Taiwan Memory Technology T4312816A-8S, T4312816A-7.5S, T4312816A-7S, T4312816A-6S, T4312816A-10S Datasheet

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SDRAM
FEATURES
3.3V power supply
Four banks operation
LVTTL compatible with multiplexed address
All inputs are sampled at the positive going
edge of system clock
Burst Read Single-bit Write operation
DQM for masking
Auto refresh and self refresh
64ms refresh period (4K cycle)
MRS cycle with address key programs
- CAS Latency ( 2 & 3 )
- Burst Length ( 1 , 2 , 4 , 8 & full page)
- Burst Type (Sequential & Interleave)
Available package type in 54 pin TSOP(II)
Operating temperature : 0 ~ +70 °C
ORDERING INFORMATION

PART NO.

T4312816A-6S 166 MHz T4312816A-7S 143 MHz T4312816A-7.5S 133 MHz T4312816A-8S 125 MHz T4312816A-10S 100 MHz
CH
Preliminary T4312816A
MAX
FREQUENCY
TEMPERATURE
0 ~ +70°C 0 ~ +70°C 0 ~ +70°C 0 ~ +70°C 0 ~ +70°C
8M x 16 SDRAM
2M x 16bit x 4Banks Synchronous DRAM
GRNERAL DESCRIPTION
The T4312816A is 134,217,728 bits synchronous high data rate Dynamic RAM organized as 4 x 2,097,152 words by 16 bits, fabricated with high performance CMOS technology .
Synchronous design allows precise cycle control with the use of system clock I/O transactions are possible on every clockcycle . Range of operating frequencies , programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth , high performance memory system applications.
PIN ARRANGEMENT (
V
DD
DD
CS
A0 A1 A2 A3
DD
1
2 3 4 5 6 7 8 9 10 11 12 13
14 15 16 17 18 19 20 21 22 23 24 25 26
(400mil x 875m il)
(0.8 mm PIN PITCH)
54 P IN T S O P( II)
DQ0
DDQ
V
DQ1
DQ2
SSQ
V
DQ3
DQ4
DDQ
V
DQ5
DQ6
SSQ
V
DQ7
V
LDQ M
W E CAS
RAS
BA0 BA1
A10/AP
V
Top View)
Vss
54
DQ15
53
V SSQ
52
DQ14
51
DQ13
50
V
49 48 47 46 45 44 43 42 41 40 39 38 37
36 35 34 33 32 31 30 29 2827
DDQ
DQ12 DQ11 V SSQ
DQ1 0 DQ9
DDQ
V DQ8 Vss N.C/RFU UDQM CLK CKE N.C A11 A9 A8 A7 A6 A5 A4 Vss
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Publication Date: APR. 2003
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BLOCK DIAGRAM
CH
Preliminary T4312816A
I/O Control Output Buffer
CLK
ADD
Bank Select
Refresh Counter
Row Buffeer
Address Register
LCBR
LRA S
Timing Register
Row Decoder
Col. Buffer
Data Input Register
2M x 16 2M x 16
2M x 16 2M x 16
Column D ecoder
Laten c y & Burst Le n g th
Programming Register
Sense AMP
DQi
CAS WE
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L(U)DQ MRASCSCKECLK
Publication Date: APR. 2003
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PIN DESCRIPTION
CH
Preliminary T4312816A

