TechNexion TEP-1010-IMX6, TEP-1560-IMX6 Product Manual
TEP-1010-IMX6 MODULAR HMI PRODUCT MANUAL
(TEP-1010-IMX6)
VER. 1.00
August 21, 2018
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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REVISION HISTORY
Revision
Date
Originator
Notes
1.00
August 21, 2018
TechNexion
First public release
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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TABLE OF CONTENTS
1. Introduction ............................................................................................................................................... 5
1.1. General Care and Maintenance ......................................................................................................... 5
2. TEP-1010-IMX6 Product Overview ........................................................................................................... 6
2.1. Functional Block Diagram .................................................................................................................. 6
2.2. Dimensions ......................................................................................................................................... 7
2.3. Device Cut-out Dimensions For Mounting Though a Panel ............................................................... 8
2.4. External Connectors ........................................................................................................................... 9
2.5. Internal Board Connectors ............................................................................................................... 10
2.5.1. Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx) ........................................ 10
2.5.2. Non-Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx) ................................. 11
2.5.3. Board View Without the I/O Expansion Module ......................................................................... 12
3. External Connectors ................................................................................................................................ 13
3.1. LED Light Indicator ........................................................................................................................... 13
3.2. Micro-SIM Connector ........................................................................................................................ 13
3.3. MicroSD Connector .......................................................................................................................... 13
3.4. USB OTG (Type-C) Connector ........................................................................................................ 14
3.5. USB Host Connector ........................................................................................................................ 14
3.6. HDMI (High Definition Multi-Media Interface) Connector ................................................................. 14
3.7. VGA (15-pin D-SUB) Connector ....................................................................................................... 14
3.8. Audio Connectors ............................................................................................................................. 15
3.9. S1 Button .......................................................................................................................................... 15
3.10. RST Button ..................................................................................................................................... 15
3.11. Power Input Connector ................................................................................................................... 15
3.12. Gigabit Ethernet Interface .............................................................................................................. 16
3.13. Antenna Holes ................................................................................................................................ 16
3.14. Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx) (optional) ......... 17
3.14.1. Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) ...................................... 17
3.14.2. Galvanic Isolated Serial Port (RS-XXX) (optional) .................................................................. 19
3.14.3. Galvanic Isolated CAN Bus Connector (CANBus) (optional) .................................................. 21
3.15. Non-Galvanic Isolated Connectors (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx) (optional) .. 22
3.15.1. Non-Galvanic Isolated Digital I/O Connectors (GPIO1/GPIO2) (optional) .............................. 22
3.15.2. Non-Galvanic Isolated Serial Port (RS-XXX) (optional)........................................................... 23
3.15.3. Non-Galvanic Isolated CAN Bus Connector (CANBus) (optional) .......................................... 24
4. Internal Connectors and Expansion Options .......................................................................................... 25
4.1. Mini-PCIe Connectors ...................................................................................................................... 25
4.2. Mini-SIM Cardslot ............................................................................................................................. 25
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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4.3. M.2 KEY-B Slots ............................................................................................................................... 26
4.4. SW2 Default Boot Mode Switch ....................................................................................................... 26
4.5. SWITCH1 Boot Mode DIP Switch .................................................................................................... 26
4.6. RTC Battery Connector .................................................................................................................... 26
4.7. Internal Stereo Speaker Connectors ................................................................................................ 27
5. Mounting.................................................................................................................................................. 28
5.1. VESA Mounting ................................................................................................................................ 28
5.2. Rear Mounting and Mounting Clips Installation ................................................................................ 29
5.3. Surface Mounting and O-ring Installation ......................................................................................... 30
6. Ordering Information ............................................................................................................................... 31
6.1. Custom Part Number Rule ............................................................................................................... 31
6.2. Standard Package Contents ............................................................................................................ 32
7. Important Notice ...................................................................................................................................... 33
8. DISCLAIMER .......................................................................................................................................... 34
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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1. Introduction
1.1. General Care and Maintenance
Your device is a product of superior design and craftsmanship and should be treated with care.
The following suggestions will help you.
• Keep the device dry. Precipitation, humidity, and all types of liquids or moisture can contain
minerals that will corrode electronic circuits. If your device does get wet, allow it to dry completely.
• Do not use or store the device in dusty or dirty areas. Its parts and electronic components can be
damaged.
• Do not store the device in hot areas. High temperatures can shorten the life of electronic devices,
damage batteries, and warp or melt certain plastics.
• Do not store the device in cold areas. When the device returns to its normal temperature,
moisture can form inside the device and damage electronic circuit boards.
