Manufactured under license from Dolby Laboratories.
"Dolby" and the double-D symbol are trademarks of Dolby Laboratories.
Page 3
SPECIFICATIONS
ItemConditionsUnitNominalLimit
1. VIDEO
1-1. Video Output75 Ω load Vp-p1.0
1-2. S-Video Output
Y (Luminance)75 Ω load Vp-p1.0
C (Chrominance)75 Ω load Vp-p0.3
2. AUDIO
2-1. Output LevelVrms2.0
2-2. Frequency Response
DVD-VIDEO LPCMfs = 96 kHzHz20 - 44 k
fs = 48 kHzHz20 - 20 k
Audio CDfs = 44.1 kHzHz20 - 20 k
2-3. Signal/Noise Ratio
DVD-VIDEO LPCMdB85
CDdB85
REC & PlaybackInput: 2 Vrms, Rec Speed: SPdB85
2-4. THD+N1 kHz, 0 dB
DVD-VIDEO LPCM%0.01
CD%0.01
REC & PlaybackInput: 2 Vrms, Rec Speed: SP%0.01
3. TUNER
3-1. Video Output75 Ω load Vp-p1.0
3-2. Video S/NdB42
3-3. Audio OutputdBv-12
3-4. Audio S/NdB46
Notes:
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply: 220 - 240 V ~ 50 Hz
3. Load imp.: 100 kΩ
4. Room ambient : 5 °C ~ 40 °C
1-1-1E6820SP
Page 4
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Top of DVD mechanism.
1-2-1R2P_LASER
Page 5
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electrical codes of the
countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 6
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3 mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
Fig. 1
AC Voltmeter
(High Impedance)
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
220 to 240 V
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-3-2DVD_SFNP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 7
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is indicated as shown.
Top View
Input
Out
2. For other ICs, pin 1 and every fifth pin are indicated
as shown.
In
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
* Be careful to avoid a short circuit.
1-4-1DVD_NOTE
Page 8
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Masking
Tape
Tweezers
Flat Pack-IC
Fig. S-1-2
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact pads as shown in Fig. S-1-5.
1-4-2DVD_NOTE
Page 9
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
To Solid
Mounting Point
CBA
Hot Air Blower
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Example :
or
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Tweezers
Flat Pack-IC
Fig. S-1-6
1-4-3DVD_NOTE
Page 10
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is properly grounded to remove any static electricity that may
be charged on the body.
2. Ground for Workbench
(1) Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.
< Incorrect >
< Correct >
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-4-4DVD_NOTE
Page 11
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[9] Fan
[8] Fan Cover
[1] Top Cover
[2] Front Assembly
[3] DVD Mechanism & DVD Main CBA Assembly
[4] SW CBA
[5] PCB Holder
[10] Rear Panel
[11] AV CBA
[12] Jack CBA[13] AFV CBA
[6] Power Supply CBA
[7] Power Holder
2. Disassembly Method
ID/
Loc.
No.
[1] Top CoverD1 7(S-1)---
[2]
[3]
[4] SW CBAD4 (S-3), Desolder---
[5] PCB HolderD4 2(S-4)---
[6]
[7] Power HolderD4 (S-6)---
[8] Fan CoverD5 2(S-7)---
[9] FanD5 Fan Earth, *CN1202---
[10] Rear PanelD5 (S-8), 7(S-9)---
Part
Front
Assembly
DVD
Mechanism &
DVD Main CBA
Assembly
Power Supply
CBA
Fig.
No.
D2 *6(L-1), *3(L-2)1
D3
D4 3(S-5), *CN1201---
Removal
Remove/*Unhook/
Unlock/Release/
Unplug/Desolder
4(S-2), *CN501,
*CN601
Note
---
[11] AV CBAD6 3(S-10)---
[12] Jack CBAD6 Desolder---
[13] AFV CBAD6 Desolder---
↓
(1)
Note:
(1) Identification (location) No. of parts in the figures
(2) Name of the part
(3) Figure Number for reference
(4) Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P = Spring, L = Locking Tab, S = Screw,
CN = Connector
* = Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5) Refer to “Reference Notes.”
