TDK Xeta Half Brick-iHG User Manual

℡ (877) 498

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0099

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Datasheet DC-DC Power Modules

Xeta



iHG Half Brick

48V Input, 3.3V/70A Output

TDK Innoveta Inc

3320 Matrix Drive, Suite 100
Plano, Texas 75082

Phone [phone] Toll Free
[phone]
Fax [phone] Toll Free
[phone]

[e-mail]
http://www.tdkinnoveta.com/

.

Information furnished by TDK Innoveta is believed to be accurate and reliable. However, TDK Innoveta

assumes no responsibility for its use, nor for any infringement of patents or other rights of third parties,

which may result from its use. No license is granted by implication or otherwise under any patent or patent

rights of TDK Innoveta. TDK Innoveta components are not designed to be used in applications, such as life

support systems, wherein failure or malfunction could result in injury or death. All sales are subject to TDK

Innoveta’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to

change without notice.

©2008 TDK Innoveta Inc.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Platform Overview:



Xeta
48V Input, 3.3V / 70A Output
Half-Brick

iHG48 Series DC-DC Power Modules

The Xeta iHG48 Series power modules operate
over a wide 36 – 75Vdc input voltage range and
provide one regulated dc output voltage that is
electrically isolated from the input. The single
board open-frame type design with high
conversion efficiency (up to 92%), and superior
thermal performance make iHG series modules
ideally suited for high power, low air flow telecom
applications in demanding thermal environments.
A wide output voltage trim range, -50 to 10%, and
remote sensing are standard features enhancing
versatility.

Standard Features:

• RoHS compliant

• Standard Half Brick footprint

• Optimized output power: 231W

• Full load efficiency, 90% typical

• Wide output trim voltage range

• Up to 70A of true usable current

• Single board design

52A at 65°C, 200LFM (no base-plate)

• Monotonic start-up into a pre-biased

output bus

• Remote sense

• Basic insulation – 1500 Vdc

• Constant switching frequency

• Auto-recovery protection:

o Input UV protection
o Output over voltage
o Output over current
o Short circuit
o Thermal protection

• High reliability open frame, surface-

mount construction

• Open frame for improved thermal

management

• UL 60950 (US and Canada), VDE 0805,

CB scheme (IEC950), CE Mark
(EN60950)

• Multiple patents

Optional Features:

• Latched output over voltage protection

• Latched output over current protection

• Latched over temperature protection

• Base-plate

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Ordering information:

Product

Identifier

i H G 48 070 A 033 V - 0 02

TDK

Innoveta

Package

Size

Half Brick

Feature

Set

000 Positive Yes Latching Auto-Recovery Auto-Recovery

Platform

Xeta

On/Off

Logic

Input

Voltage

36-75V 70 Amps 033 – 3.3V Single

Omit

pin3

Output

Current/

Power

Output OVP Output OCP OTP

Output

Units

Main

Output

Voltage

Outputs

# of

Length

0.145” No

Mechanical

Feature

0 - No base

plate

1- With base

plate

Pin

Electrical

Feature Set

02-R

Standard,

RoHS

Compliant

Base-

plate

001 Negative Yes Latching Auto-Recovery Auto-Recovery

002 Positive Yes Auto-Recovery Auto-Recovery Auto-Recovery

003 Negative Yes Auto-Recovery Auto-Recovery Auto-Recovery

OVP: Over Voltage Protection; OCP: Over Current Protection; OTP: Over Temperature Protection.

0.145” No

0.145” No

0.145” No

Product Offering:

Code Input Voltage Output Voltage Output Current

iHG48070A033V-002-R 36V to 75V 3.3V 70A 231W 90%

Maximum Output

Power

TDK Innoveta Inc

3320 Matrix Drive, Suite 100
Richardson, Texas 75082

Phone [phone] Toll Free
[phone]
Fax [phone] Toll Free
[phone]

[e-mail]
http://www.tdkinnoveta.com/

Efficiency

©2008 TDK Innoveta Inc.
iHG Datasheet 2008-05-15 Revision 1.1

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Mechanical Specification:

Dimensions are in mm [in]. Unless otherwise specified tolerances are: x.x ± 0.5 [0.02], x.xx and x.xxx ± 0.25 [0.010].

