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SV-2001-THS Computer Operations Manual 273-MNL-001 P/N 1008775
Operations Manual
1 Copyright © 2009 Technology Advancement Group (TAG)
All rights reserved. This publication and its contents are proprietary to TAG. No part of this publication may be reproduced in any form or by any means without the written permission of TAG, 22355 TAG Way, Dulles, Virginia 20166-9310.
TAG has made every effort to ensure the correctness and completeness of the material in this document. TAG shall not be liable for errors contained herein. The information in this document is subject to change without notice. TAG makes no warranty of any kind with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose.
1.1 Trademarks
All trademarks, marks, names, or product names referenced in this publication are the property of respective owners, and TAG neither endorses nor otherwise sponsors any such products or services referred to herein.
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2 About TAG
2.1 Summary of Qualifications
TAG has served as a leading provider of IT solutions to DoD customers over the past 20+ years and has a long-standing and respected history of providing Systems Engineering, Electronic Equipment and Program Management support to US Military warfighters. Headquartered in Dulles, Virginia, TAG’s state-of-the-art 35,000 sq. ft. engineering and manufacturing facility provides all the infrastructure, equipment, and manpower necessary to engineer, design, test, manufacture, and certify products to the rugged requirements of the tactical combat theater. Our facilities in Dulles, VA, San Diego, CA, and St. Louis, MO, allow for rapid deployment of products and support across the globe.
TAG quickly, efficiently, and cost-effectively tailors rugged solutions for large DoD programs with specific MIL-STD requirements. TAG’s comprehensive Quality Assurance (QA) policy – enforced through application of our UL-registered ISO 9001:2000 certified processes – enables TAG to rapidly deploy systems and solutions that reliably withstand the stresses of the tactical environment. Today, there are over 20,000 TAG systems deployed across various weapons platforms throughout the US Military. TAG effectively balances all corporate assets – our people, expertise, infrastructure, and experience – to consistently and successfully execute and deliver to the DoD.
TAG’s success lies in focusing on the
corporate Mission Statement and leveraging the tenets of our business model to ensure
the customer’s expectations are exceeded
throughout lengthy program lifecycles.
TAG’s Mission is to resolve our customers’ IT
challenges with World-Class:
Engineering; Manufacturing and Integration; and Lifecycle Management
TAG has a proven track record in implementing these tenets to serve as a trusted advisor to our Government customers. TAG uses this foundation to ensure risk is mitigated, expectations are exceeded, and the customer can consistently rely on the company, our equipment, and our services.
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2.2 Core Competences
2.2.1 Engineering
TAG’s engineering methodology is built upon Multi-Disciplinary Optimization (MDO) and rigorous design reviews. Although PMs drive the schedule at TAG, Engineering leverages Computer-Aided Design (CAD) tools, Computational Fluid Dynamics (CFD) modeling, rapid prototyping processes, and diverse test equipment and facilities to ensure requirements are being met at every step of the design. TAG Engineering follows a proven design-review process, ensuring all entrance and exit criteria are met at each stage. Rigorous documentation is compiled to demonstrate requirement compliance, risks are mitigated, and decisions are prudent – throughout the design process.
TAG prides itself on its engineering laboratories and facilities. Over the past three years, TAG has invested in several pieces of equipment that allow TAG to test and certify products directly onsite to the harshest environmental requirements of military standards – including the MIL-STD­810F and DO 160D.
TAG’s onsite test equipment currently
includes a Highly Accelerated Lifecycle Testing (HALT) Chamber, an Electromagnetic Interference (EMI) test chamber, and a high-/low-temperature thermal test chamber. TAG’s facility also provides:
A floor plan designed to support a cellular manufacturing model with modular
assembly lines
A dedicated 24-hour system burn-in room A modern production status tracking and Enterprise Resource Planning (ERP)
system with external web collaboration capabilities
Dedicated Quality Assurance workstations for system compliance and validation
inspection
2.2.2 Manufacturing and Integration
TAG implements Cellular Manufacturing processes through our compartmentalized, state-of-the-art production facility to minimize waste byproducts and maximize
production efficiency. TAG’s manufacturing facility is physically partitioned to model the
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major philosophies of Lean Manufacturing. Consistent with the model, each of TAG’s production cells are capable of operating in isolation; however personnel and tools are shared across all cells to streamline manufacturing operations, costs, and the production/integration scheduling. TAG’s floor technicians are cross-trained in multiple disciplines so they can be redistributed to any cell that encounters production bottlenecks, which ensures optimal efficiency.
2.2.3 Lifecycle Management
TAG’s world-class Program Management discipline models the renowned methodologies of the Project Management Institute (PMI) to ensure successful completion of the task at hand. Our Program Managers (PMs) serve as the voice of the customer – driving requirements to which the rest of TAG’s organization answers. As
an explicit tenet of TAG’s corporate mission statement, the PMs not only track cost, schedule, and technical compliance throughout a project’s period of performance, but
also ensure the customer is supported well beyond it.
