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P.O . Bo x 5 0 0
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USA
For product information, sales, service, and technical support:
n, OR 97077
In North America, call 1-800-833-9200.
Worldwide, visit www.tek.com to find contacts in your area.
Warranty
Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1)
year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its
option, either will repair the defective product without charge for parts and labor, or will provide a replacement
in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty
work may be n
the property of Tektronix.
ew or reconditioned to like new performance. All replaced parts, modules and products become
In order to o
the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible
for packaging and shipping the defective product to the service center designated by Tektronix, with shipping
charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within
the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping
charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
result
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage
or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has b een modified or
integrated with other products when the effect of such modification or integration increases the time or difficulty
of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY
OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY
IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
TRONIX' RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE
TEK
AND EXCLUSIVE REMEDY PR OVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL,
OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS
ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
[W2 – 15AUG04]
btain service under this warranty, Customer must notify Tektronix of the defect before the expiration of
ing from attempts by personnel other than Tektronix representatives to install, repair or service the product;
Table of Contents
Introduction to preventing Electrical Over Stress (EOS) and Electro-Static Discharge (ESD)............1
fying EOS damage .......................................................................................13
Ver i
EOS and ESD Prevention System for Sampling Modulesi
Table of Contents
List of Figure
Figure 1: Sampling module compartments in 8000 Series.......................... ...........................3
Figure 2: In
stalling a sampling module into a TDS, CSA, DSA oscilloscope. . ... . ... . ... .. . . ... .. .. ... . ...5
s
iiEOS and ESD Prevention System for Sampling Modules
Introduction to preventing Electrical Over Stress (EOS) and
Electro-Static Discharge (ESD)
Tektronix wants you to get the best possible value from your Tektronix sampling
module. Our research of customer test processes resulted in our design of the
EOS/ESD Protection System. This system helps customers maximize uptime of
their sampling modules. Customers who use the system have experienced up to an
80% reduct
system. The system removes the opportunity for operator error that may cause
EOS/ESD damages to the sampling head.
The large percent of sampling heads returned for repair have EOS/ESD damage.
Tektronix warranty and service agreement programs do not cover damages caused
by EOS/ESD. We highly recommend use of the EOS/ESD Protection System to
minimize EOS/ESD damage and to maximize your sampling module’s uptime.
ion is EOS/ESD induced failures since implementing our protection
Protection system
components
Table 1: EOS/ESD Protection System components
ItemQuantityDescription
80A021 or more based on need.
80A091 or more based on need.Protection device
The Protection System consists of either an 80A02 protection module or an 80A09
protection device. Both can then be used with a P8018 (single ended) or P80318
(differential) probe. Each P80318 requires one module or device.
Protection module (isolation module)
Link to datasheet for detailed information:
https://www.tek.com/datasheet/
80a02-eos-esd-isolation-module-dsa8300
nk to datasheet for detailed information:
Li
https://www.tek.com/datasheet/
80a09-26ghz-esd-protection-device-datasheet
EOS and ESD Prevention System for Sampling Modules1
Introduction to preventing Electrical Over Stress (EOS) and Electro-Static Discharge (ESD)
Table 1: EOS/ESD Protection System components (cont.)
ItemQuantityDescription
P80181 or more based on need.
P80318
P80318X
Based on your needs. Note
that the P80318X is a set of two
P80318 probes.
(Each differential probe requires
a separate protection module or
protection device.)
Single ended probe
Link to datasheet for detailed information:
https://www.tek.com/datasheet/
p8018-tdr-probe-datasheet
Differential probe
Link to datasheet for detailed information:
https://www.tek.com/datasheet/
p80318-p80318x-differential-impedance-tdr-probes
Affected modules
Terms
Support
ESD
EOS
This document applies to all Tektronix electrical and optical modules for sampling
oscilloscopes.
The following terms are used in this document:
ESD (electrostatic discharge) is the momentary discharge of electricity between
objects that are at different potentials. ESD can have amplitudes in hundreds or
even thousands of volts. A single ESD event can cause the sampling head to fail.
