This document applies to System Software version 4.1 and above.
Warning
The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
Use, duplication, or disclosure by the Government is subject to restricti ons as set forth in subparagraph (c)(1)(ii) of the
Rights in Technical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software -- Restricted Rights clause at FAR 52.227-19, as applicable.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
WARRANTY
Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defec tive during thi s
warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, fai lure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or c onnection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product tha t has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Specifications
Operating Infromation
General Safety Summaryix...................................
Service Safety Summaryxii....................................
Table 6 --12: BIOS error codes and explanations6-- 62................
Table 7 --1: TLA721 Service Options7--1..........................
Table 7 --2: TLA7XM Service Options7--1.........................
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
vii
Table of Contents
viii
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and
certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test
leads while they are connected to a voltage source.
Ground the Product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
ix
General Safety Summary
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
CAUTION
Refer to Manual
WARNING
High Voltage
Protective Ground
(Earth) Terminal
x
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xi
Service Safety Summary
xii
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Preface
Manual Structure
This is the service manual for the TLA721 Benchtop Mainframe and the
TLA7XM Expansion Mainframe. Read this preface to learn how this manual is
structured, what conventions it uses, and where you can find other information
related to servicing this product. Read the Introduction following this preface for
safety and other important background information needed before using this
manual for servicing this product.
This manual is divided into chapters, which are made up of related subordinate
topics. These topics can be cross referenced as sections.
Be sure to read the introductions to all procedures. These introductions provide
important information needed to do the service correctly, safely, and efficiently.
A brief description of each chapter follows:
HSpecifications contains a product description of the instrument and tables of
the characteristics and descriptions that apply to it.
HOperating information includes basic controls and connectors on the
instrument. It also provides a high-level overview of the operating system
and application interface. Refer to the Tektronix Logic Analyzer Family UserManual for detailed information on the operating system and for installation
information not found in this document.
HTheory of Operation contains a high-level overview of the basic operation of
the instrument to help you service the instrument to a module level.
HPerformance Verification contains the performance verification and
certification procedures for the instrument.
HAdjustments notes that there are no adjustments for the instrument. For
adjustment information on the product modules, refer to the appropriate
service module manual.
HMaintenance contains information and procedures for doing preventative and
corrective maintenance on the instrument. Included are instructions for
cleaning, for removal and installation of replaceable parts, and for troubleshooting product failures. Instructions for shipping the instrument are
included in this chapter.
HOptions contains information on factory installed options and accessories
that may be purchased for your instrument.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xiii
Preface
Manual Conventions
HDiagrams contains block diagrams of the instrument and interconnection
diagrams useful for isolating failures in the instrument.
HMechanical Parts List includes tables of all replaceable parts for the
instrument along with the Tektronix part number.
This manual uses certain conventions that you should become familiar with
before attempting service.
Mainframes
Modules
Replaceable Parts
Safety
This manual covers at least two different kinds of mainframes. The benchtop
mainframe consists of a mainframe with a benchtop controller module. Other
slots are available for installing logic analyzer (LA) modules, digitizing
oscilloscope (DSO) modules, or pattern generator (Patgen) modules. The
expansion mainframe consists of a mainframe with an expansion controller
module. Expansion mainframes are used to expand the capabilities of a single
TLA700 Logic Analyzer.
Throughout this manual, the term module refers to a TLA700 Series Logic
Analyzer, DSO unit, or pattern generator unit that mounts inside the mainframe.
A module is composed of circuit cards, interconnecting cables, and a user-accessible front panel enclosed in a mechanical frame.
This manual refers to any field-replaceable assembly or mechanical part
specifically by its name or generically as a replaceable part. In general, a
replaceable part is any circuit board or assembly, such as the hard disk drive, or a
mechanical part, such as the I/O port connectors, that is listed in the replaceable
parts list.
Symbols and terms related to safety appear in the Service Safety Summary found
at the beginning of this manual.
Related Manuals
xiv
The following manuals are available as part of the Tektronix Logic Analyzer
Family documentation set. The procedures in this manual assume that the service
personnel have access to all manuals listed in the following table. Other manuals
may exist outside of the table as the product line offerings change. Contact your
local Tektronix Service Representative for the latest part numbers of the service
documentation. You can also obtain part numbers from the online help for the
instrument.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table i: Tektronix Logic Analyzer Family Documentation
Manual nameDescriptionService use
Preface
The Tektronix Logic Analyzer Family User
Manual
The TLA715 Portable Mainframe Service
Manual.
The TLA7Nx/TLA7Px/TLA7Qx Logic
Analyzer Module Service Manual.
The TLA7Dx/TLA7EX Digitizing Oscilloscope Module Service Manual.
The TLA7PG2 Pattern Generator Module
Service Manual.
Provides basic operation and installation
information for the Tektronix Logic Analyzer
Family.
Provides service information for the
TLA715 Portable Mainframe.
Provides service information for the logic
analyzer modules.
Provides service information for the DSO
modules.
Provides service information for the pattern
generator modules.
Installation and removal of LA, DSO, and
pattern generator modules as well as the
mainframes.
Reinstallation of the system and application
software.
Isolating and correcting failures in the
portable mainframe and expansion
mainframes.
Isolating and correcting failures in the logic
analyzer module.
Performing periodic or after-repair functional or performance verifications, calibrations,
and certifications for the logic analyzer
modules.
Performing periodic or after-repair adjustments for the logic analyzer modules.
Isolating and correcting failures in the DSO
module.
Performing periodic or after-repair functional or performance verifications, calibrations,
and certifications for the DSO modules.
Performing periodic or after-repair adjustments for the DSO modules.
Isolating and correcting failures in the
pattern generator module.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Performing periodic or after-repair functional or performance verifications, calibrations,
and certifications for the pattern generator
modules.
xv
Preface
xvi
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Introduction
This manual contains information needed to properly service the portable
mainframe. This introduction contains information critical to safe and effective
servicing.
To prevent personal injury or damage to the instrument, consider the following
requirements before attempting service:
HRead the General Safety Summary and Service Safety Summary found at the
beginning of this manual.
HRead the Operating Basics chapter for information on the controls,
connectors, and operating system. This information is useful before servicing
the instrument.
HThe procedures in this manual may only be performed by a qualified service
person.
Be sure to follow all warnings, cautions and notes.
Adjustment and Certification Interval
Service Strategy
Generally, you should perform the adjustments and certification (calibration)
once per year, or following repairs that may affect adjustment or calibration.
This manual supports and contains information needed for periodic maintenance
of the mainframe. It supports and contains information for corrective maintenance of this product:
Hsupports isolation of faults to the failed circuit board or assembly level
shown in the Replaceable Parts List
Hsupports removal and replacement of boards or assemblies
Hsupports removal and replacement of the fuse, knobs, chassis, and other
mechanical parts listed in the parts lists
This manual does not support component-level fault isolation and replacement.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xvii
Introduction
Service Offerings
Tektronix provides service to cover repair under warranty as well as other
services that are designed to meet your specific service needs.
Whether providing warranty repair service or any of the other services listed
below, Tektronix service technicians are equipped to service the instrument.
Services are provided at Tektronix Services Centers and on-site at your facility,
depending on your location.
Warranty Repair Service
Calibration and Repair
Service
Tektronix warrants this product for one year from date of purchase. The warranty
is located behind the title page in this manual. Tektronix technicians provide
warranty service at most Tektronix service locations worldwide. The Tektronix
product catalog lists all service locations worldwide.
In addition to warranty repair, Tektronix Service offers calibration and other
services which provide solutions to your service needs and quality standards
compliance requirements.
The following services can be tailored to fit your requirements for calibration
and/or repair of your portable mainframe.
Service Options. Tektronix Service Options can be selected at the time you
purchase your instrument. You select these options to provide the services that
best meet your service needs.
Service Agreements. If service options are not added to the instrument purchase,
then service agreements are available on an annual basis to provide calibration
services or post-warranty repair coverage. Service agreements may be customized to meet special turn-around time and/or on-site requirements.
Service on Demand. Tektronix offers calibration and repair services on a
“per-incident” basis that is available with standard prices.
xviii
Self Service. Tektronix supports repair to the replaceable-part level by providing
for circuit board exchange.
Use this service to reduce down-time for repair by exchanging circuit boards for
remanufactured ones. Tektronix ships updated and tested exchange boards. Each
board comes with a 90-day service warranty.
For More Information. Contact your local Tektronix service center or sales
engineer for more information on any of the Calibration and Repair Services just
described.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Contacting Tektronix
Introduction
Phone1-800-833-9200*
AddressTektronix, Inc.
Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web sitewww.tektronix.com
Sales support1-800-833-9200, select option 1*
Service support1-800-833-9200, select option 2*
Technical supportEmail: techsupport@tektronix.com
1-800-833-9200, select option 3*
1-503-627-2400
6:00 a.m. -- 5:00 p.m. Pacific time
*This phone number is toll free in North America. After office hours, please leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
xix
Introduction
xx
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
Product Description
This chapter provides a brief product description and lists the warranted
characteristics, nominal traits, and typical characteristics of the TLA721
Benchtop Mainframe and the TLA7XM Expansion Mainframe.
Both the benchtop mainframe and the expansion mainframes are basically
identical with the exception of the controllers. The benchtop mainframe includes
a PC controller that controls the entire instrument. The expansion mainframe
includes an expansion module that expands the capabilities of a benchtop
mainframe or a TLA715 Portable Mainframe. Each mainframe can function as a
logic analyzer, a digital storage oscilloscope, or a pattern generator, depending
on the module cards installed in its slots.
Benchtop Mainframe
The benchtop mainframe comprises of a benchtop chassis and the benchtop
controller. The benchtop controller is a Pentium III based, three-wide, C-size,
embedded Slot-0 Controller that incorporates the same controller as the TLA715
Portable Mainframe. The benchtop chassis is based on the high power, 13-slot,
VX1420A Mainframe without a readout and with additional labels.
The benchtop mainframe has the following key features:
HMicrosoft Windows operating system
HTen slots (excluding three slots for the benchtop controller) for compatibility
with new and existing LA, DSO, and patgen modules
HPersonal computer (PC) based processor architecture that provides a cost
effective, high-performance, system controller with automatic “PC connectivity” to a multitude off-the-shelf devices (such as Ethernet, modem,
printers) via standard PC I/O ports and two PC card (CardBus) slots
HHigh-performance PC-based display system capable of driving large,
high-resolution, external monitors in multiple user selected formats via an
external SVGA port
HEasy configuration of modules between slots and mainframes through the
automatic system configuration support of the resource manager and
application software
HPrecision clock, trigger line, and event signaling between the mainframe and
modules for real-time triggering, sequencing, and correlation of events
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1- 1
Specifications
HEasy access to field replaceable units (FRUs) to provide a low mean-time-to-
repair (MTTR) for exchange modules
HFan airflow capacity to support a reduction in audible noise levels
HMainframe compatible with international power standards, certified to
international safety and EMC requirements, and tested to rugged environmental standards
H100% hardware and software compatibility with the TLA715 Portable
Mainframe, allowing you to transport modules, data, and end-user application programs between mainframes
Expansion Mainframe
Characteristic Tables
The expansion mainframe comprises of a benchtop chassis and the expansion
module. The expansion module is a single-wide, C-size, modules that provides
cable connections to a benchtop mainframe or to a portable mainframe.
