Tektronix TLA7XM, TLA721 Service Manual
Service Manual
TLA721 Benchtop &
TLA7XM Expansion Mainframe
071-0912-00
This document applies to System Software version 4.1 and above.
Warning
The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
www.tektronix.com
Copyright © Tektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and
are protected by United States copyright laws and international treaty provisions.
Use, duplication, or disclosure by the Government is subject to restricti ons as set forth in subparagraph (c)(1)(ii) of the
Rights in Technical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software -- Restricted Rights clause at FAR 52.227-19, as applicable.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
WARRANTY
Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defec tive during thi s
warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, fai lure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or c onnection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product tha t has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Specifications
Operating Infromation
General Safety Summary ix...................................
Service Safety Summary xii....................................
Preface xiii...................................................
Manual Structure xiii................................................
Manual Conventions xiv..............................................
Related Manuals xiv.................................................
Introduction xvii..............................................
Adjustment and Certification Interval xvii................................
Service Strategy xvii.................................................
Service Offerings xviii................................................
Contacting Tektronix xix.............................................
Product Description 1--1..............................................
Characteristic Tables 1--2.............................................
Installation 2--1.....................................................
Mainframe Controls and Connectors 2--3.................................
Benchtop Controller Controls and Connectors 2--16.........................
Expansion Module Controls and Connectors 2--22...........................
Operating System and Application Interface 2--23..........................
Theory of Operation
Benchtop Controller 3--1..............................................
Mainframe 3--4.....................................................
Expansion Module 3--7...............................................
Performance Verification
Summary Verification 4--1.............................................
Test Equipment 4--1..................................................
Functional Verification 4--3............................................
Certification 4--5....................................................
Performance Verification Procedures 4--6.................................
Calibration Data Report 4--9....................................
Adjustment Procedures
Maintenance
Preparation 6--1.....................................................
Preventing ESD 6--1.................................................
Inspection and Cleaning 6--2...........................................
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
i
Table of Contents
Mainframe Removal and Installation Procedures 6--5...............
Equipment Required 6--5..............................................
Install Empty Slot Panel Fillers 6--6.....................................
Blower Assembly 6--7................................................
Removing the Enhanced Monitor Board 6--10..............................
Power Supply 6--12...................................................
Mainframe Cover 6--13................................................
Card Guides 6--14....................................................
Nut Rails 6--16.......................................................
Temperature Sense Board 6--17..........................................
EMI DIN Shields 6--19................................................
Backplane 6--20......................................................
Special Configuration Options 6--23......................................
Benchtop Controller Removal and Installation Procedures 6--25.......
Equipment Required 6--25..............................................
Replaceable Hard Disk Drive 6--26.......................................
Injector/Ejector Handles 6--28...........................................
Covers 6--29.........................................................
Front Panel and Hard Disk Drive Interface Board 6--30.......................
Fixed Hard Drive 6--34................................................
CD-ROM Drive 6--36.................................................
Button Battery 6--37..................................................
Main Memory 6--38...................................................
Floppy Disk Drive 6--39...............................................
Expansion Module Removal and Installation Procedures 6--45.........
Equipment Required 6--45..............................................
Ejector Handles 6--46.................................................
Expansion Module Cover 6--47..........................................
Expansion Module Circuit Board 6--48....................................
Soldered-On Components 6--49..........................................
Troubleshooting 6--51...........................................
Service Level 6--52...................................................
Check for Common Problems 6--52......................................
Isolating System Problems 6--56.........................................
Eliminate other Problem Sources 6--59....................................
Diagnostics 6--59.....................................................
BIOS Error Messages 6--62.............................................
TLA Startup Sequence 6--65............................................
Troubleshoot the Benchtop Controller 6--66................................
Troubleshoot the Mainframe 6--68.......................................
Troubleshoot the Expansion Mainframe 6--71..............................
Adjustments after Repair 6--72..........................................
Repackaging Instructions 6--73...................................
Packaging 6--73......................................................
Shipping to the Service Center 6--73......................................
Options
ii
Service Options 7-- 1..................................................
Product Options 7--2.................................................
Power Cord Options 7--2..............................................
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Electrical Parts List
Diagrams
Mechanical Parts List
Table of Contents
Parts Ordering Information 10--1.........................................
Using the Replaceable Parts List 10--2....................................
