Instruction Manual
P6450
Logic Analyzer Probe
with D-MaxtProbing Technology
071-2478-00
There are no current European directives that apply to this product. This product provides cable
and test lead connections to a test object of electronic measuring and test equipment.
Warning
The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
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Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or
suppliers, and are protected by national copyright laws and international treaty provisions.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
cLGA is a registered trademark of Amphenol Intercon Systems, Inc.
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Contacting Tektronix
Tektronix, Inc.
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
For product information, sales, service, and technical support:
H In North America, call 1-800-833-9200.
H Worldwide, visit www.tektronix.com to find contacts in your are a.
Warranty 2
Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1)
year from the date of shipment. If any such product proves defective during this warranty peri od, Tektronix, at its
option, either will repair the defective product without charge for parts and labor, or will provide a replacement in
exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work
may be new or reconditioned to like new performance. All replaced parts, modules and products become the
property of Tektronix.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by Tektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the Tektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products ret urned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY
OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY
IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
TEKTRONIX’ RESPONSIBILITY TO REP AIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL,
OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS
ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
Preface xi...................................................
Related Documentation xi...........................................
Commonly Used Terms xii...........................................
Operating Basics 1..........................................
Product Description 1..............................................
Attaching Probe Labels 3...........................................
Connecting the Probes to the Logic Analyzer 5..........................
Connecting the Probes to the Target System 6...........................
Using the Probe Retention Assembly 6.............................
Dressing the Probe Cables 11.........................................
Storing the Probe Head 12............................................
Reference 13.................................................
Designing an Interface Between the Probes and a Target System 13...........
Signal Fixturing Considerations 13.................................
Board Design 17...................................................
Probe Dimensions 17............................................
Probe Retention Assembly Dimensions and Keepout 18................
Side-by-side and End-to-end Layout Dimensions 19...................
Signal Routing 20...............................................
Mechanical Considerations 20.....................................
Electrical Considerations 21......................................
Probe Footprint Dimensions 22........................................
Other Design Considerations 23.......................................
Via-in-pa d 23..................................................
Probe Pinout Definition and Channel Assignment 24......................
P6450 Single-ended Probe with D-Max probing technology 24...........
Specifications 27.............................................
Mechanical and Electrical Specifications 27.............................
Maintenance 29..............................................
Probe Calibration 29................................................
Functional Check 29................................................
Inspection and Cleaning 29...........................................
Service Strategy 29.................................................
Legacy Probe and Attachment Support 31...............................
Repackaging Instructions 31..........................................
Replaceable Parts 33..........................................
Parts Ordering Information 33.........................................
Using the Replaceable Parts List 33....................................
Mfr. Code to Manufacturer Cross Index 34...........................
Index 37....................................................
P6450 High-Density Logic Analyzer Probe Instruction Manual
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Table of Contents
List of Tables
Table 1: Probe section and label combinations 3.................
Table 2: Logic analyzer clock and qualifier availability 13..........
T able 3: 2X Demultiplexing source-to-destination
channel assignments 15....................................
Table 4: Channel assignment for a P6450 single-ended
logic analyzer probe 25....................................
T able 5: Mechanical and electrical specifications 27...............
Table 6: Environmental specifications 28........................
ii
P6450 High-Density Logic Analyzer Probe Instruction Manual
List of Figures
Table of Contents
Figure i: Flying Lead Set xii....................................
Figure ii: Probe example xiii....................................
Figure 1: P6450 High-Density probe with
D-Max probing technology 1...............................
Figure 2: Attaching labels to the P6450 probe 4..................
Figure 3: Connecting the logic analyzer probe 5..................
Figure 4: Installing the probe retention assembly 7...............
Figure 5: Proper handling of the interface clip 8..................
Figure 6: Connecting the probes to the target system 9............
Figure 7: Proper dressing of the probe cables 11...................
Figure 8: Protecting the probe head 12...........................
Figure 9: P6450 probe dimensions 17............................
Figure 10: Alternate retention assembly dimensions 18.............
Figure 11: Keepout area 18....................................
Figure 12: Side-by-side layout 19...............................
Figure 13: End-to-end layout 19................................
Figure 14: Signal routing on the target system 20..................
Figure 15: High-Density probe load model 21.....................
Figure 16: Probe footprint dimensions on the PCB 22..............
Figure 17: Optional Via-in-Pad placement recommendation 23......
Figure 18: P6450 single-ended PCB footprint pinout detail 24.......
Figure 19: Replacing the cLGA clip 30..........................
Figure 20: P6450 High-Density probe accessories 35...............
Figure 21: Optional accessories 36..............................
P6450 High-Density Logic Analyzer Probe Instruction Manual
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Table of Contents
iv
P6450 High-Density Logic Analyzer Probe Instruction Manual
General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it.