1.02 [0.040] Dia Pin

1.83 [0.072] Dia Stand-off
6 Places

2.03 [0.080] Dia Pin

3.00 [0.118] Dia Stand-off
2 Places

1

2

4

9

8

7

6

5

Recommeded hole pattern (top view)

Pin Assignment:

PIN FUNCTION PIN FUNCTION

1 Vin (+) 7 Trim
2 On/Off 8 Sense (+)
3 N/A 9 Vout (+)
4 Vin (-)
5 Vout (-)
6 Sense (-)

Pin base material is copper with matte tin plating. The maximum module weight is 63g.

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Absolute Maximum Ratings:

Stress in excess of Absolute Maximum Ratings may cause permanent damage to the device.

Characteristic Min Max Unit Notes & Conditions

Continuous Input Voltage -0.5 80 Vdc

Transient Input Voltage --- 100 Vdc 100mS max.

Isolation Voltage --- 1500 Vdc

Storage Temperature -55 125 ˚C

Operating Temperature Range (Tc) -40 123 ˚C

* Engineering estimate

Measured at the location specified in the thermal
measurement figure.

Input Characteristics:

Unless otherwise specified, specifications apply over all Rated Input Voltage, Resistive Load, and Temperature conditions.

Characteristic Min Typ Max Unit Notes & Conditions

Operating Input Voltage 36 48 75 Vdc

Maximum Input Current --- --- 8 A Vin = 0 to Vin,max, Io,max, Vo=Vo,nom

Turn-on Voltage --- 34.2 36 Vdc

Turn-off Voltage --- 32.5 --- Vdc

Hysteresis --- 1.7 --- Vdc

Startup Delay Time from application of input voltage --- 8 --- mS

Startup Delay Time from on/off --- 3 --- mS

Output Voltage Rise Time --- 24 --- mS

Standby Current 0 5 7 mA

Inrush Transient --- --- 0.1 A2s

Input Reflected Ripple --- 14 --- mApp

Input Ripple Rejection --- 60 --- dB @120Hz

*

Engineering Estimate

Vo = 0 to 0.1*Vo,nom; on/off =on,
Io=Io,max, Tc=25˚C
Vo = 0 to 0.1*Vo,nom; Vin = Vi,nom,
Io=Io,max,Tc=25˚C
Io=Io,max,Tc=25˚C, Vo=0.1 to

0.9*Vo,nom
Vin=0V to Vin,max and module on/off
pin is in ‘off’ state

See input/output ripple measurement
figure; BW = 20 MHz

Caution: The power modules are not internally fused. An external input line normal blow fuse with a maximum value of 15A is required; see the Safety
Considerations section of the data sheet.

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Electrical Data (continued):

Operating at Tc = 25˚C unless otherwise specified

Characteristic Min Typ Max Unit Notes & Conditions

Output Voltage Initial Setpoint 3.25 3.3 3.35 Vdc Vin=Vin,nom; Io=Io,max

Output Voltage Tolerance 3.2 --- 3.4 Vdc Over all rated input voltage, load, and

Efficiency --- 90 --- % Vin=Vin,nom; Io=Io,max

Line Regulation --- 3 10* mV Vin=Vin,min to Vin,max

Load Regulation --- 1 10* mV Io=Io,min to Io,max

Temperature Regulation --- 20 50* mV Tc=Tc,min to Tc,max

Output Current 0 --- 70 A At Io < 20% of Io,max, the load transient

Output Current Limiting Threshold --- 82 --- A

Short Circuit Current

Output Voltage Adjustment Range 50 --- 110 %Vo,nom

Output Voltage Sense Range --- --- --- %Vo,nom

Dynamic Response:
Recovery Time

Transient Voltage

Output Voltage Overshoot during startup 0 0 0 mV Io=Io,max

Switching Frequency --- 260 --- kHz Fixed

Output Over Voltage Protection

External Load Capacitance 230 --- 40,000** uF All charge and pre-bias start conditions.

