TAG SV-2001-THS Operation Manual

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TAG

22355 TAG Way

Dulles, VA 20166

SV-2001-THS Computer
Operations Manual
273-MNL-001
P/N 1008775

Operations Manual

1 Copyright © 2009 Technology Advancement Group (TAG)

All rights reserved. This publication and its contents are proprietary to TAG. No part of
this publication may be reproduced in any form or by any means without the written
permission of TAG, 22355 TAG Way, Dulles, Virginia 20166-9310.

TAG has made every effort to ensure the correctness and completeness of the material
in this document. TAG shall not be liable for errors contained herein. The information in
this document is subject to change without notice. TAG makes no warranty of any kind
with regard to this material, including, but not limited to, the implied warranties of
merchantability and fitness for a particular purpose.

1.1 Trademarks

All trademarks, marks, names, or product names referenced in this publication are the
property of respective owners, and TAG neither endorses nor otherwise sponsors any
such products or services referred to herein.

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2 About TAG

2.1 Summary of Qualifications

TAG has served as a leading provider of IT solutions to DoD customers over the past
20+ years and has a long-standing and respected history of providing Systems
Engineering, Electronic Equipment and Program Management support to US Military
warfighters. Headquartered in Dulles, Virginia, TAG’s state-of-the-art 35,000 sq. ft.
engineering and manufacturing facility provides all the infrastructure, equipment, and
manpower necessary to engineer, design, test, manufacture, and certify products to the
rugged requirements of the tactical combat theater. Our facilities in Dulles, VA, San
Diego, CA, and St. Louis, MO, allow for rapid deployment of products and support
across the globe.

TAG quickly, efficiently, and cost-effectively tailors rugged solutions for large DoD
programs with specific MIL-STD requirements. TAG’s comprehensive Quality
Assurance (QA) policy – enforced through application of our UL-registered ISO
9001:2000 certified processes – enables TAG to rapidly deploy systems and solutions
that reliably withstand the stresses of the tactical environment. Today, there are over
20,000 TAG systems deployed across various weapons platforms throughout the US
Military. TAG effectively balances all corporate assets – our people, expertise,
infrastructure, and experience – to consistently and successfully execute and deliver to
the DoD.

TAG’s success lies in focusing on the

corporate Mission Statement and leveraging
the tenets of our business model to ensure

the customer’s expectations are exceeded

throughout lengthy program lifecycles.

TAG’s Mission is to resolve our customers’ IT

challenges with World-Class:

 Engineering;
 Manufacturing and Integration; and
 Lifecycle Management

TAG has a proven track record in
implementing these tenets to serve as a trusted advisor to our Government customers.
TAG uses this foundation to ensure risk is mitigated, expectations are exceeded, and
the customer can consistently rely on the company, our equipment, and our services.

SV-2001-THS Computer

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2.2 Core Competences

2.2.1 Engineering

TAG’s engineering methodology is built upon Multi-Disciplinary Optimization (MDO) and
rigorous design reviews. Although PMs drive the schedule at TAG, Engineering
leverages Computer-Aided Design (CAD) tools, Computational Fluid Dynamics (CFD)
modeling, rapid prototyping processes, and diverse test equipment and facilities to
ensure requirements are being met at every step of the design. TAG Engineering
follows a proven design-review process, ensuring all entrance and exit criteria are met
at each stage. Rigorous documentation is compiled to demonstrate requirement
compliance, risks are mitigated, and decisions are prudent – throughout the design
process.

TAG prides itself on its engineering
laboratories and facilities. Over the past
three years, TAG has invested in several
pieces of equipment that allow TAG to test
and certify products directly onsite to the
harshest environmental requirements of
military standards – including the MIL-STD­810F and DO 160D.

TAG’s onsite test equipment currently

includes a Highly Accelerated Lifecycle
Testing (HALT) Chamber, an
Electromagnetic Interference (EMI) test chamber, and a high-/low-temperature thermal
test chamber. TAG’s facility also provides:

 A floor plan designed to support a cellular manufacturing model with modular

assembly lines

 A dedicated 24-hour system burn-in room
 A modern production status tracking and Enterprise Resource Planning (ERP)

system with external web collaboration capabilities

 Dedicated Quality Assurance workstations for system compliance and validation

inspection

2.2.2 Manufacturing and Integration

TAG implements Cellular Manufacturing processes through our compartmentalized,
state-of-the-art production facility to minimize waste byproducts and maximize

production efficiency. TAG’s manufacturing facility is physically partitioned to model the

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major philosophies of Lean Manufacturing. Consistent with the model, each of TAG’s
production cells are capable of operating in isolation; however personnel and tools are
shared across all cells to streamline manufacturing operations, costs, and the
production/integration scheduling. TAG’s floor technicians are cross-trained in multiple
disciplines so they can be redistributed to any cell that encounters production
bottlenecks, which ensures optimal efficiency.

