Model 7022Matrix-Digital I/O Card
Instruction Manual
A GREATER MEASURE OF CONFIDENCE
WARRANTY
Keithley Instruments, Inc. warrants this product to be free from defects in material and workmanship for a period of 1 year
from date of shipment.
Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable
batteries, diskettes, and documentation.
During the warranty period, we will, at our option, either repair or replace any product that proves to be defective.
To exercise this warranty, write or call your local Keithley representative, or contact Keithley headquarters in Cleveland, Ohio.
You will be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service
facility. Repairs will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for
the balance of the original warranty period, or at least 90 days.
LIMITATION OF WARRANTY
This warranty does not apply to defects resulting from product modification without Keithley’s express written consent, or
misuse of any product or part. This warranty also does not apply to fuses, software, non-rechargeable batteries, damage from
battery leakage, or problems arising from normal wear or failure to follow instructions.
THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY
IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PROVIDED HEREIN ARE BUYER’S SOLE AND EXCLUSIVE REMEDIES.
NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT,
INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS
INSTRUMENTS AND SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE
OF THE POSSIBILITY OF SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIMITED TO: COSTS OF REMOVAL AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY
PERSON, OR DAMAGE TO PROPERTY.
Keithley Instruments, Inc.
BELGIUM: Keithley Instruments B.V.
CHINA: Keithley Instruments China
FRANCE: Keithley Instruments Sarl
GERMANY: Keithley Instruments GmbH
GREAT BRITAIN: Keithley Instruments Ltd
INDIA: Keithley Instruments GmbH
ITALY: Keithley Instruments s.r.l.
NETHERLANDS: Keithley Instruments B.V.
SWITZERLAND: Keithley Instruments SA
TAIWAN: Keithley Instruments Taiwan
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9/00
Model 7022 Matrix-Digital I/O Card
Instruction Manual
©1997, Keithley Instruments, Inc.
All rights reserved.
Cleveland, Ohio, U.S.A.
Second Printing, March 2001
Document Number: 7022-901-01 Rev. B
Manual Print History
The print history shown below lists the printing dates of all Revisions and Addenda created for this manual. The Revision
Level letter increases alphabetically as the manual undergoes subsequent updates. Addenda, which are released between Revisions, contain important change information that the user should incorporate immediately into the manual. Addenda are numbered sequentially. When a new Revision is created, all Addenda associated with the previous Revision of the manual are
incorporated into the new Revision of the manual. Each new Revision includes a revised copy of this print history page.
Revision A (Document Number 7022-901-01)....................................................................................... April 1997
Addendum A (Document Number 7022-901-02) ................................................................................ August 1998
Revision B (Document Number 7022-901-01)..................................................................................... March 2001
All Keithley product names are trademarks or registered trademarks of Keithley Instruments, Inc.
Other brand and product names are trademarks or registered trademarks of their respective holders.
Safety Precautions
The following safety precautions should be observed before using
this product and any associated instrumentation. Although some instruments and accessories would normally be used with non-hazardous voltages, there are situations where hazardous conditions
may be present.
This product is intended for use by qualified personnel who recognize shock hazards and are familiar with the safety precautions required to avoid possible injury. Read the operating information
carefully before using the product.
The types of product users are:
Responsible body
and maintenance of equipment, for ensuring that the equipment is
operated within its specifications and operating limits, and for ensuring that operators are adequately trained.
Operators
trained in electrical safety procedures and proper use of the instrument. They must be protected from electric shock and contact with
hazardous live circuits.
Maintenance personnel
to keep it operating, for example, setting the line voltage or replacing consumable materials. Maintenance procedures are described in
the manual. The procedures explicitly state if the operator may perform them. Otherwise, they should be performed only by service
personnel.
Service personnel
safe installations and repairs of products. Only properly trained service personnel may perform installation and service procedures.
Keithley products are designed for use with electrical signals that
are rated Installation Category I and Installation Category II, as described in the International Electrotechnical Commission (IEC)
Standard IEC 60664. Most measurement, control, and data I/O signals are Installation Category I and must not be directly connected
to mains voltage or to voltage sources with high transient over-voltages. Installation Category II connections require protection for
high transient over-voltages often associated with local AC mains
connections. The user should assume all measurement, control, and
data I/O connections are for connection to Category I sources unless otherwise marked or described in the Manual.
is the individual or group responsible for the use
use the product for its intended function. They must be
perform routine procedures on the product
are trained to work on live circuits, and perform
Exercise extreme caution when a shock hazard is present. Lethal
voltage may be present on cable connector jacks or test fixtures. The
American National Standards Institute (ANSI) states that a shock
hazard exists when voltage levels greater than 30V RMS, 42.4V
peak, or 60VDC are present.
that hazardous voltage is present in any unknown circuit before
measuring.
Users of this product must be protected from electric shock at all
times. The responsible body must ensure that users are prevented
access and/or insulated from every connection point. In some cases,
connections must be exposed to potential human contact. Product
users in these circumstances must be trained to protect themselves
from the risk of electric shock. If the circuit is capable of operating
at or above 1000 volts,
exposed.
Do not connect switching cards directly to unlimited power circuits.
