dimensions of the probe adapter. The figure also shows the minimum vertical clearance of the high-density probe cable.
6 mm (.22 in)
80 mm
(3.15 in)
91 mm
(3.60 in)
Pin 1
93 mm
(3.65 in)
25.4 mm (1.00 in)
7 mm (.26 in)
Figure 3–2: Dimensions of the probe adapter
29 mm
(1.15 in)
15 mm (.60 in)
38 mm
(1.50 in)
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–5
Specifications
Figure 3–3 shows the dimensions of the PGA-to-QFP converter clip connected to the probe adapter. Figure 3–2 shows the dimensions of the probe adapter.
25.4 mm (1.00 in)
7 mm (.26 in)
55 mm
48 mm
(1.90 in)
(2.15 in)
Channel Assignments
Figure 3–3: Dimensions of the PGA-to-QFP converter clip
Channel assignments shown in Table 3–4 through Table 3–11 use the following conventions:
H All signals are required by the support unless indicated otherwise. H Channels are shown starting with the most significant bit (MSB) descending
to the least significant bit (LSB).
H Channel group assignments are for all modules unless otherwise noted. H An asterisk (*) a tilde (~) a pound sign (#) following a signal name indicates
an active low signal. H An equals sign (=) following a signal name indicates that it is double probed. Table 3–4 shows the probe section and channel assignments for the Address
group and the microprocessor signal to which each channel connects. By default, this channel group is displayed in hexadecimal.
3–6
TMS 163 i960 Jx Microprocessor Support Instruction Manual
T able 3–4: Address group channel assignments
Bit
order
31 A3:7 AD31
30 A3:6 AD30
29 A3:5 AD29
28 A3:4 AD28
27 A3:3 AD27
26 A3:2 AD26
25 A3:1 AD25
24 A3:0 AD24
23 A2:7 AD23
22 A2:6 AD22
21 A2:5 AD21
20 A2:4 AD20
19 A2:3 AD19
18 A2:2 AD18
17 A2:1 AD17
16 A2:0 AD16
15 A1:7 AD15
14 A1:6 AD14
13 A1:5 AD13
12 A1:4 AD12
11 A1:3 AD11
10 A1:2 AD10
9 A1:1 AD9
8 A1:0 AD8
7 A0:7 AD7
6 A0:6 AD6
5 A0:5 AD5
4 A0:4 AD4
3 A0:3 A3
2 A0:2 A2
1 A0:1
0 A0:0
[
Section:channel i960 Jx signal name
[
A1
[
A0
Connected to ground.
Specifications
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–7
Specifications
Table 3–5 shows the probe section and channel assignments for the Data group and the microprocessor signal to which each channel connects. By default, this channel group is displayed in hexadecimal.
NOTE. Since the microprocessor multiplexes address A31-A4 and data D31-D4 (as the AD31-AD4 signals), the D3:7-0, D2:7-0, D1:7-0 and D0:7-4 channel probes do not need to be connected.
These channels are not considered to be extra channels, even though they are not connected. Do not use them to make connections to other signals in your SUT.
T able 3–5: Data group channel assignments
Bit order
31 D3:7 AD31 30 D3:6 AD30 29 D3:5 AD29 28 D3:4 AD28 27 D3:3 AD27 26 D3:2 AD26 25 D3:1 AD25 24 D3:0 AD24 23 D2:7 AD23 22 D2:6 AD22 21 D2:5 AD21 20 D2:4 AD20 19 D2:3 AD19 18 D2:2 AD18 17 D2:1 AD17 16 D2:0 AD16 15 D1:7 AD15 14 D1:6 AD14 13 D1:5 AD13 12 D1:4 AD12 11 D1:3 AD11 10 D1:2 AD10 9 D1:1 AD9 8 D1:0 AD8 7 D0:7 AD7 6 D0:6 AD6
Section:channel i960 Jx signal name
3–8
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications
T able 3–5: Data group channel assignments (cont.)
Bit
order
5 D0:5 AD5
4 D0:4 AD4
3
2
1
0
[
These channels must be connected.
D0:3 D0:2 D0:1 D0:0
[
[
[
[
i960 Jx signal nameSection:channel
AD3 AD2 AD1 AD0
Table 3–6 shows the probe section and channel assignments for the Control group and the microprocessor signal to which each channel connects. By default, this channel group is displayed symbolically.
