Tektronix 7011-S, 7011-C Instruction Manual

Instruction Manual
Models 7011 -S and 701 I-C
Quad 1 x 10 Multiplexer Cards
Contains Operating and Servicing Information
W ARRANTY
Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable batteries, diskettes, and documentation.
During the warranty period, we will, at our option, either repair or replace any product that proves to be defective.
To exercise this warranty, write or call your local Keithle y representative, or contact Keithle y headquarters in Cleveland, Ohio. You will be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service facility . Repairs will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for the balance of the original warranty period, or at least 90 days.
LIMIT A TION OF W ARRANTY
This warranty does not apply to defects resulting from product modification without Keithley’s express written consent, or misuse of any product or part. This warranty also does not apply to fuses, software, non-rechargeable batteries, damage from battery leakage, or problems arising from normal wear or failure to follow instructions.
THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PRO­VIDED HEREIN ARE BUYER’S SOLE AND EXCLUSIVE REMEDIES.
NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS INSTRUMENTS AND SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE OF THE POSSIBILITY OF SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIM­ITED TO: COSTS OF REMOVAL AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY PERSON, OR DAMAGE TO PROPERTY.
Keithley Instruments, Inc.
Sales Offices: BELGIUM: Bergensesteenweg 709 • B-1600 Sint-Pieters-Leeuw • 02-363 00 40 • Fax: 02/363 00 64
CHINA: Yuan Chen Xin Building, Room 705 • 12 Yumin Road, Dewai, Madian • Beijing 100029 • 8610-6202-2886 • Fax: 8610-6202-2892 FINLAND: Tietäjäntie 2 • 02130 Espoo • Phone: 09-54 75 08 10 • Fax: 09-25 10 51 00 FRANCE: 3, allée des Garays • 91127 Palaiseau Cédex • 01-64 53 20 20 • Fax: 01-60 11 77 26 GERMANY: Landsberger Strasse 65 • 82110 Germering • 089/84 93 07-40 • Fax: 089/84 93 07-34 GREAT BRITAIN: Unit 2 Commerce Park, Brunel Road • Theale • Berkshire RG7 4AB • 0118 929 7500 • Fax: 0118 929 7519 INDIA: Flat 2B, Willocrissa • 14, Rest House Crescent • Bangalore 560 001 • 91-80-509-1320/21 • Fax: 91-80-509-1322 ITALY: Viale San Gimignano, 38 • 20146 Milano • 02-48 39 16 01 • Fax: 02-48 30 22 74 KOREA: FL., URI Building • 2-14 Yangjae-Dong • Seocho-Gu, Seoul 137-130 • 82-2-574-7778 • Fax: 82-2-574-7838 NETHERLANDS: Postbus 559 • 4200 AN Gorinchem • 0183-635333 • Fax: 0183-630821 SWEDEN: c/o Regus Business Centre • Frosundaviks Allé 15, 4tr • 169 70 Solna • 08-509 04 679 • Fax: 08-655 26 10 SWITZERLAND: Kriesbachstrasse 4 • 8600 Dübendorf • 01-821 94 44 • Fax: 01-820 30 81 TAIWAN: 1FL., 85 Po Ai Street • Hsinchu, Taiwan, R.O.C. • 886-3-572-9077• Fax: 886-3-572-9031
28775 Aurora Road • Cleveland, Ohio 44139 • 440-248-0400 • Fax: 440-248-6168
1-888-KEITHLEY (534-8453) • www.keithley.com
© Copyright 2001 Keithley Instruments, Inc.
Printed in the U.S.A.
11/01
Models 7011 -S and 7011 -C Instruction Manual
01991, Keithley Instruments, Inc.
Test Instrumentation Group
All Rights Reserved
Cleveland, Ohio, U. S. A.
Manual Print History
The print histoxy shown below lists the printing dates
of
all Revisions and Addenda created for this manual. The Revision Level letter increases alphabetically as the w@ undergoes subsequent updates. Addenda, which are released between Revisions, contain important change information that the user should incorporate immediately into the manual. Addenda are numbered sequentially. When a new Revision is created, all Addenda associated with the previous Revision of the manual are incorporated into the new Revision of the manual. Each new Revi­sion includes a revised copy of this print history page.
R&ion A (Dcament Number 7011-90101) ...... .._.............~
Addendum A (Document Number 7011-901-02)
Revision B (Donunmt Number 7011~901-01). ............................................................................... l&1-31 1992
Revision C (Dmment Number 7011-90141) .......................................................................... December 1992
..........................................................................
................................................
November 1991
January 992

Safety Precautions

The following safety precautions should be observed before using this product and any associaled instrumentation. Although some in-
~tnmen~s and accessories would nomxdly be used with non-haz­ardous voltages, there are situations where hazardous conditions
may be p*esent. This product is intended for use by qualified personnel who recog-
nize shock hazards and are familiar with the safety precautions re-
quired to avoid possible injury. Read the operating information carefully before using the product.
The types of product users arc: Responsible body is tbc individual or group responsible for the use
and maintenance of equipment, and for ensuring that operators are adequately trained.
Operators use the product for its intended function. They must be trained in electrical safety procedures and proper use of the instm­ment. They must be protected from electric shock and contact with hazardous live circuits.
Maintenance personnel perform routine procedures on the product to keep it operating, for example, setting the line voltage or replac­ing consumable materials. Maintenance procedures are described in the manual. The proccdurcs explicitly state if the operator may per­form them. Otherwise, they should be performed only by service perS”lld.
Service personnel 8.n~ trained to work on live circuits, and perform safe installations and repairs of products. Only properly trained ser­vice personnel may perform installation and service procedures.
Exercise extreme caution when a shock hazard is present. Lethal voltage may be present on cable connector jacks or test fixtures. The American National Standards Institute (ANSI) states that a shock hazard exists when voltage levels greater than 30V RMS, 42.4V peak, or 60VDC are present. A good safety practice is to expect that hazardous voltage is present in any unknown circuit before
measuring.
Users of this product must be protected from electric shock at all times. The responsible body must ensure that users are prevcntcd access and/or insulated from every connection point. In some cases, connections must be exposed to potendal human contact. Product users in these circumstances must be trained to protect themselves from the risk of electric shock. If the circuit is capable of operating at or above 1000 voks, no conductive part of the circuit may be exposed.
As described in the International Electrotechnical Commission (IEC) Standard IEC 664, digital multimeter measuring circuits (c,g,, Keithley Models 175A, 199, 2000, 2001, 2002, and 2010) measuring circuits are Installation Category Il. All other instm­merits’ signal terminals are Installation Category I and must not bc
connected to mains. Do not connect switching cards directly to unlimited power circuits.
They are intended to be used with impedance limited sources. NEVER connect switching cards directly to AC mains. When con­necting sources to switching cards, install protective devices to lim­it fault current and voltage to the card.
Before operating an instrument, make sure the lint cord is connect­ed to a properly grounded power receptacle. Inspect the connecting cables, teat leads, and jumpers for possible wear, cracks, or breaks
before each use.
For maximum safety, do not touch the product, test cables, or any other instruments while power is applied to the circuit under test. ALWAYS remove power from the entire test system and discharge any capacitors before: connecting or disconnecting cables or jump­ers, installing or removing switching cards, or making internal changes, such as installing or removing jumpers.
Do not touch any object that could provide a current path to the common side of the circuit under test or power line (earth) ground. Always make measurements with dry hands while standing on a dry, insulated surface capable of withstanding the voltage being measured.
Do not exceed the maximum signal levels of the instruments and ac­cessories, as defined in the specifications and operating informa­tion, and as shown on the instrument or test fixturn panels, or switching card.
When fuses are used in a product. replacc with same type and rating Car continued protection against fire hazard.
Chassis connections most only be used as shield connectioos for measuring circuits, NOT as safety earth ground connections.
If you are using a test fixture, keep the lid closed while powcr is ap­plied to the device under tat. Safe operation requires the USC of a lid interlock.
Ifa@. screw is present, connect it to safety earth ground using the wire recommended in the user documentation.
symbol on an instrument indicates that the user should re-
fer to the operating instructions located in the manual.
The A
sure 1000 volts or more, including the combined effect of normal and common mode voltages. Use standard safety precautions to avoid personal contact with these voltages.
The WARNING heading in a manual explains dangers that might result in personal injury or death. Always read the associated infor­mation very carefully before performing the indicated procedure.
symbol oo an instrument shows that it can source or mea-
Instrumentation and accessories shall not be connected to humans.
Before performing any maintenance, disconnect the line cord and all test cables.
To maintain protection from electric shock and fire, replacement
components in mains circuits, including the power transformer, test leads. and inout iacks. must be ourchased from Keithlev lnsm-
mats. Standard fuses, with applicable national safety approvals, may be used if the rating and type arc the same. Other components that are not safety related may be purchased from other suppliers as long as they are equivalent to the original component. (Note that sc-
leaed parts should be purchased only through Kcithley Instruments to maintain accuracy and functionality of the product.) If you arc unsure about the applicability of a replacement component, call a Keithley Instruments oflicc for information.
To clean the instrument. USC a dame cloth or mild. water based cleaner. Clean the exterior of the instrument only. Do not apply cleaner directly to the instrument or allow liquids to enter or spill on the instmmcnt.
The CAUTION heading in a manual explains hazards that could damage the instrument. Such damage may invalidate the warranty.

7011SPECIFICATIONS

MOD”, ‘IOU-S Quad 1x10 Multiplew with SaewT.smh&. MODEL7011-C QuadlxlOMvltiplexerwithMT~~Connector.
MDLTIPLBX CONPIGDRATION Four independent 1x10 2-p& Multi-
plex banks or two independent 1x10 &pole Multiplex banks. Adjjcent banksenbecomfftedtogether. Jumperscanberemovedtoisolateany bank from the backplane.
CONTACT CONFIGDRATION: 2-jmle Form A @Ii, Lo).
CONNECTOR TYPE:
7011-5: Screw terminal, #16AWG
mmc
MAXMUM SIGNAL LEVEb
DC Sign& 1lOV DC behveen any two pins, IA witched. AC Sign& 125V FM5 or 173V AC peak, between any two pins,
COMMON MODE VOLTAGE: 175” peak, my pin to chassis. CONTACTLIFE
O.D. 28 Conductors with .062 inch O.D.
%-pin m&Ewxardconnebor. Mates tofem&twistedwire cable, crimp or solder connedor.
bG.eive load). 1A switched, 60VA ke&tive load).
IMximllm wire size, with a92 tnch
maxima
30 Conductor madmum
#Z?AWG
typical wire size
3WA
CONTACT POTENTIAL
7011-5: c 500 nv per contact pair Hi, Lo).
< 1.5 pv par single contact
m11-c < 1.5 WV per contact pair m, Lo) eypically < 1 @q.
< 35 p? per single contact oj@zdly c 3 PVL
OPFSET ‘XItRt3iVI: < 100 PA. ACTUATION TIME: 3 ms. ISOLATION:
Bank >lC@Q < 25 pF. CbanneI to channel: >lO%Z, < 50 pF. Differenti Configured as 1x10 =-l@Q, < 100 pF.
Configured as 1x40 >loSQ, < 200 pF.
Common Mode Configured as 1x10 >lOQ, < 2W pF.
Conftgurect as 1x40 >l@O, < 600 pF.
CROSS TALK OMHz, 500 Load):
Bank <-4OdB. Channeb <4OdB.
INSERTION LOSS (MS2 Somx,sO Load): < 0.1 dB below 1 MHz, < 3 dB
below 2 MHZ. RELAYDRNECURRENT (per r&y): 16 mA. E7WIRONMEN-C
opdi0~ O’C to WC, up to 35-x < 80% Fx.
smagez spedfieti0ns subjj to change without notice.
-25°C to 65’C

Table of Contents

........................................................................................................................................................................................................................................................
....................................................................................................................................................................................................................
..........................................................................................................................................................................................................................................................................................................................................................
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.7.1
1.7.2
1.7.3
1.7.4
1.8
2.1
2.2
22.1
2.2.2
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.4
2.4.1
2.4.2
Introduction
Features .............................................................................................................................................................
warranty informaton..
Manual a&km& .............................................................................................................................................
Safety symbols and terms ..............................................................................................................................
specifications ...................................................................................................................................................
Unpacking am.3 inspection
Inspectior, for damage Shipping axItents.. apron mand..
Repacking for shipment .........................................................................................................................
Optional a~c~soties.. ......................................................................................................................................
Introduct$m
Basic m&ipkxer ca~figurations ..................................................................................................................
Multiplexer bank-to-bank jumpers.. .....................................................................................................
Backplane jumpers
Typical nultiplexer switching schemes.. .....................................................................................................
S&++&xl
Differential switching .............................................................................................................................
sensing. .....................................................................................................................................................
SMIJ co~cxtiq~.
Multiplexer expansmn
Two-card svitching system Mainframe multiplexer expansion
.....................................................................................................................................................
...................................................................................................................................
..................................................................................................................................
................................................................................................................................
....................................................................................................................................................
..................................................................................................................................
swit&ing
..........................................................................................................................
....................................................................................................................................
..................................................................................................................................
1-l l-1
l-2 l-2 1-2 1-2 l-2 l-2 l-2
1-3 1-3 l-3
2-1 2-1 2-2 2-5
2-6 2-7 2-7 2-a 2-8
2-10 t:?y
3.1
3.2
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.4
3.4.1
3.4.2
3.4.3
3.5
~~od,,,&m,
&n,&,g
C~~&i~~. .....................................................................................................................................................
&&-t&m& jumpers Backplane *pa Screw te&d KXEE&X card
Multi-pin (mass te
Tyqicd com&icm s&emes ........................................................................................................................
Single card system.. Two-c& system..
Tw~mainfrme system
Model 7011 i,,&&hc,n and remow.,
.....................................................................................................................................................
prxa~tion,s
.....................................................................................................................................
..................
.....................................................................................
rmination) connector
...............................................................................................................................
.................................................................................................................................
........................................................................................................................
......................................................................................................... 3-19
card
3-l
3-l 3-l
3-2 3-3 3-4 3-6
3-11
3-11
3-14 3-14
4.1 Introduction..
4.2
4.3
4.3.1
4.3.2
4.3.3
4.4
4.4.1
4.4.2
4.4.3
4.5
4.5.1
4.52
4.5.3
4.5.4
4.5.5
4.5.6 AC frequency
Power
limits..
Mainframe control
Channel assignments Front panel control. IEEE-488 bus operation..
Multiplexer switching examples
Resistor Transistor Testing
Measurement considerations
Path isolation.. Magnetic fields Radio frequency interference.. Ground loops Keeping connectors clean
....................................................................................................................................................
....................................................................................................................................................
testing .........................................................................................................................................
testing
with matrix cards.. ...................................................................................................................
4-1
4-1
of multiplexer card..
......................................................................................................
..............................................................................................................................
.................................................................................................................................
.........................................................................................................................
...................................................................................................................
4-l 42 4-4 44 4-5 45
.....................................................................................................................................
49
4-11
.......................................................................................................................
........................................................................................................................................
.......................................................................................................................................
.............................................................................................................
.........................................................................................................................................
.....................................................................................................................
response..
.......................................................................................................................
4-15 415 4-16 4-16 4-17 4-17 4-17
5.1
5.2
5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.6
5.3.7
5.3.8
5.4
5.5
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.6
5.6.1
5.6.2
5.6.3
Introduction Handling and cleaning precautions..
Performance verification
Environmental conditions Recommended equipment Multiplexer card connections Channel resistance tests Offset current tests Contact potential tests
......................................................................................................................................................
............................................................................................................
...............................................................................................................................
......................................................................................................................
.....................................................................................................................
................................................................................................................
..........................................................................................................................
...................................................................................................................................
.............................................................................................................................
Bank and channel-to-channel isolation tests Differential and common-mode isolation tests..
Special handling Principles of operation
Block diagram ID data circuits.. Relay control Relay power Power-on
Troubleshooting
Troubleshooting equipment Troubleshooting access Troubleshooting Procedure
of static-sensitive devices..
..................................................................................................................................
........................................................................................................................................
.....................................................................................................................................
...........................................................................................................................................
control ..............................................................................................................................
safeguard ..............................................................................................................................
.............................................................................................................................................
.................................................................................................................
.........................................................................................................................
..................................................................................................................
.......................................................................................
...............................................................................
..................................................................
.: .........................
5-l 5-l
5-2
5-2 5-2 5-3 5-3
5-5 5-7
5-8 5-12 5-14 5-15 5-15 5-15 5-17 5-17 5-17 5-17 5-17 5-18 5-18
6.1 Introduction
6.2
6.3
6.4
6.5
Parts lists Ordering Factory service..
Component
...........................................................................................................................................................
information..
......................................................................................................................................................
6-l
6-l
....................................................................................................................................
................................................................................................................................................
layouts and schematic diagrams..
...........................................................................................
6-1
6-l
6-2

