Teccor Electronics reserves the right to make changes at any time in order to improve designs and to supply the best products possible.
The information in this catalog has been carefully checked and is believed to be accurate and reliable; however, no liability of any type
shall be incurred by Teccor for the use of the circuits or devices described in this publication. Furthermore, no license of any patent
rights is implied or given to any purchaser.
Teccor Electronics is the proprietor of the QUADRAC® trademark. is a registered trademark of Underwriters Laboratories, Inc. All other brand names may be trademarks of their respective companies. To conserve space in this catalog, the
trademark sign (®) is omitted.
A thyristor is any semiconductor switch with a bi-stable action
depending on p-n-p-n regenerative feedback. Thyristors are normally two- or three-terminal devices for either unidirectional or bidirectional circuit configurations. Thyristors can have many forms,
but they have certain commonalities. All thyristors are solid state
switches that are normally open circuits (very high impedance),
capable of withstanding rated blocking/off-state voltage until triggered to on state. When triggered to on state, thyristors become a
low-impedance current path until principle current either stops or
drops below a minimum holding level. After a thyristor is triggered
to on-state condition, the trigger current can be removed without
turning off the device. Thyristors are used to control the flow of
electrical currents in applications including:
•Home appliances (lighting, heating, temperature control, alarm
activation, fan speed)
•Electrical tools (for controlled actions such as motor speed, stapling event, battery charging)
•Outdoor equipment (water sprinklers, gas engine ignition, electronic displays, area lighting, sports equipment, physical fitness)
Sensitive Triacs
Teccor's sensitive gate triacs are AC bidirectional silicon
switches that provide guaranteed gate trigger current levels in
Quadrants I, II, III, and IV. Interfacing to microprocessors or other
equipment with single polarity gate triggering is made possible with
sensitive gate triacs. Gate triggering currents of 3 mA, 5 mA,
10 mA, or 20 mA may be specified.
Sensitive gate triacs are capable of controlling AC load currents
from 0.8 A to 8 A rms and can withstand operating voltages from
200 V to 600 V.
Triacs
Teccor's triac products are bidirectional AC switches, capable of
controlling loads from 0.8 A to 35 A rms with 10 mA, 25 mA, and
50 mA I
Triacs are useful in full-wave AC applications to control AC power
either through full-cycle switching or phase control of current to the
load element. These triacs are rated to block voltage in the “OFF”
condition from 200 V minimum with selected products capable of
1000 V operation. Typical applications include motor speed controls, heater controls, and incandescent light controls.
in operating Quadrants I, II and III.
GT
Quadrac
Quadrac devices, originally developed by Teccor, are triacs and
alternistor triacs with a diac trigger mounted inside the same package. These devices save the user the expense and assembly time
of buying a discrete diac and assembling in conjunction with a
gated triac.
The Quadrac is offered in capacities from 4 A to 15 A rms and voltages from 200 V ac to 600 V ac.
Alternistor Triacs
The Teccor alternistor is specifically designed for applications
required to switch highly inductive loads. The design of this special
chip effectively offers the same performance as two thyristors
(SCRs) wired inverse parallel (back-to-back).
This new chip construction provides the equivalent of two electrically-separate SCR structures, providing enhanced dv/dt characteristics while retaining the advantages of a single-chip device.
Teccor manufactures 6 A to 40 A alternistors with blocking voltage
rating from 200 V to 1000 V. Alternistors are offered in TO-220,
TO-218, and TO-218X packages with isolated and non-isolated
versions.
Teccor's sensitive gate SCRs are silicon-controlled rectifiers representing the best in design, performance, and packaging techniques
for low- and medium-current applications.
Anode currents of 0.8 A to 10 A rms can be controlled by sensitive
gate SCRs with gate drive currents ranging from 12 µA to 500 µA.
Sensitive gate SCRs are ideally suited for interfacing to integrated
circuits or in applications where high current load requirements and
limited gate drive current capabilities exist. Examples include ignition circuits, motor controls, and DC latching for alarms in smoke
detectors. Sensitive gate SCRs are available in voltage ratings to
600 V ac.
SCRs
Teccor's SCR products are half-wave, silicon-controlled rectifiers
that represent the state of the art in design and performance.
Load current capabilities range from 1 A to 70 A rms, and voltages
from 200 V to 1000 V may be specified to meet a variety of application needs.
Because of its unidirectional switching capability, the SCR is used
in circuits where high surge currents or latching action is required.
It may also be used for half-wave-type circuits where gate-controlled rectification action is required. Applications include crowbars in power supplies, camera flash units, smoke alarms, motor
controls, battery chargers, and engine ignition.
Surge current ratings are available from 30 A in the TO-92 packaging to 950 A in the TO-218X package.
Rectifiers
Teccor manufactures 15 A to 25 A rms rectifiers with voltages
rated from 200 V to 1000 V. Due to the electrically isolated TO-220
package, these rectifiers may be used in common anode or common cathode circuits using only one part type, thereby simplifying
stock requirements.
Diacs
Diacs are trigger devices used in phase control circuits to provide
gate pulses to a triac or SCR. They are voltage-triggered bidirectional silicon devices housed in DO-35 glass axial lead packages
and DO-214 surface mount packages.
Diac voltage selections from 27 V to 45 V provide trigger pulses
closely matched in symmetry at the positive and negative breakover points to minimize DC component in the load circuit.
Some applications include gate triggers for light controls, dimmers,
power pulse circuits, voltage references in AC power circuits, and
triac triggers in motor speed controls.
Sidacs
Sidacs represent a unique set of thyristor qualities. The sidac is a
bidirectional voltage triggered switch. Some characteristics of this
device include a normal 95 V to 330 V switching point, negative
resistance range, latching characteristics at turn-on, and a low onstate voltage drop.
One-cycle surge current capability up to 20 A makes the sidac an
ideal product for dumping charged capacitors through an inductor
in order to generate high-voltage pulses. Applications include light
controls, high-pressure sodium lamp starters, power oscillators,
and high-voltage power supplies.
Circuit Requirement Diagram
BILATERAL VOLTAGE
SWITCH
SIDAC *
GATE CURRENT
12-500 µA10-50 mA
SCR *SCR (Sensitive) *
* For detailed information, see specific data sheet in product catalog.
