Tektronix DAS/TLA LADM934 Instruction Manual Instruction Manual

Instruction Manual

R

DAS

/TLA LADM934

MBus Bus Support
070-9366-00

Copyright E Tektronix, Inc. 1995. All rights reserved. Licensed software products are owned by Tektronix or its
suppliers and are protected by United States copyright laws and international treaty provisions.

Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c)(1)(ii) of the
Rights in T echnical Data and Computer Software clause at DFARS 252.227-7013, or subparagraphs (c)(1) and (2) of the
Commercial Computer Software – Restricted Rights clause at F AR 52.227-19, as applicable.

T ektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication
supercedes that in all previously published material. Specifications and price change privileges reserved.

Printed in the U.S.A.
T ektronix, Inc., P.O. Box 1000, Wilsonville, OR 97070–1000

R

DAS

TEKTRONIX, TEK, and DAS are registered trademarks of T ektronix, Inc.

NT and DASR XP are trademarks of

Tektronix, Inc.

HARDWARE WARRANTY

T ektronix warrants that the products that it manufactures and sells will be free from defects in materials and
workmanship for a period of one (1) year from the date of shipment. If a product proves defective during this
warranty period, T ektronix, at its option, either will repair the defective product without charge for parts and labor,
or will provide a replacement in exchange for the defective product.

In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period and make suitable arrangements for the performance of service. Customer shall be
responsible for packaging and shipping the defective product to the service center designated by T ektronix, with
shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a
location within the country in which the T ektronix service center is located. Customer shall be responsible for
paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.

This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. T ektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than T ektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any
damage or malfunction caused by the use of non-T ektronix supplies; or d) to service a product that has been
modified or integrated with other products when the effect of such modification or integration increases the time
or difficulty of servicing the product.

THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND
EXCLUSIVE REMEDY PROVIDED TO THE CUST OMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT , SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR
THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

SOFTWARE WARRANTY

T ektronix warrants that the media on which this software product is furnished and the encoding of the programs on
the media will be free from defects in materials and workmanship for a period of three (3) months from the date of
shipment. If a medium or encoding proves defective during the warranty period, T ektronix will provide a
replacement in exchange for the defective medium. Except as to the media on which this software product is
furnished, this software product is provided “as is” without warranty of any kind, either express or implied.
T ektronix does not warrant that the functions contained in this software product will meet Customer’s
requirements or that the operation of the programs will be uninterrupted or error-free.

In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration
of the warranty period. If T ektronix is unable to provide a replacement that is free from defects in materials and
workmanship within a reasonable time thereafter, Customer may terminate the license for this software product
and return this software product and any associated materials for credit or refund.

THIS WARRANTY IS GIVEN BY TEKTRONIX IN LIEU OF ANY OTHER WARRANTIES, EXPRESS
OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’
RESPONSIBILITY TO REPLACE DEFECTIVE MEDIA OR REFUND CUSTOMER’S PAYMENT IS
THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS
WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER
TEKTRONIX OR THE VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH
DAMAGES.

Table of Contents

Getting Started

Operating Basics

General Safety Summary v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Service Safety Summary vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Preface: A Guide to DAS/TLA Documentation ix. . . . . . . . . . . . . . . . . . . . . . . . .

Product Description 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Logic Analyzer System Software Compatibility 1–2. . . . . . . . . . . . . . . . . . . . . . . . .

Logic Analyzer Configuration 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Requirements and Restrictions 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Configuring the DAS 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Configuring the Variable-Width Module 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing and Loading the Application 1–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Installing the Application 1–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Loading the Application 1–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Configuring the Probe Adapter 1–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connecting to the System Under T est 1–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Setting Up Disassembler Software 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Channel Groups and Assignments 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Changes that Affect Disassembly 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Custom Clocking 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Symbols 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Acquiring and Displaying Disassembled Data 2–6. . . . . . . . . . . . . . . . . . . . . . . . . .

Acquiring Data 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Viewing Disassembled Data 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Disassembly Format Definition Overlay 2–10. . . . . . . . . . . . . . . . . . . . . . . . . . .

Displaying Channel Groups Symbolically 2–12. . . . . . . . . . . . . . . . . . . . . . . . . .

Searching Through Disassembled Data 2–13. . . . . . . . . . . . . . . . . . . . . . . . . . . .

Printing Disassembled Data 2–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Reference Memory 2–13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

General Purpose Analysis 2–14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Clocking 2–15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Searching Through State and Timing Data 2–16. . . . . . . . . . . . . . . . . . . . . . . . . .

