Tektronix Package 82 Simultaneous CV Instruction Manual Rev. C Instruction Manual

Package 82 Simultaneous CV Instruction Manual
Chntains Operating Information
Publication Date: November 1968 Document Number: 5956-901-01 Rev. C
WARRANTY
To exercise this warranty, write or call your local Keithley representative, or contact Keith­ley headquarters in Cleveland, Ohio. You will be given prompt assistance and return in­structions. Send the instrument, transportation prepaid, to the indicated service facility. Re­pairs will be made and the instrument returned, transportation prepaid. Repaired products are warranted for the balance of the original warranty period, or at least 90 days.
LIMITATION OF WARRANTY
This warranty does not apply to defects resulting from unauthorized modification or misuse of any product or part. This warranty also does not apply to fuses, batteries, or damage from battery leakage.
This warranty is in lieu of all other warranties, expressed or implied, including any implied warranty of merchantability or fitness for a particular use. Keithley Instruments, Inc. shall not be liable for any indirect, special or consequential damages.
STATEMENT OF CALIBRATION
This instrument has been inspected and tested in accordance with specifications published by Keithley Instruments, Inc.
The accuracy and calibration of this instrument are traceable to the National Bureau of Stan­dards through equipment which is calibrated at planned intervals by comparison to certi­fied standards maintained in the Laboratories of Keithley Instruments, Inc.
WEST GERMANY: Kdtldq lnrtrrrmcatr GmbIi / Hdglhok 5 / Mmtdwn 70 I O+3WlOOZ-O I T&C 32-12160 / Tel&~ &35Via?ZS9 GRBATBRlTAINz ~~~U/l~~Rod/~BabhinRG2ONL/o73cB6l287/T~817W/Tddueo13c86J665 FztANcE
-SC ~~~LntrW/A~Wet~/UOZMS~/P.o.BoxU9/UM)ANCcrinchmr s- Kdtblq InrtmrmntlsA/~.4/3600 AUSTRIA n-AL*
Keitblq -mUa SARL / 3 Alla du 10 Rue AmbmiseCrdzat / B. P. 60 I 91121 PahisuuKeda l+OllS 13.5 I T&x 600 933 / Tel&c 1-50117726
Kd~~CollnbH/~~huul2/A-l110~/~mp)~~UI/Tdac131671/TJdue~Om)8(JS97 Kdtblq lnstmmmta Sill I Wale B. N 4/A / 20145 Miho / 02420360 or 02-4136!540 / Tdefa 02.4121245’
Dubadaf / 014214444 / T&x 323 VT / Tdohrc 072%315%
I 01330.35333 / T&x 24 684 / Telfax 01&.3MOSZl
Instruction Manual
Package 82
Simultaneous CV
@NW, Keithley Instruments, Inc.
Instruments Division
Cleveland, Ohio, U.S.A.
Document Number 5956901-01
Hewlett-Packard is a registered trademark of Hewlett-Packard Company. IBM and AT are registered trademarks of Internation Business Machines, Inc.
SPECIFICATIONS
ANALYSIS CAPABILITIES
CONSTANTS: Flatband C and V
GRAPHICS:
Measured:
CaIcnIated: Interface Trap Density vs. Trap Energy
Threshold Voltage Bulk Doping Effective Oxide Charge Work Function Doping Type
‘Best Depth’
Simuitaneous C vs. Gate Voltage High Frequency C vs. Gate Voltage Quasistatic C vs. Gate Voltage Conductance vs. Gate Voltage Q/t Current vs. Gate Voltage Quasistatic C and Q/t Current
vs. Delay Time
Doping vs. Depletion Depth Depletion Depth vs. Gate Voltage High Frequency l/C’ vs. Gate Voltage Band Bending vs. Gate Voltage High Frequency C vs. Band Bending Quasistatic C vs. Band Bending
VOLTAGE MEASUREMENT
ACCURACY (1Year,18°-280C): *(O.QS% rdg + SOmV).
RESOLUTION: 1OmV. TEMPERATURECOEFFICIENT (O"-180&2So~oC):
*(O.OOS% + 1mV)K.
HIGH FREQUENCY CAPACITANCE*
1ookHz:
RANGE LUTION i(%rdg+ pF)
mo PF
lMHz:
RANGE LUTION ff%rdg+ pR
~PP
SHUNT CAPACITANCE LOADING EFFECT 0.1% of reading
TEST VOLTAGE: 15mV mu f 10%. TEST FREQUENCY TOLERANCE: *O.l%.
RESCh QYe~,18~-28~C) too-lS" L 28°-400CJ NOISE
10 a
looa
2nF
RESO- 11 Year, 18"-28°C) (0"-18' (t 28°400C) NOISE
10 fF 0.9 + 0.05
2nF loofF 1.4 + 0.5 0.14
additional error per 1OOpF load with equal shunt load on input and output.
ACCURACY
0.7 + 0.05 0.03
0.9 + 0.5 0.08
ACCURACY
TEMPERATURE
COEFFICIENT
i (% rdgvc
TEMPERATURE
COERIClENT
k(% rd@l'C
0.03 2cafF
P-P
18ofF
18LMfF
P-P
4lmfF
QUASISTATIC CAPACITANCE*
RANGE LUTION
XIIJ PF
RESO- (1Year,18°-280C)
10 fF 1.0 + 0.1
1mfF
2nP
ACCURACY
rekdg + pm
0.8 + 0.2 (0.09% rdg + 0.13 pF) x
NOISE P-P
(typic&
(0.12% rdg + 0.13 pF) x
(100 mV/STEP V) + 0.01 pF
(100 mV/STEP V) + 0.1 pF
VOLTAGE SOURCE
VOLTAGE (0.1 Hz to 10 Hz) RESOLUTION
S2OV
>iuvtol2ov
ll)@ally 3 mV up to 75 MHz.
MAXIMUM SWEEP SPAN, 1 V,,, - V,r 1: 40V. MAXIMUM OUTPUT CURRENT: f2mA (-0%. +a%). SWEEP STEP VOLTAGE SELECMONS: lOmV, 2OmV, SOmV,
1OOHlV.
DC OUTPUT RESISTANCE: Clof.2.
P-PNOISE'
EJl rv
23 rv
10 mV
100 mV
GENERAL
RE&NfN~TES: 444 readings per second to one reading every
DATA BUFFER: 1000 points maximum.
GRAPHICAL OUTPUTS: Computer display or digital plotter
supporting HPGL with IEEE-488 interface; also “screen copy” to compatiiIe printer.
DIGITAL I/O: Consists of one output, four inputs, +5V (series
limited with 33Q), and COMMON referenced to IEEE-W COMMON. Output will drive one TI’L load. Inputs represent
one TIL load. MAXIMUM INPUT: 30V peak, dc to 6oHz sine wave. MAXIMUM COMMON MODE VOLTAGE: 3OV maximum, dc
to 6OHz sine wave. OPERATING ENVIRONMENT:
densing RH up to 35°C. STORAGE ENVIRONMENT: -29’ to +65X
O” to 40°C, 70% non-con-
TEMPERATURECOEFFICIENT @"-lt30&2W'-400C):
*(0.02% rdg + 0.1 pF)K.
*NOTES
Specifkationa are based on parallel RC model and Quality Factor s 20. Assumes pfopa cable cone&on and open circuit suppression. ~~capsdturerruracyisexdusivcofnoise,for~VrO.OSV
and DEUY TIME s 1 second. For other parameters, derate by (SmV/STEP V) x (DELAY TIME/l second) in pF at 23OC. Double the derating for every 10°C rise in ambient temperature above 23°C.
l)pical allowable noniquilbrium current plus leakage current: <ZOpA on ZOOpF range; cZOOpA on 2nF range during capacitance measure­ments.