Current Rating
X8 = 0.8 A
N = 1 A
01 = 1 A
04 = 4 A
06 = 6 A
08 = 8 A
Package Type
Blank =
Compak
D = TO-252 (Surface Mount)
E = TO-92 (Isolated)
F = TO-202 (Non-islolated)
L = TO-220 (Isolated)
V = TO-251 (Non-islolated)
(Surface Mount)
Quadrac
Q2004 L T52
Device Type
Q =
Quadrac
Voltage Rating
20 = 200 V
40 = 400 V
60 = 600 V
Current Rating
04 = 4 A
06 = 6 A
08 = 8 A
10 = 10 A
15 = 15 A
20
04
F5
12
H
X
Special Options
V = 4000 V Isolation
(TO-220 Package Only)
Lead Form Dimensions
3 = 3 mA (Q I, II, III, IV)
5 = 5 mA (Q I, II, III, IV)
TO-202
TO-220
TO-92
Gate Variations
6 = 5 mA (Q I, II, III)
6 = 10 mA (Q IV)
8 = 10 mA (Q I, II, III)
8 = 20 mA (Q IV)
X
Special Options
V = 4000 V Isolation
(TO-220 Package Only)
Lead Form Dimensions
TO-220
Alternistor
Gate Variation
T = Internal Diac Trigger
Package Type
L = TO-220 (Isolated)
Triac and Alternistor
Q
20
Device Type
Q = Triac or Alternistor
Voltage Rating
20 = 200 V
40 = 400 V
60 = 600 V
80 = 800 V
K0 = 1000 V
Current Rating
X8 = 0.8 A
01 = 1 A
04 = 4 A
06 = 6 A
08 = 8 A
10 = 10 A
12 = 12 A
15 = 15 A
25 = 25 A
30 = 30 A
35 = 35 A
40 = 40 A
Package Type
D = TO-252 (Surface Mount)
E = TO-92 (Isolated)
F = TO-202 (Non-isolated)
J = TO-218X (Isolated)
K = TO-218 (Isolated)
L = TO-220 (Isolated)
N = TO-263 (Surface Mount)
P =
Fastpak
(Isolated)
R = TO-220 (Non-isolated)
V = TO-251 (Non-isolated)
W = TO-218X (Non-isolated)
04
X
F3
1
Special Options
V = 4000 V Isolation
(TO-220 Package Only)
Lead Form Dimensions
DH3 and VH3 = 10mA (Q I, II, III)
H4 = 35 mA (Q I, II, III) *
H5 = 50 mA (Q I, II, III) *
6 = 80 mA (Q I, II, III) *
7 = 100 mA (Q I, II, III) *
* NOTE:
Alternistor device; no Quadrant IV operation
TO-202
TO-220
TO-92
TO-218X
TO-218
Gate Variation
3 = 10 mA (Q I, II, III)
H3 = 20mA (Q I, II, III)
4 = 25 mA (Q I, II, III)
5 = 50 mA (Q I, II, III)
Sensitive SCR
20
06
FS2
21
X
Special Options
V = 4000 V Isolated
(TO-220 Package Only)
Lead Form Dimensions
Blank = Compak (Surface Mount)
D = TO-252 (Surface Mount)
F = TO-202 (Non-islolated)
V = TO-251 (Non-islolated)
TO-202
TO-220
Gate Variations
S1 = 50 µA
S2 = 200 µA
S3 = 500 µA
Package Type
L = TO-220 (Isolated)
Device Type
TCR = TO-92 (Isolated)
EC = TO-92 (Isolated)
T = TO-202 (Non-isolated)
2N = JEDEC (Isolated)
Current Rating for TCR
22 = 1.5 A
Current Rating for EC
103 = 0.8 A
Current Rating for T
106 = 4 A (I
107 = 4 A (I
Current Rating for 2N
5xxx = 0.8 A
= 200 µA)
GT
= 500 µA)
GT
EC
103
D
75
1
Gate Current (for EC series only)
Voltage Rating for EC and T
Lead Form Dimensions
Voltage Rating for TCR
Voltage Rating for 2N
TO-92
TO-202
None = 200 µA
1 = 12 µA
2 = 50 µA
3 = 500 µA
-4 = 200 V
-6 = 400 V
-8 = 600 V
B = 200 V
D = 400 V
M = 600 V
5064 = 200 V
6565 = 400 V
S
Device Type
S = Sensitive SCR
Voltage Rating
20 = 200 V
40 = 400 V
60 = 600 V
Current Rating
X8 = 0.8 A
N = 1 A
06 = 6 A
08 = 8 A
10 = 10 A
Voltage Rating
20 = 200 V
40 = 400 V
60 = 600 V
80 = 800 V
K0 = 1000 V
Current Rating
01 = 1 A
06 = 6 A
08 = 8 A
10 = 10 A
12 = 12 A
15 = 15 A
16 = 16 A
20 = 20 A
25 = 25 A
35 = 35 A
55 = 55 A
65 = 65 A
70 = 70 A
D
20
20
08
15
F12
D = TO
F = TO-202 (Non-isolated)
M = TO-218 (Non-isolated)
N = TO-263 (Surface Mount)
R = TO-220 (Non-isolated)
V = TO-251 (Non-isolated)
W = TO-218X (Non-isolated)
L55
X
Special Options
V = 4000 V Isolation
(TO-220 Package Only)
Lead Form Dimensions
-
252 (Surface Mount)
E = TO
J = TO-218X (Isolated)
K = TO-218 (Isolated)
L = TO-220 (Isolated)
-
TO
202
-
TO
220
-
TO
92
-
218X
TO
-
TO
218
Package Type
-
92 (Isolated)
V
Sidac
K
Device Type
K = Sidac
Voltage Rating
105 = 95 V to 113 V
110 = 104 V to 118 V
120 = 110 V to 125 V
130 = 120 V to 138 V
140 = 130 V to 146 V
150 = 140 V to 170 V
200 = 190 V to 215 V
220 = 205 V to 230 V
240 = 220 V to 250 V
250 = 240 V to 280 V
300 = 270 V to 330 V
105
0
E70
Lead Form Dimensions
E = TO-92 (Isolated)
F = TO-202 (Non-islolated)
G = DO-15X (Isolated)
S = DO-214 (Surface Mount)
TO-202
TO-92
Package Type
Current Rating
0 = 1 A
Diac
Device Type
D = Rectifier
Voltage Rating
20 = 200 V
40 = 400 V
60 = 600 V
80 = 800 V
K0 = 1000 V
Current Rating
15 = 15 A
20 = 20 A
25 = 25 A
Device Type
HT = Diac Trigger in DO-35
ST = Diac Trigger in DO-214
HT
Lead Form Dimensions
L = TO-220 (Isolated)
32
91
Lead Form Dimensions
32A / 5761 = 28 V to 36 V
32B / 5761A = 30 V to 34 V
36A / 5762 = 32 V to 40 V
Special Options
V = 4000 V Isolation
TO-220
Package Type
DO-35
Voltage Rating
32 = 27 V to 37 V
35 = 30 V to 40 V
40 = 35 V to 45 V
It is Teccor’s policy to ship quality products on time. We accomplish this through Total Quality Management based on the fundamentals of customer focus, continuous improvement, and people
involvement.