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Date
Version Number
Updated By
Description of
Changes
08/25/2010
A
Alan Huckerby
Author
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Document Revision History
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3 About This Manual
3.1 Scope and Audience
This manual provides information on the SV­2001-THS Computer. The SV-2001-THS Computer allows for up to 2 cores in a 2U chassis and up to 4GB of RAM. The SV-2001­THS Computer features Core 2 Duo processor to maximize processing performance, while reducing power dissipation.
The SV-2001-THS is ideal for deployable situations where such high density computing minimizes size, weight, and power.
3.1.1 Organization:
This manual is divided into the following chapters and appendix:
Chapter 1 Cautions and Warnings when
handling the SV-2001-THS Computer.
Chapter 2 provides detailed information on the
external and internal Computer components.
Chapter 3 provides procedures for replacing
hot-swappable and LRU components, as well as for replacing or adding system memory.
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Table of Contents
Contents
1 Copyright © 2009 Technology Advancement Group (TAG) .................................................... 2
1.1 Trademarks................................................................................................ ........................ 2
2 About TAG ............................................................................................................................. 3
2.1 Summary of Qualifications ................................................................................................ 3
2.2 Core Competences ............................................................................................................. 4
2.2.1 Engineering ................................................................................................................. 4
2.2.2 Manufacturing and Integration ..................................................................................... 4
2.2.3 Lifecycle Management ................................................................................................ . 5
3 About This Manual.................................................................................................................. 7
3.1 Scope and Audience .......................................................................................................... 7
3.1.1 Organization: ................................ ............................................................................... 7
4 Safety Instructions ................................................................................................................... 13
4.1 Types of warnings used in this manual............................................................................... 13
4.1.1 Safety Symbols and Labels .......................................................................................... 13
4.1.2 Conventions ................................................................................................................. 13
5 Computer Overview ................................................................................................................ 16
5.1 Product Information ........................................................................................................... 16
5.2 SV-2001-THS Computer ................................................................................................... 16
5.2.1 Specifications .............................................................................................................. 17
5.2.2 Additional specifications .............................................................................................. 18
5.2.3 Computer Highlights.................................................................................................... 18
5.2.4 SV-2001-THS Computer ............................................................................................. 18
5.2.5 I/O Connectors............................................................................................................. 19
5.3 Computer Components ...................................................................................................... 19
5.4 SV-2001-THS Computer Motherboard .............................................................................. 20
5.4.1 Connector and Component Locations ........................................................................... 21
5.4.2 Specifications .............................................................................................................. 22
5.5 Serial PCI Card................................ .................................................................................. 24
5.5.1 Specifications .............................................................................................................. 24
5.6 IRIG PCI Card ................................................................................................................... 26
5.6.1 Specifications .............................................................................................................. 26
5.6.2 System hard Drive Specifications................................................................................. 27
5.7 System Memory ................................................................................................................ 28
5.7.1 Identifying System Memory......................................................................................... 28
6 Procedures ................................................................ ............................................................... 30
6.1 Computer Startup .............................................................................................................. 30
6.2 Computer Shutdown .......................................................................................................... 30
6.3 TAG Approved BIOS ........................................................................................................ 30
6.3.1 Common BIOS Settings ............................................................................................... 31
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6.3.2 BIOS Configuration for SV-2001-THS ........................................................................ 35
6.4 Upgrading and Replacing System Components .................................................................. 50
6.4.1 Preventing Static Electricity ......................................................................................... 50
6.5 Power Supply Cable Retention Bracket Installation ........................................................... 51
6.6 Replacing a Hard Drive ..................................................................................................... 53
6.6.1 25” Solid State SATA Hard Drive ............................................................................... 53
6.7 Removing the Computer Cover.......................................................................................... 53
6.8 Adding or Replacing System Memory ............................................................................... 54
6.8.1 Install system memory. ................................................................................................ 55
Appendix ...................................................................................................................................... 56
7 Contract Drawing SV-2001-THS ............................................................................................. 57
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List of Figures
Figure 5-1 SV-2001-THS Computer ..................................................................................... 16
