Tektronix 7011-S, 7011-C Instruction Manual

Download

Instruction Manual

Models 7011 -S and 701 I-C

Quad 1 x 10 Multiplexer Cards

Contains Operating and Servicing Information

W ARRANTY

Keithley Instruments, Inc. warrants this product to be free from defects in material and workmanship for a period of 1 year from date of shipment.

Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable batteries, diskettes, and documentation.

During the warranty period, we will, at our option, either repair or replace any product that proves to be defective.

To exercise this warranty, write or call your local Keithle y representative, or contact Keithle y headquarters in Cleveland, Ohio. You will be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service facility . Repairs will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for the balance of the original warranty period, or at least 90 days.

LIMIT A TION OF W ARRANTY

This warranty does not apply to defects resulting from product modiﬁcation without Keithley’s express written consent, or misuse of any product or part. This warranty also does not apply to fuses, software, non-rechargeable batteries, damage from battery leakage, or problems arising from normal wear or failure to follow instructions.

THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PROVIDED HEREIN ARE BUYER’S SOLE AND EXCLUSIVE REMEDIES.

NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS INSTRUMENTS AND SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE OF THE POSSIBILITY OF SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIMITED TO: COSTS OF REMOVAL AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY PERSON, OR DAMAGE TO PROPERTY.

Keithley Instruments, Inc.

Sales Ofﬁces: BELGIUM: Bergensesteenweg 709 • B-1600 Sint-Pieters-Leeuw • 02-363 00 40 • Fax: 02/363 00 64

CHINA: Yuan Chen Xin Building, Room 705 • 12 Yumin Road, Dewai, Madian • Beijing 100029 • 8610-6202-2886 • Fax: 8610-6202-2892 FINLAND: Tietäjäntie 2 • 02130 Espoo • Phone: 09-54 75 08 10 • Fax: 09-25 10 51 00 FRANCE: 3, allée des Garays • 91127 Palaiseau Cédex • 01-64 53 20 20 • Fax: 01-60 11 77 26 GERMANY: Landsberger Strasse 65 • 82110 Germering • 089/84 93 07-40 • Fax: 089/84 93 07-34 GREAT BRITAIN: Unit 2 Commerce Park, Brunel Road • Theale • Berkshire RG7 4AB • 0118 929 7500 • Fax: 0118 929 7519 INDIA: Flat 2B, Willocrissa • 14, Rest House Crescent • Bangalore 560 001 • 91-80-509-1320/21 • Fax: 91-80-509-1322 ITALY: Viale San Gimignano, 38 • 20146 Milano • 02-48 39 16 01 • Fax: 02-48 30 22 74 KOREA: FL., URI Building • 2-14 Yangjae-Dong • Seocho-Gu, Seoul 137-130 • 82-2-574-7778 • Fax: 82-2-574-7838 NETHERLANDS: Postbus 559 • 4200 AN Gorinchem • 0183-635333 • Fax: 0183-630821 SWEDEN: c/o Regus Business Centre • Frosundaviks Allé 15, 4tr • 169 70 Solna • 08-509 04 679 • Fax: 08-655 26 10 SWITZERLAND: Kriesbachstrasse 4 • 8600 Dübendorf • 01-821 94 44 • Fax: 01-820 30 81 TAIWAN: 1FL., 85 Po Ai Street • Hsinchu, Taiwan, R.O.C. • 886-3-572-9077• Fax: 886-3-572-9031

28775 Aurora Road • Cleveland, Ohio 44139 • 440-248-0400 • Fax: 440-248-6168

1-888-KEITHLEY (534-8453) • www.keithley.com

Printed in the U.S.A.

11/01

Models 7011 -S and 7011 -C Instruction Manual

01991, Keithley Instruments, Inc.

Test Instrumentation Group

Cleveland, Ohio, U. S. A.

Manual Print History

The print histoxy shown below lists the printing dates

all Revisions and Addenda created for this manual. The Revision Level letter increases alphabetically as the w@ undergoes subsequent updates. Addenda, which are released between Revisions, contain important change information that the user should incorporate immediately into the manual. Addenda are numbered sequentially. When a new Revision is created, all Addenda associated with the previous Revision of the manual are incorporated into the new Revision of the manual. Each new Revision includes a revised copy of this print history page.

R&ion A (Dcament Number 7011-90101) ...... .._.............~

Addendum A (Document Number 7011-901-02)

Revision B (Donunmt Number 7011~901-01). ............................................................................... l&1-31 1992

Revision C (Dmment Number 7011-90141) .......................................................................... December 1992

..........................................................................

................................................

November 1991

January 992

Safety Precautions

The following safety precautions should be observed before using this product and any associaled instrumentation. Although some in-

~tnmen~s and accessories would nomxdly be used with non-hazardous voltages, there are situations where hazardous conditions

may be p*esent. This product is intended for use by qualified personnel who recog-

nize shock hazards and are familiar with the safety precautions re-

quired to avoid possible injury. Read the operating information carefully before using the product.

The types of product users arc: Responsible body is tbc individual or group responsible for the use

and maintenance of equipment, and for ensuring that operators are adequately trained.

Operators use the product for its intended function. They must be trained in electrical safety procedures and proper use of the instmment. They must be protected from electric shock and contact with hazardous live circuits.

Maintenance personnel perform routine procedures on the product to keep it operating, for example, setting the line voltage or replacing consumable materials. Maintenance procedures are described in the manual. The proccdurcs explicitly state if the operator may perform them. Otherwise, they should be performed only by service perS”lld.

Service personnel 8.n~ trained to work on live circuits, and perform safe installations and repairs of products. Only properly trained service personnel may perform installation and service procedures.

Exercise extreme caution when a shock hazard is present. Lethal voltage may be present on cable connector jacks or test fixtures. The American National Standards Institute (ANSI) states that a shock hazard exists when voltage levels greater than 30V RMS, 42.4V peak, or 60VDC are present. A good safety practice is to expect that hazardous voltage is present in any unknown circuit before

measuring.

Users of this product must be protected from electric shock at all times. The responsible body must ensure that users are prevcntcd access and/or insulated from every connection point. In some cases, connections must be exposed to potendal human contact. Product users in these circumstances must be trained to protect themselves from the risk of electric shock. If the circuit is capable of operating at or above 1000 voks, no conductive part of the circuit may be exposed.

As described in the International Electrotechnical Commission (IEC) Standard IEC 664, digital multimeter measuring circuits (c,g,, Keithley Models 175A, 199, 2000, 2001, 2002, and 2010) measuring circuits are Installation Category Il. All other instmmerits’ signal terminals are Installation Category I and must not bc

connected to mains. Do not connect switching cards directly to unlimited power circuits.

They are intended to be used with impedance limited sources. NEVER connect switching cards directly to AC mains. When connecting sources to switching cards, install protective devices to limit fault current and voltage to the card.

Before operating an instrument, make sure the lint cord is connected to a properly grounded power receptacle. Inspect the connecting cables, teat leads, and jumpers for possible wear, cracks, or breaks

before each use.

For maximum safety, do not touch the product, test cables, or any other instruments while power is applied to the circuit under test. ALWAYS remove power from the entire test system and discharge any capacitors before: connecting or disconnecting cables or jumpers, installing or removing switching cards, or making internal changes, such as installing or removing jumpers.

Do not touch any object that could provide a current path to the common side of the circuit under test or power line (earth) ground. Always make measurements with dry hands while standing on a dry, insulated surface capable of withstanding the voltage being measured.

Do not exceed the maximum signal levels of the instruments and accessories, as defined in the specifications and operating information, and as shown on the instrument or test fixturn panels, or switching card.

When fuses are used in a product. replacc with same type and rating Car continued protection against fire hazard.

Chassis connections most only be used as shield connectioos for measuring circuits, NOT as safety earth ground connections.

If you are using a test fixture, keep the lid closed while powcr is applied to the device under tat. Safe operation requires the USC of a lid interlock.

Ifa@. screw is present, connect it to safety earth ground using the wire recommended in the user documentation.

symbol on an instrument indicates that the user should re-

fer to the operating instructions located in the manual.

The A

sure 1000 volts or more, including the combined effect of normal and common mode voltages. Use standard safety precautions to avoid personal contact with these voltages.

The WARNING heading in a manual explains dangers that might result in personal injury or death. Always read the associated information very carefully before performing the indicated procedure.

symbol oo an instrument shows that it can source or mea-

Instrumentation and accessories shall not be connected to humans.

Before performing any maintenance, disconnect the line cord and all test cables.

To maintain protection from electric shock and fire, replacement

components in mains circuits, including the power transformer, test leads. and inout iacks. must be ourchased from Keithlev lnsm-

mats. Standard fuses, with applicable national safety approvals, may be used if the rating and type arc the same. Other components that are not safety related may be purchased from other suppliers as long as they are equivalent to the original component. (Note that sc-

leaed parts should be purchased only through Kcithley Instruments to maintain accuracy and functionality of the product.) If you arc unsure about the applicability of a replacement component, call a Keithley Instruments oflicc for information.

To clean the instrument. USC a dame cloth or mild. water based cleaner. Clean the exterior of the instrument only. Do not apply cleaner directly to the instrument or allow liquids to enter or spill on the instmmcnt.

The CAUTION heading in a manual explains hazards that could damage the instrument. Such damage may invalidate the warranty.

7011SPECIFICATIONS

MOD”, ‘IOU-S Quad 1x10 Multiplew with SaewT.smh&. MODEL7011-C QuadlxlOMvltiplexerwithMT~~Connector.

MDLTIPLBX CONPIGDRATION Four independent 1x10 2-p& Multi-

plex banks or two independent 1x10 &pole Multiplex banks. Adjjcent banksenbecomfftedtogether. Jumperscanberemovedtoisolateany bank from the backplane.

CONTACT CONFIGDRATION: 2-jmle Form A @Ii, Lo).

CONNECTOR TYPE:

7011-5: Screw terminal, #16AWG

mmc

MAXMUM SIGNAL LEVEb

DC Sign& 1lOV DC behveen any two pins, IA witched. AC Sign& 125V FM5 or 173V AC peak, between any two pins,

COMMON MODE VOLTAGE: 175” peak, my pin to chassis. CONTACTLIFE

O.D. 28 Conductors with .062 inch O.D.

%-pin m&Ewxardconnebor. Mates tofem&twistedwire cable, crimp or solder connedor.

bG.eive load). 1A switched, 60VA ke&tive load).

IMximllm wire size, with a92 tnch

maxima

30 Conductor madmum

#Z?AWG

typical wire size

3WA

CONTACT POTENTIAL

7011-5: c 500 nv per contact pair Hi, Lo).

< 1.5 pv par single contact

m11-c < 1.5 WV per contact pair m, Lo) eypically < 1 @q.

< 35 p? per single contact oj@zdly c 3 PVL

OPFSET ‘XItRt3iVI: < 100 PA. ACTUATION TIME: 3 ms. ISOLATION:

Bank >lC@Q < 25 pF. CbanneI to channel: >lO%Z, < 50 pF. Differenti Configured as 1x10 =-l@Q, < 100 pF.

Configured as 1x40 >loSQ, < 200 pF.

Common Mode Configured as 1x10 >lOQ, < 2W pF.

Conftgurect as 1x40 >l@O, < 600 pF.

CROSS TALK OMHz, 500 Load):

Bank <-4OdB. Channeb <4OdB.

INSERTION LOSS (MS2 Somx,sO Load): < 0.1 dB below 1 MHz, < 3 dB

below 2 MHZ. RELAYDRNECURRENT (per r&y): 16 mA. E7WIRONMEN-C

opdi0~ O’C to WC, up to 35-x < 80% Fx.

smagez spedfieti0ns subjj to change without notice.

-25°C to 65’C

........................................................................................................................................................................................................................................................

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.7.1

1.7.2

1.7.3

1.7.4

1.8

2.1

2.2

22.1

2.2.2

2.3

2.3.1

2.3.2

2.3.3

2.3.4

2.4

2.4.1

2.4.2

Introduction

Features .............................................................................................................................................................

warranty informaton..

Manual a&km& .............................................................................................................................................

Safety symbols and terms ..............................................................................................................................

specifications ...................................................................................................................................................

Unpacking am.3 inspection

Inspectior, for damage Shipping axItents.. apron mand..

Repacking for shipment .........................................................................................................................

Optional a~c~soties.. ......................................................................................................................................

Introduct$m

Basic m&ipkxer ca~figurations ..................................................................................................................

Multiplexer bank-to-bank jumpers.. .....................................................................................................

Backplane jumpers

Typical nultiplexer switching schemes.. .....................................................................................................

S&++&xl

Differential switching .............................................................................................................................

sensing. .....................................................................................................................................................

SMIJ co~cxtiq~.

Multiplexer expansmn

Two-card svitching system Mainframe multiplexer expansion

.....................................................................................................................................................

...................................................................................................................................

..................................................................................................................................

................................................................................................................................

....................................................................................................................................................

..................................................................................................................................

swit&ing

..........................................................................................................................

....................................................................................................................................

..................................................................................................................................

1-l l-1

l-2 l-2 1-2 1-2 l-2 l-2 l-2

1-3 1-3 l-3

2-1 2-1 2-2 2-5

2-6 2-7 2-7 2-a 2-8

2-10 t:?y

3.1

3.2

3.3

3.3.1

3.3.2

3.3.3

3.3.4

3.4

3.4.1

3.4.2

3.4.3

3.5

~~od,,,&m,

&n,&,g

C~~&i~~. .....................................................................................................................................................

&&-t&m& jumpers Backplane *pa Screw te&d KXEE&X card

Multi-pin (mass te

Tyqicd com&icm s&emes ........................................................................................................................

Single card system.. Two-c& system..

Tw~mainfrme system

Model 7011 i,,&&hc,n and remow.,

.....................................................................................................................................................

prxa~tion,s

.....................................................................................................................................

..................

.....................................................................................

rmination) connector

...............................................................................................................................

.................................................................................................................................

........................................................................................................................

......................................................................................................... 3-19

card

3-l

3-l 3-l

3-2 3-3 3-4 3-6

3-11

3-14 3-14

4.1 Introduction..

4.2

4.3

4.3.1

4.3.2

4.3.3

4.4

4.4.1

4.4.2

4.4.3

4.5

4.5.1

4.52

4.5.3

4.5.4

4.5.5

4.5.6 AC frequency

Power

limits..

Mainframe control

Channel assignments Front panel control. IEEE-488 bus operation..

Multiplexer switching examples

Resistor Transistor Testing

Measurement considerations

Path isolation.. Magnetic fields Radio frequency interference.. Ground loops Keeping connectors clean

....................................................................................................................................................

testing .........................................................................................................................................

testing

with matrix cards.. ...................................................................................................................

4-1

of multiplexer card..

......................................................................................................

..............................................................................................................................

.................................................................................................................................

.........................................................................................................................

...................................................................................................................

4-l 42 4-4 44 4-5 45

.....................................................................................................................................