WARMUP: 2 hours to rated accuracy. SYSTEM CONFIGURATION: Models 22&l, 590,595, and 5951
connected as shown in manual. Controller is HP Series 200 or 300 with BASIC 4.0. Requires 1 Mbyte of memory.
PACRAGE 82 COMPONENTS:
ModeI 230-k Prognmnublc Voltage Source Model 595: Model 590:
Model 5909: Calibration Sources
Model 5956: Model 5951:
Spe&cationa subject to change without notice.
Quaiatatic cv Meter look/lMcv‘4nalyBer
Packa@? 82 CV Software and Manual Remote Input Coupler-Includes Models: Low Noise BNC Cable, 1.2m (4 ft.) (5 supplied)
rllwI1: 7OW1: Shielded IEEEaB Cable, Im (3.3 ft.) (2 supplied)
7007-2: Shielded IEEE488 Cable, Zm (6.6 ft.) (1 supplied) 7051-2: RG-58C BNC to BNC Cable, 0.6m (2 ft.) (3 supplied)
Contains information on Package 82 features, specifi-
cations, and supplied accessories.
Gives information to aid in getting your simulta-
neous CV system up and running as quickly as
possible, including hardware and software config­uration.
Covers detailed operation including system calibra­tion, correction, and taking data.
SECTION 1 1
General Information j
SECTION 2
Getting Started
SECTION 3 1
Measurement /
Details analysis functions of the Package 82.
Discusses system block diagram, the remote input coupler, and quasistatic and high-frequency CV principles.
SECTION 4
SECTION 5
Principles of Operation
Table of Contents
SECTION l-GENERAL INFORMATION
1.1
1.2
1.3
1.4 5 i-L
ii2
1.8
1.9
1.9.1
1.9.2
1.10
INTRODUCT’ION ...............................
FEfmJREs WARRANTY INFORMATION MANUAL ADDENDA sm SYMBOLS AND TERMS
SPECIFICAI'IONS
UNPACKING AND INSPECTION
Unpa~gPK>cedure
SuppiiedEquipment REFACKING FOR SHIPMENT COMPUTER CONFIGURATION
Series 200 and 300
IBM AT
SERVICE AND CALIBRATION.
...............................
...................................................................
..........................................................................
..............................................................................
.........................................................................
............................................................................
...........................................................................
.....................................................................................
SECTION P-GETTING STARTED
..............................................................................
........................................................................
.:
....
..........................................................................
....................................................................
....................................................................
...........................................................................
...........................................................................
.....................................................................
.............................................................................
.........................................................................
..............................................................................
...........................................................................
.............................................................................
.................................................
...............................................................................
........................................................................
................................................................................
......................................................................
............................................................................
.........................................................................
...................................................................
.........................................................................
.........................................................................
......................................................................
..................................................................................
............................................................................
..........................................................................
i-:.
2:2.1
2.2.2
2.2.3
2.2.4
2.2.5
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.3.5
2.3.6
2.4
2.4.1
2.4.2
2.4.3
2.4.4 El
2:5:2
2.5.3
2.5.4
2.5.5
2.5.6
2.6
2.6.1
2.6.2
2.7
2.7.1
2.7.2
2.7.3
2.7.4
INTRODUCI’ION HARDWARE CONFIGURATION
SystemBlockDiagram RemoteInputCoupler.. SystemConnections IEEE-483 Bus Connections Remote Coupler Mounting
SYSTEM POWER UP
Instrument Power Requirements Power Connections Environmental Conditions Warm Up Period Power Up Procedure Line Frequency
SOFTWARE CONFIGURAl’ION
Computer Boot Up Software Backup Software Initialization Software Files
SOFIWARE OVERVIEW
System Reset System Characterization Cable Correction C& and Delay Time Determination Device Measurement Data Analysis and Plotting
SYSTEM CHECKOUT
Checkout Procedure System Troubleshooting
USING THE PACKAGE 82 WITH THE IBM AT
Installation Software Backup Configuration File Modification Booting the System
...............................................
.....................................................
...............................................................
...............................................................
..................................................................
................................................................
.................................................................
................................................................
................................................................
...............................................................
.................................................................
............................................................
..................................................
...............................................................
l-1 l-l l-l l-1 l-l
l-2 l-2
l-2 l-2
l-2 l-2 l-2 l-2
2-1 2-l
2-l 2-l
2-4 2-6 2-6
2-7 2-7 2-7 2-7
2-a i:
2-9 2-9 2-9
..- .................... 2-9
;I; 2-9
2-9 2-10 2-11 2-n 2-U 2-11 2-n 2-ll
;I: 2-33
2-l3 2-B
i
2.7.5
.......................................................................................................
27.6
Modifyingtheprintpath...................................... . . . . . . . . . . ..*......*........a..
Operational Check. . . . . . .
SECTION 3--MEASUREMENT
. . . . . . . . . . . . . . . . . . ..*............................*.............*....
2-14 2-14
3.1
3.2 3*3
3.4
3.4.1
3.4.2
3.4.3
3.4.4
3.45
3.5
3.5.1
3.5.2
3.5.3
3.54
3.5.5
3.5.6
3.6
3.6.1
36.2
3.6.3
3.6.4 El
3?2
3.7.3
37.4
37.5
3.8
38.1
38.2
3.8.3
3.9
3.9.1
3.9.2
3.9.3
3.9.4
3.9.5
INTRODUCTION MEASUREMENT SEQUENCE SYSTEM RESET TESTING AND CORRECTING FOR SYSTEM LEAKAGES AND !XFWt’S
Test and Correction Menu
.............................................................................. 3-l
...................................................................
...............................................................................
...........................
....................................................................
Parameter Selection Viewing Leakage Levels System Leakage Test Sweep Offset Suppression
CORRECT’ING FOR CABLING EFFECTS
When to Perform Cable Correction. RecommendedSources
Source Connections
.........................................................................
~oha.re Mciiflcation
Y ** Correction Procedure Optimizhg Correction Accuracy to Probe Tips
.................................................................................................................................................
...........................................................................................................................................
..
........................................................
...........................................................
......................................................................
.........................................................................
........................................................................
.................................................
DETERMNNG OXIDE CAPACTIXNCE AND EQUILIBRIUM DELAY TIME
& and Delay Time Menu Running and Analyzing a Diagnostic CV Sweep
...... .... .. .
........... ........
..........
Determining Oxide Capacitance, Oxide Thickness, and Gate Area Determining Optimum Delay lime
MAKINGCVMF&lIGMEMS
CVMeasurementMenu
....
...........................................................
...............................................................
........................................................................................................................
Programming Measurement Parameters Manual CV Sweep
......................................................................................................................................................
Auto CV Sweep Using Corrected Capacitance
LIGHT CONNECX’IONS
Digital I/O Port Tixminals LED collnectioIls
...........................................................................
Relaycontrol.......................................~
MEASUREMENT CDNSID~ONS
Potential Error Sources AvoidmgCapacitanceEm>rs
Correcting Residual Errors Interpreting CV Curves DynamicRangecOnsideratio~
.................................................................
......................................................................
....................................................................
.......................................
................................................
......................................................................
........
1.
.................................................................
...................................................................
......................................................................
...............................................................
........................
3-3 3-3 g
3-9 3-13 3-13 3-13
3-h r) -se
zfi 346 3-16 3-X
3-18 3-20 3-22
3-26 322
3-29 3-30
3-33 3-33 3-33 3-34 3-34 g;
3-z
3-39
3-40
SECTION 4-ANALYSIS
4.1
4.2
4.21
INTRODUCTlON
CONSWNTS AND SYMBOLS USED FOR ANALYSIS
constants.
