HEAT SINK/TRANSISTOR GREASE
Heat sink draws heat away when applied to a component. In
electronics, heat sink compound is generally used to thermally
bond a component with a mechanical heat sink. For electrical
applications, it is used with thermocouple wells, thermistors,
and calrods, or wherever efficient cooling is required.
1977
SILICONE HEAT SINK COMPOUND
Ideal for electrical applications.
• Functional Temperature Range
-67°F to 401°F (-55°C to 205°C)
• Easy Application
• Will Not Harden and Crack
1977-DP 4 oz squeeze tube
1978
SILICONE-FREE HEAT SINK COMPOUND
Ideal for electronic applications where silicone contamination
hurts solderability and increase solder defects.
• Functional Temperature Range
-40°F to 392°F (-40°C to 200°C)
• Avoid Solder Defects Due to Silicon Contamination
• Easy Application
• Will Not Separate
• Will Not Harden and Crack
1978-DP 4 oz squeeze tube
1978-1 1 lb jar
1978-DP
For more information: 800-858-4043 - tsales@techspray.com MSDS / Specs: www.techspray.com
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