In support of this commitment, Teccor applies the following principles:
•Employees shall be respected, involved, informed, and qualified
for their job with appropriate education, training, and experience.
•Customer expectations shall be met or exceeded by consistently
shipping products that meet the agreed specifications, quality
levels, quantities, schedules, and test and reliability parameters.
•Suppliers shall be selected by considering quality, service, delivery, and cost of ownership.
•Design of products and processes will be driven by customer
needs, reliability, and manufacturability.
It is the responsibility of management to incorporate these
principles into policies and systems.
It is the responsibility of those in leadership roles to coach their
people and to reinforce these principles.
It is the responsibility of each individual employee to follow the
spirit of this statement to ensure that we meet the primary policy
— to ship quality products on time.
Quality Assurance
All products must first undergo rigid quality design reviews and
pass extensive environmental life testing. Teccor uses Statistical
Process Control (SPC) with associated control charts throughout
to monitor the manufacturing processes.
Only those products which pass tests designed to assure Teccor's high quality and reliability standards, while economically
satisfying customer requirements, are approved for shipment. All
new products and materials must receive approval of QRA prior
to being released to production.
The combination of reliability testing, process controls, and lot
tracking assures the quality and reliability of Teccor's devices.
Since even the best control systems cannot overcome measurement limitations, Teccor designs and manufactures its own computerized test equipment.
Teccor's Reliability Engineering Group conducts ongoing product
reliability testing to further confirm the design and manufacturing
parameters.
Incoming Material Quality
Teccor “Vendor Analysis” programs provide stringent requirements before components are delivered to Teccor. In addition,
purchased materials are tested rigidly at incoming inspection for
specification compliance prior to acceptance for use.
Process Controls
From silicon slice input through final testing, we use statistical
methods to control all critical processes. Process audits and lot
inspections are performed routinely at all stages of the manufacturing cycle.
Parametric Testing
All devices are 100% computer tested for specific electrical characteristics at critical processing points.
Final Inspection
Each completed manufacturing lot is sampled and tested for
compliance with electrical and mechanical requirements.
Reliability Testing
Random samples are taken from various product families for
ongoing reliability testing.
Finished Goods Inspection
Product assurance inspection is performed immediately prior to
shipping.
Design Assurance
The design and production of Teccor devices is a demanding and
challenging task. Disciplined skills coupled with advanced computer-aided design, production techniques, and test equipment
are essential elements in Teccor's ability to meet your demands
for the very highest levels of quality.
The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a periodic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests
may be performed when appropriate.
Test Ty p eTypical ConditionsTest DescriptionStandards
High Temperature
AC Blocking
High Temperature
Storage Life
Temperature and Humidity
Bias Life
Temperature Cycle
[Air to Air]
Thermal Shock
[Liquid to Liquid]
Autoclave
Resistance to
Solder Heat
Solderability
TA = 100 °C to 150 °C, Bias @
100%
Rated V
T
A
, t = 24 hrs to 1000 hrs
DRM
= 150 °C, t = 250 to 1000 hrsEvaluation of the effects on
Evaluation of the reliability of
product under bias conditions
and elevated temperature
devices after long periods of
storage at high temperature
T
= 85 °C to 95 °C, rh = 85% to
A
95%
Bias @ 80% Rated V
DRM
Evaluation of the reliability of nonhermetic packaged devices in
humid environments
(320 VDC max)
t = 168 to 1008 hrs
T
= -65°C to 150°C,
A
cycles = 10 to 500
Evaluation of the device’s ability
to withstand the exposure to
extreme temperatures and the
forces of TCE during transitions
between temperatures
T
= 0 °C to 100 °C, t
A
cycled = 10 to 20
= ≤10 s,
txfr
Evaluation of the device’s ability
to withstand the sudden changes
in temperature and exposure to
extreme temperatures
T
= 121 °C, rh = 100%, P = 15 psig,
A
t = 24 hrs to 168 hrs
T
= 260 °C, t = 10 sEvaluation of the device’s ability
A
Accelerated environmental test to
evaluate the moisture resistance
of plastic packages
to withstand the temperatures as
seen in wave soldering
operations
Steam aging = 1 hr to 8 hrs,
= 245 °C, Flux = R
T
solder
Evaluation of the solderability of
device terminals after an
extended period
MIL-STD-750, M-1040
MIL-STD-750, M-1031
EIA / JEDEC, JESD22-A101
MIL-STD-750, M-1051,
EIA / JEDEC, JESD22-A104
MIL-STD-750, M-1056
EIA / JEDEC, JESD22-A102
MIL-STD-750, M-2031
MIL-STD-750, M-2026,
ANSI-J-STD-002
Flammability Test
For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories
Supplier shall not be bound by any term proposed by Buyer in the
absence of written agreement to such term signed by an authorized officer of Supplier.
(1) PRICE:
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officer of Supplier.
(13) QUANTITIES: Any variation in quantities of electronic com-
ponents, or other goods shipped over or under the quantities
ordered (not to exceed 5%) shall constitute compliance with
Buyer's order and the unit price will continue to apply.
di/dt (Critical Rate-of-rise of On-state Current) – Maximum
value of the rate-of-rise of on-state current which a thyristor can
withstand without deleterious effect
dv/dt (Critical Rate-of-rise of Off-state Voltage or Static
dv/dt) –
which will cause switching from the off state to the on state
dv/dt(c) Critical Rate-of-rise of Commutation Voltage of a
Triac (Commutating dv/dt) –
of principal voltage which will cause switching from the off state
to the on state immediately following on-state current conduction
in the opposite quadrant
Measure of let-through energy in terms of current and time for
fusing purposes
I
BO
point
I
DRM
current that may occur under the conditions of V
IGT (Gate Trigger Current) – Minimum gate current required to
switch a thyristor from the off state to the on state
IH (Holding Current) – Minimum principal current required to
maintain the thyristor in the on state
IPP (Peak Pulse Current) – Peak pulse current at a short time
duration and specified waveshape
I
RRM
current that may occur under the conditions of V
IS (Switching Current) – Current at V
from the clamping state to on state
I
T(RMS)
that may be allowed under stated conditions, usually the fullcycle RMS current
I
TSM
cycle AC current pulse allowed
P
power which may be dissipated between the gate and main terminal 1 (or cathode) average over a full cycle
PGM (Peak Gate Power Dissipation) – Maximum power which
may be dissipated between the gate and main terminal 1 (or
cathode) for a specified time duration
R
ture difference between the thyristor junction and ambient divided
by the power dissipation causing the temperature difference
under conditions of thermal equilibrium
Note: Ambient is defined as the point where temperature does
not change as a result of the dissipation.