Isolation Capacitance --- 2000 --- pF All line, load, and temperature conditions

Isolation Resistance 15 --- ---

Vref 1.225 V Required for trim calculation

* Engineering Estimate

** Contact TDK Innoveta for applications that require additional capacitance

temperature conditions to end of life

performance may degrade slightly
Vo = 0.9*Vo,nom, Tc < Tc,max

--- 2 --- A

--- 25 50* mVpp Output Ripple and Noise Voltage

--- 5.5 --- mVrms

---

---

3.8* 4.1 4.4*

200

70

---

---

µS

mV

V All line, load, and temperature conditions

MΩ

Vo = 0.25V, Tc = 25C (hiccup mode)

Vin=48V and Tc=25˚C. Measured across one
10uF, one 0.47uF, one 0.1uF ceramic
capacitors, and one 220uF electrolytic
capacitor – see input/output ripple
measurement figure; BW = 20MHz

Vin=Vin,nom; load step from 50% to 75% of
Io,max, di/dt = 0.1A/uS, with at least one

0.1uF, one 0.47uF, one 10uF ceramic
capacitors, and 220uF electrolytic capacitor
across the output terminals

For applications with large step load changes
and/or high di/dt load changes, please
contact TDK Innoveta for support.

Cext,min required for the 100% load dump.
Minimum ESR > 2 mΩ

All line, load, and temperature conditions

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E ffi c ien c y (% )

P ow er D is s ip a tio n (W )

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Electrical Characteristics:

94

90

86

82

78

74

7 14 21 28 35 42 49 56 63 70

Output Current (A)

Vin = 36V Vin = 48V Vin = 75V Vin = 60V

Efficiency vs. Input Voltage at Ta=25C, (test in socket)

35

30

25

20

15

10

5

0

7 14 21 2 8 35 42 49 56 63 70

Output Current (A)

Vin = 36V Vin = 48V Vin = 75V Vin = 60V

Power Dissipation vs. Input Voltage at Ta=25C

Start-up from on/off Switch at 48V input and Full Load.
Ch. 1: ON/OFF Ch. 3: Vo Ch. 4: Io

Start-up from Input Voltage Application at Full Load.
Ch. 1: Vin Ch. 3: Vo Ch. 4: Io Load

©2008 TDK Innoveta Inc.
iHG Datasheet 2008-05-15 Revision 1.1

Typical Output Ripple at 48V Input and Full Load at
Ta=25C Ch. 3: Vo

Transient Response. Load Step from 50% to 75% of
Full Load with di/dt= 0.1A/uS. Ch. 1: Vo Ch. 3: Io

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O u tp u t V o lta g e ( V )

In put C u r r e n t (A )

O u tp u t V o lta g e ( V )

O u tp u t V o lta g e ( V )

O u tp u t V o lta g e ( V )

%

5

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Electrical Characteristics (continued):

3.6

3

2.4

1.8

1.2

0.6

0

0 10 20 30 40 50 60 70 80 90

Output Current (A)

Vin = 36V Vin = 48V Vin = 75V Vin = 60V

Output Current Limit Characteristics vs. Input Voltage

3.299

3.298

10

8

6

4

2

0

30 35 40 4 5 50 55 60 65 70 75

Input Voltage (V)

Io_min = 7A Io_mid = 35A Io_max = 70.7A

Typical Input Current vs. Input Voltage Characteristics

3.3

3.299

3.297

3.296

3.295

3.294

7 14 21 28 35 42 49 56 63 70

Output Current (A)

Vin = 36V Vin = 48V Vin = 75V Vin = 60V

Typical Output Voltage vs. Load Current at Ta=25C. Typical Output Voltage vs. Input Voltage at Ta=25C.

