Tektronix 4200-SCS User manual

www.keithley.com
Model 4200-SCS Semiconductor Characterization System
Applications Manual
4200-904-01 Rev. E / June 2008
A GREATER MEASURE OF CONFIDENCE
Model 4200-SCS
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Should you have any questions concerning this Agreem 1-800-552-1115, or write at Keithley Instruments, 28775 Aurora Rd., Solon, Ohio, USA 44139.
warranted during the Warranty Period, as determined in Keithley’s sole discretion (a “Noncon-
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TION UNDER THIS LIMITED HARDWARE WARRANTY IS THE REPAIR OR
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ent, or if you desire to contact Keithley Instruments for any reason, please call
A G R E A T E R M E A S U R E O F C O N F I D E N C E
Keithley Instruments, Inc.
Corporate Headquarters • 28775 Aurora Road • Cleveland, Ohio 44139
440-248-0400 • Fax: 440-248-6168 • 1-888-KEITHLEY (534-8453) • www.keithley.com
03/07
4200-SCS
Semiconductor Characterization System
Applications Manual
©2008, Keithley Instruments, Inc.
All rights reserved.
Any unauthorized reproduction, photocopy, or use the information herein, in whole
or in part, without the prior written approval of Keithley Instruments, Inc. is strictly
prohibited.
TM
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of Keithley Instruments, Inc. Other brand names are trademarks or registered
trademarks of their respective holders.
Document Number: 4200-904-01 Rev. E / June 2008
The following safety precautions should be observed before using this product and any associated instrumentation. Although some instruments and accessories would normally be used with non-hazardous voltages, there are situations where hazardous conditions may be present.

Safety Precautions

This product is intended for use by qualified personnel who recog to avoid possible injury. Read and follow all installation, operation, and maintenance information carefully before using the product. Refer to the user documentation for complete product specifications.
If the product is used in a manner not
The types of product users are:
Responsible body is operated within its specifications and operating limits, and for ensuring that operators are adequately trained.
Operators use They must be protected from electric shock and contact with hazardous live circuits.
Maintenance personnel pe replacing consumable materials. Maintenance procedures are described in the user documentation. The procedures explicitly state if the operator may perform them. Otherwise, they should be performed only by service personnel.
Service personnel are traine personnel may perform installation and service procedures.
Keithley Instruments products are designed for use with electrical sig Category II, as described in the International Electrotechnical Commission (IEC) Standard IEC 60664. Most measurement, control, and data I/O signals are Measurement Category I and must not be directly connected to mains voltage or to voltage sources with high transient over-voltages. Measurement Category II connections require protection for high transient over-voltages often associated with local AC mains connections. Assume all measurement, control, and data I/O connections are for connection to Category I sources unless otherwise marked or described in the user documentation.
the individual or group responsible for the use and maintenance of equipment, for ensuring that the equipment is
the product for its intended function. They must be trained in electrical safety procedures and proper use of the instrument.
rform routine procedures on the product to keep it operating properly, for example, setting the line voltage or
d to work on live circuits, perform safe installations, and repair products. Only properly trained service
specified, the protection provided by the product warranty may be impaired.
nize shock hazards and are familiar with the safety precautions required
nals that are rated Measurement Category I and Measurement
Exercise extreme caution when a shock hazard is prese American National Standards Institute (ANSI) states that a shock hazard exists when voltage levels greater than 30V RMS, 42.4V peak, or 60VDC are present. A good safety practice is to expect that hazardous voltage is present in any unknown circuit before measuring.
Operators of this product must be protected from ele prevented access and/or insulated from every connection point. In some cases, connections must be exposed to potential human contact. Product operators in these circumstances must be trained to protect themselves from the risk of electric shock. If the circuit is capable of operating at or above 1000V, no conductive part of the circuit may be exposed.
Do not connect switching cards directly to unlimited power circuit connect switching cards directly to AC mains. When connecting sources to switching cards, install protective devices to limit fault current and voltage to the card.
Before operating an instrument, ensure that the line cord is con cables, test leads, and jumpers for possible wear, cracks, or breaks before each use.
nt. Lethal voltage may be present on cable connector jacks or test fixtures. The
ctric shock at all times. The responsible body must ensure that operators are
s. They are intended to be used with impedance-limited sources. NEVER
nected to a properly-grounded power receptacle. Inspect the connecting
03/07
When installing equipment where access to the main power cord is restricted, such as rack mounting, a separate main input power
!
disconnect device must be provided in close proximity to the equipment and within easy reach of the operator.
For maximum safety, do not touch the product, test cables, or any other instrument ALWAYS remove power from the entire test system and discharge any capacitors before: connecting or disconnecting cables or jumpers, installing or removing switching cards, or making internal changes, such as installing or removing jumpers.
Do not touch any object that could provide a current path to the co make measurements with dry hands while standing on a dry, insulated surface capable of withstanding the voltage being measured.
The instrument and accessories must be used in equipment may be impaired.
Do not exceed the maximum signal levels of the and as shown on the instrument or test fixture panels, or switching card.
When fuses are used in a product, replace with the same type an
Chassis connections must only be used as shield connections for me
If you are using a test fixture, keep the lid closed while power is applied to the device under test. Safe operation requires th interlock.
If a screw is present, connect it to safety earth ground
The symbol on an instrument indicates that the user should refer to the operating instructions located in the user documentaion.
The symbol on an instrument shows that it can source or measure 10 common mode voltages. Use standard safety precautions to avoid personal contact with these voltages.
accordance with its specifications and operating instructions, or the safety of the
instruments and accessories, as defined in the specifications and operating information,
mmon side of the circuit under test or power line (earth) ground. Always
d rating for continued protection against fire hazard.
asuring circuits, NOT as safety earth ground connections.
using the wire recommended in the user documentation.
00V or more, including the combined effect of normal and
s while power is applied to the circuit under test.
e use of a lid
The symbol on an instrument shows that
The symbol indicates a connection terminal to the equipment frame.
ARNING heading in the user documentation explains dangers that might result in personal injury or death. Always read the
The W associated information very carefully before performing the indicated procedure.
The CAUTION h warranty.
Instrumentation and accessories shall not be connected to humans.
Before performing any maintenance, disconnect the line cord and all test cables.
To maintain protection from electric shock and fire, replacement compon and input jacks - must be purchased from Keithley Instruments. Standard fuses with applicable national safety approvals may be used if the rating and type are the same. Other components that are not safety-related may be purchased from other suppliers as long as they are equivalent to the original component (note that selected parts should be purchased only through Keithley Instruments to maintain accuracy and functionality of the product). If you are unsure about the applicability of a replacement component, call a Keithley Instruments office for information.
To clean an instrument, use a damp cloth or mild, water-based clea directly to the instrument or allow liquids to enter or spill on the instrument. Products that consist of a circuit board with no case or chassis (e.g., a data acquisition board for installation into a computer) should never require cleaning if handled according to instructions. If the board becomes contaminated and operation is affected, the board should be returned to the factory for proper cleaning/servicing.
eading in the user documentation explains hazards that could damage the instrument. Such damage may invalidate the
the surface may be hot. Avoid personal contact to prevent burns.
ents in mains circuits - including the power transformer, test leads,
ner. Clean the exterior of the instrument only. Do not apply cleaner

Table of Contents

1 Graphical Data Analysis and Basic Test Sequencing
SubVt slope .......................................................................................................................... 1-2
Open “default” project .................................................................................................... 1-2
Open “subvt” test and display graph .............................................................................. 1-2
Line-fit analysis .............................................................................................................. 1-3
Modify the line-fit ............................................................................................................ 1-4
Graphical analysis ...............................................................................................................
Open “default” project and “vds-id” test ......................................................................... 1-5
Display and analyze the “vds-id” graph ......................................................................... 1-6
Sequencing tests on a single device ..
Open “default” project ................................................................................................... 1-9
Open “4terminal-n-fet” tests ........................................................................................... 1-9
Modify tests .................................................................................................................. 1-10
Change the execution sequence . Run “4terminal-n-fet” test sequence ...
Save and export test data ............................................................................................ 1-12
2 Advanced Applications
Controlling a switch matrix ................................................................................................... 2-2
KCON setup ................................................................................................................... 2-4
Open KITE and the “ivswitch” project ............................................................................ 2-6
Running test sequences ................................................................................................ 2-7
“connect” test description .......
Sequencing tests on multiple devices
Open “ivswitch” project ................................................................................................ 2-10
Execute the test sequence (Subsite Plan) ................................................................... 2-12
Customizing a user test module (UTM) ...........
Open KULT .................................................................................................................. 2-13
Open the “ki42xxulib” user library ................
Open the “Rdson42XX” user module ........................................................................... 2-15
Copy “Rdson42XX” to “RdsonAvg” .
Open and modify the “RdsonAvg” user module ........................................................... 2-17
Save, compile, and build
Add a new UTM to the “ivswitch” project .........
Test description ............................................................................................................ 2-21
the modified library .............................................................. 2-19
.................................................................................. 1-9
................................................................................ 1-10
......................................................................... 1-11
........................................................................................ 2-9
................................................................................ 2-10
................................................................... 2-12
................................................................ 2-14
............................................................................. 2-16
............................................................ 2-20
. 1-5
3 Controlling External Equipment
Controlling external equipment overview ............................................................................. 3-2
Controlling a CV Analyzer .................................................................................................... 3-5
Connections ................................................................................................................... 3-5
4200-904-01 Rev. E / June 2008 i
KCON setup .................................................................................................................. 3-6
Create a new project ..................................................................................................... 3-7
Add a Subsite Plan ........................................................................................................ 3-8
Add a Device Plan ......................................................................................................... 3-8
Add a UTM .................................................................................................................... 3-9
Modifying the “cvsweep” UTM ..................................................................................... 3-11
Executing the test ........................................................................................................ 3-11
Controlling a pulse generator .............................
Test system connections ............................................................................................. 3-12
KCON setup ................................................................................................................ 3-13
Open the “ivpgswitch” project ...................................................................................... 3-15
Description of tests ...................................................................................................... 3-16
Running the test sequence .......................................................................................... 3-19
Compare the test result
Controlling a probe station ................................................................................................. 3-21
Prober control overview ............................................................................................... 3-22
Test system connections ............................................................................................. 3-23
KCON setup ................................................................................................................ 3-23
Probe station configuration .......................................................................................... 3-26
Open the “probesubsites” project
Open the project plan window ..................................................................................... 3-27
Test descriptions .......................................................................................................... 3-27
Running the test sequence .......................................................................................... 3-31
Test data ...................................................................................................................... 3-32
Running individual plans or test
s .............................................................................................. 3-19
................................................................................ 3-26
s ................................................................................. 3-32
................................................................ 3-12
4 Pulse Applications
Charge Pumping .................................................................................................................. 4-2
CP Procedure ................................................................................................................ 4-2
Charge pumping UTM descriptions ....
amplsweep .................................................................................................................... 4-6
basesweep .................................................................................................................... 4-8
FallTimeLinearSweep .................................................................................................... 4-9
FreqFactorSweep ........................................................................................................ 4-10
FreqLinearSweep ........................................................................................................ 4-12
RiseTimeLinearSweep ................................................................................................. 4-13
Pulse IV ........................................................................................................................
Introduction (PIV-A and PIV-Q) .................................................................................... 4-15
Pulse IV for CMOS: Model 4200-PIV-A ....................................................................... 4-16
PIV-A test connections ................................................................................................ 4-17
Using the PulseIV-Complete project for the first time Pulse IV UTM descriptions .
cal_pulseiv ................................................................................................................... 4-36
vdsid_pulseiv ............................................................................................................... 4-37
Vdid_Pulse_DC_Family_pulseiv .................................................................................. 4-39
...............................................................................................................................
Vgid_DC_Pulse_pulseiv .............................................................................................. 4-43
...............................................................................................................................
vgsid_pulseiv ............................................................................................................... 4-47
scopeshot_cal_pulseiv ................................................................................................ 4-49
...............................................................................................................................
scopeshot_pulseiv ....................................................................................................... 4-51
vdsid_pulseiv_demo .................................................................................................... 4-53
vgsid_pulseiv_demo .................................................................................................... 4-53
scopeshot_pulseiv_demo ............................................................................................ 4-53
........................................................................... 4-6
...... 4-15
.................................................. 4-24
......................................................................................... 4-36
...... 4-42
...... 4-46
...... 4-51
ii 4200-904-01 Rev. E / June 2008
Slow single pulse charge trapping high K gate stack ......................................................... 4-54
Charge trapping procedure .......
Charge Trapping UTM descriptions .................
chargetrapping_single_pulse_slow ..................
................................................................................... 4-55
............................................................ 4-58
............................................................ 4-58
AC stress for WLR ............................................................................................................. 4-61
Q-Point Pulse IV – Model 4200-PIV-Q ...............
................................................................ 4-64
What is the PIV-Q Package? ....................................................................................... 4-64
Target applications and test projects ........................................................................... 4-64
PIV-Q Test Procedure .................................................................................................. 4-65
Interconnect Assembly Procedure ............................................................................... 4-66
...............................................................................................................................
Using the Model 4200
Running AutocalScope ....................................
Project QPulseIV-Complete for the first time ........................... 4-70
............................................................ 4-71
...... 4-69
Running CableCompensation ...................................................................................... 4-71
PIV-Q user libraries ...................................................................................................... 4-77
Pulse adapters, cables, hardware and PCU ......
.............................................................. 4-118
Flash Memory Testing ...................................................................................................... 4-119
Introduction ................................................................................................................ 4-119
Theory of operation .................................................................................................... 4-119
FLASH Connections .................................................................................................. 4-132
Flash Projects ............................................................................................................ 4-140
4200-904-01 Rev. E / June 2008 iii
iv 4200-904-01 Rev. E / June 2008

