Tektronix DAS/TLA LADM935 Instruction Manual Instruction Manual

Instruction Manual
R
DAS
/TLA LADM935
SBus Bus Support 070-9609-00
There are no current European directives that apply to this product. This product provides cable and test lead connections to a test object of electronic measuring and test equipment.
Warning
The servicing instructions are for use by qualified personnel only. To avoid personal injury, do not perform any servicing unless you are qualified to do so. Refer to all safety summaries prior to performing service.
Online Version: April 1997
Copyright E Tektronix, Inc. All rights reserved. Licensed software products are owned by Tektronix or its suppliers and are protected by United States copyright laws and international treaty provisions.
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the Rights in T echnical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the Commercial Computer Software – Restricted Rights clause at F AR 52.227-19, as applicable.
T ektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes that in all previously published material. Specifications and price change privileges reserved.
Printed in the U.S.A. T ektronix, Inc., P.O. Box 1000, Wilsonville, OR 97070–1000 TEKTRONIX, TEK,, and DAS are registered trademarks of T ektronix, Inc.
HARDWARE WARRANTY
T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by T ektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the T ektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
SOFTWARE WARRANTY
T ektronix warrants that the media on which this software product is furnished and the encoding of the programs on the media will be free from defects in materials and workmanship for a period of three (3) months from the date of shipment. If a medium or encoding proves defective during the warranty period, T ektronix will provide a replacement in exchange for the defective medium. Except as to the media on which this software product is furnished, this software product is provided “as is” without warranty of any kind, either express or implied. T ektronix does not warrant that the functions contained in this software product will meet Customer’s requirements or that the operation of the programs will be uninterrupted or error-free.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period. If T ektronix is unable to provide a replacement that is free from defects in materials and workmanship within a reasonable time thereafter, Customer may terminate the license for this software product and return this software product and any associated materials for credit or refund.
THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
General Safety Summary iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Service Safety Summary v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Preface: Microprocessor Support Product Documentation vii. . . . . . . .
Manual Conventions vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Documentation viii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Getting Started 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Product Description 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer System Software Compatibility 1. . . . . . . . . . . . . . . . . . . . . . . . .
Logic Analyzer Configuration 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Requirements and Restrictions 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuring the Probe Adapter 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connecting to a System Under T est 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Setting Up the Application 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Group Definitions 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking Options 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Symbols 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acquiring and Viewing Disassembled Data 10. . . . . . . . . . . . . . . . . . . . .
Acquiring Data 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing Disassembled Data 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Display Format 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Display Format 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control Flow Display Format 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Subroutine Display Format 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Changing How Data is Displayed 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Optional Display Selections 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Marking Cycles 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Viewing the Reference Memory 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Specifications 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Probe Adapter Description 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Assignments 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
How Data is Acquired 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SBus Clocking 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternate Connections 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signals Not On the Probe Adapter 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Extra Acquisition Channels 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maintenance 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing Signal Leads 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacing Protective Sockets 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replaceable Parts 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parts Ordering Information 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Using the Replaceable Parts List 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Table of Contents
List of Figures
List of Tables
Figure 1–1: Connecting podlets to the SBus probe adapter 4. . . . . . . .
Figure 1–2: Placing the SBus probe adapter onto the SUT 5. . . . . . . . .
Figure 1–3: Hardware display format 11. . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 1–4: Minimum clearance of the probe adapter 15. . . . . . . . . . . .
Figure 1–5: SBus bus timing 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 1: Sbus probe adapter exploded view 27. . . . . . . . . . . . . . . . . . . .
Table 1–1: Control group symbol table definitions 7. . . . . . . . . . . . . . .
Table 1–2: Size group symbol table definitions 7. . . . . . . . . . . . . . . . . .
Table 1–3: Ack group symbol table definitions 8. . . . . . . . . . . . . . . . . .
Table 1–4: IntReq group symbol table definitions 8. . . . . . . . . . . . . . .
Table 1–5: Cycle type definitions 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Table 1–6: LADM935 PhysAddr group channel assignments 16. . . . . . .
Table 1–7: LADM935 Data group channel assignments 17. . . . . . . . . . .
Table 1–8: LADM935 Control group channel assignments 18. . . . . . . .
Table 1–9: LADM935 Size group channel assignments 18. . . . . . . . . . .
Table 1–10: LADM935 Ack group channel assignments 19. . . . . . . . . .
Table 1–11: LADM935 IntReq group channel assignments 19. . . . . . . .
Table 1–12: LADM935 Misc group channel assignments 20. . . . . . . . . .
Table 1–13: LADM935 clock channel assignments 20. . . . . . . . . . . . . . .
Table 1–14: Extra acquisition module sections and channels 22. . . . . . .
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General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the system.
Injury Precautions
Product Damage
Precautions
Avoid Electric Overload. To avoid electric shock or fire hazard, do not apply a
voltage to a terminal that is outside the range specified for that terminal. Avoid Electric Shock. To avoid injury or loss of life, do not connect or disconnect
probes or test leads while they are connected to a voltage source. Ground the Product. This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.
Do Not Operate in Wet/Damp Conditions. To avoid electric shock, do not operate this product in wet or damp conditions.
Do Not Operate in an Explosive Atmosphere. To avoid injury or fire hazard, do not operate this product in an explosive atmosphere.
Avoid Exposed Circuitry. To avoid injury, remove jewelry such as rings, watches, and other metallic objects. Do not touch exposed connections and components when power is present.