PIN NAME

CLK System Clock
CS
CKE Clock Enable
A0 ~ A11 Address
BA0 ~ BA1 Bank Select Address
RAS
CAS
Chip Select
Row Address Strobe
Column Address Strobe
INPUT FUNCTION
Active on the positive going edge to sample all input. Disables or enables device operation by masking or enabling all input except CLK,CKE and L(U)DQM Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby. Row/column addresses are multiplexed on the same pins. Row address : RA0 ~ RA11,column address : CA0 ~ CA8 Selects bank to be activated during row address latch time. Select bank for read/write during column address latch time. Latches row addresses on the positive going edge of the CLK
RAS
with Enables row access & precharge. Latches column addresses on the positive going edge of the CLK with
CAS
low.
low.
WE
L(U)DQM
DQ0 ~ DQ15 Data Input/Output
VDD/VSS Power Supply/Ground
V
DDQ/VSSQ
N.C/RFU
Write Enable
Data Input/Output
Mask
Data Output
Power/Ground
No
Connection/Reserved
for Future Use
Enables column access . Enables write operation and row precharge. Latches data in starting from Makes data output Hi-Z, Blocks data input when L(U)DQM active. Data inputs/outputs are multiplexed on the same pins. Power and ground for the input buffers and the core logic. Isolated power supply and ground for the output buffers to provide improved noise immunity. This pin is recommended to be left No Connection on the device.
CAS, WE
t
after the clock and masks the output.
SHZ
active.
TM Technology Inc. reserves the right P. 3 to change products or specifications without notice. Revision: 0.B
Publication Date: APR. 2003
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ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Value Unit
CH
Preliminary T4312816A
Voltage on Any Pin Relative To Vss VIN,V Supply Voltage Relative To Vss VDD,V Short circuit Output Current I Power Dissipation PD 1 W Operating Temperature T Storage Temperature T
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Note :
Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(TA = 0 to +70
Parameter Symbol Min. Typ Max. Unit Notes
Supply Voltage VDD,V
Input High Voltage VIH 2.0 3.0 VDD+0.3V V
Input Low Voltage VIL -0.3 0 0.8 V
Output logic high voltage VOH 2.4 - - V IOH=-4mA
, Voltage referenced to VSS=0V)
°°°°C
3.0 3.3 3.6 V
DDQ
-1.0 to 4.6 V
OUT
-1.0 to 4.6 V
DDQ
50 mA
out
0 to +70
OPR
-55 to +150
stg
C
°
C
°
Output logic low voltage VOL - - 0.4 V IOL=4mA
Input leakage current IIL -1 - 1 uA 1
Output leakage current IOL -1.5 - 1.5 uA 2
Note :
1. Any input 0V
2. Dout = disable, 0V≤ V
VIN ≤ VDD+ 0.3V , all other pin are not under test = 0V.
V
OUT
DD .
CAPACITANCE
(TA =25
RAS,CAS,WE,CS,CKE,LDQM,
,VDD=3.3V, f = 1MHz)
C
°
Pin Symbol Min Max Unit
CLOCK C
ADDRESS C
DQ0 ~ DQ15 C
UDQM
2.5 4.0 pF
CLK
2.5 5.0 pF
ADD
4.0 6.5 pF
OUT
CIN 2.5 5.0 pF
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Publication Date: APR. 2003
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DC CHARACTERISTICS
CH
Preliminary T4312816A
TA = 0 to 70
, VIH(min)/VIL(max)=2.0V/0.8V
C
°
Parameter Symbol
Operating Current
I
CC1
( One Bank Active)
Precharge Standby
I
CC2
Current in power-
I
down mode
CC2
Precharge Standby
I
Current in non
CC2
power-down mode
I
CC2
Active Standby
I
CC3
Current in power-
I
down mode
CC3
Active Standby
I
Current in non
CC3
power-down mode
I
(One Bank Active)
CC3
Speed version
Unit Test Condition
-6 -7 -7.5 -8 -10
140 120 115 110 100 mA
P 2
mA
PS 2
N 20
mA
NS 8
P 5
mA
PS 4
N 30
mA
NS 20
Burst Length = 1
t
t
RC
RC
CKE≤ VIL(max),
CKE≤ VIL(max),CLK ≤VIL(max),
CKE
Input signals are changed one time during 30ns
CKE≥VIH(min),CLK≤VIL(min),
Input signals are stable
CKE≤ VIL(max),
CKE≤ VIL(max),CLK ≤VIL(max),
CKE≥VIH(min),
Input signals are changed one time during 30ns
CKE≥VIH(min),CLK≤VIL(min),
Input signals are stable
(min) ,
VIH(min),
t
CC
t
(min),IOL= 0 mA
CC
t
=15ns
CC
VIH(min),
CS
t
=15ns
CC
VIH(min),
CS
t
t
CC
t
t
CC
CC
t
CC
=15ns
CC
=∞
t
CC
=15ns
=∞
=∞
=∞
Note
1,3
3
3
3
3
Operating Current
(Burst Mode)
Refresh Current
Self refresh Current
150 130 125 120 110
I
CC4
150 130 125 120 110
150 130 125 120 110 mA
I
CC5
I
2 mA
CC6
CAS Latency 3
mA
CAS Latency 2
t
RC
CKE≤0.2V
=0 mA,Page Burst
I
OL
All Band Activated
t
t
=
CCD
CCD
t
(min)
RC
Note: 1. Measured with output open. Addresses are changed only one time during
2. Refresh period is 64ms. Addresses are changed only one time during
3.
t
: Clock cycle time.
CC
t
: Row cycle time.
RC
t
: Column address to column address delay time.
CCD
t
CC
(min)
t
CC
(min)
(min)
.
1,3
2,3
.
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AC OPERATING CONDITIONS
(VDD=3.3V ±0.3V ,TA= 0 to 70
Input levels (VIH/VIL) 2.4 / 0.4 V
Input timing measurement reference level 1.4 V
CH
Preliminary T4312816A
)
C
°
Parameter Value Unit
Input rise and fall time
Output timing measurement reference level 1.4 V
Output load condition See Fig.2
t
r / tf = 1 / 1
ns
3.3V
Output
870 ohm
1200 ohm
ZO=50 ohmOutput
VOH(DC)=2.4,IOH=-4mA
VOL(DC)=0.4,IOL=4mA
30pf
Vtt=1.4v
50 ohm
30pf
(Fig.1) DC Output Load Circuit (Fig.2)AC Output Load Circuit
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Publication Date: APR. 2003
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OPERATING AC PARAMETER
(AC opterating conditions unless otherwise noted)
Row active to row active delay
RAS to CAS delay
CH
Preliminary T4312816A
Parameter Symbol
t
(min)
RRD
t
(min)
RCD
Speed Version
Unit Note
-6 -7 -7.5 -8 -10
12 14 15 16 20 ns 1
15 15 18 20 20 ns 1
Row precharge time
Row active time
Row cycle time
Last data in to new col. Address delay
Last data in to row precharge
Last data in to burst stop
Col. Address to col. Address delay
Number of valid output data
t
(min)
RP
t
(min)
RAS
t
RAS
t
(min)
RC
t
CDL
t
RDL
t
BDL
t
CCD
CAS latency=3 1 CAS latency=2 1
(max)
(min)
(min)
(min)
(min)
15 15 20 20 20 ns 1
42 42 45 48 50 ns 1
120K ns
60 63 65 68 70 ns 1
1 CLK 2
2 CLK 2
1 CLK 2
1 CLK 3
ea 4
Note:
1. The minimum number of clock cycles is determined by dividing the minimum time required
with clock cycle time and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop. The earliest a precharge command can be issued after a Read command without the loss of data is CL + BL-2 clocks.
TM Technology Inc. reserves the right P. 7 to change products or specifications without notice. Revision: 0.B
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AC CHARACTERISTICS

