TDK MMZ1608 User Manual

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Chip Beads(SMD)
For Signal Line

MMZ Series MMZ1608 Type

FEATURES

• Chip bead(impeder), MMZ series offers 6 construction materials.

• Size standardized for use by automatic assembly equipment.
No preferred orientation.

• Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.

• High reliability due to an entirely monolithic structure.

• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.

• Low DC resistance structure of electrode prevents wasteful
electric power consumption.

• The products contain no lead and also support lead-free
soldering.

• It is a product conforming to RoHS directive.

APPLICATIONS

Personal computers, CRTs, liquid crystal display panels, printers,
hard disk drives, game machines, cellular phones, etc.

PRODUCT IDENTIFICATION

MMZ 1608 R 121 A T

(1) (2) (3) (4) (5) (6)

(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance

121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style

T:Taping

Conformity to RoHS Directive

MATERIAL CHARACTERISTICS

B material: This type is perfectly suited for fast digital signals. By

equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.

R material: For wide frequency applications calling for broad

impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.

S material: Standard type that features impedance characteristics

similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec­tiveness at 40 to 300MHz.

Y material: High frequency range type intended for the 100MHz

region and above.
For signal line applications in which the signal fre­quency is far from the cutoff frequency. Impedance val­ues selected for effectiveness at 80 to 400MHz.

A material: This high-impedance product is based on the imped-

ance frequency characteristics of our Y-material. The
product offers excellent impedance characteristics,
which is greater than 2500Ω, in the vicinity of 100MHz
range (MMZ1608A252B).

D material: For applications calling for low insertion loss at low fre-

quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre­quencies (300MHz to 1GHz) for signal line applica­tions.

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components. The preheat-

ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• Do not expose the inductors to stray magnetic fields.

• Avoid static electricity discharge during handling.

• When hand soldering, apply the soldering iron to the printed cir-

cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

TYPICAL MATERIAL CHARACTERISTICS

2500

2000

)

Ω

(

1500

1000

Impedance

500

B

0

10 100 1000

S

R

Frequency(MHz)

A

Y

D

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SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD

PAT TE RN

1.6± 0.15

3mg
4mg

0.8

Dimensions in mm

0.8± 0.15

T

0.3± 0.2

0.80.6 0.6

Thickness(T)Weight

0.6±0.15mm

0.8±0.15mm

TEMPERATURE RANGES

Operating/storage –55 to +125°C

PACKAGING STYLE AND QUANTITIES

Packaging style Quantity
Taping 4000 pieces/reel

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

10s max.

250 to 260˚C

230˚C

180˚C

150˚C

Preheating
60 to 120s

Soldering
30 to 60s

Time(s)

Natural
cooling

ELECTRICAL CHARACTERISTICS

Part No.

Impedance
(Ω)
[100MHz]

DC resistance
(Ω)max.

∗

Rated
current

(mA)max.
MMZ1608B121C 120±25% 0.15 600 0.6
MMZ1608B301C 300±25% 0.25 500 0.6
MMZ1608B601C 600±25% 0.4 500 0.6
MMZ1608R150A 15±25% 0.05 1500 0.8
MMZ1608R300A 30±25% 0.05 1500 0.8
MMZ1608R600A 60±25% 0.1 800 0.8
MMZ1608R121A 120±25% 0.18 500 0.8
MMZ1608R301A 300±25% 0.25 500 0.8
MMZ1608R601A 600±25% 0.4 500 0.8
MMZ1608R102A 1000±25% 0.5 400 0.8
MMZ1608S400A 40±25% 0.1 600 0.8
MMZ1608S800A 80±25% 0.15 500 0.8
MMZ1608S121A 120±25% 0.2 500 0.8
MMZ1608S181A 180±25% 0.2 500 0.8
MMZ1608S301A 300±25% 0.3 500 0.8
MMZ1608S601A 600±25% 0.4 500 0.8
MMZ1608S102A 1000±25% 0.5 400 0.8
MMZ1608Y150B 15±25% 0.05 1500 0.8
MMZ1608Y300B 30±25% 0.05 1500 0.8
MMZ1608Y600B 60±25% 0.15 500 0.8
MMZ1608Y121B 120±25% 0.2 500 0.8
MMZ1608Y301B 300±25% 0.3 500 0.8
MMZ1608Y601B 600±25% 0.4 500 0.8
MMZ1608Y102B 1000±25% 0.5 400 0.8
MMZ1608Y152B 1500±25% 0.6 300 0.8
MMZ1608A252B 2500±25% 0.8 200 0.8
MMZ1608D050C 5±2Ω 0.1 700 0.8
MMZ1608D100C 10±5Ω 0.15 500 0.6
MMZ1608D220C 22±25% 0.2 500 0.6
MMZ1608D500C 50±25% 0.3 500 0.6
MMZ1608D800C 80±25% 0.35 500 0.6
MMZ1608D800B 80±25% 0.35 500 0.8
MMZ1608D121C 120±25% 0.45 400 0.6
MMZ1608D121B 120±25% 0.45 400 0.8
MMZ1608D241C 240±25% 0.6 300 0.8
MMZ1608D301B 300±25% 0.7 300 0.8

∗

Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C

Product’s
thickness
T(mm)

• All specifications are subject to change without notice.

009-01 / 20080408 / e9412_mmz1608.fm