Tektronix TLA7AB4, TLA7AA1, TLA7AA2, TLA7AA3, TLA7AA4 Performance Verification

...

Tektronix Logic Analyzer Series

ZZZ

Product Speciﬁcations & Performance Veriﬁcation

Technical Reference Manual

This document applies to TLA System Software Version 5.6 or above

www.tektronix.com

077-1763-03

Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions.

Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Speciﬁcations and price change privileges reserved.

TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

MagniVu and iView are registered trademarks of Tektronix, Inc.

Contacting Tektronix

Tektronix, Inc. 14200 SW Karl Braun Drive P.O. B o x 5 0 0 Beaverton, OR 97077 USA

For product information, sales, service, and technical support:

In North America, call 1-800-833-9200. Worl dwid e, vis it www.tektronix.com to ﬁnd contacts in your area.

Warranty 2

Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its option, either will repair the defective product w ithout charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be n the property of Tektronix.

ew or reconditioned to like new performance. All replaced parts, modules and products become

In order to o the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the Tektronix service center is located. C ustomer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.

This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage result b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modiﬁed or integrated with other products when the effect of such modiﬁcation or integration increases the time or difﬁculty of servicing the product.

THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF A NY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.

TRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE

TEK AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

btain service under this warranty, Customer must notify Tektronix of the defect before the expiration of

ing from attempts by personnel other than Tektronix representatives to install, repair or service the product;

Ta ble of Contents

Preface ............................................................................................................... v

Related Documentation ....................................................................................... v

Speciﬁcations and Characteristics ................. ................................ ............................... 1

Characteri

Atmospheric Characteristics for the Tektronix Logic Analyzer Family...... ........................... 2

TLA7000 System Speciﬁcations.................................................................................. 3

TLA7012 Portable Mainframe Speciﬁcations ................................ .................................. . 9

TLA7016 Benchtop Mainframe Characteristics ....... ................................ ........................ 14

TLA7PC1 Controller Speciﬁcations............................................................................. 19

TL708EX

TLA700 System Speciﬁcations .................... .................................. ............................ 24

TLA715 Dual Monitor Portable Mainframe Speciﬁcations................................................... 29

Benchtop and Expansion Mainframe Speciﬁcations........................................................... 34

TLA721 Dual Monitor Benchtop Controller Speciﬁcations ................ ................................ .. 38

TLA600 Series Speciﬁcations...................... ................................ .............................. 41

Axx/TLANAx Series Logic Analyzer Module Speciﬁcations .. .................................. .... 52

TLA7

TLA7Lx/Mx/Nx/Px/Qx Module Speciﬁcations.......... ................................ ...................... 62

TLA7PG2 Module Speciﬁcations ............................................................................... 68

DSO Module Speciﬁcations .......................... .................................. .......................... 71

External Oscilloscope (iView) Characteristics ................................. ................................ 76

Performance Veriﬁcation Procedures............................................................................ 78

mmary Veriﬁcation ........................................................................................ 78

Test Equipment................................................................................................ 78

Functional Veriﬁcation ..... ................................ ................................ .................. 79

Certiﬁcation ......... .................................. ................................ ........................ 81

Performance Veriﬁcation Procedures ............................... ................................ ........ 81

Calibration Data Report........................................... .................................. .............. 83

TLA7012 and TLA7016 Test Record ............ ................................ .......................... 83

System Clock Test Data............................ .................................. ........................ 83

stic Tables .......................................................................................... 1

TekLink 8-Port Hub Characteristics ................................................................ 22

TLA Product Speciﬁcations & Performance Veriﬁcation i

Table of Contents

List of Figure

Figure 1: Dimensions of the TLA7012 Portable mainframe ................................................. 13

Figure 2: Dimensions of the TLA7016 Benchtop mainframe.............. .................................. 18

Figure 3: Dimensions of the TLA7016 Benchtop mainframe with rackmount option..................... 18

Figure 4: Dimensions of the TLA7PC1 Benchtop PC Controller............................................ 21

Figure 5: Dimensions of TLA715 Portable mainframe ....................................................... 33

Figure 6: Dimensions of the benchtop and expansion mainframe ........................................... 36

Figure 7: Dimensions of the benchtop and expansion mainframe with rackmount option................ 37

Figure 8: Dimensions of the TLA600 series logic analyzer .................... .............................. 51

List of Tables

Table 1: Atmospheric characteristics............................................................................. 2

Table 2: TLA7000 Backplane interface.......................................................................... 3

Table 3: System trigger and external signal input latencies (Typical) ........................................ 4

Table 4: System trigger and external signal output latencies (Typical)............................ ........... 5

Table 5: Intermodule latencies for LA source (Typical)........................................................ 6

Table 6: TLA7000 External signal interface .................................................................... 7

Table 7: TLA7012 Internal controller... ................................ .................................. ....... 9

Table 8: TLA7012 Display system .............. ................................ ................................ 10

Table 9: TLA7012 Front-panel interface ....................................................................... 11

Table 10: TLA7012 Rear-panel interface....................................................................... 11

Table 11: TLA7012 AC power source .......... .................................. .............................. 11

Table 12: TLA7012 Portable mainframe transportation and storage ........................................ 12

Table 13: TLA7012 Cooling . ................................ .................................. .................. 12

Table 14: TLA7012 Mechanical ................................................................................. 13

Table 15: TLA7016 Benchtop mainframe AC power source (Serial numbers B020000 and higher). . . . 14

Table 16: TLA7016 Benchtop mainframe AC power source (Serial numbers B01000 – B019999).. . .. 14

Table 17: TLA7016 Benchtop mainframe transportation and storage..................... .................. 15

Table 18: TLA7016 Benchtop mainframe cooling ............................................................ 15

Table 19: Enhanced monitor ..... ................................ ................................ ................ 16

Table 20: TLA7016 Benchtop mainframe Interface Module front panel characteristics.................. 16

Table 21: TLA7016 Benchtop mainframe mechanical .................................. ...................... 17

Table 22: TLA7PC1 Internal speciﬁcations ...... ................................ .............................. 19

Table 23: External controls and connectors .................................................................... 20

ii TLA Product Speciﬁcations & Performance Veriﬁcation

Table of Contents

Table 24: TLA7P

Table 25: TL708 EX TekLink 8-Port Hub signal switching characteristics ................................ 22