They are intended to be used with impedance limited sources.
NEVER connect switching cards directly to AC mains. When connecting sources to switching cards, install protective devices to limit fault current and voltage to the card.
Before operating an instrument, make sure the line cord is connected to a properly grounded power receptacle. Inspect the connecting
cables, test leads, and jumpers for possible wear, cracks, or breaks
before each use.
When installing equipment where access to the main power cord is
restricted, such as rack mounting, a separate main input power disconnect device must be provided, in close proximity to the equipment and within easy reach of the operator.
For maximum safety, do not touch the product, test cables, or any
other instruments while power is applied to the circuit under test.
ALWAYS remove power from the entire test system and discharge
any capacitors before: connecting or disconnecting cables or jumpers, installing or removing switching cards, or making internal
changes, such as installing or removing jumpers.
Do not touch any object that could provide a current path to the common side of the circuit under test or power line (earth) ground. Always
make measurements with dry hands while standing on a dry, insulated
surface capable of withstanding the voltage being measured.
A good safety practice is to expect
no conductive part of the circuit may be
The instrument and accessories must be used in accordance with its
specifications and operating instructions or the safety of the equipment may be impaired.
Do not exceed the maximum signal levels of the instruments and accessories, as defined in the specifications and operating information, and as shown on the instrument or test fixture panels, or
switching card.
When fuses are used in a product, replace with same type and rating
for continued protection against fire hazard.
Chassis connections must only be used as shield connections for
measuring circuits, NOT as safety earth ground connections.
If you are using a test fixture, keep the lid closed while power is applied to the device under test. Safe operation requires the use of a
lid interlock.
If a screw is present, connect it to safety earth ground using the
wire recommended in the user documentation.
!
The symbol on an instrument indicates that the user should refer to the operating instructions located in the manual.
The symbol on an instrument shows that it can source or measure 1000 volts or more, including the combined effect of normal
and common mode voltages. Use standard safety precautions to
avoid personal contact with these voltages.
The
WARNING
result in personal injury or death. Always read the associated information very carefully before performing the indicated procedure.
The
CAUTION
damage the instrument. Such damage may invalidate the warranty.
Instrumentation and accessories shall not be connected to humans.
Before performing any maintenance, disconnect the line cord and
all test cables.
To maintain protection from electric shock and fire, replacement
components in mains circuits, including the power transformer, test
leads, and input jacks, must be purchased from Keithley Instruments. Standard fuses, with applicable national safety approvals,
may be used if the rating and type are the same. Other components
that are not safety related may be purchased from other suppliers as
long as they are equivalent to the original component. (Note that selected parts should be purchased only through Keithley Instruments
to maintain accuracy and functionality of the product.) If you are
unsure about the applicability of a replacement component, call a
Keithley Instruments office for information.
To clean an instrument, use a damp cloth or mild, water based
cleaner. Clean the exterior of the instrument only. Do not apply
cleaner directly to the instrument or allow liquids to enter or spill
on the instrument. Products that consist of a circuit board with no
case or chassis (e.g., data acquisition board for installation into a
computer) should never require cleaning if handled according to instructions. If the board becomes contaminated and operation is affected, the board should be returned to the factory for proper
cleaning/servicing.
heading in a manual explains dangers that might
heading in a manual explains hazards that could
2/01
ANALOG MATRIX SPECIFICATIONS
MATRIX CONFIGURATION: 5 rows×6 columns. Jumpers can be removed
to isolate any row from the backplane. Rows A–D are connected to the
backplane.
CONTACT CONFIGURATION: 2-pole Form A (HI, LO).
MAXIMUM SIGNAL: 110V DC, 110V rms, 155V peak between any two
inputs or chassis, 1A switched, 30VA (resistive loads).
CONTACT LIFE:
Cold Switching: 10
8
closures.
Maximum Signal Levels: 105closures.
CHANNEL RESISTANCE (per conductor): <1.25Ω.
CONTACT POTENTIAL:
<3µV per channel contact pair
<9µV per single contact
OFFSET CURRENT: <100pA.
ACTUATION TIME: <3ms.
ISOLATION
1
: Path: >109Ω, <50pF.
Differential: >10
9
Ω, <70pF.
Common Mode: >109Ω, <200pF.
CROSSTALK
1
(1MHz, 50Ω Load): <–40dB.
INSERTION LOSS
1
(50Ω Source, 50Ω Load): <0.25dB below 1MHz, <3dB
below 10MHz.
RELAY DRIVE CURRENT (per relay): 16mA.
1
Specifications apply with no more than one crosspoint closed.
DIGITAL I/O SPECIFICATIONS
DIGITAL I/O CAPABILITY: 10 independent inputs. 10 independent
outputs.
OUTPUT:
Configuration: 10 open-collector drivers with factory installed
10kΩ pull-up resistors. Each driver has an internal flyback
diode.
Pull-Up Voltage: 5V internally supplied, external connection pro-
vided for user supplied voltage up to 42V max. Outputs short
circuit protected up to 25V.
Maximum Sink Current: Per Channel: 250mA. Per Card: 1A.
Logic: Hardware user configurable for negative or positive true
logic levels.
