Tektronix CSA8000B, CSA8000, TDS8000, TDS8000B, CSA8200 Service Manual

...

Service Manual

CSA8000 Series Communications Signal Analyzers, TDS8000 Series Digital Sampling Oscilloscopes, and Modules

071-0438-07

Warning

The servicing instructions are for use by qualified personnel only. To avoid personal injury, do not perform any servicing unless you are qualified to do so. Refer to all safety summaries prior to performing service.

www.tektronix.com

Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries or suppliers, and are protected by national copyright laws and international treaty provisions.

Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes that in all previously published material. Specifications and pri ce change privileges reserved.

TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

Contacting Tektronix

Tektronix, Inc. 14200 SW Karl Braun Drive P.O. Box 500 Beaverton, OR 97077 USA

For product information, sales, service, and technical support:

H In North America, call 1-800-833-9200.

H Worldwide, visit www.tektronix.com to find contacts in your area.

Warranty 2

Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1) year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its option, either will repair the defective product without charge for parts and labor, or will provide a replacement in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty work may be new or reconditioned to like new performance. All replaced parts, modules and products become the property of Tektronix.

In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible for packaging and shipping the defective product to the service center designated by Tektronix, with shipping charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping charges, duties, taxes, and any other charges for products returned to any other locations.

This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product; b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or integrated with other products when the effect of such modification or integration increases the time or difficulty of servicing the product.

THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PAR TICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY . TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS ADV ANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.

Operating Information

General Safety Summary ix...................................

Service Safety Summary xi....................................

Preface xiii...................................................

Manual Structure xiii................................................

Manual Conventions xiii..............................................

Related Documentation xiv...........................................

Installation 1--1...............................................

Check the Environmental Requirements 1--1..............................

Site Considerations 1--1...........................................

Operating Requirements 1--1.......................................

Rackmount Requirements 1--2......................................

Install the Sampling Modules 1--2.......................................

Check Your Sampling Module Manual(s) 1--2..........................

Maximum Configuration 1--3.......................................

Connect the Peripherals 1--3...........................................

Power On the Instrument 1--5..........................................

Powering Off the Instrument 1--6.......................................

Software Installation 1--7..............................................

Description 1--7.................................................

Software Release Notes 1--7........................................

Operating System Reinstallation 1--7.................................

System Hard Drive Rebuild 1--8....................................

System Diagnostics 1-- 8...........................................

Windows Safe Mode 1--8..........................................

Theory of Operation

Theory of Operation 2--1.......................................

Logic Conventions 2--1...............................................

Mainframe Overview 2--1.............................................

Input Signal Path 2--1.............................................

Display Panel 2--2................................................

Front Panel 2--2..................................................

Rear Panel 2--2..................................................

Low Voltage Power Supply 2--2.....................................

Fans 2--3.......................................................

Electrical Sampling Modules Overview 2--3..............................

80E01, 80E02, 80E03, 80E06, 80E07, and 80E09 Sampling Modules 2--3...

80E04, 80E08, and 80E10 TDR/Sampling Modules 2--4.................

CSA8000 & TDS8000 Series Instruments and Modules

Table of Contents

Optical Sampling Modules Overview 2--5................................

80C01 Optical Sampling Module 2--7................................

80C02 Optical Sampling Module 2--7................................

80C03 Optical Sampling Module 2--8................................

80C04 Optical Sampling Module 2--8................................

80C05 Optical Sampling Module 2--9................................

80C06 Optical Sampling Module 2--9................................

80C07 Optical Sampling Module 2--9................................

80C07B Optical Sampling Module 2--10...............................

80C08 Optical Sampling Module 2--10................................

80C08B Optical Sampling Module 2--10...............................

80C08C Optical Sampling Module 2--11...............................

80C09 Optical Sampling Module 2--11................................

80C10 Optical Sampling Module 2--11................................

80C11 Optical Sampling Module 2--12................................

80C12 Optical Sampling Module 2--12................................

80A01 Trigger Prescale Preamplifier Module 2--12..........................

80A02 EOS/ESD Protection Module 2--13.................................

80A05 Electrical Clock Recovery Module 2--13............................

80A06 PatternSync Trigger Module 2--14.................................

82A04 Phase Reference Module 2--14....................................

Adjustment Procedures

Maintenance

Adjustment Interval 3--1..............................................

Adjustment Environment 3--1..........................................

Adjustment After Repair 3--1..........................................

Required Equipment 3--2..............................................

Instrumentation Setup 3--2.............................................

Main Instrument Adjustments 3--3......................................

DC Calibrator Adjust 3--3..........................................

DC Calibrator Adjust Verification 3--4...............................

Internal 10 MHz Adjust 3--5........................................

Preventing ESD 4--1.................................................

Inspection and Cleaning 4--2...........................................

General Care 4--2................................................

Flat Panel Display Cleaning 4--2....................................

Exterior 4--3....................................................

Interior 4--4.....................................................

Removal and Installation Procedures 4--7.........................

Preparation 4--7.....................................................

Procedures for External Modules 4--9....................................

Front-Panel Knobs 4--9............................................

Trim and Carrying Handle 4--10.....................................

Bottom Cover 4--11...............................................

Covers 4--13.....................................................

Line Fuses and AC power cord connector 4--16.........................

CSA8000 & TDS8000 Series Instruments and Modules

Table of Contents

Procedures for Modules 4--21...........................................

Front Panel Assembly 4--21.........................................

Front Panel Board 4--23............................................

Front Panel Keypad 4--24...........................................

Display Assembly 4-- 25............................................

Display Adapter Board 4--27........................................

Standby/On Switch Flex Circuit Removal 4--29.........................

Floppy Disk Drive 4--31............................................

Hard Disk Drive 4--32.............................................

CD Drive 4--34...................................................

Fan Assembly Removal 4--35........................................

Front and Rear Power Distribution Boards 4--37.........................

Low-Voltage Power Supply 4--38.....................................

NLX Board 4--40.................................................

Microprocessor 4--43..............................................

PC Processor Board 4--45...........................................

Acquisition Assembly 4--47.........................................

Large Module Interface Circuit Board 4--53............................

Module Slot Doors 4 --55...........................................

Electrical Modules 4--64............................................

Exchanging the Electrical Sampling Module 4--65..........................

Replacing the sampling module chassis 4--65...........................

Reinstalling exchange module serial number 4--65.......................

Optical Modules 4--66.............................................

80A00 and 82A00 Series Modules 4--67...............................

Troubleshooting 4--69...........................................

Check for Common Problems 4--69......................................

Equipment Required 4 --72..............................................

Isolating Failures between the 80E0X/80C0X Modules or the Mainframe 4--72...

Isolating to a Board if Power Will Not Come Up 4--73....................

Checking the Power Supply Voltages 4--74...............................

If the instrument Will Not Boot 4--75.................................

Booting Into Windows 4--76.........................................

PPC and NLX PC Diagnostics 4--76......................................

Power-On Diagnostics 4--76.........................................

QAPlus/Win 4--76.................................................

Diagnostics 4--77.................................................

Firmware Updates 4--77................................................

After Repair 4--78....................................................

Installing the Instrument Model and Serial Number 4--78.....................

Update/Restore the NLX Board CMOS 4--79...............................

Repackaging Instructions 4--81...................................

Packaging 4--81......................................................

Shipping to the Service Center 4--81......................................

Diagrams

Symbols 5--1.......................................................

CSA8000 and TDS8000 Series Block Diagram 5--2.........................

Electrical Sampling Modules Block Diagram 5--3..........................

Optical Sampling Modules Block Diagrams 5--4...........................

80A01 Block Diagram 5--26............................................

CSA8000 & TDS8000 Series Instruments and Modules

iii

Table of Contents

Replaceable Parts

80A02 Block Diagram 5--27............................................

80A05 Block Diagram 5--28............................................

80A06 Block Diagram 5--29............................................

82A04 Block Diagram 5--30............................................

Replaceable Parts List 6-- 1......................................

Parts Ordering Information 6--1.........................................

Module Servicing 6--1............................................

Using the Replaceable Parts List 6--2....................................

CSA8000 & TDS8000 Series Instruments and Modules

List of Figures

Table of Contents

Figure 1--1: Compartments for sampling modules 1--2...............

Figure 1--2: Locations of peripheral connectors on rear panel 1--4.....

Figure 1--3: Line fuse and power cord connector locations,

rear panel 1-- 5.............................................

Figure 1-- 4: On/Standby switch location 1--6.......................

Figure 3-- 1: Adjustment setup using the DMM 3-- 3..................

Figure 3-- 2: Adjustment setup using the signal generator 3-- 5.........

Figure 4--1: Knob removal 4--9..................................

Figure 4--2: Trim removal 4--11...................................

Figure 4--3: Bottom cover removal 4--12............................

Figure 4--4: Cover removal 4--14..................................

Figure 4--5: Cover removal 4--15..................................

Figure 4--6: Line fuses and line cord removal 4--17...................

Figure 4--7: External modules 4--18................................

Figure 4-- 8: Internal modules 4-- 19................................

Figure 4-- 9: Acquisition modules 4-- 20.............................

Figure 4--10: Front panel assembly removal 4--22....................

Figure 4--11: J1 flex cable connector removal 4--23...................

Figure 4--12: Front panel board and keyboard removal 4--24..........

Figure 4--13: Display removal 4--26................................

Figure 4--14: Touch panel and LCD assembly removal 4--27...........

Figure 4--15: Display adaptor board removal 4--28...................

Figure 4--16: Connector clip assembly 4--28.........................

Figure 4-- 17: Standby/On switch flex circuit removal 4--30............

Figure 4--18: Floppy disk drive removal 4--31.......................

Figure 4--19: Hard drive disk removal 4--33.........................

Figure 4--20: Removing the hard disk drive from the cartridge 4--33....

Figure 4--21: CD drive and bracket removal 4--35....................

Figure 4--22: Fan assembly removal 4--36...........................

Figure 4--23: Front and rear power distribution board removal 4--37...

Figure 4-- 24: Low-voltage power supply removal 4--39................

Figure 4--25: NLX assembly removal 4--41..........................

Figure 4--26: Riser adapter and NLX board removal 4--42............

Figure 4--27: Microprocessor removal 4--44.........................

CSA8000 & TDS8000 Series Instruments and Modules

Table of Contents

Figure 4--28: Processor board removal 4--46........................

Figure 4--29: T-10 screws and threaded posts 4--48...................

Figure 4--30: Thermal cover removal (8200 only) 4--49................

Figure 4--31: Acquisition circuit board assembly removal (8000) 4--50...

Figure 4--32: Acquisition circuit board assembly removal (8000B) 4--51.

Figure 4--33: Acquisition circuit board assembly removal (8200) 4--52...

Figure 4--34: Large module interface circuit board removal

(8000 and 8000B) 4--54.......................................

Figure 4--35: Large module interface circuit board removal (8200) 4--55.

Figure 4--36: Small and Large module chassis removal 4--57...........

Figure 4--37: Module door spring removal 4--59.....................

Figure 4--38: Module slot door removal 4--60........................

Figure 4--39: Module ejector handles removal 4--62..................

Figure 4--40: Spring arm position 4--63............................

Figure 4--41: Electrical module hardware removal 4--64..............

Figure 4--42: Optical module cover removal 4--66....................

Figure 4--43: 80A00 and 82A00 series parts removal

(80A01 shown) 4--67.........................................

Figure 4--44: Location of power-on and over current LEDs 4--73.......

Figure 4--45: Location of debug pins 4--74..........................

Figure 4--46: Connectors J1 and J2 4--75...........................

Figure 5--1: Block diagram for CSA8000 and TDS8000

Series Instruments 5--2......................................

Figure 5--2: Block diagram for the 80E00 Series Electrical

Sampling Modules 5-- 3......................................

Figure 5--3: 80C01 Optical sampling block diagram 5--4.............

Figure 5--4: 80C01 Optical sampling with clock recovery block

diagram 5--5..............................................

Figure 5--5: 80C02 Optical sampling block diagram 5--6.............

Figure 5--6: 80C02 Optical sampling with clock recovery block

diagram 5--7..............................................

Figure 5--7: 80C03 Optical sampling block diagram 5--8.............

Figure 5--8: 80C03 Optical sampling with clock recovery block

diagram 5--9..............................................

Figure 5--9: 80C04 Optical sampling block diagram 5--10.............

Figure 5--10: 80C04 Optical sampling block diagram with clock

recovery 5--1 1..............................................

Figure 5--11: 80C05 Optical sampling block diagram 5--12............

Figure 5--12: 80C06 Optical sampling block diagram 5--13............

CSA8000 & TDS8000 Series Instruments and Modules

Table of Contents

Figure 5--13: 80C07 and 80C07B Optical sampling block diagram 5--14.

Figure 5--14: 80C07 and 80C07B Optical sampling with CR1 clock

recovery block diagram 5--15.................................

Figure 5--15: 80C08/80C08B/80C08C Optical sampling block

diagram 5--16..............................................

Figure 5--16: 80C08/80C08B/80C08C Optical sampling with CR1,

CR2, & CR4 clock recovery block diagram 5--17.................

Figure 5--17: 80C09 Optical sampling block diagram 5--18............

Figure 5--18: 80C09 Optical sampling with CR1 clock recovery

block diagram 5--19.........................................

