Tektronix TLA7BB2, TLA7BXX Series, TLA7BB3, TLA7BB4, P6960 Performance Verification

xx
TLA7Bxx Logic Analyzer Series
ZZZ
Product Specications & Performance Verication
Technical Reference
This document applies to TLA System Software Version 5.6 or higher
www.tektronix.com
P077014801*
077-0148-01
Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Specications and price change privileges reserved.
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
Contacting Tektronix
Tektronix, Inc. 14150 SW Karl Braun Drive P.O. Box 500 Beaverto USA
For product information, sales, service, and technical support:
n, OR 97077
In North America, call 1-800-833-9200. Worl dwid e, visi t www.tektronix.com to nd contacts in your area.
Warranty
Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be n the property of Tektronix.
ew or reconditioned to like new performance. All replaced parts, modules and products become
In order to o the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage result b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modied or integrated with other products when the effect of such modication or integration increases the time or difculty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
TRONIX' RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE
TEK AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
[W2 – 15AUG04]
btain service under this warranty, Customer must notify Tektronix of the defect before the expiration of
ing from attempts by personnel other than Tektronix representatives to install, repair or service the product;
Table of Contents
Preface .............................................................................................................. iii
Related Documentation ...................................................................................... iii
Specications and Characteristics ................................... ................................ ............. 1
Atmospheri
TLA7Bxx Logic Analyzer Module Specications.............................................................. 3
Performance Verication Procedures............................................................................ 13
Test Equipment................................................................................................ 13
Threshold Accuracy Test Fixture ........................................................................... 14
Threshold Accuracy Test................................. ................................ .................... 15
Setup & H
Functional Check Procedures ................................ .................................. .................. 21
Functional Verication ............. .................................. ................................ ........ 21
c Characteristics............. ................................ .................................. ... 2
old Test ............................................................................................ 17
List of Tables
Table 1: Atmospheric characteristics............................................................................. 2
Table 2: Input parameters with probes ........................................................................... 3
Table 3: Analog output............................................................................................. 4
le 4: Channel width and depth................................................................................ 4
Tab
Table 5: Asynchronous sampling................................................................................. 5
Table 6: Synchronous sampling................................................................................... 5
Table 7: Demultiplex sampling ... . ..... . .... . . .... . ..... . ..... . ... . . ..... . ..... . .... . ..... . ..... . ..... . .... . ..... 6
Table 8: Source synchronous sampling ........... ................................ ............................... 7
Table 9: Clocking state machine....................... ................................ ........................... 7
Table 10: Trigger system ................................... ................................ ....................... 7
Table 11: MagniVu feature ..................... .................................. ................................ 10
Table 12: Merged modules ... ................................ .................................. .................. 11
Table 13: Data placement..................................... ................................ .................... 11
Table 14: NVRAM ...................... ................................ ................................ .......... 12
Table 15: Mechanical ............................................................................................. 12
Table 16: Test equipment ................... ................................ ................................ ...... 13
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication i
Table of Contents
ii TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Preface
Related Documentation
This document lists the characteristics and specications of the TLA7Bxx Logic Analyzer products. It also contains performance verication and functional check procedures f
or the TLA7ABxx Logic Analyzer module.
For information on safety summaries, environmental considerations, and compliance
information, refer to the Tektronix Logic Analyzer Family Product
Safety and Compliance Instructions (Tektronix part number 071-2591-xx).
TThe following table lists related documentation, available as printed documents or as PDF documents on the TLA Documentation CD and on the Tektronix Web site (www.tektronix.com). Other documentation, such as online help, is available on the instrument.
Related documentation
Item Purpose
TLA Quick Start User manuals
Online Help
Installation Reference sheets High-level installation information
Installation manuals
XYZs of Logic Analyzers
Declassication and Securities instructions Data security concerns specic to sanitizing
Application notes
Product Specications & Performance Verication procedures
Field upgrade kits
Optional service manuals Self-service documentation for modules and
High-level operational overview
In-depth operation and UI help
Detailed rst-time installation information
Logic analyzer basics
or removing memory devices from Tektronix products
Collection of logic analyzer application specic notes
TLA Product specications and performance verication procedures
Upgrade information for your logic analyzer
mainframes
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication iii
Preface
iv TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Specications and Characteristics
All specications in this document are guaranteed unless noted Typ ical.Typical characteristics describe typical or average performance and provide useful reference in
formation.
Specications that are marked with the indirectly verication procedures described in this document. (See page 13, Performance Verication Procedures.)
The performance limits in this specication are valid with these conditions:
For mod conditions:
) at your nearest Tektronix location or by using the performance
The instr humidity, and vibration within the operating limits described in these specications.
