TAG SV-4103-X4 Operation Manual

TAG

22355 TAG Way

Dulles, VA 20166

4U Single Quad Core Xeon PICMG Server

SV-4103-X4

Operations Manual

Operations Manual

1 Copyright © 2008 Technology Advancement Group®, Inc.

(TAG®)

All rights reserved. This publication and its contents are proprietary to TAG. No part of
this publication may be reproduced in any form or by any means without the written
permission of TAG, 22355 TAG Way, Dulles, Virginia 20166-9310.

TAG has made every effort to ensure the correctness and completeness of the material
in this document. TAG shall not be liable for errors contained herein. The information in
this document is subject to change without notice. TAG makes no warranty of any kind
with regard to this material, including, but not limited to, the implied warranties of
merchantability and fitness for a particular purpose.

1.1 Trademarks

All trademarks, marks, names, or product names referenced in this publication are the
property of respective owners, and TAG neither endorses nor otherwise sponsors any
such products or services referred to herein.

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2 About TAG

2.1 Summary of Qualifications

TAG has served as a leading provider of IT solutions to DoD customers over the past
20+ years and has a long-standing and respected history of providing Systems
Engineering, Electronic Equipment and Program Management support to US Military
warfighters. Headquartered in Dulles, Virginia, TAG’s state-of-the-art 35,000 sq. ft.
engineering and manufacturing facility provides all the infrastructure, equipment, and
manpower necessary to engineer, design, test, manufacture, and certify products to the
rugged requirements of the tactical combat theater. Our facilities in Dulles, VA, San
Diego, CA, and St. Louis, MO, allow for rapid deployment of products and support
across the globe.

TAG quickly, efficiently, and cost-effectively tailors rugged solutions for large DoD
programs with specific MIL-STD requirements. TAG’s comprehensive Quality
Assurance (QA) policy – enforced through application of our UL-registered ISO
9001:2000 certified processes – enables TAG to rapidly deploy systems and solutions
that reliably withstand the stresses of the tactical environment. Today, there are over
20,000 TAG systems deployed across various weapons platforms throughout the US
Military. TAG effectively balances all corporate assets – our people, expertise,
infrastructure, and experience – to consistently and successfully execute and deliver to
the DoD.

TAG’s success lies in focusing on the
corporate Mission Statement and leveraging
the tenets of our business model to ensure

the customer’s expectations are exceeded

throughout lengthy program lifecycles.

TAG’s Mission is to resolve our customers’ IT
challenges with World-Class:

 Engineering;
 Manufacturing and Integration; and

 Lifecycle Management

TAG has a proven track record in
implementing these tenets to serve as a trusted advisor to our Government customers.
TAG uses this foundation to ensure risk is mitigated, expectations are exceeded, and
the customer can consistently rely on the company, our equipment, and our services.

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2.2 Core Competences

2.2.1 Engineering

TAG’s engineering methodology is built upon Multi-Disciplinary Optimization (MDO) and
rigorous design reviews. Although PMs drive the schedule at TAG, Engineering
leverages Computer-Aided Design (CAD) tools, Computational Fluid Dynamics (CFD)
modeling, rapid prototyping processes, and diverse test equipment and facilities to
ensure requirements are being met at every step of the design. TAG Engineering
follows a proven design-review process, ensuring all entrance and exit criteria are met
at each stage. Rigorous documentation is compiled to demonstrate requirement
compliance, risks are mitigated, and decisions are prudent – throughout the design
process.

TAG prides itself on its engineering
laboratories and facilities. Over the past
three years, TAG has invested in several
pieces of equipment that allow TAG to test
and certify products directly onsite to the
harshest environmental requirements of
military standards – including the MIL-STD­810F and DO 160D.

TAG’s onsite test equipment currently

includes a Highly Accelerated Lifecycle
Testing (HALT) Chamber, an
Electromagnetic Interference (EMI) test chamber, and a high-/low-temperature thermal
test chamber. TAG’s facility also provides:

 A floor plan designed to support a cellular manufacturing model with modular

assembly lines

 A dedicated 24-hour system burn-in room
 A modern production status tracking and Enterprise Resource Planning (ERP)

system with external web collaboration capabilities

 Dedicated Quality Assurance workstations for system compliance and validation

inspection

2.2.2 Manufacturing and Integration

TAG implements Cellular Manufacturing processes through our compartmentalized,
state-of-the-art production facility to minimize waste byproducts and maximize

production efficiency. TAG’s manufacturing facility is physically partitioned to model the

major philosophies of Lean Manufacturing. Consistent with the model, each of TAG’s
production cells are capable of operating in isolation; however personnel and tools are

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shared across all cells to streamline manufacturing operations, costs, and the
production/integration scheduling. TAG’s floor technicians are cross-trained in multiple
disciplines so they can be redistributed to any cell that encounters production
bottlenecks, which ensures optimal efficiency.

2.2.3 Lifecycle Management

TAG’s world-class Program Management discipline models the renowned
methodologies of the Project Management Institute (PMI) to ensure successful
completion of the task at hand. Our Program Managers (PMs) serve as the voice of the
customer – driving requirements to which the rest of TAG’s organization answers. As

an explicit tenet of TAG’s corporate mission statement, the PMs not only track cost,
schedule, and technical compliance throughout a project’s period of performance, but

also ensure the customer is supported well beyond it.

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Date

Version

Number

Updated By

Description of

Changes

07/09/2008

1.0

Alan Huckerby

Author

09/29/2009

1.1

Alan Huckerby

Author

Operations Manual

Document Revision History

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3 About This Manual

3.1 Scope and Audience

This Manual provides an introductory overview
of the SV-4103-X4. Designed to endure the
rigors of harsh environments, this device can
withstand shock and vibration, high and low
temperatures. All of our devices are based on
the latest Intel and AMD technology. Also, this
device doesn't use Intel Core Due or Pentium
M technology (only THS servers).

. Configuration options include extended
memory and enhanced video optimization. All
of our servers are backed by our world-class
lifecycle management and post sales support.

3.1.1 Organization:

 Chapter 1 Provides Cautions and Warnings.
 Chapter 2 Provides operational information.
 Chapter 3 Contains all relevant Procedures.