2.2.3 Lifecycle Management

TAG’s world-class Program Management discipline models the renowned
methodologies of the Project Management Institute (PMI) to ensure successful
completion of the task at hand. Our Program Managers (PMs) serve as the voice of the
customer – driving requirements to which the rest of TAG’s organization answers. As

an explicit tenet of TAG’s corporate mission statement, the PMs not only track cost,
schedule, and technical compliance throughout a project’s period of performance, but

also ensure the customer is supported well beyond it.

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Date

Version Number

Updated By

Description of

Changes

08/25/2010

A

Alan Huckerby

Author

Operations Manual

Document Revision History

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3 About This Manual

3.1 Scope and Audience

This manual provides information on the SV­2001-THS Computer. The SV-2001-THS
Computer allows for up to 2 cores in a 2U
chassis and up to 4GB of RAM. The SV-2001­THS Computer features Core 2 Duo processor
to maximize processing performance, while
reducing power dissipation.

The SV-2001-THS is ideal for deployable
situations where such high density computing
minimizes size, weight, and power.

3.1.1 Organization:

This manual is divided into the following
chapters and appendix:

 Chapter 1 Cautions and Warnings when

handling the SV-2001-THS Computer.

 Chapter 2 provides detailed information on the

external and internal Computer components.

 Chapter 3 provides procedures for replacing

hot-swappable and LRU components, as well
as for replacing or adding system memory.

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Table of Contents

Contents

1 Copyright © 2009 Technology Advancement Group (TAG) .................................................... 2

1.1 Trademarks................................................................................................ ........................ 2

2 About TAG ............................................................................................................................. 3

2.1 Summary of Qualifications ................................................................................................ 3

2.2 Core Competences ............................................................................................................. 4

2.2.1 Engineering ................................................................................................................. 4

2.2.2 Manufacturing and Integration ..................................................................................... 4

2.2.3 Lifecycle Management ................................................................................................ . 5

3 About This Manual.................................................................................................................. 7

3.1 Scope and Audience .......................................................................................................... 7

3.1.1 Organization: ................................ ............................................................................... 7

4 Safety Instructions ................................................................................................................... 13

4.1 Types of warnings used in this manual............................................................................... 13

4.1.1 Safety Symbols and Labels .......................................................................................... 13

4.1.2 Conventions ................................................................................................................. 13

5 Computer Overview ................................................................................................................ 16

5.1 Product Information ........................................................................................................... 16

5.2 SV-2001-THS Computer ................................................................................................... 16

5.2.1 Specifications .............................................................................................................. 17

5.2.2 Additional specifications .............................................................................................. 18

5.2.3 Computer Highlights.................................................................................................... 18

5.2.4 SV-2001-THS Computer ............................................................................................. 18

5.2.5 I/O Connectors............................................................................................................. 19

5.3 Computer Components ...................................................................................................... 19

5.4 SV-2001-THS Computer Motherboard .............................................................................. 20

5.4.1 Connector and Component Locations ........................................................................... 21

5.4.2 Specifications .............................................................................................................. 22

5.5 Serial PCI Card................................ .................................................................................. 24

5.5.1 Specifications .............................................................................................................. 24

5.6 IRIG PCI Card ................................................................................................................... 26

5.6.1 Specifications .............................................................................................................. 26

5.6.2 System hard Drive Specifications................................................................................. 27

5.7 System Memory ................................................................................................................ 28

5.7.1 Identifying System Memory......................................................................................... 28

6 Procedures ................................................................ ............................................................... 30

6.1 Computer Startup .............................................................................................................. 30

6.2 Computer Shutdown .......................................................................................................... 30

6.3 TAG Approved BIOS ........................................................................................................ 30

6.3.1 Common BIOS Settings ............................................................................................... 31