4.2.2 Raw Data Symbols
42.3
4.3
4.3.1
4.3.2
4.4
44.1
4.4.2
Calculated Data Symbols
OB’UINNG IN-FOlWiAIlON FROM BASIC CV CURVES
Basic CV Curves
Dgtermining Device~e
ANAIXING CV DAIX
PlotterandPxinter Requirements.. Analysis Menu
ii
..............................................................................
.....
..
..........
...........................................................................
....... .....
..................................................................................................
.....................................................................
.............................................................................
.....................................................................
........................................................................
............................................................
..............................................................................
.........................................
41 E;
41
42
42 42 44 44 4-4 45
4.4.3
4.4.4
4.4.5
4.4.6
4.4.7
4.4.8
4.4.9
4.4.10
4.4.11
4.4.12
4.4.13
4.4.14
4.5
4.5.1
4.5.2
4.5.3
4.6
4.6.1
4.6.2
Saving andRecalling Data Displaying and Printing the Reading and Graphics Arrays Graphing Data
AnalysisTools .............................................................................. 410
Reading Array
Calculated Data Array (Graphics Array) Constants Used for Analysis Graphing the Reading Array
Doping Profile
Flatband Capacitance Interface Trap Density Analysis. CalculatedAccuracyofNandD~.
MOBIL,E IONIC CHARGE CONCENTTWHON MEASUREMENT .................................
Flatband Voltage Shift Method. Triangular Voltage Sweep Method Using Effective Charge to Determine Mobile Ion Drift
REFERENCES AND BIBLIOGRAPHY OF CV MEASUREMENTS AND RELAI’ED TOPICS.
References Bibliography of CV Measurements and Related Topics
..............................................................................
.............................................................................. 412
..............................................................................
.................................................................................
...................................................................
.................................................................
.................................................................
.......................................................................
.............................................................
...........................................................
..............................................................
........................................................... 430
SECTION 5-PRINCIPLES OF OPERATION
......................................
......................................................
......................................... .433
.........................................
.........
4-6 46
49
413 413
413 419
423 4-23 429
429 4-29
433 433
433
................................................. ............................ 5-l
...................................................................
...................................................................
..............................................................................
........................................................................... 5-2
............................................................................
.................................................................
.......................................................................
.......................................................................
............................................................... 5-5
..........................................................................
::1
El
5:3:2
5.4
5.4.1
5.4.2
5.5
5.5.1
5.5.2
5.6
INTRODUCTION SYSTEM BLOCK DIAGRAM REMOTE INPUT COUPLER
Tuned Circuits
Frequency Control
QUASISTATIC CV.
Quasistatic~ Configuration
Measurement Method
HIGH FREQUENCY CV
High Frequency System Configuration
High-Fluency Measurements
SIMUJXWEOUS CV
SECTION 6-REPLACEABLE PARTS
6.1
6.2 E
k5
INTRODUCT’ION
Pm LIST ..................................................................................
ORDERING INFORMAlTON
FACRJRY SERVICE ...........................................................................
COMPONENT LAYOUTS AND
................................................. ............................
........................................ ...........................
s
CHEMAX DIAGRAMS
APPENDICES
Appendix A Appendix B Appendix C
AppendixD ..................................................................................
Appendix E AppendixF
..................................................................................
..................................................................................
..................................................................................
..................................................................................
...................................................................................
........................................................
........................................ 6-l
5-l 5-2 5-2
5-3 5-3
5-3 53 5-5
5-6
:;
z
A-l g:1
D-l
E-l
F-l
iii/iv
List of Illustrations
SECTION 2-GETTING STARTED
2-l 2-2
2-3 2-4 2-5 2-6 2-7
2-8 Main Menu.
System BlockDiagram Model5951 Front Panel Model 5951RearPanel System Front Panel Connections System Rear Panel Connections System IEEE-488 Connections Remote Coupler Mounting
..................................................................................
.........................................................................
........................................................................
.........................................................................
SECTION 34blEASUREMENT
3-l
3-2 3-3
2 3-6 3-7 3-8 3-9 3-10 3-11 3-22 3-13 3-14 3-15 3-16 3-v 3-18 3-19 3-20 3-21 3-22
3-23 3-24 3-25 3-26
3-27 3-28 3-29
3-30
3-31
3-32
3-33
3-34
3-35
3-36
Measurement Sequence Package 82 Main Menu Stray Capacitance and Leakage Current. Parameter Selection Menu Save/Load Parameter Menu Monitor Leakage Menu Diagnostic Sweep Menu Leakage Due to Constant Current Q/t Curve with Leakage Resistance Constant Leakage Current .Increases*Quasistatic Capacitance Quasistatic Capacitance with and without Leakage Current Cable Correction Connections Partial Listing Showing Nominal Source Values
X and Delay Time Menu
co
CV Characteristics of n-type Material CV Characteristics of p-type Material Oxide Capacitance Menu Delay Time Menu Q/t and C, vs. Delay Time Fixample Choosing Optimum Delay Time
Capacitance and Leakage Current Using Corrected Capacitance
Device Measurement Menu
Parameter Selection Menu Manual Sweep Menu Auto Sweep Menu Digital 110 Port Terminal Arrangement Direct LED Control Relay Light Control CV Curve with Capacitance Offset CV Curve with Added Noise CvCurw Resukingfrom GainError Curve Tilt Caused By Voltage-dependent Leakage W Curve Caused By Nonlinearity Normal~CurveRes&swhenDeviceisKeptinEquiBbrium.. Curve Hysteresis Resulting When Sweep is Too Rapid
DistortionWhenHoldTieisTooShort..
........................................................................
.........................................................................
.........................................................................
.......................................................................
.............................................................................
.........................................................................
............................................................................
...........................................................................
...........................................................................
................................................................
.................................................................
....................................................................
......................................................................
.........................................................
......................................................................
.....................................................................
..............................................................
.............................................................
...................................... 3-12
.......................................
...................................................................
..................................................
.....................................................................
........................................................... 3-19
...........................................................
......................................................................
............................................................
................................................................
...................................
....................................................................
.....................................................................
..........................................................
.............................................................
..................................................................
...........................................................
................................................
.............................................................
..................................
...........................................
......................................................
2-2 2-2 2-3 2-5 2-5 2-6
2-7
2-10
3-l
3-3
3-4 3-5
3-7
3-9
3-11
3-12 3-32
3-12
3-14
3-15
3-17
3-20
3-21
3-23
3-24
3-25 3-25
3-27
3-28
3-31 3-32 3-33
3-34
3-35 3-35
3-36 3-36
3-36
3-37
3-39
3-41 3-41
V
SECTION 4-ANALYSIS
41 42
2 45
2 4-8 4-9 410 Q-11 PI2 413
414
4-15 4-16
417
418 4l9 420 42l
CV Characteristics of p-type Material CV Characteristics of n-type Material Data Analysis Menu
........................................................................... z
Example of Reading Array Print Out Example of Graphics Array Print Out Graphics Control Menu Reading Array Graphics &ray
...............................................................................
............................................................................... 423
....................................................................... 49
Quasistatic Capacitance vs. Gate Voltage Example (Normalized to Lx) High-Frequency vs. Gate Voltage Example (Nonnaked to 6x) High-Frequency and Quasistatic vs. Gate Voltage Example
Q/t vs. Gate Voltage Example
..................................................................
Conductance vs. Gate Voltage Example Depth vs. Gate Voltage Example Doping Profile vs. Depth Example
Kh’ vs. Gate Voltage Example Band Bending vs. Gate Voltage Example Quasistatic Capacitance vs. Band Bending Example
Hligh~FrequencyCapacitance vs Band Bending Examp!e Interface Trap Density vs. Energy from Midgap Example Model for TVS Measurement of Oxide Charge Density
...........................................................