Figure 5-2 SV-2001-THS Computer Components and Connectors. (Front View). .......... 18
Figure 5-3 I/O Connectors (Rear View)................................................................................ 19
Figure 5-4 Computer Motherboard ................................................................ ....................... 20
Figure 5-5 Computer Mother Board Block Diagram. .......................................................... 21
Figure 5-6 Serial PCI Card. ................................................................................................... 24
Figure 5-7 IRIG PCI Card. ..................................................................................................... 26
Figure 6-1 BIOS Setup. ......................................................................................................... 35
Figure 6-2 Standard CMOS Features Screen. .................................................................... 35
Figure 6-3 Main Page Screen. .............................................................................................. 36
Figure 6-4 CPU Feature Screen. ................................................................ .......................... 36
Figure 6-5 Delay Prior to Thermal. ....................................................................................... 37
Figure 6-6 Advanced BIOS Features Screen. ..................................................................... 37
Figure 6-7 Hard Disk Boot Priority Screen. .......................................................................... 38
Figure 6-8 MPS Version Control Screen. ............................................................................. 38
Figure 6-9 Advanced Chipset Features. .............................................................................. 39
Figure 6-10 DRAM Timing Selectable Screen. ................................................................... 39
Figure 6-11 PCI Express Root Port Function Screen. ........................................................ 40
Figure 6-12 PCI Express Port Screen. ................................................................................. 40
Figure 6-13 Integrated Peripherals. ...................................................................................... 41
Figure 6-14 Integrated Peripherals Screen.......................................................................... 41
Figure 6-15 OnChip IDE Device Screen. ............................................................................. 42
Figure 6-16 Integrated Peripherals Screen.......................................................................... 42
Figure 6-17 Onboard Device Screen. ................................................................................... 43
Figure 6-18 Integrated Peripherals Screen. ......................................................................... 43
Figure 6-19 Integrated Peripherals Screen.......................................................................... 44
Figure 6-20 Super I/O Screen. .............................................................................................. 44
Figure 6-21 Power Management Setup Screen. ................................................................. 45
Figure 6-22 Power Management Setup. .............................................................................. 45
Figure 6-23 PCI Express PM Function Screen. .................................................................. 46
Figure 6-24 Power Management Screen. ............................................................................ 46
Figure 6-25 PnP/PCI Configurations Screen. ...................................................................... 47
Figure 6-26 PnP/PCI Configurations Screen. ...................................................................... 47
Figure 6-27 AwardBIOS CMOS Setup Utility Screen. ........................................................ 48
Figure 6-28 PC Health Status Screen. ................................................................................. 48
Figure 6-29 Frequency Control Screen. ............................................................................... 49
Figure 6-30 Frequency Control Screen. ............................................................................... 49
Figure 6-31 Grounding Wrist Strap ....................................................................................... 50
Figure 6-35 25” Solid State SATA Hard Drive. .................................................................... 53
Figure 6-36 DIMM Module Bank ........................................................................................... 55
Figure 7-1 Contract Drawing SV-2001-THS ........................................................................ 57
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List of Tables
Table 5-1 Mother Board Specifications. ............................................................................... 23
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Chapter 1
Cautions and Warnings.
Electronically distributed. Subject to user discretion when printed.
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DANGER
WARNING
CAUTION
These warnings and cautions indicate situations or practice that might result in property damage
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4 Safety Instructions
4.1 Types of warnings used in this manual Read this manual thoroughly, paying special attention to
the cautions and warnings.
4.1.1 Safety Symbols and Labels
4.1.2 Conventions
4.1.2.1 Important Messages
4.1.2.2 Warnings
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Important messages appear where mishandling of components is possible or when work orders can be misunderstood. These messages also provide vital information associated with other aspects of system
operation. The word “important” is written as
“IMPORTANT,” both capitalized and bold and
is followed by text in italics. The italicized text is the important message.
Warnings appear where overlooked details may cause damage to the equipment or result
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in personal injury. Warnings should be taken seriously. Warnings are easy to recognize. The
word “warning” is written as “WARNING,” both
capitalized and bold and is followed by text in italics. The italicized text is the warning message.
4.1.2.3 Cautions
Cautionary messages should also be heeded to help you reduce the chance of losing data or damaging the system. Cautions are easy to
recognize. The word “caution” is written as
“CAUTION,” both capitalized and bold and is
followed by text in italics. The italicized text is the cautionary message.
4.1.2.4 Notes
Notes inform the reader of essential but non­critical information. These messages should be read carefully as any directions or instructions contained therein can help you avoid making mistakes. Notes are easy to recognize. The
word “note” is written as “NOTE.”
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Chapter 2
SV-2001-THS Computer.
Electronically distributed. Subject to user discretion when printed.
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5 Computer Overview
5.1 Product Information
This chapter provides an introductory overview of the TAG family of tactical Computers. TAG Computers are highly customizable; the specific components vary depending on the mission requirements. Your system may contain components not described in this chapter. For detailed information on these components, refer to the manufactures website or contact TAG Technical Support at
tech.support@tag.com.
TAG's tactical Computers combine state-of­the-art mechanical, thermal and electrical engineering to create customized systems that perform above and beyond end user or program specifications.