T able 3–6: TMS 163 Control group channel assignments
Bit
order
7 C2:7 LOCK*
6 C2:3 HOLDA
5 C3:0 WIDTH1
4 C2:4 WIDTH0
3 C2:1 DEN*
2 C2:5 BLAST*
1 C3:4 W/R*
0 C2:6 D/C*
Section:channel i960 Jx signal name
Table 3–7 shows the acquisition probe section and channel assignments for the ByteEnbl group, and the microprocessor signal to which each channel connects. By default, this channel group is not visible.
T able 3–7: TMS 163 ByteEnbl group channel assignments
Bit
order
3 C3:6 BE3*
2 C3:2 BE2*
1 C3:5 BE1*
0 C3:1 BE0*
Section:channel i960 Jx signal name
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–9
Specifications
Table 3–8 shows the acquisition probe section and channel assignments for the Aux group, and the microprocessor signal to which each channel connects. By default, this channel group is not visible.
T able 3–8: TMS 163 Aux group channel assignments
Bit order
Section:channel i960 Jx signal name
1 C2:2 RDYRCV* 0 C2:0 ADS*
Table 3–9 shows the acquisition probe section and channel assignments for the Intr group, and the microprocessor signal to which each channel connects. By default, this channel group is not visible.
T able 3–9: TMS 163 Intr group channel assignments
Bit order
8 C0:5 7 C1:7 6 C1:3 5 C0:7 4 C0:3 3 C1:6 2 C1:2 1 C0:6 0 C0:2
}
Section: channel i960 Jx signal name
}
NMI*
}
XINT7*
}
XINT6*
}
XINT5*
}
XINT4*
}
XINT3*
}
XINT2*
}
XINT1*
}
XINT0*
Signal not required for disassembly.
Table 3–10 shows the acquisition probe section and channel assignments for the Misc group, and the microprocessor signal to which each channel connects. By default, this channel group is not visible.
T able 3–10: TMS 163 Misc group channel assignments
Bit order
8 C1:5 7 C0:1 6 C1:1
Section: channel i960 Jx signal name
}
ALE
}
HOLD
}
DT/R*
3–10
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications
T able 3–10: TMS 163 Misc group channel assignments (cont.)
Bit
order
5 C1:0
4 C3:3
3 C3:7
2 C1:4
1 C0:4
0 C0:0
}
Signal not required for disassembly.
i960 Jx signal nameSection: channel
}
FAIL* RESET* CLKIN BST AT
}
TDI
}
TDO
}
}
}
Table 3–11 shows the probe section and channel assignments for the clock probes (not part of any group) and the i960 Jx signal to which each channel connects.
T able 3–11: Clock channel assignments
How Data is Acquired
Custom Clocking
Section:channel i960 Jx signal name
CK:1 BLAST*=
CK:0 CLKIN=
These channels are used only to clock in data; they are not acquired or displayed. To acquire data from any of the signals shown in Table 3–11, you must connect another channel probe to the signal, a technique called double probing. An equals sign (=) following a signal name indicates that it is already double probed.
This part of this chapter explains how the module acquires i960 Jx signals using the TMS 163 software and probe adapter. This part also provides additional information on microprocessor signals accessible on or not accessible on the probe adapter, and on extra probe channels available for you to use for additional connections.
A special clocking program is loaded to the module every time you load the 960JX support. This special clocking is called Custom.
With Custom clocking, the module logs in signals from multiple groups of channels at different times as they become valid on the i960 Jx bus. The module then sends all the logged-in signals to the trigger machine and to the memory of the module for storage.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–11
Specifications
CLKIN
In Custom clocking, the module clocking state machine (CSM) generates one master sample for each microprocessor bus cycle, no matter how many clock cycles are contained in the bus cycle.
Figure 3–4 shows the sample points and the master sample points. The CSM has two states: Address_Ta and Data_Td. The CSM uses these two
states to handle the address (Ta), wait/data (Tw/Td), recovery (Tr), and hold (Th) states of the i960 Jx microprocessor.
Sampling occurs on the rising edge of the CLKIN signal.
Burst read cycle Burst write cycle
Ta Td Td Tr Ta Td Td Td Td Tr
AD31:0
ADS*
A3:2
BLAST*
DEN*
RDYRCV*
HOLDA
Sample point 1
Master sample points
Master sample points
Sample point 1
Figure 3–4: i960 Jx bus timing
3–12
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications
The CSM enters the Data_Td state from the Address_Ta state only if the ADS* signal is asserted, and the HOLDA signal is not asserted when DMA cycles are excluded or asserted when DMA cycles are included.
