Tektronix TLA7Nx, TLA7Px,,TLA7Qx Service Manual

Service Manual
Tektronix Logic Analyzer Module (TLA7Nx, LTA7Px, & TLA7Qx)
071-0864-01
Warning
The servicing instructions are for use by qualified personnel only. To avoid personal injury, do not perform any servicing unless you are qualified to do so. Refer to all safety summaries prior to performing service.
www.tektronix.com
Copyright © Tektronix, Inc. All rights reserved.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes that in all previously published material. Specifications and price change privileges reserved.
Tektronix, Inc., 14200 SW Karl Braun Drive, Beaverton, OR 97077
TEKTRONIX and TEK are registered tradem arks of Tektronix, Inc.
MagniVu and PowerFlex are registered trademarks of Tektronix, Inc.

WARRANTY

Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this warranty period, Tektronix, at its option, either will repair the defective produc t without charge for parts and labor, or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a locat ion within the c ountry in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than Tektronix representative s to install, re pair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product.
THIS W ARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Table of Contents

Specifications
Operating Information
General Safety Summary vii...................................
Service Safety Summary ix....................................
Preface xi...................................................
Manual Structure xi................................................
Manual Conventions xii..............................................
Related Manuals xiii.................................................
Contacting Tektronix xiv.............................................
Introduction xv..............................................
Adjustment and Certification Interval xv................................
Strategy for Servicing xv.............................................
Service Offerings xvi................................................
Product Description 1--1..............................................
Characteristic Tables 1--1.............................................
Installation 2--1.....................................................
Software Installation and Removal 2--2..................................
Operating Information 2--4............................................
Merged Modules 2--10.................................................
Merging Rules 2--10.................................................
Theory of Operation
Block Level Description 3--1....................................
Performance Verification
Performance V erification: Logic Analyzer Module 4--1..............
Summary Verification 4--1.............................................
Test Equipment 4--3..................................................
Functional Verification 4--4............................................
LA Module Certification 4--10..........................................
Performance Verification Instructions 4--10................................
Performance Verification Tests 4--16.....................................
Performance V erification: Adjustment/V erification Fixture 4--21.......
Test Equipment 4--21..................................................
Functional Verification 4--21............................................
Certification 4--25....................................................
Performance Verification 4--25..........................................
Test Procedures 4--27..................................................
Calibration Data Report 4--37....................................
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Table of Contents
Adjustment Procedures
Maintenance
Logic Analyzer Module Adjustment Procedures 5--1................
Prerequisites 5--1....................................................
Merged Modules 5--2.................................................
Using the Software 5--3...............................................
Test Equipment 5--3..................................................
Adjustment Instructions 5--4...........................................
Tests Performed 5--5.................................................
Adjustment Procedures 5--6............................................
Self Calibration 5-- 6..................................................
Completing the Adjustment Steps 5--9...................................
Adjustment/Verification Fixture Adjustments 5--11..................
Adjustment/Verification Fixture Adjustment 5--11...........................
Related Maintenance Procedures 6--1....................................
Preventing Electrostatic Discharge 6--1..................................
Inspection and Cleaning 6--2...........................................
Removal and Installation Procedures 6--5.........................
Preparation 6--5.....................................................
Tools Required 6--5..................................................
Torque Requirements 6--5.............................................
Injector/Ejector Handles 6--6...........................................
Cover 6--7..........................................................
Daughter Boards 6--11.................................................
Local Processor Unit Board 6--13.......................................
Acquisition Board 6--17................................................
Fuses 6--22..........................................................
Rear EMI Gaskets 6-- 24................................................
Troubleshooting 6--27...........................................
Service Level 6--27...................................................
Required Documentation 6--28..........................................
Check for Common Problems 6--28......................................
Eliminate Other Problem Sources 6--30...................................
Troubleshoot the Logic Analyzer Module 6--31.............................
Adjustment After Repair 6-- 38..........................................
Overview of Procedures 6--39...........................................
Repackaging Instructions 6--41...................................
Packaging 6--41......................................................
Shipping to the Service Center 6--41......................................
Storage 6--42........................................................
Options
ii
TLA7N1, TLA7N2, TLA7N3 and TLA7N4 Options 7--1....................
TLA7P2, TLA7P4, TLA7Q2 and TLA7Q4 Options 7--2.....................
Service Options 7--2..................................................
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
Electrical Parts List Diagrams
Mechanical Parts List
Table of Contents
Interconnection Block Diagram 9--1.....................................
Parts Ordering Information 10 --1.........................................
Using the Replaceable Parts List 10--2....................................
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Table of Contents