↓
(2)
↓
(3)
↓
(4)
(5)
Reference Notes
1. CAUTION 1: Locking Tabs (L-1) and (L-2) are
fragile. Be careful not to break them.
↓
1-5-1E68C1DC
Page 12
[1] Top Cover
(S-1)
(S-1)
(S-1)
Fig. D1
(S-6)
[7] Power
Holder
[6] Power Supply CBA
(S-5)
[4] SW CBA
Desolder
(S-3)
[8] Fan Cover
Fan Earth
CN1201
(S-4)
[5] PCB
Holder
Fig. D4
(S-7)
[2] Front
Assembly
(L-1)
(L-2)
(S-2)
(S-2)
CN601
(L-1)
(L-1)
Fig. D2
[3] DVD Mechanism
& DVD Main
CBA Assembly
CN501
Locking Card
Spacer
[10] Rear Panel
CN1202
(S-10)
[9] Fan
[13] AFV CBA
[11] AV CBA
(S-9)
(S-8)
Fig. D5
[12] Jack CBA
(S-10)
Desolder
Desolder
Locking
Card
Spacer
Fig. D3
Fig. D6
1-5-2E68C1DC
Page 13
3. How to Eject Manually
< Method 1 >
Note: When servicing, do not touch white resin part as shown below.
When rotating the gear, be careful not to damage the gear.
1. Remove the Top Cover.
2. Rotate the gear in the direction of the arrow manually as shown below.
View for A
Do not touch!
Rotate this gear in
the direction of the arrow
A
1-5-3E68C1DC
Page 14
< Method 2 >
Note: When servicing, do not touch white resin part
as shown below.
1. Remove the Top Cover, the Front Assembly and
the DVD Mechanism & DVD Main CBA Assembly.
Then, remove the DVD Mechanism Unit.
2. Remove two screws, and remove the Insulating
Plate.
Screw
Insulating Plate
4. Release the other side of two Locking Tabs, and
remove the Clamper Assembly.
Clamper Assembly
Locking Tabs
5. Remove the disc.
Disc
Do not touch!
3. Release two Locking Tabs, and lift up one side of
the Clamper Assembly.
Clamper Assembly
Locking Tabs
1-5-4E68C1DC
Page 15
HOW TO INITIALIZE THE DVD RECORDER
To put the program back at the factory-default,
initialize the DVD recorder as the following procedure.
1. Turn the DVD recorder on.
2. Confirm that no disc is loaded or that the disc tray
is open. To put the DVD recorder into the Version
display mode, press [CM SKIP], [1], [2], and [3]
buttons on the remote control in that order.
Fig. a appears on the screen.
*1: "
*2: Firmware Version differs depending on the
models, and this indication is one example.
Fig. a Version Display Mode Screen
" differs depending on the models.
*******
F/W VERSION
Model Name :
Firmware Version
BE :
FE :
API :
TT :
DEFAULT SETTING : ENTER
EXIT : RETURN
*******
R2E3030S2S
R20_048_000
Ver 1.08
T20191FSP
3. Press [ENTER] button, then the DVD recorder
starts initializing. When the initializing is
completed, the DVD recorder exits the Version
display mode and turns off the power
automatically.
*To move into the Normal mode from the
Version display mode, press [RETURN] button
on the remote control instead of [ENTER]
button.
*When [STANDBY-ON] button is pressed
before [ENTER] button is pressed, the DVD
recorder exits the Version display mode, then
the power turns off.
1-6-1E6820INT
Page 16
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD recorder into version up mode,
press [CM SKIP], [6], [5], and [4] buttons on the
remote control unit in that order. Then the tray will
open automatically.
Fig. a appears on the screen and Fig. b appears
on the VFD.
* Firmware Version differs depending on the
models, and this indication is one example.
Firm Update Mode
Please insert a disc.
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
ver. R2E3030S2S
Current
F/W version
is displayed.
4. Select the firmware version pressing arrow
buttons, then press [ENTER].
Fig. d appears on the screen and Fig. e appears
on the VFD. The DVD recorder starts updating.
About VFD indication of Fig. e:
1) When Fig. d is displayed on the screen, “F-UP”
is displayed on the VFD.
2) When “Firmware Updating... XX% Complete.”
is displayed on the screen, “XX”% is displayed
on the VFD.