In the Address_Ta state, the ADDR31-ADDR4, W/R*, ADS*, ALE, CLKIN, RESET*, LOCK*, HOLDA, WIDTH1, WIDTH0, NMI*, XINT7*-XINT0*, HOLD, and FAIL* signals are sampled on the assertion of the ADS* signal.
In the Data_Td state, the D31-D0, A3-A0, BE3*-BE0*, D/C*, BLAST*, DEN*, and RDYRCV* signals are sampled when the DEN* and RDYRCV* signals are asserted. If it is the last data transfer of the burst and nonburst accesses, the BLAST* signal is asserted which takes the CSM to the address state. If BLAST* is not asserted, the CSM waits in the data state, which indicates the burst access. In these three cases, the HOLDA signal is not asserted.
If the RDYRCV* signal is not asserted, the CSM waits in the data state without strobing any of the address, data, or control signals. This means that the i960 Jx microprocessor is in the wait state (Tw). When DMA cycles are included and the HOLDA and DEN* signals are asserted, it is a DMA access. The CSM goes to the Address_Ta state, data and control signals are sampled, and the master sample is logged. If DEN*, BLAST*, and ADS* signals are not asserted, the CSM comes back to the Address_Ta state without logging a master sample.
Clocking Options
The microprocessor always has a recovery state (Tr) state following the Tw/Td state. This allows the system components adequate time to remove their outputs from the bus before the microprocessor drives the next address on the multi­plexed address/data signals. But the CSM goes to the Address_Ta state after the last transfer of the bus access. It remains in the same state until the bus recovers, and the BLAST* signal and others are inactive. When the recovery state completes, if no new accesses are required, the bus enters the Ti (idle state). The CSM waits in the Address_Ta state without logging in any samples.
The clocking algorithm for the i960 Jx microprocessor support has two varia­tions: Alternate Bus Master Cycles Excluded, and Alternate Bus Master Cycles Included.
Alternate Bus Master Cycles Excluded. Whenever the HOLDA signal is high, no bus cycles are logged in. Only bus cycles initiated by the i960 Jx microprocessor (HOLDA low) will be logged in.
Alternate Bus Master Cycles Included. All bus cycles, including Alternate Bus Master cycles and Backoff cycles, are logged in.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–13
Specifications
When the HOLDA signal is high, the i960 Jx microprocessor has given up the bus to an alternate device. The design of the i960 Jx system affects what data will be logged in. The module samples the data at the pins of the i960 Jx microprocessor. To properly log in bus activity, any buffers between the i960 Jx microprocessor and the alternate bus master must be enabled and pointing at the i960 Jx microprocessor.
There are three possible i960 Jx system designs and clocking interactions when an alternate bus master has control of the bus. The three different possibilities are listed below (in each case, the HOLDA signal is logged in as a high level).
H If the alternate bus master drives the same control lines as the i960 Jx
microprocessor, and the i960 Jx microprocessor sees these signals, the bus
activity is logged in like normal bus cycles except that the HOLDA signal is
high. H If none of the control lines are driven or if the i960 Jx microprocessor can
not see them, the module will still clock in an alternate bus master cycle. The
information on the bus, one clock prior to the HOLDA signal going low, is
logged in. If the ADS# signal goes low on the same clock when the HOLDA
signal goes low, the address that gets logged in will be the next address, not
the address that occurred one clock before the HOLDA signal went low. H If some of the i960 Jx microprocessor control lines are visible (but not all),
the module logs in what it determines is valid from the control signals and
logs in the remaining bus signals one clock cycle prior to the HOLDA signal
going low. If the ADS# signal goes low on the same clock that the HOLDA
signal goes low, the next address will be logged in instead of the previously
saved address.
Alternate Microprocessor Connections
You can connect to microprocessor signals that are not required by the support so that you can do more advanced timing analysis. These signals might or might not be accessible on the probe adapter board. The following paragraphs and tables list signals that are or are not accessible on the probe adapter board.
For a list of signals required or not required for disassembly, refer to the channel assignment tables beginning on page 3–6. Remember that these channels are already included in a channel group. If you do connect these channels to other signals, you should set up another channel group for them.
Signals On the Probe
Adapter
The LAHDP2 probe contains pins for the C0 and C1 channel probes, you can connect the probes from the 92A96 module to pins on the LAHDP2 probe, because the i960 Jx signals can be useful for general purpose analysis. Since the signals are not required for disassembly, you do not have to connect the probes.
3–14
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Specifications
Table 3–12 shows the microprocessor signals available if you connect the C0 and C1 probes of the 92A96 module to the LAHDP2 probe. The signals are already assigned to either the Intr or Misc channel groups.