List of Figures

Figure 2--1: Logical address switches 2--2..........................
Figure 2--2: Front panel of the logic analyzer module 2--5............
Figure 2--3: Location of modules in a two way merge 2--11............
Figure 2--4: Location of modules in a three way merge 2--12...........
Figure 4--1: Calibration/certification procedure flow chart 4--2.......
Figure 4--2: Probe functional verification test setup 4--8..............
Figure 4--3: Activity Monitor 4--9................................
Figure 4--4: Adjustment/verification fixture connections and
jumper locations 4--16.......................................
Figure 4--5: FPV_DC_Threshold test setup 4--17.....................
Figure 4--6: Initial FPV_Setup_0F test setup 4--18...................
Figure 4--7: Initial FPV_Hold_0F test setup 4--19....................
Figure 4--8: FPV_Maxsync test setup 4--20..........................
Figure 4--9: Adjustment/verification fixture detail 4--23...............
Figure 4--10: Probe tip adapter detail 4--26........................
Figure 4--11: Adjustment/verification fixture detail 4--28..............
Figure 5--1: P6434 probe detail 5--4...............................
Figure 5--2: Initial deskew test setup 5--8..........................
Figure 5--3: Adjustment/verification fixture circuit board layout 5--13...
Figure 6--1: Injector/ejector handle replacement 6--6................
Figure 6--2: Cover removal 6--8..................................
Figure 6--3: Feeding the merge cable through the cover 6--9..........
Figure 6--4: Seating the cover on the chassis 6--10....................
Figure 6--5: Daughter board replacement 6--12......................
Figure 6--6: LPU board removal 6--14..............................
Figure 6--7: Inserting LPU board tabs into front subpanel 6--15........
Figure 6--8: Crimping the interconnect cables 6--16..................
Figure 6--9: Removing the cables from the Acquisition board 6--18.....
Figure 6--10: Removing the Merge cable connector from the chassis 6--19
Figure 6--11: Removing the acquisition board from the chassis 6--20....
Figure 6--12: Fuse replacement 6--23...............................
Figure 6--13: Rear EMI gasket removal 6--25........................
Figure 6--14: Rear EMI gasket replacement 6--25....................
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Table of Contents
Figure 6--15: Primary troubleshooting chart 6--35...................
Figure 9--1: Interconnections 9--1................................
Figure 9--2: Block diagram 9--2..................................
Figure 10--1: TLA700 Series Logic Analyzer Module exploded view 10--4
Figure 10--2: TLA700 Series LPU board exploded view 10--8..........
Figure 10--3: TLA700 Series Acquisition board exploded view 10--10....
Figure 10--4: Adjustment/verification fixture exploded view 10--13.......
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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Table of Contents