* Firmware Version differs depending on the
models, and this indication is one example.
Selected
F/W version
is displayed.
Firm Update Mode
R2E3030S2S
File Loading...
(*1)
Fig. d Programming Mode Screen
ver.
R2E3030S2S
3. Load the disc for version up.
Fig. c appears on the screen. The file on the top is
highlighted as the default.
When there is only one file to exist, Step 4 will
start automatically.
* Firmware Version differs depending on the
models, and this indication is one example.
The appearance shown in (*1) of Fig. d is
described as follows.
No.AppearanceState
1File Loading...Sending files into the memory
Firmware
2
Updating...
Writing new version data
XX% Complete.
Firmware
--Update Failure
Failed in updating
1-7-1E6820FW
Page 17
5. After updating is finished, the tray opens
automatically.
Fig. f appears on the screen and Fig. g appears on
the VFD.
* Firmware Version differs depending on the
models, and this indication is one example.
Firm Update Modever. R2E3030S2S
R2E3030S2S
B/E Firmware
Update End
Fig. f Completed Program Mode Screen
Fig. g VFD in Completed Program Mode
At this time, no button is available.
6. Press [STANDBY-ON] button to turn the power off.
Then press it again.
1-7-2E6820FW
Page 18
FUNCTION INDICATOR SYMBOLS
Note: If an error occurs, a message with the error number appears on the screen.
Recording Error
MessageSolution
Can not record on this disc.
This program is not allowed to
be recorded.
This program is not recordable
in Video mode.
This program is not allowed to
be recorded on this disc.
You cannot record on this disc as
Power Calibration Area is full.
Insert the recordable disc, and
ensure the disc status satisfies
the recording requirements.
You cannot record copy
prohibited programs.
Set “DVD-RW Recording
Format” to “VR mode”.
Insert a ver.1.1 CPRM
compatible DVD-RW disc.
Error message
E35
Error
No.
1An error occurs during data reading.-
2
3
4An error occurs with OPC.-
5During recovery in a record.-
6
7An error occurs in a format.-
8It cannot start an encode.-
9
10
11
12
13It is a reply that “ATAPI is not readable.”-
14
15
16An error occurs in Finalize Close.-
17An error occurs in Rec Stop Close.-
18An error occurs in PCA Full (DVD_R).-
19Safety Stop occurs during editing.-
20High Speed Disc.2
21The disc which is not formatted.5
22The disc that Disc Error occurred.3
23The -R Disc of VR Mode.6
24
25During the Macrovision picture input.11
26During the CGMS picture input.12
27
28
Error No.
Error DescriptionPriority
There is no reply for 15 seconds in Test
Unit Ready.
Cannot write the data after trying to write
three times.
An error occurs even if it do recovery of a
record three times.
There is not NV_PCK/RDI_PCK in data
doing an encode.
Encode Pause condition continued for 10
minutes.
Encode Pause condition continued by
normal REC condition for 10 minutes.
Differ in an address and do not get
StreamID of RDI/VIDEO.
Cannot write the data after recovering
SMALL VMGI.
Cannot write the data after DVD-R
Reverse Track.
The disc except DVD-R/RW or DVD-R
finalized disc
During the CGMS picture (possible a
record once) input. (Video Format Disc)
During the CGMS picture (possible a
record once) input. (Disc which there is
not for the correspondence to VR Format
CPRM)
-
-
-
-
-
-
-
-
-
1
12
12
1-8-1E68C1FIS
Page 19
MessageSolution
This disc is protected and not
recordable.
Disc is full.
(No area for new recording)
You cannot record more than
99 titles on one disc.
(The maximum is 99.)
You cannot record more than
999 chapters on one disc.
(The maximum is 999.)
You cannot record on this disc
as Control Information is full.
You cannot record on the disc
as Power Calibration Area is
full.
This disc is already finalized.
Can not record on this disc.Repeat the same operation.
Release the disc protect
setting in the Disc Setting
menu.
Insert the recordable disc with
enough recording space.
Delete unnecessary titles.
Delete unnecessary chapter
markers.
