Tektronix TLA7XM, TLA721 Service Manual

Service Manual

TLA721 Benchtop &
TLA7XM Expansion Mainframe

071-0912-00

This document applies to System Software ver­sion 4.1 and above.

Warning

The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.

www.tektronix.com

Copyright © Tektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and
are protected by United States copyright laws and international treaty provisions.

Use, duplication, or disclosure by the Government is subject to restricti ons as set forth in subparagraph (c)(1)(ii) of the
Rights in Technical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software -- Restricted Rights clause at FAR 52.227-19, as applicable.

Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.

Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077

TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

WARRANTY

Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defec tive during thi s
warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.

In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.

This warranty shall not apply to any defect, fai lure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or c onnection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product tha t has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.

THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Table of Contents

Specifications

Operating Infromation

General Safety Summary ix...................................

Service Safety Summary xii....................................

Preface xiii...................................................

Manual Structure xiii................................................

Manual Conventions xiv..............................................

Related Manuals xiv.................................................

Introduction xvii..............................................

Adjustment and Certification Interval xvii................................

Service Strategy xvii.................................................

Service Offerings xviii................................................

Contacting Tektronix xix.............................................

Product Description 1--1..............................................

Characteristic Tables 1--2.............................................

Installation 2--1.....................................................

Mainframe Controls and Connectors 2--3.................................

Benchtop Controller Controls and Connectors 2--16.........................

Expansion Module Controls and Connectors 2--22...........................

Operating System and Application Interface 2--23..........................

Theory of Operation

Benchtop Controller 3--1..............................................

Mainframe 3--4.....................................................

Expansion Module 3--7...............................................

Performance Verification

Summary Verification 4--1.............................................

Test Equipment 4--1..................................................

Functional Verification 4--3............................................

Certification 4--5....................................................

Performance Verification Procedures 4--6.................................

Calibration Data Report 4--9....................................

Adjustment Procedures
Maintenance

Preparation 6--1.....................................................

Preventing ESD 6--1.................................................

Inspection and Cleaning 6--2...........................................

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

i

Table of Contents

Mainframe Removal and Installation Procedures 6--5...............

Equipment Required 6--5..............................................

Install Empty Slot Panel Fillers 6--6.....................................

Blower Assembly 6--7................................................

Removing the Enhanced Monitor Board 6--10..............................

Power Supply 6--12...................................................

Mainframe Cover 6--13................................................

Card Guides 6--14....................................................

Nut Rails 6--16.......................................................

Temperature Sense Board 6--17..........................................

EMI DIN Shields 6--19................................................

Backplane 6--20......................................................

Special Configuration Options 6--23......................................

Benchtop Controller Removal and Installation Procedures 6--25.......

Equipment Required 6--25..............................................

Replaceable Hard Disk Drive 6--26.......................................

Injector/Ejector Handles 6--28...........................................

Covers 6--29.........................................................

Front Panel and Hard Disk Drive Interface Board 6--30.......................

Fixed Hard Drive 6--34................................................

CD-ROM Drive 6--36.................................................

Button Battery 6--37..................................................

Main Memory 6--38...................................................

Floppy Disk Drive 6--39...............................................

Expansion Module Removal and Installation Procedures 6--45.........

Equipment Required 6--45..............................................

Ejector Handles 6--46.................................................

Expansion Module Cover 6--47..........................................

Expansion Module Circuit Board 6--48....................................

Soldered-On Components 6--49..........................................

Troubleshooting 6--51...........................................

Service Level 6--52...................................................

Check for Common Problems 6--52......................................

Isolating System Problems 6--56.........................................

Eliminate other Problem Sources 6--59....................................

Diagnostics 6--59.....................................................

BIOS Error Messages 6--62.............................................

TLA Startup Sequence 6--65............................................

Troubleshoot the Benchtop Controller 6--66................................

Troubleshoot the Mainframe 6--68.......................................

Troubleshoot the Expansion Mainframe 6--71..............................

Adjustments after Repair 6--72..........................................

Repackaging Instructions 6--73...................................

Packaging 6--73......................................................

Shipping to the Service Center 6--73......................................

Options

ii

Service Options 7-- 1..................................................

Product Options 7--2.................................................

Power Cord Options 7--2..............................................

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Electrical Parts List
Diagrams
Mechanical Parts List

Table of Contents

Parts Ordering Information 10--1.........................................

Using the Replaceable Parts List 10--2....................................

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

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Table of Contents

List of Figures

Figure 1--1: Dimensions of the benchtop and expansion mainframe 1--15

Figure 1--2: Dimensions of the benchtop and expansion mainframe

with rackmount option 1--16..................................

Figure 2--1: Power cord identification chart 2--2....................

Figure 2-- 2: Front view of the benchtop chassis with a benchtop

controller 2--3.............................................

Figure 2-- 3: Rear view of the benchtop chassis 2-- 4..................

Figure 2--4: Passive monitor connector 2--5........................

Figure 2-- 5: Rear view of the enhanced monitor 2-- 8.................

Figure 2-- 6: Enhanced monitor board jumpers 2-- 9.................

Figure 2--7: Enhanced monitor board flash jumper 2--10.............

Figure 2-- 8: Enhanced Monitor RS-232 connector 2-- 11...............

Figure 2--9: Front view of the benchtop controller 2--16...............

Figure 2--10: Front view of the benchtop controller 2--22..............

Figure 3-- 1: Interconnection and block diagram for the benchtop

mainframe and controller 3--2................................

Figure 3--2: Mainframe block diagram 3--5........................

Figure 3--3: Benchtop and expansion mainframe block diagram 3--8...

Figure 4--1: Calibration/certification procedure flow chart 4--2.......

Figure 4--2: Benchtop and expansion mainframe 25-pin rear panel

connector 4--7.............................................

Figure 6--1: Installing the empty slot panel fillers 6--6...............

Figure 6--2: Location of blower assembly screws 6--8................

Figure 6--3: Removing the blower assembly 6--9....................

Figure 6--4: Removing the blower 6--9............................

Figure 6--5: Removing the enhanced monitor board 6--10.............

Figure 6-- 6: Removing the power supply 6-- 12.......................

Figure 6--7: Removing the mainframe cover 6--13....................

Figure 6--8: Removing the top and bottom card guides 6--15...........

Figure 6--9: Replacing the top and bottom nut rails 6--16.............

Figure 6--10: Removing the temperature sense board 6--18............

Figure 6--11: Removing the backplane EMI DIN shields 6--19..........

Figure 6--12: Removing the backplane 6--21........................

Figure 6-- 13: Soft power down jumper setting 6-- 22..................

Figure 6--14: Power switch connectors 6--24.........................

Figure 6--15: Removing the replaceable hard disk drive 6--26..........

iv

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table of Contents

Figure 6--16: Removing the hard disk drive from the cartridge 6--27....

Figure 6--17: Removal and installation of the ejectors 6--28............

Figure 6--18: Removing and installing the left and rear covers 6--29....

Figure 6--19: Removing and installing the front panel hardware 6--31...

Figure 6--20: Removing screws from the front and sides of the

controller 6--32.............................................

Figure 6--21: Removing and installing the fixed hard disk drive and

CD-ROM drive 6--35........................................

Figure 6--22: Removal and installation of the button battery and

memory 6--37...............................................

Figure 6--23: Removing the processor and interface boards 6--40.......

Figure 6--24: Separating the processor and interface boards 6--41......

Figure 6-- 25: Removing the floppy disk drive from the interface

board 6--42.................................................

Figure 6--26: Removal and installation of the ejector handles 6--46.....

Figure 6--27: Removal and installation of the cover 6--47..............

Figure 6--28: Removing the circuit board 6--48.....................

Figure 6--29: ResMan32 program output 6--58......................

Figure 6--30: Startup sequence 6--66...............................

Figure 6--31: Benchtop controller troubleshooting tree 6--68...........

Figure 6--32: Mainframe troubleshooting tree 6--70..................

Figure 9--1: Interconnection diagram 9--1.........................

Figure 9--2: Benchtop mainframe block diagram 9--2...............

Figure 9--3: Benchtop and expansion mainframe block diagram 9--3..

Figure 10--1: Cabinet and chassis assembly 10--7....................

Figure 10--2: Circuit boards and chassis parts 10--9..................

Figure 10--3: Power supply, monitor, and fan assembly 10--11..........

Figure 10--4: Benchtop controller explod ed view (covers and

handles) 10--13..............................................

Figure 10--5: Benchtop controller explod ed view (internal parts) 10--15..

Figure 10--6: Expansion module exploded view 10--17.................

Figure 10--7: Expansion module exploded view 10--19.................

Figure 10--8: IView cables 10--19...................................

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

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Table of Contents

List of Tables

Table i: Tektronix Logic Analyzer Family Documentation xv.......

Table 1 --1: Benchtop controller characteristics 1-- 3.................

Table 1--2: Front panel characteristics 1--5........................

Table 1 --3: Backplane interface 1--6..............................

Table 1--4: External signal interface 1--7..........................

T able 1--5: Backplane latencies 1--9..............................

Table 1--6: Benchtop and expansion mainframe AC power source 1--11.

Table 1--7: Benchtop and expansion mainframe secondary power 1--11..

Table 1--8: Benchtop and expansion mainframe cooling 1--12.........

T able 1--9: Atmospheric characteristics 1--13.......................

T able 1--10: Mechanical characteristics 1--14.......................

Table 1--11: Certifications and compliances 1--16....................

Table 2 --1: Passive monitor connector pinouts 2-- 6..................

Table 2--2: RS-232 pin connector 2--11.............................

Table 2 --3: P1 connector pinouts 2-- 13............................

Table 2--4: P2 connector pinouts for slots 1 -- 12 2--14................

Table 2 --5: P2 connector pinouts for slot 0 2-- 15.....................

Table 2--6: Mouse port pin assignments 2--17.......................

Table 2--7: Keyboard port pin assignments 2--17....................

Table 2--8: PC CardBus32 port pin assignments 2--19................

Table 2--9: USB pin assignments 2--19.............................

Table 2--10: SVGA OUT pin assignments 2--20.....................

Table 2 --11: RS-232 Port pin assignments 2-- 20.....................

Table 2--12: LPT port pin assignments 2--21........................

Table 4 --1: Test equipment 4--3..................................

Table 4--2: Functional verification procedures 4--3.................

T able 4--3: Performance verification procedures 4--6................

Table 4 --4: Power supply voltages at the 25-pin connector 4-- 7........

T able 6--1: External inspection check list 6--3......................

T able 6--2: Internal inspection check list 6--4......................

Table 6 --3: Equipment required to service the mainframes 6 --5.......

Table 6 --4: Enhanced monitor board jumpers 6--11..................

Table 6--5: Mainframe backplane jumpers 6--22.....................

Table 6 --6: Equipment required to service the benchtop controller 6-- 25.

Table 6--7: Signal wire identification 6--43.........................

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TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table of Contents

Table 6 --8: Equipment required to service the expansion module 6-- 45..

Table 6--9: Failure symptoms and possible causes 6--53...............

Table 6 --10: Command line options for ResMan32 6-- 57..............

Table 6--11: Power-on diagnostic tests 6--60.........................

Table 6 --12: BIOS error codes and explanations 6-- 62................

Table 7 --1: TLA721 Service Options 7--1..........................

Table 7 --2: TLA7XM Service Options 7--1.........................

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

vii

Table of Contents

viii

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.

Only qualified personnel should perform service procedures.

While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.

ToAvoidFireor

Personal Injury

Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.

Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.

Ground the Product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.

Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.

Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.

Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.

Use Proper Fuse. Use only the fuse type and rating specified for this product.

Avoid Exposed Circuitry. Do not touch exposed connections and components

when power is present.

Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.

Do Not Operate in Wet/Damp Conditions.

Do Not Operate in an Explosive Atmosphere.

Keep Product Surfaces Clean and Dry.

Provide Proper Ventilation. Refer to the manual’s installation instructions for

details on installing the product so it has proper ventilation.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

ix

General Safety Summary

Symbols and Terms

Terms in this Manual. These terms may appear in this manual:

WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.

CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.

Terms on the Product. These terms may appear on the product:

DANGER indicates an injury hazard immediately accessible as you read the
marking.

WARNING indicates an injury hazard not immediately accessible as you read the
marking.

CAUTION indicates a hazard to property including the product.

Symbols on the Product. The following symbols may appear on the product:

CAUTION

Refer to Manual

WARNING

High Voltage

Protective Ground

(Earth) Terminal

x

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service

procedures.

Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.

Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.

Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.

To avoid electric shock, do not touch exposed connections.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

xi

Service Safety Summary

xii

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Preface

Manual Structure

This is the service manual for the TLA721 Benchtop Mainframe and the
TLA7XM Expansion Mainframe. Read this preface to learn how this manual is
structured, what conventions it uses, and where you can find other information
related to servicing this product. Read the Introduction following this preface for
safety and other important background information needed before using this
manual for servicing this product.

This manual is divided into chapters, which are made up of related subordinate
topics. These topics can be cross referenced as sections.

Be sure to read the introductions to all procedures. These introductions provide
important information needed to do the service correctly, safely, and efficiently.

A brief description of each chapter follows:

H Specifications contains a product description of the instrument and tables of

the characteristics and descriptions that apply to it.

H Operating information includes basic controls and connectors on the

instrument. It also provides a high-level overview of the operating system
and application interface. Refer to the Tektronix Logic Analyzer Family User
Manual for detailed information on the operating system and for installation
information not found in this document.

H Theory of Operation contains a high-level overview of the basic operation of

the instrument to help you service the instrument to a module level.

H Performance Verification contains the performance verification and

certification procedures for the instrument.

H Adjustments notes that there are no adjustments for the instrument. For

adjustment information on the product modules, refer to the appropriate
service module manual.

H Maintenance contains information and procedures for doing preventative and

corrective maintenance on the instrument. Included are instructions for
cleaning, for removal and installation of replaceable parts, and for trouble­shooting product failures. Instructions for shipping the instrument are
included in this chapter.