4-11

.......................................................................................................................

........................................................................................................................................

.......................................................................................................................................

.............................................................................................................

.........................................................................................................................................

.....................................................................................................................

response..

.......................................................................................................................

4-15 415 4-16 4-16 4-17 4-17 4-17

5.1

5.2

5.3

5.3.1

5.3.2

5.3.3

5.3.4

5.3.5

5.3.6

5.3.7

5.3.8

5.4

5.5

5.5.1

5.5.2

5.5.3

5.5.4

5.5.5

5.6

5.6.1

5.6.2

5.6.3

Introduction Handling and cleaning precautions..

Performance verification

Environmental conditions Recommended equipment Multiplexer card connections Channel resistance tests Offset current tests Contact potential tests

......................................................................................................................................................

............................................................................................................

...............................................................................................................................

......................................................................................................................

.....................................................................................................................

................................................................................................................

..........................................................................................................................

...................................................................................................................................

.............................................................................................................................

Bank and channel-to-channel isolation tests Differential and common-mode isolation tests..

Special handling Principles of operation

Block diagram ID data circuits.. Relay control Relay power Power-on

Troubleshooting

Troubleshooting equipment Troubleshooting access Troubleshooting Procedure

of static-sensitive devices..

..................................................................................................................................

........................................................................................................................................

.....................................................................................................................................

...........................................................................................................................................

control ..............................................................................................................................

safeguard ..............................................................................................................................

.............................................................................................................................................

.................................................................................................................

.........................................................................................................................

..................................................................................................................

.......................................................................................

...............................................................................

..................................................................

.: .........................

5-l 5-l

5-2

5-2 5-2 5-3 5-3

5-5 5-7

5-8 5-12 5-14 5-15 5-15 5-15 5-17 5-17 5-17 5-17 5-17 5-18 5-18

6.1 Introduction

6.2

6.3

6.4

6.5

Parts lists Ordering Factory service..

Component

...........................................................................................................................................................

information..

......................................................................................................................................................

6-l

....................................................................................................................................

................................................................................................................................................

layouts and schematic diagrams..

...........................................................................................

6-1

6-l

6-2

List of Illustrations

Figure 2-l Figure 2-2 Figure 2-3

Figure 24 Figure 2-5 Figure 2-6 Figure 2-8 Figure 2-7 Figure 2-9 Figure 2-10 Figure 2-11 Figure 2-12 Figure 2-13

Figure 31

Figure 32 Figure 33 Figure 34 Figure 35 Figure 36 Figure 37 Figure 38 Figure 39 Figure 310 Figure 311 Figure 312 Figure 313

Figure 314 Figure 315 Figure 316 Figure 317 Figure 318 Figure 319

Model 7011 simplified schematic.. ........................................................................................................ 2-2

Four 1 x 10 multiplexer configuration (jumpers not installed) ........................................................ 2-3

Two 1 x 20 multiplexer configuration (jumpers installed).

One 1 x 40 multiplexer configuration (jumpers installed) ................................................................ 2-4

Model 7001 analog backplane ............................................................................................................... 2-5

Bank connections to backplane ............................................................................................................. 2-6

Differential switching example

Single-ended switching example .......................................................................................................... 2-7

Sensing example.. .................................................................................................................................... 2-8

SMLJ connectiom ..................................................................................................................................... 2-9

Two separate multiplexer systems ..................................................................................................... 2-10

Multiplexer input expansion example ............................................................................................... 2-11

Mixed card type example ..................................................................................................................... 2-12

Bank-to-bank jumper locations

Bank-to-bank jumper terminal identification .....................................................................................

Bank-to-bank jumper installation

Backplane jumpers.. ................................................................................................................................

Model 7011 screw terminal connector card.. .......................................................................................

Typical screw terminal connections .....................................................................................................

Cable clamp for screw terminal connector card .................................................................................

MI&-pin card terminal identification .................................................................................................

Typical round cable connection techniques ........................................................................................

Model 7011~MTR connector pinout.. ..................................................................................................

Model 7011~KIT-R (with/cable) assembly ........................................................................................

Single card system example (multi-pin connector card).

Single card System example (screw terminal connector card)

Tw-d system example (nxxki-pin connector card).

‘&v-d system example (screw terminal connector card)

Two-mainframe system example (multi-pin connector card).

Two-mainframe system example (screw terminal connector card)

Model 7011-C card jn&lk&m in Model 7001 .................................................................................

7011-S card inst&dion in Model 7001.. .............................................................................................

.............................................................................................................

. .........................................................................................................

...

......................................................................................................... 33

...............................................................

................................................................ 312

........................................................ 3-13

...................................................................

.......................................................... 316

....................................................... 317

............................................... 318

2-3

2-7

32 33

34 3-4

3-5

35 37

39 310 310

3-15

3-20 321

Figure 4-I Figure 4-2

Figure 4-3 Figure 4-4

Channel status display Display o*ganization

Model 7011 progr

2-tie resistance testing.. .......................................................................................................................

...........................................................................................................................

for multiplexer channels

amming channel assignments.. ..............................................................................

..................................................................................

4-2 4-3

4-3 4-6

iii

Figure 45 Figure 4-6 Figure 4-7 Figure 48

Figure 49 Figure 4-10 Figure 4-11 Figure 412 Figure 413 Figure 414 Figure 415

Four-wire resistance testing..

Low *&stance testing.. ...........................................................................................................................

Configuration for current gain and common-emitter Typical common-emitte~ characteristics

Conmcting multiplexer and ma&ix cards together

Resktitity test configuration ...............................................................................................................

Measurement required for resistivity test.. ........................................................................................

Path isolation resistance ........................................................................................................................

Voltage attenuation by path isolation resistance.. Power line ground loops

Eliminating ground loops ....................................................................................................................

................................................................................................................. 4-7

test.. ............................................................. 4-10

............................................................................................

411

......................................................................... 4-12

4-13 4-14 4-15

............................................................................ 4-16

......................................................................................................................

4-17 4-17

Figure 5-l Figure 5-2 Figure 5-3

Figure 5-4 Figure 5-5 Figure 56 Figure 5-7 Figure 5-8 Figure 5-9 Figure S-10

Pati *esistance test connections ............................................................................................................

Differadial offset current test connections ..........................................................................................

Contact potential test comwciions ........................................................................................................

Bank i&&ion test connections.. ............................................................................................................

Channel-to-channel isolMio* test connections ..................................................................................

Differential isolation test connections ................................................................................................

Co-on-mode i.solation test connections.. .......................................................................................

Model 7011 block diagram

................................................................................................................... 5-15

SM and stop sequences.. .....................................................................................................................

T-tit and acknowkdge sequence.. ...............................................................................................

5-4 5-6 5-7

5-8 S-10 5-12 5-14

5-16 5-16

List of Tables

Table 3-1 Table 3-2

Table 4-l

Table 5-1 Table 5-2

Table 5-3 Table 5-4 Table 5-5 Table 5-6

Bank-to-bank jumpers (refer to Figure 3-Z)

Mass termination ~ccessori~

Pa&d Cha.r,r,els in 4-p& Operation . . . . . . .._.._...t...................................................................................

verification equipment.. .........................................................................................................................

Bank is&.tic,n test s-q Channel-to-channel isolation test mmmary

Differential and ~~-~~-nd.e &&ion &ding. ............................................................................

&co-end& ~~~bk&xdzing equipment.. Troubleshooting procedux

................................................................................................................

.................................................................................................................

.........................................................................................

.....................................................................................

....................................................................................

3-3 3-6

4-6

5-2 5-9

5-11

5-13

5-17

5-19

v/vi

General Information

1.1

This section contains general information about the Model 7011 Quad 1 x 10 Multiplexer card.

There are two basic versions of this multiplexer card; the Model 7011-S and the Model 7011-C. The Model 7011-S assembly consists of a screw terminal connector card and a relay card. External test circuits are wired directly to the saew terminals of the connector card. Also available from Keithley is the Model 7011-ST. This is an extra screw terminal connector card. With an extra

connector card, you can wire a second test system without disturbing the wiring con@uration of the first test system.

The Model 7011-C assembly consists of a multi-pin

bmss te

Fxtemal test circuit connedions to the multiplexer are

made via the 96-pin male DIN connector on the connector card. Keithley offers a variety of optional accessories that can be used to make conneciiom to the connector card (see paragraph 1.9).

The rest of Setion 1 is arranged in the following manner:

1.2 Features

Introduction

rmination) connector card and the relay card.

1.4

Manual addenda

1.5

Safety symbols and terms

1.6

Specifications

1.7

Unpacking and inspection

1.8

Repacking for shipment

1.9

Optional accessories

1.2 Features

The Model 7011 is a low voltage, two-pole, quad, 1 x 10 multiplexer card. Some of the key features in&de:

Low contact potential and offset current for minimal effects on low-level signals.

The connector board detaches from the relay board

allowing easy access to the saew terminals (Model 7011-S) and jumpers.

Easy jumper cotiguration of one, two, three or four multiplexer banks.

Backplane jumpers. Cutting jumpers disconnects multiplexer bank outputs from the Model 7001 an-

alog backplane.

1.3 warranty information

1-l

1.3

Warranty information

1.6

Specifications

Warranty

information

is Located on the inside front

cover of this instruction manual. Should you Model

7011

require warranty service, contact the Keithley rep-

resentative or authorized repair fxility in your area for

further information. When returning the multiplexer

card for repair, be sure to fill out and include the service form at the back of this manual in order to provide the repair facility with the necessary information.

1.4 Manual addenda

Any improvements or changes concerning the multiplexer card or manual will be explained in an addendum inchxded with the card. Addenda are provided in

a page replacement format. Simply replace the obsolete pages with the new pages.

.S Safety symbols and terms

The following symbols and terms may be found on an

ins!mmwnt or used in this manual.

Model 7011 specifications are found at the front of this manual. These specifications are exclusive of the multiplexer mainframe speci6cation.3.

1.7 Unpacking and inspection

1.7.1 Inspection for damage

The Model 7011 is packaged in a z-sealable, anti-static bag to protect it from damage due to static discharge and from contamination that could degrade its performance. Before removing the card from the bag, observe the following precautions on handling.

Handling Precautions:

1. Always grasp the card by the side edges and shields. Do not touch the board surfaces or components.

When not installed in a Model 7001 mainframe, keep the card in the anti-static bag and store it in the

original packing carton.

The A symbol on an instrument indicates that the user should refer to the operating instmztions located in the insfnxtion manual.

The

symbol on an instrument shows :, nigh voltage may be present on the terminal(s). L* standard safety precautions to avoid personal contact with these voltages.

The WARNING heading used in this manual explains

dangers that might result in personal injury or death. Always read the associated information very carefully before performing the indicated procedure.

The CAUTION heading used in this manual explains hazards that could damage the multiplexer card. Such damage may invalidate the warranty.

After removing the card from its anti-static bag, inspect it for any obvious signs of physical damage. Report any such damage to the shipping agent immediately.

1.7.2 Shipping contents

The following items are included with every Model 7011 order:

Model 7011 Quad 1 x 10 Multiplexer Card

Model 7011 Instruction Manual

Additional accessoties as ordered

1-2

1.7.3 Instruction manual

1.8 Optional accessories

The Model 7011 Instruclion Manual is three-hole driBad so that it can be added to the three-ring binder of the Model 7001 Inshwtion h4anuaI. After removing the plastic wrapping place the manual in the binder following the mainframe instruction manuaL Note that a manual identification tab is included and should pr+ cede the multiplexer card instruction manual.

If an additional instruction manual is required, order the manual package, KeithIey part number 7011-901-

00. The manual package indudes an instruction manuaI and any pertinent addenda.

1.7.4 Repacking for shipment

Should it become necessary to return the Model 7011

for repair, carefully pack the unit in ik original packing carton or the equivalent, and include the following information:

Advise as to the warranty status of the multiplexer card.

The following accessories are available for use with the Model 7011:

Model 70ll-ST - This screw

terminal

connector card is identical to the one provided with the Model 7011-S assembly. An extra screw terminal connector card allows you to wire a second test system without disturbing the wiring coniiguration of the fist connector card.

Model 7011~KIT-R - This connection kit includes a 96-pin female DIN connector that wiU mate directly to the connector on the Model 7011-C or to a standard 9& pin male DIN bulkhead connector (see Model 7011MTR). This connector uses solder cups for connections to external circoi~ It includes an adapter for a round cable and the housing.

Model 7Oll-WC-2 - This 2-meter round cable assembly is terminated with a 96-pin female DIN connector on each end. It wiII mate directly to the connector on the Model 7011-C and to a standard 96-pin male DIN buIIchead connector (see Model 7011~MTR).

Write ATENTION REPAIR DEPARTMENT on the shipping label.

FiII out and include the service form located at the back of this manuaL

Model 7011-m-This 96pin male DIN buIkhead connector uses solder cups for connections to external

circu.i&y. It will mate to the Model 7011~KIT-R connector, and Model 7011~MTC-2 cable assembly.

l-3

Multiplexing Basics

2.1 Introduction

This section covers the basics for multiplex switching and is arranged as follows:

Basic multiplex conBgurations: Covers the basic

2.2 multiplex configurations; quad 1 x 10 con+ration, dual 1 x 20 configuration and single 1 x 40 cotiguration. The significance of the backplane jumpers is also covered here.

2.3

Typical multiplex switching schemes: Explains some of the basic ways a multiplexer cam be used to source or measure. Covers single-ended switching, differential (floating) switching and sensing.

24 System expansion: Discusses the various config-

urations that are possible by using multiple cards.

2.2 Basic multiplexer configurations

A simplified schematic of the Model 7011 multiplexer is shown in Figure 2-l. It is organized as four 1 x 10 multiplexer banks. Each bank has 10 inputs and one output. Two-pole switching is provided for each multiplexer input, with HI and LO switched. Two or more banks can be jumpered together to expand multiplexer inputs, and backplane jumpers provide bank connections to a second card installed in Model 7001 mainframe.

2-l

Figure 2-l Mode/ 707 7 simplified schematic

2.2.1 Multiplexer bank-to-bank jumpers

Jumpers are installed on the connector card to connect multiplexer banks together to form a multiplexer of 1 x

40. Each jum:~ :- set connects two adjacent banks together. These j;-nper sets are included with the Model

7011.

The bank-to-bank jumpers allow you to configure the multiplexer card in a variety of ways. Typical multiplexer coniigwations include:

Four 1 x 10 rxtitiplexers; no jumpers installed (Fig-

ure 2-2).

Backplane Jumpers

(to 7001 Analog

Bank to Bank

Jumpers

Two 1 x 20 multiplexers; Bank A jumpered to Bank

Backplane)

B, Bank C jumpered to Bank D (Figure 2-3).

One 1 x 40 multiplexer; all bank-to-bank jumpers installed (Figure 2-4).

Other combinations are possible, including multiplex-

ers of various sizes (in multiples of 10 channels). For example, you could install jumpers to configure the card as one 1 x 30 and one 1 x 10 multiplexer.

