Tektronix P6450 Instruction Manual

P6450 Logic Analyzer Probe

ZZZ

with D-Max™ Probing Technology

Instruction Manual

There are no current European directives that apply to this product. This product provides cable and test lead connections to a test object of electronic measuring and test equipment.

Warning

The servicing instructions are for use by qualiﬁed personnel only. To avoid personal injury, do not perform any servicing unless you are qualiﬁed to do so. Refer to all safety summaries prior to performing service.

www.tektronix.com

P071247801*

071-2478-01

Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions.

Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material. Speciﬁcations and price change privileges reserved.

TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

D-Max is a registered trademark of Tektronix, Inc. MagniVu is a trademark of Tektronix, Inc.

cLGA is a registered trademark of Amphenol Intercon Systems, Inc.

Velcro is a registered trademark of Velcro Industries B.V.

Contacting Tektronix

Tektro ni 14150 SW Karl Braun Drive P.O . B ox 5 0 0 Beaverton, OR 97077 USA

For pro

x, Inc.

duct information, sales, service, and technical support: In North America, call 1-800-833-9200. World wi de, vis i t www.tektronix.com to ﬁnd contacts in your area.

Warranty

Tektronix warrants that this product will be free from defects in materials and workmanship for a p eriod of one (1) year from the date of shipment. If any such product proves defective during this warranty p eriod, Tektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be n the property of Tektronix.

ew or reconditioned to like new performance. All replaced parts, modules and products become

In order to o the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location w ithin the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.

This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage result b) to repair damage resulting from improper u se or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modiﬁed or integrated with other products when the effect of such modiﬁcation or integration increases the time or difﬁculty of servicing the product.

THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.

TRONIX' RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE

TEK AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

[W2 – 15AUG04]

btain service under this warranty, Customer must notify Tektronix of the defect before the expiration of

ing from attempts by personnel other than Tektronix representatives to install, repair or service the product;

Table of Contents

General safety summary ............ ................................ ................................ .............. iv

Service safety summary........................................................................................... vi

Compliance Information......................................................................................... vii

Environmen

Preface ........... ................................ ................................ .................................. ix

Related Documentation ...................................................................................... ix

Commonly Used Terms ....................................................................................... x

Operating Basics ............ ................................ ................................ ....................... 1

Product Description ........................................................................................... 1

Attachi

Connecting the Probes to the Logic Analyzer ........................ ................................ ..... 5

Connecting the Probes to the Target System ............................................................... 6

Dressing the Probe Cables ........ ................................ ................................ .......... 11

Storing the Probe Head....................................................................................... 12

Reference .......................................................................................................... 13

gning an Interface Between the Probes and a Target System..................... .................. 13

Desi

Board Design ..... ................................ .................................. .......................... 16

Probe Footprint Dimensions................................................................................. 20

Other Design Considerations ............................................................................... 21

Probe Pinout Deﬁ nition and Channel Assignment . ... . ... ... . ... .... ... . .. . ... . ... ... . ... ... . ... ... . ... . 23

Speciﬁcations ...................... ................................ ................................ ................ 25

chanical and Electrical Speciﬁcations .................. .................................. .............. 25

Maintenance........................................................................................................ 27

Probe Calibration ............... .................................. ................................ ............ 27

Functional Check ............................................................................................. 27

Inspection and Cleaning.................................... .................................. ................ 27

Service Strategy................... ................................ ................................ ............ 27

Legacy Probe and Attachment Support .................................................................... 28

Repackaging Instructions ...................... ................................ .............................. 29

Replaceable Parts ....................... ................................ .................................. ........ 31

Parts Ordering Information ... ................................ ................................ .............. 31

Using the Replaceable Parts List ..... .................................. ................................ .... 31

Index

tal Considerations ...................... .................................. ..................... vii

ng Probe Labels ....................................................................................... 2

P6450 High-Density Logic Analyzer Probe Instruction Manual i

Table of Contents

List of Figure

Figure i: Flying lead set........................... .................................. ............................... x

Figure ii: P

Figure 1: P6450 High-Density probewith D-Max probing technology....................................... 1

Figure 2: Attaching labels to the P6450 probe ............... ................................ ................... 4

Figure 3: Connecting the logic analyzer probe......................................... ......................... 5

Figure 4: Installing the probe retention a ssembly.. ... . ... ... . ... ... . ... . .. . ... . ... ... . ... ... . ... .... ... . ... ... . 7

Figure 5: Proper handling of the interface clip.................................................................. 8

Figure 6:

Figure 7: Proper dressing of the probe cables.... ................................ .............................. 11

Figure 8: Protecting the probe head ......... .................................. ................................ .. 12

Figure 9: P6450 probe dimensions ........ .................................. ................................ .... 16

Figure 10: Alternate retention assembly dimensions ...................... ................................ .... 17

Figure 11: Keepout area ........ ................................ .................................. ................ 17

Figur

Figure 13: End-to-end layout ........................ .................................. .......................... 18

Figure 14: Signal routing on the target system................................................................. 19

Figure 15: High-Density probe load model......................................... ............................ 20

Figure 16: Probe footprint dimensions on the PCB.......................................... .................. 21

Figure 17: Optional Via-in-Pad placement recommendation..................................... ............ 22

gure 18: P6450 single-ended PCB footprint pinout detail.................................................. 23

Figure 19: Replacing the cLGA clip ................ .................................. .......................... 28

Figure 20: P6450 High-Density probe accessories .. ................................ .......................... 33

Figure 21: Optional accessories...................... .................................. .......................... 34

robe example.......................................................................................... xi