The instrument must have had a warm-up period of at least 20 minutes.
The mo
The module must h ave been calibrated/adjusted at an ambient temperature betw
ument must be in an environment with temperature, altitude,
ules, the performance limits in this specication are valid with these
dule must be installed in a Tektronix Logic Analyzer Mainframe.
een +18 °C and +28 °C.
symbol are checked directly (or
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 1
Specications and Characteristics
Atmospheric C
haracteristics
Table 1: Atmospheric characteristics
Characteris
Temperature
Relative
ude
Altit
tic
Humidity
Description
Operating (n
+0 °C to +40 ° 305 m (1000 ft) above 1524 m (5000 ft) altitude)
Nonoperating (no media)
-20 °C to +60 °C, 15 °C/hr maximum gradient, noncondensing
Operating (no media)
5% to 90% relative humidity at 30 ° C, 75% relative humidity between 30 °C to 40 °C, noncondensing. Maximum wet bulb temperature: +29.4 °C (derates relative humidity to approxi
Nonope
5% to 90 +40 °C (derates relative humidity to approximately 22% at +50 °C).
Operating
To 3000 m (9843 ft), (derated 1 °C per 305 m (1000 ft) above 1524 m (5000 ft) altitude.
Nono
12,
o media in CD or DVD drive of the mainframe)
C, 15 °C/hr maximum gradient, noncondensing (derated 1 °C per
mately 57% at +40 °C).
rating (no media)
% relative humidity to 50 °C, noncondensing. Maximum wet bulb temperature:
perating
000 m (39,370 ft )
2 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
TLA7Bxx Logic Analyzer Module Specications
TLA7Bxx Logic
Table 2: Inpu
t parameters with probes
Analyzer Module Specications
Characteristic Description
Threshold accuracy
± (35 mV + 1% of threshold voltage setting)
For certication trace the characteristic
Threshold range and step size
Large mode
Fast mode
P6960HS probe
Threshold channel selection
Channel-to-channel skew
1
2
Settable from –2.0 V to + 4.5 V in 5 mV steps
Settable from –1.8 V to + 2.8 V in 5 mV steps
Settable
There is a
±40 ps ma
from –1.0 V to +2.25 V in 5 mv steps
n independent threshold control for each signal.
ximum (module only)
Add:±60 ps for P6810, P6860, and P6880 probes
Channel-to-channel skew (Typical)
Merged
module-to-module skew
(Typical)
For modu
Inside slave modules (next to master module): +/-120ps (modules only)
Outside slave modules (not next to master module): +/-220ps (modules only)
le only:±20 ps
Sample uncertainty
Asynchronous
Synchronous
Sample period
20 ps
Input voltage range
Large mode
Fast mode
60HS probe
P69
imum slew rate (Typical)
Min
1
2
–2.0 V to + 5.5 V
–2.5 V to + 3.5 V
25 V to +2.5 V
–1.
V/ns
0.2
Maximum operating signal swing
Large mode
Fast mode
Probe overdrive
1
2
6.0 V
2.0 V
p-p
p-p
(Relationship between signal amplitude and threshold setting)
Single ended probes ±150 mV (Large mode)
±100 mV (Fast mode)
or ±25% of signal swing minimum required beyond threshold, whichever is greater
±50 mV or ±25% (P6960HS probe)
Differential probes V
Maximum nondestructive input signal to probe
±50 mV
V
±15 V
±7.5 V (P6960HS probe)
pos–Vneg
pos–Vneg
is 1250 mV
(Fast mode)
p-p
is ±50 mV
1
2
(Large mode)
p-p
2
(P6960HS probe)
p-p
1
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 3
TLA7Bxx Logic Analyzer Module Specications
Table 2: Input parameters with probes (cont.)
Characteristic Description
Minimum input pulse width (single channel) (Typical)
Electrical delay from probe tip to
200 ps (high-density and differential probes)
250 ps (general purpose probe)
7.70 ns ±60 ps (general purpose, high-density, and differential probes)
input connector (Typical)
1
The Large m
2
The Fast mode specication applies when the voltage swing of the input signal is less than two volts; performance is not degraded in Fast mode.
ode specication applies when the voltage swing of the input signal is over two volts; the performance can degrade in Large mode.
Table 3: Analog output
Characteristic Description
Number of outputs Four analog outputs regardless of the module width. Any four of the module's channels can be
mapped t
Attenuation 10X
Bandwidth (Typical) >3 GHz
Accuracy (Gain & Offset)(Typical) ±(50 mV + 2% of signal amplitude)
o the four analog outputs.