Table 26: TL708EX TekLink 8-Port Hub AC power source characteristics................................ 22

Table 27: TL708EX TekLink 8-Port Hub atmospherics ...................................................... 23

Table 28: TL708EX TekLink 8-Port Hub miscellaneous ..................................................... 23

Table 29: TL708EX TekLink 8-Port Hub mechanical ........................ ................................ 23

Table 30: TLA700 Backplane interface......................................................................... 24

Table 31: TLA700 Backplane latencies................... ................................ ...................... 25

Table 32: TLA700 External signal interface ................................................................... 27

Table 33: TLA715 Internal controller................................... ................................ ........ 29

Table 34: TLA715 display system............................................................................... 30

Table 35: TLA715 front-panel interface ........ ................................ ................................ 31

Table 36: TLA715 rear-panel interface ......................................................................... 31

Table 37: TLA715 AC power source........................ .................................. .................. 31

Table 38: TLA715 cooling ..................... ................................ ................................ .. 32

Table 39: TLA715 mechanical............. ................................ .................................. .... 32

Table 40: Benchtop and expansion mainframe AC power source ........................................... 34

Table 41: Benchtop and expansion mainframe cooling ....... ................................ ................ 34

Table 42: Enhanced monitor ............... ................................ ................................ ...... 35

Table 43: Benchtop and expansion mainframe mechanical................................................... 35

Table 44: TLA721 benchtop controller characteristics........................................................ 38

Table 45: Front panel characteristics ............................................................................ 40

Table 46: TLA600 input parameters with probes.......... ................................ .................... 41

Table 47: TLA600 timing latencies ............................................................................. 41

Table 48: TLA600 external signal interface ............................ ................................ ........ 42

Table 49: TLA600 channel width and depth ................................................................... 43

Table 50: TLA600 clocking ...................................................................................... 44

Table 51: TLA600 trigger system ............................................................................... 45

Table 52: TLA600 MagniVu feature ............................................................................ 47

Table 53: TLA600 Data handling................................................................................ 47

Table 54: TLA600 internal controller............. .................................. ............................ 47

Table 55: TLA600 display system............................................................................... 48

Table 56: TLA600 front-panel interface ........ ................................ ................................ 49

Table 57: TLA600 rear-panel interface ......................................................................... 49

Table 58: TLA600 AC power source........................ .................................. .................. 50

Table 59: TLA600 cooling ..................... ................................ ................................ .. 50

Table 60: TLA600 mechanical characteristics ................................................................. 50

Table 61: TLA7Axx/TLA7NAx input parameters (with probes) ............................................ 52

Table 62: TLA7Axx analog output...... ................................ .................................. ...... 53

Table 63: Channel width and depth...................................... ................................ ........ 53

Table 64: Clocking ........................ ................................ ................................ ........ 53

C1 mechanical................................................................................. 21

TLA Product Speciﬁcations & Performance Veriﬁcation iii

Table of Contents

Table 65: TLA7A

Table 66: MagniVu acquisition . . ..... . ..... . ..... . ... . . . .... . ..... . ..... . ..... . ..... . .... . ..... . ..... . ..... . ... . 60

Table 67: Merged modules ..... ................................ ................................ .................. 60

Table 68: Data placement............................. .................................. .......................... 61

Table 69: NVRAM .......... ................................ ................................ ...................... 61

Table 70: Mechanical ............................................................................................. 61

Table 71: LA

Table 72: LA module clocking............................. ................................ ...................... 62

Table 73: LA module trigger system .................... ................................ ........................ 64

Table 74: LA module MagniVu feature....... ................................ ................................ .. 66

Table 75: LA module data handling..................... .................................. ...................... 66

Table 76: LA module input parameters with probes........................................................... 66

Table 77

Table 78: PG module electrical speciﬁcation, operational mode................... .......................... 68

Table 79: PG module clocking................................................................................... 69

Table 80: PG module event processing ......................................................................... 70

Table 81: PG module inter-module interactions ............................................................... 70

Table 82: PG module merged PG modules ............. ................................ ........................ 70

Tabl

Table 84: DSO module signal acquisition system .... . ..... . ..... . ... . . . .... . ..... . ..... . ..... . ..... ..... . .... 71

Table 85: DSO module timebase system ....................................................................... 73

Table 86: DSO module trigger system .. ................................ ................................ ........ 73

Table 87: DSO module front-panel connectors ................................................................ 75

Table 88: DSO module mechanical ............................................................................. 75

Table 90: TDS1000B, TDS2000B, TDS1000, and TDS2000 Series oscilloscope waveform edge

Table 91: Test equipment................... ................................ ................................ ...... 78

Table 92: Functional veriﬁcation procedures................. ................................ .................. 79

Table 93: Performance veriﬁcation procedures ........ ................................ ........................ 81

: LA module mechanical ..... .................................. ................................ ........ 67

e 83: PG module mechanical...................................... ................................ .......... 70

ble 89: External oscilloscope (Integrated View or iView) characteristics... . ..... . .... . ..... . ..... ..... . 76

alignment ...................................................................................................... 77

xx/TLA7NAx module trigger system ...................................................... 58

module channel width and depth .................... ................................ ............ 62

iv TLA Product Speciﬁcations & Performance Veriﬁcation

Preface

This document lists characteristics and speciﬁcations of the following Tektronix Logic Analyzer Family products:

TLA7000 series mainframes

TLA7PC1 Controller

TL708EX TekLink 8-Port Hub

TLA700 series mainframes

lated Documentation

TLA600 se

TLA7Axx/TLA7Nx series logic analyzer modules

TLA7Lx/Mx/Nx/Px/Qx series logic analyzer modules

TLA7PG2 pattern generation modules

DSO digital storage oscilloscope modules

Other Tektronix Logic Analyzer modules, microprocessor-related products, and individual logic analyzer probes have their own documentation for characteristics and speciﬁcations.

This document also contains performance veriﬁcation procedures for the TLA7000 Series mainframes.