Connecting the probes to the target system ..................... ................................ ..... 9

e 12: Side-by-side layout................................................................................... 18

ii P6450 High-Density Logic Analyzer Probe Instruction Manual

List of Tables

Table i: Product documentation.................................................................................. ix

Table 1: Pro

Table 2: Logic analyzer clock and qualiﬁer availability . . ... . ... ... . ... .... ... . ... ... . ... . ... ... . ... . ... ... . . 13

Table 3: 2X Demultiplexing source-to-destination channel assignments .. ... . ... .... ... . ... ... . ... ... . ... . 14

Table 4: Channel assignment for a P6450 single-ended logic analyzer probe.................... .......... 23

Table 5: M echanical and electrical speciﬁcations........................ ................................ ...... 25

Table 6: Environmental speciﬁcations .. .................................. ................................ ...... 25

Table 7: P

Table 8: Manufacturers cross index ....... ................................ ................................ ...... 32

Table 9: P6450 replaceable parts list ............................................................................ 32

Table 10: P6450 Probe optional accessories.................................................................... 33

be section and label combinations.................................................................. 2

arts list column descriptions...................................... .................................. .. 31

Table of Contents

P6450 High-Density Logic Analyzer Probe Instruction Manual iii

General safety summary

General safet

To avoid ﬁre or personal

injury

ysummary

Review the fo this product or any products connected to it.

To avoid pot

Only qualiﬁed personnel should perform service procedures.

While using this product, you may need to access other parts of a larger system. Read the safety sections of the other component manuals for warnings and cautions r

Connect and disconnect properly.Connect the probe output to the measurement instrument before connecting the probe to the circuit under test. Connect the probe reference lead to the circuit under test before connecting the probe input. Disconnect the probe input and the probe reference lead from the circuit under test before

Ground the product.This product is indirectly grounded through the grounding condu conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, e nsure that the product is properly grounded.

disconnecting the probe from the measurement instrument.

ctor of the mainframe power cord. To avoid electric shock, the grounding

llowing safety precautions to avoid injury and prevent damage to

ential hazards, use this product only as speciﬁed.

elated to operating the system.

Observe all terminal ratings. To avoid ﬁre or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product.

The inputs are not rated for connection to mains or Category II, III, or IV circuits.

Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal.

Power disconnect.The power cord disconnects the product from the power source. Donotblockthepowercord;itmustremain accessible to the user at all times.

Do not operate without covers. Do not operate this product with covers or panels removed.

Do not operate with suspected failures. If you suspect that there is damage to this product, have it inspected by qualiﬁed service personnel.

Avoid exposed circuitry. Do not touch exposed connections and components when power is present.

Use proper fuse.Use only the fuse type and rating speciﬁed for this product.

iv P6450 High-Density Logic Analyzer Probe Instruction Manual

General safety summary

Terms in this manual

Symbols and terms on the

product

Do not operate i

Do not operate in an explosive atmosphere.

Keep product surfaces clean and dry.

Provide prop

on installing the product so it has proper ventilation.

These terms may appear in this manual:

WAR N ING.

in injury or loss of life.

CAUTION

damage to this product or other property.

These t

erms may appear on the product:

DANGER indica t es an injury hazard immediately accessible as you read the ma

n wet/damp conditions.

er ventilation.Refer to the manual's installation instructions for details

Warning statements identify conditions or practices that could result

. Caution statements identify conditions or practices that could result in

rking.

WARNING indicates an injury hazard not immediately accessible as you

the marking.

read

CAUTION indicates a hazard to property including the product.

The following symbol(s) may appear on the product:

P6450 High-Density Logic Analyzer Probe Instruction Manual v

Service safety summary

Service safet

ysummary

Only qualiﬁe safety summary and the General safety summary before performing any service procedures.

Do not service alone. Do not perform internal service or adjustments of this product unless another person capable of rendering ﬁrst aid and resuscitation is present.

Disconnect power. To avoid electric shock, switch off the instrument power, then disconnect the power cord from the mains power.

Use care when servicing with power on. Dangerous voltages or currents may exist in this p test leads before removing protective panels, soldering, or replacing components.

To avoi

d personnel should pe rform service procedures. Read this Service

roduct. Disconnect power, remove battery (if applicable), and disconnect

d electric shock, do not touch exposed connections.

vi P6450 High-Density Logic Analyzer Probe Instruction Manual

Compliance Information

This section lists the EMC (electromagnetic compliance), safety, and environmental standards with which the instrument complies.

Environmental Considerations

This section provides information about the environmental impact of the product.

Product En

riction of Hazardous

Rest

Substances

d-of-Life

Handling

Observe the following guidelines when recycling an instrument or component:

Equipment recycling. Production of this equipment required the extraction and use of nat harmful to the environment or human health if improperly handled at the product’s end of life. To avoid release of such substances into the environment and to reduce the use of natural resources, we encourage you to recycle this product in an appropriate system that will ensure that most of the materials are reused or recycled appropriately.

This product is classiﬁed as Monitoring and Control equipment, and is outside the scope of the 2002/95/EC RoHS Directive.

ural resources. The equipment may contain substances that could be

This symbol indicates that this product complies with the applicable European Union requirements according to Directives 2002/96/EC and 2006/66/EC on waste electrical and electronic equipment (WEEE) and batteries. For information about recycling options, check the Support/Service section of the Tektronix Web site (www.tektronix.com).

P6450 High-Density Logic Analyzer Probe Instruction Manual vii

Compliance Information

viii P6450 High-Density Logic Analyzer Probe Instruction Manual

Preface

Tektronix P6450 Instruction Manual

Specifications and Main Features

Frequently Asked Questions

User Manual