H Options contains information on factory installed options and accessories

that may be purchased for your instrument.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

xiii

Preface

Manual Conventions

H Diagrams contains block diagrams of the instrument and interconnection

diagrams useful for isolating failures in the instrument.

H Mechanical Parts List includes tables of all replaceable parts for the

instrument along with the Tektronix part number.

This manual uses certain conventions that you should become familiar with
before attempting service.

Mainframes

Modules

Replaceable Parts

Safety

This manual covers at least two different kinds of mainframes. The benchtop
mainframe consists of a mainframe with a benchtop controller module. Other
slots are available for installing logic analyzer (LA) modules, digitizing
oscilloscope (DSO) modules, or pattern generator (Patgen) modules. The
expansion mainframe consists of a mainframe with an expansion controller
module. Expansion mainframes are used to expand the capabilities of a single
TLA700 Logic Analyzer.

Throughout this manual, the term module refers to a TLA700 Series Logic
Analyzer, DSO unit, or pattern generator unit that mounts inside the mainframe.
A module is composed of circuit cards, interconnecting cables, and a user-acces­sible front panel enclosed in a mechanical frame.

This manual refers to any field-replaceable assembly or mechanical part
specifically by its name or generically as a replaceable part. In general, a
replaceable part is any circuit board or assembly, such as the hard disk drive, or a
mechanical part, such as the I/O port connectors, that is listed in the replaceable
parts list.

Symbols and terms related to safety appear in the Service Safety Summary found
at the beginning of this manual.

Related Manuals

xiv

The following manuals are available as part of the Tektronix Logic Analyzer
Family documentation set. The procedures in this manual assume that the service
personnel have access to all manuals listed in the following table. Other manuals
may exist outside of the table as the product line offerings change. Contact your
local Tektronix Service Representative for the latest part numbers of the service
documentation. You can also obtain part numbers from the online help for the
instrument.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table i: Tektronix Logic Analyzer Family Documentation

Manual name Description Service use

Preface

The Tektronix Logic Analyzer Family User
Manual

The TLA715 Portable Mainframe Service
Manual.

The TLA7Nx/TLA7Px/TLA7Qx Logic
Analyzer Module Service Manual.

The TLA7Dx/TLA7EX Digitizing Oscillo­scope Module Service Manual.

The TLA7PG2 Pattern Generator Module
Service Manual.

Provides basic operation and installation
information for the Tektronix Logic Analyzer
Family.

Provides service information for the
TLA715 Portable Mainframe.

Provides service information for the logic
analyzer modules.

Provides service information for the DSO
modules.

Provides service information for the pattern
generator modules.

Installation and removal of LA, DSO, and
pattern generator modules as well as the
mainframes.

Reinstallation of the system and application
software.

Isolating and correcting failures in the
portable mainframe and expansion
mainframes.

Isolating and correcting failures in the logic
analyzer module.

Performing periodic or after-repair function­al or performance verifications, calibrations,
and certifications for the logic analyzer
modules.

Performing periodic or after-repair adjust­ments for the logic analyzer modules.

Isolating and correcting failures in the DSO
module.

Performing periodic or after-repair function­al or performance verifications, calibrations,
and certifications for the DSO modules.

Performing periodic or after-repair adjust­ments for the DSO modules.

Isolating and correcting failures in the
pattern generator module.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Performing periodic or after-repair function­al or performance verifications, calibrations,
and certifications for the pattern generator
modules.

xv

Preface

xvi

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Introduction

This manual contains information needed to properly service the portable
mainframe. This introduction contains information critical to safe and effective
servicing.

To prevent personal injury or damage to the instrument, consider the following
requirements before attempting service:

H Read the General Safety Summary and Service Safety Summary found at the

beginning of this manual.

H Read the Operating Basics chapter for information on the controls,

connectors, and operating system. This information is useful before servicing
the instrument.

H The procedures in this manual may only be performed by a qualified service

person.

Be sure to follow all warnings, cautions and notes.

Adjustment and Certification Interval

Service Strategy

Generally, you should perform the adjustments and certification (calibration)
once per year, or following repairs that may affect adjustment or calibration.

This manual supports and contains information needed for periodic maintenance
of the mainframe. It supports and contains information for corrective mainte­nance of this product:

H supports isolation of faults to the failed circuit board or assembly level

shown in the Replaceable Parts List

H supports removal and replacement of boards or assemblies

H supports removal and replacement of the fuse, knobs, chassis, and other

mechanical parts listed in the parts lists

This manual does not support component-level fault isolation and replacement.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

xvii

Introduction

Service Offerings

Tektronix provides service to cover repair under warranty as well as other
services that are designed to meet your specific service needs.

Whether providing warranty repair service or any of the other services listed
below, Tektronix service technicians are equipped to service the instrument.
Services are provided at Tektronix Services Centers and on-site at your facility,
depending on your location.

Warranty Repair Service

Calibration and Repair

Service

Tektronix warrants this product for one year from date of purchase. The warranty
is located behind the title page in this manual. Tektronix technicians provide
warranty service at most Tektronix service locations worldwide. The Tektronix
product catalog lists all service locations worldwide.

In addition to warranty repair, Tektronix Service offers calibration and other
services which provide solutions to your service needs and quality standards
compliance requirements.

The following services can be tailored to fit your requirements for calibration
and/or repair of your portable mainframe.

Service Options. Tektronix Service Options can be selected at the time you
purchase your instrument. You select these options to provide the services that
best meet your service needs.

Service Agreements. If service options are not added to the instrument purchase,
then service agreements are available on an annual basis to provide calibration
services or post-warranty repair coverage. Service agreements may be custom­ized to meet special turn-around time and/or on-site requirements.

Service on Demand. Tektronix offers calibration and repair services on a
“per-incident” basis that is available with standard prices.

xviii

Self Service. Tektronix supports repair to the replaceable-part level by providing

for circuit board exchange.

Use this service to reduce down-time for repair by exchanging circuit boards for
remanufactured ones. Tektronix ships updated and tested exchange boards. Each
board comes with a 90-day service warranty.

For More Information. Contact your local Tektronix service center or sales
engineer for more information on any of the Calibration and Repair Services just
described.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Contacting Tektronix

Introduction

Phone [phone]*

Address Tektronix, Inc.

Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA

Web site www.tektronix.com

Sales support 1-800-833-9200, select option 1*

Service support 1-800-833-9200, select option 2*

Technical support Email: [e-mail]

1-800-833-9200, select option 3*
1-503-627-2400

6:00 a.m. -- 5:00 p.m. Pacific time

* This phone number is toll free in North America. After office hours, please leave a

voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

xix

Introduction

xx

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Specifications

Product Description

This chapter provides a brief product description and lists the warranted
characteristics, nominal traits, and typical characteristics of the TLA721
Benchtop Mainframe and the TLA7XM Expansion Mainframe.

Both the benchtop mainframe and the expansion mainframes are basically
identical with the exception of the controllers. The benchtop mainframe includes
a PC controller that controls the entire instrument. The expansion mainframe
includes an expansion module that expands the capabilities of a benchtop
mainframe or a TLA715 Portable Mainframe. Each mainframe can function as a
logic analyzer, a digital storage oscilloscope, or a pattern generator, depending
on the module cards installed in its slots.

Benchtop Mainframe

The benchtop mainframe comprises of a benchtop chassis and the benchtop
controller. The benchtop controller is a Pentium III based, three-wide, C-size,
embedded Slot-0 Controller that incorporates the same controller as the TLA715
Portable Mainframe. The benchtop chassis is based on the high power, 13-slot,
VX1420A Mainframe without a readout and with additional labels.

The benchtop mainframe has the following key features:

H Microsoft Windows operating system

H Ten slots (excluding three slots for the benchtop controller) for compatibility

with new and existing LA, DSO, and patgen modules

H Personal computer (PC) based processor architecture that provides a cost

effective, high-performance, system controller with automatic “PC connec­tivity” to a multitude off-the-shelf devices (such as Ethernet, modem,
printers) via standard PC I/O ports and two PC card (CardBus) slots

H High-performance PC-based display system capable of driving large,

high-resolution, external monitors in multiple user selected formats via an
external SVGA port

H Easy configuration of modules between slots and mainframes through the

automatic system configuration support of the resource manager and
application software

H Precision clock, trigger line, and event signaling between the mainframe and

modules for real-time triggering, sequencing, and correlation of events

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 1

Specifications

H Easy access to field replaceable units (FRUs) to provide a low mean-time-to-

repair (MTTR) for exchange modules

H Fan airflow capacity to support a reduction in audible noise levels

H Mainframe compatible with international power standards, certified to

international safety and EMC requirements, and tested to rugged environ­mental standards

H 100% hardware and software compatibility with the TLA715 Portable

Mainframe, allowing you to transport modules, data, and end-user applica­tion programs between mainframes

Expansion Mainframe

Characteristic Tables

The expansion mainframe comprises of a benchtop chassis and the expansion
module. The expansion module is a single-wide, C-size, modules that provides
cable connections to a benchtop mainframe or to a portable mainframe.

The expansion mainframe has the following key features:

H Microsoft Windows operating system

H 12 slots (excluding one slot for the expansion module) for compatibility with

new and existing LA, DSO, and patgen modules

H Precision clock, trigger line, and event signaling between the mainframe and

modules for real-time triggering, sequencing, and correlation of events

H Easy access to field replaceable units (FRUs) to provide a low mean-time-to-

repair (MTTR) for exchange modules

H Fan airflow capacity to support a reduction in audible noise levels

H Mainframe compatible with international power standards, certified to

international safety and EMC requirements, and tested to rugged environ­mental standards

1- 2

This section contains the specifications for the portable mainframe. All
specifications are warranted unless noted “typical”. Typical characteristics
describe typical or average performance and provide useful reference informa­tion. Specifications marked with the n symbol are checked in the Performance
Verification chapter in this manual.

The specifications listed in this section are valid under the following conditions:

H The instrument must reside in an environment with temperature, altitude,

and humidity, within the operating limits described in Table 1--9 beginning
on page 1--13.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

H The instrument has has a warm-up period of at least 20 minutes.

Tables 1--1 through 1--2 list the specifications for the TLA721 Benchtop
Controller.

Table 1- 1: Benchtop controller characteristics

Characteristic Description

Operating system Microsoft Windows 2000

Microprocessor Intel 733 MHz Pentium III configuration with an Intel 815E chip-set

Main memory Two 144 pin SODIMM sockets support one or two SDRAM modules

Available configurations 16, 32, 64, 256 MB per SODIMM

Installed configuration 512 MB maximum configuration

Speed 133 MHz

CAS latency 2, 3

RAS to CAS delay 2, 3

Specifications

RAS precharge 2, 3

DRAM cycle time 5/7 or 7/9

Cache memory 512 KB, level 2 (L2) write-back cache

Flash BIOS 512 KB

Provides PC plug-and-play services with and without
Microsoft Windows operating system.

Flash based BIOS field upgradable via a floppy disk

Forced recovery jumper is provided

Real-time clock and CMOS setups NVRAM Real-time clock/calendar. Standard and advanced PC CMOS setups: see BIOS

specifications

RTC, CMOS setup, & PnP NVRAM retention
time (Typical)

Floppy disk drive Standard 3.5 inch, 1.44 MB, high-density, double-sided, PC-compatible high-density

Transfer rate 500 Kbits per second

Access time (ave.) 194 ms

Bootable replaceable hard disk drive Standard PC compatible IDE (Integrated device Electronics) hard disk drive residing

Size Maximum 30 GByte

Battery life is typically > 7 years

floppy disk drive

on an EIDE interface

Continually subject to change due to the fast-moving PC component environment

These storage capacities valid at product introduction

Interface ATA-5/Enhanced IDE (EIDE)

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 3

Specifications

Table 1- 1: Benchtop controller characteristics (Cont.)

Characteristic Description

Average seek time Read 12 ms

I/O data-transfer rate 33.3 MB/s maximum (U-DMA mode 2)

Average latency 7/14 ms

Cache buffer 512 KB

CD ROM drive Standard PC compatible IDE (Integrated device Electronics)

24X (minimum) CD ROM drive residing on an EIDE interface

Continually subject to change due to the fast-moving PC component environment

Applicable formats CD-DA; CE-ROM Mode 1, Mode 2; CD-ROM XA Mode 2 (Form 1, Form 2); Photo CD

(single/multi session); Enhanced CD

Interface IDE (ATAPI)

Average access time 130 ms

Data-transfer rate (burst sustained) 16.7 MB per second maximum, 1290--3000 KB per second

Display classification Standard PC graphics accelerator technology (bitBLT based) residing on t he

Peripheral Component Interconnect (PCI) bus capable of supporting external color
VGA, SVGA, or XGA monitors

Display configuration Hardware automatically senses a missing flat panel LCD in the benchtop mainframe

and defaults to the external SVGA monitor output during the BIOS boot sequence (no
internal TFT LCD display exists). This is indicated by a singl e beep during the boot
sequence.

Dynamic Display Configuration 1 (DDC1) support for the external monitor is provided.