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
iii
Table of Contents
List of Figures
Figure 1--1: Dimensions of the benchtop and expansion mainframe 1--15
Figure 1--2: Dimensions of the benchtop and expansion mainframe
with rackmount option 1--16..................................
Figure 2--1: Power cord identification chart 2--2....................
Figure 2-- 2: Front view of the benchtop chassis with a benchtop
controller 2--3.............................................
Figure 2-- 3: Rear view of the benchtop chassis 2-- 4..................
Figure 2--4: Passive monitor connector 2--5........................
Figure 2-- 5: Rear view of the enhanced monitor 2-- 8.................
Figure 2-- 6: Enhanced monitor board jumpers 2-- 9.................
Figure 2--7: Enhanced monitor board flash jumper 2--10.............
Figure 2-- 8: Enhanced Monitor RS-232 connector 2-- 11...............
Figure 2--9: Front view of the benchtop controller 2--16...............
Figure 2--10: Front view of the benchtop controller 2--22..............
Figure 3-- 1: Interconnection and block diagram for the benchtop
mainframe and controller 3--2................................
Figure 3--2: Mainframe block diagram 3--5........................
Figure 3--3: Benchtop and expansion mainframe block diagram 3--8...
Figure 4--1: Calibration/certification procedure flow chart 4--2.......
Figure 4--2: Benchtop and expansion mainframe 25-pin rear panel
connector 4--7.............................................
Figure 6--1: Installing the empty slot panel fillers 6--6...............
Figure 6--2: Location of blower assembly screws 6--8................
Figure 6--3: Removing the blower assembly 6--9....................
Figure 6--4: Removing the blower 6--9............................
Figure 6--5: Removing the enhanced monitor board 6--10.............
Figure 6-- 6: Removing the power supply 6-- 12.......................
Figure 6--7: Removing the mainframe cover 6--13....................
Figure 6--8: Removing the top and bottom card guides 6--15...........
Figure 6--9: Replacing the top and bottom nut rails 6--16.............
Figure 6--10: Removing the temperature sense board 6--18............
Figure 6--11: Removing the backplane EMI DIN shields 6--19..........
Figure 6--12: Removing the backplane 6--21........................
Figure 6-- 13: Soft power down jumper setting 6-- 22..................
Figure 6--14: Power switch connectors 6--24.........................
Figure 6--15: Removing the replaceable hard disk drive 6--26..........
iv
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table of Contents
Figure 6--16: Removing the hard disk drive from the cartridge 6--27....
Figure 6--17: Removal and installation of the ejectors 6--28............
Figure 6--18: Removing and installing the left and rear covers 6--29....
Figure 6--19: Removing and installing the front panel hardware 6--31...
Figure 6--20: Removing screws from the front and sides of the
controller 6--32.............................................
Figure 6--21: Removing and installing the fixed hard disk drive and
CD-ROM drive 6--35........................................
Figure 6--22: Removal and installation of the button battery and
memory 6--37...............................................
Figure 6--23: Removing the processor and interface boards 6--40.......
Figure 6--24: Separating the processor and interface boards 6--41......
Figure 6-- 25: Removing the floppy disk drive from the interface
board 6--42.................................................
Figure 6--26: Removal and installation of the ejector handles 6--46.....
Figure 6--27: Removal and installation of the cover 6--47..............
Figure 6--28: Removing the circuit board 6--48.....................
Figure 6--29: ResMan32 program output 6--58......................
Figure 6--30: Startup sequence 6--66...............................
Figure 6--31: Benchtop controller troubleshooting tree 6--68...........
Figure 6--32: Mainframe troubleshooting tree 6--70..................
Figure 9--1: Interconnection diagram 9--1.........................
Figure 9--2: Benchtop mainframe block diagram 9--2...............
Figure 9--3: Benchtop and expansion mainframe block diagram 9--3..
Figure 10--1: Cabinet and chassis assembly 10--7....................
Figure 10--2: Circuit boards and chassis parts 10--9..................
Figure 10--3: Power supply, monitor, and fan assembly 10--11..........
Figure 10--4: Benchtop controller explod ed view (covers and
handles) 10--13..............................................
Figure 10--5: Benchtop controller explod ed view (internal parts) 10--15..
Figure 10--6: Expansion module exploded view 10--17.................
Figure 10--7: Expansion module exploded view 10--19.................
Figure 10--8: IView cables 10--19...................................