...........................................................
............................................................
........................................................... z
.........................................................
............................................................... 420
............................................................. 421
................................................................ 422
....................................................... 425
SEaION S-PRINCIPLES OF OPERATION
5-l z
5-4
5-5 5-6
El
System Block Diagram
Simplified Schematic of Remote Input Coupler
System Configuration~for Quasistatic CV Measurements Bxdbaclc Charge Method of Capacitance Measurements U&age and Charge Waveforms for Quasistatic Capacitance Measurement
System Configuration for High Frequency CV Measurements High Frequency Capacitance Measurement Simukmeous CV Waveform.
.........................................................................
...................................................................
............................
................................... 415
....................................... 4%
.............................................
....................................
....
........................................
.......................................... 431
.................................................. 5-2
..........................................
..........................................
..........................
..................................... 5-5
......................................................
43
423 414
417 418
426
A-w
T” 428
5-l
5-3 54 5-4
5-6
57
vi
List of Tables
SECTION l-GENERAL INFORMATION
l-1
l-2 l-3
SuppliedEquipment ...........................................................................
Minimum Computer Requirements ..............................................................
Necessary Binary Files
................................................ ..........................
SECTION 2-GETTING STARTED
2-l ;I$
Supplied Cables Diskette Files System Troubleshooting Summary
...............................................................................
.................................................................................
SECTON 3-MEASUREMENT
3-l 3-2
Cable Correction Sources Digital I/O Port Terminal Assignments
......................................................................
SECTION 4-ANALYSIS
41 42 Displayed Constants 43 Analysis Constants
Graphical Analysis
............................................................................ 410
........................................................................... 4-10
............................................................................ 419
..............................................................
.......................................................... 3-33
l-3 l-3
l-3
2-4
;I;
3-14
vii/viii
SECTION 1
General Information
1.1 INTRODUCTION
This section contains overview information for the Package 82 Simultaneous CV system and is arranged as follows:
1.2 Features
1.3 Warranty Information
1.4 Manual Addenda
1.5 Safety Symbols and Terms Specifications
1.6
1.7 Unpacking and Inspection Repacking for Shipment
1.8
1.9 Computer Configurations Service and Calibration
1.10
1.2 FEATURES
The Package 82 is a computer-controlled system of in­struments designed to make simultaneous quasistatic CV and high frequency (1oOkHz and lMHz) CV measurements on semiconductors. The package 82 includes a Model 590 CV Analyzer for high-frequency CV measurements, and a Model 595 Quasistatic CV Meter, along with the necessary input coupler, connecting and control cables, and cable calibration sources. A Model 230-l Lbltage Souse and software for the HP 9000 Series 2(Xl and 300 computers (or an IBM AT with an HP BASIC language processor card) running BASIC 4.0 are also included.
l Graphical analysis capabilities allow plotting of data on
the computer display as well as hard copy graphs using an external digital plotter. Graphical analysis for such parameters as doping profile and interface trap density vs. trap energy is provided.
. Supplied external voltage source (Model 230-l) extends
the DC bias capabilities to *l2OV.
0 Supplied calibration capacitors to allow compensation for
cable effects that would otherwise reduce the accuracy of lOOkHz and lMHz measurements.
l All necessary cables are supplied for easy system hook
UP.
1.3 WARRANTY INFORMATION
Warranty information is located on the inside front cover
of this instruction manual. Should you require warranty service, contact your Keithley representative or the factory
for further information.
1.4 MANUAL ADDENDA
Any improvements or changes concerning the Package 82 or this instruction manual will be explained on a separate
addendum supplied with the package. Please be sure to note these changes and incorporate them into the manual
before operating or servicing the system.
Key Package 82 features include: 0 Remote input coupler to simplify connections to the
device under test. Both the Model 595 and the Model 590 are connected to the device under test through the coupler, allowing simultaneous quasistatic and high fre­quency measurement of device parameters with negligi­ble interaction between instruments.
l Supplied menu-driven software allows easy collection
of C, G, V, and Q/t data with a minimum of effort. No computer programming knowledge is necessary to operate the system.
l Data can be stored on disk for later reference or analysis.
Addenda concerning the Models 250~1,590,595, and 5909
will be packed separately with those instruments.
1.5 SAFETY SYMBOLS AND TERMS
The following safety symbols and terms may be found on
one of the instruments or used in this manual:
symbol on an instrument indicates that you
Q
The
should consult the operating instructions in the associated manual.
l-l
GENERAL INFORMATION
The WARNING heading used in this and other manuals
cautions against possible hazards that could lead to per­sonal injury or death. Always read the associated infor­mation very carefully before performing the indicated procedure.
A CAUTION heading outlines dangers that could damage the instrument. Such damage may invalidate the warranty.
1.6 SPECIFICATIONS
Detailed specifications for the Package 82 system can be found at the front of this manual. Specifications for the individual instruments are located in their respective in­struction manuals.
1.7 UNPACKING AND INSPECTION
1.7.1 Unpacking Procedure
Upon receiving the Package 82, carefully unpack all in­struments and accessories from their respective shipping cartons, and inspect all items for any obvious physical damage. Report any such damage to the shipping agent at once. Save the original packing cartons for possible future reshipment.
l Advise as to the warranty status of the equipment. l Write ALTENTION REPAIR DEPARTMENT
on the ship
ping label.
l Fill out and include the service form which is located
at the back of this or one of the other instruction manuals.
1.9 COMPUTER CONFIGURATIONS
1.9.1 HP Series 200 and 300
The Package 82 is supplied with software intended for use with the Hewlett Packard HP 9000 Series 200 and 300 com­puters running under BASIC 4.0. Table l-2 summarizes minimum requirements for the computer system. Table l-3 summarizes necessary binary files.
1.9.2 IBM AT
The Package 82 can also be used with an IBM AT (or com-
patible) that is equipped with a BASIC-ROM configured HP-8232lA Language Processor card. Paragraph 23 of this manual gives an overview of the procedure; see the HP documentation for detailed information.
1.10 SERVICE AND CALIBRATION
1.7.2 Supplied Equipment
Table l-l summarizes the equipment supplied with the Package 82 system.
1.8 REPACKING FOR SHIPMENT
Should it become necessary to return any of the in­struments for repair, carefully pack them in their original packing cartons (or the equivalent), and be sure to include the following information:
The Model 5951 Remote Input Coupler cannot be calibrated or repaired by the user, so it must be returned to the factory or authorized service center for repair or calibration. If the Model 5951 is to be returned, proceed as folIows:
1. Complete the service form at the back of the manual and include it with the unit.
2. tZarefdy pack the unit in the original packing carton
or its equivalent.
3. Write AITENTION RJBUR DEl?A#IuENT
on the ship
ping label.
l-2
Table l-1. Supplied Equipment
GENERAL INFORMATION
w-------2
1
1 1
1
- ---- ----_
230-l Voltage Source
590 CV Analyzer 595 Quasistatic CV Meter
5951 Remote Input Coupler
5909 Capacitance Sources : 3
.
2 1 1
4801 Low noise BNC cables (4’)
7051-2 BNC cables
7007-l Shielded IEEE488 cables (lm)
7007-2 Shielded IEEE488 cable (2m) Connect controller to instrument bus
5956 CV Software Package Control Package 82 system.
Table l-2. Minimum Computer Requirements
Hewlett-Packard HP9000
Computer
Minimum FUM Monitor Disk Storage
Series 200 or 300**
lM bytes* Monochrome HP829Olm (5%“) or HP&TJ22 (3%“) floppy disk
IEEE-488 Interface
HP-I-B
Programming language BASIC 4.0
-Yp*.~.I”‘.