Display memory 4 MB SDRAM is on board the video controller; there is no external video memory

Display drive One VGA, SVGA, or XGA compatible analog output port

Display size User selected via Microsoft Windows

Plug and Play support for DDC1 and DDC2 A and B

(Primary with Silicon Motion Chip)
Resolution (Pixels) Colors Refresh Rates
640 x 480 256, 64 K, 16.8 M 60, 75, 85
800 x 600 256, 64 K, 16.8 M 60, 75, 85
1024 x768 256, 64 K, 16.8 M 60, 75, 85
1280 x 1024 256, 64 K, 16.8 M 60
1600 x 600 256, 64 K 60
1600 x 1200 256, 64 K 60

(Secondary with 815E Chip set)
Resolution (Pixels) Colors Refresh Rates
640 x 480 256, 64 K, 16.8 M 60, 75, 85
800 x 600 256, 64 K, 16.8 M 60, 75, 85
1024 x768 256, 64 K, 16.8 M 60, 75, 85
1280 x 1024 256, 64 K, 16.8 M 60, 75, 85
1600 x 1200 256 60, 75

1- 4

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Specifications

Table 1- 2: Front panel characteristics

Characteristic Description

SVGA output port (SVGA) Two 15-pin sub-D SVGA connectors

Dual USB ports Two USB (Universal Serial Bus) compliant ports

Mouse port Front panel mounted PS2 compatible mouse port utilizing a mini DIN connector

Keyboard port Front panel mounted PS2 compatible keyboard port utilizing a mini DIN connector

Parallel interface port (LPT) 36-pin high-density connector supports standard Centronics mode, Enhanced Parallel

Port (EPP), or Microsoft high-speed mode (ECP)

Serial interface port (COM) 9-pin male sub-D connector to support an RS232 serial port

PC CardBus32 port Standard Type I and II PC compatible PC card slot

Type I, II, and III PC Card Port Standard Type I, II, and III PC compatible PC card slot

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 5

Specifications

Table 1- 3: Backplane interface

Characteristic Description

Slots

Benchtop mainframe 13

Expansion mainframe 13

CLK10 Frequency 10 MHz ±100 PPM

n

Relative Time Correlation Error

LA to LA “MagniVu” data 2 ns

LA to LA “normal” data utilizing an internal clock

LA to LA “normal” data utilizing an external clock 2ns

LA “MagniVu” to DSO data

LA to DSO “normal” data utilizing an internal clock

LA to DSO “normal” data utilizing an external clock

DSO to DSO

3

1,2

3

(Typical)

4

1 LA sample -- 0.5 ns

3ns

3,4

3,5

1 LA sample ± 2ns

3ns

3ns

Enhanced monitor

Voltage readout +24 V, --24 V, +12 V, --12V, +5 V, --5.2 V, --2 V, +5 V

present, and +5 V

External

via RS232

Voltage readout accuracy (Typical) ±3% maximum

Current readout Readout of t he present current on the +24 V, --24 V, +12 V,

--12 V, +5 V, --2 V, --5.2 V rails via RS232

Current readout accuracy (Typical) ±5% of maximum power supply I

mp

Rear panel connector levels ±25 VDC maximum, 1 A maximum per pin

(Provides access for RS-232 host to enhanced monitor)

1

Includes typical jitter, slot-to-slot skew, and probe-to-probe variations to provide a “typical” number for the measure­ment. Assumes standard accessory probes are utilized.

2

For time intervals longer than 1 s between modules, add 0.01% of the difference between the absolute tim e
measurements to the relative time correlation error to account for the inaccuracy of the CLK10 source.

3

The DSO module time correlation is measured at the maximum sample rate on one channel only.

4

Sample represents the time from the event to the next valid data sample at the probe tip of the LA. In the normal
Internal clock mode, this represents the delta time to the next sample clock

5

On this measurement, the DSO is measuring the CLK channel of the LA. If the DSO is measuring a data channel, the
time from when the data edge occurs until the clock edge occurs must be included.

Standby

if

1- 6

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Specifications

Table 1- 4: External signal interface

Characteristic Description

Intermodule signal line bandwidth

Signal 1, 2 (ECLTRG0,1)
Signal 3, 4 (TTLTRG0,1)

System trigger input TTL compatible input via front panel mounted SMB connectors (benchtop controller)

Input destination System trigger (TTLTRG7)

Input Levels

V

IH

V

IL

Input mode Falling edge sensitive, latched (active low)

Minimum pulse width 12 ns

Active period Accepts system triggers during valid acquisition periods via real-time gating, resets system

Maximum input voltage 0 to +5 V peak

External signal input TTL compatible input via front panel mounted SMB connectors (benchtop controller)

Input destination Signal 1, 2 (ECLTRG0,1)

Input levels

V

IH

V

IL

Input mode Active (true) low, level sensitive

Input bandwidth

1

Signal 1, 2 (ECLTRG0,1)
Signal 3, 4 (TTLTRG0,1)

Active period Accepts signals during valid acquisition periods via real-time gating

Maximum input voltage 0 to +5 V peak

System trigger output TTL compatible output via front panel mounted SMB connectors (benchtop controller)

Source selection System trigger (TTLTRG7)

Source mode Active (true) low, falling edge latched

Active period Outputs system trigger state during valid acquisition period, resets system trigger output to false

Output levels

V

OH

50 MHz square wave minimum
10 MHz square wave minimum

TTL compatible input

≥ 2.0 V
≤ 0.8 V

trigger input latch between valid acquisition periods

Signal 3, 4 (TTLTRG0,1)

TTL compatible input

≥ 2.0 V
≤ 0.8 V

50 MHz square wave minimum
10 MHz square wave minimum

state between valid acquisitions via software

50 Ω back terminated TTL-compatible output

≥4 V into open circuit
≥ 2Vinto50Ω to ground

V

OL

≤ 0.7Vsinking10ma

Output protection Short-circuit protected (to ground)

External signal output TTL compatible outputs via front panel mounted SMB connectors (benchtop controller)

Source selection Signal 1, 2 (ECLTRG0,1)

Signal 3, 4 (TTLTRG0,1)
10 MHz clock

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 7

Specifications

Table 1- 4: External signal interface (Cont.)

Characteristic Description

Output modes

Level sensitive

Output levels

V

OH

User definable
Active (true) low or active (true) high

50 Ω back terminated TTL output

≥ 4 V into open circuit
≥ 2Vinto50Ω to ground

V

OL

Output bandwidth

2

Signal 1, 2 (ECLTRG0,1)
Signal 3, 4 (TTLTRG0,1)

≤ 0.7Vsinking10ma

50 MHz square wave minimum
10 MHz square wave minimum

Active period Outputs signals during valid acquisition periods, resets signals to false state between valid

acquisitions

Outputs 10 MHz clock continuously

Output protection Short-circuit protected (to ground)

1

The Input Bandwidth specification only applies to signals to the modules; it does not apply to signals applied to the
External Signal Input and sent back to the External Signal Output.

2

The Output Bandwidth specification only applies to signals from the modules; it does not apply to signals applied to the
External Signal Input and sent back to the External Signal Output.

1- 8

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Specifications

Table 1- 5: Backplane latencies

Characteristic Benchtop mainframe Expansion mainframe

System trigger and external signal input latencies

(Typical)

External system trigger input to LA probe tip

External signal input to LA probe tip via Signal 3, 4

External signal input to LA probe tip via Signal 1, 2

External system trigger input to DSO probe tip

System trigger and external signal output latencies1(Typical)

LA probe tip to external system trigger out 376 ns + SMPL 412 ns + SMPL

LA probe tip to external signal out via Signal 3, 4

OR function 366 ns + SMPL 402 ns + SMPL

AND function 379 ns + SMPL 415 ns + SMPL

LA probe tip to external signal out via Signal 1, 2

2

4

5

5, 6

4

3

3,6

--266 ns --230 ns

--212 ns + Clk --176 ns + Clk

--208 ns + Clk --187 ns + Clk

--25 ns -- 1 1 n s

normal function 364 ns + SMPL 385 ns + SMPL

inverted logic on backplane 364 ns + SMPL 385 ns + SMPL

DSO probe tip to external system trigger out 68 ns 104 ns

DSO Probe tip to external signal out via Signal 3, 4

3

OR function 65 ns 101 ns

AND function 75 ns 111 ns

DSO probe tip to external signal out via Signal 1, 2

3,6

normal function 68 ns 89 ns

inverted logic on backplane 71 ns 92 ns

Inter-module latencies (Typical)

LA to DSO inter-module system trigger (TTLTRG&)

1,4

358 ns + SMPL
(LA: Trigger All Modules
DSO: Wait for System Trigger)

LA to LA inter-module system trigger (TTLTRG7)

1,4

66 ns + SMPL 102 ns + SMPL
(LA2: Trigger All Modules
LA1: Do Nothing)

1,5

1

360 ns + SMPL 396 ns + SMPL

108 ns + SMPL + Clk 144 ns + SMPL + Clk

1,5, 6

116 ns + SMPL + Clk 137 ns + SMPL + Clk

LA to DSO inter-module ARM (TTLTRG2,4,5,6)

LA to LA inter-module ARM (TTLTRG2,4,5,6)

LA to LA inter-module via Signal 1, 2 (ECLTRG0,1)

(LA2: Trigger, then set Signal 2
LA1: If Signal 2 is true, trigger)

LA to LA inter-module via Signal 3, 4 (TTLTRG0,1)

1,5

116 ns + SMPL + Clk 152 ns + SMPL + Clk
(LA2: Trigger, then set Signal 3
LA1: If Signal 3 is true, trigger)

394 ns + SMPL

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 9

Specifications

Table 1- 5: Backplane latencies (Cont.)

Characteristic Expansion mainframeBenchtop mainframe

DSO to LA inter-module System Trigger (TTLTRG7)

(DSO: Trigger all Modules
LA: Do Nothing)

DSO to DSO inter-module System Trigger (TTLTRG7)

(DSO1: Trigger all Modules
DSO2: Wait for System Trigger)

DSO to LA inter-module ARM (TTLTRG2,4,5,6)

DSO to DSO inter-module ARM (TTLTRG2,4,5,6) 59 ns 95 ns

DSO to LA inter-module via Signal 1, 2(ECLTRG0,1)

(DSO: Trigger and set Signal 1
LA: Wait for Signal 1, then Trigger)

DSO to LA inter-module via Signal 3, 4 (TTLTRG0,1)

(DSO: Trigger and set Signal 3
LA: Wait for Signal 3; then Trigger)

1

SMPL represents the time from the event at the probe tip inputs to the next valid data sample of the LA module. In the
Normal Internal clock mode, this represents the delta time to the next sample clock. In the MagniVu Internal clock mode,
this represents 500 ps or less. In the External clock mode, this represents the time to the next master clock generated by
the setup of the clocking state machine, the system-under-test supplied clocks, and the qualification data.

2

All system trigger and external signal input latencies are measured from a falling-edge transition (active true low) with
signals measured in the wired-OR configuration.

3

All signal output latencies are validated to the rising edge of an active (true) high output.

4

In the Waveform window, triggers are always marked immediately except when delayed to the first sample. In the Listing
window, triggers are always marked on the next sample period following their occurrence.

5

“Clk” represents the time to the next master clock at the destination logic analyzer. In the asynchronous (or internal)
clock mode, this represents the delta time to the next sample clock beyond the minimum asynchronous rate of 4 ns. In
the synchronous (or external) clock mode, this represents the time to the next master clock generated by the setup of the
clocking state machine and the supplied system under test clocks and qualification data.

6

Signals 1 and 2 (ECLTRG0, 1) are limited to a “broadcast” mode of operation, where only one source is allowed to drive
the signal node at any one time. That single source may be utilized to drive any combination of destinations.

4

5

5, 6

--240 ns --204 ns

4

50 ns 86 ns

--192 ns + Clk --156 ns + Clk

--179 ns + Clk --158 ns + Clk

5

--184 ns + Clk --148 ns + Clk

1- 10

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Specifications

(

,

v

a

geava

(CombinedSystem,voltageavail-

Table 1- 6: Benchtop and expansion mainframe AC power source

Characteristic Description

Source voltage 90--250 V

100--132 V

Maximum power consumption 1450 W l ine power (the maximum power consumed by a fully loaded 13-slot

instrument)

Fuse rating
(Current and voltage ratings and type of fuse
used to fuse the source line voltage)

45--66 Hz, continuous range CAT II

RMS,

360--440 Hz, continuous range CAT II

RMS,

90 V -- 132 VAC
High-power/Low Line (159-0379-00)

RMS

operation

Safety: UL198G/CSA C22.2
Size: 0.25 in × 1.25 in
Style: Slow acting
Rating: 20 A/250 V

103 V -- 250 VAC
(159-0256-00)

RMS

operation

Safety: UL198G/CSA C22.2
Size: 0.25 in × 1.25 in
Style: No. 59/Fast acting
Rating: 15 A/250 V

207 V -- 250 VAC
(159-0381-00)

RMS

operation

Safety: IEC 127/Sheet 1
Size: 5 mm × 20 mm
Style: Fast acting “F”, high-breaking capacity
Rating: 6.3 A/250 V

Inrush surge current 70 A maximum

Steady state input current 16.5 A

6.3 A

maximum at 90 VAC

RMS

maximum at 207 VAC

RMS

RMS
RMS

Powerfactorcorrection(Typical) 0.99 at 60 Hz operation and 0.95 at 400 Hz operation

ON/Standby switch and indicator Front Panel On/Standby switch with integral power indicator

Table 1- 7: Benchtop and expansion mainframe secondary power

Characteristic Description

n DC Voltage regulation Voltage Minimum Nominal Maximum

Combined System

able at each slot)

olt

+24 V 23.28 V 24.24 V 25.20 V

il-

+12 V

+5 V

-- 2 V

-- 5 . 2 V

-- 1 2 V

11.64 V 12.12 V 12.60 V

4.875 V 5.063 V 5.250 V

--2.10 V --2.00 V --1.90 V

--5.460 V --5.252 V --5.044 V

--12.60 V --12.12 V --11.64 V

-- 2 4 V --25.20 V --24.24 V --23.28 V

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 11

Specifications

Table 1- 8: Benchtop and expansion mainframe cooling

Characteristic Description

Cooling system Forced air circulation system (positive pressurization) using a single low-noise

centripetal (squirrel cage) fan configuration with no filters for the power supply and 13
module slots.

Fan speed control Rear panel switch selects between full speed and variable speed. Slot exhaust

temperature and ambient air temperature are monit ored such that a constant delta
temperature is maintained.

Slot activation Installing a module activates the cooling for the corresponding occupied slots by opening

the air flow shutter mechanism. Optimizes cooling efficiency by only applying airflow to
modules that are installed.