Table 4: Channel width and depth
Characteristic Description
Number of data channels
TLA7BB4, TLA7BC4
TLA7BB3
TLA7BB2
Acquisition memory depth
TLA7BB2, TLA7BB3, TLA7BB4 64 M per channel, maximum
TLA7BC4
128 data, 8 clock/qualier
96 data, 6 clock/qualier
64 data, 4 clock/qualier
128 M per channel, maximum
4 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
TLA7Bxx Logic Analyzer Module Specications
Table 5: Asynch
Characteristic Description
Internal sampling period
Minimum recognizable word
(across all channels)
ronous sampling
1.25 ns, 800 MS, all channels
625 ps, 1600 MS, all channels
313 ps, 3200 M
157 ps, 6400 MS, quarter channels
50 ms is the slowest sampling rate. A 1-2-5 sequence is supported, but it starts with 157 p s.
Channel-to-channel skew + sample uncertainty
Example for =1.47ns
This specication applies only with asynchronous sampling. With synchronous sampling, the setup and h
Table 6: Synchronous sampling
Characteristic Description
Synchronous sampling
Master clock signals
TLA7BB2
TLA7BB3
TLA7BB4, TLA7BC4
Merged slave clock signals
TLA7BB2
TLA7BB3
TLA7BB4, TLA7BC4
Qualier signals
TLA7BB2
TLA7BB3
TLA7BB4, TLA7BC4
Single channel setup and hold
indow size
w
Clock signals
4
4
4
You can enable any or all of the clock signals. For an enabled clock signal, you can select the rising, falling, or both edges as active clock edge(s). The clock signals are stored.
Clock signals
4
4
4
(In addition to the two clock signals that the Master can send to merged slave modules, each slave module can have additional clocks.)
You can enable any or all of the clock signals For an enabled clock signal you can select the rising, falling, or both edges as active clock edge(s). Merging is allowed with all TLA7Bxx modules.
Qualier signals
0
2
4
Qualier signals are stored.
Single channel on single module 220 ps maximum
Single channel on two to ve merged modules 240 ps maximum
If Deskew is used, add 20 ps (one oversampler step size) to the above numbers.
S, half channels
a P6860 high-density probe and a 1.25 ns sample period: 160 ps (±60 ps) + 1.25 ns
old window size applies.
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 5
TLA7Bxx Logic Analyzer Module Specications
Table 6: Synchronous sampling (cont.)
Characteristic Description
Setup and hold window range For each signal, the setup and hold w indow can be moved from +7.5 ns (setup time, typical) to
-7.5 ns (setup time, typical) in 20 ps steps. You can shift the setup and hold window towards the setup region with 0 ns, 2.5 ns, 5 ns, or 7.5 ns. With a 0 ns shift the range is [+7.5, -7.5] ns, with a 2.5 ns shift the range is [+10,-5] ns, and with a shift of 7.5 ns the range is [+15,0]. The sample point selection region is the same setup and hold window. This is specied for the setup time with typical gures. Hold time follows the setup time by the Setup and hold window size.
Maximum synchronous clock
rate
750 MHz, one sample point per clock, all channels
750 MHz, two sample points per clock, all channels
750 MHz, four samples points per clock, half channels
1400 MHz, one sample point per clock, all channels
1400 MHz, two sample points per clock, half channels
Table 7:
Characteristic Description
Base signals (2:1)
Base signals (4:1)
ime between demultiplex clock
T edges (Typical)
Demultiplex sampling
], A2[7:0], A1[7:0], A0[7:0]
A3[7:0
TLA7BB4, TLA7BC4
TLA7BB3 A3[7:0], A2[7:0], A1[7:0], A0[7:0]
BB2
TLA7
TLA7BB4, TLA7BC4
TLA7BB3 A3[7:0], A1[7:0]
A7BB2
TL
C3[7:0], C2[7:0]
E3[7:0], E2[7:0]
K2, CK1, CK0
CK3, C
0], C2[7:0]
C3[7:
CK1, CK0
:0], A2[7:0], A1[7:0], A0[7:0]
A3[7
CK3, CK1
:0], A1[7:0]
A3[7
C3[7:0]
E3[7:0]
,CK1
CK3
[7:0]
C3
CK1
[7:0]
A1
C3[7:0]
Same limitations as that for normal synchronous acquisition.
6 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
TLA7Bxx Logic Analyzer Module Specications
Table 8: Source
Characteristic Description
Source synchronous edge detectors per module
Source synchronous edge detectors w
Clock group
Size of clo
Source synchronous clock alignment window
Source synchronous clock reset The Clock Group Valid FIFOs can be reset in the following ways:
ck group valid FIFO
synchronous sampling
ith merged modules
s
4
Slave modules have four source synchronous edge detectors. Two clocks are passed over from the mas
Four for bot
Four stage the Clock Group Valid signal for that group.