List of Illustrations

Figure 2-l Figure 2-2 Figure 2-3
Figure 24 Figure 2-5 Figure 2-6 Figure 2-8 Figure 2-7 Figure 2-9 Figure 2-10 Figure 2-11 Figure 2-12 Figure 2-13
Figure 31
Figure 32 Figure 33 Figure 34 Figure 35 Figure 36 Figure 37 Figure 38 Figure 39 Figure 310 Figure 311 Figure 312 Figure 313
Figure 314 Figure 315 Figure 316 Figure 317 Figure 318 Figure 319
Model 7011 simplified schematic.. ........................................................................................................ 2-2
Four 1 x 10 multiplexer configuration (jumpers not installed) ........................................................ 2-3
Two 1 x 20 multiplexer configuration (jumpers installed).
One 1 x 40 multiplexer configuration (jumpers installed) ................................................................ 2-4
Model 7001 analog backplane ............................................................................................................... 2-5
Bank connections to backplane ............................................................................................................. 2-6
Differential switching example
Single-ended switching example .......................................................................................................... 2-7
Sensing example.. .................................................................................................................................... 2-8
SMLJ connectiom ..................................................................................................................................... 2-9
Two separate multiplexer systems ..................................................................................................... 2-10
Multiplexer input expansion example ............................................................................................... 2-11
Mixed card type example ..................................................................................................................... 2-12
Bank-to-bank jumper locations
Bank-to-bank jumper terminal identification .....................................................................................
Bank-to-bank jumper installation
Backplane jumpers.. ................................................................................................................................
Model 7011 screw terminal connector card.. .......................................................................................
Typical screw terminal connections .....................................................................................................
Cable clamp for screw terminal connector card .................................................................................
MI&-pin card terminal identification .................................................................................................
Typical round cable connection techniques ........................................................................................
Model 7011~MTR connector pinout.. ..................................................................................................
Model 7011~KIT-R (with/cable) assembly ........................................................................................
Single card system example (multi-pin connector card).
Single card System example (screw terminal connector card)
Tw-d system example (nxxki-pin connector card).
‘&v-d system example (screw terminal connector card)
Two-mainframe system example (multi-pin connector card).
Two-mainframe system example (screw terminal connector card)
Model 7011-C card jn&lk&m in Model 7001 .................................................................................
7011-S card inst&dion in Model 7001.. .............................................................................................
.............................................................................................................
. .........................................................................................................
...
......................................................................................................... 33
...............................................................
................................................................ 312
........................................................ 3-13
...................................................................
.......................................................... 316
....................................................... 317
............................................... 318
2-3
2-7
32 33
34 3-4
3-5
35 37
39 310 310
3-15
3-20 321
Figure 4-I Figure 4-2
Figure 4-3 Figure 4-4
Channel status display Display o*ganization
Model 7011 progr
2-tie resistance testing.. .......................................................................................................................
...........................................................................................................................
for multiplexer channels
amming channel assignments.. ..............................................................................
..................................................................................
4-2 4-3
4-3 4-6
iii
Figure 45 Figure 4-6 Figure 4-7 Figure 48
Figure 49 Figure 4-10 Figure 4-11 Figure 412 Figure 413 Figure 414 Figure 415
Four-wire resistance testing..
Low *&stance testing.. ...........................................................................................................................
Configuration for current gain and common-emitter Typical common-emitte~ characteristics
Conmcting multiplexer and ma&ix cards together
Resktitity test configuration ...............................................................................................................
Measurement required for resistivity test.. ........................................................................................
Path isolation resistance ........................................................................................................................
Voltage attenuation by path isolation resistance.. Power line ground loops
Eliminating ground loops ....................................................................................................................
................................................................................................................. 4-7
48
test.. ............................................................. 4-10
............................................................................................
411
......................................................................... 4-12
4-13 4-14 4-15
............................................................................ 4-16
......................................................................................................................
4-17 4-17
Figure 5-l Figure 5-2 Figure 5-3
Figure 5-4 Figure 5-5 Figure 56 Figure 5-7 Figure 5-8 Figure 5-9 Figure S-10
Pati *esistance test connections ............................................................................................................
Differadial offset current test connections ..........................................................................................
Contact potential test comwciions ........................................................................................................
Bank i&&ion test connections.. ............................................................................................................
Channel-to-channel isolMio* test connections ..................................................................................
Differential isolation test connections ................................................................................................
Co-on-mode i.solation test connections.. .......................................................................................
Model 7011 block diagram
................................................................................................................... 5-15
SM and stop sequences.. .....................................................................................................................
T-tit and acknowkdge sequence.. ...............................................................................................
5-4 5-6 5-7
5-8 S-10 5-12 5-14
5-16 5-16
iv

List of Tables

Table 3-1 Table 3-2
Table 4-l
Table 5-1 Table 5-2
Table 5-3 Table 5-4 Table 5-5 Table 5-6
Bank-to-bank jumpers (refer to Figure 3-Z)
Mass termination ~ccessori~
Pa&d Cha.r,r,els in 4-p& Operation . . . . . . .._.._...t...................................................................................
verification equipment.. .........................................................................................................................
Bank is&.tic,n test s-q Channel-to-channel isolation test mmmary
Differential and ~~-~~-nd.e &&ion &ding. ............................................................................
&co-end& ~~~bk&xdzing equipment.. Troubleshooting procedux
................................................................................................................
.................................................................................................................
.................................................................................................................
.........................................................................................
.....................................................................................
....................................................................................
3-3 3-6
4-6
5-2 5-9
5-11
5-13
5-17
5-19
v/vi

General Information

1.1
This section contains general information about the Model 7011 Quad 1 x 10 Multiplexer card.
There are two basic versions of this multiplexer card; the Model 7011-S and the Model 7011-C. The Model 7011-S assembly consists of a screw terminal connector card and a relay card. External test circuits are wired directly to the saew terminals of the connector card. Also available from Keithley is the Model 7011-ST. This is an extra screw terminal connector card. With an extra
connector card, you can wire a second test system without disturbing the wiring con@uration of the first test system.
The Model 7011-C assembly consists of a multi-pin
bmss te
Fxtemal test circuit connedions to the multiplexer are
made via the 96-pin male DIN connector on the con­nector card. Keithley offers a variety of optional acces­sories that can be used to make conneciiom to the connector card (see paragraph 1.9).
The rest of Setion 1 is arranged in the following man­ner:

1.2 Features

Introduction

rmination) connector card and the relay card.
1.4
Manual addenda
1.5
Safety symbols and terms
1.6
Specifications
1.7
Unpacking and inspection
1.8
Repacking for shipment
1.9
Optional accessories
1.2 Features
The Model 7011 is a low voltage, two-pole, quad, 1 x 10 multiplexer card. Some of the key features in&de:
l
Low contact potential and offset current for mini­mal effects on low-level signals.
l
The connector board detaches from the relay board
allowing easy access to the saew terminals (Model 7011-S) and jumpers.
l
Easy jumper cotiguration of one, two, three or four multiplexer banks.
l
Backplane jumpers. Cutting jumpers disconnects multiplexer bank outputs from the Model 7001 an-
alog backplane.
1.3 warranty information
1-l
1.3

Warranty information

1.6

Specifications

Warranty
information
is Located on the inside front
cover of this instruction manual. Should you Model
7011
require warranty service, contact the Keithley rep-
resentative or authorized repair fxility in your area for
further information. When returning the multiplexer
card for repair, be sure to fill out and include the service form at the back of this manual in order to provide the repair facility with the necessary information.

1.4 Manual addenda

Any improvements or changes concerning the multi­plexer card or manual will be explained in an adden­dum inchxded with the card. Addenda are provided in
a page replacement format. Simply replace the obsolete pages with the new pages.
1

.S Safety symbols and terms

The following symbols and terms may be found on an
ins!mmwnt or used in this manual.
Model 7011 specifications are found at the front of this manual. These specifications are exclusive of the mul­tiplexer mainframe speci6cation.3.

1.7 Unpacking and inspection

1.7.1 Inspection for damage
The Model 7011 is packaged in a z-sealable, anti-static bag to protect it from damage due to static discharge and from contamination that could degrade its perfor­mance. Before removing the card from the bag, observe the following precautions on handling.
Handling Precautions:
1. Always grasp the card by the side edges and shields. Do not touch the board surfaces or components.
2.
When not installed in a Model 7001 mainframe, keep the card in the anti-static bag and store it in the
original packing carton.
The A symbol on an instrument indicates that the user should refer to the operating instmztions located in the insfnxtion manual.
$
The
symbol on an instrument shows :, nigh voltage may be present on the terminal(s). L* stan­dard safety precautions to avoid personal contact with these voltages.
The WARNING heading used in this manual explains
dangers that might result in personal injury or death. Always read the associated information very carefully before performing the indicated procedure.
The CAUTION heading used in this manual explains hazards that could damage the multiplexer card. Such damage may invalidate the warranty.
After removing the card from its anti-static bag, inspect it for any obvious signs of physical damage. Report any such damage to the shipping agent immediately.
1.7.2 Shipping contents
The following items are included with every Model 7011 order:
l
Model 7011 Quad 1 x 10 Multiplexer Card
l
Model 7011 Instruction Manual
l
Additional accessoties as ordered
1-2
1.7.3 Instruction manual

1.8 Optional accessories

The Model 7011 Instruclion Manual is three-hole driBad so that it can be added to the three-ring binder of the Model 7001 Inshwtion h4anuaI. After removing the plastic wrapping place the manual in the binder following the mainframe instruction manuaL Note that a manual identification tab is included and should pr+ cede the multiplexer card instruction manual.
If an additional instruction manual is required, order the manual package, KeithIey part number 7011-901-
00. The manual package indudes an instruction manu­aI and any pertinent addenda.
1.7.4 Repacking for shipment
Should it become necessary to return the Model 7011
for repair, carefully pack the unit in ik original packing carton or the equivalent, and include the following in­formation:
l
Advise as to the warranty status of the multiplexer card.
The following accessories are available for use with the Model 7011:
Model 70ll-ST - This screw
terminal
connector card is identical to the one provided with the Model 7011-S assembly. An extra screw terminal connector card al­lows you to wire a second test system without disturb­ing the wiring coniiguration of the fist connector card.
Model 7011~KIT-R - This connection kit includes a 96-pin female DIN connector that wiU mate directly to the connector on the Model 7011-C or to a standard 9& pin male DIN bulkhead connector (see Model 7011­MTR). This connector uses solder cups for connections to external circoi~ It includes an adapter for a round cable and the housing.
Model 7Oll-WC-2 - This 2-meter round cable as­sembly is terminated with a 96-pin female DIN connec­tor on each end. It wiII mate directly to the connector on the Model 7011-C and to a standard 96-pin male DIN buIIchead connector (see Model 7011~MTR).
l
Write ATENTION REPAIR DEPARTMENT on the shipping label.
l
FiII out and include the service form located at the back of this manuaL
Model 7011-m-This 96pin male DIN buIkhead connector uses solder cups for connections to external
circu.i&y. It will mate to the Model 7011~KIT-R connec­tor, and Model 7011~MTC-2 cable assembly.
l-3
2

Multiplexing Basics

2.1 Introduction

This section covers the basics for multiplex switching and is arranged as follows:
Basic multiplex conBgurations: Covers the basic
2.2 multiplex configurations; quad 1 x 10 con+ra­tion, dual 1 x 20 configuration and single 1 x 40 cotiguration. The significance of the backplane jumpers is also covered here.
2.3
Typical multiplex switching schemes: Explains some of the basic ways a multiplexer cam be used to source or measure. Covers single-ended switching, differential (floating) switching and sensing.
24 System expansion: Discusses the various config-
urations that are possible by using multiple cards.