To prevent personal injury or damage consider the following requirements before attempting service:

Read the General Safety Summary and Service Safety Summary found in the

Tektronix Logic Analyzer Family Product Safety & Compliance Instructions

(Tektronix part number 071-2591-xx).

ries logic analyzers

Refer to the individual service manuals for the performance veriﬁcation procedures and adjustment procedures for earlier TLA products.

The following table lists related documentation available for your logic analyzer. The documentation is available on the TLA Documentation CD and on the Tektronix Web site (www.tektronix.com/manuals).

You can also check the release notes on the instrument for additional information. To access the release notes, select Start > All Programs > Tektronix Logic Analyzer > TLA Release Notes.

TLA Product Speciﬁcations & Performance Veriﬁcation v

Preface

Related Docume

Item Purpose Location

TLA Quick Star

Online Help

Installati

Installation Manuals

XYZs of Logic Analyzers

Declassiﬁcation and Securities instructions

Applicat

Product Speciﬁcations & Performance Veriﬁcation Procedures

on Quick Reference Cards

ion notes

ntation

t User Manuals

High-level operational overview

In-depth operation and UI help

High-level

Detailed ﬁrst-time installation information

Logic anal

Data security concerns speciﬁcto sanitizing or removing memory devices from Tektronix products

Collection of l ogic analyzer application speciﬁc notes

TLA Product speciﬁcations and performance veriﬁcation procedures

installation information

yzer basics

TPI.NET Documentation

Field upgrade kits

nal Service Manuals

Optio

Detailed information for controlling the

nalyzer using .NET

logic a

Upgrade information for your logic analyzer

service documentation for modules

Selfand mainframes

vi TLA Product Speciﬁcations & Performance Veriﬁcation

Speciﬁcations and Characteristics

This document lists the speciﬁcations for the Tektronix Logic Analyzer mainframes and other logic analyzer products. Additional speciﬁcation documents ar Web site. For the most current documentation, refer to the Tektronix Web site (http://www.Tektronix.com).

Characteristic Tables

All speciﬁcations are guaranteed unless noted Typical . Typical characteristics describe typical or average performance and provide useful reference information.

e available on the TLA Documentation CD or on the Tektronix

Speciﬁcations that are marked with the indirectly) using performance veriﬁcation procedures.

For mainframes and modules, the performance limits in this speciﬁcation are valid with these conditions:

The logic analyzer must be in an environment with temperature, altitude, humidity, and vibration within the operating limits described in these speciﬁcations.

The logic analyzer must have had a warm-up period of at least 30 minutes.

For modules, the performance limits in this speciﬁcation are valid with these conditions:

The modules must be installed in a Logic Analyzer Mainframe.

The module must have been calibrated/adjusted at an ambient temperature between +20 °C and +30 °C.

The DSO module must have had its signal-path-compensation routine (self calibration or self cal) last executed after at least a 30 minute warm-up period.

After the warm-up period, the DSO module must have had its signal-path-compensation routine last executed at an ambient temperature within ±5 °C of the current ambient temperature.

symbol are checked directly (or

For optimum performance using an external oscilloscope, please consult the documentation for any external oscilloscopes used with your Tektronix Logic Analyzer to determine the warm-up period and signal-path compensation requirements.

TLA Product Speciﬁcations & Performance Veriﬁcation 1

Speciﬁcations and Characteristics

Atmospheric C

haracteristics for the Tektronix Logic Analyzer Family

The following table lists the Atmospheric characteristics of components in the Tektronix Logic Analyzer family.

Table 1: Atm

Characteristic Description

Temperatur

Relative Humidity

tude

Alti

For TLA7012 instruments, the operating temperature is +5 °C to +45 °C, 11 °C/hr maximum gradient, noncondensing (derated 1 °C per 1000 ft above 5000 ft (1524 m) altitude)

TLA7Axx series module operating temperature is +40 °C maximum.

A7Axx series module operating humidity is 5% to 90% up to +30 °C, 75% from +30 to +40 °C, noncondensing. Maximum wet-bulb temperature is +29.4 °C.

TLA7NAx series module operating humidity is 5% to 90% up to +30 °C, 75% from +30 to +40 °C, 45 % from +40 to +50 °C, noncondensing. Maximum wet-bulb temperature is +29.4 °C.

TLA7Axx/TLA7NAx series module nonoperating humidity is 5% to 90% limited by a wet bulb temperature of +40 °C.

ospheric characteristics

Operating (no media in CD or DVD drive)

+5 °C to +50 °C, 15 °C/hr maximum gradient, noncondensing (derated 1 °C per 305 m (1000 ft) above 1524 m (5000 ft) altitude)

Nonoperating (no media in drive)

-20 °C to +60 °C, 15 °C/hr maximum gradient, noncondensing

Operating (no media in drive)

20% to 80% relative humidity, noncondensing. Maximum wet bulb temperature: +29 °C (derates relative humidi

Nonop

8% to 8 humidity to approximately 22% at +50 °C).

Operating

To 3000 m (9843 ft), (derated 1 °C per 305 m (1000 ft) above 1524 m (5000 ft) altitude.

Non

190 m (40,000 ft )

12,

ty to approximately 22% at +50 °C).

erating (no media in drive)

0% relative humidity, noncondensing. Maximum wet bulb temperature: +29 °C (derates relative

operating

2 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7000 System Speciﬁcations

TLA7000 Syste

m Speciﬁcations

The followin

g tables list the speciﬁcations common to the TLA7000 series logic

analyzers.

Table 2: TLA7000 Backplane interface

Characteristic Description

Number of Slots Portable mainframe

Benchtop m

CLK10 Frequency

Relative Time Correlation

Error

(Typical)

Includes typical jitter, slot-to-slot skew, and probe-to-probe variations to provide a "typical" number for the measurement. Assumes standard accessory probes are utilized.

r time intervals longer than 1 ms between modules, add 0.01% of the difference between the absolute time measurements to the relative time correlation

Fo error to account for the inaccuracy of the CLK10 source.

