Tektronix DSA8200 Service

Service Manual
DSA8200 Digital Serial Analyzer and Modules
071-2049-02
Warning
The servicing instructions are for use by qualified personnel only. To avoid personal injury, do not perform any servicing unless you are qualified to do so. Refer to all safety summaries prior to performing service.
www.tektronix.com
Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes that in all previously published material. Specifications and price change privileges reserved.
TEKTRONIX and TEK are registered tradem arks of Tektronix, Inc.
Contacting Tektronix
Tektronix, Inc. 14200 SW Karl Braun Drive P.O. Box 500 Beaverton, OR 97077 USA
For product information, sales, service, and technical support:
H In North America, call 1-800-833-9200.
H Worldwide, visit www.tektronix.com to find contacts in your area.
Warranty 2
Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be new or reconditioned to like new performance. All replaced pa rts, modules and products become the property of Tektronix.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than Tektronix representative s to install, re pair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A P ARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REP AIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Table of Contents

Operating Information
General Safety Summary xi...................................
Service Safety Summary xv....................................
Preface xvii...................................................
Manual Structure xvii................................................
Manual Conventions xvii..............................................
Related Documentation xviii...........................................
Installation 1--1...............................................
Check the Environmental Requirements 1--1..............................
Site Considerations 1--1...........................................
Operating Requirements 1--1.......................................
Rackmount Requirements 1--1......................................
Install the Sampling Modules 1--2.......................................
Check Your Sampling Module Manual(s) 1--2..........................
Maximum Configuration 1--3.......................................
Connect the Peripherals 1--3...........................................
Power On the Instrument 1--5..........................................
Powering Off the Instrument 1--6.......................................
Software Installation 1--7..............................................
Description 1--7.................................................
Software Release Notes 1--7........................................
Operating System Reinstallation 1--7.................................
System Hard Drive Rebuild 1--8....................................
System Diagnostics 1--8...........................................
Windows Safe Mode 1--8..........................................
Theory of Operation
Logic Conventions 2--1...............................................
Mainframe Overview 2--1.............................................
Input Signal Path 2--1.............................................
Display Panel 2--2................................................
Front Panel 2--2..................................................
Rear Panel 2--2..................................................
Low Voltage Power Supply 2--2.....................................
Fans 2--3.......................................................
Electrical Sampling Modules Overview 2--3..............................
80E01, 80E02, 80E03, 80E06, 80E07, and 80E09 Sampling Modules 2--3...
80E04, 80E08, and 80E10 TDR/Sampling Modules 2--4.................
Optical Sampling Modules Overview 2--5................................
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Table of Contents
80C01 Optical Sampling Module 2--7................................
80C02 Optical Sampling Module 2--7................................
80C03 Optical Sampling Module 2--8................................
80C04 Optical Sampling Module 2--8................................
80C05 Optical Sampling Module 2--9................................
80C06 Optical Sampling Module 2--9................................
80C07 Optical Sampling Module 2--9................................
80C07B Optical Sampling Module 2--10...............................
80C08 Optical Sampling Module 2--10................................
80C08B Optical Sampling Module 2--10...............................
80C08C Optical Sampling Module 2--11...............................
80C09 Optical Sampling Module 2--11................................
80C10 Optical Sampling Module 2--11................................
80C10B Optical Sampling Module 2--12...............................
80C11 Optical Sampling Module 2--12................................
80C12 Optical Sampling Module 2--12................................
80A01 Trigger Prescale Preamplifier Module 2--13..........................
80A02 EOS/ESD Protection Module 2--13.................................
80A05 Electrical Clock Recovery Module 2--14............................
80A06 PatternSync Trigger Module 2--14.................................
82A04 Phase Reference Module 2--15....................................
Adjustment Procedures
Maintenance
Adjustment Interval 3--1..............................................
Adjustment Environment 3--1..........................................
Adjustment After Repair 3--1..........................................
Required Equipment 3--2..............................................
Instrumentation Setup 3--2.............................................
Main Instrument Adjustments 3--3......................................
DC Calibrator Adjust 3--3..........................................
DC Calibrator Adjust Verification 3 -- 4...............................
Internal 10 MHz Adjust 3--5........................................
Preventing ESD 4--1.................................................
Inspection and Cleaning 4--2...........................................
General Care 4--2................................................
Flat Panel Display Cleaning 4--2....................................
Exterior 4--3....................................................
Interior 4--4.....................................................
Removal and Installation Procedures 4--7.........................
Preparation 4--7.....................................................
Procedures for External Modules 4--9....................................
Line Fuses and AC power cord connector 4--9.........................
Front-Panel Knobs 4--11............................................
Trim and Carrying Handle 4--12.....................................
Bottom Cover 4--14...............................................
Left and Right Covers 4--16.........................................
Procedures for Modules 4--22...........................................
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Table of Contents
Front Panel Assembly 4--23.........................................
Front Panel Board 4--25............................................
Front Panel Keypad 4--26...........................................
Display Assembly 4-- 27............................................
Display Adapter Board 4--29........................................
Standby/On Switch Flex Circuit Removal 4--31.........................
USB Assembly 4--33..............................................
Hard Disk Drive 4--34.............................................
CD-RW/DVD Drive 4--36..........................................
CD-RW/DVD and Hard Disk Drive Mounting Frame 4--38...............
ATX Board Assembly 4--40.........................................
ATX Board 4--42..................................................
Microprocessor 4--44..............................................
Front and Rear Power Distribution Boards 4--46.........................
PC Processor Board 4--47...........................................
Fan Assembly Removal 4--49........................................
Low-Voltage Power Supply 4--50.....................................
Acquisition Assembly 4--52.........................................
Large Module Interface Circuit Board 4--56............................
Module Slot Doors 4--57...........................................
Electrical Modules 4--66............................................
Exchanging the Electrical Sampling Module 4--67..........................
Replacing the sampling module chassis 4--67...........................
Reinstalling exchange module serial number 4--67.......................
Optical Modules 4--68.............................................
80A00 and 82A00 Series Modules 4--69...............................
Troubleshooting 4--71...........................................
Check for Common Problems 4--71......................................
Equipment Required 4--74..............................................
Isolating Failures between the 80E0X/80C0X Modules or the Mainframe 4--74...
Isolating to a Board if Power Will Not Come Up 4--75....................
Checking the Power Supply Voltages 4--76...............................
If the instrument Will Not Boot 4--77.................................
Booting Into Windows 4--78.........................................
PPC and ATX PC Diagnostics 4--78......................................
Power-On Diagnostics 4--78.........................................
Instrument Diagnostics 4--78........................................
Firmware Updates 4--78................................................
After Repair 4--79....................................................
Installing the Instrument Model and Serial Number 4--79.....................
Repackaging Instructions 4--81...................................
Packaging 4--81......................................................
Shipping to the Service Center 4--81......................................
Diagrams
Symbols 5--1.......................................................
DSA8200 Block Diagram 5--2..........................................
Electrical Sampling Modules Block Diagram 5--3..........................
Optical Sampling Modules Block Diagrams 5--4...........................
80A01 Block Diagram 5--26............................................
80A02 Block Diagram 5--27............................................
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Table of Contents
Replaceable Parts
80A05 Block Diagram 5--28............................................
80A06 Block Diagram 5--29............................................
82A04 Block Diagram 5--30............................................
Replaceable Parts List 6-- 1......................................
Parts Ordering Information 6-- 1.........................................
Module Servicing 6--1............................................
Using the Replaceable Parts List 6--2....................................
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DSA8200 Digital Serial Analyzer and Modules

List of Figures

Table of Contents
Figure 1--1: Compartments for sampling modules 1--2...............
Figure 1--2: Locations of peripheral connectors on rear panel 1--4.....
Figure 1--3: Line fuse and power cord connector locations,
rear panel 1-- 5.............................................
Figure 1-- 4: On/Standby switch location 1--6.......................
Figure 3-- 1: Adjustment setup using the DMM 3-- 3..................
Figure 3-- 2: Adjustment setup using the signal generator 3-- 5.........
Figure 4--1: Line fuses and line cord removal 4--10...................
Figure 4--2: Knob removal 4--11..................................
Figure 4--3: Trim removal 4--13...................................
Figure 4--4: Bottom cover removal 4--15............................
Figure 4--5: Cover removal 4--17..................................
Figure 4--6: Cover removal 4--18..................................
Figure 4--7: External modules 4--19................................
Figure 4-- 8: Internal modules 4-- 20................................
Figure 4-- 9: Acquisition modules 4-- 21.............................
Figure 4--10: Front panel assembly removal 4--24....................
Figure 4--11: J1 flex cable connector removal 4--25...................
Figure 4--12: Front panel board and keyboard removal 4--27..........
Figure 4--13: Display removal 4--28................................
Figure 4--14: Touch panel and LCD assembly removal 4--29...........
Figure 4--15: Display adaptor board removal 4--30...................
Figure 4--16: Connector clip assembly 4--31.........................
Figure 4-- 17: Standby/On switch flex circuit removal 4--32............
Figure 4--18: USB assembly removal 4--33..........................
Figure 4--19: Hard drive disk removal 4--35.........................
Figure 4--20: Removing the hard disk drive from the cartridge 4--36....
Figure 4--21: CD--RW/DVD disk drive removal 4--37.................
Figure 4--22: Removing the CD-RW/DVD drive
from the mounting frame 4--38................................
Figure 4--23: Hard drive and CD-RW/DVD drive
mounting frame removal 4--39................................
Figure 4--24: ATX assembly removal 4--41..........................
Figure 4--25: ATX board removal 4--43.............................
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Table of Contents
Figure 4--26: Microprocessor removal 4--45.........................
Figure 4--27: Front and rear power distribution board removal 4--46...
Figure 4--28: Processor board removal 4--48........................
Figure 4--29: Fan assembly removal 4--50...........................
Figure 4-- 30: Low-voltage power supply removal 4--51................
Figure 4--31: T-10 screws and threaded posts 4--53...................
Figure 4--32: Thermal cover removal 4--54..........................
Figure 4--33: Acquisition circuit board assembly removal 4--55.........
Figure 4--34: Large module interface circuit board removal 4--57.......
Figure 4--35: Small and large module chassis removal 4--59...........
Figure 4--36: Module door spring removal 4--61.....................
Figure 4--37: Module slot door removal 4--62........................
Figure 4--38: Module ejector handles removal 4--64..................
Figure 4--39: Spring arm position 4--65............................
Figure 4--40: Sample of electrical module hardware removal 4--66......
Figure 4--41: Optical module cover removal 4--68....................
Figure 4--42: 80A00 and 82A00 series parts removal
(80A01 shown) 4--69.........................................
Figure 4--43: Location of power-on and over current LEDs 4--75.......
Figure 4--44: Location of debug pins 4--76..........................
Figure 4--45: Connectors P1 and P2 4--77...........................
Figure 5--1: Block diagram for the DSA8200 5--2...................
Figure 5--2: Block diagram for the 80E00 Series
Electrical Sampling Modules 5--3.............................
Figure 5--3: 80C01 Optical sampling block diagram 5--4.............
Figure 5--4: 80C01 Optical sampling with
clock recovery block diagram 5--5............................
Figure 5--5: 80C02 Optical sampling block diagram 5--6.............
Figure 5--6: 80C02 Optical sampling with
clock recovery block diagram 5--7............................
Figure 5--7: 80C03 Optical sampling block diagram 5--8.............
Figure 5--8: 80C03 Optical sampling with
clock recovery block diagram 5--9............................
Figure 5--9: 80C04 Optical sampling block diagram 5--10.............
Figure 5--10: 80C04 Optical sampling block diagram
with clock recovery 5--11.....................................
Figure 5--11: 80C05 Optical sampling block diagram 5--12............
Figure 5--12: 80C06 Optical sampling block diagram 5--13............
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DSA8200 Digital Serial Analyzer and Modules
Table of Contents
Figure 5--13: 80C07 and 80C07B Optical
sampling block diagram 5--14.................................
Figure 5--14: 80C07 and 80C07B Optical sampling
with CR1 clock recovery block diagram 5--15....................
Figure 5--15: 80C08/80C08B/80C08C Optical
sampling block diagram 5--16.................................
Figure 5--16: 80C08/80C08B/80C08C Optical sampling
with CR1, CR2, & CR4 clock recovery block diagram 5--17........
Figure 5--17: 80C09 Optical sampling block diagram 5--18............
Figure 5--18: 80C09 Optical sampling with CR1
clock recovery block diagram 5--19............................
Figure 5--19: 80C10 and 80C10B Optical sampling block diagram 5--20.
Figure 5--20: 80C11 Optical sampling block diagram 5--21............
Figure 5--21: 80C11 Optical sampling with
CR1 clock recovery option block diagram 5--22..................
Figure 5--22: 80C11 Optical sampling with
CR2 and CR3 clock recovery option block diagram 5--23..........
Figure 5--23: 80C11 Optical sampling with
CR4 clock recovery option block diagram 5--24..................
Figure 5--24: 80C12 Optical sampling block diagram 5--25............
Figure 5--25: 80A01 block diagram 5--26...........................
Figure 5--26: 80A02 block diagram 5--27...........................
Figure 5--27: 80A05 block diagram 5--28...........................
Figure 5--28: 80A06 block diagram 5--29...........................
Figure 5--29: 82A04 block diagram 5--30...........................
Figure 6--1: External parts 6--4..................................
Figure 6--2: Drives 6--6.........................................
Figure 6-- 3: Front panel and processors 6--9.......................
Figure 6--4: ATX 6--11...........................................
Figure 6-- 5: Power supply 6--13...................................
Figure 6--6: Acquisition 6--15.....................................
Figure 6--7: Coaxial cables 6--17..................................
Figure 6--8: 80E01, 80E02, 80E03, and 80E04 modules 6--19...........
Figure 6--9: 80E05 module (Option 10G shown) 6--20................
Figure 6--10: 80E06 module 6--21.................................
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Table of Contents
Figure 6--11: 80E07, 80E08, 80E09, and 80E10 modules 6--22..........
Figure 6--12: Optical modules 6--23................................
Figure 6--13: 80A01 module 6--24.................................
Figure 6--14: 82A04 module 6--25.................................
Figure 6--15: 80A06 module 6--27.................................
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DSA8200 Digital Serial Analyzer and Modules