Refer to Section 3 for information on installing bank-tobank jumpers.

2-2

Bank A

10. ,

Bank B

Bank C

Bank D

10, ,

Figure 2-2 Four 1 x 10 multiplexer configuration (jumpers not installed)

‘*

1. .’

‘12

,I i ~~--z+O”,utD

Figure 2-3

Two 7 x 20

1. ,x2

Bank 6

109 ,x2 l

1. ,z2

Bank C

10. :2 l

1. ,*2

Bank D

10. ,*2 l

multiplexer configuration (jumpers installed)

. .

2-3

Bank A

inputs

10 ,’

10. ,

;I- Output A

1. ,*2

Bank B

10. ;2

1. ;2

Bank C

10. ./Z

1. ,,2

Bank D

100 ,‘2

One 1 x 40 multiplexer configuration (jumpers

Jumpers

JUllp~S

installedl

2-4

2.2.2 Backplane jumpers

There are four pairs of backplane jumpers located on the relay card. With the jumpers installed, the banks of

the multiplexer card are connected to the analog backplane of the Model 7001 allowing expansion

with a sec-

ond 7001 card installed in the mainframe. With the jumpers removed (cut), the multiplexer card is isolated from another card installed in the mainframe.

Model 7001

The three-pole analog backplane of the Model 7001 nminframe is shown in Fieure 2-5. Throwh this analog backplane the banks of a kodel7011 muitplexer car& installed in one slot, can be connected to the banks (or rows) of a compatible card installed in the other slot of the mainframe.

r----

I I

I I I

Card 1

----

I I

““IG

Ht L+-----4~L

Analog

Backplane

ROW 1 or Bank A

Row2OrBa”kB I H

L>I

Q-----f

ROW 4 or Bank D

r----

kti

‘<G

I< g

Card 2

_---

I I

I I I

L--------l

Figure 2-5

Model 7001 analog backplane

,?-----f”

H = High

L= LOW

G = Guard

L--------l

ROW = Matrix Card (7012) ea"!i = MUX Card (7011)

2-s

Figure 2-6 shows how each bank of the Model 7011 is connected to the backplane. Notice that since the Mod-

el 7011 is a twopole card, there is no connection made to the Guard terminal of the backplane. The Model 7011 is shipped from the factory with the backplane jumpers installed.

Removing (cutting) the backplane jumpers isolates the card from the backplane, and subsequently, any card installed in the other slot. For information on removing the @mpers, refer to section 3.

NOTE

The Model 7001 does not provide an analog backplane for the non-701X series cards. As a result, any of these cads installed in one slot in the mainframe is electrically isolated from any card installed in the other slot. The only way to connect a Model 7011 to one of these cards is to wire them together.

7011 Bank Analog

(1 Of 4)

H\> H L>

H = High L=Lcw G = Guard

Figure 2-6 Bank connections to backplane

Backplane Jumpers

Backplane

7001

< <

2.3 Typical multiplexer switching schemes

The following paragraphs describe some basic switching schemes that are possible with a two-pole switching multiplexer. These switching schemes include some various shielding configurations to help mini-

mize noise pick up in sensitive measurement applications. These shields are shown connected to chassis ground. For some test

prove to be more effective connected to circuit common. Chassis ground is accessible at the rear panel of the Model 7001.

configurations,

shielding may

2-6

2.3.1 Single-ended switching

2.3.2 Differential switching

In the single-ended switching configuration, the source or measure instrument is connected to the DLJT through a single pathway as shown in Figure 2-7. The insinJml?nt is connectd to the output of one of the banks and the DUT is shown connect4 to one of the inputs for that bank.

The differential or floating switching configl.lration is shown in Figure 2-8. The advantage of using this configuration is that the terminals of the scarce or measure instrument are not confined to the same pathway. Each terminal of the instrument can be switched to any available input in the test system.

Figure 2-7 Sing/e-ended switching example

Figure 2-8

Differential switching example

Input l-10

2-7

2.3.3 Sensing .

Figure 2-9 shows how the multiplexer card can be con-

figured to use instruments that have sensing capability. The main advantage of using sensing is to cancel the effacts of switch card path resistance (43) and the resis-

tame of external cabling. Whenever path resistance is a

consideration, sensing should be used.

2.3.4 SMU connections

Figure 2-10 shows how to connect a Keithley Model

236,237 or 238

Source Measure Unit

the multiplexer card. By wing lkxx cables that are unterminated at one end, the driven guard and chassis ground are physically extended all the way to the card.

Figure 2-9

Sensing example

Bank C, D

Input l-10

2-8

7011

Lb-

Input l-10

Figure 2- 10 SMU connections

Output LO TriaX

iIT-

WARNING

: Hazardous v&ages may be present on

GUARD. Make sure all cable shields are

GUARD. Make sure all cable shields are properly insulated before applying power.

properly insulated before applying power.

Cables (3)

2-9

2.4 Multiplexer expansion

With the use of additional

switching

cards and mainframes, larger systems can be configured. Each Model 7001 Switch System mainframe will accommodate up to two cards, and up to six mainframes can be connect-

ed together. Thus, a switch system using as many as 12

cards can be configured.

2.4.1 Two-card switching systems

Each Model 7001 Switch System mainframe can accommodate two cards to allow the following switching

configurations.

Separate switching systems

Two singie-card systems can be configured by remov-

ing the backplane jumpers from one of the cards. The

two cards will be controlled by the same mainframe, but they will be electrically isolated from each other. Figure 2-11 shows an example using two Model 7011 niultiplexer cards.

Multiplexer input expansion You can double the number of multiplexer inputs by

simply installing two “as shipped” Model 7011s in the Model 7001 mainframe. By leaving the backplane jumpers installed, the banks of the multiplexer card installed in slot 1 (CARD 1) are automatically connected to the banks of the multiplexer card installed in slot 2 (CARD 2) through the analog backplane.

Figure 2-12 shows an example of input expansion. Each Model 7011 card is configured as four 1 x 10 multiplexers. By connecting the banks together (via Model 7001 analog backplane), the resultant multiplexer systern has 20 inputs for each of the four banks. Notice

that if all the bank-to-bank jumpers (for both cards)

were installed, the result would be a single 1 x 80 mul-

tiplexer.

Card 1

r----

h”kB -

Bankc -

i smI-------------

Figure Z- 11

Two separate multiplexer systems

----------

Four 1x10 Muniplexers

7011

7031 Analog

&.CkplCl”e

/ r---------I-~

L-----------A

Four 1x10 Multiplexers

Card 2

2-l 0

r-------

Card 1

7011

-----,

7Wl Analog

BX.kph”e

Card 2

-----

-------- ----Quad 1x10 Multiplexers

Quad 1 x20 Multiplexer

Figure 2- 12

Mdripkxer input expansion exampk

Mixing card types Different types of cards can be used together to create

some unique switching systems. For example, you could have a Model 7011 multiplexer card installed in one slot and a Model 7012 matrix card installed in the other slot.

Figure 2-13 shows a possible switching system using a matrix card and a multiplexer card. The backplane jumpers for both the matrix and multiplexer cards must be installed. This allows matrix rows to be conneded to multiplexer banks. On the multiplexer card,

the bank-to-bank jumpers must be removed to main-

_-----_---

Quad 1x10 Multiplexers

tain isolation between matrix rows. See the instmction

manual for the Model 7012 for complete information

on the mati card.

2.4.2 Mainframe multiplexer expansion

Multiplexer systems using up to 12 multiplexer cards are possible by using six Model 7001 mainframes together. Each Model 7011 added to the system provides 40 additional inputs. Paragraph 3.4.3 explains how to

connect a test system using two mainframes.

2-1 ,l

r---- -------

---..--------__

Figure 2- 73

Mixed card type example

Card 1

7012

r------------

Card 2

701

------_-__

4xlOMatrix Quad 1 x 10 MUX

Bank A

Bank C

Bank D

---

2-12

Card Connections & Installation

3.1

The information in this section is arranged as follows:

3.2

3.3

introduction

WARNING

The procedures in this section are intended only for qualified service per-

sonnel. Do not perform these

procedures unless qualified to do so. Failure to recognize and observe “ormal safety precautions could result

in personal injury or death.

Handling precautions: Explains precautions that must be followed to prevent contamination to the multiplexer card assembly. Contamination could degrade the performance of the multiplexer card.

Conmxtions: Covers the basics for connecting

extecd circuitry to the two available connector cards for the multiplexer; the screw terminal connector card and the multi-pin connector card.

3.2 Handling precautions

To maintain high impedance isolation, care should be taken when handling the relay card to avoid contamination from such foreign materials as body oils. Such contamination can substantially lower leakage resistances, thus degrading performance.

To avoid possible contamination, always grasp the relay and connector cards by the side edges or shields. Do not touch the board surfaces or components. On connectors, do not touch areas adjacent to the electrical contacts. Dirt build-up over a period of time is another possible source of contamination. To avoid this problem, operate the mainframe and multiplexer card in a

clean environment.

If a card becomes contaminated, it should be thoroughly cleaned as explained in paragraph 5.2.

Typical connection schemes: Provides some typ-

3.4

ical connection schemes for single card, two-card

and two-mainframe system configurations.

Model 7Oll ixkallation: Provides a procedure to

3.5

install the multiplexer card assembly in the

Model 7001 mainframe.

3.3 Connections

This paragraph provides the basic information needed

to connect your external teSt circuitry to the multiplexer. It includes the installation of the bank-to-bank jumpers on the connector card, insta.Ilation/removal of backplane jumpers on the relay card, and detailed in-

3-1

fcmnaiion on making external connections tcl the two available connector cards.

WARNING

The following connection infolmation is intended to be used by qualified service personnel. Failure to recognize and observe standard safety precautions could result in personal injmy or death.

:~ 3.3.1 Bank-to-bank jumpers

As explained in paragraph 22.1, the banks of the mul-

tiplexer card can be connected together (using plug-in

jumpers) to form larger mukiplexers. The locations of

the bank-to-bank jumper terminals for both connector

cards are

shown in

Figure 3-l.

A. Screw Terminal Connector

Card

Figure 3- 1 Bank-to-bank jumper locations

3-2

6. Multi-pin Connector Card

Terminal identification is provided by Figure 32. On the drawing, the six terminal pairs are labeled WlOO through W105. The top three terminal pairs (WlOl, W103 and W105) are used to connect the LO terminals of the banks together. The bottom terminal pairs

(WlOO, WI02 and W104) are used to connect the HI terminals of the banks together. Table 3-1 summarizes the effects of each jumper.

Jumper

u--

I I

Jumper Terminal

Lt-

Pair

Bank

AtoB

IFzl

L-A

WlOl

l-S-3

xitir

Figure 3-2 Bank-to-bank jumper terminal identification

Table 3-7

Bank-to-bank jumpers (refer to Figure 3-Z)

,nstalled jumper Effect

WlOl Connect Bank A LO to Bank B LO WlOO

w103

w102

ConnectBankAHItoBankBHI Connect Bank B LO to Bank C LO

ConmxtBmkBHItoBankCHl

Bank

BtoC

h-3

L-2

w103

rr-Tl m6F

Bank

ctocJ

E--G-l

L-4

w105

r&--a

L-d

WI04

Figure 3-3 Bank-to-bank jumper installation

3.3.2 Backplane jumpers

The Model 7001 mainframe has an analog backplane that allows the banks of a Model 7011 multiplexer to be internally connected to a compatible stalled in the other slot (see paragraph 2.4.1 for details).

The backplane jumpers for the multiplexer card assembly are located on the relay card as shown in Figure 3-4. The card is shipped from the factory with

the jumpers installed.

Jumper removal Perform the following steps to remove backplane

jumpers:

switching

card in-

w105 Connect Bank C LO to Bank D LO w104 ConnectBankCHItoBankDHl

Referring to Figure 3-l for jumper locations, perform the following steps to install bank-to-bank jumpers:

1. If mated together, separate the relay card from the comector card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.

2. Refer to Figure 32 and Table 31 to determine which jumpers to install.

Using Figure 3-3 as a guide, install the jumpers on the appropriate terminal pairs.

1. If mated together, separate the relay card from the connector card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.

2. Use Figure 3-4 to locate the jumper(s) that are to be removed.

3. It is not necessary to physically remove the jumpers from the PC board. Using a pair of wire cutters, cut one lead of each jumper.

3-3

Card Connections & Installation

:umper installation

Referring to Figure 3-4 for jumper locations, perform the following steps to install backplane TOW jumpers:

Physically remove a cut jumper by unsoldering it from the PC board.

Install a new #22 AWG jumper wire o(eithley P/N J-15) and solder it to the PC board.

Remove the solder flux from the PC board The cleaning pmcedure is explained in paragraph 5.2.

a..

. . .

:::

. . .

.,*

. . .

Figure 34 Backplane jumpers

7011 Relay

Card

3.3.3 Screw terminal connector card

The screw terminal connector card is shown in Figure

3-5.

Connections are made directly to the screw terminals of the twelve terminal blocks. Each screw terminal will accommodate #X-22 AWG wire.

3-4

Figure 3-5 Mode/ 7077 screw terminal connector card

Wiring procedure Perform the following procedure to wire circuitry to

the screw terminal connector card:

WARNING

Make sure all power is off and any stored energy in external circuitry is discharged.

Jf mated together, separate the connector card from the relay card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.

Using an insulated screwdriver, connect the circuitry to the appropriate terminals. Figure 3-6 shows how the output of Bank A would be connected to a DMM.

Referring to Figure 3-7, remove the top half of the cable clamp as follows:

A. Loosen the cable clamp screw enough to disen-

gage it from the bottom half of the cable clamp.

B. Using your thumb and forefinger, press the re-

taining clips inward and, with your other hand, remove the top half of the clamp.

Route wires under wire guide/connector shim.

Route the wires through the bottom half of the ca-

ble clamp.

Replace the top half of the clamp. It simply snaps onto the bottom half of the clamp. lighten the ca-

ble clamp screw. The clamp serves as a strain relief

for terminal block wires.

Mate the connector card to the relay card. The Model 7011 is now ready to be installed in the Model 7001 mainframe. See paragraph 3.5 for details.

Figure 3-6

Typical screw

’

Figure 3-7

Cable clamp for screw terminal

terminal connections

Clips \

connector

card

3-5

3.3.4 Multi-pin (mass termination) connector card

Since comections to external circuiq are made at the 96-pin male DIN bulkhead connector, there is no need to separate the connector card from the relay card. If the connector card is separated from the relay card, carefully mate them together and install tlw supplied

440 mounting screw. Make sure to handle the cards by

the edges and shields to avoid contamination.

Terminal identification for the DIN connedor of the

multi-pin connector card is provided by Figure 3-8.

This connector will mate to a 96-pin female DIN con-

nector.

Keithley has a variety of cable and connector accessories available to accommodate connections from the

connector card to test instrumentation and DUT (devices under test). In general, these accessories, which are summarized in Table 3-2, utilize a round cable assembly for connections.