2.2 Basic multiplexer configurations

A simplified schematic of the Model 7011 multiplexer is shown in Figure 2-l. It is organized as four 1 x 10 multiplexer banks. Each bank has 10 inputs and one output. Two-pole switching is provided for each multi­plexer input, with HI and LO switched. Two or more banks can be jumpered together to expand multiplexer inputs, and backplane jumpers provide bank connec­tions to a second card installed in Model 7001 main­frame.
2-l
Figure 2-l Mode/ 707 7 simplified schematic
2.2.1 Multiplexer bank-to-bank jumpers
Jumpers are installed on the connector card to connect multiplexer banks together to form a multiplexer of 1 x
40. Each jum:~ :- set connects two adjacent banks to­gether. These j;-nper sets are included with the Model
7011.
The bank-to-bank jumpers allow you to configure the multiplexer card in a variety of ways. Typical multi­plexer coniigwations include:
l
Four 1 x 10 rxtitiplexers; no jumpers installed (Fig-
ure 2-2).
Backplane Jumpers
(to 7001 Analog
Bank to Bank
Jumpers
l
Two 1 x 20 multiplexers; Bank A jumpered to Bank
Backplane)
B, Bank C jumpered to Bank D (Figure 2-3).
l
One 1 x 40 multiplexer; all bank-to-bank jumpers installed (Figure 2-4).
Other combinations are possible, including multiplex-
ers of various sizes (in multiples of 10 channels). For example, you could install jumpers to configure the card as one 1 x 30 and one 1 x 10 multiplexer.
Refer to Section 3 for information on installing bank-to­bank jumpers.
2-2
2
Bank A
10. ,
Bank B
Bank C
Bank D
10, ,
Figure 2-2 Four 1 x 10 multiplexer configuration (jumpers not installed)
‘*
1. .’
‘12
,I i ~~--z+O”,utD
Figure 2-3
Two 7 x 20
1. ,x2
Bank 6
109 ,x2 l
1. ,z2
Bank C
10. :2 l
1. ,*2
Bank D
10. ,*2 l
multiplexer configuration (jumpers installed)
. .
. .
.
.
2-3
Bank A
inputs
10 ,’
10. ,
,:
;I- Output A
1. ,*2
Bank B
10. ;2
1. ;2
Bank C
10. ./Z
1. ,,2
Bank D
100 ,‘2
One 1 x 40 multiplexer configuration (jumpers
Jumpers
Jumpers
JUllp~S
installedl
2-4
2.2.2 Backplane jumpers
There are four pairs of backplane jumpers located on the relay card. With the jumpers installed, the banks of
the multiplexer card are connected to the analog back­plane of the Model 7001 allowing expansion
with a sec-
ond 7001 card installed in the mainframe. With the jumpers removed (cut), the multiplexer card is isolated from another card installed in the mainframe.
Model 7001
The three-pole analog backplane of the Model 7001 nminframe is shown in Fieure 2-5. Throwh this analog backplane the banks of a kodel7011 muitplexer car& installed in one slot, can be connected to the banks (or rows) of a compatible card installed in the other slot of the mainframe.
r----
I I
I I
I
I
I I I
I
Card 1
----
1
I
HS
I I
L
““IG
Ht L+-----4~L
Analog
Backplane
ROW 1 or Bank A
Row2OrBa”kB I H
L>I
Q-----f
I
ROW 4 or Bank D
9
:A
r----
I
kti
L
‘<G
L
I< g
Card 2
_---
1
I
I I
I I I
I
L--------l
Figure 2-5
Model 7001 analog backplane
,?-----f”
H = High
L= LOW
G = Guard
L--------l
ROW = Matrix Card (7012) ea"!i = MUX Card (7011)
2-s
Figure 2-6 shows how each bank of the Model 7011 is connected to the backplane. Notice that since the Mod-
el 7011 is a twopole card, there is no connection made to the Guard terminal of the backplane. The Model 7011 is shipped from the factory with the backplane jumpers installed.
Removing (cutting) the backplane jumpers isolates the card from the backplane, and subsequently, any card installed in the other slot. For information on removing the @mpers, refer to section 3.
NOTE
The Model 7001 does not provide an analog backplane for the non-701X se­ries cards. As a result, any of these cads installed in one slot in the main­frame is electrically isolated from any card installed in the other slot. The only way to connect a Model 7011 to one of these cards is to wire them to­gether.
7011 Bank Analog
(1 Of 4)
H\> H L>
H = High L=Lcw G = Guard
Figure 2-6 Bank connections to backplane
Backplane Jumpers
Backplane
>
7001
L
G
<
< <

2.3 Typical multiplexer switching schemes

The following paragraphs describe some basic switch­ing schemes that are possible with a two-pole switch­ing multiplexer. These switching schemes include some various shielding configurations to help mini-
mize noise pick up in sensitive measurement applica­tions. These shields are shown connected to chassis ground. For some test
prove to be more effective connected to circuit com­mon. Chassis ground is accessible at the rear panel of the Model 7001.
configurations,
shielding may
2-6
2.3.1 Single-ended switching
2.3.2 Differential switching
In the single-ended switching configuration, the source or measure instrument is connected to the DLJT through a single pathway as shown in Figure 2-7. The insinJml?nt is connectd to the output of one of the banks and the DUT is shown connect4 to one of the inputs for that bank.
The differential or floating switching configl.lration is shown in Figure 2-8. The advantage of using this con­figuration is that the terminals of the scarce or measure instrument are not confined to the same pathway. Each terminal of the instrument can be switched to any available input in the test system.
Figure 2-7 Sing/e-ended switching example
Figure 2-8
Differential switching example
Input l-10
2-7
2.3.3 Sensing .
Figure 2-9 shows how the multiplexer card can be con-
figured to use instruments that have sensing capability. The main advantage of using sensing is to cancel the ef­facts of switch card path resistance (43) and the resis-
tame of external cabling. Whenever path resistance is a
consideration, sensing should be used.
2.3.4 SMU connections
Figure 2-10 shows how to connect a Keithley Model
236,237 or 238
Source Measure Unit
to
the multiplexer card. By wing lkxx cables that are unterminated at one end, the driven guard and chassis ground are physical­ly extended all the way to the card.
Figure 2-9
Sensing example
Bank C, D
Input l-10
2-8
7011
Lb-
Input l-10
Figure 2- 10 SMU connections
Output LO TriaX
iIT-
WARNING
WARNING
: Hazardous v&ages may be present on
: Hazardous v&ages may be present on
GUARD. Make sure all cable shields are
GUARD. Make sure all cable shields are properly insulated before applying power.
properly insulated before applying power.
Cables (3)
\
2-9

2.4 Multiplexer expansion

With the use of additional
switching
cards and main­frames, larger systems can be configured. Each Model 7001 Switch System mainframe will accommodate up to two cards, and up to six mainframes can be connect-
ed together. Thus, a switch system using as many as 12
cards can be configured.
2.4.1 Two-card switching systems
Each Model 7001 Switch System mainframe can ac­commodate two cards to allow the following switching
configurations.
Separate switching systems
Two singie-card systems can be configured by remov-
ing the backplane jumpers from one of the cards. The
two cards will be controlled by the same mainframe, but they will be electrically isolated from each other. Figure 2-11 shows an example using two Model 7011 niultiplexer cards.
Multiplexer input expansion You can double the number of multiplexer inputs by
simply installing two “as shipped” Model 7011s in the Model 7001 mainframe. By leaving the backplane jumpers installed, the banks of the multiplexer card in­stalled in slot 1 (CARD 1) are automatically connected to the banks of the multiplexer card installed in slot 2 (CARD 2) through the analog backplane.
Figure 2-12 shows an example of input expansion. Each Model 7011 card is configured as four 1 x 10 mul­tiplexers. By connecting the banks together (via Model 7001 analog backplane), the resultant multiplexer sys­tern has 20 inputs for each of the four banks. Notice
that if all the bank-to-bank jumpers (for both cards)
were installed, the result would be a single 1 x 80 mul-
tiplexer.
Card 1
r----
h”kB -
Bankc -
i sm­I-------------
Figure Z- 11
Two separate multiplexer systems
----------
Four 1x10 Muniplexers
7011
._
1
7031 Analog
&.CkplCl”e
/ r---------I-~
L-----------A
Four 1x10 Multiplexers
Card 2
2-l 0
r-------
Card 1
7011
-----,
7Wl Analog
BX.kph”e
Card 2
-----
-------- ----­Quad 1x10 Multiplexers
Quad 1 x20 Multiplexer
Figure 2- 12
Mdripkxer input expansion exampk
Mixing card types Different types of cards can be used together to create
some unique switching systems. For example, you could have a Model 7011 multiplexer card installed in one slot and a Model 7012 matrix card installed in the other slot.
Figure 2-13 shows a possible switching system using a matrix card and a multiplexer card. The backplane jumpers for both the matrix and multiplexer cards must be installed. This allows matrix rows to be con­neded to multiplexer banks. On the multiplexer card,
the bank-to-bank jumpers must be removed to main-
_-----_---
Quad 1x10 Multiplexers
tain isolation between matrix rows. See the instmction
manual for the Model 7012 for complete information
on the mati card.
2.4.2 Mainframe multiplexer expansion
Multiplexer systems using up to 12 multiplexer cards are possible by using six Model 7001 mainframes to­gether. Each Model 7011 added to the system provides 40 additional inputs. Paragraph 3.4.3 explains how to
connect a test system using two mainframes.
2-1 ,l
r---- -------
---..--------__
Figure 2- 73
Mixed card type example
Card 1
7012
r------------
Card 2
701
1
------_-__
4xlOMatrix Quad 1 x 10 MUX
Bank A
Bank C
Bank D
---
2-12
3

Card Connections & Installation

3.1
The information in this section is arranged as follows:
3.2
3.3

introduction

WARNING
The procedures in this section are in­tended only for qualified service per-
sonnel. Do not perform these
procedures unless qualified to do so. Failure to recognize and observe “or­mal safety precautions could result
in personal injury or death.
Handling precautions: Explains precautions that must be followed to prevent contamination to the multiplexer card assembly. Contamination could degrade the performance of the multiplexer card.
Conmxtions: Covers the basics for connecting
extecd circuitry to the two available connector cards for the multiplexer; the screw terminal con­nector card and the multi-pin connector card.

3.2 Handling precautions

To maintain high impedance isolation, care should be taken when handling the relay card to avoid contami­nation from such foreign materials as body oils. Such contamination can substantially lower leakage resis­tances, thus degrading performance.
To avoid possible contamination, always grasp the re­lay and connector cards by the side edges or shields. Do not touch the board surfaces or components. On connectors, do not touch areas adjacent to the electrical contacts. Dirt build-up over a period of time is another possible source of contamination. To avoid this prob­lem, operate the mainframe and multiplexer card in a
clean environment.
If a card becomes contaminated, it should be thorough­ly cleaned as explained in paragraph 5.2.
Typical connection schemes: Provides some typ-
3.4
ical connection schemes for single card, two-card
and two-mainframe system configurations.
Model 7Oll ixkallation: Provides a procedure to
3.5
install the multiplexer card assembly in the
Model 7001 mainframe.

3.3 Connections

This paragraph provides the basic information needed
to connect your external teSt circuitry to the multiplex­er. It includes the installation of the bank-to-bank jumpers on the connector card, insta.Ilation/removal of backplane jumpers on the relay card, and detailed in-
3-1
fcmnaiion on making external connections tcl the two available connector cards.
WARNING
The following connection infolma­tion is intended to be used by quali­fied service personnel. Failure to recognize and observe standard safe­ty precautions could result in person­al injmy or death.
:~ 3.3.1 Bank-to-bank jumpers
As explained in paragraph 22.1, the banks of the mul-
tiplexer card can be connected together (using plug-in
jumpers) to form larger mukiplexers. The locations of
the bank-to-bank jumper terminals for both connector
cards are
shown in
Figure 3-l.
A. Screw Terminal Connector
Card
Figure 3- 1 Bank-to-bank jumper locations
3-2
6. Multi-pin Connector Card
Terminal identification is provided by Figure 32. On the drawing, the six terminal pairs are labeled WlOO through W105. The top three terminal pairs (WlOl, W103 and W105) are used to connect the LO terminals of the banks together. The bottom terminal pairs
(WlOO, WI02 and W104) are used to connect the HI ter­minals of the banks together. Table 3-1 summarizes the effects of each jumper.
Jumper
u--
I I
Jumper Terminal
Lt-
Pair
Bank
AtoB
IFzl
LO
L-A
WlOl
l-S-3
HI
xitir
Figure 3-2 Bank-to-bank jumper terminal identification
Table 3-7
Bank-to-bank jumpers (refer to Figure 3-Z)
,nstalled jumper Effect
WlOl Connect Bank A LO to Bank B LO WlOO
w103
w102
ConnectBankAHItoBankBHI Connect Bank B LO to Bank C LO
ConmxtBmkBHItoBankCHl
Bank
BtoC
h-3
L-2
w103
rr-Tl m6F
Bank
ctocJ
E--G-l
L-4
w105
r&--a
L-d
WI04
Figure 3-3 Bank-to-bank jumper installation
3.3.2 Backplane jumpers
The Model 7001 mainframe has an analog backplane that allows the banks of a Model 7011 multiplexer to be internally connected to a compatible stalled in the other slot (see paragraph 2.4.1 for details).
The backplane jumpers for the multiplexer card assembly are located on the relay card as shown in Figure 3-4. The card is shipped from the factory with
the jumpers installed.
Jumper removal Perform the following steps to remove backplane
jumpers:
switching
card in-
w105 Connect Bank C LO to Bank D LO w104 ConnectBankCHItoBankDHl
Referring to Figure 3-l for jumper locations, perform the following steps to install bank-to-bank jumpers:
1. If mated together, separate the relay card from the comector card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.
2. Refer to Figure 32 and Table 31 to determine which jumpers to install.
3.
Using Figure 3-3 as a guide, install the jumpers on the appropriate terminal pairs.
1. If mated together, separate the relay card from the connector card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.
2. Use Figure 3-4 to locate the jumper(s) that are to be removed.
3. It is not necessary to physically remove the jump­ers from the PC board. Using a pair of wire cutters, cut one lead of each jumper.
3-3
Card Connections & Installation
:umper installation
Referring to Figure 3-4 for jumper locations, perform the following steps to install backplane TOW jumpers:
1. If mated together, separate the relay card from the connector card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.
2.
Physically remove a cut jumper by unsoldering it from the PC board.
3.
Install a new #22 AWG jumper wire o(eithley P/N J-15) and solder it to the PC board.
4.
Remove the solder flux from the PC board The cleaning pmcedure is explained in paragraph 5.2.
e
a..
. . .
:::
. . .
. . .
. . .
. . .
. . .
. . .
. . .
. . .
. . .
.,*
. . .
. . .
0
;~
I
Figure 34 Backplane jumpers
7011 Relay
Card
3.3.3 Screw terminal connector card
The screw terminal connector card is shown in Figure
3-5.
Connections are made directly to the screw termi­nals of the twelve terminal blocks. Each screw terminal will accommodate #X-22 AWG wire.
3-4
Figure 3-5 Mode/ 7077 screw terminal connector card
Wiring procedure Perform the following procedure to wire circuitry to
the screw terminal connector card:
WARNING
Make sure all power is off and any stored energy in external circuitry is discharged.
1.
Jf mated together, separate the connector card from the relay card by removing the mounting screw and pulling the two cards away from each other. Remember to only handle the cards by the edges and shields to avoid contamination.
2.
Using an insulated screwdriver, connect the cir­cuitry to the appropriate terminals. Figure 3-6 shows how the output of Bank A would be con­nected to a DMM.
3.
Referring to Figure 3-7, remove the top half of the cable clamp as follows:
A. Loosen the cable clamp screw enough to disen-
gage it from the bottom half of the cable clamp.
B. Using your thumb and forefinger, press the re-
taining clips inward and, with your other hand, remove the top half of the clamp.
4.
Route wires under wire guide/connector shim.
5.
Route the wires through the bottom half of the ca-
ble clamp.
6.
Replace the top half of the clamp. It simply snaps onto the bottom half of the clamp. lighten the ca-
ble clamp screw. The clamp serves as a strain relief
for terminal block wires.
7.
Mate the connector card to the relay card. The Model 7011 is now ready to be installed in the Model 7001 mainframe. See paragraph 3.5 for de­tails.
Figure 3-6
Typical screw
Figure 3-7
Cable clamp for screw terminal
terminal connections
Clips \
connector
card
3-5
3.3.4 Multi-pin (mass termination) connec­tor card
Since comections to external circuiq are made at the 96-pin male DIN bulkhead connector, there is no need to separate the connector card from the relay card. If the connector card is separated from the relay card, carefully mate them together and install tlw supplied
440 mounting screw. Make sure to handle the cards by
the edges and shields to avoid contamination.
Terminal identification for the DIN connedor of the
multi-pin connector card is provided by Figure 3-8.
This connector will mate to a 96-pin female DIN con-
nector.
Keithley has a variety of cable and connector accesso­ries available to accommodate connections from the
connector card to test instrumentation and DUT (de­vices under test). In general, these accessories, which are summarized in Table 3-2, utilize a round cable as­sembly for connections.
Table 3-2
Mass termination accessories
Model 7011-m-R
7011~ME-2
7011~MTR
1
Description 96pin female DIN connector and
housing for round cable. Two-meter round cable assembly
terminated with a 96-pin female DIN comwctor on each end.
96-pin male DIN bulkhead con­nector.
3-6
Pins of the Model 7011-C mass termination connector can be identiiied in one of three ways:
1. Mux terminal, consisting of banks A-D and inputs l-10.
2. Connector description. consisting of rows a-c and columns l-32.
3. Schematic and component layout designation (l-96).
The following pinout diagrams show the correspondence between these arrangements:
3231302928273~*25*423~221*0191~1716151413121110 9 8 7 6 5 4 3 2 1
l . . . . . . ..*.....*....*...........
Card Connections & hstahtion
View from
pin
side
of connector
3-7
Card Connections & /nm//arion
Typical connection techniques All external circuitry, such as instrumentation and
DLJTs, that you wish to connect to the multiplexer card must be terminated with a single 9&pin female DIN coMecror. The following coxlnection techniques pro­vide some guidelines and suggestions for wiring your circui&y.
WARNING
Before beginning any wiring proce-
dures, make sure all power is off and any stored energy in external circuit­ry is discharged.
NOTE
External circuitry should be connected
,7ed id only wirh the 7001’s
(I
e1
after the Model 7011 assembly is
pow-
in:;slled in the Model 7001 main­frame. Installation is covered in para­graph 3.5.
Output relays- The multi-pin connector card uses a relay for each of the four output banks. These output relays are normally open to prevent any hazardous voltages (via the mainframe backplane) from appear­ing cm the pins of the rw.le DIN connector. The output relays will only close when the Model 7011~MTC-2 ca-
ble assembly is connected to card. If building you own
cable assembly, you must make sure that it shorts pins
la to lb of the card ccmnector (Figure 3-8) when it is mated to the card. Shorting pins la to lb allows the output relays to close.
Round cable assemblies -Figure 3-9 shows typical round cable connection techniques using accessories
available from Keithley.
In Figure 3-9A,
connections
are accomplished using a Model 7011 h4TC-2 cable and a Model 7011~MTR bulk­head connector. The two-meter round cable is termi­nated with a 96-pin female DIN connector at each end. This cable mates directly to the multi-pin connector card and to the bulkhead connector. The bulkhead con­nector has solder cups to allow direct connection ia in­strumentation and DUT. Figure 3-10 provider rhe pinout for the bulkhead connector.
In Figure 3-9B, connections are accomplished using a Model 7011 MTC-2 cable assembly that is cut in half. The 96-pin female DIN connector on one end of the ca­ble mates directly to the multi-pin connector card. The unterminated end of the cable is wired directly to in­strumentation and DUT. The other half of the cable as­sembly could be used for a second switching card.
In Figure 3-9C, connections are accomplished using a custom-built cable assembly that consists of a Model 7011~KlT-R connector and a suitable round cable. Hita­chi cable part number N28!?‘-P/D-50TAB is a 5O-con­ductor cable. Two of these cz~les can be used to supply 100 conductors.The connector has solder cups to ac­commodate the individual wires of the unterminated cable. Figure 3-11 provides an exploded view of the connector assembly and shows how the cable is con­nected. The connector end of the resultant cable assem-
bly mates directly to the multi-pin connector card. The
unterminated end of the cable assembly is wired di-
rl?crly to inshumen tation and DIJT.
3-8
Figure 3-9
Typical round cable connection
techniques
3-9
Note : See Figure 3-6 for terminal
identification.
Figure 3- 10 Model 7011 -MTR connector pinout
View from solder cup side of
0
connector
Figure 3- 11 Model 707 I-KIT-R (with/cable) assembly
3-10