3.6

3

2.4

1.8

1.2

0.6

0

30 31 32 33 34 35 36 37 38

Input Voltage (V)

Io_min = 7A Io_mid = 35A Io_max = 70.7A

3.298

3.297

3.296

3.295

36 40 44 48 52 56 60 64 68 72 76

Input Voltage (V)

Io_min = 7A Io_mid = 35A Io_max = 70.7A

%
Change
of Vout

Trim
Down
Resistor

%
Change
of Vout

(Kohm)

-3% 31.33K +3% 57.16K

-5% 18K +5% 34.57K

-10% 8K +10% 17.63K

e.g. trim up 5%

3.3




225.1



= kR

up



−




1%)51(2

++⋅

Trim Up
Resistor
(Kohm)

)(57.34

Ω=

Typical Output Voltage vs. Low Voltage Input Turn-on
and Turn-off at Ta=25C

©2008 TDK Innoveta Inc.
iHG Datasheet 2008-05-15 Revision 1.1

Calculated Resistor Values for Output Voltage Adjustment

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T rim R e s i s ta n c e ( k

Ω

)

T rim R e s is t a n c e ( k

Ω

)

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Electrical Characteristics (continued):

1000

100

10

1

0

0 10 20 30 40

% Decrease in Output Voltage, ∆ (%)

Output Trim down curve for output voltage adjustment

10000

1000

100

10

0 2 4 6 8 10

% Increase in Output Voltage, ∆ (%)

Trim up curve for output voltage adjustment

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O u tp u t C ur re n t (A )

O u tp u t C u rre n t ( A )

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Thermal Performance:

70

60

50

40

30

20

30 40 50 60 70 80 90 100 110 120 130

Ambient Tempe rature (C)

NC 0.3 m/s (60 LFM) 0.5 m/s (100 LFM) 1.0 m/s (200 LFM)

1.5 m/s (300 LFM) 2.0 m/s (400 LFM) 3.0 m/s (600 LFM)
Max MOSFET Temperature

Maximum output current vs. ambient temperature at nominal
input voltage for airflow rates natural convection (0.3m/s) to

3.0m/s with airflow from pin 4 to 1.

Thermal
Measurement
Location (Drain
pad of MOSFET)

70

60

50

40

30

20

30 40 50 60 70 80 90 100 110 120 130

NC 0.3 m/s (60 LFM) 0.5 m/s (100 LFM) 1.0 m/s (200 LFM)

1.5 m/s (300 LFM) 2 .0 m/s (400 LFM) 3.0 m/s (600 LFM)
Max MOSFET Temperature

Maximum output current vs. ambient temperature at nominal
input voltage for airflow rates natural convection (0.3m/s) to

3.0m/s with airflow from pin 1 to pin 4.

Ambient Temperature (C)

Thermal measurement location – top view

The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is
described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta
recommends that the user verify the module’s thermal performance in the end application. The critical component
should be thermo-coupled and monitored, and should not exceed the temperature limit specified in the derating curve
above. It is critical that the thermocouple be mounted in a manner that gives direct thermal contact otherwise significant
measurement errors may result.

©2008 TDK Innoveta Inc.
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AIRFLOW

Air Velocity and Ambient Temperature

Measurement Location

A

12.7

(0.50)

Module

Centerline

Air Passage

Centerline

Adjacent PCB

76 (3.0)

Wind Tunnel Test Setup Figure

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Thermal Management:

An important part of the overall system
design process is thermal management;
thermal design must be considered at all
levels to ensure good reliability and lifetime
of the final system. Superior thermal design
and the ability to operate in severe
application environments are key elements
of a robust, reliable power module.

A finite amount of heat must be dissipated
from the power module to the surrounding
environment. This heat is transferred by the
three modes of heat transfer: convection,
conduction and radiation. While all three
modes of heat transfer are present in every
application, convection is the dominant
mode of heat transfer in most applications.
However, to ensure adequate cooling and
proper operation, all three modes should be
considered in a final system configuration.