List of Tables

Table of Contents
Table 1--1: Additional accessory connection information 1--3.........
Table 1--2: Line fuses 1-- 5......................................
T able 2--1: Electrical sampling module features 2--3................
Table 2--2: TDR sampling module features 2-- 4....................
T able 2--3: Module optical/electrical split 2--6......................
Table 3--1: Adjustments required for module replaced 3--1...........
Table 3--2: Required equipment and materials 3--2.................
T able 4--1: External inspection check list 4--3......................
T able 4--2: Internal inspection check list 4--4......................
Table 4--3: Tools required for module removal 4--8.................
Table 4--4: Failure symptoms and possible causes 4--71...............
Table 4--5: Power supply voltages 4--77............................
Table 4--6: Action required for module replaced 4--79................
DSA8200 Digital Serial Analyzer and Modules
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Table of Contents
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DSA8200 Digital Serial Analyzer and Modules

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it.
To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the system.
ToAvoidFireor
Personal Injury
Use Proper Power Cord. Use only the power cord specified for this product and certified for the country of use. Power cord needed only in the mainframe, not modules.
Connect and Disconnect Properly. Do not connect or disconnect probes or test leads while they are connected to a voltage source.
Ground the Product. The mainframe is grounded through the grounding conductor of the power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.
Ground the Product. The modules are indirectly grounded through the grounding conductor of the mainframe power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product.
The inputs are not rated for connection to mains or Category II, III, or IV circuits.
Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal.
Power Disconnect. The power switch disconnects the product from the power source. See instructions for the location. Do not block the power switch; it must remain accessible to the user at all times.
Do Not Operate Without Covers. Do not operate this product with covers or panels removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
DSA8200 Digital Serial Analyzer and Modules
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General Safety Summary
Avoid Exposed Circuitry. Do not touch exposed connections and components when power is present.
Wear Eye Protection. Wear eye protection if exposure to high-intensity rays or laser radiation exists.
Do Not Operate With Suspected Failures. If you suspect there is damage to this product, have it inspected by qualified service personnel.
Do Not Operate in Wet/Damp Conditions.
Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Symbols and Terms
Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.
Terms on the Product. These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the marking.
WARNING indicates an injury hazard not immediately accessible as you read the marking.
CAUTION indicates a hazard to property including the product.
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DSA8200 Digital Serial Analyzer and Modules
General Safety Summary
Symbols on the Product. The following symbols may appear on the product:
CAUTION
Refer to Manual
Chassis Ground
WARNING
High Voltage
Mains Disconnected
OFF (Power)
Protective Ground
(Earth) Terminal
Mains Connected
ON (Power)
Earth Terminal
Standby
DSA8200 Digital Serial Analyzer and Modules
xiii
General Safety Summary
xiv
DSA8200 Digital Serial Analyzer and Modules

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this product unless another person capable of rendering first aid and resuscitation is present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
DSA8200 Digital Serial Analyzer and Modules
xv
Service Safety Summary
xvi
DSA8200 Digital Serial Analyzer and Modules

Preface

Manual Structure

This is the service manual for the DSA8200 Digital Serial Analyzer and the modules that install in the instrument (except for the 80A03 module).
NOTE. The 80A03 instruction manual contains its own specifications and servicing information.
Read this preface to learn how this manual is structured, what conventions it uses, and where you can find other information related to servicing this product. Read the Introduction following this preface for safety and other important background information needed before servicing this product.
This manual is divided into chapters, which are made up of related subordinate topics. These topics can be cross referenced as sections.
Be sure to read the introductions to all procedures. These introductions provide important information needed to do the service correctly, safely, and efficiently.

Manual Conventions

Modules
Replaceable Parts
Safety
This manual uses certain conventions that you should become familiar with before attempting service.
Throughout this manual, the term module appears. A module is composed of electrical and mechanical assemblies, circuit cards, interconnecting cables, and a user-accessible front panel. References to a module are different than references to products such as “Sampling modules”, “Phase Reference modules”, or “Accessory modules”, which are products installed in the instrument compart­ments.
This manual refers to any field-replaceable assembly or mechanical part by its name or generically as a replaceable part. In general, a replaceable part is any circuit board or assembly, such as a hard disk drive, or a mechanical part, such as I/O port connectors, that is listed in the replaceable parts list of Chapter 8.
Symbols and terms related to safety appear in the General Safety Summary found at the beginning of this manual.
DSA8200 Digital Serial Analyzer and Modules
xvii
Preface

Related Documentation

The following documents relate to the instruments this service manual supports:
H DSA8200 Quick Start User manual. Tektronix part number 071-2047-XX.
This document also contains specification changes when using the 82A04 Phase Reference module.
H DSA8200 Specifications and Performance Verification manual. Tektronix
part number 071-2048-XX.
H DSA8200 Online Help. Installed with the application software and accessed
from the instrument Help menu.
H DSA8200 Programmer Guide. An online document accessed from the
instrument Help menu. It is also provided on the DSA8200 Product
Documentation CD.
H 80E01, 80E02, 80E03, 80E04, and 80E06 Electrical Sampling Modules
User manual. Tektronix part number 071-0434-XX.
H 80E07, 80E08, 80E09, and 80E10 Electrical Sampling Remote Modules
User manual. Tektronix part number 071-2038--XX.
H 80C00 Series Optical Sampling Modules User manual. Tektronix part
number 071-0435-XX.
H 80A01 Trigger Prescale Limiting Preamplifier Module User manual.
Tektronix part number 071-0873-XX.
H 80A02 EOS/ESD Protection Module Instructions. Tektronix part number
071-1317-XX
H 80A03 TekConnect Probe Interface Module Instructions. Tektronix part
number 071-1298-XX.
H 80A05 Electrical Clock Recovery Module User manual. Tektronix part
number 071-1467-XX.
H 80A06 PatternSync Trigger Module Instructions. Tektronix part number
071-xxx-XX.
H DSA8200, TDS8200, TDS8000, TDS8000B, CSA8200, CSA8000, and
CSA8000B Rackmount Kit Instructions. Tektronix part number
071-0696-XX.
H TDR Z-Meas Application Online Help. Ships with this product on a separate
CD. Provides information about this TDR Impedance Measuring application that implements the TDR calibration procedures specified by the IPC TM-650 test method.
xviii
H Fast NRZ Application Online Help. Ships with this product on a separate
CD. Provides information about this application that improves throughput for optical eye-pattern mask testing.
DSA8200 Digital Serial Analyzer and Modules
Operating Information

Installation

This section covers installation of the instrument, addressing the following topics:
H Check the Environment Requirements on page 1--1
H Install the Sampling Modules on page 1--2
H Connect the Peripherals on page 1--3
H Power On the Instrument on page 1--5
H Powering Off the Instrument on page 1--6
The basic operating software is already installed on the hard disk. If reinstalla­tion of software becomes needed, see the following topic:
H Software Installation on page 1--7

Check the Environmental Requirements

Site Considerations
Operating Requirements
Rackmount Requirements
Read this section before attempting any installation procedures. This section describes site considerations, power requirements, and ground connections for your instrument.
The instrument is designed to operate on a bench or on a cart in the normal position (on the bottom feet). For proper cooling, at least two inches (5.1 cm) of clearance is recommended on the sides of the instrument.
You can also operate the instrument while it rests on its rear feet. Make sure that you properly route any cables coming out of the rear of the instrument to avoid damaging them.
CAUTION. Keep the bottom of the instrument clear of obstructions to ensure proper cooling.
Specifications in chapter 1 list the operating requirements for the instrument.
Power source and temperature, humidity, and altitude are listed.
Rackmount instructions are provided with the Option 1R rackmount kit. For additional information about rackmounted instruments and site considerations or
DSA8200 Digital Serial Analyzer and Modules
1- 1
Installation
operating requirements, see the DSA8200, TDS8200, TDS8000, TDS8000B, CSA8200, CSA8000, and CSA8000B Rackmount Installation Kit Instructions.

Install the Sampling Modules

WARNING. Do not install or remove any sampling modules while the instrument is powered on. Electrical shock may occur. Always power the instrument down before attempting to remove or insert any sampling module to avoid potential injury from shock.
CAUTION. Sampling modules are inherently vulnerable to static damage. Always observe static-safe procedures and cautions as outlined in your sampling module user manual.
Check Your Sampling
Module Manual(s)
Large-module compartments (2)
Small-module compartments (4)
Connect ESD wrist strap here
Read the sampling-module user manual for instructions on how to install your sampling modules.
NOTE. After first installing a sampling module(s) or after moving a sampling module from one compartment to another, you should run compensation from the Utilities menu to ensure the instrument meets its accuracy specifications. You must run a compensation (accessed from the Utilities menu) whenever the extender configuration is changed from that present at the last compensation. In short, if you install or remove an 80E00 extender, run a compensation. If you exchange an extender for one of a different length, run a compensation.
Figure 1--1 shows compartments for both large and small sampling modules, along with the plug-in connector for the ESD wrist strap that you must use to install and remove these modules.
1- 2
Figure 1- 1: Compartments for sampling modules
DSA8200 Digital Serial Analyzer and Modules
Installation
Maximum Configuration
You can install up to two large sampling modules and four small modules for a maximum of 12 inputs. Of these inputs, only eight inputs can be active at one time. Also, note that installing a large module may disable a small-module compartment. Refer to the DSA8200 Quick Start user manual for compartment interaction.
Install probes, cables, and other connection accessories to your sampling modules as appropriate for your application and sampling module. Again, consult your sampling-module and connection-accessory manuals. Continue with the next section after installing the sampling modules.