TLA7Nx/Px/Qx to TLA7Lx/Mx/Nx/Px/Qx "MagniVu" data

TLA7Axx/TLA7NAx to TLA7AxxTLA7NAx "MagniVu" data

TLA7Axx/TLA7NAx to TLA7Nx/Px/Qx "MagniVu" data

TLA7Nx/Px/Qx to TLA7Nx/Px/Qx "normal" data using an internal clock

TLA7Axx/TLA7NAx to TLA7Axx "normal" data using an internal clock

TLA7Axx/TLA7NAx to TLA7Nx/Px/Qx "normal" data using an internal clock

TLA7Nx/Px/Qx to TLA7Nx/Px/Qx "normal" data using an external clock

TLA7Axx/TLA7NAx to TLA7Axx/TLA7NAx "normal" data using an e xternal clock

TLA7Axx/TLA7NAx to TLA7Nx/Px/Qx "normal" data using an external clock

ainframe

10 MHz ±100 ppm

2ns

-3 ns

1 TLA7Nx/Px/Qx sample – 0.5 ns

1 TLA7Axx/TLA7NAx sample – 0.5 ns

1 TLA7Nx/Px/Qx sample – 0.5 ns

2ns

4ns

TLA Product Speciﬁcations & Performance Veriﬁcation 3

TLA7000 System Speciﬁcations

Table 3: System

Logic analyzer s ou rce characteristic

External syst

TLA7Nx/Px/Q

TLA7AAx/TL

trigger and external signal input latencies (Typical)

em trigger input to LA probe tip

x modules

A7NAx modules

Same mainframe To expansion frame

–266 ns –202 ns

–626 ns –562 ns

TLA7BBx modules –1202 ns –1143 ns

TLA7Sxx modules

External Signal In to LA probe tip via Signals 3, 4 (TTLTRG 0,1)

–958 ns ±30 ns –1221 ns ±30 ns

TLA7Nx/Px/Qx modules –212 ns + Clk –148 ns + Clk

TLA7AAx/TLA7NAx modules –535 ns + Clk –471 ns + Clk

TLA7BBx modules

TLA7Sxx modules

External Signal In to LA probe tip via Signals 1, 2(ECLTRG 0,1)

–1190 ns + Clk –1118 ns + Clk

–950 ns ±30 ns –1220 ns ±30 ns

TLA7Nx/Px/Qx modules –208 ns + Clk –144 ns + Clk

TLA7AAx/TLA7NAx modules –627 ns + Clk –556 ns + Clk

TLA7BBx modules

TLA7Sxx modules

All system trigger and signal input latencies were measured from a falling edge transition (active true low) with signals in the wired-OR conﬁguration.

In the Waveform window, triggers are always marked immediately except when delayed to the ﬁrst sample. In the Listing window, triggers are always marked on the next sample period following their occurrence.

Clk represents the time to the next master clock at the destination logic analyzer module. With asynchronous clocking this represents the delta time to the next sample clock. With synchronous sampling this represents the time to the next master clock generated by the setup of the clocking state machine and the

plied SUT clocks and qualiﬁcation data.

sup

Signals 1 and 2 (ECLTRG0, 1) are limited to a broadcast mode where only one source can drive the signal node at any one time. The signal source can be used to drive any combination of destinations.

–1186 ns + Clk –1043 ns + Clk

–950 ns ±30 ns –1116 ns ±30 ns

4 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7000 System Speciﬁcations

Table 4: System

Logic analyzer source characteristic

LA probe tip to external system trigger out (skid)

trigger and external signal output latencies (Typical)

Same mainframe To expansion frame

TLA7Nx/Px/Qx modules 376 ns + Smpl 437 ns + Smpl

TLA7AAx/TLA7NAx modules 794 ns + Smpl 854 ns + Smpl

TLA7BBx mod

TLA7Sxx modules

LA probe tip to External Signal Out via Signal 3, 4 (TTLTRG 0,1)

ules

1332 ns + Smpl 1392 ns + Smpl

1170 ns ±30

1230 ns ±30

OR function

TLA7Nx/Px/Qx modules 366 ns + S mpl 428 ns + Smpl

TLA7AAx/TLA7NAx modules 793 ns + S mpl 854 ns + Smpl

TLA7BBx modules

TLA7Sxx modules

1328 ns + Smpl 1390 ns + Smpl

950 ns ±30 ns 1011 ns ±30 ns

AND function

TLA7Nx/Px/Qx modules 379 ns + S mpl 457 ns + Smpl

TLA7AAx/TLA7NAx modules 803 ns + S mpl 881 ns + Smpl

TLA7BBx modules

TLA7Sxx modules

LA probe tip to External Signal Out via Signals 1, 2 (ECLTRG0,1)

1340 ns + Smpl 1418 ns + Smpl

950 ns ±30 ns 1028 ns ±30 ns

TLA7Nx/Px/Qx modules 374 ns + Smpl 444 ns + Smpl

TLA7AAx/TLA7NAx modules 793 ns + Smpl 863 ns + Smpl

TLA7BBx modules

TLA7Sxx modules

SMPL represents the time from the event to the next valid data sample at the probe tip of the LA module. With asynchronous sampling, this represents the delta time to the next sample clock. With MagniVu asynchronous sampling, this represents 500 ps or less. With synchronous sampling, this represents the timetothe next master clock generated by the setup of the clocking state machine, the system-under-test supplied clocks, and the qualiﬁcation data.

Skid is commonly referred to as the system level system trigger and signaling output latency. This is the absolute time from when the event ﬁrst appears at the input probe tips of a module to when the corresponding event that it generates appears at the system trigger or external signal outputs.

All signal output latencies are validated to the rising edge of an active (true) high output.

Signals 1 and 2 (ECLTRG0, 1) are limited to a broadcast mode where only one source can drive the signal node at any one time. The signal source can be used to drive any combination of destinations.