The expansion mainframe has the following key features:
HMicrosoft Windows operating system
H12 slots (excluding one slot for the expansion module) for compatibility with
new and existing LA, DSO, and patgen modules
HPrecision clock, trigger line, and event signaling between the mainframe and
modules for real-time triggering, sequencing, and correlation of events
HEasy access to field replaceable units (FRUs) to provide a low mean-time-to-
repair (MTTR) for exchange modules
HFan airflow capacity to support a reduction in audible noise levels
HMainframe compatible with international power standards, certified to
international safety and EMC requirements, and tested to rugged environmental standards
1- 2
This section contains the specifications for the portable mainframe. All
specifications are warranted unless noted “typical”. Typical characteristics
describe typical or average performance and provide useful reference information. Specifications marked with the n symbol are checked in the Performance
Verification chapter in this manual.
The specifications listed in this section are valid under the following conditions:
HThe instrument must reside in an environment with temperature, altitude,
and humidity, within the operating limits described in Table 1--9 beginning
on page 1--13.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
HThe instrument has has a warm-up period of at least 20 minutes.
Tables 1--1 through 1--2 list the specifications for the TLA721 Benchtop
Controller.
Table 1- 1: Benchtop controller characteristics
CharacteristicDescription
Operating systemMicrosoft Windows 2000
MicroprocessorIntel 733 MHz Pentium III configuration with an Intel 815E chip-set
Main memoryTwo 144 pin SODIMM sockets support one or two SDRAM modules
Available configurations16, 32, 64, 256 MB per SODIMM
Installed configuration512 MB maximum configuration
Speed133 MHz
CAS latency2, 3
RAS to CAS delay2, 3
Specifications
RAS precharge2, 3
DRAM cycle time5/7 or 7/9
Cache memory512 KB, level 2 (L2) write-back cache
Flash BIOS512 KB
Provides PC plug-and-play services with and without
Microsoft Windows operating system.
Flash based BIOS field upgradable via a floppy disk
Forced recovery jumper is provided
Real-time clock and CMOS setups NVRAMReal-time clock/calendar. Standard and advanced PC CMOS setups: see BIOS
specifications
RTC, CMOS setup, & PnP NVRAM retention
time (Typical)
I/O data-transfer rate33.3 MB/s maximum (U-DMA mode 2)
Average latency7/14 ms
Cache buffer512 KB
CD ROM driveStandard PC compatible IDE (Integrated device Electronics)
24X (minimum) CD ROM drive residing on an EIDE interface
Continually subject to change due to the fast-moving PC component environment
Applicable formatsCD-DA; CE-ROM Mode 1, Mode 2; CD-ROM XA Mode 2 (Form 1, Form 2); Photo CD
(single/multi session); Enhanced CD
InterfaceIDE (ATAPI)
Average access time130 ms
Data-transfer rate (burst sustained)16.7 MB per second maximum, 1290--3000 KB per second
Display classificationStandard PC graphics accelerator technology (bitBLT based) residing on t he
Peripheral Component Interconnect (PCI) bus capable of supporting external color
VGA, SVGA, or XGA monitors
Display configurationHardware automatically senses a missing flat panel LCD in the benchtop mainframe
and defaults to the external SVGA monitor output during the BIOS boot sequence (no
internal TFT LCD display exists). This is indicated by a singl e beep during the boot
sequence.
Dynamic Display Configuration 1 (DDC1) support for the external monitor is provided.
Display memory4 MB SDRAM is on board the video controller; there is no external video memory
Display driveOne VGA, SVGA, or XGA compatible analog output port
Display sizeUser selected via Microsoft Windows
Plug and Play support for DDC1 and DDC2 A and B
(Primary with Silicon Motion Chip)
Resolution (Pixels)ColorsRefresh Rates
640 x 480256, 64 K, 16.8 M 60, 75, 85
800 x 600256, 64 K, 16.8 M 60, 75, 85
1024 x768256, 64 K, 16.8 M 60, 75, 85
1280 x 1024256, 64 K, 16.8 M 60
1600 x 600256, 64 K60
1600 x 1200256, 64 K60
(Secondary with 815E Chip set)
Resolution (Pixels)ColorsRefresh Rates
640 x 480256, 64 K, 16.8 M 60, 75, 85
800 x 600256, 64 K, 16.8 M 60, 75, 85
1024 x768256, 64 K, 16.8 M 60, 75, 85
1280 x 1024256, 64 K, 16.8 M 60, 75, 85
1600 x 120025660, 75
1- 4
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
Table 1- 2: Front panel characteristics
CharacteristicDescription
SVGA output port (SVGA)Two 15-pin sub-D SVGA connectors
Dual USB portsTwo USB (Universal Serial Bus) compliant ports
Mouse portFront panel mounted PS2 compatible mouse port utilizing a mini DIN connector
Keyboard portFront panel mounted PS2 compatible keyboard port utilizing a mini DIN connector
Parallel interface port (LPT)36-pin high-density connector supports standard Centronics mode, Enhanced Parallel
Port (EPP), or Microsoft high-speed mode (ECP)
Serial interface port (COM)9-pin male sub-D connector to support an RS232 serial port
PC CardBus32 portStandard Type I and II PC compatible PC card slot
Type I, II, and III PC Card PortStandard Type I, II, and III PC compatible PC card slot
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1- 5
Specifications
Table 1- 3: Backplane interface
CharacteristicDescription
Slots
Benchtop mainframe13
Expansion mainframe13
CLK10 Frequency10 MHz ±100 PPM
n
Relative Time Correlation Error
LA to LA “MagniVu” data2 ns
LA to LA “normal” data utilizing an internal clock
LA to LA “normal” data utilizing an external clock2ns
LA “MagniVu” to DSO data
LA to DSO “normal” data utilizing an internal clock
LA to DSO “normal” data utilizing an external clock
DSO to DSO
3
1,2
3
(Typical)
4
1 LA sample -- 0.5 ns
3ns
3,4
3,5
1 LA sample ± 2ns
3ns
3ns
Enhanced monitor
Voltage readout+24 V, --24 V, +12 V, --12V, +5 V, --5.2 V, --2 V, +5 V
present, and +5 V
External
via RS232
Voltage readout accuracy (Typical)±3% maximum
Current readoutReadout of t he present current on the +24 V, --24 V, +12 V,
--12 V, +5 V, --2 V, --5.2 V rails via RS232
Current readout accuracy (Typical)±5% of maximum power supply I
mp
Rear panel connector levels±25 VDC maximum, 1 A maximum per pin
(Provides access for RS-232 host to enhanced monitor)
1
Includes typical jitter, slot-to-slot skew, and probe-to-probe variations to provide a “typical” number for the measurement. Assumes standard accessory probes are utilized.
2
For time intervals longer than 1 s between modules, add 0.01% of the difference between the absolute tim e
measurements to the relative time correlation error to account for the inaccuracy of the CLK10 source.
3
The DSO module time correlation is measured at the maximum sample rate on one channel only.
4
Sample represents the time from the event to the next valid data sample at the probe tip of the LA. In the normal
Internal clock mode, this represents the delta time to the next sample clock
5
On this measurement, the DSO is measuring the CLK channel of the LA. If the DSO is measuring a data channel, the
time from when the data edge occurs until the clock edge occurs must be included.
Standby
if
1- 6
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
Table 1- 4: External signal interface
CharacteristicDescription
Intermodule signal line bandwidth
Signal 1, 2 (ECLTRG0,1)
Signal 3, 4 (TTLTRG0,1)
System trigger inputTTL compatible input via front panel mounted SMB connectors (benchtop controller)
The Input Bandwidth specification only applies to signals to the modules; it does not apply to signals applied to the
External Signal Input and sent back to the External Signal Output.
2
The Output Bandwidth specification only applies to signals from the modules; it does not apply to signals applied to the
External Signal Input and sent back to the External Signal Output.
1- 8
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
(DSO1: Trigger all Modules
DSO2: Wait for System Trigger)
DSO to LA inter-module ARM (TTLTRG2,4,5,6)
DSO to DSO inter-module ARM (TTLTRG2,4,5,6)59 ns95 ns
DSO to LA inter-module via Signal 1, 2(ECLTRG0,1)
(DSO: Trigger and set Signal 1
LA: Wait for Signal 1, then Trigger)
DSO to LA inter-module via Signal 3, 4 (TTLTRG0,1)
(DSO: Trigger and set Signal 3
LA: Wait for Signal 3; then Trigger)
1
SMPL represents the time from the event at the probe tip inputs to the next valid data sample of the LA module. In the
Normal Internal clock mode, this represents the delta time to the next sample clock. In the MagniVu Internal clock mode,
this represents 500 ps or less. In the External clock mode, this represents the time to the next master clock generated by
the setup of the clocking state machine, the system-under-test supplied clocks, and the qualification data.
2
All system trigger and external signal input latencies are measured from a falling-edge transition (active true low) with
signals measured in the wired-OR configuration.
3
All signal output latencies are validated to the rising edge of an active (true) high output.
4
In the Waveform window, triggers are always marked immediately except when delayed to the first sample. In the Listing
window, triggers are always marked on the next sample period following their occurrence.
5
“Clk” represents the time to the next master clock at the destination logic analyzer. In the asynchronous (or internal)
clock mode, this represents the delta time to the next sample clock beyond the minimum asynchronous rate of 4 ns. In
the synchronous (or external) clock mode, this represents the time to the next master clock generated by the setup of the
clocking state machine and the supplied system under test clocks and qualification data.
6
Signals 1 and 2 (ECLTRG0, 1) are limited to a “broadcast” mode of operation, where only one source is allowed to drive
the signal node at any one time. That single source may be utilized to drive any combination of destinations.