Channel-to-channel skew only
1. By the or by the master heartbeat clock (synchronous or asynchronous). An active edge on a source synchronous clock places the reset count to its preset value. The timing is such that an active clock ed
2. By enabling an external reset. In this mode, one of the clock signals must be traded on the master module to act as a level-sensitive reset input. Any one of the clocks can be chosen and a polar
The two modes cannot be intermixed; one or the other must be chosen.
ter module.
h single module and for a merged system
s (source synchronous or other) clocks to occur before the clock that completes
overow of a presettable (0-255) 8-bit counter that counts by the 1.25 ns system clock
ge will clear the Clock Group Reset before a rriving at the FIFO so that no data is lost.
ity selection is available. This mode affects all Clock Group Complete circuits.
Table 9: Clocking state machine
Characteristic Description
Pipeline delays
Each signal can be individually programmed with a pipeline delay of 0 through 31 active clock edges. The value held by the pipelines at the beginning of an acquisition can be preset high or low (all stages of a particular signal are forced to the same value).
Table 10: Trigger system
Characteristic Description
Triggering resources
rd, range, and
Wo channel-to-channel compare recognizers
24, word/range recognizers. The word recognizers can be traded off to form full width, double-bounded range recognizers. The following selections are available:
24 word recognizers
21 word recognizers
8 word recognizers
1
15 word recognizers
12 word recognizers
9 word recognizers
6 word recognizers
3 word recognizers
0 word recognizers
0 range recognizers
1 range recognizer
range recognizers
2
3 range recognizers
4 range recognizers
5 range recognizers
6 range recognizers
7 range recognizers
8 range recognizers
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 7
TLA7Bxx Logic Analyzer Module Specications
Table 10: Trigger system (cont.)
Characteristic Description
Range recognizer channel order
TLA7BB4, TLA7BC4 CK3 Q1 C3 C2 C1 C0 Q3 Q2 E3 E2 E1 E0 CK0 Q0 A3 A2 D3 D2 CK1 CK2 A1 A0 D1 D0
TLA7BB3
TLA7BB2
Glitch detector (Asynchronous clock mode)
Minimum detectable glitch pulse width (Typical)
Setup and hold violation detector (Synchronous clock mode)
Transition detector
Fast counter/timers
Signal In [3:0] Mainframe backplane input signal
Arm In
From most-signicant probe group to least-signicant probe group:
Missing channels for modules with fewer than 136 channels are omitted. When merged, the range recognition extends across the two modules. The master module contains the most-signicant groups.
CK3 Q1 C3 C2 C1 C0 CK0 Q0 A3 A2 D3 D2 CK1 CK2 A1 A0 D1 D0
CK3 CK0 C3 C2 A3 A2 CK1 CK2 A1 A0 D1 D0
Any signal can be individually enabled to detect a glitch.
A glitch is two or more signal transitions on a signal between the Asynchronous sample points.
Minimum input pulse width (single-signal)
200 ps for high-density probes
250 ps for general purpose probes
Any signal can be individually enabled to detect a setup or hold violation. The window range is from 7.5 ns before the clock edge to 7.5 ns after the clock edge. This range may be shifted towards the positive region by 0 ns, 2.5 ns, 5 ns, or 7.5 ns. With a 0 ns shift the range is [+7.5,-7.5]ns,witha2.5nsshiftitis[+10,-5]ns,witha5nsshifttherange is [+12.5, -2.5] ns, and with a shift of 7.5 ns the range is [+15, 0] ns. The sample point selection region is the same as the setup and hold violation window.
The size of each signal’s setup/hold violation window can be individually programmed. The maximum width of the window (and granularity of adjustment) depends on the decimation setting:
@ 20 ps granularity, max window size = 2.5 ns
@ 40 ps granularity, max window size = 5.0 ns
@ 80 ps granularity, max window size = 15 ns
Any setup value is subject to variation of up to the skew specication. Any hold value is subject to variation of up to the skew specication.
Setup and hold detection is restricted to a group rather than individual signals; you can dene individual groups for individual signals.
24, any signal can be individually enabled or disabled to detect a rising or falling transition (or either) between the current valid data sample and the previous valid data sample.
Transition detection is restricted to a group rather than individual signals; you can dene individual groups for individual signals.
Two fast counter/timers. Each is 48 bits wide and can be clocked up to 800 MHz.
48
maximum count = 2
maximum time = ~3.5 x 10
–1 (including sign bit)
5
sec = ~4 days
Zero clock TC latency, with zero reset latency
Counters can be reset, do nothing, incremented or decremented.