5.2 SV-2001-THS Computer
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Figure 5-1 SV-2001-THS Computer
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5.2.1 Specifications Chassis & power supply:
2U Heavy-duty aluminum rack-mount chassis. Chassis is designed to EIA-310-D Standards. 3.469”H (2U) x 19”W x 17”D. Cooling system developed specifically for
harsh environments.
Front accessible on/off switches.
Processor & Cache:
Intel Core2 Duo CPU (T7400, 2.166GHz, 2MB
2nd level cache, 667MHz FSB).
Core2 Duo Motherboard
Accepts Intel Core 2 Duo Processor, 667 Mhz
FSB.
Intel 945 GME Chipset. On-board Serial ATA Controllers. (6) USB 2.0 ports. ((4) Rear, (2) Front.) (3) Serial Ports ((2) On board, (1) PCI
Expansion Card)
(2) 10/100/1000 Ethernet Ports. PS/2 Keyboard and Mouse Port. Low Profile Expansion Slots. (1) PCI-Express
x16, (1) PCI-Express x4, 2x PCI.
Expandable to 4GB DDR2 RAM.
System Components:
4GB DDR2 RAM. (1) 80GB removable Solid State (SATA) hard
drive with rugged metal carrier and receiver.
(1) Low Profile PCI Serial Card. (1) Spectrum PCI-E IRIG Time Code
Processor.
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5.2.2 Additional specifications
Total Weight: 16.8lbs. Input voltage range is 100V to 240V range. Input frequency range is 60hz nominal but can
go from 63 to 47 hertz
Power supply max available power is 460
watts.
Inrush current at 115VAC is 8 amps max Inrush current at 230VAC is 4 amps max Power supply efficiency is 65%
5.2.3 Computer Highlights
The SV-2001-THS is unlike any other
Computer that is currently on the market. The SV-2001-THS is ideal for use in deployable
situations where the product’s compact size,
high density computing, minimized size, weight, and power make for a highly portable, rugged and reliable system.
Contains an intelligent fan controller
(acoustically optimized, environmentally aware).
Small-form factor chassis. Proven to function in a variety of operating
temperature ranges from 0C TO 50C.
5.2.4 SV-2001-THS Computer
Figure 5-2 SV-2001-THS Computer Components and Connectors. (Front View).
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5.2.5 I/O Connectors
Figure 5-3 I/O Connectors (Rear View).
5.3 Computer Components
This section provides an overview of the most common components installed in the SV-2001­THS Computer. Information is also provided on how to identify specific components within your Computer. For detailed information on the specific components installed in your Computer, refer the manufactures website.
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5.4 SV-2001-THS Computer Motherboard
Figure 5-4 Computer Motherboard
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5.4.1 Connector and Component Locations
Figure 5-5 shows the layout of the Computer board.
Figure 5-5 Computer Mother Board Block Diagram.
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Processor System
CPU (65nm)
Intel® Core™ 2
Duo
Intel® Core™
Duo
Intel® Celeron M
Max. Speed
2.16 GHz
2.0 GHz
1.86 GHz
L2 Cache
2 MB/4 MB
2 MB
1 MB Chipset
Intel 945GME + ICH7M-DH
BIOS
Award® 4 Mbit FWH
Front Side Bus
533/667 MHz
Expansion Slot
PCIe x16
4.0 GB/s per direction, 1 slot
PCIe x4
1.0 GB/s per direction, 1 slot
PCI
32-bit/33 MHz, 2 slots
Memory Techn
ology
Dual channel DDR2 400/533/667 SDRAM
Max. Capacity
4 GB
Socket
240-pin DIMM x 2
Graphics
Embed ded
Intel GMA 950 sharing 224 MB system memory
LVDS
Single channel 18-bit/Dual channel 36-bit LVDS
TV-Out
Supports both S-video and composite video (TV-out function is not supported during POST stage)
Add-on
PCIe x16 slot
Ethernet
Interface
10/100/1000 Base-T
Controller
GbE LAN1: Intel 82573L, GbE LAN2: Intel 82573L
Connector
RJ-45 x 2
SATA
Max. Data Transfer Rate
300 MB/s
Channel
2
EIDE
Mode
ATA 100/66/33
Channel
1 (Max. two devices)
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5.4.2 Specifications
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I/O Interface
VGA
1
LAN
1 (for VG version); 2 (for G2 version)
USB
8 (USB 2.0, 480Mbps; 4 external ports and 4 onboard pin headers)
Audio
2 (Line-Out and Mic-In)
Serial
2 (1 of RS-232/422/485 on pin header, 1 of RS-232 on rear I/O)
Parallel
1 (SPP/EPP/ECP)
FDD
1
PS/2
2 (keyboard and mouse)
Watchdog Timer
Output
System reset
Interval
Programmable 1 ~ 255 sec/ min
Power Requirement Typical
Intel Core Duo-T2400 1.83GHz (667FSB) DDR2 667 1GB SDRAM X2
+5 V
+3.3 V
+12 V
2.4 A
3 A
1.5 A
Environment
Operating
Non­Operating
Temperature
0 ~ 60° C (32 ~ 140° F), depends on
CPU’s speed and
cooler solution.