R
difference between the thyristor junction and the thyristor case
divided by the power dissipation causing the temperature difference under conditions of thermal equilibrium
Minimum value of the rate-of-rise of principal voltage
Minimum value of the rate-of-rise
(Breakover Current) – Principal current at the breakover
(Repetitive Peak Off-state Current) – Maximum leakage
DRM
(Repetitive Peak Reverse Current) – Maximum leakage
RRM
when a sidac switches
S
(On-state Current) – Anode cathode principal current
(Surge (Non-repetitive) On-state Current) – Peak single
(Thermal Resistance, Junction-to-case) – Temperature
θJC
tgt (Gate-controlled Turn-on Time) – Time interval between
the 10% rise of the gate pulse and the 90% rise of the principal
current pulse during switching of a thyristor from the off state to
the on state
tq (Circuit-commutated Turn-off Time) – Time interval
between the instant when the principal current has decreased to
zero after external switching of the principal voltage circuit and
the instant when the SCR is capable of supporting a specified
principal voltage without turning on
VBO (Breakover Voltage) – Principal voltage at the breakover
point
V
(Repetitive Peak Off-state Voltage) – Maximum allow-
DRM
able instantaneous value of repetitive off-state voltage that may
be applied across a bidirectional thyristor (forward or reverse
direction) or SCR (forward direction only)
V
(Gate Trigger Voltage) – Minimum gate voltage required to
GT
produce the gate trigger current
V
(Repetitive Peak Reverse Voltage) – Maximum allow-
RRM
able instantaneous value of a repetitive reverse voltage that may
be applied across an SCR without causing reverse current avalanche
VS (Switching Voltage) – Voltage point after V
switches from a clamping state to on state
when a sidac
BO
VT (On-state Voltage) – Principal voltage when the thyristor is in
the on state
Diode Rectifiers
I
(Average Forward Current) – Average forward conduc-
F(AV)
tion current
IFM (Maximum (Peak) Reverse Current) – Maximum reverse
Teccor's line of sensitive gate triacs includes devices with current
capabilities through 8 A. Voltage ranges are available from 200 V
to 600 V. This line features devices with guaranteed gate control
in Quadrants II and IV as well as control in the commonly used
Quadrants I and III. Four-quadrant control devices require
sensitive gate triacs. They can be controlled by digital circuitry
where positive-only or negative-only pulses must control AC
current in both directions through the device. Note that triacs with
low I
values in Quadrants II and IV will have lower dv/dt
GT
characteristics.
The sensitive gate triac is a bidirectional AC switch and is gate
controlled for either polarity of main terminal voltage. It is used
primarily for AC switching and phase control applications such as
motor speed controls, temperature modulation controls, and
lighting controls.
The epoxy TO-92 and TO-220 configurations feature Teccor's
electrically-isolated construction where the case or mounting tab
is internally isolated from the semiconductor chip and lead
attachments. Non-isolated epoxy TO-202 packages are available
as well as TO-251 and surface mount TO-252 (D-Pak). Tapeand-reel capability and tube packing also are available. See
“Packing Options” section of this catalog.
(0.8 A to 8 A)
All Teccor triacs have glass-passivated junctions. This glassing
process prevents migration of contaminants and ensures longterm device reliability with parameter stability.
Variations of devices covered in this data sheet are available for
custom design applications. Consult factory for more information.
Features
•Electrically-isolated packages
•Glass-passivated junctions ensure long device
reliability and parameter stability
•Voltage capability — up to 600 V
•Surge capability — up to 80 A
•Four-quadrant gating guaranteed
Compak Sensitive Gate Triac
•Surface mount package — 0.8 A and 1 A series
•New small profile three-leaded Compak package
•Packaged in embossed carrier tape with 2,500
devices per reel
(1) For either polarity of MT2 with reference to MT1 terminal
(2) For either polarity of gate voltage V
terminal
(3) See Gate Characteristics and Definition of Quadrants.
(4) See Figure E1.4 for i
(5) See Figure E1.6 for V
(6) See Figure E1.7 for I
(7) See Figure E1.5 for I
(8) See Figure E1.9 for surge rating and specific duration.
(9) See Figure E1.8 for t
(10) See Figure E1.2 and Figure E1.3 for maximum allowable case
temperature at maximum rated current.
(11) See Figure E1.1, Figure E1.2, and Figure E1.3 for T
I
T(RMS)
(12) See package outlines for lead form configurations. When ordering
special lead forming, add type number as suffix to part number.
(13) Pulse width ≤10 µs
or T
(14) T
C
(15) Minimum non-trigger V
V
GT
(2) (5) (15)
Volts
I
H
(1) (7)
mAmps
versus vT.
T
versus TC.
GT
versus TC.
GT
versus TC.
H
versus IGT.
gt
I
GTM
(13)
Amps
GT
.
= TJ for test conditions in off state
L
at 110 °C is 0.2 V.
GT
P
GM
(13)
WattsWatts
P
G(AV)
with reference to MT1
or TC versus
A
I
TSM
(8) (10)
Amps
dv/dt(c)dv/dt
(1) (10)
Volts/ µSec
(1)
Volts/ µSec
t
gt
(9)
µSecAmps
I2tdi/dt
2
SecAmps/µSec
Gate Characteristics
Teccor triacs may be turned on between gate and MT1 terminals
in the following ways:
•In-phase signals (with standard AC line) using Quadrants I
and III
•Application of unipolar pulses (gate always positive or negative), using Quadrants II and III with negative gate pulses and
Quadrants I and IV with positive gate pulses
When maximum surge capability is required, pulses should be a
minimum of one magnitude above I
waveform (
Teccor’s isolated triac packages withstand a minimum high
potential test of 2500 V ac rms from leads to mounting tab over
the device's operating temperature range. The following isolation
table shows standard isolation ratings.