Connect the Peripherals

The peripheral connections are mostly the same as those you would make on a personal computer. The connection points are shown in Figure 1--2. See Table 1--1 on page 1--3 for additional connection information.
NOTE. Before installing peripheral accessories to connectors (mouse, keyboard, etc.), power down the instrument. See Powering Off the Instrument on page .
Table 1- 1: Additional accessory connection information
Item Description
Monitor If you use a non-standard monitor, you may need to change the the
Windows display settings to achieve the proper resolution for your monitor.
Printer Connect the printer to the EPP (enhanced parallel port) connect or directly. If
your printer has a DB-25 connector, use the adapt er cable that came with your printer to connect to the EPP connector.
Rackmount Refer to the DSA8200, TDS8200, TDS8000, TDS8000B, CSA8200,
CSA8000, and CSA8000B Rackmount Installation Kit Instructions for information on installing the rackmount kit.
Other Refer to the Application release notes (readme.txt) in the C:\Program
Files\DSA8200\System directory of the instrument for possible additional accessory installation information not covered in t his manual.
DSA8200 Digital Serial Analyzer and Modules
1- 3
Installation
Description Icon/Label Locations
PS2 mouse
PS2 keyboard
RS-232............................
Printer..............................
Monitor.............................
USB.................................
Network...........................
Audio line in....................
Audio line out..................
Audio line out..................
Monitor............................
GPIB................................
1,2
.................
1,2
............
Gated trigger..................
1
Product ships with a USB keyboard that plugs into the USB port, and a USB mouse that plugs into the back of the keyboard.
2
Some instruments ship with the keyboard and mouse ports reversed.
Figure 1- 2: Locations of peripheral connectors on rear panel
1- 4
DSA8200 Digital Serial Analyzer and Modules

Power On the Instrument

Follow these steps to power on the instrument for the first time.
1. Check that the line fuses are correct for your application. Both fuses must be
Table 1- 2: Line fuses
Fuse type Rating Fuse part number
0.25 x 1.250 inch 8 A, fast blow, 250 V 159-0046-00 200-2264-00
5x20mm 6.3 A, fast blow, 250 V 159-0381-00 200-2265-00
Installation
the same rating and type. Fuse types require a unique cap and fuseholder. See
Table 1--2 and Figure 1--3.
Cap & fuseholder part number
Fuses AC powerPower switch
Figure 1- 3: Line fuse and power cord connector locations, rear panel
CAUTION. Connect accessories (such as a PS2 keyboard and mouse, and other accessories) before applying power to the product. Some accessories can be damaged if connecting or disconnecting with the instrument power on.
USB devices can be plugged or unplugged without first turning power off.
2. Connect the keyboard and mouse, observing the caution above.
NOTE. Connection of the keyboard and mouse is optional. You can operate most features without them, using the front-panel controls and the touchscreen.
3. Connect the power cord.
4. Turn the Power switch on at the rear panel. (See Figure 1--3 on page 1--5 for
switch location.)
5. Push the On/Standby switch to power on the instrument (see Figure 1--4 for
the switch location).
DSA8200 Digital Serial Analyzer and Modules
1- 5
Installation
Switch
Figure 1- 4: On/Standby switch location
6. Wait for the boot routine and low-level self test to complete.
7. Follow any instructions on the screen.
The internal setup software will automatically configure your instrument and install all required devices, depending on the installed accessories.

Powering Off the Instrument

The instrument has a built-in soft power-down function that safely powers down the instrument when you push the On/Standby button. You do not need to close the UI application or Windows before using the On/Standby button.
To completely remove power to the instrument, first soft power-down the instrument using the On/Standby button, and then set the power switch on the rear panel to off.
You can restore the UI application to the screen by clicking its button in the Windows Task bar.
1- 6
DSA8200 Digital Serial Analyzer and Modules

Software Installation

Installation
This section describes how to install the system software found on the DSA8200 Windows XP OS Restore CD that accompanies this product. The instrument ships with the product software installed, so only perform these procedures if
reinstallation becomes necessary.
Description
Software Release Notes
The product software comprises two parts:
H Microsoft Windows. The Microsoft Windows operating system comes
preinstalled on the instrument. Microsoft Windows is the operating system
on which the user-interface application of this product runs. The CD-
ROM(s) included with your instrument contain the Windows operating
system, which can be used to rebuild the instrument hard drive.
If you need to reinstall Windows, you may be able to do so without
rebuilding the instrument hard drive. See Operating System Reinstallation on
page 1--7 for more information.
H User Interface (UI) Application. The UI application complements the
hardware controls of the front panel, allowing complete set up of all
instrument features. The CD-ROM(s) included with your instrument contain
the UI application for reinstallation if rebuilding the hard drive.
Tektronix provides updates to the user interface application on a regular
basis. Updates can be obtained by visiting the Tektronix Web site at
www.tektronix.com.
Read the software release notes in the Release Notes file (or Readme file for earlier versions), if present, on the CD-ROM containing the user interface application before performing any installation procedures. This file contains additional installation and operation information that supercedes other product documentation.
After installation, you can also read the copy from a directory on the product:
C:\Programs Files\Tektronix\TekScope\System
Operating System
Reinstallation
DSA8200 Digital Serial Analyzer and Modules
If reinstalling Microsoft Windows becomes necessary, the method is different depending on the serial number of your instrument.
NOTE. Only reinstall the Microsoft Windows operating system if it is missing or corrupted. Reinstalling the operating system removes all data and applications from the hard drive.
1- 7
Installation
SN B019999 and Below. Use the Windows Operating System restore CD(s) that came with your instrument. Follow the installation procedures provided with the CD(s). The procedures vary based on the instrument and the version of Microsoft Windows being installed.
SN B020000 and Above. Use the procedure found in the DSA8200 Quick Start User Manual. Operating System restore disks are not shipped with these products.
System Hard Drive
Rebuild
System Diagnostics
Windows Safe Mode
If you cannot reboot from the instrument hard drive, you must rebuild the instrument hard drive. This process will return the hard disk to the its original condition present when the instrument shipped.
Data and programs you may have installed will be lost when rebuilding the hard drive.
If you must rebuild the system hard drive, install the Microsoft Windows operating system and then reinstall all applications.
In case of instrument problems, you may want to run the system diagnostics. If needed, you can see the procedure in the DSA8200 Specifications and Perfor- mance Verification manual.
If the instrument is turned off before the operating system boots, or if you’ve installed a third-party product with a driver incompatible with instrument start up, Windows will open in Safe mode. The touchscreen will be inoperable; therefore, you must install the standard-accessory mouse and keyboard to operate the instrument.
When you have finished investigating and have removed any barrier to Windows start-up, you can reboot. If the instrument no longer boots to Safe mode, you can remove the keyboard and mouse if desired.
1- 8
DSA8200 Digital Serial Analyzer and Modules
Theory of Operation

Theory of Operation

This chapter describes the electrical operation of the instrument and sampling modules. The diagrams in Chapter 9 show the interconnections of the major circuit blocks.

Logic Conventions

The instrument contains many digital logic circuits. This manual refers to these circuits with standard logic symbols and terms. Unless otherwise stated, all logic functions are described using the positive-logic convention: the more positive of the two logic levels is the high (1) state, and the more negative level is the low (0) state. Signal states may also be described as “true”, meaning their active state, or “false”, meaning their nonactive state. The specific voltages that constitute a high or low state vary among the electronic devices.

Mainframe Overview

This mainframe overview describes the basic operation of each functional circuit block as shown in Figure 5--1 on page 5--2.
General
Input Signal Path
The instrument control system is a dual Wintel/PowerPC based processor board. The platform features VGA resolution flat-panel display, transparent touch screen and user front-panel with direct access to commonly used scope functions. The instrument is also equipped with a mouse pointing device to facilitate access to more advanced scope functions.
A signal enters the instrument through a direct coaxial connection to the input connector on a sampling module, or a real time probe connected to the sampling module channel.
Acquisition System. The acquisition system conditions the input signals, samples them, converts them to digital signals, and controls the acquisition process under direction of the processor system. The acquisition system includes the multi­source trigger, acquisition timebase, and acquisition mode generation and control circuitry. The acquisition board is located in the bottom compartment of the instrument and can accommodate four small slot sampling plug-ins, two large slot plug-ins and a trigger/holdoff subsystem. Up to 8 vertical channels are accommodated simultaneously. Channels 1, 2, 3, and 4 can be either large or small slots. The presence of a module in one or both large slots displaces the small slot functionality in the corresponding small slots. The external trigger and
DSA8200 Digital Serial Analyzer and Modules
2- 1
Theory of Operation
all small slot channels feature a Tekprobe Level 2 probe power connector for additional front end signal conditioning functions like high input-impedance real-time probes, if equipped on the sampling module.
Processor System. The processor system contains a dual Wintel/PowerPC. The basic instrument configuration supports up to eight channels labeled Ch1 through Ch 8, provides two external trigger inputs for direct and prescaled triggering through built--in prescaler and is able to support two optional internal trigger sources associated with the large slot channels.
Display Panel
Front Panel
Rear Panel
Color LCD display Active-matrix touch panel.
Display System. The display system sends the text and waveform information to the display panel.
Touch Panel. The Display board sends information to the processor. Any changes in their settings are reported to the processor system.
The front panel board reads the front-panel switches and knob sensors. Any changes in their settings are reported to the processor system. The front panel board also turns the LEDs on and off and generates the bell signal. One USB port is also accessible from the front panel.
Front-panel menu switches are also read by the PPC processor board. The processor sends any changes in menu selections to the processor system. The ON/STBY switch is one of the menu switches. However, it is not read by the front panel board, but passes through the front panel board to the low voltage power supply.
The hard drive and CD-RW/DVD drive provide access to stored waveform data and enable you to load software to customize your instrument for your measure­ment needs. The GPIB allows for external control of the instrument.
Low Voltage Power Supply
2- 2
You can make hardcopies on the GPIB and RS-232 ports. Other ports are outputs from the ATX board: SVGA, USB (4), sound, serial, parallel, Ethernet, mouse, and keyboard.
The low voltage power supply is a switching power converter with active power factor control. It supplies power to all of the circuitry in the instrument.
The principal POWER switch, located on the rear panel, controls all power to the instrument including the Low Voltage Power Supply. The ON/STBY switch,
DSA8200 Digital Serial Analyzer and Modules
Theory of Operation
located on the front panel, also controls all of the power to the instrument except for part of the circuitry in the Low Voltage Power Supply.
The power supply sends a power fail (~PF) warning to the processor system if the power is going down.
Fans
The fan assembly provides forced air cooling for the instrument. The fans are controlled by the PPC processor.

Electrical Sampling Modules Overview

80E01, 80E02, 80E03,
80E06, 80E07, and 80E09
Sampling Modules
Table 2- 1: Electrical sampling module features
Feature 80E01 80E02 80E03 80E06 80E07 80E09
Number of independent channels 1 2 2 1 2 2
Bandwidth 50 GHz 12.5 GHz 20 GHz 70 GHz 30 GHz 60 GHz
Selectable bandwidths N.A. N.A. N.A. N.A. 20 GHz,
Signal connectors 2.4 mm
Remote sampler N.A. N.A. N.A. N.A. 2 meter cable 2 meter cable
The electrical sampling modules (non-TDR capable) are one- and two-channel sampling modules. Their basic features are listed in the following table. (The TDR capable sampling modules are describe later.)
40 GHz,
female
3.5 mm female
3.5 mm female
1.85 mm (V) female
30 GHz
2.92 mm (K) female
30 GHz, 60 GHz
1.85 mm (V) female
For the two-channel modules, a single strobe delivered from the instrument mainframe to both acquisition channels controls the timing of the strobe assertion to both channels. If channel-to-channel deskew is zero and the channel delays (if equipped) are matched, the sampling coincidence between channels is very close. Acquisition deskew function is carried out either by making separate acquisitions over individual acquisition windows or by adjusting Channel Delay (if equipped).
For the one-channel modules, an individual strobe delivered from the instrument mainframe to the acquisition channel controls the timing of the strobe assertion to the channel. Acquisition deskew function is carried out by moving the strobe timing for the channel to a unique acquisition window or by adjusting Channel Delay (if equipped).
DSA8200 Digital Serial Analyzer and Modules
2- 3
Theory of Operation
Most electrical channels feature a Tekprobe Level 2 probe power connector for attachment of a real time probe. The control of this probe is a mainframe function.
All module calibration signals are derived from a 2.5 V precision voltage reference internal to the sampling module. Settings derived from this reference are stored in a non-volatile EEPROM in the sampling module, although the responsibility for the execution of these settings is with the mainframe.
For major functional circuit blocks refer to Figure 5--2 on page 5--3.
80E04, 80E08, and 80E10
TDR/Sampling Modules
The TDR/Sampling modules are low noise samplers, with each channel capable of generating its own Time Domain Reflectometry (TDR) step. The basic features of these modules are listed in the following table.
Table 2- 2: TDR sampling module features
Feature 80E04 80E08 80E10
Number of independent channels 2 2 2
Number of TDR channels 2 2 2
Bandwidth 20 GHz 30 GHz 50 GHz
Selectable bandwidths N.A. 20 GHz, 30 GHz 40 GHz, 30 GHz, 50 GHz
Signal connectors 3.5 mm female 2.92 mm (K) female 1.85 mm (V) female
Remote sampler N.A. 2 meter cable 2 meter cable
For these modules, a single strobe delivered from the instrument mainframe to both acquisition channels controls the timing of the strobe assertion to both channels. If channel-to-channel deskew is zero and the channel delays (if equipped) are matched, the sampling coincidence between channels is very close. Acquisition deskew function is carried out by making separate acquisitions over acquisition windows or by adjusting Channel Delay (if equipped).
2- 4
Each electrical channel features a Tekprobe Level 2 probe power connector for attachment of a real time probe. The control of this probe is a mainframe function.
All module calibration signals are derived from a 2.5 V precision voltage reference internal to the sampling module. Settings derived from this reference are stored in a non-volatile EEPROM in the sampling module, although the responsibility for the execution of these settings is with the mainframe.
When used in the acquisition mode (that is, with the TDR step generator turned off) each channel functions as a normal sampling input. In the TDR mode, a fast rise time step is generated internally for each channel and applied to the input signal path for that channel. The acquisition portion of the TDR/sampling
DSA8200 Digital Serial Analyzer and Modules
module remains functional for monitoring the primary step and its reflected components. The sampling module provides two self-contained TDR channels. The polarity of the output step can be selected independently for each channel. This allows differential or common mode testing of two coupled lines as well as independent testing of isolated lines.
For major functional circuit blocks refer to Figure 5--2 on page 5--3.

