Tektronix GeoProbe G10 Hardware Maintenance Manual

Software Version 7.13.2

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G10 Hardware Maintenance Guide

GeoProbe® G10

Copyright © Tektronix, Inc. All rights reserved. Printed in the USA. Tektronix products are covered

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by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in
all previously published material. Specification and price change privileges reserved. TEKTRONIX
and TEK are registered trademarks of Tektronix, Inc. The GeoProbe system uses the SmartHeap
product for memory management. SmartHeap is a product of Compuware Corporation,
Copyright © All rights reserved. All other trade names
trademarks or registered trademarks of their respective companies.

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The products and specifications, configurations, and other technical information regarding the
services described or refe
statements, technical information, and recommendations contained in this document are believed
to be accurate and reliable but are presented “as is” without warranty of any kind, express or
implied. Users must take full responsibility for their application of any products specified in this
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as a result of this document or the information described or referenced within, and all other
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planned capabilities and intended functionality offered by the product and version number
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WHAT’S NEW IN G10 HARDWARE VERSION 7.13.2?

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Feature ID Description Refer to:

F-02470 New Applications Blade

G10 probes support a new IAP320 application blade.

Chapter 1, G10 Probe

Configurations

Chapter 3, Blades and

RTMs

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User Documentation

Table of Contents

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What’s New in G10 Hardware Version 7.13.2? ............................................................. 3

Chapter 1 G10 Probe Overview ........................................................................................................... 9

Overview ...................................................................................................................... 9

G10 Probe Configurations .......................................................................................... 10

G10 Architecture Overview ......................................................................................... 11

Data Collection and Processing............................................................................ 11

Line Rate Processing—Iris Interface Card (IIC) ............................................... 12

User Plane and Control Plane Processing—Iris Interface Card (IIC)

and Application Blade .................................................................................... 12

Storage Subsystem—Store to Disk ...................................................................... 12

G10 Hardware Components ....................................................................................... 13

G10 Front View .................................................................................................... 13

G10 Rear View ..................................................................................................... 14

Network Connectivity.................................................................................................. 15

Default Port Settings ............................................................................................ 16

Time Synchronization.................................................................................................. 17

G10 Media Probe Configuration.................................................................................. 18

G10 Control Plane Probe Configuration ...................................................................... 19

Chapter 2 Chassis Subsystem........................................................................................................... 22

Overview .................................................................................................................... 22

Shelf Manager ............................................................................................................ 23

Rear Panel LEDs .................................................................................................. 24

Rear Panel Connectors ........................................................................................ 25

Power Entry Modules (PEMs)...................................................................................... 26

DC PEMs ............................................................................................................. 26

Front Panel LEDs........................................................................................... 27

AC PEMs ............................................................................................................. 28

Front Panel LEDs........................................................................................... 28

Fan Trays.................................................................................................................... 29

Electro-Static Discharge Points................................................................................... 30

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Chapter 3 Blades and RTMs ..............................................................................................................31

Overview .....................................................................................................................31

Iris Interface Card ........................................................................................................32

IIC LEDs................................................................................................................32

IIC200 ...................................................................................................................34

IIC200 LEDs ...................................................................................................34

FPC200 AMC .................................................................................................35

LPC200 AMC .................................................................................................37

IIC200 RTMs ..................................................................................................39

IIC100 ...................................................................................................................42

FPC100 AMC .................................................................................................43

LPC100 AMC .................................................................................................45

IIC100 RTMs ..................................................................................................46

Applications Blade .......................................................................................................53

Table of Contents

IAP320/IAP200 .....................................................................................................54

IAP320 ...........................................................................................................55

IAP200 ...........................................................................................................58

PRM300 RTM/PRM200 RTM .........................................................................60

IAP100..................................................................................................................63

IAP100 LEDs ..................................................................................................64

IAP100 Connectors ........................................................................................65

SAS AMC .......................................................................................................66

IAP100 RTMs .................................................................................................67

10G Interconnect Card ................................................................................................70

10G Interconnect Card LEDs ..........................................................................71

10G Interconnect Card Connectors ................................................................72

G10 Hardware Component Name Reference ..............................................................72