-20 ~ 70° C (­4~15 0° F)
Physical Characteristics
Dimensions (W x D)
244 mm x 244 mm (9.6" x 9.6")
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Table 5-1 Mother Board Specifications.
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5.5 Serial PCI Card
Features
A low profile form factor PCI card made for
space constrained system designs.
Supports 32-/64-bit, 3.3V/5V PCI and PCI-X
slots.
One high-speed 16550 UART serial port (9-
pin) supports data rate up to 230 Kbps.
Will work as standard RS232 port or with 5V or
12V power output for devices that require power (such as handheld scanners, table scanners, POS displays, etc.). Configurable via jumpers with Silkscreened settings on PCB.
5.5.1 Specifications
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Figure 5-6 Serial PCI Card.
Regulatory approval(s): FCC Class B (DoC) &
CE.
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RoHS-compliant. Chip: CyberPro. Bus type: 32-bit PCI. Port type: One 9-pin RS232 serial port. IRQ sharing reduces IRQ conflicts. Built-in 32-byte FIFO buffers dramatically.
increase data transmit/receive speed, especially under Windows multitasking environment.
4-layer PCB board: separate layers for data &
grounding. Greatly reduces signal noise & loss. Delivers reliable high-speed data transfers.
Enhanced bracket design to prevent bending.
Connected to PCB with washered screws for a more secure connection.
Supports 3.3V operation with 5V tolerance. Conforms to PCI v2.2 universal card standard.
PCI-X & 64-bit compatible.
Supports PME # (Power Management Event).
Allows device to request a change in system power state (wake up system).
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5.6 IRIG PCI Card
The IRIG PCI Card with optional GPS, is a complete synchronized timecode reader/generator package offering flexibility and easy integration of precise timing into an embedded computing application. It supports multiple prioritized timing inputs. When an input is lost, the unit automatically switches to the next input.
Figure 5-7 IRIG PCI Card.
5.6.1 Specifications
Low-Profile PCIe Form Factor. PCIe x1 Local Bus Operation. Zero Latency Time Reads. ±100ns Accuracy to Input. Auto-detects and prioritizes GPS and Time
Code Inputs.
IRIG AM/DCLS Time Code Outputs. 1PPS Input. Multiple External Event Time Capture/Interrupt.
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Programmable Periodic Output/Interrupt (1Hz–
10MHz).
Programmable Time Match Output/Interrupt. Optional GPS Synchronization. Optional OCXO Upgrade. CE and RoHS Compliant. Synchronization to Precision Time Protocol
option.
5.6.2 System hard Drive Specifications
The Intel® X18-M/X25-M SATA Solid State Drive (SSD) delivers leading performance in industry standard 2.5” form factor while simultaneously improving system responsiveness for mobile applications over standard rotating drive media or hard diskdrives.
Power Management
5 V (2.5”) SATA Supply Rail  SATA Interface Power Management OS-Aware Hot Plug/Removal
Power Specifications
Active: 0.150 W TYP Idle: 0.060 W TYP
Temperature
Operating: 0o C to 70o C  Non-Operating: -55o C to 95o C.
Reliability
Read Error Rate (BER): 1 sector per 1015
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5.7 System Memory
The type and amount of system memory, or RAM (random access memory), on your computer depends on the motherboard installed and how it was configured.
5.7.1 Identifying System Memory
Refer to your TAG SV-2001-THS serial number. Once you have identified the serial number contact TAG technical support to assist you in determining the type and amount of memory in your system. TAG technical support contact information is located on last page of this manual.
For information on replacing or upgrading your
system memory, refer to “Adding and
Replacing System Memory on page 50.”
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Chapter 3
Procedures.
Electronically distributed. Subject to user discretion when printed.
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6 Procedures
The procedures within this Chapter contain relevant information to ensure your SV-2001­THS Computer maintains its maximum performance potential.
6.1 Computer Startup
1. Check to make sure that all the cables are seated and connected correctly to the back of the unit such as keyboard, mouse, monitor video and power cables.
2. Press ON hard power ON/OFF switch at rear of computer. (Figure 5.3).
3. Then Press the power switch ON to start the computer (power switch is located in the front of the unit). (Figure 5.2).
4. Once the unit starts, System will go thru Power On self Test (POST) (no action is required at this time).
5. Type in the correct user name and password and then press enter to login.
6. Once the operator is logged on they can use the computer as they wish.
NOTE: These instructions are assuming the Computer is not connected to any network.