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
v
Table of Contents
List of Tables
Table i: Tektronix Logic Analyzer Family Documentation xv.......
Table 1 --1: Benchtop controller characteristics 1-- 3.................
Table 1--2: Front panel characteristics 1--5........................
Table 1 --3: Backplane interface 1--6..............................
Table 1--4: External signal interface 1--7..........................
T able 1--5: Backplane latencies 1--9..............................
Table 1--6: Benchtop and expansion mainframe AC power source 1--11.
Table 1--7: Benchtop and expansion mainframe secondary power 1--11..
Table 1--8: Benchtop and expansion mainframe cooling 1--12.........
T able 1--9: Atmospheric characteristics 1--13.......................
T able 1--10: Mechanical characteristics 1--14.......................
Table 1--11: Certifications and compliances 1--16....................
Table 2 --1: Passive monitor connector pinouts 2-- 6..................
Table 2--2: RS-232 pin connector 2--11.............................
Table 2 --3: P1 connector pinouts 2-- 13............................
Table 2--4: P2 connector pinouts for slots 1 -- 12 2--14................
Table 2 --5: P2 connector pinouts for slot 0 2-- 15.....................
Table 2--6: Mouse port pin assignments 2--17.......................
Table 2--7: Keyboard port pin assignments 2--17....................
Table 2--8: PC CardBus32 port pin assignments 2--19................
Table 2--9: USB pin assignments 2--19.............................
Table 2--10: SVGA OUT pin assignments 2--20.....................
Table 2 --11: RS-232 Port pin assignments 2-- 20.....................
Table 2--12: LPT port pin assignments 2--21........................
Table 4 --1: Test equipment 4--3..................................
Table 4--2: Functional verification procedures 4--3.................
T able 4--3: Performance verification procedures 4--6................
Table 4 --4: Power supply voltages at the 25-pin connector 4-- 7........
T able 6--1: External inspection check list 6--3......................
T able 6--2: Internal inspection check list 6--4......................
Table 6 --3: Equipment required to service the mainframes 6 --5.......
Table 6 --4: Enhanced monitor board jumpers 6--11..................
Table 6--5: Mainframe backplane jumpers 6--22.....................
Table 6 --6: Equipment required to service the benchtop controller 6-- 25.
Table 6--7: Signal wire identification 6--43.........................
vi
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table of Contents
Table 6 --8: Equipment required to service the expansion module 6-- 45..
Table 6--9: Failure symptoms and possible causes 6--53...............
Table 6 --10: Command line options for ResMan32 6-- 57..............
Table 6--11: Power-on diagnostic tests 6--60.........................
Table 6 --12: BIOS error codes and explanations 6-- 62................
Table 7 --1: TLA721 Service Options 7--1..........................
Table 7 --2: TLA7XM Service Options 7--1.........................
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
vii
Table of Contents
viii
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
ix
General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
CAUTION
Refer to Manual
WARNING
High Voltage
Protective Ground
(Earth) Terminal
x
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xi
Service Safety Summary
xii
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Preface
Manual Structure
This is the service manual for the TLA721 Benchtop Mainframe and the
TLA7XM Expansion Mainframe. Read this preface to learn how this manual is
structured, what conventions it uses, and where you can find other information
related to servicing this product. Read the Introduction following this preface for
safety and other important background information needed before using this
manual for servicing this product.
This manual is divided into chapters, which are made up of related subordinate
topics. These topics can be cross referenced as sections.
Be sure to read the introductions to all procedures. These introductions provide
important information needed to do the service correctly, safely, and efficiently.
A brief description of each chapter follows:
H Specifications contains a product description of the instrument and tables of
the characteristics and descriptions that apply to it.
H Operating information includes basic controls and connectors on the
instrument. It also provides a high-level overview of the operating system
and application interface. Refer to the Tektronix Logic Analyzer Family User
Manual for detailed information on the operating system and for installation
information not found in this document.
H Theory of Operation contains a high-level overview of the basic operation of
the instrument to help you service the instrument to a module level.
H Performance Verification contains the performance verification and
certification procedures for the instrument.
H Adjustments notes that there are no adjustments for the instrument. For
adjustment information on the product modules, refer to the appropriate
service module manual.