Electrical Isolation
from Leads to Mounting Tab
VACRMSTO-220 *
2500Standard
*UL Recognized File #E71639
Thermal Resistance (Steady State) Junction to Mounting Tab
and Junction to Ambient
[R
R
θJC
] °C/W (TYP)
θJA
Package CodeECFLF2DV
Typ e
TO-92
PlasticCompak
TO-202
Type 1
TO-220
Isolated
TO-202
Type 2
TO-252
D-Pak
TO-251
V-Pa k
0.8 A60 [135]60 *
1 A50 [95]40 *
4A3.5 [45]3.6 [50]6.0 [70]3.56.0 [70]
6A3.33.23.2
8A2.82.72.7
* Mounted on 1 cm
2
copper foil surface; two-ounce copper foil
120
) - ˚C
A
T
100
80
60
40
25
20
Maximum Allowable Ambient Temperature (
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
CURRENT WAVEFORM: Sinusoidal
LOAD: Resistive or Inductive
CONDUCTION ANGLE: 360
FREE AIR RATING – NO HEATSINK
1 A TO-92
0.8 A TO-92
RMS On-State Current [I
˚
TO-220 and
TYPE 1 and 3 TO-202
TYPE 2 and 4 TO-202
and TO-251
] - Amps
T(RMS)
110
) – ˚C
C
100
90
80
70
60
50
00.20.40.60.81.01.21.41.6
Maximum Allowable Case Temperature (T
0.8 A
RMS On-State Current [I
CURRENT WAVEFORM: Sinusoidal
LOAD: Resistive or Inductive
CONDUCTION ANGLE: 360˚
CASE TEMPERATURE: Measured as
shown on Dimensional Drawings
1 A
] – Amps
T(RMS)
Figure E1.1 Maximum Allowable Ambient Temperature versus
On-state Current
Figure E1.2 Maximum Allowable Case Temperature versus
These gated triacs from Teccor Electronics are part of a broad
line of bidirectional semiconductors. The devices range in current
ratings from 0.8 A to 35 A and in voltages from 200 V to 1000 V.
The triac may be gate triggered from a blocking to conduction
state for either polarity of applied voltage and is designed for AC
switching and phase control applications such as speed and temperature modulation controls, lighting controls, and static switching relays. The triggering signal is normally applied between the
gate and MT1.
Isolated packages are offered with internal construction, having
the case or mounting tab electrically isolated from the semiconductor chip. This feature facilitates the use of low-cost assembly
and convenient packaging techniques. Tape-and-reel capability
is available. See “Packing Options” section of this catalog.
All Teccor triacs have glass-passivated junctions to ensure longterm device reliability and parameter stability. Teccor's glass-passivated junctions offer a rugged, reliable barrier against junction
contamination.
(1) For either polarity of MT2 with reference to MT1 terminal
(2) For either polarity of gate voltage (V
terminal
(3) See Gate Characteristics and Definition of Quadrants.
(4) See Figure E2.1 through Figure E2.7 for current rating at specific
) with reference to MT1
GT
(15) RL = 60 Ω for 0.8 A to10 A triacs; RL = 30 Ω for 15 A to 35 A triacs
= TJ for test conditions in off state
(16) T
C
= 300 mA for 25 A and 35 A devices
(17) I
GT
(18) Quadrants I, II, III only
(19) Minimum non-trigger V
at 125 °C is 0.2 V for all except 50 mA
GT
MAX QIV devices which are 0.2 V at 110 °C.
operating temperature.
(5) See Figure E2.8 through Figure E2.10 for i
versus v
T
T
.
(6) See Figure E2.12 for VGT versus TC.
(7) See Figure E2.11 for I
(8) See Figure E2.14 for I
versus TC.
GT
versus TC.
H
(9) See Figure E2.13 for surge rating with specific durations.
(10) See Figure E2.15 for t
versus IGT.
gt
(11) See package outlines for lead form configurations. When ordering
special lead forming, add type number as suffix to part number.
(12) Initial on-state current = 200 mA dc for 0.8 A to10 A devices,
400 mA dc for 15 A to 35 A devices
(13) See Figure E2.1 through Figure E2.6 for maximum allowable case
temperature at maximum rated current.
(14) Pulse width ≤10
µs; IGT ≤ I
GTM
Gate Characteristics
Teccor triacs may be turned on between gate and MT1 terminals
in the following ways:
•In-phase signals (with standard AC line) using Quadrants I
and III
•Application of unipolar pulses (gate always positive or negative), using Quadrants II and III with negative gate pulses and
Quadrants I and IV with positive gate pulses
However, due to higher gate requirements for Quadrant IV, it
is recommended that only negative pulses be applied. If positive pulses are required, see “Sensitive Triacs” section of
this catalog or contact the factory. Also, see
Figure AN1002.8, “Amplified Gate” Thyristor Circuit.
In all cases, if maximum surge capability is required, pulses
should be a minimum of one magnitude above I
rating with a
GT
steep rising waveform (≤1 µs rise time).
ALL POLARITIES ARE REFERENCED TO MT1
MT2 POSITIVE
(Positive Half Cycle)
MT2
(-)
I
GT
GATE
MT1
I
GT
GATE
REF
MT2
MT1
REF
I
-
GT
(-)
+
(+)
QII
QI
QIV
QIII
(+)
-
MT2 NEGATIVE
(Negative Half Cycle)
I
GT
GATE
I
GT
GATE
MT2
REF
MT2
REF
MT1
MT1
+
I
GT
Electrical Isolation
Teccor’s isolated triac packages will withstand a minimum high
potential test of 2500 V ac rms from leads to mounting tab or
base, over the operating temperature range of the device. The
following isolation table shows standard and optional isolation
ratings.
Electrical Isolation
from Leads to Mounting Tab *
VACRMS
TO-220
Isolated
2500StandardStandard
4000Optional **N/A
* UL Recognized File E71639
** For 4000 V isolation, use V suffix in part number.
Te cc o r’ s Quadrac devices are triacs that include a diac trigger
mounted inside the same package. This device, developed by
Teccor, saves the user the expense and assembly time of buying
a discrete diac and assembling in conjunction with a gated triac.
Also, the alternistor Quadrac device (QxxxxLTH) eliminates the
need for a snubber network.
The Quadrac device is a bidirectional AC switch and is gate controlled
for either polarity of main terminal voltage. Its primary purpose is for AC switching and phase control applications such as
speed controls, temperature modulation controls, and lighting
controls where noise immunity is required.
Triac current capacities range from 4 A to 15 A with voltage
ranges from 200 V to 600 V. Quadrac devices are available in the
TO-220 package.
The TO-220 package is electrically isolated to 2500 V rms from
the leads to mounting surface. 4000 V rms is available on special
order. This means that no external isolation is required, thus
eliminating the need for separate insulators and insulator-mounting steps and saving dollars over “hot tab” devices.
Quadrac
All Teccor triac and diac chips have glass-passivated junctions to
ensure long-term device reliability and parameter stability.
Variations of devices in this data sheet are available for custom
design applications. Consult the factory for more information.