6.2 Computer Shutdown
1. Save any data that is needed and then close application
2. Once all data is saved and applications are closed it is now safe to shut down the computer.
6.3 TAG Approved BIOS
The BIOS (basic input/output system) is the program stored on the CMOS that the Computer's microprocessor uses to get the
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system started after you turn it on. The BIOS also manages data flow between the computer's operating system and attached devices such as the hard disk, video adapter, keyboard, and mouse.
CAUTION: The BIOS installed on your
Computer was loaded and tested with all the devices initially installed in your system. If you desire to have the BIOS updated, consult TAG technical support in advance as updates to your approved BIOS may cause your system to become unstable or inoperable.
6.3.1 Common BIOS Settings
6.3.1.1 Printer Parallel Port Uni., Bi-Directional, Disable, Enable, ECP, EPP.
Settings in the CMOS enable you to configure a parallel port to use Enhanced Parallel Port (EPP) or Enhanced Parallel Port (ECP). ECP. EPP and ECP are bi-directional standards, operate in 8-bit, and allow data transfer speed of approximately 2 MB/s. Some of the main differences are that ECP supports Direct Memory Access (DMA) and data compression, which enables higher transfer rates.
It is also possible to completely disable the parallel port in the BIOS. Most BIOS' allow you to set the DMA channel, when the port mode is set to ECP.
6.3.1.2 Com / Serial Port
Most personal computers have two serial ports. In the BIOS you can assign COM1/COM2/COM3/COM4 to serial port 1 or
2.
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Most BIOS' also allow you to set the I/O and IRQ but this is mostly done automatically.
6.3.1.3 Hard Drives
Most modern BIOS' allow automatic detection of disk parameters. The settings can be individually configured for the primary master and slave device and the secondary master and slave device. The following are some of the primary settings that apply to hard drives as well as CD/DVD-ROM drives, tape backup drive, etc.
Common disk types are:
User-defined Cylinders, Heads, Sectors (CHS)
values.
Auto-automatically detects hard disks
parameters at every startup.
1-46-predefined combinations of CHS values. CDROM-used for AT Attachment Packet
Interface (ATAPI) CD-ROM drives.
ARMD-used for ATAPI ZIP and LS 120 drives. DVDROM.
Size - Determines the capacity of the drive CHS
values:
Number of Cylinders. Number of Heads. Number of Sectors. LBA (Large Block Addressing)-technology to
overcome the 528 MB limit.
6.3.1.4 Boot Sector Virus
A common setting related to hard drives. When enabled, the BIOS issues a warning message/beep if an attempt is made to write to the boot sector or partition table of a hard disk.
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6.3.1.5 Memory
Parity adds an extra bit (odd or even) to the 8­bit data-string to ensure data integrity in memory modules. Its successor, ECC, provides improved data integrity by adding information about individual bits.
6.3.1.6 Boot Sequence
This setting is used to control the order that the BIOS uses during the boot process to look for a boot device from which to load the operating system. For example:
CD. Floppy. Hard Disk.
6.3.1.7 Date and Time
The Date and Time is set in the BIOS, stored in CMOS, and maintained by CMOS battery.
6.3.1.8 Passwords
In most cases a user (startup) password and a supervisor (setup) password can be set in the CMOS. When a Setup password is required, the computer will prompt for it when you try to access the BIOS setup. When a Startup password is configured, the computer will prompt for it at every startup.
The CMOS password can be reset by shorting the "CMOS restore to factory defaults jumper" or by temporarily removing the CMOS battery.
6.3.1.9 Plug and Play BIOS
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Today's BIOS' are Plug and Play (PnP)-aware. This means they are able to automatically
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assign resources such as IRQ and DMA to PnP devices.
Information about PnP devices is stored in a separate area of non-volatile CMOS memory, called the Extended System Configuration Database (ESCD). Both the PnP BIOS and the operating system can access this area and communicate with each other about resource settings assigned to PnP devices as well as non-PnP devices. For example, when a fixed interrupt request (IRQ) is manually assigned to a particular device using Device Manager, Windows will write this information to the ESCD on shutdown thereby preventing the BIOS from assigning the same IRQ to a PnP device at startup.
You can also reserve IRQs for non-PnP devices in the CMOS setup, this will prevent the BIOS from assigning these reserved resources to PnP devices, a common example is a legacy sound card that needs IRQ 5.
6.3.1.10 Power Management
Modern motherboards provide Advanced Configuration and Power Management Interface (ACPI) settings such as wake-up, power button function and standby/suspend timers. These functions are configured in the CMOS Setup.
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6.3.2 BIOS Configuration for SV-2001-THS
1. On the Main page, Default Setting is Standard CMOS Features. Press ENTER. (Figure 6-1).
Figure 6-1 BIOS Setup.