Delete unnecessary titles.34
Insert a new disc.35PCA Full. (in REC start)4
Release the finalizing for this
disc.
Error
No.
Error DescriptionPriority
29Disc Protected Disc.7
30There is no it in a space field.5
It is recorded a 99 title. (Video Format
31
Disc)
32It is recorded a 99 title. (VR Format Disc)8
There is 999 number of total chapter. (VR
33
Format Disc)
There is not a space to a record field of
control information.
36It is done Finalize. (Video Format Disc)6
37Access to Memory Area range outside.-
38Sector Address is wrong.-
39BUP writing error of chapter editing.-
7
9
10
If an error occurs during the timer recording, one of the following error numbers (40 to 42) or the above error
messages (error number: 1 to 39) is displayed on the recording menu after timer recording.
(Once the screen of the program line is exited, the program line for the error will be cleared.)
(No Error Message is displayed for the error No. 40 ~ 42.)
Timer Programming
The speed mode changes
to the error number.
Error DescriptionPriority
A program with the error number is grayed out and asterisked on the timer programming list.
MessageSolution
Error message is not
displayed.
2. ---
3. ---
4. ---
5. ---
6. ---
7. ---
8. ---
Error
No.
- Set the timer programming
correctly.
- Set the timer programming
before the start time.
- Insert a recordable videotape
with a record tab.
Turn the power on and set the
clock correctly then set timer
programming again.
Insert the recordable disc.42No disc when recording-
- Some portion has not been recorded
40
because of program overlapping.
- Recording did not start at the start time.
41Power failed-
-
1-8-2E68C1FIS
Page 20
BLOCK DIAGRAMS
System Control Block Diagram
Q1222
IC1206
EV+3.3V
RESET
12
14
RESET
30
P-DOWN
EV+5V
Q1224
C1231
7
VCC
(BACKUP CAPACITOR)
VFD
FL1203
GRID
~
23
17
~
7G
1G
(VFD DRIVER)
CLK
DIN
IC1205
1
28
485049
FL-DIN
FL-CLK
STB
2
27
FL-STB
REMOTE
7
a
~
~
RM1201
SEGMENT
16
14
i
h
SENSOR
REMOTE
FAN
1 FAN+12V
CN1202
FAN CONTROL
Q1205,Q1206
55
FAN-CONT2
2 GND
FAN-AL+12V
TO AUDIO
TO VIDEO INPUT SELECT
BLOCK DIAGRAM
SCL
SDA
BLOCK DIAGRAM
SDA
AUDIO-MUTE
38
AUDIO-MUTE
SCL
TU1201(TUNER UNIT)
6
5
IC1215
3
2
33
34
SUB-SCL
SUB-SDA
SCL
11
(5V<-->3.3V LEVEL CONVERTER)
SDA
12
TO AUDIO
BLOCK DIAGRAM
RGB THROUGH
17
RGB THROUGH
SELECT BLOCK DIAGRAM
RGB THROUGH TO VIDEO OUTPUT
IC1207
(SUB MICRO CONTROLLER)
REG-CONT
52
J908
J906
REG-CONT
PWSW
TO POWER SUPPLY
BLOCK DIAGRAM
VIDEO-SW1
41
42 VIDEO-SW2
43 VIDEO-SW3
VIDEO-SW1
