Taiwan Memory Technology T15N1024A-55D, T15N1024A-100PI, T15N1024A-100P, T15N1024A-100HI, T15N1024A-100CI Datasheet

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TE
CH
tm
T15N1024A
TM Technology Inc. reserves the right P. 1 Publication Date: FEB. 2003 to change products or specifications without notice. Revision:E
128K X 8 LOW POWER
CMOS STATIC RAM
FEATURES
Low-power consumption
- Active: 40mA at 55ns (Max.)
- CMOS Stand-by: 10uA (Max.)
55/70/100 ns access time
Equal access and cycle time
Single +2.4V to 3.6V Power Supply
TTL compatible , Tri-state output
Common I/O capability
Automatic power-down when deselected
Available in 32-pin SOP ,TSOP-I(8x20mm),
TSOP-I(8x13.4mm) ,48-pin CSP packages
Operating temperature :
Commercial : 0 ~ +70 °C Industrial : -40 ~ +85 °C
PART NUMBER EXAMPLES
PART NO.
PACKAGE
CODE
Operating
Temperature
T15N1024A-55D T15N1024A-70H T15N1024A-100P T15N1024A-100C
D=SOP H=TSOP-I(8x20) P=TSOP-I(8x13.4) C=CSP
0 ~ +70 °C
T15N1024A-55DI T15N1024A-70HI T15N1024A-100PI T15N1024A-100CI
D=SOP H=TSOP-I(8x20) P=TSOP-I(8x13.4) C=CSP
-40 ~ +85 °C
GENERAL DESCRIPTION
The T15N1024A is a very Low Power CMOS Static RAM organized as 131,072 words by 8 bits. That operates on a wide voltage range from 2.4V to 3.6V power supply, Fabricated using high performance CMOS technology, Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Data retention is guaranteed at a power supply voltage as low as 1.5V.
BLOCK DIAGRAM
DECODER
A0
A16
I/O8
Vcc
. . .
.
.
.
DATA I/O
CORE
ARRAY
Vss
I/O1
WE
OE
CE1
CONTROL
CIRCUIT
CE2
TE
CH
tm
T15N1024A
TM Technology Inc. reserves the right P. 2 Publication Date: FEB. 2003 to change products or specifications without notice. Revision:E
PIN CONFIGURATIONS
SOP
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
NC A16 A14 A12
A7 A6 A5 A4 A3 A2 A1
A0 I/O1 I/O2 I/O3
VSS
VDD
A15
CE2
WE
A13
A8 A9
A11
OE
A10 CE1 I/O8 I/O7 I/O6 I/O5 I/O4
TSOP-I
(8x20mm)
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
A11
A9
A8 A13 WE CE2 A15
VDD
NC A16 A14 A12
A7
A6
A5
A4
OE A10 CE1 I/O8 I/O7 I/O6 I/O5 I/O4
VSS I/O3 I/O2 I/O1
A0 A1 A2 A3
TSOP-I
(8x13.4mm)
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
A11
A9
A8 A13 WE
CE2 A15 VDD
NC
A16 A14 A12
A7
A6
A5
A4
OE A10 CE1 I/O8 I/O7 I/O6 I/O5 I/O4
VSS I/O3 I/O2 I/O1
A0 A1 A2 A3
A0 A1
I/O5
VDD
VSS
I/O6
I/O7
I/O8
A9 A10
NCOENC
CE1 A16
A11 A12
A15
A13 A14
I/O4
I/O3
A5
A8
VDD
VSS
A2
I/O2
I/O1
CE2 A3 A6
A7A4WE
NC
A
654321
H
G
F
E
D
C
B
48-CSP
TOP VIEW
PIN DESCRIPTIONS
SYMBOL DESCRIPTIONS SYMBOL DESCRIPTIONS A0 ~ A16 Address inputs
OE
Output enable input
I/O0~I/O8 Data inputs/outputs VDD Power supply
CE1
,
CE2
Chip enable VSS Ground
WE
Write enable input
NC No connection
TE
CH
tm
T15N1024A
TM Technology Inc. reserves the right P. 3 Publication Date: FEB. 2003 to change products or specifications without notice. Revision:E
ABSOLUTE MAXIMUM RATINGS*
PARAMETER SYM MIN. MAX. UNIT
Voltage on Any Pin Relative to Gnd VR -0.5 +4.6 V V Power Dissipation
P
D
- 0.7 W
Storage Temperature
T
STG
-55 +150 °C
commercial 0 +70
Operating
Temperature
industrial
Ta
-40 +85
°C
*Note: Stresses greater than those listed above Absolute Maximum Ratings may cause permanent damage to
the device. This is a stress rating only and function operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
TRUTH TABLE
CE 1
CE2
WE
OE
DATA MODE
H X X X High-Z
Standby
X L X X High-Z
Standby
L H H L Data Out Active, Read L H H H High-Z Active, Output Disable L H L X Data In Active, Write
*Note: X = Don’t Care, L = Low, H = High
TE
CH
tm
T15N1024A
TM Technology Inc. reserves the right P. 4 Publication Date: FEB. 2003 to change products or specifications without notice. Revision:E
OPERATING CHARACTERISTICS
(Vcc = 2.4 to 3.6V, Gnd = 0V, Ta =
0 ~ +70 °C
/-40°C to 85°C)
-55 -70 -100
PARAMETER SYM. TEST CONDITIONS
Min Max Min Max Min Max
UNIT
Input Leakage
Current
I
LI
Vcc = Max, V
IN
= Gnd to Vcc
- 1 - 1 - 1 uA
Output Leakage
Current
I
LO
CE1
= VIH or CE2= VIL
or
OE
= VIH
or
WE
= VIL
V
OUT
= Gnd to Vcc
- 1 - 1 - 1 uA
Operating Power
Supply Current
I
CC
CE1
= VIL,CE2= V
IH,
WE
=V
IH,
OE
= V
IH ,
V
IN
= VIH or V
IL,
I
OUT
=0mA
- 2 - 2 - 2 mA
I
CC1
Cycle time=1us, 100% duty, I
OUT
=0mA,
CE1
0.2V,
CE2 ≥ V
CC
-0.2V,
V
IN
0.2V
- 3 - 3 - 3 mA
Average Operating
Current
I
CC2
Cycle time=min, 100% duty, I
OUT
=0mA,
CE1
= VIL,CE2= V
IH ,
V
IN
= VIH or VIL
- 40 - 35 - 25 mA
Standby Power
Supply Current
(TTL Level)
I
SB
CE1
=VIH
CE2= V
IL
- 0.5 - 0.5 - 0.5 mA
Standby Power
Supply Current
(CMOS Level)
I
SB1
CE1
Vcc-0.2V,
CE2 ≥ V
CC
-0.2V
or CE2 ≤ 0.2V V
IN
0.2V or
V
IN
Vcc-0.2V
- 10 - 10 - 10
u
A
Output Low Voltage
V
OL
I
OL
= 1.0mA
- 0.4 - 0.4 - 0.4 V
Output High Voltage
V
OH
I
OH
= -0.5 mA
2.1 - 2.1 - 2.1 - V
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