EOS (electrical overvoltage stress) occurs when an electro
nicdeviceissubjected
to a voltage level that is slightly higher than its designed limit. EOS damage can
occur at low voltage levels. EOS damage has a cumulative effect, and over time
causes the s ampling head to fail. Standard methods for preventing ESD are not
very effective against EO S damage.
Contact your Account Manager or visit the Support link at www.tek.com for
additional information.
2EOS and ESD Prevention System for Sampling Modules
Installation
Installation
Sampling modules fit into the front panel of TDS, C SA, DSA oscilloscopes. The
following figure shows the front panel of an instrument and the locations of the
sampling-mo
If you have a TSO820 instrument with optical modules, see the module installation
section in this document for information. (See page 5, Module Installation.)
dule compartments.
Electrostatic Discharge
Figure 1: Sampling module compartments in 8000 Series
At least one sampling module must be installed in an instrument to sample signals.
NOTE. Installing a large module in the left-most slot disables the left-most small
module compartment. Installing a large module in the right-most slot d isables the
small module compartment that is second from the left.
Each instrument supports four large-compartment channels, two per sampling
module, and eight small-compartment channels, two per sampling module. Eight
of the ten channels are usable at one time.
To prevent electrostatic damage to the main instrument and sampling modules,
follow the precautions described in this manual and the manuals that come with
your instrument/modules.
Circuitryinthesamplingmoduleisverysusceptible to damage from electrostatic
discharge or from overdrive signals. Be sure to only operate the sampling module
in a static-controlled environment. Be sure to discharge to ground any electrostatic
charge that may be present on the center and outer connectors of cables before
attaching the cable to the sampling module.
EOS and ESD Prevention System for Sampling Modules3
Installation
Know your signa
not depend on the signal source settings for protection, but instead use an external
attenuator that protects the input from the worst-case conditions. For example, for
a 20 V maximum source connected to a 3 V maximum sampling module, use a
10X attenuator. Where possible, connect your cables to the signal source first,
and to the sampling module second.
CAUTION. To
terminations on the sampling-module connectors before removing a sampling
module from an instrument or when it is not in use. Store the sampling module in
a static-free container, such as the shipping container. Whenever you move the
sampling module from one instrument to another, use a static-free container to
transport the sampling module.
To prevent damage to the sampling module, discharge to ground any electrostatic
charge that may be present on the center and outer conductors of cables before
ing the cable to the sampling module.
attach
To prevent damage to the sampling module, do not create an ESD antenna by
ng cables attached to the sampling-module input with the other end of the
leavi
cable open.
vent damage to the sampling module or instrument, never install or remove
To p re
a sampling module when the instrument is powered-on.
l source. If it is capable of delivering overvoltages, it is safer to
prevent damage from electrostatic discharge, install 50 Ω
Static Controlled
Workstation
ys use a grounded wrist strap (provided with your instrument) when handling
Alwa
sampling modules or making signal connections. Wear anti-static clothing and
work in a static-free workstation when using sampling modules.
Use a Tektronix 80A02 EOS/ESD Protection Module if doing TDR work.
prevent damage to the sampling module or instrument, do not apply a voltage
To
outside the Maximum Input Voltage for your sampling module.
or information on creating a static-controlled workstation, consult the
F
Electronic Industries Association document EIA-625; Requirements for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices.
You can use a Tektronix 80A02/80A09 EOS/ESD Protection Module to protect
the sampling module from damage due to static discharge from circuit boards and
cables. Use the 80A02/80A09 in applications where large static charges can be
stored on the device under test, such as when testing TDR circuit boards or cables.
Refer to the documentation supplied with the 80A02/80A09 modules for proper
installation and use.
4EOS and ESD Prevention System for Sampling Modules
Installation
Module Install
ation
CAUTION. To prevent damage to the sampling module or instrument, never install
or remove a sampling module when the instrument is powered on or when either
input connector is unprotected.