Figure 5--19: 80C10 Optical sampling block diagram 5--20............

Figure 5--20: 80C11 Optical sampling block diagram 5--21............

Figure 5--21: 80C11 Optical sampling with CR1 clock recovery

option block diagram 5--22...................................

Figure 5--22: 80C11 Optical sampling with CR2 and CR3 clock

recovery option block diagram 5--23...........................

Figure 5--23: 80C11 Optical sampling with CR4 clock recovery

option block diagram 5--24...................................

Figure 5--24: 80C12 Optical sampling block diagram 5--25............

Figure 5--25: 80A01 block diagram 5--26...........................

Figure 5--26: 80A02 block diagram 5--27...........................

Figure 5--27: 80A05 block diagram 5--28...........................

Figure 5--28: 80A06 block diagram 5--29...........................

Figure 5--29: 82A04 block diagram 5--30...........................

Figure 6--1: External parts 6--4..................................

Figure 6-- 2: Front panel and drives 6-- 7...........................

Figure 6-- 3: Power supply 6-- 10...................................

Figure 6--4: Acquisition 6--12.....................................

Figure 6--5: 8000 and 8000B coaxial cables 6--14.....................

Figure 6--6: 8200 coaxial cables 6--16..............................

Figure 6--7: 80E01, 80E02, 80E03, and 80E04 modules 6--18...........

Figure 6--8: 80E05 module (Option 10G shown) 6--19................

Figure 6--9: 80E06 module 6--20..................................

Figure 6--10: 80E07, 80E08, 80E09, and 80E10 modules 6--21..........

Figure 6--11: Optical modules 6--22................................

Figure 6--12: 80A01 module 6--23.................................

Figure 6--13: 82A04 module 6--24.................................

Figure 6--14: 80A06 module 6--26.................................

CSA8000 & TDS8000 Series Instruments and Modules

vii

Table of Contents

List of Tables

Table 1--1: Additional accessory connection information 1--3.........

Table 1--2: Line fuses 1--5......................................

T able 2--1: Module optical/electrical split 2--6......................

Table 3--1: Adjustments required for module replaced 3--1...........

Table 3--2: Required equipment and materials 3--2.................

T able 4--1: External inspection check list 4--3......................

T able 4--2: Internal inspection check list 4--4......................

Table 4--3: Tools required for module removal 4--8.................

Table 4--4: Failure symptoms and possible causes 4--69...............

Table 4--5: Power supply voltages 4--75............................

Table 4--6: Action required for module replaced 4--78................

viii

CSA8000 & TDS8000 Series Instruments and Modules

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to this product or any products connected to it. To avoid potential hazards, use this product only as specified.

Only qualified personnel should perform service procedures.

While using this product, you may need to access other parts of the system. Read the General Safety Summary in other system manuals for warnings and cautions related to operating the system.

ToAvoidFireor

Personal Injury

Use Proper Power Cord. Use only the power cord specified for this product and certified for the country of use. Power cord needed only in the mainframe, not modules.

Connect and Disconnect Properly. Do not connect or disconnect probes or test leads while they are connected to a voltage source.

Ground the Product. The mainframe is grounded through the grounding conductor of the power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.

Ground the Product. The modules are indirectly grounded through the grounding conductor of the mainframe power cord. To avoid electric shock, the grounding conductor must be connected to earth ground. Before making connections to the input or output terminals of the product, ensure that the product is properly grounded.

Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings and markings on the product. Consult the product manual for further ratings information before making connections to the product.

Do not apply a potential to any terminal, including the common terminal, that exceeds the maximum rating of that terminal.

Do Not Operate Without Covers. Do not operate this product with covers or panels removed.

Use Proper Fuse. Use only the fuse type and rating specified for this product.

Avoid Exposed Circuitry. Do not touch exposed connections and components

when power is present.

Wear Eye Protection. Wear eye protection if exposure to high-intensity rays or laser radiation exists.

Do Not Operate With Suspected Failures. If you suspect there is damage to this product, have it inspected by qualified service personnel.

CSA8000 & TDS8000 Series Instruments and Modules

General Safety Summary

Do Not Operate in Wet/Damp Conditions.

Do Not Operate in an Explosive Atmosphere.

Keep Product Surfaces Clean and Dry.

Provide Proper Ventilation. Refer to the manual’s installation instructions for

details on installing the product so it has proper ventilation.

Symbols and Terms

Terms in this Manual. These terms may appear in this manual:

WARNING. Warning statements identify conditions or practices that could result in injury or loss of life.

CAUTION. Caution statements identify conditions or practices that could result in damage to this product or other property.

Terms on the Product. These terms may appear on the product:

DANGER indicates an injury hazard immediately accessible as you read the marking.

WARNING indicates an injury hazard not immediately accessible as you read the marking.

CAUTION indicates a hazard to property including the product.

Symbols on the Product. The following symbols may appear on the product:

CAUTION

Refer to Manual

Mains Disconnected

OFF (Power)

WARNING

High Voltage

Mains Connected

ON (Power)

Protective Ground

(Earth) Terminal

Standby

CSA8000 & TDS8000 Series Instruments and Modules

Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service Safety Summary and the General Safety Summary before performing any service

procedures.

Do Not Service Alone. Do not perform internal service or adjustments of this product unless another person capable of rendering first aid and resuscitation is present.

Disconnect Power. To avoid electric shock, switch off the instrument power, then disconnect the power cord from the mains power.

Use Care When Servicing With Power On. Dangerous voltages or currents may exist in this product. Disconnect power, remove battery (if applicable), and disconnect test leads before removing protective panels, soldering, or replacing components.

To avoid electric shock, do not touch exposed connections.

CSA8000 & TDS8000 Series Instruments and Modules

Service Safety Summary

xii

CSA8000 & TDS8000 Series Instruments and Modules

Preface

Manual Structure

This is the service manual for the:

H CSA8000, CSA8000B, and CSA8200 Communications Signal Analyzers

H TDS8000, TDS8000B, and TDS8200 Digital Sampling Oscilloscopes

H modules that install in the instruments (except the 80A03 module)

NOTE. The 80A03 instruction manual contains its own specifications and servicing information.

Read this preface to learn how this manual is structured, what conventions it uses, and where you can find other information related to servicing this product. Read the Introduction following this preface for safety and other important background information needed before servicing this product.

This manual is divided into chapters, which are made up of related subordinate topics. These topics can be cross referenced as sections.

Manual Conventions

Modules

Replaceable Parts

Safety

Be sure to read the introductions to all procedures. These introductions provide important information needed to do the service correctly, safely, and efficiently.

This manual uses certain conventions that you should become familiar with before attempting service.

Throughout this manual, the term module appears. A module is composed of electrical and mechanical assemblies, circuit cards, interconnecting cables, and a user-accessible front panel. References to a module are different than references to products such as “Sampling modules”. “Phase Reference modules”, or “Accessory modules” which are products installed in the instrument compartments.

This manual refers to any field-replaceable assembly or mechanical part by its name or generically as a replaceable part. In general, a replaceable part is any circuit board or assembly, such as a hard disk drive, or a mechanical part, such as I/O port connectors, that is listed in the replaceable parts list of Chapter 8.

Symbols and terms related to safety appear in the General Safety Summary found at the beginning of this manual.

CSA8000 & TDS8000 Series Instruments and Modules

xiii

Preface

Installation

This section covers installation of the instrument, addressing the following topics:

H Check the Environment Requirements on page 1--1

H Install the Sampling Modules on page 1--2

H Connect the Peripherals on page 1--3

H Power On the Instrument on page 1--5

H Powering Off the Instrument on page 1--6

The basic operating software is already installed on the hard disk. If reinstallation of software becomes needed, see the following topic:

H Software Installation on page 1--7

Check the Environmental Requirements

Site Considerations

Operating Requirements

Read this section before attempting any installation procedures. This section describes site considerations, power requirements, and ground connections for your instrument.

The instrument is designed to operate on a bench or on a cart in the normal position (on the bottom feet). For proper cooling, at least two inches (5.1 cm) of clearance is recommended on the sides of the instrument.

You can also operate the instrument while it rests on its rear feet. Make sure that you properly route any cables coming out of the rear of the instrument to avoid damaging them.

CAUTION. Keep the bottom of the instrument clear of obstructions to ensure proper cooling.

Specifications in chapter 1 list the operating requirements for the instrument.

Power source and temperature, humidity, and altitude are listed.

CSA8000 & TDS8000 Series Instruments and Modules

1- 1

Installation

Rackmount Requirements

If this instrument is rackmounted, see the TDS8000 & CSA8000 Rackmount Instructions for additional site considerations or operating requirements. This

document ships with the Option 1R (rackmount kit).

Install the Sampling Modules

CAUTION. Do not install or remove any sampling modules while the instrument is powered on.

Always power the instrument down before attempting to remove or insert any sampling module.

WARNING. Sampling modules are inherently vulnerable to static damage. Always observe static-safe procedures and cautions as outlined in your sampling module user manual.

Check Your Sampling

Module Manual(s)

Read the sampling-module user manual for instructions on how to install your sampling modules.

Large-module compartments (2)

Small-module compartments (4)

Connect ESD wrist strap here

NOTE. After first installing a sampling module(s) or after moving a sampling module from one compartment to another, you should run compensation from the Utilities menu to ensure the instrument meets its accuracy specifications. You must run a compensation (accessed from the Utilities menu) whenever the extender configuration is changed from that present at the last compensation. In short, if you install or remove an 80E00 extender, run a compensation. If you exchange a extender for one of a different length, run a compensation.

Figure 1--1 shows compartments for both large and small sampling modules, along with the plug-in connector for the ESD wrist strap that you must use to install and remove these modules.

Figure 1- 1: Compartments for sampling modules

1- 2

CSA8000 & TDS8000 Series Instruments and Modules

Installation

Maximum Configuration

You can install up to two large sampling modules and four small modules for a maximum of 10 inputs (CSA and TDS 8000 and 8000B) or 12 inputs (CSA and TDS 8200). Of these inputs, only eight inputs can be active at one time. Also, note that installing a large module may disable a small-module compartment. Refer to the user manual for compartment interaction for the various CSA and TDS 8000 Series mainframes.

Install probes, cables, and other connection accessories to your sampling modules as appropriate for your application and sampling module. Again, consult your sampling-module and connection-accessory manuals. Continue with the next section after installing the sampling modules.

Connect the Peripherals

The peripheral connections are mostly the same as those you would make on a personal computer. The connection points are shown in Figure 1--2. See Table 1--1 on page 1--3 for additional connection information.

WARNING. Before installing peripheral accessories to connectors (mouse, keyboard, etc.), power down the instrument. See Powering Off the Instrument on page 1--6.

Table 1- 1: Additional accessory connection information

Item Description

Monitor If you use a non-standard monitor, you may need to change the the

Windows display settings to achieve the proper resolution for your monitor.

Printer Connect the printer to the EPP (enhanced parallel port) connector directly. If

your printer has a DB-25 connector, use the adapter cable that came with your printer to connect to the EPP connector.

Rackmount Refer to the CSA8000 & TDS8000 Rackmount Installation Instructions for

information on installing the rackmount kit.

Other Refer to the Appli cation release notes (readme.txt) in the C:\Program

Files\TDSCSA8000\System directory of the instrument for possible additional accessory installation information not covered in this manual.

CSA8000 & TDS8000 Series Instruments and Modules

1- 3

Installation

Description..........................Icon/Label Locations

Monitor.............

Printer......................

RS-232.................

Network.............................

PS2 mouse

PS2 keyboard

1,2

......................

1,2

..............

USB................................

Audio line out.......................

Audio line in........................

Removable hard drive.....................

CD drive.........................

GPIB...........

Monitor....................

Card slot

...........

Gated trigger...........

Product ships with a USB keyboard, that plugs into the USB port, and a USB mouse that plugs into the back of the keyboard

Some instruments ship with the keyboard and mouse ports reversed.

Card slot not available on CSA/TDS8000B or CSA/TDS8200 instruments. The card slot is disabled in instruments running Microsoft Windows 2000.

Figure 1- 2: Locations of peripheral connectors on rear panel

1- 4

CSA8000 & TDS8000 Series Instruments and Modules

Power On the Instrument

Follow these steps to power on the instrument for the first time.

1. Check that the line fuses are correct for your application. Both fuses must be

Table 1- 2: Line fuses

Fuse type Rating Fuse part number

0.25 x 1.250 inch 8 A, fast blow, 250 V 159-0046-00 200-2264-00

5x20mm 6.3 A, fast blow, 250 V 159-0381-00 200-2265-00

Installation

the same rating and type. Fuse types require a unique cap and fuseholder. See

Table 1--2 and Figure 1--3.

Cap & fuseholder part number

Fuses AC powerPower switch

Figure 1- 3: Line fuse and power cord connector locations, rear panel

CAUTION. Connect accessories (such as a PS2 keyboard and mouse, and other accessories) before applying power to the product. Some accessories can be damaged if connecting or disconnecting with the instrument power on.

USB devices can be plugged or unplugged without first turning power off.

2. Connect the keyboard and mouse, observing the caution above.

NOTE. Connection of the keyboard and mouse is optional. You can operate most features without them, using the front-panel controls and the touchscreen.

3. Connect the power cord.

4. Turn the Power switch on at the rear panel. (See Figure 1--3 on page 1--5 for

switch location.)