VIDEO-SW2
VIDEO-SW3
TO VIDEO INPUT/OUTPUT
SELECT BLOCK DIAGRAM
X1202
OSC2
8
8MHz
OSC1
9
RESONATOR
X OUT
12
32.768KHz
X1201
X IN
11
X'TAL
IC601
(MAIN MICRO CONTROLLER)
SUB-RXD
SYS-RESET
2219182029
CN1204
3030SYS-RESET
2929SUB-RXD
CN601
V7A2Y2
SUB-RXD
SYS-RESET
SUB-TXD
SUB-SCLK
RDY
2727SUB-TXD
2525SUB-SCLK
2828RDY
H2
U8
RDY
SUB-TXD
SUB-SCLK
X802
27MHz
X'TAL
M1
CLK 27 IN
N1
IC1501
CLK 27 OUT
CN601CN1204
EV+2.4VP-ON+1.5V
+1.5V
REGULATOR
26 REG-CONT2
2626REG-CONT2
DVD MAIN CBA
KEY-1
1
1
CN1205
KEY-1
1
CN3001
KEY SWITCH
KEY-2
2
2
KEY-2
2
KEY SWITCH
AV CBA
SW CBA
1-9-1
E68C1BLS
Page 21
Digital Signal Process Block Diagram
TO VIDEO
OUTPUT
SELECT
BLOCK
DIAGRAM
BCK
VIDEO-Y
VIDEO-C
VIDEO-G
VIDEO-B
VIDEO-R
VIDEO-C
VIDEO-Y/CVBS
SPDIF
DATA
LRCK
MD
MC
TO AUDIO
MS
INPUT/
OUTPUT
SCK
BLOCK
DIAGRAM
LRCK
BCK
DATA
SYSCLK
REC VIDEO SIGNAL PB VIDEO SIGNALREC AUDIO SIGNAL PB AUDIO SIGNAL
IC601 (MPEG2 AV CODEC)IC201
J18
D/A
H18
D/A
K18
D/A
VIDEO
ENCODER
VIDEO
I/F
H19
D/A
G19
D/A
V15
W17
VIDEO
DECODER
BACK-END
DIGITAL
SIGNAL
FRONT-END
E20
PROCESS
DIGITAL
SIGNAL
T20
N19
PROCESS
M19
V4W4V3
AUDIO
H20
G20
F20
FLASH MEMORY
IC604 (FLASH MEMORY)
DDR SDRAM
IC602,IC603 (DDR SDRAM)
P19
U20
I/F
SDRAM
IC204
IC101
DVD MECHANISM
RF/
ERROR AMP
IC102
CN101
LPC
TILT
PICK
IC402
TRACKING
-UP
FOCUS
MOTOR
DRIVER
CN1003
1-9-2
FE
ENCODER
IC410
ENCODER CBA
OP AMP
CN401
CN1001
TRAY OPEN
IC202
+3.3V
FLASH
MEMORY
LOADER CBA
IC401
SLED
MOTOR
M
MOTOR
DRIVER
CN1002
SPINDLE
MOTOR
DVD MAIN CBA
RELAY CBA
M
E68C1BLD
Page 22
Video Input Select Block Diagram
JK1211
S-VIDEO
IN3
(REAR)
C
REC VIDEO SIGNAL
TO VIDEO
OUTPUT SELECT
BLOCK DIAGRAM
VIDEO-OUT2
VIDEO-OUT1
2
1
34
Y
JK1212
C
34
Y
S-VIDEO
IN4
(FRONT)
2
1
VIDEO-IN4
JK1201
(FRONT)
30
31
DRIVER
BUFFER
6dB
AMP
IC1219 (VIDEO INPUT SELECT)
28
24
VIDEO OUT
TU1201 (TUNER UNIT)
1
29
DRIVER
6dB
AMP
3
5
DVD-VIDEO
TO VIDEO
OUTPUT SELECT
BLOCK DIAGRAM
CONTROL
33
LOGIC
32
(VIDEO INPUT SELECT)IC1209
13
Y1
Y2
LPF
BUFFER
19
BUFFER
Q1232
15
MUTE
10
12
TU/LINE
VIDEO4
20
MUTE
2214
C1
Q1231
C2
BUFFERLPF
BUFFER
MUTE
CONTROL
LOGIC
22 23 24
TO SYSTEM CONTROL
BLOCK DIAGRAM
VIDEO-SW2
VIDEO-SW1
VIDEO-SW3
SCL
SDA
AV CBA
JK1206
20
VIDEO IN
10
VIDEO-IN2
10
CN2001CN1210
JK2001
20
VIDEO2 IN
CN1204
VIDEO-Y/CVBS
2121
2323VIDEO-C
CN601
JACK CBA
VIDEO-Y/CVBS
VIDEO-C
DVD MAIN CBA
TO DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
1-9-3
E68C1BLVIS
Page 23
Video Output Select Block Diagram
JK1213
S-VIDEO
OUT
2
1
34
YC
REC VIDEO SIGNAL PB VIDEO SIGNAL
C1407
VIDEO-OUT1
19
JK1206