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6.3.2 BIOS Configuration for SV-2001-THS ........................................................................ 35

6.4 Upgrading and Replacing System Components .................................................................. 50

6.4.1 Preventing Static Electricity ......................................................................................... 50

6.5 Power Supply Cable Retention Bracket Installation ........................................................... 51

6.6 Replacing a Hard Drive ..................................................................................................... 53

6.6.1 25” Solid State SATA Hard Drive ............................................................................... 53

6.7 Removing the Computer Cover.......................................................................................... 53

6.8 Adding or Replacing System Memory ............................................................................... 54

6.8.1 Install system memory. ................................................................................................ 55

Appendix ...................................................................................................................................... 56

7 Contract Drawing SV-2001-THS ............................................................................................. 57

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List of Figures

Figure 5-1 SV-2001-THS Computer ..................................................................................... 16

Figure 5-2 SV-2001-THS Computer Components and Connectors. (Front View). .......... 18

Figure 5-3 I/O Connectors (Rear View)................................................................................ 19

Figure 5-4 Computer Motherboard ................................................................ ....................... 20

Figure 5-5 Computer Mother Board Block Diagram. .......................................................... 21

Figure 5-6 Serial PCI Card. ................................................................................................... 24

Figure 5-7 IRIG PCI Card. ..................................................................................................... 26

Figure 6-1 BIOS Setup. ......................................................................................................... 35

Figure 6-2 Standard CMOS Features Screen. .................................................................... 35

Figure 6-3 Main Page Screen. .............................................................................................. 36

Figure 6-4 CPU Feature Screen. ................................................................ .......................... 36

Figure 6-5 Delay Prior to Thermal. ....................................................................................... 37

Figure 6-6 Advanced BIOS Features Screen. ..................................................................... 37

Figure 6-7 Hard Disk Boot Priority Screen. .......................................................................... 38

Figure 6-8 MPS Version Control Screen. ............................................................................. 38

Figure 6-9 Advanced Chipset Features. .............................................................................. 39

Figure 6-10 DRAM Timing Selectable Screen. ................................................................... 39

Figure 6-11 PCI Express Root Port Function Screen. ........................................................ 40

Figure 6-12 PCI Express Port Screen. ................................................................................. 40

Figure 6-13 Integrated Peripherals. ...................................................................................... 41

Figure 6-14 Integrated Peripherals Screen.......................................................................... 41

Figure 6-15 OnChip IDE Device Screen. ............................................................................. 42

Figure 6-16 Integrated Peripherals Screen.......................................................................... 42

Figure 6-17 Onboard Device Screen. ................................................................................... 43

Figure 6-18 Integrated Peripherals Screen. ......................................................................... 43

Figure 6-19 Integrated Peripherals Screen.......................................................................... 44

Figure 6-20 Super I/O Screen. .............................................................................................. 44

Figure 6-21 Power Management Setup Screen. ................................................................. 45

Figure 6-22 Power Management Setup. .............................................................................. 45

Figure 6-23 PCI Express PM Function Screen. .................................................................. 46

Figure 6-24 Power Management Screen. ............................................................................ 46

Figure 6-25 PnP/PCI Configurations Screen. ...................................................................... 47

Figure 6-26 PnP/PCI Configurations Screen. ...................................................................... 47

Figure 6-27 AwardBIOS CMOS Setup Utility Screen. ........................................................ 48

Figure 6-28 PC Health Status Screen. ................................................................................. 48

Figure 6-29 Frequency Control Screen. ............................................................................... 49

Figure 6-30 Frequency Control Screen. ............................................................................... 49

Figure 6-31 Grounding Wrist Strap ....................................................................................... 50

Figure 6-35 25” Solid State SATA Hard Drive. .................................................................... 53

Figure 6-36 DIMM Module Bank ........................................................................................... 55

Figure 7-1 Contract Drawing SV-2001-THS ........................................................................ 57

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List of Tables

Table 5-1 Mother Board Specifications. ............................................................................... 23

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Chapter 1

Cautions and Warnings.

Electronically distributed. Subject to user discretion when printed.

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DANGER

WARNING

CAUTION

These warnings and cautions indicate
situations or practice that might result in
property damage

Operations Manual

4 Safety Instructions

4.1 Types of warnings used in this manual
Read this manual thoroughly, paying special attention to

the cautions and warnings.