3.4 Typical connection schemes

The following information provides some typical con­nection schemes for single card, two-card and two­mainframe system schemes for the multi-pin connector card use some of the techniques presented in paragraph 3.3.2. Keep in mind that these are only examples to demonstrate var­ious ways to wire a test system. Connection details for both connector cards (multi-pin and screw terminal connector cards) are provided in paragraph 3.3.
3.4.1 Single card system
configurations. connection
using the Model 7011~h4TC-2 round cable assembly. This cable mates directly to both the external bulkhead connector and the Model 7011-C multiplexer card as­sembly. Notice that the bulkhead connector is shown mounted to a fixture to help keep the cabling stable during the test.
The single card system in Figure S13 is identical to the system in the previous illustration, except for the con­nection scheme. The system in Figure 3-13 uses the screw terminal connector card. With this card, single conductor connectional are made directly from the ter­minal blocks of the connector card to instrumentation and DLlTs.
Figure 3-12 shows how external connections can be made to a single card system that uses the multi-pin comvxtor card. This single card system is configured as two 1 x 20 mtitiplexers. To accomplish this, the ap­propriate bank-to-bank jumpers must be installed to connect Banks A and B together and Banks C and D tw gether.
Instrumentation and DUTs are hard-wired to the Mod-
el 7011~MTR male bulkhead comwctor. ‘Ibis connector has solder cups that will accept wire size up to #24 AWG. The test system is connected to the multiplexer
When using a single card system, you will want to
make sure that the card remains elwtrically isolated from any other switching cards. There are several ways to ensure isolation for a single card in the Model 7001 mainframe:
1. Vacate the other mainframe slot. If there is a Model
701X
card installed in the other slot, remove it.
2. Remove the backplane jumpers on the multiplexer card. This will disconnect the card from the analog backplane of the mainframe.
3.
Remove the backplane jumpers from the switching card installed in the other slot.
3-11
Figure 3- 12
Single cardsystem example (multi-pin connector card)
3-l 2
mdB _
Card Connections & Insrallation
--...- -
I
1
Simplified Equivalent Circuit
2nd D
(Dual 1x20)
I
1
DUT Test Fixture I
Notes: Bank-to-bank jumpers installed
Figure 3-13 single card system example (screw terminal connector card)
3-13
3.4.2 Two-card system
Both Figure 314 and Figure 315 show a system using two multiplexer cards installed in one Model 7001 mainframe to configure a single 1 x 80 multiplexer sys­ten Each card is conf?gured as a single 1 x 40 multi­plexer. To accomplish this, all bank-to-bank jumpers
(both cards) are installed to connect Banks A, B, C, and D together. By leaving the backplane jumpers of both cards installed, the banks of Card 1 are connected to the banks of Card 2 through the analog backplane of the Model 7001 mainframe resulting in the 1 x SO con@­ration.
Figure 314 shows how external connections can be made for the multi-pin connector cards. In this exam­ple, a single Model 7011-h4TC-2 round cable assembly is cot in half to provide two cables, each of which is on-
terminated at one end. The unterminated ends of the
two cables are hard-wired to the instrument and DLJT
as shown in the &awing. The other ends of these cables
mate directly to the Model 7011-C multiplexer card as-
semblies.
Figure 315 shows how external connections can be
made for the screw terminal connector card. Single
conductor conneclions are made directlv from the
saew terminals of the connector card to the~%Inzrnent
and DUT.
3.4.3 Two-mainframe system
system. Each card is con6gured as a single 1 x 40 mul-
:I, .gplexer. To accomplish this, bank-to-bank jumpers of
fall three cards must be installed to connect Banks A, B,
L’ C, and D together.
By leaving the bac!+me jumpers of the cards in main­fmme #l installed, the banks of Card 1 are connected to the banks of Card 2 through the analog backplane of the Model 7001 mainframe resulting in a 1 x 80 config­uration. External bank connections from the instru­ment to the card in the second mainframe connect the
banks of all three cards together to form the 1 x 120
multiplexer system. This system is similar to the TWW card System (see previous paragraph) except that a third multiplexer card (installed in a second main­frame) is added.
Figure 316 shows the connection scheme for the multi­pin connector cards. External circuit connections to the Model
7001
#l
mainframe
are identical to the ones
used for the Two-card System. The third multiplexer
card (installed in Model 7001 #2 mainframe) shows
how a custom-built cable can be used to make
connec-
tions to external circuiq. A suitable round cable can be
constructed using a 96-pin female DIN connector (Model 7011~KIT-R) with two lengths of Hitachi cable P/N N28Ll7-P/D5OTAB. This cable contains 50 con­ductors; two lengths provide 100 conductors. This ca­ble will mate to the Model 7011-C multiplexer card assembly. The unterminated end of the cable is con­nected directly to the inaument and DUT. Notice that the bank conneciions for the third multiplexer card are made at the inskumenis.
Both Figure 316 and Figure 317 show a system using three multiplexer cards installed in two Model 7001 mainframes to contigure a single 1 x 120 multiplexer
3-14
Figure 317 shows connections for the screw terminal
connector card. Single conductor connections are made directly from the screw termimds of the connector card to the instrument and DUT.
Figure 3-14 TWO-card system example (multi-pin connector card)
DUT Test Fixture
3-15
DUTTest Fixture
Simplified Equivalent Circuit
Figure 3-75 Two-card system example (screw terminal connector card)
I
3-16
Card Connections & installation
DUT Test Fixture
1
,O,l-K”-R
40 41
DUT Test Fixture
Figure 3- 16
Two-mainhme
system example
Simplified Equivalent Circuit
(multi-pin connector card)
3-17
Simplified Equivalent Circuit
Figure 3- 17
Two-mainframe system example (screw terminal connectOr card)
3-l 8
3.5 Model 7011 installation and re­moval
This paragraph explains how to install and remove the
Model 7011 multiplexer card assembly froti tlw Model 7001 mainframe.
WARNING
Turn off power from all instmmenta­tion (including the Model 7001 main-
frame) and disconnect their line
cords. Make sure all power is re­moved and any stored energy in ex­ternal circuitry is discharged.
WARNING
Instdlation or removal of the Model 7Oll is to be performed by qualified service personnel. Failure to recog­nize and observe standard safety pre­cautions could result in personal injury or death.
NOTE
If using the screw terminal connector card, make sure your external circuit­xy is wired to the card (as explained in paragraph 3.3.1) before installing the card assembly in the Model 7001 mainframe.
CAUTION
To prevent contamination to the mul­tiplexer card that could degrade per­formance, only handle the card assembly by the edges and shields.
1. Mate the connector card to the relay card if they are separated. IInstall the supplied 4-40 screw at the end
of the card to secure the assembly. Make sure to han­dle the cards by the edges and shields to prevent contamination.
2. Facing the rear panel of the Model 7001, select the slot (CARD 1 or CARD 2) that you wish to install the card in.
3. Referring to Figure 3-18 for Model 7011-C installa­tion, or Figure 3-19 for Model 7011-S installation, feed the multiplexer card assembly into the desired slot such that the edges of the relay card ride in the rails.
4. With the ejector -in the unlocked position, puSh the card assembly all the way into the mainframe until the - engage into the ejector cups. Then push both arms inward to lock the card into the mainframe.
5. For the 7011-C, also install the screw shown in Fig­ure 3-18.
Multiplexer card removal
Multiplexer card installation Perform the following steps to install the multiplexer
card assembly in the Model 7001 mainframe:
To remove the muXiplexer card assembly, first unlock it by pulling the latches outward, then pull the card as­sembly out of the mainframe. Remember to handle the card assembly by the edges and shields to avoid con­tamination that could degrade performance.
3-l 9
3-18 7011-C card installation in Model 7001
Ejector Arms (2)
3-20
Figure 3- 19 7011~scardinstallation in Model700]
3-21

Operation

4.1
The information in this section is formatted as follows:
4.2
4.3
4.4
4.5

Introduction

Power limits: Summarizes the maximum power limits of the Model 7011 multiplexer card assem-
bly.
Mainframe control of multiplexer card: Summa­rizes prognmming steps to control the multi-
plexer card from the Model 7001 Switch System
mainframe. Multiplexer switching examples: Provides some
typical applications for using the Model 7011. Measurement considerations: Reviews a mm-
ber of considerations when using the Model 7011 to make measurements.

4.2 Power limits

CAUTfON
To prevent damage to the card, do not exceed the maximum signal level specifications of the card.
Maximum signal levels
To prevent overheating or damage to the relays, never exceed the following maximum signal levels:
IlOV between any two pins (temi­II&), 1A switched, 30VA (resistive load).
125V rms or 175V AC peak be-
tween any two pins (terminals), 1A
switched, 60VA (resistive load)
4.3
DC signals:
AC signals:

Mainframe control of multiplexer card

The following information pertains to the Model 7011 multiplexer card. It assumes that you are familiar with the operation of the Model 7001 mainframe.
If you are not familiar with the operation of the main­frame, it is recommended that you proceed to Getting Started (Section 3) of the Model 7001 Instruction Man­ual after reading the following infomu.tion.
4-1
4.3.1 Channel assignments
The Model 7001 has a cbamel status display (Figure 4
1) that provides the real-time state of each available
channel. The left portion of the display is for slot 1
(Card I), and the ri&t portion is for slot 2 (Card 2).
Multiplexer organization of the channel status display for each slot is shown in Figure 4-2. The card contains 40 channels and is made up of four banks (Bank A, B, C, and D) of 10 multiplexer inputs as shown in the il­1UStiatiOII.
To control the multiplexer (mux) card from the main­frame, each multiplexer input must have a unique
7001 Display
CHANNEL assignment which includes the slot num­her that the card is installed in. The CHANNE
L assign-
ments for the multiplexer card are provided in Figure
4-3.
Each CHANNEL assignment is made up of the slot designator (1 or 2.) and the multiplexer channel. To be consistent with Model 7001 operation, the slot designa-
tor and nwx input are separated by exclamation points (!). Some examples of CHANNEL assignments are as
follows: CHANNEL l!l = Slot 1, Cbamel 1 (Input 1 of Bank A)
CHANNEL 1!40 = Slot 1, Channel 40 (Input 10 of Bank D) CHANNEL 2!23 = Slot 2, Channel 23 (Input 3 of Bank C) CHANNEL 2!36 = Slot 2, Input 36 (Lnput 6 of Bank D)
CARD 1
CARD 2
4-2
Display organization for multiplexer channels
Operation
A. Slot 1 (Card 1) 1
B. Slot 2 (Card 2) 1
Examples
: 1!18 =
Slot 1, Channel 18 (Input 8, Bank B)
2!36 = Slot 2.
Figure 4-3 Model 7011 programming channel assignments
Channel 38
&xut 6. Bank Db
4-3
4.3.2 Front panel control
Closing and opening channels A multiplexer channel is closed from the front panel by
simply keying in the CHANNE L assignment and pressing CLOSE. For example, to close channel 36 (In­put 6 ,ef Bank D) of a multiplexer card installed in slot 2, key in the following channel list and press CLOSE:
SELECT CHANNELS 2!36
The above closed channel can be opened by pressing OPEN or OPEN ALL. The OPEN key opens only the channels specified in the channel list, and OPEN ALL opens all channels.
The following display is an example of a channel list that consists of several channels:
A manual scan can be performed by using the RESET default conditions of the Model 7001. RESET is selected from the SAVESETUP menu of the main MENU. When
,,#,&%T is performed, the mainframe is configured for
:%-ii inbite number of manual scans. The first press of
STEP takes the mainframe out of the idle state. The next press of SlXP will close the first cbamel specified in the scan list. Each subsequent press of STEP will se­lect the next channel in the scan list.
4.3.3 IEEE-488 bus operation
Bus operation is demonstrated using HP BASIC 4.0. The prclgr
amming statements assume that the primary
address of the mainframe is 07.
Closing and opening channels
SELECT CHANNELS 2!1,2!3,2!22-2!25
Notice that channel entries are separated by convnas
6). A com~,a is inserted by pwsing JZNTER or the right
cursor key D ). The channel range is qxcified by using
the hyphen (-) key I separate the range limits. Press-
ing CLOSE will cl@> r all the channels specified in the
&me’i
list. Pressing OPEN (or OPEN ALL) will open
the channels.
Scanning channels
Multiplexer channels are scanned by matig a scan
list and con+ring the Model 7001 to perform a scan. The scan list is created in the same manner as a channel list (see Closing and opening Channels). However, the San list is specim l%n the %Kx.N CHANNEL” dis­play mode. )The SCAN LIST key toggles between the channel list and the scan list.) The following shows an
example of a scan list
SCAN CHANNELS 2!1,2!3,2!21-2!25
The following SCI’I commands are used to close and open channels:
:CLOSe <lisfi
:Ol’EN <list> I ALL
ne folkming statement closes channels 1!1, and 1!3 through 1!11:
OlJ-mJT 707; “:dos (@ 1!1,1!3:1!11)”
Notice that the colon (:) is used to separate the range hits.
Eiti of the following statement5 will open channels l!?. .d 1!3 throl.@ l!ll:
0uTMlT 707; “mpen (@ l!l, 1!3:1!11)”
OUTPUT 707; “:opf?n alY
Scanning channels
When a scan is performed, the &am& specified in the scan list will be scanned in the order that they are pre­sented in the scan list.
4-4
There are many commands associated with scanning. However, it is possible to configure a scan using as llt­tie as four corNnan
ds. These commands are listed as
follows:
%ST :TRIGger:SEQuence:COLNt:ALITo ON” :ROUTe:SCAN clistz :DJIl-
Line5 opensallchanneL5.
Line25 Sets a l/4 second delay after each channel
closes.
The first command resets the mainframe to a default scan configuration. The second command automatical­ly sets the channel count to the number of channels in the Scan List, the third command defines the Scan List and the fourth command takes the Model 7001 out of the idle state.
The following program will perform a single scan
through all 40 channels of a multiplexer card installed
in slot 1:
10 ouTI?uT 707; “%w’
20 OUTPUT 707; 30 OUTPUT 707;“:scan (@1!1:1!40)”
40 0uTMlT707;“:ini~
50
END
“:&ig:seqxoun:aufo on-
Line 10 Selects a default conQuration for the scan. Lie 20 Set.5 ckannd count to the scan-list-length.
Line30 Definesthescml.ist.
Line 40 Take the Model 7001 out of the idle state. The
scan is coniigmd to start as soon as this command is executed.
When the above program is run, the scan will be com­pleted in approximately 240 milliseconds (3msec delay
for each relay close and a 3msec delay for each open),
which is too fast to view from the front panel. An addi-
tional relay delay can be added to the program to slow down the scan for viewing. The program is modified
by adding line 25 to slow down the scan. Also, Line 5 is
added to the beginning of the program to ensure that all channels are open before the scan is started.

4.4 Multiplexer switching examples

This paragraph presents some typical applications for the Model 7011. These include resistor testing, transis­tor testing, and resistivity testing, which shows how to use the Model 7011 with a matrix card (Model 7012).
4.4.1 Resistor testing
The Model 7011 can be used to test a large number of resistors using only one test instnunent or group of in­struments. Such tests include two-wire and four-wire resistance measurements using a DMM, and low-resis­tance measurements using a current source and sensi­tive digital voltmeter, as discussed in the following paragraphs.
Two-wire resistance tests Figure 4-1 shows a typical test setup for making two-
wire resistance measurements. The Model 7011 card provides the switching function, while the resistance mea.sUTements are made by a Model 199 DMM. Since
only two-pole switching is required for this applica­tion, one Model 7011 card can be used to switch up to 40 resistors (additional multiplexer banks can be add­ed, if desired, by adding more cards).
Accuracy of measurements can be optimized by mini-
mizing sway resistance.
5 OUTPW 707;
10
0IJTmT707;“*RsY 20 OUTPUT 707; 25 OUTPU’I 707; 30 0uTruT707;“:scan (@ 1!1:1!40)” 40 0InPuT707; “:W 50 END
“:open alY “:trig:seq:coun:auto on”
“:trigzdelO.Z5”
Make connecting wires as short as possible to mini­mize path resistance. Another technique is to short one of the multiplexer inputs, close the shorted channel and then enable the DMM zero feature to cancel path resistance. Leave zero enabled for the entire test.
4-5
1
I I I I I I
_I
A. Test Configuration
I I I
L---J L----l
199 DMM
8. Simplified Equivalent Circuit
Figure 4-4
Z-wire resistance testing
Four-wire resistc tests
More precise measurements over a wider range of sys-
tem and DIJT conditions can be obtained by using the four-wire measurement scheme shown in Figure 45.
Here, separate sense leads from the Model 196 DMM
are routed through the multiplexer to the resistor un-
der test. The extra set of sense leads minimizes the ef-
fects of voltage drops amoss the test leads. Note, however, that an extra two poles of switching are re­quired for each resistors per card can be tested using this configura-
tiOIL
The Model 7011 can be configured for 20 channels of 4 pole operation by isolating Banks A and B from Banks C and D, and by programming the Model 7001 main­frame for 4pole mode. The resulting pa&d channels are shown in Table 4-1.
resiStor tested.
I I
7011
L---l
Dlrr
For this reason, only 20
I
Table 4-1
Paired
Channels in &pole Operation
7001
CHANNEL p&ill CONlWtiOXl assignment 4-p&
1 land21 BankA,Inl and
2
3
4
5
6
7
8
9 9and29 BankA,ln- znd
10 10 and 30 BankA,InlOand
11 11 and 31 BankB,Inl and
12 12 and 32 BankB,InZand
13 13and33 BankB,In3and
14
15
16 ~‘. 5 and 36 BankB,ln6and
17
18
19
20
Channel
designations
BankC,Inl
2and22 BmkA,LnZand
BankC,In2
3and23 Bank A, In 3 and
BankC,In3
4and24 BmkA,In4and
BankC,In4
5and25 BankA,In5and
BankC,In5
6and26 BmkA,In6and
BankC,Ino
7and27 BankA,ln7and
BankC,In7
8and28 BankA,InSand
BankC,In8
BankC,In
BankC,lnlO
BankD,Inl
Ban!cD,InZ
BankD,In3
14and34 BankB,In4and
BmlcD,In4
15
and 35 BankB,In5and
BankD,Ln5
BankD,In6
17and37 BankB,In7and
BankD,In’/
18 and 35 BankB,InSand
BankD,In8
19 and 39 BankB,Ingand
BankD,In9
2Oand40 BankB,InlOand
BankD,InlO
4-6
Bank jumper removal is described in paragraph 3.3.1. To configure the connector card for 4-p& operation,
only mncwe the jumpers between Banks C and D
i.WlO2
and W103).
Selecting 4-p& operation for a Model 7001 card slot is
discussed in Section 4 of the Model 7001 Instruction
Manual. After the Ppole mode is selected, the Model
7001
mainframe will display just 20 channels for the chosen card slot. Each closed channel will also dose its paired channel on the card.
Although the four-wire connection scheme minimizes
problems caused by voltage drops, there is one other potentially txublesome area associated with low r&s­tance measurements: thermal EM% caused by the re­lay contacts. In order to compensate for thermal EMFs, the offset-compensated ohms feature of the Model 196 DMM should be used. To we this feature, short the HI and LO terminals of one of the bank inputs, then close the relay. Enable zero on the Model 196, then select off-
set-compensated ohms.
A. Test Configmtian
r---i
removed
r---1
L---J L---J
196 DMM
B. aimpmed Eq”ivalent circuit
Figure 4ii
Four-wire resistance testing
7011
L---J
DLn
4-7
Low-level resistance measurements Many times, it is necessary to make resistance mea-
surements with either lower voltage sensitivity or higher currents than are available with ordinary DMMs. Examples of cases where low-level resistance measurements may be necessary include the testing of PC board traces, contacts, bus bars, and low resistance shunts.
Figure 44 shows a typical test con6guation for a
switching system capable of testing a number of low resistance devices. The Model 220 Current Source forc­es current through the device under test, while the
Model 182 Sensitive Digital Voltmeter measures there-
suliing voltage across the device.
Since low voltage levels are being measured, thermal F.MF offsets generated by relay and connector contacts
will have a detrimental effect on measurement accwa-
cy unless steps are taken to avoid them (the Model 7011 has been designed to keep relay EMF at a minimal lev-
el.). Thermal FMF effects can be virtually eliminated by taking two voltage measurements, E, and E,, the first with the current, I, flowing in one direction, and the second with a current, I, of the same magnitude flow­ing in the opposite direction. The resistance can then be calculated as follows:
Note that simply reversing the current source polarity
will result in a 2X accuracy specification change. To
avoid this problem, matrix switching could be added to the test system to reverse the current. See paragraph
4.4.3.
Figure 4-6 Low resistance testing
4-8
L-l
L---J
Dud 1%?B MUX
r---1
I a:G I
L:-:J
r-.--
1
I I
L-1-J
4.4.2 Transistor testing
Typical transistor tests that can be performed with the aid of the Model 7011 include current gain tests, leak­age tests, as well as tests to determine the common­emitter characteristics of the device. The following paragraphs discuss these tesests and give typical equip­ment con@urations for the tests.
Current gain tests The DC or static common-xnitter current gain of a
transistor can be determined by biasing the transistor for a speci6c value of base current, 1~ and then mea­suring the collector current, 1~. The DC common-emit-
ter current gain, p, of the transistor is then determined as follows:
Figure 47 shows the test configuration and equivalent circuit for the current gain test. The Model 224 Current Source is used to source the base current, I,. The Model 730 Voltage Source supplies the collector-emitter volt­age, V,, and the collector current, k, is measured by the Model 196 DMM. Switching among the transistors being tested is, of course, performed by the Model 7011 multiplexer card.
In order to perform the current gain test, the voltage source is f&t set to the desired value of Ve The cur­rent source is then set to a base current value that will result in the desired value of E as measured by the DMh4. The current gain can then be calculated as out­lined above.
In order to reduce errors caused by voltage burden, use a higher current range on the Model 196 DMM. Doing
so will result in the loss of one or two decades of reso lution, but 3 ‘/z or 4 ‘/~-digit resolution wiIl probably be adequate for most situations.
4-9
Model 224
C”ment eowce
A. Test Configuration
B. Simplified Equivalent Circuit
Figure 4-7
Configuration for current gain and common-emitter test
4-l 0
4.4.3 Testing with matrix cards
Operation
Common-emitter characteristics are determined by setting the base current, IB, to specific values. At each IB value, the collector-amitter voltage, v,, is swept across the desired range at specific intervals, and the collector current, b is then measured. When the data are plotted, the result is the familiar family of common­emitter curves (Figure 4-S).
The same test coni%guration that is used for current
gain tests can be used for measuring common-emi~er characteristics. The Model 224 is used to set the base current, I, to the desired values. The Model 230 Volt­age Source provides the collector-emitter voltage, V, and the Model 196 DMM measures the collector cur­rent, IQ
6
F!
4
4
The Model 7011 can be added to a matrix switching system to enhance the test capabilities of that system. The following paragraphs discuss an overall multi­plexer/matrix switching system and also briefly out­line a typical test that can be made with such a system.
Multiplexer and matrix card connections Figure 4-9 shows a typical sy.stem using Model 7012
and 7011 cards together. In this instance, the multiplex­er card is configured as four 1 x 10 multiplexers. Note that rows of the ma&ix card are connected to the banks of the multiplexer card through the analog backplane of the mainframe; no external wiring is necessary to connect the two cards together.
In this application, the DUTs are connected to the bank inputs on the multiplexer card, allowing a large nun­her of DUTs to be switched through the matrix card. Also, the instruments are connected to the columns on the matrix card. This particular configuration is best suited for applications requiring a large number of DIJTs to be connected to several insttuments. In other cases, the test co~guration may call for a large num­her of instnunents and few DUTs. In those situations, the instruments would be connected to the multiplexer
inputs, and the DUTs would be connected to the col-
UItUlS.
0
1 2
3 4 5
VCE , votts
Figure 4-8
Typical common-emitter characteristics
4-11
Bkd@.Jle
Jumpers
L------- ---------- --‘7()0,&p&
7011
M”lti~pr
Figure 4-9 Connecting multiplexer and matrix cards together
General Purpose
B~Ckphll?
Resistivity tests
The general test con6gwation shown in Figure 410 can be used to perform resistivity tests on semiccmduc­tars. Such tests can yield important information such as doping concentratiOn.
As shown in
Figure 410, the Model 7011 switches ten samples for the test. The Model 7012 Matrix card al­lows any device test node to be connected to any in­stmment terminal. The Model 220 Current Source
4-12
forces a current through the DUT, and the Model 196 DMh4 measures the voltage across the device. In order to minimize errors caused by sample loading, the Mod-
d 196
should be used on the 3OOmV or 3V ranges. Also,
resistance values should be 1MQ or less.
In order to perform the tests, a current Wmn the Model
220) is applied to two terminals, and the voltage is measured (by the Model 196) across the two opposite terminals. A
total
of eight such measumnents are re-
quired, as shown in Figure 411.
6. Simplified Equivalent Circuit (One measurement leg shown)
Figure 4-l 0
Resistiviv 2~3 COnfiguratiOn
A. Connections
4-l 3
Operation
Figure 4-l 1 Measurement required for resistivity test
4-14
Once the measurements have been taken, the resistiti-
ty can be calculated. Two values of resistivity, A and B,
are initially computed as follows:
1.133l~,r~(v~+v~-li,-V~)
o* =
I
4.5.1 Path isolation
The path isolation is simply the equivalent impedance between any two test paths in a measurement system.
Ideally, the path isolation should be infinite, but the ac­tual resistance and distributed capadtance of cables and connectors results in less than infinite path isola­tion values for these devices.
1.1331~gr~(v~+v*-v115-v,)
GB =
I
WhW2: o/, and oB are the rssistivities in Q-cm,
ts is the sample thickness in an, V1 through Vs are the voltages measured by the Model
196, I is the current through tlw sample in amperes, f* and fB are geometrical factors based on sample sym-
meby (fA = f, = 1) for perfect symmetry. Once oA and oa are known, the
average resistivity,
oAvG, can be determined as follows:
Path isolation resistance
forms a signal path that is in parallel with the equivalent resistance of the DUT, as shown in Figure 412. For low-to-medium device r&s­tance values, path isolation resistance is seldom a con­sideration; however, it can seriously degrade measure­ment accuracy when testing high-impedance devices.
The voltage measured across such a device, for exam-
ple, can be substantially attenuated by the voltage di­vider action of the device source resistance and path isolation resistance, as shown in Figure 413. Also, leak­age currents can be generated through these resistanc­es by voltage sources in the system.
r----i r _ I I I I I I
I I I
L----J L-_--J l--Z--.
Dur
__-_ ----
I I I I 1
I I
MUX Measure
Card Instrument
1
1
I I