1330 ns + Smpl 1399 ns + Smpl

950 ns ±30 ns 1019 ns ±30 ns

TLA Product Speciﬁcations & Performance Veriﬁcation 5

TLA7000 System Speciﬁcations

Table 5: Interm

odule latencies for LA source (Typical)

Logic analyzer source characteristic Same mainframe Frame to frame

LA to LA intermodule system trigger (TTLTRG7)

LA2: Trigger All Modules, LA1: Do Nothing

TLA7Nx/Px/Qx modules 66 ns + Smpl 128 ns + Smpl

TLA7AAx/TLA7ABx modules 108 ns + Smpl 118 ns + Smpl

TLA7BBx modules

TLA7Sxx modules

LA to LA intermodule ARM (TTLTRG 2, 4 ,5, 6)

82 ns + Smpl 145 ns + Smpl

105 ns ±30 nsl 167 ns ±30 ns

TLA7Nx/Px/Qx modules 108 ns + Smpl + Clk 170 ns + Smpl +Clk

TLA7AAx/TLA7ABx modules 115 ns + Smpl + Clk 180 ns + Smpl + Clk

TLA7BBx modules

TLA7Sxx modules

LA to LA intermodule Signals 1, 2 (ECLTRG 0, 1)

Trigger, Then Set Signal 2; LA1: If Signal 2 Is True, Then Trigger)

(LA2:

Nx/Px/Qx modules

TLA7

AAx/TLA7ABx modules

TLA7

234

TLA7BBx modules

7Sxx modules

TLA

to LA intermodule Signals 3, 4 (TTLTRG0,1)

95 ns + Smpl + Clk 162 ns + Smpl +Clk

85 ns ±30 ns 147 ns ±30 ns

s + Smpl + Clk

116 n

s + Smpl + Clk

118 n

s + Smpl + Clk

95 n

s + Smpl + Clk

178 n

s + Smpl + Clk

192 n

ns + Smpl + Clk

166

130 ns ±30 ns 192 ns ±30 ns

(LA2: Trigger, Then Set Signal 3; LA1: If Signal 3 Is True, Then Trigger)

TLA7Nx/Px/Qx modules 116 ns + Smpl + Clk 128 ns + Smpl + Clk

TLA7AAx/TLA7ABx modules 120 ns + Smpl + Clk 184 ns + Smpl + Clk

TLA7BBx modules

TLA7Sxx modules

Clk represents the time to the next master clock at the destination logic analyzer module. With ascynchronous clocking this represents the delta time to the next sample clock. With synchronous sampling this represents the time to the next master clock generated by the setup of the clocking state machine and the supplied SUT clocks and qualiﬁcation data.

Signals 1 and 2 (ECLTRG0, 1) are limited to a broadcast mode where only one source can drive the signal node at any one time. The signal source can be used to drive any combination of destinations.

91 ns + Smpl + Clk 158 ns + Smpl + Clk

950 ns ±30 ns 1012 ns ±30 ns

6 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7000 System Speciﬁcations

Table 6: TLA700

0 External signal interface

Characteristic Description

System Trigger Input

TTL compatible input via rear panel mounted BNC connectors (portable mainframe) or front panel mounted SMB connectors (benchtop mainframe)

Input levels 0 V to 3.0 V

Minimum inp

ut voltage

300 mV

swing

Threshold r

ange

0.5 V to 1.5 V

Threshold step size 50 mV

Input destination

Input Mode

System trigger

Falling edge sensitive, latched (active low)

Minimum Pulse Width 12 ns

Active Pe

riod

Accepts s

ystem triggers during valid acquisition periods via real-time

gating, resets system trigger input latch between valid acquisition periods

Input Voltage

0to+5Vp

TTL com

patible input via rear panel mounted BNC connectors (portable

Extern

Maximum

al Signal Input

mainframe) or front panel mounted SMB connectors (benchtop mainframe)

estination

Input D

levels

Input

Minimum input voltage

Signal 1, 2, 3, 4

.0 V

0Vto3

300 mV

swing

Threshold range 0.5 V to 1.5 V

Threshold step size 50 mV

t Mode

Inpu

ut Bandwidth

Inp

Active (true) low, level sensitive

Signal 1, 2 Signal 3, 4

Hz square wave minimum

50 M

Active Period Accepts signals during valid acquisition periods via real-time gating

Maximum Input Voltage 0 V to 5 V peak

System Trigger Output

TTL compatible output via rear panel mounted BNC connectors (portable mainframe) or front panel mounted SMB connectors (benchtop mainframe)

Source selection System trigger

Source Mode Active (true) low, falling edge latched

Active Period

Outputs system trigger state during valid acquisition period, resets system trigger output to false state between valid acquisitions

Output Levels VOHV

50 Ω back terminated TTL-compatible output

≥4 V into open circuit, ≥2Vinto50Ω to ground

≤ 0.7Vsinking10mA

Output Protection Short-circuit protected (to ground)

eak

Hz square wave minimum

10 M

TLA Product Speciﬁcations & Performance Veriﬁcation 7

TLA7000 System Speciﬁcations

Table 6: TLA7000 External signal interface (cont.)

Characteristic Description

External Signal Output

Source Selection Signal 1, 2

Output Modes

Level Sensitive

Output Levels VOHV

Active Period

Output Protection Short-circuit protected (to ground)

Intermodule Signal Line Bandwidth

The Input Bandwidth speciﬁcation only applies to signals to the modules; it does not apply to signals applied to the External Signal Input and sent back to the External Signal Output.

The Output Bandwidth speciﬁcation only applies to signals from the modules; it does not apply to signals applied to the External Signal Input and sent back to the External Signal Output.

TTL compatible outputs via rear panel mounted BNC connectors (portable mainframe) or front panel mounted SMB connectors (benchtop mainframe)

Signal 3, 4

10 MHz clock

User deﬁnable

Active (true) low or active (true) high

50 Ω back terminated TTL output

≥4 V into open circuit, ≥2Vinto50Ω to ground

≤ 0.7Vsinking10mA

Signal 1, 2 Signal 3, 4Output Bandwidth

50 MHz square wave minimum 10 MHz square wave minimum

Outputs signals during valid acquisition periods, resets signals to false state between valid acquisitions Outputs 10 MHz clock continuously

Minimum bandwidth up to which the intermodule signals are speciﬁed to operate correctly

Signal 1, 2 Signal 3, 4

50 MHz square wave minimum 10 MHz square wave minimum

8 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7012 Portable Mainframe Speciﬁcations

TLA7012 Porta

ble M ainframe Speciﬁcations

The followin

g tables describe the speciﬁcations for the TLA7012 Portable

Mainframe.