This manual is divided into the following
chapters:

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Table of Contents

Contents

1 Copyright © 2008 Technology Advancement Group®, Inc. (TAG®) ............................ 2

1.1 Trademarks ............................................................................................................ 2

2 About TAG ................................................................................................................... 3

2.1 Summary of Qualifications ...................................................................................... 3

2.2 Core Competences ................................................................................................. 4

2.2.1 Engineering ....................................................................................................... 4

2.2.2 Manufacturing and Integration ........................................................................... 4

2.2.3 Lifecycle Management ...................................................................................... 5

3 About This Manual ....................................................................................................... 7

3.1 Scope and Audience .............................................................................................. 7

3.1.1 Organization: ..................................................................................................... 7

4 Safety Instructions ....................................................................................................... 13

4.1 Types of Warnings used in this Manual .................................................................. 13

4.1.1 Safety Symbols and Labels ............................................................................... 13

4.1.2 Conventions ...................................................................................................... 13

5 SV-4103-X4 Overview ................................................................................................. 16

5.1 Product Information ................................................................................................ 16

6 SV-4103-X4 ................................................................................................................. 17

6.1.1 SV-4103-X4‖ Specifications .............................................................................. 17

6.1.2 SV-4103-X4 Components ................................................................................. 20

6.1.3 Trenton 6680 Sys/Host Board ........................................................................... 20

6.1.4 Trenton 6680 Sys/Host Board Components ...................................................... 22

6.1.5 PCI X Bus Frame Grabber ................................................................................ 22

6.1.6 PCI X Bus Frame Grabber Board Components ................................................ 24

6.1.7 MCG-Series PICMG 1.3 PCI System Host Board ............................................. 27

6.1.8 PCI Express System Host Board Components ................................................. 28

6.1.9 PCI Analog Frame Grabber Board .................................................................... 29

6.1.10 PCI Analog Frame Grabber Board Components ............................................. 30

6.1.11 PCI X Digital Frame Grabber .......................................................................... 31

6.1.12 PCI X Digital Frame Grabber Components ..................................................... 33

6.1.13 PCI/Express Graphics Card ............................................................................ 35

6.1.14 PCI Graphics Card Components ..................................................................... 36

6.1.15 Non Rotating Solid State Memory ................................................................... 37

6.2 Power Management ............................................................................................... 39

6.2.1 Power Supply .................................................................................................... 39

6.2.2 Power Supply Components ............................................................................... 39

6.3 COTS 28 Vin Filter ................................................................................................. 41

6.3.1 Vin Filter Features ............................................................................................. 41

7 Procedures .................................................................................................................. 43

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7.1 SV-4103-X4 Startup ............................................................................................... 43

7.2 SV-4103-X4 Shutdown ........................................................................................... 43

8 Identifying Server Components Using Device Manager ............................................... 44

8.1 Working with Device Properties .............................................................................. 47

8.2 Installing and Removing Hardware in Windows...................................................... 49

8.2.1 Using the Add New Hardware Wizard ............................................................... 50

8.3 Installing Legacy Peripherals .................................................................................. 51

8.3.1 Removing Legacy Peripherals .......................................................................... 51

8.4 TAG Approved BIOS .............................................................................................. 54

8.4.1 BIOS Configuration for Nightvision .................................................................... 54

8.4.2 80

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List of Figures

Figure 5-1 SV-4103-X4 ................................................................................................. 16

Figure 6-1 SV-4103-X4 ................................................................................................. 17

Figure 6-4 Trenton 6680 Sys/Host Board ...................................................................... 21

Figure 6-5 Trenton 6680 Sys/Host Board (Block Diagram) ........................................... 22

Figure 6-6 PCI X Bus Frame Grabber ........................................................................... 23

Figure 6-7 PCI X Bus Frame Grabber Block Diagram ................................................... 24

Figure 8-1 Control Panel ............................................................................................... 44

Figure 8-2 System Properties ........................................................................................ 45

Figure 8-3 Device Manger ............................................................................................. 45

Figure 8-4 Device Manager ........................................................................................... 47

Figure 8-5 Properties Dialog Box .................................................................................. 48

Figure 8-6 Control Panel ............................................................................................... 50

Figure 8-7 Add Hardware Wizard .................................................................................. 50

Figure 8-8 Control Panel ............................................................................................... 51

Figure 8-9 System Properties ........................................................................................ 52

Figure 8-10 Device Manager ......................................................................................... 52

Figure 8-11 System Overview ....................................................................................... 55

Figure 8-12 CPU Configuration Screen ......................................................................... 55

Figure 8-13 Advanced CPU Settings............................................................................. 56

Figure 8-14 IDE Configuration ....................................................................................... 56

Figure 8-15 IDE Configuration ....................................................................................... 57

Figure 8-16 Floppy Configuration Page ......................................................................... 57

Figure 8-17 IDE Configuration Page ............................................................................. 58

Figure 8-18 IDE Configuration Page ............................................................................. 58

Figure 8-19 Floppy Configuration Page ......................................................................... 59

Figure 8-20 Floppy Configuration Page ......................................................................... 59

Figure 8-21 Super IO Configuration Page ..................................................................... 60

Figure 8-22 Super IO Configuration Page. .................................................................... 60

Figure 8-23 ACPI Configuration Page ........................................................................... 61

Figure 8-24 ACPI Configuration Page ........................................................................... 61

Figure 8-25 South Bridge ACPI Configuration Page ..................................................... 62

Figure 8-26 ACHI Configuration Page ........................................................................... 62

Figure 8-27 ACHI Configuration Page ........................................................................... 63

Figure 8-28 SMBIOS Configuration Page ..................................................................... 63

Figure 8-29 SMBIOS Configuration Page ..................................................................... 64

Figure 8-30 Remote Access Configuration Page .......................................................... 64

Figure 8-31 Remote Access Configuration Page .......................................................... 65

Figure 8-32 Trusted Computing Page ........................................................................... 66

Figure 8-33 Trusted Computing Page ........................................................................... 66

Figure 8-34 MPS Configuration Page............................................................................ 67

Figure 8-35 MPS Configuration Page............................................................................ 67

Figure 8-36 MPS Configuration Page............................................................................ 68

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Figure 8-37 USB Configuration Page ............................................................................ 68

Figure 8-38 USB Configuration Page ............................................................................ 69

Figure 8-39 PCI/PnP Screen ......................................................................................... 69

Figure 8-40 Plug & Play Configuration Popup Screen................................................... 70

Figure 8-41 Onboard VGA Controller Screen ................................................................ 70

Figure 8-42 Onboard VGA Controller Screen ................................................................ 71

Figure 8-43 Onboard VGA Controller Popup Screen .................................................... 71

Figure 8-44 Boot Setting Configuration Screen ............................................................. 72

Figure 8-45 Boot Settings Configuration Popup Screen ................................................ 72

Figure 8-46 Boot Settings Screen ................................................................................. 73

Figure 8-47 Boot Settings Configuration Screen ........................................................... 73

Figure 8-48 Boot Device Priority Screen ....................................................................... 74

Figure 8-49 Boot Device Priority Screen ....................................................................... 74

Figure 8-50 Boot Settings Screen ................................................................................. 75

Figure 8-51 North Bridge Configuration Screen ............................................................ 75

Figure 8-52 Security Screen .......................................................................................... 76

Figure 8-53 South Bridge Chipset Configuration Screen............................................... 76

Figure 8-54 Onboard LAN Boot ROM Screen ............................................................... 77

Figure 8-55 ESB2 PCI X Hub Configuration Screen ..................................................... 77

Figure 8-56 ESB2 PCI X Hub Settings Screen .............................................................. 78

Figure 8-57 Save Changes and Exit Screen ................................................................. 78

Figure 8-58 Save Configuration Screen ........................................................................ 79

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Chapter 1

Chapter 1

Cautions and Warnings.