Table 3-2

Mass termination accessories

Model 7011-m-R

7011~ME-2

7011~MTR

Description 96pin female DIN connector and

housing for round cable. Two-meter round cable assembly

terminated with a 96-pin female DIN comwctor on each end.

96-pin male DIN bulkhead connector.

3-6

Pins of the Model 7011-C mass termination connector can be identiiied in one of three ways:

1. Mux terminal, consisting of banks A-D and inputs l-10.

2. Connector description. consisting of rows a-c and columns l-32.

3. Schematic and component layout designation (l-96).

The following pinout diagrams show the correspondence between these arrangements:

3231302928273~*25*423~221*0191~1716151413121110 9 8 7 6 5 4 3 2 1

l . . . . . . ..*.....*....*...........

Card Connections & hstahtion

View from

side

of connector

3-7

Card Connections & /nm//arion

Typical connection techniques All external circuitry, such as instrumentation and

DLJTs, that you wish to connect to the multiplexer card must be terminated with a single 9&pin female DIN coMecror. The following coxlnection techniques provide some guidelines and suggestions for wiring your circui&y.

WARNING

Before beginning any wiring proce-

dures, make sure all power is off and any stored energy in external circuitry is discharged.

NOTE

External circuitry should be connected

,7ed id only wirh the 7001’s

after the Model 7011 assembly is

pow-

in:;slled in the Model 7001 mainframe. Installation is covered in paragraph 3.5.

Output relays- The multi-pin connector card uses a relay for each of the four output banks. These output relays are normally open to prevent any hazardous voltages (via the mainframe backplane) from appearing cm the pins of the rw.le DIN connector. The output relays will only close when the Model 7011~MTC-2 ca-

ble assembly is connected to card. If building you own

cable assembly, you must make sure that it shorts pins

la to lb of the card ccmnector (Figure 3-8) when it is mated to the card. Shorting pins la to lb allows the output relays to close.

Round cable assemblies -Figure 3-9 shows typical round cable connection techniques using accessories

available from Keithley.

In Figure 3-9A,

connections

are accomplished using a Model 7011 h4TC-2 cable and a Model 7011~MTR bulkhead connector. The two-meter round cable is terminated with a 96-pin female DIN connector at each end. This cable mates directly to the multi-pin connector card and to the bulkhead connector. The bulkhead connector has solder cups to allow direct connection ia instrumentation and DUT. Figure 3-10 provider rhe pinout for the bulkhead connector.

In Figure 3-9B, connections are accomplished using a Model 7011 MTC-2 cable assembly that is cut in half. The 96-pin female DIN connector on one end of the cable mates directly to the multi-pin connector card. The unterminated end of the cable is wired directly to instrumentation and DUT. The other half of the cable assembly could be used for a second switching card.

In Figure 3-9C, connections are accomplished using a custom-built cable assembly that consists of a Model 7011~KlT-R connector and a suitable round cable. Hitachi cable part number N28!?‘-P/D-50TAB is a 5O-conductor cable. Two of these cz~les can be used to supply 100 conductors.The connector has solder cups to accommodate the individual wires of the unterminated cable. Figure 3-11 provides an exploded view of the connector assembly and shows how the cable is connected. The connector end of the resultant cable assem-

bly mates directly to the multi-pin connector card. The

unterminated end of the cable assembly is wired di-

rl?crly to inshumen tation and DIJT.

3-8

Figure 3-9

Typical round cable connection

techniques

3-9

Note : See Figure 3-6 for terminal

identification.

Figure 3- 10 Model 7011 -MTR connector pinout

View from solder cup side of

connector

Figure 3- 11 Model 707 I-KIT-R (with/cable) assembly

3-10

3.4 Typical connection schemes

The following information provides some typical connection schemes for single card, two-card and twomainframe system schemes for the multi-pin connector card use some of the techniques presented in paragraph 3.3.2. Keep in mind that these are only examples to demonstrate various ways to wire a test system. Connection details for both connector cards (multi-pin and screw terminal connector cards) are provided in paragraph 3.3.

3.4.1 Single card system

configurations. connection

using the Model 7011~h4TC-2 round cable assembly. This cable mates directly to both the external bulkhead connector and the Model 7011-C multiplexer card assembly. Notice that the bulkhead connector is shown mounted to a fixture to help keep the cabling stable during the test.

The single card system in Figure S13 is identical to the system in the previous illustration, except for the connection scheme. The system in Figure 3-13 uses the screw terminal connector card. With this card, single conductor connectional are made directly from the terminal blocks of the connector card to instrumentation and DLlTs.

Figure 3-12 shows how external connections can be made to a single card system that uses the multi-pin comvxtor card. This single card system is configured as two 1 x 20 mtitiplexers. To accomplish this, the appropriate bank-to-bank jumpers must be installed to connect Banks A and B together and Banks C and D tw gether.

Instrumentation and DUTs are hard-wired to the Mod-

el 7011~MTR male bulkhead comwctor. ‘Ibis connector has solder cups that will accept wire size up to #24 AWG. The test system is connected to the multiplexer

When using a single card system, you will want to

make sure that the card remains elwtrically isolated from any other switching cards. There are several ways to ensure isolation for a single card in the Model 7001 mainframe:

1. Vacate the other mainframe slot. If there is a Model

701X

card installed in the other slot, remove it.

2. Remove the backplane jumpers on the multiplexer card. This will disconnect the card from the analog backplane of the mainframe.

Remove the backplane jumpers from the switching card installed in the other slot.

3-11

Figure 3- 12

Single cardsystem example (multi-pin connector card)

3-l 2

mdB _

Card Connections & Insrallation

--...- -

Simplified Equivalent Circuit

2nd D

(Dual 1x20)

DUT Test Fixture I

Notes: Bank-to-bank jumpers installed

Figure 3-13 single card system example (screw terminal connector card)

3-13

3.4.2 Two-card system

Both Figure 314 and Figure 315 show a system using two multiplexer cards installed in one Model 7001 mainframe to configure a single 1 x 80 multiplexer systen Each card is conf?gured as a single 1 x 40 multiplexer. To accomplish this, all bank-to-bank jumpers

(both cards) are installed to connect Banks A, B, C, and D together. By leaving the backplane jumpers of both cards installed, the banks of Card 1 are connected to the banks of Card 2 through the analog backplane of the Model 7001 mainframe resulting in the 1 x SO con@ration.

Figure 314 shows how external connections can be made for the multi-pin connector cards. In this example, a single Model 7011-h4TC-2 round cable assembly is cot in half to provide two cables, each of which is on-

terminated at one end. The unterminated ends of the

two cables are hard-wired to the instrument and DLJT

as shown in the &awing. The other ends of these cables

mate directly to the Model 7011-C multiplexer card as-

semblies.

Figure 315 shows how external connections can be

made for the screw terminal connector card. Single

conductor conneclions are made directlv from the

saew terminals of the connector card to the~%Inzrnent

and DUT.

3.4.3 Two-mainframe system

system. Each card is con6gured as a single 1 x 40 mul-

:I, .gplexer. To accomplish this, bank-to-bank jumpers of

fall three cards must be installed to connect Banks A, B,

L’ C, and D together.

By leaving the bac!+me jumpers of the cards in mainfmme #l installed, the banks of Card 1 are connected to the banks of Card 2 through the analog backplane of the Model 7001 mainframe resulting in a 1 x 80 configuration. External bank connections from the instrument to the card in the second mainframe connect the

banks of all three cards together to form the 1 x 120

multiplexer system. This system is similar to the TWW card System (see previous paragraph) except that a third multiplexer card (installed in a second mainframe) is added.

Figure 316 shows the connection scheme for the multipin connector cards. External circuit connections to the Model

7001

mainframe

are identical to the ones

used for the Two-card System. The third multiplexer

card (installed in Model 7001 #2 mainframe) shows

how a custom-built cable can be used to make

connec-

tions to external circuiq. A suitable round cable can be

constructed using a 96-pin female DIN connector (Model 7011~KIT-R) with two lengths of Hitachi cable P/N N28Ll7-P/D5OTAB. This cable contains 50 conductors; two lengths provide 100 conductors. This cable will mate to the Model 7011-C multiplexer card assembly. The unterminated end of the cable is connected directly to the inaument and DUT. Notice that the bank conneciions for the third multiplexer card are made at the inskumenis.

Both Figure 316 and Figure 317 show a system using three multiplexer cards installed in two Model 7001 mainframes to contigure a single 1 x 120 multiplexer

3-14

Figure 317 shows connections for the screw terminal

connector card. Single conductor connections are made directly from the screw termimds of the connector card to the instrument and DUT.

Figure 3-14 TWO-card system example (multi-pin connector card)

DUT Test Fixture

3-15

DUTTest Fixture

Simplified Equivalent Circuit

Figure 3-75 Two-card system example (screw terminal connector card)

3-16

Card Connections & installation

DUT Test Fixture

,O,l-K”-R

40 41

DUT Test Fixture

Figure 3- 16

Two-mainhme

system example

Simplified Equivalent Circuit

(multi-pin connector card)

3-17

Simplified Equivalent Circuit

Figure 3- 17

Two-mainframe system example (screw terminal connectOr card)

3-l 8

3.5 Model 7011 installation and removal

This paragraph explains how to install and remove the

Model 7011 multiplexer card assembly froti tlw Model 7001 mainframe.

WARNING

Turn off power from all instmmentation (including the Model 7001 main-

frame) and disconnect their line

cords. Make sure all power is removed and any stored energy in external circuitry is discharged.

WARNING

Instdlation or removal of the Model 7Oll is to be performed by qualified service personnel. Failure to recognize and observe standard safety precautions could result in personal injury or death.

NOTE

If using the screw terminal connector card, make sure your external circuitxy is wired to the card (as explained in paragraph 3.3.1) before installing the card assembly in the Model 7001 mainframe.

CAUTION

To prevent contamination to the multiplexer card that could degrade performance, only handle the card assembly by the edges and shields.

1. Mate the connector card to the relay card if they are separated. IInstall the supplied 4-40 screw at the end

of the card to secure the assembly. Make sure to handle the cards by the edges and shields to prevent contamination.

2. Facing the rear panel of the Model 7001, select the slot (CARD 1 or CARD 2) that you wish to install the card in.

3. Referring to Figure 3-18 for Model 7011-C installation, or Figure 3-19 for Model 7011-S installation, feed the multiplexer card assembly into the desired slot such that the edges of the relay card ride in the rails.

4. With the ejector -in the unlocked position, puSh the card assembly all the way into the mainframe until the - engage into the ejector cups. Then push both arms inward to lock the card into the mainframe.

5. For the 7011-C, also install the screw shown in Figure 3-18.

Multiplexer card removal

Multiplexer card installation Perform the following steps to install the multiplexer

card assembly in the Model 7001 mainframe:

To remove the muXiplexer card assembly, first unlock it by pulling the latches outward, then pull the card assembly out of the mainframe. Remember to handle the card assembly by the edges and shields to avoid contamination that could degrade performance.

3-l 9

3-18 7011-C card installation in Model 7001

Ejector Arms (2)

3-20

Figure 3- 19 7011~scardinstallation in Model700]

3-21

Operation

4.1

The information in this section is formatted as follows:

4.2

4.3

4.4

4.5

Introduction

Power limits: Summarizes the maximum power limits of the Model 7011 multiplexer card assem-

bly.

Mainframe control of multiplexer card: Summarizes prognmming steps to control the multi-

plexer card from the Model 7001 Switch System

mainframe. Multiplexer switching examples: Provides some

typical applications for using the Model 7011. Measurement considerations: Reviews a mm-

ber of considerations when using the Model 7011 to make measurements.

4.2 Power limits

CAUTfON

To prevent damage to the card, do not exceed the maximum signal level specifications of the card.

Maximum signal levels

To prevent overheating or damage to the relays, never exceed the following maximum signal levels:

IlOV between any two pins (temiII&), 1A switched, 30VA (resistive load).

125V rms or 175V AC peak be-

tween any two pins (terminals), 1A

switched, 60VA (resistive load)

4.3

DC signals:

AC signals:

Mainframe control of multiplexer card

The following information pertains to the Model 7011 multiplexer card. It assumes that you are familiar with the operation of the Model 7001 mainframe.

If you are not familiar with the operation of the mainframe, it is recommended that you proceed to Getting Started (Section 3) of the Model 7001 Instruction Manual after reading the following infomu.tion.

4-1

4.3.1 Channel assignments

The Model 7001 has a cbamel status display (Figure 4

1) that provides the real-time state of each available

channel. The left portion of the display is for slot 1

(Card I), and the ri&t portion is for slot 2 (Card 2).

Multiplexer organization of the channel status display for each slot is shown in Figure 4-2. The card contains 40 channels and is made up of four banks (Bank A, B, C, and D) of 10 multiplexer inputs as shown in the il1UStiatiOII.

To control the multiplexer (mux) card from the mainframe, each multiplexer input must have a unique

7001 Display

CHANNEL assignment which includes the slot numher that the card is installed in. The CHANNE

L assign-

ments for the multiplexer card are provided in Figure

4-3.

Each CHANNEL assignment is made up of the slot designator (1 or 2.) and the multiplexer channel. To be consistent with Model 7001 operation, the slot designa-

tor and nwx input are separated by exclamation points (!). Some examples of CHANNEL assignments are as

follows: CHANNEL l!l = Slot 1, Cbamel 1 (Input 1 of Bank A)

CHANNEL 1!40 = Slot 1, Channel 40 (Input 10 of Bank D) CHANNEL 2!23 = Slot 2, Channel 23 (Input 3 of Bank C) CHANNEL 2!36 = Slot 2, Input 36 (Lnput 6 of Bank D)

CARD 1

CARD 2

4-2

Display organization for multiplexer channels

Operation

A. Slot 1 (Card 1) 1

B. Slot 2 (Card 2) 1

Examples

: 1!18 =

Slot 1, Channel 18 (Input 8, Bank B)

2!36 = Slot 2.

Figure 4-3 Model 7011 programming channel assignments

Channel 38

&xut 6. Bank Db

4-3

4.3.2 Front panel control

Closing and opening channels A multiplexer channel is closed from the front panel by

simply keying in the CHANNE L assignment and pressing CLOSE. For example, to close channel 36 (Input 6 ,ef Bank D) of a multiplexer card installed in slot 2, key in the following channel list and press CLOSE:

SELECT CHANNELS 2!36

The above closed channel can be opened by pressing OPEN or OPEN ALL. The OPEN key opens only the channels specified in the channel list, and OPEN ALL opens all channels.

The following display is an example of a channel list that consists of several channels:

A manual scan can be performed by using the RESET default conditions of the Model 7001. RESET is selected from the SAVESETUP menu of the main MENU. When

,,#,&%T is performed, the mainframe is configured for

:%-ii inbite number of manual scans. The first press of

STEP takes the mainframe out of the idle state. The next press of SlXP will close the first cbamel specified in the scan list. Each subsequent press of STEP will select the next channel in the scan list.