List of Tables

Table 1--1: LA module channel width and depth 1--2...............
Table 1--2: LA module clocking 1--2..............................
Table 1--3: LA module trigger system 1--4.........................
Table 1--4: LA module MagniVu feature 1--6......................
Table 1--5: LA module data handling 1--6.........................
Table 1--6: LA module input parameters with probes 1--7...........
Table 1--7: LA module mechanical 1--8...........................
T able 1--8: Merged modules 1--8.................................
T able 1--9: Atmospherics 1--8...................................
Table 1--10: Certifications and compliances 1--9....................
T able 1--11: Adjustment/verification fixture specifications 1--9........
Table 3--1: Local Processor Unit board fuses 3--2...................
Table 4--1: Test equipment 4--3..................................
Table 4--2: Logic Analyzer Module functional verification
procedures 4--4............................................
T able 4--3: LA Module performance verification tests 4--12...........
T able 4--4: LA Module characteristics indirectly checked by the
performance verification tests 4--12............................
T able 4--5: Adjustment/verification fixture performance
verification tests 4--25.......................................
T able 4--6: Adjustment/verification fixture jumper settings 4--28.......
T able 6--1: External inspection check list 6--3......................
T able 6--2: Internal inspection check list 6--3......................
Table 6--3: Tools required for circuit board replacement 6--5.........
Table 6--4: Local Processor Unit board fuses 6--22...................
Table 6--5: Acquisition board fuses 6--22...........................
Table 6--6: Failure symptoms and possible causes 6--29...............
Table 6--7: Diagnostic tests 6--36..................................
Table 6--8: Requirements after replacement 6--38....................
Table 6--9: Troubleshooting overview 6--39.........................
Table 7--1: TLA7N1, TLA7N2, TLA7N3 and TLA7N4 options 7--1....
Table 7--2: TLA7P2, TLA7P4, TLA7Q2 and TLA7Q4 options 7--2....
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TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the instrument.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and certified for the country of use.
Connect and Disconnect Properly. Do not connect or disconnect probes or test leads while they are connected to a voltage source.
Ground the Product. This product is grounded through the grounding conductor of the power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product.
Connect the ground lead of the probe to earth ground only.
Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal.
Replace Batteries Properly. R eplace batteries only with the proper type and rating specified.
Do Not Operate Without Covers. Do not operate this product with covers or panels removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate With Suspected Failures. If you suspect there is damage to this product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
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General Safety Summary
Provide Proper Ventilation. Refer to the manual’s installation instructions for details on installing the product so it has proper ventilation.
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the marking.
WARNING indicates an injury hazard not immediately accessible as you read the marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
CAUTION
Refer to Manual
WARNING
High Voltage
Protective Ground
(Earth) Terminal
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TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this product unless another person capable of rendering first aid and resuscitation is present.
Disconnect Power. To avoid electric shock, disconnect the main power by means of the power cord or, if provided, the power switch.
Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
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Service Safety Summary
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TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual

Preface

Manual Structure

This is the service manual for the TLA7Nx/7Px/7Qx Logic Analyzer Module. Read this preface to learn how this manual is structured, what conventions it uses, and where you can find other information related to servicing this product. Read the Introduction, which follows this preface, for important background information needed before using this manual for servicing this product.
The Logic Analyzer Module (TLA7Nx/7Px/7Qx) Service Manual is divided into chapters, which are made up of related subordinate topics. These topics can be cross referenced as sections.
Be sure to read the introductions in the sections and subsections because they contain information that you will need to do the service correctly and efficiently.
A brief description of each chapter follows:
H Specifications contains a product description of the logic analyzer module
and tables of the characteristics and descriptions that apply to it.
H Operating Information includes basic installation and operating instructions
at the level needed to safely operate and service the logic analyzer module. For complete installation and configuration procedures, refer to the Tektronix Logic Analyzer Family User Manual.
H Theory of Operation contains circuit descriptions that support general service
to the circuit board level.
H Performance Verification contains the performance verification procedures
for the logic analyzer module, logic analyzer module probes, and the adjustment/verification fixture.
H Adjustment Procedures contains the adjustment procedures for the logic
analyzer module and the adjustment/verification fixture.
H Maintenance contains information and procedures for doing preventive and
corrective maintenance on the logic analyzer module. Included are instruc­tions for cleaning, for removal and installation of replacement parts, and for troubleshooting to the circuit board level.
H Options contains information on servicing any of the factory--installed
options that may be available for the logic analyzer module.
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Preface