Electronically distributed. Subject to user discretion when printed.

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DANGER

WARNING

CAUTION

These warnings and
cautions indicate situations
or practice that might
result in property damage.

Operations Manual

4 Safety Instructions

4.1 Types of Warnings used in this Manual

Read this manual thoroughly, paying special attention to the cautions and warnings.

4.1.1 Safety Symbols and Labels

4.1.2 Conventions

4.1.2.1 Important Messages

4.1.2.2 Warnings

Important messages appear where
mishandling of components is possible or when
work orders can be misunderstood. These
messages also provide vital information
associated with other aspects of system

operation. The word ―important‖ is written as

―IMPORTANT,‖ both capitalized and bold and

is followed by text in italics. The italicized text
is the important message.

Warnings appear where overlooked details
may cause damage to the equipment or result
in personal injury. Warnings should be taken
seriously. Warnings are easy to recognize. The

word ―warning‖ is written as ―WARNING,‖ both

capitalized and bold and is followed by text in

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italics. The italicized text is the warning
message.

4.1.2.3 Cautions

Cautionary messages should also be heeded
to help you reduce the chance of losing data or
damaging the system. Cautions are easy to

recognize. The word ―caution‖ is written as

―CAUTION,‖ both capitalized and bold and is

followed by text in italics. The italicized text is the

cautionary message.

4.1.2.4 Notes

Notes inform the reader of essential but non­critical information. These messages should be
read carefully as any directions or instructions
contained therein can help you avoid making
mistakes. Notes are easy to recognize. The

word ―note‖ is written as ―NOTE,‖

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Chapter 2

Chapter 2

SV-4103-X4

.

Electronically distributed. Subject to user discretion when printed.

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5 SV-4103-X4 Overview

Figure 5-1 SV-4103-X4

5.1 Product Information

The SV-4103-X4 sets the standard for Servers
with state-of-the-art technology. The newest
Server can stand up to the harshest
environments, and is designed specifically to
be fully customized to support unique, mission­critical applications.

Your system may contain components not
described in this User Manual. For detailed
information on these components, refer to the
manufactures website or contact TAG
Technical Support at [e-mail].

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6 SV-4103-X4

6.1.1 SV-4103-X4” Specifications

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Figure 6-1 SV-4103-X4

Chassis & Power Supply

 Dimensions: 7‖H x 16.875‖W x 15‖D.
 Weight: 30 lbs.

 Internal Power: The internal "ATX

power supply" is provided with two
28Vdc input power supplies.

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 Input DC Voltage: The input power is

28Vdc.

System Specifications.

 Intel Quad Core Low-voltage CPU

(L5408, 2.13GHz).

 Cache: 12MB L2 Cache.
 Memory: 4GB (2 x 2GB

Modules)/Expandable to 8GB. Type:
FB-DIMM RAM.

System Management:

 Intelligent fan controller. With Custom

Thermal solution to provide operation in
extreme temperature environment

 Environmentally aware
 Acoustically optimized

Storage:

 (Internal) 2.5‖, SATA, Industrial Flash Drive.
 PCI Graphics: MSI 8600 GTS PCI-E x16

(NX8600GTS-T2D256E_OC) Graphics
Card.

 PCI Express Analog Video Frame

Grabber Card: PC2 COMP EXPRESS

PCI-E x1 Analog Video Capture Card.

 PCI X Analog Frame Grabber Card:

X64AN-QUAD PCI-X Analog Frame
Grabber Card.

 PCI X Digital Frame Grabber Card: X64-

CL DUAL Digital Frame Grabber Card.

 Operating System: Microsoft Windows XP

Professional – 32bit.

 Imaging Software: Sapera Lite Software.

I/O Ports:

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 Three one (1) Gigabit Ethernet Copper (RJ-

45) connections. (2) are in the Sys/Host

Card. (1) In the rear panel. (All are rear
panel accessible).

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 (4) USB 2.0 ports. (Front panel

accessible).

 (1) DB9 COMM Serial Port (rear

accessible)

 PS/2 keyboard and mouse port. (Front

panel accessible).

Optional

 Keyboard: Mobile backlit USB keyboard.
 Pointer: Waterproof optical mouse.

Environmental Specifications

 Operating Temperature: Designed to

meet 0°C to 60°C.

 Non-operating Temperature: Designed to

meet -40°C to 70°C.

 Humidity: Designed to meet 0%-90% non-

condensing.

 Salt/Fog: Designed to meet MIL-STD-

810F, Method 509.4.

 Fungus/Mold: Designed to meet MIL-STD-

810F, Method 508.5.

 Shock: The server is designed to meet

MIL-STD-810F.

 Vibration: The server is designed to meet

MIL-STD-810F.

 Sand and Dust Protection: The server is

designed to meet MIL-STD-810F.

 EMI: The server is designed to meet FCC

Class B.

Maintenance and Repair

 The SV-4103-X4 is considered a line

replaceable unit (LRU) and will be
maintained and spared at the LRU level.

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6.1.2 SV-4103-X4 Components

This section provides an overview of the most
common components installed in the SV-4103­X4. Information is also provided on how to
identify specific components within your SV­4103-X4. For detailed information on the
specific components installed, refer the
manufactures websites.

6.1.3 Trenton 6680 Sys/Host Board

This Backplane/Motherboard supports

multiple PCI/ExpressTM serial interfaces to
option card slot s and devices. The
flexible System Host board Provides:

 PCI /Express Graphics Card,
 PCI Express (Analog Video Frame Grabber

Card),

 PCI X (Analog Frame Grabber Card) including

one extra PCI/X slot.

 PCI X (DUAL Digital Frame Grabber Card).

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Figure 6-2 Trenton 6680 Sys/Host Board

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Figure 6-3 Trenton 6680 Sys/Host Board (Block Diagram)

6.1.4 Trenton 6680 Sys/Host Board Components

Processor

 Option (internal pin connector).
 4x RS232C serial ports with FIFO.
 8x USB 2.0 (4x internal and 4x

external).

 Up to 3x 10/100/1000 Mbps Ethernet

Controller, Realtek RTL8111B.

 Standard PS/2 mouse and keyboard

(internal connection available).

 HD Audio and AC97 compliant.
 8 channel GPIO.
 Temperature, fan and voltages.
 Software interface to monitor hardware

values including HDD S.M.A.R.T.

 On board Lithium battery and external

battery input 0-60°C.

 Compliance with EN55022 and

EN61000-4-2 (ESD).

 UL609501-1:2003, First edition.
 CSA C22.2 No. 60950-1-03, First

edition, April 1. 2003.

 RoHS and Lead-free production.
 Trenton’s PICMG 1.3 compatible

backplanes, 170 mm x 170 mm (6.7‖ x

6.7‖).