Optical Sampling Modules Overview

80CXX and 80CXX-CR optical modules share the same mechanical package and are built with a common circuit board. Different functionality within the modules (current and future modules) is achieved by installing different O/E modules, filters and clock recovery boards along with setting the sampler bandwidth as demanded. The key features supported in the module are:
H A one channel, low noise, adjustable bandwidth sampler allowing multiple
bandwidth settings for optimizing noise versus bandwidth demands.
Theory of Operation
H An amplified or non-amplified O/E converter.
H Support for internal RF switches in the signal path with a straight-through
path and three hardware-filtered reference receiver paths between the O/E
converter and the sampler.
H An average optical power meter.
H Integral clock recovery option with internal coaxial connection to the
mainframe trigger, front panel clock and data output (not all have data).
H Communication with the mainframe for identification, control and calibra-
tion/compensation storage.
The “system response” depends on all of the components in the signal path from the front panel to the sampler. Bandwidth and reference receiver responses are calibrated at the factory with a sub-picosecond optical impulse applied to the front panel connector or with an optical heterodyne system. This ensures that all components are included, but also means that components can not be replaced without performing calibration.
Compensation performs a DC transfer curve characterization for each bandwidth/ reference receiver setting. The curve data is stored in the module’s EEPROM and used to generate a look-up table in the mainframe. This data corrects for linearity, gain and offset errors in the sampler.
Reference receivers can be created in any of the following ways:
H A hardware filter inserted between the O/E and the sampler and dominates
the response.
DSA8200 Digital Serial Analyzer and Modules
2- 5
Theory of Operation
H No filter is used, but the sampler’s bandwidth is adjusted.
H The O/E bandwidth is adjusted and dominates the response.
Information about the available bandwidth and reference receiver selections, and the method used to set the bandwidth for the optical modules starts on page 2--7.
The power monitor is a second measure of the photodiode current that is independent of the sampler signal path. Analog circuitry continuously senses the current flowing into the bias side of the photodiode. The signal is amplified by a programmable gain amplifier and input to an 8 bit AD converter. The AD converter and amplifier are controlled through the I
2
C interface. Compensation performs two functions in the power meter: First, two offset inputs are adjusted in the amplifier so that the signal stays in range for all of the gain settings. Next, offset is measured for all gain settings and stored so it can be subtracted from the raw measured current. Because the measurements are made through independent paths the power monitor is useful in debugging module/mainframe problems.
The main board of the module only provides power and control bits to the clock recovery board. A small fraction of the input signal is split off and applied to the clock recovery components. The type of splitter for each module is shown in Table 2--3.
Table 2- 3: Module optical/electrical split
Module Optical Split Electrical Split
C01 n
C02 n
C03 n
C04 n
C07 n
C07B n
C08 n
C08B n
C08C n
C09 n
C11 n
C12 n
The recovered clock is routed in coaxial cable through the rear connector of the module to the Optical Front End board in the mainframe. The Optical Front End
2- 6
DSA8200 Digital Serial Analyzer and Modules
Theory of Operation
board has a switch that selects which modules clock will be applied to the trigger. The control signal for that switch comes from the optical module.
80C01 Optical Sampling
Module
The 80C01 module supports conformance testing of long wavelength (1100-1650 nm) signals at 622, 2488, and 9953 Mb/s as well as general purpose testing up to 20 GHz optical bandwidth. Bandwidth and reference receiver calibration is performed with a sub-picosecond optical impulse and a fourier transform method.
H OC12: The electrical sampler is adjusted to approximately 7.5 GHz (--3 dB)
bandwidth and signal is routed through a hardware filter designed to result in the combined system having an OC12 (STM-4) Reference Receiver response.
H OC48: The electrical sampler is adjusted to 7.5 GHz (--3 dB) bandwidth and
signal is routed through a hardware filter designed to result in the combined system having an OC48 (STM-16) Reference Receiver response. These adjustments must be made at the factory.
H OC192: The electrical sampler is adjusted to give the desired response, and
signal is not routed through any filter (signal is sent through the straight­through path). The sampler bandwidth and response is optimized during the calibration such that the combined system will have an OC192 (STM-64) Reference Receiver response.
H 12.5 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >12.5 GHz.
H 20 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >20 GHz.
For major functional circuit blocks refer to Figures 5--3 and 5--4 beginning on page 5--4.
80C02 Optical Sampling
Module
DSA8200 Digital Serial Analyzer and Modules
The 80C02 module is optimized for testing of long-wavelength (1100-1650 nm) signals at (9.953 Gb/s) SONET OC-192 / SDH STM-64 standards. With its high optical bandwidth (>30 GHz) it is also well suited to general purpose high-per­formance optical component testing.
H OC192: The electrical sampler is adjusted to give the desired response, and
signal is not routed through any filter (signal is sent through the straight­through path). The sampler bandwidth and response is optimized during the calibration such that the combined system will have an OC192 (STM-64) Reference Receiver response.
2- 7
Theory of Operation
H 12.5 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >12.5 GHz.
H 20 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >20 GHz.
H 30 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >30 GHz.
For major functional circuit blocks refer to Figures 5--5 and 5--6 beginning on page 5--6.
80C03 Optical Sampling
Module
The 80C03 module supports conformance testing of both short and long bandwidth (700-1650 nm) signals at 1.063, 1.250, and 2.488 Mb/s as well as general purpose testing with >2.3 GHz optical bandwidth. Its amplified optical to electrical converter design enables the user to examine very low-level optical signals.
H OC48: The electrical sampler is adjusted to approximately 12.5 GHz (--3 dB)
bandwidth and signal is not routed through any filter (signal is sent through the straight-through path). The O/E converter is designed by the vendor to match the OC48 reference receiver response curve. The span adjustment provides limited adjustment of the frequency response. It is adjusted at the factory so that the combined system will have an OC48 (STM-64) Reference Receiver response. This mode is synonymous with the 2.3 GHz maximum bandwidth setting.
H FC1063: The electrical sampler is adjusted and O/E converter span voltage
are the same values as in the OC48 mode. The signal is routed through a hardware filter designed to result in the combined system having an FC1063 (1.0625 Gb/s Fibre Channel) Reference Receiver response.
H GBE: The electrical sampler is adjusted and O/E converter span voltage are
the same values as in the OC48 mode. The signal is routed through a hardware filter designed to result in the combined system having an GBE (1.25 Gb/s Gigabit Ethernet) Reference Receiver response.
80C04 Optical Sampling
Module
2- 8
The 80C03 module can be configured with clock recovery that supports Fibre Channel 1063 (1.063 Gb/s) and OC-48 / STM-16 (2.488 Gb/s) standards.
For major functional circuit blocks refer to Figure 5--7 and 5--8 beginning on page 5--8.
The 80C04 module is optimized for testing of long wavelength (1100--1650 nm) signals at either 9.953 Gb/s or 10.664 Gb/s. With its high optical bandwidth
DSA8200 Digital Serial Analyzer and Modules
Theory of Operation
>28 GHz, it is also well suited to general-purpose, high-performance optical component testing.
H OC192 or 10.664 Gb/s: The electrical sampler is adjusted to give the desired
response, and signal is not routed through any filter (signal is sent through the straight-through path). The sampler bandwidth and response is optimized during the calibration such that the combined system will have an OC192 (STM-64) or 10.66 Gb Reference Receiver response.
H 20 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >20 GHz.
H 30 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >28 GHz.
The 80C04 can be optionally configured with clock recovery (Opt. CR-1) that supports 9.953 Gb/s telecom standards.
80C05 Optical Sampling
Module
80C06 Optical Sampling
Module
For major functional circuit blocks refer to Figures 5--9 and 5--10 beginning on page 5--10.
The 80C05 module is designed to test long wavelength (1520--1580 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >40 GHz.
H OC192: There is one Reference Receiver setup selectable for 9.95328 Gb/s
SONET/SDH standard.
H There is no clock recovery option available.
For major functional circuit blocks refer to Figure 5--11 on page 5--12.
The 80C06 module is designed to test long wavelength (1520--1580 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >55 GHz.
H 55 GHz: There is only a single bandwidth selection available, no Reference
Receiver setups selectable.
H There is no clock recovery option available.
For major functional circuit blocks refer to Figure 5--12 on page 5--13.
80C07 Optical Sampling
Module
DSA8200 Digital Serial Analyzer and Modules
The 80C07 module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and
2- 9
Theory of Operation
measurement tool for high bandwidth telecommunications with its high optical bandwidth >2.3 GHz.
H Filtered rates are OC-3, OC-12; unfiltered rate is OC-48.
H There is clock recovery option available (155/622/2488 Multi-rate)
For major functional circuit blocks refer to Figures 5--13 and 5--14 beginning on page 5--14.
80C07B Optical Sampling
Module
80C08 Optical Sampling
Module
The 80C07B module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >2.3 GHz.
H Supported standards or data filtering rates include OC--3, OC--12, OC-48,
ENET2500/2GBE, GBE, FC1063, FC2125, and Infiniband.
H Clock recovery options are available
(155/622/1063/1250/2125/2488/2500/2666)
For major functional circuit blocks refer to Figures 5--13 and 5--14 beginning on page 5--14.
The 80C08 module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >9.0 GHz.
H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E
bandwidth is adjusted and dominates the response (9.953/10.3125 Gb/s Multi--rate).
H There is clock recovery option available (9.953/10.3125 Gb/s Multi-rate).
80C08B Optical Sampling
Module
2- 10
For major functional circuit blocks refer to Figures 5--15 and 5--16 beginning on page 5--16.
The 80C08B module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >9.5 GHz.
H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E
bandwidth is adjusted and dominates the response (9.953/10.3125 Gb/s Multi-rate).
DSA8200 Digital Serial Analyzer and Modules
Theory of Operation
H Clock recovery options are available (9.953/10.3125/10.51875 Gb/s
Multi-rate).
For major functional circuit blocks refer to Figures 5--15 and 5--16 beginning on page 5--16.
80C08C Optical Sampling
Module
80C09 Optical Sampling
Module
The 80C08C module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >10 GHz.
H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E
bandwidth is adjusted and dominates the response (9.953/10.3125/10.518/10.66/10.709/11.1/11.317 Gb/s).
H Clock recovery options are available (9.953/10.3125/10.518 Gb/s and
Continuous-rate from 9.8 Gb/s to 12.6 Gb/s).
For major functional circuit blocks refer to Figures 5--15 and 5--16 beginning on page 5--16.
The 80C09 module is designed to test long wavelength (1100--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >30 GHz.
H Supported standards or data filtering rates include OC-192 and FEC10.709.
H Clock recovery options are available (OC-192 and FEC10.709)
For major functional circuit blocks refer to Figures 5--17 and 5--18 beginning on page 5--18.
80C10 Optical Sampling
Module
DSA8200 Digital Serial Analyzer and Modules
The 80C10 module is designed to test long wavelength (1310 and 1550 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >65 GHz.
H Supported standards or data filtering rates include OC-768 and FEC43.02
(G.709).
H 30 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >30 GHz.
H 65 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >65 GHz.
H There is no clock recovery option available.
For major functional circuit blocks refer to Figure 5--19 on page 5--20.
2- 11
Theory of Operation
80C10B Optical Sampling
Module
80C11 Optical Sampling
Module
The 80C10B module is designed to test long wavelength (1310 and 1550 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >80 GHz.
H Supported standards or data filtering rates include OC-768 and FEC43.02
(G.709).
H 30 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >30 GHz.
H 65 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >65 GHz.
H 80 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB) >80 GHz.
H There is no clock recovery option available.
For major functional circuit blocks refer to Figure 5--19 on page 5--20.
The 80C11 module is designed to test long wavelength (1100--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >20 GHz.
80C12 Optical Sampling
Module
H Supported standards or data filtering rates include
9.953/10.31/10.518/10.66/10.71/11.1 Gb/s.
H Clock recovery options are available (9.953/10.66/10.71 Gb/s and Continu-
ous-rate from 9.8 Gb/s to 12.6 Gb/s)
For major functional circuit blocks refer to Figures 5--20, 5--21, 5--22, and 5--23 beginning on page 5--21.
The 80C12 module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >10 GHz.
H There are three Reference Receiver filters selectable that are customer
specified from the following list of five rates: 1FC (FC1063) for 1.0625Gb/s FibreChannel, 2FC (FC2125) for 2.125Gb/s FibreChannel, 10GBase-X4 for
3.125Gb/s, VSR-5 for 3.31776 Gb/s, and 4FC (FC4250) for 4.25 Gb/s Fibre Channel. Filterless, full-bandwidth settings (8.5 GHz and 9 GHz) are also available.
2- 12
DSA8200 Digital Serial Analyzer and Modules
H In addition, this module offers the option to support 10 Gb/s optical
standards as well. This option is mutually exclusive with the sub--10Gb/s filter options. The standard reference receiver filter rates offered with the Option 10G are SONET/SDH OC-192/STM-64, 10GBase-W, 10 Gb Ethernet (9.95338 Gb/s), 10GBase-R (10.3125 Gb/s), 10G Fibre Channel (10.51875 Gb/s), G.975 FEC (10.66 Gb/s), G.709 FEC (10.71 Gb/s), 10GBE FEC (11.0957 Gb/s), 8G FibreChannel (8.5 Gb/s), 10G FibreChannel FEC (11.317 Gb/s). These filter settings require no hardware filters.
H An electrical clock recovery output signal is provided that can be routed to
the Tektronix 80A05 or 80A07 for clock recovery.
For major functional circuit blocks refer to Figure 5--24 on page 5--25.