VIDEO-G OUT
VIDEO-B OUT
VIDEO-R OUT
RGB-SW
7
11
15
16
TO SYSTEM CONTROL
BLOCK DIAGRAM
RGB-THROUGH
5
6
DRIVER
2dB
AMP
8dB
-6dB
LPFDRIVER
4dB
AMP
IC1223 (VIDEO DRIVER)
3
AMP
7
2dB
AMP
LPFDRIVER
4dB
AMP
1
WF3
DVD-VIDEO
VIDEO-OUT2
VIDEO-OUT1
TO VIDEO INPUT SELECT
BLOCK DIAGRAM
11
2dB
AMP
2dB
LPFDRIVER
4dB
4dB
AMP
IC1226 (VIDEO DRIVER)
6
15
IC1221 (SW)
1
2
3
15
AMP
LPFDRIVER
AMP
1
4
5
10
2dB
AMP
LPFDRIVER
4dB
AMP
8
14
13
12
SW
AV CBA
Q1254
9 10 11
CONTROL
P-ON+3.3V
WF1
WF4
CN1204
11VIDEO-Y
CN601
VIDEO-G
VIDEO-Y
TO DIGITAL
7
5
VIDEO-G
VIDEO-B
7
99VIDEO-C
5
VIDEO-C
VIDEO-B
SIGNAL
PROCESS
BLOCK
3
VIDEO-R
3
VIDEO-R
DIAGRAM
WF2
WF6
WF5
1-9-4
Q1240
8
CN1210
13
VIDEO-G-IN
VIDEO-OUT2
8
13
CN2001
12
11
VIDEO-B-IN
VIDEO-R-IN1414
RGB-SW
12
11
Q1246
Q1252
JACK CBA
JK2001
7
111915
16
DVD MAIN CBA
RGB-SW
VIDEO-B IN
VIDEO-R IN
VIDEO-G IN
VIDEO OUT2
E68C1BLVOS
Page 24
Audio Block Diagram
AUDIO(R)-IN2
AUDIO(L)-OUT2
AUDIO(R)-OUT2
AUDIO(L)-IN2
2
613
JK2001
AUDIO(L)-IN1
613
JK1206
JACK CBA
REC AUDIO SIGNAL PB AUDIO SIGNAL
CN2001
AUDIO(L)-IN2
AUDIO(R)-IN2
AUDIO(L)-OUT2
AUDIO(R)-OUT2
66
55
11
33
MUTE-ON
Q2002
MUTE-ON
Q2001
2
AUDIO-MUTE
2
AUDIO(R)-IN1
AUDIO(L)-OUT1
AUDIO(R)-OUT1
2
Q1258
Q1257
AFV CBA
MUTE-ON
MUTE-ON
IF SIGNAL
PROCESS
CN1
SIF
TU-AUDIO(R)
TU-AUDIO(L)
22
55
44
CN1209
SIF OUT
TU1201 (TUNER UNIT)
22
Q1244
JK1210
AUDIO(L)
-OUT
MUTE-ONDRIVE
Q1255
Q1245
AUDIO(R)
-OUT
MUTE-ON
Q1256
AUDIO(L)
JK1204
TO SYSTEM
CONTROL
BLOCK DIAGRAM
AUDIO-MUTE
RGB-THROUGH
-IN3
AUDIO(R)
-IN3
JK1202
AUDIO(L)
-IN4
AUDIO(R)
JK1203
-IN4
CN1210
8
10
24
AMP
BUFFER
IC1219 (INPUT/OUTPUT SELECT)
27
DIGITAL
AUDIO OUT
(COAX1AL)
JK1209
6
AMP
DIGITAL
AUDIO OUT
(OPTICAL)
FIBER OPTIC
TRANS MODULE
JK1207
26
25
DRIVER
DRIVER
14
BUFFER
23
162012
AMP
LOGIC
333213
SCL
SDA
AV CBADVD MAIN CBA
22
21
425
1
7
AMP
DRIVER
DRIVER
CONTROL
15
(OP AMP)IC1222
WF7
OP AMP
2
OP AMP
6
IN3
TU/IN1/2
(L-CH)
(AUDIO INPUT SELECT)
IC1208
)
OP AMP
(
IC1216
3
6
OP
7
AMP
IN4
TU/IN1/2
(R-CH)
111121514
IN3
13
2
OP
AMP
1
IN4
SW CTL
9
10
Q1247
BUFFER
CN1203
11SPDIF
CN501
SPDIF
WF8
TO SYSTEM CONTROL
BLOCK DIAGRAM
IC901
(AUDIO D/A CONVERTER)
1-9-5
768
BCK
AUDIO(L)-OUT
1717
CN601CN1204
151416
L-CH
R-CH
DATA
LRCKMDMC
AUDIO(L)-IN
AUDIO(R)-IN
AUDIO(R)-OUT
DVD-AUDIO-MUTE
1515
1919
1313
1111
MUTE
AUDIO D/A
CONVERTER
4
3
2
ML
5
SCK
TO DIGITAL
SIGNAL
PROCESS
BLOCK
IC902
DIAGRAM
(AUDIO A/D CONVERTER)
1
R-CH
L-CH
101112
BCK
LRCK
2
AUDIO A/D
CONVERTER
15
DATA
SYSCLK
E68C1BLA
Page 25
Power Supply Block Diagram