5. Push the On/Standby switch to power on the instrument (see Figure 1--4 for

the switch location).

CSA8000 & TDS8000 Series Instruments and Modules

1- 5

Installation

Switch

Figure 1- 4: On/Standby switch location

6. Wait for the boot routine and low-level self test to complete.

7. Follow any instructions on the screen.

The internal setup software will automatically configure your instrument and install all required devices, depending on the installed accessories.

Powering Off the Instrument

The instrument has a built-in soft power-down function that safely powers down the instrument when you push the On/Standby button. You do not need to close the UI application or Windows before using the On/Standby button.

To completely remove power to the instrument, first soft power-down the instrument using the On/Standby button, and then set the power switch on the rear panel to off.

You can restore the UI application to the screen by clicking its button in the Windows Task bar.

1- 6

CSA8000 & TDS8000 Series Instruments and Modules

Software Installation

Installation

This section describes how to install the system software found on the 8000 Series OS Restore CDs that accompany this product. The instrument ships with the product software installed, so only perform these procedures if reinstallation

becomes necessary.

Description

Software Release Notes

The product software comprises two parts:

H Microsoft Windows. The Microsoft Windows operating system comes

preinstalled on the instrument. Microsoft Windows is the operating system

on which the user-interface application of this product runs. The CD-

ROM(s) included with your instrument contain the Windows operating

system which can be used to rebuild the instrument hard drive.

If you need to reinstall Windows, you may be able to do so without

rebuilding the instrument hard drive. See Operating System Reinstallation on

page 1--7 for more information.

H User Interface (UI) Application. The UI application complements the

hardware controls of the front panel, allowing complete set up of all

instrument features. The CD-ROM(s) included with your instrument contain

the UI application for reinstallation if rebuilding the hard drive.

Tektronix provides updates to the user interface application on a regular

basis. Updates can be obtained by visiting the Tektronix Web site at

www.tektronix.com.

Read the software release notes in the Release Notes file (or Readme file for earlier versions), if present, on the CD-ROM containing the user interface application before performing any installation procedures. This file contains additional installation and operation information that supercedes other product documentation.

After installation, you can also read the copy from a directory on the product:

C:\Programs Files\TDSCSA8000\System

Operating System

Reinstallation

CSA8000 & TDS8000 Series Instruments and Modules

If reinstalling Microsoft Windows becomes necessary, use the Windows Operating System restore CD(s) that came with your instrument. Follow the installation procedures provided with the CD(s). The procedures vary between instruments and the version of Microsoft Windows being installed.

NOTE. Only do the reinstall if the Microsoft Windows operating system is missing or corrupted.

1- 7

Installation

System Hard Drive

Rebuild

System Diagnostics

Windows Safe Mode

If you cannot reboot from the instrument hard drive, you must rebuild the instrument hard drive. This process will return the hard disk to the its original condition present when the instrument shipped.

Data and programs you may have installed will be lost when rebuilding the hard drive.

If you must rebuild the system hard drive, use the System Rebuild CD(s) that shipped with the instrument. Follow the instructions in the booklet found in the CD case.

In case of instrument problems, you may wish to run the system diagnostics. If needed, you can see the procedure in the Performance Verification and Specifica- tions manual.

If the instrument is turned off before the operating system boots, or if you’ve installed a third-party product with a driver incompatible with instrument start up, Windows will open in Safe mode. The touchscreen will be inoperable; therefore, you must install the standard-accessory mouse and keyboard to operate the instrument.

When you have finished investigating and removed any barrier to Windows start-up, you can reboot. If the instrument no longer boots to Safe mode, you can remove the keyboard and mouse if desired.

1- 8

CSA8000 & TDS8000 Series Instruments and Modules

Theory of Operation

This chapter describes the electrical operation of the instrument and sampling modules. The diagrams in Chapter 9 show the interconnections of the major circuit blocks.

Logic Conventions

The instrument contains many digital logic circuits. This manual refers to these circuits with standard logic symbols and terms. Unless otherwise stated, all logic functions are described using the positive-logic convention: the more positive of the two logic levels is the high (1) state, and the more negative level is the low (0) state. Signal states may also be described as “true” meaning their active state or “false” meaning their nonactive state. The specific voltages that constitute a high or low state vary among the electronic devices.

Mainframe Overview

This mainframe overview describes the basic operation of each functional circuit block as shown in Figure 5--1 on page 5--2.

General

Input Signal Path

The instrument control system is a dual Wintel/PowerPC based processor board. The platform features VGA resolution flat-panel display, transparent touch screen and user front-panel with direct access to commonly used scope functions. The instrument is also equipped with a mouse pointing device to facilitate access to more advanced scope functions

A signal enters the instrument through a direct coaxial connection to the input connector on a sampling module, or a real time probe connected to the sampling module channel.

Acquisition System. The acquisition system conditions the input signals, samples them, converts them to digital signals, and controls the acquisition process under direction of the processor system. The acquisition system includes the multisource trigger, acquisition timebase, and acquisition mode generation and control circuitry. The acquisition board is located in the bottom compartment of the instrument and can accommodate four small slot sampling plug-ins, two large slot plug-ins and a trigger/holdoff subsystem. Up to 8 vertical channels are accommodated simultaneously . Channels 1 and 2 (CSA and TDS8000 and 8000B) or channels 1, 2, 3, and 4 (CSA and TDS8200) can be either large or small slots. The presence of a module in one or both large slots displaces the

CSA8000 & TDS8000 Series Instruments and Modules

2- 1

Theory of Operation

small slot functionality in the corresponding small slots. The external trigger and all small slot channels feature a Tekprobe Level 2 probe power connector for additional front end signal conditioning functions like high input-impedance real-time probes, if equipped on the sampling module.

Processor System. The processor system contains a dual Wintel/PowerPC. The basic instrument configuration supports up to eight channels labeled Ch1 through Ch 8, provides two external trigger inputs for direct and prescaled triggering through built--in prescaler and is able to support two optional internal trigger sources associated with the large slot channels.

Display Panel

Front Panel

Rear Panel

Color LCD display Active-matrix touch panel.

Display System. The display system sends the text and waveform information to the display panel.

Touch Panel. The Display board sends information to the processor. Any changes in their settings are reported to the processor system.

The front panel board reads the front-panel switches and knob sensors. Any changes in their settings are reported to the processor system. The front panel board also turns the LEDs on and off and generates the bell signal.

Front-panel menu switches are also read by the PPC processor board. The processor sends any changes in menu selections to the processor system. The ON/STBY switch is one of the menu switches. However, it is not read by the front panel board, but passes through the front panel board to the low voltage power supply.

The hard drive and CD Rom provides access to stored waveform data and to load software to customized your instrument with your measurement needs. The GPIB allows for external control of the instrument.

Low Voltage Power Supply

2- 2

You can make hardcopies on the GPIB and RS-232 ports. Other ports from the front panel board: PC cardbus x 2 and cal adjust lock.

Outputs from the NLX board: SVGA, USB (1), sound, serial, parallel, Ethernet, mouse, keyboard.

The low voltage power supply is a switching power converter with active power factor control. It supplies power to all of the circuitry in the instrument.

The principal POWER switch, located on the rear panel, controls all power to the instrument including the Low Voltage Power Supply. The ON/STBY switch,

CSA8000 & TDS8000 Series Instruments and Modules

Theory of Operation

located on the front panel, also controls all of the power to the instrument except for part of the circuitry in the Low Voltage Power Supply.

The power supply sends a power fail (~PF) warning to the processor system if the power is going down.

Fans

The fan assembly provides forced air cooling for the instrument. The fans are controlled by the PPC processor.

Electrical Sampling Modules Overview

80E01, 80E02, 80E03,

80E06, 80E07, and 80E09

Sampling Modules

Table 2- 1: Electrical sampling module features

Feature 80E01 80E02 80E03 80E06 80E07 80E09

Number of independent channels 1 2 2 1 2 2

Bandwidth 50 GHz 12.5 GHz 20 GHz 70 GHz 30 GHz 60 GHz

Selectable bandwidths N.A. N.A. N.A. N.A. 20 GHz,

Signal connectors 2.4 mm

Remote sampler N.A. N.A. N.A. N.A. 2 meter cable 2 meter cable

The electrical sampling modules (non-TDR capable) are one- and two-channel sampling modules. Their basic features are listed in the following table. (The TDR capable sampling modules are describe later.)

40 GHz,

female

3.5 mm female

1.85 mm (V) female

30 GHz

2.92 mm (K) female

30 GHz, 60 GHz

1.85 mm (V) female

For the two-channel modules, a single strobe delivered from the instrument mainframe to both acquisition channels controls the timing of the strobe assertion to both channels. If channel-to-channel deskew is zero and the channel delays (if equipped) are matched, the sampling coincidence between channels is very close. Acquisition deskew function is carried out either by making separate acquisitions over individual acquisition windows or by adjusting Channel Delay (if equipped).

For the one-channel modules, an individual strobe delivered from the instrument mainframe to the acquisition channel controls the timing of the strobe assertion to the channel. Acquisition deskew function is carried out by moving the strobe timing for the channel to a unique acquisition window or by adjusting Channel Delay (if equipped).

CSA8000 & TDS8000 Series Instruments and Modules

2- 3

Theory of Operation

Most electrical channels feature a Tekprobe Level 2 probe power connector for attachment of a real time probe. The control of this probe is a mainframe function.

All module calibration signals are derived from a 2.5 V precision voltage reference internal to the sampling module. Settings derived from this reference are stored in a non-volatile EEPROM in the sampling module, although the responsibility for the execution of these settings is with the mainframe.

For major functional circuit blocks refer to Figure 5--2 on page 5 --3.

80E04, 80E08, and 80E10

TDR/Sampling Modules

The TDR/Sampling modules are low noise samplers, with each channel capable of generating its own Time Domain Reflectometry (TDR) step. The basic features of these modules are listed in the following table.

Table 2- 2: TDR sampling module features

Feature 80E04 80E08 80E10

Number of independent channels 2 2 2

Number of TDR channels 2 2 2

Bandwidth 20 GHz 30 GHz 50 GHz

Selectable bandwidths N.A. 20 GHz, 30 GHz 40 GHz, 30 GHz, 50 GHz

Signal connectors 3.5 mm female 2.92 mm (K) female 1.85 mm (V) female

Remote sampler N.A. 2 meter cable 2 meter cable

For these modules, a single strobe delivered from the instrument mainframe to both acquisition channels controls the timing of the strobe assertion to both channels. If channel-to-channel deskew is zero and the channel delays (if equipped) are matched, the sampling coincidence between channels is very close. Acquisition deskew function is carried out by making separate acquisitions over acquisition windows or by adjusting Channel Delay (if equipped).

2- 4

Each electrical channel features a Tekprobe Level 2 probe power connector for attachment of a real time probe. The control of this probe is a mainframe function.

When used in the acquisition mode (that is, with the TDR step generator turned off) each channel functions as a normal sampling input. In the TDR mode, a fast rise time step is generated internally for each channel and applied to the input signal path for that channel. The acquisition portion of the TDR/sampling

CSA8000 & TDS8000 Series Instruments and Modules

module remains functional for monitoring the primary step and its reflected components. The sampling module provides two self- contained TDR channels. The polarity of the output step can be selected independently for each channel. This allows differential or common mode testing of two coupled lines as well as independent testing of isolated lines.

For major functional circuit blocks refer to Figure 5--2 on page 5 --3.

Optical Sampling Modules Overview

80C0X and 80C0X-CR optical modules share the same mechanical package and are built with a common circuit board. Different functionality within the modules (current and future modules) is achieved by installing different O/E modules, filters and clock recovery boards along with setting the sampler bandwidth as demanded. The key features supported in the module are:

H A one channel, low noise, adjustable bandwidth sampler allowing multiple

bandwidth settings for optimizing noise versus bandwidth demands.

Theory of Operation

H An amplified or non-amplified O/E converter.

H Support for internal RF switches in the signal path with a straight-through

path and two hardware-filtered reference receiver paths between the O/E

converter and the sampler.

H An average optical power meter.

H Integral clock recovery option with internal coaxial connection to the

mainframe trigger, front panel clock and data output (not all have data).

H Communication with the mainframe for identification, control and calibra-

tion/compensation storage.

The “system response” depends on all of the components in the signal path from the front panel to the sampler. Bandwidth and reference receiver responses are calibrated at the factory with a sub-picosecond optical impulse applied to the front panel connector or with an optical heterodyne system. This insures that all components are included, but also means that components can not be replaced without performing calibration.

Compensation performs a DC transfer curve characterization for each bandwidth/ reference receiver setting. The curve data is stored in the module’s EEPROM and used to generate a look-up table in the mainframe. This data corrects for linearity, gain and offset errors in the sampler.

Reference receivers can be created in any of the following ways:

H A hardware filter inserted between the O/E and the sampler and dominates

the response.

CSA8000 & TDS8000 Series Instruments and Modules

2- 5

Theory of Operation

H No filter is used, but the sampler’s bandwidth is adjusted.

H The O/E bandwidth is adjusted and dominates the response.

Information about the available bandwidth and reference receiver selections, and the method used to set the bandwidth for the optical modules starts on page 2--7.