80A01 Trigger Prescale Preamplifier Module

The 80A01 module is designed to increase the sensitivity of the prescale trigger input of the DSA8200 to 200 mV
pk-pk
Theory of Operation
.
The major function block of the module is a high sensitivity, high gain RF amplifier. The input and output to this amplifier are routed to two identical SMA, female connectors, labelled Input and Output at the module front panel.
The module receives power from the main instrument through a single connector at the rear of the module. The power LED indicates the module is receiving power through the interface connector.
For major functional circuit blocks refer to Figure 5--25 on page 5--26.

80A02 EOS/ESD Protection Module

The 80A02 EOS/ESD (Electrical Over Stress/Electro-Static Discharge) protection module works with any DSA8200 instrument and provides static electricity damage protection to vulnerable sampling head input stages and/or other sensitive elements.
The 80A02 EOS/ESD module has a 26 GHz bandwidth, making it possible to provide static protection to a sensitive single input channel of a sampling oscilloscope with very minimal speed degradation.
The 80A02 EOS/ESD module is designed to work with either the Tektronix P8018 probe for manual test station static protection as well as automated test stations.
For major functional circuit blocks refer to Figure 5--26 on page 5--27.
DSA8200 Digital Serial Analyzer and Modules
2- 13
Theory of Operation

80A05 Electrical Clock Recovery Module

The electrical clock recovery module is capable of performing clock recovery on the input signal (signal input must meet data rate and format requirements), and provides this signal as a trigger source to the DSA8200.
Front panel connectors provide a replica of the recovered clock signal.
The module uses one of two separate clock recovery circuits dependant on the specified data rate. The single-ended or complementary input signals are split with a 1:2 divider and routed to the two circuits.
The low bandwidth circuit recovers clock and data from input data in the 50 Mb/s to 2.7 Gb/s range. The recovered clock from this circuit is routed directly to the front panel and internal trigger.
The high bandwidth circuit recovers clock and data from input data in the
2.7 Gb/s to 12.6 Gb/s range. The recovered clock to the front panel and internal trigger signals are always clock/16.
With option 10G, the 10G recovered clock is also routed to the front panel.
There is one front panel indicator LED -- Clock Recovery Enable. It indicates the clock recovery circuitry is on and programmed to the requested bit rate.
For major functional circuit blocks refer to Figure 5--27 on page 5--28.

80A06 PatternSync Trigger Module

The 80A06 PatternSync Trigger Module is designed to provide a frame trigger for the DSA8200.
The frame trigger is derived by counting a programmed amount of user supplied clock cycles and generating a pulse at the completion of the count. This pulse is then routed externally to the main instrument’s external trigger direct input.
An additional buffered copy of the input clock is output to the front panel for connection to additional equipment such as an 82A04 Phase Reference Module.
The 80A06 consumes a small slot or may be operated on a SlotSaver cable connected to the main instrument’s probe power connector.
Pattern triggering works for clocks in the range of 150 MHz to 12.75 GHz.
2- 14
For major functional circuit blocks refer to Figure 5--28 on page 5--29.
DSA8200 Digital Serial Analyzer and Modules

82A04 Phase Reference Module

The 82A04 Phase Reference Module is designed to decrease horizontal position uncertainty with data signals, when a reference clock signal synchronized to the data signal, is available. It consumes a small slot, and displaces operation of both channels in that slot.
The Phase Correction modes available are free run, where the module provides unit circle location information for the phase of the data sample, and triggered, where the module, in conjunction with the trigger signal, provides both base positioning, and refined positioning, for the data sample.
The input is precision 1.85 mm. Phase correction works over the range of
2.5 GHz -- 25 GHz (82A04), or 2.5 GHz -- 60 GHz (82A04--60G). The LED indicates the module is being utilized for phase correction.
For major functional circuit blocks refer to Figure 5--29 on page 5--30.
Theory of Operation
DSA8200 Digital Serial Analyzer and Modules
2- 15
Theory of Operation
2- 16
DSA8200 Digital Serial Analyzer and Modules
Adjustment Procedures

Adjustment Procedures

This chapter contains an adjustment procedure for your instrument. The purpose of this procedure is to return the instrument conformance to its specifications.

Adjustment Interval

The voltage and timing references inside the instrument are very stable over time and should not need routine adjustment. The only time you should perform the Adjustment Procedures is if the instrument fails any of the mainframe perfor­mance verification checks provided in the DSA8200 Specifications and Performance Verification manual.

Adjustment Environment

The instrument must be adjusted in a 20 °Cto30°C ambient temperature environment. The instrument and signal source must warm up at least 20 minutes in this environment before you begin the adjustment procedure.

Adjustment After Repair

After removal and replacement of a module due to electrical failure, you must either perform the adjustment procedure or not, depending on the module replaced. See Table 3--1.
Table 3- 1: Adjustments required for module replaced
Module replaced Adjustment required
Front panel assembly No
Acquisition board Yes
Processor board No
ATX processor assembly No
Display panel or display system
Power supply No
Interconnect boards No
Fans No
No
DSA8200 Digital Serial Analyzer and Modules
3- 1
Adjustment Procedures

Required Equipment

The adjustment procedure requires the specific test equipment and materials listed in Table 3--2.
Table 3- 2: Required equipment and materials
Category Specific equipment required Quantity
Signal source Si gnal generator 50 MHz to 1 GHz, 1 ppm
frequency accuracy
Meter Digital Multimeter, with 6.5 plus digits 1ea
1ea
Instrument controller (only one of these configurations required)
Divider Power, 50 Ω, SMA “T”. male Tektronix 015-0565-00 1ea
Adapter SMA “T”, male to 2 SMA female Tektronix part
Adapter SMA male to BNC female, Tektronix part number
Adapter BNC to dual banana plug, Tektronix part number
Coaxial cables 50 Ω, male-to-male SMA connectors 3ea
GPIB cables GPIB cable, 1 m minimum length, Tektronix part
1
Depending on other USB devices attached to the instrument, a USB hub may also be required. Consult your National Instruments documentation for more information.
PC-compatible computer with National Instruments GPIB Controller card and software, running Windows 95/98 or NT
National Instruments USB GPIB Controller card for Windows 98 and National Instruments NI -488. 2 for Windows software (to install in t he inst rument)
number 015-1016-00
015-0554-00
103-0095-00
number 002-0991-01
1
1ea
1ea
1ea
1ea
1ea
1ea

Instrumentation Setup

3- 2
Set the National Instruments GPIB Interface command software to allow GPIB communications between the PC controller and DSA8200, device under test (DUT).
Before you can execute the adjustment program, you need to set up and configure the instrumentation. Make connections according to the following diagrams. See Figure 3--1.
To perform this procedure you must have the specific equipment listed in Table 3--2.
DSA8200 Digital Serial Analyzer and Modules

Main Instrument Adjustments

Once the instrumentation is connected and GPIB configured, allow the instru­mentation to warm up for at least 20 minutes before starting the DC Calibrator Adjust procedures.
DSA82000
Controller
GPIB cable
50 Ω
Terminator
Adjustment Procedures
Digital
multimeter
-- +
DC CALIBRATION
Figure 3- 1: Adjustment setup using the DMM
DC Calibrator Adjust
Connect the instrument to a DMM as shown in Figure 3--1.
1. Run the compensation routine.
2. Enter the following GPIB command to verify communication between the
controller and DUT. *IDN? Should respond with Tektronix and Firmware Version.
3. Enter the following GPIB command to turn the instrument’s cal constant protection off: SYST:PROT OFF
4. Enter the following GPIB command to set the instrument’s DC calibrator offset cal constant to 0: CALCOMP:DOUBLE “DcCalOffsetAdj”,0.0
5. Wait 8 seconds then enter the following GPIB command to set the instrument’s DC calibrator Lsb cal constant to 1.0: CALCOMP:DOUBLE “DcCalLsbAdj”,1.0
OUTPUT
SMA “T”
6. Wait 8 seconds then enter the following GPIB command to set the instrument’s DC calibrator output to 0 Volts: CALIBRATE:DCCALIBRATOR 0.0 Record DMM reading.
DSA8200 Digital Serial Analyzer and Modules
3- 3
Adjustment Procedures
7. Enter the following GPIB command to set the instrument’s DC calibrator offset cal constant to --1 * DMM reading: CALCOMP:DOUBLE “DcCalOffsetAdj”,(--1.0 * the DMM reading)
Example: CALCOMP:DOUBLE “DcCalOffsetAdj”, 3.2e--4
8. Enter the following GPIB command to set the instrument’s calibrator to
1.0 V: CALIBRATE:DCCALIBRATOR 1.0 Record the DMM reading (reading1).
9. Enter the following GPIB command to set the instrument’s calibrator to
--1.0 V: CALIBRATE:DCCALIBRATOR --1.0 Record the DMM reading (reading2). Calculate cal constant as follows:
DC Calibrator Adjust
Verification
(
–1.0 * Reading2 + Reading1
2
)
10. Enter the following GPIB command to set the instrument’s calibrator Lsb cal constant: CALCOMP:DOUBLE “DcCalLsbAdj”,calculated result from Step 9.
11. Wait 8 seconds then enter the following GPIB command to save the DC adjustments as follows: CAL:SAVE:FACT:MAI
12. Update the mainframe calibration time/date/temperature stamp by entering the following GPIB command: CAL:UPDATEINFO:MAI
13. Enter the following GPIB command to turn the instrument’s cal constant protection on: SYST:PROT ON
To verify that the DC calibration adjustment was successful complete the following procedures:
1. Set the instrument’s DC calibrator to --1.0 V and verify as follows: CALIBRATE:DCCALIBRATOR --1.0
3- 4
2. Verify that the DMM reads --1.0 V 1mV
3. Set the instrument’s DC calibrator to 1.0 V and verify as follows:
CALIBRATE:DCCALIBRATOR 1.0
4. Verify that the DMM reads 1.0 V
1mV
DSA8200 Digital Serial Analyzer and Modules
Adjustment Procedures
5. Set the instrument’s DC calibrator to 0.0 V and verify as follows: CALIBRATE:DCCALIBRATOR 0.0
6. Verify that the DMM reads 0.0 V
GPIB cable
Controller
Channel 1
DSA82000
Figure 3- 2: Adjustment setup using the signal generator
Internal 10 MHz Adjust
Connect the instrument to a signal generator as shown in Figure 3--2.
0.1 mV
Synthesized signal generator
TRIGGER DIRECT INPUT
50 Ω Power divider
Setup
Set the signal generator as follows:
H Frequency to 1 GHz
H Amplitude to 1.0 V peak to peak
H Output to on
Preset the instrument controls:
NOTE. To open the Setups Dialog box to access Acquisition, Horizontal, Measurement, Trigger, and Vertical menus, select the Setup Menu.
H Select C1 in the Waveform Selector .
H Acquisition menu, Acquisition to, Average, 64 samples.
H Horizontal menu, Timebase, Scale to 250 ps/division.
H Horizontal menu, All Timebases Mode, Lock to Int 10MHz.
H Measurement menu, Select Meas, Timing, + Cross.
H Measurement menu, select Statistics.
DSA8200 Digital Serial Analyzer and Modules
3- 5
Adjustment Procedures
1. Enter the following GPIB command to turn the instrument’s cal constant protection off: SYST:PROT OFF
2. Set the calibration value to default by sending the following GPIB com­mand: CALCOMP:DOUBLE “Internal10MHzRefFreq”,10e6
3. Click Run/Stop (button should be green).
4. Measurement menu, click Show Stats.
5. Record target value = (Mean value +1 s);whereMean is from the
Statistics window.
6. Horizontal menu, Timebase, Position, enter target value recorded in step 5.
7. Click Run/Stop (button should be gray).
8. Measurement menu, click Clear Stats.
9. Click Run/Stop (button should be green), wait 8 seconds then click Run/Stop
again (button should be gray).
10. Using the present Mean value from the Statistics window, and the target value calculated in step 5,. Calculate the error and the new cal
constant:
Error = (mean -- target value) / 1 s New Cal Const = Error * 10e6 + 10e6
11. Input the new calibration constant into the instrument by sending the following GPIB command: CALCOMP:DOUBLE “Internal10MHzRefFreq”, New Cal Const where New Cal Const is from Step 10.
12. Wait 8 seconds then save the mainframe factory calibration constants by entering the following GPIB commands: CAL:SAVE:FACT:MAI
13. Update the mainframe calibration time/date/temperature stamp by entering the following GPIB command: CAL:UPDATEINFO:MAI
14. Enter the following GPIB command to turn the instrument’s cal constant protection on: SYST:PROT ON
3- 6
End of Procedure
DSA8200 Digital Serial Analyzer and Modules
Maintenance