Printing State and Timing Data 2–16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Timing Display 2–16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

State Display 2–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Contents

Specifications

Maintenance

Replaceable Parts

Probe Adapter Description 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Channel Assignments 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MBus-2 Support Setup 3–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MBus_Tmg_96 Module Setup 3–10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

How Data is Acquired 3–16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Alternate Connections 3–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signals Not On the Probe Adapter 3–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Extra Channels 3–18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Care and Maintenance 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Removing And Replacing Signal Leads 4–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Parts Ordering Information 5–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Using the Replaceable Parts List 5–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Appendix

Index

Appendix A: Error Messages and Disassembly A–1. . . . . . . . . . . . . . . . . . . . . . . . . .

Module Error Messages A–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Slow Clock A–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Waiting for Stop A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Waiting for Stop-Store A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Waiting for Trigger A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Disassembly Problems A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Incorrect Data A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Other Suggestions A–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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List of Figures

Contents

Figure 1–1: DAS connected to a typical probe adapter 1–3. . . . . . . . . . . .

Figure 1–2: Applying slot number labels 1–5. . . . . . . . . . . . . . . . . . . . . . .

Figure 1–3: Jumper location 1–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 1–4: Connecting podlets to the MBus probe adapter 1–8. . . . . . .

Figure 1–5: Placing the MBus probe adapter onto the SUT 1–9. . . . . . . .

Figure 2–1: Disassembled data in the Hardware display format 2–9. . . .

Figure 3–1: Minimum clearance of the probe adapter 3–2. . . . . . . . . . . .

Figure 3–2: MBus bus timing 3–16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Figure 3–3: An example of jumper connections for dedicated

MBus signals 3–17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Contents

List of Tables

Table 2–1: Control group symbol table definitions 2–3. . . . . . . . . . . . . . .

Table 2–2: Size group symbol table definitions 2–4. . . . . . . . . . . . . . . . . .

Table 2–3: lrl_0 and lrl_1 group symbol table definition 2–4. . . . . . . . . .

Table 2–4: Cycle type definitions 2–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Table 3–1: MBus–2: V_Addr group channel assignments 3–3. . . . . . . . .

Table 3–2: MBus–2: Hi group channel assignments 3–3. . . . . . . . . . . . . .

Table 3–3: MBus–2: P_Addr_L group channel assignments 3–4. . . . . . .

Table 3–4: MBus–2: Data_H group channel assignments 3–5. . . . . . . . .

Table 3–5: MBus–2: Data_L group channel assignments 3–6. . . . . . . . . .

Table 3–6: MBus–2: Control group channel assignments 3–7. . . . . . . . .

Table 3–7: MBus–2: Size group channel assignments 3–8. . . . . . . . . . . . .

Table 3–8: MBus–2: lrl_0 group channel assignments 3–8. . . . . . . . . . . .

Table 3–9: MBus–2: lrl_1 group channel assignments 3–8. . . . . . . . . . . .

Table 3–10: MBus–2: JTAG group channel assignments 3–9. . . . . . . . . .

Table 3–11: MBus–2: Misc group channel assignments 3–9. . . . . . . . . . .

Table 3–12: MBus–2: Clock channel assignments 3–10. . . . . . . . . . . . . . . .

Table 3–13: MBus_Tmg_96: MAD_H group channel assignments 3–11. .
Table 3–14: MBus_Tmg_96: MAD_L group channel assignments 3–12. .
Table 3–15: MBus_Tmg_96: Control group channel assignments 3–13. .

Table 3–16: MBus_Tmg_96: lntr_0 group channel assignments 3–13. . . .

Table 3–17: MBus_Tmg_96: lntr_1 group channel assignments 3–14. . . .

Table 3–18: MBus_Tmg_96: JTAG group channel assignments 3–14. . . .

Table 3–19: MBus_Tmg_96: MISC group channel assignments 3–14. . . .

Table 3–20: MBus_Tmg_96: Clock channel assignments 3–15. . . . . . . . . .

Table 3–21: Extra 92C96 groups and channels 3–18. . . . . . . . . . . . . . . . . .

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General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it.

Only qualified personnel should perform service procedures.

While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.

Injury Precautions

Do Not Operate in an

Explosive Atmosphere

Avoid Exposed Circuitry

To avoid injury or fire hazard, do not operate this product in an explosive
atmosphere.