The power monitor is a second measure of the photodiode current that is independent of the sampler signal path. Analog circuitry continuously senses the current flowing into the bias side of the photodiode. The signal is amplified by a programmable gain amplifier and input to an 8 bit AD converter. The AD converter and amplifier are controlled through the I

C interface. Compensation performs two functions in the power meter: First, two offset inputs are adjusted in the amplifier so that the signal stays in range for all of the gain settings. Next, offset is measured for all gain settings and stored so it can be subtracted from the raw measured current. Because the measurements are made through independent paths the power monitor is useful in debugging module/mainframe problems.

The main board of the module only provides power and control bits to the clock recovery board. A small fraction of the input signal is split off and applied to the clock recovery components. The type of splitter for each module is shown in Table 2--3.

Table 2- 3: Module optical/electrical split

Module Optical Split Electrical Split

C01 n

C02 n

C03 n

C04 n

C07 n

C07B n

C08 n

C08B n

C08C n

C09 n

C11 n

C12 n

The recovered clock is routed in coaxial cable through the rear connector of the module to the Optical Front End board in the mainframe. The Optical Front End

2- 6

CSA8000 & TDS8000 Series Instruments and Modules

Theory of Operation

board has a switch that selects which modules clock will be applied to the trigger. The control signal for that switch comes from the optical module.

80C01 Optical Sampling

Module

The 80C01 module supports conformance testing of long wavelength (1100-1650 nm) signals at 622, 2488, and 9953 Mb/s as well as general purpose testing up to 20 GHz optical bandwidth. Bandwidth and reference receiver calibration is performed with a sub-picosecond optical impulse and a fourier transform method.

H OC12: The electrical sampler is adjusted to approximately 7.5 GHz (--3 dB)

bandwidth and signal is routed through a hardware filter designed to result in the combined system having an OC12 (STM-4) Reference Receiver response.

H OC48: The electrical sampler is adjusted to 7.5 GHz (--3 dB) bandwidth and

signal is routed through a hardware filter designed to result in the combined system having an OC48 (STM-16) Reference Receiver response. These adjustments must be made at the factory.

H OC192: The electrical sampler is adjusted to give the desired response, and

signal is not routed through any filter (signal is sent through the straightthrough path). The sampler bandwidth and response is optimized during the calibration such that the combined system will have an OC192 (STM-64) Reference Receiver response.

H 12.5 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >12.5 GHz.

H 20 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >20 GHz.

For major functional circuit blocks refer to Figures 5--3 and 5--4 beginning on page 5--4.

80C02 Optical Sampling

Module

CSA8000 & TDS8000 Series Instruments and Modules

The 80C02 module is optimized for testing of long-wavelength (1100-1650 nm) signals at (9.953 Gb/s) SONET OC-192 / SDH STM-64 standards. With its high optical bandwidth (>30 GHz) it is also well suited to general purpose high-performance optical component testing.

H OC192: The electrical sampler is adjusted to give the desired response, and

2- 7

Theory of Operation

H 12.5 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >12.5 GHz.

H 20 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >20 GHz.

H 30 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >30 GHz.

For major functional circuit blocks refer to Figures 5--5 and 5--6 beginning on page 5--6.

80C03 Optical Sampling

Module

The 80C03 module supports conformance testing of both short and long bandwidth (700-1650 nm) signals at 1.063, 1.250, and 2.488 Mb/s as well as general purpose testing with >2.3 GHz optical bandwidth. Its amplified optical to electrical converter design enables the user to examine very low-level optical signals.

H OC48: The electrical sampler is adjusted to approximately 12.5 GHz (--3 dB)

bandwidth and signal is not routed through any filter (signal is sent through the straight-through path). The O/E converter is designed by the vendor to match the OC48 reference receiver response curve. The span adjustment provides limited adjustment of the frequency response. It is adjusted at the factory so that the combined system will have an OC48 (STM-64) R eference Receiver response. This mode is synonymous with the 2.3 GHz maximum bandwidth setting.

H FC1063: The electrical sampler is adjusted and O/E converter span voltage

are the same values as in the OC48 mode. The signal is routed through a hardware filter designed to result in the combined system having an FC1063 (1.0625 Gb/s Fibre Channel) Reference Receiver response.

H GBE: The electrical sampler is adjusted and O/E converter span voltage are

the same values as in the OC48 mode. The signal is routed through a hardware filter designed to result in the combined system having an GBE (1.25 Gb/s Gigabit Ethernet) Reference Receiver response.

80C04 Optical Sampling

Module

2- 8

The 80C03 module can be configured with clock recovery that supports Fibre Channel 1063 (1.063 Gb/s) and OC-48 / STM-16 (2.488 Gb/s) standards.

For major functional circuit blocks refer to Figure 5--7 and 5--8 beginning on page 5--8.

The 80C04 module is optimized for testing of long wavelength (1100--1650 nm) signals at either 9.953 Gb/s or 10.664 Gb/s. With its high optical bandwidth

CSA8000 & TDS8000 Series Instruments and Modules

Theory of Operation

>28 GHz, it is also well suited to general-purpose, high-performance optical component testing.

H OC192 or 10.664 Gb/s: The electrical sampler is adjusted to give the desired

response, and signal is not routed through any filter (signal is sent through the straight-through path). The sampler bandwidth and response is optimized during the calibration such that the combined system will have an OC192 (STM-64) or 10.66 Gb Reference Receiver response.

H 20 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >20 GHz.

H 30 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >28 GHz.

The 80C04 can be optionally configured with clock recovery (Opt. CR-1) that supports 9.953 Gb/s telecom standards.

80C05 Optical Sampling

Module

80C06 Optical Sampling

Module

For major functional circuit blocks refer to Figures 5--9 and 5--10 beginning on page 5--10.

The 80C05 module is designed to test long wavelength (1520--1580 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >40 GHz.

H OC192: There is one Reference Receiver setup selectable for 9.95328 Gb/s

SONET/SDH standard.

H There is no clock recovery option available.

For major functional circuit blocks refer to Figure 5--11 on page 5--12.

The 80C06 module is designed to test long wavelength (1520--1580 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >55 GHz.

H 55 GHz: There is only a single bandwidth selection available, no Reference

Receiver setups selectable.

H There is no clock recovery option available.

For major functional circuit blocks refer to Figure 5--12 on page 5 --13.

80C07 Optical Sampling

Module

CSA8000 & TDS8000 Series Instruments and Modules

The 80C07 module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and

2- 9

Theory of Operation

measurement tool for high bandwidth telecommunications with its high optical bandwidth >2.3 GHz.

H Filtered rates are OC-3, OC-12; unfiltered rate is OC-48.

H There is clock recovery option available (155/622/2488 Multi-rate)

For major functional circuit blocks refer to Figures 5--13 and 5--14 on page 5-- 14.

80C07B Optical Sampling

Module

80C08 Optical Sampling

Module

The 80C07B module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >2.3 GHz.

H Supported standards or data filtering rates include OC--3, OC--12, OC-48,

ENET2500/2GBE, GBE, FC1063, FC2125, and Infiniband.

H Clock recovery options are available

(155/622/1063/1250/2125/2488/2500/2666)

For major functional circuit blocks refer to Figures 5--13 and 5--14 on page 5-- 14.

The 80C08 module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >9.0 GHz.

H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E

bandwidth is adjusted and dominates the response (9.953/10.3125 Gb/s Multi--rate).

H There is clock recovery option available (9.953/10.3125 Gb/s Multi-rate).

80C08B Optical Sampling

Module

2- 10

For major functional circuit blocks refer to Figures 5--15 and 5--16 beginning on page 5--16.

The 80C08B module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >9.5 GHz.

H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E

bandwidth is adjusted and dominates the response (9.953/10.3125 Gb/s Multi-rate).

H Clock recovery options are available (9.953/10.3125/10.51875 Gb/s

Multi-rate).

CSA8000 & TDS8000 Series Instruments and Modules

Theory of Operation

For major functional circuit blocks refer to Figures 5--15 and 5--16 beginning on page 5--16.

80C08C Optical Sampling

Module

80C09 Optical Sampling

Module

The 80C08C module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >10 GHz.

H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E

bandwidth is adjusted and dominates the response (9.953/10.3125/10.518/10.66/10.709/11.1 Gb/s).

H Clock recovery options are available (9.953/10.3125/10.518 Gb/s and

Continuous-rate from 9.8 Gb/s to 12.6 Gb/s).

For major functional circuit blocks refer to Figures 5--15 and 5--16 beginning on page 5--16.

The 80C09 module is designed to test long wavelength (1100--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >30 GHz.

H Supported standards or data filtering rates include OC-192 and FEC10.709.

H Clock recovery options are available (OC-192 and FEC10.709)

For major functional circuit blocks refer to Figures 5--17 and 5--18 beginning on page 5--18.

80C10 Optical Sampling

Module

CSA8000 & TDS8000 Series Instruments and Modules

The 80C10 module is designed to test long wavelength (1310 and 1550 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >65 GHz.

H Supported standards or data filtering rates include OC-768 and FEC43.02

(G.709).

H 30 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >30 GHz.

H 65 GHz: The sampler bandwidth and response is set during the calibration

such that the combined system will have an Optical Bandwidth (--6 dB) >65 GHz.

H There is no clock recovery option available.

For major functional circuit blocks refer to Figure 5--19 on page 5 --20.

2- 11

Theory of Operation

80C11 Optical Sampling

Module

80C12 Optical Sampling

Module

The 80C11 module is designed to test long wavelength (1100--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >20 GHz.

H Supported standards or data filtering rates include

9.953/10.31/10.518/10.66/10.71/11.1 Gb/s.

H Clock recovery options are available (9.953/10.66/10.71 Gb/s and Continu-

ous-rate from 9.8 Gb/s to 12.6 Gb/s)

For major functional circuit blocks refer to Figures 5--20, 5--21, 5--22, and 5--23 beginning on page 5--21.

The 80C12 module is designed to test both long and short wavelength (700--1650 nm) signals. This module is intended to be used as a test and measurement tool for high bandwidth telecommunications with its high optical bandwidth >10 GHz.

H There are three Reference Receiver filters selectable that are customer

specified from the following list of five rates: 1FC (FC1063) for 1.0625Gb/s FibreChannel, 2FC (FC2125) for 2.125Gb/s FibreChannel, 10GBase-X4 for

3.125Gb/s, VSR-5 for 3.31776 Gb/s, and 4FC (FC4250) for 4.25 Gb/s Fibre Channel. A filterless, full-bandwidth setting (9 GHz) is also available.

H In addition, this module offers the option to support 10 Gb/s optical

standards as well. This option is mutually exclusive with the sub--10Gb/s filter options. The standard reference receiver filter rates offered with the Option 10G are SONET/SDH OC-192/STM-64, 10GBase-W, 10 Gb Ethernet (9.95338 Gb/s), 10GBase-R (10.3125 Gb/s), 10G Fibre Channel (10.51875 Gb/s), G.975 FEC (10.66 Gb/s), G.709 FEC (10.71 Gb/s), 10GBE FEC (11.0957 Gb/s). These filter settings require no hardware filters.

H An electrical clock recovery output signal is provided that can be routed to

the Tektronix 80A05 Electrical Clock Recovery module for clock recovery.

For major functional circuit blocks refer to Figure 5--24 on page 5 --25.

80A01 Trigger Prescale Preamplifier Module

The 80A01 module is designed to increase the sensitivity of the prescale trigger input of the CSA8000/TDS8000 instruments to ≤200 mV

The major function block of the module is a high sensitivity, high gain RF amplifier. The input and output to this amplifier are routed to two identical SMA, female connectors, labelled Input and Output at the module front panel.

pk-pk

2- 12

CSA8000 & TDS8000 Series Instruments and Modules

The module receives power from the main instrument through a single connector at the rear of the module. The power LED indicates the module is receiving power through the interface connector.

For major functional circuit blocks refer to Figure 5--25 on page 5 --26.

80A02 EOS/ESD Protection Module

The 80A02 EOS/ESD (Electrical Over Stress/Electro-Static Discharge) protection module provides static electricity damage protection to vulnerable sampling head input stages and/or other sensitive elements.

The 80A02 works with any CSA/TDS8000 series instruments or with 11K series sampling instruments (11800 or CSA803 series instruments).

The 80A02 EOS/ESD module has a 26 GHz bandwidth, making it possible to provide static protection to a sensitive single input channel of a sampling oscilloscope with very minimal speed degradation.

Theory of Operation

The 80A02 EOS/ESD module is designed to work with either the Tektronix P8018 probe for manual test station static protection as well as automated test stations.

For major functional circuit blocks refer to Figure 5--26 on page 5 --27.

80A05 Electrical Clock Recovery Module

The electrical clock recovery module is capable of performing clock recovery on the input signal (signal input must meet data rate and format requirements), and provides this signal as a trigger source to the CSA/TDS8000 series instruments.

Front panel connectors provide a replica of the recovered clock signal.

The module uses one of two separate clock recovery circuits dependant on the specified data rate. The single-ended or complementary input signals are split with a 1:2 divider and routed to the two circuits.

The low bandwidth circuit recovers clock and data from input data in the 50 Mb/s to 2.7 Gb/s range. The recovered clock from this circuit is routed directly to the front panel and internal trigger.

The high bandwidth circuit recovers clock and data from input data in the

2.7 Gb/s to 12.6 Gb/s range. The recovered clock to the front panel and internal trigger signals are always clock/16.

With option 10G, the 10G recovered clock is also routed to the front panel.