Chapter 4 Storage Subsystem............................................................................................................74

SAS Storage Arrays.....................................................................................................74

Supported Models ................................................................................................75

Storage Enclosure Features ..................................................................................75

Disk Enclosure Front Panels ........................................................................................77

SA100R, SA100J, SA200R, and SA200J Front Panel ...........................................77

SA210J Front Panel ..............................................................................................77

Front Panel LEDs ..................................................................................................78

Disk Enclosure Rear Panel...........................................................................................79

SA200R Controller Enclosure Rear Panel ..............................................................79

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SA200R Controller Enclosure Connectors ......................................................81

SA100R Controller Enclosure Rear Panel ..............................................................81

SA100R Controller Enclosure Connectors ......................................................83

SA100J, SA200J, and SA210J Expansion Enclosure Rear Panel ..........................84

Expansion Enclosure Connectors ...................................................................85

Chapter 5 Maintenance Guidelines .....................................................................................................86

Overview .....................................................................................................................86

G10 Maintenance Procedures .....................................................................................87

Field Replaceable Units .........................................................................................87

Removing and Replacing a PEM ...........................................................................89

Replacing a DC PEM ......................................................................................89

Replacing an AC PEM ....................................................................................91

Replacing the Fan Tray .........................................................................................94

Replacing G10 Chassis Air Filters ..........................................................................97

Table of Contents

Replacing the Top Air Filter .............................................................................97

Replacing the Bottom Air Filter .......................................................................99

G10 Blade Removal/Replacement Procedures....................................................102

IAP100 .........................................................................................................102

SAS AMC (IAP100) .......................................................................................105

IAP200/IAP320.............................................................................................106

Iris Interface Card (IIC100 or IIC200) .............................................................108

LPC and FPC AMCs (IIC100 or IIC200).........................................................115

RTMs ...........................................................................................................116

10G Interconnect Card .................................................................................118

Replacing G10 Shelf Managers (SHMMs) ............................................................120

Replacing the First (Standby) SHMM ............................................................120

Replacing the Second (Active) SHMM ..........................................................121

Serial Over LAN (SOL) Support ...........................................................................122

G10 Probe and Array Start Up/Shut Down Sequence .........................................122

Start Up Procedure.......................................................................................122

Shut Down Procedure ..................................................................................124

Storage Array Maintenance Procedures.....................................................................125

Storage Array Maintenance Guidelines................................................................125

Replacing a Power Supply ..................................................................................126

Removing the Power Supply.........................................................................126

Installing the Power Supply...........................................................................128

Bezel (Air Filter) Procedures.................................................................................129

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Table of Contents

Installing the Bezel ........................................................................................129

Removing the Air Filter ..................................................................................130

Replacing the Air Filter ..................................................................................132

Replacing a Controller or Expansion Module .......................................................134

Removing the Controller Module...................................................................134

Installing the Controller Module

Replacing a Drive Module....................................................................................137

Removing Air Management Modules ............................................................137

Installing Drive Modules ................................................................................138

Replacing the Disk Array Chassis ........................................................................139

Removing the Disk Array Chassis .................................................................140

Installing the Disk Array Chas

Chapter 6 System Operating Specifications......................................................................................143

Overview ...................................................................................................................143

Physical Specifications ..............................................................................................144

Power and Ground Requirements .............................................................................145

DC Power Requirements.....................................................................................145

AC Power Requirements .....................................................................................146

Environmental Specifications...............................................................................147

Regulatory Specifications ..........................................................................................147

Safety Compliance ..............................................................................................147

EMC Standards ..................................................................................................148

.............................

sis

...................................................................141

........................................136

CE Mark..............................................................................................................149

NEBS..................................................................................................................149

ETSI Compliance ................................................................................................149

Safety Guidelines .......................................................................................................150

Equipment Use ...................................................................................................150

Handling the GeoProbe G10 ...............................................................................150

Damage to Circuits .............................................................................................150

GeoProbe G10 Power Disconnect ......................................................................150

Circuit Protection ................................................................................................151

FP100 Fuse Panel ........................................................................................151

G10 Equipment Warning Labels ................................................................................153

Appendix A SFP Reference ........................................................................................................