4.5 Measurement considerations

Many memmments made with the Model 7011 are subject to various effects that can seriously affect low­level measurement accuracy. The following para-
graphs discuss these effects and ways to minimize them.
RDw = Source Resistance of DUT
E
em = Source EMF of DUT
RpAm = Path Isolation Resistance
RN = Input Resistance of Measuring Instrument
Figure 4-12 Path
isolation resistance
4-l 5
~UJT =
Any differatlal isolation capacitance a&& Ix mea­surement settling time as well as AC measurement ac­curacy. Thus, it is often important that such capacitance be kept as low as possible. Although the distributed ca­pacitance of the matrix card is generally fixed by de-
sign, there is one area where you do have control over the capacitance in your system; the conrwting cables.
To minimize capacitance, keep all cables as short as
possible
4.5.2 Magnetic fields
EDUT bmi
ROUT + bm
produced by various signals such as the AC power line voltage. Large inductors such as power transformers
can generate substantial magnetic fields, so care must
be taken to keep the switching and maswing circuits
a good distance away from these potential noise S0ll.K~.
At high current levels, even a single conductor can gen­crate significant fields. These effects can be minimized
by using twisted pairs, which will cancel out most of the resulting fields.
4.5.3 Radio frequency interference
RFI (Radio Frequency Interference) is a general term used to describe electromagnetic interference over a wide range of t%quencies across the spectrum. Such RFl can be particularly troublesome at low signal lev-
els, but is can also affect measurements at high levels if the problem is of sufiicient severity.
RFI can be caused by steady-state sources such as radio or TV signals, or some types of electrcmic equipment (microprocessors, high speed digital circuits, etc.), or it can result from impulse sources, as in the case of arcing in high-voltage environments. In either case, the effect on the measurement can be considerable if enough of the unwanted signal is present
When a conductor cuts through magnetic lines of force, a very small current is generated. This phenomenon will frequently cause unwanted signals to occur in the test leads of a switcbin.g matrix system. If the conduc­tar has suflicient length, e”en weak magnetic fiekls like those of the earth can mat* sufficient signals to aff& low-level measurements.
Two ways to reduce these effeck are: (1) reduce the lengths of the test leads, and (2) minimize the exposed circuit area. In extreme cases, magnetic shielding may be required. Special metal with high permeability at low flux densities (such as mu metal) is effective at re ducing these effects.
Even when the conductor is stationary, magnetically­induced signals may still be a problem. Fields can be
4-16
RFIcanbe minimized in several ways. The most obvi­ous method is to keep the equipment and signal leads a.5 far away from the RFl source a.5 possible. Shielding the switching ad, signal leads, sources, and measur­ing instrumer,~ will often reduce RFI to an acceptable 1eveL In extreme cases, a specially-constructed screen ro0n-l may be required to !5ufficiently attenuate the ixmbieaome signal.
Many inshuments incorporate internal filtering that may help to reduce RFI effects in some situations. In
some cases, additional external filtering may also be re­quired. Keep in mind, however, that tiltering may have detrimental effects on the desired signal.
4.5.4 Ground loops
when two or more instruments are conneaed together, care must be taken to avoid unwanted signals caused by ground loops. Ground loops usually occur when sensitive instrumentation is connected to other instcw mentation with more than one signal return path such as power lin
e ground. As shown in Figure 414, the re­ding ground loop causes current to flow through the instrument LO signal leads and then back through
power line ground. This circulating current develops a small but undesirable voltage between the LO termi­nals of the two instruments. This voltage will be added to the scnlrce voltage, affecting the accuracy of the mea-
surement.
Ground loops are not nomwlly a problem with insku­mats having isolated LO terminals. However, all in­struments in the test setup may not be designed in this manner. When in doubt, consult the manual for ail in­strumentation in the test setup.
4.5.5 Keeping connectors clean
As is the case with any high-resistance device, the in­tegrity of connectors can be damaged if they are not handled properly. If connector insulation becomes con-
taminated, the insulation resistance will be substantial­ly reduced, affecting high-impedance measurement
pd.%
Oils and salts from the skin can contaminate connector insulators, reducing their resistance. Also, contami­nants present in the air can be deposited on the insala­tar surface. To avoid these problems, never touch the
connector insulating material. In addition, the multi­plexer card should be used only in clean, dry environ­ments to avoid contamination.
Figure 415 shows
how
to
connect several instruments
together to eliminate this type of ground loop problem. Here, only one instrument is connected to power line ground.
Figure 415
Eliminating ground loops
If the connector insulators should become contaminat­ed, either by inadvertent touching, or from air-borne
deposits, they can be deaned with a cotton swab
dipped in clean methanol. After thoroughly cleaning, they should be allowed to dry for several hours in a low-humidity environment before use, or they can be
dried more quickly using dry nitrogen.
4.5.6 AC frequency response
The AC frequency response of the Model 7011 is impor-
tant in test systems that switch AC sign&. Refer to the
spetications at the front of this manual.
4-l 7
5

Service Information

WARNING
The information in this section is in­tended only for qualified service per­sonnel. Some expose you to hazardous voltages that could result in personal injury or death. Do not attempt to perform these procedures unless you are qualified to do so.
of
the procedures may

5.1 Introduction

This section contains information necessary to service
the Model 7011 multiplexer card and is arranged as fol­lows:
5.2
Handling and cleaning precautions: Discusses handling precautions and
card should it become contaminated.
5.3
Perfomance
necessary to determine if the card meets stated
Cpdl~tiOIlS.
verification: Covers the procedures
methods to clean the
5.6 Troubleshooting:
tips for the Model 7011 induding relay replace­ment precautions.
Presents some troubleshooting

5.2 Handling and cleaning precautions

Because of the high-impedance areas on the Model 7011, care should be taken when handling or servicing the card to prevent possible contamination. The fol­lowing precautions should be taken when servicing the card.
Handle the card only by the edges and shields. Do not
touch any board surfaces or components not associated
with the repair. Do not touch areas adjacent to electrical
contacts. When servicing the card, wear clean cotton gloves.
Do not store or operate the card in an environment
where dust could settle on the circuit board. Use dry ni-
trogen gas to clean dust off the board if necessary.
5.4
Special handling of static-sensitive devices: Reviews
static-sensitive devices.
5.5
Principles of operation: Briefly discusses circuit
operation.
precautions necessary when handling
Should it become necessary to use solder on the circuit board, use an OA-based (organic activated) flux. Re­move the flux from the work areas when the repair has been completed. Use pure water along with clean cot­ton swabs or a clean soft brush to remove the flux. Take
care not to spread the flux to other areas of the circuit
5-l
Service information
board. Once the 511x has been removed, swab only the
repaired area with methanol, then blow dry the board with dry nitrogen gas.
After cleaning, the card should be placed in a 50°C low hc: xlity environment for several hours before use.
5.3