[∆V±] — Dynamic breakback voltage (forward and reverse)
∆V
— Breakover voltage symmetry
BO
— Trigger firing capacitance
C
T
di/dt — Maximum rate-of-change of on-state current
dv/dt — Critical rate-of-rise of off-state voltage at rated V
dv/dt(c) — Critical rate-of-rise of commutation voltage at rated V
and I
commutating di/dt = 0.54 rated I
T(RMS)
T(RMS)
unenergized
2
I
t — RMS surge (non-repetitive) on-state current for period of 8.3 ms
for fusing
I
— Peak breakover current
BO
I
— Peak off-state current gate open; V
DRM
I
— Peak gate trigger current (10 µs Max)
GTM
I
— Holding current; gate open
H
I
— RMS on-state current, conduction angle of 360°
T(RMS)
I
— Peak one-cycle surge
TSM
t
— Gate controlled turn-on time
gt
V
— Breakover voltage (forward and reverse)
BO
= maximum rated value
DRM
DRM
/ms; gate
gate open
DRM
DRM
V
— Peak on-state voltage at maximum rated RMS current
TM
General Notes
•All measurements are made at 60 Hz with resistive load at an ambi-
ent temperature of +25 °C unless otherwise specified.
•Operating temperature range (T
•Storage temperature range (T
) is -40 °C to +125 °C.
J
) is -40 °C to +125 °C.
S
•Lead solder temperature is a maximum of +230 °C for 10 seconds
maximum; ≥1/16" (1.59 mm) from case.
•The case temperature (T
) is measured as shown on dimensional
C
outline drawings. See “Package Dimensions” section of this
catalog.
Electrical Specification Notes
(1) For either polarity of MT2 with reference to MT1
(2) See Figure E3.1 for I
(3) See Figure E3.4 and Figure E3.5 for i
versus TC.
H
versus vT.
T
(4) See Figure E3.9 for surge ratings with specific durations.
(5) See Figure E3.6, Figure E3.7, and Figure E3.8 for current rating at
specific operating temperature.
(6) See Figure E3.2 and Figure E3.3 for test circuit.
(7) ∆V
= [+ VBO] - [- VBO]
BO
(8) See Figure E3.7 and Figure E3.8 for maximum allowable case
temperature at maximum rated current.
(9) Trigger firing capacitance = 0.1 µF with 0.1 µs rise time
(10) T
= TJ for test conditions in off state
C
(11) Maximum required value to ensure sufficient gate current
(12) See package outlines for lead form configurations. When ordering
special lead forming, add type number as suffix to part number.
Electrical Isolation
All Teccor isolated Quadrac packages withstand a minimum high
potential test of 2500 V ac rms from leads to mounting tab over
the operating temperature range of the device. The following isolation table shows standard and optional isolation ratings.
Electrical Isolation
from Leads to Mounting Tab *
V AC RMSTYPE
2500Standard
4000Optional **
* UL Recognized File #E71639
**For 4000 V isolation, use “V” suffix in part number.
Teccor offers bidirectional alternistors with current ratings from
6 A to 40 A and voltages from 200 V to 1000 V as part of Teccor's
broad line of thyristors. Teccor's alternistor is specifically
designed for applications that switch highly inductive loads.
A special chip offers the same performance as two thyristors
(SCRs) wired inverse parallel (back-to-back), providing better
turn-off behavior than a standard triac. An alternistor may be triggered from a blocking to conduction state for either polarity of
applied AC voltage with operating modes in Quadrants I, II,
and III.
This new chip construction provides two electrically separate
SCR structures, providing enhanced dv/dt characteristics while
retaining the advantages of a single-chip device.
All alternistors have glass-passivated junctions to ensure longterm reliability and parameter stability. Teccor's glass-passivated
junctions offer a reliable barrier against junction contamination.
Teccor's TO-218X package is designed for heavy, steady powerhandling capability. It features large eyelet terminals for ease of
soldering heavy gauge hook-up wire. All the isolated packages
have a standard isolation voltage rating of 2500 V rms
.
TO-251
V-Pak
MT2MT1
G
(6 A to 40 A)
Variations of devices covered in this data sheet are available for
custom design applications. Consult the factory for further
information.
(11) See package outlines for lead form configurations. When ordering
special lead forming, add type number as suffix to part number.
(12) Initial on-state current = 400 mA dc for 16 A to 40 A devices and
100 mA for 6 A to 12 A devices.
(13) See Figure E4.1 through Figure E4.4 for maximum allowable case
temperature at maximum rated current.
(14) Pulse width ≤10 µs;
IGT ≤ I
GTM
(15) For 6 A to 12 A devices, RL = 60 Ω; 16 A and above, RL = 30 Ω
(16) 40 A pin terminal leads on K package can run 100 °C to 125 °C.
(17) Alternistor does not turn on in Quadrant IV.
(18) T
= T
for test conditions in off state
C
J
= 200 mA for 6 A to 12 A devices and 500 mA for 16 A to 40 A
(19) I
GT
devices with gate pulse having rise time of ≤0.1 µs.
(20) Minimum non-trigger V
at 125 °C is 0.2 V.
GT
I
GT
ALL POLARITIES ARE REFERENCED TO MT1
MT2 POSITIVE
(Positive Half Cycle)
MT2
(-)
I
GT
GATE
MT1
-
(-)
REF
MT2
I
GT
GATE
MT1
REF
NOTE: Alternistors will not operate in QIV
+
QII
QI
QIV
QIII
-
MT2 NEGATIVE
(Negative Half Cycle)
MT2
(+)
I
GT
GATE
MT1
REF
+ I
MT2
(+)
I
GT
GATE
REF
GT
MT1
Gate Characteristics
Teccor triacs may be turned on in the following ways:
•In-phase signals (with standard AC line) using Quadrants I
and III
•Application of unipolar pulses (gate always negative), using
Quadrants II and III with negative gate pulses
In all cases, if maximum surge capability is required, gate pulses
should be a minimum of one magnitude above minimum I
rating
GT
with a steep rising waveform (≤1 µs rise time).
If QIV and QI operation is required (gate always positive), see
Figure AN1002.8, “Amplified Gate” Thyristor Circuit.
Definition of Quadrants
Electrical Isolation
Teccor’s isolated alternistor packages withstand a minimum high
potential test of 2500 V ac rms from leads to mounting tab, over
the operating temperature range of the device. The following isolation table shows standard and optional isolation ratings.
Electrical Isolation
from Leads to Mounting Tab *
VACRMS
2500
4000
Isolated
StandardStandardStandard
N/AOptional **N/A
* UL Recognized File E71639
** For 4000 V isolation, use V suffix in part number.
The Teccor line of sensitive SCR semiconductors are half-wave
unidirectional, gate-controlled rectifiers (SCR-thyristor) which
complement Teccor's line of power SCRs. This group of
packages offers ratings of 0.8 A to 10 A, and 200 V to 600 V with
gate sensitivities of 12 µA to 500 µA. For gate currents in the
10 mA to 50 mA ranges, see “SCRs” section of this catalog.
The TO-220 and TO-92 are electrically isolated where the case
or tab is internally isolated to allow the use of low-cost assembly
and convenient packaging techniques.
