TAG SV-4002-X2 Operation Manual

TAG

22355 TAG Way

Dulles, VA 20166

4U Quad Core Xeon Server

SV-4002-X2

Operations Manual

Operations Manual

1 Copyright © 2008 Technology Advancement Group®, Inc.

(TAG®)

All rights reserved. This publication and its contents are proprietary to TAG. No part of
this publication may be reproduced in any form or by any means without the written
permission of TAG, 22355 TAG Way, Dulles, Virginia 20166-9310.

TAG has made every effort to ensure the correctness and completeness of the material
in this document. TAG shall not be liable for errors contained herein. The information in
this document is subject to change without notice. TAG makes no warranty of any kind
with regard to this material, including, but not limited to, the implied warranties of
merchantability and fitness for a particular purpose.

1.1 Trademarks

All trademarks, marks, names, or product names referenced in this publication are the
property of respective owners, and TAG neither endorses nor otherwise sponsors any
such products or services referred to herein.

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2 About TAG

2.1 Summary of Qualifications

TAG has served as a leading provider of IT solutions to DoD customers over the past
20+ years and has a long-standing and respected history of providing Systems
Engineering, Electronic Equipment and Program Management support to US Military
warfighters. Headquartered in Dulles, Virginia, TAG’s state-of-the-art 35,000 sq. ft.
engineering and manufacturing facility provides all the infrastructure, equipment, and
manpower necessary to engineer, design, test, manufacture, and certify products to the
rugged requirements of the tactical combat theater. Our facilities in Dulles, VA, San
Diego, CA, and St. Louis, MO, allow for rapid deployment of products and support
across the globe.

TAG quickly, efficiently, and cost-effectively tailors rugged solutions for large DoD
programs with specific MIL-STD requirements. TAG’s comprehensive Quality
Assurance (QA) policy – enforced through application of our UL-registered ISO
9001:2000 certified processes – enables TAG to rapidly deploy systems and solutions
that reliably withstand the stresses of the tactical environment. Today, there are over
20,000 TAG systems deployed across various weapons platforms throughout the US
Military. TAG effectively balances all corporate assets – our people, expertise,
infrastructure, and experience – to consistently and successfully execute and deliver to
the DoD.

TAG’s success lies in focusing on the
corporate Mission Statement and leveraging
the tenets of our business model to ensure
the customer’s expectations are exceeded
throughout lengthy program lifecycles.

TAG’s Mission is to resolve our customers’ IT

challenges with World-Class:

 Engineering;
 Manufacturing and Integration; and

 Lifecycle Management

TAG has a proven track record in
implementing these tenets to serve as a trusted advisor to our Government customers.
TAG uses this foundation to ensure risk is mitigated, expectations are exceeded, and
the customer can consistently rely on the company, our equipment, and our services.

SV-4002-X2

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2.2 Core Competences

2.2.1 Engineering

TAG’s engineering methodology is built upon Multi-Disciplinary Optimization (MDO) and
rigorous design reviews. Although PMs drive the schedule at TAG, Engineering
leverages Computer-Aided Design (CAD) tools, Computational Fluid Dynamics (CFD)
modeling, rapid prototyping processes, and diverse test equipment and facilities to
ensure requirements are being met at every step of the design. TAG Engineering
follows a proven design-review process, ensuring all entrance and exit criteria are met
at each stage. Rigorous documentation is compiled to demonstrate requirement
compliance, risks are mitigated, and decisions are prudent – throughout the design
process.

TAG prides itself on its engineering
laboratories and facilities. Over the past
three years, TAG has invested in several
pieces of equipment that allow TAG to test
and certify products directly onsite to the
harshest environmental requirements of
military standards – including the MIL-STD­810F and DO 160D.

TAG’s onsite test equipment currently

includes a Highly Accelerated Lifecycle
Testing (HALT) Chamber, an
Electromagnetic Interference (EMI) test chamber, and a high-/low-temperature thermal
test chamber. TAG’s facility also provides:

 A floor plan designed to support a cellular manufacturing model with modular

assembly lines

 A dedicated 24-hour system burn-in room
 A modern production status tracking and Enterprise Resource Planning (ERP)

system with external web collaboration capabilities

 Dedicated Quality Assurance workstations for system compliance and validation

inspection

2.2.2 Manufacturing and Integration

TAG implements Cellular Manufacturing processes through our compartmentalized,
state-of-the-art production facility to minimize waste byproducts and maximize
production efficiency. TAG’s manufacturing facility is physically partitioned to model the
major philosophies of Lean Manufacturing. Consistent with the model, each of TAG’s
production cells are capable of operating in isolation; however personnel and tools are

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shared across all cells to streamline manufacturing operations, costs, and the
production/integration scheduling. TAG’s floor technicians are cross-trained in multiple
disciplines so they can be redistributed to any cell that encounters production
bottlenecks, which ensures optimal efficiency.