INPUT:
Configuration: 10 inputs with internal 10kΩ pull-up resistors pro-
vided. Input resistors can be set for pull-up or pull-down configuration.
MAXIMUM VOLTAGE LEVEL: 42V peak.
LOGIC: Positive true.
1 2 3 4 5 6
J
A
J
B
J
C
J
D
E
Backplane
5V
Output
V
EXT
GND
Output Channel 1 of 10
5V
Input
GND
Input Channel 1 of 10
10K
10K
10K
Matrix Configuration Digital I/O Configuration
GENERAL
CONNECTOR TYPE: 96-pin male DIN connector (7011-KIT-R mating
connector included).
ENVIRONMENT:
Operating: 0° to 50°C, up to 35°C <80% RH.
Storage: –25° to 65°C.
EMC: Conforms to European Union Directive 89/336/EEC.
SAFETY: Conforms to European Union Directive 73/23/EEC (meets
EN61010-1/IEC 1010).
7022 Matrix-Digital I/O Card
HW 8/24/01
Rev. A
Table of Contents
1 General Information
Introduction......................................................................................................................................................... 1-1
Features ............................................................................................................................................................... 1-1
Warranty information.......................................................................................................................................... 1-2
Manual addenda .................................................................................................................................................. 1-2
Safety symbols and terms ................................................................................................................................... 1-2
Specifications ...................................................................................................................................................... 1-2
Unpacking and inspection................................................................................................................................... 1-2
Inspection for damage................................................................................................................................. 1-2
Shipping contents........................................................................................................................................ 1-2
Instruction manual....................................................................................................................................... 1-2
Repacking for shipment ...................................................................................................................................... 1-3
Optional accessories............................................................................................................................................ 1-3
2 Matrix Configuration
Introduction......................................................................................................................................................... 2-1
Basic matrix configuration (5 × 6) ...................................................................................................................... 2-1
Typical matrix switching schemes...................................................................................................................... 2-2
Single-ended switching ............................................................................................................................... 2-3
Differential switching ................................................................................................................................. 2-3
Sensing ........................................................................................................................................................ 2-4
SMU connections........................................................................................................................................ 2-4
Matrix expansion................................................................................................................................................. 2-5
Two-card switching systems....................................................................................................................... 2-5
Mainframe matrix expansion ...................................................................................................................... 2-8
3 Digital I/O Configuration
Introduction......................................................................................................................................................... 3-1
Digital outputs..................................................................................................................................................... 3-1
Controlling pull-up devices................................................................................................................................. 3-1
Controlling devices using pull-up resistors......................................................................................................... 3-2
Digital inputs....................................................................................................................................................... 3-2
i
4 Card Connections and Installation
Introduction ......................................................................................................................................................... 4-1
Handling precautions........................................................................................................................................... 4-1
Matrix connections .............................................................................................................................................. 4-2
Backplane row jumpers ............................................................................................................................... 4-2
Jumper removal ........................................................................................................................................... 4-2
Jumper installation....................................................................................................................................... 4-2
Digital I/O connections........................................................................................................................................ 4-2
Voltage source jumper................................................................................................................................. 4-2
Pull-up resistors ........................................................................................................................................... 4-3
Configuring digital I/O output logic............................................................................................................ 4-4
Configuring digital I/O input pull-up resistance ......................................................................................... 4-4
Multi-pin (mass termination) connector card ...................................................................................................... 4-5
Typical matrix connection schemes .................................................................................................................. 4-11
Single-card system..................................................................................................................................... 4-11
Two-card system ....................................................................................................................................... 4-12
Two-mainframe system ............................................................................................................................. 4-14
Typical digital I/O connection schemes ............................................................................................................ 4-16
Output connection schemes....................................................................................................................... 4-16
Input connection scheme ........................................................................................................................... 4-17
Model 7022 installation and removal ................................................................................................................ 4-18
Card installation......................................................................................................................................... 4-18
Card removal ............................................................................................................................................. 4-18
Models 7022-D and 7022-DT ........................................................................................................................... 4-19
Internal connections................................................................................................................................... 4-19
Input/output connections ........................................................................................................................... 4-19
5 Operation
Introduction ......................................................................................................................................................... 5-1
Power limits......................................................................................................................................................... 5-1
Analog matrix maximum signal levels........................................................................................................ 5-1
Digital I/O maximum signal levels.............................................................................................................. 5-1
Mainframe control of the card............................................................................................................................. 5-1
Channel assignments ................................................................................................................................... 5-2
Closing and opening channels ..................................................................................................................... 5-4
Scanning channels ....................................................................................................................................... 5-4
Reading input channels................................................................................................................................ 5-5
