PAH-S48 SERIES HANDBOOK No : PA548-39-01F
BEFORE USING THE POWER SUPPLY UNIT
Pay attention to all warnings and cautions before using the unit . Incorrect usage coul d lead to an ele ct rical shock, dam a ge to the unit, or a fire hazard.
WARNING
z Do not touch heatsinks and case which may be hot.
z Confirm connections to input/output terminals and signal ter minals are correct as indicated in instruction manual.
z Attach a fast blow type external fuse to each module to ensure safety operation and to acquire each safety standard app roval .
z This power supply is designed for professional installation within a n end user equipment.
z The output from this power supply must be consi dered as an energy hazard (> 240VA power and 2V voltage) and must not be accessible to a user. End equipment manufacturers
must provide protection against inadvertent contact with the output terminals on this product by a service engineer or by the service engineer dropping a tool into them.
z Use isolated voltage by reinforced insulation at primary power supply or double insulation as input power source.
NOTE : CE MARKING
CE marking, when applied to a product covered by this handbook indicates compliance with the low voltage directive (73/23/EEC) as modifie d by the CE Marking Directive
(93/68/EEC) in that it is complies with EN60950.
1. TERMINAL EXPLANATION
-Vin
CASE
NAME PLATE
CNT
+Vin
-V
-S
TRM
+S
+V
-Vin : Negative Input Terminal
CASE : Baseplate Terminal
: ON/OFF Control TerminalCNT
+Vin : Positive Input Terminal
-V : Negative Output Terminal
: Negative Remote Sensing-S
: Output Voltage Adjustment TerminalTRM
: Positive Remote S en s ing+S
: Positive O u tput Ter minal+V
TDK-Lambda
1
2. BASIC CONNECTION
S
n
n
Fuse
+Vi
C2
CNT
CASE
-Vi
Vin
C1
3. WITHSTAND VOLTAGE
This power module is designed to withstand 1.5kVAC input-output and 1.5kVAC inp ut-baseplate for each 1 minute.
4. MOUNTING DIRECTION
4-1. Circuit Board Mounting
Input/Signal/Output Terminal Pin (φ1.0mm)
Hole Diameter : φ1.5mm
Land Diameter : φ3.5mm
Output Terminal Pin (φ2.0mm)
Hole Diameter : φ2.5mm
Land Diameter : φ5.0mm
+V
+
TRM
-S
-V
1) The power module is fixed to printed circuit board by 4 positi ons throu gh the M3 tapped holes in the resin case side. Recommended
torque is 5.5kgcm.
2) The M3 mounting tapped hol es of the power module are connected to the baseplate. FG (Frame Ground) can be taken by these tapped
holes.
3) Mounting Holes on Printed Cir cuit Board
M3 Mounting Tap (FG)
Hole Diameter : φ3.5mm
Land Diameter : φ7.0mm
4) Recommended Printed Circuit Board is a double sided glass epoxy (t=1.6mm) with through holes.
5) The standard power module lead length is 5.08mm.
C3
50mm
C4
+
LOAD
-
Fuse : External Fuse C3 : Film/Ceramic Capacitor
C1 : Electrolytic Capacitor C4 : Electrolytic Capacitor
C2 : High Withstand Voltage Ceramic Capacitor
Note : Above Basic Connection is for C ontrol ON/OFF Negative Logic.
TDK-Lambda
2
4-2. Recommended Soldering Condition
Recommended soldering temperature is as follows.
(1) Soldering dip : 260°C within 10 seconds
Pre-heat condition : 110°C 30~40 seconds
(2) Soldering iron : 350°C within 3 seconds
4-3. Recommended Cleaning C ondi t i on
Recommended cleaning condition after soldering is as follows.
• Cleaning solvent : IPA (isopropyl alcohol)
• Cleaning Procedure : Use brush and dry the solvent completely
Note : For other cleaning methods, contact us.
4-4. Heatsink Installation
1) The power module is fixed to the heatsink by 4 position through the M3 mounting tapped holes provided on the baseplate. It is recommended that the sequence to screw the 4
screws is in a diagonally manner and the recommended torque is 5.5kgcm.
2) Recommended hole diameter for heatsink = 3.5mm.
3) Use thermal grease or thermal sheet in between heatsink and baseplate to minimize the contact thermal resistance. However, make sure that the thermal grease or sheet is evenly
applied and using no-warped heatsink in order to avoid any warpage on the baseplate.
4) Recommended thermal sheet is as shown below. Cutting the corner of thermal sheet is NOT advisable.
TDK-Lambda
3
4-5. Input / Output terminal pin
Connect +Vin, -Vin, +V, -V terminals such that contact resistance is minimal. Note that if conta ct resistance is high, efficiency will drop and power m odule wil l be damaged by
abnormal heat.
5. OUTPUT DERATING
(i) PAH50S48, PAH75S48, PAH100S48 & PAH150S48 (ii) PAH200S48
120
100
80
60
40
Load (%)
20
0
-40 -20 0 20 40 60 80 100 120
120
100
80
60
40
Load (%)
20
0
-40 -20 0 20 40 60 80 100 120
Baseplate Temperature (°C)
Baseplate Temperature (°C)
Temperature Measu ring
Point of
6. EXTERNAL FUSE RATING
Fuse rating : PAH200S48 --- 250V 15A (Fast Blow Type)
PAH150S48 --- 250V 10A (Fast Blow Type)
PAH100S48 --- 250V 7A (Fast Blow Type)
PAH75S48 --- 250V 5A (Fast Blow Type)
PAH50S48 --- 250V 5A (Fast Blow Type)
7. NOTES
Over Current Protection operates > 105% of maximum DC output current.
Baseplate
TDK-Lambda
4
Loading...