4.1.1 Safety Symbols and Labels

4.1.2 Conventions

4.1.2.1 Important Messages

4.1.2.2 Warnings

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Important messages appear where
mishandling of components is possible or when
work orders can be misunderstood. These
messages also provide vital information
associated with other aspects of system

operation. The word “important” is written as

“IMPORTANT,” both capitalized and bold and

is followed by text in italics. The italicized text
is the important message.

Warnings appear where overlooked details
may cause damage to the equipment or result

Operations Manual

in personal injury. Warnings should be taken
seriously. Warnings are easy to recognize. The

word “warning” is written as “WARNING,” both

capitalized and bold and is followed by text in
italics. The italicized text is the warning
message.

4.1.2.3 Cautions

Cautionary messages should also be heeded
to help you reduce the chance of losing data or
damaging the system. Cautions are easy to

recognize. The word “caution” is written as

“CAUTION,” both capitalized and bold and is

followed by text in italics. The italicized text is
the cautionary message.

4.1.2.4 Notes

Notes inform the reader of essential but non­critical information. These messages should be
read carefully as any directions or instructions
contained therein can help you avoid making
mistakes. Notes are easy to recognize. The

word “note” is written as “NOTE.”

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Chapter 2

SV-2001-THS Computer.

Electronically distributed. Subject to user discretion when printed.

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5 Computer Overview

5.1 Product Information

This chapter provides an introductory overview
of the TAG family of tactical Computers. TAG
Computers are highly customizable; the
specific components vary depending on the
mission requirements. Your system may
contain components not described in this
chapter. For detailed information on these
components, refer to the manufactures website
or contact TAG Technical Support at

[e-mail].

TAG's tactical Computers combine state-of­the-art mechanical, thermal and electrical
engineering to create customized systems that
perform above and beyond end user or
program specifications.

5.2 SV-2001-THS Computer

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Figure 5-1 SV-2001-THS Computer

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5.2.1 Specifications
Chassis & power supply:

 2U Heavy-duty aluminum rack-mount chassis.
 Chassis is designed to EIA-310-D Standards.
 3.469”H (2U) x 19”W x 17”D.
 Cooling system developed specifically for

harsh environments.

 Front accessible on/off switches.

Processor & Cache:

 Intel Core2 Duo CPU (T7400, 2.166GHz, 2MB

2nd level cache, 667MHz FSB).

Core2 Duo Motherboard

 Accepts Intel Core 2 Duo Processor, 667 Mhz

FSB.

 Intel 945 GME Chipset.
 On-board Serial ATA Controllers.
 (6) USB 2.0 ports. ((4) Rear, (2) Front.)
 (3) Serial Ports ((2) On board, (1) PCI

Expansion Card)

 (2) 10/100/1000 Ethernet Ports.
 PS/2 Keyboard and Mouse Port.
 Low Profile Expansion Slots. (1) PCI-Express

x16, (1) PCI-Express x4, 2x PCI.

 Expandable to 4GB DDR2 RAM.

System Components:

 4GB DDR2 RAM.
 (1) 80GB removable Solid State (SATA) hard

drive with rugged metal carrier and receiver.

 (1) Low Profile PCI Serial Card.
 (1) Spectrum PCI-E IRIG Time Code

Processor.

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5.2.2 Additional specifications

 Total Weight: 16.8lbs.
 Input voltage range is 100V to 240V range.
 Input frequency range is 60hz nominal but can

go from 63 to 47 hertz

 Power supply max available power is 460

watts.

 Inrush current at 115VAC is 8 amps max
 Inrush current at 230VAC is 4 amps max
 Power supply efficiency is 65%

5.2.3 Computer Highlights

 The SV-2001-THS is unlike any other

Computer that is currently on the market. The
SV-2001-THS is ideal for use in deployable

situations where the product’s compact size,

high density computing, minimized size,
weight, and power make for a highly portable,
rugged and reliable system.

 Contains an intelligent fan controller

(acoustically optimized, environmentally
aware).

 Small-form factor chassis.
 Proven to function in a variety of operating

temperature ranges from 0C TO 50C.

5.2.4 SV-2001-THS Computer

Figure 5-2 SV-2001-THS Computer Components and Connectors. (Front View).

SV-2001-THS Computer

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