4
5
5, 6
--240 ns--204 ns
4
50 ns86 ns
--192 ns + Clk--156 ns + Clk
--179 ns + Clk--158 ns + Clk
5
--184 ns + Clk--148 ns + Clk
1- 10
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
(
,
v
a
geava
(CombinedSystem,voltageavail-
Table 1- 6: Benchtop and expansion mainframe AC power source
CharacteristicDescription
Source voltage90--250 V
100--132 V
Maximum power consumption1450 W l ine power (the maximum power consumed by a fully loaded 13-slot
instrument)
Fuse rating
(Current and voltage ratings and type of fuse
used to fuse the source line voltage)
45--66 Hz, continuous range CAT II
RMS,
360--440 Hz, continuous range CAT II
RMS,
90 V -- 132 VAC
High-power/Low Line (159-0379-00)
RMS
operation
Safety: UL198G/CSA C22.2
Size: 0.25 in × 1.25 in
Style: Slow acting
Rating: 20 A/250 V
103 V -- 250 VAC
(159-0256-00)
RMS
operation
Safety: UL198G/CSA C22.2
Size: 0.25 in × 1.25 in
Style: No. 59/Fast acting
Rating: 15 A/250 V
207 V -- 250 VAC
(159-0381-00)
RMS
operation
Safety: IEC 127/Sheet 1
Size: 5 mm × 20 mm
Style: Fast acting “F”, high-breaking capacity
Rating: 6.3 A/250 V
Inrush surge current70 A maximum
Steady state input current16.5 A
6.3 A
maximum at 90 VAC
RMS
maximum at 207 VAC
RMS
RMS
RMS
Powerfactorcorrection(Typical)0.99 at 60 Hz operation and 0.95 at 400 Hz operation
ON/Standby switch and indicatorFront Panel On/Standby switch with integral power indicator
Table 1- 7: Benchtop and expansion mainframe secondary power
CharacteristicDescription
n DC Voltage regulationVoltageMinimumNominalMaximum
Combined System
able at each slot)
olt
+24 V23.28 V24.24 V25.20 V
il-
+12 V
+5 V
-- 2 V
-- 5 . 2 V
-- 1 2 V
11.64 V12.12 V12.60 V
4.875 V5.063 V5.250 V
--2.10 V--2.00 V--1.90 V
--5.460 V--5.252 V--5.044 V
--12.60 V--12.12 V--11.64 V
-- 2 4 V--25.20 V--24.24 V--23.28 V
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1- 11
Specifications
Table 1- 8: Benchtop and expansion mainframe cooling
CharacteristicDescription
Cooling systemForced air circulation system (positive pressurization) using a single low-noise
centripetal (squirrel cage) fan configuration with no filters for the power supply and 13
module slots.
Fan speed controlRear panel switch selects between full speed and variable speed. Slot exhaust
temperature and ambient air temperature are monit ored such that a constant delta
temperature is maintained.
Slot activationInstalling a module activates the cooling for the corresponding occupied slots by opening
the air flow shutter mechanism. Optimizes cooling efficiency by only applying airflow to
modules that are installed.
PressurizationPositive pressurization system, all chambers including modules
Slot airflow directionP2 to P1, bottom of module to top of module
Mainframe air intakeLower fan-pack rear face and bottom
Mainframe air exhaustTop-sides and top-rear back. Top rear-back exhaust redirected to the sides by the fan
pack housing to minimize reentry into the intake.
∆ Temperature readout sensitivity100 mV/°Cwith0°C corresponding to 0 V output
Temperature sense range-- 1 0 °Cto+90°C, delta temperature ≤ 50°C
Clearance2 in (51 mm), rear, top, and sides
Fan speed readoutRPM = 20 ¢ (Tach frequency) or 10 (+Pulse Width)
where (+Pulse Width) is the positive width of the TACH1 fan output signal measured
in seconds
Fan speed range650 to 2250 RPM
1- 12
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table 1- 9: Atmospheric characteristics
CharacteristicDescription
Temperature:
Operating and nonoperating
Operating (no media in floppy disk drive):
+5_Cto+50_C, 15_C/hr maximum gradient, non-condensing
(derated 1_C per 1000 ft above 5000 foot altitude
Line voltage derated for temperatures > 40_, maximum output power reduced 15W/_C for line
voltage < 110 VAC)
Nonoperating (no media in floppy disk drive or CD ROM drive):
-- 2 0 _Cto+60_C, 15_C/hr maximum gradient, non-condensing.
Specifications
Relative Humidity:
Operating and nonoperating
Altitude:
Operating and nonoperating
Operating (no media in floppy disk drive or CD ROM drive):
20% to 80% relative humidity, non-condensing. Maxi mum wet bulb temperature: +29_C
(derates relative humidity to approximately 22% at +50_C).
Nonoperating (no media in floppy disk drive or CD ROM drive):
8% to 80% relative humidity, non-condensing. Maxi mum wet bulb temperature: +29_C (derates
relative humidity to approximately 22% at +50_C).
Operating:
To 10,000 ft (3048 m), (derated 1_C per 1000 ft (305 m) above 5000 ft
(1524 m) altitude)
Nonoperating:
40,000 ft (12192 m).
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1- 13
Specifications
Table 1- 10: Mechanical characteristics
CharacteristicDescription
Mainframe dimensions(See Figures 1--1 and 1--2 for overall dimensions.)
Standard
Height (with feet)13.7 in (346.7 mm) including feet
Width16.7 in (424.2 mm)
Depth26.5 in (673.1 mm)
Rackmount
Height13.25 in (336.6 mm)
Width18.9 in (480.1 mm)
Depth28.9 in to 33.9 in (734.1 mm to 861.1 mm) in 0.5 in i ncrements, user selectable
Benchtop controller dimensions
Height10.32 in (262.1 mm)
Width2.39 in (60.7 mm)
Depth14.75 in (373.4 mm)
Expansion module dimensions
Height10.32 in (262.1 mm)
Width1.25 in (31.75 mm)
Depth14.75 in (373.4 mm)
Weight
Mainframe with benchtop controller and
slot fillers
(Typical)
Shipping configuration
(Typical)
Benchtop controller6 lbs 10 oz. (3.0 kg)
Expansion module3 lbs (1.4 kg)
Maximum per slot5lbs(2.27kg)
Rackmount kit adder20 lbs (9.1 kg)
58 lbs 11 oz. (26.7 kg)
60 lbs 11 oz. (26.7 kg) minimum configuration with controller (only) and all standard
accessories (two manuals, five dual-wide and one single-wide slot filler panels, power
cord, empty pouch, front cover, keyboard, software, and cables)
187 lbs (85 kg) fully configured,
Same as above with the addition of five LA modules (four TLA7P4 modules, one
TLA7N4 module) and all module standard accessories (probes and clips)
Size
Benchtop controllerThree slots wide
Expansion moduleSingle slot wide
1- 14
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Specifications
Table 1- 10: Mechanical characteristics (Cont.)
CharacteristicDescription
Acoustic noise level (Typical)
Variable fan speed (at 860 RPM)43.2 dBA weighted (front)
43.8 dBA weighted (back)
Full speed fan (switched at rear)66.2 dBA weighted (front)
66.2 dBA weighted (back)
Construction materialsChassis parts, aluminum alloy
Front panel and trim pieces, plastic
Circuit boards, glass laminate
Finish typeMainframes are Tektronix silver gray with dark gray trim on fan pack and bottom feet
support rails.
Benchtop controllers are Tektronix silver gray on front lexan and injector/ejector
assemblies with a black FDD and PC card ejector buttons
16.7 in
(42.4 cm)
13.7 in
(35 cm)
13.3 in
(34 cm)
Figure 1- 1: Dimensions of the benchtop and expansion mainframe
26.5 in
(67 cm)
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1- 15
Specifications
g
18.9 in
(48 cm)
13.25 in
(33.66 cm)
28.9in(73.4cm)Minto
33.9 in (86.1 cm) Max
Figure 1- 2: Dimensions of the benchtop and expansion mainframe with rackmount option
Table 1- 11: Certifications and compliances
CategoryStandards or description
EC Declaration of Conformity -EMC
Meets intent of Directive 89/336/EEC for Electromagnetic Compatibility. Compliance was
demonstrated to the following specifications as listed in the Official Journal of the European
Communities:
EN 61326EMC requirements for Class A electrical equipment for
measurement, control and laboratory use.
1
IEC 61000--4--2Electrostatic discharge immunity (Performance criterion B)
IEC 61000--4--3RF electromagnetic field immunity (Performance criterion A)
IEC 61000--4--4Electrical fast transient / burst immunity (Performance criterion B)
IEC 61000--4--5Power line surge immunity (Performance criterion B)
IEC 61000--4--6Conducted RF immunity (Performance criterion A)
IEC 61000--4--11Voltage dips and interruptions immunit y (Performance criterion B)
EN 61000--3--2AC power line harmonic emissions
Australia / New Zealand
Declaration of Conformity-EMC
EC Declaration of Conformity -Low Voltage
Complies with EMC provision of Radiocommunications Act per the following standard(s):
AS/NZS 2064.1/2Industrial, Scientific, and Medical Equipment: 1992
Compliance was demonstrated to the following specification as listed in the Official Journal of the
European Communities:
Low Voltage Directive 73/23/EEC, amended by 93/68/EEC
EN 61010-1/A2:1995Safety requirements for electrical equipment for measurement
control and laboratory use.
Canadian CertificationCAN/CSA C22.2 No. 1010.1Safety requirements for electrical equipment for measurement,
control, and laboratory use.
1
Emissions which exceed the levels required by this standard may occur when this equipment is connected to a test
object.
1- 16
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table 1- 11: Certifications and compliances (Cont.)
g
y
CategoryStandards or description
Specifications
Installation (Overvoltage)
Category
Pollution DegreeA measure of the contaminates that could occur in the environment around and within a product.
Safety Certification Compliance
Equipment TypeTest and measuring
Safety ClassClass 1 (as defined in IEC61010-1, Annex H) -- grounded product
Overvoltage CategoryOvervoltage Category II (as defined in IEC61010-1, Annex J)
Pollution DegreePollution Degree 2 (as defined in IEC61010-1). Note: Rated for i ndoor use only.
Terminals on this product may have different installation (overvoltage) category designations. The
installation categories are:
CAT IIIDistribution-level mains (usually permanently connected). Equipment at this level is
typically in a fixed industrial location.
CAT IILocal-level mains (wall sockets). Equipment at this level includes appliances, portable
tools, and similar products. Equipment is usually cord-connected.
CAT ISecondary (signal level) or battery operated circuits of electronic equipment.
Typically the internal environment inside a product is considered to be the same as the external.
Products should be used only in the environment for which they are rated.
Pollution Degree 2Normally only dry, nonconductive pollution occurs. Occasionally a
temporary conductivity that is caused by condensation must be
expected. This location is a typical office/home environment.
Temporary condensation occurs only when the product is out of
service.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1- 17
Specifications
1- 18
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Operating Information
This chapter contains high-level information about operating the TLA721
Benchtop Mainframe and the TLA7XM Expansion Mainframe. It also provides
information on the controls and connectors on the instrument. The last part of the
chapter contains information on SCPI commands that you can use to service the
mainframe from a remote host.
Installation
Complete installation procedures are described in the Tektronix Logic Analyzer
Family User Manual; refer to that manual for detailed installation instructions.
Install any modules that are required for your application before applying power
to the instrument.
If you are operating the instrument on a bench (without a rackmount) ensure a
two-inch (5.1 cm.) clearance around the instrument for proper cooling.
CAUTION. Connect the keyboard, mouse, and other accessories before applying
power to the instrument.
Selecting the Correct
Power Cord and Fuse
Connecting accessories after applying power to the instrument can damage the
instrument or the accessories.
The mainframe comes standard with two power cords and three fuses. Before
installing the instrument you must determine the correct fuse and power cord for
your application. If you are uncertain of the power requirements of the instrument, refer to Power Cord and Line Fuse Requirements for the Benchtop andExpansion Mainframes in the Tektronix Logic Analyzer Family User Manual.
This information is important to avoid overloading the power distribution system
and to comply with the National Electrical Code.