Maintenance

This section contains the information needed to do periodic and corrective maintenance on the Mainframe, Sampling Heads and Optical modules. The following subsections are included:
H Preparation. Introduction plus general information on preventing damage to
internal modules when doing maintenance.
H Inspection and Cleaning. Information and procedures for inspecting the
instrument and cleaning its external and internal modules.
H Removal and Installation Procedures. Procedures for the removal of
defective modules and replacement of new or repaired modules. Also included is a procedure for disassembly of the instrument for cleaning.
H Troubleshooting. Information for isolating and troubleshooting failed
modules. Included are instructions for operating the instrument’s internal diagnostic routines and troubleshooting trees. Most of the trees make use of these internal diagnostic routines to speed fault isolation to a module.

Preventing ESD

Before servicing this product, read the Safety Summary and Introduction at the front of the manual and the electrostatic discharge (ESD) information below.
CAUTION. Electrostatic discharge can damage any semiconductor component in this instrument. To avoid EDS damage, always wear a grounded antistatic wrist strap when handling the instrument.
When performing any service that requires internal access to the instrument, adhere to the following precautions to avoid damaging internal modules and their components due to ESD.
1. Minimize handling of static-sensitive circuit boards and components.
2. Transport and store static-sensitive modules in their static protected
containers or on a metal rail. Label any package that contains static-sensitive boards.
3. Discharge the static voltage from your body by wearing a grounded antistatic wrist strap while handling these modules. Do service of static-sensitive modules only at a static-free work station.
DSA8200 Digital Serial Analyzer and Modules
4- 1
Maintenance
4. Nothing capable of generating or holding a static charge should be allowed
5. Handle circuit boards by the edges when possible.
6. Do not slide the circuit boards over any surface.
7. Avoid handling circuit boards in areas that have a floor or work-surface

Inspection and Cleaning

Inspection and Cleaning describes how to inspect for dirt and damage. It also describes how to clean the exterior and interior of the instrument. Inspection and cleaning are done as preventive maintenance. Preventive maintenance, when done regularly, may prevent instrument malfunction and enhance its reliability.
Preventive maintenance consists of visually inspecting and cleaning the instrument and using general care when operating it.
on the work station surface.
covering capable of generating a static charge.
General Care
Flat Panel Display
Cleaning
How often to do maintenance depends on the severity of the environment in which the instrument is used. A proper time to perform preventive maintenance is just before instrument adjustment.
The cabinet helps keep dust out of the instrument and should normally be in place when operating the instrument.
WARNING. To avoid personal injury due to electric shock, before performing any procedure that follows, power down the instrument and disconnect it from line voltage.
The portable mainframe display is a soft plastic display and must be treated with care during cleaning.
CAUTION. Improper cleaning agents or methods can damage the flat panel display. To avoid damage, do not use abrasive cleaners or commercial glass cleaners to clean the display surface. Do not spray liquids directly on the display surface or scrub the display with excessive force.
4- 2
Clean the flat panel display surface by gently rubbing the display with a clean-room wipe (such as WypAll Medium Duty Wipes, #05701, available from Kimberly-Clark Corporation).
DSA8200 Digital Serial Analyzer and Modules
Maintenance
If the display is very dirty, moisten the wipe with distilled water or a 75% isopropyl alcohol solution and gently rub the display surface. Avoid using excess force or you may damage the plastic display surface.
CAUTION. To prevent getting moisture inside the instrument during external cleaning, use only enough liquid to dampen the cloth or applicator.
Exterior
Use the following guidelines and methods to inspect and clean the outside of the instrument.
Inspection — Exterior. Inspect the outside of the instrument for damage, wear, and missing parts, using Table 4--1 as a guide. Immediately repair defects that could cause personal injury or lead to further damage to the instrument.
Table 4- 1: External inspection check list
Item Inspect for Repair action
Cabinet, front panel, and cover
Front-panel knobs Missing, damaged, or loose
Connectors Broken shells, cracked insulation,
80C0X male fiber con­nections
Carrying handle, and cabinet feet
Cracks, scratches, deformations, damaged hardware.
knobs.
and deformed contacts. Dirt in connectors.
Lint or dust on all male fiber connections.
Correct operation. Repair or replace defecti ve
Repair or replace defective module.
Repair or replace missing or defective knobs.
Repair or replace defective modules. Clear or wash out dirt.
Clean all male fiber connections with a lint-free cleaning cloth.
module.
Accessories Missing items or parts of items,
Cleaning — Exterior. Clean the exterior surfaces of the chassis with a dry lint-free cloth or a soft-bristle brush. If any dirt remains, use a cloth or swab dipped in a 75% isopropyl alcohol solution. Use a swab to clean narrow spaces around controls and connectors. Do not use abrasive compounds on any part of the chassis that may damage the chassis.
Clean the On/Standby switch using a dampened cleaning towel. Do not spray or wet the switch directly.
DSA8200 Digital Serial Analyzer and Modules
bent pins, broken or frayed cables, and damaged connec­tors.
Repair or replace damaged or missing items, frayed cables, and defective modules.
4- 3
Maintenance
CAUTION. Avoid the use of chemical cleaning agents that might damage the plastics used in this instrument. Use a 75% isopropyl alcohol solution as a cleaner and rinse with deionized water. Use only deionized water when cleaning the menu buttons or front-panel buttons. Before using any other type of cleaner, consult your Tektronix Service Center or representative.
Interior
Use the following guidelines and methods to inspect and clean the inside of the instrument.
Inspection — Interior. To access the inside of the instrument for inspection and cleaning, refer to the Removal and Installation Procedures in this section.
Inspect the internal portions of the instrument for damage and wear, using Table 4--2 as a guide. Defects found should be repaired immediately.
If any circuit board is repaired or replaced, check Table 3--1 on page 3--1, in Chapter 5 to see if it is necessary to adjust the instrument.
CAUTION. To prevent damage from electrical arcing, ensure that circuit boards and components are dry before applying power to the instrument.
Table 4- 2: Internal inspection check list
Item Inspect for Repair action
Circuit boards Loose, broken, or corroded
solder connections. Burned circuit boards. Burned, broken, or cracked circuit-run plating.
Remove and replace damaged circuit board.
4- 4
Resistors Burned, cracked, broken, blis-
tered condition.
Solder connections Cold solder or rosin joints. Resolder joint and clean with
Capacitors Damaged or leaking cases.
Corroded solder on leads or terminals.
Remove and replace damaged circuit board.
isopropyl alcohol.
Remove and replace damaged circuit board.
DSA8200 Digital Serial Analyzer and Modules
Table 4- 2: Internal inspection check list (cont.)
Item Repair actionInspect for
Semiconductors Loosely inserted in sockets.
Distorted pins.
Maintenance
Firmly seat loose semiconduc­tors. Remove devices that have distorted pins. Carefully straight­en pins (as required to fit the socket), using long-nose pliers, and reinsert firmly. Ensure that straightening action does not crack pins, causing them to break off.
Wiring and cables Loose plugs or connectors.
Burned, broken, or frayed wiring.
Chassis Dents, deformations, and dam-
aged hardware.
Firmly seat connectors. Repair or replace modules with defective wires or cables.
Straighten, repair, or replace defective hardware.
Cleaning Procedure — Interior. To clean the instrument interior, do the following steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free cloth dampened in isopropyl
alcohol (75% solution) and rinse with warm deionized water. (A cotton­tipped applicator is useful for cleaning in narrow spaces and on circuit boards.)
STOP. If, after doing steps 1 and 2, a module is clean upon inspection, skip the remaining steps.
3. If steps 1 and 2 do not remove all the dust or dirt, the instrument may be spray washed using a solution of 75% isopropyl alcohol by doing steps 4 through 8.
4. Gain access to the parts to be cleaned by removing easily accessible shields and panels (see Removal and Installation Procedures).
5. Spray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the majority of the alcohol to evaporate.
6. Use hot (120 _F to 140 _F) deionized water to thoroughly rinse them.
7. Dry all parts with low-pressure, deionized air.
8. Dry all components and assemblies in an oven or drying compartment using
low-temperature (125 _F to 150 _F) circulating air.
DSA8200 Digital Serial Analyzer and Modules
4- 5
Maintenance
4- 6
DSA8200 Digital Serial Analyzer and Modules

Removal and Installation Procedures

This subsection contains procedures for removal and installation of all mechani­cal and electrical modules.