T able 3–12: i960 Jx signals available on C0 and C1 (92A96 only)
C0 channel* Signal name C1 channel* Signal name
7 XINT5* 7 XINT7*
6 XINT1* 6 XINT3*
5 NMI* 5 ALE
4 TDI 4 BSTA T
3 XINT4* 3 XINT6*
2 XINT0* 2 XINT2*
1 HOLD 1 DT/R*
0 TDO 0 FAIL*
* Sections not available with the 32GPX module.
Signals Not On the Probe
Adapter
Extra Channels
The probe adapter does not provide access for the following microprocessor signals:
H STEST H TCK H TRST* H TMS
Table 3–13 lists extra sections and channels that are left after you have connected all the probes used by the support. You can use these extra channels to make alternate SUT connections.
T able 3–13: Extra module sections and channels
Module Section: channels
102-channels Qual:1, Qual:0
136-channels C1:7-0, C0:7-0, D3:7-0, D2:7-0, E3:7-0, E2:7-0, E1:7-0, E0:7-0, Qual:3-0
96-channels None
These channels are not defined in any channel group and data acquired from them is not displayed. To display data, you will need to define a channel group.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
3–15
Specifications
3–16
TMS 163 i960 Jx Microprocessor Support Instruction Manual
WARNING
The following servicing instructions are for use only by qualified personnel. To avoid injury, do not perform any servicing other than that stated in the operating instructions unless you are qualified to do so. Refer to all Safety Summaries before performing any service.
Maintenance

Maintenance

This chapter contains information on the following topics:
H Probe adapter circuit description H How to replace a fuse
Probe Adapter Circuit Description
The i960 Jx probe adapter does not contain any active circuitry.
Replacing the Fuse
If the fuse on the i960 Jx probe adapter opens (burns out), you can replace it with a 5 A, 125 V fuse. Figure 4–1 shows the location of the fuse on the probe adapter.
Figure 4–1: Location of the fuse
Fuse
TMS 163 i960 Jx Microprocessor Support Instruction Manual
4–1
Maintenance
4–2
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Replaceable Electrical Parts

Replaceable Electrical Parts

This chapter contains a list of the replaceable electrical components for the TMS 163 i960 Jx microprocessor support. Use this list to identify and order replacement parts.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or representative.
Changes to Tektronix products are sometimes made to accommodate improved components as they become available and to give you the benefit of the latest improvements. Therefore, when ordering parts, it is important to include the following information in your order:
H Part number H Instrument type or model number H Instrument serial number H Instrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your local Tektronix field office or representative will contact you concerning any change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Electrical Parts List
The tabular information in the Replaceable Electrical Parts List is arranged for quick retrieval. Understanding the structure and features of the list will help you find all of the information you need for ordering replacement parts. The following table describes each column of the electrical parts list.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
5–1
Replaceable Electrical Parts
Parts list column descriptions
Column Column name Description
1 Component number The component number appears on diagrams and circuit board illustrations, located in the diagrams
section. Assembly numbers are clearly marked on each diagram and circuit board illustration in the Diagrams section, and on the mechanical exploded views in the Replaceable Mechanical Parts list section. The component number is obtained by adding the assembly number prefix to the circuit number (see Component Number illustration following this table).
The electrical parts list is arranged by assemblies in numerical sequence (A1, with its subassemblies and parts, precedes A2, with its subassemblies and parts).
Chassis-mounted parts have no assembly number prefix, and they are located at the end of the
electrical parts list. 2 Tektronix part number Use this part number when ordering replacement parts from Tektronix. 3 and 4 Serial number Column three indicates the serial number at which the part was first effective. Column four indicates
the serial number at which the part was discontinued. No entry indicates the part is good for all serial
numbers. 5 Name & description An item name is separated from the description by a colon (:). Because of space limitations, an item
name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1 for
further item name identification. 6 Mfr. code This indicates the code number of the actual manufacturer of the part. 7 Mfr. part number This indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Component Number
List of Assemblies
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Component number
A23A2R1234 A23 R1234
Assembly number Circuit number
Read: Resistor 1234 (of Subassembly 2) of Assembly 23
A2
Subassembly number
(optional)
A list of assemblies is located at the beginning of the electrical parts list. The assemblies are listed in numerical order. When a part’s complete component number is known, this list will identify the assembly in which the part is located.
Chassis-mounted parts and cable assemblies are located at the end of the Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of manufacturers or vendors of components listed in the parts list.