Manual Conventions

H Diagrams contains block diagrams and interconnection diagrams that are
useful when isolating failed circuit boards.
H Mechanical Parts List includes a table of all replaceable parts, their
descriptions, and their Tektronix part numbers.
This manual uses certain conventions that you should be familiar with before attempting service.
Acquisition Board
Adjustment Procedures
Adjustment/Verification
Fixture
Certification Procedures
Daughter Board
Functional Verification
Procedures
The acquisition board is one of the circuit boards inside the logic analyzer module. The circuit board receives and stores acquisition data from the probes and works with the LPU board to provide logic analysis information to the operator of the logic analyzer.
Adjustment procedures check for, and if necessary, correct any adjustment errors discovered when performing functional or performance verification procedures.
The adjustment/verification fixture is a test fixture used to perform the adjust­ment, functional check, and performance verification procedures. Specifications and replaceable parts information are documented in this service manual.
Certification procedures certify a product and provide a traceability path to national standards.
The daughter board provides additional channels for the logic analyzer. Data from these channels is sent to the acquisition board for processing with other data from the acquisition board.
Functional verification procedures verify the basic functionality of the instru­ment. These procedures include power-on and extended diagnostics, self calibration, as well as semi-automated or manual check procedures. These procedures can be used as incoming inspection purposes. This manual provides information on power-on and extended diagnostics and the self calibration.
xii
LPU Board
The Local Processor Unit (LPU) Board. The LPU board is one of the circuit boards inside the logic analyzer module that provides the main communications interface with the mainframe.
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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Maintenance Procedures
Modules
Performance Verification
Procedures
Replaceable Parts
Safety
Maintenance procedures are used for fault isolation and repair to the circuit board level or to the replaceable part level.
Throughout this manual, the term modulerefers to a logic analyzer or DSO unit that mounts inside a mainframe. A module is composed of circuit cards, interconnecting cables, and a user-accessible front panel.
Performance verification procedures confirm that a product meets or exceeds the performance requirements for each of the published specifications.
This manual refers to any field-replaceable assembly or mechanical part specifically by its name or generically as a replaceable part. In general, a replaceable part is any circuit board or assembly, such as the hard disk drive, or a mechanical part, such as the I/O port connectors, that is listed in the replaceable parts list.
Symbols and terms related to safety appear in the Safety Summary found at the beginning of this manual.

Related Manuals

The following manuals are available as part of the TLA700 Series Logic Analyzer documentation set. Refer to Optional Accessories on page 10--7 for part numbers.
Manual Name Description Service use
Tektronix Logic Analyzer Family User Manual
TLA715 Portable Mainframe Service Manual
TLA721 Benchtop Mainframe and TLA7XM Expansion Mainframe Service Manual
TLA7Dx/TLA7Ex Digitizing Oscilloscope Service Manual
Provides operating information on the TLA Series Logic Analyzer
Provides service information for the portable mainframes
Provides service information for the benchtop mainframe and expansion mainframe
Provides service information for the digitizing oscilloscope modules
Augments operating information found in chapter 2 of this manual
Isolating and correcting failures in the portable mainframe
Isolating and correcting failures in the benchtop mainframe, controller, or expan­sion mainframe
Isolating and correcting failures in the DSO module
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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Preface

Contacting Tektronix

Phone 1-800-833-9200*
Address Tektronix, Inc.
Department or name (if known) 14200 SW Karl Braun Drive P.O. Box 500 Beaverton, OR 97077 USA
Web site www.tektronix.com
Sales support 1-800-833-9200, select option 1*
Service sup­port
Technical sup­port
* This phone number is toll free in North America. After office hours, pl ease leave a
voice mail message. Outside North America, contact a Tektronix sales office or distributor; see the Tektronix web site for a list of offices.
1-800-833-9200, select option 2*
Email: techsupport@tektronix.com
1-800-833-9200, select option 3* 1-503-627-2400
6:00 a.m. -- 5:00 p.m. Pacific time
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TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual

Introduction

This manual contains information needed to properly service the logic analyzer module, as well as general information critical to safe servicing.
To prevent personal injury or damage consider the following requirements before attempting service:
H The procedures in this manual should be performed only by a qualified
service person.
H Read the General Safety Summary and Service Safety Summary found at the
beginning of this manual.
When using this manual for servicing follow all warnings and cautions.

Adjustment and Certification Interval

Generally, you should perform the adjustments and certification (calibration) described in the Performance Verification and Adjustment Procedures chapters once per year, or following repairs that affect adjustment or calibration.

Strategy for Servicing

This manual contains information for corrective maintenance of this product:
H Supports isolation of faults to the failed circuit board or assembly level
shown in the replaceable parts list
H Supports removal and replacement of those boards or assemblies
H Supports removal and replacement of fuses, knobs, chassis, and other
mechanical parts listed in the replaceable parts list
This manual does not support component-level fault isolation and replacement.
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Introduction