Teccor's line of SCRs features glass-passivated junctions to
ensure long-term device reliability and parameter stability.
Teccor's glass offers a rugged, reliable barrier against junction
contamination.
Tape-and-reel packaging is available for the TO-92 package.
Consult the factory for more information.
Variations of devices covered in this data sheet are available for
custom design applications. Consult the factory for more
information.
AK
G
Sensitive SCRs
(0.8 A to 10 A)
Features
•Electrically-isolated TO-220 package
•High voltage capability — up to 600 V
•High surge capability — up to 100 A
•Glass-passivated chip
Compak Features
•Surface mount package — 0.8 A series
•New small-profile three-leaded Compak package
•Four gate sensitivities available
•Packaged in embossed carrier tape with 2,500
devices per reel
(1) See Figure E5.1 through Figure E5.9 for current ratings at
specified operating temperatures.
(2) See Figure E5.10 for I
(3) See Figure E5.11 for instantaneous on-state current (i
state voltage (v
T
(4) See Figure E5.12 for V
(5) See Figure E5.13 for I
(6) For more than one full cycle, see Figure E5.14.
(7) 0.8 A to 4 A devices also have a pulse peak forward current on-
state rating (repetitive) of 75 A. This rating applies for operation at
60 Hz, 75 °C maximum tab (or anode) lead temperature, switching
from 80 V peak, sinusoidal current pulse width of 10 µs minimum,
15 µs maximum. See Figure E5.20 and Figure E5.21.
(8) See Figure E5.15 for t
(9) Test conditions as follows:
or T
– T
≤80 °C, rectangular current waveform
C
L
– Rate-of-rise of current ≤10 A/µs
– Rate-of-reversal of current ≤5A/µs
*Mounted on 1 cm2 copper foil surface; two-ounce copper foil
Electrical Isolation
Teccor’s isolated sensitive SCRs will withstand a minimum high
potential test of 2500 V ac rms from leads to mounting tab over
the device's operating temperature range. The following table
shows other standard and optional isolation ratings.
Electrical Isolation *
from Leads to Mounting Tab
V AC RMSTO-220
2500
4000
Standard
Optional **
*UL Recognized File #E71639
**For 4000 V isolation, use “V” suffix in part number.
130
120
110
) – ˚C
C
100
90
80
Maximum Allowable
70
Case Temperature (T
60
50
0.10.20.30.40.50.60.70.80.91.0
EC Series
RMS On-State Current [
CURRENT WAVEFORM: Sinusoidal
LOAD: Resistive or Inductive
CONDUCTION ANGLE: 180
CASE TEMPERATURE: Measured
as Shown on Dimensional Drawing
JEDEC 2N Series
Compak
] – Amps
I
T(RMS)
˚
Figure E5.1 Maximum Allowable Case Temperature versus
RMS On-state Current
Figure E5.2 Maximum Allowable Case Temperature versus
130
120
) – ˚C
C
T
110
100
Maximum Allowable Case Temperature (
4 A TO-251
and TO-252
90
80
70
60
TCR22 Devices
50
40
00.51.01.52.02.53.03.54.0
RMS On-state Current [
CURRENT WAVEFORM: Sinusoidal
LOAD: Resistive or Inductive
CONDUCTION ANGLE: 180˚
CASE TEMPERATURE: Measured
as Shown on Dimensional Drawing
T106 and T107
Type 2 and 4
2.6
] – Amps
I
T(RMS)
T106 and T107
Type 1 and 3
RMS On-state Current
130
120
) – ˚C
C
T
110
100
90
80
EC Series
70
60
50
00.10.20.30.40.50.6
Maximum Allowable Case Temperature (
Average On-state Current [
CURRENT WAVEFORM: Sinusoidal
LOAD: Resistive or Inductive
CONDUCTION ANGLE: 180˚
CASE TEMPERATURE: Measured
as Shown on Dimensional Drawing
JEDEC 2N Series
Compak
] – Amps
I
T(AV)
TO-251
V-Pa k
0.51
Figure E5.3 Maximum Allowable Case Temperature versus
The Teccor line of thyristor SCR semi-conductors are half-wave,
unidirectional, gate-controlled rectifiers which complement Teccor's line of sensitive SCRs. Teccor offers devices with ratings of
1 A to 70 A and 200 V to 1000 V, with gate sensitivities from
10 mA to 50 mA. If gate currents in the 12 µA to 500 µA ranges
are required, see “Sensitive SCRs” section of this catalog.
Three packages are offered in electrically isolated construction
where the case or tab is internally isolated to allow the use of
low-cost assembly and convenient packaging techniques.
The Teccor line of SCRs features glass-passivated junctions to
ensure long-term reliability and parameter stability. Teccor’s
glass offers a rugged, reliable barrier against junction contamination.
Variations of devices covered in this data sheet are available for
custom design applications. Consult the factory for more information.
TO-251
V-Pak
AK
G
SCRs
(1 A to 70 A)
Features
•Electrically-isolated package
•High voltage capability — 200 V to 1000 V
•High surge capability — up to 950 A
•Glass-passivated chip
Compak SCR
•Surface mount package — 1 A series
•New small profile three-leaded Compak package
•Packaged in embossed carrier tape with 2,500
devices per reel
(1) See Figure E6.5 through Figure E6.16 for current rating at
specified operating case temperature.
(2) See Figure E6.1 and Figure E6.2 for free air current rating.
(3) See Figure E6.19 and Figure E6.20 for instantaneous on-state
current versus on-state voltage (typical).
(4) See Figure E6.18 for I
(5) See Figure E6.17 for I
(6) For more than one full cycle rating, see Figure E6.23.
(7) See Figure E6.22 for t
(8) See Figure E6.21 for V
(9) Test conditions are as follows:
= 1 A for 1 A devices and 2 A for all other devices
•I
T
versus TC.
GT
versus TC.
H
versus IGT.
gt
versus TC.
GT
(11) See package outlines for lead form configuration. When ordering
special lead forming, add type number as suffix to part number.
(12) Pulse width ≤10 µs
(13) Initial on-state current = 200 mA dc for 1 A through 16 A devices;
400 mA dc for 20 A through 70 A devices.
= TJ for test conditions in off state.
(14) T
C
(15) The R, K, or M package rating is intended for high surge condition
use only and not recommended for ≥50 A rms continuous current
use since narrow pin lead temperature can exceed PCB solder melting
temperature. Teccor's J package or W package is recommended
for ≥50 A rms continuous current requirements.
(16) For various durations of an exponentially decaying current
waveform, see Figure E6.3 and Figure E6.4. (t
is defined as
W
5 time constants.)
(17) Minimum non-trigger V
at 125 °C is 0.2 V.