Timers can be reset, not changed, started or stopped.
Mainframe backplane input signal
8 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
TLA7Bxx Logic Analyzer Module Specications
Table 10: Trigger system (cont.)
Characteristic Description
Trigger In
Active trigger resources
Trigger states 16
Trigger st
sequence rate
Trigger machine actions
Main acquisition trigger Trigger the main acquisition memory.
Main trigger position
MagniVu trigger
MagniVu trigger position
Increment and decrement counter
Snapshot recognizer Loads the current acquired data sample into the reference value of the word recognizer via a
Snapshot load latency
Start/stop timer Either of the two counter/timers used as a timer can be started or stopped.
Reset counter/timer Either of the counter/timers can be reset.
Signal Out[3:0]
Trigger Out
Probe/Trigger/Backplane delay relationships
Delay time from probe tip to multiplex Signal Out (TLA7Bxx module front panel analog output connector) (Typical)
Delay time from probe tip to trigger machine action (Typical)
Delay time from trigger machine action to Signal Out (TLA7Bxx module P2 connector) (Typical)
Delay time from trigger machine action to Trigger Out (TLA7Bxx module P2 connector) (Typical)
ate machine (TSM)
Mainframe backplane input signal that causes both the main acquisition and MagniVu acquisition to trigger (if they are not already triggered).
24 maximum (excluding the counter/timers and Signal In)
DC to 800 MHz (1.25 ns)
For data rates of 800 Mb/s or less, the TSM evaluates one data sample per TS M clock. For data rates greater than 800 Mb/s, the TSM evaluates multiple data s amples per TSM clock up to the maximum acquired data rate.
Programmable to any data sample (1.25 ns boundaries).
Triggering of MagiVu memory is controlled by the main acquisition trigger machine.
Programmable within 1.25 ns boundaries and separate from the main acquisition memory trigger position.
Either of the two counter/timers used as counters can be incremented or decremented.
trigger machine action. All the data signals are loaded into their respective word recognizer reference register on a one-to-one manner.
With merged modules, the snapshot recognizer only works with the master module.
325 ns
When a timer is reset, the timer continues in the started or stopped state it w as in prior to the reset.
A signal sent to the backplane to be used by other modules.
A signal sent to the backplane to trigger other modules.
9.45 ns, ± 500 ps
1254 ns + Sample error
Driving Signal 3:4
Driving Signal 2:1
38 ns
35 ns
35 ns
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 9
TLA7Bxx Logic Analyzer Module Specications
Table 10: Trigger system (cont.)
Characteristic Description
Delay time from Signal In to trigger
Signal In 4:1 54 ns + Sample CLK
machine action (not used as ARM)
(Typical)
Delay time fromSignal In (TLA7B xx
53 ns + Sample CLK
1
module P2 connector) to trigger machine action (used as ARM)
(Typical)
Delay time from Trigger In
38 ns + Sample CLK
1
(TLA7Bxx module P2 connector) to trigger machine action (Typical)
Storage control
Global storage Storage is allowed only if a specied condition is met. This condition can use any of the trigger
resources except for the counter/timers. Storage commands dened in the current trigger state will override the global storage control.
Global storage can be used to start the acquisition with storage initially turned on (default), or off.
By event
Storage may be turned on or off, or only the current sample may be stored. Event storage control overrides any global storage commands.
Block storage
(This allows users to store a group of samples around a valid data
When enabled, 31 samples are stored before and after the valid sample.
This has meaning only when storage control is being used. Block storage is disallowed when
glitch storage or setup and hold violation storage is enabled. sample when storage control is used.)
Glitch violation storage Glitch violation information can be stored to acquisition memory with each data sample when
asynchronous sampling is used. The acquisition data storage size is reduced by half when
this mode is enabled (the other half holds the violation information). The fastest asynchronous
sampling rate when Glitch violation storage is enabled is 1.25 ns.
Setup and hold violation storage The acquisition memory can be enabled to store setup and hold violation information with each
data sample when synchronous sampling is used. The acquisition data storage size is reduced
by one half when this mode is enabled (the other half holds the violation information). The
maximum sync clock rate in this mode is 750 MHz.
1
Sample CLK is the delay due to logic analyzer sampling. For asynchronous sampling, this delay is equal to the internal sampling period. For synchronous sampling, this delay is equal to time until the next active clock edge.
1
Table 11: MagniVu feature
Characteristic Description
MagniVu memory depth 128K per channel
This acquisition memory is separate from the main acquisition memory.
MagniVu sampling period Data is asynchronously sampled and stored every 20 ps in a separate high resolution memory.