6.1.5 PCI X Bus Frame Grabber

The X64-AN Quad is a high-performance PCI­X bus compatible frame grabber. Driven by the
need to integrate vision automation with
multiple view inspection, the X64-AN Quad is
designed to deliver concurrent image
acquisition from multiple independent standard
and progressive scan analog cameras.

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The X64-AN Quad is capable of grabbing from
four independent cameras at the same time,
and offers independent control signals for each
input channel to acquire, transfer and track
images accurately. Supporting high-resolution
8-bit image digitization, the X64-AN Quad
offers independent image paths creating
virtually four frame grabbers in one slot.

Figure 6-4 PCI X Bus Frame Grabber

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Figure 6-5 PCI X Bus Frame Grabber Block Diagram

6.1.6 PCI X Bus Frame Grabber Board Components

 Image time stamp for accurate object tracking

of each input channel.

 Concurrent acquisition from up to four

independent format cameras.

 High-speed image transfers at up to 528MB/s
 PCI-X 66MHz compatible.
 Supports Windows® XP and 2000.

Board:

 Full length 64-bit PCI-X 66MHz compatible

Transfers Supports 5V and 3.3V slots

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Acquisition:
 Concurrent image acquisition from four

independent interlaced or progressive scan
analog cameras.

 Single slot solution supports acquisition rates

up to 50MHz in 8-bit/pixel mode.

 Horizontal Size (min/max): 32 pixels to 4096

pixels in 1 pixel/step.

 Vertical Size: 1 to 16384 lines in 1 line/step

Interfaces to monochrome standard or custom
format cameras

 Pixel jittter VBS 1 VPP, 75 ohms terminated
 Pixel jittter Video 0.714 VPP, 75 ohms

terminated

 Pixel jittter Partial scan mode
Synchronization:

 Supports composite video and separate

horizontal and vertical sync input.

 Horizontal/Vertical Drive output, LV TTL and

TTL compatible.

 Frame reset and WEN inputs for each channel.
Onboard memory:
 128MB Onboard frame buffer memory Pixel

Formats: Monochrome 8-bit/pixel.

 Transfers: Real-time transfers to system

memory:

 PCI-32 bus: 32 bits @ 33MHz.
 PCI-64 bus: 64 bits @ 66MHz.
 PCI-X bus: 64 bits @ 66MHz.

Pixel jittter:

 Robust error tracking, reporting and recovery.

Look-up tables:

 One 256 x 8-bit look-up table per channel

Noise and Pixel Jitter:

 +/- 1 LSB with +/- 1.5ns jitter

Controls:

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 Independent gain/offset control for each input

channel from 0.4V to 1.2V 780µV/step.

 Anti-aliasing filter: 12MHz1 5th Butterworth.
 Comprehensive event notification includes

end/start-of-field/frame/transfer.

 4 independent opto-isolated trigger inputs;

programmable as active high or low (edge or
level trigger).

 4 strobes TTL outputs.
 PC independent RS232 serial communication

ports provide seamless interface to MS
Windows applications.

Optional: General purpose IO module
supports:

 Inputs and 8 TTL outputs.
 Inputs support TTL and 24V operations.
 TTL outputs support PNP and NPN operations.

Power Output:

 Power-on-reset fused +12V DC output at 750

mA(max) for each input channel.

Software:
 Microsoft Windows XP and Windows 2000

compliant.

 Full support of DALSA’s Sapera programming

package.

 Microsoft Visual Studio 6.0 and .NET.

compatible C/C++ DLLs and ActiveX controls.

System Requirements:

 PCI-X compliant system and 64MB system

memory.

Dimensions:

 12.25‖ (31cm) Length x 4.125‖ (10.5cm)

Height.

Temperature:
0° C (32° F) to 55° C (131° F).
Relative Humidity: up to 95% (non-condensing).

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6.1.7 MCG-Series PICMG 1.3 PCI System Host Board

The PCI Systems Host board (SHBs) offers a
wide variety of board configurations designed
to excel in your most demanding and diverse
server-class computing applications. Dual-Core
processor options provide two and Quad-Core
processors provide four execution cores per
CPU. For dual-processor board configurations,
each CPU has its own independent system
bus to reduce data bottlenecks while
maximizing processing throughput. The four­channel memory interface features
DDR2-667 FB-DIMMS with a maximum of
16GB.

NOTE: This Unit provides a Single Quad
core CPU.

Figure 6-8 MCG-Series PICMG 1.3 PCI System Host Board

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Figure 6-9 MCG-Series PICMG 1.3 PCI Express System Host Board

6.1.8 PCI Express System Host Board Components

 Dual- or Quad-Core Intel® Xeon® Processors

and the Intel® 5000P chipset.

 A single-board design with two processors that

provide up to eight processor execution cores
per board (1 + 2 = 8

 An independent 1066/1333MHz system bus for

each processor.

 Support for 32-bit and 64-bit operating

systems.

 A four-channel system memory interface with

standard memory (16GB) and extended
memory (32GB) support.

 Six SATA/300 ports that support RAID 0, 1, 5

and 10 drive arrays.

 Three Gigabit Ethernet interfaces and eight

USB 2.0 ports.

 Supports PCI Express™, PCI-X and PCI option

cards.

 Compatible with the SHB Express™ (PICMG®

1.3) specification.

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6.1.9 PCI Analog Frame Grabber Board

Figure 6-10 PCI Analog Frame Grabber Board

Figure 6-11 PCI Analog Frame Grabber Board (Block Diagram).

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The PC2-COMP ExpressTM is designed to
meet the dynamic requirements of general­purpose video applications. The PC2-COMP
Express offers a cost effective solution for a
wide variety of application areas including
video monitoring, medical visualization,
surveillance, and machine vision applications.
Its flexible acquisition front-end allows video
capture from up to six color or monochrome
composite video or two S video cameras.
Designed within DALSA’s field proven ―Trigger­to-Image Reliability‖ framework, the PC2­COMP Express allows OEMs to bring
high performance imaging solutions to market
faster.

6.1.10 PCI Analog Frame Grabber Board Components

 Board Half-slot PCI Express 1.0a compliant.
 Acquisition 6 Composite Video or 2 Y/C (4 CV

and 1 YC OR 2 CV and 2 YC).

 Standard RS170, NTSC, CCIR, and PAL

formats.

 Up to 8MB of frame buffer memory.
 Image mirroring and vertical flip.
 Adaptive 2/4 line comb filter for high accuracy

chrominance and luminance separation.

 Arbitrary horizontal and vertical down scaling for

randomly sized windows 0.7 VPP 75Ω
terminated.

 Pixel Jitter ± 2ns.
 Pixel Formats Pixel formats allow 8-bit mono,

16-bit YUV 4:2:2 packed and YUV 4:2:2 planar
formats.

 Transfers Simultaneous live image display and

real-time transfers to system memory with no
host CPU overhead.

 DMA supports scatter-gather to optimize host

frame buffer usage.