2.2.3 Lifecycle Management

TAG’s world-class Program Management discipline models the renowned
methodologies of the Project Management Institute (PMI) to ensure successful
completion of the task at hand. Our Program Managers (PMs) serve as the voice of the
customer – driving requirements to which the rest of TAG’s organization answers. As

an explicit tenet of TAG’s corporate mission statement, the PMs not only track cost,
schedule, and technical compliance throughout a project’s period of performance, but

also ensure the customer is supported well beyond it.

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Date

Version

Number

Updated By

Description of

Changes

09/09/2010

1.0

Alan Huckerby

Author

Operations Manual

Document Revision History

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3 About This Manual

3.1 Scope and Audience

This Manual provides an introductory overview
of the SV-4002-X2. Designed to endure the
rigors of harsh environments, this device can
withstand shock and vibration, high and low
temperatures. All of our devices are based on
the latest Intel and AMD technology. Also, this
device doesn't use Intel Core Due or Pentium
M technology (only THS servers).

. Configuration options include extended
memory and enhanced video optimization. All
of our servers are backed by our world-class
lifecycle management and post sales support.

3.1.1 Organization:

 Chapter 1 Provides Cautions and Warnings.
 Chapter 2 Provides operational information.
 Chapter 3 Contains all relevant Procedures.
 Appendix CDW.

This manual is divided into the following
chapters:

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Table of Contents

Contents

1 Copyright © 2008 Technology Advancement Group®, Inc. (TAG®) ............................ 2

1.1 Trademarks ............................................................................................................ 2

2 About TAG ................................................................................................................... 3

2.1 Summary of Qualifications ...................................................................................... 3

2.2 Core Competences ................................................................................................. 4

2.2.1 Engineering ....................................................................................................... 4

2.2.2 Manufacturing and Integration ........................................................................... 4

2.2.3 Lifecycle Management ...................................................................................... 5

3 About This Manual ....................................................................................................... 7

3.1 Scope and Audience .............................................................................................. 7

3.1.1 Organization: ..................................................................................................... 7

4 Safety Instructions ....................................................................................................... 12

4.1 Types of Warnings used in this Manual .................................................................. 12

4.1.1 Safety Symbols and Labels ............................................................................... 12

4.1.2 Conventions ...................................................................................................... 12

5 SV-4002-X2 Overview ................................................................................................. 15

5.1 Product Information ................................................................................................ 15

5.2 SV-4002-X2 ............................................................................................................ 16

5.2.1 SV-4002-X2” Specifications .............................................................................. 17

5.2.2 SV-4002-X2 Components ................................................................................. 17

5.2.3 Server Board ..................................................................................................... 19

5.2.4 Server Board Feature Location ................................................................ ......... 22

5.3 Host Bus Adapter ................................................................................................... 23

5.3.1 Hot Bus Adapter Specifications ......................................................................... 23

5.4 Power Management ............................................................................................... 25

5.4.1 Power Supply .................................................................................................... 25

5.4.2 Power Supply Components ............................................................................... 25

6 Procedures .................................................................................................................. 28

6.1 SV-4002-X2 Startup ............................................................................................... 28

6.2 SV-4002-X2 Shutdown ........................................................................................... 28

7 Identifying Server Components Using Device Manager ............................................... 29

7.1 Working with Device Properties .............................................................................. 32

7.2 Installing and Removing Hardware in Windows...................................................... 34

7.2.1 Using the Add New Hardware Wizard ............................................................... 35

7.3 Installing Legacy Peripherals .................................................................................. 36

7.3.1 Removing Legacy Peripherals .......................................................................... 36

7.4 TAG Approved BIOS .............................................................................................. 40

7.4.1 BIOS Configuration for SV-4002-IX ................................................................... 41

8 APPENDIX CDW ......................................................................................................... 52

SV-4002-X2

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List of Figures

Figure 5-1 SV-4002-X2 ................................................................................................. 15

Figure 5-2 SV-4002-X2 (Front View) ............................................................................. 16

Figure 5-3 SV-4002-X2 (Rear View).............................................................................. 16

Figure 5-4 Server Board. ............................................................................................... 20

Figure 5-5 Server Board Layout .................................................................................... 21

Figure 7-1 Control Panel. .............................................................................................. 29

Figure 7-2 System Properties. ....................................................................................... 30

Figure 7-3 Device Manger ............................................................................................. 30

Figure 7-4 Device Manager ........................................................................................... 32

Figure 7-5 Properties Dialog Box .................................................................................. 33

Figure 7-6 Control Panel. .............................................................................................. 35

Figure 7-7 Add Hardware Wizard .................................................................................. 36

Figure 7-8 Control Panel. .............................................................................................. 37

Figure 7-9 System Properties. ....................................................................................... 38

Figure 7-10 Device Manager. ........................................................................................ 38

Figure 7-11 BIOS Setup. ............................................................................................... 41

Figure 7-12 Quiet Boot Disable Screen. ........................................................................ 41

Figure 7-13 Main Page Screen. .................................................................................... 42

Figure 7-14 Advanced Feature Screen. ........................................................................ 42

Figure 7-15 Delay Prior to Thermal. ................................ .............................................. 43