The storage speed can be changed (by software) to 40 ps, 80 ps, 160 ps, 320 ps, or 640 ps
(with no loss in memory depth) so that the MagniVu memory covers more time at a l ower
resolution.
10 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
TLA7Bxx Logic Analyzer Module Specications
Table 12: Merge
Characteristic Description
Number of merged modules
Number of channels after merging Sum of all channels available on each of the merged modules including clocks and qualiers.
Merged system acquisition depth
Number of clock and qualier channels
Merged system triggering resourc
after merging
es
d modules
2, 3, 4, or 5 adj and channel depths.
When two modules are merged, the master is in the lower numbered slot.
When three modules are merged, the master is in the center slot (slave on each side).
When four modules are merged, the master is in the next to lowest numbered slot.
When ve modules are merged, the master is in the center slot (two slaves on each side).
No channels are lost when modules are merged.
The channel depth is equal to that of the shallowest module.
The qualier signals on the slave m odules can only be used as data signals. They cannot inuence
The clock signals on the slave modules can c apture data on those modules for source-synchronous applications. Each slave module contributes four additional clock signals to the me
Same as a main difference is that for word recognizers, setup and hold violation detector, glitch detector, and transition detectors, the width is increased to equal the merged signal width. The range
izer width will increase to the merged signal width up to three modules. Range
recogn recognizers are limited to a maximum of f our when merged. The Snapshot recognizer only works with the master module in merged module congurations.
acent modules can be merged. Modules can have unequal channel widths
the actual clocking function of the logic analyzer (for example, log strobe generation).
rge set. All clock and qualier signals are stored to acquisition memory.
single module except for range recognizers and the snapshot recognizer. The
Table 13: Data placement
Characteristic Description
System time zero placement error
(Typical)
Data correlation error (Typical) ±50 ps + System time zero placement error
Relative data timestamp accuracy
(Typical)
Timestamp counter resolution and duration
±1.25 ns + Mainframe backplane 10 MHz skew
This species how well TLA7Bxx modules can place system time zero. All of the stored acquisition data is referenced to this point.
The maximum error in being able to place data to the System Time Zero mark.
Error sources include:
System time zero placement error
400 MHz clock variation
±100 ps + Sample uncertainty + mainframe backplane 10 MHz clock jitter/tolerance
A timestamp value relative to System time zero i s stored w ith every data sample.
This specication can be used to indicate the accuracy of a time measurement between samples. When measuring between the samples, only the time difference between samples should be used to indicate the accuracy. For example, if one sample has a timestamp of 1 hour, and another sample has a timestamp of 1 hour and 10 ms, then 10 ms is the period of time used to determine the amount of error caused by the 10 MHz clock tolerance.
20 ps resolution
4.17 days duration
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 11
TLA7Bxx Logic Analyzer Module Specications
Table 14: NVRAM
Characteristic Description
Nonvolatile memory retention time (Typical) Battery is integral to the NVRAM. Battery life is >10 years.
The length of time that calibration constants and other information stored in NVRAM is retained i
n the absence of power to the instrument.
Table 15: Mechanical
Characteristic Description
Construction material Chassis parts constructed of aluminum alloy; front of instrument is constructed of
plastic laminated to steel front panel; circuit boards constructed of glass-laminate. Cabinet is aluminum.
Weight
Overall dimensions
TLA7BB4, TLA7BC4
TLA7BB3
TLA7BB2
Height
Width
Depth
5 lb. 6 oz. or 2.45 kg
5 lb. 4 oz. or 2.4 kg
5 lb. 0.5 oz. or 2.3 kg
10.32 in.
2.39 in. (Width increases by 0.41 in. when the merge connector is in the “up” position.)
14.70 in.
12 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Performance Verication Procedures
This section contains procedure for performance verication of the logic analyzer. Generally, you should perform these procedures once per year or following repairs that affect c
The performance verication procedures c heck the following specications:
Threshold Accuracy
Setup/Hold Window Size
Test Equipment
The procedures in this section use external, traceable signal sources to test the specications marked with the directly (or indirectly) by using the performance vericationproceduresinthis section. For convenience, you can also return your TLA7Bxx module to your nearest Tektronix location to have Tektronix perform these procedures.
To complete the performance verication procedures, you will need the equipment listed in the following table:
ertication.
symbol. These specications are checked
Table 16: Test equipment
Test equipment or xture Requirements Example
Precision voltage reference or a DC signal generator and precision digital voltmeter
Threshold Accuracy test xture
TLACAL software Refer to the TLA7000 Series
Deskew xture Includes coaxial cable with SMA connector. Use deskew
P6800 Deskew xture
P6900 Deskew xture
(accurate to within ±5 mV)
For Threshold Accuracy Test
For Setup and Hold Test
One required. (Seepage 14,
Threshold Accuracy Test Fixture.) Warm-up tim e:
30 minutes
Logic Analyzer Installation Manual for information on
installing and using the TLACAL software.
xture appropriate for your P6800 or P6900 probe.