Table 7: TLA7012 Internal controller

Characteristic D escription

Operating system Microsoft Windows XP Professional

Motherboard

Microprocessor

Chip set Intel 915GM GMCH with an Intel ICH6-M I/O hub. Supports dual channel

Main memory

Cache memory 2 MB Level 2 (L2) write-back cache

RTC, CMOS setup, & PNP NVRAM retention time

ical)

(Typ

Bootable replaceable

ddiskdrive

har

rmatted capacity

nterface

Average seek time Read 9 ms

DVD-RW drive

The AB915GM motherboard is an ATX-family board that meets the FlexATX a Intel Mobil Celeron M or Pentium M processor and an Intel 915GM chipset, integrating video, system monitoring, and Ethernet controllers on a 9.0 X

7.5 inch b

Intel 2 G processor package

memory for higher performance.

Two 200 pin SO DIMM sockets for DDR2-400/533 (PC2-3200/4300) modul

Maximum 2 GB (two modules, Gbit technology), minimum 128 MB

Installed Conﬁguration 1 GB

> 5 years battery life, lithium battery

Sta drive residing on an EIDE interface.

80 GB

Continually subject to change due to the fast-moving PC component en

ATA, native

Standard PC compatible IDE (Integrated Device Electronics) DVD-RW drive residing on an EIDE interface.

Continually subject to change due to the fast-moving PC component environment.

nd microATX form-factor speciﬁcations. It is based around an

oard.

Hz/533 Dothan microprocessor; 479-pin PGA socket for uFC-PGA

es.

ndard PC compatible IDE (Integrated Device Electronics) hard disk

vironment. These storage capacities valid at product introduction.

rite 10 ms

TLA Product Speciﬁcations & Performance Veriﬁcation 9

TLA7012 Portable Mainframe Speciﬁcations

Table 8: TLA701

Characteristic Description

Display selec

External display drive

Internal display

2 Display system

tion

The TLA7012 Portable Mainframe motherboard can drive 3 video displays.

Two DVI conne connectors has both the DVI digital signals and the analog signals while the other connector has only DVI digital signals available.

The third di This connection is via LVDS. This port drives the internal 15-inch display. One of the external connectors and the internal connection are connected t

One VGA, SV

Primary video port with DVI

nly

digital o

Secondary video port with

ital and analog

DVI dig VGA signalling through an adapter

Classiﬁcation Color LCD (NEC TFT NL10276BC30-24D)

Resolution/Refresh rate and area

lor scale

on (Pixels)

Resoluti

640 x 480

1024 x 768

1280 x 1024

1600 x 1200

Resolution (Pixels) Colors Refresh Rates

640 x 480

1024 x 768

1280 x 1

1600 x 1200

Maximum resolution on the analog VGA is 1600 x 1200 with 32-bit color at 75 Hz.

Colo silicon thin ﬁlm transistor liquid crystal display (a-Si TFT LCD) panel structure with driver LSIs for driving the TFT (Thin Film Transistor) arr motherboard via LVDS signaling.

1024 pixels horizontal by 768 pixels vertical (1024X 768) at 60 Hz refresh rate

26 NTSC

024

r LCD module NL10276BC30-24D is composed of the amorphous

ay and a backlight. This LCD display will be driven directly by the

ea of 304 mm (11.7 in) by 228 mm (9 in) of viewing area.

2, 144 colors (6-bit RGB) with a color gamut of 42% at center to

ctors connect to the external world. One of the

splay connector is available only as an internal connection.

o the same video information.

GA, or XGA-compatible analog output port.

Colors Refresh R

256, 16-bit, 32-bit 60, 75, 85

60, 75, 85

256, 16-bit, 32-bit 60, 75, 85

60, 75, 85

60, 75,

ates

10 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7012 Portable Mainframe Speciﬁcations

Table 9: TLA701

2 Front-panel interface

Characteristic Description

Keypad

18 buttons allow user to perform the m ost common tasks required to operate theTLA

Special function knobs

Multi-function Knob Various increment, decrement functions dependent on screen/window

selected.

Vertical position

Vertical scale

Horizontal position

Horizontal scale

Scrolling a

Scales wav

Scrolling

Scales wa

USB Port Front pa

nd positioning dependent on display type.

eform displays only.

and positioning dependent on display type.

veform displays only.

nel (lower Right on Front Panel) 3 each USB 2.0 connectors.

Table 10: TLA7012 Rear-panel interface

Characteristic Description

TekLink interface bus

Input signal characteristics

Output signal characteristics LVDS compatible outputs via rear-panel 40-pin connector

Reference clock characteristics LVDS compatible inputs via rear-panel 40-pin connector

SVGA output ports

External Trigger input Trigger input routed to the system trigger line

External Signal input Signal input routed to one of four internal signals

System Trigger output

External Signal output One of four internal signals routed to the signal output connector. The

USB 2.0 ports Four USB 2.0 connections

GBit LAN port RJ-45 connector 10/100/1000 Mbps

Connector supports Reference Clock (10 MHz), Power On Signaling, Run event, System Trigger, General purpose events

LVDS compatible inputs via rear-panel 40-pin connector

Two DVI connectors

Internal system trigger routed as TTL-compatible output

internal 10 MHz reference clock can be routed to this output.

Table 11: TLA7012 AC power source

Characteristic D escription

Source voltage and frequency 100 V

115 V

to 240 V

RMS

±10%, 400 Hz

RMS

±10%,50Hzto60Hz

RMS

Maximum power consumption 750 W

Steady-state input current 6 A

maximum at 90 VAC

RMS

, 60 Hz or 100 VAC

RMS

, 400 Hz

RMS

Inrush surge current 70 A maximum

Power factor correction

Yes

TLA Product Speciﬁcations & Performance Veriﬁcation 11

TLA7012 Portable Mainframe Speciﬁcations

Table 11: TLA7012 AC power source (cont.)

Characteristic D escription

On/Sleep indicator Green/yellow front panel LED located left of the On/Standby switch

provides visual feedback when the switch is actuated. When the LED is green, the instrument is powered and the processor is not sleeping. When the LED is yellow, the instrument is powered, but the processor is sleeping.

On/Standby switch and indicator Front panel On/Standby switch allows users to turn the instrument on. A

soft power down is implemented so that users can turn the instrument off without going through the Windows shutdown process; the instrument powers down normally.