4.3.3 IEEE-488 bus operation

Bus operation is demonstrated using HP BASIC 4.0. The prclgr

amming statements assume that the primary

address of the mainframe is 07.

Closing and opening channels

SELECT CHANNELS 2!1,2!3,2!22-2!25

Notice that channel entries are separated by convnas

6). A com~,a is inserted by pwsing JZNTER or the right

cursor key D ). The channel range is qxcified by using

the hyphen (-) key I separate the range limits. Press-

ing CLOSE will cl@> r all the channels specified in the

&me’i

list. Pressing OPEN (or OPEN ALL) will open

the channels.

Scanning channels

Multiplexer channels are scanned by matig a scan

list and con+ring the Model 7001 to perform a scan. The scan list is created in the same manner as a channel list (see Closing and opening Channels). However, the San list is specim l%n the %Kx.N CHANNEL” display mode. )The SCAN LIST key toggles between the channel list and the scan list.) The following shows an

example of a scan list

SCAN CHANNELS 2!1,2!3,2!21-2!25

The following SCI’I commands are used to close and open channels:

:CLOSe <lisfi

:Ol’EN <list> I ALL

ne folkming statement closes channels 1!1, and 1!3 through 1!11:

OlJ-mJT 707; “:dos (@ 1!1,1!3:1!11)”

Notice that the colon (:) is used to separate the range hits.

Eiti of the following statement5 will open channels l!?. .d 1!3 throl.@ l!ll:

0uTMlT 707; “mpen (@ l!l, 1!3:1!11)”

OUTPUT 707; “:opf?n alY

Scanning channels

When a scan is performed, the &am& specified in the scan list will be scanned in the order that they are presented in the scan list.

4-4

There are many commands associated with scanning. However, it is possible to configure a scan using as llttie as four corNnan

ds. These commands are listed as

follows:

%ST :TRIGger:SEQuence:COLNt:ALITo ON” :ROUTe:SCAN clistz :DJIl-

Line5 opensallchanneL5.

Line25 Sets a l/4 second delay after each channel

closes.

The first command resets the mainframe to a default scan configuration. The second command automatically sets the channel count to the number of channels in the Scan List, the third command defines the Scan List and the fourth command takes the Model 7001 out of the idle state.

The following program will perform a single scan

through all 40 channels of a multiplexer card installed

in slot 1:

10 ouTI?uT 707; “%w’

20 OUTPUT 707; 30 OUTPUT 707;“:scan (@1!1:1!40)”

40 0uTMlT707;“:ini~

END

“:&ig:seqxoun:aufo on-

Line 10 Selects a default conQuration for the scan. Lie 20 Set.5 ckannd count to the scan-list-length.

Line30 Definesthescml.ist.

Line 40 Take the Model 7001 out of the idle state. The

scan is coniigmd to start as soon as this command is executed.

When the above program is run, the scan will be completed in approximately 240 milliseconds (3msec delay

for each relay close and a 3msec delay for each open),

which is too fast to view from the front panel. An addi-

tional relay delay can be added to the program to slow down the scan for viewing. The program is modified

by adding line 25 to slow down the scan. Also, Line 5 is

added to the beginning of the program to ensure that all channels are open before the scan is started.

4.4 Multiplexer switching examples

This paragraph presents some typical applications for the Model 7011. These include resistor testing, transistor testing, and resistivity testing, which shows how to use the Model 7011 with a matrix card (Model 7012).

4.4.1 Resistor testing

The Model 7011 can be used to test a large number of resistors using only one test instnunent or group of instruments. Such tests include two-wire and four-wire resistance measurements using a DMM, and low-resistance measurements using a current source and sensitive digital voltmeter, as discussed in the following paragraphs.

Two-wire resistance tests Figure 4-1 shows a typical test setup for making two-

wire resistance measurements. The Model 7011 card provides the switching function, while the resistance mea.sUTements are made by a Model 199 DMM. Since

only two-pole switching is required for this application, one Model 7011 card can be used to switch up to 40 resistors (additional multiplexer banks can be added, if desired, by adding more cards).

Accuracy of measurements can be optimized by mini-

mizing sway resistance.

5 OUTPW 707;

0IJTmT707;“*RsY 20 OUTPUT 707; 25 OUTPU’I 707; 30 0uTruT707;“:scan (@ 1!1:1!40)” 40 0InPuT707; “:W 50 END

“:open alY “:trig:seq:coun:auto on”

“:trigzdelO.Z5”

Make connecting wires as short as possible to minimize path resistance. Another technique is to short one of the multiplexer inputs, close the shorted channel and then enable the DMM zero feature to cancel path resistance. Leave zero enabled for the entire test.

4-5

I I I I I I

A. Test Configuration

I I I

L---J L----l

199 DMM

8. Simplified Equivalent Circuit

Figure 4-4

Z-wire resistance testing

Four-wire resistc tests

More precise measurements over a wider range of sys-

tem and DIJT conditions can be obtained by using the four-wire measurement scheme shown in Figure 45.

Here, separate sense leads from the Model 196 DMM

are routed through the multiplexer to the resistor un-

der test. The extra set of sense leads minimizes the ef-

fects of voltage drops amoss the test leads. Note, however, that an extra two poles of switching are required for each resistors per card can be tested using this configura-

tiOIL

The Model 7011 can be configured for 20 channels of 4 pole operation by isolating Banks A and B from Banks C and D, and by programming the Model 7001 mainframe for 4pole mode. The resulting pa&d channels are shown in Table 4-1.

resiStor tested.

I I

7011

L---l

Dlrr

For this reason, only 20

Table 4-1

Paired

Channels in &pole Operation

7001

CHANNEL p&ill CONlWtiOXl assignment 4-p&

1 land21 BankA,Inl and

9 9and29 BankA,ln- znd

10 10 and 30 BankA,InlOand

11 11 and 31 BankB,Inl and

12 12 and 32 BankB,InZand

13 13and33 BankB,In3and

16 ~‘. 5 and 36 BankB,ln6and

Channel

designations

BankC,Inl

2and22 BmkA,LnZand

BankC,In2

3and23 Bank A, In 3 and

BankC,In3

4and24 BmkA,In4and

BankC,In4

5and25 BankA,In5and

BankC,In5

6and26 BmkA,In6and

BankC,Ino

7and27 BankA,ln7and

BankC,In7

8and28 BankA,InSand

BankC,In8

BankC,In

BankC,lnlO

BankD,Inl

Ban!cD,InZ

BankD,In3

14and34 BankB,In4and

BmlcD,In4

and 35 BankB,In5and

BankD,Ln5

BankD,In6

17and37 BankB,In7and

BankD,In’/

18 and 35 BankB,InSand

BankD,In8

19 and 39 BankB,Ingand

BankD,In9

2Oand40 BankB,InlOand

BankD,InlO

4-6

Bank jumper removal is described in paragraph 3.3.1. To configure the connector card for 4-p& operation,

only mncwe the jumpers between Banks C and D

i.WlO2

and W103).

Selecting 4-p& operation for a Model 7001 card slot is

discussed in Section 4 of the Model 7001 Instruction

Manual. After the Ppole mode is selected, the Model

7001

mainframe will display just 20 channels for the chosen card slot. Each closed channel will also dose its paired channel on the card.

Although the four-wire connection scheme minimizes

problems caused by voltage drops, there is one other potentially txublesome area associated with low r&stance measurements: thermal EM% caused by the relay contacts. In order to compensate for thermal EMFs, the offset-compensated ohms feature of the Model 196 DMM should be used. To we this feature, short the HI and LO terminals of one of the bank inputs, then close the relay. Enable zero on the Model 196, then select off-

set-compensated ohms.

A. Test Configmtian

r---i

removed

r---1

L---J L---J

196 DMM

B. aimpmed Eq”ivalent circuit

Figure 4ii

Four-wire resistance testing

7011

L---J

DLn

4-7

Low-level resistance measurements Many times, it is necessary to make resistance mea-

surements with either lower voltage sensitivity or higher currents than are available with ordinary DMMs. Examples of cases where low-level resistance measurements may be necessary include the testing of PC board traces, contacts, bus bars, and low resistance shunts.

Figure 44 shows a typical test con6guation for a

switching system capable of testing a number of low resistance devices. The Model 220 Current Source forces current through the device under test, while the

Model 182 Sensitive Digital Voltmeter measures there-

suliing voltage across the device.

Since low voltage levels are being measured, thermal F.MF offsets generated by relay and connector contacts

will have a detrimental effect on measurement accwa-

cy unless steps are taken to avoid them (the Model 7011 has been designed to keep relay EMF at a minimal lev-

el.). Thermal FMF effects can be virtually eliminated by taking two voltage measurements, E, and E,, the first with the current, I, flowing in one direction, and the second with a current, I, of the same magnitude flowing in the opposite direction. The resistance can then be calculated as follows:

Note that simply reversing the current source polarity

will result in a 2X accuracy specification change. To

avoid this problem, matrix switching could be added to the test system to reverse the current. See paragraph

4.4.3.

Figure 4-6 Low resistance testing

4-8

L-l

L---J

Dud 1%?B MUX

r---1

I a:G I

L:-:J

r-.--

I I

L-1-J

4.4.2 Transistor testing

Typical transistor tests that can be performed with the aid of the Model 7011 include current gain tests, leakage tests, as well as tests to determine the commonemitter characteristics of the device. The following paragraphs discuss these tesests and give typical equipment con@urations for the tests.

Current gain tests The DC or static common-xnitter current gain of a

transistor can be determined by biasing the transistor for a speci6c value of base current, 1~ and then measuring the collector current, 1~. The DC common-emit-

ter current gain, p, of the transistor is then determined as follows:

Figure 47 shows the test configuration and equivalent circuit for the current gain test. The Model 224 Current Source is used to source the base current, I,. The Model 730 Voltage Source supplies the collector-emitter voltage, V,, and the collector current, k, is measured by the Model 196 DMM. Switching among the transistors being tested is, of course, performed by the Model 7011 multiplexer card.

In order to perform the current gain test, the voltage source is f&t set to the desired value of Ve The current source is then set to a base current value that will result in the desired value of E as measured by the DMh4. The current gain can then be calculated as outlined above.

In order to reduce errors caused by voltage burden, use a higher current range on the Model 196 DMM. Doing

so will result in the loss of one or two decades of reso lution, but 3 ‘/z or 4 ‘/~-digit resolution wiIl probably be adequate for most situations.

4-9

Model 224

C”ment eowce

A. Test Configuration

B. Simplified Equivalent Circuit

Figure 4-7

Configuration for current gain and common-emitter test

4-l 0

4.4.3 Testing with matrix cards

Operation

Common-emitter characteristics are determined by setting the base current, IB, to specific values. At each IB value, the collector-amitter voltage, v,, is swept across the desired range at specific intervals, and the collector current, b is then measured. When the data are plotted, the result is the familiar family of commonemitter curves (Figure 4-S).

The same test coni%guration that is used for current

gain tests can be used for measuring common-emi~er characteristics. The Model 224 is used to set the base current, I, to the desired values. The Model 230 Voltage Source provides the collector-emitter voltage, V, and the Model 196 DMM measures the collector current, IQ

The Model 7011 can be added to a matrix switching system to enhance the test capabilities of that system. The following paragraphs discuss an overall multiplexer/matrix switching system and also briefly outline a typical test that can be made with such a system.

Multiplexer and matrix card connections Figure 4-9 shows a typical sy.stem using Model 7012

and 7011 cards together. In this instance, the multiplexer card is configured as four 1 x 10 multiplexers. Note that rows of the ma&ix card are connected to the banks of the multiplexer card through the analog backplane of the mainframe; no external wiring is necessary to connect the two cards together.

In this application, the DUTs are connected to the bank inputs on the multiplexer card, allowing a large nunher of DUTs to be switched through the matrix card. Also, the instruments are connected to the columns on the matrix card. This particular configuration is best suited for applications requiring a large number of DIJTs to be connected to several insttuments. In other cases, the test co~guration may call for a large numher of instnunents and few DUTs. In those situations, the instruments would be connected to the multiplexer

inputs, and the DUTs would be connected to the col-

UItUlS.

1 2

3 4 5

VCE , votts

Figure 4-8

Typical common-emitter characteristics

4-11

Bkd@.Jle

Jumpers

L------- ---------- --‘7()0,&p&

7011

M”lti~pr

Figure 4-9 Connecting multiplexer and matrix cards together

General Purpose

B~Ckphll?

Resistivity tests

The general test con6gwation shown in Figure 410 can be used to perform resistivity tests on semiccmductars. Such tests can yield important information such as doping concentratiOn.

As shown in

Figure 410, the Model 7011 switches ten samples for the test. The Model 7012 Matrix card allows any device test node to be connected to any instmment terminal. The Model 220 Current Source

4-12

forces a current through the DUT, and the Model 196 DMh4 measures the voltage across the device. In order to minimize errors caused by sample loading, the Mod-

d 196

should be used on the 3OOmV or 3V ranges. Also,

resistance values should be 1MQ or less.

In order to perform the tests, a current Wmn the Model

220) is applied to two terminals, and the voltage is measured (by the Model 196) across the two opposite terminals. A

total

of eight such measumnents are re-

quired, as shown in Figure 411.

6. Simplified Equivalent Circuit (One measurement leg shown)

Figure 4-l 0

Resistiviv 2~3 COnfiguratiOn

A. Connections

4-l 3

Operation

Figure 4-l 1 Measurement required for resistivity test

4-14

Once the measurements have been taken, the resistiti-

ty can be calculated. Two values of resistivity, A and B,

are initially computed as follows:

1.133l~,r~(v~+v~-li,-V~)

o* =

4.5.1 Path isolation

The path isolation is simply the equivalent impedance between any two test paths in a measurement system.

Ideally, the path isolation should be infinite, but the actual resistance and distributed capadtance of cables and connectors results in less than infinite path isolation values for these devices.

1.1331~gr~(v~+v*-v115-v,)

GB =

WhW2: o/, and oB are the rssistivities in Q-cm,

ts is the sample thickness in an, V1 through Vs are the voltages measured by the Model

196, I is the current through tlw sample in amperes, f* and fB are geometrical factors based on sample sym-

meby (fA = f, = 1) for perfect symmetry. Once oA and oa are known, the

average resistivity,

oAvG, can be determined as follows:

Path isolation resistance

forms a signal path that is in parallel with the equivalent resistance of the DUT, as shown in Figure 412. For low-to-medium device r&stance values, path isolation resistance is seldom a consideration; however, it can seriously degrade measurement accuracy when testing high-impedance devices.

The voltage measured across such a device, for exam-

ple, can be substantially attenuated by the voltage divider action of the device source resistance and path isolation resistance, as shown in Figure 413. Also, leakage currents can be generated through these resistances by voltage sources in the system.

r----i r _ I I I I I I

I I I

L----J L-_--J l--Z--.