Monitored Ports SFPs ...............................................................................................154

1 Gb Port SFPs .........................................................................................................155

1000base-LX Fiber..............................................................................................155

...

.....154

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Table of Contents

1000base-SX Fiber .............................................................................................156

1000base-T Copper............................................................................................156

10 Gb Port SFPs .......................................................................................................157

10Gbase-SR Fiber ..............................................................................................158

10Gbase-LR Fiber...............................................................................................158

Minimum Signal Levels ..............................................................................................158

Installing SFPs ...........................................................................................................159

IIC200 ..........................................................................................................160

IIC100 ..........................................................................................................161

TRM100 RTM...............................................................................................161

PRM200 RTM or PRM300 RTM ...................................................................162

SRM200 RTM...............................................................................................162

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User Documentation

OVERVIEW

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G10 Probe Overview

The newest member of the GeoProbe family was designed specifically to address high
bandwidth IP interfaces with a distributed architecture optimized to handle larger traffic
volumes.

With native IPv4 and IPv6 support, the GeoProbe G10 offers the following benefits:

 Optimized for portions of the operator networks with high volumes of voice and data

IP traffic.

 Additional on-board capabilities improve usability and efficiencies: Store to Disk (S2D)

supports configurable packet capture rates with expandable storage configurations.

Beyond quantifiable performance metr
configuration, and maintenance.

 Automated workflows facilitate installation and configuration tasks.
 Scheduled group downloads streamline maintenance windows with built-in

reversibility commands for ensuring upgrade integrity.

ics, the GeoProbe G10 enables low-touch installation,

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G10 Probe Overview

G10 PROBE CONFIGURATIONS

Table 1.1 describes the different GeoProbe G10 configuration options.

Table 1.1 - G10 Configuration Options

G10 Configuration Supported HW Configuration Details Refer to:

1

Standalone 8 x 1G IIC100 + SRM100RTM

Standalone Mixed Model
(1G and 10G)

Media Probe IIC100 + TRM100 RTM

Control Plane Probe IIC100 + TRM100 RTM

a. This configuration is only supported for standalone probe configurations monitoring eHRPD.
b. Due to the Media probe and Control Plane probe configurations, deployments with IIC100/TRM100 RTM have a maximum

of TWO 10G physical ports available to monitor traffic.

c. The control plane probe only supports the IIC100/IAP200 configuration; the IIC100/IAP320 configuration is not supported.

IAP100 + PRM100 RTM
IAP200 + PRM200 RTM
IAP320 + PRM300 RTM

IIC100 + TRM100 RTM
IIC200 + SRM200 RTM
IIC200 + TRM100 RTM
IAP100 + PRM100 RTM
IAP200 + PRM200 RTM
IAP320 + PRM300 RTM

IIC200 + SRM200 RTM
IAP100 + PRM100 RTM
IAP200 + PRM200 RTM
IAP320 + PRM300 RTM

IIC200 + SRM200 RTM
IAP100 + PRM100 RTM
IAP200 + PRM200 RTM
IAP320 + PRM300 RTM

a

b

b,c

Single chassis probe configuration

 Supports 8 physical 1G connections
 Can be upgraded in the field to a Mixed

Model

Single chassis probe configuration

 Provides support for both 1G and 10G

Ethernet connections on one probe.

 Various combinations are supported with

the following maximums:

- Maximum support of 8 total ports (1G +
10G)

- Maximum support of 4 10G ports

Two-chassis probe configuration for supporting
RTP media monitoring

 Primary Chassis supports:

- Maximum of 8 total ports (1G + 10G)

- Maximum of 4 10G ports

 Expansion Chassis provides additional

data processing support

Two-chassis probe configuration for supporting
Mobility Management Entity (MME) monitoring

 Primary Chassis supports:

- Maximum of 8 total ports (1G + 10G)

- Maximum of 4 10G ports

 Expansion Chassis provides additional

data processing support

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Page 18

Page 19

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G10 ARCHITECTURE OVERVIEW

As the foundation for Tektronix Communications' Network Intelligence solution, the GeoProbe

G10 efficiently and comprehensively handles virtua lly all data acquisition and processing tasks
within the Iris architecture.