Service Offerings

Tektronix provides service to cover repair under warranty as well as other services that are designed to meet your specific service needs.
Whether providing warranty repair service or any of the other services listed below, Tektronix service technicians are well equipped to service the logic analyzer module.
Warranty Repair Service
Calibration and Repair
Service
Service Options
Service Agreements
Tektronix warrants this product for one year from date of purchase. (The warranty appears behind the title page in this manual.) Tektronix technicians provide warranty service at most Tektronix service locations worldwide. The Tektronix product catalog lists all service locations worldwide or you can visit us on our Customer Services World Center web site at http://www.tek.com/Mea- surement/Service. See our latest service offerings and contact us by email.
In addition to warranty repair, Tektronix Service offers calibration and other services that provide cost-effective solutions to your service needs and quality­standards compliance requirements. Our instruments are supported worldwide by the leading-edge design, manufacturing, and service resources of Tektronix to provide the best possible service.
The following services can be tailored to fit your requirements for calibration and/or repair of the logic analyzer module.
Tektronix Service Options can be selected at the time you purchase your instrument. You select these options to provide the services that best meet your service needs.
If service options are not added to the instrument purchase, then service agreements are available on an annual basis to provide calibration services or post-warranty repair coverage for the logic analyzer module. Service agreements may be customized to meet special turn-around time and/or on-site requirements.
xvi
Service On Demand
Self Service
Tektronix also offers calibration and repair services on a per-incidentbasis that is available with standard prices for many products.
Tektronix supports repair to the replaceable-part level by providing for circuit board exchange. Use this service to reduce down-time for repair by exchanging circuit boards for remanufactured ones. Tektronix ships updated and tested exchange boards. Each board comes with a 90-day service warranty.
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
Introduction
When you exchange circuit boards, you must supply the following information to allow the board to be preconfigured to the proper PowerFlex level. You can also return the repaired module to your local service center for configuration.
H Model number and serial number
H PowerFlex option upgrade number
H Firmware level
For More Information
Contact your local Tektronix service center or sales engineer for more informa­tion on any of the Calibration and Repair Services just described.
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Introduction
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TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual

Specifications

Product Description

This chapter provides a brief product description, specifications and characteris­tics of the logic analyzer module and the adjustmernt/verification fixture.
The logic analyzer module is designed to be used with either the benchtop mainframe or portable mainframe in a TLA700 Series Logic Analyzer. The logic analyzer module is used as a test and measurement tool for high-speed digital timing and state acquisition across several channels.
Some of the key features of the logic analyzer module include the following:
H 100 MHz synchronous acquisition with a programmable setup and hold
window (PowerFlex configurable to 200 MHz)
H 250 MHz asynchronous full depth selections with selectable sampling rates
H 2 GHz asynchronous acquisition into a 2 K high resolution timing buffer
H 250 MHz trigger capability, plus special setup and hold violation triggering
and glitch triggering