5–2
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Replaceable Electrical Parts
Manufacturers cross index
Mfr. code
00779 AMP INC. CUSTOMER SERVICE DEPT
0LXM2 LZR ELECTRONICS INC 8051 CESSNA AVENUE GAITHERSBURG, MD 20879 26742 METHODE ELECTRONICS INC BACKPLAIN DIVISION
61857 SAN–O INDUSTRIAL CORP 91–3 COLIN DRIVE HOLBROOK, NY 11741 63058 MCKENZIE TECHNOLOGY 910 PAGE AVE FREMONT, CA 945387340 80009 TEKTRONIX INC 14150 SW KARL BRAUN DR
Manufacturer Address City , state, zip code
HARRISBURG, PA 17105–3608
PO BOX 3608
CHICAGO, IL 60656–4548
7444 WEST WILSON AVE
BEAVERT ON, OR 97077–0001
PO BOX 500
Replaceable electrical parts list
Component number
A01 010–0597–00 PROBE ADAPTER:80960JX,PGA–132,SOCKETED,TMS 163 80009 010–0597–00 A01 136–0940–00 SOCKET,PGA::PCB,132 POS,14 X 14,0.1 CTR,0.170 H X 0.170
A01 174–3418–00 CA ASSY,RF:TLC,MICRO–STRIP,TLC,50 OHM,FEP,PROP DELAY
A01 671–3800–00 CIRCUIT BR ASSY:80960JX,PGA–132, SOCKETED,389–2212–00
A01F401 159–0059–00 FUSE,WIRE LEAD:5A,125V 61857 SPI–5A A01J301 131–4530–00 CONN,HDR:PCB,MALE,STR,1 X 3,0.1 CTR,0.230 MLG X 0.120
A01J401 131–5527–00 JACK,POWER DC:PCB,MALE,R TANG,2MM PIN,1 1MM H(0.433) X
A01J501 131–5947–00 CONN,BOX:PCB,MICRO–STRIP,FEMALE,STR,100 POS,0.05
A01P301 131–4356–00 CONN,SHUNT:SHUNT/SHORTING,FEMALE,1 X 2,0.1 CTR,0.63
Tektronix part number
Serial no. effective
Serial no. discont’d
Name & description
TAIL,OPEN CTR,SYMMETRICAL,P AT 1415
1.4NS,12.0 L,100 POS,PLUG,LATCHING BOT
WIRED
TAIL,30 GOLD,BD RETENTION
3.5MM(0.137) TAIL,9MM(0.354) W ,TIN,W/SWI
CTR,W/GRD PLANE,0.320 H X 0.125 TAIL,LAT
H,BLK,W/HANDLE,JUMPER
Mfr. code
63058 PGA
00779 1–340014–0
80009 671–3800–00
00779 104344–1
0LXM2 DJ005A
00779 121289–7
26742 9618–302–50
Mfr. part number
132H101B1–1414F
TMS 163 i960 Jx Microprocessor Support Instruction Manual
5–3
Replaceable Electrical Parts
5–4
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Replaceable Mechanical Parts

Replaceable Mechanical Parts

This chapter contains a list of the replaceable mechanical components for the TMS 163 i960 Jx microprocessor support. Use this list to identify and order replacement parts.
Parts Ordering Information
Replacement parts are available through your local Tektronix field office or representative.
Changes to Tektronix products are sometimes made to accommodate improved components as they become available and to give you the benefit of the latest improvements. Therefore, when ordering parts, it is important to include the following information in your order:
H Part number H Instrument type or model number H Instrument serial number H Instrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your local Tektronix field office or representative will contact you concerning any change in part number.
Change information, if any, is located at the rear of this manual.
Using the Replaceable Mechanical Parts List
The tabular information in the Replaceable Mechanical Parts List is arranged for quick retrieval. Understanding the structure and features of the list will help you find all of the information you need for ordering replacement parts. The following table describes the content of each column in the parts list.
TMS 163 i960 Jx Microprocessor Support Instruction Manual
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Replaceable Mechanical Parts
Parts list column descriptions
Column Column name Description
1 Figure & index number Items in this section are referenced by figure and index numbers to the exploded view illustrations
that follow. 2 Tektronix part number Use this part number when ordering replacement parts from Tektronix. 3 and 4 Serial number Column three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entries indicates the part is
good for all serial numbers. 5 Qty This indicates the quantity of parts used. 6 Name & description An item name is separated from the description by a colon (:). Because of space limitations, an
item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook H6-1
for further item name identification. 7 Mfr. code This indicates the code of the actual manufacturer of the part. 8 Mfr. part number This indicates the actual manufacturer’s or vendor’s part number.