IEEE-488 bus operation .............................................................................................................................. 5-5
Matrix switching examples.................................................................................................................................. 5-7
Thick film resistor network testing.............................................................................................................. 5-7
Transistor testing ....................................................................................................................................... 5-10
Measurement considerations ............................................................................................................................. 5-12
Path isolation ............................................................................................................................................. 5-12
Magnetic fields .......................................................................................................................................... 5-13
Radio frequency interference .................................................................................................................... 5-13
Ground loops ............................................................................................................................................. 5-14
Keeping connectors clean.......................................................................................................................... 5-14
AC frequency response.............................................................................................................................. 5-14
ii
6 Service Information
Introduction......................................................................................................................................................... 6-1
Handling and cleaning precautions ..................................................................................................................... 6-1
Performance verification..................................................................................................................................... 6-2
Environmental conditions ........................................................................................................................... 6-2
Recommended equipment........................................................................................................................... 6-2
Matrix connections...................................................................................................................................... 6-2
Channel resistance tests .............................................................................................................................. 6-3
Offset current tests ...................................................................................................................................... 6-4
Contact potential tests ................................................................................................................................. 6-6
Path isolation tests....................................................................................................................................... 6-7
Differential and common-mode isolation tests ........................................................................................... 6-8
Channel functionality test ................................................................................................................................. 6-10
Special handling of static-sensitive devices...................................................................................................... 6-11
Principles of operation ...................................................................................................................................... 6-11
Block diagram ........................................................................................................................................... 6-11
ID data circuits .......................................................................................................................................... 6-12
Matrix relay control .................................................................................................................................. 6-13
Matrix relay power control ....................................................................................................................... 6-13
Digital I/O output channel control ............................................................................................................ 6-13
Digital I/O input channel control .............................................................................................................. 6-13
Power-on safeguard................................................................................................................................... 6-13
Troubleshooting ................................................................................................................................................ 6-14
Troubleshooting equipment ...................................................................................................................... 6-14
Troubleshooting access ............................................................................................................................. 6-14
Troubleshooting procedure ....................................................................................................................... 6-14
7 Replaceable Parts
Introduction......................................................................................................................................................... 7-1
Parts lists ............................................................................................................................................................. 7-1
Ordering information .......................................................................................................................................... 7-1
Factory service .................................................................................................................................................... 7-1
Component layouts and schematic diagrams ...................................................................................................... 7-2
Index
iii
iv
List of Illustrations
2 Matrix Configuration
Figure 2-1 Model 7022 simplified schematic ............................................................................................................... 2-1
Figure 2-2 Model 7001/7002 analog backplane ........................................................................................................... 2-2
Figure 2-3 Matrix row connections to backplane ......................................................................................................... 2-2
Figure 2-4 Single-ended switching example ................................................................................................................ 2-3
Figure 2-5 Differential switching example................................................................................................................... 2-3
Figure 2-6 Sensing example ......................................................................................................................................... 2-4
Figure 2-7 SMU connections........................................................................................................................................ 2-4
Figure 2-8 Two separate 5 × 6 matrices........................................................................................................................ 2-5
Figure 2-9 Narrow matrix example (4 × 12)................................................................................................................. 2-6
Figure 2-10 Wide matrix example (10 × 6) .................................................................................................................... 2-7
Figure 2-11 Mixed card type example............................................................................................................................ 2-8
Figure 2-12 Partial matrix expansion (10 × 12).............................................................................................................. 2-9
3 Digital I/O Configuration
Figure 3-1 Output configuration for pull-up devices.................................................................................................... 3-1
Figure 3-2 Output configuration using pull-up resistance ............................................................................................ 3-2
Figure 3-3 Input configuration...................................................................................................................................... 3-2
4 Card Connections and Installation
Figure 4-1 Backplane row jumpers............................................................................................................................... 4-2
Figure 4-2 Voltage source jumper for output channels ................................................................................................ 4-3
Figure 4-3 Component locations - connector board ..................................................................................................... 4-3
Figure 4-4 Voltage source jumper installation ............................................................................................................. 4-3
Figure 4-5 Digital I/O output logic location ................................................................................................................. 4-4
Figure 4-6 Digital I/O output logic selection................................................................................................................ 4-4
Figure 4-7 Digital I/O input pull-up resistance selection.............................................................................................. 4-5
Figure 4-8 Multi-pin connector card terminal identification ........................................................................................ 4-6
Figure 4-9 Typical round cable connection techniques ................................................................................................ 4-9