The open frame design of the power module
provides an air path to individual
components. This air path improves
convection cooling to the surrounding
environment, which reduces areas of heat
concentration and resulting hot spots.

Test Setup: The thermal performance data
of the power module is based upon
measurements obtained from a wind tunnel
test with the setup shown in the wind tunnel
figure. This thermal test setup replicates the
typical thermal environments encountered in
most modern electronic systems with
distributed power architectures. The
electronic equipment in networking, telecom,
wireless, and advanced computer systems
operates in similar environments and utilizes
vertically mounted printed circuit boards
(PCBs) or circuit cards in cabinet racks.

The power module is mounted on a 0.087
inch thick, 12-layer, 2oz/layer PCB and is
vertically oriented within the wind tunnel.
Power is routed on the internal layers of the
PCB. The outer copper layers are thermally
decoupled from the converter to better
simulate the customer’s application. This
also results in a more conservative derating.

The cross section of the airflow passage is
rectangular with the spacing between the
top of the module and a parallel facing PCB
kept at a constant (0.5 in). The power
module’s orientation with respect to the
airflow direction can have a significant
impact on the unit’s thermal performance.

Dimensions are in millimeters (inches)

Thermal Derating: For proper application of

the power module in a given thermal
environment, output current derating curves
are provided as a design guideline in the
Thermal Performance section for the power
module of interest. The module temperature
should be measured in the final system
configuration to ensure proper thermal
management of the power module. For
thermal performance verification, the module
temperature should be measured at the
location indicated in the thermal
measurement location figure in the Thermal
Performance section for the power module
of interest. In all conditions, the power
module should be operated below the
maximum operating temperature shown on

I
R
F
L
O

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

the derating curve. For improved design
margins and enhanced system reliability, the
power module may be operated at
temperatures below the maximum rated
operating temperature.

Heat transfer by convection can be
enhanced by increasing the airflow rate that
the power module experiences. The
maximum output current of the power
module is a function of ambient temperature
(T

) and airflow rate as shown in the

AMB

thermal performance figures on the thermal
performance page for the power module of
interest. The curve in the figures is shown
for natural convection and up. The data for
the natural convection condition has been
collected at 0.3 m/s (60 ft/min) of airflow,
which is the typical airflow generated by
other heat dissipating components in many
of the systems that these types of modules
are used in. In the final system
configurations, the airflow rate for the natural
convection condition can vary due to
temperature gradients from other heat
dissipating components.

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Operating Information:

Over-Current-Protection (OCP): The power

modules have current limit protection to
protect the module during output overload and
short circuit conditions. During overload
conditions, the power modules may protect
themselves by entering a hiccup current limit
mode. The modules will operate normally once
the output current returns to the specified
operating range. A latched over-current
protection option is also available. Consult the
TDK Innoveta technical support for details.

Output Over-Voltage-Protection (OVP): The
power modules have a control circuit,
independent of the main control loop, that
reduces the risk of over voltage appearing at
the output of the power module during a fault
condition. If there is a fault in the voltage
regulation loop, the over voltage protection
circuitry will cause the power module to shut
down. The module will try to auto re-start in 1
+/- 0.2 sec time period. An optional feature
with latched OVP protection can also be
offered. Consult the TDK Innoveta technical
support for details.

Thermal Protection: When the power
modules exceed the maximum operating
temperature, the modules may turn-off to
safeguard the power unit against thermal
damage. The module will auto restart as the
unit is cooled below the over temperature
threshold. A latched over-temperature
protection option is also available. Consult the
TDK Innoveta technical support for details.

Remote On/Off: - The power modules have
an internal remote on/off circuit. The user must
supply an open-collector or compatible switch
between the Vin(-) pin and the on/off
pin. The maximum voltage generated by the
power module at the on/off terminal is 15V.
The maximum allowable leakage current of
the switch is 50uA. The switch must be
capable of maintaining a low signal Von/off <

0.8V while sinking 400uA.