The power cord provides main power disconnect

Table 12: TLA7012 Portable mainframe transportation and storage

Charact

Transportation Package Material Transportation Package material meets recycling criteria as described

Conﬁguration for Transportation The system can be shipped with or without modules installed. Only

eristic

Descrip

in Envi 063-1290-00) and Environmentally Responsible Packaging Handbook (Tektronix part number 063-1302-00).

modul 60g shock (per Tektronix Standard part number 062-2858-00, Rev B, Class 5 subassembly requirement) can be shipped installed in this mainframe and i

tion

ronmental Guidelines for Package Design (Tektronix part number

es weighing less than 5lbs/slot which have been qualiﬁed to meet

ts standard shipping package.

Table 13: TLA7012 Cooling

Characteristic Description

Cooling system Forced air circulation system with no removable ﬁlters using eight fans

operating in parallel

Pressurization Negative pressurization system in all chambers including modules

Slot activation Installing a module activates cooling for the corresponding occupied slots

by opening the airﬂow shutter mechanism. Optimizes cooling efﬁciency by only applying airﬂow to installed modules.

Air intake Front sides and bottom

Air exhaust Back rear

Cooling clearance 6 inches (152 mm) front, sides, top, and rear. Prevent blockage of airﬂow

to bottom of instrument by placing on a solid, noncompressable surface; can be operated on rear feet.

Fan speed and operation

All fans operational at half their rated potential and speed (12 VDC)

12 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7012 Portable Mainframe Speciﬁcations

Table 14: TLA70

Characteristic D escription

Classiﬁcation The portable mainframe is intended for design and development bench

Overall dimensions

Weight

Shipping conﬁguration 58 lbs (26.30 kg) minimum conﬁguration (no modules), with all standard

Acoustic noise level (Typical) 43 dBA weighted (operator) 41 dBA weighted (bystander)

Construction materials Chassis parts are constructed of aluminum alloy; front panel and trim

Finish type

12 Mechanical

Height (wit

Width

Depth

h feet)

and lab-based applications.

Dimensions are without front feet extended, front cover attached, pouch attached, n

11.6 in (294

17.75 in (450.85 mm)

18.1 in (459.74 mm)

40 lbs 12 oz (18.45 kg) with no modules installed, two dual-wide slot covers, a

5 lbs (2.27 kg) maximum per module slot

accessories

89 lbs 8 o standard accessories (including probes and clips)

peaces are constructed of plastic; circuit boards are constructed of glass.

Tektronix blue body and Tektronix silver-gray trim and front with black pouch

or power cord attached.

.64 mm)

nd empty pouch

z (41.6 kg) full conﬁguration, with two TLA7P4 modules and

, FDD feet, handle, and miscellaneous trim pieces

gure 1: Dimensions of the TLA7012 Portable mainframe

TLA Product Speciﬁcations & Performance Veriﬁcation 13

TLA7016 Benchtop Mainframe Characteristics

TLA7016 Bench

top Mainframe Characteristics

The followin

g tables list the speciﬁcations for the TLA7016 Benchtop Mainframe. The mainframe includes the interface module. The interface module provides the interface between an external controller and the mainframe. All communication between the controller and the mainframe is via GB LAN.

Table 15: TLA7016 Benchtop mainframe AC power source (Serial numbers B020000 and higher)

Characteristic Description

Source voltage & Maximum power consumption

100 V

120 V

115 V

to 120 V

RMS

to 240 V

RMS

, 440 Hz; 1450 W line power

RMS

, 50 Hz to 60 Hz; 1450 W line power

RMS

, 50 Hz to 60 Hz; 1900 W line power

RMS

Inrush surge current 70 A maximum

Steady state input current 17.6 A

10 A

Powerfactorcorrection(Typical)

0.99 at 60 Hz operation and 0.95 at 400 Hz operation

maximum at 108 VAC

RMS

maximum at 207 VAC

RMS

ON/Standby switch and indicator Front Panel On/Standby switch with integral power indicator.

Switch allows users to turn the instrument on. A soft power down is implemented so that users c an turn off the instrument without going through the Windows shutdown process; the instrument powers down normally.

Maximum power consumed by a fully loaded six-module instrument.

Table 16: TLA7016 Benchtop mainframe AC power source (Serial numbers B01000 – B019999)

Characteristic Description

Source voltage 100 V

100 V

Maximum power consumption

1450 W line power (the maximum power consumed by a fully loaded, 6-module instrument)

Fuse rating (Current and voltage ratings and type of fuse used to fuse the source line voltage)

90 V - 132 VAC

RMS

Operation High-power/Low line (159-0379-00)

Safety: UL198G/CSA C22.2

Size: 0.25 in × 1.25 in

Style: Slow acting

Rating: 20 A/250 V

103 V - 250 VAC

RMS

Operation (159-0256-00)

Safety: UL198G/CSA C22.2

Size: 0.25 in × 1.25 in

Style: No. 59/Fast acting

Rating: 15 A/250 V

207 V - 250 VAC

RMS

Operation (159-0381-00)

Safety: IEC 127/Sheet 1

Size: 5 mm × 20 mm

Style: Fast acting "F", high-breaking capacity

Rating: 6.3 A/250 V

RMS

to 240 V

to 120 V

±10%,45Hzto66Hz

RMS

, 360 Hz to 440 Hz

RMS

14 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7016 Benchtop Mainframe Characteristics

Table 16: TLA7016 Benchtop mainframe AC power source (Serial numbers B01000 – B019999) (cont.)

Characteristic Description

Inrush surge current 70 A maximum

Steady state input current 16.5 A

6.3 A

Power factor correction (Typical)

0.99 at 60 Hz operation and 0.95 at 400 Hz operation

maximum at 90 VAC

RMS

maximum at 207 VAC

RMS

ON/Standby switch and indicator Front Panel On/Standby switch with integral power indicator.

Switch allows users to turn the instrument on. A soft power down is implemented so that users can turn off the instrument without going through the Windows shutdown process; the instrument powers down normally.

Table 17: TLA7016 Benchtop mainframe transportation and storage

Characteristic Description

Transportation Package Material Transportation Package material meets recycling criteria as described

in Environmental Guidelines for Package Design (Tektronix part number 063-1290-00) and Environmentally Responsible Packaging Handbook (Tektronix part number 063-1302-01).