H Maintenance contains information and procedures for doing preventative and
corrective maintenance on the instrument. Included are instructions for
cleaning, for removal and installation of replaceable parts, and for troubleshooting product failures. Instructions for shipping the instrument are
included in this chapter.
H Options contains information on factory installed options and accessories
that may be purchased for your instrument.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xiii
Preface
Manual Conventions
H Diagrams contains block diagrams of the instrument and interconnection
diagrams useful for isolating failures in the instrument.
H Mechanical Parts List includes tables of all replaceable parts for the
instrument along with the Tektronix part number.
This manual uses certain conventions that you should become familiar with
before attempting service.
Mainframes
Modules
Replaceable Parts
Safety
This manual covers at least two different kinds of mainframes. The benchtop
mainframe consists of a mainframe with a benchtop controller module. Other
slots are available for installing logic analyzer (LA) modules, digitizing
oscilloscope (DSO) modules, or pattern generator (Patgen) modules. The
expansion mainframe consists of a mainframe with an expansion controller
module. Expansion mainframes are used to expand the capabilities of a single
TLA700 Logic Analyzer.
Throughout this manual, the term module refers to a TLA700 Series Logic
Analyzer, DSO unit, or pattern generator unit that mounts inside the mainframe.
A module is composed of circuit cards, interconnecting cables, and a user-accessible front panel enclosed in a mechanical frame.
This manual refers to any field-replaceable assembly or mechanical part
specifically by its name or generically as a replaceable part. In general, a
replaceable part is any circuit board or assembly, such as the hard disk drive, or a
mechanical part, such as the I/O port connectors, that is listed in the replaceable
parts list.
Symbols and terms related to safety appear in the Service Safety Summary found
at the beginning of this manual.
Related Manuals
xiv
The following manuals are available as part of the Tektronix Logic Analyzer
Family documentation set. The procedures in this manual assume that the service
personnel have access to all manuals listed in the following table. Other manuals
may exist outside of the table as the product line offerings change. Contact your
local Tektronix Service Representative for the latest part numbers of the service
documentation. You can also obtain part numbers from the online help for the
instrument.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table i: Tektronix Logic Analyzer Family Documentation
Manual name Description Service use
Preface
The Tektronix Logic Analyzer Family User
Manual
The TLA715 Portable Mainframe Service
Manual.
The TLA7Nx/TLA7Px/TLA7Qx Logic
Analyzer Module Service Manual.
The TLA7Dx/TLA7EX Digitizing Oscilloscope Module Service Manual.
The TLA7PG2 Pattern Generator Module
Service Manual.
Provides basic operation and installation
information for the Tektronix Logic Analyzer
Family.
Provides service information for the
TLA715 Portable Mainframe.
Provides service information for the logic
analyzer modules.
Provides service information for the DSO
modules.
Provides service information for the pattern
generator modules.
Installation and removal of LA, DSO, and
pattern generator modules as well as the
mainframes.
Reinstallation of the system and application
software.
Isolating and correcting failures in the
portable mainframe and expansion
mainframes.
Isolating and correcting failures in the logic
analyzer module.
Performing periodic or after-repair functional or performance verifications, calibrations,
and certifications for the logic analyzer
modules.
Performing periodic or after-repair adjustments for the logic analyzer modules.
Isolating and correcting failures in the DSO
module.
Performing periodic or after-repair functional or performance verifications, calibrations,
and certifications for the DSO modules.
Performing periodic or after-repair adjustments for the DSO modules.
Isolating and correcting failures in the
pattern generator module.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Performing periodic or after-repair functional or performance verifications, calibrations,
and certifications for the pattern generator
modules.
xv
Preface
xvi
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Introduction
This manual contains information needed to properly service the portable
mainframe. This introduction contains information critical to safe and effective
servicing.
To prevent personal injury or damage to the instrument, consider the following
requirements before attempting service:
H Read the General Safety Summary and Service Safety Summary found at the
beginning of this manual.
H Read the Operating Basics chapter for information on the controls,
connectors, and operating system. This information is useful before servicing
the instrument.
H The procedures in this manual may only be performed by a qualified service
person.
Be sure to follow all warnings, cautions and notes.
Adjustment and Certification Interval
Service Strategy
Generally, you should perform the adjustments and certification (calibration)
once per year, or following repairs that may affect adjustment or calibration.