Supply *lOOV DC offset, control 5951 frequency Measure lOOkI-&, lMHz C and G
Measure C, Q/t; supply staircase bias waveform Connect 590 and 595 to DUT System configuration/calibration Connect 5951 to DUT and instruments Connect instrument control and voltage signals
Connect instruments to bus
Table 1-3. Necessary Binary Files
Filename
DISC or CS80*
Comments
Depends on disc drive type I-FIB* CRTAorCRTB*
Depends on display type FHPlB*
F!!KHW IO”
*Only 5I2K bytes required with ROM-based BASIC 4.0
“An IBM-AT equipped with the HP BASIC Language
Processor Card can also be used. See paragraph 2.7.
*Driver
*Language extension
l-311-4
SECTION 2
Getting Started
2.1 INTRODUCTION
Section 2 contains introductory information to help you get your system up and running as quickly as possible. Sec­tion 3 contains more detailed information on using the Package 82 system.
Section 2 contains:
2.2
Hardware Configuration: Details system hardware configuration, cable co~ections, and remote input
coupler mounting.
2.3
System Power Up: Covers the power up procedure for the system, environmental conditions, and warm up periods.
2.4
Software Configuration: Outlines methods for booting up the computer, making backup copies, and Package 82 software initialization.
25
Software Ovmiew: Descriks the purpose andoverall confi8uration of the Package 82 software
2.6
System Checkout: Gives the procedure for checking out the system to ensure that everything is working properly.
2.2 HARDWARE CONFIGURATION
The system block diagram and connection procedure are covered in the following paragraphs.
2.2.1 System Block Diagram
An overall block diagram of the Package 82 system is shown in Fii 2-l. The function of each instrument is as follows:
Model 230-l Voltage Source-Supplies a DC offset voltage of up to ~XHJV, and also controls operating frequency of the Model 5951 Remote Input Coupler.
Model 590 CV Analyzer-Supplies a lCHWIz or lMHz test signal and measures capacitance and conductance when making high-frequency CV measurements.
Model 595 CV Meter-Measures low-frequency (quasistatic) capacitance and Q/t, and also supplies the stepped bias waveform (&2CW maximum) for simultaneous low- and high-frequency CV measurement sweeps.
Model 5951 Remote Input Coupler-Connects the Model 590 and 595 inputs to the device under test. The input coupler contains tuned circuits to minimize interaction be­tween low- and high-frequency measurements.
Computer (HP 9000)-Provides the user interface to the system and controls all instruments over the IEEE-488 bus, processes data, and allows graphing of results.-
Model 5909 Calibration Set-Provides capacitance reference somces for cable correcting the system to the test fixture.
2.2.2 Remote Input Coupler
The Model 5951 Remote Coupler is the link between the test fixture (which contains the wafer under test) and the measuring instruments, the Models 590 and 595. The unit not only simplifies system connections, but also contains the circuitry necessary to ensure minimal interaction bet­ween the low-frequency measurements made by the Model 595, and the high-frequency measurements made by the Model 590.
The front and rear panels of the Model.5951 are shown in Fiis 2-2 and 2-3 respectively. The front panel includes
input and output jacks for connections to the device under test, as well as indicators that show the selected test fre­quency (l00kHz or lMI-Iz) for high-frequency measure­ments. The rear panel includes a binding post for chassis ground, BNC jacks for connections to the Models 590 and 595, a ribbon cable connector (which co~ects to the Model 230-l digital I/O port), and a digital I/O port edge co~ec- tar providing one ITL output, four TIL inputs, digital com­mon, and +5V DC.
2-l
GETTING STARTED
Meter
7051
‘I ,-
c!cmdElta
I I
Meter Input
IEEE-48S BUS
7051
1 I
I
1
Figure 2-l. System Block Diagram
1 SOS1 REMOTE INPUT COUPLER
f
OUTPUT INPUT
2oov MAX 3oV PEAK
Tf
h5qHp
l I
’ OUTPUT and INPU’LBNC jacks used to connect
cl
the Model 5951 to the test fixture containing the device under test.
(7 2 Frequency indicators (X&Hz and lMHz)-Shows
the selected test frequency for high-frequency measurements.
Figure 2-2. Model 5953 Front Panel
2-2
1 OQkHI
0
I
Maximum voltage between the outer shell of the EJNC jacks and earth ground Is 3OV RMS. Maximum OUTPUT voltage Is 200& maximum INPUT voltage Is 30V peak. Exceeding these values may &eat a shock hazard.
IYHt
cl
I
I
WARNING
)
-
SYSTEM SIGNAL CONNECTIONS
GETTING STARTED
TO 2361 DIGITAL L’O
1
0
CHASSIS binding post-Provides a convenient con­nection to chassis ground of the Model 5951.
WARNING
Connect CHASSIS to earth ground to avoid a
possible shock hazard, Use #16 AWG or larger
Wh.
2 Ribbon cable-Connects to the Model 230-l digital
Ll
I/O port for frequency switching of the remote coupler.
3 DIGllAL I/O-Passes through the Model 230-l
LJ
digital I/O port signals for control and sensing of other components (for example, light control and door closed status).
DIGITAL l/O
4 To 590 INPUT-Connects to the Model 590 INPUT
cl
jack on the front panel of the instrument.
5 ‘IO 590 OUTPUT-Connects to the Model 590 OUT
cl
PUT jack on the front panel.
6 To 595 METER INPUT-Connects to the Model 595
cl
METER INPUT jack on the rear of the instrument.
WARNING
Maximum voltage between the outer shell of
the BNC jacks and earth ground is 30V RYS.
Figure 2-3. Model 5951 Rear Panel ”
2-3
GETTING STARTED
Table 2-l. Supplied Cables
-;
Q
5 3 2 1 1
Model
4801 7051-2 7N%l 7007-2
*
Description
4’ BNC Low Noise
Auriiication
590, 595, 5951 2’ BNC (RG-58) 230-1, 590, 595 lm shielded IEEE-488
IEEE-488 instrument bus 2m shielded IEEE-488 Computer to instruments Ribbon cable 5951 to 230-l
*Supplied with Model 5951
2.2.3 System Connections NOTE
OUTPUT should be connected to the substrate
Supplied Cables
lhble 2-l summarizes the cables supplied with the Package 82 system along with the application for each cable. Note that low-noise cables am provided for making co~ections between the chuck and the CV measurement instruments. The Model 4801 cables are each four feet long. Be careful not to use the Model 7051 BNC cables in place of the low­noise cables (Model 48Ol), as doing so will have detrimen­tal effects on your measurements.
Connection Procedure Use Figures 2-4 and 2-5 as a guide and co~ect the equip-
ment together as follows. Note that the stacked arrange­ment shown in the figures is recommended, but other setups can be used, if desired.
NOTE
All equipment should be turned off when mak­ing coMections.
contact, and INPUT should be connected to the gate metallization contact.
3. Connect the Model 5951 To 595 METER INPUT jack to the Model 595 METER INPUT jack using a Model 4801 cable.
4. Connect the ribbon cable to the Model 5951, and then connect the opposite end of the cable to the digital I/O port of the Model 230-l. Both connectors are keyed so that they can be installed only in one direction.
5. Using a Model 7051 cable, connect the Model 595
METERCOMPLEIEOUTPUTtothe EXTERNALTRIG GER INPUT jack of the Model 590.