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
TO
SYSTEM
CONTROL
BLOCK
DIAGRAM
PWSW
EV+32V
MAIN CBA
AL+12V
FAN-AL+12V
131211
131211
CN1106
SW+10VP-ON+10V
Q1228
Q1215,Q1217
10
10
P-ON+12V
SW+12V
9
9
EV+5V
Q1221
EV+3.3V
SW+3.3V
REG.
IC1211
P-ON+5V
SW+5V
Q1218
VIDEO+5V
Q1214
P-ON+3.3V
P-ON+5V
SW+5V
TO DVD MAIN
CBA CN501
CN1203
IC1212
CN1201
77
CN1106
21 P-ON+2.5V
22 P-ON+2.5V
20 P-ON+2.5V
IC1213
+2.5V REG.
55
22
33
25 P-ON+3.3V
26 P-ON+3.3V
27 P-ON+3.3V
+3.3V REG.
11
11 P-ON+5V
12 P-ON+5V
Q1213
4 EV+10.5V
13 P-ON+5V
5 EV+10.5V
6 EV+10.5V
14 EV+2.4V
TO SYSTEM CONTROL
BLOCK DIAGRAM
REG-CONT
15 EV+2.4V
16 EV+2.4V
17 EV+2.4V
F2
AL-30V
EV-5V
F1
2
3
1
AL+5V
3 AL+12V
12
RECTIFIER
AL+5V
1
5 AL+44V54 FAN-AL+12V42
CN1103CN1105CN1201
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
11
T1001
3
BRIDGE
D1001 - D1004
JUNCTION
7
7 EV+3V
CN1102CN1104
5 AL+4V5
3
3 AL-30V
2F22
1
F1
1
CBA
COLD
Q1101
13
14
15
16
17
18
19
20
5
Q1003
Q1002
7
8
IC1001
ERROR
VOLTAGE DET
1
4
23
POWER SUPPLY CBA
LINE
FILTER
L1004
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
F1001
HOT CIRCUIT. BE CAREFUL.
T1.6A L 250V
AC1001
1-9-6
Q1001
HOT
E68C1BLP
Page 26
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these
special safety characteristics are identified in this
manual and its supplements; electrical components
having such features are identified by the mark " ! "
in the schematic diagram and the parts list. Before
replacing any of these components, read the parts list
in this manual carefully. The use of substitute
replacement parts that do not have the same safety
characteristics as specified in the parts list may create
shock, fire, or other hazards.
Notes:
1. Do not use the part number shown on these
drawings for ordering. The correct part number is
shown in the parts list, and may be slightly different
or amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless
otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two
digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1R2P_SC
Page 27
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON
THE FOLLOWING PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see that all components in the power supply circuit are not
defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components
in the power supply circuit to fail.
3. Note:
1. Do not use the part number shown on the drawings for ordering. The correct part number is shown in the
parts list, and may be slightly different or amended since the drawings were prepared.