Dur

__-_ ----

I I I I 1

I I

MUX Measure

Card Instrument

I I

4.5 Measurement considerations

Many memmments made with the Model 7011 are subject to various effects that can seriously affect lowlevel measurement accuracy. The following para-

graphs discuss these effects and ways to minimize them.

RDw = Source Resistance of DUT

em = Source EMF of DUT

RpAm = Path Isolation Resistance

RN = Input Resistance of Measuring Instrument

Figure 4-12 Path

isolation resistance

4-l 5

~UJT =

Any differatlal isolation capacitance a&& Ix measurement settling time as well as AC measurement accuracy. Thus, it is often important that such capacitance be kept as low as possible. Although the distributed capacitance of the matrix card is generally fixed by de-

sign, there is one area where you do have control over the capacitance in your system; the conrwting cables.

To minimize capacitance, keep all cables as short as

possible

4.5.2 Magnetic fields

EDUT bmi

ROUT + bm

produced by various signals such as the AC power line voltage. Large inductors such as power transformers

can generate substantial magnetic fields, so care must

be taken to keep the switching and maswing circuits

a good distance away from these potential noise S0ll.K~.

At high current levels, even a single conductor can gencrate significant fields. These effects can be minimized

by using twisted pairs, which will cancel out most of the resulting fields.

4.5.3 Radio frequency interference

RFI (Radio Frequency Interference) is a general term used to describe electromagnetic interference over a wide range of t%quencies across the spectrum. Such RFl can be particularly troublesome at low signal lev-

els, but is can also affect measurements at high levels if the problem is of sufiicient severity.

RFI can be caused by steady-state sources such as radio or TV signals, or some types of electrcmic equipment (microprocessors, high speed digital circuits, etc.), or it can result from impulse sources, as in the case of arcing in high-voltage environments. In either case, the effect on the measurement can be considerable if enough of the unwanted signal is present

When a conductor cuts through magnetic lines of force, a very small current is generated. This phenomenon will frequently cause unwanted signals to occur in the test leads of a switcbin.g matrix system. If the conductar has suflicient length, e”en weak magnetic fiekls like those of the earth can mat* sufficient signals to aff& low-level measurements.

Two ways to reduce these effeck are: (1) reduce the lengths of the test leads, and (2) minimize the exposed circuit area. In extreme cases, magnetic shielding may be required. Special metal with high permeability at low flux densities (such as mu metal) is effective at re ducing these effects.

Even when the conductor is stationary, magneticallyinduced signals may still be a problem. Fields can be

4-16

RFIcanbe minimized in several ways. The most obvious method is to keep the equipment and signal leads a.5 far away from the RFl source a.5 possible. Shielding the switching ad, signal leads, sources, and measuring instrumer,~ will often reduce RFI to an acceptable 1eveL In extreme cases, a specially-constructed screen ro0n-l may be required to !5ufficiently attenuate the ixmbieaome signal.

Many inshuments incorporate internal filtering that may help to reduce RFI effects in some situations. In

some cases, additional external filtering may also be required. Keep in mind, however, that tiltering may have detrimental effects on the desired signal.

4.5.4 Ground loops

when two or more instruments are conneaed together, care must be taken to avoid unwanted signals caused by ground loops. Ground loops usually occur when sensitive instrumentation is connected to other instcw mentation with more than one signal return path such as power lin

e ground. As shown in Figure 414, the reding ground loop causes current to flow through the instrument LO signal leads and then back through

power line ground. This circulating current develops a small but undesirable voltage between the LO terminals of the two instruments. This voltage will be added to the scnlrce voltage, affecting the accuracy of the mea-

surement.

Ground loops are not nomwlly a problem with inskumats having isolated LO terminals. However, all instruments in the test setup may not be designed in this manner. When in doubt, consult the manual for ail instrumentation in the test setup.

4.5.5 Keeping connectors clean

As is the case with any high-resistance device, the integrity of connectors can be damaged if they are not handled properly. If connector insulation becomes con-

taminated, the insulation resistance will be substantially reduced, affecting high-impedance measurement

pd.%

Oils and salts from the skin can contaminate connector insulators, reducing their resistance. Also, contaminants present in the air can be deposited on the insalatar surface. To avoid these problems, never touch the

connector insulating material. In addition, the multiplexer card should be used only in clean, dry environments to avoid contamination.

Figure 415 shows

how

connect several instruments

together to eliminate this type of ground loop problem. Here, only one instrument is connected to power line ground.

Figure 415

Eliminating ground loops

If the connector insulators should become contaminated, either by inadvertent touching, or from air-borne

deposits, they can be deaned with a cotton swab

dipped in clean methanol. After thoroughly cleaning, they should be allowed to dry for several hours in a low-humidity environment before use, or they can be

dried more quickly using dry nitrogen.

4.5.6 AC frequency response

The AC frequency response of the Model 7011 is impor-

tant in test systems that switch AC sign&. Refer to the

spetications at the front of this manual.

4-l 7

Service Information

WARNING

The information in this section is intended only for qualified service personnel. Some expose you to hazardous voltages that could result in personal injury or death. Do not attempt to perform these procedures unless you are qualified to do so.

the procedures may

5.1 Introduction

This section contains information necessary to service

the Model 7011 multiplexer card and is arranged as follows:

5.2

Handling and cleaning precautions: Discusses handling precautions and

card should it become contaminated.

5.3

Perfomance

necessary to determine if the card meets stated

Cpdl~tiOIlS.

verification: Covers the procedures

methods to clean the

5.6 Troubleshooting:

tips for the Model 7011 induding relay replacement precautions.

Presents some troubleshooting

5.2 Handling and cleaning precautions

Because of the high-impedance areas on the Model 7011, care should be taken when handling or servicing the card to prevent possible contamination. The following precautions should be taken when servicing the card.

Handle the card only by the edges and shields. Do not

touch any board surfaces or components not associated

with the repair. Do not touch areas adjacent to electrical

contacts. When servicing the card, wear clean cotton gloves.

Do not store or operate the card in an environment

where dust could settle on the circuit board. Use dry ni-

trogen gas to clean dust off the board if necessary.

5.4

Special handling of static-sensitive devices: Reviews

static-sensitive devices.

5.5

Principles of operation: Briefly discusses circuit

operation.

precautions necessary when handling

Should it become necessary to use solder on the circuit board, use an OA-based (organic activated) flux. Remove the flux from the work areas when the repair has been completed. Use pure water along with clean cotton swabs or a clean soft brush to remove the flux. Take

care not to spread the flux to other areas of the circuit

5-l

Service information

board. Once the 511x has been removed, swab only the

repaired area with methanol, then blow dry the board with dry nitrogen gas.

After cleaning, the card should be placed in a 50°C low hc: xlity environment for several hours before use.

5.3

Performance verification

The following paragraphs discuss performance verifi-

cation procedures for the Model 7011, inclwling path resistance, offset current, contact potential, and isolation.

With the Model 7011’s backplane jumpers installed, the performance veriiication procedures must be performed with only one multiplexer card (the one being checked) installed in the Modal 7001 mainframe. These conditions do not apply if the backplane jumpers are

removed.

the side edges. Do not touch the connectors, and do not touch the board s.lufaces or components. on plugs and receptacles, do not touch areas adjacent to the electrical contacts.

NOTE

Failure of any performance verification test may indicate that the multiplexer card is contaminated. See paragraph 5.2 to clean the card.

5.3.1 Environmental conditions

All verification measurements should be made at an ambient temperature between W and 28OC, and at a relative humidity of less than 70%.

5.3.2 Recommended equipment

CAUTION

Contamination will degrade the perfo-ce of the card. To avoid contamination, always grasp the card by

Table 5-l

Verification equipment

Description Model or part

Table 5-l s-arizes the equipment necessary for perfo-ce verification, along with an application for each unit.

specifications

Applications

DMM Keithley Model 196 3cm; 0.01% Path resistance

Electrometer w/voltage source Keithley Model 617

lOpA< laOpA;

1.6%

1MlV source;

Offset cumnt, path isolation

0.2%

3mv;

Sensitive Digital Voltmeter Triax cable (untermknated) Low thermal cable

Keith@ Model 182 Keithley Model 7025 - offset current Keithley Model 1484 - contact potential

6Oppm Contact potential

(unterminated)

5-2

5.3.3 Multiplexer card connections

The following information summarizes methods that can be used to connect test inshumentation to the two

connector cards. Detailed connection information is

provided in Section 3.

Model 7011-S-Instrumentation

can simply be hard-

wired directly to the screw terminals of the connector

card. Jumper wires should be kept as short as possible.

Model 7011~C-Gne

method to make instrument connections to the multiplexer card is by hard-wiring a 96pin female DIN connector then mating it to the connector on the Model 7011-C. Input and output shorting connections can also be done at the connector. The connector in the Model 7011~IQT-R connection kit (see Table 3-2) can be used for this purpose. Pi identification for the connector is provided by Figure 3-8.

CAUTION

After making solder connections to a

connector, remove solder flux as ex-

plained in paragraph 5.2. Failure to

clean the solder connections could result in degraded petiormance pre-

venting the card from passing verifi-

cation tests.

Before pre-wiring any connectors or plugs, study the following test procedures to fuIIy understand the connection requirements.

Turn the Model 7001 off if it is on.

Turn on the Model 196, and a.IIow it to warm up for one hour before making measurements.

3. Connect ail input terminals of Bank A together to form one common terminaI, as shown in Figure 5-

Set the Model 196 to the 3WR range and connect the four test leads to the OHMS and OHMS SENSE input jacks.

Short the four test leads toaether and zero the

Model 196. Leave zero enable: for the entire test.

Connect OHMS Hl and OHMS SENSE HI of the Model 196 to the common terminal (jumper on Bank A inputs). It is recommended that the physical connections be made at inputs 1 and 10 of Bank A, as shown in Figure 5-l.

Connect OHMS LO and OHMS SENSE LO to the HI (H) terminal of Bank A.

Install the Model 7011 in slot 1 (CARD 1) of the Model 7001.

Turn on the Model 7001 and program it

close Channel l!l (Bank A, Input 1). Verify that the resistance of this path is <IQ.

10.

Open Channel l!l and close Channel 1!2 (Bank A, Input 2). Verify that the resistance of this path is

dL-2.

Using the basic procedure in steps 9 and 10, check

11. the resistance of Bank A HI (H) terminal paths for Inputs 3 through 10 (Channels 1!3 through l!lO).

Turn off the Model 7001 and move the OHMS LO

12. and OHMS SENSE LO test leads to the LO (L) ter-

minal of Bank A.

Repeat steps 9 through 11 to check the LO (L) ter-

13.

minal paths of BankA(ChamveIs l!l through l!lO). Repeat the basic procedure in steps 1 through 13

14. for Banks B through D (Channels l!ll through

1!40).

5.3.4 Channel resistance tests

Perform the f&wing steps to verify that each contact of every relay is closing properly and that the resistance is within speciiication.

5-3

Figure 5-l

Path resistance test connections

--i

--H

-L

-H

-L

--H

i HLHL~LHLHL~LHLHiHL~L /

Bank lnptlts

--L I

Model 7011

I &c”ts

5-4

5.3.5 Offset current tests

These tests check leakage current between HI (H) and LO (L) Wfferential offset current) and from HI (H) and LO (L) to chassis (common-mode offset current) of each pathway. In general, these tests are performed by simply me asuring the leakage current with an electrometer. In the following procedure, the Model 617 is used to measure the leakage current. Test connections are shown in Figure 5-Z.

Perform the following procedure to check offset current

Turn the Model 7001 off if if is on, and remove any jumpers or wires connl?cted to the multiplexer card.

Connect the friax cable to the Model 617, but do not connect it to the multiplexer card at this tie.

Turn on the Model 617 and allow the unit to warm up for two hours before testing. After warm up, select the 2M)pA range, and enable zero check and zero correct in that order. Leave zero correct enabled for the entire procedure. Also, be certain that V-Q GUARD is OFF and ground strap is connected to LO.

Connect the !xiax cable to Bank A HI and LO, as

shown in Figure 5-2A.

Install the Model 7011 in slot 1 (CARD 1) of the Model 7001.

Turn on the Model 7001 and program the unit to

6. close channel l!l (Bank A, Input 1).

On the Model 617, disable zero check and allow the reading to settle. Verify that the reading is <lM)pA. This specification is the offset (leakage) current of the pathway.

Enable zero check on the Model 617 and open

8. Channel l!l from the front panel of the Model

7001.

Repeat the basic procedure in steps 6 through 8 to check the rest of the pathways (Inputs 2 through

10) of BankA(Channels l!Zthrough l!lO).

10.

Turn off the Model 7001 and change the eleckometer connections to Bank B.

11.

Repeat the basic procedure in steps 6 through 10 to che& Bank B, Inputs 1 through 10 (Channels l!ll through 1!20).

12.

Repeat the basic procedure in steps 6 through 11 for Banks C and D Khannels 1!21 through 1!40).

Turn off the Model 7001 and change the electrome-

13. ter corm&ions, as shown in Figure 5-2B. Note that eledmmeter HI is connected to HI and LO of the Bank A output, which are jumpered together. Electrometer LO is connected to chassis.

Repeat steps 6 through 12 to check that the com-

14. mon mode offset

current is

<loOpA.

5-5

L----.-------------J

A) Differential

Bank outputs

Model 7011

Figure 5-2

Differential offset current test connections

L------------------J

B) Common-Mode

------------_

Bank inputs

Model 7011

5-6

5.3.6 Contact potential tests

These tests check the EMF generated by each relay con-

tact pair (H and L) for each pathway. The tests simply consist of using a sensitive digital voltmeter (Model

182) to

measure

the contact potential.

Perform the following procedure to check contact po-

tential of each path:

1. Turn the Model 7001 off if it is on.

2. Place jumpers between Banks A-B, B-C, and C-D.

Turn on the Model 182 and allow the unit to warm up to achieve rated accumcy.

Place a short between HI to LO on each input

(Channels l-40).

Place a short between HI to LO on output Bank D

(long enough to cut with wire cutters).

6. Connect the Model 182 input leads to HI and LO output Bank A using copper wires.

Install the Model 7011 in the Model 7001 slot 1, and turn the Model 7001 on.

Allow Models 7001,7011 and 182 to warm up for two hours.

Select the 3mV range on the Model 182.

10.

Press REL READING (on the Model 182) to null

out internal offsets. Leave REL READING enabled

for the entire procedure.

11.

Turn the Model 7001 off. Remove the Model 7011 from slot 1. Cut the short on B and D output HI to LO.

12.

Install the Model 7011 in the Model 7001 slot 1, and turn power on.

13.

wait 15 minutes.

14.

Program the Model 7001 to close Channel l!l.

15.

After settling, verify that reading on the Model 182 is <5OOnV (for the Model 7011-S). This measurement represents the contact potential of the pathway.

16.

From the Model 7001, open Channel l!l.

17.

Repeat steps 12 through 14 for all 40 channels.