Figure 7-16 Advanced BIOS Features Screen. ............................................................. 43

Figure 7-17 Advance Screen. ........................................................................................ 44

Figure 7-18 ATA Controller Configuration Screen. ........................................................ 44

Figure 7-19 Serial Port Configuration Screen. ............................................................... 45

Figure 7-20 Serial Port Configuration Screen. ............................................................... 45

Figure 7-21 USB Configuration Screen. ........................................................................ 46

Figure 7-22 USB Configuration Screen. ........................................................................ 46

Figure 7-23 PCI Configuration Screen. ......................................................................... 47

Figure 7-24 System Acoustic and Performance Configuration Screen.......................... 47

Figure 7-25 Integrated Peripherals Screen. .................................................................. 48

Figure 7-26 Onboard Device Screen. ............................................................................ 48

Figure 7-27 Boot Options Screen. ................................................................................. 49

Figure 7-28 Integrated Peripherals Screen. .................................................................. 49

Figure 7-29 IPO INTEL SSDSA2M040G2GC Screen. .................................................. 50

Figure 7-30 Boot Manager Screen. ................................................................ ............... 50

Figure 7-31 Save and Reset Popup Menu Screen. ....................................................... 51

Figure 8-1 CDW ASSY-4U X2 ....................................................................................... 53

Table 5-1 Server Board Features (1)............................................................................. 19

Table 5-2 Server Board Features (2)............................................................................. 20

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Table 5-3 Server Board Feature Location. .................................................................... 22

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Chapter 1

Cautions and Warnings.

Electronically distributed. Subject to user discretion when printed.

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DANGER

WARNING

CAUTION

These warnings and
cautions indicate situations
or practice that might
result in property damage.

Operations Manual

4 Safety Instructions

4.1 Types of Warnings used in this Manual

Read this manual thoroughly, paying special attention to the cautions and warnings.

4.1.1 Safety Symbols and Labels

4.1.2 Conventions

4.1.2.1 Important Messages

4.1.2.2 Warnings

Important messages appear where
mishandling of components is possible or when
work orders can be misunderstood. These
messages also provide vital information
associated with other aspects of system

operation. The word “important” is written as

“IMPORTANT,” both capitalized and bold and

is followed by text in italics. The italicized text
is the important message.

Warnings appear where overlooked details
may cause damage to the equipment or result
in personal injury. Warnings should be taken
seriously. Warnings are easy to recognize. The

word “warning” is written as “WARNING,” both

capitalized and bold and is followed by text in

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italics. The italicized text is the warning
message.

4.1.2.3 Cautions

Cautionary messages should also be heeded
to help you reduce the chance of losing data or
damaging the system. Cautions are easy to

recognize. The word “caution” is written as

“CAUTION,” both capitalized and bold and is

followed by text in italics. The italicized text is the

cautionary message.

4.1.2.4 Notes

Notes inform the reader of essential but non­critical information. These messages should be
read carefully as any directions or instructions
contained therein can help you avoid making
mistakes. Notes are easy to recognize. The

word “note” is written as “NOTE,”

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Chapter 2

SV-4002-X2

.

Electronically distributed. Subject to user discretion when printed.

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5 SV-4002-X2 Overview

5.1 Product Information

Figure 5-1 SV-4002-X2

The SV-4002-X2 sets the standard for Servers
with state-of-the-art technology. The newest
Server can stand up to the harshest
environments, and is designed specifically to
be fully customized to support unique, mission­critical applications.

Your system may contain components not
described in this User Manual. For detailed
information on these components, refer to the
manufactures website or contact TAG
Technical Support at [e-mail].

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5.2 SV-4002-X2

Figure 5-2 SV-4002-X2 (Front View)

Figure 5-3 SV-4002-X2 (Rear View).

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5.2.1 SV-4002-X2” Specifications

TAG SV-4002-X2, 4U Quad Core Xeon Server
Chassis

 4U Heavy-duty Aluminum rack-mount chassis.
 6.97"H x 13.23"W x 17.31"L.

Hot-swap, Redundant P/Supplies
(accepts power sources world-wide).

Intelligent Fan Controller
Intel Xeon low voltage L5408 Quad Core

Processor 1

 2.13GHz, 12MB cache

Intel® Server Board

 Eight-Port 6Gb/s PCI Express SATA+SAS

Host Bus Adapter

4GB DDR2 RAM (8GB total)

 Operating System: MS Windows Server

2003.

I/O Ports:

 (2) Ethernet Ports. (Rear Panel

Accessible).

 2) High-Speed 6Gb/s Ports,
 (2) USB 2.0 ports. (Front Panel

Accessible).

 (4) USB 2.0 ports. (Rear Panel Accessible).

 (1) DB9 COMM Serial Port (Front Panel

Accessible)

 PS/2 keyboard and mouse port. (Rear

Panel Accessible).

5.2.2 SV-4002-X2 Components

This section provides an overview of the most
common components installed in the SV-4002­X2. Information is also provided on how to
identify specific components within your SV-

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