To install a sampling module for the TDS, CSA, DSA series oscilloscopes, first
turn off the instrument using the front-panel On/Standby switch. Then place the
sampling module in a compartment and slowly push it in with firm pressure. Once
the sampling module is seated, turn the hold-down screw on the sampling module
to tighten the sampling module into place. (See Figure 2.)
NOTE. Whe
and then use the sampling module ejector on the main instrument to eject the
sampling module.
n removing your sampling module, first loosen the hold-down screw,
Figure 2: Installing a sampling module into a TDS, CSA, DSA oscilloscope
If you are installing a TSO8C17 or TSO8C18 optical module into a TSO820
oscilloscope, see the 8 Series Sampling Oscilloscope Installation and SafetyInstructions or the 8 Series Sampling Oscilloscope and TSOVu Application Help
at www.tek.com/manuals for detailed installation instructions.
CAUTION. Do not hot swap TSO8C17 or TSO8C18 modules. Installing or
removing these modules into/from the TSO820 mainframe with the power on
will damage the modules. To avoid damage, turn off the power before installing
or removing a m odule.
EOS and ESD Prevention System for Sampling Modules5
Installation
Compensation
After installi
compartment to another, you should run compensation from the Utilities menu to
ensure the instrument meets it specifications. Also run a compensation (accessed
from the Utilities menu) when doing the following:
Installing an 80E00 sampling-module extender between the instrument and an
80E00 sampling module, where none was used before.
Removing an 80E00 sampling-module extender between the instrument and
an 80E00 sampling module, where one had been used before.
Exchanging an extender for one of a different length.
For instructions on running a compensation, see Optimizing MeasurementAccuracy in the Help for your main instrument.
ng a sampling module or after moving a sampling module from one
6EOS and ESD Prevention System for Sampling Modules
Connecting optical signals
Connecting op
tical signals
CAUTION. To prevent loss of optical power or damage to the optical connectors,
keep the connectors clean at all times. Check that all connectors, jumpers, and
protective caps are clean before connecting them to the module.
Do not drop an optical module, as doing so can cause damage and misalignment
of the photodiode optical assembly.
Optical modules use a universal connector interface (UCI) that allows use of
many standard fiber-optic female connector styles. Some of the standard UCI
interfaces supported a re FC, ST, SC, and DIN.
Attach the fiber optic cable with a suitable connectororaUCIInterfaceadapterto
the optical input receptacle as follows:
1. Line up the key with the slot in the UCI adapter before inserting.
2. Firmly press the cable connector or adapter into the UIC interface ferrule
until it reaches the stop.
CAUTION. Do not insert the connector into the UCI adapter at an angle. Do
not insert the connector and then rotate to line up the key with the slot. Either
on may damage the UCI adapter.
acti
4. Firmly tighten the cable connector or the adapter shell. Tighten with finger
ssure only.
pre
5. To remove, loosen the cable connector or adapter shell.
UTION. To avoid damaging the module optical input, maintain signal levels
CA
within optimal performance range, and avoid clipping, attenuate the input
optical signal to the Absolute Maximum Nondestructive Optical Input (peak)
specifications.
Optical sampling modules may have dynamic ranges exceeded without obvious
visual indication on the display because the overloaded photodetector signal
output may still be within the dynamic range of the internal electrical sampler.
EOS and ESD Prevention System for Sampling Modules7
Cleaning optical connectors
Cleaning opti
cal connectors
1. Obtain the fo
One compressed air can (Tektronix part number 118-1068-01).
A cleaning tool such as a FIS cassette cleaner (FI-6270), a FIS tape
dispenser cleaner (FI-7111), or an Optipop pipe cleaner (F1-6364).
Cleaning k
Connector Cleaner part number 020-2494-xx) are available from several
suppliers.
2. Loosen the UCI adapter and remove it. This exposes the male fiber end-face
behind the UCI connector.
3. Pull the pipe cleaner through the hollow female-to-female ferrule alignment
tube inside the UCI adapter. Then use the compressed air to clean the tube of
the UCI adapter.