Figure 4-10 Model 7011-MTR connector pinout ......................................................................................................... 4-10
Figure 4-11 Model 7011-KIT-R (with cable) assembly ............................................................................................... 4-10
Figure 4-12 Single-card system example...................................................................................................................... 4-11
Figure 4-13 Two-card system example ........................................................................................................................ 4-13
Figure 4-14 Two-mainframe system example.............................................................................................................. 4-15
Figure 4-15 Digital output, solenoid control ................................................................................................................ 4-16
Figure 4-16 Digital output, motor control .................................................................................................................... 4-16
Figure 4-17 Digital output, logic device control........................................................................................................... 4-17
v
Figure 4-18 Digital input, monitoring micro-switches.................................................................................................. 4-17
Figure 4-19 Model 7022 card installation in Model 7001 ............................................................................................ 4-18
Figure 4-20 Mating the PC-boards................................................................................................................................ 4-19
Figure 4-21 Mating connector (solder-side view)......................................................................................................... 4-20
5 Operation
Figure 5-1 Model 7001 channel status display.............................................................................................................. 5-2
Figure 5-2 Model 7002 channel status display (slot 1) ................................................................................................. 5-2
Figure 5-3 Channel display organization ...................................................................................................................... 5-3
Figure 5-4 Model 7022 programming channel assignments......................................................................................... 5-3
Figure 5-5 Thick film resistor network testing.............................................................................................................. 5-7
Figure 5-6 Four-terminal ohms measurements ............................................................................................................. 5-8
Figure 5-7 Voltage divider checks ................................................................................................................................ 5-9
Figure 5-8 Transistor testing ....................................................................................................................................... 5-10
Figure 5-9 DC parameter checks................................................................................................................................. 5-11
Figure 5-10 Common-emitter characteristics of an NPN silicon transistor.................................................................. 5-12
Figure 5-11 Path isolation resistance ............................................................................................................................ 5-12
Figure 5-12 Voltage attenuation by path isolation resistance ....................................................................................... 5-13
Figure 5-13 Power line ground loops............................................................................................................................ 5-14
Figure 5-14 Eliminating ground loops .......................................................................................................................... 5-14
6 Service Information
Figure 6-1 Path resistance testing.................................................................................................................................. 6-3
Figure 6-2 Common-mode offset current testing.......................................................................................................... 6-4
Figure 6-3 Differential offset current testing ................................................................................................................ 6-5
Figure 6-4 Contact potential testing .............................................................................................................................. 6-6
Figure 6-5 Path isolation testing (guarded) ................................................................................................................... 6-7
Figure 6-6 Differential isolation testing ........................................................................................................................ 6-8
Figure 6-7 Common-mode isolation testing................................................................................................................ 6-10
Figure 6-8 Testing an input or output channel ............................................................................................................ 6-10
Figure 6-9 Model 7022 block diagram........................................................................................................................ 6-11
Figure 6-10 Start and stop sequences............................................................................................................................ 6-12
Figure 6-11 Transmit and acknowledge sequence ........................................................................................................ 6-12
vi
List of Tables
4 Card Connections and Installation
Table 4-1 Mass termination accessories...................................................................................................................... 4-5
Table 4-2 Pin designation identification...................................................................................................................... 4-7
Table 4-3 Terminal identification.............................................................................................................................. 4-20
6 Service Information
Table 6-1 Verification equipment ............................................................................................................................... 6-2
Table 6-2 Path isolation tests....................................................................................................................................... 6-8
Table 6-3 Differential and common-mode isolation testing........................................................................................ 6-9
Table 6-4 Recommended troubleshooting equipment............................................................................................... 6-14
Table 6-5 Troubleshooting procedure ....................................................................................................................... 6-15
7 Replaceable Parts
Table 7-1 Relay card for Model 7022, parts list.......................................................................................................... 7-3
Table 7-2 Mass terminated connector card for Model 7022, parts list........................................................................ 7-5
Table 7-3 Model 7011-KIT-R 96-pin female DIN connector kit, parts list ................................................................ 7-7
vii
viii
•
•
•
General Information
1
Introduction
This section contains general information about the Model
7022 matrix-digital I/O card.
The Model 7022 consists of a multi-pin (mass termination)
connector card and a relay card. External test circuit connections are made via the 96-pin male DIN connector on the
connector card. Keithley offers a variety of optional accessories that can be used to make connections to the connector
card. (See the available accessories at the end of this section.)
The rest of Section 1 is arranged in the following manner:
• Features
• Warranty information
Manual addenda
• Safety symbols and terms
Specifications
• Unpacking and inspection
• Repacking for shipment
Optional accessories
Features
The Model 7022 has a two-pole, 5 × 6 (five rows by six columns) matrix. It also has ten independent inputs and outputs
for digital I/O capabilities. Some of the key features include:
• Low contact potential and offset current for minimal effects on low-level signals.
• Backplane row jumpers. Cutting jumpers disconnects
matrix rows from the Model 7001/7002 analog backplane.
• High density switching and control.
• High capacity digital output sink of 250mA.
• 1A pathway current carrying capacity.
• Model 7011-KIT-R connector kit that includes a 96-pin
female DIN connector that will mate directly to the connector on the Model 7022 or to a standard 96-pin male
DIN bulkhead connector (see Model 7011-MTR). This
connector uses solder cups for connections to external
circuitry and includes an adapter for a round cable and
the housing.
1-1
General Information
Warranty information
Warranty information is located on the inside front cover of
this instruction manual. Should your Model 7022 require
warranty service, contact the Keithley representative or
authorized repair facility in your area for further information. When returning the card for repair, be sure to fill out and
include the service form at the back of this manual in order
to provide the repair facility with the necessary information.
Manual addenda
Any improvements or changes concerning the card or manual will be explained in an addendum included with the card.
Addenda are provided in a page replacement format. Replace
the obsolete pages with the new pages.
Safety symbols and terms
The following symbols and terms may be found on an instrument or used in this manual.
!
The symbol on an instrument indicates that the user
should refer to the operating instructions located in the
instruction manual.
Unpacking and inspection
Inspection for damage
The Model 7022 is packaged in a resealable, anti-static bag
to protect it from damage due to static discharge and from
contamination that could degrade its performance. Before
removing the card from the bag, observe the following precautions on handling.