CSA8000 & TDS8000 Series Instruments and Modules

2- 13

Theory of Operation

There is one front panel indicator LED -- Clock Recovery Enable. It indicates the clock recovery circuitry is on and programmed to the requested bit rate.

For major functional circuit blocks refer to Figure 5--27 on page 5 --28.

80A06 PatternSync Trigger Module

The 80A06 PatternSync Trigger Module is designed to provide a frame trigger for the CSA8000 and TDS8000 series instruments. The instrument must be using the Windows 2000 Operating System and product software version 2.4 or greater.

The frame trigger is derived by counting a programmed amount of user supplied clock cycles and generating a pulse at the completion of the count. This pulse is then routed externally to the main instrument’s external trigger direct input.

An additional buffered copy of the input clock is output to the front panel for connection to additional equipment such as an 82A04 Phase Reference Module.

The 80A06 consumes a small slot or may be operated on a SlotSaver cable connected to the main instrument’s probe power connector.

Pattern triggering works for clocks in the range of 150 MHz to 12.75 GHz.

For major functional circuit blocks refer to Figure 5--28 on page 5 --29.

82A04 Phase Reference Module

The 82A04 Phase Reference Module is designed to decrease horizontal position uncertainty with data signals, when a reference clock signal synchronized to the data signal, is available. It consumes a small slot, and displaces operation of both channels in that slot.

The Phase Correction modes available are free run, where the module provides unit circle location information for the phase of the data sample, and triggered, where the module, in conjunction with the trigger signal, provides both base positioning, and refined positioning, for the data sample.

The input is precision 1.85 mm. Phase correction works over the range of

2.5 GHz -- 25 GHz (82A04), or 2.5 GHz -- 60 GHz (82A04--60G). The LED indicates the module is being utilized for phase correction.

2- 14

For major functional circuit blocks refer to Figure 5--29 on page 5 --30.

CSA8000 & TDS8000 Series Instruments and Modules

Adjustment Procedures

This chapter contains an adjustment procedure for your instrument. The purpose of this procedure is to return the instrument conformance to its specifications.

Adjustment Interval

The voltage and timing references inside the instrument are very stable over time and should not need routine adjustment. The only time you should perform the Adjustment Procedures is if the instrument fails any of the Mainframe performance verification checks provided in the Performance Verification and Specifications manual.

Adjustment Environment

The instrument must be adjusted in a 20 °Cto30°C ambient temperature environment. The instrument and signal source must warm up at least 20 minutes in this environment before you begin the adjustment procedure.

Adjustment After Repair

After removal and replacement of a module due to electrical failure, you must either perform the adjustment procedure or not, depending on the module replaced. See Table 3--1.

Table 3- 1: Adjustments required for module replaced

Module replaced Adjustment required

Front panel assembly No

Acquisition board Yes

Processor board No

NLX processor assembly No

Display panel or display system

Power supply No

Interconnect boards No

Fans No

CSA8000 & TDS8000 Series Instruments and Modules

3- 1

Adjustment Procedures

Required Equipment

The adjustment procedure requires the specific test equipment and materials listed in Table 3--2.

Table 3- 2: Required equipment and materials

Category Specific equipment required Quantity

Signal source Signal generator 50 MHz to 1 GHz, ≤1 ppm

frequency accuracy

Meter Digital Multimeter, with 6.5 plus digits 1ea

1ea

Instrument controller (only one of these configurations required)

Divider Power, 50 Ω, SMA “T”. male Tektronix 015-0565-00 1ea

Adapter SMA “T”, male to 2 SMA female Tektronix part

Adapter SMA male to BNC female, Tektronix part number

Adapter BNC to dual banana plug, Tektronix part number

Coaxial cables 50 Ω, male-to-male SMA connectors 3ea

GPIB cables GPIB cable, 1 m minimum length, Tektronix part

Depending on other USB devices attached to the instrument, a USB hub may also be required. Consult your Nati onal Instruments documentation for more information.

PC-compatible computer with National Instruments GPIB Controller card and software, running Windows 95/98 or NT

National Instruments USB GPIB Controller card for Windows 98 and National Instruments NI-488.2 for Windows software (to install in the instrument)

number 015-1016-00

015-0554-00

103-0095-00

number 002-0991-01

1ea

Instrumentation Setup

3- 2

Set the National Instruments GPIB Interface command software to allow GPIB communications between the PC controller and CSA8000/TDS8000, device under test (DUT).

Before you can execute the adjustment program, you need to set up and configure the instrumentation. Make connections according to the following diagrams. See Figure 3--1.

To perform this procedure you must have the specific equipment listed in Table 3--2.

CSA8000 & TDS8000 Series Instruments and Modules

Main Instrument Adjustments

Once the instrumentation is connected and GPIB configured, allow the instrumentation to warm up for at least 20 minutes before starting the DC Calibrator Adjust procedures.

CSA8000/TDS8000

Controller

GPIB cable

50 Ω

Terminator

Adjustment Procedures

Digital

multimeter

-- +

DC CALIBRATION

Figure 3- 1: Adjustment setup using the DMM

DC Calibrator Adjust

Connect the instrument to a DMM as shown in Figure 3--1.

1. Run the compensation routine.

2. Enter the following GPIB command to verify communication between the

controller and DUT. *IDN? Should respond with Tektronix and Firmware Version.

3. Enter the following GPIB command to turn the instrument’s cal constant protection off: SYST:PROT OFF

4. Enter the following GPIB command to set the instrument’s DC calibrator offset cal constant to 0: CALCOMP:DOUBLE “DcCalOffsetAdj”,0.0

5. Wait 8 seconds then enter the following GPIB command to set the instrument’s DC calibrator Lsb cal constant to 1.0: CALCOMP:DOUBLE “DcCalLsbAdj”,1.0

OUTPUT

SMA “T”

6. Wait 8 seconds then enter the following GPIB command to set the instrument’s DC calibrator output to 0 Volts: CALIBRATE:DCCALIBRATOR 0.0 Record DMM reading.

CSA8000 & TDS8000 Series Instruments and Modules

3- 3

Adjustment Procedures

7. Enter the following GPIB command to set the instrument’s DC calibrator offset cal constant to --1 * DMM reading: CALCOMP:DOUBLE “DcCalOffsetAdj”,(--1.0 * the DMM reading)

Example: CALCOMP:DOUBLE “DcCalOffsetAdj”, 3.2e--4

8. Enter the following GPIB command to set the instrument’s calibrator to

1.0 V: CALIBRATE:DCCALIBRATOR 1.0 Record the DMM reading (reading1).

9. Enter the following GPIB command to set the instrument’s calibrator to

--1.0 V: CALIBRATE:DCCALIBRATOR --1.0 Record the DMM reading (reading2). Calculate cal constant as follows:

DC Calibrator Adjust

Verification

(

–1.0 * Reading2 + Reading1

)

10. Enter the following GPIB command to set the instrument’s calibrator Lsb cal constant: CALCOMP:DOUBLE “DcCalLsbAdj”,calculated result from Step 9.

11. Wait 8 seconds then enter the following GPIB command to save the DC adjustments as follows: CAL:SAVE:FACT:MAI

12. Update the mainframe calibration time/date/temperature stamp by entering the following GPIB command: CAL:UPDATEINFO:MAI

13. Enter the following GPIB command to turn the instrument’s cal constant protection on: SYST:PROT ON

To verify that the DC calibration adjustment was successful complete the following procedures:

1. Set the instrument’s DC calibrator to --1.0 V and verify as follows: CALIBRATE:DCCALIBRATOR --1.0

3- 4

2. Verify that the DMM reads --1.0 V

1mV

3. Set the instrument’s DC calibrator to 1.0 V and verify as follows: CALIBRATE:DCCALIBRATOR 1.0

4. Verify that the DMM reads 1.0 V

1mV

CSA8000 & TDS8000 Series Instruments and Modules

Adjustment Procedures

5. Set the instrument’s DC calibrator to 0.0 V and verify as follows: CALIBRATE:DCCALIBRATOR 0.0

6. Verify that the DMM reads 0.0 V

GPIB cable

Controller

CSA8000/TDS8000

Channel 1

Figure 3- 2: Adjustment setup using the signal generator

Internal 10 MHz Adjust

Connect the instrument to a signal generator as shown in Figure 3--2.

0.1 mV

Synthesized signal generator

TRIGGER DIRECT INPUT

50 Ω Power divider

Setup

Set the signal generator as follows:

H Frequency to 1 GHz

H Amplitude to 1.0 V peak to peak

H Output to on

Preset the CSA8000/TDS8000 controls:

NOTE. CSA8000/TDS8000 settings; Acquisition, Horizontal, Measurement, Trigger, or Vertical menus are located in the Setups dialog, which can be popped up by selecting the Setup Menu.

H Select C1 in the W aveform Selector.

H Acquisition menu, Acquisition to, Average, 64 samples.

H Horizontal menu, Timebase, Scale to 250 ps/division.

H Horizontal menu, All Timebases Mode, Lock to Int 10MHz.

H Measurement menu, Select Meas, Timing, + Cross.

H Measurement menu, select Statistics.

CSA8000 & TDS8000 Series Instruments and Modules

3- 5

Adjustment Procedures

1. Enter the following GPIB command to turn the instrument’s cal constant protection off: SYST:PROT OFF

2. Set the calibration value to default by sending the following GPIB command: CALCOMP:DOUBLE “Internal10MHzRefFreq”,10e6

3. Click Run/Stop (button should be green).

4. Measurement menu, click Show Stats.

5. Record target value = (Mean value +1 s);whereMean is from the

Statistics window.

6. Horizontal menu, Timebase, Position, enter target value recorded in step 5.

7. Click Run/Stop (button should be gray).

8. Measurement menu, click Clear Stats.

9. Click Run/Stop (button should be green), wait 8 seconds then click Run/Stop

again (button should be gray).

10. Using the present Mean value from the Statistics window, and the target value calculated in step 5,. Calculate the error and the new cal

constant:

Error = (mean -- target value) / 1 s New Cal Const = Error * 10e6 + 10e6

11. Input the new calibration constant into the instrument by sending the following GPIB command: CALCOMP:DOUBLE “Internal10MHzRefFreq”, New Cal Const where New Cal Const is from Step 10.

12. Wait 8 seconds then save the mainframe factory calibration constants by entering the following GPIB commands: CAL:SAVE:FACT:MAI

13. Update the mainframe calibration time/date/temperature stamp by entering the following GPIB command: CAL:UPDATEINFO:MAI

14. Enter the following GPIB command to turn the instrument’s cal constant protection on: SYST:PROT ON

3- 6

End of Procedure

CSA8000 & TDS8000 Series Instruments and Modules

Maintenance

This section contains the information needed to do periodic and corrective maintenance on the Mainframe, Sampling Heads and Optical modules. The following subsections are included:

H Preparation. Introduction plus general information on preventing damage to

internal modules when doing maintenance.

H Inspection and Cleaning. Information and procedures for inspecting the

instrument and cleaning its external and internal modules.

H Removal and Installation Procedures. Procedures for the removal of

defective modules and replacement of new or repaired modules. Also included is a procedure for disassembly of the instrument for cleaning.

H Troubleshooting. Information for isolating and troubleshooting failed

modules. Included are instructions for operating the instrument’s internal diagnostic routines and troubleshooting trees. Most of the trees make use of these internal diagnostic routines to speed fault isolation to a module.

Preventing ESD

Before servicing this product, read the Safety Summary and Introduction at the front of the manual and the ESD information below.

CAUTION. Static discharge can damage any semiconductor component in this instrument.

When performing any service which requires internal access to the instrument, adhere to the following precautions to avoid damaging internal modules and their components due to electrostatic discharge (ESD).

1. Minimize handling of static-sensitive circuit boards and components.

2. Transport and store static-sensitive modules in their static protected

containers or on a metal rail. Label any package that contains static-sensitive boards.

3. Discharge the static voltage from your body by wearing a grounded antistatic wrist strap while handling these modules. Do service of static-sensitive modules only at a static-free work station.

4. Nothing capable of generating or holding a static charge should be allowed on the work station surface.

CSA8000 & TDS8000 Series Instruments and Modules

4- 1

Maintenance

5. Handle circuit boards by the edges when possible.

6. Do not slide the circuit boards over any surface.

7. Avoid handling circuit boards in areas that have a floor or work-surface

Inspection and Cleaning

Inspection and Cleaning describes how to inspect for dirt and damage. It also describes how to clean the exterior and interior of the instrument. Inspection and cleaning are done as preventive maintenance. Preventive maintenance, when done regularly, may prevent instrument malfunction and enhance its reliability.

Preventive maintenance consists of visually inspecting and cleaning the instrument and using general care when operating it.

How often to do maintenance depends on the severity of the environment in which the instrument is used. A proper time to perform preventive maintenance is just before instrument adjustment.

covering capable of generating a static charge.

General Care

Flat Panel Display

Cleaning

The cabinet helps keep dust out of the instrument and should normally be in place when operating the instrument.

WARNING. Before performing any procedure that follows, power down the instrument and disconnect it from line voltage.

The portable mainframe display is a soft plastic display and must be treated with care during cleaning.

CAUTION. Improper cleaning agents or methods can damage the flat panel display.