To avoid injury, remove jewelry such as rings, watches, and other metallic
objects. Do not touch exposed connections and components when power is
present.

Product Damage Precautions

Provide Proper Ventilation

Do Not Operate With

Suspected Failures

To prevent product overheating, provide proper ventilation.

If you suspect there is damage to this product, have it inspected by qualified
service personnel.

Safety Terms and Symbols

Terms in This Manual

These terms may appear in this manual:

WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.

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General Safety Summary

CAUTION. Caution statements identify conditions or practices that could result in
damage to this product or other property.

Terms on the Product

These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read the

marking.
WARNING indicates an injury hazard not immediately accessible as you read the

marking.
CAUTION indicates a hazard to property including the product.

Symbols on the Product

The following symbols may appear on the product:

DANGER

High Voltage

Certifications and Compliances

EMC Compliance

This product has demonstrated compliance to the Electromagnetic Compatibility
(EMC) specifications when attached to the instrument identified in the product
specifications. If this probe is attached to an instrument other than the one
identified in the product specifications, the EMC performance may exceed the
EMC specifications published with the instrument.

Protective Ground

(Earth) T erminal

ATTENTION

Refer to Manual

Double

Insulated

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Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service

procedures.

Do Not Service Alone

Disconnect Power

Use Care When Servicing

With Power On

Do not perform internal service or adjustments of this product unless another
person capable of rendering first aid and resuscitation is present.

To avoid electric shock, disconnect the main power by means of the power cord
or, if provided, the power switch.

Dangerous voltages or currents may exist in this product. Disconnect power,
remove battery (if applicable), and disconnect test leads before removing
protective panels, soldering, or replacing components.

To avoid electric shock, do not touch exposed connections.

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Preface: A Guide to DAS/TLA Documentation

The Digital Analysis System (DAS) documentation package provides the
information necessary to install, operate, maintain, and service the DAS/NT,
DAS/XP, and 92XTerm system and modules, and TLA 510 and TLA 520 system
units. The DAS/TLA documentation consists of the following:

H

The DAS System User Manual or TLA 500 Series Logic Analyzer User
Manual, the main reference manuals for the DAS/TLA systems, that

provides an overview of the operating system, basic installation information,
a tutorial for new users, and information for system-level menus.

H

The DAS 92A96 & 92C96 Acquisition Module User Manual that provides
detailed information on the 92A96 and 92C96 Data Acquisition Modules
and application; consult this manual for information on the 92A96 and
92C96 Setup and Display menus, and for information on how to connect
acquisition probes to the system under test.

H

A series of other module user manuals that provide detailed information on
the data acquisition and pattern generation modules available for use with the
DAS/TLA systems; consult the individual manuals for information on the
Setup and Display menus for each module and for information on how to
connect the probes to the system under test.

H

An LA-OffLine User Manual that describes how to transfer, display, and
analyze data (acquired on a DAS/TLA system) from a personal computer or
a workstation.

H

A series of bus, microprocessor, microcontroller, data communications, and
digital signal processor support product instruction manuals that describe the
various support products available with the DAS/TLA systems.

H

A technician’s reference manual that provides service information for
qualified service technician to isolate problems to the module level.

H

A series of software user manuals that accompany the various software
support products.

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Preface

About This Manual

This manual is based on the assumption that you are familiar with how to
operate the system software for the DAS, TLA 510 and TLA 520 logic analyz­ers, and the 92A96 acquisition module application. Therefore, details about the
system software and the acquisition application, and how to move through the
menu structures are not provided. An overview of some of those functions is
provided so that you do not need to consult another manual.

This manual provides detailed information for the MBus support product on how
to do the following:

H

Install and load application software

H

Connect to your system under test

H

Setup the disassembler software and use it

H

View acquired data
The following conventions are used in this manual:

H

The terms disassembler and disassembler software are used interchangeably

in reference to the MBus support software that disassembles bus cycles into

instruction mnemonics and cycle types.

H

The term SUT (system under test) is used to refer to the MBus from which

data is being acquired.

H

References to DAS include TLA 510 and TLA 520 system units unless

otherwise noted; these Tektronix Logic Analyzer (TLA) products operate

identically to the DAS.

H

References to 92C96 Modules include all versions of this modules unless

otherwise noted.

H

A signal that is active low has a tilde (~) following its name.

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Getting Started

The DAS 92DM900 series of support products are developed by third parties to
support buses, microprocessors, microcontrollers, and digital signal processors
for specific Tektronix customers. These support products are currently being
successfully used by these customers. If you need assistance in using this
product, contact your local Tektronix Technical Support Specialist.