For card cage loads in the nonshaded region of Figure 2--1, use the power cord
with the 15 A plug (Tektronix part number 161-0213-XX) or the power cord
with the 20 A plug (Tektronix part number 161-0218-XX). For high card cage
loads combined with low input line voltages (shaded region), use only the power
cord with the 20 A plug.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 1
Operating Information
Select the proper fuse based on the ranges shown in Figure 2--1.
Power-on Procedure
Power Cord with 20A plug (NEMA 5--20P) O NLY!
Power Cord with 15A plug (NEMA 5--15P)
Power Cord with 20A plug (NEMA 5--20P)
130150170190210230250
Input Line Voltage (Volts AC)
6.3AF Fuse
Card Cage Power Consumption (Watts)
800
700
600
500
400
300
200
100
0
90110
20AT Fuse
115
15AF Fuse
Figure 2- 1: Power cord identification chart
Complete the following steps to power on the instrument.
1. If you have not already done so, select the proper power cord and fuse as
described in the previous paragraphs.
2. If you have an expansion mainframe, connect the expansion mainframe to
the benchtop mainframe as described in the Tektronix Logic Analyzer FamilyUser Manual.
2- 2
3. Connect the external monitor.
4. Power on the monitor.
5. Press the On/Standby switch to turn on the mainframe (if you have an
expansion mainframe attached, it should automatically power on when you
turn on the benchtop mainframe.
6. Wait for the instrument to complete the power-on self tests, start Windows,
and start the logic analyzer application.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Mainframe Controls and Connectors
Figure 2--2 shows the front view of the benchtop mainframe with a benchtop
controller installed. The benchtop mainframe and the expansion mainframe are
basically identical with the exception of the front panel labels. Slots 3 through 11
are labeled on the top and bottom of the instrument. Slots 0, 1 and 2 are reserved
for the three slot-wide controller, all other slots are available for any other
TLA700 Series module.
When you install a module, shutters on the bottom of each slot automatically
open to provide cooling.
Operating Information
Figure 2- 2: Front view of the benchtop chassis with a benchtop controller
On/Standby Switch
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
The On/Standby switch on the top-left corner of the front panel applies DC
voltages to the mainframe. The switch is a momentary contact switch. The
switch is lighted when DC voltages are applied to the instrument.
2- 3
Operating Information
AC Power
Figure 2--3 shows the rear view of the mainframe along with some of the key
connectors.
25-Pin PASSIVE
MONITOR connector
Fan speed switch
Fuse
AC Power Connector
Chassis Ground Screw
Fan Speed Switch
Passive Monitor
Connector
Figure 2- 3: Rear view of the benchtop chassis
The AC power connector is located on the rear bottom left side of the instrument. The AC fuse holder is located just above the power connector.
The chassis ground screw can be used to connect more than one instrument to a
common ground point.
The fan speed switch controls the speed of the fan (blower). When the switch is
set to the VAR (variable) position, the mainframe automatically controls the
speed of the blower depending on the air temperature and amount of cooling
required by the modules. When the switch is in the FULL position, the blower
operates at full speed.
The 25-pin Sub-D connector lets you monitor the power supply voltages, fan
speed, and the maximum slot temperature rise within the mainframe.
The connector also provides remote on and off capability and access to the SYSRESET* and ACFAIL* signals.
Figure 2--4 shows the location of the Passive Monitor Connector. Table 2--1 lists
the pin out of the Passive Monitor Connector and its function.
2- 4
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Pin 1
Pin 25
Operating Information
Figure 2- 4: Passive monitor connector
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 5
Operating Information
Table 2- 1: Passive monitor connector pinouts
PinFunctionDescription
1+5 VM+5 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
2-- 1 2 V M--12 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
3-- 2 4 V M--24 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
4-- 2 V M--2 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
5ON/STRemote On/Standby Power Switch.
6+5 VC+5 V output for charging batteries, running external TTL circuitry,
1Amaximum
7+12 VC+12 V output for charging batteries, running external TTL circuitry,
1Amaximum
1
8+5 VBInput for +5 V standby voltage (for example, from an external
battery). Maximum of 1 A total (pins 8 and 21 combined)
2
9GNDLogic Ground
10SYSRESET*Backplane SYSRESET* signal (input or output). If you use this pin,
do not violate VXIbus electrical specifications (keep the extender
cable as short as possible).
11∆TAn analog output signal proportional to the maximum temperature
rise of the 13 modules (100 mV/°C) 0V=0°C
12TACH1A square wave output signal whose period is proportional to the
speed of fan number 1
13TACH2A square wave output signal whose period is proportional to the
speed of fan number 2 when a second fan is used. In the current
mainframe only a single fan is used.
14+12 VM+12 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
15+24 VM+24 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
16-- 5 . 2 V M--5.2 V for voltage monitoring
To monitor, only use a probe with greater than 1 MΩ impedance.
17GNDLogic Ground
18GNDLogic Ground
2- 6
19GNDLogic Ground
20GNDLogic Ground
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
21+5 VBInput for +5 V standby voltage (for example, from an external
battery). Maximum of 1 A total (pins 8 and 21 combined)
22GNDLogic Ground
23ACFAIL*Backplane ACFAIL* signal output. If you use this pin, do not violate
the VXIbus electrical specifications (keep the extender cable as
short as possible).
Refer to VMEbus Specification Manual for details on using the
ACFAIL* and SYSRESET* signals.
24GNDLogic Ground
25RSVRequest Service signal
1
By momentarily grounding this line, the mainframe will toggle from on to off (or vice
3
versa). The state changes on the falling edge of the signal. Hold the signal low for at
least 500 ms before releasing. Attach only a momentary switch or an open collector
device to drive this line. The line is pulled up to 1 V internally.
2
If you use pins 8 and 21 (+5 VB) to supply +5 V Standby to the backplane, make sure
that the rear panel jumper is in the correct position (refer to Enhanced Monitor BoardJumpers on page 2- 9).
3
The RSV signal is equivalent to the IEEE 488.1 SRQ signal. The signal is asserted (0)
when an enable event is generated; the signal is unasserted(1) when the event is
cleared by reading the event register. This line is an open collector output. The
signal can be stand-alone or multiple mainframes can be tied together. If you tie
multiple mainframes together, each mainframe must be polled to determine the
source of the service request.
2
Enhanced Monitor
The enhanced monitor, in addition to the DB25-pin connector and the fan switch,
includes an industry standard 9-pin RS-232 serial port, logical address switches, a
jumper for slot-1 or slot-12 MODID selection, an auxiliary power connection, a slot
for adding programming FLASH jumper, and status lights. Refer to Figure 2--5.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 7
Operating Information
RS-232C connector
MONITOR BACKUP
POWER SUPPLY
LOGICAL ADDRESS switches
READY light
ACCESSED light
MODID Jumper Selection
Figure 2- 5: Rear view of the enhanced monitor
The logical address switches select the logical addresses for the enhanced
monitor. The top switch sets the most-significant digit, the bottom switch sets
the least-significant digit. It is recommended that you set the address switches to
FF so that the resource manger can dynamically configure the instruments
address; if you select any other address, you must be careful to select a unique
address.
The green READY indicator lights after the power-on diagnostics are complete
and there are no failures. During normal operation, the light flashes if there is a
pending error message. Once all error messages have been retrieved, the READY
indicator stops flashing and remains on.
The amber ACCESSED indicator lights when the MODID line is accessed by
the slot 0 device.
An auxiliary power connector (MONITOR BACKUP POWER SUPPLY) allows
you to apply +5 V to the enhanced monitor board to provide RS-232 communication with the enhanced monitor while the mainframe is not powered on. The
jumper located just above the power connector determines whether you source
the +5 V standby voltage from the monitor backup power supply connector or
from the 25-pin connector.
2- 8
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Operating Information
The enhanced monitor board has two jumpers accessible from the rear of the
mainframe. Figure 2--6 shows the factory default settings of these jumpers.
+5V Standby sourced from
monitor backup power supply
(default)
+5V Standby sourced
from P9, pins 8 & 21
MODID12
MODID01
(default)
Figure 2- 6: Enhanced monitor board jumpers
You can also select the source of the +5 V Standby voltage. If you source the
+5 V Standby voltage from the +5 V external supply (monitor backup power
supply connector), then the external supply will provide the backplane with the
+5 V external voltage (1 A maximum). If you source the +5 V Standby voltage
from the 25-pin connector, you must provide the +5 V to pins 8 and 21 of the
25-pin connector. The default jumper setting is to provide the voltage from the
external source (+5 V external power supply).
The enhanced monitor can answer to the slot 1 or slot 12 MODID line for the
configuration manager. The default position is slot 12.
In order to flash the enhanced monitor board with the latest firmware, you need
to install a firmware loader jumper at the location shown in Figure 2--7.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 9
Operating Information
MOD ID jumper
Enhanced Monitor RS-232
Connector
Flesh jumper
Figure 2- 7: Enhanced monitor board flash jumper
The Enhanced Monitor includes a 9-pin RS-232 connector that allows connection to a RS-232 host. Figure 2--8 shows the pin assignments of the 9-pin
RS-232 connector; Table 2--2 describes the pin assignments. Use this port to read
the status of the mainframe using the SCPI commands documented at the end of
this chapter.
2- 10
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table 2- 2: RS-232 pin connector
PinDescription
ShieldProtective Ground
1No Connection
2Receive Data (RxD)
3Transmit Data (TxD)
4Data Terminal Ready (DTR)
5Signal Ground (GND)
6No Connection
7Request to Send (RTS)
8Clear to Send (CTS)
9No Connection
Operating Information
Pin 1
Pin 9
RS 232C
I/O levels
±
25 VDC MAX
1A MAX PER PIN
Figure 2- 8: Enhanced Monitor RS-232 connector
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 11
Operating Information
Backplane Connectors
Table 2--3 s hows the P1 connector pinouts for all slots in the mainframe.
Table 2--4 s hows the P2 connector pinouts for slots 1 to 12 and Table 2--5 shows
the pinouts for the Slot 0 P2 connector.