 Allows on-the-fly camera switching with minimal

frame loss.

 Controls 1 TTL Trigger Input.
 Detects loss of input video signal.

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 Comprehensive event notification for start/end

of odd/even field or frame signals required for
application process synchronization.

 Software Microsoft Windows XP Professional

and Windows XP Professional 64-bit1
compliant.

 Supports DirectDraw and TWAIN-32.
 Fully supported of Sapera LT.
 Application development using C/C++ DLLs and

ActiveX controls with Microsoft Visual Studio 6.0
and Microsoft Visual Studio .Net.

 System Requirement Intel Pentium class CPU,

64MB system memory,

 10MB free hard-drive space.
 Dimensions PCI Express—6.677" (16.95 cm)

Length x 4.20".

 (10.7cm) Height
 Power Max 1.8A at + 3.3V.
 Consumption 170mA at + 12V.
 Temperature.
 Operating 0°C (32° F) to +50° C (131° F).
 Storage -40°C (-40°F) to +125°C (257°F).
 Relative Humidity 5% to 95% (non-condensing).
 Markings FCC-Approved.
 CE-Approved.

6.1.11 PCI X Digital Frame Grabber

Compatible with one Base, Medium or Full
Camera Link camera, the X64-CL Full
is universal PCI slot compliant and supports all
standard multiple tap area and linescan
color and monochrome Camera Link cameras.
For greater versatility, the X64-CL Full can
also interface with custom camera formats,
including pixel depths and tap configurations
not covered by the Camera Link standard.

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Figure 6-12 PCI X Digital Frame Grabber

Figure 6-13 PCI X Digital Frame Grabber. Block Diagram

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6.1.12 PCI X Digital Frame Grabber Components

 Half length PCI 2.1 64-bit 66MHz compliant
 5V and 3.3V slot compatible.
 Acquisition rates up to 680MB/s.
 Horizontal Size (min/max): 8 byte/256KB.
 Vertical Size (min/max):
 Linescan cameras: 1 line to infinity.
 Area scan cameras: 1 line to 16 million/frame

variable length frames.

 Onboard frame buffer memory up to 2GB

(32MB standard).

 LUT: One 8 or 10-bit(mono/RGB) or 12-bit

(mono) input lookup table1.

 Single slot solution supports 1 Medium, 1 Base

or 2 synchronized Base Camera Link cameras.

 Interfaces to digital area scan or linescan color

or monochrome cameras.

 Supports standard multi-tap Camera Link

configurations:

 1 Full camera: 8 x 8-bit.
 1 Medium camera: 4 x 8-bit, 4 x 10-bit, 4 x

12-bit, 1 x 30-bit/RGB and 1 x 36-bit.

 1 Base camera: 3 x 8-bit, 2 x 10-bit, 2 x

12-bit, 1 x 14-bit, 1 x 16-bit, and 1 x 24­bit/RGB.

 Alternate multi-tap Camera Link configurations

support: 4 x 14-bit, 4 x 16-bit, 1 x 48-bit or 1 x
64-bit.

 Pixel Formats •Monochrome 8, 10, 12, 14, 16,

or 36-bit/RGB.

 Transfers •Real-time transfers to system

memory:

 PCI-32 bus: 32 bits @ 33MHz.
 PCI-64 bus: 64 bits @ 66MHz.
 PCI-X bus: 64 bits @ 66MHz.

 On-the-fly tap adjustments for multiple tap area

scan and linescan cameras.

 Controls •Comprehensive event notification

includes start/end-of-frame, sequence or N-line
events.

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 One independent TTL/LVDS trigger input

programmable as active high or low (edge or
level trigger).

 One strobe TTL output for area scan and

linescan cameras.

 One PC independent "serial communication"

port provides seamless interface to MS
Windows applications.

 Quadrature (AB) shaft-encoder inputs for

external web synchronization; supports
cascaded divide and multiply.

 Power Output •Power-on-reset fused

+12V/+5V DC output at 1.5A.

 Software •Microsoft Windows NT 4.0, Windows

2000, and Windows XP compliant.

 Full support of the Sapera programming

package.

 Compatible with Microsoft Visual Studio 6.0

and .Net (unmanaged code only).

 Visual Basic 6.0 and Borland C++ Builder 5.5

or higher.

 System Requirements •PCI-64 or PCI-32

compliant system and 64MB system memory.

 Dimensions •8.27‖ (21cm) Length x 4.20‖

(10.7cm) Height.

 Temperature •0° C (32° F) to 55° C (131° F)
 Relative Humidity: up to 95% (non-

condensing).

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6.1.13 PCI/Express Graphics Card

MSI's NX8600GT Twin Turbo videocard has
push-button shader overclocking! By default
the videocard comes pre-overclocked with its
core running at 600 MHz and memory at 1600
MHz (stock is 540/1400).

MSI's NX8600GTS-T2D256E-OC videocard is
based on the new nVIDIA GeForce 8600GTS
core. The card packs in a modest 256MB of
GDDR3 memory.

This PCI Graphics card enhances image
quality:

 Brings the easiest way to optimize graphic

quality.

 Colorize your vision when browsing digital

photographs.

 Sharpens characters edges.

Figure 6-14 PCI/Express Graphics Card

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Figure 6-15 PCI/Express Graphics Card (Connectors)

6.1.14 PCI Graphics Card Components

Support Memory

 NX8600GTS-T2D256E-OC videocard
 700 MHz core, 2100 MHz memory.
 256MB DDR3

Video Output Function

 Dual-link DVI Support
 HDTV/HDCP Support
 TV-out + Dual DVI Connectors
 GPU: 675MHz.
 Memory: 2000MHz

Performances

 Graphics Bus Technology: PCI Express.
 Memory: 256MB.
 Memory Interface: 128-bit.
 Memory Bandwidth (GB/sec): 32.
 Fill Rate (Billion pixels/sec): 10.8.
 RAMDACs (MHz): 400.
 Custom Cooling Solution

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6.1.15 Non Rotating Solid State Memory

Figure 6-16 2.5‖, SATA, Industrial Flash Drive

6.1.15.1 2.5”, SATA, Industrial Flash Drive

SMART Modular Technologies’ XceedLite

SATA SSD product line offers the industry's
lowest power consumption for rugged, low cost
data storage applications. Ideally suited for
HDD replacement in systems that require high
reliability storage in a low profile (H-5mm x W-

68.9 x L-100.25) package, the industrial grade
XceedLite is suited for use as rugged, reliable
boot drives in a wide range of communications
applications including mobile and embedded
computing, medical, automotive, and industrial.

The XceedLite features enhanced reliability as
a result of advanced on-board error detection
as well as correction and comprehensive wear
leveling algorithms that provide consistent
operation throughout the product life cycle.

Compatibility

 Serial ATA: High-speed serialized AT

attachment, revision 1.0a, Serial ATA working
group.