Figure 5-3 Contact potential test connections

Model7011

s-7

5.3.7 Bank and channel-to-channel isolation tests

Bank isolation tests check the leakage resistance be-

tween adjacent banks. Channel-to-channel isolation tests check the leakage resistance between a Bank Output connection and a Bank Input connection with an adjacent Bank Input relay closed. In general, the tests are pa-formed by applying a voltage (1OOW across the leakage resistance and then measuring the -nt. The isolation resistance is then calculated as R = V/I. In the following procedure, the Model 617 functions as both a voltage source and an ammeter. In the V/I function, the Model 617 internally calculates the resistance from the known voltage and current levels and displays the resistive value.

Perform the following steps to check bank and channel-to-channel isolation:

1. Turn the Model 7001 off if it is on, and remove any jumpers or test leads conneaed to the multiplexe!r card.

Turn on the Model 617 and allow the unit to warm up for two hours before testing.

3. On the Model 617, select the ZpArange, and enable zero check and zero correct in that order. Leave zero comxt enabled for the entire procedure.

Connect the electrometer to the Model 7011, as shown in Figure 5-4.

5. Install the

Model

7011

in slot 1 (CARD 1) of the

Model 7001 and turn the mainframe on.

On the Model 617, select the 2OpA range and release zero check.

7. On the Model 617, press SUPPRESS to cancel offset current, then enable zero check.

WARNING

The following steps use high voltage (1OOV). Be sure to remove power from the circuit before making connection changes.

On the

Model

617,

set the voltage source for +lOOV, and select the 2OnA current range. Make sure the voltage source is in standby.

9. Placethe Model 617 in the b/I measurement funciion by pressing SHIET OHMS.

10. Prmam the Model 7001 to close Channels 1!1 and l!l;(Bank A, Input 1 and Bank B, Input 2).

5-8

Model7011

11. On the Model 617, disable zero check and press OPERATE to source +lOOV

12. After allowing the reading on the Model 617 to settle, verify that it is >lGQ (lOgQ). This measurement is the leakage resistance (bank isolation) between Bank A, Input 1 and Bank B, Input 2.

13. Place the Model 617 voltage source in standby and enable zero check.

14.

Turn

off the

Model

7031

and move the electrometer

connections to Banks B and C.

15.

Install the Model 7011 in slot 1 of the mainframe and tom the Model 7001 on.

16.

Program the Model 7001 to close Channels 1!12 and 1!23 (Bank B, Input 2 and Bank C, Input 3).

17. On the Model 617, disable zero check and press OPERATE to source +lOOV.

18. After allowing the reading on the Model 617 to settle, vaify that it is rlGS2 (1O’Q).

19. Place the Model 617 voltage source in standby and enable zero check.

20. Turn off the Model 7001 and move the electrometer connections to Bank C and D.

21.

Install the Model 7011 in slot 1 of the mainframe, and turn the Model 7001 on.

22. Using Table 5-2 as a guide, repeat the basic procedue of steps 16 through 18 for the rest of the path pairs (test numbers 3 through 9 in the table).

23.

Place the Model 617 voltage source in standby and enable zero check.

NOTE

Refer to for the following procedure to check channel-to-ckannel isolation.

24.

Turn off the Model 7001 and connect the Model 617

to the card as shown in Figure 5-5.

25. Install the Model 7011 in slot 1 of the Model 7001, and turn the mainframe on.

26.

l’rogmm the Model 7001 to close Channel 1!2

CBank A, Input 2). Make sure all other channels are open.

27. On the Model 617, disable zero check and press OPERATE to source 1OOV.

28.

After allowing the reading on the Model 617 to settle, verify that it is >lGsL (lOgsZ).

29.

Place the Model 617 voltage source in standby, and enable zero check.

30.

Using Table 5-3 as a guide, perform tests 2 through 9 for the remaining Bank A Inputs. Remember to move Bank Input connections as indicated in the table.

31.

Use Table 5-3 (test numbers 10 through 36) and the

above procedure to test Banks B, C, and D.

Table 5-2

Bank isolation test summary

Test

number

5 6 7 8

9 Bank C, Input 9 to Bank D, Input 10

*Assumes Model 7011 installed in slot 1 of mainframe. Programmed as slot (1) and channel.

Bank isolation Test equipment location Bank A, Input 1 to Bank B, Input 2

BankAandBankB l!l and 1!12 Bank B, Input 2 to Bank C, Input 3 BankBandBankC 1!12 and 1!23 Bank C, Input 3 to Bank D, Input 4 BankCandBankD 1!23and1!34

Bank C,

Input 4 to Bank D, Input 5 BankCandBankD Bank C, Input 5 to Bank D, Input 6 BankCandBankD 1!25 and 1!36 Bank C, Input 6 to Bank D, Input 7 BankCandBankD 1!26 and 1!37 Bank C, Input 7 to Bank D, Input 8 BankCandBankD 1!27 and 1!38 Bank C, Input 8 to Bank D, Input 9 BankCandBankD 1!28 and 1!39

BankCandBankD 1!29and1!40

Channels closed*

1!24 and 1!35

5-9

Service Information

Figure 5-5 Channel-to-channel isolation test connections

5-10

Table 5-3

Channel-to-channel isolation test summy

Test

number Channel-t o-cbmnel isolation Test equipment location

1 Bank A, Input 1 to Bank A, Input 2

2 3 4 5 6 7

Bank A, Input 2 to Bank A, Input 3 Bank A, Input 3 to Bank A, Input 4 Bank A and Input 3 Bank A, Input 4 to Bank A, Input 5 Bank A and Input 4 Bank A, Input 5 to Bank A, Input 6 Bank A and Input 5 Bank A, Input 6 to

Bank

A, Input 7 Bank A and Input 6

Bank A, Input 7 to Bank A, Input 8 BmkAandInput7 1!8

Bank A and Input 1 1!2 Bank A and Input 2

8 Bank A, Input 8 to Bank A, Input 9 Bank A and Input 8 1!9

Bank A, Input 9 to Bank A, Input 10 Bank A and Input 9 l!lO

10 Bank B, Input 1 to Bank B, Input 2 Bank B and Input 1 11 Bank B, Input 2 to Bank B, Input 3 Bank B and Input 2

12 13 14 15 16 17 18

19 20

Bank B, Input 3 to Bank B, Input 4 Bank B and Input 3 Bank B, Input 4 to Bank B, Input 5 Bank B and Input 4 Bank B, Input 5 to Bank 8, Input 6 Bank B and Input 5 Bank B, Input 6 to Bank B, Input 7 Bank B and Input 6 Bank B, Input 7 to Bank B, Input 8 Bank Band Input 7 Bank B, Input 8 to Bank B, Input 9 Bank B and Input 8 Bank B, Input 9 to Bank B, Input 10 Bank B and Input 9 1!20

Bank C, Input 1 to Bank C, Input 2 Bank C and Input 1 1!22 Bank C, Input 2 to Bank C, Input 3 Bank C and Input 2 Bank C, Input 3 to Bank C, Input 4

Bank C and Input 3

Bank C, Input 4 to Bank C, Input 5 Bank C and Input 4

23 Bank C, Input 5 to Bank C, Input 6 Bank C and Input 5

25 26 27

Bank C, Input 6 to Bank C, Input 7 Bank C, Input 7 to Bank C, Input 8 Bank C, Input 8 to Bank C, Input 9 Bank C, Input 9 to Bank C, Input 10

Bank C and Input 6 Bank C and Input 7 1!28 Bank C and Input 8 Bank C and Input 9 1!30

Channel

closed*

1!3 1!4 1!5 1!6 I!7

1!12 1!13 1!14

1!15

1!16

1!17

1!18 1!19

1!23

I!24

1!25

1!26

1!27

1!29

28 29

Bank D, Jnput 1 to Bank D, Input 2 Bank D, Input 2 to Bank D, Input 3 Bank D and Input 2

Bank D and Input 1

30 Bank D, Input 3 to Bank D, Innput 4 Bank D and Input 3 31 Bank D, Input 4 to Bank D, Input 5

32 33 34

Bank D, Input 5 to Bank D, Input 6 BankDandInput5

Bank D, Input 6 to Bank D, Input 7

Bank D, Input 7 to Bank D, Input 8 Bank D and Input 7 35 Bank D, Input 8 to Bank D, Input 9 36 Bank D, Input 9 to Bank D, Input 10

Bank D and Input 4 1!35 Bank D and Input 6 Bank D and Input 8

BankDandInput9

I!32

1!33 I!34

1!36

1!37

1!38 1!39

1!40

5-11

Service Information

5.3.8 Differential and common-mode isolation tests

These tests check the leakage resistance (isolation) between HI 0 and LO Q (differ&ial), and from HI @I) and LO CL) to chassis kommon-mode) of every bank and channeL In general, the test is performed by applying a voltage NJOv) ~CXISS the terminals and then measuring the leakage current. The isolation resistance is then calculated as R = V/I. In the following procedure, the Model 617 functions as a voltage source and an ammeter. In the V/I function, the Model 617 intemalIy calculates the resistance from the known voltage and current levels, and displays the resistance value.

+rform the following steps to check differential and

::ommon mode isolation:

1. Turn the Model 7001 off if it is on, and remove any jumpers and test leads connected to the multiplex-

er card.

Turn on the Model 617 and allow the unit to warm

up for two hours for rated accuracy.

On the Model 617, select the 2pA range, and enable zero check and zero correct in that order. Leave zero correct enabled for the entire procedure.

WARNING

The following steps use high voltage

(100X9. Be sure to remove

power from the circuit before making connection changes.

On the Model 617, set the voltage source for +lOOV, and select the 2CGnA current range. Make sure the voltage source is still in standby.

Place the Model 617 in the V/I measurement functim by pressing SHFI OHMS.

6. With the Model 617 in standby, connect the electrometer to Bank A of the multiplexer card, as shown in Figure 5-6.

install the Model 7011 in slot 1 CARD 1) of the mainframe, and turn the Model 7001 on.

8. Make sure all the relays are open. (press OPEN ALL on the Model 7001.)

On the Model 617, disable zero check, and press olmL4TF. to source 1ooV.

10. After allowing the reading on the Model 617 to settle,verify that it is >lGQ (1O’Q). This measurement is the differential leakage resistance (isolation) of BankA.

11. Place the Model 617 in standby and enable zero check

Figure 5-6

Differential isolation test connections

3-12

12. Program the Model 7001 to close Channel 1!1 (BankA, Input 1).

13. On tlw Model 617, disable zero check and press

OPERATE to source +lOOc!

14. After allowing the reading on the Model 617 to settle,verifytbatitis&o ~lG~(lOgS&Thismeasurement check5 the differential isolation of Input 1.

15. Using Table 5-4 as a guide, repeat the basic procedure in steps 11 through 14 to test Inputs 2 through IO of Bank A (test numbers 3 through 11 of the ta-

ble).

16. Use Table 5-4 (test numbers 12 through 42) and the above procedure to test Banks B, C and D.

17. Place the Model 617 voltage source in standby and enable zero check.

Table 5-4

Differential and

Test number

1 2 3 4 5 6 7 8 9

common-mode

isolation testing

Differential or com-

mon

mode isolation

BankA Bank A, Input 1 Bank A, Input 2 Bank A, Input 3

Bank

A, Input 4 Bank A, Input 5 Bank A, Input 6 Bank A, Input 7 Bank A, Input 8 Bank A, Input 9 Bank A, Input 10

Channel

closed*

None

1!1 1!2 1!3 1!4 1!5 1!6 1!7 1!8 1!9

l!lO

NOTE

Refer to Figure 5-7 for the following procedure to check common mode isolation.

18. Turn off the Model 7001, and connect the electrometer to the Model 7011 as shown in Figure 5-7.

19. Repeat steps 4 through 16 to check common mode isolation. Verify that each reading is a1G.Q (lOpQ).

12 13 14 15 16 17 18

19 20 21

23 24 25 26 27 28

29 30 31 32 33

35 36 37 38

39 40 41 42 43 44

BankB Bank B, Input 1 Bank B, Input 2 Bank B, Input 3 Bank B, Input 4

Bank B, Input 5 Bank B, Input 6 Bank B, Input 7 Bank B, Input 8 Bank B, Input 9 Bank B, Input 10

Bi3llkC Bank C, Input 1 Bank C, Input 2 Bank C, Input 3 Bank C, Input 4 Bank C, Input 5 Bank C, Input 6 Bank C, Input 7 Bank C, Input 8 Bank C, Input 9 Bank C, Input 10

BankD Bank D, Input 1 Bank D, Input 2 Bank D, Input 3 Bank D, Input 4 Bank D, Input 5 Bank D, Input 6 Bank D, Input 7 Bank D, Input 8 Bank D, Input 9 Bank D, Input 10

None

1!11 1!12 1!13 1!14

I!15 1!16 1!17 I!18 1!19 1!20

None

I!21 1!22 1!23 1!24 1!25 1!26 I!27 I!28 1!29 I!30

None

1!31 I!32 1!33 1!34 1!35 I!% 1!37 1!38 1!39 1!40

gxmrmd as slot (1) and charmeL

5-l 3

service information

Figure57

Common-mode isolation test connections

5.4 Special handling of static-sensitive devices

CMOS and other high-impedance devices are subject to possible static discharge damage because of the high-impedance levels involved. When handling such devices, use the precautions listed below.

NOTE

In order to prevent damage, assume

that all park are static~ensitive.

Such devices should be transported and handled

only in containers specially designed to prevent or dissipate static build-up. Typically, these devices will be received in anti-static containers made of plastic or foam. Keep these parts in their original containers until ready for installation or use.

Remove the devices from their protective containers only at a properly-gCounded workstation. Also, ground yourself with an appropriate wrist strap while working with these devices.

Handle the devices only by the body; do not touch the pins or terminals.

Any printed circuit board into which the device is to be inserted must first be grounded to the bench or table.

Use only anti-static type de-soldering tools and grounded-tip soldering irons.

5-14

5.5 Principles of operation

The following paragraphs discuss the basic operating principles for the Model 7011, and can be used as an aid in troubleshooting the card. The schematic drawing of the card is shown on drawing number 7011-106, located at the end of Section 6.

5.5.1 Block diagram

Figure 5-8 shows a simplilied block diagram of the Model 7011. Key elements include the relay drivers and relays, as well as the ROM, which contains card ID and conQuration information. These various elements are discussed in the following paragraphs.

5.5.2 ID data circuits

Upon power-up, card identification information each card is read by the mainframe. This ID data indudes such information as card ID, hardware settling time, and relay con&uration information.

from

ID data is contained within an on-card EEPROM

W105). In order to read this information, the sequence

described below is performed on power-up.

The IDDATA line (pin 6 of U105) is set

from

high to

low while the IDCLK line (pin 5 of U105) is held

high. This action initiates a start command to the

ROM to kmsmit data serially to the mainframe

(Figure 5-9).