 Data is captured directly from the network in a passive and non-intrusive mode, as

opposed to information provided in vendor-specific format by individual network
elements. As a result, carriers can gain an independent view regardless of which
vendor's equipment is deployed in their network.

 Serving as a processing hub, the GeoProbe G10 eliminates the need for external

processing equipment-reducing the number of system components required and
ultimately conserving LAN/WAN bandwidth between system elements.

 Offering independence from a larger centralized storage server, the GeoProbe

G10 facilitates streaming, real-time, programmable record feeds and real-time
session traces

.

G10 Probe Overview

1

Data Collection and Processing

As illustrated in Figure 1.1, the GeoProbe G10 connects to the monitored network via a
physical interface at the link port. Raw packets are pr
Iris Interface Card (line rate processing functions) and forwarded (stream to disk functions) to
the Storage Subsystem.

In parallel, the Iris Interface Card sends contro
correlation, xDR generation, and KPI aggregation (control-plane processing functions).

After the packets are processed, the resulting xDRs, KPIs, and processed packets are made
available

for use by the various Iris Network Management applications.

ocessed in real time as they reach the

l plan

e traffic to the Application Blade for

Figure 1.1 - GeoProbe Data Flow

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Line Rate Processing—Iris Interface Card (IIC)

G10 Probe Overview

Consisting of a tiered pair of NPUs, the Iris Interface Card is able to process raw packets at
line rate speed with a distributed internal architecture and purpose-specific processing
functions.

 Packet Processor NPU-packet classification with fast processing requirements and

lower memory requirements.

 Flow Processor NPU-flow specific criteria processing across multiple packets with

higher memory requirements.

1

The Iris Interface Card’s dual NPU architecture allows
either NPU as desired-allowing additional processing power to be added incrementally as
needed and available.

for independent upgrades of each or

User Plane and Control Plane Processing—Iris Interface Card (IIC) and Application Blade

As the GeoProbe G10 architecture can support both User p lane and Control pla ne processing
with the same hardware, domain-specific sizing rules have been applied to maximize
processing performance for both traffic types.

rd h

While the Iris Interface Ca
Plane is forwarded directly to the x86 Application Blade for analysis, correlation and
processing functions.

andles the majority of the User Plane processing, the Control

Storage Subsystem—Store to Disk

In addition to I/O ports, interface processors and application boards, the GeoProbe G10
architecture relies upon a storage subsystem to further optimize processing functions.

Native Store to Disk (S2D) capabilities ensure line rate proces
capturing and storing monitored packets for use with applications requiring more extensive
and expansive data collection.

sing performance integrity by



ra

The incorporation of a RAID dual controller disk ar
provides the additional capacity required.

Refer to Storage Subsyste m for more det ail s about the storage system hardwa re component s.

G10 Hardware Maintenance Guide 7.13.2 12

y with every GeoProbe G10 installation

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ESD Bond Point

Power Entry
Modules

Iris Interface Card

(IIC200)

Application Blade

Fan Tray

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G10 HARDWARE COMPONENTS

The following sections highlight the G10 hardwa re com p onen ts.

G10 Front View

Figure 1.2 shows the front view of the GeoProbe G10.

G10 Probe Overview

1

Figure 1.2 - G10 Probe Front View

The front view of the G10 system provides access to the following hardware components:

 Iris Interface Card (IIC200 or IIC100)
 Applications Blade (IAP320/IAP200 or IAP100)
 Two Power Entry Modules (PEMs) (AC or DC)
 Fan Trays (one air inlet fan tray and a second fan tray located on the rear of the G10)
 Electro-Static Discharge Points

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ESD Bond Point

SHmm Shelf Managers

Applications Blade RTM

AC or DC Power Connectors

Fan Tray

SRM200 RTM

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G10 Rear View

G10 Probe Overview

1

Figure 1.3 shows rear views of the GeoProbe G10. The IIC RTM installed in Slot 2 (top slot)

varies depending on the G10 configuration.