Characteristic Tables

H Data correlation with other modules
This section lists the specifications for the logic analyzer module. All specifica­tions are guaranteed unless noted Typical. Specifications that are marked with the
n symbol are checked directly (or indirectly) in the Performance Verification
chapter. The specifications apply to all versions of the logic analyzer module unless otherwise noted.
The performance limits in this specification are valid with these conditions:
H The logic analyzer module must have been calibrated/adjusted at an ambient
temperature between +20° C and +30° C.
H The logic analyzer module must be in an environment with temperature,
altitude, humidity, and vibration within the operating limits described in these specifications.
H The logic analyzer module must have had a warm-up period of at least 30
minutes.
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
1- 1
Specifications
H The logic analyzer module must have had its signal-path-compensation
routine (self-calibration) last executed after at least a 30 minute warm-up period.
Table 1- 1: LA module channel width and depth
Characteristic Description
Number of channels Product Channels
TLA7N1 32 data and 2 clock
TLA7N2, TLA7P2, TLA7Q2 64 data and 4 clock
TLA7N3, TLA7L3, TLA7M3 96 data, 4 clock, and 2 qualifier
TLA7N4, TLA7P4, TLA7Q4 128 data, 4 clock, and 4 qualifier
Acquisition memory depth Product Memory depth
TLA7L1, TLA7L2, TLA7L3, TLA7L4 32 K or 128 K samples
TLA7N1, TLA7N2, TLA7N3, TLA7N4 64 K or 256 K or 1 M or 4 M samples
TLA7P2, TLA7P4 16 M samples
TLA7Q2, TLAQP4 64 M samples
1
PowerFlex options
1
Table 1- 2: LA module clocking
Characteristic Description
Asynchronous clocking
n Internal sampling period
n Minimum recognizable word
(across all channels)
Synchronous clocking
Number of clock channels
Number of qualifier channels Product Qualifier channels
1
4 ns to 50 ms in a 1--2--5 sequence 2 ns in 2x Clocking mode
2
Channel-to-channel skew + sample uncertainty
Example: for a P6417 or a P6418 Probe anda4nssampleperiod=
1.6ns+4ns=5.6ns
3
Product Clock channels
TLA7N1 2
TLA7N2, TLA7P2, TLA7Q2 4
TLA7N3 4
TLA7N4, TLA7P4, TLA7Q4 4
TLA7N1 0
TLA7N2, TLA7P2, TLA7Q2 0
TLA7N3 2
1- 2
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
Specifications
Table 1- 2: LA module clocking (Cont.)
Characteristic Description
TLA7N4, TLA7P4, TLA7Q4 4
n Setup and hold window size
(data and qualifiers)
Setup and hold window size (data and qualifiers) (Typical)
Setup and hold window range The setup and hold window can be moved for each channel group from +8.5 ns (Ts) to
n Maximum synchronous clock rate
4
Maximum window size = Maximum channel-to-channel skew + (2 x sample
uncertainty) + 0.4 ns Maximum setup time = User interface setup time + 0.8 ns Maximum hold time = User interface hold time + 0.2 ns
Maximum setup time for slave module of m erged pair = User Interface setup time + 0.8 ns Maximum hold time for slave module of m erged pair = User Interface hold time + 0.7 ns
Examples: for a P6417 or a P6418 probe and user interface
setup and hold of 2.0/0.0 typical: Maximum window size = 1.6 ns + (2 x 500 ps) + 0.4ns = 3.0 ns Maximum setup time = 2.0 ns + 0.8 ns = 2.8 ns Maximum hold time = 0.0 ns + 0.2 ns = 0.2ns
Channel-to-channel skew (typical) + (2 x sample uncertainty)
Example: for P6417 or P6418 Probe = 1 ns + (2 x 500 ps) = 2 ns
--7.0 ns (Ts) in 0.5 ns steps (setup time). Hold time follows the setup time by the setup and hold window size.
200 MHz in full speed mode (5 ns minimum between active clock edges)
100 MHz in half speed mode (10 ns minimum between active clock edges)
Demux clocking
Demux Channels TLA7N3, TLA7N4, TLA7P4, TLA7Q4,
Channels multiplex as follows: A3(7:0) to D3(7:0) A2(7:0) to D2(7:0) A1(7:0) to D1(7:0) A0(7:0) to D0(7:0)
TLA7N1, TLA7N2, TLA7P2, TLA7Q2 Channels multiplex as follows:
A3(7:0) to C3(7:0) A2(7:0) to C2(7:0) A1(7:0) to D1(7:0) TLA7N2, TLA7P2, TLA7Q2 only A0(7:0) to D0(7:0) TLA7N2, TLA7P2, TLA7Q2 only
Time between DeMux clock edges (Typical)
Time between DeMux store clock edges (Typical)
Data Rate (Typical) TLA7N1, TLA7N2, TLA7P2, TLA7Q2, TLA7N3, TLA7N4, TLA7P4, TLA7Q4,
4
5 ns minimum between DeMux clock edges in full-speed mode 10 ns minimum between DeM ux clock edges in half-speed mode
4
10 ns minimum between DeMux master clock edges in full-speed mode 20 ns minimum between DeMux master clock edges in half-speed mode
400 MHz (200 MHz option required) half channel. (Requires channels to be multiplexed. ) These multiplexed channels double the m emory depth.
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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Specifications
Table 1- 2: LA module clocking (Cont.)
Characteristic Description
Clocking state machine