The mainframe sends the ROM address location to

2. be read over the IDDATA line. The ROM then

transmits an acknowledge signal back to the mainframe, and it then transmits data at that location

back to the mainframe CFigure 5-10).

The mainfkame then transmits an acknowledge

signal, indicating that it requires more data. The ROM will then sequentially transmit data after each acknowledge signal it receives.

Once all data is received, the mainframe sends a stop co

mmand, which is a low-to-high transition of the IDDATA line with the IDCLK line held high (see Figure 5-9).

To Mainframe

Figure 5-8 Model 7011 block diagram

+6V, +14.6V

ROM

u105

Relays

Relay

Power

Control

0100, QlOl

U106, u107

I User connections 4

3.5V (Steady State)

15.7 (= 100 msec during relay achration)

5-l 5

Service lnfomration

ID CLK

ID DATA -

Figure 5-9 Stat and stop sequences

ID CLK

IDDATA (Data oulpui from mainframe or ROM)

IDDATA

(Dataoutput I

from mainframe

or ROM)

Start

I I

stat Bii

I I

I\ I

I I

I I l/l I

I I

I I I I

Stop

Bit

I I

(

Figure510

Transmit and acknowledge sequence

5-l 6

Servfce Information

5.5.3 Relay control

Card relays are controlled by serial data &nmnitted via the relay DATA line. A total of five bytes for each card are shifted in serial fashion into latches located in the card relay driver ICs. The serial data is clocked in by the CLK line. As data overflows one register, it is fed out the Q’S line of the register down the chain.

Once all five bytes have shifted into the card, the STROBE line is set high to latch the relay information into the Q outputs of the relay drivers, and the appropriate relays are energized (assuming the driver out-

puts are enabled, as discussed below). Note that a relay driver output goes low to energize the corresponding Rhy.

5.5.4 Relay power control

A relay power control circuit, made up of U106, U107,

QlCO, QlOl, and associated components, keeps power dissipated in relay coils at a minimum, thus reducing possible problems caused by thermal EM%.

A power-on safeguard &xit, made up of U114 (a D-

type tlip-flop) and associated components ensures that relays do not randomly energize on power-up and power-down. This circuit disables all relays (all relays are open) during power-up and power-down periods.

The PRESET line on the D-type flip-flop is controlled by the 68302 micmprocessor, while the CLK line of the

D-type tllp-flop is controlled by a VIA port line on the

68302

processor. The Q output of the flip-flop drive

each switch card relay driver IC enable pin (UlO& u104, pin 8).

When the 68302 microprocessor is in the reset mode, the flip-flop PRESET line is held low, and Q out imme-

diately goes high, disabling aU relays (relay driver IC enable pins are high, disabling the relays). After the re set condition elapses (=ZOOmec), PRESET goes high

while Q out stays high. When the first valid STROBE

pulse occurs, a low logic level is clocked into the D type flip-flop, setting Q out low and enabling all relay drivers simultaneously. Note that Q out stays low, (enabling relay drivers) until the 68302 processor goes into a reset condition.

During steady-state operation, the relay supply~ voltage, +V, is regulated to +3.5V to minimize coil power dissipation. When a relay is first closed, the STROBE p&e applied to WC6 changes the parameters of therelay supply voltage regulator, QlOO, allowing the relay

supply voltage, +V, to rise to +5.7V for about lC0msec.

This brief voltage rise ensures that relays close as

quickly as possible. After the 1OOmsec period. has

elapsed, the relay supply voltage (+v) drops back

down to its nominal steady-state value of +3X

5.5.5 power-on safeguard

NOTE

The power-on safeguard circuit discussed below is actually located on the digital board in the Model 7001 mainframe.

5.6 Troubleshooting

5.6.1 Troubleshooting equipment

Table 5-5 summarizes recommended equipment for troubleshooting the Model 7011.

Tab/e 5-5 Recommended troubleshooting equipment

Manufacturer

Description

and model

Multimeter Keithley 196 oscilloscope TEK 2243

Application

Measure DC voltages

View logic waveforms

5-17

Service lnformarion

5.6.2 Troubleshooting access

In order to gain access to the r&y card top surface to measure voltages under actual operation conditions, perform the following steps:

1. Disconnect the connector card from the relay card.

2. Remove the Model 7001 cover.

3. Install the relay card in the CARD 1 slot location.

4. Turn on Model 7001 power to measure voltages (see following paragraph).

5.6.3 Troubleshooting Procedure

Table 5-6 s-aims switch card troubleshooting.

WARNING

Lethal voltages are present within the 7001 mainframe. Some of the pmcedures may expose you to hazardous voltages. Observe standard safety precautions for dealing with live circuits. Failure to do SD could resuit in personal injury or death.

CAUTION

Observe the following precautions when troubleshooting or repairing the switch card:

To avoid contamination, which could degrade card performance, always handle the card only by the handle and side edges. Do not touch edge

connectors, board surfaces, or components on the card. Also, do not touch areas adjacent to electrical EOIItacts on connectors.

Use care when removing relays from the PC board to avoid pulling traces away from the circuit board. Before attempting to remove a relay, use an appropriate de-soldering tool, such as a solder sucker, to clear each mounting hole completely free of solder. Each relay pin must be free to move in its mounting hole before removal. Also, make certain that no burrs are present on the ends of the relay pins.

5-18

Table .5d

Troubleshooting procedure

step

2 3 4 5 6 7 8 9

Item/component GND pad

+6V pad +5V pad +14.6V pad +V pad u105, pin 5 U105, pin 6 uloo, pin 7 Uloa, pin 2 UlOO, pin 3 ulooa1o4, pins 10-M

+iwDc

+5vDc +14.6VDC +3.5vDc* IDCLKpulseS

ID DATA pulses STROBE pulse CLK pukes DATA pukes Low with relay energized;

high with relay de-energized.

ChNllent.5

All voltages referenced to digital ground

(GND pad). Relay voltage. Logic voltage. Relay bias voltage. Regulated relay voltage. During power-up only. During power-up only. End of relay update sequence. During relay update sequence only. During relay update sequence only. Relay driver outputs.

5-19

Replaceable Parts

6.1 introduction

This seciion contains replacement parts infcmnation,

schematic diagrams, and component layout drawings for the Model 7011.

Card model number 7011

2. Card serial number

Part description

4. Circuit description, if applicable

5. Keithley part number

6.2 Parts lists

Parts lists for the various circuit boards are inchded in tables integrated with schematic diagrams and component layout drawings for the boards. Parts are listed alphabetically in order of circuit designation.

6.3 Ordering information

To place an order, or to obtain information concerning

replacement park, contact your Keithley representative or the factay (see inside front cover for addresses). When ordering parts, be sure to include the following

information:

6.4 Factory service

If the card is to be returned to Keithky Instnunents for repair, perform the f0lkxvin~

1. Complete the service form at the back of this manual and include it with the card.

2 Carefully pack the card in the original pa&kg car-

toll.

3. Write ATENTION REPAIR DEPT on the shipping label.

Note: It is not necessary to return the matrix main-

frame with the card.

b-l

6.5 Component layouts and schematic diagrams

Component layout drawings and schematic diagrams are included on the following pages integrated with the parts lists:

Table2 Parts List, Screw Terminated Connector

Card for 7011-S.

7011-160 Component Layout, Screw Terminated Con-

nector Card for 7011-S.

7011-166 Schematic, Screw Terminated Connector

Card for 7011-S.

Table 1 7011-100 Component Layout, Relay Card for 7011-S

7011-106 Schematic, Relay Card for 7011-S and 7011-

Parts List, Relay Card for 7011-S and 7011-C. and 7011-C. C.

NOTE

The Model 7011 and 7012 use the same relay card, only the connector cards are different.

Table 3 Parts List, Mass Terminated Connector Card

for 7011-c.

7011-170 Component Layout, Mass Terminated Con-

nector Card for 7011-C.

7011-176 Schematic, Mass Terminated tonnector

Card for 7011-C.

6-2

Table 6-1

Relay Board for Model 7011 -S and 701 l-C, Parts List

Circuit Desig.

ClOO-109,118,119 c110,111

Cl12 c113,114 c115-117

J1002,1003 KlOO-139 P2001 QlOO

QlOl RlOO

RlOl R102,103 RlC4 R105 R106,107

Description EJECTOR ARM

ROLL PIN (FOR EJECTOR ARMS) SHIELD SOCKET (FOR U105)

CAP,.lUF,20%,5OV,CERAMIC

CAF,lUF,20%5OV,CERAMIC

CAp,O.OOlUF,2O%,5OOV,CER4MIC CAP,lOUF,-20+100%,25V,ALUM ELEC CAP,l5OPF,lO%,lOOOV,CERAMIC

CONNECTOR, MALE

RELAY, ULTRA-SMALL POLARIZED TF2E-5V CONNECTOR, RIGHT ANGLE MALE TRANS, Nl’N PWR, TIP31, (TO-220AB)

TRANS,N CHAN MOSPOW FET,V11713 (TO-92) RES, 2.49K, l%, l/SW, METAL FILM

RES, l.l5K, l%, l/EW,METALRLM RES, 560,10%, 1/2W, COMPOSITION RES,1K,1%,1/8W,METALFILM

RES,22OK, 5%,1/4W,COMPOSITION OR FILM RES,lOK,5%,1/4W,COMPOSITION OR FILM

Keithley Part No.

7011-301 DP-6-l

7011-305

SO-72 C-365.1

C-237-l c-22-.001 c-31410 c-64-15OP

CS-736-2 RL-149 c-775-1 TG253

TG195 R-88-2.49K

R-8&1.15K R-1-560 R-8%1K R-76220K R-761OK

moo-104 u105 U106 u107

WlOO-107

IC, &BIT SERIAL-IN LATCH DRIVER, 5841A EPROM PROGRAM IC,RETRIG MONO MUITMB,74HC123

IC,AJD SHUNT REGULATOR,TL431CLP

K-536 7011~800-““” IC492

K-677

J-15

25917

TC17-100

25917

DELETED SO-72.

CHG’D U105 FROM IC-737 TO TC17-100.

25917

6/18/01

TC17-100 BOARD ASS’Y. ORIENT ARROW TOWARDS PIN 1 OF DEVICE.

Table 6-2

Screw Terminal Board for Model 7011 -S, Parts List

Circuit Desig.

J1004,1005,1007 1008,1010,1011, 1013,1014

J1006,1009,1012, 1015

P1002,1003 WlOO-105

Description CABLE CLAMl’

CAPTIVE SCREW (FOR TOP CLAMP) CONNECTOR, JUMl’ER (FOR CS-339-Z) CONNECTOR SHIM (FOR P1002,1003) SHIELD STRIP, P0LYuRETHAiwz (FOR BOTTOM CLAMP)

TOP CLAMF COW, 8 PIN

CONN, 6-PIN

CONNECTOR, 4%PIN, 3 ROWS CONN,BERG, 2 PIN

Keithley Part No.

7011-304-l FA-243-1 CS-476 7011-309 7011-305 2001-345-I 7011-302

E-115-8

TE-115-6

a-748-3 (X-339-2

Table 6-3

Mass Terminated Connector Board for Model 707 7-C Parts List

Circuit D&g.

c101,102 Cl03

CRlOl-105 E101,102 J1004

KlOl-104 P1002,1003 4101-103

Description BRACKET

STANDOFF SHIELD CONNECTOR SHIM CONN,BERG CONNECTOR, JUMl’ER (FOR WlOO-105)

CAP,lUF,20%,5OV, CERAMIC CAP,.luF20%>0V,CERAMIC

DIODE,SILICON,IN4148 m-35)

FERRITE BEAD CONN, 96-PIN, 3 ROWS RLAY, ULTRA-SMALL POLARIZED TF2E-4.5V CONNECTOR, FEMALE TRANS, N CHAN MOSPOW FET, V11713 (TO-92)

Keithley Part No.

7011-307

ST-203-l

7011-311

7011-309 cs339 CS-476

C-237-l C-365-.1

RF-28 CT-8 cs514 RL-162 a-748-3 TG-195

R103,104 R105 R106 R107 R108,llO RlG9 Rlll

UlOl u102

WlOo-105

RES, lM, lo%, 1/2W, COMPOSITION RES, 39,5%, 1/4W, COMPOSITION OR FILM RES,1O,5%,1/4W,COMl’OSITION OR FILM RES,4.99K,l%,l/8W,METALFIL.M RES,lOK,5%,1/4W,COMPOSITION OR FILM RES,1OOK,5%,1/4W,COh4POSITION OR FILM RES,lOK,l%,l/SW,METAL FILM

IC,QUAD 2 INPUT NOR,74HCOZ IC, DUAL COMP,LM393

CONN, BERG,2 PIN

R-l-1M

R-76-39

R-76-10

R-88-4.99K

R-76-10K

R-76-100K

R-8810K

IC-412

IC-343

c-339-2

Service Form

Model No.

Serial No. Date Name and Telephone No. Company

List all control settings, describe problem and check boxes that apply to problem.

Cl Intermittent 0 IEEE failure

m Front panel operational Display or output (check one)

0 Drifts 0 Unstable 0 Overload

0 Calibration only 0 Data required (attach any additional sheets as

Show a block diagram of your measurement system including all instruments connected (whether power is turned on or not). Also, describe signal source.

0 Analog output follows display D Obvious problem on power-up

B All ranges or functions are bad

0 Unable to zero 0 Will not read applied input

0 Certificate of calibration required

necessary)

0 Particular range or function bad; specify 0 Batteries and fuses are OK

0 Checked all cables

Where is the measurement being performed? (factory, controlled laboratory, out-of-doors, etc.)

What power line voltage is used?

Relative humidity?

Any additional information. (If special modifications have been made by the wer, please describe.)

Other?

Ambient temperature7

“F

Keithley Instruments, Inc. lest Instrumentation Croup

28775 Aurora Road Cleveland, Ohio 44139

Printed in the U.S.A.

Tektronix 7011-S, 7011-C Instruction Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Safety Precautions

7011SPECIFICATIONS

Table of Contents

List of Illustrations

List of Tables

General Information

1.2 Features

Introduction

Warranty information

Specifications

1.4 Manual addenda

.S Safety symbols and terms

1.7 Unpacking and inspection

1.8 Optional accessories

Multiplexing Basics

2.1 Introduction

2.2 Basic multiplexer configurations

2.3 Typical multiplexer switching schemes

2.4 Multiplexer expansion

Card Connections & Installation

introduction

3.2 Handling precautions

3.3 Connections

3.4 Typical connection schemes

Operation

Introduction

4.2 Power limits

Mainframe control of multiplexer card

4.4 Multiplexer switching examples

4.5 Measurement considerations

Service Information

5.1 Introduction

5.2 Handling and cleaning precautions

Performance verification

5.4 Special handling of static-sensitive devices

5.5 Principles of operation

5.6 Troubleshooting

Replaceable Parts

6.1 introduction

6.2 Parts lists

6.3 Ordering information

6.4 Factory service

6.5 Component layouts and schematic diagrams