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Performance

 Burst Read/Write: 150MB/sec.
 Sustained Read: up to 40MB/sec.
 Sustained Write: up to 25MB/sec.
 Access time:.2ms (typical).

Physical

 Form factor: 2.5‖.
 Dimensions (mm): 100.25 (L) x 68.9 (W) x 5

(H).

 Weight: 0.1kg (16GB).

Environmental

 Operating temperature.

 Industrial grade: 0ºC to +70ºC.
 Industrial temp: -40ºC to +85ºC.

 Storage temperature: -65ºC to +150ºC.
 Humidity: 5% to 95%.
 Operating altitude: up to 80,000 ft.
 Operating shock: 50G peak @ 2ms.
 Operating vibration: 15G peak to peak.

Power

 Input voltage: 5.0V ± 5%.
 Typical consumption.

 Idle: 60mA.
 Sustained Read/Write: 110mA/130Ma.

Compliance

CE, UL, EN 55022 Class B, CISPR 22 Class B,
AS/NZS 3548 Class B, BSMI CNS 13438
Class B, CAN/CSA-V-3/2001.04 (VCCI), FCC
Part 15 Class B, EN 61000-3-2, EN 61000-3-3,
IEC 61000-4-2/3/4/5/6/8/11.

Reliability

 MTBF:>2 million operating hours.
 EDC/ECC: 32-bit Reed-Solomon.
 Bit Error Rate (BER)<10-14.
 Built-in power-up self-test (BIT).
 Manual and automatic self-diagnostics.
 Data integrity under power-cycling.

Endurance

 Read unlimited
 2,000,000 write/erase cycles

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 Dynamic wear-leveling
 10 years data retention

6.2 Power Management

Modern motherboards provide Advanced
Configuration and Power Management
Interface (ACPI) settings such as wake-up,
power button function and standby/suspend
timers. These functions are configured in the
CMOS Setup. (Section 8-4 BIOS Setup).

6.2.1 Power Supply

Two 300W DC power supply modules are
supplied.

 One 300W DC module will supply power solely

to the .backplane ATX connector.

 The second 300W DC module will supply all

other power requirements. Including power
supply to auxiliaries such as: Fans, HD, etc.

6.2.2 Power Supply Components

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Figure 6-17 Zippy Power Supply

Output Wattage

 300W.

Dimension

 225.00x100.00x40.50mm.
 8,85x3.94x1.59‖ inch.

DC Input Spec

 Voltage: DC20V~28V

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 Input Current: 20.0A (RMS) for 24VDC.

Inrush Current: 20.0A Max.

 Temperature range: operating 10℃～40℃.
 Humidity:operating:20%-95%, non-

operating:10%-95%.

 Remarks: 85% is normal condition and 95% is

with special coating process.

 Hold up time1.6ms minimum at full load &

nominal input voltage.

 Dielectric withstand: input/output 1500 vac for

1 second.

 Input to frame ground 1500 vac for 1 second.
 Efficiency: 65% typical at full load*power good

signal: on delay 100ms to 500ms.

 Overload Protection：130±20%.
 Over Voltage Protection: +5v→5.5v～7.0v ,

+3.3v→4.0v～4.5v.

 Short Circuit Protection: +5v、+12v、+3.3v.
 Emi Noise Filter :fcc class a, cispr22 class a.
 Safety : ul 60950, csa 22.2 iec60950, tuv

en60950.

 Remote on/off Control.
 The unit shall accept a logic open collector

level which will disable/enable all the output
voltage (exclude +5v stand by).

 As logic level is low, outputs voltage were

enable.

 As logic level is high, outputs voltage were

disable.

 Cooling :two 40mm dc fans.

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6.3 COTS 28 Vin Filter

Figure 6018 Vin Filter

The M-FIAM5 is a DC front-end module
that provides EMI filtering and transient
protection. The M-FIAM5 enables designers
using Vicor’s Maxi, Mini, Micro Series 24 V
DC-DC converters to meet conducted
emission/ conducted susceptibility per
MIL-STD-461E; and input transients per
MIL-STD-704E/F. The M-FIAM5 accepts an
input voltage of 14 – 36 Vdc and delivers
output current up to 20 A.

6.3.1 Vin Filter Features

• Transient protection-MIL-STD-704E/F.

• Environments-MIL-STD-810, MIL-STD- 202.

• Environmental stress screening.

• Low profile mounting options.

• Output current up to 20 A.

• Mini sized package.

• Inrush current limiting.

• Reverse polarity protection.

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Chapter 3

Procedures.

Electronically distributed. Subject to user discretion when printed.

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7 Procedures

The procedures within this Chapter contain
relevant information to ensure the SV-4103-X4
maintains its maximum performance potential.

7.1 SV-4103-X4 Startup

1. Check to make sure that all the cables are
seated and connected correctly to the back of
the unit such as keyboard, mouse, monitor
video cable and both power cables.

2. Then Press the power switch ON to start the
computer (power switch is located in the front
of the unit)

3. Once the unit starts, System will go thru Power
On self Test (POST) (no action is required at
this time)

4. At windows dialog box press Ctrl+Alt+Delete
at once to login

5. Type in the correct user name and password
and then press enter to login

6. Once the operator is logged on to the unit they
could use the computer as they wish.

NOTE: Assuming the SV-4103-X4is not
connected to any network.

7.2 SV-4103-X4 Shutdown

1. The operator needs to save all data, and then
close all applications.

2. Once all data is saved and applications are
closed, click on Start menu, select shutdown
and then click OK to shutdown the computer.

NOTE: Holding down the front panel “on”
switch for two (2) seconds shuts down the
machine it does not save files. This is an

immediate power off switch.

7.2.1.1 Passwords

In most cases a user (startup) password and a
supervisor (setup) password can be set in the
CMOS. When a Setup password is required,

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the computer will prompt for it when you try to
access the BIOS setup. When a Startup
password is configured, the computer will
prompt for it at every startup.

The CMOS password can be reset by shorting
the "CMOS restore to factory defaults jumper"
or by temporarily removing the CMOS battery.

8 Identifying Server Components Using Device Manager

The Device Manager is one of Windows' most
useful diagnostic tools. It lets you see all of the
devices attached to your computer, and which
resources they are each using. To access the
Device Manager do the following:

1. Click Start, point to Settings, and then click

Control Panel. (Figure 8-1).

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Figure 8-1 Control Panel

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2. Double-click the System icon. (Figure 8-2).

Figure 8-2 System Properties

3. Click the Hardware tab, and then click the

Device Manager button. (Figure 8-3).

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Figure 8-3 Device Manger

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After opening Device Manager, you will see a
list of all the devices Windows detected on
your system. The Device Manager display is
recreated each time the computer is started, or
whenever a dynamic change to the computer
configuration occurs, such as addition of a new
device while the system is running.

NOTE: To include hidden devices, on the
View menu, click Show hidden devices. A
check mark next to Show hidden devices
indicates hidden devices are showing.
Click it again to clear the check mark.
Hidden devices include non-PnP devices
and devices that have been physically
removed from the computer but have not
had their drivers uninstalled.