2. No changes for Standard CMOS Features. Press ESCAPE to return to the main screen. (Figures 6-2).
Figure 6-2 Standard CMOS Features Screen.
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3. On the Main page, Scroll down and select Advanced BIOS Features. Press ENTER. (Figures 6-3).
Figure 6-3 Main Page Screen.
4. In Advanced BIOS Features. Select CPU
Feature then press ENTER. (Figure 6-4).
Figure 6-4 CPU Feature Screen.
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5. No changes for Delay Prior to Thermal. Press ESCAPE to return to the main screen. (Figure 6-5).
Figure 6-5 Delay Prior to Thermal.
6. On the Advanced BIOS Features page, Scroll down and select Hard Disk Boot Priority. Press ENTER. (Figure 6-6)
Figure 6-6 Advanced BIOS Features Screen.
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7. No changes for Hard Disk Boot Priority. Default Selected Ch2 M. Press ENTER. (Figure 6-7)
Figure 6-7 Hard Disk Boot Priority Screen.
8. Scroll down and select MPS Version Control for OS[1.4]. Press ESCAPE to return to the main screen. (Figure 6-8)
Figure 6-8 MPS Version Control Screen.
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9. On the Main Screen scroll down and select Advanced Chipset Features. Press ENTER. (Figure 6-9)
Figure 6-9 Advanced Chipset Features.
10. No changes for DRAM Timing Selectable. Default Selected [By SPD]. Press ENTER. (Figure 6-10)
Figure 6-10 DRAM Timing Selectable Screen.
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11. Scroll Down and select PCI Express Root Port Function No changes press ENTER. (Figure 6-121)
Figure 6-11 PCI Express Root Port Function Screen.
12. No changes for PCI Express Boot Port Function. Defaults Selected. Press ESCAPE
to return to the Main Screen. (Figure 6.12).
Figure 6-12 PCI Express Port Screen.
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13. On the Main Screen scroll down and select Integrated Peripherals. Press ENTER. (Figure 6-13)
Figure 6-13 Integrated Peripherals.
14. No Change on the Integrated Peripherals Screen. Defaults Selected. Press ENTER. (Figure 6-14)
Figure 6-14 Integrated Peripherals Screen.
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15. No Change on the OnChip IDE Device page. Defaults Selected. Press ENTER. (Figure 6-15)
Figure 6-15 OnChip IDE Device Screen.
16. No Changes on the Integrated Peripherals page. Scroll down and select Onboard
Device. Press ENTER. (Figure 6-16)
Figure 6-16 Integrated Peripherals Screen.
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17. No Changes on the Onboard Devices page. Press ENTER. (Figure 6.17).
Figure 6-17 Onboard Device Screen.
18. No Changes on the Integrated Peripherals page. Scroll down to Super I/O Devices. Press
ENTER. (Figure 6.18).
Figure 6-18 Integrated Peripherals Screen.
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19. Scroll Down and select Super I/O Device. Press ENTER. (Figure 6.19).
Figure 6-19 Integrated Peripherals Screen.
20. No Changes on the Super I/O Device page. Default selections. Press ESCAPE to return to the Main Page. (Figure 6.20).
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Figure 6-20 Super I/O Screen.
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21. On the Main Screen scroll down and select
Power Management Setup. Press ENTER. (Figure 6-21).
Figure 6-21 Power Management Setup Screen.
22. No Change on the Power Management Setup Screen. Defaults Selected. Press ENTER. (Figure 6-22)
Figure 6-22 Power Management Setup.
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23. No Change on the PCI Express PM
Function screen. Default Selected. Press ENTER. (Figure 6-23)
Figure 6-23 PCI Express PM Function Screen.
24. No Changes on the Power Management page. Scroll down and select PWRON After PWR-Fail. Press Escape to return to the Main Screen. (Figure 6-24).
Figure 6-24 Power Management Screen.
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25. On the Main Page. Scroll down and select PnP/PCI Configurations. Press ENTER.
(Figure 6.25).
Figure 6-25 PnP/PCI Configurations Screen.
26. On the PnP/PCI Configurations Screen Default Reset Configuration Data is selected. Press ENTER. (Figure 6-26).
Figure 6-26 PnP/PCI Configurations Screen.
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27. No Change on the AwardBIOS CMOS
Setup Utility Screen. Select PC Health Status. Press ENTER. (Figure 6-27)
Figure 6-27 AwardBIOS CMOS Setup Utility Screen.
28. No Change on the PC Health Status screen. Default Selected. Press ENTER. (Figure 6-28)
Figure 6-28 PC Health Status Screen.
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29. Select Frequency Control. Press ENTER. (Figure 6-29).
Figure 6-29 Frequency Control Screen.
30. On the Frequency Control screen. Default selection Spread Spectrum. Press
ENTER. (Figure 6.30).