Handling precautions
1. Always grasp the card by the side edges and shields. Do
not touch the board surfaces or components.
2. When not installed in a Model 7001/7002 mainframe,
keep the card in the anti-static bag and store it in the
original packing carton.
After removing the card from its anti-static bag, inspect it for
any obvious signs of physical damage. Report any such damage to the shipping agent immediately.
Shipping contents
The following items are included with every Model 7022
order:
The symbol on an instrument shows that high voltage
may be present on the terminal(s). Use standard safety precautions to avoid personal contact with these voltages.
The WARNING heading used in this manual explains dangers that might result in personal injury or death. Always
read the associated information very carefully before performing the indicated procedure.
The CAUTION heading used in this manual explains hazards that could damage the card. Such damage may invalidate the warranty.
Specifications
Model 7022 specifications are found at the front of this manual. These specifications are exclusive of the mainframe
specifications.
• Model 7022 Matrix-Digital I/O Card
• Model 7011-KIT-R 96-pin Female DIN Connector Kit
• Model 7022 Instruction Manual
• Additional accessories as ordered
Instruction manual
The Model 7022 Instruction Manual is three-hole drilled so
it can be added to the three-ring binder of the Model 7001 or
7002 Instruction Manual. After removing the plastic wrapping, place the manual in the binder following the mainframe
instruction manual. Note that a manual identification tab is
included and should precede the Model 7022 Instruction
Manual.
If an additional instruction manual is required, order the
manual package, Keithley part number 7022-901-00. The
manual package includes an instruction manual and any pertinent addenda.
1-2
General Information
Repacking for shipment
Should it become necessary to return the Model 7022 for
repair, carefully pack the unit in its original packing carton,
or the equivalent, and include the following information:
• Advise as to the warranty status of the card.
• Write ATTENTION REPAIR DEPARTMENT on the
shipping label.
• Fill out and include the service form located at the back
of this manual.
Optional accessories
The following accessories are available for use with the
Model 7022:
Model 7011-MTC-2 This two-meter round cable assem-
bly is terminated with a 96-pin female DIN connector on
each end. It will mate directly to the connector on the Model
7022 and to a standard 96-pin male DIN bulkhead connector
(see Model 7011-MTR).
Model 7011-MTR This 96-pin male DIN bulkhead con-
nector uses solder cups for connections to external circuitry.
It will mate to the Model 7011-KIT-R connector and Model
7011-MTC-2 cable assembly.
1-3
General Information
1-4
Rows
Columns
To 7001/7002
Analog
Backplane
Backplane
Jumpers
(4 pairs)
1
A
B
C
D
23456
E
HI
LO
Crosspoint (1 of 30)
2
Matrix Configuration
Introduction
This section covers the basics for matrix switching and is
arranged as follows:
• Basic matrix configuration (5 × 6) — Covers the basic
5 × 6 matrix configuration. The significance of the
backplane jumpers is also covered here.
• Typical matrix switching schemes — Explains some
of the basic ways a matrix can be used to source or measure. Covers single-ended switching, differential (floating) switching, and sensing.
• Matrix expansion — Discusses the various matrix
configurations possible using multiple cards.
Basic matrix configuration (5
A simplified schematic of the Model 7022 matrix is shown
in Figure 2-1. The card is configured as a 5 × 6 matrix. Each
of the 30 crosspoints is made up of a two-pole switch. By
closing the appropriate crosspoint switch, any matrix row
can be connected to any column in the matrix.
×
6)
Figure 2-1
Model 7022 simplified schematic
Backplane jumpers
In Figure 2-1, the four pairs of backplane jumpers shown are
located on the relay card. With the jumpers installed, the
matrix is connected to the analog backplane of the Model
7001/7002 to allow matrix expansion with a second card
installed in the mainframe. With the jumpers removed (cut),
the matrix is isolated from an adjacent card installed in the
mainframe. Note that row E does not connect to the analog
backplane.
2-1
Matrix Configuration
F
M
Card 1
Model 7001/7002
Analog
Backplane
Row A
H
L
G
Row B
H
L
G
L
L
Row C
Row D
H = High
L = Low
G = Guard
H
G
H
G
Card 2
H
L
G
H
L
G
H
L
G
H
L
G
Row = Matrix (7022)
Note: Row E does not
connect to the
analog backplane.
igure 2-2
odel 7001/7002 analog backplane
The three-pole analog backplane of the mainframe is shown
in Figure 2-2. It is through this analog backplane where the
rows of a Model 7022 card installed in one slot can be connected to the rows (or banks) of a compatible card installed
in the adjacent slot of the mainframe.
Figure 2-3 shows how each row of the Model 7022 is connected to the backplane. Since the Model 7022 is a two-pole
card, it does not provide a connection to the Guard terminal
of the backplane. The Model 7022 is shipped from the factory with the backplane row jumpers installed.
7001/7002
Analog
Backplane
H
L
G
H
L
H = High
L = Low
7022
Matrix Row
(1 of 4)
Backplane
Jumpers
Figure 2-3
Matrix row connections to backplane
Removing (cutting) the backplane jumpers isolates the card
from the backplane, and subsequently, any card installed in
the adjacent slot. For information on removing the jumpers,
refer to Section 4.