Use Proper Power Source. Do not operate this product from a power source that applies more than the voltage specified.
Do Not Operate With Suspected Failures. If you suspect there is damage to this product, have it inspected by qualified service personnel.
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General Safety Summary
Symbols and Terms
T erms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.
T erms on the Product. These terms may appear on the product: DANGER indicates an injury hazard immediately accessible as you read the
marking. WARNING indicates an injury hazard not immediately accessible as you read the
marking. CAUTION indicates a hazard to property including the product. Symbols on the Product. The following symbols may appear on the product:
DANGER
High Voltage
Protective Ground
(Earth) T erminal
ATTENTION
Refer to Manual
Double
Insulated
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Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service
procedures. Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is present.
Disconnect Power. To avoid electric shock, disconnect the main power by means of the power cord or, if provided, the power switch.
Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
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Preface: Microprocessor Support Product Documentation
This instruction manual is part of a two-manual set for operating bus support products on compatible Tektronix logic analyzers and contains specific informa­tion about the SBus support product. If you are familiar with operating support products on the logic analyzer for which this product was purchased, you probably only need to use this instruction manual to successfully operate the product.
One or more basic operations user manuals are included with bus support products. Each logic analyzer has its own basic operations manual that describes how to perform tasks common to bus support products on that platform. You should place the appropriate basic operations user manual in the notebook behind this instruction manual.
If you are not familiar with operating bus support products on a Tektronix logic analyzer, you will need to use the basic operations user manual with this instruction manual to operate the SBus support product.
This manual provides detailed information on the following topics:
H
Connecting the logic analyzer to the system under test
Manual Conventions
H
Setting up the logic analyzer to acquire data from the system under test
H
Acquiring and viewing disassembled data
H
The LADM935 probe adapter
This manual uses the following conventions:
H
The term disassembler refers to the application software that disassembles bus cycles into instruction mnemonics and cycle types.
H
The term SUT (system under test) refers to the bus-based system from which data is being acquired.
H
The term logic analyzer refers to the Tektronix logic analyzer for which this product was purchased.
H
The term acquisition module refers to the 92A96 data acquisition modules.
H
The term 92A96 refers to all versions of the 92A96, 92C96, and subsequent DAS/TLA acquisition modules unless otherwise noted.
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Preface: Microprocessor Support Product Documentation
H
The term XXX or P54C used in field selections and file names in the basic operations user manual can be replaced with SBus. This is the name of the bus in field selections and file names you must use to operate the support product.
H
A tilde (~) following a signal name indicates an active low signal.
Also refer to the Glossary in the basic operations user manual for definitions of logic analyzer, acquisition module, and disassembler terms.
Logic Analyzer Documentation
A description of other documentation available for each type of Tektronix logic analyzer is located in each basic operations user manual. The documentation provides the information necessary to install, operate, maintain, and service the logic analyzer and associated products.
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Getting Started
Product Description
The DAS/TLA LADM900 series of support products are developed by third parties to support buses, microprocessors, microcontrollers, and digital signal processors for specific Tektronix customers. These support products are currently being successfully used by these customers. If you need assistance in using this product, contact your local Tektronix Technical Support Specialist.
This chapter provides information on the following topics:
H
The LADM935 SBus support product
H
Logic analyzer system software compatibility
H
Your SBus system requirements
H
SBus support product restrictions
H
How to connect to your SUT (system under test)
The SBus Bus Support product disassembles data from systems based on SUN SPARC Technology microSPARC-II microprocessors (manufactured by Fujitsu) using SBus protocol. The instruction mnemonics are based on the SPARC Version 8 instruction set. The LADM935 product runs on a DAS/TLA logic analyzer equipped with at least one 92A96 Data Acquisition Module.
A complete list of accessories and options is provided at the end of the parts list in the Replaceable Parts chapter.
To use this product efficiently, you need to have the items listed in the basic operations user manual as well as the IEEE Standard for a Chip and Module Interconnect Bus (IEEE Std 1496-1993), IEEE, 1993.
Logic Analyzer System Software Compatibility
The label on the application floppy disk states which version of logic analyzer system software the application is compatible with.
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Getting Started
Logic Analyzer Configuration
To use the SBus support product, the logic analyzer must be equipped with at least one 92A96 module and four standard data acquisition probes.
The basic operations user manual contains information on how to configure the DAS/TLA under Configuring the Logic Analyzer in the Getting Started chapter.
Requirements and Restrictions
You should review the general requirements and restrictions of bus support products in the Getting Started chapter in the basic operations user manual as they pertain to your SUT:
You should also review the mechanical specifications in the Specifications chapter in this manual as they pertain to your system under test, as well as the following description of other SBus support product requirements and restrictions.
9201T DAS System. If you have a 9201T version of the DAS/TLA system, you must change the system to the 92XTerm or 9202XT version.
Burst Reads and Burst Writes. For Burst Reads and Burst Writes, the calculated address following the rules of Sub-Block Ordering are not supported.
64-Bit Extended Transfers. The 64- bit extended transfers are not supported.
Disabling the Instruction and Data Caches. To disassemble acquired data, you
must disable the internal instruction and data caches on the microSPARC-II microprocessor. Disabling the cache makes all instruction prefetches visible on the SBus bus so they can be acquired and disassembled.
Configuring the Probe Adapter
The probe adapter does not require any configuration.
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