• Do not open the device while power is on. Otherwise electrical shock may result.
• Do not drop, knock, or shake the device. Rough handling can break internal circuit boards and
fine mechanics.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the device.
• Do not paint the device. Paint can clog the parts and prevent proper operation.
• Unauthorized modifications or attachments could damage the device and may violate regulations
governing radio devices.
These suggestions apply equally to your device, battery, charger, or any enhancement. If any device is
not working properly, take it to the nearest authorized service facility for service.
Regulatory information
Disposal of Waste Equipment by Users in Private Household in the European Union
This symbol on the product or on its packaging indicates that this product must not be
disposed of with your other household waste. Instead, it is your responsibility to dispose
of your waste equipment by handing it over to a designated collection point for the
recycling of waste electrical and electronic equipment. The separate collection and
recycling of your waste equipment at the time of disposal will help to conserve natural
resources and ensure that it is recycled in a manner that protects human health and the
environment. For more information about where you can drop off your waste equipment
for recycling, please contact your local city office, your household waste disposal service or the shop
where you purchased the product.
We hereby declare that the product is in compliance with the essential requirements and
other relevant provisions of European Directive 1999/5/EC (radio equipment and
telecommunications terminal equipment Directive).
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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2. TEP-1010-IMX6 Product Overview
2.1. Functional Block Diagram
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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2.2. Dimensions
The following figure shows the TEP-1010-IMX6 dimensions (unit: mm):
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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2.3. Device Cut-out Dimensions For Mounting Though a Panel
The TEP-1010-IMX6 can be mounted on the front or the back of the panel. In order to mount it from the
front, a nominal rectangular cutout must be made in the panel. The following drawing shows the
dimensions of the cut-out area (unit: mm):
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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2.4. External Connectors
The TEP-1010-IMX6 has a number of external connectors.
Bottom view:
1 2 4 5 7 9 10 11 12 13 14 15
3
6 8
16 17 18 19 20 21
External Connectors:
No.
Description
No.
Description
1
LED Light indicator
12
3.5mm jack Line in
2
Micro-SIM cardslot
13
3.5mm jack Mic in
3
MicroSD cardslot
14
S1 Boot Select button
4
USB OTG (Type-C) connector
15
Reset button
5
USB Host connector
16
Power Input connector
6
USB Host connector
17
LAN RJ45 connector
7
USB Host connector
18
GPIO1 connector (optional)
8
USB Host connector
19
GPIO2 connector (optional)
9
HDMI connector
20
RS-XXX (Serial Port) connector (optional)
10
VGA (15-pin D-SUB) connector
21
CAN Bus connector (optional)
11
3.5mm jack Line out
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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2.5. Internal Board Connectors
The TEP-1010-IMX6 has several connectors, switches and internal expansion options.
2.5.1. Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XG20-xxx-xxxx)
Rear view (opened device) with the galvanic isolated I/0 Expansion module:
K*
J*
I/O Expansion Module
I*
A B C D
E
H
F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
mini-PCIe connector (PCIe + USB)
G
M.2 KEY-B slot (SATA + USB)
B
mini-PCIe connector (USB)
H
SWITCH1 Boot mode DIP switch
C
SW2 Default Boot mode switch
I*
SW1 DIP switch
D
M.2 KEY-B slot (USB)
J*
SW3 Terminator Resistor DIP switch
E
RTC Battery connector
K*
SW2 Terminator Resistor DIP switch
F
Mini-SIM cardslot
NOTE: Items marked with * are available on the galvanic isolated I/O Expansion module
(TXB-I2-GS2-GC2-GG8) (optional).
TEP-1010-IMX6 HARDWARE MANUAL – VER 1.00 – AUG 21 2018
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2.5.2. Non-Galvanic Isolated (TEP1010-IMX6x-Rxx-Exx-Lxxx-XS20-xxx-xxxx)
Rear view (opened device) with the non-galvanic isolated I/0 Expansion module:
I*
I/O Expansion
Module
A B C D
E
H
F G
Internal Connectors and Switches:
No.
Description
No.
Description
A
mini-PCIe connector (PCIe + USB)
F
Mini-SIM cardslot
B
mini-PCIe connector (USB)
G
M.2 KEY-B slot (SATA + USB)
C
SW2 Default Boot mode switch
H
SWITCH1 Boot mode DIP switch
D
M.2 KEY-B slot (USB)
I*
SW1 Terminator Resistor DIP switch
E
RTC Battery connector
NOTE: Items marked with * are available on the non-galvanic isolated I/O Expansion module
(TXB-I2-S2-C2-G8) (optional).
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