Pressurization Positive pressurization system, all chambers including modules

Slot airflow direction P2 to P1, bottom of module to top of module

Mainframe air intake Lower fan-pack rear face and bottom

Mainframe air exhaust Top-sides and top-rear back. Top rear-back exhaust redirected to the sides by the fan

pack housing to minimize reentry into the intake.

∆ Temperature readout sensitivity 100 mV/°Cwith0°C corresponding to 0 V output

Temperature sense range -- 1 0 °Cto+90°C, delta temperature ≤ 50°C

Clearance 2 in (51 mm), rear, top, and sides

Fan speed readout RPM = 20 ¢ (Tach frequency) or 10  (+Pulse Width)

where (+Pulse Width) is the positive width of the TACH1 fan output signal measured
in seconds

Fan speed range 650 to 2250 RPM

1- 12

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table 1- 9: Atmospheric characteristics

Characteristic Description

Temperature:
Operating and nonoperating

Operating (no media in floppy disk drive):
+5_Cto+50_C, 15_C/hr maximum gradient, non-condensing
(derated 1_C per 1000 ft above 5000 foot altitude
Line voltage derated for temperatures > 40_, maximum output power reduced 15W/_C for line
voltage < 110 VAC)

Nonoperating (no media in floppy disk drive or CD ROM drive):

-- 2 0 _Cto+60_C, 15_C/hr maximum gradient, non-condensing.

Specifications

Relative Humidity:
Operating and nonoperating

Altitude:
Operating and nonoperating

Operating (no media in floppy disk drive or CD ROM drive):
20% to 80% relative humidity, non-condensing. Maxi mum wet bulb temperature: +29_C
(derates relative humidity to approximately 22% at +50_C).

Nonoperating (no media in floppy disk drive or CD ROM drive):
8% to 80% relative humidity, non-condensing. Maxi mum wet bulb temperature: +29_C (derates
relative humidity to approximately 22% at +50_C).

Operating:
To 10,000 ft (3048 m), (derated 1_C per 1000 ft (305 m) above 5000 ft
(1524 m) altitude)

Nonoperating:
40,000 ft (12192 m).

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 13

Specifications

Table 1- 10: Mechanical characteristics

Characteristic Description

Mainframe dimensions (See Figures 1--1 and 1--2 for overall dimensions.)

Standard

Height (with feet) 13.7 in (346.7 mm) including feet

Width 16.7 in (424.2 mm)

Depth 26.5 in (673.1 mm)

Rackmount

Height 13.25 in (336.6 mm)

Width 18.9 in (480.1 mm)

Depth 28.9 in to 33.9 in (734.1 mm to 861.1 mm) in 0.5 in i ncrements, user selectable

Benchtop controller dimensions

Height 10.32 in (262.1 mm)

Width 2.39 in (60.7 mm)

Depth 14.75 in (373.4 mm)

Expansion module dimensions

Height 10.32 in (262.1 mm)

Width 1.25 in (31.75 mm)

Depth 14.75 in (373.4 mm)

Weight

Mainframe with benchtop controller and
slot fillers
(Typical)

Shipping configuration
(Typical)

Benchtop controller 6 lbs 10 oz. (3.0 kg)

Expansion module 3 lbs (1.4 kg)

Maximum per slot 5lbs(2.27kg)

Rackmount kit adder 20 lbs (9.1 kg)

58 lbs 11 oz. (26.7 kg)

60 lbs 11 oz. (26.7 kg) minimum configuration with controller (only) and all standard
accessories (two manuals, five dual-wide and one single-wide slot filler panels, power
cord, empty pouch, front cover, keyboard, software, and cables)

187 lbs (85 kg) fully configured,
Same as above with the addition of five LA modules (four TLA7P4 modules, one
TLA7N4 module) and all module standard accessories (probes and clips)

Size

Benchtop controller Three slots wide

Expansion module Single slot wide

1- 14

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Specifications

Table 1- 10: Mechanical characteristics (Cont.)

Characteristic Description

Acoustic noise level (Typical)

Variable fan speed (at 860 RPM) 43.2 dBA weighted (front)

43.8 dBA weighted (back)

Full speed fan (switched at rear) 66.2 dBA weighted (front)

66.2 dBA weighted (back)

Construction materials Chassis parts, aluminum alloy

Front panel and trim pieces, plastic
Circuit boards, glass laminate

Finish type Mainframes are Tektronix silver gray with dark gray trim on fan pack and bottom feet

support rails.
Benchtop controllers are Tektronix silver gray on front lexan and injector/ejector
assemblies with a black FDD and PC card ejector buttons

16.7 in

(42.4 cm)

13.7 in

(35 cm)

13.3 in

(34 cm)

Figure 1- 1: Dimensions of the benchtop and expansion mainframe

26.5 in

(67 cm)

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 15

Specifications

g

18.9 in
(48 cm)

13.25 in

(33.66 cm)

28.9in(73.4cm)Minto

33.9 in (86.1 cm) Max

Figure 1- 2: Dimensions of the benchtop and expansion mainframe with rackmount option

Table 1- 11: Certifications and compliances

Category Standards or description

EC Declaration of Conformity -­EMC

Meets intent of Directive 89/336/EEC for Electromagnetic Compatibility. Compliance was
demonstrated to the following specifications as listed in the Official Journal of the European
Communities:

EN 61326 EMC requirements for Class A electrical equipment for

measurement, control and laboratory use.

1

IEC 61000--4--2 Electrostatic discharge immunity (Performance criterion B)
IEC 61000--4--3 RF electromagnetic field immunity (Performance criterion A)
IEC 61000--4--4 Electrical fast transient / burst immunity (Performance criterion B)
IEC 61000--4--5 Power line surge immunity (Performance criterion B)
IEC 61000--4--6 Conducted RF immunity (Performance criterion A)
IEC 61000--4--11 Voltage dips and interruptions immunit y (Performance criterion B)

EN 61000--3--2 AC power line harmonic emissions

Australia / New Zealand
Declaration of Conformity-­EMC

EC Declaration of Conformity -­Low Voltage

Complies with EMC provision of Radiocommunications Act per the following standard(s):

AS/NZS 2064.1/2 Industrial, Scientific, and Medical Equipment: 1992

Compliance was demonstrated to the following specification as listed in the Official Journal of the
European Communities:

Low Voltage Directive 73/23/EEC, amended by 93/68/EEC

EN 61010-1/A2:1995 Safety requirements for electrical equipment for measurement

control and laboratory use.

Canadian Certification CAN/CSA C22.2 No. 1010.1 Safety requirements for electrical equipment for measurement,

control, and laboratory use.

1

Emissions which exceed the levels required by this standard may occur when this equipment is connected to a test
object.

1- 16

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table 1- 11: Certifications and compliances (Cont.)

g

y

Category Standards or description

Specifications

Installation (Overvoltage)
Category

Pollution Degree A measure of the contaminates that could occur in the environment around and within a product.

Safety Certification Compliance

Equipment Type Test and measuring

Safety Class Class 1 (as defined in IEC61010-1, Annex H) -- grounded product

Overvoltage Category Overvoltage Category II (as defined in IEC61010-1, Annex J)

Pollution Degree Pollution Degree 2 (as defined in IEC61010-1). Note: Rated for i ndoor use only.

Terminals on this product may have different installation (overvoltage) category designations. The
installation categories are:

CAT III Distribution-level mains (usually permanently connected). Equipment at this level is

typically in a fixed industrial location.

CAT II Local-level mains (wall sockets). Equipment at this level includes appliances, portable

tools, and similar products. Equipment is usually cord-connected.

CAT I Secondary (signal level) or battery operated circuits of electronic equipment.

Typically the internal environment inside a product is considered to be the same as the external.
Products should be used only in the environment for which they are rated.

Pollution Degree 2 Normally only dry, nonconductive pollution occurs. Occasionally a

temporary conductivity that is caused by condensation must be
expected. This location is a typical office/home environment.
Temporary condensation occurs only when the product is out of
service.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

1- 17

Specifications

1- 18

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

This chapter contains high-level information about operating the TLA721
Benchtop Mainframe and the TLA7XM Expansion Mainframe. It also provides
information on the controls and connectors on the instrument. The last part of the
chapter contains information on SCPI commands that you can use to service the
mainframe from a remote host.

Installation

Complete installation procedures are described in the Tektronix Logic Analyzer
Family User Manual; refer to that manual for detailed installation instructions.

Install any modules that are required for your application before applying power
to the instrument.

If you are operating the instrument on a bench (without a rackmount) ensure a
two-inch (5.1 cm.) clearance around the instrument for proper cooling.

CAUTION. Connect the keyboard, mouse, and other accessories before applying
power to the instrument.

Selecting the Correct

Power Cord and Fuse

Connecting accessories after applying power to the instrument can damage the
instrument or the accessories.

The mainframe comes standard with two power cords and three fuses. Before
installing the instrument you must determine the correct fuse and power cord for
your application. If you are uncertain of the power requirements of the instru­ment, refer to Power Cord and Line Fuse Requirements for the Benchtop and
Expansion Mainframes in the Tektronix Logic Analyzer Family User Manual.
This information is important to avoid overloading the power distribution system
and to comply with the National Electrical Code.

For card cage loads in the nonshaded region of Figure 2--1, use the power cord
with the 15 A plug (Tektronix part number 161-0213-XX) or the power cord
with the 20 A plug (Tektronix part number 161-0218-XX). For high card cage
loads combined with low input line voltages (shaded region), use only the power
cord with the 20 A plug.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

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Operating Information

Select the proper fuse based on the ranges shown in Figure 2--1.

Power-on Procedure

Power Cord with 20A plug (NEMA 5--20P) O NLY!

Power Cord with 15A plug (NEMA 5--15P)
Power Cord with 20A plug (NEMA 5--20P)

130 150 170 190 210 230 250

Input Line Voltage (Volts AC)

6.3AF Fuse

Card Cage Power Consumption (Watts)

800

700

600

500

400

300

200

100

0

90 110

20AT Fuse

115

15AF Fuse

Figure 2- 1: Power cord identification chart

Complete the following steps to power on the instrument.

1. If you have not already done so, select the proper power cord and fuse as
described in the previous paragraphs.

2. If you have an expansion mainframe, connect the expansion mainframe to
the benchtop mainframe as described in the Tektronix Logic Analyzer Family
User Manual.

2- 2

3. Connect the external monitor.

4. Power on the monitor.

5. Press the On/Standby switch to turn on the mainframe (if you have an

expansion mainframe attached, it should automatically power on when you
turn on the benchtop mainframe.

6. Wait for the instrument to complete the power-on self tests, start Windows,
and start the logic analyzer application.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Mainframe Controls and Connectors

Figure 2--2 shows the front view of the benchtop mainframe with a benchtop
controller installed. The benchtop mainframe and the expansion mainframe are
basically identical with the exception of the front panel labels. Slots 3 through 11
are labeled on the top and bottom of the instrument. Slots 0, 1 and 2 are reserved
for the three slot-wide controller, all other slots are available for any other
TLA700 Series module.

When you install a module, shutters on the bottom of each slot automatically
open to provide cooling.

Operating Information

Figure 2- 2: Front view of the benchtop chassis with a benchtop controller

On/Standby Switch

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

The On/Standby switch on the top-left corner of the front panel applies DC
voltages to the mainframe. The switch is a momentary contact switch. The
switch is lighted when DC voltages are applied to the instrument.

2- 3

Operating Information

AC Power

Figure 2--3 shows the rear view of the mainframe along with some of the key
connectors.

25-Pin PASSIVE
MONITOR connector

Fan speed switch

Fuse

AC Power Connector

Chassis Ground Screw

Fan Speed Switch

Passive Monitor

Connector

Figure 2- 3: Rear view of the benchtop chassis

The AC power connector is located on the rear bottom left side of the instru­ment. The AC fuse holder is located just above the power connector.

The chassis ground screw can be used to connect more than one instrument to a
common ground point.

The fan speed switch controls the speed of the fan (blower). When the switch is
set to the VAR (variable) position, the mainframe automatically controls the
speed of the blower depending on the air temperature and amount of cooling
required by the modules. When the switch is in the FULL position, the blower
operates at full speed.

The 25-pin Sub-D connector lets you monitor the power supply voltages, fan
speed, and the maximum slot temperature rise within the mainframe.

The connector also provides remote on and off capability and access to the SYS­RESET* and ACFAIL* signals.

Figure 2--4 shows the location of the Passive Monitor Connector. Table 2--1 lists
the pin out of the Passive Monitor Connector and its function.

2- 4

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Pin 1

Pin 25

Operating Information

Figure 2- 4: Passive monitor connector

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 5

Operating Information

Table 2- 1: Passive monitor connector pinouts

Pin Function Description

1 +5 VM +5 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

2 -- 1 2 V M --12 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

3 -- 2 4 V M --24 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

4 -- 2 V M --2 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

5 ON/ST Remote On/Standby Power Switch.

6 +5 VC +5 V output for charging batteries, running external TTL circuitry,

1Amaximum

7 +12 VC +12 V output for charging batteries, running external TTL circuitry,

1Amaximum

1

8 +5 VB Input for +5 V standby voltage (for example, from an external

battery). Maximum of 1 A total (pins 8 and 21 combined)

2

9 GND Logic Ground

10 SYSRESET* Backplane SYSRESET* signal (input or output). If you use this pin,

do not violate VXIbus electrical specifications (keep the extender
cable as short as possible).

11 ∆T An analog output signal proportional to the maximum temperature

rise of the 13 modules (100 mV/°C) 0V=0°C

12 TACH1 A square wave output signal whose period is proportional to the

speed of fan number 1

13 TACH2 A square wave output signal whose period is proportional to the

speed of fan number 2 when a second fan is used. In the current
mainframe only a single fan is used.

14 +12 VM +12 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

15 +24 VM +24 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

16 -- 5 . 2 V M --5.2 V for voltage monitoring

To monitor, only use a probe with greater than 1 MΩ impedance.

17 GND Logic Ground

18 GND Logic Ground

2- 6

19 GND Logic Ground

20 GND Logic Ground

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

Table 2- 1: Passive monitor connector pinouts (Cont.)