Performance verification

The following paragraphs discuss performance verifi-
cation procedures for the Model 7011, inclwling path resistance, offset current, contact potential, and isola­tion.
With the Model 7011’s backplane jumpers installed, the performance veriiication procedures must be per­formed with only one multiplexer card (the one being checked) installed in the Modal 7001 mainframe. These conditions do not apply if the backplane jumpers are
removed.
the side edges. Do not touch the con­nectors, and do not touch the board s.lufaces or components. on plugs and receptacles, do not touch areas adjacent to the electrical contacts.
NOTE
Failure of any performance verifica­tion test may indicate that the multi­plexer card is contaminated. See para­graph 5.2 to clean the card.
5.3.1 Environmental conditions
All verification measurements should be made at an ambient temperature between W and 28OC, and at a relative humidity of less than 70%.
5.3.2 Recommended equipment
CAUTION
Contamination will degrade the per­fo-ce of the card. To avoid con­tamination, always grasp the card by
Table 5-l
Verification equipment
Description Model or part
Table 5-l s-arizes the equipment necessary for per­fo-ce verification, along with an application for each unit.
specifications
Applications
DMM Keithley Model 196 3cm; 0.01% Path resistance
Electrometer w/voltage source Keithley Model 617
lOpA< laOpA;
1.6%
1MlV source;
Offset cumnt, path isola­tion
0.2%
3mv;
Sensitive Digital Voltmeter Triax cable (untermknated) Low thermal cable
Keith@ Model 182 Keithley Model 7025 - offset current Keithley Model 1484 - contact potential
6Oppm Contact potential
(unterminated)
5-2
5.3.3 Multiplexer card connections
The following information summarizes methods that can be used to connect test inshumentation to the two
connector cards. Detailed connection information is
provided in Section 3.
Model 7011-S-Instrumentation
can simply be hard-
wired directly to the screw terminals of the connector
card. Jumper wires should be kept as short as possible.
Model 7011~C-Gne
method to make instrument con­nections to the multiplexer card is by hard-wiring a 96­pin female DIN connector then mating it to the connec­tor on the Model 7011-C. Input and output shorting connections can also be done at the connector. The con­nector in the Model 7011~IQT-R connection kit (see Ta­ble 3-2) can be used for this purpose. Pi identification for the connector is provided by Figure 3-8.
CAUTION
After making solder connections to a
connector, remove solder flux as ex-
plained in paragraph 5.2. Failure to
clean the solder connections could result in degraded petiormance pre-
venting the card from passing verifi-
cation tests.
Before pre-wiring any connectors or plugs, study the following test procedures to fuIIy understand the con­nection requirements.
1.
Turn the Model 7001 off if it is on.
2.
Turn on the Model 196, and a.IIow it to warm up for one hour before making measurements.
3. Connect ail input terminals of Bank A together to form one common terminaI, as shown in Figure 5-
1.
4.
Set the Model 196 to the 3WR range and connect the four test leads to the OHMS and OHMS SENSE input jacks.
5.
Short the four test leads toaether and zero the
Model 196. Leave zero enable: for the entire test.
6.
Connect OHMS Hl and OHMS SENSE HI of the Model 196 to the common terminal (jumper on Bank A inputs). It is recommended that the physi­cal connections be made at inputs 1 and 10 of Bank A, as shown in Figure 5-l.
7.
Connect OHMS LO and OHMS SENSE LO to the HI (H) terminal of Bank A.
8.
Install the Model 7011 in slot 1 (CARD 1) of the Model 7001.
9.
Turn on the Model 7001 and program it
to
close Channel l!l (Bank A, Input 1). Verify that the resis­tance of this path is <IQ.
10.
Open Channel l!l and close Channel 1!2 (Bank A, Input 2). Verify that the resistance of this path is
dL-2.
Using the basic procedure in steps 9 and 10, check
11. the resistance of Bank A HI (H) terminal paths for Inputs 3 through 10 (Channels 1!3 through l!lO).
Turn off the Model 7001 and move the OHMS LO
12. and OHMS SENSE LO test leads to the LO (L) ter-
minal of Bank A.
Repeat steps 9 through 11 to check the LO (L) ter-
13.
minal paths of BankA(ChamveIs l!l through l!lO). Repeat the basic procedure in steps 1 through 13
14. for Banks B through D (Channels l!ll through
1!40).
5.3.4 Channel resistance tests
Perform the f&wing steps to verify that each contact of every relay is closing properly and that the resis­tance is within speciiication.
5-3
Figure 5-l
Path resistance test connections
--i
--H
-L
-H
-L
--H
i HLHL~LHLHL~LHLHiHL~L /
Bank lnptlts
--L I
Model 7011
I &c”ts
5-4
5.3.5 Offset current tests
These tests check leakage current between HI (H) and LO (L) Wfferential offset current) and from HI (H) and LO (L) to chassis (common-mode offset current) of each pathway. In general, these tests are performed by simply me asuring the leakage current with an elec­trometer. In the following procedure, the Model 617 is used to measure the leakage current. Test connections are shown in Figure 5-Z.
Perform the following procedure to check offset cur­rent
Turn the Model 7001 off if if is on, and remove any jumpers or wires connl?cted to the multiplexer card.
Connect the friax cable to the Model 617, but do not connect it to the multiplexer card at this tie.
Turn on the Model 617 and allow the unit to warm up for two hours before testing. After warm up, se­lect the 2M)pA range, and enable zero check and zero correct in that order. Leave zero correct en­abled for the entire procedure. Also, be certain that V-Q GUARD is OFF and ground strap is connect­ed to LO.
Connect the !xiax cable to Bank A HI and LO, as
shown in Figure 5-2A.
5.
Install the Model 7011 in slot 1 (CARD 1) of the Model 7001.
Turn on the Model 7001 and program the unit to
6. close channel l!l (Bank A, Input 1).
7.
On the Model 617, disable zero check and allow the reading to settle. Verify that the reading is <lM)pA. This specification is the offset (leakage) current of the pathway.
Enable zero check on the Model 617 and open
8. Channel l!l from the front panel of the Model
7001.
9.
Repeat the basic procedure in steps 6 through 8 to check the rest of the pathways (Inputs 2 through
10) of BankA(Channels l!Zthrough l!lO).
10.
Turn off the Model 7001 and change the eleckome­ter connections to Bank B.
11.
Repeat the basic procedure in steps 6 through 10 to che& Bank B, Inputs 1 through 10 (Channels l!ll through 1!20).
12.
Repeat the basic procedure in steps 6 through 11 for Banks C and D Khannels 1!21 through 1!40).
Turn off the Model 7001 and change the electrome-
13. ter corm&ions, as shown in Figure 5-2B. Note that eledmmeter HI is connected to HI and LO of the Bank A output, which are jumpered together. Elec­trometer LO is connected to chassis.
Repeat steps 6 through 12 to check that the com-
14. mon mode offset
current is
<loOpA.
5-5
L----.-------------J
A) Differential
Bank outputs
Model 7011
Figure 5-2
Differential offset current test connections
L------------------J
B) Common-Mode
------------_
Bank inputs
Model 7011
5-6
5.3.6 Contact potential tests
These tests check the EMF generated by each relay con-
tact pair (H and L) for each pathway. The tests simply consist of using a sensitive digital voltmeter (Model
182) to
measure
the contact potential.
Perform the following procedure to check contact po-
tential of each path:
1. Turn the Model 7001 off if it is on.
2. Place jumpers between Banks A-B, B-C, and C-D.
3.
Turn on the Model 182 and allow the unit to warm up to achieve rated accumcy.
4.
Place a short between HI to LO on each input
(Channels l-40).
5.
Place a short between HI to LO on output Bank D
(long enough to cut with wire cutters).
6. Connect the Model 182 input leads to HI and LO output Bank A using copper wires.
7.
Install the Model 7011 in the Model 7001 slot 1, and turn the Model 7001 on.
8.
Allow Models 7001,7011 and 182 to warm up for two hours.
9.
Select the 3mV range on the Model 182.
10.
Press REL READING (on the Model 182) to null
out internal offsets. Leave REL READING enabled
for the entire procedure.
11.
Turn the Model 7001 off. Remove the Model 7011 from slot 1. Cut the short on B and D output HI to LO.
12.
Install the Model 7011 in the Model 7001 slot 1, and turn power on.
13.
wait 15 minutes.
14.
Program the Model 7001 to close Channel l!l.
15.
After settling, verify that reading on the Model 182 is <5OOnV (for the Model 7011-S). This measure­ment represents the contact potential of the path­way.
16.
From the Model 7001, open Channel l!l.
17.
Repeat steps 12 through 14 for all 40 channels.
Figure 5-3 Contact potential test connections
Model7011
s-7
5.3.7 Bank and channel-to-channel isolation tests
Bank isolation tests check the leakage resistance be-
tween adjacent banks. Channel-to-channel isolation tests check the leakage resistance between a Bank Out­put connection and a Bank Input connection with an adjacent Bank Input relay closed. In general, the tests are pa-formed by applying a voltage (1OOW across the leakage resistance and then measuring the -nt. The isolation resistance is then calculated as R = V/I. In the following procedure, the Model 617 functions as both a voltage source and an ammeter. In the V/I function, the Model 617 internally calculates the resistance from the known voltage and current levels and displays the resistive value.
Perform the following steps to check bank and chan­nel-to-channel isolation:
1. Turn the Model 7001 off if it is on, and remove any jumpers or test leads conneaed to the multiplexe!r card.
2.
Turn on the Model 617 and allow the unit to warm up for two hours before testing.
3. On the Model 617, select the ZpArange, and enable zero check and zero correct in that order. Leave zero comxt enabled for the entire procedure.
4.
Connect the electrometer to the Model 7011, as shown in Figure 5-4.
5. Install the
Model
7011
in slot 1 (CARD 1) of the
Model 7001 and turn the mainframe on.
6.
On the Model 617, select the 2OpA range and re­lease zero check.
7. On the Model 617, press SUPPRESS to cancel offset current, then enable zero check.
WARNING
The following steps use high voltage (1OOV). Be sure to remove power from the circuit before making con­nection changes.
8.
On the
Model
617,
set the voltage source for +lOOV, and select the 2OnA current range. Make sure the voltage source is in standby.
9. Placethe Model 617 in the b/I measurement func­iion by pressing SHIET OHMS.
10. Prmam the Model 7001 to close Channels 1!1 and l!l;(Bank A, Input 1 and Bank B, Input 2).
5-8
Model7011
11. On the Model 617, disable zero check and press OPERATE to source +lOOV
12. After allowing the reading on the Model 617 to set­tle, verify that it is >lGQ (lOgQ). This measurement is the leakage resistance (bank isolation) between Bank A, Input 1 and Bank B, Input 2.
13. Place the Model 617 voltage source in standby and enable zero check.
14.
Turn
off the
Model
7031
and move the electrometer
connections to Banks B and C.
15.
Install the Model 7011 in slot 1 of the mainframe and tom the Model 7001 on.
16.
Program the Model 7001 to close Channels 1!12 and 1!23 (Bank B, Input 2 and Bank C, Input 3).
17. On the Model 617, disable zero check and press OPERATE to source +lOOV.
18. After allowing the reading on the Model 617 to set­tle, vaify that it is rlGS2 (1O’Q).
19. Place the Model 617 voltage source in standby and enable zero check.
20. Turn off the Model 7001 and move the electrometer connections to Bank C and D.
21.
Install the Model 7011 in slot 1 of the mainframe, and turn the Model 7001 on.
22. Using Table 5-2 as a guide, repeat the basic proce­due of steps 16 through 18 for the rest of the path pairs (test numbers 3 through 9 in the table).
23.
Place the Model 617 voltage source in standby and enable zero check.
NOTE
Refer to for the following procedure to check channel-to-ckannel isolation.
24.
Turn off the Model 7001 and connect the Model 617
to the card as shown in Figure 5-5.
25. Install the Model 7011 in slot 1 of the Model 7001, and turn the mainframe on.
26.
l’rogmm the Model 7001 to close Channel 1!2
CBank A, Input 2). Make sure all other channels are open.
27. On the Model 617, disable zero check and press OPERATE to source 1OOV.
28.
After allowing the reading on the Model 617 to set­tle, verify that it is >lGsL (lOgsZ).
29.
Place the Model 617 voltage source in standby, and enable zero check.
30.
Using Table 5-3 as a guide, perform tests 2 through 9 for the remaining Bank A Inputs. Remember to move Bank Input connections as indicated in the table.
31.
Use Table 5-3 (test numbers 10 through 36) and the
above procedure to test Banks B, C, and D.
Table 5-2
Bank isolation test summary
Test
number
1
2
3
4
5 6 7 8
9 Bank C, Input 9 to Bank D, Input 10
*Assumes Model 7011 installed in slot 1 of mainframe. Programmed as slot (1) and channel.
Bank isolation Test equipment location Bank A, Input 1 to Bank B, Input 2
BankAandBankB l!l and 1!12 Bank B, Input 2 to Bank C, Input 3 BankBandBankC 1!12 and 1!23 Bank C, Input 3 to Bank D, Input 4 BankCandBankD 1!23and1!34
Bank C,
Input 4 to Bank D, Input 5 BankCandBankD Bank C, Input 5 to Bank D, Input 6 BankCandBankD 1!25 and 1!36 Bank C, Input 6 to Bank D, Input 7 BankCandBankD 1!26 and 1!37 Bank C, Input 7 to Bank D, Input 8 BankCandBankD 1!27 and 1!38 Bank C, Input 8 to Bank D, Input 9 BankCandBankD 1!28 and 1!39
BankCandBankD 1!29and1!40
Channels closed*
1
1!24 and 1!35
5-9
Service Information
Figure 5-5 Channel-to-channel isolation test connections
5-10
Table 5-3
Channel-to-channel isolation test summy
Test
number Channel-t o-cbmnel isolation Test equipment location
1 Bank A, Input 1 to Bank A, Input 2
2 3 4 5 6 7
Bank A, Input 2 to Bank A, Input 3 Bank A, Input 3 to Bank A, Input 4 Bank A and Input 3 Bank A, Input 4 to Bank A, Input 5 Bank A and Input 4 Bank A, Input 5 to Bank A, Input 6 Bank A and Input 5 Bank A, Input 6 to
Bank
A, Input 7 Bank A and Input 6
Bank A, Input 7 to Bank A, Input 8 BmkAandInput7 1!8
Bank A and Input 1 1!2 Bank A and Input 2
8 Bank A, Input 8 to Bank A, Input 9 Bank A and Input 8 1!9
9
Bank A, Input 9 to Bank A, Input 10 Bank A and Input 9 l!lO
10 Bank B, Input 1 to Bank B, Input 2 Bank B and Input 1 11 Bank B, Input 2 to Bank B, Input 3 Bank B and Input 2
12 13 14 15 16 17 18
19 20
21
22
Bank B, Input 3 to Bank B, Input 4 Bank B and Input 3 Bank B, Input 4 to Bank B, Input 5 Bank B and Input 4 Bank B, Input 5 to Bank 8, Input 6 Bank B and Input 5 Bank B, Input 6 to Bank B, Input 7 Bank B and Input 6 Bank B, Input 7 to Bank B, Input 8 Bank Band Input 7 Bank B, Input 8 to Bank B, Input 9 Bank B and Input 8 Bank B, Input 9 to Bank B, Input 10 Bank B and Input 9 1!20
Bank C, Input 1 to Bank C, Input 2 Bank C and Input 1 1!22 Bank C, Input 2 to Bank C, Input 3 Bank C and Input 2 Bank C, Input 3 to Bank C, Input 4
Bank C and Input 3
Bank C, Input 4 to Bank C, Input 5 Bank C and Input 4
23 Bank C, Input 5 to Bank C, Input 6 Bank C and Input 5
24
25 26 27
Bank C, Input 6 to Bank C, Input 7 Bank C, Input 7 to Bank C, Input 8 Bank C, Input 8 to Bank C, Input 9 Bank C, Input 9 to Bank C, Input 10
Bank C and Input 6 Bank C and Input 7 1!28 Bank C and Input 8 Bank C and Input 9 1!30
Channel
closed*
1!3 1!4 1!5 1!6 I!7
1!12 1!13 1!14
1!15
1!16
1!17
1!18 1!19
1!23
I!24
1!25
1!26
1!27
1!29
28 29
Bank D, Jnput 1 to Bank D, Input 2 Bank D, Input 2 to Bank D, Input 3 Bank D and Input 2
Bank D and Input 1
30 Bank D, Input 3 to Bank D, Innput 4 Bank D and Input 3 31 Bank D, Input 4 to Bank D, Input 5
32 33 34
Bank D, Input 5 to Bank D, Input 6 BankDandInput5
Bank D, Input 6 to Bank D, Input 7
Bank D, Input 7 to Bank D, Input 8 Bank D and Input 7 35 Bank D, Input 8 to Bank D, Input 9 36 Bank D, Input 9 to Bank D, Input 10
Bank D and Input 4 1!35 Bank D and Input 6 Bank D and Input 8
BankDandInput9
I!32
1!33 I!34
1!36
1!37
1!38 1!39
1!40
5-11
Service Information
5.3.8 Differential and common-mode isola­tion tests
These tests check the leakage resistance (isolation) be­tween HI 0 and LO Q (differ&ial), and from HI @I) and LO CL) to chassis kommon-mode) of every bank and channeL In general, the test is performed by apply­ing a voltage NJOv) ~CXISS the terminals and then mea­suring the leakage current. The isolation resistance is then calculated as R = V/I. In the following procedure, the Model 617 functions as a voltage source and an am­meter. In the V/I function, the Model 617 intemalIy cal­culates the resistance from the known voltage and current levels, and displays the resistance value.
+rform the following steps to check differential and
::ommon mode isolation:
1. Turn the Model 7001 off if it is on, and remove any jumpers and test leads connected to the multiplex-
er card.
2.
Turn on the Model 617 and allow the unit to warm
up for two hours for rated accuracy.
3.
On the Model 617, select the 2pA range, and enable zero check and zero correct in that order. Leave zero correct enabled for the entire procedure.
WARNING
The following steps use high voltage
(100X9. Be sure to remove
power from the circuit before making con­nection changes.
4.
On the Model 617, set the voltage source for +lOOV, and select the 2CGnA current range. Make sure the voltage source is still in standby.
5.
Place the Model 617 in the V/I measurement func­tim by pressing SHFI OHMS.
6. With the Model 617 in standby, connect the elec­trometer to Bank A of the multiplexer card, as shown in Figure 5-6.
7.
install the Model 7011 in slot 1 CARD 1) of the mainframe, and turn the Model 7001 on.
8. Make sure all the relays are open. (press OPEN ALL on the Model 7001.)
9.
On the Model 617, disable zero check, and press olmL4TF. to source 1ooV.
10. After allowing the reading on the Model 617 to set­tle,verify that it is >lGQ (1O’Q). This measurement is the differential leakage resistance (isolation) of BankA.
11. Place the Model 617 in standby and enable zero check
Figure 5-6
Differential isolation test connections
3-12
12. Program the Model 7001 to close Channel 1!1 (BankA, Input 1).
13. On tlw Model 617, disable zero check and press
OPERATE to source +lOOc!
14. After allowing the reading on the Model 617 to set­tle,verifytbatitis&o ~lG~(lOgS&Thismeasure­ment check5 the differential isolation of Input 1.
15. Using Table 5-4 as a guide, repeat the basic proce­dure in steps 11 through 14 to test Inputs 2 through IO of Bank A (test numbers 3 through 11 of the ta-
ble).
16. Use Table 5-4 (test numbers 12 through 42) and the above procedure to test Banks B, C and D.
17. Place the Model 617 voltage source in standby and enable zero check.
Table 5-4
Differential and
r-
Test number
1 2 3 4 5 6 7 8 9
10
11
common-mode
isolation testing
Differential or com-
mon
mode isolation
BankA Bank A, Input 1 Bank A, Input 2 Bank A, Input 3
Bank
A, Input 4 Bank A, Input 5 Bank A, Input 6 Bank A, Input 7 Bank A, Input 8 Bank A, Input 9 Bank A, Input 10
Channel
closed*
None
1!1 1!2 1!3 1!4 1!5 1!6 1!7 1!8 1!9
l!lO
NOTE
Refer to Figure 5-7 for the following procedure to check common mode isolation.
18. Turn off the Model 7001, and connect the electrom­eter to the Model 7011 as shown in Figure 5-7.
19. Repeat steps 4 through 16 to check common mode isolation. Verify that each reading is a1G.Q (lOpQ).
12 13 14 15 16 17 18
19 20 21
22
23 24 25 26 27 28
29 30 31 32 33
34
35 36 37 38
39 40 41 42 43 44
BankB Bank B, Input 1 Bank B, Input 2 Bank B, Input 3 Bank B, Input 4
Bank B, Input 5 Bank B, Input 6 Bank B, Input 7 Bank B, Input 8 Bank B, Input 9 Bank B, Input 10
Bi3llkC Bank C, Input 1 Bank C, Input 2 Bank C, Input 3 Bank C, Input 4 Bank C, Input 5 Bank C, Input 6 Bank C, Input 7 Bank C, Input 8 Bank C, Input 9 Bank C, Input 10
BankD Bank D, Input 1 Bank D, Input 2 Bank D, Input 3 Bank D, Input 4 Bank D, Input 5 Bank D, Input 6 Bank D, Input 7 Bank D, Input 8 Bank D, Input 9 Bank D, Input 10
None
1!11 1!12 1!13 1!14
I!15 1!16 1!17 I!18 1!19 1!20
None
I!21 1!22 1!23 1!24 1!25 1!26 I!27 I!28 1!29 I!30
None
1!31 I!32 1!33 1!34 1!35 I!% 1!37 1!38 1!39 1!40
gxmrmd as slot (1) and charmeL
I
5-l 3
service information
Figure57
Common-mode isolation test connections

5.4 Special handling of static-sensitive devices

CMOS and other high-impedance devices are subject to possible static discharge damage because of the high-impedance levels involved. When handling such devices, use the precautions listed below.
NOTE
In order to prevent damage, assume
that all park are static~ensitive.
Such devices should be transported and handled
1.
only in containers specially designed to prevent or dissipate static build-up. Typically, these devices will be received in anti-static containers made of plastic or foam. Keep these parts in their original containers until ready for installation or use.
2
Remove the devices from their protective contain­ers only at a properly-gCounded workstation. Also, ground yourself with an appropriate wrist strap while working with these devices.
3.
Handle the devices only by the body; do not touch the pins or terminals.
4.
Any printed circuit board into which the device is to be inserted must first be grounded to the bench or table.
5.
Use only anti-static type de-soldering tools and grounded-tip soldering irons.
5-14

