The T15L256A is a high speed, low power
CMOS static RAM organized as 32,768 x 8 bits that
operates on a single 3.3-volt power supply. This
device is packaged in standard 28-pin 300 mil SOJ ,
28-pin SOP, TSOP-I forward.
SYMBOL DESCRIPTION
A0 - A14 Address Inputs
I/O1 - I/O8 Data Inputs/Outputs
Vcc Power Supply
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vss Ground
A10
CS
I/O8
I/O7
I/O6
I/O5
PART NUMBER EXAMPLES
I/O4
PACKAGE SPEED
VSS
I/O3
T15L256A-35J SOJ 35ns
I/O2
T15L256A-70P TSOP-I 70ns
I/O1
A0
T15L256A-70D SOP 70ns
A1
A2
Chip Select Inputs
Write Enable
Output Enable
Taiwan Memory Technology, Inc. reserves the right P. 1 Publication Date: APR. 2001
to change products or specifications without notice. Revision:C
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V
IL
IH
A
I
I
SB1
I
LI
LO
CS
IH
V
IH
V
IL
OL
OL
OH
OH
2.4
CS
V
IL
SB
CS
IH
SB1
CS
cc
T15L256A
DC CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNIT
Supply Voltage to Vss Potential -0.5 to + 4.6 V
Inputs to Vss Potential -0.5 to Vcc +0.5 V
Power Dissipation 0.5 W
Storage Temperature -60 to +150
RECOMMENDED OPERATING CONDITIONS
PARAMETER SYM MIN TYP MAX UNIT
Supply Voltage Vcc Typ-5% 3.3 Typ+ 5% V
V
T
-0.3 - 0.8 V
2.1 - Vcc+0.3 V
0 - 70 °C
Input Voltage, low
Input Voltage, high
Ambient Temperature
TRUTH TABLE
°
C
CS
OE
WE
MODE I/O1- I/O8 Vcc
H X X Not Selected High -Z
L H H Output Disable High-Z Icc
L L H Read Data Out Icc
L X L Write Data In Icc
OPERATING CHARACTERISTICS
(Vcc = 3.3V± 5%, Vss = 0V, Ta = 0 to 70°C)
PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT
Input Leakage Current
Output Leakage Current
Output Low Voltage
Output High Voltage
Operating Power
Supply Current
Standby Power
Supply Current I
Vin=Vss to Vcc -10 - +10 uA
I
V
V
Icc
I
V
I/O
or OE=
I
I
Cycle = MIN.
Duty = 100%
=Vss to Vcc ,
or WE =
= + 8.0mA
= - 4.0mA
=
, I/O=0mA
V
=
, Cycle=MIN, Duty=100%
V
≥
-0.2V,f=0MHz
V
=
-35 - - 40
-70 - - 35
-10 - +10 uA
- - 0.4 V
- - V
- - 8 mA
- - 0.8 mA
SB,
mA
mA
Note: Typical characteristics are at Vcc = 3.3V, Ta = 25°C
Taiwan Memory Technology, Inc. reserves the right P. 2 Publication Date: APR. 2001
to change products or specifications without notice. Revision:C
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IN
IN
I/O
OUT
C
L
I
OH
I
OL
T15L256A
CAPACITANCE
(Vcc = 3.3V, Ta = 25°C, f = 1 MHz)
PARAMETER SYMBOL CONDITION MAX. UNIT
C
Input Capacitance
Input/ Output Capacitance
Note: These parameters are sampled but not 100% tested.
C
AC TEST CONDITIONS
PARAMETER CONDITIONS
Input P ulse Levels 0V to 3V
Input Rise and Fall Times 3 ns
Input and Output Timing Reference Level 1.5V
Output Load
AC TEST LOADS AND WAVEFORM
V
V
=30pF,
= 0V
= 0V
/
= -4mA/8mA
6 pF
8 pF
3.3V
OUTPUT
DQ
Z0 = 50 ohm
Fig.1
Fig.2
Vt =1.5V
R1 320 ohm
30pF
Including
Jig and
Scope
50 ohm
3.0V
0 V
3ns
30 pF
DQ
Z0 = 50
ohm
Fig.3
3.3V
OUTPUT
R2
350 ohm
(For TCLZ, TOLZ, TCHZ , TOHZ, TWHZ, TOW )
90%
10%10%
Fig.5
90%
3ns
R1 320 ohm
5pF
Including
Jig and
Scope
Vt =1.5V
Fig.4
50
ohm
5 pF
R2
350
ohm
Taiwan Memory Technology, Inc. reserves the right P. 3 Publication Date: APR. 2001
to change products or specifications without notice. Revision:C
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cc
T
RC
AA
TACS
AOE
T
CLZ
T
T
CHZ
T
OH
WC
AW
T
AS
DW
DH
T
T
OW
T15L256A
AC CHARACTERISTICS
(
=3.3V ± 5%, Vss = 0V, Ta = 0 to 70°C)
V
(1) READ CYCLE
PARAMETER SYM.
Read Cycle Time
T
T
T
OLZ
OHZ
Address Access Time
Chip Select Access Time
Output Enable to Output Valid
Chip Selection to Output in Low Z
Output Enable to Output in Low Z
Chip Deselection to Output in High Z
Output Disable to Output in High Z
Output Hold from Address Change
* These parameters are sampled but not 100% tested.
MIN. MAX. MIN. MAX.