6. Using a second Model 7051 BNC cable, connect the
Model 595 VOLEAGE SOURCE OUTPUT to the OUT PUT LO of the Model 230-l Voltage Source. In a similar manner, use a Model 7051 BNC cable to connect the Model 23&l OUTPUT HI to the EXTERNAL BIAS IN­PUT of the Model 590 CV Analyzer.
Z Connect the Model 5951 chassis ground post to earth
ground using heavy copper wire.
1. Connect a Model 4801 cable between the Model 590 INPUT jack and the To 590 INPUT jack of the Model 5951 Remote Input Coupler. Co~ect a second Model 4801 between the Model 590 OUTF’UT jack and the ‘ID 590 OUT jack of the Model 5951.
2. Connect the Model 5951 INPUT and OUTPUT jacks to the chuck test fixture using Model 4801 cables.
2-4
WARNING The Model 5951 must be connected to earth grwnd using #l6 AWG or larger wire.
GETTING STARTED
595
CV Meter
590
CV Analyzer
230-l
Voltage Source
Figure 2-4. System Front Panel Connections
voltl3ga sourcs output
Figure 2-5. System Rear Panel Connections
2-5
GETTING SThtlED
2.2.4 IEEE-488 Bus Connections
In order to use the system, the instruments must be con­nected to one another and the computer using the sup­plied IEEE-488 cables. Typically the shorter cables will be used to connect the instruments together, while the longer cable connects the instrument group to the computer. Figure 2-6 shows a typical arrangement for IEEE-488 bus
coM&ions.
2.2.5 Remote Coupier Mounting
In many cases, the wafer prober will be located inside a faraday cage to remote coupler itself can also be placed inside the cage for convenience and to minimize cable lengths, assuming, of course, there is sufficient room.
nkimize noise. In these situations, the
230-l
Voltage !3ams
The coupler can be permanently mounted to the sides or top of the faraday cage by removing the rubber feet and using the threaded holes in the bottom case for mounting. Appropriate mating holes can be drilled in the faraday cage, and the coupler should be secured to the cage with
16-32 screws of sufficient length.
CAUTION Be sum that the mounting scmws do not extend more than Y4” inside the Model 5951 case, or
they may contact the circuit board inside.
Figure 2-7 shows a typical installation for coupler moun­ting, including suggested cable routing. Note that the Model 5951 chassis should be grounded to the faraday cage by connecting a grounding strap or wire between the cage
and the coupler chassis ground binding post.
2-4
7UU7-2 Shiekhi Ca#e pm)
Figure 2-6. System IEEE-468 Connections
TO
Instruments
GETTING STARTEll
5951
Coupler
Probr Fixturm
Figure 2-7. Remote Coupler Mounting
2.3 SYSTEM POWER UP
Line voltage selection, power connections, environmen­tal conditions, and instrument warm-up periods are covered in the following paragraphs.
2.3.1 Instrument Power Requirements
The Models 2304, 590, and 595 are designed to operate
from 105425V or 2lO-250X 50 or 6OHz AC power sources
(special transformers can be factory installed for 904.W
and 195~235V AC voltage ranges). The factory setting for each instrument is marked on the rear panel of that par­ticular instrument. The operating voltage for each in&m­ment is either internally or externally selectable; see the
appropriate instruction manual for details.
CAUTION Do not attempt to operate an instrument on a supply voltage outside the aHowed range, or in­strument damage may occur.
2.3.2 Power Connections
Each instrument should be connected to a grounded AC outlet using the supplied AC power cord or the equivalent.
WARNING Each instrument must be connected to a grounded outlet using the supplied power cord in order to ensure continued protection from possible electric shock. Failure to use a grounded outlet and a 3-wire power cord may result in personal injury or death because of electric shock.
2.3.3 Environmental Conditions
For maximum measurement accuracy, all instruments and the remote coupler must be operated at an ambient tem-
perature between 0 and 4CPC at a relative humidity less
than 70%, and within *5T of the cable correction temper­ature.
2-7
GElTING STARTED
2.3.4 Warm Up Period
.
The system can be used immediately when all instruments are first turned on; however, to achieve rated system ac­curacy, all instruments should be turned on and allowed
to warm up for at least two hours before use.
2.3.5 Power Up Procedure
Follow the general procedure below to power up the Package 82 system.
1. Connect the instruments together as outlined in para­graph 2.2.3.
2. Co~ect the instruments to the IEEE-488 bus of the host ?;4puter following the procedure given in paragraph
. . .
3. Turn on the computer and boot up its operating system in the usual manner. Refer to the computer documen­tation for complete details for your particular system.
4. Turn on each instrument by pressing in on its liont panel power switch. Verify that each instrument goes through its normal power up routine, as described below.
Model 230-l
1. The instrument first turns on all LEDs ind segments.
2. The software revision level is then displayed as in this example:
Bl3
3. The unit then displays the primary address:
2. Thh,““‘” then displays the programmed primary :
IEEE ADDRESS l.5
Verify the address is 15; program it for that value if not.
3. Finally, the unit begins displaying normal readings.
Model 595
1. The instrument first displays the ROM self-test message:
to.
2. The unit then displays normal readings.
3. Press MENU and verify the primary address is 23; set
it to that value if not.
2.3.6 Line Frequency
The Models 230-l and 590 can be operated from either 50 or 6OHz power sources with no further adjustments. However, for the Model 595 to meet its stated noise specifications, the unit must be programmed for the line frequency being used. To set or check the Model 595 line frequency, proceed as follows:
1. Turn off the Model 595 if it is presently turned on.
2. Press and hold the MENU button and then turn on the power. Release the MENU button after the display blanks on power up.
3. Press the MENU button and note .that the frequency selection prompt is displayed:
IEl.3
4. The unit begins normal display.
Model 590
1. The Model 590 first displays the software revision level as in this example:
590REVDl3
2-B
Fr - 50
or,
Fr = 60
4. Use one of the ADJUST keys to toggle the unit to the desired frequency.
5. Press SHIFT EXIT to return to normal operation. Note that the frequency selection prompt will remain in the menu until power is removed.
GETTING STARTED
2.4 SOFTWARE CONFIGURATION
The folIowing paragraphs discuss booting up the com­puter, making backup copies of the Package 82 software, and loading and initializing the software.
2.4.1 Computer Boot Up
Before you can use the Package 82 software, the computer must be booted up with the proper operating system soft­ware. See paragraph 1.9 for further information on com­puter requirements.
Turn on the computer and boot up BASIC 4.0 (if the com-
puter has ROM-based BASIC, no initialization is necessary).
2.4.2 Software Backup
Before using the software, it is strongly recommended that you make a working copy of the software supplied with the Package 82. Since the software is not copy protected, you can use the standard copy commands to duplicate each diskette. After duplication, put the master diskette
away in a safe place and use only the working copy.
you intend to use. A typical example is:
MASS STORAGE IS “:,700,0“
Place the Package 82 software working disk in the
3. default drive.
4.
Type in LOAD”PKG82CV” and press the EXEC key.
5.
After the program loads, press the RUN key, or type in RUN and then press the EXEC key The main menu shown in Figure 2-8 should appear on the computer display.
2.4.4 Software Files
Package 82 software files that are included with the
distribution diskette are SulTLznarized in ‘Iable 2-2. Note that “pkg82cal” is created when cable correction is performed the first time.
2.5 SOFTWARE OVERVIEW
The main sections of the Package 82 software are discussed in the following paragraphs. These decriptions follow the order of the main menu shown in Figure 2-8. For detailed information on using the software to make measurements and analyze data, refer to Sections 3 and 4.
Use the COPY command to copy the software diskette. A typical example is:
COPY “:I-lP9895,700,0” ‘IO “:HP9895,7OO,l”
Here, HP9895 represents the type of disk drive, 700 is the primary address, and 0 Note that the working diskette should be formatted with the INITIALIZE command before attempting copying.
and 1 are the disk drive numbers.