Pin DescriptionFunction

21 +5 VB Input for +5 V standby voltage (for example, from an external

battery). Maximum of 1 A total (pins 8 and 21 combined)

22 GND Logic Ground

23 ACFAIL* Backplane ACFAIL* signal output. If you use this pin, do not violate

the VXIbus electrical specifications (keep the extender cable as
short as possible).
Refer to VMEbus Specification Manual for details on using the
ACFAIL* and SYSRESET* signals.

24 GND Logic Ground

25 RSV Request Service signal

1

By momentarily grounding this line, the mainframe will toggle from on to off (or vice

3

versa). The state changes on the falling edge of the signal. Hold the signal low for at
least 500 ms before releasing. Attach only a momentary switch or an open collector
device to drive this line. The line is pulled up to 1 V internally.

2

If you use pins 8 and 21 (+5 VB) to supply +5 V Standby to the backplane, make sure
that the rear panel jumper is in the correct position (refer to Enhanced Monitor Board
Jumpers on page 2- 9).

3

The RSV signal is equivalent to the IEEE 488.1 SRQ signal. The signal is asserted (0)
when an enable event is generated; the signal is unasserted(1) when the event is
cleared by reading the event register. This line is an open collector output. The
signal can be stand-alone or multiple mainframes can be tied together. If you tie
multiple mainframes together, each mainframe must be polled to determine the
source of the service request.

2

Enhanced Monitor

The enhanced monitor, in addition to the DB25-pin connector and the fan switch,
includes an industry standard 9-pin RS-232 serial port, logical address switches, a
jumper for slot-1 or slot-12 MODID selection, an auxiliary power connection, a slot
for adding programming FLASH jumper, and status lights. Refer to Figure 2--5.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 7

Operating Information

RS-232C connector

MONITOR BACKUP
POWER SUPPLY

LOGICAL ADDRESS switches

READY light

ACCESSED light
MODID Jumper Selection

Figure 2- 5: Rear view of the enhanced monitor

The logical address switches select the logical addresses for the enhanced
monitor. The top switch sets the most-significant digit, the bottom switch sets
the least-significant digit. It is recommended that you set the address switches to
FF so that the resource manger can dynamically configure the instruments
address; if you select any other address, you must be careful to select a unique
address.

The green READY indicator lights after the power-on diagnostics are complete
and there are no failures. During normal operation, the light flashes if there is a
pending error message. Once all error messages have been retrieved, the READY
indicator stops flashing and remains on.

The amber ACCESSED indicator lights when the MODID line is accessed by
the slot 0 device.

An auxiliary power connector (MONITOR BACKUP POWER SUPPLY) allows
you to apply +5 V to the enhanced monitor board to provide RS-232 commu­nication with the enhanced monitor while the mainframe is not powered on. The
jumper located just above the power connector determines whether you source
the +5 V standby voltage from the monitor backup power supply connector or
from the 25-pin connector.

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TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

The enhanced monitor board has two jumpers accessible from the rear of the
mainframe. Figure 2--6 shows the factory default settings of these jumpers.

+5V Standby sourced from
monitor backup power supply
(default)

+5V Standby sourced
from P9, pins 8 & 21

MODID12

MODID01
(default)

Figure 2- 6: Enhanced monitor board jumpers

You can also select the source of the +5 V Standby voltage. If you source the
+5 V Standby voltage from the +5 V external supply (monitor backup power
supply connector), then the external supply will provide the backplane with the
+5 V external voltage (1 A maximum). If you source the +5 V Standby voltage
from the 25-pin connector, you must provide the +5 V to pins 8 and 21 of the
25-pin connector. The default jumper setting is to provide the voltage from the
external source (+5 V external power supply).

The enhanced monitor can answer to the slot 1 or slot 12 MODID line for the
configuration manager. The default position is slot 12.

In order to flash the enhanced monitor board with the latest firmware, you need
to install a firmware loader jumper at the location shown in Figure 2--7.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 9

Operating Information

MOD ID jumper

Enhanced Monitor RS-232

Connector

Flesh jumper

Figure 2- 7: Enhanced monitor board flash jumper

The Enhanced Monitor includes a 9-pin RS-232 connector that allows connec­tion to a RS-232 host. Figure 2--8 shows the pin assignments of the 9-pin
RS-232 connector; Table 2--2 describes the pin assignments. Use this port to read
the status of the mainframe using the SCPI commands documented at the end of
this chapter.

2- 10

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table 2- 2: RS-232 pin connector

Pin Description

Shield Protective Ground

1 No Connection

2 Receive Data (RxD)

3 Transmit Data (TxD)

4 Data Terminal Ready (DTR)

5 Signal Ground (GND)

6 No Connection

7 Request to Send (RTS)

8 Clear to Send (CTS)

9 No Connection

Operating Information

Pin 1

Pin 9

RS 232C

I/O levels

±

25 VDC MAX

1A MAX PER PIN

Figure 2- 8: Enhanced Monitor RS-232 connector

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 11

Operating Information

Backplane Connectors

Table 2--3 s hows the P1 connector pinouts for all slots in the mainframe.
Table 2--4 s hows the P2 connector pinouts for slots 1 to 12 and Table 2--5 shows
the pinouts for the Slot 0 P2 connector.

2- 12

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

Table 2- 3: P1 connector pinouts

Pin Row A Row B Row C

1 D00 BBSY* D08

2 D01 BCLR* D09

3 D02 ACFAIL* D10

4 D03 BG0IN* D11

5 D04 BG0OUT* D12

6 D05 BG1IN* D13

7 D06 BG1OUT* D14

8 D07 BG2IN* D15

9 GND BG2OUT* GND

10 SYSCLK BG3IN* SYSFAIL*

11 GND BG3OUT* BERR*

12 DS1* BR0* SYSRESET*

13 DS0* BR1* LWORD*

14 WRITE* BR2* AM5

15 GND BR3* A23

16 DTACK* AM0 A22

17 GND AM 1 A21

18 AS* AM2 A20

19 GND AM 3 A19

20 IACK* GND A18

21 IACKIN* SERCLK A17

22 IACKOUT* SERDAT* A16

23 AM4 GND A15

24 A07 IRQ7* A14

25 A06 IRQ6* A13

26 A05 IRQ5* A12

27 A04 IRQ4* A11

28 A03 IRQ3* A10

29 A02 IRQ2* A09

30 A01 IRQ1* A08

31 -- 1 2 V +5 V STDBY +12 V

32 +5 V +5 V +5 V

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 13

Operating Information

Table 2- 4: P2 connector pinouts for slots 1 - 12

Pin Row A Row B Row C

1 ECLTRG0 +5 V CLK10+

2 -- 2 V GND CLK10--

3 ECLTRG1 RSV1 GND

4 GND A24 -- 5 . 2 V

5 LBUSA00 A25 LBUSC00

6 LBUSA01 A26 LBUSC01

7 -- 5 . 2 V A27 GND

8 LBUSA02 A28 LBUSC02

9 LBUSA03 A29 LBUSC03

10 GND A30 GND

11 LBUSA04 A31 LBUSC04

12 LBUSA05 GND LBUSC05

13 -- 5 . 2 V +5 V -- 2 V

14 LBUSA06 D16 LBUSC06

15 LBUSA07 D17 LBUSC07

16 GND D18 GND

17 LBUSA08 D19 LBUSC08

18 LBUSA09 D20 LBUSC09

19 -- 5 . 2 V D21 -- 5 . 2 V

20 LBUSA10 D22 LBUSC10

21 LBUSA11 D23 LBUSC11

22 GND GND GND

23 TTLTRG0* D24 TTLTRG1*

24 TTLTRG2* D25 TTLTRG3*

25 +5 V D26 GND

26 TTLTRG4* D27 TTLTRG5*

27 TTLTRG6* D28 TTLTRG7*

28 GND D29 GND

29 RSV2 D30 RSV3

2- 14

30 MODID D31 GND

31 GND GND +24 V

32 SUMBUS +5 V -- 2 4 V

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

Table 2- 5: P2 connector pinouts for slot 0

Pin Row A Row B Row C

1 ECLTRG0 +5 V CLK10+

2 -- 2 V GND CLK10--

3 ECLTRG1 RSV1 GND

4 GND A24 -- 5 . 2 V

5 MODID12 A25 LBUSC00

6 MODID11 A26 LBUSC01

7 -- 5 . 2 V A27 GND

8 MODID10 A28 LBUSC02

9 MODID09 A29 LBUSC03

10 GND A30 GND

11 MODID08 A31 LBUSC04

12 MODID07 GND LBUSC05

13 -- 5 . 2 V +5 V -- 2 V

14 MODID06 D16 LBUSC06

15 MODID05 D17 LBUSC07

16 GND D18 GND

17 MODID04 D19 LBUSC08

18 MODID03 D20 LBUSC09

19 -- 5 . 2 V D21 -- 5 . 2 V

20 MODID02 D22 LBUSC10

21 MODID01 D23 LBUSC11

22 GND GND GND

23 TTLTRG0* D24 TTLTRG1*

24 TTLTRG2* D25 TTLTRG3*

25 +5 V D26 GND

26 TTLTRG4* D27 TTLTRG5*

27 TTLTRG6* D28 TTLTRG7*

28 GND D29 GND

29 RSV2 D30 RSV3

30 MODID00 D31 GND

31 GND GND +24 V

32 SUMBUS +5 V -- 2 4 V

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 15

Operating Information

Benchtop Controller Controls and Connectors

The benchtop controller is an integral part of the benchtop mainframe. The
module is a slot zero device and occupies three slots, 0 through 2 in the benchtop
mainframe.

LED Indicators

The benchtop controller has four LED indicators located on the front panel.
Figure 2--9 shows the front panel with the location of the LED indicators and
front panel connectors.

SLEEP Indicator

RUN Indicator

SYSTEM FAIL Indicator

TEST Indicator

Floppy Disk Drive

Secondary Video

PCMCIA PC Cards (2)

CD-ROM Drive

COM Port

2- 16

Primary Video

USB Ports (2)

Mouse

Keyboard

Figure 2- 9: Front view of the benchtop controller

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Replaceable Hard Disk Drive

SYSTEM TRIG IN

SYSTEM TRIG OUT

EXTERNAL SIG IN

EXTERNAL SIG OUT

Operating Information

SLEEP Indicator. Indicates that the benchtop controller is in sleep mode.

RUN Indicator. Indicates that the memory is accessing data.

SYSTEM FAIL Indicator. Indicates a SYSFAIL condition exists on the communica-

tions bus.

TEST Indicator. Indicates that the benchtop controller is executing a power-on self
test (POST) diagnostic test sequence.

Mouse Port

Keyboard Port

The mouse connector is a standard six-pin, PS/2-compliant DIN connector. The
mouse port can be connected to an external, standard PS/2-compliant three-but­ton wheel mouse. Table 2--6 lists the pin assignments.

Table 2- 6: Mouse port pin assignments

Pin number Pin Assignment

1 Data

2 No connection

3 GND

4 +5 V

5 Clock

6 GND

The keyboard connector is a standard six-pin PS/2-compliant DIN connector.
The keyboard port can be connected to an external, standard PS/2-compliant
keyboard. Table 2--7 lists the pin assignments.

Table 2- 7: Keyboard port pin assignments

Pin number Pin Assignment

1 Data

2 No connection

3 GND

4 +5 V

5 Clock

6 GND

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 17

Operating Information

Replaceable

Hard Disk Drive

Floppy Disk Drive

CD ROM

PC CardBus32 Port

There is one replaceable hard drive. Because of the speed at which the PC
industry evolves, the hard disk drive size is subject to change. This service
manual lists the size of the hard disk drive available at the time the product was
introduced.

There is one standard high-density/double-sided floppy disk drive.

There is one CD ROM drive. Because of the speed at which the PC industry
evolves, the CD ROM drive is subject to change. This service manual lists the
speed of the CD ROM drive available at the time the product was introduced.

There are two PC Card Bus slots. The PC card(s) can be inserted in either slot, or
two cards can occupy both slots at the same time. The PC card port supports an
optional Ethernet NIC (network interface card). Table 2--8 shows the pin
assignments.

2- 18

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

Table 2- 8: PC CardBus32 port pin assignments

Pin number Pin assignment Pin number Pin assignment Pin number Pin assignment

1 GND 24 A5 47 A18

2 D3 25 A4 48 A19

3 D4 26 A3 49 A20

4 D5 27 A2 50 A21

5 D6 28 A1 51 VCC

6 D7 29 A0 52 VPP2

7 CE1* 30 D0 53 A22

8 A10 31 D1 54 A23

9 OE* 32 D2 55 A24

10 A11 33 ISI16* 56 A25

11 A9 34 GND 57 VS2

12 A8 35 GND 58 RESET

13 A13 36 CD1* 59 WAIT*

14 A14 37 D11 60 INPACK*

15 WE* 38 D12 61 REG*

16 IR EQ* 39 D13 62 SPKR*

17 VCC 40 D14 63 STSCHG*

18 VPP1 41 D15 64 D8

19 A16 42 CE2* 65 D9

20 A15 43 VS1 66 D10

21 A12 44 IORD* 67 CD2*

22 A7 45 IOWR* 68 GND

23 A6 46 A17

USB Ports

There are two USB (universal serial bus) ports. The USB ports can be used for
any USB complaint device. Table 2--9 shows the pin assignments for the US B
ports.

Table 2- 9: USB pin assignments

Pin number Pin function Pin number Pin function

A1 Vcc B1 Vcc

A2 ADATA-- B2 BDATA--

A3 ADATA+ B3 BDATA+

A4 GND B4 GND

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 19

Operating Information

SVGA Ports

COM Port

Two SVGA ports (Primary and Secondary) support industry standard SVGA
color monitors. Table 2--10 lists the pin assignments for both ports.