This manual supports and contains information needed for periodic maintenance
of the mainframe. It supports and contains information for corrective maintenance of this product:
H supports isolation of faults to the failed circuit board or assembly level
shown in the Replaceable Parts List
H supports removal and replacement of boards or assemblies
H supports removal and replacement of the fuse, knobs, chassis, and other
mechanical parts listed in the parts lists
This manual does not support component-level fault isolation and replacement.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xvii
Introduction
Service Offerings
Tektronix provides service to cover repair under warranty as well as other
services that are designed to meet your specific service needs.
Whether providing warranty repair service or any of the other services listed
below, Tektronix service technicians are equipped to service the instrument.
Services are provided at Tektronix Services Centers and on-site at your facility,
depending on your location.
Warranty Repair Service
Calibration and Repair
Service
Tektronix warrants this product for one year from date of purchase. The warranty
is located behind the title page in this manual. Tektronix technicians provide
warranty service at most Tektronix service locations worldwide. The Tektronix
product catalog lists all service locations worldwide.
In addition to warranty repair, Tektronix Service offers calibration and other
services which provide solutions to your service needs and quality standards
compliance requirements.
The following services can be tailored to fit your requirements for calibration
and/or repair of your portable mainframe.
Service Options. Tektronix Service Options can be selected at the time you
purchase your instrument. You select these options to provide the services that
best meet your service needs.
Service Agreements. If service options are not added to the instrument purchase,
then service agreements are available on an annual basis to provide calibration
services or post-warranty repair coverage. Service agreements may be customized to meet special turn-around time and/or on-site requirements.
Service on Demand. Tektronix offers calibration and repair services on a
“per-incident” basis that is available with standard prices.
xviii
Self Service. Tektronix supports repair to the replaceable-part level by providing
for circuit board exchange.
Use this service to reduce down-time for repair by exchanging circuit boards for
remanufactured ones. Tektronix ships updated and tested exchange boards. Each
board comes with a 90-day service warranty.
For More Information. Contact your local Tektronix service center or sales
engineer for more information on any of the Calibration and Repair Services just
described.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Contacting Tektronix
Introduction
Phone 1-800-833-9200*
Address Tektronix, Inc.
Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web site www.tektronix.com
Sales support 1-800-833-9200, select option 1*
Service support 1-800-833-9200, select option 2*
Technical support Email: techsupport@tektronix.com
1-800-833-9200, select option 3*
1-503-627-2400
6:00 a.m. -- 5:00 p.m. Pacific time
* This phone number is toll free in North America. After office hours, please leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xix
Introduction
xx
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
Product Description
This chapter provides a brief product description and lists the warranted
characteristics, nominal traits, and typical characteristics of the TLA721
Benchtop Mainframe and the TLA7XM Expansion Mainframe.
Both the benchtop mainframe and the expansion mainframes are basically
identical with the exception of the controllers. The benchtop mainframe includes
a PC controller that controls the entire instrument. The expansion mainframe
includes an expansion module that expands the capabilities of a benchtop
mainframe or a TLA715 Portable Mainframe. Each mainframe can function as a
logic analyzer, a digital storage oscilloscope, or a pattern generator, depending
on the module cards installed in its slots.
Benchtop Mainframe
The benchtop mainframe comprises of a benchtop chassis and the benchtop
controller. The benchtop controller is a Pentium III based, three-wide, C-size,
embedded Slot-0 Controller that incorporates the same controller as the TLA715
Portable Mainframe. The benchtop chassis is based on the high power, 13-slot,
VX1420A Mainframe without a readout and with additional labels.
The benchtop mainframe has the following key features:
H Microsoft Windows operating system
H Ten slots (excluding three slots for the benchtop controller) for compatibility
with new and existing LA, DSO, and patgen modules
H Personal computer (PC) based processor architecture that provides a cost
effective, high-performance, system controller with automatic “PC connectivity” to a multitude off-the-shelf devices (such as Ethernet, modem,
printers) via standard PC I/O ports and two PC card (CardBus) slots
H High-performance PC-based display system capable of driving large,
high-resolution, external monitors in multiple user selected formats via an
external SVGA port
H Easy configuration of modules between slots and mainframes through the
automatic system configuration support of the resource manager and
application software
H Precision clock, trigger line, and event signaling between the mainframe and
modules for real-time triggering, sequencing, and correlation of events
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
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Specifications
H Easy access to field replaceable units (FRUs) to provide a low mean-time-to-
repair (MTTR) for exchange modules
H Fan airflow capacity to support a reduction in audible noise levels
H Mainframe compatible with international power standards, certified to
international safety and EMC requirements, and tested to rugged environmental standards
H 100% hardware and software compatibility with the TLA715 Portable
Mainframe, allowing you to transport modules, data, and end-user application programs between mainframes
Expansion Mainframe
Characteristic Tables
The expansion mainframe comprises of a benchtop chassis and the expansion
module. The expansion module is a single-wide, C-size, modules that provides
cable connections to a benchtop mainframe or to a portable mainframe.