CAUTION. Do not blow compressed air into the female input of the UCI adapter
when it is installed on the module.
4. Advance the fiber cleaning cassette or tape-dispenser cleaner to expose an
unused clean section of the lint-free, dry, cleaning surface.
llowing equipment:
its for optical connectors (such as the Tektronix Optical
5. Lightly drag the clean, dry, surface of the cleaning tool cloth against the male
end-face of the fiber input for a short distance (a centimeter or two).
6. Place the UCI adapter back on the cleaned fiber end-face on the module.
7. When the module does not have a fiber cable attached to its input(s), attach
the black dust-cap to prevent airborne contaminates from lodging in the
female optical input.
8. Clean any male fiber end-face input fiber cable or device that you attach to
the UCI input.
8EOS and ESD Prevention System for Sampling Modules
Failures, detection, and prevention
In order to achieve very high bandwidth performance in electronic circuits,
parasitic capacitance, inductance, as well as series resistances, need to be kept
to a minimum.
same philosophy with attention in every detail during design to ensure state
of the art bandwidth performances. To achieve low parasitics, it is essential
to minimize device dimensions and semiconductor junctions. Along with
those miniaturizations came an increased vulnerability to accidental out of
specification electrical stresses, such as EOS (electrical overvoltage stress) and
ESD (elec
Dominant failure mechanisms (EOS and ESD)
Historical experience in the ESD process has led to well established preventative
measures to control ESD damage to devices. These include, but are not limited to:
electrostatic safe workbench
Tektronix’s high bandwidth sampling modules adopted the
trostatic discharge).
Failures, detection, and prevention
EOS/ESD prevention
antistatic garment
grounding wristband
grounded footwear
ionized air shower
Device damage due to EOS, however, is seldom discussed and often overlooked.
Ignorance of this damage mechanism resulted in many sampling module failures
seen in production line test areas where ESD preventative measures were
rigorously followed.
EOS occurs where an electronic device is subjected to a voltage level higher than
its designed maximum limit. Unlike ESD, where hundreds or often thousands of
volts are involved, EOS damage can start at very low voltages. It is therefore
important to recognize where the EOS sources are and then find a way to interrupt
its damaging course.
EOS and ESD failure mechanisms can be involved at times. However, the
principle for prevention is relatively straightforward: electrically ground the
device under test (DUT) immediately prior to engaging a sensitive measuring
instrument, such as a sampling module, to the DUT.
For example, implementation of the following safeguards and procedure could
be done in a PCB impedance testing area to prevent static damages to the TDR
modules:
EOS and ESD Prevention System for Sampling Modules9
Failures, detection, and prevention
1. Place the TDR in
antistatic workbench (please contact a Tektronix Field Officeifyouneedhelp
to properly install an antistatic work environment).
2. Wear a grounded wrist strap and foot straps.
3. Wear onl y an
4. Keep a ground cap on the TDR module input terminal whenever it is not in
use.
5. Never hot plug/unplug a sampling module.
6. Momentarily ground the center conductor of the SMA cable before connecting
it to a TDR input.
7. Momentarily ground the center conductor of the TDR probe before connecting
it to the SMA cable attached to the TDR module.
8. Ground the probe tip or place the probe tip inside a grounded Faraday cage
when not probing any DUT, but the probe is still connected to a TDR module.
9. Avoid personnel movement in the vicinity of a TDR test station to minimize
the chance of induction charge transients.
10. Establish a momentary ground path to the DUT to fully discharge any
accumulated static charges immediately before connecting a live TDR probe
.
to it
strument and the PCB under test on only a properly grounded
tistatic gloves or none at all.
11. Do not swipe a live TDR probe across any isolated conductor unless that
face has been properly discharged.
sur
The above simple procedure, when rigorously followed, can ensure an EOS/ESD
mage free operation of the TDR modules for a long time.
da
Experience in customer production lines told us that due to human errors,
S/ESD damages to sampling modules in the areas where the above procedures
EO
are “followed” can still happen and often at an alarmingly high level. This is
because the EOS damages are cumulative and any a ccidental out of process
mistakes are faithfully “experienced and recorded” by the TDR module’s sensitive
input circuit. As those incremental damages accumulate, increased measurement
errors r esult.