2- 12
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Operating Information
Table 2- 3: P1 connector pinouts
PinRow ARow BRow C
1D00BBSY*D08
2D01BCLR*D09
3D02ACFAIL*D10
4D03BG0IN*D11
5D04BG0OUT*D12
6D05BG1IN*D13
7D06BG1OUT*D14
8D07BG2IN*D15
9GNDBG2OUT*GND
10SYSCLKBG3IN*SYSFAIL*
11GNDBG3OUT*BERR*
12DS1*BR0*SYSRESET*
13DS0*BR1*LWORD*
14WRITE*BR2*AM5
15GNDBR3*A23
16DTACK*AM0A22
17GNDAM 1A21
18AS*AM2A20
19GNDAM 3A19
20IACK*GNDA18
21IACKIN*SERCLKA17
22IACKOUT*SERDAT*A16
23AM4GNDA15
24A07IRQ7*A14
25A06IRQ6*A13
26A05IRQ5*A12
27A04IRQ4*A11
28A03IRQ3*A10
29A02IRQ2*A09
30A01IRQ1*A08
31-- 1 2 V+5 V STDBY+12 V
32+5 V+5 V+5 V
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 13
Operating Information
Table 2- 4: P2 connector pinouts for slots 1 - 12
PinRow ARow BRow C
1ECLTRG0+5 VCLK10+
2-- 2 VGNDCLK10--
3ECLTRG1RSV1GND
4GNDA24-- 5 . 2 V
5LBUSA00A25LBUSC00
6LBUSA01A26LBUSC01
7-- 5 . 2 VA27GND
8LBUSA02A28LBUSC02
9LBUSA03A29LBUSC03
10GNDA30GND
11LBUSA04A31LBUSC04
12LBUSA05GNDLBUSC05
13-- 5 . 2 V+5 V-- 2 V
14LBUSA06D16LBUSC06
15LBUSA07D17LBUSC07
16GNDD18GND
17LBUSA08D19LBUSC08
18LBUSA09D20LBUSC09
19-- 5 . 2 VD21-- 5 . 2 V
20LBUSA10D22LBUSC10
21LBUSA11D23LBUSC11
22GNDGNDGND
23TTLTRG0*D24TTLTRG1*
24TTLTRG2*D25TTLTRG3*
25+5 VD26GND
26TTLTRG4*D27TTLTRG5*
27TTLTRG6*D28TTLTRG7*
28GNDD29GND
29RSV2D30RSV3
2- 14
30MODIDD31GND
31GNDGND+24 V
32SUMBUS+5 V-- 2 4 V
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Operating Information
Table 2- 5: P2 connector pinouts for slot 0
PinRow ARow BRow C
1ECLTRG0+5 VCLK10+
2-- 2 VGNDCLK10--
3ECLTRG1RSV1GND
4GNDA24-- 5 . 2 V
5MODID12A25LBUSC00
6MODID11A26LBUSC01
7-- 5 . 2 VA27GND
8MODID10A28LBUSC02
9MODID09A29LBUSC03
10GNDA30GND
11MODID08A31LBUSC04
12MODID07GNDLBUSC05
13-- 5 . 2 V+5 V-- 2 V
14MODID06D16LBUSC06
15MODID05D17LBUSC07
16GNDD18GND
17MODID04D19LBUSC08
18MODID03D20LBUSC09
19-- 5 . 2 VD21-- 5 . 2 V
20MODID02D22LBUSC10
21MODID01D23LBUSC11
22GNDGNDGND
23TTLTRG0*D24TTLTRG1*
24TTLTRG2*D25TTLTRG3*
25+5 VD26GND
26TTLTRG4*D27TTLTRG5*
27TTLTRG6*D28TTLTRG7*
28GNDD29GND
29RSV2D30RSV3
30MODID00D31GND
31GNDGND+24 V
32SUMBUS+5 V-- 2 4 V
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 15
Operating Information
Benchtop Controller Controls and Connectors
The benchtop controller is an integral part of the benchtop mainframe. The
module is a slot zero device and occupies three slots, 0 through 2 in the benchtop
mainframe.
LED Indicators
The benchtop controller has four LED indicators located on the front panel.
Figure 2--9 shows the front panel with the location of the LED indicators and
front panel connectors.
SLEEP Indicator
RUN Indicator
SYSTEM FAIL Indicator
TEST Indicator
Floppy Disk Drive
Secondary Video
PCMCIA PC Cards (2)
CD-ROM Drive
COM Port
2- 16
Primary Video
USB Ports (2)
Mouse
Keyboard
Figure 2- 9: Front view of the benchtop controller
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Replaceable Hard Disk Drive
SYSTEM TRIG IN
SYSTEM TRIG OUT
EXTERNAL SIG IN
EXTERNAL SIG OUT
Operating Information
SLEEP Indicator. Indicates that the benchtop controller is in sleep mode.
RUN Indicator. Indicates that the memory is accessing data.
SYSTEM FAIL Indicator. Indicates a SYSFAIL condition exists on the communica-
tions bus.
TEST Indicator. Indicates that the benchtop controller is executing a power-on self
test (POST) diagnostic test sequence.
Mouse Port
Keyboard Port
The mouse connector is a standard six-pin, PS/2-compliant DIN connector. The
mouse port can be connected to an external, standard PS/2-compliant three-button wheel mouse. Table 2--6 lists the pin assignments.
Table 2- 6: Mouse port pin assignments
Pin numberPin Assignment
1Data
2No connection
3GND
4+5 V
5Clock
6GND
The keyboard connector is a standard six-pin PS/2-compliant DIN connector.
The keyboard port can be connected to an external, standard PS/2-compliant
keyboard. Table 2--7 lists the pin assignments.
Table 2- 7: Keyboard port pin assignments
Pin numberPin Assignment
1Data
2No connection
3GND
4+5 V
5Clock
6GND
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 17
Operating Information
Replaceable
Hard Disk Drive
Floppy Disk Drive
CD ROM
PC CardBus32 Port
There is one replaceable hard drive. Because of the speed at which the PC
industry evolves, the hard disk drive size is subject to change. This service
manual lists the size of the hard disk drive available at the time the product was
introduced.
There is one standard high-density/double-sided floppy disk drive.
There is one CD ROM drive. Because of the speed at which the PC industry
evolves, the CD ROM drive is subject to change. This service manual lists the
speed of the CD ROM drive available at the time the product was introduced.
There are two PC Card Bus slots. The PC card(s) can be inserted in either slot, or
two cards can occupy both slots at the same time. The PC card port supports an
optional Ethernet NIC (network interface card). Table 2--8 shows the pin
assignments.
2- 18
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
There are two USB (universal serial bus) ports. The USB ports can be used for
any USB complaint device. Table 2--9 shows the pin assignments for the US B
ports.
Table 2- 9: USB pin assignments
Pin numberPin functionPin numberPin function
A1VccB1Vcc
A2ADATA--B2BDATA--
A3ADATA+B3BDATA+
A4GNDB4GND
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 19
Operating Information
SVGA Ports
COM Port
Two SVGA ports (Primary and Secondary) support industry standard SVGA
color monitors. Table 2--10 lists the pin assignments for both ports.
Table 2- 10: SVGA OUT pin assignments
Pin numberPin functionPin numberPin function
1Red2Green
3Blue4DDC DB2
5GND6GND
7GND8GND
9(KEY)10GND
11DDC DB012DDC DB1
13HSYNC14VSYNC
15DDC DB3
The COM port on the benchtop controller is an industry standard RS-232 serial
port. Table 2--11 lists the pin assignments for the port.
System Trig In Connector
System Trig Out
Connector
Ext Sig In Connector
Table 2- 11: RS-232 Port pin assignments
Pin numberPin functionPin numberPin function
1DCD2RXD
3TXD4DTR
5GND6DSR
7RTS8CTS
9Ring indicator
The system trigger input is a TTL compatible signal input that is user definable
in software. This connector is a sub-miniature bayonet (SMB) connector.
The system trigger output is a TTL compatible output signal that is user
definable in software. This connector is a sub-miniature bayonet (SMB)
connector.
The external signal Input is a TTL compatible input signal that is user definable
in software. This connector is a sub-miniature bayonet (SMB) connector.
2- 20
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Operating Information
Ext Sig Out Connector
LPT Port
The external signal output is a TTL compatible output signal that is user
definable in software. This connector is a sub-miniature bayonet (SMB)
connector.
The LPT port is a parallel printer port. This parallel printer port supports
standard Centronics mode, Enhanced Parallel Port (EPP), or Microsoft highspeed mode (ECP) and has a 36-pin high density Centronics-compliant
connector. See Table 2--12 for pin assignments.
Table 2- 12: LPT port pin assignments
Pin numberPin functionPin numberPin function
1BUSY19GND
2SLCT20GND
3ACK*21GND
4ERR*22GND
5PE23GND
6D024GND
7D125GND
8D226GND
9D327GND
10D428GND
11D529GND
12D630GND
13D731GND
14INIT*32GND
15STB*33GND
16SLIN*34GND
17AFD*35GND
18HI36GND
See IEEE specification P1284-C for pin connection definitions for other modes
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
2- 21
Operating Information
Expansion Module Controls and Connectors
The expansion module is a control module that is an integral part of the
expansion mainframe. The expansion module must be located in slot 0 of the
expansion mainframe.
The front panel of the expansion module has three connectors, two of the
connectors handle TTL signals, the other connector handles ECL signals. The
cables for the three connectors connect to another expansion module in the host
benchtop mainframe (or portable mainframe).
2- 22
Figure 2- 10: Front view of the benchtop controller
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Operating System and Application Interface
The TLA721 Benchtop Mainframe comes with the Microsoft Windows 2000
operating system factory-installed. Operations and capabilities when running on
the mainframe are the same as with Microsoft Windows running on a high-performance personal computer. Windows Help is available from the Start menu of
the Windows Task Bar.
The instrument also comes with the Tektronix Logic Analyzer Family application software configured at the factory to launch after the logic analyzer boots up
and the operating system is running. The application software controls data
acquisition and processing by the logic analyzer. The application software is
included with the product; refer to the Tektronix Logic Analyzer Family UserManual if you need to reinstall any software.
Operating Information
Online Help
System Window
Setup Window
Trigger Window
Most of the user information for operating the logic analyzer is available through
online help.
Refer to the online help for more information on the individual menus, icons,
and fields within each window.
The System window provides an overview of the entire logic analyzer. Use the
System window to navigate through the logic analyzer. The center of the system
window displays icons that represent logic analyzer modules, DSO modules, or
pattern generator modules. These icons provide links to other windows in the
instrument.
A setup window exists for each module in the instrument. It contains the setup
information for the module, such as clocking, memory depth, threshold
information, and channel information.
Each trigger window provides access to the trigger setups. DSO and logic
analyzers have their own trigger windows. Use the trigger window to determine
when you want the logic analyzer or DSO to acquire data and how much data to
acquire.
Listing Window
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
The listing window displays acquired data as tabular text. Each column of data
represents one group of data or other logical data information, such as time
stamps. Each row represents a different time that data was acquired: newer
samples display below older samples.
2- 23
Operating Information
Waveform Window
Other Windows
The waveform window displays acquired data as graphical waveforms. All
defined channels display as Busforms for the logic analyzer and as individual
data channels for the DSO.
Other windows may exist on the logic analyzer depending on the installed setup.
For more information on the logic analyzer application, refer to the TektronixLogic Analyzer Family User Manual.
2- 24
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Theory of Operation
This chapter provides a high-level overview of the theory of operation for the
TLA721 Benchtop Mainframe and the TLA7XM Expansion Mainframe. The
two mainframes are identical with the following exceptions:
HThe TLA721 Benchtop Mainframe includes a plug-in controller that controls
the operation of the entire system.
HThe TLA7XM Expansion Mainframe includes an expansion module that
routes signals from another external mainframe to the expansion mainframe.
The external mainframe can be a TLA715 Portable Mainframe, a TLA721
Benchtop Mainframe, or another TLA7XM Expansion Mainframe. The
external mainframe also has an expansion module that routes the backplane
signals from the external mainframe through three cables to the expansion
module in the expansion mainframe.
The theory of operation is broken down according to the benchtop controller,
mainframe, and expansion controller. The Diagrams chapter contains block
diagrams and interconnection diagrams separate from this chapter that you may
want to use while servicing the instrument.