The standard on/off logic is positive logic. The
power module will turn on if terminal 2 is left
open and will be off if terminal 2 is connected
to terminal 4. An optional negative logic is
available. The power module will turn on if
terminal 2 is connected to terminal 4, and it
will be off if terminal 2 is left open.

Vin (+)

On/ Off

Vin(-)

An On/Off Control Circuit

Output Voltage Adjustment: The output

voltage of the power module may be adjusted
by using an external resistor connected
between the Vout trim terminal (pin 7) and
either the Sense (+) or Sense (-) terminal. If
the output voltage adjustment feature is not
used, pin 7 should be left open. Care should
be taken to avoid injecting noise into the
power module’s trim pin. A small 0.01uF
capacitor between the power module’s trim pin
and Sense (-) pin may help to avoid this.

Vout(+)

Sense(+)

Trim

Sense(-)

Vout(-)

Circuit to decrease output voltage

Rdown

©2008 TDK Innoveta Inc.
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−

−

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

With a resistor between the trim and Sense (-)
terminals, the output voltage is adjusted down.
To adjust the output voltage down a
percentage of Vout (%Vo) from Vo,nom, the
trim resistor should be chosen according to
the following equation:

%100

VV

desirednom

nom

Vout(+)

Sense(+)

Trim

Sense(-)

Vout(-)

∆

up

VV

nomdesired

)2

kΩ

⋅

%100⋅

Rup

+∆+⋅

1)1(2

up

kΩ

%100

and

( −

=

R

down

where

down

The current limit set point does not increase
as the module is trimmed down, so the
available output power is reduced.

Circuit to increase output voltage

With a resistor between the trim and sense (+)
terminals, the output voltage is adjusted up.
To adjust the output voltage up a percentage
of Vout (%Vo) from Vo,nom the trim resistor
should be chosen according to the following
equation:








R

=

up

where

up

The value of Vref is found in the Electrical
Data section for the power module of interest.
Trim up and trim down curves are found in the

∆

down

=∆

V

V

nom

V

ref



−






=∆

V

nom

Electrical Characteristics section for the power
module of interest.

The maximum power available from the power
module is fixed. As the output voltage is
trimmed up, the maximum output current must
be decreased to maintain the maximum rated
power of the module.

As the output voltage is trimmed, the output
over-voltage set point is not adjusted.
Trimming the output voltage too high may
cause the output over voltage protection circuit
to be triggered.

Remote Sense: The power modules feature
remote sense to compensate for the effect of
output distribution drops. The output voltage
sense range defines the maximum voltage
allowed between the output power terminals
and output sense terminals, and it is found on
the electrical data page for the power module
of interest. If the remote sense feature is not
being used, the Sense(+) terminal should be
connected to the Vo(+) terminal and the
Sense (-) terminal should be connected to the
Vo(-) terminal. The output voltage at the Vo(+)
and Vo(-) terminals can be increased by either
the remote sense or the output voltage
adjustment feature. The maximum voltage
increase allowed is the larger of the remote
sense range or the output voltage adjustment
range; it is not the sum of both.

As the output voltage increases due to the use
of the remote sense, the maximum output
current must be decreased for the power
module to remain below its max power rating.

EMC Considerations: TDK Innoveta power

modules are designed for use in a wide variety
of systems and applications. For assistance
with designing for EMC compliance, please
contact TDK Innoveta technical support.

Input Impedance: The source impedance of
the power feeding the DC/DC converter
module will interact with the DC/DC converter.
To minimize the interaction, a 220-470uF input
electrolytic capacitor should be present.

©2008 TDK Innoveta Inc.
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C

Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Input/Output Ripple and Noise Measurements:

12uH

1 2

Battery

12

220uF

esr<0.1
100KHz

12

33uF

esr<0.7
100KHz

+

in

Vinput

-

+

Voutput

-

12

Cext

12

RLoad

Ground Plane

The input reflected ripple is measured with a current probe and oscilloscope. The ripple current is the current through the
12uH inductor. The capacitor Cin shall be at least 100uF/100V. One 220uF or two 100uF/100V capacitors in parallel are
recommended.