Preparation

WARNING. Before doing this or any other procedure in this manual, read the Safety Summary found at the beginning of this manual. Also, to prevent possible injury to service personnel or damage to this instrument’s components, read
Installation in Chapter 2, and Preventing ESD in this section.
This subsection contains the following items:
H Preparatory information that you need to properly do the procedures that
follow.
H A list of tools required to remove and disassemble all modules.
H Procedures for removal and reinstallation of the electrical and mechanical
modules.
H A disassembly procedure for removal of all the major modules from the
instrument at one time and for reassembly of those modules into the instrument. Instructions for doing the actual cleaning are found under Inspection and Cleaning at the beginning of this section.
H Module disassembly procedures.
WARNING. Before doing any procedure in this subsection, disconnect the power cord from the line voltage source. Failure to do so could cause serious injury or death.
NOTE.ReadEquipment Required for a list of the tools needed to remove and install modules in this instrument. See Table 4--3, page 4--8.
Read the cleaning procedure before disassembling the instrument for cleaning.
DSA8200 Digital Serial Analyzer and Modules
4--7
Removal and Installation Procedures
Equipment Required. Most modules in this instrument can be removed with a screwdriver handle mounted with a size T-15, TorxR screwdriver tip. Use this
tool whenever a procedure step instructs you to remove or install a screw unless a different size screwdriver is specified in that step. All equipment required to
remove and reinstall each module is listed in the first step of its procedure.
Table 4--3: Tools required for module removal
Item No.
1 Screwdriver handle
2 Screwdriver handle, ex-
Name Description Part number
Accepts TorxR-driver bits
General Tool: 620-440
tended length, 10.5 to 12 inches
Accepts TorxR-driver bits and
3
socket tip. Used for removing the
3
/
T-10 screws and
inch hex posts
16
/
16
Standard tool or Xcelite 99X10V N/S#48706
from the electrical and optical module slots.
3 T-10 Torx tip Used for removing the electrical or
optical module chassis. TorxR-driver
General Tool: 640-235
bit for T-10 size screw heads.
4 T-15 Torx tip Used for removing most the instru-
ment’s screws. TorxR-driver bit for
General Tool: 640-247
T-15 size screw heads.
5 T-20 Torx tip Used for removing the handle
hardware. TorxR-driver bit for T-20
General Tool: 640-250
size screw heads.
6
3
/
inch socket tip Used for removing the
16
3
/
16
inch hex
Standard tool posts from the electrical and optical module slots.
7
8 #0 phillips screwdriver Screwdriver for removing small
1
/8inch flat-bladed screw-
driver
Screwdriver for unlocking cable connectors.
Standard tool
Standard tool phillips screws, CD & hard drive.
9 Angle-Tip Tweezers Used to remove front panel knobs Standard tool
10
3
/
inch open-end wrench
16
Used to remove the rear panel nut
Standard tool posts.
11
5
/
inch open-end wrench
16
Used to remove the rear panel nut
Standard tool posts.
4--8
12 Coaxial cable connector
tool
Used to remove coaxial connectors
Amp: 58095-1 from d-subminiature connector housings.
DSA8200 Digital Serial Analyzer and Modules

Procedures for External Modules

The following procedures are found here and are listed in the order presented. If you do not wish to remove the front panel, you do not need to remove the front panel knobs, but can start with trim disassembly.
H Line Fuse and Line Cord
H Front Panel Knobs
H Trim (all)
H Bottom cover
H Left and Right covers
Removal and Installation Procedures
Line Fuses and AC power
cord connector
1. Assemble equipment and locate modules to be removed: Locate the power switch, line fuses and AC power cord connector in Figure 4--1, page 4--10.
CAUTION. When powering off the instrument, use the Windows XP shut down procedure. (Choose Shut Down from the Start menu.)
Powering down the instrument without using the Windows XP shut down procedure can corrupt the software on the hard disk.
2. The instrument has a built-in soft power-off function that safely powers off the instrument when you press the On/Standby switch. You must power off the instrument using the Windows XP shut down process before depressing the front panel On/Standby switch.
3. Power off the rear panel power switch before servicing the line fuses or power cord.
4. Orient the instrument: Set the instrument so its bottom is down on the work surface and its rear is facing you. If you are servicing the line fuses, do the next step; if you are servicing the line cord, skip to step 6.
5. Remove line fuses: Find the fuse caps on the rear panel. Now, remove both fuse caps by turning them counterclockwise using a flat-bladed screwdriver, and remove the line fuses. Reverse procedure to reinstall.
6. Remove line cord: Find the line cord on the rear cover. Pull the line cord away to remove from the AC power connector. Reverse procedure to reinstall.
7. Reinstallation: Do in reverse steps 5 and 6 to reinstall the line cord and then the line fuse.
DSA8200 Digital Serial Analyzer and Modules
4--9
Removal and Installation Procedures
AC power cord
connector
Power
switch
AC power cord
Figure 4--1: Line fuses and line cord removal
Line fuses
Line fuse
holder
4--10
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
Front-Panel Knobs
1. Collect equipment and locate modules to be removed: Use an angled-tip tweezers (Item 9) and locate the the front panel see Figure 4--3 on page 4--13.
2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front is facing you.
3. Remove the knob(s): Grasp any knob you want to remove and pull it straight out from the front panel about a
1
/4inch to create some clearance between the base of the knob and the front panel. Insert the tweezers between the knob and front panel and use them to remove the knob. See Figure 4--2.
4. Reinstallation: To reinstall, align knob to shaft and push it in until it snaps.
CAUTION. To prevent damage to the encoders located onto the circuit board, apply pressure to the backs of the encoders while pushing the knob on the shaft.
Figure 4--2: Knob removal
DSA8200 Digital Serial Analyzer and Modules
4--11
Removal and Installation Procedures
Trim and Carrying Handle
1. Locate module to be removed: Locate the Trim in the locator diagram, See Figure 4--7, page 4--19.
2. Remove the top cover trim: Use Figure 4--3, page 4--13 as a guide.
a. Remove the accessory pouch; it snaps off.
b. Remove the four T-15 Torxdrive screws that secure the top cover trim to
the instrument. The T-15 Torxdrive screws also secure the snap studs to the top cover.
c. Grasp the back of the top cover trim and swing it upwards and toward
you to release it from the front panel trim.
d. Pull the front cover trim away from you and remove it from the
instrument.
3. Remove the carrying handle and the right/left side trim panels: Use Figure 4--3, page 4--13 as a guide.
a. Remove the two T-20 Torxdrive screws that secure the handle to the
instrument. Remove the handle from the instrument.
CAUTION. Over-tightening the handle screws may cause the handle to break off from the cabinet. Use a torque wrench to tighten the screws to 8--10 in.lb.
b. Slide the side trim panels towards the rear of the instrument allowing the
tabs to clear the cover openings, then pull out to remove the panels from the instrument.
4. Remove the front panel trim: Use Figure 4--3, page 4--13, as a guide.
a. Grasp the trim ring by its top edge and pull toward you to detach the
three plastic snaps. (Alternatively, you can use a flat-bladed screwdriver or other small prying tool to help you detach the snaps.)
b. Swing the bottom of the ring upward and off the front panel.
5. Remove the acquisition trim: Use Figure 4--3, page 4--13 as a guide.
a. Remove the six T-15 Torxdrive screws that secure the acquisition trim to
the instrument.
b. Remove the knobs from the electrical and optical ejector levers. Grasp
the knobs with your fingers and pull straight out.
c. Remove the acquisition trim from the instrument.
6. Reinstallation: Do in reverse steps 2 through 5 to reinstall the appropriate
trim.
4--12
DSA8200 Digital Serial Analyzer and Modules
Left side trim
Lever knob (6)
Removal and Installation Procedures
T-15 Torxdrive
screw (4)
Top cover trim
Right side trim
T-15 Torxdrive
screw (3)
Front panel trim
Acquisition trim
Carrying handle
T-15 Torxdrive screw (3)
Soldering aid
To remove the trim ring, slide the flat end of a soldering aid into the side slot on the trim ring. Press in, then lift up to hook it underneath, then pry up.
T-20 Torxdrive
screw (2)
Figure 4--3: Trim removal
DSA8200 Digital Serial Analyzer and Modules
4--13
Removal and Installation Procedures
Bottom Cover
1. Remove the bottom cover: See Figure 4--4, page 4--15.
2. Orient the instrument: Set the instrument so its top is down on the work
surface and its bottom is facing you.
a. Remove the five T-15 Torxdrive screws that secure the bottom cover to
the instrument.
b. Remove the bottom cover from the instrument.
3. Reinstallation: Do in reverse steps a and b to reinstall the bottom cover.
4--14
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
T-15 Torxdrive
screw (5)
Figure 4--4: Bottom cover removal
Bottom cover
DSA8200 Digital Serial Analyzer and Modules
4--15
Removal and Installation Procedures
Left and Right Covers
1. Remove the left and right covers: See Figures 4--5 and 4--6, pages 4--17 and 4--18.
H Trim (all)
H Bottom cover
2. Orient the instrument: Set the instrument so its rear is on the work surface and the front of the instrument facing the technician.
NOTE. All mounting screw holes are indicated by a star etched around the mounting hole.
a. Remove the thirteen T-15 Torxdrive screws that secure the covers to the
top and both sides of the chassis.
b. Remove the nine T-15 Torxdrive screws that secure the covers to the
bottom of the chassis.
c. Pull the bottom-right cover down and slide to the right to remove from
the instrument. Pull the top-left cover upward and slide to the left to remove from the instrument.
CAUTION. Take care not to bind or snag the covers on the instrument’s internal cabling as you remove or install.
3. Reinstallation: Do in reverse steps a through c to reinstall the cabinet.
4--16
DSA8200 Digital Serial Analyzer and Modules
Left side cover
Removal and Installation Procedures
All left and right cover mounting holes are indicated as shown.
T-15 Torxdrive screw (13)
Figure 4--5: Cover removal
Right side cover
DSA8200 Digital Serial Analyzer and Modules
4--17
Removal and Installation Procedures
Left side cover
4--18
Right side cover
T-15 Torxdrive
screw (9)
Figure 4--6: Cover removal
DSA8200 Digital Serial Analyzer and Modules
Pouch
Removal and Installation Procedures
Left side trim
Front panel trim
Front panel cover
Acquisition trim
Top cover trim
Left side cover
Rear foot
Right side cover
Right side trim
Carrying handle
Chassis
Bottom cover
Figure 4--7: External modules
DSA8200 Digital Serial Analyzer and Modules
4--19
Removal and Installation Procedures
Display adapter
board
Display inverter
Fan assembly
board
CD drive
CD drive trim
CD--RW/DVD/HD Interface board
Hard-drive
Drive frame
ATX chassis
ATX board
Microprocessor
Fan and heat sink
Bridge board
Processor board
Low-voltage power supply assembly
Standby/On switch
Display module
assembly
Figure 4--8: Internal modules
4--20
Front panel
assembly
Front panel knobs
Electrical frontend board
Acquisition board
Front panel board
Front panel keypad
Rear power
distribution
board
Front power
distribution
board
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
Large interface
circuit board
Large module
chassis
Small module
chassis
Electrical front
end circuit board
Acquisition
circuit board
Figure 4--9: Acquisition modules
Acquisition assembly
DSA8200 Digital Serial Analyzer and Modules
4--21
Removal and Installation Procedures