This section provides information on the following:

H

The MBus Support product

H

Logic analyzer system software (DAS) compatibility

H

Logic analyzer configuration (DAS)

H

Your MBus system requirements

H

MBus support restrictions

H

How to install and load software

H

How to configure the probe adapter

Product Description

H

How to connect the DAS to the system under test

The MBus Bus Support product disassembles data from systems based on Texas
Instruments SuperSPARC microprocessors using MBus protocol. The instruction
mnemonics are based on the SPARC Version 8 and SuperSPARC instruction set.
The MBus support product runs on a DAS logic analyzer equipped with at least
two 92C96 Acquisition Modules.

These products consist of an application on a floppy disk, a probe adapter, and
this manual. The application includes setup files, one demonstration reference
memory, and a disassembler program. A complete list of all accessories and
options is provided at the end of the mechanical parts list in the Replaceable
Mechanical Parts section.

A demonstration reference memory is provided so you can see an example of
disassembled instruction mnemonics. You can view the reference memory
without connecting the DAS to your SUT. The reference memory is automatical­ly installed on the logic analyzer when you install the disassembler software.
Directions for viewing this file can be found in the Operating Basics section.

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Getting Started

To use this product efficiently, you need to have the following:

H

Knowledge of your specific DAS configuration and its operation

H

Knowledge of your MBus and SuperSPARC system

H

This manual

H

The DAS System User Manual, Tektronix, Inc.

H

The 92C96 Module User Manual, Tektronix, Inc.

H

The SPARC MBus Interface Specification, SPARC International, Inc. 1991

Logic Analyzer System Software Compatibility

The LADM934 MBus Support Product is compatible with any DAS System
Software Release 3, Version 1.5 or higher. You can operate the software in an X
window on a workstation (X terminal) or an X11/R4-compatible display.

Logic Analyzer Configuration

To use the bus support product, your DAS must be equipped with two 92C96
Modules. The modules must be combined to form a variable–width (192–chan­nel wide) module in a single DAS mainframe.

Figure 1–1 shows an overview of a DAS connected to a typical probe adapter.

1–2

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DAS

92A96 Probe

cables

Getting Started

To 92A96 Cards

Probe adapter

Figure 1–1: DAS connected to a typical probe adapter

Requirements and Restrictions

This section describes requirements and restrictions of the bus support product.

MBus System and Probe Adapter Cooling. You must retain the original level of
cooling for your system after you install the probe adapter. To maintain the
required operating temperature, you may need to provide additional cooling for
the probe adapter.

92A96 Interface

housing

Clock probe

8-Channel probe

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Getting Started

Disabling the Instruction and Data Caches. To disassemble acquired data, you
must disable the internal instruction and data caches on the SuperSPARC
microprocessor. Disabling the cache makes all instruction prefetches visible on
the MBus bus so they can be acquired and disassembled.

Configuring the DAS

When there are two or three 92C96 Modules in adjacent slots, they are automati­cally formed into a variable-width module by the system software at power up. If
you need to to use one 92C96 Module from a variable-width module, you must
reconfigure the DAS prior to selecting software support in the 92C96 Configura­tion menu. Refer to the discussion of the System Configuration menu in the DAS
System User Manual for details on how to reconfigure variable-width modules.

Configuring the Variable-Width Module

To acquire data from a system using MBus protocol, two 92C96 Modules are
required; they must be configured into one variable–width module (192–chan­nels wide).

When using a variable–width module, both modules must be positioned in
adjacent DAS slots in a single mainframe. You cannot use slots 1 or 8 when
creating a variable–width module. The modules do not need to have the same
memory depth.

Check the System Configuration menu to see if the module is defined correctly.
The Module in the higher–numbered slot is referred to as the HI module; the

module in the lower–numbered slot is referred to as the LO module. Probe
connections on the probe adapter board are labeled to identify which module and
which probe group connects to them. For example, HI_A0 indicates the A0
probe group from the HI module.

Clock pins on the probe adapter do not have the HI/LO designation; they are just
labeled CK0, CK1, CK2, and CK3. Each pair of clock pins connect to the same
signal on the probe adapter. The clock probes from both modules must connect
to the appropriate clock pins for custom clocking to function properly.

Refer to your module user manual for information about variable–width
modules, and for additional information about connecting probe cables, and
positioning and installing modules.