Benchtop Controller
Refer to Figure 3--1 while reading the following paragraphs on the benchtop
controller.
The benchtop controller provides all the benefits of a high-performance
PC-based controller architecture including graphics and I/O. The main difference
between the benchtop controller and a standard PC is the interface used to
communicate with the modules installed in the mainframe. The benchtop
controller is installed in a three-wide controller module that supports integration
with the mainframe.
The benchtop controller uses the same Pentium III controller found in the
TLA715 Portable Mainframe. However, the parts are rearranged to provide
access to the PC I/O connectors found on the front of the controller. An
additional adapter board interfaces the controller board to the backplane and
additional peripherals. A hard disk drive board mounts the hard disk drive and
CD-ROM drive.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
3- 1
Theory of Operation
Benchtop Controller
Slots 0 - 2
PCI to Backplane
Bridge ASIC
Benchtop Chassis
PC Cards, SVGA, COM, USB, EPP
& Trigger Ports
VTC Trig
ASIC
Module Slot #3
Module Slot #4
PC Controller
Display and I/O
Adapter Board
Fixed hard
disk drive
disk drive
CD ROM
drive
Hard Disk Interface
Floppy
Removeable
hard
disk drive
Mouse &
Keyboard
Module Slot #12
Backplane
Power Supply
Enhanced Monitor
Blower
Figure 3- 1: Interconnection and block diagram for the benchtop mainframe and controller
PC Controller, Display,
and I/O
The PC controller uses a standard Intel Pentium III microprocessor using the
815E chip-set. The controller has a 733 MHz Pentium III processor with 512 MB
of SDRAM, 512 KB of L2 cache, and 512 KB of flash-based BIOS. A Texas
Instrument TI PCI1251B controls the two CardBus 32 slots.
A Silicon Motion Lynx3DM SVGA/XGA display controller with up to 4 MB of
internal DRAM supports both the integrated color TFT LCD flat panel and
external SVGA port.
3- 2
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Theory of Operation
An ECP/EPP Centronics compatible parallel port, two USB ports, and two
16550-based serial RS-322 COM ports (one external) support standard PC-based
I/O peripherals.
PCI-to-Backplane Bridge
ASIC
Trigger Crossbar ASIC
Adapter Board
The backplane bus interface appears as a standard PCI device to the PC-based
controller. The PCI-to-Backplane interface is managed by a Tektronix-designed
ADG343 CMOS ASIC which includes support for DMA transfers with FIFO,
IRQ management, programmable byte swapping, backplane address space
management and windowing (A16, A24, and A32 space), backplane control
lines, and MODID control lines.
The trigger lines are managed through the Tektronix-designed Trigger Crossbar
(VTC) ASIC. The VTC ASIC cross connects any of the ten backplane trigger
lines (ECL and TTL) to any of the four SMB connector ports on the front panel.
The logic analyzer uses four SMB ports to accommodate two inputs (System
Trigger In and External Signal In) and two outputs (System Trigger Out and
External Signal Out).
The VTC ASIC also supports several standard backplane protocols including
START/STOP, which support a synchronous start of all installed modules to
System Time Zero (STZ), and several custom features. These features include
time interpolation to support the use of the VTC ASIC in individual module
applications.
The Adapter board integrates the TLA715 Portable Mainframe controller into the
TLA721 Benchtop Mainframe controller by providing electrical and mechanical
support for the controller board, floppy disk drives, keyboard and mouse ports,
PC speaker, decoding of additional MODID lines via an FPGA, and buffering of
the backplane signal lines to comply with VXI System Specification 1.4 and
VMEbus ANSI/IEEE Std 1014-1987 standards.
Hard Disk Drive Board
Hard Disk Drive
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
The hard disk drive board provides electrical and mechanical support for the hard
disk drive and the CD-ROM drive.
The hard disk drive (HDD) is a standard 2.5-inch IDE drive which interfaces
directly to the controller through the Enhanced Integrated Device Electronics
(IDE) interface. The hard disk drive is easily replaceable without removing any
of the covers or screws on the controller.
The hard disk drive is only available in the maximum configuration. The sizes of
the hard disk drive are dependent on the current cost and availability. The
benchtop controller is electrically capable of accepting dual master/slave IDE
HDD configurations for a total of three hard disk drives (however the CD-ROM
takes one of the configurations) but is currently limited to mounting two hard
3- 3
Theory of Operation
disk drives. A second hard disk drive can be added to the controller with one of
the options in the TLA7UP upgrade kits.
Floppy Disk Drive
CD-ROM Drive
Mouse and Keyboard
Mainframe
Ports
USB Ports
The floppy disk drive is a standard 0.5-inch drive supporting 3.5-inch,
1.44 MB high-density, double sided floppy disks.
The CD-ROM drive is a standard 24X CD-ROM drive.
The mouse and keyboard ports are standard PS2 compliant ports. They interface
to the controller board through the Adapter board.
A dual USB port connects USB devices to the controller.
The benchtop and expansion mainframes are identical and contain the following
major modules:
HPower supply
HBackplane
HEnhanced monitor board
HTemperature sense board
Refer to Figure 3--2 while reading the following paragraphs on the mainframe.
3- 4
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
The power supply is a custom power supply capable of supplying 1000 Watts of
secondary power to the overall mainframe with an input power of up to
1450 Watts operating at it’s minimum 70% efficiency. The power supply
incorporates a continuous AC source operating in the range of 90 to 250 VAC
(from 45 Hz to 66 Hz) and 100 to 132 VAC (from 360 Hz to 440 Hz). This
covers virtually all international power combinations. The power supply also
supports automatic power factor correction and over-voltage, current, and
thermal protection mechanisms.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
3- 5
Theory of Operation
The power supply connects to the backplane at J1 and J2 through the power
supply interface board.
Backplane
Enhanced Monitor Board
The backplane (A4) provides all the connections to module slots 0 through 12 in
the chassis. It also has connections to all other circuit boards and modules in the
chassis.
The front panel On/Standby DC switch connects to one of two connectors at the
top of the backplane. When the switch is connected to J22, the switch controls
the power in the chassis. When the switch is connected to J23, the power-on
functions are controlled by an external source through the 25-pin connector on
the enhanced monitor board. Although the switch still illuminates when power is
applied to the chassis, the on/off function of the switch is disabled.
A 34-wide ribbon cable at 0J4 on the backplane connects to J16 on the temperature sense board. Connectors 0J1, 0J2, and 0P3 carry instrument monitoring
information from the backplane to the enhanced monitor board.
The enhanced monitor board (A3) collects the monitoring information from the
power supply, blower, and temperature sense board and passes the information to
the 25-pin D connector. The enhanced monitor board connects directly to the
backplane at 0J3, 0P1 and 0P2.
The 25-pin D passive monitor connector lets you monitor the power supply
voltages, blower speed, and the maximum slot temperature rise within the
chassis. The connector also provides remote on and off capability and access to
the SYSRESET* and ACFAIL* signals.
3- 6
Blower
CAUTION. Do not connect an RS-232 cable to the 25-pin connector. This 25-pin
connector is not an RS-232 port.
Connecting an RS-232 cable to this connector might result in damage to the
equipment.
The universal fan controller on the enhanced monitor board drives the EBM/
PAPST fan pulse with modulation (PWM) speed control input.
The blower (fan assembly) consists of a chassis mount, rear fan cover, and
EBM/PAPST fan. The fan is a low-noise, high-airflow design that supports up to
308 CFM of airflow through the mainframe at full speed. The blower connects to
the enhanced monitor board at FAN 1/Blower (J8). The fan speed switch (S1)
lets you select either variable fan speed (V AR) or full speed (FULL).
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Theory of Operation
Temperature Sense Board
Expansion Module
Slot 0 Interface
The temperature sense board (A2) monitors the temperatures for each slot within
the chassis. The temperature sense board connects to the backplane through the
ribbon cable at J16.
Figure 3--3 shows the block diagram for the expansion module when one is
installed in an mainframe and second expansion module is installed in a second
mainframe. You may want to refer to this illustration while reading the following
text.
The primary expansion module, located in the primary benchtop mainframe or
portable mainframe, is connected to the expansion module, located in second
expansion mainframe, by routing signals through three expansion cables. The
expansion module both receives and drives the bus signals in both mainframes.
The expansion modules are connected together by two TTL cables and one ECL
cable.
The MODID register is enabled only when the expansion module is installed in
slot 0 of the expansion mainframe. During power up, the value of the MODID0
signal is sampled. If the signal on MODID0 is low, the expansion module is
determined to be installed in slot 0. If the signal on MODID0 is high, the
expansion module is determined to be installed in slot 1--12.
System Clock
Slot 0 Interface
System Clock
CLK10
Power On Sequence
The SYSCLK (system clock) is buffered and transmitted to the expansion
mainframe from the benchtop mainframe.
The MODID register is enabled only when the expansion module is installed in
slot 0 of the expansion mainframe. During power up, the value of the MODID0
signal is sampled. If the signal on MODID0 is low, the expansion module is
determined to be installed in slot 0. If the signal on MODID0 is high, the
expansion module is determined to be installed in slot 1--12.
The SYSCLK (system clock) is buffered and transmitted to the expansion
mainframe from the benchtop mainframe.
The CLK10 is a differential ECL signal that provides system timing and
reference. The CLK10 is transmitted to the expansion mainframe from the
benchtop mainframe.
On power up, the expansion module determines correct configuration of the
expansion modules and the expansion cables.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
3- 7
Theory of Operation
Primary mainframe expansion module
Register based
interface
Expansion
cable(s)
CPU Bus
Buffers
Trigger and
Clock Buffers
Second expansion mainframe module
Control and
Diagnostic
Registers
CPU Bus
Buffers
Primary MF
backplane
Expansion MF
backplane
Automatic Power Control
3- 8
Trigger and
Clock Buffers
Figure 3- 3: Benchtop and expansion mainframe block diagram
The expansion module controls the power on and power off of the expansion
mainframe. When the benchtop mainframe is powered on, a signal is sent to the
expansion mainframe causing the expansion mainframe to power on. The same
signal is sent to the expansion mainframe upon power down.
Automatic power on and automatic power off only work when the primary
power switch on the expansion mainframe is closed.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Performance Verification Procedures
This chapter contains procedures for functional verification, certification, and
performance verification procedures for the TLA721 Benchtop Mainframe and
TLA7XM Expansion Mainframe. Generally, you should perform these procedures once per year or following repairs that affect certification.
Summary V erification
Functional verification procedures verify the basic functionality of the instrument inputs, outputs, and basic instrument actions. These procedures include
power-on diagnostics, extended diagnostics, and manual check procedures.
These procedures can be used for incoming inspection purposes.
Certification procedures certify the accuracy of an instrument and provide a
traceability path to national standards. Certification data is recorded on calibration data reports provided with this manual. The calibration data reports are
intended to be copied and used for calibration/certification procedures.
After completing the performance verification procedures or the certification
procedures, you can fill out a calibration data report to keep on file with your
instrument.
Test Equipment
Performance verification procedures confirm that a product meets or exceeds the
performance requirements for the published specifications documented in the
Specifications chapter of this manual. Refer to Figure 4--1 on page 4--2 for a
graphic overview of the procedures.