Avoid using abrasive cleaners or commercial glass cleaners to clean the display surface.

Avoid spraying liquids directly on the display surface.

Avoid scrubbing the display with excessive force.

Clean the flat panel display surface by gently rubbing the display with a clean-room wipe (such as Wypall Medium Duty Wipes, #05701, available from Kimberly-Clark Corporation).

4- 2

CSA8000 & TDS8000 Series Instruments and Modules

Maintenance

If the display is very dirty, moisten the wipe with distilled water or a 75% isopropyl alcohol solution and gently rub the display surface. Avoid using excess force or you may damage the plastic display surface.

CAUTION. To prevent getting moisture inside the instrument during external cleaning, use only enough liquid to dampen the cloth or applicator.

Exterior

Use the following guidelines and methods to inspect and clean the outside of the instrument.

Inspection — Exterior. Inspect the outside of the instrument for damage, wear, and missing parts, using Table 4--1 as a guide. Immediately repair defects that could cause personal injury or lead to further damage to the instrument.

Table 4- 1: External inspection check list

Item Inspect for Repair action

Cabinet, front panel, and cover

Front-panel knobs Missing, damaged, or loose

Connectors Broken shells, cracked insulation,

80C0X male fiber connections

Carrying handle, and cabinet feet

Cracks, scratches, deformations, damaged hardware.

knobs.

and deformed contacts. Dirt in connectors.

Lint or dust on all male fiber connections.

Correct operation. Repair or replace defective

Repair or replace defective module.

Repair or replace missing or defective knobs.

Repair or replace defective modules. Clear or wash out dirt.

Clean all male fiber connections with a lint-free cleaning cloth.

module.

Accessories Missing items or parts of i tems,

Cleaning — Exterior. Clean the exterior surfaces of the chassis with a dry lint-free cloth or a soft-bristle brush. If any dirt remains, use a cloth or swab dipped in a 75% isopropyl alcohol solution. Use a swab to clean narrow spaces around controls and connectors. Do not use abrasive compounds on any part of the chassis that may damage the chassis.

Clean the On/Standby switch using a dampened cleaning towel. Do not spray or wet the switch directly.

CSA8000 & TDS8000 Series Instruments and Modules

bent pins, broken or frayed cables, and damaged connectors.

Repair or replace damaged or missing items, frayed cables, and defective modules.

4- 3

Maintenance

CAUTION. Avoid the use of chemical cleaning agents which might damage the plastics used in this instrument. Use only deionized water when cleaning the menu buttons or front-panel buttons. Use a 75% isopropyl alcohol solution as a cleaner and rinse with deionized water. Before using any other type of cleaner, consult your Tektr onix Service Center or representative.

Interior

Use the following guidelines and methods to inspect and clean the inside of the instrument.

Inspection — Interior. To access the inside of the instrument for inspection and cleaning, refer to the Removal and Installation Procedures in this section.

Inspect the internal portions of the instrument for damage and wear, using Table 4--2 as a guide. Defects found should be repaired immediately.

If any circuit board is repaired or replaced, check Table 3--1 on page 3--1, in Chapter 5 to see if it is necessary to adjust the instrument.

CAUTION. To prevent damage from electrical arcing, ensure that circuit boards and components are dry before applying power to the instrument.

Table 4- 2: Internal inspection check list

Item Inspect for Repair action

Circuit boards Loose, broken, or corroded

solder connections. Burned circuit boards. Burned, broken, or cracked circuit-run plating.

Remove and replace damaged circuit board.

4- 4

Resistors Burned, cracked, broken, blis-

tered condition.

Solder connections Cold solder or rosin joints. Resolder joint and clean with

Capacitors Damaged or leaking cases.

Corroded solder on leads or terminals.

Remove and replace damaged circuit board.

isopropyl alcohol.

Remove and replace damaged circuit board.

CSA8000 & TDS8000 Series Instruments and Modules

Table 4- 2: Internal inspection check list (cont.)

Item Repair actionInspect for

Semiconductors Loosely inserted in sockets.

Distorted pins.

Maintenance

Firmly seat loose semiconductors. Remove devices t hat have distorted pins. Carefully straighten pins (as required to fit the socket), using long-nose pliers, and reinsert firmly. Ensure that straightening action does not crack pins, causing them to break off.

Wiring and cables Loose plugs or connectors.

Burned, broken, or frayed wiring.

Chassis Dents, deformations, and dam-

aged hardware.

Firmly seat connectors. Repair or replace modules with defective wires or cables.

Straighten, repair, or replace defective hardware.

Cleaning Procedure — Interior. To clean the instrument interior, do the following steps:

1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).

2. Remove any remaining dust with a lint-free cloth dampened in isopropyl

alcohol (75% solution) and rinse with warm deionized water. (A cottontipped applicator is useful for cleaning in narrow spaces and on circuit boards.)

STOP. If, after doing steps 1 and 2, a module is clean upon inspection, skip the remaining steps.

3. If steps 1 and 2 do not remove all the dust or dirt, the instrument may be spray washed using a solution of 75% isopropyl alcohol by doing steps 4 through 8.

4. Gain access to the parts to be cleaned by removing easily accessible shields and panels (see Removal and Installation Procedures).

5. Spray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the majority of the alcohol to evaporate.

6. Use hot (120 _F to 140 _F) deionized water to thoroughly rinse them.

7. Dry all parts with low-pressure, deionized air.

8. Dry all components and assemblies in an oven or drying compartment using

low-temperature (125 _F to 150 _F) circulating air.

CSA8000 & TDS8000 Series Instruments and Modules

4- 5

Maintenance

4- 6

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

This subsection contains procedures for removal and installation of all mechanical and electrical modules.

Preparation

WARNING. Before doing this or any other procedure in this manual, read the Safety Summary found at the beginning of this manual. Also, to prevent possible injury to service personnel or damage to this instrument’s components, read

Installation in Chapter 2, and Preventing ESD in this section.

This subsection contains the following items:

H Preparatory information that you need to properly do the procedures that

follow.

H A list of tools required to remove and disassemble all modules.

H Procedures for removal and reinstallation of the electrical and mechanical

modules.

H A disassembly procedure for removal of all the major modules from the

instrument at one time and for reassembly of those modules into the instrument. Instructions for doing the actual cleaning are found under Inspection and Cleaning at the beginning of this section.

H Module disassembly procedures.

WARNING. Before doing any procedure in this subsection, disconnect the power cord from the line voltage source. Failure to do so could cause serious injury or death.

NOTE.ReadEquipment Required for a list of the tools needed to remove and install modules in this instrument. See Table 4--3, page 4--8.

Read the cleaning procedure before disassembling the instrument for cleaning.

CSA8000 & TDS8000 Series Instruments and Modules

4--7

Removal and Installation Procedures

Equipment Required. Most modules in this instrument can be removed with a screwdriver handle mounted with a size T-15, TorxR screwdriver tip. Use this

tool whenever a procedure step instructs you to remove or install a screw unless a different size screwdriver is specified in that step. All equipment required to

remove and reinstall each module is listed in the first step of its procedure.

Table 4--3: Tools required for module removal

Item No.

1 Screwdriver handle

2 Screwdriver handle, ex-

Name Description Part number

Accepts TorxR-driver bits

General Tool: 620-440

tended length, 10.5 to 12 inches

Accepts TorxR-driver bits and socket tip. Used for removing the

T-10 screws and

inch hex posts

Standard tool or Xcelite 99X10V N/S#48706

from the electrical and optical module slots.

3 T-10 Torx tip Used for removing the electrical or

optical module chassis. TorxR-driver

General Tool: 640-235

bit for T-10 size screw heads.

4 T-15 Torx tip Used for removing most the instru-

ment’s screws. TorxR-driver bit for

General Tool: 640-247

T-15 size screw heads.

5 T-20 Torx tip Used for removing the handle

hardware. TorxR-driver bit for T-20

General Tool: 640-250

size screw heads.

inch socket tip Used for removing the

inch hex

Standard tool posts from the electrical and optical module slots.

8 #0 phillips screwdriver Screwdriver for removing small

/8inch flat-bladed screw-

driver

Screwdriver for unlocking cable connectors.

Standard tool

Standard tool phillips screws, CD, floppy & hard drive.

9 Angle-Tip Tweezers Used to remove front panel knobs Standard tool

inch open-end wrench

Used to remove the rear panel nut

Standard tool posts.

inch open-end wrench

Used to remove the rear panel nut

Standard tool posts.

4--8

12 Coaxial cable connector

tool

CSA8000 & TDS8000 Series Instruments and Modules

Used to remove coaxial connectors from d-subminiature connector housings.

Amp: 58095-1

Procedures for External Modules

The following procedures are found here and are listed in order presented.

H Front Panel Knobs

H Trim (all)

H Bottom cover

H Left and Right covers

H Line Fuse and Line Cord

Removal and Installation Procedures

Front-Panel Knobs

1. Assemble equipment and locate modules to be removed: Use an angled-tip tweezers (Item 9) and locate the the front panel see Figure 4--2 on page 4--11.

2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front is facing you.

3. Remove the knob(s): Grasp any knob you want to remove and pull it straight out from the front panel about a the base of the knob and the front panel. Insert the tweezers between the knob and front panel and use them to remove the knob. See Figure 4--1.

4. Reinstallation: To reinstall, align knob to shaft and push it in until it snaps.

CAUTION. To prevent damage to the encoders located onto the circuit board, apply pressure to the backs of the encoders while pushing the knob on the shaft.

/4inch to create some clearance between

Figure 4--1: Knob removal

CSA8000 & TDS8000 Series Instruments and Modules

4--9

Removal and Installation Procedures

Trim and Carrying Handle

1. Locate module to be removed: Locate the Trim in the locator diagram, See Figure 4--7, page 4--18.

2. Remove the front panel trim: Use Figure 4--2, page 4--11, as a guide.

a. Grasp the trim ring by its top edge and pull toward you to detach the

three plastic snaps. (Alternatively, you can use a flat-bladed screwdriver or other small prying tool to help you detach the snaps.)

b. Swing the bottom of the ring upward and off the front panel.

3. Remove the acquisition trim: Use Figure 4--2, page 4--11 as a guide.

a. Remove the six T-15 Torxdrive screws that secure the acquisition trim to

the instrument.

b. Remove the knobs from the electrical and optical ejector levers. Grasp

the knobs with your fingers and pull straight out.

c. Remove the acquisition trim from the instrument.

4. Remove the top cover trim: Use Figure 4--2, page 4--11 as a guide.

a. Remove the accessory pouch; it snaps off.

b. Remove the four T-15 Torxdrive screws that secure the top cover trim to

the instrument. The T-15 Torxdrive screws also secure the snap studs to the top cover.

c. Remove the top cover trim from the instrument.

5. Remove the carrying handle and the right/left side trim panels: Use

Figure 4--2, page 4--11 as a guide.

a. Remove the two T-20 Torxdrive screws that secure the handle to the

instrument. Remove the handle from the instrument.

CAUTION. Over-tightening the handle screws may cause the handle to break off from the cabinet. When reinstalling the screws, use a torque wrench to tighten the screws to 8--10 in.lb.

b. Slide the side trim panels towards the rear of the instrument allowing the

tabs to clear the cover openings, then pull out to remove the panels from the instrument.

6. Reinstallation: Do in reverse steps 2 through 5 to reinstall the appropriate trim.

4--10

CSA8000 & TDS8000 Series Instruments and Modules

Left side trim

T-15 Torxdrive

screw (3)

Removal and Installation Procedures

T-15 Torxdrive

screw (4)

Top cover trim

Right side trim

Front panel trim

Figure 4--2: Trim removal

Acquisition trim

T-15 Torxdrive screw (3)

Soldering aid

To remove the trim ring, slide the flat end of a soldering aid into the side slot on the trim ring. Press in, then lift up to hook it underneath, then pry up.

Carrying handle

T-20 Torxdrive

screw (2)

1. Remove the bottom cover: See Figure 4--3, page 4--12.Bottom Cover

CSA8000 & TDS8000 Series Instruments and Modules

4--11

Removal and Installation Procedures

2. Orient the instrument: Set the instrument so its top is down on the work

3. Reinstallation: Do in reverse steps a and b to reinstall the cabinet feet.

surface and its bottom is facing you.

a. Remove the five T-15 Torxdrive screws that secure the bottom cover to

the instrument.

b. Remove the bottom cover from the instrument.

4--12

Bottom cover

T-15 Torxdrive

screw (5)

Figure 4--3: Bottom cover removal

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

Covers

1. Remove the left and right covers: See Figures 4--4 and 4--5, pages 4--14 and 4--15.

H Trim (all)

H Bottom cover

2. Orient the instrument: Set the instrument so its rear is on the work surface and the front of the instrument facing the technician.

NOTE. All mounting screw holes are indicated by a star etched around the mounting hole.

a. Remove the thirteen T-15 Torxdrive screws that secure the covers to the

top and both sides of the chassis.

b. Remove the nine T-15 Torxdrive screws that secure the covers to the

bottom of the chassis.

c. Pull the bottom-right cover down and slide to the right to remove from

the instrument. Pull the top-left cover upward and slide to the left to remove from the instrument.

CAUTION. Take care not to bind or snag the covers on the instrument’s internal cabling as you remove or install.