NOTE
The Model 7001/7002 does not provide an
analog backplane for the non-701X/702X/
703X series cards. As a result, any of these
cards installed in one slot in the mainframe is electrically isolated from any card
installed in the adjacent slot. The only way
to connect a Model 7022 to one of these
cards is to wire them together.
Typical matrix switching schemes
The following paragraphs describe some basic switching
schemes that are possible with a two-pole switching matrix.
These switching schemes include some various shielding
configurations to help minimize noise pickup in sensitive
measurement applications. These shields are shown connected to chassis ground. For some test configurations,
shielding may prove to be more effective connected to circuit
common. Chassis ground is accessible at the rear panel of the
Model 7001/7002.
2-2
Matrix Configuration
Single-ended switching
In the single-ended switching configuration, the source or
measure instrument is connected to the DUT through a single pathway as shown in Figure 2-4.
Row Columns
HI
LO
Source or
Measure
Figure 2-4
Single-ended switching example
Differential switching
The differential or floating switching configuration is shown
in Figure 2-5. The advantage of using this configuration is
that the terminals of the source or measure instrument are not
confined to the same matrix crosspoint. Each terminal of the
instrument can be connected to any matrix crosspoint.
H
DUT
L
7022
Optional
Shield
Source or
Measure
Figure 2-5
Differential switching example
HI
LO
Rows Columns
H
L
DUT
H
L
7022
2-3
Matrix Configuration
Sensing
Figure 2-6 shows how the matrix can be configured to use
instruments that have sensing capability. The main advantage of using sensing is to cancel the effects of matrix path
resistance (<1.25Ω) and the resistance of external cabling.
Whenever path resistance is a consideration, sensing should
be used.
Rows
Source HI
Sense HI
Sense LO
Source LO
Source or
Measure
Figure 2-6
Sensing example
SMU connections
Figure 2-7 shows how a Keithley Model 236, 237, or 238
Source Measure Unit could be connected to the matrix. By
using triax cables that are unterminated at one end, the driven
guard and chassis ground are physically extended all the way
to the card.
Columns
H
L
DUT
H
L
7022
Rows
Output HI
Guard
Sense HI
Guard
Sense LO
Output LO
Output LO
Triax
Cables (3)
236/237/238
WARNING: Hazardous voltages may be present on
GUARD. Make sure all cable shields are
properly insulated before applying power.
Columns
H
L
DUT
H
L
7022
Figure 2-7
SMU connections
2-4
Matrix Configuration
Matrix expansion
With the use of additional cards and mainframes, larger
matrices can be configured. Each Model 7001 Switch System mainframe can accommodate up to two cards, and up to
six mainframes can be connected together to configure up to
12 cards. Each Model 7002 Switch System mainframe can
accommodate up to ten cards. And, by connecting up to six
Model 7002 mainframes, 60 cards can be configured. The
limits on the number of cards in the Model 7001/7002 are
due to triggering.
Card 1
7022
Columns
16
A
7001/7002
Analog
Backplane
Two-card switching systems
The Model 7001 and 7002 Switch System mainframes can
accommodate two and ten cards, respectively. The following
paragraphs use a two-card system to illustrate multiple-card
switching configurations.
Separate switching systems
Two single-card systems can be configured by removing the
backplane jumpers from one of the cards. The two cards will
be controlled by the same mainframe, but they will be electrically isolated from each other. Figure 2-8 shows an example using two Model 7022 cards.
Card 2
7022
Columns
16
A
B
Rows
C
D
E
Note: Row E does not connect
to the analog backplane.
Figure 2-8
Two separate 5 × 6 matrices
5 × 6 Matrix
B
Rows
C
D
E
5 × 6 Matrix
Jumpers
Removed
2-5
Matrix Configuration
Narrow matrix expansion (4 × 12 matrix)
A narrow 4-row by 12-column matrix can be configured by
installing two “as shipped” Model 7022s in the Model 7001/
7002 mainframe. By leaving the backplane jumpers
installed, matrix rows A through D of the card installed in
Card 1
7022
Columns
16
A
B
Rows
C
D
E
slot 1 (CARD 1) are automatically connected to matrix rows
A through D of the card installed in slot 2 (CARD 2) through
the analog backplane. Note that row E does not connect to
the analog backplane. The 4 × 12 matrix is shown in Figure
2-9.
Card 2
7022
7001/7002
Analog
Backplane
712
Columns
Notes: 1. Backplane jumpers on both cards must be installed.
Figure 2-9
Narrow matrix example (4 × 12)
4 × 12 Matrix
2. Row E does not connect to the analog backplane.
2-6
Matrix Configuration
Wide matrix expansion (10 × 6 matrix)
A wide ten-row by six-column matrix is shown in
Figure 2-10. For this configuration, the six columns of the
two matrices must be physically hard-wired together. Also
Card 1
7022
16
A
B
Rows
C
D
E
Columns
note that the backplane jumpers on one of the cards must be
removed in order to isolate the rows of the two cards from
each other.