The devices shown represent the computer's
current hardware configuration information.
Any non-functioning devices are displayed with
an exclamation point, indicating that a problem
exists with the device; disabled devices are
displayed with a small red "x" over the icon.

You can use Device Manager to enable or
disable devices, troubleshoot devices, update
drivers, use driver rollback, and change
resources such as interrupt requests (IRQs)
assigned to devices.

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8.1 Working with Device Properties

To display a device's properties do the
following:

1. Access the Device Manager as described in
steps 1 through 3. (Figure 8-4).

Figure 8-4 Device Manager

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2. In the Device manager dialog box (Figure4-4\),
double-click the device, or select the device
and then click the Properties toolbar button.
(Figure 8-5).

Figure 8-5 Properties Dialog Box

In the device's Properties dialog box, there
might be several tabs. You can view the status
and configuration information, as well as the
device manufacturer, device type, and location
in the upper portion of the General tab.

The Device status box in the middle of the
General tab displays the status of the device,
including any errors. If the device has any
problems, the Device Status box briefly
describes the problem, and usually describes
the appropriate course of action to correct the
problem.

3. Click Troubleshoot... to use the built-in
mechanisms for detecting the nature of the
problem.

Other tabs include the Driver tab, which
displays the details of the driver being used.

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This tab also lets you update or uninstall the
driver. The Resources tab displays the
hardware resources being used. This tab
allows you to see and resolve any conflicts
caused by non-PnP devices. Along with these
tabs, some devices have additional advanced
settings or tabs for device-specific settings.

8.2 Installing and Removing Hardware in Windows

Plug and Play (PnP) is a standard that makes
installing new hardware devices easier. Prior to
PnP, installing new hardware meant finding
and installing peripheral drivers and making
sure the new device didn't conflict with another
device. Theoretically, if you have a computer
designed for PnP and are using a PnP
operating system (like Windows), installing a
printer, sound card, modem, or other peripheral
is a simple matter of plugging in the device.

It's not always quite this simple. Assuming you
are using a PnP computer, when you attach a
PnP device, you may see a message indicating
that Windows has recognized the new device­either immediately or the next time you start up
your system. If Windows needs a driver that is
not currently installed, you may at that point be
asked to insert a disk or the Windows CD­ROM. If you don't see a message but the
device appears to be working, you can assume
that everything is fine.

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8.2.1 Using the Add New Hardware Wizard

If the device is not working properly, try using the
Add New Hardware Wizard. To run this wizard, do
the following:

1. From the Start menu, point to Settings and then
click Control Panel. (Figure 8-6).

Figure 8-6 Control Panel

2. Double-click the Add Hardware icon. (Figure
8-7).

Figure 8-7 Add Hardware Wizard

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8.3 Installing Legacy Peripherals

When you install what Microsoft calls a legacy
peripheral, you will need to use the Add
Hardware Wizard, as described to let Windows
know about the new device.

NOTE: The term legacy refers to anything
that's no longer on the cutting edge.

8.3.1 Removing Legacy Peripherals

When removing a legacy peripheral from your
system, you need to let Windows know that the
device is gone. This enables Windows to reuse the
resources (places in memory and internal
communications channels) that it previously
allocated to that device.

To tell Windows that you have removed a legacy
device, perform the following steps:

1. From the Start menu, point to Settings and then
click Control Panel. (Figure 8-8).

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Figure 8-8 Control Panel

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2. Double-click the System icon. (Figure 8-9).

Figure 8-9 System Properties

3. Click the Hardware tab.

4. Click the Device Manager button. (Figure 8-

10).

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Figure 8-10 Device Manager

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5. Click the name of the item you have removed from
your system. If you don't see the item, look for a
category heading that describes the type of device
you removed, and then click the plus sign to its left
to display a list of items in that category.

6. From the Action menu, click Uninstall.

7. Click OK.

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8.4 TAG Approved BIOS

The BIOS (basic input/output system) is the
program stored on the CMOS that the server's
microprocessor uses to get the system started
after you turn it on. The BIOS also manages
data flow between the computer's operating
system and attached devices such as the hard
disk, video adapter, keyboard, and mouse.

CAUTION: The server's hardware and

software was loaded and tested with a
specific "BIOS" version. If you desire to
have the BIOS updated, consult TAG
technical support in advance as updates to
your approved BIOS may cause your
system to become unstable or inoperable.

8.4.1 BIOS Configuration for Nightvision

Enter BIOS by pressing Delete when prompted
in POST. Once the BIOS Configuration Utility
has been entered scroll to the exit tab using
the arrow keys. Under the exit menu option
select ―Load Optimal Defaults‖ when prompted
select OK to load optimal defaults. Scroll back
to the Main menu and ensure that all of the
settings seen in the screenshots below are set.
Upon exit ensure that settings are saved upon
exit.

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1. On the Main BIOS System Overview screen
ensure System Time and Date are correct,
Press Enter. (Figure 8-11).

Figure 8-11 System Overview

2. On the Advanced Settings screen select CPU
Configuration. Press Enter. (Figure 8-12).

Figure 8-12 CPU Configuration Screen

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3. On the CPU Configuration screen, No
Change, Press Enter. (Figure 8-13).Then

press Escape to return to Advanced Settings
screen

Figure 8-13 Advanced CPU Settings

4. On Advanced BIOS screen Scroll down to IDE
Configuration, Press Enter. (Figure 8-14).

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Figure 8-14 IDE Configuration

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5. No Change required for IDE Configuration,
Press Enter. Then press Escape to return to

Advanced Settings screen. (Figure 8-15).

Figure 8-15 IDE Configuration

6. On Advanced Settings screen Scroll down to
Floppy Configuration, Press Enter. (Figure

8-16).

Figure 8-16 Floppy Configuration Page

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7. On Advanced Settings screen Scroll down to
IDE Configuration, Press Enter. (Figure 817).

Figure 8-17 IDE Configuration Page

8. No Change required for IDE Configuration,
Press Enter. Then press Escape to return to
Advanced Settings screen. (Figure 8-18).

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Figure 8-18 IDE Configuration Page

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9. On Advanced Settings screen Scroll down to
Floppy Configuration, Press Enter. (Figure 8-

19)..

Figure 8-19 Floppy Configuration Page

10. On the Floppy Configuration page, change
Floppy A to [Disabled]. Press Enter. Then

press Escape to return to Advanced Settings
screen. (Figure 8-20).

Figure 8-20 Floppy Configuration Page

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11. On Advanced Settings screen Scroll down to
SuperIO Configuration, Press Enter. (Figure

8-21).

Figure 8-21 Super IO Configuration Page

12. On the Super IO Configuration Page, no

changes are necessary. (Figure 8-22).
Then press Escape to return to Advanced

Settings screen.

Figure 8-22 Super IO Configuration Page.