GT
• Pulse duration = 50 µs, dv/dt = 20 V/µs, di/dt = -10 A/µs for 1 A
devices, and -30 A/µs for other devices
= 200 mA at turn-on
•I
GT
(10) See Figure E6.5 through Figure E6.10 for maximum allowable
* Mounted on 1cm2 copper foil surface; two-ounce copper foil
Electrical Isolation
Teccor’s isolated SCR packages will withstand a minimum high
potential test of 2500 V ac rms from leads to mounting tab over
the device's operating temperature range. The following table
shows standard and optional isolation ratings.
Electrical Isolation *
from Leads to Mounting Tab
VACRMS
2500
4000
Isolated
StandardStandardStandard
Optional **N/AN/A
* UL Recognized File #E71639
** For 4000 V isolation, use “V” suffix in part number.
Teccor manufactures 15 A rms to 25 A rms rectifiers with voltages rated from 200 V to 1000 V. Due to the electrically-isolated
TO-220 package, these rectifiers may be used in common anode
or common cathode circuits using only one part type, thereby
simplifying stock requirements.
Teccor's silicon rectifiers feature glass-passivated junctions to
ensure long term reliability and stability. In addition, glass offers a
rugged, reliable barrier against junction contamination.
I2t — RMS surge (non-repetitive) forward current for 8.3 ms for fusing
— Average forward current
I
F(AV)
— RMS forward current
I
F(RMS)
I
— Peak one-cycle surge current
FSM
— Peak reverse current
I
RM
— Thermal resistance (steady state) junction to case
R
JC
θ
V
— Peak forward voltage at rated average forward current
FM
— DC blocking voltage
V
R
— Peak repetitive reverse voltage
V
RRM
General Notes
•Operating temperature range (TJ) is -40 °C to +125 °C.
•Storage temperature range (T
•Lead solder temperature is a maximum of 230 °C for 10 seconds
maximum at a minimum of 1/16" (1.59 mm) from case.
•The case temperature (T
outline drawings in the “Package Dimensions” section of this
catalog.
•Teccor's electrically-isolated TO-220 devices withstand a high
potential test of 2500 V ac rms from leads to mounting tab over the
operating temperature range.
•Typical Reverse Recovery Time (t
0.9 A forward current and 1.5 A reverse current)
) is -40 °C to +125 °C.
S
) is measured as shown on dimensional
C
) is 4 µs. (Test conditions =
rr
Electrical Specification Notes
(1) See Figure E7.3 for current rating at specified case temperature.
(2) For more than one full cycle rating, see Figure E7.4.
= TJ for test conditions
(3) T
C
(4) See package outlines for lead form configurations. When ordering
special lead forming, add type number as suffix to part number.
Electrical Isolation
Electrical Isolation
from Leads to Mounting Tab *
VACRMS
2500
4000
* UL Recognized File #E71639
** For 4000 V isolation, use “V” suffix in the part number.
Teccor’s HT and ST Series of bilateral trigger diacs offer a range
of voltage characteristics from 27 V to 45 V.
A diac semiconductor is a full-wave or bidirectional thyristor. It is
triggered from a blocking- to conduction-state for either polarity
of applied voltage whenever the amplitude of applied voltage
exceeds the breakover voltage rating of the diac.
The Teccor line of diacs features glass-passivated junctions to
ensure long-term reliability and parameter stability. Teccor’s
glass offers a rugged, reliable barrier against junction
contamination.
The diac specifications listed in this data sheet are for standard
products. Special parameter selections such as close tolerance
voltage symmetry are available. Consult the factory for more
information about custom design applications.
* Adjust for one firing in each half cycle. D.U.T. = Diac
100 k
V
C
*
D.U.T.
R
C
T
O.1 µF
L
I
L
20 Ω
1%
Figure E8.3 Normalized VBO Change versus Junction Temperature
V
C
+V
BO
0
-V
BO
I
L
+I
PK
0
-I
PK
Typical pulse base width is 10 µs
∆V+
t
∆V-
t
Figure E8.4 Test Circuit Waveforms (Refer to Figure E8.5.)
Figure E8.5 Circuit Used to Measure Diac Characteristics
(Refer to Figure E8.4.)
300
250
) – mA
PK
200
150
100
50
Peak Output Current (I
0
.01 .02 .03 .04 .05 .06 .07 .08 .09
Typical (35 V Device)
.10
Triggering Capacitance (CT) – µF
Figure E8.6 Peak Output Current versus Triggering Capacitance
(Per Figure E8.5 with RL of 20 Ω)
http://www.teccor.comE8 - 4
2002 Teccor Electronics
+1 972-580-7777Thyristor Product Catalog
DO-214
Surface Mount
E9
DO-15X
TO-92
Type 70
TO-202
Sidac
E9
General Description
The sidac is a silicon bilateral voltage triggered switch with
greater power-handling capabilities than standard diacs. Upon
application of a voltage exceeding the sidac breakover voltage
point, the sidac switches on through a negative resistance region
to a low on-state voltage. Conduction continues until the current
is interrupted or drops below the minimum holding current of the
device.
Teccor’s sidacs feature glass-passivated junctions to ensure a
rugged and dependable device capable of withstanding harsh
environments.
Variations of devices covered in this data sheet are available for
custom design applications. Consult the factory for more information.
Note A: Input pulse width is increased until ICM = 0.63 A.
=
≤
≥
V
IN - VBO
I
BO
V
IN - VTM
I
H (MIN)
VCE Monitor
TIP-47
VCC = 20 V
R
= 0.1 Ω
S
100 mH
+
-
Monitor
I
C
Input
Voltage
Collector
Current
Sidac V
Collector
Voltage
V
tw ≈ 3 ms
0 V
(See Note A)
t
w
5 V
0.63 A
0
BO
10 V
CE(sat)
Voltage and Current Waveforms
t
100 ms
Note B: Sidac (or Diac or series of Diacs) chosen so that V
The Sidac (or Diac) eliminates a reverse breakdown of the transistor in inductive switching circuits where otherwise the
is just below V
BO
rating of transistor to be protected.
CEO
transistor could be destroyed.
Figure E9.16 Sidac Added to Protect Transistor for Typical Transistor Inductive Load Switching Requirements
Non-isolated Mounting Tab Common with MT2 / Anode / PIN 2
A
Tab Common to
MT2 / Anode / PIN 2
R
DIA.
Case
Temperature
Measurement
Point
MT1 / Cathode / PIN 1
MT2 / Anode / PIN 2
M
Notes:
(1) Maximum torque to be applied to mounting tab is 8 in-lbs. (0.904 Nm)
(2) Pin 2 and mounting tab are electrically connected. Do not use either
for Sidac o