Table 2- 10: SVGA OUT pin assignments

Pin number Pin function Pin number Pin function

1 Red 2 Green

3 Blue 4 DDC DB2

5 GND 6 GND

7 GND 8 GND

9 (KEY) 10 GND

11 DDC DB0 12 DDC DB1

13 HSYNC 14 VSYNC

15 DDC DB3

The COM port on the benchtop controller is an industry standard RS-232 serial
port. Table 2--11 lists the pin assignments for the port.

System Trig In Connector

System Trig Out

Connector

Ext Sig In Connector

Table 2- 11: RS-232 Port pin assignments

Pin number Pin function Pin number Pin function

1 DCD 2 RXD

3 TXD 4 DTR

5 GND 6 DSR

7 RTS 8 CTS

9 Ring indicator

The system trigger input is a TTL compatible signal input that is user definable
in software. This connector is a sub-miniature bayonet (SMB) connector.

The system trigger output is a TTL compatible output signal that is user
definable in software. This connector is a sub-miniature bayonet (SMB)
connector.

The external signal Input is a TTL compatible input signal that is user definable
in software. This connector is a sub-miniature bayonet (SMB) connector.

2- 20

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating Information

Ext Sig Out Connector

LPT Port

The external signal output is a TTL compatible output signal that is user
definable in software. This connector is a sub-miniature bayonet (SMB)
connector.

The LPT port is a parallel printer port. This parallel printer port supports
standard Centronics mode, Enhanced Parallel Port (EPP), or Microsoft high­speed mode (ECP) and has a 36-pin high density Centronics-compliant
connector. See Table 2--12 for pin assignments.

Table 2- 12: LPT port pin assignments

Pin number Pin function Pin number Pin function

1 BUSY 19 GND

2 SLCT 20 GND

3 ACK* 21 GND

4 ERR* 22 GND

5 PE 23 GND

6 D0 24 GND

7 D1 25 GND

8 D2 26 GND

9 D3 27 GND

10 D4 28 GND

11 D5 29 GND

12 D6 30 GND

13 D7 31 GND

14 INIT* 32 GND

15 STB* 33 GND

16 SLIN* 34 GND

17 AFD* 35 GND

18 HI 36 GND

See IEEE specification P1284-C for pin connection definitions for other modes

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2- 21

Operating Information

Expansion Module Controls and Connectors

The expansion module is a control module that is an integral part of the
expansion mainframe. The expansion module must be located in slot 0 of the
expansion mainframe.

The front panel of the expansion module has three connectors, two of the
connectors handle TTL signals, the other connector handles ECL signals. The
cables for the three connectors connect to another expansion module in the host
benchtop mainframe (or portable mainframe).

2- 22

Figure 2- 10: Front view of the benchtop controller

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Operating System and Application Interface

The TLA721 Benchtop Mainframe comes with the Microsoft Windows 2000
operating system factory-installed. Operations and capabilities when running on
the mainframe are the same as with Microsoft Windows running on a high-per­formance personal computer. Windows Help is available from the Start menu of
the Windows Task Bar.

The instrument also comes with the Tektronix Logic Analyzer Family applica­tion software configured at the factory to launch after the logic analyzer boots up
and the operating system is running. The application software controls data
acquisition and processing by the logic analyzer. The application software is
included with the product; refer to the Tektronix Logic Analyzer Family User
Manual if you need to reinstall any software.

Operating Information

Online Help

System Window

Setup Window

Trigger Window

Most of the user information for operating the logic analyzer is available through
online help.

Refer to the online help for more information on the individual menus, icons,
and fields within each window.

The System window provides an overview of the entire logic analyzer. Use the
System window to navigate through the logic analyzer. The center of the system
window displays icons that represent logic analyzer modules, DSO modules, or
pattern generator modules. These icons provide links to other windows in the
instrument.

A setup window exists for each module in the instrument. It contains the setup
information for the module, such as clocking, memory depth, threshold
information, and channel information.

Each trigger window provides access to the trigger setups. DSO and logic
analyzers have their own trigger windows. Use the trigger window to determine
when you want the logic analyzer or DSO to acquire data and how much data to
acquire.

Listing Window

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

The listing window displays acquired data as tabular text. Each column of data
represents one group of data or other logical data information, such as time
stamps. Each row represents a different time that data was acquired: newer
samples display below older samples.

2- 23

Operating Information

Waveform Window

Other Windows

The waveform window displays acquired data as graphical waveforms. All
defined channels display as Busforms for the logic analyzer and as individual
data channels for the DSO.

Other windows may exist on the logic analyzer depending on the installed setup.
For more information on the logic analyzer application, refer to the Tektronix
Logic Analyzer Family User Manual.

2- 24

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Theory of Operation

This chapter provides a high-level overview of the theory of operation for the
TLA721 Benchtop Mainframe and the TLA7XM Expansion Mainframe. The
two mainframes are identical with the following exceptions:

H The TLA721 Benchtop Mainframe includes a plug-in controller that controls

the operation of the entire system.

H The TLA7XM Expansion Mainframe includes an expansion module that

routes signals from another external mainframe to the expansion mainframe.
The external mainframe can be a TLA715 Portable Mainframe, a TLA721
Benchtop Mainframe, or another TLA7XM Expansion Mainframe. The
external mainframe also has an expansion module that routes the backplane
signals from the external mainframe through three cables to the expansion
module in the expansion mainframe.

The theory of operation is broken down according to the benchtop controller,
mainframe, and expansion controller. The Diagrams chapter contains block
diagrams and interconnection diagrams separate from this chapter that you may
want to use while servicing the instrument.

Benchtop Controller

Refer to Figure 3--1 while reading the following paragraphs on the benchtop
controller.

The benchtop controller provides all the benefits of a high-performance
PC-based controller architecture including graphics and I/O. The main difference
between the benchtop controller and a standard PC is the interface used to
communicate with the modules installed in the mainframe. The benchtop
controller is installed in a three-wide controller module that supports integration
with the mainframe.

The benchtop controller uses the same Pentium III controller found in the
TLA715 Portable Mainframe. However, the parts are rearranged to provide
access to the PC I/O connectors found on the front of the controller. An
additional adapter board interfaces the controller board to the backplane and
additional peripherals. A hard disk drive board mounts the hard disk drive and
CD-ROM drive.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

3- 1

Theory of Operation

Benchtop Controller

Slots 0 - 2

PCI to Backplane

Bridge ASIC

Benchtop Chassis

PC Cards, SVGA, COM, USB, EPP

& Trigger Ports

VTC Trig

ASIC

Module Slot #3

Module Slot #4

PC Controller

Display and I/O

Adapter Board

Fixed hard

disk drive

disk drive

CD ROM

drive

Hard Disk Interface

Floppy

Removeable

hard

disk drive

Mouse &

Keyboard

Module Slot #12

Backplane

Power Supply

Enhanced Monitor

Blower

Figure 3- 1: Interconnection and block diagram for the benchtop mainframe and controller

PC Controller, Display,

and I/O

The PC controller uses a standard Intel Pentium III microprocessor using the
815E chip-set. The controller has a 733 MHz Pentium III processor with 512 MB
of SDRAM, 512 KB of L2 cache, and 512 KB of flash-based BIOS. A Texas
Instrument TI PCI1251B controls the two CardBus 32 slots.

A Silicon Motion Lynx3DM SVGA/XGA display controller with up to 4 MB of
internal DRAM supports both the integrated color TFT LCD flat panel and
external SVGA port.

3- 2

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Theory of Operation

An ECP/EPP Centronics compatible parallel port, two USB ports, and two
16550-based serial RS-322 COM ports (one external) support standard PC-based
I/O peripherals.

PCI-to-Backplane Bridge

ASIC

Trigger Crossbar ASIC

Adapter Board

The backplane bus interface appears as a standard PCI device to the PC-based
controller. The PCI-to-Backplane interface is managed by a Tektronix-designed
ADG343 CMOS ASIC which includes support for DMA transfers with FIFO,
IRQ management, programmable byte swapping, backplane address space
management and windowing (A16, A24, and A32 space), backplane control
lines, and MODID control lines.

The trigger lines are managed through the Tektronix-designed Trigger Crossbar
(VTC) ASIC. The VTC ASIC cross connects any of the ten backplane trigger
lines (ECL and TTL) to any of the four SMB connector ports on the front panel.
The logic analyzer uses four SMB ports to accommodate two inputs (System
Trigger In and External Signal In) and two outputs (System Trigger Out and
External Signal Out).

The VTC ASIC also supports several standard backplane protocols including
START/STOP, which support a synchronous start of all installed modules to
System Time Zero (STZ), and several custom features. These features include
time interpolation to support the use of the VTC ASIC in individual module
applications.

The Adapter board integrates the TLA715 Portable Mainframe controller into the
TLA721 Benchtop Mainframe controller by providing electrical and mechanical
support for the controller board, floppy disk drives, keyboard and mouse ports,
PC speaker, decoding of additional MODID lines via an FPGA, and buffering of
the backplane signal lines to comply with VXI System Specification 1.4 and
VMEbus ANSI/IEEE Std 1014-1987 standards.

Hard Disk Drive Board

Hard Disk Drive

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

The hard disk drive board provides electrical and mechanical support for the hard
disk drive and the CD-ROM drive.

The hard disk drive (HDD) is a standard 2.5-inch IDE drive which interfaces
directly to the controller through the Enhanced Integrated Device Electronics
(IDE) interface. The hard disk drive is easily replaceable without removing any
of the covers or screws on the controller.

The hard disk drive is only available in the maximum configuration. The sizes of
the hard disk drive are dependent on the current cost and availability. The
benchtop controller is electrically capable of accepting dual master/slave IDE
HDD configurations for a total of three hard disk drives (however the CD-ROM
takes one of the configurations) but is currently limited to mounting two hard

3- 3

Theory of Operation

disk drives. A second hard disk drive can be added to the controller with one of
the options in the TLA7UP upgrade kits.

Floppy Disk Drive

CD-ROM Drive

Mouse and Keyboard

Mainframe

Ports

USB Ports

The floppy disk drive is a standard 0.5-inch drive supporting 3.5-inch,

1.44 MB high-density, double sided floppy disks.

The CD-ROM drive is a standard 24X CD-ROM drive.

The mouse and keyboard ports are standard PS2 compliant ports. They interface
to the controller board through the Adapter board.

A dual USB port connects USB devices to the controller.

The benchtop and expansion mainframes are identical and contain the following
major modules:

H Power supply

H Backplane

H Enhanced monitor board

H Temperature sense board

Refer to Figure 3--2 while reading the following paragraphs on the mainframe.

3- 4

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

2

12

9

25

J6

S1/2J10P9S3J7J8

Theory of Operation

External Monitor Power

Logical Addr

RS232

Passive Monitor

3

4

Fan Speed Switch

Blower

AC in

3

Enhanced

Monitor A7

0J3 0P 1 0P2

30 96

1

4

On/Standby

Switch

30

J29

Power Supply

P26 P28P27

P25

96

5

5

J25 J27

0J4 0P3 0J1 0J2

18

J23 J22

0P1 1P1 2P 1 3P1 4P 1 5P1 6P 1 7P 1 8P1 9P1 10P 1 11P1 12P1

0P2

J16

J26 J28

1P2 2P2 3P2 4P2 5P2 6P2 7P 2 8P2 9P 2 10P2

5

J24

BackplaneA4

Temperature Sense BoardA2

Slot 0 Slot 1 Slot 2 Slot 3 Slot 4 Slot 5 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 Slot 11

11P 2

12P2

Slot 12

Figure 3- 2: Mainframe block diagram

Power Supply and Power

Supply Interface

The power supply is a custom power supply capable of supplying 1000 Watts of
secondary power to the overall mainframe with an input power of up to
1450 Watts operating at it’s minimum 70% efficiency. The power supply
incorporates a continuous AC source operating in the range of 90 to 250 VAC
(from 45 Hz to 66 Hz) and 100 to 132 VAC (from 360 Hz to 440 Hz). This
covers virtually all international power combinations. The power supply also
supports automatic power factor correction and over-voltage, current, and
thermal protection mechanisms.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

3- 5

Theory of Operation

The power supply connects to the backplane at J1 and J2 through the power
supply interface board.

Backplane

Enhanced Monitor Board

The backplane (A4) provides all the connections to module slots 0 through 12 in
the chassis. It also has connections to all other circuit boards and modules in the
chassis.

The front panel On/Standby DC switch connects to one of two connectors at the
top of the backplane. When the switch is connected to J22, the switch controls
the power in the chassis. When the switch is connected to J23, the power-on
functions are controlled by an external source through the 25-pin connector on
the enhanced monitor board. Although the switch still illuminates when power is
applied to the chassis, the on/off function of the switch is disabled.

A 34-wide ribbon cable at 0J4 on the backplane connects to J16 on the tempera­ture sense board. Connectors 0J1, 0J2, and 0P3 carry instrument monitoring
information from the backplane to the enhanced monitor board.

The enhanced monitor board (A3) collects the monitoring information from the
power supply, blower, and temperature sense board and passes the information to
the 25-pin D connector. The enhanced monitor board connects directly to the
backplane at 0J3, 0P1 and 0P2.

The 25-pin D passive monitor connector lets you monitor the power supply
voltages, blower speed, and the maximum slot temperature rise within the
chassis. The connector also provides remote on and off capability and access to
the SYSRESET* and ACFAIL* signals.

3- 6

Blower

CAUTION. Do not connect an RS-232 cable to the 25-pin connector. This 25-pin
connector is not an RS-232 port.

Connecting an RS-232 cable to this connector might result in damage to the
equipment.

The universal fan controller on the enhanced monitor board drives the EBM/
PAPST fan pulse with modulation (PWM) speed control input.

The blower (fan assembly) consists of a chassis mount, rear fan cover, and
EBM/PAPST fan. The fan is a low-noise, high-airflow design that supports up to
308 CFM of airflow through the mainframe at full speed. The blower connects to
the enhanced monitor board at FAN 1/Blower (J8). The fan speed switch (S1)
lets you select either variable fan speed (V AR) or full speed (FULL).