P6810Logic analyzer probe
P6800 or P6900 series probe
Tektronix part number 020-2942-00
Tektronix part number 020-2940-00
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 13
Performance Verication Procedures
Threshold Accuracy Test Fixture
Use this xture to gain access to the logic analyzer probe pins. The xture
connects all ground pins together, and all signal pins together.
Equipment Required
Build Procedure
You will need the following items to build the test xture:
Item Description Example part number
Square-pin strip
Wire 20 gauge
Soldering iron and solder
0.100 x 0.100, 2 x 8 contacts (or two 1 x 8 contacts )
50 W
SAMTEC part number TSW-102-06-G-S
Use the following procedure to build the test fixture.
1. Set the square-pin strip down and lay a wire across one row of pins on one side of the insulator as shown. Leave some extra wire at one end for connec
ting to a test lead. (See Figure 1.)
2. Solder the wire to each pin in the row.
3. Repeat for the other row of pins.
Figure 1: Threshold Accuracy test xture
14 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Threshold Accuracy Test
This procedure veries the threshold voltage accuracy of the logic analyzer.
Performance Verication Procedures
Test Equipment Setup
TLA7Bxx Setup
Equipment required
Prerequisi
Connect a P
tes
6810 probe from the logic analyzer to the voltage source, using the
Precision vo generator and precision digital voltmeter (accurate to within ±5mV)
Threshold A
P6810 Logic analyzer probe
Warm-up tim
ltage reference or a DC signal
ccuracy test xture
e: 30 minutes
Threshold Accuracy test xture. If the voltage source does not have the required output accuracy, use a multimeter with the required accuracy to verify the voltage output levels specied in the procedure.
To set up the logic analyzer for this test, you must dene the characteristics of the channel that you are testing, and then set the trigger parameters:
1. Open the Setup window.
2. In the
Group column, enter a name for the probe group that you are testing
(“Test” in the example).
a. Dene
the signals for the group that you are testing.
b. Set the sampling to Asynchronous, 1.25 ns.
c. Set Acquire to Samples.
d. Set the Samples per Signal to 128 K or less.
3. Go to the Trigger window and select the Power Trigger tab. Create a trigger
program that triggers the logic analyzer when it doesn't see all highs or all lows:
a. Click the If Then button.
b. Set the channel denition to match the gure shown. (See Figure 2 on
page 16.)
c. After you set the channel denitions, click OK.
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 15
Performance Verication Procedures
Figure 2: Setting trigger parameters
16 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Performance Verication Procedures
Verication Procedure
Complete the fo the copy of the Calibration Data Sheet.
1. Go to the Setup window of the logic analyzer and set the probe threshold voltages to 4 V.
2. Set the voltage source to 3.875 V.
3. Start t
4. Increase the voltage in 10 mV steps, waiting at least 3 seconds between steps
to make sure that the logic analyzer continues to run without triggering. Continue until the logic analyzer triggers and then record the voltage.
5. Set the voltage source to 4.125 V.
6. Start the logic analyzer and verify that it does not trigger.
7. Decrease the voltage in 10 mV steps, waiting at least 3 seconds between
steps to make sure that the logic analyzer continues to run without triggering. Continue until the logic analyzer triggers and then record the voltage.
8. Add the two voltage values and divide by two. Verify that the result is
4.00 V ±75 mV. Record the voltage on the Calibration Data Sheet.
9. Go to the Setup window and set the logic analyzer threshold voltages to –2.0 V.
10. Repeat steps 3 through 8 for –2.105 V and –1.895 V.
llowing steps to complete this procedure. Record the results on
he logic analyzer and verify that it does not trigger.
Setup & Hold Test
11. Add the two voltage values and divide by two. Verify that the result is –2.00 V ±55 mV. Record the voltage on the Calibration Data Sheet.
12. Repeat the procedure for each probe channel group that you want to verify.
This test uses the Verication part of the TLA7Bxx deskew procedure to verify the setup and hold time. The complete deskew procedures are described in the TLA7000 Series Logic Analyzers Installation Manual. The manual is available on your TLA Documentation CD and on the Tektronix Web site. Refer to the installation manual, to install the TLACAL software.
NOTE. The deskew procedures require the appropriate TLACAL software and
deskew test xture, which are described in the TLA7000 Series Logic Analyzer Installation Manual.