(AC opterating conditions unless otherwise noted)
CLK cycle time
CH
Preliminary T4312816A
-6 -7 -7.5 -8 -10
t
Min Max Min Max Min Max Min Max Min Max
CC
8 9 9 10 10
Parameter
CAS Latency = 3 6 1K 7 1K 7.5 1K 8 1K 10 1K
CAS Latency = 2
Symbol
Unit Note
ns 1
CLK to valid Output delay
Output data hold time CLK high pulse width CLK low pulse width
Input setup time Input hold time CLK to output in Low-Z
CLK to output in Hi-Z
CAS Latency = 3 - 5.5 - 6 6 - 6 - 7 ns
t
SAC
CAS Latency = 2
t
OH
t
CH
t
CL
t
SS
t
SH
t
SLZ
CAS Latency = 3 - 5.5 - 6 6 - 6 - 7 ns
t
SHZ
CAS Latency = 2
- 6 - 6 6 - 7 - 9 ns 2 2.5 2.5 2.5 2.5 ns 2 2 2.5 2.5 3 3 ns 3 2 2.5 2.5 3 3 ns 3
1.5 1.75 1.75 2 2.5 ns 3 1 1 1 1 1 ns 3 1 1 1 1 1 ns 2
- 6 - 6 6 - 7 - 9 ns
Note:
1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns,(tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf)=1ns.
If tr & tf is longer than 1ns,transient time compensation should be considered, i.e.,[(tr+tf)/2-1]ns should be added to the parameter.
1
TM Technology Inc. reserves the right P.8 to change products or specifications without notice. Revision: 0.B
Publication Date: APR. 2003
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FREQUENCY vs. AC PARAMETER RELATIONAHIP TABLE