Conﬁguration for Transportation The system can be shipped with or without modules installed. Only

modules weighing less than 5lbs/slot which have been qualiﬁed to meet 60g shock (per Tektronix Standard part number 062-2858-00, Rev B, Class 5 ’subassembly’ requirement) can be shipped installed in this mainframe and its standard shipping package.

Table 18: TLA7016 Benchtop mainframe cooling

Characteristic Description

Cooling system Forced air circulation system (positive pressurization) using a single

low-noise centripetal (squirrel cage) fan conﬁguration with no ﬁlters for the power supply and 13 module slots.

Fan speed control

Slot activation Installing a module activates the cooling for the corresponding occupied

Pressurization Positive pressurization system, all chambers including modules

Slot airﬂow direction P2 to P1, bottom of module to top of module

Mainframe air intake Lower fan-pack rear face and bottom

Mainframe air exhaust

D Temperature readout sensitivity (Typical) 100 mV/ °C with 0 °C corresponding to 0 V output

Temperature sense range (Typical) -10 °C to + 90 °C, delta temperature ≤ 50 °C

Clearance 2 in (51 mm), rear, top, and sides

Rear panel switch selects between full speed and variable speed. Slot exhaust temperature and ambient air temperature are monitored such that a constant delta temperature is maintained.

slots by opening the air ﬂow shutter mechanism. Optimizes cooling efﬁciency by only applying airﬂow to modules that are installed.

Top-sides and top-rear back. Top rear-back exhaust redirected to the sides by the fan pack housing to minimize reentry into the intake.

TLA Product Speciﬁcations & Performance Veriﬁcation 15

TLA7016 Benchtop Mainframe Characteristics

Table 18: TLA7016 Benchtop mainframe cooling (cont.)

Characteristic Description

Fan speed readout

RPM = 20 (Tach frequency) or 10 ≥ (+Pulse Width)

where (+Pulse Width) is the positive width of the TACH1 fan output signal measured in seconds

Fan speed range 650 to 2250 RPM

Table 19: Enhanced monitor

Characte

ristic

Voltage readout

Descript

+24 V, -2 +5 V

ion

4V,+12V,-12V,+5V,-5.2V,-2V,+5V

via RS-232

External

if present, and

Standby

Voltage readout accuracy (Typical) ±3% maximum

Current readout Readout of the present current on the +24 V, -24 V, +12 V, -12 V, +5 V,

-2 V, -5.2 V rails via RS-232

Current readout accuracy (Typical) ±5% of maximum power supply I

Provides access for RS-232 host to enhanced monitorRS-232 Connector

Connector levels ±25 VDC maximum, 1 A maximum per pin

Passive monitor c onnector

25-pin connector provides access for monitoring the power supply,

perature, and fan speed.

tem

Table 20: TLA7016 Benchtop mainframe Interface Module front panel characteristics

Characteristic Description

TekL ink interface bus

Input signal characteristics

Output signal characteristics LVDS compatible outputs via rear-panel 40-pin connector

Reference clock characteristics LVDS com patible inputs via rear-panel 40-pin connector

External Trigger input Trigger input routed to the system trigger line

External Signal input Signal input routed to one of four internal signals

System Trigger output

External Signal output One of four internal signals routed to the signal output connector. The

GBit LAN port RJ-45 connector 10/100/1000 Mbps

Connector supports Reference Clock (10 MHz), Power On Signaling, Run event, System Trigger, General purpose events

LVDS compatible inputs via rear-panel 40-pin connector

Internal system trigger routed as TTL-compatible output

internal 10 MHz reference clock can be routed to this output.

16 TLA Product Speciﬁcations & Performance Veriﬁcation

TLA7016 Benchtop Mainframe Characteristics

Table 21: TLA70

Characteristic D escription

Classiﬁcation

Overall Dimensions

Interface module dimensions

Weight

Shipping weight 60 lbs 11 oz (26.7 kg) minimum conﬁguration with interface module (no

Siz

Acoustic noise level

ypical)

Construction materials Chassis parts, aluminum alloy

Finish type

16 Benchtop mainframe m echanical

Standard

Height (with feet)

Width

Depth

Rackmount

Height

Width

Depth

Height

Width

Depth

me with interface

Mainfra module and slot ﬁllers

(Typical)

Maximum per slot

Rackmount kit added

erface module

Int

riable fan speed (at

Va 860 RPM)

Full speed fan (switched at rear)

For lab bencht

13.7 in (35 cm) including feet

16.7 in (42.4 cm)

26.5 in (67 c

13.25 in (33.66 cm)

18.9in(4

28.9 in to 33.9 in (73.4 cm to 86.1 c m) in 0.5 in increments, user selectable

10.32 in (262.1 mm)

1.25 in (31.75 mm)

14.75 in

52 lbs 14 dual-slot ﬁller panels

5lbs(2.27kg)

20 lbs (9.1 kg)

r modules), with standard accessories

othe

187 lbs (85 kg) fully conﬁgured instrument with the addition of ﬁve logic analyzer modules and all m odule standard accessories including probes

lips

and c

slot wide

One

.2 dBA weighted (front)

43.8 dBA weighted (back)

66.2 dBA weighted (front)

66.2 dBA weighted (back)

ront panel and trim pieces, plastic

Circuit boards, glass laminate

Mainframes are Tektronix silver g ray with dark gray trim on fan pack and bottom feet support rails.

op or rackmount applications

8cm)

(373.4 mm)

oz. (24 kg) minimum conﬁguration with interface module and 6

TLA Product Speciﬁcations & Performance Veriﬁcation 17

TLA7016 Benchtop Mainframe Characteristics

Figure 2: Dimensions of the TLA7016 Benchtop mainframe

e 3: Dimensions of the TLA7016 Benchtop mainframe with rackmount option

Figur

18 TLA Product Speciﬁcations & Performance Veriﬁcation

+ 65 hidden pages

Tektronix TLA7AB4, TLA7AA1, TLA7AA2, TLA7AA3, TLA7AA4 Performance Verification

Specifications and Main Features

Frequently Asked Questions

User Manual