5.5 Principles of operation

The following paragraphs discuss the basic operating principles for the Model 7011, and can be used as an aid in troubleshooting the card. The schematic drawing of the card is shown on drawing number 7011-106, locat­ed at the end of Section 6.
5.5.1 Block diagram
Figure 5-8 shows a simplilied block diagram of the Model 7011. Key elements include the relay drivers and relays, as well as the ROM, which contains card ID and conQuration information. These various elements are discussed in the following paragraphs.
5.5.2 ID data circuits
Upon power-up, card identification information each card is read by the mainframe. This ID data in­dudes such information as card ID, hardware settling time, and relay con&uration information.
from
ID data is contained within an on-card EEPROM
W105). In order to read this information, the sequence
described below is performed on power-up.
The IDDATA line (pin 6 of U105) is set
1.
from
high to
low while the IDCLK line (pin 5 of U105) is held
high. This action initiates a start command to the
ROM to kmsmit data serially to the mainframe
(Figure 5-9).
The mainframe sends the ROM address location to
2. be read over the IDDATA line. The ROM then
transmits an acknowledge signal back to the main­frame, and it then transmits data at that location
back to the mainframe CFigure 5-10).
3.
The mainfkame then transmits an acknowledge
signal, indicating that it requires more data. The ROM will then sequentially transmit data after each acknowledge signal it receives.
4.
Once all data is received, the mainframe sends a stop co
mmand, which is a low-to-high transition of the IDDATA line with the IDCLK line held high (see Figure 5-9).
To Mainframe
Figure 5-8 Model 7011 block diagram
+6V, +14.6V
ROM
u105
Relays
I
Relay
Power
Control
0100, QlOl
U106, u107
I User connections 4
3.5V (Steady State)
15.7 (= 100 msec during relay achration)
5-l 5
Service lnfomration
ID CLK
ID DATA -
Figure 5-9 Stat and stop sequences
ID CLK
IDDATA (Data oulpui from mainframe or ROM)
IDDATA
(Dataoutput I
from mainframe
or ROM)
Start
I I
I I
I I
stat Bii
I
I I
I I
I
I\ I
I I
I
I
I
I
I I l/l I
I I
I I I I
Stop
Bit
I
I I
I
x
x
(
I
I
I
I
I
I
Figure510
Transmit and acknowledge sequence
5-l 6
Servfce Information
5.5.3 Relay control
Card relays are controlled by serial data &nmnitted via the relay DATA line. A total of five bytes for each card are shifted in serial fashion into latches located in the card relay driver ICs. The serial data is clocked in by the CLK line. As data overflows one register, it is fed out the Q’S line of the register down the chain.
Once all five bytes have shifted into the card, the STROBE line is set high to latch the relay information into the Q outputs of the relay drivers, and the appro­priate relays are energized (assuming the driver out-
puts are enabled, as discussed below). Note that a relay driver output goes low to energize the corresponding Rhy.
5.5.4 Relay power control
A relay power control circuit, made up of U106, U107,
QlCO, QlOl, and associated components, keeps power dissipated in relay coils at a minimum, thus reducing possible problems caused by thermal EM%.
A power-on safeguard &xit, made up of U114 (a D-
type tlip-flop) and associated components ensures that relays do not randomly energize on power-up and power-down. This circuit disables all relays (all relays are open) during power-up and power-down periods.
The PRESET line on the D-type flip-flop is controlled by the 68302 micmprocessor, while the CLK line of the
D-type tllp-flop is controlled by a VIA port line on the
68302
processor. The Q output of the flip-flop drive
each switch card relay driver IC enable pin (UlO& u104, pin 8).
When the 68302 microprocessor is in the reset mode, the flip-flop PRESET line is held low, and Q out imme-
diately goes high, disabling aU relays (relay driver IC enable pins are high, disabling the relays). After the re set condition elapses (=ZOOmec), PRESET goes high
while Q out stays high. When the first valid STROBE
pulse occurs, a low logic level is clocked into the D type flip-flop, setting Q out low and enabling all relay drivers simultaneously. Note that Q out stays low, (en­abling relay drivers) until the 68302 processor goes into a reset condition.
During steady-state operation, the relay supply~ volt­age, +V, is regulated to +3.5V to minimize coil power dissipation. When a relay is first closed, the STROBE p&e applied to WC6 changes the parameters of there­lay supply voltage regulator, QlOO, allowing the relay
supply voltage, +V, to rise to +5.7V for about lC0msec.
This brief voltage rise ensures that relays close as
quickly as possible. After the 1OOmsec period. has
elapsed, the relay supply voltage (+v) drops back
down to its nominal steady-state value of +3X
5.5.5 power-on safeguard
NOTE
The power-on safeguard circuit dis­cussed below is actually located on the digital board in the Model 7001 main­frame.

5.6 Troubleshooting

5.6.1 Troubleshooting equipment
Table 5-5 summarizes recommended equipment for troubleshooting the Model 7011.
Tab/e 5-5 Recommended troubleshooting equipment
Manufacturer
Description
and model
Multimeter Keithley 196 oscilloscope TEK 2243
Application
Measure DC voltages
View logic waveforms
5-17
Service lnformarion
5.6.2 Troubleshooting access
In order to gain access to the r&y card top surface to measure voltages under actual operation conditions, perform the following steps:
1. Disconnect the connector card from the relay card.
2. Remove the Model 7001 cover.
3. Install the relay card in the CARD 1 slot location.
4. Turn on Model 7001 power to measure voltages (see following paragraph).
5.6.3 Troubleshooting Procedure
Table 5-6 s-aims switch card troubleshooting.
WARNING
Lethal voltages are present within the 7001 mainframe. Some of the pm­cedures may expose you to hazard­ous voltages. Observe standard safety precautions for dealing with live circuits. Failure to do SD could re­suit in personal injury or death.
CAUTION
Observe the following precautions when troubleshooting or repairing the switch card:
To avoid contamination, which could degrade card performance, always handle the card only by the handle and side edges. Do not touch edge
connectors, board surfaces, or com­ponents on the card. Also, do not touch areas adjacent to electrical EOII­tacts on connectors.
Use care when removing relays from the PC board to avoid pulling traces away from the circuit board. Before attempting to remove a relay, use an appropriate de-soldering tool, such as a solder sucker, to clear each mounting hole completely free of solder. Each relay pin must be free to move in its mounting hole before re­moval. Also, make certain that no burrs are present on the ends of the relay pins.
5-18
Table .5d
Troubleshooting procedure
step
1
2 3 4 5 6 7 8 9
10
11
Item/component GND pad
+6V pad +5V pad +14.6V pad +V pad u105, pin 5 U105, pin 6 uloo, pin 7 Uloa, pin 2 UlOO, pin 3 ulooa1o4, pins 10-M
+iwDc
+5vDc +14.6VDC +3.5vDc* IDCLKpulseS
ID DATA pulses STROBE pulse CLK pukes DATA pukes Low with relay energized;
high with relay de-energized.
ChNllent.5
All voltages referenced to digital ground
(GND pad). Relay voltage. Logic voltage. Relay bias voltage. Regulated relay voltage. During power-up only. During power-up only. End of relay update sequence. During relay update sequence only. During relay update sequence only. Relay driver outputs.
L
5-19

Replaceable Parts

6.1 introduction

This seciion contains replacement parts infcmnation,
schematic diagrams, and component layout drawings for the Model 7011.
1.
Card model number 7011
2. Card serial number
3.
Part description
4. Circuit description, if applicable
5. Keithley part number
6

6.2 Parts lists

Parts lists for the various circuit boards are inchded in tables integrated with schematic diagrams and compo­nent layout drawings for the boards. Parts are listed al­phabetically in order of circuit designation.

6.3 Ordering information

To place an order, or to obtain information concerning
replacement park, contact your Keithley representa­tive or the factay (see inside front cover for addresses). When ordering parts, be sure to include the following
information:

6.4 Factory service

If the card is to be returned to Keithky Instnunents for repair, perform the f0lkxvin~
1. Complete the service form at the back of this man­ual and include it with the card.
2 Carefully pack the card in the original pa&kg car-
toll.
3. Write ATENTION REPAIR DEPT on the shipping label.
Note: It is not necessary to return the matrix main-
frame with the card.
b-l

6.5 Component layouts and schematic diagrams

Component layout drawings and schematic diagrams are included on the following pages integrated with the parts lists:
Table2 Parts List, Screw Terminated Connector
Card for 7011-S.
7011-160 Component Layout, Screw Terminated Con-
nector Card for 7011-S.
7011-166 Schematic, Screw Terminated Connector
Card for 7011-S.
Table 1 7011-100 Component Layout, Relay Card for 7011-S
7011-106 Schematic, Relay Card for 7011-S and 7011-
Parts List, Relay Card for 7011-S and 7011-C. and 7011-C. C.
NOTE
The Model 7011 and 7012 use the same relay card, only the connector cards are different.
Table 3 Parts List, Mass Terminated Connector Card
for 7011-c.
7011-170 Component Layout, Mass Terminated Con-
nector Card for 7011-C.
7011-176 Schematic, Mass Terminated tonnector
Card for 7011-C.
6-2
Table 6-1
Relay Board for Model 7011 -S and 701 l-C, Parts List
Circuit Desig.
ClOO-109,118,119 c110,111
Cl12 c113,114 c115-117
J1002,1003 KlOO-139 P2001 QlOO
QlOl RlOO
RlOl R102,103 RlC4 R105 R106,107
Description EJECTOR ARM
ROLL PIN (FOR EJECTOR ARMS) SHIELD SOCKET (FOR U105)
CAP,.lUF,20%,5OV,CERAMIC
CAF,lUF,20%5OV,CERAMIC
CAp,O.OOlUF,2O%,5OOV,CER4MIC CAP,lOUF,-20+100%,25V,ALUM ELEC CAP,l5OPF,lO%,lOOOV,CERAMIC
CONNECTOR, MALE
RELAY, ULTRA-SMALL POLARIZED TF2E-5V CONNECTOR, RIGHT ANGLE MALE TRANS, Nl’N PWR, TIP31, (TO-220AB)
TRANS,N CHAN MOSPOW FET,V11713 (TO-92) RES, 2.49K, l%, l/SW, METAL FILM
RES, l.l5K, l%, l/EW,METALRLM RES, 560,10%, 1/2W, COMPOSITION RES,1K,1%,1/8W,METALFILM
RES,22OK, 5%,1/4W,COMPOSITION OR FILM RES,lOK,5%,1/4W,COMPOSITION OR FILM
Keithley Part No.
7011-301 DP-6-l
7011-305
SO-72 C-365.1
C-237-l c-22-.001 c-31410 c-64-15OP
CS-736-2 RL-149 c-775-1 TG253
TG195 R-88-2.49K
R-8&1.15K R-1-560 R-8%1K R-76220K R-761OK
moo-104 u105 U106 u107
WlOO-107
IC, &BIT SERIAL-IN LATCH DRIVER, 5841A EPROM PROGRAM IC,RETRIG MONO MUITMB,74HC123
IC,AJD SHUNT REGULATOR,TL431CLP
K-536 7011~800-““” IC492
K-677
J-15
25917
2
TC17-100
25917
2
E2
DELETED SO-72.
CHG’D U105 FROM IC-737 TO TC17-100.
25917
KK
6/18/01
TC17-100 BOARD ASS’Y. ORIENT ARROW TOWARDS PIN 1 OF DEVICE.
Table 6-2
Screw Terminal Board for Model 7011 -S, Parts List
Circuit Desig.
J1004,1005,1007 1008,1010,1011, 1013,1014
J1006,1009,1012, 1015
P1002,1003 WlOO-105
Description CABLE CLAMl’
CAPTIVE SCREW (FOR TOP CLAMP) CONNECTOR, JUMl’ER (FOR CS-339-Z) CONNECTOR SHIM (FOR P1002,1003) SHIELD STRIP, P0LYuRETHAiwz (FOR BOTTOM CLAMP)
TOP CLAMF COW, 8 PIN
CONN, 6-PIN
CONNECTOR, 4%PIN, 3 ROWS CONN,BERG, 2 PIN
Keithley Part No.
7011-304-l FA-243-1 CS-476 7011-309 7011-305 2001-345-I 7011-302
E-115-8
TE-115-6
a-748-3 (X-339-2
Table 6-3
Mass Terminated Connector Board for Model 707 7-C Parts List
Circuit D&g.
c101,102 Cl03
CRlOl-105 E101,102 J1004
KlOl-104 P1002,1003 4101-103
Description BRACKET
STANDOFF SHIELD CONNECTOR SHIM CONN,BERG CONNECTOR, JUMl’ER (FOR WlOO-105)
CAP,lUF,20%,5OV, CERAMIC CAP,.luF20%>0V,CERAMIC
DIODE,SILICON,IN4148 m-35)
FERRITE BEAD CONN, 96-PIN, 3 ROWS RLAY, ULTRA-SMALL POLARIZED TF2E-4.5V CONNECTOR, FEMALE TRANS, N CHAN MOSPOW FET, V11713 (TO-92)
Keithley Part No.
7011-307
ST-203-l
7011-311
7011-309 cs339 CS-476
C-237-l C-365-.1
RF-28 CT-8 cs514 RL-162 a-748-3 TG-195
R103,104 R105 R106 R107 R108,llO RlG9 Rlll
UlOl u102
WlOo-105
RES, lM, lo%, 1/2W, COMPOSITION RES, 39,5%, 1/4W, COMPOSITION OR FILM RES,1O,5%,1/4W,COMl’OSITION OR FILM RES,4.99K,l%,l/8W,METALFIL.M RES,lOK,5%,1/4W,COMPOSITION OR FILM RES,1OOK,5%,1/4W,COh4POSITION OR FILM RES,lOK,l%,l/SW,METAL FILM
IC,QUAD 2 INPUT NOR,74HCOZ IC, DUAL COMP,LM393
CONN, BERG,2 PIN
R-l-1M
R-76-39
R-76-10
R-88-4.99K
R-76-10K
R-76-100K
R-8810K
IC-412
IC-343
c-339-2
Service Form
Model No.
Serial No. Date Name and Telephone No. Company
List all control settings, describe problem and check boxes that apply to problem.
Cl Intermittent 0 IEEE failure
m Front panel operational Display or output (check one)
0 Drifts 0 Unstable 0 Overload
0 Calibration only 0 Data required (attach any additional sheets as
Show a block diagram of your measurement system including all instruments connected (whether power is turned on or not). Also, describe signal source.
0 Analog output follows display D Obvious problem on power-up
B All ranges or functions are bad
0 Unable to zero 0 Will not read applied input
0 Certificate of calibration required
necessary)
0 Particular range or function bad; specify 0 Batteries and fuses are OK
0 Checked all cables
Where is the measurement being performed? (factory, controlled laboratory, out-of-doors, etc.)
What power line voltage is used?
Relative humidity?
Any additional information. (If special modifications have been made by the wer, please describe.)
Other?
Ambient temperature7
“F
Keithley Instruments, Inc. lest Instrumentation Croup
28775 Aurora Road Cleveland, Ohio 44139
Printed in the U.S.A.
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