These procedures use external, traceable signal sources to directly test characteristics that are designated as checked (n)intheSpecifications chapter of this
manual. Table 4--1 on page 4--3 shows the required equipment list. Always
warm up the equipment for 30 minutes before beginning the procedures.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table 4- 1: Test equipment
Item number and descriptionMinimum requirementsExample
Performance Verification Procedures
1. Benchtop MainframeTLA721 Benchtop Mainframe with a
LA, DSO, or Patgen module installed
2. Expansion MainframeTLA7XM Expansion Mainframe with
a LA, DSO, or Patgen module
installed. Expansion mainframe
should be connected to the TLA721
Benchtop Mainframe
3. Frequency counterFrequency accuracy: <0.0025%
Frequency range: 1 kHz to 100 MHz
4. Miniature probe-to-square pin
adapters
5. 0.025-inch square pin3/4-inch length, (two required)Tektronix part number 131-1426-XX
6. Digital multimeter
with test leads
7. Cable, precision
50 Ω coaxial
8. SMB-to-BNC cableOne requiredTektronix P6041
Two requiredTektronix part number 103-0177-XX
VDC accuracy: 0.1% from --10 V to
+100 V
50 Ω, 36 in, male-to-male BNC
connectors
--
--
Hewlett Packard 5314A
Tektronix DMM 900 Series
Tektronix part number 012-0482-XX
Functional Verification
Table 4--2 lists the functional verification procedures that are available for the
benchtop and expansion mainframes. If you have an expansion mainframe, these
procedures assume that the expansion mainframe is properly connected to the
TLA721 Benchtop Mainframe. If necessary, refer to the Tektronix Logic AnalyzerFamily User Manual for installation instructions.
Table 4- 2: Functional verification procedures
InstrumentProcedure
Benchtop and expansion mainframePower-on and fan operation
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Power-up diagnostics
Extended diagnostics
TLA Mainframe diagnostics
CheckIt Utilities diagnostics
4- 3
Performance Verification Procedures
Power-on and Fan
Operation
Extended Diagnostics
Complete the following steps to check the power-on and fan operation of the
TLA721 Benchtop Mainframe and the TLA7XM Expansion mainframe (if
installed).
You will need a mainframe with an LA or DSO module installed in each
mainframe.
1. Power on the benchtop mainframe and observe that the On/Standby switch
illuminates.
2. If you have an expansion mainframe attached, check that the expansion
mainframe automatically powers on.
3. Check that the fan spins without undue noise.
4. If everything is properly connected and operational, you should see the
modules (and expansion mainframe with its modules) in the System window
of the logic analyzer application.
5. If there are no failures indicated in the System window, the power-on
diagnostics pass when you power on the mainframe(s).
Do the following steps to run the extended diagnostics:
NOTE. Running the extended diagnostics will invalidate any acquired data. If
you want to save any of the acquired data, do so before running the extended
diagnostics.
You will need a mainframe with an LA or DSO module installed in each
mainframe.
Equipment
required
PrerequisitesWarm-up time: 30 minutes
Cable, 50 Ω coaxial (item 7)
Perform the following tests to complete the functional verification procedure.
1. If you have not already done so, power on the instrument and wait for the
logic analyzer application to start.
2. Go to the System menu and select Calibration and Diagnostics.
3. Verify that all power-on diagnostics pass.
4. Click the Extended Diagnostics tab.
4- 4
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Performance Verification Procedures
5. Select All Modules, All Tests, and then click the Run button on the property
sheet.
All tests that displayed an “Unknown” status will change to a Pass or Fail
status depending on the outcome of the tests.
6. Scroll through the tests and verify that all tests pass.
TLA Mainframe
Diagnostics
CheckIt Utilities
The TLA Mainframe Diagnostics are a comprehensive software test that checks
the functionality of the mainframes. To run these diagnostics, do the following
steps:
CheckIt Utilities is a comprehensive software application used to check and
verify the operation of the PC hardware in the portable mainframe. To run the
software, you must have either a keyboard, mouse, or other pointing device.
NOTE. To check the floppy disk drive or the CD-ROM drive, you must have a test
floppy disk or CD installed before starting the CheckIt Utilities.
To run CheckIt Utilities, follow these instructions:
1. Quit the logic analyzer application.
2. Click the Windows Start button.
3. Select Programs → CheckIt Utilities.
4. Run the tests. If necessary, refer to the CheckIt Utilities online help for
information on running the software and the individual tests.
Certification
Benchtop Mainframe
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
The system clock of the controller is checked for accuracy. The instrument is
certifiable if this parameter meets specifications. This procedure is described
under Checking the 10 MHz System Clock (CLK10) on page 4--8. Record the
results in a copy of the Calibration Data Report at the end of this chapter.
4- 5
Performance Verification Procedures
Expansion Mainframe
There are no certifiable parameters for the TLA7XM Expansion Mainframe.
Performance Verification Procedures
This section contains procedures to verify that the TLA721 Benchtop Mainframe
and the TLA7XM Expansion Mainframe perform as warranted. Verify instrument performance whenever the accuracy or function of your instrument is in
question.
Tests Performed
Do the following tests listed in Table 4--3 to verify the performance of the
TLA721 Benchtop Mainframe and the TLA7XM Expansion Mainframe. You
will need some of the equipment shown in Table 4--1 on page 4--3 to complete
the performance verification procedures. If you substitute equipment, always
choose instruments that meet or exceed the minimum requirements specified.
Table 4- 3: Performance verification procedures
ParameterProcedure
Power supply voltagesVoltage level check at the 25-pin connector
System clock (CLK 10)
1
Certifiable parameter
1
10 MHz system clock test
Checking Power Supply
Voltages
Use a digital voltmeter to check the voltages on the pins of the 25-pin connector
and compare the results against the range listed in Table 4--4. The connector is
located on the right rear panel of the mainframe (see Figure 4--2).
Equipment
required
PrerequisitesWarm-up time: 30 minutes
Digital multimeter with test leads (item 6)
Two 0.025-inch square pins (item 5)
Two miniature probe-to-square pin adapters (item 4)
CAUTION. To prevent damaging the 25 pin connector, use care when probing the
connector with the square pins.
4- 6
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
1. Connect the reference lead of the digital voltmeter to one of the ground pins.
2. Connect the other lead of the digital voltmeter to the supply pins of the
25-pin connector on the right rear panel of the mainframe.
3. Measure the power supply voltages with the voltmeter and compare each
reading to the values listed in Table 4--4. If the voltages are within the
specified ranges, the mainframe is operating properly.
Table 4- 4: Power supply voltages at the 25-pin connector
PinSupplyAcceptable voltage range
1+5 V4.875 V to 5.250 V
2-- 1 2 V--12.60 V to --11.64 V
3-- 2 4 V--25.20 V to --23.28 V
4-- 2 V--2.10 V to --1.90 V
14+12 V11.64 V to 12.60 V
15+24 V23.28 V to 25.20 V
16-- 5 . 2 V--5.460 V to --5.044 V
9, 17--20, 22, 24Logic Ground
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
4- 7
Performance Verification Procedures
Checking the 10 MHz
System Clock (CLK10)
The following procedure checks the accuracy of the 10 MHz system clock. This
procedure is only required on the benchtop mainframe; it is not required for the
expansion mainframe.
Equipment
required
PrerequisitesWarm-up time: 30 minutes
Frequency counter (item 3)
SMB-to-BNC cable (item 8)
Power-up, mainframe, and CheckIt diagnostics pass
1. Verify that all of the prerequisites above are met for the procedure.
2. Connect the frequency counter to the External Signal Out TTL SMB
connector on the benchtop mainframe controller.
3. Go to the System window and select System Configuration from the System
menu.
4. In the System Configuration dialog box, select 10 MHz Clock from the list
of routable signals in the External Signal Out selection box and click OK.
5. Verify that the output frequency at the External Signal Out TTL connector is
10 MHz ±1 kHz. Record the measurement on a copy of the calibration data
report and disconnect the frequency counter.
6. In the System Configuration dialog box, reset the External Signal Out signal
to None.
4- 8
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
There are no adjustments for the TLA721 Benchtop Mainframe or TLA7XM
Expansion Mainframe. For adjustment procedures on the individual modules,
refer to the appropriate module service manual.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
5- 1
Adjustment Procedures
5- 2
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Maintenance
This chapter provides information and procedures for inspecting, cleaning,
removing and replacing components, and troubleshooting the TLA721 Benchtop
Mainframe and the TLA7XM Expansion Mainframe. The procedures isolate
problems to a module lever rather than a component level.
This chapter is divided up as follows:
HPreventing electrostatic discharge (ESD)
HInspection and cleaning
HMainframe removal and replacement procedures
HBenchtop controller removal and replacement procedures
HExpansion module removal and replacement procedures
HTroubleshooting
HRepackaging instructions
Preparation
Preventing ESD
The information in this chapter is designed for use by qualified service personnel. Read the Safety Summary at the front of this manual before attempting any
procedures in this chapter.
WARNING. To avoid electric shock, always power off the instrument and
disconnect the power cord before cleaning or servicing the instrument.
When performing any service which requires internal access to the mainframe
benchtop chassis, adhere to the following precautions to avoid damaging internal
circuit boards and their components due to electrostatic discharge (ESD).
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
6- 1
Maintenance
CAUTION. Many components within the instrument are susceptible to static
discharge damage.
Service the instrument only in a static-free environment. Observe standard
handling precautions for static-sensitive devices.
1. Minimize handling of static-sensitive circuit boards.
2. Transport and store static-sensitive circuit boards in their static protected
containers or on a metal rail. Label any package that contains static-sensitive
boards.
3. Discharge the static voltage from your body by wearing a grounded antistatic
wrist strap while handling these circuit boards.
4. Nothing capable of generating or holding a static charge should be allowed
on the work station surface.
5. Handle circuit boards by the edges when possible.
6. Do not slide the circuit boards over any surface.
7. Avoid handling circuit boards in areas that have a floor or work-surface
Inspection and Cleaning
The instrument is inspected mechanically and electrically before shipment. It
should be free of marks or scratches and should meet or exceed all electrical
specifications. To confirm this, inspect for physical damage incurred during
transit. Retain the packaging in case shipment for repair is necessary. If there is
damage or deficiency, contact your local Tektronix representative.
Cleaning procedures consist of exterior and interior cleaning. Periodic cleaning
reduces instrument breakdown and increases reliability. Clean the instrument as
needed, based on your operating environment.
These procedures equally to the mainframes, benchtop controller, and expansion
modules. You will have to remove the benchtop controller and the expansion
module from the mainframes to complete the inspection and cleaning procedures.
Exterior Inspection
Inspect the outside of the instrument for damage, wear, and missing parts. Use
Table 6--1 as a guide. Modules that appear to have been dropped or otherwise
abused should be checked thoroughly to verify correct operation and performance. Immediately repair defects that could cause personal injury or lead to
further damage to the benchtop controller, expansion module, or the mainframes
that the module plug into.
covering capable of generating a static charge.