Figure 1.3 - G10 Probe Rear View

The rear view of the GeoProbe G10 system provides access to the following hardware
compone

nts:

 Slot 2 (Top)—Installed IIC RTM varies per G10 model:

- 8x1G Model: SRM100 R

- Mixed 1G and 10G Model: SRM2

TM (Connects to IIC100)

00 RTM (connects to IIC200) or TRM100 RTM

(connects to IIC100 or IIC200)

 Slot 1 (Bottom)—Applications Blade RTM (PRM300 RTM/PRM200 RTM or PRM100

RTM)

 Redundant Shelf Manager (SHmm)
 Fan Trays (front to rear air flow)
 Rear connection for power cables
 Electro-Static Discharge Points

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NETWORK CONNECTIVITY

A G10 deployment currently requires that the customer provide three Ethernet connections
and associated addresses on the same subnet (see Figure 1.4):

 Primary Interface that connects the G10 to the Iris server. This enables probe

maintenance and configuration, as well as delivery of network traffic statistics and
detailed data to the server for display in IrisView applications. The Primary Interface
supports 100/1000 Mbps (IAP100) and 100/1000/10000 Mbps (PRM200/PRM300
RTM) Ethernet physical connections; it requires at least 100 Mbps connectivity. The
primary interface can be configured as non-redundant or re dunda nt. Refer to the G10
Installation Guide for details.

 OAM Interfaces (2) that connect to the Shelf Management Modules (ShMM) on the

rear of the chassis. The SHmms provide a central management point for controlling
the operation of the chassis, for providing probe status, and for monitoring the alarm
conditions. The OAM interfaces support 10/100 Mbps Ethernet physical connections.
They require at least 10Mbps connectivity to the Iris server for management.

Figure 1.4 shows a diagram of the required Ethernet connections for G10 configurations

using the IAP200/PRM200 RTM or IAP320/PRM300 RTM configurations. Primary Interface 2

t B) is optional and only used in redundant configurations.

r

(Po

G10 Probe Overview

1

Figure 1.4 - Ethernet Connections

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Default Port Settings

Table 1.2 lists the default port settings for the G10 probe.

Table 1.2 - Default Port Settings

G10 Probe Overview

1

G10 Component Ports Supported

e

eds

Sp

LPC200 (IIC200 1G 1G No
LPC200 (IIC200) 10G/1G 10G/1G No
LPC100 (IIC100) All 1G No
SRM200 10G 10G No
TRM100 10G 10G No
PRM300 ETH A-D 10G/1G/100M Yes
PRM200 ETH A-D 10G/1G/100M Yes
IAP320 ETH 1G/100M Yes
IAP200 ETH 1G/100M Yes
IAP100
SHMM MGMT 100M Yes

a

a. Not supported on Control Plane or Media probes.

ETH A, B 1G/100M Yes

Autonegotiation?

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TIME SYNCHRONIZATION

The GeoProbe G10 system time stamps all captured messages, generated alarms, and
events to a common time base, allowing the Iris system to provide detailed, network-wide
traces and event occurrence reporting. Inter-node timing and message paths can also be
analyzed throughout the network.

The G10 Probe supports NTP timing and IRIG timing as described in Table 1.1. G10 probe
timing is configured in IrisView OAM; r

Timing Support Description

ef

er to the Admin Online Help for details.

Table 1.1 - G10 Probe Timing

G10 Probe Overview

1

NTP Timing from Defined
NTP Servers

IRIG Timing from Master
G10

IRIG Timing from Third-

t

y Source

Par

G10 probes support multiple NTP servers, defined at the system­level; system admins c
G10 probes select the best available NTP server from the list an d use
it as their timing reference.

Customize NTP timing at the probe-level by adding or removing NTP

v

ers for a specific probe

ser
G10s support IRIG timing references to and between probes allowing

for greater monitoring ac
Support for the IRIG timing interface allows G10 probes to share
timing with other G10 probes and with 14U and 2U GeoProbes. A
G10 probe can operate as an IRIG master or an IRIG slave.

The G10 designated as the IRIG timin
have a valid timing reference such as NTP. The IRIG slaves use IRIG
timing reference from the IRIG master G10; however, the slave G10s
also require NTP timing reference for the time of day.