To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
ToAvoidFireor
Personal Injury
Connect and Disconnect Properly. Connect the probe output to the measurement
instrument before connecting the probe to the circuit under test. Disconnect the
probe input and the probe ground from the circuit under test before disconnecting
the probe from the measurement instrument.
Ground the Product. This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to the
input or output terminals of the product, ensure that the product is properly
grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
The inputs are not rated for connection to mains or Category II, III, or IV
circuits.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Power Disconnect. The power cord disconnects the product from the power
source. Do not block the power cord; it must remain accessible to the user at all
times.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
P6450 High-Density Logic Analyzer Probe Instruction Manual
v
General Safety Summary
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s instructions for details on
installing the product so it has proper ventilation.
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbol may appear on the product:
CAUTION
Refer to Manual
vi
Earth Terminal
Chassis Ground
P6450 High-Density Logic Analyzer Probe Instruction Manual
Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
P6450 High-Density Logic Analyzer Probe Instruction Manual
vii
Service Safety Summary
viii
P6450 High-Density Logic Analyzer Probe Instruction Manual
Environmental Considerations
This section provides information about the environmental impact of the
product.
Product End-of-Life
Handling
Restriction of Hazardous
Substances
Observe the following guidelines when recycling an instrument or component:
Equipment Recycling. Production of this equipment required the extraction and
use of natural resources. The equipment may contain substances that could be
harmful to the environment or human health if improperly handled at the
product’s end of life. In order to avoid release of such substances into the
environment and to reduce the use of natural resources, we encourage you to
recycle this product in an appropriate system that will ensure that most of the
materials are reused or recycled appropriately.
The symbol shown to the left indicates that this product
complies with the European Union’s requirements
according to Directive 2002/96/EC on waste electrical and
electronic equipment (WEEE). For information about
recycling options, check the Support/Service section of the
Tektronix Web site (www.tektronix.com).
This product has been classified as Monitoring and Control equipment, and is
outside the scope of the 2002/95/EC RoHS Directive. This product is known to
contain lead and hexavalent chromium.
P6450 High-Density Logic Analyzer Probe Instruction Manual
ix
Environmental Considerations
x
P6450 High-Density Logic Analyzer Probe Instruction Manual
Preface
This document provides information on using and servicing the P6450 logic
analyzer probe.
Related Documentation
The following table lists related documentation that is available for your
instrument. The documentation is available on the TLA Documentation CD and
on the Tektronix Web site (www.Tektronix.com/manuals).
For documentation not specified in the table, contact your local Tektronix
representative.
Table i: Product documentation
Item Purpose Location
TLA Quick Start User Manual High-level operational overview
Online Help In depth operation and UI help
Installation Quick Reference Cards High-level installation information
Installation Manuals Detailed first-time installation infor-
mation
XYZs of Logic Analyzers Introduction to logic analyzer basics
Product Specifications TLA product specification documents
TPI.NET Documentation Detailed information for controlling
the logic analyzer using .NET
Field upgrade kits Upgrade information for your logic
analyzer product
Optional Service Manuals Self-service documentation for
modules and mainframes
+ +
P6450 High-Density Logic Analyzer Probe Instruction Manual
xi
Preface
Commonly Used Terms
Refer to the following list of commonly used terms throughout the manual.
cLGA
Compression Footprint
D-Max probing technology
Flying Lead Set
An acronym for compression Land Grid Array, a connector that provides an
electrical connection between a PCB and the probe input circuitry.
A connectorless, solderless contact between your PCB and the P6450 probes.
Connection is obtained by applying pressure between your PCB and the probe
through a cLGA c-spring.
Trademark name that describes the technology used in the P6450 high-density
logic analyzer probe.
A lead set designed to attach to a P6450 probe to provide general-purpose
probing capability. See Figure i.
xii
Functional Check
Procedure
Keepout Area
CLK
Figure i: Flying Lead Set
Functional check procedures verify the basic functionality of the probes by
confirming that the probes recognize signal activity at the probe tips.
An area on a printed circuit board in which component, trace, and/or via
placement may be restricted.
GND
SIG
P6450 High-Density Logic Analyzer Probe Instruction Manual
Preface
Module
Module End
PCB
Probe
The unit that plugs into a mainframe that provides instrument capabilities such
as logic analysis.
The end of the probe that plugs into the module unit.
An acronym for Printed Circuit Board; also known as Etched Circuit Board
(ECB).
The device that connects a module with a target system. See F igure ii.
Module end
Probe Head
SUT
Probe head
P6450 Single-ended
probe
Figure ii: Probe example
The end of the probe that connects to the target system or probe adapter.
An acronym for System Under Test; also referred to as target system.
P6450 High-Density Logic Analyzer Probe Instruction Manual
xiii
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