10EOS and ESD Prevention System for Sampling Modules
Failures, detection, and prevention
EOS/ESD prote
ction for the system
To assist our production line customers in resolving these hard-to-avoid
human errors causing EOS/ESD failures, Tektronix designed and marketed
this integra
protection module and TDR probe seamlessly blends in a DUT discharging
cycle just prior to the TDR module engagement to the DUT, without operator
conscious intervention; like the foot switch systems (such as SIU800) do. The
system also included a reference impedance line section along with a much
improved net bandwidth (better impedance variation resolving power). Initial test
of the pre
demonstrated excellent results. TDR failures due to static damages are essentially
eliminated. Before the deployment of the prevention system, that customer had
recorded over 100 failure incidences over the prior 12 months. After system
deployment, reduced impedance testing down time and tremendous cost savings
resulted for both the customer and Tektronix.
To assist production line customers who need high bandwidth differential TBS
hand probes, Tektronix has introduced the P80318 18 GHz adjustable pitch, 100 Ω
diffe
ted, intuitive EOS/ESD prevention system. The combination of the
vention system on the production floor of a major PCB m anufacturer has
rential TDR hand probes that work with the protection module/device.
EOS and ESD Prevention System for Sampling Modules11
Failures, detection, and prevention
Detecting blown inputs
High bandwidth sampling modules are vulnerable to damage through ESD and
EOS to the input due to their technology. Damage can occur instantaneously.
Under most conditions, when EOS damage occurs the trace will be flat. It
typically involves short period, high current discharge. Large offset or no response
to input ind
To check for damage of an 80E00 series sampling module if your instrument has
TDR capabi
module, use a similar procedure as shown below, but use an external step source.
The Tektronix part number 067-1338-00 is recommended.
1. Attach a 50 Ω termination to the channel input and perform a TDR
2. Adjust the HORIZONTAL SCALE to 500 ns per division. This should display
icates a blown diode.
lity, use the following procedure. If checking a non-TDR sampling
measurement of the attached fitting.
theTDRstepfromedgetoedge. Displaythesteptopat40mρ per division
and check for flatness. If the top is bowed, sagged, hooked, or tilted, assume
static has damaged the module and service is required. See following image.
12EOS and ESD Prevention System for Sampling Modules
Failures, detection, and prevention
Verifying EOS
damage
The following procedure can be used to identify heads that have EOS damage.
If the waveform top is bowed, sagged, hooked, or tilted, assume static has
damaged the module and service is required. Figure 1 shows a typical waveform
signature indicating EOS damage. Also be aware that EOS can be cumulative; that
is, every ti
until there is even greater damage, as shown in the following figures. In this
example, the percentage of overshoot is increased.
If checking for damage of an 80E04 sampling module and your instrument has
TDR capability, us the following procedure. If checking a non-TDR sampling
module, use a similar procedure as shown below, but use an external step source.
The Tektronix part number 067-1338-00 is recommended.
1. Attach a 50 Ω termination to the channel input.
2. Select the TDR channel to turn it on.
3. Press the TDR preset.
4. Perfo
5. Adjust the HORIZONTAL SCALE to 2 μs per division. The vertical setting
me an EOS event occurs during testing, EOS damage can accumulate
rm a TDR measurement.
ld be 200 mρ, as shown in the illustrations. This should display the entire
shou
TDR step from edge to edge. Display the step top at 40 mρ per division and
check for flatness. The top of the waveform should be flat.
EOS and ESD Prevention System for Sampling Modules13
Failures, detection, and prevention
14EOS and ESD Prevention System for Sampling Modules
Index
Symbols and Numbers
80A02, 1
80A09, 1
A
Affected
affected, 2
C
Cleaning optical connectors, 8
Compens
Components of system, 1
Connecting optical signals, 7