Pipeline delays Each channel group can be programmed with a pipeline delay of 0 through 3 active
clock edges.
1
It is possible to use storage control and only store data when it has changed (transitional storage).
2
Applies to asynchronous clocking only. Setup and hold window specification applies to synchronous clocking only.
3
Any or all of the clock channels may be enabled. For an enabled clock channel, either the rising, falling, or both edges can be selected as the active clock edges. The clock channels are stored.
4
Full and half speed modes are controlled by PowerFlex options and upgrade kits.
Table 1- 3: LA module trigger system
Characteristic Description
Triggering resources
Word/Range recognizers 16 word recognizers. The word recognizers can be combined to f orm ful l width, double
bounded, range recognizers. The following selections are available:
16 word recognizers 0 range recognizers 13 word recognizers 1 range recognizer 10 word recognizers 2 range recognizers 7 word recognizers 3 range recognizers 4 word recognizers 4 range recognizers
Range recognizer channel order From most-significant probe group to least-significant probe group: C3 C2 C1 C0 E3
E2 E1 E0 A3 A2 D3 D2 A1 A0 D1 D0 Q3 Q2 Q1 Q0 CK3 CK2 CK1 CK0
Missing channels for modules with f ewer than 136 channels are omitted. When merged, the range recognition extends across all the modules; the master module contains the most-significant groups.
The master module is to the left (lower-numbered slot) of a merged pair.
The master module is in the center when three modules are merged. Slave module 1 is located to t he right of the master module, and slave module 2 is located to the left of the master modul e.
Glitch detector
Minimum detectable glitch pulse wi dth
1,2
Each channel group can be enabled to detect a glitch
2.0 ns (single channel with P6417 or a P6418 probe)
(Typical)
Setup and hold violation detector
1,3
Each channel group can be enabled to detect a setup and hold violation. The range is from 8 ns before the clock edge to 8 ns after the clock edge. The range can be selected in 0.5 ns increments.
Transition detector
1- 4
1, 4
The setup and hold violation of each window can be individually programmed.
Each channel group can be enabled or disabled to detect a transition between the current valid data sample and the previous valid data sample.
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
Table 1- 3: LA module trigger system (Cont.)
Characteristic Description
Specifications
Counter/Timers 2 counter/timers, 51 bits wi de, can be clocked up to 250 MHz.
Maximum count is 2 Maximum time is 9.007 X 10
51
.
6
seconds or 104 days.
Counters and timers can be set, reset, or tested and have zero reset lat ency.
Signal In 1 A backplane input signal
Signal In 2 A backplane input signal
Trigger In A backplane input signal that causes the main acquisition and the MagniVu
acquisition to trigger if they are not already triggered
Active trigger resources 16 maximum (excluding counter/timers)
Word recognizers are traded off one-by-one as Signal In 1, Signal In 2, glitch detection, setup and hold detection, or transition detection resources are added.
Trigger States 16
n Trigger State sequence rate Same rate as valid data samples received, 250 MHz maximum
Trigger Machine Actions
Main acquisition trigger Triggers the main acquisition memory
Main trigger position Trigger position is programmable to any data sample (4 ns boundaries)
Increment counter Either of the two counter/timers used as counters can be incremented.
Start/Stop timer Either of the two counter/timers used as timers can be st arted or stopped.
Reset counter/timer Either of the two counter/timers can be reset.
When a counter/timer is used as a timer and is reset, the timer continues in the started or stopped state that it was in prior to the reset.
Signal out A signal sent to the backplane to be used by other modules
Trigger out A trigger out signal sent to the backplane to trigger other modules
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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Specifications
Table 1- 3: LA module trigger system (Cont.)
Characteristic Description
Storage control
Global storage Storage is allowed only when a specific condition is met. This condition can use any
of the trigger machine resources except for the counter/timers. Storage commands defined in the current trigger state will override the global storage control.
Global storage can be used to start the acquisition with storage initially turned on (default) or turned off.
By event Storage can be turned on or off; only the current sample can be stored. The event
storage control overrides any global storage commands.
Block storage When enabled, 31 samples are stored before and after the valid sample.