G10 probes support receiving IRIG timing from a third-party source,
such as GPS.

an define up to 11 servers for the Iris system.

curacy at facilities with multiple probes.

master to other probes must

g

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G10 MEDIA PROBE CONFIGURATION

To support RTP monitoring, Tektronix also provides a multiprobe configuration called the G10
Media Probe. The G10 Media probe consists of two G10 chassis with the supported
configurations listed in Table 1.3. See Figure 1.5 and Figure 1.6 for a graphical view of the
media probe configuration.

The IICs within a multiprobe configuration must be the same model, either IIC100 or
IIC200. You cannot install mix IIC100s and IIC200s within the same multiprobe
configuration.

Table 1.3 - G10 Media Probe Configurations

Chassis Supported Blades

Primary Chassis Slot 1 (Bottom) IAP200 + PRM200 RTM OR

Slot 2 (Top) IIC200 + SRM200 RTM OR

Expansion Chassis Slot 1 (Bottom) IIC200 + SRM200 RTM OR

G10 Probe Overview

IAP320 + PRM300 RTM

IIC100 + TRM100 RTM

IIC100 + TRM100 RTM

1

Slot 2 (Top) IIC200 + SRM200 RTM OR

IIC100 + TRM100 RTM

For details about the components of the media probe, refer to the appropriate sections in this
guide. For information about installing and cabling the media probe, refer to the G10 Media
Installation Guide.

Figure 1.5 shows the front view of the G10 media probe components (IIC200 version).

Figure 1.5 - G10 Media Probe Front

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G10 Probe Overview

Figure 1.6 shows the rear view of the G10 media probe components (IIC200 version).

1

Figure 1.6 - G10 Media Probe Rear

G10 CONTROL PLANE PROBE CONFIGURATION

The G10 Control Plane probe configuration is designed for handling additional contr ol-plane
capacity for one Mobility Management Entity (MME) or several pooled MMEs. This probe
supports capture of the protocols listed in Table 1.4.

Table 1.4 - Control Plane Probe Supported Protocols

VoIP Protocols LTE Protocols

 SIP
 MGCP
 H.323
 H.248
 DIAMETER
 DNS
 SIGTRAN

 S1AP (S1-MME)
 DIAMETER (S6a)
 GTPv2-C (S10, inter-MME)
 DNS
 SgsAP

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The G10 Control Plane probe consists of two G10 chassis with the supported configurations

listed in Table 1.5. Refer to Figure 1.7 and Figure 1.8 for a graphical view of the control plane
probe configuration.

Pr

Table 1.5 - G10 Control Plane

Chassis Supported Blades

Primary Chassis Slot 1 (Bottom) IAP200 + PRM200 RTM OR

obe Configurations

IAP320 + PRM300 RTM

G10 Probe Overview

1

Slot 2 (Top) IIC200 + SRM200 RTM OR

IIC100 + TRM100 RTM

Expansion Chassis Slot 1 (Bottom) IAP200 + PRM200 RTM OR

IAP320 + PRM300 RTM

Slot 2 (Top) IAP200 + PRM200 RTM OR

IAP320 + PRM300 RTM

a. The control plane probe only supports the IIC100/IAP200 configuration; the IIC100/IAP320

configuration is not supported.

For details about the components of the control plane

in this guide. For information about installing and cabling the control plane probe, refer to the

G10 Control Plane Installation Guide.

Figure 1.7 shows the front view of the G10 Control Plane probe components.

probe, refer to the appropriate sections

a

Figure 1.7 - G10 Control Plane Probe (Front)

G10 Hardware Maintenance Guide 7.13.2 20

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G10 Probe Overview

Figure 1.8 shows the rear view of the G10 Control Plane probe components.

1

Figure 1.8 - G10 Control Plane Probe (Rear)

G10 Hardware Maintenance Guide 7.13.2 21

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User Documentation

OVERVIEW

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Chassis Subsystem

The Chassis subsystem is a high-availability Advanced TCA that integrates cooling, power
distribution, and shelf management into an off-the-shelf platform, which allows you to add
GeoProbe G10 service-related hardware and software. The Chassis subsystem of the
GeoProbe G10 enables scalable reliability through the use of either independent or redundant
functions throughout the chassis. Most electronic modules, blades and cards are Field
Replaceable Units (FRUs).