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Theory of Operation

Temperature Sense Board

Expansion Module

Slot 0 Interface

The temperature sense board (A2) monitors the temperatures for each slot within
the chassis. The temperature sense board connects to the backplane through the
ribbon cable at J16.

Figure 3--3 shows the block diagram for the expansion module when one is
installed in an mainframe and second expansion module is installed in a second
mainframe. You may want to refer to this illustration while reading the following
text.

The primary expansion module, located in the primary benchtop mainframe or
portable mainframe, is connected to the expansion module, located in second
expansion mainframe, by routing signals through three expansion cables. The
expansion module both receives and drives the bus signals in both mainframes.
The expansion modules are connected together by two TTL cables and one ECL
cable.

The MODID register is enabled only when the expansion module is installed in
slot 0 of the expansion mainframe. During power up, the value of the MODID0
signal is sampled. If the signal on MODID0 is low, the expansion module is
determined to be installed in slot 0. If the signal on MODID0 is high, the
expansion module is determined to be installed in slot 1--12.

System Clock

Slot 0 Interface

System Clock

CLK10

Power On Sequence

The SYSCLK (system clock) is buffered and transmitted to the expansion
mainframe from the benchtop mainframe.

The MODID register is enabled only when the expansion module is installed in
slot 0 of the expansion mainframe. During power up, the value of the MODID0
signal is sampled. If the signal on MODID0 is low, the expansion module is
determined to be installed in slot 0. If the signal on MODID0 is high, the
expansion module is determined to be installed in slot 1--12.

The SYSCLK (system clock) is buffered and transmitted to the expansion
mainframe from the benchtop mainframe.

The CLK10 is a differential ECL signal that provides system timing and
reference. The CLK10 is transmitted to the expansion mainframe from the
benchtop mainframe.

On power up, the expansion module determines correct configuration of the
expansion modules and the expansion cables.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

3- 7

Theory of Operation

Primary mainframe expansion module

Register based

interface

Expansion

cable(s)

CPU Bus

Buffers

Trigger and

Clock Buffers

Second expansion mainframe module

Control and

Diagnostic

Registers

CPU Bus

Buffers

Primary MF
backplane

Expansion MF
backplane

Automatic Power Control

3- 8

Trigger and

Clock Buffers

Figure 3- 3: Benchtop and expansion mainframe block diagram

The expansion module controls the power on and power off of the expansion
mainframe. When the benchtop mainframe is powered on, a signal is sent to the
expansion mainframe causing the expansion mainframe to power on. The same
signal is sent to the expansion mainframe upon power down.

Automatic power on and automatic power off only work when the primary
power switch on the expansion mainframe is closed.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Performance Verification Procedures

This chapter contains procedures for functional verification, certification, and
performance verification procedures for the TLA721 Benchtop Mainframe and
TLA7XM Expansion Mainframe. Generally, you should perform these proce­dures once per year or following repairs that affect certification.

Summary V erification

Functional verification procedures verify the basic functionality of the instru­ment inputs, outputs, and basic instrument actions. These procedures include
power-on diagnostics, extended diagnostics, and manual check procedures.
These procedures can be used for incoming inspection purposes.

Certification procedures certify the accuracy of an instrument and provide a
traceability path to national standards. Certification data is recorded on calibra­tion data reports provided with this manual. The calibration data reports are
intended to be copied and used for calibration/certification procedures.

After completing the performance verification procedures or the certification
procedures, you can fill out a calibration data report to keep on file with your
instrument.

Test Equipment

Performance verification procedures confirm that a product meets or exceeds the
performance requirements for the published specifications documented in the
Specifications chapter of this manual. Refer to Figure 4--1 on page 4--2 for a
graphic overview of the procedures.

These procedures use external, traceable signal sources to directly test character­istics that are designated as checked (n)intheSpecifications chapter of this
manual. Table 4--1 on page 4--3 shows the required equipment list. Always
warm up the equipment for 30 minutes before beginning the procedures.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

4- 1

Performance Verification Procedures

Determine equipment

to certify.

Go to appropriate

procedure(s).

Gather required test

equipment.

Photocopy the required

Calibration Data Report(s).

Enter product model and

serial number(s) on the

Calibration Data Report(s).

Set up test equipment.

Allow all mainframes, modules and

equipment to warm up (30 minutes).

Use

Tektronix-supplied

probes.

Is it OK

No

with customer to

remove/reconnect probes

from System

Under Test?

Select procedure.

Configure customer’s

mainframe and modules as

described in procedure.

Yes

Repair or adjust

equipment as

required.

Perform procedure.

No

No

measurements

tolerance?

Enter measurements on

the appropriate

Calibration Data Report.

Create necessary

Calibration Certificate.

all certifications

complete?

Are

within

Yes

Are

Yes

Done

Figure 4- 1: Calibration/certification pr ocedure flow chart

4- 2

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table 4- 1: Test equipment

Item number and description Minimum requirements Example

Performance Verification Procedures

1. Benchtop Mainframe TLA721 Benchtop Mainframe with a
LA, DSO, or Patgen module installed

2. Expansion Mainframe TLA7XM Expansion Mainframe with
a LA, DSO, or Patgen module
installed. Expansion mainframe
should be connected to the TLA721
Benchtop Mainframe

3. Frequency counter Frequency accuracy: <0.0025%
Frequency range: 1 kHz to 100 MHz

4. Miniature probe-to-square pin

adapters

5. 0.025-inch square pin 3/4-inch length, (two required) Tektronix part number 131-1426-XX

6. Digital multimeter

with test leads

7. Cable, precision

50 Ω coaxial

8. SMB-to-BNC cable One required Tektronix P6041

Two required Tektronix part number 103-0177-XX

VDC accuracy: 0.1% from --10 V to
+100 V

50 Ω, 36 in, male-to-male BNC
connectors

--

--

Hewlett Packard 5314A

Tektronix DMM 900 Series

Tektronix part number 012-0482-XX

Functional Verification

Table 4--2 lists the functional verification procedures that are available for the
benchtop and expansion mainframes. If you have an expansion mainframe, these
procedures assume that the expansion mainframe is properly connected to the
TLA721 Benchtop Mainframe. If necessary, refer to the Tektronix Logic Analyzer
Family User Manual for installation instructions.

Table 4- 2: Functional verification procedures

Instrument Procedure

Benchtop and expansion mainframe Power-on and fan operation

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Power-up diagnostics

Extended diagnostics

TLA Mainframe diagnostics

CheckIt Utilities diagnostics

4- 3

Performance Verification Procedures

Power-on and Fan

Operation

Extended Diagnostics

Complete the following steps to check the power-on and fan operation of the
TLA721 Benchtop Mainframe and the TLA7XM Expansion mainframe (if
installed).

You will need a mainframe with an LA or DSO module installed in each
mainframe.

1. Power on the benchtop mainframe and observe that the On/Standby switch
illuminates.

2. If you have an expansion mainframe attached, check that the expansion
mainframe automatically powers on.

3. Check that the fan spins without undue noise.

4. If everything is properly connected and operational, you should see the

modules (and expansion mainframe with its modules) in the System window
of the logic analyzer application.

5. If there are no failures indicated in the System window, the power-on
diagnostics pass when you power on the mainframe(s).

Do the following steps to run the extended diagnostics:

NOTE. Running the extended diagnostics will invalidate any acquired data. If
you want to save any of the acquired data, do so before running the extended
diagnostics.

You will need a mainframe with an LA or DSO module installed in each
mainframe.

Equipment
required

Prerequisites Warm-up time: 30 minutes

Cable, 50 Ω coaxial (item 7)

Perform the following tests to complete the functional verification procedure.

1. If you have not already done so, power on the instrument and wait for the
logic analyzer application to start.

2. Go to the System menu and select Calibration and Diagnostics.

3. Verify that all power-on diagnostics pass.

4. Click the Extended Diagnostics tab.

4- 4

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Performance Verification Procedures

5. Select All Modules, All Tests, and then click the Run button on the property
sheet.

All tests that displayed an “Unknown” status will change to a Pass or Fail
status depending on the outcome of the tests.

6. Scroll through the tests and verify that all tests pass.

TLA Mainframe

Diagnostics

CheckIt Utilities

The TLA Mainframe Diagnostics are a comprehensive software test that checks
the functionality of the mainframes. To run these diagnostics, do the following
steps:

1. Quit the logic analyzer application.

2. Click the Windows Start button.

3. Select Programs → Tektronix Logic Analyzer → TLA Mainframe Diagnos-

tics.

4. Run the mainframe diagnostics.

CheckIt Utilities is a comprehensive software application used to check and
verify the operation of the PC hardware in the portable mainframe. To run the
software, you must have either a keyboard, mouse, or other pointing device.

NOTE. To check the floppy disk drive or the CD-ROM drive, you must have a test
floppy disk or CD installed before starting the CheckIt Utilities.

To run CheckIt Utilities, follow these instructions:

1. Quit the logic analyzer application.

2. Click the Windows Start button.

3. Select Programs → CheckIt Utilities.

4. Run the tests. If necessary, refer to the CheckIt Utilities online help for

information on running the software and the individual tests.

Certification

Benchtop Mainframe

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

The system clock of the controller is checked for accuracy. The instrument is
certifiable if this parameter meets specifications. This procedure is described
under Checking the 10 MHz System Clock (CLK10) on page 4--8. Record the
results in a copy of the Calibration Data Report at the end of this chapter.

4- 5

Performance Verification Procedures

Expansion Mainframe

There are no certifiable parameters for the TLA7XM Expansion Mainframe.

Performance Verification Procedures

This section contains procedures to verify that the TLA721 Benchtop Mainframe
and the TLA7XM Expansion Mainframe perform as warranted. Verify instru­ment performance whenever the accuracy or function of your instrument is in
question.

Tests Performed

Do the following tests listed in Table 4--3 to verify the performance of the
TLA721 Benchtop Mainframe and the TLA7XM Expansion Mainframe. You
will need some of the equipment shown in Table 4--1 on page 4--3 to complete
the performance verification procedures. If you substitute equipment, always
choose instruments that meet or exceed the minimum requirements specified.

Table 4- 3: Performance verification procedures

Parameter Procedure

Power supply voltages Voltage level check at the 25-pin connector

System clock (CLK 10)

1

Certifiable parameter

1

10 MHz system clock test

Checking Power Supply

Voltages

Use a digital voltmeter to check the voltages on the pins of the 25-pin connector
and compare the results against the range listed in Table 4--4. The connector is
located on the right rear panel of the mainframe (see Figure 4--2).

Equipment
required

Prerequisites Warm-up time: 30 minutes

Digital multimeter with test leads (item 6)

Two 0.025-inch square pins (item 5)

Two miniature probe-to-square pin adapters (item 4)

CAUTION. To prevent damaging the 25 pin connector, use care when probing the
connector with the square pins.

4- 6

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Performance Verification Procedures

Pin 1

Pin 25

Figure 4- 2: Benchtop and expansion mainframe 25-pin rear panel connector

1. Connect the reference lead of the digital voltmeter to one of the ground pins.

2. Connect the other lead of the digital voltmeter to the supply pins of the

25-pin connector on the right rear panel of the mainframe.

3. Measure the power supply voltages with the voltmeter and compare each
reading to the values listed in Table 4--4. If the voltages are within the
specified ranges, the mainframe is operating properly.

Table 4- 4: Power supply voltages at the 25-pin connector

Pin Supply Acceptable voltage range

1 +5 V 4.875 V to 5.250 V

2 -- 1 2 V --12.60 V to --11.64 V

3 -- 2 4 V --25.20 V to --23.28 V

4 -- 2 V --2.10 V to --1.90 V

14 +12 V 11.64 V to 12.60 V

15 +24 V 23.28 V to 25.20 V

16 -- 5 . 2 V --5.460 V to --5.044 V

9, 17--20, 22, 24 Logic Ground

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

4- 7

Performance Verification Procedures

Checking the 10 MHz

System Clock (CLK10)

The following procedure checks the accuracy of the 10 MHz system clock. This
procedure is only required on the benchtop mainframe; it is not required for the
expansion mainframe.

Equipment
required

Prerequisites Warm-up time: 30 minutes

Frequency counter (item 3)

SMB-to-BNC cable (item 8)

Power-up, mainframe, and CheckIt diagnostics pass

1. Verify that all of the prerequisites above are met for the procedure.

2. Connect the frequency counter to the External Signal Out TTL SMB

connector on the benchtop mainframe controller.

3. Go to the System window and select System Configuration from the System
menu.

4. In the System Configuration dialog box, select 10 MHz Clock from the list
of routable signals in the External Signal Out selection box and click OK.

5. Verify that the output frequency at the External Signal Out TTL connector is
10 MHz ±1 kHz. Record the measurement on a copy of the calibration data
report and disconnect the frequency counter.

6. In the System Configuration dialog box, reset the External Signal Out signal
to None.

4- 8

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Calibration Data Report

TLA721 Benchtop Mainframe

Instrument model number:

Serial number: Certificate number:

Verification performed by: Verification date:

System Clock Test Data

Procedure

Characteristic Specification Tolerance

Clock frequency 10 MHz ±1 kHz (9.9990 MHz-10.0010 MHz) Page 4--8,

reference

Step 5

Incoming data Outgoing data

Adjustment Procedures

There are no adjustments for the TLA721 Benchtop Mainframe or TLA7XM
Expansion Mainframe. For adjustment procedures on the individual modules,
refer to the appropriate module service manual.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

5- 1

Adjustment Procedures

5- 2

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Maintenance

This chapter provides information and procedures for inspecting, cleaning,
removing and replacing components, and troubleshooting the TLA721 Benchtop
Mainframe and the TLA7XM Expansion Mainframe. The procedures isolate
problems to a module lever rather than a component level.

This chapter is divided up as follows:

H Preventing electrostatic discharge (ESD)

H Inspection and cleaning

H Mainframe removal and replacement procedures

H Benchtop controller removal and replacement procedures

H Expansion module removal and replacement procedures

H Troubleshooting

H Repackaging instructions

Preparation

Preventing ESD

The information in this chapter is designed for use by qualified service person­nel. Read the Safety Summary at the front of this manual before attempting any
procedures in this chapter.