List of Figures

1 Graphical Data Analysis and Basic Test Sequencing
Figure 1-1 Graph for the “subvt” test .................................................................................................. 1-2
Figure 1-2 Open Formulator window .................................................................................................. 1-3
Figure 1-3 Formulator for “subvt” test ................................................................................................. 1-3
Figure 1-4 Start and stop points for the line-fit.................................................................................... 1-4
Figure 1-5 Changing the STOPI value................................................................................................ 1-4
Figure 1-6 Modified line fit ..............................................................................................................
Figure 1-7 “vds-id” graph ................................................................................................................
Figure 1-8 Tools menu access to Graph Settings.................
Figure 1-9 Graph Settings .................................................................................................................
Figure 1-10 Cursors window................................................................................................................
Figure 1-11 Initial Cursor position.....................................................................................................
Figure 1-12 Graph with Cursors ...........................................................................................................
Figure 1-13 Project Navigator — “4terminal-n-fet” tests .. Figure 1-14 “4terminal-n-fet” tests opened in W
Figure 1-15 Device Plan window for “4terminal-n-fet” ........
Figure 1-16 New order for test sequence table .................................................................................. 1-11
Figure 1-17 Project Navigator — new execution sequence
Figure 1-18 “4terminal-n-fet” selected to run................
Figure 1-19 Saving test data.............................................................................................................
orkspace..................................................................... 1-9
.............................................................. 1-6
..................................................................... 1-9
................................................................ 1-10
................................................................ 1-11
...................................................................... 1-11
.... 1-5
.... 1-6
. 1-7 . 1-7
.... 1-8
1-8
.. 1-12
2 Advanced Applications
Figure 2-1 Devices connected to 707A switching matrix .................................................................... 2-3
Figure 2-2 Add a switch matrix to the system configurat
Figure 2-3 Add a test fixture to the system configuration ................................................................... 2-4
Figure 2-4 Add a switch card to the system configuration
Figure 2-5 Define the system connections ......................................................................................... 2-5
Figure 2-6 Save the system configuration .......................................................................................... 2-6
Figure 2-7 Project Navigator - “ivswitch” project
Figure 2-8 Signal paths for “4terminal-n-fet” tests .............................................................................. 2-7
Figure 2-9 Signal paths for “3terminal-npn-bjt” t Figure 2-10 Signal paths for “2-wireresistor” test
Figure 2-11 Signal paths for “diode” tests............................................................................................. 2-8
Figure 2-12 Signal paths for “capacitor” test......................................................................................... 2-8
Figure 2-13 “connect” test.................................................................................................................
Figure 2-14 “connect” parameters for “4terminal-n-fet” device
Figure 2-15 Project Navigator - “ivswitch” project............................................................................... 2-10
Figure 2-16 Subsite Plan window ....................................................................................................... 2-11
Figure 2-17 “diode” moved to top of sequence table .......
Figure 2-18 “diode” moved to top of Project
Figure 2-19 Execution indicator box ................................................................................................... 2-12
4200-904-01 Rev. E / June 2008
ion ............................................................... 2-4
.................................................................. 2-5
................................................................................. 2-6
ests .......................................................................... 2-7
s................................................................................ 2-8
.... 2-9
........................................................... 2-10
................................................................... 2-11
Navigator....................................................................... 2-12
v
Figure 2-20 KULT main window.......................................................................................................... 2-13
Figure 2-21 Open “ki42xxulib” library ................................................................................................. 2-14
Figure 2-22 Open “Rdson42XX” module ............................................................................................ 2-15
Figure 2-23 Copy “Rdson42xx” module as “RdsonA
Figure 2-24 KULT module window...................................................................................................... 2-17
Figure 2-25 Program modifications .................................................................................................... 2-18
Figure 2-26 Module name for Description .......................................................................................... 2-19
Figure 2-27 Save, compile, and build library
Figure 2-28 Project Navigator for “ivswitch” project.........
Figure 2-29 Add new UTM ................................................................................................................. 2-20
Figure 2-30 “rdson10” added to Project Navigator ............................................................................. 2-21
Figure 2-31 “rdson10” UTM ................................................................................................................
...................................................................................... 2-19
vg” ..................................................................... 2-16
................................................................... 2-20
2-21
3 Controlling External Equipment
Figure 3-1 System configuration with external instruments................................................................ 3-3
Figure 3-2 Relationships between KULT and KITE and betwe
3-4
Figure 3-3 Typical CV curve ..............................................................................................................
Figure 3-4 Keithley Model 590 CV Analyzer DUT connections .......................................................... 3-5
Figure 3-5 Adding a Keithley 590 CV Analyzer to the sys
Figure 3-6 Setting the Model 590 GPIB address................................................................................ 3-6
Figure 3-7 Saving the system configuration ....................................................................................... 3-6
Figure 3-8 New Project menu selection.............................................................................................. 3-7
Figure 3-9 Define new project ............................................................................................................
Figure 3-10 Add a new Subsite Plan to a KITE project ........................................................................ 3-8
Figure 3-11 Add a new Subsite Plan.................................................................................................... 3-8
Figure 3-12 Add a new Device Plan to a KITE project ......................................................................... 3-8
Figure 3-13 Add a Device Plan............................................................................................................
Figure 3-14 Default test library folders ............................................................................................... 3-10
Figure 3-15 Add the “cvsweep” UTM..................................
Figure 3-16 “cvsweep” UTM ............................................................................................................... 3-11
Figure 3-17 Test system for “ivpgswitch” project ................................................................................ 3-12
Figure 3-18 Adding a pulse generator ................................................................................................ 3-13
Figure 3-19 Pulse generator configuration ......................................................................................... 3-13
Figure 3-20 Adding a switch matrix .................................................................................................... 3-13
Figure 3-21 Configuring the switch matrix .......................................................................................... 3-14
3-22 Adding a probe station .................................................................................................... 3-14
Figure
Figure 3-23 Connecting the switch matrix .......................................................................................... 3-15
Figure 3-24 Saving the system configuration ..................
Figure 3-25 Project Navigator - “ivpgswitch” project........................................................................... 3-15
Figure 3-26 First “connect” test - connects the device to the SMUs ................................................... 3-16
Figure 3-27 Signal paths for the pre and post stress tests ................................................................. 3-16
Figure 3-28 Second “connect” test - connects the device to the PGU................................................ 3-17
Figure 3-29 Signal paths to apply the pulse stress............................................................................. 3-17
Figure 3-30 PGU initialization ...........................................................................................................
Figure 3-31 “pgu1-setup” - configure the PGU channel ..................................................................... 3-18
Figure 3-32 PGU stress pulse specifications...................................................................................... 3-18
Figure 3-33 “pgu-trigger” test - trigger the burst of stress pulses ....................................................... 3-18
Figure 3-34 Buttons to close or reduce s
Figure 3-35 “id-vg” graphs ................................................................................................................
Figure 3-36 Graph scale settings ....................................................................................................... 3-20
Figure 3-37 Sample wafer organization.....
Figure 3-38 System configuration for the “probesubsites” project ...................................................... 3-23
Figure 3-39 Adding a switch matrix .................................................................................................... 3-24
Figure 3-40 Configuring the switch matrix .......................................................................................... 3-24
ize of test documents.......................................................... 3-19
......................................................................................... 3-21
en user libraries, user modules, and UTMs
. 3-5
tem configuration ..................................... 3-6
3-7
. 3-9
................................................................ 3-10
................................................................... 3-15
.. 3-17
.. 3-20
vi 4200-904-01 Rev. E / June 2008
Figure 3-41 Adding a probe station .................................................................................................... 3-24
Figure 3-42 Connecting the switch matrix .......................................................................................... 3-25
Figure 3-43 Saving the system configuration ..................
Figure 3-44 Project Navigator - probesubsit
Figure 3-45 Modified project plan settings.......................................................................................... 3-27
Figure 3-46 prober-init ..................................................................................................................
Figure 3-47 Connect SMUs to N-channel MOSFET........................................................................... 3-29
Figure 3-48 Connect SMUs to NPN transistor.................................................................................... 3-29
Figure 3-49 prober-separate..............................................................................................................
Figure 3-50 prober-prompt test and dialog window ............................................................................ 3-30
Figure 3-51 Test sequence ................................................................................................................
Figure 3-52 Site Navigator................................................................................................................
Figure 3-53 KITE title bar..............................................................................................................
es project ....................................................................... 3-26
................................................................... 3-25
...... 3-28
. 3-30
. 3-31
.. 3-32
...... 3-32
4 Pulse Applications
Figure 4-1 Charge Pumping—hardware setup block diagram............................................................ 4-3
Figure 4-2 Charge pumping — hardware connection ........................................................................ 4-4
Figure 4-3 Two types of sweeps for charge pumping......................................................................... 4-4
Figure 4-4 Example data plots for N
Figure 4-5 Pulse IV—hardware setup block diagram ....................................................................... 4-17
Figure 4-6 Pulse IV—hardware connections .................................................................................... 4-18
Figure 4-7 Side view of scope card connections .............................................................................. 4-18
Figure 4-8 Model 8101-PIV test fixture ............................................................................................. 4-19
Figure 4-9 Model 8101-PIV schematic ............................................................................................. 4-19
Figure 4-10 PRB-C adapter cable – pulse SMA to SSMC Y ............................................................. 4-20
Figure 4-11 Schematic diagram of the PRB-C adapter cable ............................................................ 4-21
Figure 4-12 Pulse IV connections using PRB-C adapter cables ........................................................ 4-22
Figure 4-13 Pulse IV connections using RF G-S-G probes ................................................................ 4-23
Figure 4-14 Pulse IV connections using the 8101-PIV test fixture...................................................... 4-23
Figure 4-15 DUT inserted in pulse
Figure 4-16 Project plan for Pulse-IV Complete .............
Figure 4-17 PulseIVCal dialog boxes ................................................................................................ 4-26
Figure 4-18 8101-PIV shorted/through socket ...
Figure 4-19 Default definition and typical graph for Vds-id ....
Figure 4-20 Default Definition tab and G
Figure 4-21 Default definition and typical graph for vds-id-pulse-vs-dc.............................................. 4-28
Figure 4-22 Default definition and typical graph for vgs-id Figure 4-23 Default definition and typical graph for vgs-id-puls Figure 4-24 Default GUI definition and typical graph f
Figure 4-25 Typical graphical result for scope-shot .....
Figure 4-26 Highlighting all entries in vds-id data sheet ..................................................................... 4-34
Figure 4-27 Data from vds-id pasted int
Figure 4-28 Graph Definition dialog box and resulting graph that shows the three added curves..... 4-35
Figure 4-29 Trapping and de-trapping in a single gate volt
Figure 4-30 Slow single pulse—hardware setup block diagram ..................................................... 4-55
Figure 4-31 Slow single pulse—hardware connection ...................................................................... 4-56
Figure 4-32 Example slow single pulse waveform graph .................................................................. 4-56
Figure 4-33 Single slow pulse example data plot ............................................................................... 4-57
Figure 4-34 AC Pulse stress-measure—hardware setup block diagram ............................................ 4-61
Figure 4-35 AC Pulse stress-measure—hardware matrix card simplified
Figure 4-36 AC Pulse stress-measure—hardware connections ....................................................... 4-63
Figure 4-37 PIV-Q Block Diagram ...................................................................................................... 4-65
Figure 4-38 PIV-Q connections diagram............................................................................................. 4-66
Figure 4-39 Photo showing PIV-Q connections.................................................................................. 4-69
Figure 4-40 PIV-Q connections using RF G-S-G probes.................................................................... 4-69
it..........................................................................................................................
socket of 8101-PIV test fixture..................................................... 4-24
................................................................... 4-25
................................................................................ 4-26
............................................................ 4-27
UI For vds-id-pulse.............................................................. 4-28
................................................................. 4-29
e........................................................ 4-30
or vgs-id-pulse-vs-dc ...................................... 4-30
...................................................................... 4-31
o vds-id-pulse calc sheet...................................................... 4-34
age pulse................................................. 4-54
schematic ......................... 4-62
4-5
4200-904-01 Rev. E / June 2008 vii
Figure 4-41 PIV-Q connections using the 8101-PIV test fixture ......................................................... 4-70
Figure 4-42 Proper orientation for the plastic package T
O-92 n-channel enhancement mode FET .. 4-70
Figure 4-43 QPulse-IV-Complete project............................................................................................ 4-72
Figure 4-44 Definition and Graph tabs for Vd-Id-Pulse (Vgs = 5V) .................................................... 4-73
Figure 4-45 Default definition and typical graph for Vd-Id-Family
...................................................... 4-73
Figure 4-46 Vg-Id-Pulse Graph tab..................................................................................................... 4-74
Figure 4-47 Default GUI definition for Vg-I
d-Pulse-vs-DC .................................................................. 4-75
Figure 4-48 Typical graph for Vg-Id-Pulse-vs-DC............................................................................... 4-75
Figure 4-49 Typical graphical result for ScopeShot -FET................................................................... 4-76
Figure 4-50 Pulse adapters, cables and hardware........................................................................... 4-118
Figure 4-51 Cross section of a floating gate transistor in both the erased and programmed states 4-119 Figure 4-52 Graph of shifted voltage threshold, VT, due to stored charge on
floating gate on a 1 bit (2 level) cell. 4-
Figure 4-53 Fowler-Nordheim tunneling Program and Erase.
.......................................................... 4-121
120
Figure 4-54 Hot Electron Injection (HEI) Program and Erase. ......................................................... 4-121
Figure 4-55 Block diagram of an example flash t Figure 4-56 Block diagram of a flash test setup without using a
est setup using a switch matrix ............................ 4-122
switch matrix (direct connect)....... 4-122
Figure 4-57 Program pulse waveforms for a floating gate DUT, with separate
pulse waveforms for the DUT gate, drain, source, and bulk 4-
123
Figure 4-58 Example erase pulse waveforms for a floating gate DUT, with separate
pulse waveforms for the DUT gate, drain, source, and bulk 4-
123
Figure 4-59 Program + Erase pulse waveforms for a floating gate DUT, with separate
pulse waveforms for the DUT gate, drain, source, and bulk. 4-
Figure 4-60 Basic schematic of flash testing without a sw
itch matrix ............................................... 4-124
Figure 4-61 Example results of VT shift in an Endurance test Figure 4-62 Disturb testing – configuration to
test a single device ................................................... 4-126
on a NOR flash cell.......................... 4-125
124
Figure 4-63 Kpulse showing the Segment Arb settings for the 4205-PG2 card in the
lowest numbered-slot (PG2-1) ........................
.............................................................. 4-128
Figure 4-64 Kpulse showing the Segment Arb settings for the 4205-PG2 card in the
second lowest-numbered slot (PG2-2) 4-
Figure 4-65 Flash-NAND Project Definition Tab, including
arrows for the 6 input arrays ................. 4-131
Figure 4-66 Flash-NAND PulseVoltages Array Entry and PrePulseDelay Figure 4-67 Flash connections – program/erase an
connection to a single, stand-alone 4 terminal Figure 4-68 Flash direct DUT connections – Disturb testing Figure 4-69 Flash Switch connections – Characterization, endurance
d endurance testing using direct
device................................................... 4-133
............................................................ 4-134
or disturb testing................. 4-135
s Entry ............................ 4-132
128
Figure 4-70 Supplied items for 4200-Flash package ........................................................................ 4-135
Figure 4-71 KCON Row-Column Card Properties for Flash testing with 4 SMUs and 4 VPU pulse
channels 4-
Figure 4-72 Project listing _Memory folder.......................................................................................
139
4-140
Figure 4-73 Flash-NAND project ...................................................................................................... 4-141
Figure 4-74 Parameters for Program or Eras
e UTMs (using single_pulse_flash module) ............... 4-142
Figure 4-75 Parameters for Fast Program-Erase pulse waveform
(using double_pulse_flash module) 4-
Figure 4-76 Flash-NAND project – Program definition t
ab ............................................................... 4-142
142
Figure 4-77 Flash-NAND project – Erase definition tab.................................................................... 4-143
Figure 4-78 Flash-NAND project – Fast-Program-Erase def Figure 4-79 Flash-NAND project – SetupDC definition t
inition tab ........................................... 4-143
ab .............................................................. 4-144
Figure 4-80 Flash-NAND project – Vt-MaxGm definition tab............................................................ 4-145
Figure 4-81 Flash-Switch project ..................................................................................................... 4-146
Figure 4-82 ConPin-Pulse test Definition tab.................................................................................... 4-146
Figure 4-83 ConPin-Pulse test GUI definition dialog ....
Figure 4-84 FlashEndurance-NAND project plan ...............
Figure 4-85 FlashEndurance-NAND project – Subsite Plan t Figure 4-86 FlashEndurance-NAND project – Device Stres Figure 4-87 FlashEndurance-NAND project – Subsite Graph t
.................................................................... 4-147
.............................................................. 4-153
ab....................................................... 4-154
s Properties ......................................... 4-154
ab .................................................... 4-155
viii 4200-904-01 Rev. E / June 2008
Figure 4-88 FlashEndurance-NAND project – Program Definition tab ............................................. 4-156
Figure 4-89 FlashEndurance-NAND project – SetupDC Definition tab ............................................ 4-157
Figure 4-90 FlashEndurance-NAND project – Vt-MaxGm-Program Definition Figure 4-91 FlashEndurance-NAND project – Vt-MaxGm-Program G
raph tab................................ 4-158
tab........................... 4-158
Figure 4-92 FlashEndurance-NAND project – Erase Definition tab.................................................. 4-159
Figure 4-93 FlashEndurance-Switch project .................................................................................... 4-160
Figure 4-94 FlashDisturb-NAND project – Subsite Setup tab........................................................... 4-164
Figure 4-95 FlashDisturb-NAND project – Device Stress Propert
ies................................................ 4-164
4200-904-01 Rev. E / June 2008 ix
x 4200-904-01 Rev. E / June 2008

List of Tables

1 Graphical Data Analysis and Basic Test Sequencing
Figure 1-1 Graph for the “subvt” test .................................................................................................. 1-2
Figure 1-2 Open Formulator window .................................................................................................. 1-3
Figure 1-3 Formulator for “subvt” test ................................................................................................. 1-3
Figure 1-4 Start and stop points for the line-fit.................................................................................... 1-4
Figure 1-5 Changing the STOPI value................................................................................................ 1-4
...
Figure 1-6 Modified line fit ..............................................................................................................
Figure 1-7 “vds-id” graph ...................................................................................................................
Figure 1-8 Tools menu access to Graph Settings....................
Figure 1-9 Graph Settings ..................................................................................................................
Figure 1-10 Cursors window.................................................................................................................
Figure 1-11 Initial Cursor position........................................................................................................
Figure 1-12 Graph with Cursors ........................................................................................................... 1-8
ure 1-13 Project Navigator — “4terminal-n-fet” tests.....
Fig Figure 1-14 “4terminal-n-fet” tests opened in Wo
Figure 1-15 Device Plan window for “4terminal-n-fet” ............
Figure 1-16 New order for test sequence table .................................................................................. 1-11
Figure 1-17 Project Navigator — new execution sequence....
Figure 1-18 “4terminal-n-fet” selected to run...................
Figure 1-19 Saving test data...............................................................................................................
rkspace..................................................................... 1-9
........................................................... 1-6
.................................................................. 1-9
............................................................ 1-10
............................................................ 1-11
................................................................... 1-11
. 1-5 . 1-6
1-7 1-7
. 1-8
1-12
2 Advanced Applications
Figure 2-1 Devices connected to 707A switching matrix .................................................................... 2-3
Figure 2-2 Add a switch matrix to the system configuration
Figure 2-3 Add a test fixture to the system configuration ................................................................... 2-4
Figure 2-4 Add a switch card to the system configuration ....
Figure 2-5 Define the system connections ......................................................................................... 2-5
Figure 2-6 Save the system configuration .......................................................................................... 2-6
Figure 2-7 Project Navigator - “ivswitch” project
Figure 2-8 Signal paths for “4terminal-n-fet” tests .............................................................................. 2-7
Figure 2-9 Signal paths for “3terminal-npn-bjt” te Figure 2-10 Signal paths for “2-wireresistor” tests
Figure 2-11 Signal paths for “diode” tests............................................................................................. 2-8
Figure 2-12 Signal paths for “capacitor” test......................................................................................... 2-8
Figure 2-13 “connect” test.................................................................................................................
Figure 2-14 “connect” parameters for “4terminal-n-fet” device ..
Figure 2-15 Project Navigator - “ivswitch” project............................................................................... 2-10
Figure 2-16 Subsite Plan window ....................................................................................................... 2-11
Figure 2-17 “diode” moved to top of sequence table ..........
Figure 2-18 “diode” moved to top of Project Navigat
Figure 2-19 Execution indicator box ................................................................................................... 2-12
4200-904-01 Rev. E / June 2008
............................................................... 2-4
.............................................................. 2-5
..
............................................................................... 2-6
sts .......................................................................... 2-7
................................................................................ 2-8
...
. 2-9
......................................................... 2-10
................................................................ 2-11
or....................................................................... 2-12
v
Figure 2-20 KULT main window.......................................................................................................... 2-13
Figure 2-21 Open “ki42xxulib” library ................................................................................................. 2-14
Figure 2-22 Open “Rdson42XX” module ............................................................................................ 2-15
vg”
Figure 2-23 Copy “Rdson42xx” module as “RdsonA
Figure 2-24 KULT module window...................................................................................................... 2-17
Figure 2-25 Program modifications .................................................................................................... 2-18
Figure 2-26 Module name for Description .......................................................................................... 2-19
...
Figure 2-27 Save, compile, and build library
Figure 2-28 Project Navigator for “ivswitch” project............
Figure 2-29 Add new UTM ................................................................................................................. 2-20
Figure 2-30 “rdson10” added to Project Navigator ............................................................................. 2-21
Figure 2-31 “rdson10” UTM ................................................................................................................
................................................................................... 2-19
..................................................................... 2-16
................................................................ 2-20
2-
21
3 Controlling External Equipment
Figure 3-1 System configuration with external instruments................................................................ 3-3
Figure 3-2 Relationships between KULT and KITE and between user
Figure 3-3 Typical CV curve ............................................................................................................... 3-5
Figure 3-4 Keithley Model 590 CV Analyzer DUT connections .......................................................... 3-5
Figure 3-5 Adding a Keithley 590 CV Analyzer to the system configuration ..................................... 3-6
Figure 3-6 Setting the Model 590 GPIB address................................................................................ 3-6
Figure 3-7 Saving the system configuration ....................................................................................... 3-6
Figure 3-8 New Project menu selection.............................................................................................. 3-7
Figure 3-9 Define new project ............................................................................................................ 3-7
Figure 3-10 Add a new Subsite Plan to a KITE project ........................................................................ 3-8
Figure 3-11 Add a new Subsite Plan.................................................................................................... 3-8
Figure 3-12 Add a new Device Plan to a KITE project ......................................................................... 3-8
Figure 3-13 Add a Device Plan............................................................................................................. 3-9
Figure 3-14 Default test library folders ............................................................................................... 3-10
Figure 3-15 Add the “cvsweep” UTM.................................................................................................. 3-10
Figure 3-16 “cvsweep” UTM ............................................................................................................... 3-11
Figure 3-17 Test system for “ivpgswitch” project ................................................................................ 3-12
Figure 3-18 Adding a pulse generator ................................................................................................ 3-13
Figure 3-19 Pulse generator configuration ......................................................................................... 3-13
Figure 3-20 Adding a switch matrix .................................................................................................... 3-13
Figure 3-21 Configuring the switch matrix .......................................................................................... 3-14
3-22
Figure
Figure 3-23 Connecting the switch matrix .......................................................................................... 3-15
Figure 3-24 Saving the system configuration ..................................................................................... 3-15
Figure 3-25 Project Navigator - “ivpgswitch” project........................................................................... 3-15
Figure 3-26 First “connect” test - connects the device to the SMUs ................................................... 3-16
Figure 3-27 Signal paths for the pre and post stress tests ................................................................. 3-16
Figure 3-28 Second “connect” test - connects the device to the PGU................................................ 3-17
Figure 3-29 Signal paths to apply the pulse stress............................................................................. 3-17
Figure 3-30 PGU initialization ............................................................................................................. 3-17
Figure 3-31 “pgu1-setup” - configure the PGU channel ..................................................................... 3-18
Figure 3-32 PGU stress pulse specifications...................................................................................... 3-18
Figure 3-33 “pgu-trigger” test - trigger the burst of stress pulses ....................................................... 3-18
Figure 3-34 Buttons to close or reduce size of test documents.......................................................... 3-19
Figure 3-35 “id-vg” graphs .................................................................................................................. 3-20
Figure 3-36 Graph scale settings ....................................................................................................... 3-20
Figure 3-37 Sample wafer organization.............................................................................................. 3-21
Figure 3-38 System configuration for the “probesubsites” project ...................................................... 3-23
Figure 3-39 Adding a switch matrix .................................................................................................... 3-24
Figure 3-40 Configuring the switch matrix .......................................................................................... 3-24
Adding a probe station .................................................................................................... 3-14
libraries, user modules, UTMs 3-4
vi 4200-904-01 Rev. E / June 2008
Figure 3-41 Adding a probe station .................................................................................................... 3-24
Figure 3-42 Connecting the switch matrix .......................................................................................... 3-25
Figure 3-43 Saving the system configuration ..................
Figure 3-44 Project Navigator - probesubsit
Figure 3-45 Modified project plan settings.......................................................................................... 3-27
Figure 3-46 prober-init ..................................................................................................................
Figure 3-47 Connect SMUs to N-channel MOSFET........................................................................... 3-29
Figure 3-48 Connect SMUs to NPN transistor.................................................................................... 3-29
Figure 3-49 prober-separate..............................................................................................................
Figure 3-50 prober-prompt test and dialog window ............................................................................ 3-30
Figure 3-51 Test sequence ................................................................................................................
Figure 3-52 Site Navigator................................................................................................................
Figure 3-53 KITE title bar..............................................................................................................
es project ....................................................................... 3-26
................................................................... 3-25
...... 3-28
. 3-30
. 3-31
.. 3-32
...... 3-32
4 Pulse Applications
Figure 4-1 Charge Pumping—hardware setup block diagram............................................................ 4-3
Figure 4-2 Charge pumping — hardware connection ........................................................................ 4-4
Figure 4-3 Two types of sweeps for charge pumping......................................................................... 4-4
Figure 4-4 Example data plots for N
Figure 4-5 Pulse IV—hardware setup block diagram ....................................................................... 4-17
Figure 4-6 Pulse IV—hardware connections .................................................................................... 4-18
Figure 4-7 Side view of scope card connections .............................................................................. 4-18
Figure 4-8 Model 8101-PIV test fixture ............................................................................................. 4-19
Figure 4-9 Model 8101-PIV schematic ............................................................................................. 4-19
Figure 4-10 PRB-C adapter cable – pulse SMA to SSMC Y ............................................................. 4-20
Figure 4-11 Schematic diagram of the PRB-C adapter cable ............................................................ 4-21
Figure 4-12 Pulse IV connections using PRB-C adapter cables ........................................................ 4-22
Figure 4-13 Pulse IV connections using RF G-S-G probes ................................................................ 4-23
Figure 4-14 Pulse IV connections using the 8101-PIV test fixture...................................................... 4-23
Figure 4-15 DUT inserted in pulse
Figure 4-16 Project plan for Pulse-IV Complete .............
Figure 4-17 PulseIVCal dialog boxes ................................................................................................ 4-26
Figure 4-18 8101-PIV shorted/through socket ...
Figure 4-19 Default definition and typical graph for Vds-id ....
Figure 4-20 Default Definition tab and G
Figure 4-21 Default definition and typical graph for vds-id-pulse-vs-dc.............................................. 4-28
Figure 4-22 Default definition and typical graph for vgs-id Figure 4-23 Default definition and typical graph for vgs-id-puls Figure 4-24 Default GUI definition and typical graph f
Figure 4-25 Typical graphical result for scope-shot .....
Figure 4-26 Highlighting all entries in vds-id data sheet ..................................................................... 4-34
Figure 4-27 Data from vds-id pasted int
Figure 4-28 Graph Definition dialog box and resulting graph that shows the three added curves..... 4-35
Figure 4-29 Trapping and de-trapping in a single gate volt
Figure 4-30 Slow single pulse—hardware setup block diagram ..................................................... 4-55
Figure 4-31 Slow single pulse—hardware connection ...................................................................... 4-56
Figure 4-32 Example slow single pulse waveform graph .................................................................. 4-56
Figure 4-33 Single slow pulse example data plot ............................................................................... 4-57
Figure 4-34 AC Pulse stress-measure—hardware setup block diagram ............................................ 4-61
Figure 4-35 AC Pulse stress-measure—hardware matrix card simplified
Figure 4-36 AC Pulse stress-measure—hardware connections ....................................................... 4-63
Figure 4-37 PIV-Q Block Diagram ...................................................................................................... 4-65
Figure 4-38 PIV-Q connections diagram............................................................................................. 4-66
Figure 4-39 Photo showing PIV-Q connections.................................................................................. 4-69
Figure 4-40 PIV-Q connections using RF G-S-G probes.................................................................... 4-69
it..........................................................................................................................
socket of 8101-PIV test fixture..................................................... 4-24
................................................................... 4-25
................................................................................ 4-26
............................................................ 4-27
UI For vds-id-pulse.............................................................. 4-28
................................................................. 4-29
e........................................................ 4-30
or vgs-id-pulse-vs-dc ...................................... 4-30
...................................................................... 4-31
o vds-id-pulse calc sheet...................................................... 4-34
age pulse................................................. 4-54
schematic ......................... 4-62
4-5
4200-904-01 Rev. E / June 2008 vii
Figure 4-41 PIV-Q connections using the 8101-PIV test fixture ......................................................... 4-70
Figure 4-42 Proper orientation for the plastic package T
O-92 n-channel enhancement mode FET .. 4-70
Figure 4-43 QPulse-IV-Complete project............................................................................................ 4-72
Figure 4-44 Definition and Graph tabs for Vd-Id-Pulse (Vgs = 5V) .................................................... 4-73
Figure 4-45 Default definition and typical graph for Vd-Id-Family
...................................................... 4-73
Figure 4-46 Vg-Id-Pulse Graph tab..................................................................................................... 4-74
Figure 4-47 Default GUI definition for Vg-I
d-Pulse-vs-DC .................................................................. 4-75
Figure 4-48 Typical graph for Vg-Id-Pulse-vs-DC............................................................................... 4-75
Figure 4-49 Typical graphical result for ScopeShot -FET................................................................... 4-76
Figure 4-50 Pulse adapters, cables and hardware........................................................................... 4-118
Figure 4-51 Cross section of a floating gate transistor erased with stored charge,
and programmed in the floating gate 4-1
19
Figure 4-52 Graph of shifted voltage threshold, VT, due to stored charge on floating
gate on a 1 bit (2 level) cell. 4-
Figure 4-53 Fowler-Nordheim tunneling Program and Erase.
.......................................................... 4-121
120
Figure 4-54 Hot Electron Injection (HEI) Program and Erase. ......................................................... 4-121
Figure 4-55 Block diagram of an example flash t Figure 4-56 Block diagram of a flash test setup without using a
est setup using a switch matrix ............................ 4-122
switch matrix (direct connect)....... 4-122
Figure 4-57 Program pulse waveforms for a floating gate DUT, with separate
pulse waveforms for the DUT gate, drain, source, and bulk
......................................... 4-123
Figure 4-58 Example erase pulse waveforms for a floating gate DUT, with separate
pulse waveforms for the DUT gate, drain, source, and bulk 4-
123
Figure 4-59 Program + Erase pulse waveforms for a floating gate DUT, with separate
pulse waveforms for the DUT gate, drain, source, and bulk. 4-
Figure 4-60 Basic schematic of flash testing without a sw
itch matrix ............................................... 4-124
Figure 4-61 Example results of VT shift in an Endurance test Figure 4-62 Disturb testing – configuration to
test a single device ................................................... 4-126
on a NOR flash cell.......................... 4-125
124
Figure 4-63 Kpulse showing the Segment Arb settings for the 4205-PG2 card in the
lowest numbered-slot (PG2-1) ........................
.............................................................. 4-128
Figure 4-64 Kpulse showing the Segment Arb settings for the 4205-PG2 card in the
second lowest-numbered slot (PG2-2) 4-
Figure 4-65 Flash-NAND Project Definition Tab, including
arrows for the 6 input arrays ................. 4-131
Figure 4-66 Flash-NAND PulseVoltages Array Entry and PrePulseDelay Figure 4-67 Flash connections – program/erase an
connection to a single, stand-alone 4 terminal Figure 4-68 Flash direct DUT connections – Disturb testing Figure 4-69 Flash Switch connections – Characterization, endurance
d endurance testing using direct
device................................................... 4-133
............................................................ 4-134
or disturb testing................. 4-135
s Entry ............................ 4-132
128
Figure 4-70 Supplied items for 4200-Flash package ........................................................................ 4-135
Figure 4-72 Project listing _Memory folder....................................................................................... 4-140
Figure Figure 4-74 Parameters for Program or Eras
4-73 Flash-NAND project ...................................................................................................... 4-141
e UTMs (using single_pulse_flash module) ............... 4-142
Figure 4-75 Parameters for Fast Program-Erase pulse waveform
(using double_pulse_flash module) Figure 4-76 Flash-NAND project – Program definition t
.............................................................................. 4-142
ab ............................................................... 4-142
Figure 4-77 Flash-NAND project – Erase definition tab.................................................................... 4-143
Figure 4-78 Flash-NAND project – Fast-Program-Erase def Figure 4-79 Flash-NAND project – SetupDC definition t
inition tab ........................................... 4-143
ab .............................................................. 4-144
Figure 4-80 Flash-NAND project – Vt-MaxGm definition tab............................................................ 4-145
Figure 4-81 Flash-Switch project ..................................................................................................... 4-146
Figure 4-82 ConPin-Pulse test Definition tab.................................................................................... 4-146
Figure 4-83 ConPin-Pulse test GUI definition dialog ....
Figure 4-84 FlashEndurance-NAND project plan ...............
Figure 4-85 FlashEndurance-NAND project – Subsite Plan t Figure 4-86 FlashEndurance-NAND project – Device Stres Figure 4-87 FlashEndurance-NAND project – Subsite Graph t Figure 4-88 FlashEndurance-NAND project – Program Def
.................................................................... 4-147
.............................................................. 4-153
ab....................................................... 4-154
s Properties ......................................... 4-154
ab .................................................... 4-155
inition tab ............................................. 4-156
viii 4200-904-01 Rev. E / June 2008
Figure 4-89 FlashEndurance-NAND project – SetupDC Definition tab ............................................ 4-157
Figure 4-90 FlashEndurance-NAND project – Vt-MaxGm-Program Definition Figure 4-91 FlashEndurance-NAND project – Vt-MaxGm-Program G
raph tab................................ 4-158
tab........................... 4-158
Figure 4-92 FlashEndurance-NAND project – Erase Definition tab.................................................. 4-159
Figure 4-93 FlashEndurance-Switch project .................................................................................... 4-160
Figure 4-94 FlashDisturb-NAND project – Subsite Setup tab........................................................... 4-164
Figure 4-95 FlashDisturb-NAND project – Device Stress Propert
ies................................................ 4-164
4200-904-01 Rev. E / June 2008 ix
Graphical Data Analysis and
Basic Test Sequencing
Section Topics List
SubVt slope, page 1-2
Open “default” project, page 1-2
Open “subvt” test and display graph, page 1-2
Line-fit analysis, page 1-3
Modify the line-fit, page 1-4
Graphical analysis, page 1-5
Open “default” project and “vds-id” test, page 1-5
Display and analyze the “vds-id” graph, page 1-6
Sequencing tests on a single device, page 1-9
Open “default” project, page 1-9
Open “4terminal-n-fet” tests, page 1-9
Modify tests, page 1-10
Change the execution sequence, page 1-10
Run “4terminal-n-fet” test sequence, page 1-11
Save and export test data, page 1-12
1
1-2 Graphical Data Analysis and Basic Test Sequencing 4200-SCS Applications Manual

SubVt slope

This application demonstrates how to use the Formulator to determine the slope of a specified portion of an IV curve. For additional information regarding the Formulator and parameter extraction, refer to the 4200-SCS Reference manual.
Open “default” project
If the “default” project is not currently open, open it using the Open Project item of the File menu on the toolbar.
Open “subvt” test and display graph
The test is opened by double-clicking “subvt” in the Project Navigator. With the test in the Workspace, click the Graph tab to display the graph (Figure 1-1).
The Formulator is used to determine the sub-thre calculated by performing an exponential line-fit over a specified portion of the IV curve. The straight blue line (IDFIT) is the result of the line-fit. The displayed slope value (SUBVTSLP) is the slope of IDFIT and, in this case, the slope of the fitted portion of the IV curve.
Figure 1-1
Graph for the “subvt” test
shold slope for the IV curve. The slope is
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4200-SCS Applications Manual Graphical Data Analysis and Basic Test Sequencing 1-3
Click to open Formulator panel
Fomula Definition Box
Formula List
Line-fit analysis
The formulas to calculate sub-threshold slope were created using the Formulator. To open the Formulator window, click the Definition tab in the Workspace, and then click the Formulator button as shown in Figure 1-2.
Figure 1-2
Open Formulator window
The formulas for the “subvt” test are shown in F
igure 1-3. The formulas created for the test are
listed below the formula definition box at the top of the window.
The ST
ARTI and STOPI formulas specify the portion of the IV curve for the line-fit. These two current data points are shown in Figure 1-4. Notice that these start/stop points section off a linear portion of the IV curve.
The ID
FIT formula uses the STARTI and STOPI values to calculate the data points for the IDFIT line, which is the straight blue line in the graph. Finally, the SUBVTSLP formula calculates the slope of the IDFIT line.
NOTE Some engineers prefer to view the inverse of the subthreshold slope. This is easily
accomplished by adding the formula: INVSUBVTSLP = 1/SUBVTSLP.
Figure 1-3
Formulator for “subvt” test
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1-4 Graphical Data Analysis and Basic Test Sequencing 4200-SCS Applications Manual
STARTI = 1E-10
STOPI = 1E-5
Figure 1-4
Start and stop points for the line-fit
Modify the line-fit
The following exercise shows how to modify the line-fit.
1. Open the Formulator window
2. In the formula list, double-click STOPI = 1E-5 to place it in the formula definition box.
3. Using the keyboard, change the stop value to 1.0E-2 as shown in Figure 1-5.
4. Click the Add button (Figure 1-5) to place the modified formula in the list.
NOTE A pop-up menu will indicate that the formula already exists. Click Yes to update the
formula.
5. Close the Formulator by clicking the Close
6. In the Workspace, click the Graph tab to display the graph.
Figure 1-5
Changing the STOPI value
for the “subvt” test.
button at the bottom of the window.
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4200-SCS Applications Manual Graphical Data Analysis and Basic Test Sequencing 1-5
STARTI = 1E-10
STOPI = 1E-2
As shown in Figure 1-6, the IV curve does not fit the slope of the IDFIT line. This is because the exponential line-fit was performed on a non-linear portio
Figure 1-6 show the non-linear portion of the IV curve used
invalidates the SUBVTSLP results.
Figure 1-6
Modified line fit
n of the IV curve. The start/stop points in
for the line-fit. This of course,
The above exercise demonstrates the value of displaying good line-fit as shown in Figure 1-1, then the “SUBVTSLP” value is the slope for the fitted portion of the IV curve.

Graphical analysis

This application demonstrates how to analyze graphical data using Cursors. With a Cursor positioned on a curve, the X and Y coordinate readings for the graph point are displayed in the graph. For details, refer to the 4200-SCS Reference manual.
Open “default” project and “vds-id” test
If the “default” project is not currently open, open it using the Open Project item of the File menu on the toolbar.
The test is opened by double-clicking “vds
the IDFIT line in the graph. If there is a
-id” in the Project Navigator.
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1-6 Graphical Data Analysis and Basic Test Sequencing 4200-SCS Applications Manual
Display and analyze the “vds-id” graph
Step 1. Display the graph
In the Workspace, click the Graph tab for the “vds-id” test to display the graph. A typical graph for this test is shown in Figure 1-7.
Figure 1-7
“vds-id” graph
Step 2. Open Graph menu
While a graph is displayed, the Graph menu can be opened from the Too ls menu as shown in
Figure 1-8. It can also be opened by placing the mouse pointer in an open area of the graph, and
clicking the right mouse button. The Graph
Figure 1-8
Tools menu access to Graph Settings
menu is shown in Figure 1-9.
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4200-SCS Applications Manual Graphical Data Analysis and Basic Test Sequencing 1-7
Figure 1-9
Graph Settings
Step 3. Enable Cursors
In the Graph menu, select the Cursors item to display the Cursors window. The Cursors window in Figure 1-10 shows that Cursors 1, 2, 3 and by clicking the Vi click OK to close the window. For details, refer to the 4200-SCS Reference manual..
sible box in the Cursor area of the window. With the desired Cursor(s) enabled,
4 are enabled. A Cursor is enabled () or disabled
The Cursor(s) will appear at the first data point of the first dat
Figure 1-10
Cursors window
a series as shown in Figure 1-11.
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1-8 Graphical Data Analysis and Basic Test Sequencing 4200-SCS Applications Manual
Initial position of cursors
Figure 1-11
Initial Cursor position
Step 4. Position Cursor on I-V curve
To position a Cursor, place the mouse pointer on the Cursor, hold down the left mouse button, and drag it to the desired point on an IV curve. The drain voltage (x-axis) and drain current (y-axis) readings for the graph point are displayed in the Cursor Display at the bottom of the graph.
The properties of each Cursor can be set by right-clicking the Cursor. The Cursors windo be opened by right-clicking the Cursor Display.
In Figu
re 1-12, Cursor data provides the drain current readings for each IV curve at a drain voltage
of 3V.
Figure 1-12
Graph with Cursors
w can
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4200-SCS Applications Manual Graphical Data Analysis and Basic Test Sequencing 1-9

Sequencing tests on a single device

This application demonstrates how to run a test sequence on a single device. When the test sequence is started, the tests for the device will execute in the order that they are presented in the Project Navigator. That is, they will be executed in top-down order. For details refer to the 4200­SCS Reference manual.
This application will also show you how to change the order of execution for the test sequence. For
etails, refer to the 4200-SCS Reference manual..
d
Open “default” project
If the “default” project is not currently open, open it using File -> Open Project.
Open “4terminal-n-fet” tests
The partial Project Navigator in Figure 1-13 shows the five tests for the “4terminal-n-fet” device. Double-click each test to open it and place it in the Workspace.
Figure 1-13
Project Navigator — “4terminal-n-fet” tests
Figure 1-14
name tab at the bottom of the Workspace, or double-c
Figure 1-14
“4terminal-n-fet” tests opened in Workspace
shows all five tests opened in the Workspace. A test is displayed by clicking the test
licking on the test in the Project Navigator.
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1-10 Graphical Data Analysis and Basic Test Sequencing 4200-SCS Applications Manual
Modify tests
All instrument selections shown on the Definition tab must match the actual physical connections to the device. If you change the instrument selections for one test, you must also make the same change to the other four tests on that device so that the tests can be executed as a sequence.
Change the execution sequence
The order of presentation in the Project Navigator determines the execution sequence. For the Project Navigator in Figure 1-13, the “4terminal-n-fet” tes order:
ts will execute in the following, top-down,
“vds-id”
Perform the following steps to change the execution sequence so that “ig-vg” is the first test to be ex
ecuted:
vtlin” “subvt” “vgs-id” “ig-vg”
Step 1. Open Device Plan window
The Device Plan for the “4terminal-n-fet” device is opened by double-clicking “4terminal-n-fet” in the Project Navigator. The Device Plan Sequence tab is shown in Figure 1-15.
Notice that the execution sequence for the test Sequence Table of the Device Plan.
Figure 1-15
Device Plan window for “4terminal-n-fet”
s in the Project Navigator appears in the Test
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4200-SCS Applications Manual Graphical Data Analysis and Basic Test Sequencing 1-11
Step 2. Select and move “ig-vg”
The “ig-vg” test is selected by clicking on it in the Test Sequence Table. Figure 1-15 shows
-vg” selected. Use the Move Up button to move the test to the top of the sequence table.
ig
Figure 1-16 shows the new order for the T
Figure 1-16
New order for test sequence table
est Sequence Table.
Step 3. Apply new execution sequence to the Device Plan
In the Device Plan window (Figure 1-15), click the Apply button to apply the new execution sequence to the project. The partial Project Navigator in Figure 1-17 shows the new execution sequence.
Figure 1-17
Project Navigator — new execution sequence
Run “4terminal-n-fet” test sequence
Step 1. Select “4terminal-n-fet” Device Plan
In the Project Navigator, click “4terminal-n-fet” to select the test sequence. That Device Plan name appears in the Test/Plan Indicator box as shown in Figure 1-18.
Figure 1-18
“4terminal-n-fet” selected to run
By selecting “4t device will be executed.
erminal-n-fet” and pressing the Run button, all of the tests associated with this
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1-12 Graphical Data Analysis and Basic Test Sequencing 4200-SCS Applications Manual
Save
Save All
Step 2. Click Run button to execute the test sequence
The green Run button starts the test sequence. The name of each individual test will be displayed in the Test/Plan Indicator box while it is being executed.
You can observe data being graphed while each test is in p its tab at the bottom of the Workspace. For example, click the ig-vg#1@1 tab to display the test. The graph for the test is then displayed by clicking the Graph tab at the top of the Workspace.
Save and export test data
The toolbar buttons to save test data are shown in Figure 1-19. Click Save to save test data and the setup for the selec in project.
As previously explained, data for each te
Figure 1-19
Saving test data
ted (displayed) test. Click Save All to save test data and setups for all tests
rogress. A test is displayed by clicking
st can be exported as an Excel workbook.
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Advanced Applications

Section Topics List
Controlling a switch matrix, page 2-2
KCON setup, page 2-4
Open KITE and the “ivswitch” project, page 2-6
Running test sequences, page 2-7
“connect” test description, page 2-9
Sequencing tests on multiple devices, page 2-10
Open “ivswitch” project, page 2-10
Execute the test sequence (Subsite Plan), page 2-12
Customizing a user test module (UTM), page 2-12
Open KULT, page 2-13
Open the “ki42xxulib” user library, page 2-14
Open the “Rdson42XX” user module, page 2-15
Copy “Rdson42XX” to “RdsonAvg”, page 2-16
Open and modify the “RdsonAvg” user module, page 2-17
Save, compile, and build the modified library, page 2-19
Add a new UTM to the “ivswitch” project, page 2-20
Test description, page 2-21
2
2-2 Advanced Applications 4200-SCS Applications Manual
In this section, you will learn the following:
Controlli connect any instrument terminal to any test system pin.
Seq will utilize a switch matrix to automatically test all of the devices in the “ivswitch” project.
Cust using the Keithley User Library Tool (KULT).
The following equipment is r correlates with data included with the “ivswitch” sample project.
1 - Keithley Model 4200-SCS with a total of three SMUs (PreAmps not required)
1 - Keithley Model 8006 Component Test Fixture
1 - Keithley Model 707A or 708 Switch Matrix
1 - Keithley Model 7072 or 7174A 8×12 matrix card
4 - Keithley Model 4200-MTRX-X cables (0 if using PreAmps)
12 - Keithley Model 4200-TRX-X cables (16 if using PreAmps)
1 - Keithley Model 7007 GPIB cable
1 - Keithley Model 236-ILC-3 safety interlock cable
1 - NPN transistor (2N3904 or similar)
1 - N-channel MOSFET (Temic SD210DE or similar)
1 - Capacitor (10pF)
1 - Resistor (1GΩ)
1 - Diode (1N970B or similar)
ng a switch matrix — Demonstrates how to use a switch matrix to automatically
uencing tests on multiple devices — Demonstrates how to run a test sequence that
omizing a user test module (UTM) — Demonstrates how to modify a user module
equired to complete this tutorial and obtain data that functionally

Controlling a switch matrix

This tutorial demonstrates how to use a switch matrix to automatically connect any instrument terminal to any test system pin. The “ivswitch” sample project will be used to illustrate this functionality. Before loading and running the “ivswitch” project, the 4200-SCS, switch matrix, and component test fixture must be connected as illustrated in Figure 2-1.
The switch matrix is controlled by the 4200-SCS via to connect the Model 707 Switching Matrix to the 4200-SCS. For connection details, refer to the 4200-SCS Reference manual. This example shows a Model 7174A matrix card installed in slot 1 of a Model 707A Switching Matrix. The row-column connection scheme is used for this tutorial.
A User Test Module (UTM) is used to control the switch is started, the UTM will close the appropriate matrix crosspoints to connect the specified instrument terminals to the appropriate test system pins. For details on UTMs, refer to the 4200­SCS Reference manual.
the GPIB bus. Use a Model 7007 GPIB cable
matrix. When a test sequence for a device
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4200-SCS Applications Manual Advanced Applications 2-3
SMU1
Gate
Source
Drain
Bulk
N-Channel
MOSFET
1
23
4
5
6
7
8
9
10
11
12
Columns
Rows
A
B
C
D
SMU2
SMU3
GNDU
NPN
Transistor
Base
Emitter
Collector
Capacitor
Diode
Resistor
Model 7174A Low Current Matrix Card
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Pin 11
Pin 12
Model 8006 Component Test Fixture
GPIB
To the
4200-SCS
Model 707A Switching Matrix
F G C
F
Force Guard
G
C
F = Force G = Guard C = Common
GNDU
Pin 1
Triax
Connector
Triax
Connector
Row D
Column 1
707A chassis
SAFETY
INTERLOCK
To the
4200-SCS
Figure 2-1
Devices connected to 707A switching matrix
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2-4 Advanced Applications 4200-SCS Applications Manual
KCON setup
After connecting the system as indicated in Figure 2-1, run the Keithley CONfiguration utility (KCON) used to manage the configuration of all instrumentation controlled by the 4200-SCS software. Once the matrix and test fixture have been added, and the instrument-to-matrix-to-pins connections have been defined, simply specify an instrument terminal and test system pin and KITE will automatically connect the two using the matrix. In general, changes to the system configuration will only be necessary when changes to instrument-to-matrix-to-pins wiring are made.
to add the switch matrix and test fixture to the system configuration. In general, KCON is
Follow the steps below to start KCON and modify For additional information regarding KCON, refer to the 4200-SCS Reference manual. Similarly, for additional information regarding switch matrix configuration and usage, refer to the 4200-SCS Reference manual.
1. On the desktop, double-click the KCON ic
2. Using the Tools menu, add a switch matrix to the system configuration as indicated in
Figure 2-2.
Figure 2-2
Add a switch matrix to the system configuration
3. Using the T
Figure 2-3.
Figure 2-3
Add a test fixture to the system configuration
ools menu, add a test fixture to the system configuration as indicated in
the system configuration as described above.
on to open KCON.
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4200-SCS Applications Manual Advanced Applications 2-5
4. Select the KI 707/707A Switching Matrix - MTRX1 item in the Configuration Navigator (tree control on left side of screen) and add a Keithley 7174 Low Current Matrix Card to Slot 1 of the switch matrix. Add the switch card using the pull down menu on the Properties tab. See Figure 2-4.
Figure 2-4
Add a switch card to the system configuration
5. Select the KI 7174 SMUs, GNDU, and test fixture pins as indicated in Figure 2-1 using the pull down menus on the Properties tab. See Figure 2-5.
Figure 2-5
Define the system connections
Matrix Card - CARD1 item in the Configuration Navigator. Connect the
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2-6 Advanced Applications 4200-SCS Applications Manual
6. Save the system configuration and Exit KCON. See Figure 2-6.
Figure 2-6
Save the system configuration
Open KITE and the “ivswitch” project
1. On the desktop, double-click the KITE icon to open KITE.
2. Open the ivswitch” project from the File menu on the KITE toolbar (click Open Project). The Project Navigator for the “ivswitch” project is shown in Figure 2-7.
Figure 2-7
Project Navigator - “ivswitch” project
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4200-SCS Applications Manual Advanced Applications 2-7
Gate
Source
Drain
Substrate
N-Channel
MOSFET
1
2
3
4
5
6
7
8
9101112
A
B
C
D
SMU1
SMU2
SMU3
GNDU
NPN
Transistor
Base
Emitter
1
2
3
4
5
6
7
8
9101112
A
B
C
D
Collector
SMU1
SMU2
SMU3
GNDU
Running test sequences
NOTE For detailed information regarding test and sequence execution, refer to the 4200-SCS
Reference manual.
The “ivswitch” project uses the same ITMs that are used in the “default” project. The primary d
ifference between the two projects is that the “ivswitch” project uses “connect” UTMs to control the switch matrix. As shown in Figure 2-7, there is a “connect” UTM at the beginning of each device test sequence.
A test sequence for a device is executed by selecting the Device
Plan, and then clicking the green
Run button. When a Device Plan is started, the connect test closes the appropriate matrix
crosspoints to connect the instruments to the appropriate device.
All devices may be tested by
Figure 2-8 th
rough Figure 2-12 show the signal paths that are automatically selected for the five
selecting the Subsite Plan and clicking the green Run button.
devices.
Figure 2-8
Signal paths for “4terminal-n-fet” tests
Figure 2-9
Signal paths for “3terminal-npn-bjt” tests
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2-8 Advanced Applications 4200-SCS Applications Manual
1
2
3
4
5
6
7
8
9101112
A
B
C
D
Resistor
SMU1
SMU2
SMU3
GNDU
Diode
SMU1
SMU2
SMU3
SMU4
1
2
3
4
5
6
7
8
9
10
11
12
A
B
C
D
Capacitor
SMU1
SMU2
SMU3
SMU4
1
2
3
4
5
6
7
8
9
10
11
12
A
B
C
D
Figure 2-10
Signal paths for “2-wireresistor” tests
Figure 2-11
Signal paths for “diode” tests
Figure 2-12
Signal paths for “capacitor” test
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4200-SCS Applications Manual Advanced Applications 2-9
“connect” test description
In the Project Navigator, double-click “connect” under the “4terminal-n-fet” device to open the test. The test is shown in Figure 2-13.
Figure 2-13
“connect” test
The “connect” test is a User Test Module (UTM). KITE su Interactive Test Modules (ITMs) and UTMs. A UTM, like an ITM, has Definition, Sheet, Graph, and Status tabs. The operation of each tab, regardless of test module type, is identical except for the Definition tab.
On the UTM De Library, and sets the module parameter values. This information is stored with the UTM when it is saved. When a UTM is executed, the parameters will be passed from the UTM to the user module and the user module will be executed. User libraries and user modules are created and managed using the Keithley User Library Tool (KULT). Refer to the 4200-SCS Reference manual for more information regarding user libraries.
In this example, the “connect” UTM is connected to the Conne Matrixulib user library. ConnectPins has a total of 17 parameters. The first parameter, OpenAll, will cause ConnectPins to open all matrix crosspoints before closing any additional crosspoints. It is a good practice to open all the switch connections before making any new closures. Inadvertent switch closures may damage DUT.
The 16 additional parameters are comprised of eig each specified terminal-pin-pair causes Conne Because the instrument-to-matrix-to-pin connectivity was defined using KCON, KITE is able to automatically connect the specified instrument terminals to the appropriate tester pins.
NOTE If a Pin parameter is < 1, the terminal-pin-pair is ignored and no matrix connections are
made.
finition tab, the user connects the UTM to a User Module located within a User
ctPins to make the desired matrix connection.
pports two types of test modules;
ctPins user module in the
ht terminal-pin-pairs. As shown in Figure 2-14,
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2-10 Advanced Applications 4200-SCS Applications Manual
Connects SMU1 to pin 3 of test fixture
Connects SMU2 to pin 4 of test fixture
Connects SMU3 to pin 5 of test fixture
Connects GNDU to pin 6 of test fixture
1
Opens all relays
Subsite Plan
Figure 2-14
“connect” parameters for “4terminal-n-fet” device

Sequencing tests on multiple devices

For the previous tutorial, a switch matrix was added to the test system to automate connection changes for different devices. When a test sequence for a device (Device Plan) is executed, the “connect” test closes the appropriate matrix crosspoints to connect that device to the appropriate instrumentation. The test sequence stops after the Device Plan has been executed.
This tutorial demonstrates how to run a test s the “ivswitch” project. After all the devices have been tested, the test sequence will stop.
Open “ivswitch” project
If the “ivswitch” project is not currently open, open it using the Open Project item of the File menu on the toolbar. The Project Navigator for the “ivswitch” project is shown in Figure 2-15.
With a switch matrix added to the system, all the devices sequence from the subsite level of the Project Navigator. Figure 2-15 shows the Subs selected (highlighted) to execute.
Figure 2-15
Project Navigator - “ivswitch” project
equence that will automatically test all the devices in
can be tested by starting the test
ite Plan
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4200-SCS Applications Manual Advanced Applications 2-11
Modify test sequence
The Project Navigator shows the execution sequence for the Subsite Plan. As shown in
Figure 2-15, the “4terminal-n-fet” will be tested first, followed by test
s for the other four devices.
The device test sequence may be changed using the Subsite Plan Sequence t exercise shows how to change the test sequence by making “diode” the first device in the sequence:
1. In the Project Navigator, double-click “subsite” to op
Figure 2-16).
2. In the Device Sequence Table, click “diode” to select it. Figure 2-16 shows “diode” selected.
3. Use the Move Up button to move “diode” to the top of the sequence table (Figure 2-17).
4. At the bottom right-hand corner of the Subsite Plan window, click the Apply button to change the sequence (see Figure 2-18).
Figure 2-16
Subsite Plan window
en the Subsite Plan window (see
ab. The following
Figure 2-17
“diode” moved to top of sequence table
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2-12 Advanced Applications 4200-SCS Applications Manual
Figure 2-18
“diode” moved to top of Project Navigator
Execute the test sequence (Subsite Plan)
To select the Subsite Plan, click “subsite” in the Project Navigator. The Subsite Plan name will appear in the execution indicator box as shown in Figure 2-19.
To execute the Su the switch matrix, which connects the device to the instrumentation. The switch matrix was added in the previous application “Controlling a switch matrix” on page 2-2.
While each test is running, the test “vt” is executed, the testing process will stop.
Figure 2-19
Execution indicator box
bsite Plan, click the green Run button. The first test for each device will control
test name will appear in the execution indicator box. After the last

Customizing a user test module (UTM)

This tutorial demonstrates how to modify a user module using the Keithley User Library Tool (KULT). In the “ivswitch” project, there is a test named “rdson.” The “rdson” test measures the drain-to-source resistance of a saturated N-channel MOSFET as follows:
1. Applies 2V to the gate (Vg) to s
2. Applies 3V to the drain (Vd1) and performs a current measurement (Id1).
3. Applies 5V to the drain (Vd2) and performs another current measurement (Id2).
4. Calculates the drain-to-source resistance “rdson” as follows: “rdson” = (Vd2-Vd1) / (Id2-Id1)
aturate the MOSFET.
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4200-SCS Applications Manual Advanced Applications 2-13
The “rdson” test has a potential shortcoming. If the drain current is noisy, the two current measurements may not be representative of the actual drain current. Therefore, the calculated resistance may be incorrect.
In this example, the user module will be performed at Vd1 and 10 more at Vd2. The current readings at Vd1 will be averaged to yield Id1, and the current readings at Vd2 will be averaged to yield Id2. Using averaged current readings smooths out the noise. For details on using KULT, refer to the 4200-SCS Reference manual.
Open KULT
From the desktop, open the KULT tool by double-clicking the KULT icon. The KULT main window is shown in Figure 2-20.
Figure 2-20
KULT main window
be modified in KULT such that 10 current measurements will
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2-14 Advanced Applications 4200-SCS Applications Manual
A. Select Open Library B. Select “ki42xxulib” and click OK
Open the “ki42xxulib” user library
1. From the File menu, select the Open Library item (see Figure 2-21A).
2. From the Open Library window, select “ki42xxulib” as shown in Figure 2-21B and click OK.
Figure 2-21
Open “ki42xxulib” library
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4200-SCS Applications Manual Advanced Applications 2-15
A. Select Open Module B. Select “Rdson42XX.c” and click OK
Open the “Rdson42XX” user module
1. From the File menu, select the Open Module item (see Figure 2-22A).
2. From the Open Module window, select “Rdson42XX.c” as shown in Figure 2-22B, and click OK. The “Rdson42XX” module will open.
Figure 2-22
Open “Rdson42XX” module
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2-16 Advanced Applications 4200-SCS Applications Manual
A. Select Copy Module
B. Select “ki42xxulib” and click OK
C. Type in “RdsonAvg” and click OK
Copy “Rdson42XX” to “RdsonAvg”
The new module will be created by copying the “Rdson42XX” module as “RdsonAvg” and then making the appropriate changes to the test module.
1. From the Fi
2. From the Copy Module window, select “ki42xxulib” as shown in Figure 2-23B and click OK. This selects the library for the module.
3. From the Enter New Module Name window, type in the name as shown in Figure 2-23C and click OK. A dialog box will remind you that the library using the new module will have to be built. Click OK.
Figure 2-23
Copy “Rdson42xx” module as “RdsonAvg”
le menu, select the Copy Module item (see Figure 2-23A).
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Advanced Applications 2-17
Open and modify the “RdsonAvg” user module
From the File menu, select Open Module, and then select “RdsonAvg.c” from the Open Module window. The “RdsonAvg” module is shown in Figure 2-24.
Figure 2-24
KULT module window
Return to Section Topics List 4200-904-01 Rev. E / June 2008
2-18 Advanced Applications 4200-SCS Applications Manual
// Make the connections if ((GatePin > 0) && (DrainPin > 0) && (SourcePin > 0)) {
// Switch matrix used.
conpin(SMU1, GatePin, 0);
conpin(SMU2, DrainPin, 0);
conpin(GND, SMU1L, SMU2L, SourcePin, BulkPin, 0); }
// Force the first point and measure forcev(SMU1, Vg); forcev(SMU2, Vd1); measi(SMU2, Id1);
// Force the second point and measure forcev(SMU2, Vd2); measi(SMU2, Id2);
// Clean up and clear the connections and the instrument devint();
*Rdson = (Vd2-Vd1)/(Id2-Id1); // Calculate Rdson
return( OK );
// Program changes
:
*Rdson10 = (Vd2-Vd1)/(Id2-Id1); // Calculate Rdson10
avgi (SMU2, Id2, 10, 0.01); // Perform averaged I measurement
avgi (SMU2, Id1, 10, 0.01); // Perform averaged I measurement
Modify the user module code
The measi commands are to be replaced with avgi commands. While a measi command performs a single measurement, an avgi command performs a specified number of measurements, and then calculates the average reading. For example:
avgi (SMU2, Id1, 10, 0.01);
For the above command, SMU2 pe
rforms 10 current measurements and then calculates the
average reading (Id1). The 0.01 parameter is the delay between measurements (10ms).
The source code for the module is located in the module code area of the window. In this area, ma
ke the changes indicated in the following NOTE.
NOTE For details on modifying a KULT program, refer to the 4200-SCS Reference manual.
Figure 2-25
Program modifications
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Advanced Applications 2-19
A. Select Save Module B. Select Compile C. Select Build Library
Change a parameter name
With the Parameters tab selected, the parameter names for the module are listed in a table located at the bottom of the window. Change the parameter name “Rdson” (shown in
Figure 2-24) to “Rdson10”. Af
change.
NOTE For details on the Parameters tab, refer to the 4200-SCS Reference manual.
ter typing in the new parameter name, click Apply to enter the
Change the module description
Click the Description tab to display the description for the module. Above DESCRIPTION, change MODULE: Rdson42xx to MODULE: RdsonAvg as shown in Figure 2-26. In addition, replace all
occurrences of Rdson with Rds show the text that is entered on the Description tab in KULT.
Figure 2-26
Module name for Description
on10. In KITE, any UTMs that are connected to this module will
Save, compile, and build the modified library
The user module has to be saved and compiled. Finally, the library must be rebuilt to ensure that the new module is available for use by KITE UTMs. These operations are performed from the File and Options menus.
In the order shown in F will be displayed to indicate that the c details, refer to the 4200-SCS Reference manual.
Figure 2-27
Save, compile, and build library
igure 2-27, save, compile, and build the library. Note that pop-up windows
ompile and library building operations are in process. For
Return to Section Topics List 4200-904-01 Rev. E / June 2008
2-20 Advanced Applications 4200-SCS Applications Manual
A. Select New User Test Module B. Type in “rdson10” and click OK
Add a new UTM to the “ivswitch” project
Open KITE and load the “ivswitch” project
1. From the desktop, open KITE by double-clicking the KITE icon.
2. Open the ivswitch” project from the File menu.
The Project Navigator for the “ivswitch” project is shown in Figu last test for the “4ter
Figure 2-28
Project Navigator for “ivswitch” project
minal-n-fet” device.
re 2-28. Notice that rdson is the
Add a new UTM
1. In the Project Navigator, single-click rdson to select it. This establishes the position for the new UTM.
2. From the Project menu, select New User Test Module (see Figure 2-29A).
3. In the Add New User Test Module (UTM) to Project window, type in the new name as shown in Figure 2-29B and click OK. Figure 2-30 shows the new UTM added to the Project Navigator.
Figure 2-29
Add new UTM
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Advanced Applications 2-21
“rdson10” added
Figure 2-30
“rdson10” added to Project Navigator
Connect the “rdson10” UTM to the “RdsonAvg” user module
In the Project Navigator, double-click “rdson10” test to open it. The test will open in the Workspace with the Definition tab blank.
Referring to Figu box in the UTM. Next, select “Rds
Figure 2-31
“rdson10” UTM
re 2-31, select “ki42xxulib” from the drop-down menu for the User Libraries
onAvg” from the menu for the User Modules box.
Test description
The “rdson10” test measures the drain-to-source resistance of a saturated MOSFET. Using the user-input parameter values shown in Figure 2-31, the MOSFET is tested as follows when “rdson10” is executed:
1. Applies 2V
2. Applies 3V to the drain (Vd1) and performs 10 current measurements.
3. Averages the 10 current readings to yield a single reading (Id1).
4. Applies 5V to the drain (Vd2) and performs 10 more current measurements.
5. Averages the 10 current readings to yield a single reading (Id2).
6. Calculates the drain-to-source resistance (rdson10) as follows: “Rdson10” = (Vd2-Vd1) / (Id2-Id1)
to the gate (Vg) to saturate the MOSFET.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
2-22 Advanced Applications 4200-SCS Applications Manual
4200-904-01 Rev. E / June 2008 Return to Section Topics List

Controlling External Equipment

Section Topics List
Controlling external equipment overview, page 3-2
Controlling a CV Analyzer, page 3-5
Connections, page 3-5
KCON setup, page 3-6
Create a new project, page 3-7
Add a Subsite Plan, page 3-8
Add a Device Plan, page 3-8
Add a UTM, page 3-9
Modifying the “cvsweep” UTM, page 3-11
Executing the test, page 3-11
Controlling a pulse generator, page 3-12
Test system connections, page 3-12
KCON setup, page 3-13
Open the “ivpgswitch” project, page 3-15
Description of tests, page 3-16
Running the test sequence, page 3-19
Compare the test results, page 3-19
Controlling a probe station, page 3-21
Prober control overview, page 3-22
Test system connections, page 3-23
KCON setup, page 3-23
Probe station configuration, page 3-26
Open the “probesubsites” project, page 3-26
Open the project plan window, page 3-27
Test descriptions, page 3-27
Running the test sequence, page 3-31
Test data, page 3-32
Running individual plans or tests, page 3-32
3
3-2 Controlling External Equipment 4200-SCS Applications Manual
In this section, you will learn the following:
Cont
Cont
Cont
Cont
The following equipment is r correlates with the sample data provided with the sample projects.
1 - Keithley Model 4200-SCS with a total of three SMUs (PreAmps not required)
1 - Keithley Model 590 CV Analyzer
1 - Hewlett Packard 8110A/81110A Pulse Generator
1 - Keithley Model 707 or 708 Switch Matrix
1 - Keithley Model 7072 or 7174 8×12 matrix card
1 - Keithley Model 8006 Component Test Fixture
1 - Probe station (manual or supported semi-autom
2 - Keithley Model 4801 BNC cables
1 - Keithley Model 7078-TRX-BNC adapter
1 - Keithley Model 8007-GND-3 cable
4 - Keithley Model 4200-MTRX-X cables (0 if using PreAmps)
8 - Keithley Model 4200-TRX-X cables (11 if using PreAmps)
2 - Keithley Model 7007 GPIB cables
1 - Keithley Model 236-ILC-3 safety interlock cable
rolling External Equipment Overview — Generically describes how external
instruments are controlled by the Model 4200-SCS.
rolling a CV Analyzer — Demonstrates how to create a KITE project that uses a
Keithley Model 590 CV Analyzer to acquire CV data from a MOS capacitor.
rolling a Pulse Generator — Demonstrates how to use the “ivpgswitch” KITE project to control an HP Model 8110A/81110A Pulse Generator. The pulse generator is used to stress a semiconductor device and the effects of the stress are then analyzed.
rolling a Probe Station — Demonstrates how to use the “probesubsites” KITE project to five identical sites (or die or reticles) on a semi-conductor wafer. Each test site is comprised of two subsites (or test element groups). Therefore, the wafer will be probed a total of 10 times.
equired to complete this tutorial and obtain data that functionally
atic) and a wafer containing test devices
(MOS capacitor, N-channel MOSFET, and NPN bi-polar transistor)

Controlling external equipment overview

In general, the Model 4200-SCS can control any external instrument or component connected to either of the following communication interfaces:
IEEE-488 (GPIB) bus
RS-232 (COM1) port
When an external instrument is added to the system configuration, it is grouped into one of the
ing categories:
follow
Switch Matrix
Capacitance Meter
Pulse Generator
Probe Station or Test Fixture
General Purpose Test Instrument
This is illustrated in Figu further discussed in the Reference sections.
4200-904-01 Rev. E / June 2008 Return to Section Topics List
re 3-1. The properties associated with each instrument category are
4200-SCS Applications Manual Controlling External Equipment 3-3
External Instruments
GPI1-8
General Purpose
Test Instrument(s)
PGU1-16
Pulse Generator(s)
CMTR1-8
Capacitance Meter(s)
MTRX1
Switch Matrix
PRBR1
Probe Station
TF1
Test Fixture
Probe
Station
Controller
IEEE-488
or
RS-232
IEEE-488
IEEE-488
IEEE-488
IEEE-488
or
RS-232
Device
Under
Test
(DUT)
Instrument
Terminal
Connections
Test
System
Pins
IEEE-488 and RS-232
Internal Instruments
Safety Interlock
LAN
Model 4200-SCS
INSTRUMENT CONNECTIONS
SMU ONLY
SMU AND GNDU
GNDU
COM 1
INSTRUMENTS
SLOT8SLOT7SLOT6SLOT5SLOT4SLOT3SLOT2SLOT
1
LPT 1
INSTALLATION
CATEGORY I
S E N S E
F O R C E
C O M M O N
SENSE LO GUARD
SENSE LO
COMMON
COMMON
FORCE
SENSE
GUARD
4200 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4200 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4210 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4210 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4200 TM
INTLK
IN
OUT
KEITHLEY
Figure 3-1
System configuration with external instruments
User modules are utilized to acces equipment. User modules are stored in user libraries which are created and maintained with the Keithley User Library Tool (KULT). See the Reference sections for additional information regarding creating and maintaining user libraries.
To execute a KUL
T user module in KITE, you create a KITE User Test Module (UTM) and connect
s these communication interfaces, and hence control external
it to the user module. Once this user module is connected to the UTM, the following occurs each time KITE executes the UTM:
KITE dynam
KITE p
asses the user-module parameters—stored in the UTM—to the user module.
ically loads the user module and the appropriate user library.
Data generated by the user module is returned to the UTM for interactive analysis.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-4 Controlling External Equipment 4200-SCS Applications Manual
KULT Window
User Library
KITE Window displaying UTM Definition
User Library Directory (usrlib)
U
s
er
M
o
d
u
l
e
U
s
e
r
M
o
d
u
l
e
Figure 3-2 below illustrates the relationships between user libraries, user modules, UTMs, KITE,
and KUL
T.
Figure 3-2
Relationships between KULT and KITE and between user libraries, user modules, and UTMs
Keithley provides a number of standard user librar in semiconductor characterization applications. Standard libraries of user modules for the following equipment are provided:
Table 3-1
Supported external equipment table
Category Instrument Keithley User Library / Additional Information
Switch Matrix Keithley Model 707/707A
Switchin
Capacitance Meter
Pulse
nerator
Ge
Probe Station Karl Suss Model PA-200
Test Fixture Keithley Model 8006
Keithley Model 590 CV Analyzer ki590ulib / 4200-SCS Reference manual.
ki595ulib Model 595 Quasistatic CV Meter Instruction Manual
ki82ulib 4200-SCS Reference manual.
Hewlett Packard Model 4284 LCR Meter
Hewlett Packard Model 8110A Pulse Generator
Semiau
Micromanipulator Model 8860 Semiau
Manual and/or Fake probe station prbgen / 4200-SCS Reference manual.
g Matrix
tomatic probe station
tomatic probe station
Component Test Fixture Keithley Model 8007
Sem
iconductor Test Fixture
Generic test fixture (not applicable)
General Pu
rpose Test
Instrument
(any IEEE-488 or RS-232 controlled instrument or equipment)
ies to control external equipment typically used
matrixulib / 4200-SCS Reference manual
ocument number 595-901-01)
(d
hp4284ulib / 4200-SCS Reference manual.
hp8110ulib / 4200-SCS Reference manual.
prbgen / 4200-SCS Reference manual.
prbgen / 4200-SCS Reference manual.
(not applicable)
(not applicable)
(created by user)
NOTE Contact Keithley for the most up to date list of supported external equipment.
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-5
Metal/Polysilicon
Gate Oxide
Silcon Substrate
590 CV Analyzer
INPUT
OUTPUT
BNC
Connectors
Wafer
BNC
Cables
Faraday Shield
GPIB
To the
4200-SCS
Probe Station
Chuck

Controlling a CV Analyzer

This tutorial demonstrates how to control a Keithley Model 590 CV Analyzer to acquire capacitance vs. voltage (CV) data from a MOS capacitor. This tutorial also demonstrates how to create a new KITE project. The new project will contain one User Test Module (UTM) that is connected to a standard CV user module supplied with each 4200-SCS.
The CV Analyzer will apply a linear staircase volt
age sweep to a capacitor. A capacitance measurement will be performed on every voltage step of the sweep. Figure 3-3 shows a typical CV curve generated by this test.
Figure 3-3
Typical CV curve
Connections
Connection details for the Model 590 CV Analyzer are provided in the 4200-SCS Reference manual. In general, the INPUT and OUTPUT connectors of the Model 590 are connected to the capacitor using Model 4801 (RG-58) BNC cables. The Model 590 is controlled by the 4200-SCS through the GPIB bus. Use a Model 7007 GPIB cable to connect the Model 590 to the Model 4200-SCS. Figure 3-4 provides an illustration of
Figure 3-4
Keithley Model 590 CV Analyzer DUT connections
these connections.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-6 Controlling External Equipment 4200-SCS Applications Manual
KCON setup
For this tutorial, the Model 590 CV Analyzer must be included in the 4200-SCS system configuration. The Keithley CONfiguration utility (KCON) is used to add external equipment and instrumentation to the test system. Follow the steps below to add the Model 590 to the system configuration using KCON:
NOTE For details on KCON, refer to the 4200-SCS Reference manual.
Step 1. St
Step 2. Add
Figure 3-5
Adding a Keithley 590 CV Analyzer to the system configuration
Step 3. Set the GPIB ad
Figure 3-6
Setting the Model 590 GPIB address
art KCON. Double click on the KCON icon or use the Start menu, Start -> Programs ->
Keithley -> KCON.
the Keithley Model 590 CV Analyzer to the system configuration using the KCON
Tools menu as illustrated in Figure 3-5.
dress for the Model 590 by selecting the KI 590 CV Analyzer - CMTR1 in
the Configuration Navigator and entering the appropriate GPIB address on the Properties
& Connections tab. This is illustrated in Figure 3-6.
Step 4. Save the config
Figure 3-7
Saving the system configuration
4200-904-01 Rev. E / June 2008 Return to Section Topics List
uration using the KCON File menu as illustrated in Figure 3-7.
4200-SCS Applications Manual Controlling External Equipment 3-7
A. Define New Project window
B. Project Navigator
Create a new project
On the KITE toolbar, select New Project from the File menu (see Figure 3-8) to open the Define New Project
Figure 3-8
New Project menu selection
window. The new project definition window is shown in Figure 3-9A.
Type in the name of the project (cv) shown in the Loca Make sure the specified Number of Sites is 1, and initialization and termination steps are Off.
With the project defined as shown in Fig The project name will appear in the Projec
NOTE For details on creating a project, refer to the 4200-SCS Reference manual.
Figure 3-9
Define new project
tion box is the default location where the factory defined projects are located.
and define it as shown in Figure 3-9A. The directory path
ure 3-9A, click the OK button at the bottom of the window.
t Navigator as shown in Figure 3-9B.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-8 Controlling External Equipment 4200-SCS Applications Manual
Click to add subsite plan
OR
A. Add new Subsite Plan button
B. Project menu
Click to add Subsite Plan
A. Window to specify the
Subsite Plan name
B. Project Navigator
Click to add device plan
OR
A. Add new Device Plan button
B. Project menu
Click to add Device Plan
Add a Subsite Plan
A subsite, or test element group, is a collection of devices to be tested. Open the Add New Subsite Plan to Project window by clicking the Add new Subsite Plan button on the toolbar (see
Figure 3-10A)
(see Figure 3-10B).
Figure 3-10
Add a new Subsite Plan to a KITE project
. It can also be opened by clicking the New Subsite Plan item on the Project menu
With the Add Ne
subsite and
w Subsite Plan to Project window open (see Figure 3-11A), type in the name
click OK. The Subsite Plan appears in the Project Navigator as shown in
Figure 3-11B.
Figure 3-11
Add a new Subsite Plan
Add a Device Plan
1. A Device Plan is a collection of tests to be performed on a particular device. Open the Add New Device Plan to Project window by clicking the Add new Device Plan button on the
toolbar (see Figure 3-12A). It can also be opened by clicking the New Device Plan item on the Project menu (see Figure 3-12B).
Figure 3-12
Add a new Device Plan to a KITE project
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-9
A. Window to specify Device Plan name B. Project Navigator
2. In the window to add a Device Plan (Figure 3-13A), double-click the Capacitor folder to open it, and then click capacitor to select that Device Plan name.
3. With the capacitor Device Plan selected, as shown in Figure 3-13A, click OK at the bottom of the window. The Device Plan will appear in the Project Navigator as shown in
Figure 3-13B.
Figure 3-13
Add a Device Plan
Add a UTM
The “cvsweep” UTM is added to the new project by copying it from the default test library
C:\S4200\kiuser\tests) as follows:
(
1. In the Project Navigator, double-click on the ca window.
2. On the Sequence tab of the Device Plan window, use the Test Library pull-down menu to select the default test library as shown in Figure 3-14.
3. Double-click the Capacitor folder to open it and display the available tests for that device.
Figure 3-15A shows the Capacitor folder opened.
4. For the Capacitor folder, click “cvsweep” to select it. Figure 3-15A shows “cvsweep” selected.
5. Click Copy to place the test in the Test Sequence Table. Figure 3-15A shows “cvsweep” copied into the Test Sequence Table.
6. At the bottom of the Device Plan window, click Apply to copy the test into the Project Navigator. Figure 3-15B shows the “cvsweep” UTM added to the project.
7. If desired, the Device Plan window may be closed by pressing the close (X) button. The close (X) button is located on the right, above the Device Plan window.
pacitor device to open the Device Plan
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-10 Controlling External Equipment 4200-SCS Applications Manual
A. Window to specify the test module name B. Project Navigator
Figure 3-14
Default test library folders
Figure 3-15
Add the “cvsweep” UTM
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-11
Modifying the “cvsweep” UTM
The default “cvsweep” parameters will sweep the voltage from -4V to +6V. If these parameters are acceptable, proceed to “Executing the test” on page 3-11. To modify the parameters, perform the following steps:
1. In the Project Navigator, double-click on the “cv
Figure 3-16 will be displayed:
Figure 3-16
“cvsweep” UTM
sweep” UTM to open it. The window in
2. Click on the De
NOTE For details on the “cvsweep” UTM, refer to the 4200-SCS Reference manual.
Executing the test
Since this new project has only one Subsite Plan and only one Device Plan, the test can be run from any level in the Project Navigator. To run the “cvsweep” test, simply click the green Run button. After the test is finished, use the Sheet and Graph tabs to view and analyze the results.
NOTE The 4200-SCS also supports the Keithley Model 595 Quasistatic C-V Meter and the
Keithley Model 82-WIN Simultaneous C-V System. For more information, refer to the 4200-SCS Reference Manual.
finition tab and make the desired parameter changes to the test.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-12 Controlling External Equipment 4200-SCS Applications Manual
GPIB To the
4200-SCS
(7007 Cable)
Model 7174A Matrix Card
Model 707 or 708 Switch Matrix
1
A
2 3 4 5 6 7 8 9 10 11 12
B
C
D
E
F
SMU1
SMU2
SMU3
SMU4
Probe Station
Safety
Interlock
To the
4200-SCS
(236-ILC-3
Cable)
Pin
1
Pin
2
Pin
3
Pin
4
Pin5Pin
6
Pin
7
Pin8Pin9Pin10Pin11Pin
12
Drain
Substrate
Source
N-Channel
MOSFET
Wafer Subsite
Gate
GNDU
Pulse
Generator
Chassis GND
COMMON
GPIB
To the
4200-SCS
(7007
Cable)
(8007-GND-3
Cable)
4200-MTRX-X
or
4200-TRX-X
Cables
7078-TRX-BNC
Adapter
4801 BNC
Cable
4200-TRX-X
Cables

Controlling a pulse generator

This tutorial demonstrates how to control a pulse generator to stress a semiconductor device and analyze the effects of the stress. The applied stress is a burst of 3.5V pulses across the gate-substrate (bulk) terminals of an N-Channel MOSFET
. The basic test sequence is as follows:
1. Measure the transfer characteristics
of the device before the stress.
2. Apply a stress burst of 3.5V pulses.
3. Measure the transfer characteristics of the device after the stress.
ter-stress characteristics can then be compared to the before-stress characteristics.
The af
Test system connections
A typical test system for this application is shown in Figure 3-17. As shown, the Model 4200-SCS, HP Model 8110A/81110A Pulse Generator (PGU), an Low Current Matrix Card. User Test Modules (UTMs) are used to control the switch matrix and the PGU. For details on SMU, GNDU (Ground Unit) and matrix card connections, refer to the 4200­SCS Reference manual.
The Model 7174A matrix card is installed in the Model 707/707A or Model 708/708A Switching Matrix. The s
witch matrix and PGU are controlled through the GPIB. Use the Model 7007 GPIB cables to connect the switch matrix and PGU to the Model 4200-SCS. For details on GPIB connections, refer to the 4200-SCS Reference manual.
Figure 3-17
Test system for “ivpgswitch” project
d the DUT are connected to the Model 7174A
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-13
KCON setup
For this tutorial, a Hewlett Packard Model 8110A/81110A Pulse Generator, Keithley Model 707A Switching Matrix, Keithley Model 7174A Low Current Matrix Card, and a test fixture must be added to the system configuration. The Keithley CONfiguration utility (KCON) is used to add external equipment and instrumentation to the test system. Follow the steps below to add these components to the system configuration. Detailed information regarding KCON can be found in the 4200-SCS Reference manual.
Step 1. St
Step 2. Add
Figure 3-18
Adding a pulse generator
Step 3. Set th
Figure 3-19
Pulse generator configuration
art KCON. Double click on the KCON icon or use the Start menu, Start -> Programs ->
Keithley -> KCON.
the Hewlett Packard Model 8110A/81110A Pulse Generator to the system
configuration using the KCON Tools menu as illustrated in Figure 3-18.
e GPIB Address for the pulse generator by selecting it in the Configuration Navigator and entering the appropriate GPIB Address on the Properties & Connections tab. This is illustrated in Figure 3-19.
Step 4. Add the Ke
the KCON Tools menu as illustrated in Figure 3-20.
Figure 3-20
Adding a switch matrix
ithley Model 707/707A Switching Matrix to the system configuration using
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-14 Controlling External Equipment 4200-SCS Applications Manual
Step 5. Set the GPIB Address for the switch matrix and add the 7174A matrix card in Slot 1 as
illustrated in Figure 3-21.
Figure 3-21
Configuring the switch matrix
Step 6. Add
a manual probe station to the system configuration using the KCON Tools menu as illustrated in Figure 3-22. If a test fixture is already part of the config removed before the probe station can be added. T the system configuration, select it in the Configuration Navigator and press the DELETE key.
Figure 3-22
Adding a probe station
Step 7. Con
nect the instrument terminals and probe station pins to the switch matrix by selecting the KI 7174 Matrix Card - CARD1 in the Configuration Navigator and configuring it as illustrated in Figure 3-23. Detailed information regarding s be found in the 4200 Reference Manual - Appendix B, “Using Switch Matrices”.
uration, it must be
o remove any external component from
witch matrix configuration can
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-15
Figure 3-23
Connecting the switch matrix
Step 8. Save the config
Figure 3-24
Saving the system configuration
uration using the KCON File menu as illustrated in Figure 3-24.
Open the “ivpgswitch” project
Open the “ivpgswitch” project from the File menu (select Open Project). The Project Navigator for the “ivpgswitch” project is shown in Figure 3-25.
Figure 3-25
Project Navigator - “ivpgswitch” project
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3-16 Controlling External Equipment 4200-SCS Applications Manual
Connects SMU1 to pin 3 of test fixture
Connects SMU2 to pin 4 of test fixture
Connects SMU3 to pin 5 of test fixture
Connects SMU4 to pin 6 of test fixture
Opens all relays
Gate
Source
Drain
Substrate
N-Channel
MOSFET
SMU1
SMU2
SMU3
1
2
3
4
5
6
A
B
C
D
E
F
GND
SMU4
PGU
LO
Description of tests
The project tests are described in the same order that they are presented in the Project Navigator.
First “connect” test
The first test, “connect”, is a UTM that connects the device to the four SMUs. In the Project Navigator, double-click the first “connect” UTM to open it. Figure 3-26 shows the parameters that connect the device to the SMUs. Note that the first parameter (line 1) have been closed by a previous test. For the other parameter shown in Figure 3-26, the device connects to the SMUs as shown in Figure 3-27.
NOTE For details on the “connect” UTM, refer to the 4200-SCS Reference Manual.
Figure 3-26
First “connect” test - connects the device to the SMUs
opens any relays that may
Figure 3-27
Signal paths for the pre and post stress tests
First “id-vg” test
The “id-vg” ITM measures the transfer characteristics of the N-channel MOSFET. The ID vs. VG data points are graphed. The test also calculates and graphs transconductance. This is the before- stress characterization test.
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-17
Connects PGU to pin 5 of test fixture
Connects GNDU to pin 6 of test fixture
Gate
Source
Drain
Substrate
N-Channel
MOSFET
1
2
3
4
5
6
A
B
C
D
E
F
SMU2
SMU3
GND
SMU4
PGU
LO
SMU1
Initializes HP 8110
Second “connect” test
This “connect” UTM connects the device to the PGU and the Ground Unit (GNDU). In the Project Navigator, double-click the second “connect” test to open it. Figure 3-28 shows the parameters that connect the device to the PGU. Not shown is line 1 (OpenA the previous “connect” test. Line 1 is shown in Figure 3-26.
ll) that opens the relays closed by
For the parameters shown in Fig
ure 3-28, the device connection pathways to the PGU and GNDU
are shown in Figure 3-29. Keep in mind that if your physical matrix connections are different, you will have to change the connection parameters
in the UTM accordingly.
Figure 3-28
Second “connect” test - connects the device to the PGU
Figure 3-29
Signal paths to apply the pulse stress
“pgu1-init” test
In the Project Navigator, double-click “pgu1-init” to open the test. This one parameter test (see
Figure 3-30) initializes the PGU. For exam
triggering. More information on the initialized s Definition tab. For details on the UTMs for the pulse generator, refer to the 4200-SCS Reference manual.
Figure 3-30
PGU initialization
Return to Section Topics List 4200-904-01 Rev. E / June 2008
ple, it disables the output, resets errors and sets
tate is provided in the DESCRIPTION area of the
3-18 Controlling External Equipment 4200-SCS Applications Manual
Rise
Time
(100ns)
Fall
Time
(100ns)
Width
1
µ
s
Period
5
µ
s
Base Value
(0V)
Amplitude
(3.5V)
Triggers burst of pulses
“pgu1-setup” test
In the Project Navigator, double-click “pgu1-setup” to open the test. The complete parameter listing for the test is shown in Figure 3-31. These parameters to configure the PGU are explained in the DESCR
IPTION area of the Definition tab.
Figure 3-32 sho
ws the pulse that is configured by this test. Note that the pulse is not drawn to
scale.
Figure 3-31
“pgu1-setup” - configure the PGU channel
Figure 3-32
PGU stress pulse specifications
“pgu-trigger” test
In the Project Navigator, double-click “pgu-trigger” to open the test. The 2-line parameter list for this test is shown in Figure 3-33. This test triggers the PGU to output 60,000 pulses to the N-channel MOSFET.
Figure 3-33
“pgu-trigger” test - trigger the burst of stress pulses
Third “connect” test
This “connect” test is the same as the first “connect” test. That is, it connects the device to the SMUs so that the transfer characteristics can be determined after applying the pulse stress (see
4200-904-01 Rev. E / June 2008 Return to Section Topics List
Figure 3-26 and Figure 3-27).
4200-SCS Applications Manual Controlling External Equipment 3-19
Click to close displayed test
Click to reduce size of all test documents
Second “id-vg” test
This “id-vg” test is the same as the first “id-vg” test. That is, it measures the transfer characteristics of the N-channel MOSFET. This is the after-stress characterization test.
Running the test sequence
To run the test sequence, select (click) the “4terminal-n-fet” device in the Project Navigator, and then click the green Run button. The test sequence is summarized in Table 3-2.
Table 3-2
Test sequence for “ivpgswitch” project
Test Description
1 “connect” Connects the MOSFET to the four SMUs.
2 “id-vg” Measures the initial transfer ch
3 “connect” Connects the MOSFET to the PGU.
4 “pgu1-init” Initializes the PGU.
5 “pgu1-setup” Configures the PGU output pulse.
6 “pgu-trigger” Triggers the PGU to output a burst of pulses.
7 “connect” Connects the MOSFET to the four SMUs.
8 “id-vg” Measures the final transfer characteristics of
aracteristics of the MOSFET.
the MOSFET.
Compare the test results
A way to compare “id-vg” test results is to do a side-by-side visual inspection of the two graphs. In the Project Navigator, double-click the two “id-vg” tests to open them in the Workspace.
Close some UTMs ­Workspace. Figure 3-34 shows the button to close a displayed test.
Make room for the graphs ­expand the size of the Workspace; and (2) reduce the size of the test documents. The close button (X) is located at the top right-hand corner of the Project Navigator. Figure 3-34 shows the button to reduce the size of the test documents in the Workspace.
Figure 3-34
Buttons to close or reduce size of test documents
Position tests side-by-side ­document and dragging it to the desired location in the Workspace.
To reduce clutter, you may want to remove any other tests (UTMs) from the
To make room for the two graphs, (1) hide the Project Navigator to
A test document is moved by clicking the title bar at the top of the
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-20 Controlling External Equipment 4200-SCS Applications Manual
A. Before-stress graph B. After-stress graph
A. X-axis B. Y-axis C. Y2-axis
Display the graphs - The graph for each test is displayed by clicking the Graph tab. Figure 3-35 shows typical graphs for the two “id-vg” tests.
Figure 3-35
“id-vg” graphs
Scale settings - T
o effectively compare the two graphs, they must both have the same scale settings. Figure 3-36 shows the scale settings for the graphs in Figure 3-35. Scale settings for a graph are set by clicking the Axis Properties item
in the Graph menu. A Graph menu is displayed by placing the mouse pointer in an open area of the graph, and then right-clicking the mouse. Keep in mind that there is a separate Graph menu (and Axis Properties window) for each graph.
Figure 3-36
Graph scale settings
Compare graphs -
Visually inspect the two graphs for differences caused by the stress. You can
also click the Sheet tabs and compare the data collected for the two tests.
Overlaying graphs
Another way to compare the two graphs is to lay the after-stress graph over the before-stress graph as follows:
1. For the af
2. Select all five columns by clicking and dragging the mouse pointer from column A through column E. Press CTRL + C to copy those columns.
3. For the before-stress test, click the Sheet tab, and then the Calc tab (located at the bottom).
4200-904-01 Rev. E / June 2008 Return to Section Topics List
ter-stress test, click the Sheet tab to display the data spreadsheet.
4200-SCS Applications Manual Controlling External Equipment 3-21
Subsite 1
112
Subsite 2
112
Subsites or Test
Element Groups
Site or Die
or Reticle
Final
Product
Die
Probe Pads
4. In the Calc spreadsheet, click cell A1 to select it, and then press CTRL + V. This pastes the copied columns into the Calc spreadsheet. This after-stress data is now available to be graphed.
5. In the Calc spreadsheet, give the DrainI and GM columns new names to distinguish them as after-stress (AS) data. For example, change DrainI to DrainI(AS), and change GM to GM(AS).
6. Click the Graph tab for the present test (before-stress). In an open area of the graph, right- click the mouse to open the graph menu. In the graph menu, click Define Graph to open the Graph Definition window.
7. In the Graph Definition window, click the Y1/DrainI(AS) cell and the Y2/GM(AS) cell to select them, and click OK. The graph will now show the overlaid data.
8. From the graph menu, use the Legend and Graph Properties - Series items to add a legend and to change the line properties of the graph, if desired.

Controlling a probe station

This tutorial demonstrates how to control a probe station to test five identical sites (or die or reticles) on a sample wafer. Each wafer site has two subsites (or test element groups). At each subsite there are two devices (or test elements) to be tested; a 4-terminal N-channel MOSFET and a 3-terminal NPN transistor. The subsites need not be identical, but for simplicity they are assumed to be the same. This is illustrated below in Figure 3-37.
Figure 3-37
Sample wafer organization
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3-22 Controlling External Equipment 4200-SCS Applications Manual
Prober control overview
NOTE The information provided in this overview is a summary of the information provided in the
4200-SCS Reference manual.
A probe station, like any other external instrument, is controlled by the 4200-SCS through user modules. Basic
prbgen, is provided with the 4200-SCS to facilitate prober control. This generic prober user library,
system connections are illustrated in Figure 3-1. A library of user modules, called
developed and maintained by Keithley, allows KITE to control all supported probers in the same manner. Therefore, KITE projects utilizing
prbgen will work with any prober supported by Keithley.
Refer to Ta bl e 3-3 for the list of supported prober.
Table 3-3
Supported probers
Supported Probe Station Additional Information
Karl Suss Model PA-200
Micromanipulator Model 8860
Manual (or Fake)
Refer to the 4200-SCS Reference manual.
NOTE Contact Keithley for the most up to date list of supported probe stations.
Sophisticated prober control software, available from each supported prober vendor, provides ac
cess to the full feature set of each prober. In all cases, this prober control software provides the ability to define a list of wafer locations to be probed. The 4200-SCS relies on the prober controller, and associated software, to maintain this probe list. The
prbgen user modules communicate with
the prober controller, through the GPIB bus or COM1 port in most cases, to instruct it to step through the probe list. This technique of prober control is referred to as learn mode because the prober control software is taught where each probe location is physically located. Tab le 3-4 summarizes the user modules included in the
prbgen prober control user library.
Table 3-4
prbgen user modules
User Module Description
PrInit Initializes the prober driver and establishes the referen
or UTM data acquired by KITE will be tagged with [row, column] site coordinate information that is relative to the reference site.
PrChuck Instructs the prober to move the probe station chuck up or down, making or
king contact between the wafer and test system pins (probe needles).
brea
PrSSMovNxt Instructs the prober to move to the next subsite (or test element group) in the
e list.
prob
PrMovNxt Instructs the prober to move to the next site (or die) in the probe list.
Before a KITE project
that utilizes the prbgen user library can be executed, the probe list must be
ce site (or die). All ITM
created using the appropriate prober control software. Helpful instructions for creating the probe list for each supported prober are included in the 4200-SCS Reference sections. Refer to
Ta bl e 3-3 for additional information.
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-23
GPIB
To the
4200-SCS
(7007 Cable)
Model 7174A Matrix Card
Model 707 or 708 Switch Matrix
1
A
234567891011
12
B
C
D
SMU1
SMU2
SMU3
GNDU
Probe Station
Safety
Interlock
To the
4200-SCS
(236-ILC-3
Cable)
Pin1Pin2Pin3Pin4Pin5Pin
6
Pin
7
Pin8Pin9Pin10Pin11Pin
12
Drain
Substrate
Source
N-Channel
MOSFET
Wafer Subsite
Gate
4200-MTRX-X
or
4200-TRX-X
Cables
4200-TRX-X
Cables
Collector
Base
Emitter
NPN
Transistor
Test system connections
A typical test system for this tutorial is shown in Figure 3-38. As shown, the Model 4200-SCS and probe station are connected to a 7174A matrix card. The matrix card is installed in the switch
atrix and the switch matrix and probe station are controlled through the GPIB bus. For
m connection details as well as information on the Keithley CONfiguration Utility, refer to the 4200­SCS Reference manual.
Figure 3-38
System configuration for the “probesubsites” project
KCON setup
For this tutorial, the following external equipment must be added to the system configuration:
Switch matrix
Matrix card
Probe station
The Keithley CONfiguration utility (KCON) is used to ad to the test system. Below is a step by step procedure for adding the necessary equipment to the system configuration:
Step 1. St
art KCON. Double click on the KCON icon or use the Start menu, Start -> Programs ->
Keithley -> KCON.
d external equipment and instrumentation
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-24 Controlling External Equipment 4200-SCS Applications Manual
Step 2. Add the Keithley Model 707/707A Switching Matrix to the system configuration using
the KCON Tools menu as illustrated in Figure 3-39.
Figure 3-39
Adding a switch matrix
Step 3. Set th
e GPIB Address for the switch matrix and add the 7174A matrix card in Slot 1 as
illustrated in Figure 3-40.
Figure 3-40
Configuring the switch matrix
Step 4. Add
a manual probe station to the system configuration using the KCON Tools menu as illustrated in Figure 3-41. If a test fixture is already part of the config removed before the probe station can be added. T the system configuration, select it in the Configuration Navigator and press the DELETE key.
Figure 3-41
Adding a probe station
4200-904-01 Rev. E / June 2008 Return to Section Topics List
uration, it must
o remove any external component from
4200-SCS Applications Manual Controlling External Equipment 3-25
Step 5. Connect the instrument terminals and probe station pins to the switch matrix by selecting
the KI 7174 Matrix Card - CARD1 in the Configuration Navigator and configuring it as illustrated in Figure 3-42. Detailed information regarding switc
h matrix configuration can
be found in the 4200-SCS Reference manual.
Figure 3-42
Connecting the switch matrix
Step 6. Save the config
uration using the KCON File menu as illustrated in Figure 3-43.
Figure 3-43
Saving the system configuration
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-26 Controlling External Equipment 4200-SCS Applications Manual
Probe station configuration
Before KITE can begin controlling a probe station, the probe station must be properly configured. Probe station configuration includes:
1. Making test system measurement and communication connections.
3. Loading and aligning the wafer.
2. Creating a probe list using the appropriate prober control software.
Helpful configuration instructions for each supported prober are include in the 4200-SCS
ference sections. Refer to Table 3-3 for additional information. Because this tutorial uses a
Re Manual probe station, probe station configuration is To configure a manual probe station, simply connect the test system measurement signals to the probe station as indicated in Figure 3-38 and align the prober to the first subsite (test element group) in the test sequence.
simple because step 2 above can be omitted.
Open the “probesubsites” project
Open the “probesubsites” project from the File menu on the KITE toolbar (click Open Project). The Project Navigator for the “probesubsites” project is shown in Figure 3-44.
Figure 3-44
Project Navigator - probesubsites project
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-27
Open the project plan window
In the Project Navigator, double-click “probesubsites” to open the project plan window. For this tutorial, five sites on a wafer are to be tested. As shown in Figure 3-45, set up the project plan as follows and click the Ap
ply button at the bottom right-hand corner of the window:
Enable () P
Enable ()
Start Execution at Site: 1
Finish Execution at Site: 5
Figure 3-45
Modified project plan settings
roject Inititialization Steps
Project Termination Steps
Test descriptions
Test descriptions for the “probesubsites” project are provided in Tab le 3-5. Tests can be opened in the Workspace by double-clicking them in the Project Navigator.
NOTE The “connect” UTMs are used to control the switch matrix.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-28 Controlling External Equipment 4200-SCS Applications Manual
Line 1 — Parameter value 6 selects the Learn control mode. Assumes that the probe list is
maintained by the prober controller software.
Lines 2 and 3 — These parameters (along with the units setting in Line 6) input a die size
of 22mm x 22mm.
Lines 4 and 5 — These parameters input the initial prober position as the 0, 0 coordinates. Line 6 — Parameter value 1 sets units for die size (lines 2 and 3) to metric.
Table 3-5
“probesubsites” test descriptions
“probesubsites” Project Test Description
InitializationSteps
prober-init Initializes the prober driver (see Fig
Subsite1
4terminal-n-fet
connect
vds-id-1x
3terminal-npn-bjt
connect vce-ic-1x probe-ss-move
Subsite2
4terminal-n-fet
connect
vds-id-2x
3terminal-npn-bjt
connect vce-ic-2x probe-ss-move
TerminationSteps
prober-separate prober-prompt
Connects the SMUs to the probes for the N-channel MOSFET (see Fig Generates a family of curves (ID vs. VD) for the MOSFET.
Connects the SMUs to the probes for the NPN transistor (see Fi Generates a collector family of curves (IC vs. VC) for the transistor. Moves prober to ne
Connects the SMUs to the probes for the N-channel MOSFET (see Fig Generates a family of curves (ID vs. VD) for the MOSFET.
Connects the SMUs to the probes for the NPN transistor (see Fi Generates a collector family of curves (IC vs. VC) for the transistor. Moves prober to the first subsite of the next site.
The following steps occur after all three sites are tested: Separates the prober pins from the wafer (see Figu Displays a pop-up window indicating that testing is finished (see Figure 3-50).
xt subsite.
ure 3-46).
ure 3-47).
gure 3-48).
ure 3-47).
gure 3-48).
re 3-49).
Figure 3-46
prober-init
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-29
SMU1
Gate
Source
Drain
Bulk
N-Channel
MOSFET
1
23
4
5
6
7
8
9
Columns
Rows
A
B
C
D
SMU2
SMU3
GNDU
NPN
Transistor
Base
Emitter
Collector
Matrix Card
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Wafer Subsite
Probe Station
SMU1
Gate
Source
Drain
Bulk
N-Channel
MOSFET
1
23
4
5
6
7
8
9
Columns
Rows
A
B
C
D
SMU2
SMU3
GNDU
NPN
Transistor
Base
Emitter
Collector
Matrix Card
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
Pin 8
Pin 9
Wafer Subsite
Probe Station
Figure 3-47
Connect SMUs to N-channel MOSFET
Figure 3-48
Connect SMUs to NPN transistor
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-30 Controlling External Equipment 4200-SCS Applications Manual
Line 1 — Parameter value 0 separates the prober pins from the wafer.
Line 1 — Parameter value 3 specifies three lines of text to be
displayed.
Lines 2 thru 4 — Text messages to be displayed in dialog window
A. Prober-prompt test window
B. Dialog window
Figure 3-49
prober-separate
Figure 3-50
prober-prompt test and dialog window
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Controlling External Equipment 3-31
Subsite1
4terminal-n-fet
connect
vds-id-1x
3terminal-npn-bjt
connect
vce-ic-1x
Subsite2
4terminal-n-fet
3terminal-npn-bjt
connect
vce-ic-2x
probe-ss-move
Site 1
probe-ss-move
vds-id-2x
connect
Start
InitializationSteps
ProbeInit
probesubsites
Subsite1
4terminal-n-fet
connect
vds-id-1x
3terminal-npn-bjt
connect
vce-ic-1x
Subsite2
4terminal-n-fet
3terminal-npn-bjt
connect
vce-ic-2x
probe-ss-move
probe-ss-move
vds-id-2x
connect
Stop
TerminationSteps
prober-separate
prober-prompt
Site 2
Running the test sequence
The five wafer sites are tested as follows:
1. Manually align the prober to test Subsite 1 of Site 1
. Make sure the prober pins are making
contact with the wafer probe pads.
2. In the Project Navigator, click “probesubsites” in the KITE Project Navigator to select the project.
3. Click the green Run button to execute the test sequence.
NOTE Because a manual probe station is being used, the prober will not actually move when the
prober control UTMs are executed. However, a pop-up dialog window will appear instructing you to move the probes to the next subsite in the test sequence.
The test sequence is shown in Fig for Subsite 1 and Subsite 2 are performed at Site 1.
ure 3-51. After the prober is initialized by “prober-init”, the tests
The last test for Site 1 (“probe-ss-move”)
moves the prober to Site 2 where the subsite tests are repeated.
After all five sites are tested, the prober pins separate from the wafer (prober-separate), and a dialog window Click OK to c
(prober-prompt) will alert that the test sequence is finished (see Figure 3-50B).
ontinue.
Figure 3-51
Test sequence
Return to Section Topics List 4200-904-01 Rev. E / June 2008
3-32 Controlling External Equipment 4200-SCS Applications Manual
Click to increment or
to decrement site number
vce-ic-2x
(test name)
@2
(site number)
#1
(UID number)
Test data
Since five sites were tested, there will be five sets of test data; one for each site. Remember, a test is opened by double-clicking it in the Project Navigator. Test data is viewed by clicking the Graph or Sheet tab for the test.
When you double-click a test to open it, its test da
ta corresponds to the site number displayed by the Site Navigator at the top of the Project Navigator. As shown in Figure 3-52, click the up or down arrow to change the site number. For example, to view test data for Site 2, set the Site Naviga
tor to Site 2 and double-click the desired test.
Figure 3-52
Site Navigator
The title bar at the top of the KITE p
Figure 3-53, test “vce-ic-2x” for Site 2 is being disp
anel indicates which test is presently being displayed. In
layed. The unique identifier (UID) number
distinguishes this test from any other test having the same name.
Figure 3-53
KITE title bar
Running individual plans or tests
You can run any Subsite Plan, Device Plan, or test in the project. The test sequence will stop after the plan or test is finished. The following steps show how to run the “3terminal-npn-bjt” Device Plan for Subsite 2 of Site 2:
1. Manually position the prober to test Subsite 2 making contact with the subsite pads.
2. Set the Site Navigator to Site 2.
3. In the Project Navigator, click “3terminal-npn-bjt” for Subsite2 to select the Device Plan.
4. Click the green Run button to start the test sequence.
4200-904-01 Rev. E / June 2008 Return to Section Topics List
of Site 2. Make sure the prober pins are

Pulse Applications

Section Topics List
Charge Pumping, page 4-2
CP Procedure, page 4-2
Charge pumping UTM descriptions, page 4-6
amplsweep, page 4-6
basesweep, page 4-8
FallTimeLinearSweep, page 4-9
FreqFactorSweep, page 4-10
FreqLinearSweep, page 4-12
RiseTimeLinearSweep, page 4-13
Pulse IV, page 4-15
Introduction (PIV-A and PIV-Q), page 4-15
PIV-A test connections, page 4-17
Using the PulseIV-Complete project for the first time, page 4-24
Pulse IV UTM descriptions, page 4-36
cal_pulseiv, page 4-36
vdsid_pulseiv, page 4-37
vgsid_pulseiv, page 4-47
scopeshot_pulseiv, page 4-51
vdsid_pulseiv_demo, page 4-53
vgsid_pulseiv_demo, page 4-53
scopeshot_pulseiv_demo, page 4-53
Slow single pulse charge trapping high K gate stack, page 4-54
Charge trapping procedure, page 4-55
Charge Trapping UTM descriptions, page 4-58
chargetrapping_single_pulse_slow, page 4-58
AC stress for WLR, page 4-61
Q-Point Pulse IV – Model 4200-PIV-Q, page 4-64
PIV-Q Test Procedure, page 4-65
Interconnect Assembly Procedure, page 4-66
Using the Model 4200 Project QPulseIV-Complete for the first time, page 4-70
Running AutocalScope, page 4-71
Running CableCompensation, page 4-71
PIV-Q user libraries, page 4-77
Pulse adapters, cables, hardware and PCU, page 4-118
4
4-2 Pulse Applications 4200-SCS Applications Manual
Flash Memory Testing, page 4-119
Introduction, page 4-119
Theory of operation, page 4-119
FLASH Connections, page 4-132
Flash Projects, page 4-140
There are many possible applications for using pulse source and measure with DC source and measure. This section contains the following:
Charge pumping for interface characterization for CMOS (requires one channel of the pulse g
enerator card and one Model 4200 SMU)
Pulse IV to eliminate charge trapping or self-heating effects in new CMOS material and structur
Slow Single Pulse Charge Trapping for high K package)
AC stress for WLR (requires pulse generator ca switch matrix and RBTs)
The Model 4200-PIV-Q package provides q-point pulse IV testing for higher power comp duty cycle pulse IV testing.
e technologies (requires full 4200-PIV package)
gate stack structures (requires PIV-A
rd and Model 4200 SMUs, and optionally a
ound semiconductor or LDMOS RF transistors, or any device may benefit from low
NOTE The various adapters, cables and hardware used for pulsing are shown in Figure 4-50
(located at the end of this section).

Charge Pumping

Charge Pumping (CP) is a useful technique for understanding gate stack behavior, that is increasingly important as high κ films become more commonly used for transistor gates. CP
racterizes interface and charge-trapping phenomena. The change in the CP results can be
cha used to determine the amount of degradation caused by typical reliability test methods, employing either DC or pulsed stress: hot carrier injection (HCI), negative bias temperature instability (NBTI), and time dependent dielectric breakdown (TDDB).
Pulsed voltage provides a key capability for investigating inherent material, interface, and properties of high κ films, and devices based on these new films simultaneously measuring the DC current is the basis for charge pumping, that is valuable for measuring inherent charge trapping. Used in conjunction with DC or pulsed stress, CP can also study charge trapping, as well as new charge creation on the high κ-Si interface and within the
igh κ film. Pulsed stress also provides a stress me
h the in-circuit devices, that is useful for various device reliability tests, including NBTI, TDDB, and HCI. In addition, pulsed stress provides insight into device reliability behaviors not available using DC stress. Pulsed stress complements traditional DC techniques to provide a better understanding of device reliability behavior.
This application demonstrates CMOS charge pum schematic in Figure 4-1 shows source and drain of the transistor connected to ground, while the gate is pulsed with fixed frequency and amplitude. The body is connected to ground using a
urce-Measure Unit (SMU), that is used to measure the current through the gate (I
So
reliability
. Pulsing a voltage while
thod that better mimics actual stresses seen by
ping for interface characterization. The
).
CP
NOTE Although the pulse train must be applied to the DUT before the SMU current
measurement begins, there is no strict timing requirement between the pulse applied to DUT and the corresponding SMU current measure. An oscilloscope may be used to monitor the pulse characteristics for initial setup and troubleshooting, but is not used for pulse measurement during the test.
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Pulse Applications 4-3
4200-PG2
Measure I
Pulse Generator
V
g
Output
4200-SMU (1)
Source
Drain
Substrate
Gate
CP Procedure
1. Connect DUT (transistor) as shown in Figure 4-2. Make sure source and drain are connected to ground.
2. Choose desired test method (Figure 4-3). For a brief overview of the test methods contained in this manual, refer to . To go directly to a specific charge pumping UTM, see the list of test methods and page numbers below:
NOTE Each CP test method is in a separate UTM (User Test Module).
• Amplitude sweep — see
Base voltage sweep — see
• Fall time sweep — see
• Frequency factor sweep — see
• Frequency linear sweep — see
• Rise time linear sweep — see
3. Choose voltage (V) steps and current (I) measurement parameters.
4. The UTM then pulses gate with a train of pulses at a fixed base/amplitude.
5. While pulsing, the UTM will measure DC substrate current with SMU.
6. Once one measurement is finished, change pulse characteristics and re-measure again. Pulse parameters are changed based on type of voltage sweep. See upper half of
Figure 4-3 for type of sweeps. Both plots in Figure 4-3 (base voltage sweep and amplitude
sweep) show ICP (measured charge pumping current) vs. pulse voltage.
Figure 4-1
Charge Pumping—hardware setup block diagram
NOTE The pulse width is not explicitly set, but is derived from the frequency and the duty cycle.
Table 4-1
Key pulse generator parameters
Parameters Range/Specification
Variable rise time and fall time 100ns to 500us
Duty cycle 0.01% to 99%, default 50%
Frequency 100 Hz to 12.5 MHz
Pulse amplitude -5 to +5V
1
Base + Amplitude must not exceed -5V or +5V absolute.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
4-4 Pulse Applications 4200-SCS Applications Manual
4205
PG2
Model 4200-SCS
Instrument Slots
4200
SCP2HR
V
G
INSTRUMENTS
SLOT8SLOT7SLOT6SLOT5SLOT4SLOT3SLOT2SLOT
1
4200 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4200
SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4210 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
4210 SMU
SENSE LO
SENSE
FORCE
PA CNTRL
KEITHLEY
KEITHLEY
Channel 1
Channel 2
Ext
Trg
Ext Clk
NOTE Use torque wrench to tighten SMA
connections to 8 inch-lbs.
Model 4205-PG2
Model 4200-SMU (1)
4200-MTRX-X
Cable (2m, 6ft)
Substrate
Pulse
Output
DC Output
Source
Gate
Drain
Adapter (if required) Triax (female) to BNC (male)
Adapter (if required) BNC (female) to SMA (male)
CHANNEL 1
KEITHLEY
TRIGGER
OUT
CHANNEL 2
TRIGGER
IN
White SMA Cable (2m, 6ft)
(male-to-male)
1.8E–15
1.6E–15
1.4E–15
1.2E–15
1.0E–15
800.0E–18
600.0E–18
400.0E–18
200.0E–18
0.0E+0
I
CP
Base V
–2.0E+0 –1.0E+0 0.0E+0 1.0E+0
80.0E–12
70.0 E–12
60.0E–12
50.0 E–12
40.0E–12
30.0 E–12
20.0 E–12
10.0 E–12
0.0E+0
–10.0E–12
I
CP
Amplitude V
1.0E+0 2.0E+0 3.0E+0
V
t
V
fb
V
t
V
fb
Amplitude SweepBase Level Voltage Sweep
Table 4-1 (cont.)
Key pulse generator parameters
Parameters Range/Specification
Base voltage +/- 5V
1
Load impedance 50Ω or 1MΩ.
1
Base + Amplitude must not exceed -5V or +5V absolute.
Figure 4-2
Charge pumping — hardware connection
Figure 4-3
Two types of sweeps for charge pumping
7. Outputs curves:
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Pulse Applications 4-5
N
it
I
CP
qfA
---------=
D
it
I
CP
qAfΔE
-----------------=
-1.0 -0.5 0.0 0.5 1.0 1.5
nFET W/L=10/1 m
V
base_fixed
= -1.0V
V
peak
[V]
1MHz N2O 800C 100kHz N2O 800C 10kHz N2O 800C
-1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2
0.0
0.5
1.0
1.5
2.0
2.5 V
peak_fixed
= 1.2V
nFET W/L=10/1 m
1 MHz
100 kHz
10 kHz
V
base
[V]
Amplitude Peak [V] Base Voltage[V]
10
9
10
10
10
11
a. Plot ICP vs swept parameter (e.g., amplitude, base, frequency, rise time). b. An example of the calculated parameters as shown in Figure 4-4:
Interface Trap Charge
where: Icp = charge pumping current measured by the SMU q = elemental charge of an electron f = frequency of the pulses A = area of the capacitor
c. Another useful calculated parameter:
Interface Trap Density
where: Icp = charge pumping current measured by the SMU q = elemental charge of an electron A = area of the capacitor f = frequency of the pulses
Δ
E = difference between the inversion Fermi level and the accumulation Fermi level
Figure 4-4
Example data plots for N
it
Return to Section Topics List 4200-904-01 Rev. E / June 2008
4-6 Pulse Applications 4200-SCS Applications Manual
Charge pumping UTM descriptions
The chargepumping user library contains modules required to characterize interface and charge­trapping phenomena. The modules contained in the charge pumping user library are listed in
Tab le 4-2 with detailed information following the table.
Table 4-2
Charge pumping UTMs
User Module Description
Performs and graphs a linear sweep of the pulse amplitude.
Performs and graphs a linear sweep of the pulse base or offset.
Performs and graphs a linear sweep of the falling transition time of the pu
Performs and graphs a log or multiply frequency sweep of the pulse.
Performs and graphs a linear sweep of the frequency of the pulse.
Performs and graphs a linear sweep of the rising transition time of the pulse,
lse.
amplsweep
Description The amplsweep is a charge pumping routine that performs a linear sweep of the
Connection This procedure requires connection of the appropriate pulse channel to the gate of
pulse amplitude, graphing the resulting charge pumping current measured by a 4200 SMU. This routine controls a single channel of the pulse generator card as well as a 4200 SMU. Make sure to set the appropriate values
for the charge pumping parameters (Table 4-3). Table 4-4 contains the routines output parameters. The rise time and fall time parameters are the full transition times (0–100%), not the 10%–90% times. For the 5V range of the pulse generator card, the 10–90% rise times are about 20% less than the full 0–100% transition times that are used to program the pulse.
the DUT (device under test) and the substrate/well to the 4200 SMU Force. The other DUT pins should be connected to ground. For detailed connection information, refer to the .
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Pulse Applications 4-7
Table 4-3
Inputs for amplsweep
Input Type Description
VPUID char * The instrument ID. This should be set to VPU1 for 4200 systems with a
single pulse generator card.
PulseChan int The pulse generator card output channel, 1 or 2.
SubSMU char * The SMU for the substrate/well. This can be SMU1 up to the maximum
number of SMUs in the system.
StartVampl double Starting pulse amplitude (V). This can be set from -80V to +80V.
StopVampl double Stopping amplitude voltage for the sweep (V). This can be set from -80V
to +80V.
StepVampl double Step size for the amplitude sweep (V). This can be set from -80V to
+80V.
PulseOffset double Offset, or base, of the pulse (V). This can be set from -40V to +40V
(inclusive of amplitude).
PulseRiseTime double Transition rise time for the pulse. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseFallTime double Transition fall time for the pulse. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseFrequency double Pulse frequency. This can be set from 1Hz to 20Mhz.
DutyCyclePercent double Duty Cycle percent. This can be set from 0.001% to 99.9%.
PulseLoad double DUT load or impedance (ohm). This can be set from 50 to 1E6. This
value is used to adjust the pulse amplitude sourced by the pulse generator card to compensate for non-50 ohm termination. For example, setting the load = 1E6 means the pulse generator card will output half the voltage compared to load = 50.
PulseRange double Selects pulse range. Set this value to 5 for high speed or to 20 for high
voltage
NPLC int Integration time in power line cycles. This can be set from 0.01 to 10.
SMUCompliance double Current limit for the SMU. Set from 10e-12 to 100e-3.
PulseAmpl_size Icp_size Qcp_size
LowestIRange double Lowest current measure range used during limited auto range. This can
double Set to a value that is at least equal to the number of steps in the sweep.
All _size values must be equal to each other.
be set from 10e-12 to 100e-3
Table 4-4
Outputs for amplsweep
Output Type Description
PulseAmpl double * The array of pulse amplitudes used.
Icp double * The array of current values measured by the SMU. Qcp double * The array charge values calculated from the Icp values, where:
Qcp = Icp/(Frequency)
Return to Section Topics List 4200-904-01 Rev. E / June 2008
4-8 Pulse Applications 4200-SCS Applications Manual
basesweep
Description The basesweep is a charge pumping routine to perform a linear sweep of the
pulse base or offset, graphing the resulting charge pumping current measured by a 4200 SMU. This routine controls a single channel of the pulse generator card as well as a 4200 SMU. Make sure to set the appropriate values (Table 4-5). Table 4-6 contains the routines output parameters. The rise time and fall time parameters are the full transition times (0–100%), not the 10%–90% times. For the 5V range of the pulse generator card the 10–90% rise times are about 20% less than the full 0–100% transition times that are used to program the pulse.
Connection Using this routine requires connection of the appropriate pulse channel to the gate
of the DUT (device under test) and the substrate or well to the 4200 SMU Force. The other DUT pins should be connected to ground. For detailed connection information, refer to
Table 4-5
Inputs for basesweep
Input Type Description
VPUID char * The instrument ID. This should be set to VPU1 for 4200 systems with a
single pulse generator card.
PulseChan int The pulse generator card output channel, 1 or 2.
SubSMU char * The SMU for the substrate/well. This can be SMU1 up to the maximum
number of SMUs in the system.
StartVBase double Starting pulse base (V). This can be set from -40 to +40V.
StepVBase double Step size for the base sweep (V). This can be set from -40 to +40V.
StopVBase double Stopping amplitude voltage for the sweep (V). This can be set from -40
to +40V.
PulseAmplitude double This sets pulse amplitude (V) from -80 to +80V (inclusive of base).
PulseRiseTime double Transition rise time for the pulse. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseFallTime double Transition fall time for the pulse. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseFrequency double Pulse frequency. This can be set from 1Hz to 20Mhz.
DutyCyclePercent double Duty Cycle percent. This can be set from 0.001% to 99.9%.
PulseLoad double DUT load or impedance (ohm). This can be set from 50 to 1E-6. This
value is used to adjust the pulse amplitude sourced by the pulse generator card to compensate for non-50 ohm termination. For example, setting the load = 1E6 means the pulse generator card will output half the voltage compared to load = 50.
PulseRange double Selects pulse range. Set this value to 5 for high speed or to 20 for high
voltage.
NPLC double Integration time in power line cycles. This can be set from 0.01 to 10.
SMUCompliance double Current limit for the SMU. Set from 10e-12 to 100e-3.
BaseV_size Icp_size Qcp_size
LowestIRange double Lowest current measure range used during limited auto range. This can
int Set to a value that is at least equal to the number of steps in the sweep.
All _size values must be equal to each other.
be set from 10e-12 to 100e-3.
for the charge pumping parameters
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Pulse Applications 4-9
Table 4-6
Outputs for basesweep
Output Type Description
BaseV double * The array of pulse base voltages
Icp double * The array of current values measured by the SMU. Qcp double * The array charge values calculated from the Icp values, where:
Qcp = Icp/(Frequency)
FallTimeLinearSweep
Description The FallTimeLinearSweep is a charge pumping routine that performs a linear
sweep of the falling transition time of the pulse, graphing the resulting charge pumping current measured by a 4200 SMU. This routine controls a single channel of the pulse generator card as well as a 4200 SMU. Make sure to set the appropriate values (Table 4-7). Table 4-8 contains the routines output parameters. The rise time and fall time parameters are the full transition times (0–100%), not the 10%–90% times. For the 5V range of the pulse generator card the 10–90% rise times are about 20% less than the full 0–100% transition times that are used to program the pulse.
for the charge pumping parameters
Connection Using this routine requires connection of the appropriate pulse channel to the gate
of the device under test (DUT) and the substrate or well to the 4200 SMU Force. The other DUT pins should be connected to ground. For detailed connection information, refer to the .
Table 4-7
Inputs for FallTimeLinearSweep
Input Type Description
VPUID char * The instrument ID. This should be set to VPU1 for 4200 systems with a
single pulse generator card.
PulseChan int The pulse generator card channel, 1 or 2.
SubSMU char The SMU number. This can be SMU1 to the maximum number of SMUs
in the system.
StartFallTime double Starting transition fall time for sweep (s). This can be set from 10E-9
(10ns) to 1 second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
StopFallTime double Stopping transition fall time for sweep (s). This can be set from 10E-9
(10ns) to 1 second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
StepFallTime double Stepsize for transition fall time sweep (s). This can be set from 10E-9
(10ns) to 1 second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseRiseTime double Transition rise time for sweep. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseAmplitude double Amplitude of pulse (V). This can be set from -40V to +40V (inclusive of
offset).
PulseFrequency double Pulse frequency. This can be set from 1 Hz to 20 Mhz.
PulseOffset double Offset, or base, of the pulse (V). This can be set from -40V to +40V
(inclusive of amplitude).
DutyCyclePercent double Duty Cycle percent. This can be set from 0.001% to 99.9%.
Return to Section Topics List 4200-904-01 Rev. E / June 2008
4-10 Pulse Applications 4200-SCS Applications Manual
Table 4-7 (cont.)
Inputs for FallTimeLinearSweep
Input Type Description
PulseLoad double DUT load or impedance (ohm). This can be set from 50 to 1E6. This
value is used to adjust the pulse amplitude sourced by the pulse generator card to compensate for non-50 ohm termination. For example, setting the load = 1E6 means the pulse generator card will output half the voltage compared to load = 50.
PulseRange double Selects pulse range. Set this value to 5 for high speed or to 20 for high
voltage
NPLC int Integration time in power line cycles. This can be set from 0.01 to 10.
SMUCompliance double Current limit for the SMU. Set from 10e-12 to 100e-3.
FallTimeSize Icp_size Qcp_size
LowestIRange double Lowest current measure range used during limited auto range. This can
int Set to a value that is at least equal to the number of steps in the sweep.
All _size values must be equal to each other.
be set from 10e-12 to 100e-3
Table 4-8
Outputs for FallTimeLinearSweep
Output Type Description
FallTransTime double * The array of fall transition times used.
Icp double * The array of current values measured by the SMU. Qcp double * The array charge values calculated from the Icp values, where:
FreqFactorSweep
Description The FreqFactorSweep is a charge pumping routine that performs a log or multiply
Connection Using this routine requires connection of the appropriate pulse channel to the gate
Qcp = Icp/(Frequency)
frequency sweep of the pulse, graphing the resulting charge pumping current measured by a 4200 SMU. This routine controls a single channel of the pulse generator card as well as a 4200 SMU. Make sure to set the appropriate values
for the charge pumping parameters (Table 4-9). Table 4-10 contains the routines output parameters. The rise time and fall time parameters are the full transition times (0–100%), not the 10%-90% times. For the 5 V range of the pulse generator card the 10–90% rise times are about 20% less than the full 0–100% transition times that are used to program the pulse.
of the device under test (DUT) and the substrate or well to the 4200 SMU Force. The other DUT pins should be connected to ground. For detailed connection information, refer to .
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Pulse Applications 4-11
Table 4-9
Inputs for FreqFactorSweep
Input Type Description
VPUID char * The instrument ID. This should be set to VPU1 for 4200 systems with a
single pulse generator card.
PulseChan int The pulse generator card channel, 1 or 2.
SubSMU char The SMU number. This can be SMU1 to the maximum number of SMUs
in the system.
FreqMultFactor double Multiplier factor to control step size. Next Freq = Previous frequency *
FreqMultFactor. Use Factors > 1 for sweeping to higher frequencies. Use Factors < 1 for sweeping to lower frequencies.
NumPoints int Number of points in the frequency sweep.
PulseRiseTime double Transition rise time for sweep. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseFallTime double Transition fall time for the pulse. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseAmplitude double Amplitude of pulse (V). This can be set from -80 to +80V (inclusive of
offset).
PulseFrequency double Pulse frequency. This can be set from 1Hz to 20Mhz.
PulseOffset double Offset, or base, of the pulse (V). This can be set from -40V to +40V
(inclusive of amplitude).
DutyCyclePercent double Duty Cycle percent. This can be set from 0.001% to 99.9%.
PulseLoad double DUT load or impedance (ohm). This can be set from 50 to 1E6. This
value is used to adjust the pulse amplitude sourced by the pulse generator card to compensate for non-50 ohm termination. For example, setting the load = 1E6 means the pulse generator card will output half the voltage compared to load = 50.
PulseRange double Selects pulse range. Set this value to 5 for high speed or to 20 for high
voltage
NPLC int Integration time in power line cycles. This can be set from 1 to 10.
SMUCompliance double Current limit for the SMU. Set from 10e-12 to 100e-3.
Frequency_size Qcp_size Icp_size
LowestIRange double Lowest current measure range used during limited auto range. This can
(int) Set to a value that is at least equal to the number of steps in the sweep.
All _size values must be equal to each other.
be set from 10e-12 to 100e-3
Table 4-10
Outputs for FreqFactorSweep
Output Type Description
Frequency double * The array of frequencies used.
Icp double * The array of current values measured by the SMU. Qcp double * The array charge values calculated from the Icp values, where:
Qcp = Icp/(Frequency)
Return to Section Topics List 4200-904-01 Rev. E / June 2008
4-12 Pulse Applications 4200-SCS Applications Manual
FreqLinearSweep
Description The FreqLinearSweep is a Charge Pumping routine to perform a linear sweep of
the pulse frequency, graphing the resulting charge pumping current measured by a 4200 SMU. This routine controls a single channel of the pulse generator card as well as a 4200 SMU. Make sure to set the appropriate values (Table 4-11). Table 4-12 contains the routines output parameters. Note that the rise time and fall time parameters are the full transition times (0–100%), not the 10%– 90% times. For the 5 V range of the pulse generator card the 10–90% rise times are about 20% less than the full 0–100% transition times that are used to program the pulse.
Connection Using this routine requires connection of the appropriate pulse channel to the gate
of the device under test (DUT) and the substrate or well to the 4200 SMU Force. The other DUT pins should be connected to ground. For detailed connection information, refer to the .
Table 4-11
Inputs for FreqLinearSweep
Input Type Description
InstIdStr char * The instrument ID. This should be set to VPU1 for 4200 systems with a
single pulse generator card.
PulseChan int The pulse generator card output channel, 1 or 2.
SubSMU char The SMU number. This can be SMU1 to the maximum number of SMUs
in the system.
StartFreq double Starting pulse frequency for sweep (Hz). This can be set from 1 to 20
MHz (20E6).
StopFreq double Stopping pulse frequency for sweep (Hz). This can be set from 1 to 20
MHz (20E6).
StepFreq double Pulse frequency step size for sweep (Hz). This can be set from 1 to 20
MHz (20E6).
PulseRiseTime double Transition rise time for sweep. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseFallTime double Transition fall time for sweep. This can be set from 10E-9 (10ns) to 1
second with 10ns resolution. Note that this value programs the full transition time (0–100%) not 10–90%.
PulseAmplitude double Amplitude of pulse (V). This can be set from -80V to +80V (inclusive of
offset).
Frequency double Pulse frequency. This can be set from 1Hz to 10Mhz.
PulseOffset double Offset, or base, of the pulse (V). This can be set from -40V to +40V
(inclusive of amplitude).
DutyCyclePercent double Duty Cycle percent. This can be set from 0.001% to 99.9%.
PulseLoad double DUT load or impedance (ohm). This can be set from 50 to 1E6. This
value is used to adjust the pulse amplitude sourced by the pulse generator card to compensate for non-50 ohm termination. For example, setting the load = 1E6 means the pulse generator card will output half the voltage compared to load = 50.
PulseRange double Selects pulse range. Set this value to 5 for high speed or to 20 for high
voltage
NPLC int Integration time in power line cycles. This can be set from 0.01 to 10.
SMUCompliance double Current limit for the SMU. Set from 10e-12 to 100e-3.
for the charge pumping parameters
4200-904-01 Rev. E / June 2008 Return to Section Topics List
4200-SCS Applications Manual Pulse Applications 4-13
Table 4-11 (cont.)
Inputs for FreqLinearSweep
Input Type Description
Frequency_size Qcp_size Icp_size
LowestIRange double Lowest current measure range used during limited auto range. This can
int Set to a value that is at least equal to the number of steps in the sweep.
All _size values must be equal to each other.
be set from 10e-12 to 100e-3
Table 4-12
Outputs for FreqFactorSweep
Output Type Description
Frequency double * The array of frequencies used.
Icp double * The array of current values measured by the SMU. Qcp double * The array charge values calculated from the Icp values, where:
Qcp = Icp/(Frequency)
RiseTimeLinearSweep
Description The RiseTimeLinearSweep is a charge pumping routine to perform a linear sweep
of the rising transition time of the pulse, graphing the resulting charge pumping current measured by a 4200 SMU. This routine controls a single channel of the pulse generator card as well as a 4200 SMU. Make sure to set the appropriate value for the charge pumping parameters
able 4-13). Table 4-14 contains the routines output parameters. The rise time and
(T fall time parameters are the full transition times (0–100%), not the 10%–90% times. For the 5V range of the pulse generator card the 10–90% rise times are about 20% less than the full 0–100% transition times that are used to program the pulse.
Connection Using this routine requires connection of the appropriate pulse channel to the gate
of the device under test (DUT) and the substrate or well to the 4200 SMU Force. The other DUT pins should be connected to ground. For detailed connection information, refer to the .
Return to Section Topics List 4200-904-01 Rev. E / June 2008
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