The expansion mainframe has the following key features:
H Microsoft Windows operating system
H 12 slots (excluding one slot for the expansion module) for compatibility with
new and existing LA, DSO, and patgen modules
H Precision clock, trigger line, and event signaling between the mainframe and
modules for real-time triggering, sequencing, and correlation of events
H Easy access to field replaceable units (FRUs) to provide a low mean-time-to-
repair (MTTR) for exchange modules
H Fan airflow capacity to support a reduction in audible noise levels
H Mainframe compatible with international power standards, certified to
international safety and EMC requirements, and tested to rugged environmental standards
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This section contains the specifications for the portable mainframe. All
specifications are warranted unless noted “typical”. Typical characteristics
describe typical or average performance and provide useful reference information. Specifications marked with the n symbol are checked in the Performance
Verification chapter in this manual.
The specifications listed in this section are valid under the following conditions:
H The instrument must reside in an environment with temperature, altitude,
and humidity, within the operating limits described in Table 1--9 beginning
on page 1--13.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
H The instrument has has a warm-up period of at least 20 minutes.
Tables 1--1 through 1--2 list the specifications for the TLA721 Benchtop
Controller.
Table 1- 1: Benchtop controller characteristics
Characteristic Description
Operating system Microsoft Windows 2000
Microprocessor Intel 733 MHz Pentium III configuration with an Intel 815E chip-set
Main memory Two 144 pin SODIMM sockets support one or two SDRAM modules
Available configurations 16, 32, 64, 256 MB per SODIMM
Installed configuration 512 MB maximum configuration
Speed 133 MHz
CAS latency 2, 3
RAS to CAS delay 2, 3
Specifications
RAS precharge 2, 3
DRAM cycle time 5/7 or 7/9
Cache memory 512 KB, level 2 (L2) write-back cache
Flash BIOS 512 KB
Provides PC plug-and-play services with and without
Microsoft Windows operating system.
Flash based BIOS field upgradable via a floppy disk
Forced recovery jumper is provided
Real-time clock and CMOS setups NVRAM Real-time clock/calendar. Standard and advanced PC CMOS setups: see BIOS
specifications
RTC, CMOS setup, & PnP NVRAM retention
time (Typical)
Floppy disk drive Standard 3.5 inch, 1.44 MB, high-density, double-sided, PC-compatible high-density
Transfer rate 500 Kbits per second
Access time (ave.) 194 ms
Bootable replaceable hard disk drive Standard PC compatible IDE (Integrated device Electronics) hard disk drive residing
Size Maximum 30 GByte
Battery life is typically > 7 years
floppy disk drive
on an EIDE interface
Continually subject to change due to the fast-moving PC component environment
These storage capacities valid at product introduction
Interface ATA-5/Enhanced IDE (EIDE)
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
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Specifications
Table 1- 1: Benchtop controller characteristics (Cont.)
Characteristic Description
Average seek time Read 12 ms
I/O data-transfer rate 33.3 MB/s maximum (U-DMA mode 2)
Average latency 7/14 ms
Cache buffer 512 KB
CD ROM drive Standard PC compatible IDE (Integrated device Electronics)
24X (minimum) CD ROM drive residing on an EIDE interface
Continually subject to change due to the fast-moving PC component environment
Applicable formats CD-DA; CE-ROM Mode 1, Mode 2; CD-ROM XA Mode 2 (Form 1, Form 2); Photo CD
(single/multi session); Enhanced CD
Interface IDE (ATAPI)
Average access time 130 ms
Data-transfer rate (burst sustained) 16.7 MB per second maximum, 1290--3000 KB per second
Display classification Standard PC graphics accelerator technology (bitBLT based) residing on t he
Peripheral Component Interconnect (PCI) bus capable of supporting external color
VGA, SVGA, or XGA monitors
Display configuration Hardware automatically senses a missing flat panel LCD in the benchtop mainframe
and defaults to the external SVGA monitor output during the BIOS boot sequence (no
internal TFT LCD display exists). This is indicated by a singl e beep during the boot
sequence.