WARNING. To avoid electric shock, always power off the instrument and
disconnect the power cord before cleaning or servicing the instrument.

When performing any service which requires internal access to the mainframe
benchtop chassis, adhere to the following precautions to avoid damaging internal
circuit boards and their components due to electrostatic discharge (ESD).

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

6- 1

Maintenance

CAUTION. Many components within the instrument are susceptible to static
discharge damage.

Service the instrument only in a static-free environment. Observe standard
handling precautions for static-sensitive devices.

1. Minimize handling of static-sensitive circuit boards.

2. Transport and store static-sensitive circuit boards in their static protected

containers or on a metal rail. Label any package that contains static-sensitive
boards.

3. Discharge the static voltage from your body by wearing a grounded antistatic
wrist strap while handling these circuit boards.

4. Nothing capable of generating or holding a static charge should be allowed
on the work station surface.

5. Handle circuit boards by the edges when possible.

6. Do not slide the circuit boards over any surface.

7. Avoid handling circuit boards in areas that have a floor or work-surface

Inspection and Cleaning

The instrument is inspected mechanically and electrically before shipment. It
should be free of marks or scratches and should meet or exceed all electrical
specifications. To confirm this, inspect for physical damage incurred during
transit. Retain the packaging in case shipment for repair is necessary. If there is
damage or deficiency, contact your local Tektronix representative.

Cleaning procedures consist of exterior and interior cleaning. Periodic cleaning
reduces instrument breakdown and increases reliability. Clean the instrument as
needed, based on your operating environment.

These procedures equally to the mainframes, benchtop controller, and expansion
modules. You will have to remove the benchtop controller and the expansion
module from the mainframes to complete the inspection and cleaning proce­dures.

Exterior Inspection

Inspect the outside of the instrument for damage, wear, and missing parts. Use
Table 6--1 as a guide. Modules that appear to have been dropped or otherwise
abused should be checked thoroughly to verify correct operation and perfor­mance. Immediately repair defects that could cause personal injury or lead to
further damage to the benchtop controller, expansion module, or the mainframes
that the module plug into.

covering capable of generating a static charge.

6- 2

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Table 6- 1: External inspection check list

Item Inspect for Repair action

Front panel and side
cover

Cracks, scratches, deformations,
missing or damaged retainer
screws, or ejector handles.

Replace defective or missing
parts.

Maintenance

Exterior Cleaning

Procedure

Front panel connectors Broken shells, cracked insulation,

and deformed contacts. Dirt in
connectors.

Rear connectors Cracked or broken shells, dam-

aged or missing contacts. Dirt in
connectors.

Accessories Missing items or parts of items,

bent pins, broken or frayed
cables, and damaged connectors.

Replace defective parts. Clear dirt
out of connectors.

Replace defective parts. Clear dirt
out of connectors.

Replace damaged or missing
parts, frayed cables.

CAUTION. To prevent damage to electrical components from moisture during
external cleaning, use only enough liquid to dampen the cloth or applicator.

Clean the exterior surfaces with a soft dry lint-free cloth, or a soft-bristle brush.
If any dirt remains, use a soft cloth or swab dipped in a 75% isopropyl alcohol
solution. Use a swab to clean narrow spaces around controls and connectors. Do
not use abrasive cleaning compounds.

CAUTION. Avoid getting moisture inside the instrument during exterior cleaning;
use just enough moisture to dampen the cloth or swab.

Use only deionized water when cleaning. Use a 75% isopropyl alcohol solution
as a cleanser and rinse with deionized or distilled water.

Do not use chemical cleaning agents; they may damage the chassis. Avoid
chemicals that contain benzene, toluene, xylene, acetone, or similar solvents.

Interior Inspection

Remove the module covers to access the inside of the benchtop controller or the
expansion module for inspection and cleaning. Refer to the Removal and
Installation Procedures for detailed information on cover removal. Inspect the
internal portions of the modules and the mainframes for damage and wear using
Table 6--2 as a guide. Defects found should be repaired immediately.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

6- 3

Maintenance

Table 6- 2: Internal inspection check list

Item Inspect for Repair action

Circuit boards Loose, broken, or corroded

solder connections. Burned
circuit boards. Burned, broken,
or cracked circuit-run plating.

Return to a Tektronix Service Center.

Interior Cleaning

Procedure

Resistors Burned, cracked, broken,

blistered condition.

Solder connections Cold solder or rosin joints. Return to a Tektronix Service Center.

Capacitors Damaged or leaking cases.

Corroded solder on leads or
terminals.

Wiring and cables Loose plugs or connectors.

Burned, broken, or frayed
wiring.

Chassis Dents, deformations, and

damaged hardware.

Return to a Tektronix Service Center.

Return to a Tektronix Service Center.

Firmly seat connectors. Repair or replace
parts with defective wires or cables.

Straighten, repair, or replace defective
hardware.

CAUTION. To prevent damage from electrical arcing, ensure that circuit boards
and components are dry before applying power to the expansion module.

Use a dry, low-velocity stream of air to clean the interior of the modules and the
mainframes. Use a soft-bristle brush for cleaning around components. If you
must use a liquid for minor interior cleaning, use a 75% isopropyl alcohol
solution and rinse with deionized or distilled water.

6- 4

Clean the exterior (face) of the floppy disk drive, CD-ROM, and replaceable
hard disk drive cartridge on the benchtop controller with a soft, clean cloth and a
mild detergent.

To clean the floppy disk drive or the CD-ROM, use commercially available
floppy disk drive or CD-ROM drive cleaning kits and follow the manufacturer’s
instructions.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Mainframe Removal and Installation Procedures

This section provides procedures for removing and installing mechanical and
electrical modules in the benchtop and expansion mainframes. These procedures
apply identically to both the benchtop and expansion mainframes unless noted
otherwise.

CAUTION. Before doing this or any other procedure in this manual, read the

General Safety Summary and Service Safety Summary found at the beginning of
this manual.

Equipment Required

Table 6--3 lists the tools needed to remove and replace components in the
mainframes.

Table 6- 3: Equipment required to service the mainframes

Item number Item Description

1 Flat blade screwdriver Small flat blade screwdriver

2 Cutters Diagonal cutters (for removing cable ties)

3 Screwdriver handle Accepts Torx driver bits

4 T-7 Torx tip Torx drive bit for T-7 size screws

5 T-15 Torx t ip Torx drive bit for T-15 size screws

6 T-20 Torx t ip Torx drive bit for T-20 size screws

7 Allen wrench A 3/32-inch Allen wrench (hex wrench)

8 Phillips screwdriver Phillips #1 screwdriver

9 Cable ties 4-inch tie-down straps (Tektronix part number

343-0549-00)

NOTE. When installing the screws, use a torque screwdriver and tighten the
screws to 8 in-lbs unless otherwise noted.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

6- 5

Mainframe Removal and Installation Procedures

Install Empty Slot Panel Fillers

If you have any unused (empty) slots in your mainframe, you may install the
empty slot Panel Fillers. Install either the single-wide or double-wide fillers that
came with your mainframe. Refer to Figure 6--1 for information on installing the
slot fillers.

CAUTION. To avoid damage caused by heat use only Tektronix front panels;
otherwise, the shutters may activate, effectively robbing airflow from installed
modules. Installing the fillers provides improved cooling for installed modules,
improved EMI shielding, and more accurate air temperature sensing to control
the fan speeds.

6- 6

Single panel fillers

Double panel fillers

Figure 6- 1: Installing the empty slot panel fillers

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Blower Assembly

Mainframe Removal and Installation Procedures

You will need a Phillips #1 screwdriver and an Allen wrench to complete these
procedures.

Removal

To remove the blower assembly, refer to Figures 6--2, 6--3 and Figure 6--4 while
performing the following steps:

1. From the back of the chassis, loosen the five captive screws including the
safety ground (refer to Figure 6--2 for the screw locations).

2. Loosen the four 8-32 hex screws (see Figure 6--4 on page 6--9) under the
mainframe so that you can easily remove the blower assembly.

3. Remove the cable cover.

4. Unplug the blower cable and set the blower assembly aside on a clean

working surface.

5. To remove the blower, remove the ten screws with (the Allen wrench)
holding the shroud part of the blower assembly to the chassis part of the
assembly. Set the shroud aside. There are three screws on each side and four
on the bottom. See Figure 6--4.

6. Remove the two sheet metal screws at the top of the blower.

7. Remove the four screws that hold the blower to the chassis part of the blower

assembly.

8. For convenience, replace the two sheet metal screws from step 6 onto the top
of the blower.

Installation

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Install the blower assembly by following the removal procedures in reverse
order.

NOTE. When reconnecting the blower cables to the chassis, verify that you
connect the blower cable to J8, 1/BLOWER.

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Mainframe Removal and Installation Procedures

8-32 Captive

screw/fan housing

8-32 Captive

screw/fan housing

8-32 Captive

screw/fan housing

8-32 Captive

screw/fan housing

Figure 6- 2: Location of blower assembly screws

8-32 Captive
screw/Enhance monitor

8-32 Captive
screw/cable cover

8-32 Captive
screw/Enhance monitor

8-32 Captive

screw/fan housing

6- 8

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Power supply

Mainframe Removal and Installation Procedures

Cable cover

Fan cable

Blower
assembly

Figure 6- 3: Removing the blower assembly

Blower assembly

Shroud

Screws (4)

Screws (6)

Screws (4)

Chassis

Screws (2)

Blower

Cable tie

Figure 6- 4: Removing the blower

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

6- 9

Mainframe Removal and Installation Procedures

Removing the Enhanced Monitor Board

Removal

To remove the enhanced monitor board, complete the following steps:

1. Refer to Figure 6--3 and unscrew the captive screw that attaches the cable
cover. Remove the cable cover and set it aside.

2. Unplug the blower cable from the connector labeled 1/BLOWER.

3. Unscrew the two captive screws that attach the monitor board to the

mainframe.

4. Slide the enhanced monitor board out of the mainframe as shown in
Figure 6--5.

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Monitor board

Figure 6- 5: Removing the enhanced monitor board

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Mainframe Removal and Installation Procedures

Installation

To install the enhanced monitor board, complete the following steps:

1. Refer to Table 6--4 and verify that the jumpers on the enhanced monitor
board are in the default locations before installing the board in the
mainframe.

Table 6- 4: Enhanced monitor board jumpers

Jumpers (location) Pins Label on board

J2 (top of board) 1-2 and 3-4 TLA721

J38 (middle of board) 2-3 Blower

J19 (bottom of board) 2-3 Blower

2. Slide the enhanced monitor board into the mainframe as shown in Fig­ure 6--5. You may have to adjust the enhanced monitor board to engage the
connectors on the rear of the board.

3. Push the enhanced monitor board into the mainframe to fully mate the rear
connectors.

4. Tighten the two screws that attach the enhanced monitor board to the
mainframe.

5. Connect the blower cable into the connector labeled 1/BLOWER.

6. Install the cable cover and tighten the captive screw to that attaches to the

mainframe.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

6- 11

Mainframe Removal and Installation Procedures

Power Supply

Removal

To remove the power supply from the mainframe, perform Removing the Blower
Assembly procedure on page 6--7 and then complete the following steps:

1. Using the handle on the power supply, firmly pull out the power supply form
the rear of the mainframe.

2. Remove the two 3/32 hex drive screws and washers to remove the handle
from the power supply.

Mainframe

Power supply

6- 12

Installation

Handle

Figure 6- 6: Removing the power supply

Complete the following steps to reinstall the power supply in the mainframe:

1. Reinstall the handle to the power supply if you removed it earlier.

2. Slide the power supply into the mainframe.

3. Push the power supply handle in firmly to ensure that the connectors are

completely seated into the back plane connectors.

4. Reinstall the blower assembly.

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

Mainframe Cover

Mainframe Removal and Installation Procedures

Remove screws (20)

Removal

To remove the mainframe cover, refer to Figure 6-- 7 while performing the
following steps (Note that this procedure assumes that the mainframe does not
include any rails for the rackmount option; if it does, remove the rails before
continuing this procedure).

1. Remove the 12 hex drive screws (6 on each side) using a 3/32 Allen wrench.

2. Remove the eight T-7 screws: four on the top front and four on the top rear.

3. Lift the front bottom corners up.

4. After tilting the cover up about 3 inches, lift the cover straight off the

instrument.

Step 1 Step 2

Step 3

Figure 6- 7: Removing the mainframe cover

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual

6- 13

Mainframe Removal and Installation Procedures

Card Guides

Installation

Removal

Complete the following steps to install the mainframe cover (refer to Figure 6--7
as necessary):

1. Slide the cover over the mainframe.

2. Tilt the rear of the cover in place and then lower the front until the cover

binds slightly (do not force the cover down).

3. Slowly push the cover down until the screw holes on the sides of the cover
line up with those on the mainframe. Use care not to damage the front panel
label while installing the cover.

4. Install the eight T-7 screws on the top of the mainframe cover; tighten them
to4in-lbs.

5. Install the remaining 12 screws on the sides of the mainframe.

6. Tighten all screws.

The card guides at the top and bottom of the mainframe are very similar. The
main difference is that the bottom guides include the spring-loaded shutters to
redirect air into the mainframe. The procedure for removing both guides is
identical. Refer to Figure 6--8 while performing the following steps:

Installation

1. Use a small flat blade screwdriver to pry up the tab of the card guide at the
front of the mainframe being careful not to damage the card guide or the
mainframe.

2. Gently pull the card guide forward until it pops out of place.

3. Remove the card guide.

Refer to Figure 6--8 while completing the following steps:

NOTE. The bottom card guides are replaced as a unit. These guides are not
intended to be disassembled.

1. Slide the card guide towards the rear of the mainframe and allow the front of
the card guide to snap into place.

2. Test the card guides in the mainframe and verify that they do not move.

6- 14

TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual