How it Works
TechNexion
Loading...
TEP1560 Series
Product Manual
39 pgs2.03 Mb0

TechNexion TEP1560 Series, TEP-1560-BSW Product Manual

TEP-1560-BSW MODULAR HMI PRODUCT MANUAL
(TEP-1560-BSW)
VER. 1.00
March 25, 2019
Page 2 of 39
REVISION HISTORY
Revision
Date
Originator
Notes
1.00
March 25, 2019
TechNexion
First public release
Page 3 of 39
TABLE OF CONTENTS
1. Introduction ............................................................................................................................................... 5
1.1. General Care and Maintenance ......................................................................................................... 5
2. TEP-1560-BSW Product Overview ........................................................................................................... 6
2.1. Functional Block Diagram .................................................................................................................. 6
2.2. Dimensions ......................................................................................................................................... 7
2.3. Device Cut-out Dimensions For Mounting Though a Panel ............................................................... 8
2.4. External Connectors ........................................................................................................................... 9
2.5. Internal Board Connectors ............................................................................................................... 10
2.5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx) ............................... 10
2.5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx) ........................ 11
3. External Connectors ................................................................................................................................ 12
3.1. LED Light Indicator ........................................................................................................................... 12
3.2. Micro-SIM Connector ........................................................................................................................ 12
3.3. MicroSD Connector .......................................................................................................................... 12
3.4. USB OTG (Type-C) Connector ........................................................................................................ 13
3.5. Gigabit Ethernet Interface (LAN1/LAN2) .......................................................................................... 13
3.6. USB 2.0 Host Connectors ................................................................................................................ 13
3.7. USB 3.0 Host Connectors ................................................................................................................ 14
3.8. miniDP (Mini DisplayPort) Connector ............................................................................................... 14
3.9. HDMI (High Definition Multi-Media Interface) Connector ................................................................. 14
3.10. Audio Connectors ........................................................................................................................... 14
3.11. RST Button ..................................................................................................................................... 14
3.12. PWR Button .................................................................................................................................... 14
3.13. Power Input Connector ................................................................................................................... 15
3.14. Antenna Holes ................................................................................................................................ 15
3.15. Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XG21-xxxx-xxx-xxxx-xxxx) (optional) . 15
3.15.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ...................................... 16
3.15.2. Galvanic Isolated Serial Port (RS-XXX) (optional) .................................................................. 17
3.16. Non-Galvanic Isolated Connectors (TEP1560-xxxxx-Rxx-Lxxx-XS21- xxxx-xxx-xxxx-xxxx)
(optional) .................................................................................................................................................. 18
3.16.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) .............................. 19
3.16.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)........................................................... 20
4. Internal Connectors and Expansion Options .......................................................................................... 21
4.1. M.2 KEY-B Slots ............................................................................................................................... 21
4.2. SATA 3.0 and SATA Power Connectors .......................................................................................... 21
4.3. RTC Battery Connector .................................................................................................................... 22
Page 4 of 39
4.4. M.2 KEY-E Slot ................................................................................................................................. 22
4.5. CMOS Jumper .................................................................................................................................. 22
4.6. SO-DIMM DDR3L Slot...................................................................................................................... 22
4.7. Internal Stereo Speaker Connectors ................................................................................................ 23
5. BIOS Setup ............................................................................................................................................. 24
5.1. Entering and Exiting BIOS ................................................................................................................ 24
5.2. BIOS Setup Screens Overview ........................................................................................................ 24
5.2.1. Main ........................................................................................................................................... 25
5.2.2. Chipset ....................................................................................................................................... 26
5.2.3. Advanced ................................................................................................................................... 27
5.2.4. Boot ............................................................................................................................................ 30
5.2.5. Security ...................................................................................................................................... 31
5.2.6. Save & Exit ................................................................................................................................ 32
6. Mounting.................................................................................................................................................. 33
6.1. VESA Mounting ................................................................................................................................ 33
6.2. Rear Mounting and Mounting Clips Installation ................................................................................ 34
6.3. Surface Mounting ............................................................................................................................. 35
7. Ordering Information ............................................................................................................................... 36
7.1. Custom Part Number Rule ............................................................................................................... 36
7.2. Standard Package Contents ............................................................................................................ 37
8. Important Notice ...................................................................................................................................... 38
9. Disclaimer ............................................................................................................................................... 39
Page 5 of 39
1. Introduction
1.1. General Care and Maintenance
Your device is a product of superior design and craftsmanship and should be treated with care. The following suggestions will help you.
• Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.
• Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be damaged.
• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices, damage batteries, and warp or melt certain plastics.
• Do not store the device in cold areas. When the device returns to its normal temperature, moisture can form inside the device and damage electronic circuit boards.
• Do not open the device while power is on. Otherwise electrical shock may result.
• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and
fine mechanics.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
• Do not paint the device. Paint can clog the parts and prevent proper operation.
• Unauthorized modifications or attachments could damage the device and may violate regulations
governing radio devices.
These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is not working properly, take it to the nearest authorized service facility for service. Regulatory information
Disposal of Waste Equipment by Users in Private Household in the European Union This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the
environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or the shop where you purchased the product.
We hereby declare that the product is in compliance with the essential requirements and other relevant provisions of European Directive 2014/53/EU (Directive on the harmonisation of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/5/EC).
Page 6 of 39
2. TEP-1560-BSW Product Overview
2.1. Functional Block Diagram
Page 7 of 39
2.2. Dimensions
The following figure shows the TEP-1560-BSW dimensions (unit: mm):
Page 8 of 39
2.3. Device Cut-out Dimensions For Mounting Though a Panel
The TEP-1560-BSW can be mounted on the front or the back of the panel. In order to mount it from the front, a nominal rectangular cutout must be made in the panel. The following drawing shows the dimensions of the cut-out area (unit: mm):
Page 9 of 39
2.4. External Connectors
The TEP-1560-BSW has a number of external connectors.
Bottom view:
1 2 4 5 6 8 10 11 12 14 15 16 3 7 9 13 17 18 19 20 21
External Connectors:
No.
Description
No.
Description
1
LED Light indicator
12
3.5mm jack Line out
2
Micro-SIM cardslot
13
3.5mm jack Line in
3
MicroSD cardslot
14
3.5mm jack Mic in
4
USB OTG (Type-C) connector
15
Reset button
5
LAN2 RJ45 connector
16
Power button
6
USB 2.0 Host connector
17
Power Input connector
7
USB 2.0 Host connector
18
LAN1 RJ45 connector (PoE)
8
USB 3.0 Host connector
19
GPIO1 connector (optional)
9
USB 3.0 Host connector
20
GPIO2 connector (optional)
10
miniDP connector
21
RS-XXX (Serial Port) connector (optional)
11
HDMI connector
Page 10 of 39
2.5. Internal Board Connectors
The TEP-1560-BSW has several connectors, switches and internal expansion options.
2.5.1. Galvanic Isolated (TEP1560-xxxxx-Rxx-Lxxx-XG21- xxxx-xxx-xxxx-xxxx)
Rear view (opened device) with the galvanic isolated I/0 Expansion module:
I J Power I/O Expansion
Module A H Module B C D E F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
M.2 KEY-B slot (SATA + USB 2.0)
F
RTC Battery connector
B
M.2 KEY-B slot (USB 2.0)
G
M.2 KEY-E slot (PCIe + USB 2.0)
C
SATA Power connector
H
SO-DIMM DDR3L slot
D
CMOS jumper
I
Internal R speaker connector
E
SATA 3.0 connector
J
Internal L speaker connector
Page 11 of 39
2.5.2. Non-Galvanic Isolated (TEP1010-xxxxx-Rxx-Lxxx-XS21-xxxx-xxx-xxxx-xxxx)
Rear view (opened device) with the non-galvanic isolated I/0 Expansion module:
I J Power I/O Expansion
Module A H Module B C D E F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
M.2 KEY-B slot (SATA + USB 2.0)
F
RTC Battery connector
B
M.2 KEY-B slot (USB 2.0)
G
M.2 KEY-E slot (PCIe + USB 2.0)
C
SATA Power connector
H
SO-DIMM DDR3L slot
D
CMOS jumper
I
Internal R speaker connector
E
SATA 3.0 connector
J
Internal L speaker connector
Page 12 of 39
3. External Connectors
3.1. LED Light Indicator
The TEP-1560-BSW has one Power LED Light indicator. The Power LED Light indicator is lit, when the system is powered on.
LED #
Color
Power on
Power off
1
Green
ON
OFF
3.2. Micro-SIM Connector
The TEP-1560-BSW features an external Micro-SIM cardslot for use by 3G/4G/LTE wireless module. NOTE: This cardslot can be only used by a M.2 KEY-B 3G/4G/LTE module installed into the 3G/LTE
connector. The 3G/LTE connector can be found at location “A” in chapter 4. Internal Connectors and
Expansion Options of this manual. No M.2 KEY-B 3G/LTE module is included in this device (must be
purchased separately, not sold by TechNexion).
3.3. MicroSD Connector
The TEP-1560-BSW features a standard microSD cardslot which is connected to the Intel processor’s (Atom x5-E8000 / Pentium N3710) integrated “Ultra Secured Digital Host Controller” (uSDHC).
The following main features are supported by uSDHC:
• Compatible with the MMC System Specification version 4.2/4.3/4.4/4.41/5.0.
• Conforms to the SD Host Controller Standard Specification version 3.0.
• Compatible with the SD Memory Card Specification version 3.0 and supports the “Extended
Capacity SD Memory Card”.
• Compatible with the SDIO Card Specification version 3.0.
• Supports 1-bit / 4-bit SD and SDIO modes
The MMC/SD/SDIO host controller can support a single MMC / SD / SDIO card or device.
Loading...
+ 27 hidden pages
Buy Points How it Works FAQ Contact Us Questions and Suggestions Privacy Policy Cookie Policy Terms of Use