2.4.3 Software hitialization
Software initiakation is simply a matter of loading and running a program as you would any other BASIC pro­gram, as outlined below.
1. Boot up or enter BASIC 4.0 in the usual manner.
2. If necessary, assign a mass storage specifier to the drive
2.5.1 System Reset
By selecting option I on the main menu, you can easily reset the instruments and the software to default condi­tions. DCL (Device Clear) and IFC (Interface Clear) com­mands are sent over the bus to return the instruments to their power-on states and remove any talkers or listeners from the bus.
2.52 System Characterization
Option 2 on the main menu allows you to perform a
“probes up” characterization of the complete system from
the measuring instruments, through the connecting cables
and remote couple& down to the prober level:Characteri­zation is necessary to null out (G, C#, or G), or remedy
leakage sent in the system that could affect measurement accuracy;
the procedure also allows you to verify connection problems.
currents, resistances, and stray capacitance pre-
2-9
GETTING STARTED
f
l * PfICKflGE 82 MAIN MENU **
1. Reset Package 82 CU System
2. Test and Correct for System Leakages and Strays
3. Correct for Cabling Effects
4. Find Dtv~ct Cox and Equilibrium Delay Time
5. Make CV Measurements
6. halyze CU Data
7. Return to BASIC
Enter number to select from menu
Figure.24. Main Menu
There are two important aspects to systemcharackrktion:
1, Quasistatic capacitance (0, high-frequency capacitance
(C,), conductance (G), and Q/t (current) are measured at a specified bias voltage to determine system contribu­tion of these factors. Ce, CM, and G can be suppressed in order to maximize accuracy. If abnormally large er­ror terms are noted, the system should be checked for poor connections or other factors that could lead to large erms.
2. Q/t vs. V sweeps can be performed to determine the
presence of leakage resistance and extemal le rent sources. C vs. V sweeps can be done to test
cur-
r the
7 presence of voltage dependent capacitance in the system.
System checkout should be performed whenever the con­figuration, step V, or delay time is changed. Probes-up sup pression should precede every measurement to achiwe rated accuracy.
2.5.3 Cable Correction
Cable correction can be performed by selecting option 3 on the main menu. Cable correction is necessary to com­pensate for transmission line effects of the connecting cables and is essential for maintaining accuracy of high­frequency CV measurements. In order to cable correct the
system, you must connect the Model 5909 Calibration Sources to the system. Refer to paragraph 3.5 Correcting
for Cabling Rffects.
Included in the cable correction procedure is a gain cor­rection of the Model 595 CV Meter. Cable correction and gain unmction parameters are automatically stored on disk during cable correction and are restored when the softwam is run ini- so that correction need not be performed each time the system is used. Note, however, that correc­tion should be performed whenever the ambient tempera­ture changes by more than 5OC, or if the system configura­tion is changed.
240
GETTING STARTED
MOTE
The diskette for storing cable correction parameters
must be in the default drive when correction is performed.
2.5.4 C, and Delay Time Determination
Option 4 allows you to determine optimum parameters for
measuring the device under test. The key areas of this
characterization process are:
1. A CV sweep of the device is used to find accumulation and inversion voltages.
2. The device is biased in the accumulation region in order to determine 6x.
3. The device is biased in inversion to determine Model 595 step time. A test for equilibrium can be performed by monitoring the decay tune of Q/t to the system leakage level following a step in DC bias voltage. The user can also control a light on the device to help achieve equilibrium.
4. A sweep of C and Q/t vs time delay is performed to determine optimum delay time.
2.5.5 Device Measu@ment
Option 5 on the main menu allows you to perform a simultaneous CV sweep on the device under test. As parameters are measured, the data am stored within an array for plotting or additional analysis, as required.
The two types of sweeps that can be performed include:
1. Accumulation to inversion: Initially, the device is biased in accumulation, and the bias voltage is held static un­til Q/t reaches the system leakage level. The sweep is then performed and the data are stored in the array.
2. inversion to accumulation: In this case, the device is first biased in inversion, and the sweep is paused until equilibrium is reached (when Q/t equals the system leakage levei) . A submenu option allows you to control a light within the test fixture (using the Model 5951 digital II0 port) as an aid in attaining the equilibrium
point. The sweep is then completed and the data are stored in an array for further analysis.
the CRT or plotter, graphical analysis, and loading or stor­ing array data on disk. Note that this option can also be directly selected from menus providing sweep measurements without having to go through the main menu.
2.6 SYSTEM CHECKOUT
Use the basic procedure below to check out the Package 82 to determine if the system is operational. The procedure requires the use of the Model 5909 Calibration Sources, which are supplied with the package. Note that this pro-
cedure is not intended as an accuracy check, but is in-
cluded to show that all instruments and the system are functioning normally.
2.6.1 Checkout Procedure
1. Connect the system together, as discussed in paragraph
2.2.
2. Power up the system using the procedure given in paragraph 2.3.
3. Boot up the computer and load the Package 82 software, as covered in paragraph 2.4.
4. Select option 2 on the main menu, and then option 2 on the &bsequent menu. Connect the l&F capacitor and verify that C, is within 1% of the lkHz capacitor value, and that Q/t is <IpA. Correct any cabling pro­blems before proceeding.
Select the cable correction option on the main menu. Ebllow the prompts and connect the Model 5909 Calibra-
tion Sources to the Model 5951 INPUT and OUTPUT cables using the BNC adapters supplied with the Model
5909. After correction, return to main menu selection 2, then
select option 2 on the submenu. Connect the 1.8nF capacitor; verify that C, is within 1% of the lkH2 capacitance, and that CB is within 1% of the ICiXHz or IMHz value (depending on the selected frequency).
Select option 3 on, the leakage and strays menu. Turn on the sweep and observe the Model 590 voitage
display. Verify that the bias voltage readings step thmugh the range of -2V to +2V in XhnV increments.
2.6.2 System lkoubleshooting
2.5.6 Data Analysis and Plotting
Option 6 on the main menu provides a window to a number of analysis and graphing tools. Key options here include printing out parameters, graphing array data on
Troubleshoot any system problems using the basic pro­cedure shown in Table 2-3. For information on troubleshooting individual instruments, refer to the respec­tive instruction manual(s).
2-11
GE-KING STARTED
Table 2-2. Diskette Files
Filename File %e Description
PKG82CV Program M5!3ocv* Program Model 590 program M595cv*
P~.D~T Model 595 program
pkg82cal* *See Appendix for details on these programs.
“this file is created/updated when cable correction is per-
formed.
Table 2-3. System liwbleshooting Summary
Symptom
No instrument responds over bus. One instrument fails to respond. Improper low-frequency measurements.
Improper high-frequency measurements. 5951 does not change frequency. No DC bias applied to device. Excessive leakage current. Rrratic readings.
590 readings not triggered. Probes up Q/t vs V improper. Probes up c -3s v improper.
Main Package 82 program
Cable correction constants
Possible Cause(s)
Units not connected to controller, controller defective.’ Unit not connected to bus, improper primary address, unit defective. 595 not connected properly, 595 defective. 590 not connected properly ribbon cable not cormected, 590 defective. Ribbon cable not connected, 5951 or 230-l defective, loose ribbon cable connection. 595 or 230-l not connected properly, 595 or 2304 defective. Wrong cables used, dirty jacks, test fixture contamination. EMI interference, poor connections. 595 to 590 trigger cable not connected. External leakage current present. Eternal voltage-dependent capacitance
2-12
Cable correction impossible. Reading dynamic range insufficient.