Figure 6-30 Frequency Control Screen.
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31. Press F10, then Y, and Enter to save the changes and Exit BIOS.
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6.4 Upgrading and Replacing System Components
6.4.1 Preventing Static Electricity
This section provides procedures for replacing all hot-swappable and LRU components, including procedures for replacing or adding system memory.
The components inside your computer are extremely sensitive to static electricity, also known as electrostatic discharge (ESD). ESD can permanently damage electrostatic discharge-sensitive components in your Computer.
To prevent ESD damage, follow these guidelines before opening the Computer case:
1. Turn off the Computer and unplug the power cord before opening the case.
2. Wear a grounding wrist strap and attach it to a bare metal part of the Computer, workbench, or other grounded connection.
Figure 6-31 Grounding Wrist Strap
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3. Do not insert any object into the vent holes on the case or the power supply. Touch a bare metal surface on the back of the computer, a
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____1.0 :Initial Check Points
____1.1
VERIFY the Work Permit instructions have been completed.
____1.2
VERIFY locks and tags are properly attached to equipment.
____1.3
VERIFY all power is removed from the Computer.
____2.0 Install AC Retainer
Bracket:
____2.1
SV-2001-THS-Computer. (Figure 6-
32).
Figure 6-32 SV-2001-THS Computer (Rear View)
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bare metal surface on your workbench, or other grounded object before handing DIMMs or other components.
Before working with computer components, follow these guidelines:
1. Avoid static-causing surfaces such as carpeted floors, plastic, and packing foam.
2. Remove components from their antistatic bags only when you are ready to use them. Do not lay components on the outside of antistatic bags because only the inside of the bags provide electrostatic protection. Always hold memory modules and components by their edges or their metal mounting brackets.
3. Avoid touching the edge connectors and components on the cards. Never slide memory modules or components over any surface.
6.5 Power Supply Cable Retention Bracket Installation
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____2.3
Power Supply Cable Retention Bracket. (Figure 6-33).
Figure 6-33 Power Supply Cable Retention Bracket.
____2.4
Secure Power Supply Cable Retention Bracket by the THREE supplied screws. (Figure 6-34).
Figure 6-34 Secure Power Supply Cable Retention Bracket
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6.6 Replacing a Hard Drive
To remove the systems Hard Drive you need to stop the hard drive and take it offline to remove the logical software links to the hard drive, and to reconfigure the file system so that it will recognize the new drive. You will have to reconfigure your application software. Therefore it is strongly recommended that you contact TAG Technical Support at
tech.support@tag.com before attempting to
exchange the hard drive. For more information on contact information see Manual back page.
6.6.1 25” Solid State SATA Hard Drive
Figure 6-32 25” Solid State SATA Hard Drive.
6.7 Removing the Computer Cover
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The location of the mounting screws securing the Computer cover varies per Computer
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model. To remove the cover, use a Phillips screwdriver to remove all screws from the sides and top of the cover.
NOTE: It is important to make note of the location from which screws are removed since different screw lengths may be used to secure the cover.
CAUTION
It is not safe to operate TAG Computers without the cover in place. Failure to take this precaution may result in personal injury and system damage.
6.8 Adding or Replacing System Memory
This section lists the procedures for adding or replacing system memory.
WARNING
Ensure that the system is powered-down and all power sources have been disconnected from the Computer prior to removing or replacing system memory. Failure to do so could result in serious injury from electrical shock.
CAUTION
Printed circuit boards and hard drives contain electronic components that are extremely sensitive to static electricity. Ordinary amounts of static from your clothes or the work environment can destroy components. Do not touch the components or any metal parts without taking proper antistatic precautions.
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6.8.1 Install system memory.
Unlatch both DIMM socket levers, as shown in Figure 6-62.
Figure 6-33 DIMM Module Bank
1. Note the location of the alignment notch.
2. Align the notches on the new module with the notches on the memory and press it firmly into the bank.
NOTE: The tabs on the sides of the memory module should secure the DIMM automatically. When the DIMM locks into place, you will hear a click.
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Appendix
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Chapter 3
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Part Number: 1006446 Page 57 of 58
Version A. 07/12/10
7 Contract Drawing SV-2001-THS
Figure 7-1 Contract Drawing SV-2001-THS
NOTE: This Contract Drawing is subject to change. Contact TAG for latest drawing Tel: 1-800-824-7693
www.tag.com
Contact Information
7.1.1
22355 TAG Way Dulles, VA 20166 Tel: 1-800-824-7693
www.tag.com
Technical Support
USA 1-800-824-7693 Outside USA
While every precaution has been taken to ensure the accuracy and completeness of this literature. TAG assumes no responsibility and disclaims and liability for damage resulting from use of this information or for any errors or omissions.
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