Dynamic Display Configuration 1 (DDC1) support for the external monitor is provided.
Display memory 4 MB SDRAM is on board the video controller; there is no external video memory
Display drive One VGA, SVGA, or XGA compatible analog output port
Display size User selected via Microsoft Windows
Plug and Play support for DDC1 and DDC2 A and B
(Primary with Silicon Motion Chip)
Resolution (Pixels) Colors Refresh Rates
640 x 480 256, 64 K, 16.8 M 60, 75, 85
800 x 600 256, 64 K, 16.8 M 60, 75, 85
1024 x768 256, 64 K, 16.8 M 60, 75, 85
1280 x 1024 256, 64 K, 16.8 M 60
1600 x 600 256, 64 K 60
1600 x 1200 256, 64 K 60
(Secondary with 815E Chip set)
Resolution (Pixels) Colors Refresh Rates
640 x 480 256, 64 K, 16.8 M 60, 75, 85
800 x 600 256, 64 K, 16.8 M 60, 75, 85
1024 x768 256, 64 K, 16.8 M 60, 75, 85
1280 x 1024 256, 64 K, 16.8 M 60, 75, 85
1600 x 1200 256 60, 75
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TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
Table 1- 2: Front panel characteristics
Characteristic Description
SVGA output port (SVGA) Two 15-pin sub-D SVGA connectors
Dual USB ports Two USB (Universal Serial Bus) compliant ports
Mouse port Front panel mounted PS2 compatible mouse port utilizing a mini DIN connector
Keyboard port Front panel mounted PS2 compatible keyboard port utilizing a mini DIN connector
Parallel interface port (LPT) 36-pin high-density connector supports standard Centronics mode, Enhanced Parallel
Port (EPP), or Microsoft high-speed mode (ECP)
Serial interface port (COM) 9-pin male sub-D connector to support an RS232 serial port
PC CardBus32 port Standard Type I and II PC compatible PC card slot
Type I, II, and III PC Card Port Standard Type I, II, and III PC compatible PC card slot
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
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Specifications
Table 1- 3: Backplane interface
Characteristic Description
Slots
Benchtop mainframe 13
Expansion mainframe 13
CLK10 Frequency 10 MHz ±100 PPM
n
Relative Time Correlation Error
LA to LA “MagniVu” data 2 ns
LA to LA “normal” data utilizing an internal clock
LA to LA “normal” data utilizing an external clock 2ns
LA “MagniVu” to DSO data
LA to DSO “normal” data utilizing an internal clock
LA to DSO “normal” data utilizing an external clock
DSO to DSO
3
1,2
3
(Typical)
4
1 LA sample -- 0.5 ns
3ns
3,4
3,5
1 LA sample ± 2ns
3ns
3ns
Enhanced monitor
Voltage readout +24 V, --24 V, +12 V, --12V, +5 V, --5.2 V, --2 V, +5 V
present, and +5 V
External
via RS232
Voltage readout accuracy (Typical) ±3% maximum
Current readout Readout of t he present current on the +24 V, --24 V, +12 V,
--12 V, +5 V, --2 V, --5.2 V rails via RS232
Current readout accuracy (Typical) ±5% of maximum power supply I
mp
Rear panel connector levels ±25 VDC maximum, 1 A maximum per pin
(Provides access for RS-232 host to enhanced monitor)
1
Includes typical jitter, slot-to-slot skew, and probe-to-probe variations to provide a “typical” number for the measurement. Assumes standard accessory probes are utilized.
2
For time intervals longer than 1 s between modules, add 0.01% of the difference between the absolute tim e
measurements to the relative time correlation error to account for the inaccuracy of the CLK10 source.
3
The DSO module time correlation is measured at the maximum sample rate on one channel only.
4
Sample represents the time from the event to the next valid data sample at the probe tip of the LA. In the normal
Internal clock mode, this represents the delta time to the next sample clock
5
On this measurement, the DSO is measuring the CLK channel of the LA. If the DSO is measuring a data channel, the
time from when the data edge occurs until the clock edge occurs must be included.
Standby
if
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TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
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