3. Reinstallation: Do in reverse steps a through c to reinstall the cabinet.

CSA8000 & TDS8000 Series Instruments and Modules

4--13

Removal and Installation Procedures

Left side cover

Right side cover

Figure 4--4: Cover removal

All left and right cover mounting holes are indicated as shown.

T-15 Torxdrive screw (13)

4--14

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

Left side cover

Right side cover

T-15 Torxdrive

screw (9)

Figure 4--5: Cover removal

CSA8000 & TDS8000 Series Instruments and Modules

4--15

Removal and Installation Procedures

Line Fuses and AC power

cord connector

1. Assemble equipment and locate modules to be removed: Locate the power switch, line fuses and AC power cord connector in Figure 4--6, page 4--17.

2. The instrument has a built-in soft power-off function that safely powers off the instrument when you press the On/Standby switch. You must power off the instrument using the Windows 98 shutdown process before depressing the front panel On/Standby switch.

3. Power off the rear panel power switch before servicing the line fuses or power cord.

CAUTION. When powering off the instrument, use the Windows 98 shut down procedure. (Choose Shutdown from the Start menu.)

Powering down the instrument without using the Windows 98 shut down procedure can corrupt the software on the hard disk.

4. Orient the instrument: Set the instrument so its bottom is down on the work surface and its rear is facing you. If you are servicing the line fuses, do the next step; if you are servicing the line cord, skip to step 6.

5. Remove line fuses: Find the fuse caps on the rear panel. Now, remove both fuse caps by turning them counterclockwise using a flat-bladed screwdriver, and remove the line fuses. Reverse procedure to reinstall.

6. Remove line cord: Find the line cord on the rear cover. Pull the line cord away to remove from the AC power connector. Reverse procedure to reinstall.

7. Reinstallation: Do in reverse steps 5 and 6 to reinstall the line cord and then the line fuse.

4--16

CSA8000 & TDS8000 Series Instruments and Modules

AC power cord

connector

Power switch

Removal and Installation Procedures

Line fuse

Line fuses

holder

Figure 4--6: Line fuses and line cord removal

AC power cord

CSA8000 & TDS8000 Series Instruments and Modules

4--17

Removal and Installation Procedures

Pouch

Left side trim

Front panel trim

Front panel cover

Acquisition trim

Top cover trim

Left side cover

Rear foot

Right side cover

Right side trim

Carrying handle

Chassis

Figure 4--7: External modules

4--18

Bottom cover

CSA8000 & TDS8000 Series Instruments and Modules

Fan assembly

Removal and Installation Procedures

Hard-drive

CD-drive

CD-drive Interface board

Microprocessor, fan and heat sink

NLX board

Riser board

Display adapter board

Standby/On switch

Figure 4--8: Internal modules

Floppy disk drive

Display module

assembly

Front panel board

Front panel keypad

Front panel assembly

Processor board

Low-voltage power supply assembly

Rear power

distribution

board

Front power

distribution

board

CSA8000 & TDS8000 Series Instruments and Modules

4--19

Removal and Installation Procedures

Large interface

circuit board

Large module

chassis

Small module

chassis

Electrical front

end circuit board

Acquisition

circuit board

Figure 4--9: Acquisition modules

Acquisition assembly

4--20

CSA8000 & TDS8000 Series Instruments and Modules

Procedures for Modules

Removal and Installation Procedures

You should have completed the Procedures for external modules before doing many of the procedures in this collection. The procedures found here are listed in disassembly order:

H Front Panel assembly

H Front Panel Board

H Front Panel Keypad

H Display assembly

H Display Adapter Board

H Standby/On Switch Flex Circuit

H Floppy Disk Drive

H Hard Disk Drive

H CD Drive

H Front and Rear Power Distribution Boards

H Low-Voltage Power Supply

H NLX Board

H Microprocessor

H PC Processor Board

H Fan assembly

H Acquisition assembly

H Large Module Interface Board

H Module Slot Doors

H Electrical Modules

H Optical Modules

H 80A00 and 82A00 Series Modules

Front Panel Assembly

CSA8000 & TDS8000 Series Instruments and Modules

1. Locate module to be removed: Locate the Front Panel assembly Figure 4--10, page 4--22. Additional modules to be removed:

H Trim (Front panel)

4--21

Removal and Installation Procedures

2. Remove the Front Panel assembly: See Figure 4--10, page 4--22.

3. Orient the instrument: Set the instrument so its bottom is down on the work

surface and its front panel is facing you.

a. Remove the six T-15 Torxdrive screws that secure the Front panel

assembly to the front chassis.

b. Grasp the top of Front Panel assembly and pull forward to allow access

to the ribbon cable connector on the front panel board.

4. Reinstallation: Do in reverse steps a through d to reinstall the front panel

Floppy disk

support tab (2)

Chassis

slot (2)

c. Use the

@8inch flat-bladed screwdriver to carefully lift J1 cable

connector lock up to disconnect J1 flex cable from the display module assembly. See Figure 4--11, page 4--23. Note the connector’s pin 1 index mark and the black stripe on the cable for later reassembly.

d. Pull the Front Panel assembly forward and remove from the instrument.

assembly.

4--22

J1 ribbon cable

Front panel

assembly

Front panel square

opening (2)

T--15 Torxdrive

screw (6)

Figure 4--10: Front panel assembly removal

CSA8000 & TDS8000 Series Instruments and Modules

Screwdriver

Removal and Installation Procedures

Black stripe toward connector

Screwdriver

Front Panel Board

Figure 4--11: J1 flex cable connector removal

1. Locate module to be removed: Locate the Front Panel assembly Figure 4--10, page 4--22. Additional modules to be removed:

H Front Panel Knobs

H Trim (front panel)

H Front Panel assembly

2. Remove the Front Panel board: See Figure 4--12, page 4--24.

a. Remove the eight T-15 Torxdrive screws that secure the Front panel

board to the Front panel assembly.

b. Pry the board up off the alignment studs. Place a flat bladed screwdriver

in the pry point access holes to pry the board up from the assembly.

c. Remove the board from the assembly.

3. Reinstallation: Do in reverse steps a through c to reinstall the front panel

board.

CSA8000 & TDS8000 Series Instruments and Modules

4--23

Removal and Installation Procedures

Front Panel Keypad

1. Locate module to be removed: Locate the Front Panel assembly Figure 4--10, page 4--22. Additional modules to be removed:

H Front Panel Knobs

H Trim (front panel)

H Front Panel assembly

H Front Panel Board

2. Remove the Front Panel keypad: See Figure 4--12, page 4--24.

a. Pull on each of the keypad support guides to separate the keypad from

the Front panel board. Use a pair of tweezers or equivalent tool to pull the keypad support guides.

b. Remove the keypad from the front panel board.

Front panel board

Keypad support

guide (9)

T-15 Torxdrive

screw (8)

Keypad

Alignment

stud

Pry point

access hole

Pry point access hole

Figure 4--12: Front panel board and keyboard removal

4--24

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

CAUTION. When removing or installing the keypad, make sure you do not touch the switch contact with your fingers. The oils in your fingers will degrade or damage the switch contacts. To help prevent damage to the keypad use cotton gloves when removing or installing the keyboard pad.

3. Reinstallation: Do in reverse steps to reinstall the Keypad, front panel board, and the front panel assembly. Then see the following instructions:

a. Make sure the keypad is aligned properly on the Front Panel board.

b. Make sure the ribbon cable is routed correctly when installing the Front

Panel into the chassis.

c. Insert the two floppy disk support tabs into the front panel square

openings. Both left front panel tabs must go into the chassis slots. See Figure 4--10, page 4--22.

Display Assembly

1. Locate module to be removed: Locate the Display assembly, Figure 4--13, page 4--26. Additional modules to be removed:

H Trim (front panel and top)

2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front panel is facing you.

CAUTION. To avoid damage to the front panel Standby/On switch assembly, do not set the Display module assembly on a work surface. Sliding the instrument over the edge of the work surface could break off the Standby/On switch assembly.

3. Remove the Display assembly: See Figure 4--13, page 4--26.

a. Remove the four T-15 Torxdrive screws that secure the Display assembly

to the chassis.

b. Grasp the top edge of the Display assembly and pull forward far enough

to allow access to the flex cable connector.

c. Disconnect J8 flex cable from the display assembly. Remove the display

module assembly from the instrument. See Figure 4--13, page 4--26.

CSA8000 & TDS8000 Series Instruments and Modules

4--25

Removal and Installation Procedures

T-15 Torxdrive

screw (4)

J8 flex cable

Display

assembly

Figure 4--13: Display removal

4. Remove the Touch panel from the Display assembly: See Figures 4--14 and 4--15, pages 4--27 and 4--28.

CAUTION. To prevent degradation of the display sharpness, this procedure must be performed in a dust free environment. The service technician should wear cotton gloves to prevent finger oils from contaminating all surfaces of the display glass.

a. Disconnect J1, J9 and J10 cables from the Display Adapter circuit board.

b. Separate the assembly by carefully prying the Touch panel (outer)

assembly from the Display (inner) assembly. Insert a flat-bladed screwdriver in the access notches to push out on the Touch panel assembly.

4--26

CSA8000 & TDS8000 Series Instruments and Modules

Access notches

(top and bottom)

Removal and Installation Procedures

Display Adapter Board

Touch panel

LCD module

Figure 4--14: Touch panel and LCD assembly removal

5. Reinstallation: Do in reverse steps 1 through 5 to reinstall the Display assembly.

1. Locate module to be removed: Locate the display adapter board in the locator diagram Internal Modules, Figure 4--7, page 4--18. Additional modules to be removed:

H Trim (front panel and top)

H Display assembly

2. Remove the Display Adapter Board: See Figures 4--15 and 4--16, page 4--28.

a. Disconnect J11, J1, J7, J8, and J9 cables from the Display Adapter board.

b. Slide the clip off the connector (at J10).

c. Disconnect J10 cable from the Display Adapter board.

d. Remove the two T-15 Torxdrive screws that secure the Display Adapter

circuit board to the Display assembly. Remove the Display Adapter from the assembly.

3. Reinstallation: Do in reverse steps 2a through 2d to reinstall the board.

CSA8000 & TDS8000 Series Instruments and Modules

4--27

Removal and Installation Procedures

Display module

J10

Display

adaptor board

Back view

Figure 4--15: Display adaptor board removal

Slide the clip

over connector

T--15

Torxdri v e

screw (2)

J10

Clip to secure

connector as

shown

4--28

Figure 4--16: Connector clip assembly

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

Standby/On Switch Flex

Circuit Removal

1. Locate module to be removed: Locate the Standby/On Switch flex circuit in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be removed:

H Trim (front panel and top)

H Display assembly

2. Orient the oscilloscope: Set the oscilloscope so its bottom is down on the work surface and its front is facing you.

3. Remove the Standby/On Switch flex circuit: See F igure 4--17, page 4--30.

a. Peel the Standby/On switch flex circuit away from the front of the

display assembly.

b. Disconnect the flex circuit from J9 on the Display Adapter circuit board.

c. Grasp the flex circuit and pull it out of the Display assembly.

4. Reinstallation: Do following procedure to reinstall the Standby/On Switch.

a. Remove the protective backing on the Standby/On switch flex circuit.

b. Slide the connector end of the Standby/On switch flex circuit through the

slot in the Display assembly. Make sure the flex circuit connector aligns with J9 on the Display Adapter circuit board.

c. Align the holes in the flex circuit to the two index posts on the front side

of the Display assembly.

d. Firmly press the flex circuit to the Display assembly chassis surface.

CSA8000 & TDS8000 Series Instruments and Modules

4--29

Removal and Installation Procedures

Standby/On switch

Display

assembly

flex circuit

Front view

Display adaptor board

Standby/On switch flex circuit

Back view

Figure 4--17: Standby/On switch flex circuit removal

4--30

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

Floppy Disk Drive

1. Locate modules to be removed: Locate the Floppy Disk Drive in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be removed:

H Trim (front panel and top)

H Front Panel assembly

H Display assembly

2. Remove the floppy disk drive: Use Figure 4--18, page 4--31 as a guide. A #0 phillips screwdriver is required for this procedure.

3. Orient the instrument: Set the instrument so its bottom is down on the work surface and its front panel is facing you.

a. Remove the two small phillips screws that secure floppy disk drive

assembly to the bracket. Use the access hole located on the outer chassis to remove one of the small phillips screws.

b. Slide the floppy drive out toward the front of the instrument far enough

to allow you to disconnect the ribbon cable connector.

c. Remove the floppy drive from the instrument.

4. Reinstallation: Do in reverse steps a through c to reinstall the floppy disk

drive.

Ribbon

Floppy drive

Small phillips screw (2)

Figure 4--18: Floppy disk drive removal

CSA8000 & TDS8000 Series Instruments and Modules

cable

Access hole (2)

4--31

Removal and Installation Procedures

Hard Disk Drive

1. Locate module to be removed: Locate the Hard Disk Drive in the locator diagram Internal Modules, Figure 4--8, page 4--19.

CAUTION. Do not remove the replaceable hard disk drive when the mainframe is powered on.

The replaceable hard disk drive may be permanently damaged if it is removed while the mainframe is powered on.

Always power down the mainframe before removing the replaceable hard disk drive.

2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its rear panel is facing you.

3. Remove the hard disk drive: See Figure 4--19, page 4--33.

a. Verify that the chassis is powered down.

b. Push the hard disk drive cover in and the hard drive will disconnect from

the latch.

c. Grasp the hard disk drive assembly and slide it out of the instrument.