Abbreviations
Chassis Parts
Mfr. Code to Manufacturer
Cross Index
Abbreviations conform to American National Standard ANSI Y1.1–1972.
Chassis-mounted parts and cable assemblies are located at the end of the Replaceable Electrical Parts List.
The table titled Manufacturers Cross Index shows codes, names, and addresses of manufacturers or vendors of components listed in the parts list.
6–2
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Replaceable Mechanical Parts
Manufacturers cross index
Mfr. code
00779 AMP INC. CUSTOMER SERVICE DEPT
0LXM2 LZR ELECTRONICS INC 8051 CESSNA AVENUE GAITHERSBURG, MD 20879 26742 METHODE ELECTRONICS INC BACKPLAIN DIVISION
61857 SAN–O INDUSTRIAL CORP 91–3 COLIN DRIVE HOLBROOK, NY 11741 63058 MCKENZIE TECHNOLOGY 910 PAGE AVE FREMONT, CA 945387340 80009 TEKTRONIX INC 14150 SW KARL BRAUN DR
Manufacturer Address City , state, zip code
HARRISBURG, PA 17105–3608
PO BOX 3608
CHICAGO, IL 60656–4548
7444 WEST WILSON AVE
BEAVERT ON, OR 97077–0001
PO BOX 500
TMS 163 i960 Jx Microprocessor Support Instruction Manual
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Replaceable Mechanical Parts
Replaceable mechanical parts list
Fig. & index number
1–0 010–0597–00 1 PROBE ADAPTER:80960JX,PGA–132,SOCKETED 80009 010–0597–00 –1 174–3418–00 1 CA ASSY,RF:TLC,MICRO–STRIP,TLC,50 OHM,FEP,PROP
–2 131–4356–00 1 CONN,SHUNT:SHUNT/SHORTING,FEMALE,1 X 2,0.1 CTR,0.63
–3 131–4530–00 1 CONN,HDR:PCB,MALE,STR,1 X 3,0.1 CTR,0.230 MLG X 0.120
–4 131–5527–00 1 JACK,POWER DC:PCB,MALE,RTANG,2MM PIN,1 1MM
–5 671–3800–00 1 CIRCUIT BR ASSY:80960JX,PGA–132, SOCK-
–6 136–0940–00 2 SOCKET,PGA::PCB,132 POS,14 X 14,0.1 CTR,0.170 H X 0.170
–7 103–0406–00 1 CONN, ADAPTER,; QFP, 132–PIN JEDEC TEST CLIP TO PGA
–8 131–5947–00 1 CONN,BOX:PCB,MICRO–STRIP,FEMALE,STR,100 POS,0.05
–9 159–0059–00 1 FUSE,WIRE LEAD:5A,125V 61857 SPI–5A
Tektronix part number
070–9817–00 1 MANUAL,TECH:INSTRUCTION,960JX,DISSASEMBLER,
070–9803–00 1 MANUAL, TECH:TLA 700 SERIES MICRO SUPPORT
119–5061–01 1 POWER SUPPLY:25W ,5V 5A,CONCENTRIC
161–0104–00 1 CA ASSY,PWR:3,18 AWG,98 L,250V/10AMP,98 INCH,
Serial no. effective
Serial no.