In a system with many modules, it is easier to identify which modules are
connected to the probe adapter if slot number labels are applied to the 92C96
probe interface housings and DAS mainframe. Figure 1–2 shows where to apply
slot number labels.

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Apply slot number labels here.

Figure 1–2: Applying slot number labels

Getting Started

Installing and Loading the Application

When you install the bus support software on the DAS system, you copy the
files from the floppy disk to the mainframe’s hard disk. When you load the
application, the software from the mainframe’s hard disk is loaded into the DAS
system RAM.

If you have the 9201T version of the DAS system, you must change the system
to the 92XTerm or 9202XT version.

Installing the Application

One floppy disk is shipped with the LADM934 support product for installing the
application on a DAS system. The amount of disk free space required after
installation is shown on the label of the floppy disk. During installation, you will
need approximately twice that amount of disk space.

To install the application onto the DAS, follow these steps:

1. Power on the DAS mainframe.

2. Insert the disk labeled LADM934 Bus Support into the DAS’s floppy drive.

3. Press the Select Menu key, and select the Disk Services menu.

4. Select Install Application in the Operation field of the menu.

5. Press F8: EXECUTE OPERATION, and follow the on-screen prompts.

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NOTE. After each install and load operation, a message appears on the screen
informing you the operation succeeded or failed. If the message tells you the
operation failed, you may need to remove applications or files from the hard disk
and try installing or loading again. If the operation fails again, refer to

Appendix A: Error Messages and Disassembly Problems.

If there is inadequate disk free space available on the hard disk, you must use the
Remove Application or Delete File function of the Disk Services menu to free up
enough disk space to install the application.

For information on installing the LA-OffLine bus support application on your
workstation, refer to the LA-OffLine User Manual.

Loading the Application

To load the MBus disassembler, follow these steps:

1. Press the Menu Select key, select the appropriate 92C96 module, and select

its Configuration menu.

2. Select MBus–2 Support in the Software Support field.
When you load the disassembler, the Channel, Clock, and Trigger menus are

automatically set up to acquire data from your MBus system. You can change the
setups in the Clock and Trigger menus as needed. Refer to Channel Groups and
Assignments in the next section for information on what can be changed in the
Channel menu.

If you want to perform general purpose analysis, such as timing using Internal or
External clocking, you need to restore the MBus_Tmg_96 Module Setup file. To
do this, follow these steps:

1. Press the Menu Select key and select the Save/Restore utility menu.

2. Select Restore Setup in the Operation field of the Save/Restore menu.

3. Select MBus_Tmg_96 in the File field.

4. Press F8: EXECUTE OPERATION.

When you restore the MBus_Tmg_96 setup file, the Channel menu is automati­cally set up to acquire multiplexed address and data from your MBus system.

Configuring the Probe Adapter

You can use the MCLK jumper, J150, to set the source of the clock signal on the
probe adapter for proper clocking. The jumper position must match the MCLK
signal used in the your MBus system: MCLK0, MCLK1, MCLK2, or MCLK3.
Figure 1–3 shows the location of the MCLK jumper.

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J150

Figure 1–3: Jumper location

Getting Started

Connecting to the System Under Test

Before you connect to the SUT, you must connect the standard probes to the
92C96 module card. Your SUT must also have a minimum amount of clear space
surrounding the MBus connector to accommodate the probe adapter.

To connect the DAS to the SUT, follow these steps:

1. Turn off power to your SUT. It is not necessary to turn off power to the DAS

CAUTION. Static discharge can damage the microprocessor, the probe adapter,
the podlets, or the 92C96 Module. To prevent static damage, handle all of the
above only in a static–free environment.

Always wear a grounding wrist strap or similar device while handling the probe
adapter.

2. To discharge your stored static electricity, touch the ground jack located on

the back of the DAS. Then, touch any of the ground pins of the probe
adapter to discharge stored static electricity from the probe adapter.

3. Connect the 92C96 clock and 8–channel probes to the probe adapter as

shown in Figures 1–4. Match the channel groups and numbers on the probe
interface housing to the corresponding pins on the probe adapter. Match the
ground pins on the probes to the corresponding pins on the probe adapter.

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Hold the 8-Channel probes by the podlet
holder when connecting them to the
probes adapter. Do not hold them by the
cables or necks of the podlets.

8-Channel probes

Clock probes

Probe adapter

Figure 1–4: Connecting podlets to the MBus probe adapter

4. Align pin 1 on the probe adapter connector with pin 1 on the connector in

your SUT and connect the two together as shown in Figure 1–4.

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