6- 2
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Table 6- 1: External inspection check list
ItemInspect forRepair action
Front panel and side
cover
Cracks, scratches, deformations,
missing or damaged retainer
screws, or ejector handles.
Replace defective or missing
parts.
Maintenance
Exterior Cleaning
Procedure
Front panel connectors Broken shells, cracked insulation,
and deformed contacts. Dirt in
connectors.
Rear connectorsCracked or broken shells, dam-
aged or missing contacts. Dirt in
connectors.
AccessoriesMissing items or parts of items,
bent pins, broken or frayed
cables, and damaged connectors.
Replace defective parts. Clear dirt
out of connectors.
Replace defective parts. Clear dirt
out of connectors.
Replace damaged or missing
parts, frayed cables.
CAUTION. To prevent damage to electrical components from moisture during
external cleaning, use only enough liquid to dampen the cloth or applicator.
Clean the exterior surfaces with a soft dry lint-free cloth, or a soft-bristle brush.
If any dirt remains, use a soft cloth or swab dipped in a 75% isopropyl alcohol
solution. Use a swab to clean narrow spaces around controls and connectors. Do
not use abrasive cleaning compounds.
CAUTION. Avoid getting moisture inside the instrument during exterior cleaning;
use just enough moisture to dampen the cloth or swab.
Use only deionized water when cleaning. Use a 75% isopropyl alcohol solution
as a cleanser and rinse with deionized or distilled water.
Do not use chemical cleaning agents; they may damage the chassis. Avoid
chemicals that contain benzene, toluene, xylene, acetone, or similar solvents.
Interior Inspection
Remove the module covers to access the inside of the benchtop controller or the
expansion module for inspection and cleaning. Refer to the Removal andInstallation Procedures for detailed information on cover removal. Inspect the
internal portions of the modules and the mainframes for damage and wear using
Table 6--2 as a guide. Defects found should be repaired immediately.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Solder connections Cold solder or rosin joints.Return to a Tektronix Service Center.
CapacitorsDamaged or leaking cases.
Corroded solder on leads or
terminals.
Wiring and cablesLoose plugs or connectors.
Burned, broken, or frayed
wiring.
ChassisDents, deformations, and
damaged hardware.
Return to a Tektronix Service Center.
Return to a Tektronix Service Center.
Firmly seat connectors. Repair or replace
parts with defective wires or cables.
Straighten, repair, or replace defective
hardware.
CAUTION. To prevent damage from electrical arcing, ensure that circuit boards
and components are dry before applying power to the expansion module.
Use a dry, low-velocity stream of air to clean the interior of the modules and the
mainframes. Use a soft-bristle brush for cleaning around components. If you
must use a liquid for minor interior cleaning, use a 75% isopropyl alcohol
solution and rinse with deionized or distilled water.
6- 4
Clean the exterior (face) of the floppy disk drive, CD-ROM, and replaceable
hard disk drive cartridge on the benchtop controller with a soft, clean cloth and a
mild detergent.
To clean the floppy disk drive or the CD-ROM, use commercially available
floppy disk drive or CD-ROM drive cleaning kits and follow the manufacturer’s
instructions.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Mainframe Removal and Installation Procedures
This section provides procedures for removing and installing mechanical and
electrical modules in the benchtop and expansion mainframes. These procedures
apply identically to both the benchtop and expansion mainframes unless noted
otherwise.
CAUTION. Before doing this or any other procedure in this manual, read the
General Safety Summary and Service Safety Summary found at the beginning of
this manual.
Equipment Required
Table 6--3 lists the tools needed to remove and replace components in the
mainframes.
Table 6- 3: Equipment required to service the mainframes
5T-15 Torx t ipTorx drive bit for T-15 size screws
6T-20 Torx t ipTorx drive bit for T-20 size screws
7Allen wrenchA 3/32-inch Allen wrench (hex wrench)
8Phillips screwdriverPhillips #1 screwdriver
9Cable ties4-inch tie-down straps (Tektronix part number
343-0549-00)
NOTE. When installing the screws, use a torque screwdriver and tighten the
screws to 8 in-lbs unless otherwise noted.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
6- 5
Mainframe Removal and Installation Procedures
Install Empty Slot Panel Fillers
If you have any unused (empty) slots in your mainframe, you may install the
empty slot Panel Fillers. Install either the single-wide or double-wide fillers that
came with your mainframe. Refer to Figure 6--1 for information on installing the
slot fillers.
CAUTION. To avoid damage caused by heat use only Tektronix front panels;
otherwise, the shutters may activate, effectively robbing airflow from installed
modules. Installing the fillers provides improved cooling for installed modules,
improved EMI shielding, and more accurate air temperature sensing to control
the fan speeds.
6- 6
Single panel fillers
Double panel fillers
Figure 6- 1: Installing the empty slot panel fillers
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Blower Assembly
Mainframe Removal and Installation Procedures
You will need a Phillips #1 screwdriver and an Allen wrench to complete these
procedures.
Removal
To remove the blower assembly, refer to Figures 6--2, 6--3 and Figure 6--4 while
performing the following steps:
1. From the back of the chassis, loosen the five captive screws including the
safety ground (refer to Figure 6--2 for the screw locations).
2. Loosen the four 8-32 hex screws (see Figure 6--4 on page 6--9) under the
mainframe so that you can easily remove the blower assembly.
3. Remove the cable cover.
4. Unplug the blower cable and set the blower assembly aside on a clean
working surface.
5. To remove the blower, remove the ten screws with (the Allen wrench)
holding the shroud part of the blower assembly to the chassis part of the
assembly. Set the shroud aside. There are three screws on each side and four
on the bottom. See Figure 6--4.
6. Remove the two sheet metal screws at the top of the blower.
7. Remove the four screws that hold the blower to the chassis part of the blower
assembly.
8. For convenience, replace the two sheet metal screws from step 6 onto the top
of the blower.
Installation
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Install the blower assembly by following the removal procedures in reverse
order.
NOTE. When reconnecting the blower cables to the chassis, verify that you
connect the blower cable to J8, 1/BLOWER.
6- 7
Mainframe Removal and Installation Procedures
8-32 Captive
screw/fan housing
8-32 Captive
screw/fan housing
8-32 Captive
screw/fan housing
8-32 Captive
screw/fan housing
Figure 6- 2: Location of blower assembly screws
8-32 Captive
screw/Enhance monitor
8-32 Captive
screw/cable cover
8-32 Captive
screw/Enhance monitor
8-32 Captive
screw/fan housing
6- 8
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Power supply
Mainframe Removal and Installation Procedures
Cable cover
Fan cable
Blower
assembly
Figure 6- 3: Removing the blower assembly
Blower assembly
Shroud
Screws (4)
Screws (6)
Screws (4)
Chassis
Screws (2)
Blower
Cable tie
Figure 6- 4: Removing the blower
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
6- 9
Mainframe Removal and Installation Procedures
Removing the Enhanced Monitor Board
Removal
To remove the enhanced monitor board, complete the following steps:
1. Refer to Figure 6--3 and unscrew the captive screw that attaches the cable
cover. Remove the cable cover and set it aside.
2. Unplug the blower cable from the connector labeled 1/BLOWER.
3. Unscrew the two captive screws that attach the monitor board to the
mainframe.
4. Slide the enhanced monitor board out of the mainframe as shown in
Figure 6--5.
6- 10
Monitor board
Figure 6- 5: Removing the enhanced monitor board
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Mainframe Removal and Installation Procedures
Installation
To install the enhanced monitor board, complete the following steps:
1. Refer to Table 6--4 and verify that the jumpers on the enhanced monitor
board are in the default locations before installing the board in the
mainframe.
Table 6- 4: Enhanced monitor board jumpers
Jumpers (location)PinsLabel on board
J2 (top of board)1-2 and 3-4TLA721
J38 (middle of board)2-3Blower
J19 (bottom of board)2-3Blower
2. Slide the enhanced monitor board into the mainframe as shown in Figure 6--5. You may have to adjust the enhanced monitor board to engage the
connectors on the rear of the board.
3. Push the enhanced monitor board into the mainframe to fully mate the rear
connectors.
4. Tighten the two screws that attach the enhanced monitor board to the
mainframe.
5. Connect the blower cable into the connector labeled 1/BLOWER.
6. Install the cable cover and tighten the captive screw to that attaches to the
mainframe.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
6- 11
Mainframe Removal and Installation Procedures
Power Supply
Removal
To remove the power supply from the mainframe, perform Removing the Blower
Assembly procedure on page 6--7 and then complete the following steps:
1. Using the handle on the power supply, firmly pull out the power supply form
the rear of the mainframe.
2. Remove the two 3/32 hex drive screws and washers to remove the handle
from the power supply.
Mainframe
Power supply
6- 12
Installation
Handle
Figure 6- 6: Removing the power supply
Complete the following steps to reinstall the power supply in the mainframe:
1. Reinstall the handle to the power supply if you removed it earlier.
2. Slide the power supply into the mainframe.
3. Push the power supply handle in firmly to ensure that the connectors are
completely seated into the back plane connectors.
4. Reinstall the blower assembly.
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Mainframe Cover
Mainframe Removal and Installation Procedures
Remove screws (20)
Removal
To remove the mainframe cover, refer to Figure 6-- 7 while performing the
following steps (Note that this procedure assumes that the mainframe does not
include any rails for the rackmount option; if it does, remove the rails before
continuing this procedure).
1. Remove the 12 hex drive screws (6 on each side) using a 3/32 Allen wrench.
2. Remove the eight T-7 screws: four on the top front and four on the top rear.
3. Lift the front bottom corners up.
4. After tilting the cover up about 3 inches, lift the cover straight off the
instrument.
Step 1Step 2
Step 3
Figure 6- 7: Removing the mainframe cover
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
6- 13
Mainframe Removal and Installation Procedures
Card Guides
Installation
Removal
Complete the following steps to install the mainframe cover (refer to Figure 6--7
as necessary):
1. Slide the cover over the mainframe.
2. Tilt the rear of the cover in place and then lower the front until the cover
binds slightly (do not force the cover down).
3. Slowly push the cover down until the screw holes on the sides of the cover
line up with those on the mainframe. Use care not to damage the front panel
label while installing the cover.
4. Install the eight T-7 screws on the top of the mainframe cover; tighten them
to4in-lbs.
5. Install the remaining 12 screws on the sides of the mainframe.
6. Tighten all screws.
The card guides at the top and bottom of the mainframe are very similar. The
main difference is that the bottom guides include the spring-loaded shutters to
redirect air into the mainframe. The procedure for removing both guides is
identical. Refer to Figure 6--8 while performing the following steps:
Installation
1. Use a small flat blade screwdriver to pry up the tab of the card guide at the
front of the mainframe being careful not to damage the card guide or the
mainframe.
2. Gently pull the card guide forward until it pops out of place.
3. Remove the card guide.
Refer to Figure 6--8 while completing the following steps:
NOTE. The bottom card guides are replaced as a unit. These guides are not
intended to be disassembled.
1. Slide the card guide towards the rear of the mainframe and allow the front of
the card guide to snap into place.
2. Test the card guides in the mainframe and verify that they do not move.
6- 14
TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
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