discont’d
Qty Name & description
DELAY 1.4NS,12.0 L,100 POS,PLUG,LATCHING BOT
H,BLK,W/HANDLE,JUMPER
TAIL,30 GOLD,BD RETENTION
H(0.433) X 3.5MM(0.137) TAIL,9MM(0.354) W,TIN,W/SWI
ETED,389–2212–00 WIRED
TAIL,OPEN CTR,SYMMETRICAL,P AT 1415
SOCKET
CTR,W/GRD PLANE,0.320 H X 0.125 TAIL,LAT
STANDARD ACCESSORIES
TMS 163
INSTALLATION
2MM,90–265V,47–63HZ (NOT SHOWN)
RTANG,IEC320,RCPT X STR,NEMA 15–5P,W/CORD GRIP
Mfr. code
00779 1–340014–0
26742 9618–302–50
00779 104344–1
0LXM2 DJ005A
80009 671–3800–00
63058 PGA
00779 121289–7
80009 070–9817–00
80009 070–9803–00
14310 SW106KA002F01
S3109 ORDER BY DE-
Mfr. part number
132H101B1–1414F
SCRIPTION
6–4
OPTIONAL ACCESSORIES
070–9802–00 1 MANUAL, TECH:BASIC OPS MICRO SUP ON DAS/TLA 500
SERIES LOGIC ANALYZERS
161–0104–06 1 CA ASSY,PWR:3,1.0MM SQ,250V/10AMP,2.5 METER,
RTANG,IEC320,RCPT, EUROPEAN,SAFETY CONTROLLED (OPT A1)
161–0104–07 1 CA ASSY,PWR:3,1.0MM SQ,240V/10AMP,2.5 METER,
RTANG,IEC320,RCPT X 13A, FUSED, UK PLUG, (13A FUSE), UNITED KINGDOM,SAFETY CONTROL (OPT A2)
161–0104–05 1 CA ASSY,PWR:3,1.0MM SQ,250V/10AMP,2.5 METER,
RTANG,IEC320,RCPT, AUSTRALIA,SAFETY CONTROLLED (OPT A3)
161–0167–00 1 CA ASSY,PWR:3,0.75MM SQ,250V/10AMP,2.5 METER,
RTANG,IEC320,RCPT, SWISS,NO CORD GRIP, SAFETY CONTROLLED (OPT A5)
TMS 163 i960 Jx Microprocessor Support Instruction Manual
80009 070–9802–00
S3109 ORDER BY DE-
SCRIPTION
S3109 ORDER BY DE-
SCRIPTION
S3109 ORDER BY DE-
SCRIPTION
S3109 ORDER BY DE-
SCRIPTION
Replaceable Mechanical Parts
1
2
3
9
8
7
4
5
6
Figure 1: i960 Jx probe adapter exploded view
TMS 163 i960 Jx Microprocessor Support Instruction Manual
6–5
Replaceable Mechanical Parts
Replaceable mechanical parts list
Fig. & index number
2–0 010– 0582–00 1 ADAPTER,PROBE:192–CHANNEL,HIGH DENSITY PROBE 80009 010058200
–1 380–1095–00 1 HOUSING,HALF:UPPER,192 CHANNEL HIGH DENSITY
–2 211–0152–00 4 SCR,ASSEM WSHR:4–40 X 0.625,PNH,BRS,NP ,POZ TK0435 ORDER BY DESC –3 131–5947–00 2 CONN BOX:CPCB, MICRO–STRIP;FEMALE,STR,100 POS,0.05
–4 671–3395–00 1 CKT BD ASSY:192–CHANNELS,HIGH DENSITY PROBE 80009 671339500
Tektronix part number
Serial no. effective
Serial no.
discont’d
Qty Name & description
PROBE
CTR,W/GRD PLANE,0.320 H X 0.124 TAIL, LATCHING, 4 ROW,
0.05 PCB, STAGGER (J150, J250)
Mfr. code
80009 380109500
80009 131594700
Mfr. part number
–5 380–1096–00 1 HOUSING,HALF:LOWER,192 CHANNEL HIGH DENSITY
PROBE –6 348–0070–01 2 PAD,CUSHIONING:2.03 X 0.69 X 0.18 SI RBR 85471 ORDER BY DESC –7 131–4917–00 8 CONN,HDR CPCB,;MALE,STR,1 X 2,0.1 CTR,0.235 MLF X
0.110 TAIL,20 BOLD, TUBE, HIGH TEMP
(J300,J340J400,J440J500,J640,J600) –8 131–5267–00 5 CONN,HDR CPCB,;MALE,STR,2 X 40.O.1 CTR,0.234 MLG X
0.110 TAIL, 30 GOLD
(J310,J320,J330,J340,J350,J360,J370,J410,J420,J430,J450,J46
0,J470,J510,J520,J530,J550,J560,J570,J610,J620,J630,J650,J6
60,J670)
80009 380109600
53387 131491700
53387 131526700
6–6
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Replaceable Mechanical Parts
1
2
8
7
6
3
4
5
Figure 2: 192-Channel High-Density Probe exploded view
TMS 163 i960 Jx Microprocessor Support Instruction Manual
6–7
Replaceable Mechanical Parts
6–8
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Index

Index

A
about this manual set, ix acquiring data, 2–7 Address group
channel assignments, 3–6 display column, 2–9 symbol table
Control T able, 2–4 Fault T able, 2–5 IBR, 2–3 Interrupt Table, 2–4 PRCB, 2–3
Alternate Bus Master Cycles
clocking option, 2–2 how data is acquired, 3–13
alternate connections
extra channel probes, 3–15 to other signals, 3–14
Aux group, channel assignments, 3–10
B
basic operations, where to find information, ix bus cycles, displayed cycle types, 2–8 bus timing, 3–12 ByteEnbl group, channel assignments, 3–9
C
C0 and C1 probes, signal connections, 3–15 certifications, 3–4 channel assignments