The following procedure describes the Verication part of the deskew procedure. You should be able to run the Verication procedure without performing the full deskew procedure. If any failures occur, try running the full deskew procedure as described in the TLA7000 Series Logic Analyzer Installation Manual and then try the Verication procedure again.
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 17
Performance Verication Procedures
1. Close the TLA ap
2. Double-click the TLACAL icon on the desktop to start the software.
3. When the TLA Connection dialog box appears, connect to your instrument.
The TLACAL window appears on your desktop. (See Figure 3.)
plication if it is running.
Figure 3: TLACAL startup window
4. In the dialog box, select the module that you want to test.
5. Click the Verication button to start the software. The Verication procedure
dialog box appears. (See Figure 4.)
18 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Performance Verication Procedures
Figure 4: Verication procedure dialog box
6. Verify that Setup and Hold is selected at the top of the dialog box.
7. Click the Next button at the bottom of the dialog box to display the probe
connection instructions.
8. Follow the on-screen instructions to connect the probes, clock cable, and the deskew xture.
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 19
Performance Verication Procedures
9. Click the Next b instructions. The software will begin the verification procedure and display the results in the dialog box.
The procedure has you connect and disconnect probes and the deskew xture. After you complete the procedures, make sure that the correct probes are connected for your conguration. These procedures are only valid for the probes connected to the specic probe connectors. If you change the probe connections, you must redo the procedures.
NOTE. If an
reseat them, if necessary. Then click the Back button to restart the test. If the failures continue to occur, try running the Deskew and Adjustment procedures as described in the TLA7000 Series Logic Analyzer Installation Manual. Try running the Verication procedure again.
10. Click the Finish button to nish the procedure and return to the startup window.
y failures occur, check your probe or deskew xture connections and
utton to begin the procedure and follow the on-screen
20 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Functional Check Procedures
Functional Ch
eck Procedures
Functional Verication
Power-on and Exten ded
Diagnosti
cs
Functional Extended diagnostics, and acquiring a signal from the SUT.
Do the following steps to run the power-on and extended diagnostics:
NOTE. Run
you want to save any of the acquired data, do so before running the extended diagnostics.
You w ill need a mainframe with a logic analyzer module installed in the mainframe.
Perform the following tests to complete the functional verication procedure:
NOTE. If you control your logic analyzer from a remote location, make sure
that you select Run Power-on Diagnostics in the TLA Connection dialog box. Othe
verication procedures consist of running the Power-on diagnostics,
ning the extended diagnostics will invalidate any acquired data. If
rwise the instrument will bypass the power-on diagnostics.
1. If you have not already done so, power on the instrument.
The instrument runs the power-on diagnostics each time that you power on the instrument. If any failures occur, the diagnostic window will appear.
2. Go to the System menu and select Calibration and Diagnostics.
3. Scroll through the list of tests and verify that all power-on diagnostics is pass.
NOTE. Allow the instrument to warm up for 30 minutes before continuing with the
Extended diagnostics.
TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication 21
Functional Check Procedures
4. Click the Exten
NOTE. Disconnect any probes connected to your logic analyzer module. If probes
are connected while you run the extended diagnostics, the oating stimulus test will fail. If you do not want to remove the probes, disregard the results of this test. All other tests should pass.
5. Select the top-most selection for your module in the list of tests. For example, if your logic analyzer module is installed in Slot 3 of your mainframe, select Slot 3:TLA7BB4 - LA.
6. Select the type of test that you want to run (One Time, Continuous, or Until Fail).
7. Click Run to start the tests.
All tests that displayed an "Unknown" status will change to a Pass or Fail status depending on the outcome of the tests.
8. After the tests have been completed, scroll through the list and verify that the instrument passes all tests.
NOTE. Installing a module in the mainframe provides a means of verifying
connectivity and communication between the module and the mainframe. If the
rument fails any test, try using a different module and repeat the tests to isolate
inst the problem to the mainframe or to the m odule.
ded Diagnostics tab.
Acquire a Signal
erify t hat the logic analyzer module can acquire signals, connect the logic
To v analyzer to a known good signal source through one of the logic analyzer probes.
wer on the logic analyzer and the SUT.
Po
Go to the logic analyzer Setup window and verify that the signal activity
onnectors show activity for any signals connected to the SUT. The logic analyzer
c always acquires signals. If the signal activity indicators show the correct activity for the SUT, you have veried that the logic analyzer acquired a signal from the SUT and displayed the information in the Setup window.
NOTE. If there is no signal activity, verify that the threshold setting is correct for
your circuit.
22 TLA7Bxx Logic Analyzer Series Product Specications & Performance Verication
Loading...