TDK MMZ1005 User Manual

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Chip Beads(SMD)
For Signal Line

MMZ Series MMZ1005 Type

FEATURES

• Size standardized for use by automatic assembly equipment.
No preferred orientation.

• Electroplated terminal electrodes accommodate reflow
soldering.

• High reliability due to an entirely monolithic structure.

• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.

• Low DC resistance structure of electrode prevents wasteful
electric power consumption.

• It is a product conforming to RoHS directive.

APPLICATIONS

Personal computers, CRTs, liquid crystal display panels, printers,
hard disk drives, game machines, cellular phones, etc.

PRODUCT IDENTIFICATION

MMZ 1005 S 121 C T

(1) (2) (3) (4) (5) (6)

(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance

121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style

T:Taping

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components. The preheat-

ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• Do not expose the inductors to stray magnetic fields.

• Avoid static electricity discharge during handling.

• When hand soldering, apply the soldering iron to the printed cir-

cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.

Conformity to RoHS Directive

MATERIAL CHARACTERISTICS

B material: This type is perfectly suited for fast digital signals. By

equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.

S material: Standard type that features impedance characteristics

similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec­tiveness at 40 to 300MHz.

Y material: High frequency range type intended for the 100MHz

region and above.
For signal line applications in which the signal fre­quency is far from the cutoff frequency. Impedance val­ues selected for effectiveness at 80 to 400MHz.

D material: For applications calling for low insertion loss at low fre-

quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre­quencies (300MHz to 1GHz) for signal line applica­tions.

F material: This new product inherits the characteristic of our D-

material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres­sion from 600MHz to as high as in the GHz range.

TYPICAL MATERIAL CHARACTERISTICS

2000

1800

1600

1400

)

Ω

(

1200

1000

800

Impedance

600

400

B

200

0

10 100 1000

A

S

Frequency(MHz)

D

Y

F

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

008-01 / 20080407 / e9412_mmz1005.fm

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SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD

PAT TE RN

1±0.05

0.5± 0.05

0.5± 0.05

0.1min.

0.40.5 0.5

0.5

Weight: 1mg

Dimensions in mm

TEMPERATURE RANGES

Operating/storage –55 to +125°C

PACKAGING STYLE AND QUANTITIES

Packaging style Quantity
Taping 10000 pieces/reel

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

10s max.

250 to 260˚C

230˚C

180˚C

150˚C

Preheating
60 to 120s

Soldering
30 to 60s

Natural
cooling

ELECTRICAL CHARACTERISTICS

Par t No.

Impedance

(Ω)[100MHz]
MMZ1005B800C 80±25% 0.2 450
MMZ1005B121C 120±25% 0.25 400
MMZ1005B601C 600±25% 0.85 200
MMZ1005S800C 80±25% 0.2 500
MMZ1005S121C 120±25% 0.25 500
MMZ1005S241C 240±25% 0.4 400
MMZ1005S601C 600±25% 0.6 300
MMZ1005S102C 1000±25% 1 200
MMZ1005Y400C 40±25% 0.12 550
MMZ1005Y800C 80±25% 0.17 450
MMZ1005Y121C 120±25% 0.21 400
MMZ1005Y241C 240±25% 0.33 300
MMZ1005Y301C 300±25% 0.38 250
MMZ1005Y471C 470±25% 0.5 250
MMZ1005Y601C 600±25% 0.56 250
MMZ1005Y102C 1000±25% 0.74 200
MMZ1005Y152C 1500±25% 1.15 100
MMZ1005A152E 1500±25% 2 100
MMZ1005D100C 10±5Ω 0.1 500
MMZ1005D220C 22±25% 0.2 400
MMZ1005D330C 33±25% 0.35 400
MMZ1005D680C 68±25% 0.55 400
MMZ1005D121C 120±25% 0.75 350
MMZ1005D241C 240±25% 1.2 200
MMZ1005F330C 33±25% 0.6 200
MMZ1005F470C 47±25% 0.8 100
MMZ1005F560C 56±25% 0.8 100

∗

Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C

∗

DC resistance
(Ω)max.

Rated current
(mA)max.

Time(s)

TYPICAL ELECTRICAL CHARACTERISTICS

Z, X, R vs. FREQUENCY CHARACTERISTICS

MMZ1005B800C MMZ1005B121C MMZ1005B601C

120

100

)

80

Ω

(

60

40

Impedance

20

0

1 10 100 1000 10000

Z

R

X

Frequency(MHz

)

350

300

)

250

Ω

(

200

150

Impedance

100

50

0

1 10 100 1000 10000

Z

R

X

Frequency(MHz

)

800

700

600

)

Ω

(

500

400

300

Impedance

200

100

0

1 10 100 1000 10000

MMZ1005S800C MMZ1005S121C MMZ1005S241C

400

350

300

)

Ω

(

250

200

150

Impedance

100

50

0

1 10 100 1000 10000

Frequency(MHz

Z

R

X

)

400

350

300

)

Ω

(

250

200

150

Impedance

100

50

0

1 10 100 1000 10000

Z

R

X

Frequency(MHz

)

400

350

300

)

Ω

(

250

200

150

Impedance

100

50

0

1 10 100 1000 10000

Z

R

X

Frequency(MHz

R

Z

X

Frequency(MHz

)

)

• All specifications are subject to change without notice.

008-01 / 20080407 / e9412_mmz1005.fm