Jumpers
Removed
External
Column
Jumpers
7001/7002
Analog Backplane
A
B
Rows
C
D
E
7022
Card 2
10 × 6 Matrix
Figure 2-10
Wide matrix example (10 × 6)
2-7
Matrix Configuration
Mixing card types
Different types of cards can be used together to create some
unique switching systems. For example, you could have a
Model 7022 matrix-digital I/O card installed in one slot and
a Model 7011 card installed in the adjacent slot.
Figure 2-11 shows a possible switching system using a
Model 7011 and a Model 7022. The backplane jumpers for
both cards must be installed. This allows matrix rows to be
connected to multiplexer banks. On the Model 7011, the
bank-to-bank jumpers must be removed to maintain isolation
between matrix rows. See the instruction manual for the
Model 7011 for complete multiplexer information.
Card 1
7022
16
A
Columns
7001/7002
Backplane
Mainframe matrix expansion
A 12-card matrix is possible by using six Model 7001 mainframes together, which provides 360 crosspoints. Also, a 60card matrix is possible by using six Model 7002 mainframes
together, which provides 1800 crosspoints. The limits on the
number of cards in the Model 7001/7002 switch system are
due to triggering.
In general, connecting the rows of a card in one mainframe
to the rows of a card in a second mainframe increases the column numbers of the matrix. For example, if the rows of a
4 × 12 matrix in one mainframe are connected to the rows of
a 4 × 12 matrix in a second mainframe, the resulting matrix
would be 4 × 24. Section 4 explains how to connect a test
system using two mainframes.
Card 2
7011
Inputs
1
1
10
Bank A
10
B
Rows
C
D
E
5 × 6 Matrix
Notes: 1. Models 7011 and 7022 backplane jumpers must be installed.
2. Model 7011 bank-to-bank jumpers must be removed.
Figure 2-11
Mixed card type example
Bank B
10
Bank C
10
Bank D
Quad 1 × 10 Mux
2-8
Matrix Configuration
Partial matrix implementation
A fully implemented matrix provides a relay at each potential crosspoint. For example, a fully implemented 10 × 12
matrix utilizing four 5 × 6 cards contains 120 crosspoints. A
partially implemented 10 × 12 matrix would contain fewer
crosspoints.
An example of a partially implemented 10 × 12 matrix is
shown in Figure 2-12. The partial matrix is still considered
10 × 12 but contains only 90 crosspoints using three Model
7022 cards installed in two Model 7001/7002 mainframes.
Matrix card #1 (7022 #1) installed in one of the slots of the
first mainframe (7001/7002 #1) provides a 5 × 6 matrix. The
other slot of the first mainframe should be left empty. If
another switching card is left in that slot, it must be isolated from the analog backplane (i.e., backplane jumpers
7001/7002 #1
7022 #1
Columns
1
6
removed). The two cards (7022 #2 and #3) installed in
the second mainframe (7001/7002 #2) are configured as a
10 × 6 matrix as explained in the wide matrix expansion
(10 × 6) paragraph. Remember that the rows of card #2 must
be isolated from the rows of card #3. This is accomplished by
removing the jumpers on one of the two cards. Finally, the
partially implemented 10 × 12 matrix is realized by externally hard-wiring the rows of card #1 to the rows of card #2.
An obvious advantage of a partial matrix is that fewer cards
are needed. Another reason to use a partial matrix is to keep
specific devices from being connected directly to other
devices. For example, a source connected to rows F, G, H, I,
or J (Figure 2-12) cannot be connected to a column of Model
7022 #1 with one “accidental” crosspoint closure. Three specific crosspoints must be closed in order to route the source
signal to a column of card #1.
7001/7002 #2
External
Row
Jumpers
7
7022 #2
Columns
12
A
B
Rows
C
D
E
F
G
Rows
H
I
J
Figure 2-12
Partial matrix expansion (10 × 12)
7022 #3
2-9
Matrix Configuration
2-10
3
F
Digital I/O Configuration
Introduction
This section covers the basic digital input and output configurations for the Model 7022. Connection information for
these configurations is provided in Section 4 of this manual,
while operation (front panel and IEEE-488 bus) is explained
in Section 5.
Digital outputs
Output channels are user configurable for negative (low) or
positive (high) true logic. That is, the output can be high or
low when the channel is turned on (closed) depending upon
user configuration. Conversely, the output can be high or low
when the channel is turned off (open). Refer to Section 4 to
configure the logic to your requirement.
7022
Jumper
5V
10kΩ
Controlling pull-up devices
Typically, the digital outputs are used to provide drive for relatively high current devices such as solenoids, relays, and
small motors. The configurations for these applications are
shown in Figure 3-1. Figure 3-1 allows you to use an external
voltage source (V) for devices that require a higher voltage
(42V maximum). An internal jumper is used to select the
internal pull-up voltage. At the factory, the internal 5V
source is selected.
Each output channel uses a fly-back diode for protection
when switching an inductive device, such as a solenoid coil.
This diode diverts the potentially damaging fly-back voltage
away from the driver.
V
V
EXT
Solenoid or
relay coil
NOTE: Setup uses an
external voltage
source (42V maximum).
Driver
igure 3-1
Output configuration for pull-up devices
3-1
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