The output ripple measurement is made approximately 9 cm (3.5 in.) from the power module using an oscilloscope and
BNC socket. The capacitor Cext is located about 5 cm (2 in.) from the power module; its value varies from code to code
and is found on the electrical data page for the power module of interest under the ripple & noise voltage specification in
the Notes & Conditions column.

Safety Considerations:

All TDK Innoveta products are certified to
regulatory standards by an independent,
Certified Administrative Agency laboratory.
UL 1950, 3rd edition (US & Canada), and
other global certifications are typically
obtained for each product platform.

Various safety agency approvals are pending
on the iHG product family. For safety agency
approval of the system in which the DC-DC
power module is installed, the power module
must be installed in compliance with the
creepage and clearance requirements of the
safety agency. The isolation is basic
insulation. For applications requiring basic
insulation, care must be taken to maintain
minimum creepage and clearance distances
when routing traces near the power module.

As part of the production process, the power
modules are hi-pot tested from primary and
secondary at a test voltage of 1500Vdc. The
case pin is considered a primary pin for the
purpose of hi-pot testing.

When the supply to the DC-DC converter is
less than 60Vdc, the power module meets all
of the requirements for SELV. If the input
voltage is a hazardous voltage that exceeds
60Vdc, the output can be considered SELV
only if the following conditions are met:

1) The input source is isolated from the
ac mains by reinforced insulation.

2) The input terminal pins are not
accessible.

3) One pole of the input and one pole of
the output are grounded or both are
kept floating.

4) Single fault testing is performed on
the end system to ensure that under a
single fault, hazardous voltages do
not appear at the module output.

To preserve maximum flexibility, the power
modules are not internally fused. An external
input line normal blow fuse with the maximum
rating stipulated in the Electrical Data section
is required by safety agencies. A lower value
fuse can be selected based upon the
maximum dc input current and maximum
inrush energy of the power module.

©2008 TDK Innoveta Inc.
iHG Datasheet 2008-05-15 Revision 1.1

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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series

Reliability:

The power modules are designed using TDK
Innoveta’s stringent design guidelines for
component derating, product qualification, and
design reviews. Early failures are screened
out by both burn-in and an automated final
test. The MTBF is calculated to be greater
than 3M hours using the Telcordia TR-332
calculation method.

Improper handling or cleaning processes can
adversely affect the appearance, testability,
and reliability of the power modules. Contact
TDK Innoveta technical support for guidance
regarding proper handling, cleaning, and
soldering of TDK Innoveta’s power modules.

Quality:

TDK Innoveta’s product development process
incorporates advanced quality planning tools
such as FMEA and Cpk analysis to ensure
designs are robust and reliable. All products
are assembled at ISO certified assembly
plants.

Warranty:

TDK Innoveta’s comprehensive line of power
solutions includes efficient, high-density DC­DC converters. TDK Innoveta offers a three­year limited warranty. Complete warranty
information is listed on our web site or is
available upon request from TDK Innoveta.

TDK Innoveta Inc.

3320 Matrix Drive, Suite 100
Plano, Texas 75082

Phone [phone] Toll Free
[phone]
Fax [phone] Toll Free
[phone]

[e-mail]
http://www.tdkinnoveta.com/

©2008 TDK Innoveta Inc.
iHG Datasheet 2008-05-15 Revision 1.1

Information furnished by TDK Innoveta is believed to be accurate and reliable. However, TDK Innoveta

assumes no responsibility for its use, nor for any infringement of patents or other rights of third parties,

which may result from its use. No license is granted by implication or otherwise under any patent or patent

rights of TDK Innoveta. TDK Innoveta components are not designed to be used in applications, such as life

support systems, wherein failure or malfunction could result in injury or death. All sales are subject to TDK

Innoveta’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to

change without notice.

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