Address group, 3–6 Aux group, 3–10 ByteEnbl group, 3–9 clocks, 3–11 Control group, 3–9 Data group, 3–8 Intr group, 3–10
Misc group, 3–10 channel groups, 2–1 clock channel assignments, 3–11 clock rate, 1–2 clocking, Custom, 2–1
how data is acquired, 3–12 clocking options
Alternate Bus Master Cycles, 2–2
field name, 2–1
how data is acquired, 3–13 compliances, 3–4 connections
no probe adapter, 1–10
channel probes, 1–10
clock probes, 1–12 other microprocessor signals, 3–14 probe adapter to SUT
PGA, with a high-density probe, 1–4
PGA-to-QFP converter clip, 1–8
Control Flow display format, 2–10 Control group
channel assignments, 3–9 display column, 2–10 symbol table, 2–2
Custom clocking, 2–1
Alternate Bus Master Cycles, 2–2 how data is acquired, 3–12
cycle types, 2–8
D
data
acquiring, 2–7 disassembly formats
Control Flow, 2–10
Hardware, 2–8
Software, 2–10
Subroutine, 2–10 how it is acquired, 3–11
Data cache, 1–2 data display , changing, 2–11 Data group
channel assignments, 3–8 display column, 2–9
demonstration file, 2–14 dimensions
PGA-to-QFP converter clip, 3–6 probe adapter, 3–5
disassembled data
cycle type definitions, 2–8 viewing, 2–7 viewing an example, 2–14
disassembler
definition, ix logic analyzer configuration, 1–2 setup, 2–1
Disassembly Format Definition overlay, 2–11 Disassembly property page, 2–11
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Index–1
Index
display formats
Control Flow, 2–10 Hardware, 2–8 Software, 2–10 special characters, 2–7 Subroutine, 2–10
E
electrical specifications, 3–2 environmental specifications, 3–3 exception vectors, 2–12
F
Fault T able Base field, 2–11 fault vectors, 2–12 fuse, replacing, 4–1
H
Hardware display format, 2–8
cycle type definitions, 2–8
high-density probe, connecting channels to, 1–6
I
installing hardware. See connections Instruction cache, 1–2 Interrupt Table Base field, 2–11 interrupt vectors, 2–12 Intr group, channel assignments, 3–10
J
Mark Cycle function, 2–12 Mark Opcode function, 2–12 marking cycles, definition of, 2–12 microprocessor
package types supported, 1–1 signals not accessible on probe adpter, 3–15
specific clocking and how data is acquired, 3–12 Misc group, channel assignments, 3–10 Mnemonics display column, 2–10
P
power, for the probe adapter
applying, 1–12
jumper position, 1–3
removing, 1–14 power adapter, 1–12 power jack, 1–13 probe adapter
alternate connections, 3–14
circuit description, 4–1
clearance, 1–3
adding sockets, 1–5 dimensions, 3–5
PGA-to-QFP converter clip dimensions, 3–6 configuring, 1–3, 3–1 hardware description, 3–1 jumper positions, 3–1 not using one, 1–10 replacing the fuse, 4–1
R
reference memory, 2–14 restrictions, 1–2
without a probe adapter, 1–10
jumpers, Power Source, 1–3
L
leads (podlets), high-density probe. See connections logic analyzer
configuration for disassembler, 1–2 software compatibility, 1–2
M
manual
conventions, ix how to use the set, ix
Index–2
S
service information, 4–1 setups, disassembler, 2–1 signals
active low sign, x alternate connections, 3–14 extra channel probes, 3–15
Software display format, 2–10 special characters displayed, 2–7 specifications, 3–1
certifications, 3–4 channel assignments, 3–6 compliances, 3–4
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Index
electrical, 3–2 environmental, 3–3
mechanical (dimensions), 3–5, 3–6 Subroutine display format, 2–10 support setup, 2–1 SUT, definition, ix symbol table
Address group
Control T able, 2–4 Fault T able, 2–5 IBR, 2–3 Interrupt Table, 2–4 PRCB, 2–3
Control channel group, 2–2
system file, demonstration, 2–14
T
terminology, ix Timestamp display column, 2–10
V
Vector cache, 1–2 viewing disassembled data, 2–7
TMS 163 i960 Jx Microprocessor Support Instruction Manual
Index–3
Index
Index–4
TMS 163 i960 Jx Microprocessor Support Instruction Manual
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