Block storage is disallowed when glitch storage or setup and hold v iolation is enabled.
Glitch violation storage The acquisition memory can be enabled to store glitch violation information with each
data sample when asynchronous clocking is used. The probe data storage size is reduced by one half (the other half holds the violation information). The fastest asynchronous clocking rate is reduced to 10 ns.
1
Each use of a glitch detector, setup and hold violation detector, or transition detector requires a trade-off of one word recognizer resource.
2
Any glitch is subject to pulse width variation of up to the channel-to-channel skew specification + 0.5 ns.
3
For TLA7N1, TLA7N2, TLA7N3, TLA7N4, TLA7P2, TLA7P4, TLA7Q2, and TLA7Q4 Logic Analyzer modules, any setup value is subject to variation of up to 1.8 ns; any hold value is subject to variation of up to 1.2 ns.
4
This mode can be used to create transitional storage selections where all channels are enabled.
Table 1- 4: LA module MagniVu feature
Characteristic Description
MagniVu memory depth 2016 samples per channel
MagniVu sampling period Data is asynchronously sampled and stored every 500 ps in a separate hi gh resoluti on
memory.
Table 1- 5: LA module data handling
Characteristic Description
Nonvolatile memory retention time (Typical)
1- 6
Battery is integral to the NVRAM. Battery life is > 10 years.
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
Table 1- 6: LA module input parameters with probes
Characteristic Description
n Threshold Accuracy ±100 mV
Threshold range and step size Setable from +5 V to --2 V in 50 mV steps
Threshold channel selection 16 threshold groups assigned to channels.
P6417 and P6418 probes have two threshold settings, one for the clock/qualifier channel and one for the data channels. P6434 probes have four threshold settings, one for each of the clock/qualifier channels and two for the data channel s (one per 16 data channels).
n Channel-to-channel skew ≤ 1.6 ns maximum (When merged, add 0.5 ns for the slave module.)
Channel-to-channel skew (Typical)
Sample uncertainty
Asynchronous: Sample period
Synchronous: 500 ps
Probe input resistance (Typical)
Probe input capacitance: P6417, P6434 (Typical)
Probe input capacitance: P6418 (Typical)
Minimum slew rate (Typical)
Maximum operating signal 6.5 V
Probe overdrive:
P6417, P6418
P6434
Maximum nondestructive input signal to probe ±15 V
Minimum input pulse width signal (single channel) (Typical)
Delay time from probe tip to input probe connector (Typical)
1.0 ns typical (When merged, add 0.3 ns for the slave module.)
20 k
2pF
1.4 pF data channels 2 pF CLK/Qual channels
0.2 V/ns
p-p
--3.5 V absolute input voltage minimum
6.5 V absolute input voltage maximum
±250 mV or ±25% of signal swing minimum required beyond threshold, whichever is greater ±300 mV or ±25% of signal swing minimum required beyond threshold, whichever is greater ±4 V maximum beyond threshold
2ns
7.33 ns
Specifications
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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Specifications
Table 1- 7: LA module mechanical
Characteristic Description
Slot width Requires 2 mainframe slots
Weight (Typical)
Overall dimensions
Height 262 mm (10.32 in)
Width 61 mm (2.39 in)
Depth 373 mm (14.7 in)
Probe cables
P6417 length 1.8 m (6 ft)
P6418 length 1.93 m (6 ft 4 in)
P6434 length 1.6 m (5 ft 2 in)
Mainframe interlock 1.4 ECL keying is implemented
5 lbs 10 oz. (2.55 kg) for TLA7N4, TLA7P4 or TLA7Q4 8 lbs (3.63 kg) for TLA7N4, TLA7P4 or TLA7Q4 packaged for domestic shipping
Table 1- 8: Merged modules
Characteristic Description
Number of modules that can be merged together
Number channels after merge The sum of the data channels of both modules plus the CLK/QUAL channels (active
Merge system acquisition depth Channel depth is equal to the smallest depth of the modules.
Number of clock and qualifier channels after merge
Merge system triggering resources Triggering resources are the same as a single module except that the widths of the
Refer to Merging Rules on page 2--10.
clocks for the merge system) of the master module plus the CLK/QUAL channels (nonactive stored clock channels to the merge system).
Same number of clock and qualifier channels on the master module. The clock and qualifier channels on the slave module have no effect on clocking and are only stored.
word/range recognizers, setup and hold violation detector, glitch detector, and transition detector are increased to the merged channel width.
Table 1- 9: Atmospherics
Characteristic Description
Altitude
Operating To 10,000 ft. (3040 m) (derated 1_ C per 1000 ft (305 m) above 5000 ft (1524 m)
altitude)
Non-operating 40,000 ft. (12190 m)
Temperature
1- 8
TLA7Nx, TLA7Px, & TLA7Qx Logic Analyzer Module S ervice Manual
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