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13. On Advanced Settings screen Scroll down

to ACPI Configuration, Press Enter.
(Figure 8-23).

Figure 8-23 ACPI Configuration Page

14. On the ACPI Configuration Page, change

Power Supply Shutoff to [Auto]. (Figure
8-24). Then press Escape to return to
Advanced Settings screen.

Figure 8-24 ACPI Configuration Page

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15. Scroll down to ACPI AFIC Support and

press Enter. On the South Bridge ACPI
Configuration Page, no changes are
necessary. (Figure 8-25). Then press
Escape to return to Advanced Settings
screen.

Figure 8-25 South Bridge ACPI Configuration Page

16. On Advanced Settings screen Scroll down

to ACHI Configuration, Press Enter.
(Figure 8-26).

Figure 8-26 ACHI Configuration Page

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17. No Change on the ACHI Configuration

page (Figure 8-27). Then press Escape to
return to Advanced Settings screen.

Figure 8-27 ACHI Configuration Page

18. On Advanced Settings screen scroll down

to SMBIOS Configuration, Press Enter.
(Figure 8-28).

Figure 8-28 SMBIOS Configuration Page

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19. On the SMBIOS Configuration Page, no

changes are necessary. (Figure 8-29).
Then press Escape to return to Advanced

Settings Screen.

Figure 8-29 SMBIOS Configuration Page

20. On Advanced Settings screen scroll down

to Remote Access Configuration, Press
Enter. (Figure 8-30).

Figure 8-30 Remote Access Configuration Page

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21. On the Remote Access Configuration

Page, no changes are necessary. (Figure
8-31). Then press Escape to return to

Advanced Settings screen.

Figure 8-31 Remote Access Configuration Page

22. On Advanced Settings screen scroll down

to Trusted Computing, Press Enter.
(Figure 8-32).

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Figure 8-32 Trusted Computing Page

23. No Change on the Trusted Computing

page (Figure 8-33). Then press Escape to
return to Advanced Settings screen.

Figure 8-33 Trusted Computing Page

24. On Advanced Settings screen Scroll down

to MPS Configuration, Press Enter.
(Figure 8.34).

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Figure 8-34 MPS Configuration Page

25. No Change on the MPS Configuration

page (Figure 8-35). Then press Escape to
return to Advanced Settings screen.

Figure 8-35 MPS Configuration Page

26. No Change on the MPS Configuration

page (Figure 8-36). Then press Escape to
return to Advanced Settings screen.

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Figure 8-36 MPS Configuration Page

27. On Advanced Settings screen scroll down

to USB Configuration, Press Enter.
(Figure 8-37).

Figure 8-37 USB Configuration Page

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28. No Change on the USB Configuration

page (Figure 8-38). Then press Escape to
return to Advanced Settings screen.

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Figure 8-38 USB Configuration Page

29. On Advanced Settings screen, scroll

across to PCI/PnP and Press Enter.
(Figure 8-39).

Figure 8-39 PCI/PnP Screen

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30. On the PCI/PnP Page, scroll down to Plug

& Play O/S and press Enter. On the Pop

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up screen select YES and press Enter.
(Figure 8-40).

Figure 8-40 Plug & Play Configuration Popup Screen

31. On PCI/PnP screen, Scroll down to

Onboard VGA Controller, Press Enter.

(Figure 8-41).

Figure 8-41 Onboard VGA Controller Screen

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32. On the Onboard VGA Controller screen.

Select Onboard VGA Controller. Then
Press Enter. (Figure 8-42).

Figure 8-42 Onboard VGA Controller Screen

33. On Onboard VGA Controller Popup

screen. Select Disabled, Press Enter.
(Figure 8-43).

Figure 8-43 Onboard VGA Controller Popup Screen

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34. On the PCI/PnP screen, scroll across to the

BOOT tag and press Enter. Then select
Quiet Boot and press Enter. (Figure 8-44).

Figure 8-44 Boot Setting Configuration Screen

35. On the Boot Settings Configuration

Popup screen, select Disabled. Press
Enter. (Figure 8-45). Then press Escape to
return to Boot Setup screen.

Figure 8-45 Boot Settings Configuration Popup Screen

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36. On the Boot Settings screen, select Boot

Settings Configuration. Press Enter.

(Figure 8-46).

Figure 8-46 Boot Settings Screen

37. On the Boot Settings Configuration

screen, select Quick Boot. No changes
are necessary. Press Enter to return to the

Main Boot screen. (Figure 8-47).

Figure 8-47 Boot Settings Configuration Screen

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38. On the Boot Settings screen, scroll down

and select Boot Device Priority. Press

Enter. (Figures 8-48).

Figure 8-48 Boot Device Priority Screen

39. On Boot Device Priority screen the boot

order should be: [HDD:PM-SMART
XCEED], [Network:IBA GE Slo], and
[Network:IBA GE Slo].. (Figure 8-49).

Press Escape to return to Boot Settings
screen.

Figure 8-49 Boot Device Priority Screen

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40. On Boot Settings screen scroll down to

Hard Drive Priority, Press Enter. (Figure

8-50).

Figure 8-50 Boot Settings Screen

41. On the Hard Disk Drives Page, no

changes are necessary. Press Escape to
return to the Boot Settings screen. (Figure
8-51).

Figure 8-51 North Bridge Configuration Screen

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42. On the Boot Settings screen scroll across

to Security. No changes are necessary.
(Figure 8-52).

Figure 8-52 Security Screen

43. Scroll across to the Chipset tab and press

Enter. Select South Bridge Chipset
Configuration. Press Enter. (Figure 8-53).

Figure 8-53 South Bridge Chipset Configuration Screen

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44. On the South Bridge Configuration

screen select Onboard LAN Boot ROM.

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Press Enter. On the popup screen select

Enabled and press Enter. Then press
Escape to return to the Chipset screen.

(Figure 8-54).

Figure 8-54 Onboard LAN Boot ROM Screen

45. On Chipset screen scroll down to ESB2

PCI-X Hub Configuration. Press Enter.

(Figure 8-55).

Figure 8-55 ESB2 PCI X Hub Configuration Screen

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46. On ESB2 PCI-X Hub Settings screen. No

changes are necessary. (Figure 8-56).
Press Escape to return to Chipset screen.

Figure 8-56 ESB2 PCI X Hub Settings Screen

47. Scroll over to the Exit tab and press Enter.

Select Save Changes and Exit. Then
press Enter. (Figure 8-57).

Figure 8-57 Save Changes and Exit Screen

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48. Select OK on the Popup screen and Press

Enter. (Figure 8-58).

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Figure 8-58 Save Configuration Screen

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CONTACT

8.4.2

22355 TAG Way
Dulles, VA 20166
Tel: [phone]

www.tag.com

Technical Support

USA 1-800-824-7693
Outside USA

While every precaution has been taken
to ensure the accuracy and completeness
of this literature. TAG assumes
no responsibility and disclaims and liability
for damage resulting from use of this information
or for any errors or omissions.