Ezt&bles used, 590 defective. Connecting cables too long, excessive fix­ture capacitance.
*If using an IBM AT with the Language Processor Card, you can check to see if the card is
functioning by using the procedure covered in paragraph 2.7.6.
GETTING STARTED
2.7 USlNG THE PACKAGE 82 WITH THE IBM AT
The Package 82 can be used with IBM AT computers (and some compatibles such as the HP Vectra) that are equip­ped with the HP 8232lA Language Processor Card. The HP BASIC 5.0 ROM must be installed on the processor card in order to support the Package 82 software. Note that an EGA monitor is recommended (a monochrome monitor will work, but displayed graphs will be somewhat small).
The following paragraphs give a brief overview of hard­ware and software installation, configuration file, and methods to change the print path to support a parallel or
serial printer. Refer to the documentation supplied with
the processor card, BASIC ROM, and programming
language for detailed information.
2.7.1 Installation
IbIlow the overall procedure below to install the hardware
and software.
1.
Install the HP BASIC ROM on the processor card, as discussed in the HP BASIC ROM Installation Instruc­tions. Be sure to place the ROM jumper in the RUM IN position.
2.
Install the processor card in the IBM Al’ computer, as discussed in the Language Processor Instructions.
3.
Connect the IEEE-488 bus of the Package 82 instruments
to the I-IPlB connector of the processor card. See para­graph 2.2.4 of this instruction manual for more infor­mation on IEEE-488 bus connections.
4.
Boot up the IBM AT computer with MS-DOS.
5.
Install the BASIC Language software, as discussed in the HP BASIC ROM Installation hstructions.
2.7.3 Configuration File Modification
The configuration file, HPW.CON, must be modified to redefine the display mode1 type to combined alphal graphics for use with the Package 82. To do so, run the CONFXXE utility from MS-DOS, and change the machine type to “9816 combined”, Save the new configuration before exiting the CONEEXE utility. Remember that the I-IPW.CON file must be in the directory of the disk you use to BOOT the system.
2.7.4 Booting the System
Use the appropriate procedure below to boot BASIC and
load the Package 82 software. These procedures assume
that you have followed the software installation instruc-
tions given in the HP BASIC ROM Installation Instructions.
Hard Disk System Boot-up The procedure below assumes that drive C is your hard
disk, and that you have created a directory called HPW as part of the installation procedure. All pertinent HP files must exist under the HPW directory.
1.
Type the following:
C: <Enter>
CD \HPW <Enter>
2.
If you have.not already done do, copy the Package 82 soflwanzintotheI-IPWdirectorybyusingtheHPWUTIL
utility program supplied with HP BASIC. Select the LIP to HPW option for copying for master disks, or use HPW to I-IPW copy for working disks copied with
HPUTIL utility.
3.
After the disk has been copied, boot the system by typ­ing the following:
2.7.2 Software Backup
Before using the Package 82 software, it is strongly recom­mended that you make working copies of the supplied disks, and use only the working disks on a day-to-day basis. To do so, perform an LIFto-HPW copy using the HPWUTIL utility supplied with the HP BASIC package. Note that disks copied to the HPW format can only be used on MS-DOS drives along with the HP BASIC system; these copies cannot be used on HP Series 200 or 300 drives.
BOOT e Enter >
4.
After the boot-up sequence has finished, type the following to enter BASIC:
HPBASIC <Enter >
5.
Load the Package 82 software as follows: LOAD ‘TKG82CV” <Enter >
(Or use ‘M59OCV or ‘M595CV filenames for those Programs).
2-13
GE-KING STARTED
6. RUN the program in the usual manner. Refer to the re­mainder of Section 2, as well as Sections 3 and 4 for detailed operation information.
Flexible Disk System Boot-up
1. Place the HP BASIC working disk into the default drive, and type the following:
BOOT <Enter >
2. After the boot-up procedure, enter the following: HPBASIC <Enter >
3. Place the Package 82 working disk in the default drive, and type the following:
LOAD “PKG82CV” <Enter> (Or use “M59OCV” or “M595CV” filenames for those
Programs.)
4. RUN the
3, and 4 or detailed operation information.
rogram in the usual manner. See Sections 2,
4
2.7.5 Modifying the Print Path
As supplied, the Package 82 software supports a printer connected to the HP-IB bus with a primary address of 1.
The program must be modified to support printers con-
nected to the parallel or serial ports of the IBM AT’ as outlined below. Note that such printers must emulate HP
Think Jet bit-mapped graphics in order to properly display
graphs generated by the Package 82.
1. Boot up HP BASIC and the ‘PKG82CV” (or “M59OCV’
or “M595CV”) programs, as described above.
2.Type the following in order to locate the Printpath
variable in the program:
Printpath = 26 For the serial port (COMl), modify the Printpath as
follows: Printpath = 9
(Note: It may also be necessary to modify the configura­tion file for oroner serial sort oneration. See the HP BASIC La&rag; Programmer’s Reference Guide.)
Save the modified program under a convenient name.
4. Use the modified program in order to support the parallel or serial printers.
2.7.6 Operational Check
After software and hardware installation, the procedure below can be used to determine if the language processor card is properly communicating with the instruments.
1. Connect the instruments to the IEEE-488 connector on the back of the IBM AT computer.
2. Turn on the computer, boot MS-DOS, then boot up HP BASIC, as described in paragraph 2.7.4.
3. Turn on the instruments; make sure they go through their normal power-up cycles, and that the primary ad­dresses of the instruments are set to their default values (2304 X3; 590, W; 595,28). If not, set or program the pri­mary address to the correct value(s).
4. .From the HP BASIC direct mode, type in the following command, and verify that the Model 230-1 displays XJVz
OUTPUT 7X3 ; ‘VIOXfl <Enter>
5. Type in the following, and note that the Model 590 goes into the autorange mode:
OUTPUT 7.5; ‘W <Enter>
6. Type in the following, and verify that the Model 595 changes to the current function:
FIND ‘l%ntpatW <Enter>
3. When the computer displays the line in which Printpath is defined, modify the variable as follows (for the parallel
Dolt. ml:
L .
I
2-14
OUTPUT 728 ; ‘TW <Enter>
SECTION 3
s
Measurement
3.1 INTRODUCTION
This section gives detailed information on using the Package 82 Software to acquire CV data and is organized
as follows:
3.2
Measurement Sequence: Outlines the basic
measurement sequence that should be followed to ensure accurate measurements and analysis.
33
System Reseh Describes how to reset the instruments in the system.
3.4
Testing and Correcting for System Leakages and
Strays: Describes the procedure to test the complete system for the presence of unwanted characteristics such as leakage resistance, current, and capacitance.
35
Correcting for Cabling Pffecta: Details cable correc­tion that must be used in order to ensure accuracy of high-frequency CV measurements.
3.6
Finding Device Oxide Capacitance and Equilibrium Delay The: Covers the procedures necessary to
determine Cax and optimum delay time to attain device equilibrium.
3.7
Making CV Measurements: Describes in detail the
procedures necessary to measure the device under test and store the resulting data in arrays.
38
Light Connections: Discusses connection of a light
to the system as an aid in attaining device equilibrium.
3.9
Measurement Considerations: Outlines numerous
factors that should be taken into account in order to maximize measurement accuracy and minimke er-
rors in analysis.
The measurements must be carried out in the proper se­quence in order to ensure that the system is optimized and ermrtermsare minimized. The basic sequence is outlined below; Figure 3-l is a flowchart of the sequence.
0
No
rv
Figure 3-1. Measurement Sequence
N6W
Device ?
Yes
Perform
Sweep
Analyze
cv
Data
End
3-l
Loading...
+ 105 hidden pages