35 - 70 -
- 35 - 70
*
∗
*
∗
- 35 - 70
- 25 - 35
3 - 3 0 - 0 -
- 25 - 35
- 25 - 35
3 - 3 -
T15M256A-35 T15M256A-70
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
(2)WRITE CYCLE
PARAMETER SYM.
Write Cycle Time
Chip Selection to End of Write
Address Valid to End of Write
Address Setup Time
Write Pulse Width
Write Recovery Time
Data Valid to End of Write
Data Hold from End of Write
Write to Output in High Z
Output Disable to Output in High Z
Output Active from End of Write
T15M256A-35 T15M256A-70
UNIT
MIN. MAX. MIN. MAX.
T
TCW 30 - 60 -
T
TWP 25 - 50 -
TWR 0 - 0 -
T
T
∗
WHZ
∗
OHZ
T
35 - 70 -
30 - 60 -
0 - 0 -
20 - 30 -
0 - 0 -
- 10 - 25
- 10 - 25
0 - 0 -
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
* These parameters are sampled but not 100% tested.
Taiwan Memory Technology, Inc. reserves the right P. 4 Publication Date: APR. 2001
to change products or specifications without notice. Revision:C
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T15L256A
TIMING WAVEFORMS
READ CYCLE 1
(Address Controlled)
A d d r e s s
t
OH
D
O U T
READ CYCLE 2
(Chip Select Controlled)
C S
t
CL Z
t
R C
t
AA
t
OH
t
A CS
t
CH Z
D
O U T
READ CYCLE 3
(Output Enable Controlled)
A d d r e s s
O E
C S
D
O U T
t
t
t
t
t
AOE
OLZ
AC S
CL Z
AA
t
RC
t
OH
t
OH Z
t
CH Z
DON 'T CA R E
UN DE F IN E D
Taiwan Memory Technology, Inc. reserves the right P. 5 Publication Date: APR. 2001
to change products or specifications without notice. Revision:C
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V
IL
T15L256A
WRITE CYCLE 1 (OE CLOCK)
A d d r e s s
O E
CS
t
t
WC
CW
t
t
AW
WP
t
WR
WE
D
OU T
D
I N
WRITE CYCLE 2
A d d r e s s
C S
W E
D
O U T
(OE =
t
t
AS
t
OHZ
AS
(1 ,4)
Fixed)
t
WH Z
t
DW
t
DH
t
WC
t
CW
t
AW
t
WP
(1 ,4 )
t
D W
t
WR
t
OH
t
OW
(2 )
t
DH
(3)
D
I N
D O N 'T CA R E
U N DE F I NE D
Taiwan Memory Technology, Inc. reserves the right P. 6 Publication Date: APR. 2001
to change products or specifications without notice. Revision: C
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OUT
IN
OUT
L
OE
WE
T15L256A
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs
should not be applied.
2. The data output from
3.
4. Transition is measured ± 500 mV from steady state with
5. If
D
provides the read data for the next address.
guaranteed but not 100% tested.
OE
is low during a
tWP or (t
required tDW. If
apply and the write pulse can be as short as the specified tWP.
WHZ
D
are the same as the data written to
WE
controlled write cycle, the write pulse width must be the larger of
+ tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the
is high during a
controlled write cycle, this requirement does not
C
D
during the write cycle.
= 5pF. This parameter is
Taiwan Memory Technology, Inc. reserves the right P. 7 Publication Date: APR. 2001
to change products or specifications without notice. Revision: C
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T15L256A
PACKAGE DIMENSIONS
28-LEAD SOJ SRAM (300 mil)
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 0.710±0.002 18.03±0.05
B 0.300±0.005 7.62±0.13
C 0.060±0.002 1.52±0.05
D 0.050±0.001 1.27±0.03
E 0.063±0.001 1.63±0.03
F 0.015±0.002 0.38±0.05
G 0.030±0.002 0.76±0.05
H 0.050±0.002 1.27±0.05
I 0.018±0.002 0.46±0.05
J 0.028±0.002 0.71±0.05
K 0.337±0.002 8.56±0.05
L 0.010±0.001 0.25±0.03
M 0.026±0.002 0.66±0.05
N 0.268±0.003 6.81±0.08
O 0.300±0.002 7.62±0.05
P 0.053±0.001 1.35±0.03
Q 0.140±0.004 3.56±0.10
y 0.004(MAX) 0.10(MAX)
Taiwan Memory Technology, Inc. reserves the right P. 8 Publication Date: APR. 2001
to change products or specifications without notice. Revision: C
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T15L256A
PACKAGE DIMENSIONS
28-LEAD TSOP-I SRAM (8X13.4mm)
D
C
1
1415
Db
Seating plane
28
"A"
Gauge plane
Detail "A"
b
E
e
A2AA1
Seating plane y
0.010
L
L1
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 0.047(max.) 1.20(max.)
A1 0.004±0.002 0.10±0.05
A2 0.039±0.002 1.00±0.05
b 0.008(typ.) 0.20(typ.)
c 0.006(typ.) 0.15(typ.)
Db 0.465±0.004 11.80±0.10
E 0.315±0.004 8.00±0.10
e 0.022(typ.) 0.55(typ.)
D 0.528±0.008 13.40±0.20
L 0.020±0.004 0.50±0.10
L1 0.0315±0.004 0.80±0.10
y 0.004(max.) 0.10(max.)
0°°~5°° 0°°~5°°
θ
Taiwan Memory Technology, Inc. reserves the right P. 9 Publication Date: APR. 2001
to change products or specifications without notice. Revision: C