Procedures for Modules

You should have completed the Procedures for external modules before doing many of the procedures in this collection. The procedures found here are listed in disassembly order:
H Front Panel Assembly
H Front Panel Board
H Front Panel Keypad
H Display Assembly
H Display Adapter Board
H Standby/On Switch Flex Circuit
H Hard Disk Drive
H CD-RW/DVD Drive
H CD-RW/DVD and Hard Disk Drive Mounting Frame
H ATX Board Assembly
H ATX Board
H Microprocessor
H Front and Rear Power Distribution Boards
H PC Processor Board
H Low-Voltage Power Supply
H Fan Assembly
H Acquisition Assembly
H Large Module Interface Board
H Module Slot Doors
H Electrical Modules
H Optical Modules
H 80A00 and 82A00 Series Modules
4--22
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
Front Panel Assembly
1. Locate module to be removed: Locate the Front Panel assembly Figure 4--10, page 4--24. Additional modules to be removed:
H Trim (Front panel)
H CD-RW/DVD trim and drive
2. Remove the Front Panel assembly: See Figure 4--10, page 4--24.
3. Orient the instrument: Set the instrument so its bottom is down on the work
surface and its front panel is facing you.
a. Remove the six T-15 Torxdrive screws that secure the Front panel
assembly to the front chassis.
b. Grasp the bottom of the front panel assemblyand pull it towards you until
it catches.
c. Using a flat-tipped screw driver, from the side, insert its tip directly
above the USB port and below the front panel assembly. There is a piece of flexible metal there that keeps the front panel from slipping over the USB port.
d. Press up on the flexible piece of metal as you pull the front panel
forward and away from the instrument.
e. Use the
1
@8inch flat-bladed screwdriver to carefully lift J1 cable
connector lock up. Pull up on the J1 flex cable to disconnect it from the display module assembly. See Figure 4--11, page 4--25. Note the connector’s pin 1 index mark and the black stripe on the cable for later reassembly.
f. Pull the Front Panel assembly forward and remove from the instrument.
4. Reinstallation: Do in reverse steps a through f to reinstall the front panel
assembly.
DSA8200 Digital Serial Analyzer and Modules
4--23
Removal and Installation Procedures
J1 flex cable
Front panel
assembly
T--15 Torxdrive
screw (6)
Figure 4--10: Front panel assembly removal
4--24
DSA8200 Digital Serial Analyzer and Modules
Screwdriver
Removal and Installation Procedures
Black stripe toward connector
Screwdriver
Front Panel Board
Figure 4--11: J1 flex cable connector removal
1. Locate module to be removed: Locate the Front Panel assembly Figure 4--10, page 4--24. Additional modules to be removed:
H Front Panel Knobs
H Trim (front panel)
H CD-RW/DVD drive and trim
H Front Panel assembly
2. Remove the Front Panel board: See Figure 4--12, page 4--27.
a. Remove the eight T-15 Torxdrive screws that secure the Front panel
board to the Front panel assembly.
b. Pry the board up off the alignment studs. Place a flat bladed screwdriver
in the pry point access holes to pry the board up from the assembly.
c. Remove the board from the assembly.
3. Reinstallation: Do in reverse steps a through c to reinstall the front panel
board.
DSA8200 Digital Serial Analyzer and Modules
4--25
Removal and Installation Procedures
Front Panel Keypad
1. Locate module to be removed: Locate the Front Panel assembly Figure 4--10, page 4--24. Additional modules to be removed:
H Front Panel Knobs
H Trim (front panel)
H CD-RW/DVD drive and trim
H Front Panel assembly
H Front Panel Board
CAUTION. When removing or installing the keypad, make sure you do not touch the switch contact with your fingers. The oils in your fingers will degrade or damage the switch contacts. To help prevent damage to the keypad use cotton gloves when removing or installing the keyboard pad.
2. Remove the Front Panel keypad: See Figure 4--12, page 4--27.
a. Pull on each of the keypad support guides to separate the keypad from
the Front panel board. Use a pair of tweezers or equivalent tool to pull the keypad support guides.
b. Remove the keypad from the front panel board.
4--26
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
Keypad support
guide (9)
Keypad
Front panel board
T-15 Torxdrive
screw (8)
Display Assembly
Front panel knobs (8)
Figure 4--12: Front panel board and keyboard removal
3. Reinstallation: Do in reverse steps to reinstall the Keypad, front panel board, and the front panel assembly. Then see the following instructions:
a. Make sure the keypad is aligned properly on the Front Panel board.
b. Make sure the ribbon cable is routed correctly when installing the Front
Panel into the chassis.
1. Locate module to be removed: Locate the Display assembly, Figure 4--13, page 4--28. Additional modules to be removed:
H Trim (front panel and top)
2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front panel is facing you.
DSA8200 Digital Serial Analyzer and Modules
4--27
Removal and Installation Procedures
CAUTION. To avoid damage to the front panel Standby/On switch assembly, do not set the Display module assembly on a work surface. Sliding the instrument over the edge of the work surface could break off the Standby/On switch assembly.
3. Remove the Display assembly: See Figure 4--13, page 4--28.
a. Remove the four T-15 Torxdrive screws that secure the Display assembly
to the chassis.
b. Grasp the top and bottom edges of the Display assembly and pull
forward far enough to allow access to the ribbon cable connector.
c. Disconnect the J2 and J3 ribbon cables from the display assembly.
Remove the display module assembly from the instrument. See Figure 4--13, page 4--28.
T-15 Torxdrive
screw (4)
J3 ribbon cable
J2 ribbon cable
Display assembly
Figure 4--13: Display removal
4. Remove the Touch panel from the Display assembly: See Figures 4--14 and 4--15, pages 4--29 and 4--30.
4--28
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
CAUTION. To prevent degradation of the display sharpness, this procedure must be performed in a dust free environment. The service technician should wear cotton gloves to prevent finger oils from contaminating all surfaces of the display glass.
a. Disconnect J1, J4 and J7 cables from the Display Adapter circuit board.
b. Separate the assembly by carefully prying the Touch panel (outer)
assembly from the Display (inner) assembly. Insert a flat-bladed screwdriver in the access notches to push out on the Touch panel assembly.
Access notches
(top and bottom)
Touch panel
Figure 4--14: Touch panel and LCD assembly removal
5. Reinstallation: Do in reverse steps 1 through 5 to reinstall the Display assembly.
Display Adapter Board
1. Locate module to be removed: Locate the display adapter board in the locator diagram Internal Modules, Figure 4--7, page 4--19. Additional modules to be removed:
H Trim (front panel and top)
H Display assembly
2. Remove the Display Adapter Board: See Figures 4--15 and 4--16, page 4-- 30.
DSA8200 Digital Serial Analyzer and Modules
LCD module
4--29
Removal and Installation Procedures
3. Reinstallation: Do in reverse steps 2a through 2d to reinstall the board.
a. Disconnect J1, J6, and J7 cables from the Display Adapter board.
b. Slide the clip off the connector (at J4).
c. Disconnect J4 cable from the Display Adapter board.
d. Remove the two T-15 Torxdrive screws that secure the Display Adapter
circuit board to the Display assembly. Remove the Display Adapter from the assembly.
Display module
To J 4
To J 1
To CN2
CN2
Back view
Display inverter
board
Figure 4--15: Display adaptor board removal
To J 7
Phillips
screw (2)
CN1
Display adaptor
board
J6
J4
J1
J7
T--15 Torxd r i v e screw (3)
4--30
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
Standby/On Switch Flex
Circuit Removal
Slide the clip
over connector
J1
Clip to secure
connector as
J4
shown
Figure 4--16: Connector clip assembly
1. Locate module to be removed: Locate the Standby/On Switch flex circuit in the locator diagram Internal Modules, Figure 4--8, page 4--20. Additional modules to be removed:
H Trim (front panel and top)
H Display assembly
2. Orient the oscilloscope: Set the oscilloscope so its bottom is down on the work surface and its front is facing you.
3. Remove the Standby/On Switch flex circuit: See F igure 4--17, page 4--32.
a. Peel the Standby/On switch flex circuit away from the front of the
display assembly.
b. Disconnect the flex circuit from J7 on the Display Adapter circuit board.
c. Grasp the flex circuit and pull it out of the Display assembly.
4. Reinstallation: Do following procedure to reinstall the Standby/On Switch.
a. Remove the protective backing on the Standby/On switch flex circuit.
b. Slide the connector end of the Standby/On switch flex circuit through the
slot in the Display assembly. Make sure the flex circuit connector aligns with J7 on the Display Adapter circuit board.
c. Align the holes in the flex circuit to the two index posts on the front side
of the Display assembly.
d. Firmly press the flex circuit to the Display assembly chassis surface.
DSA8200 Digital Serial Analyzer and Modules
4--31
Removal and Installation Procedures
Standby/On switch
Display
assembly
flex circuit
Front view
Display adaptor board
Standby/On switch flex circuit
J7
Back view
Figure 4--17: Standby/On switch flex circuit removal
4--32
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
USB Assembly
1. Locate module to be removed: Locate the USB assembly in the locator diagram Internal Modules, Figure 4--8, page 4--20.
2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front panel is facing you.
3. Remove the USB assembly: See Figure 4--18, page 4--33.
a. Detach the J1 cable.
b. Remove the T-15 Torxdrive screw.
c. Pull the USB assembly toward you to detach it from the instrument.
4. Reinstallation: Do in reverse steps 3a through 3 to reinstall the USB
assembly.
J1 cable
T--15 Torxdrive screw
USB assembly
Figure 4--18: USB assembly removal
DSA8200 Digital Serial Analyzer and Modules
4--33
Removal and Installation Procedures
Hard Disk Drive
1. Locate module to be removed: Locate the Hard Disk Drive in the locator diagram Internal Modules, Figure 4--8, page 4--20.
CAUTION. Do not remove the replaceable hard disk drive when the mainframe is powered on. Power down the instrument and then turn off the mains switch located on the rear of the instrument (or remove the power cord).
Damage can occur to the replaceable hard disk drive and mainframe if the drive is removed while the mainframe is powered on.
2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its rear panel is facing you.
3. Remove the hard disk drive: See Figure 4--19, page 4--35.
a. Verify that the chassis is powered down.
b. Remove the two thumbscrews from the front of the hard disk drive
assembly.
c. Grasp the hard disk drive assembly and slide it out of the instrument.
4. Reinstallation: Do step a. Then, in reverse, do steps b and c to reinstall the
hard disk drive assembly.
4--34
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
Hard disk drive
assembly
Thumbscrews
Figure 4--19: Hard drive disk removal
5. Remove the hard disk drive from the cartridge: See Figure 4--20, page 4--36.
a. Remove the four #0 Phillips screws that fasten the hard disk drive to the
cartridge.
b. Carefully remove the hard disk drive from the cartridge.
DSA8200 Digital Serial Analyzer and Modules
4--35
Removal and Installation Procedures
Thumbscrews (2)
Hard drive chassis top
CD-RW/DVD Drive
T-15 Torxdrive
screw (2)
Hard drive interface
circuit board
Phillps screw (4)
Hard drive
Hard drive chassis bottom
Figure 4--20: Removing the hard disk drive from the cartridge
1. Locate module to be removed: Locate the CD-RW/DVD drive in the locator diagram Internal Modules, Figure 4--8, page 4--20. Additional modules to be removed:
4--36
H Trim (all)
H Bottom cover
H Left and Right covers
2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front panel is facing you.
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
3. Remove the CD-RW/DVD drive trim. See Figure 4--21, page 4--37. Remove the two Phillips screws that hold the trim to the mounting frame and remove the trim.
4. Remove the CD-RW/DVD drive. See Figure 4--21, page 4--37.
a. Place one thumb on each side of the front of the CD-RW/DVD drive and
your forefingers on the back of the drive.
b. Pull the drive straight toward you until the drive detaches from the
CD/HD interface board.
5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the CD-RW/DVD drive.
CD--RW/DVD
drive assembly
CD--RW/DVD drive trim
Phillips screw (2)
Figure 4--21: CD--RW/DVD disk drive removal
6. Remove the CD-RW/DVD drive from the cartridge: See Figure 4--22, page 4--38.
a. Remove the four small Phillips screws that fasten the CD-RW/DVD
drive to the mounting frame.
b. Remove the drive from the mounting frame.
DSA8200 Digital Serial Analyzer and Modules
4--37
Removal and Installation Procedures
7. Remove the interface circuit board. Detach the interface cicuit board from
8. Reinstallation: Do in reverse steps 6 and 7 to reinstall the mounting frame to
CD-RW/DVD drive assembly
the CD-RW/DVD drive.
the CD-RW/DVD drive.
CD-RW/DVD drive interface circuit board
CD-RW/DVD and Hard
Disk Drive Mounting
Frame
CD-RW/DVD drive mounting frame
Small Phillips screw (4)
Figure 4--22: Removing the CD-RW/DVD drive from the mounting frame
1. Locate module to be removed: Locate the CD-RW/DVD and hard drive mounting frame in the locator diagram Internal Modules, Figure 4 --8, page 4--20. Additional modules to be removed:
H Trim (all)
H Bottom cover
H Left and Right covers
H CD-RW/DVD drive
H Hard drive
2. Orient the instrument: Set the instrument so its bottom is down on the work surface and the side with the mounting drive side is facing you.
4--38
DSA8200 Digital Serial Analyzer and Modules
Removal and Installation Procedures
3. Remove the mounting frame. See Figure 4--23, page 4--39.
a. Remove the six T-15 Torxdrive screws that secure the mounting frame to
the ATX chassis.
b. Remove the CDD/HDD drive tape cable and the P1 cable from the
CDD/HDD interface board.
c. Grasp both far side corners of the drive frame.
d. Lift up and toward the rear of the instrument simultaneously.
e. Gently shift the frame from side to side as you pull it the rear until you
can remove it completely.
4. Reinstallation: Do in reverse the substeps of step 3 to reinstall the CD-RW/ DVD and hard drive mounting frame.
P2
P1
Drive frame
Drive interface board
cable access hole
T-15 Torxdrive screw (6)
ATX chassis
Figure 4--23: Hard drive and CD-RW/DVD drive mounting frame removal
DSA8200 Digital Serial Analyzer and Modules
4--39
Removal and Installation Procedures
ATX Board Assembly
1. Locate module to be removed: Locate the ATX Board Assembly in the locator diagram Internal Modules, Figure 4--8, page 4--20. Additional modules to be removed:
H Trim (all)
H Bottom cover
H Left and Right covers
H CD-RW/DVD and Hard Drive mounting frame
2. Remove the ATX Board Assembly: See Figure 4--24, page 4--41.
3. Orient the instrument: Set the instrument so its bottom is down on the work
surface and its side panel is facing you.
a. Remove the three T-15 Torxdrive screws that secure ATX board
assembly to the chassis.
b. Remove the four T-15 Torxdrive screws that secure ATX board assembly
to the rear chassis.
c. Grasp the front edge of the ATX board assembly and pull up on the
assembly to disconnect the Riser Adapter from the edge connector of the PC Processor board.
d. Detach the following connections from the microprocessor board: J410,
J8H1 (FP USB 1), and J300.
e. Remove the ATX board assembly from the instrument.
f. Reinstallation: Do in reverse steps 3a through 3e.
4--40
DSA8200 Digital Serial Analyzer and Modules
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