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Team Industrial SATAIII M.2 2260 SSD
Team Industrial SATAIII M.2 2260 SSD
1.
INTRODUCTION
1.1 General Description
Team’s M6Q56 M.2 2260 SATA Drive delivers all the advantages of Flash Disk technology
with the Serial ATA I/II/III interface and is fully compliant with the standard Next Generation
Form Factor (NGFF) called M.2 Card Format, which is generated by Intel. The M.2 2260
SATA Drive is designed to operate at a maximum operating frequency of 200MHz with
30MHz external crystal. Its capacity could provide a wide range up to 512GB. Moreover, it
can reach up to 550MB/s read as well as 460MB/s write high performance based on Toshiba
NAND flash (with 32MB SDR enabled and measured by CrystalDiskMark v5.0). The power
consumption of the M.2 2260 is much lower than traditional Hard Drives, making it the best
embedded solution for new platforms.
1.2 Block Diagram
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Team Industrial SATAIII M.2 2260 SSD
Capacity:
MLC: From 32GB up to 512GB(Support 48-bit addressing mode)
Electrical/Physical Interface:
SATA Interface
Compliant with SATA Revision 3.2
Compatible with SATA 1.5Gbps, 3Gbps and 6Gbps interface
Support power management
Support expanded register for SATA protocol 48 bits addressing mode
Embedded BIST function for SATA PHY for low cost mass production
Built-in 2-channel NAND flash interface controller
Compliant with Toggle 1.0 and Toggle 2.0 NAND Flash interface
Compliant with ONFI 4.0 interface:
SDR up to mode 5
NV-DDR up to mode 5
NV-DDR2 up to mode 7
NV-DDR3 up to mode 8
Supported NAND Flash:
Support up to 16 Flash Chip Enables (CE) within single design
Toshiba 15nm/3D-NAND MLC and TLC
Support all types of SLC/MLC/TLC/3D-NAND, 8KB/page and 16K/page NAND flash
Support ONFI 2.3, ONFI 3.0, ONFI 3.2 and ONFI 4.0 interface: 2 channels at
maximum
ECC Scheme
Applies the LDPC (Low Density Parity Check) of ECC algorithm
UART Function
GPIO
Support SMART and TRIM commands
2.
PRODUCT SPECIFICATIONS
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Team Industrial SATAIII M.2 2260 SSD
Note:
1. The performance was estimated based on Toshiba NAND flash.
2. Performance may differ according to flash configuration and platform.
3. The table above is for reference only.
TBW (Terabytes Written)
Note:
1. Samples were built using Toshiba NAND flash.
2. TBW may differ according to flash configuration and platform.
3. The endurance of SSD could be estimated based on user behavior, NAND endurance
cycles, and write amplification factor. It is not guaranteed by flash vendor.
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Team Industrial SATAIII M.2 2260 SSD
Capacity
MLC: 32GB up to 512GB
SATA Interface
SATA Revision 3.2
SATA 1.5Gbps, 3Gbps, and 6Gbps
interface
Flash Interface
Flash Type: MLC
Performance
Read: up to 550 MB/s
Write: up to 460 MB/s
Power Consumption
Active mode: < 1740mW
Idle mode: < 265mw
TBW (Terabyte Written)
544TBW for 512GB
MTBF
More than 2,000,000 hours
Advanced Flash Management
Static and Dynamic Wear Leveling
Bad Block Management
TRIM
SMART
Over-Provision
Low Power Management
DEVSLP Mode (Optional)
DIPM/HIPM Mode
Temperature Range
Operation(Standard): 0 ~ 70°C
Storage: -40°C ~ 85°C
RoHS compliant
Overview
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Team Industrial SATAIII M.2 2260 SSD
Table of Contents
1. Introduction ............................................................................................................... …1
1.1 General Description ......................................................................................... 1
1.2 Block Diagram .................................................................................................. 1
2. Product Specifications ................................................................................................... 2
3. Environmental Specifications ....................................................................................... 6
3.1 Environmental Conditions .............................................................................. 6
3.2
MTBF
................................................................................................................ 8
3.3 Certification & Compliance ............................................................................ 8
4.
ELECTRICAL SPECIFICATIONS
............................................................................ 9
4.1 Supply Voltage .................................................................................................. 9
4.2 Power Consumption ......................................................................................... 9
5.
INTERFACE
................................................................................................................ 10
5.1 Pin Assignment and Descriptions ................................................................. 10
6.
SUPPORTED COMMANDS
6.1
ATA Command List
...................................................................................... 13
....................................................................................... 13
6.2 Identify Device Data ....................................................................................... 15
7. Physical Dimension ..................................................................................................... 20
8. Product Ordering Number ......................................................................................... 21
9. Revision Histories ........................................................................................................ 22
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Team Industrial SATAIII M.2 2260 SSD
Operation (Standard Grade)
Operation (Standard Grade)
Operation (Standard Grade)
Operation
(Standard Grade)
3.
ENVIRONMENTAL SPECIFICATIONS
3.1
Environmental Conditions
3.1.1 Temperature and Humidity
Storage Temperature Range:
-40°C ~ 85°C
Operation Temperature Range:
Standard Grade: 0°C ~ 70°C
Humidity:
Standard Grade: RH 90% under 40°C (in operational)
High Temperature Test Condition:
Result: No any abnormality is detected.
Low Temperature Test Condition:
Result: No any abnormality is detected.
High Humidity Test Condition:
Result: No any abnormality is detected.
Temperature Cycle Test:
Result: No any abnormality is detected.
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Team Industrial SATAIII M.2 2260 SSD
X, Y, Z axis/60
min for each
6 face of each unit, 2 times
Device functions are
affected, but EUT will
be back to its normal or
operational state
automatically.
3.1.2 Shock:
Shock Specification.
Result: No any abnormality is detected when power on.
3.1.3 Vibration:
Vibration Specification
Result: No any abnormality is detected when power on.
3.1.4 Drop:
Drop Specification
Result: No any abnormality is detected when power on.
3.1.5 Bending:
Bending Specification
Result: No any abnormality is detected when power on.
3.1.6 Electrostatic Discharge (ESD):
Contact ESD Specification