T4312816A-6S (Unit : number of clock)
Frequency
166MHz(6.0ns) 143MHz(7.0ns) 3 9 6 3 2 3 1 1 2 125MHz(8.0ns) 2 9 6 2 2 2 1 1 2
111MHz(9.0ns) 2 7 5 2 2 2 1 1 2
100MHz(10.0ns) 2 7 5 2 2 2 1 1 2
T4312816A-7S (Unit : number of clock)
Frequency
143MHz(7.0ns) 125MHz(8.0ns) 3 9 6 2 2 2 1 1 2 111MHz(9.0ns) 2 8 5 2 2 2 1 1 2
100MHz(10.0ns) 2 7 5 2 2 2 1 1 2
83MHz(12.0ns) 2 6 4 2 2 2 1 1 2
T4312816A-7.5S (Unit : number of clock)
Frequency
133MHz(7.5ns) 125MHz(8.0ns) 3 9 6 3 2 3 1 1 2 111MHz(9.0ns) 2 8 5 3 2 2 1 1 2
100MHz(10.0ns) 2 7 5 2 2 2 1 1 2
83MHz(12.0ns) 2 6 4 2 2 2 1 1 2
CH
Preliminary T4312816A
CAS
Latency
3 10 7 3 2 3 1 1 2
CAS
Latency
3 9 6 3 2 3 1 1 2
CAS
Latency
3 9 6 3 2 3 1 1 2
RC
t
60ns 42ns 15ns 12ns 15ns 6ns 6ns 12ns
RC
t
63ns 42ns 15ns 14ns 15ns 7ns 7ns 14ns
RC
t
65ns 45ns 20ns 15ns 18ns 7.5ns 7.5ns 15ns
RAS
t
RAS
t
RAS
t
RP
t
RP
t
RP
t
RRD
t
RRD
t
RRD
t
RCD
t
RCD
t
RCD
t
CCD
t
CCD
t
CCD
t
CDL
t
CDL
t
CDL
t
RDL
t
RDL
t
RDL
t
T4312816A-8S (Unit : number of clock)
Frequency
125MHz(8.0ns) 111MHz(9.0ns) 3 9 6 3 2 3 1 1 2
100MHz(10.0ns) 2 7 5 2 2 2 1 1 2
83MHz(12.0ns) 2 6 4 2 2 2 1 1 2 75MHz(13.0ns) 2 6 4 2 2 2 1 1 2
CAS
Latency
3 9 6 3 2 3 1 1 2
RC
t
68ns 48ns 20ns 16ns 20ns 8ns 8ns 16ns
RAS
t
RP
t
RRD
t
RCD
t
CCD
t
CDL
t
RDL
t
T4312816A-10S (Unit : number of clock)
Frequency
100MHz(10.0ns)
83MHz(12.0ns) 2 7 5 2 2 2 1 1 2 75MHz(13.0ns) 2 6 4 2 2 2 1 1 2 66MHz(15.0ns) 2 6 4 2 2 2 1 1 2 60MHz(16.7ns) 2 5 3 2 2 2 1 1 Note 1
Note : 1.
2. Clock count formula : clock
RDL ≥
t
CAS
Latency
2 7 5 2 2 2 1 1 2
16.7ns is recommended for T4312816A
RC
t
70ns 50ns 20ns 20ns 20ns 10ns 10ns 20ns
RAS
t
RP
t
RRD
t
valuebase periodclock
(round off whole number).
RCD
t
CCD
t
CDL
t
RDL
t
TM Technology Inc. reserves the right P.9 to change products or specifications without notice. Revision: 0.B
Publication Date: APR. 2003
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