The Chassis subsystem contains the

 Shelf Manager
 Power Entry Modules (PEMs)
 Fan Trays

G10 Hardware Maintenance Guide 7.13.2 22

following main hardware component

s:

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Shelf Manager Modules (SHmms)

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SHELF MANAGER

The Shelf Manager (SHmm) is the central management unit of the shelf and designed
specifically for the AdvancedTCA systems. Its purpose is to monitor, control and ensure
proper operation of the shelf and all other components of the Advance d TCA shelf. The shelf
manager reports anomalies and errors and takes corrective actions if required (for example,
increases the speed of the fans). Alarm states are displayed from the LEDs of the shelf’s
alarm panel. The shelf manager performs the following functions:

 Retrieve FRU inventory information
 Receive events from sensors of the shelf
 Monitor and control the temperature of the shelf
 Reports errors
 Execute corrective actions
 Manage interconnect resources to prevent damage of the blades due to hot swap

Chassis Subsystem

2

The shelf manager consists of two shelf manager modules (SHmms) located on the back of
the Ge

oProbe G10 (Figure 2.1).

Figure 2.1 - Shelf Manager Modules (SHmms)

The modules have an Ethernet port that connect to the Iris server for maintenance. The ports
are RJ4

5 jacks each capable of connecting to 10/100 Mbps networks. The modules provide
redundant shelf management functionality utilizing an active/ standby architecture and is
based on a proven shelf management design.

G10 Hardware Maintenance Guide 7.13.2 23

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Rev. 002-140228

Base Channel 1

Ethernet Management Link

Base
Channel 2

Ethernet
Management Activity

Hot Swap Indicator

ACT MGMT

OK

OOS

Ethernet
Management
Connector

Ethernet
Uplink
Connector

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Rear Panel LEDs

Figure 2.2 shows the SHmm LEDs on the rear of the G10.

Chassis Subsystem

2

Figure 2.2 - SHmm LEDs

Table 2.1 describes the SHmm LED indicators.

Table 2.1 - LED Indicators of the Shmm

LED LED Color Description

H/S BLUE Hot Swap Indicator. It indicates when it

is safe to

module.

 SOLID BLUE—The module is in standby mode and can be

safely extracted.

 OFF—The module is operational, and it is unsafe to

extract it.

 BLINKING—The module is in transition between standby

mode and operational mode.

Base Channel 1 GREEN Indicates the Ethernet connection to the chassis 1

 GREEN—The link to base channel 1 is available.

Ethernet
Mana

gement Link

GREEN Indicates system manager Ethernet link availability.

 BLINKING—Link and activity.
 OFF—Otherwise.

 GREEN—The link is available.

remove the

G backplane.

 OFF—Otherwise.

G10 Hardware Maintenance Guide 7.13.2 24

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Chassis Subsystem

Table 2.1 - LED Indicators of the Shmm (Continued)

2

LED LED Co

lor Description

Base Channel 2 GREEN Indicates the Ethernet connection to the chassis 1

 GREEN—The link to base channel 2 is available.
 BLINKING—Link and activity.
 OFF—Otherwise.

Ethernet
Mana

gement

Activity

AMBER Indicates system manager Ethernet link activity.

 AMBER—Activity.
 OFF—No activity.

ACT MGMT AMBER Indicates which Shmm is active.

 AMBER—The SHmm is active.
 OFF—The SHmm is in standby mode.

OK GREEN Indicates normal system functions.

 GREEN—The Shmm is operating properly.
 OFF—Otherwise.
 BLINKING—The board boots up.

OOS RED Indicates SHMM failure.

G backplane.

Rear Panel Connectors

Table 2.2 describes the connectors available on the SHmm (Figure 2.2).

LED/Connector Description

Ethernet Management This port provides 10/100 Mb connectivity to the customer LAN

Ethernet Uplink
Conne

ctor

 RED—The Shmm is out-of-service.
 OFF—The Shmm is operating properly.

Table 2.2 - Connectors of the Shmm

Operations, Administration, and M ain te na n ce (O AM ).

for
In some configurations, this is used to connect to the

management port on the disk enclosure.