4. Reinstallation: Do in reverse steps a and b to reinstall the hard disk drive

assembly. The hard disk drive will push in to lock and push in again to unlock.

4--32

CSA8000 & TDS8000 Series Instruments and Modules

Depress the latch

Remove the

hard disk drive

Removal and Installation Procedures

Figure 4--19: Hard drive disk removal

5. Remove the hard disk drive from the cartridge: See Figure 4-- 20, page 4--33.

a. Remove the four #0 phillips screws that fasten the hard disk drive to the

cartridge.

b. Carefully remove the hard disk drive from the cartridge, and remove the

cable assembly from the connector on the hard disk drive.

Remove 4 screws

Figure 4--20: Removing the hard disk drive from the cartridge

CSA8000 & TDS8000 Series Instruments and Modules

4--33

Removal and Installation Procedures

CD Drive

1. Locate module to be removed: Locate the CD Drive in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be

removed:

H Trim (all)

H Bottom cover

H Left and Right covers

2. Remove the CD Drive assembly: See Figure 4--21, page 4--35.

3. Orient the instrument: Set the instrument so its bottom is down on the work

surface and its rear panel is facing you.

a. Remove the two T-15 Torxdrive screws that secure CD Drive assembly

to the rear chassis.

b. Disconnect the CD Drive ribbon cable J230, from Riser board.

c. Slide the CD Drive assembly (with the cable attached) toward the rear of

the chassis and remove it from the instrument.

4. Remove the CD Drive bracket and Rom interface board: See Figure 4--21, page 4--35.

a. Remove the four #0 phillips screws that secure the bracket to the CD

Drive. Remove the CD Drive from the bracket.

b. Remove the Interface board from the CD Drive by pulling the Interface

board straight back until they separate.

5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the CD Drive assembly.

4--34

CSA8000 & TDS8000 Series Instruments and Modules

Disconnect J230 CD drive ribbon cable

CD drive

interface board

CD drive

ribbon cable

Removal and Installation Procedures

CD drive

#0 Phillips

screw (4)

CD drive bracket

T--15 Torxdrive

screw (2)

Figure 4--21: CD drive and bracket removal

Fan Assembly Removal

1. Locate module to be removed: Locate the Fan assembly in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be removed:

H Trim (all)

H Bottom cover

H Left and Right covers

2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its left side is facing you.

CSA8000 & TDS8000 Series Instruments and Modules

4--35

Removal and Installation Procedures

3. Remove the fan assembly: See Figure 4--22, page 4--36.

CAUTION. Take care when handling the fan assembly, the fan blades are brittle and can be easily damaged.

4. Reinstallation: Do in reverse steps a through c to reinstall the fan assembly.

a. Disconnect the fan from processor/display board: Disconnect the fan’s

two power cables J130 and J170 located on the processor board.

b. Remove the two T-15 Torxdrive screws securing the fan assembly to the

top main chassis.

c. Lift the fan assembly up and out from the chassis.

Disconnect

from J170

Disconnect from J130

4--36

Figure 4--22: Fan assembly removal

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

Front and Rear Power

Distribution Boards

1. Assemble equipment and locate modules to be removed: Find the modules to be removed in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be removed:

H Trim (all)

H Bottom cover

H Left and Right covers

2. Orient the instrument: Set the instrument so its left side is down on the work surface and its right side is facing you.

3. Remove the Front power distribution board: See Figure 4--23, page 4--37.

a. Grasp the Front power distribution board and pull it out from the

instrument to disconnect it from the following connectors; J2 Power supply board, J102 Electrical front-end board, and J202 Acquisition board.

b. Remove the Rear power distribution board: Grasp the Rear Power

Distribution board and pull it out from the instrument to disconnect it from the following connectors; J201 Processor board, J1 Power supply board, J301 Electrical front-end board, and J102 Acquisition board.

4. Reinstallation: Do in reverse steps a and b to reinstall the front and rear power distribution circuit boards.

Rear power distribution circuit board

Front power

distribution

circuit board

Figure 4--23: Front and rear power distribution board removal

CSA8000 & TDS8000 Series Instruments and Modules

4--37

Removal and Installation Procedures

Low-Voltage Power

Supply

1. Assemble equipment and locate modules to be removed: Locate the modules to be removed in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be removed:

NOTE. In addition to this topic, see Checking the Power Supply Voltages on page 4--74 in the Troubleshooting section.

H Trim (all)

H Bottom cover

H Left and Right covers

H Front and Power rear distribution boards

2. Orient theinstrument: Set the instrument so its bottom is down on the work surface and its right-side is facing you.

3. Remove the low-voltage power supply: See Figure 4--24, page 4--39.

a. Disconnect J930 ribbon cable connector from the PC processor board.

b. Remove the two T-15 Torxdrive screws securing the low-voltage power

supply to the right-side chassis support.

c. Remove the three T-15 Torxdrive screws securing the low-voltage power

supply to rear chassis.

d. Grasp the low-voltage power supply and carefully slide the assembly out

of the mainframe.

4. Reinstallation: Do in reverse steps a through c to reinstall the low-voltage power supply.

4--38

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

T-15 Torxdrive screw (3)

Low-voltage power supply

T-15 Torxdrive screw (2)

Figure 4--24: Low-voltage power supply removal

CSA8000 & TDS8000 Series Instruments and Modules

4--39

Removal and Installation Procedures

NLX Board

1. Locate module to be removed: Locate the NLX Board in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be

removed:

H Trim (all)

H Bottom cover

H Left and Right covers

2. Remove the NLX Board assembly: See Figure 4--25, page 4--41.

3. Orient the instrument: Set the instrument so its bottom is down on the work

surface and its top panel is facing you.

a. Remove the two T-15 Torxdrive screws that secure the floppy disk drive

assembly into the front chassis.

b. Slide the floppy drive assembly, with cable attached, out toward the rear

of the instrument. Place floppy drive assembly on top of the hard/CD drive bracket.

c. Remove the five T-15 Torxdrive screws that secure NLX board assembly

to the chassis.

d. Remove the five T-15 Torxdrive screws that secure NLX board assembly

to the rear chassis.

e. Grasp the front edge of the NLX board assembly and pull up on the

assembly to disconnect the Riser Adapter from the PC Processor board’s edge connector.

f. Remove the NLX board assembly from the instrument.

4--40

CSA8000 & TDS8000 Series Instruments and Modules

Place floppy drive assembly on

top of hard/CD drive bracket

NLX board

assembly

Riser adapter

Leave floppy drive

cable attached

Removal and Installation Procedures

Hard/CD drive

bracket

board

Remove floppy drive assembly

from front chassis

Processor board

edge connector

Figure 4--25: NLX assembly removal

4. Remove the Riser Adapter and NLX boards: See Figure 4--26, page 4--42.

a. Remove the two T-15 Torxdrive screws that secure Riser Adapter board

to the NLX support bracket.

b. Disconnect the ribbon cable connectors from the floppy drive, hard drive

and CD drive.

CSA8000 & TDS8000 Series Instruments and Modules

4--41

Removal and Installation Procedures

5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the NLX board.

c. Remove the floppy drive assembly from the NLX board assembly.

d. Grasp the Riser board and pull it straight out to disconnect J510 edge

card connector from the NLX board. Remove the Riser Adapter board from the NLX board assembly.

e. Remove the four T-15 Torxdrive screws that secure NLX board to the

NLX support bracket.

f. Remove the six 3/16 nut posts that secure the three connectors to the rear

of the support bracket. Then remove the NLX board from the support bracket.

g. Remove the NLX board from the support bracket.

Riser adapter

T--15 Torx

screw (2)

Hard drive cable

CD drive cable

connector

T--15 Torx screw (4)

Floppy

drive cable

board

connector

NLX board

J510

Nut

post (6)

4--42

NLX support

bracket

Figure 4--26: Riser adapter and NLX board removal

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

Microprocessor

1. Locate module to be removed: Locate the Front Panel board in the locator diagram Internal Modules, Figure 4--8, page 4--19. Additional modules to be removed:

H Trim

H Bottom cover

H Left and Right covers

CAUTION. The microprocessor is susceptible to static-discharge damage. Service this component only in a static-free environment. Observe standard handling precautions for static-sensitive devices while servicing the chassis. Always wear a grounded wrist and foot straps while servicing the microprocessor, NLX or processor boards.

2. Remove the microprocessor: See Figure 4--27, page 4--44.

a. Disconnect the fan power cable J401 from the NLX board.

b. Push down and pull out on the holding bracket located nearest to the

outer edge of the circuit board.

c. Pull out and unlatch the remaining bracket. Lift the fan/heatsink

assembly out from the microprocessor.

d. Lift the microprocessor socket locking lever upward. Remove the

microprocessor.

3. Reinstallation: To reinstall the microprocessor to the NLX board as follows:

a. Install the microprocessor in the socket.

b. Lower the socket locking lever.

c. Make sure the fan/heatsink assembly is positioned with the fan cable

toward the outer edge of the circuit board.

d. Place the fan/heatsink assembly on the microprocessor to allow you to

latch the bracket to the tab that is nearest to the center of the circuit board.

e. Set the remaining edge of the fan/heatsink down on the microprocessor

and fasten the remaining bracket to the assembly.

f. Connect the fan power cable J401 from the NLX board.

CSA8000 & TDS8000 Series Instruments and Modules

4--43

Removal and Installation Procedures

and pull out to

release clamp

Fan and heatsink

Microprocessor

Push down

Locking lever

Push down and pull out to release clamp

J401 power cable

Figure 4--27: Microprocessor removal

NLX board

4--44

CSA8000 & TDS8000 Series Instruments and Modules

Removal and Installation Procedures

PC Processor Board

1. Locate module to be removed: Locate the PC Processor Board assembly in the locator diagram Internal Modules, Figure 4--8, page 4--19. Remove the following in this order:

H Trim (all)

H Bottom cover

H Left and Right covers

H Hard Disk and CD Drive

H Floppy Disk Drive

H NLX Board

H Front and Rear Power Distribution Boards

2. Orient the instrument: Set the instrument so its bottom is down on the work surface and its top panel is facing you.

3. Remove the PC Processor board assembly: See Figure 4--28, page 4--46.

a. Disconnect J190 and J691 ribbon cables from the PC processor board.

b. Remove the nine T-15 Torxdrive screws securing the PC processor board

to the chassis support.

c. Remove the five T-15 Torxdrive screws securing the PC processor board

assembly to the rear chassis.

4. Remove the PC Processor Board: See Figure 4--28, page 4--46.

a. Remove the two

/16nut posts that secure the RS--232 connector to the

rear of the support bracket.

b. Remove the two

/16nut posts that secure the sub-D connector to the rear

of the support bracket.

c. Remove the two phillips screws that secure the PCMCIA (Personal card,

memory card interface adapter) to the pc processor board. Remove the PCMCIA from the PC processor board.

d. Disconnect J930 ribbon cable connector from the PC processor board.

e. Then remove the PC processor board from the instrument.

5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the PC processor

assembly.

CSA8000 & TDS8000 Series Instruments and Modules

4--45

Removal and Installation Procedures

T--15 Torx

screw (9)

PC processor

board

J691 J690

J930

J190

Phillips screw (2)

Support

bracket

3/16 Nut post (2)

5/16 Nut post (2)

4--46

Chassis support

Disconnect

from J930

Figure 4--28: Processor board removal

CSA8000 & TDS8000 Series Instruments and Modules

Tektronix CSA8000B, CSA8000, TDS8000, TDS8000B, CSA8200 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Warranty 2

Table of Contents

List of Figures

List of Tables

General Safety Summary

Service Safety Summary

Preface

Manual Structure

Manual Conventions

Related Documentation

Installation

Check the Environmental Requirements

Site Considerations

Operating Requirements

Rackmount Requirements

Install the Sampling Modules

Maximum Configuration

Connect the Peripherals

Power On the Instrument

Powering Off the Instrument

Software Installation

Description

Software Release Notes

rebuilding the instrument hard drive. See Operating System Reinstallation on

System Diagnostics

Windows Safe Mode

Theory of Operation

Logic Conventions

Mainframe Overview

General

Input Signal Path

Display Panel

Front Panel

Rear Panel

Low Voltage Power Supply

Fans

Electrical Sampling Modules Overview

Optical Sampling Modules Overview

80A01 Trigger Prescale Preamplifier Module

80A02 EOS/ESD Protection Module

80A05 Electrical Clock Recovery Module

80A06 PatternSync Trigger Module

82A04 Phase Reference Module

Adjustment Procedures

Adjustment Interval

Adjustment Environment

Adjustment After Repair

Required Equipment

Instrumentation Setup

Main Instrument Adjustments

DC Calibrator Adjust

Internal 10 MHz Adjust

Maintenance

Preventing ESD

Inspection and Cleaning

General Care

Exterior

Interior

Removal and Installation Procedures

Preparation

Procedures for External Modules

Front-Panel Knobs

Trim and Carrying Handle

Covers

Procedures for Modules

Front Panel Assembly

Front Panel Board

Front Panel Keypad

Display Assembly

Display Adapter Board

Floppy Disk Drive

Hard Disk Drive

CD Drive

Fan Assembly Removal

NLX Board

Microprocessor