G10 Hardware Maintenance Guide 7.13.2 25

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G10 Front View

G10 Rear View

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POWER ENTRY MODULES (PEMS)

The chassis includes two removable PEMs. The dual PEMs allow for two separate AC or DC

power feeds to the system. Both power feeds are fully distributed to every module and
subassembly within the chassis. Only one of the PEMs must be present for the chassis to be
fully operational.

The G10 supports both DC PEMs and AC PEMs. The PEMs are accessible from the front of

the shelf and connect to the PEM connectors on the
covers the power feeds and returns to prevent accidental shorting. The PEM also features an
injector/ejector handle that provides the hot swap mechanism for signaling the state of the
PEM prior to removal. The PEM is an Field Replaceable Unit (FRU).

Chassis Subsystem

backplane. A removable plastic housing

2

DC PEMs

The PEMs are hot-swappable and will not cause a fault
They operate in load sharing where the tota l load is equal to or le ss than what on e power feed
can provide.

Figure 2.3 shows the G10 DC PEMs front view and back view. Both A and B side power

modules operate within the specifications listed in Power and Ground Requirements. Refer to

Maintenance Guidelines for replacement details.

when one is removed for

replacement.

Figure 2.3 - DC PEMs

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Front Panel LEDs

Chassis Subsystem

Both A and B side power modules operate within the specifications listed in Power and

Ground Requirements. All probe power and chassis ground c

larger.

Tektronix equipment, cables, and wiring diagrams comply with industry standard DC
electrical color coding. Please ensure proper cabling if your equipment and cabling use
nonstandard DC electrical color coding. Improper cabling can cause damage to equipment
or personal injury. Contact Tektronix to request specially labeled power cables (-48V = Red,
Return = Black) for the G10 chassis and the storage enclosures.

Figure 2.4 displays the DC Front Panel PEM LEDs and the ON and OFF switch.

abling will use 12AWG cable or

2

Figure 2.4 - DC PEM Front Panel LEDs and ON/OFF Switch

Table 2.3 describes the DC PEM LED indicators.

Table 2.3 - DC PEM LED Indicators

LED LED Color Description

Line Power Reverse RED Indicates the connected power is reversed. Do not

swit

ch on the breaker while this LED is on.

Line Power In GREEN Indicates the power is connected properly.

Line Power Backplane GREEN Indicates the power module is sending power from the

ckp

lane.

ba

G10 Hardware Maintenance Guide 7.13.2 27

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G10 Front View

G10 Rear View

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AC PEMs

Chassis Subsystem

Figure 2.5 shows the G10 AC PEMs front view and rear view. Both A and B side power

modules operate within the specifications listed in Power and Ground Requirements. Refer to

Maintenance Guidelines for replacement details.

2

Figure 2.5 - G10 AC PEMs

Front Panel LEDs

Figure 2.6 displays the AC Front Panel PEM LED.

Figure 2.6 - AC PEM Front Panel LED

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Front Fan Tray

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FAN TRAYS

Chassis Subsystem

Table 2.3 displays the AC PEM LED indicators.

Table 2.4 - AC PEM LED Indicators

LED Color Description

OFF Power is disconnected.
RED Power supply is in a failed state.

GREEN The power is connected correctly.

The Chassis subsystem supports two fan trays in a push/pull configuration:

 One fan tray is accessible from the front of the chassis and contains the replaceable

air filter.

2

 The other fan tray is located in the rear of the chassis.

Figure 2.7 displays the front fan tray. Refer to Replacing the Fan Tray and Replacing G10

Chassis Air Filters for replacement details.

Figure 2.7 - Front Fan Tray

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Front ESD

Rear ESD

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ELECTRO-STATIC DISCHARGE POINTS

The Electro-Static Discharge (ESD) points are locations where you can plug an ESD wrist
strap to the chassis to prevent electrical dama ge w hen yo u ha nd le the bo a rd s. Figure 2.8
displays the front ESD point.

Chassis Subsystem

2

Figure 2.8 - Front ESD Point

Figure 2.9 displays the rear ESD point.

Figure 2.9 - Rear ESD Point

G10 Hardware Maintenance Guide 7.13.2 30

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