2. To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Voltage indications for PLAY and REC mode on the schematics are as shown below:
2
1
(Unit: Volt)
The same voltage for
both PLAY & REC modes
5.0
3
5.0
(2.5)
Indicates that the voltage
is not consistent here.
PLAY mode
REC mode
5. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
6. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
1-10-2R2P_SC
Page 28
DVD Main 1/6 Schematic Diagram
1-10-3
E68C1SCD1
Page 29
DVD Main 2/6 Schematic Diagram
1-10-4
E68C1SCD2
Page 30
DVD Main 3/6 Schematic Diagram
1-10-5
E68C1SCD3
Page 31
DVD Main 4/6 Schematic Diagram
NOTE:
1. The order of pins shown in this diagram is different from that of actual IC601.
2. IC601 is divided into six and shown as IC601 (1/6) ~ IC601 (6/6) in this DVD Main Schematic Diagram Section.
1-10-6
E68C1SCD4
Page 32
DVD Main 5/6 Schematic Diagram
NOTE:
1. The order of pins shown in this diagram is different from that of actual IC601.
2. IC601 is divided into six and shown as IC601 (1/6) ~ IC601 (6/6) in this DVD Main Schematic Diagram Section.
1-10-7
E68C1SCD5
Page 33
DVD Main 6/6 Schematic Diagram
NOTE:
1. The order of pins shown in this diagram is different from that of actual IC601.
2. IC601 is divided into six and shown as IC601 (1/6) ~ IC601 (6/6) in this DVD Main Schematic Diagram Section.
1-10-8
E68C1SCD6
Page 34
AV 1/6 Schematic Diagram
*1 NOTE
IC1206
BU4219G-TR
PST3619NR
Group AGroup B
C12250.0150.1
These components (IC1206, C1225)
can be used in any models.
However, you cannot mix components under
Group A with the ones under Group B.
You can choose either Group. The difference
between Group A and Group B is shown below.
1-10-9
E68C1SCAV1
Page 35
AV 2/6 Schematic Diagram
5G4G3G2G1G
7G
6G
a
d
g
h
h
g
c
b
ef
REPEAT
PM
REC
VCD VCR
DVD
R
XP SP
LP EP
SLP
P.SCAN
SEP
W
CD
TC
7G6G5G4G3G2G1G
a
b
c
d
e
f
g
c
d
e
f
gg
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
hh
i
ababababa
b
FL1203 MATRIX CHART
REPEAT
PM
REC
VCD VCRDVD
R
XP
SP
LP
EP
SLP
P.SCAN
SEP
W
CD
T
C
1-10-10
E68C1SCAV2
Page 36
AV 3/6 Schematic Diagram
1-10-11
E68C1SCAV3
Page 37
AV 4/6 Schematic Diagram
1-10-12
E68C1SCAV4
Page 38
AV 5/6 Schematic Diagram
1-10-13
E68C1SCAV5
Page 39
AV 6/6 Schematic Diagram
1-10-14
E68C1SCAV6
Page 40
Power supply & Junction Schematic Diagram
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
1-10-15
E68C1SCP
Page 41
AFV Schematic Diagram
1-10-16
E68C1SCAFV
Page 42
Jack Schematic Diagram
SW Schematic Diagram
E68C1SCJE68C1SCSW
1-10-17
Page 43
AV CBA Top View
1-10-18BE6800F01013A
Page 44
AV CBA Bottom View
WF3
C1407
PLUS LEAD
WF8
PIN 1 OF
CN1203
WF1
PIN 1 OF
CN1204
WF6
PIN 3 OF
CN1204
WF5
PIN 5 OF
CN1204
WF4
PIN 7 OF
CN1204
WF2
PIN 9 OF
CN1204
WF7
PIN 17 OF
CN1204
1-10-19
BE6800F01013A
Page 45
Power supply CBA Top View
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
1-10-20
BE6800F01023A
Page 46
Power supply CBA Bottom View
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
2SC1815-BL(TPE2)
2SC1815-GR(TPE2)
2SC1815-BL(TE2 F T)
2SC1815-GR(TE2 F T)
2SC1815-Y(TE2 F T)
2SC1815-Y(TPE2)
KTC3203(Y)
KTC3203-Y-AT/P
2SA966(Y)
2SA966-Y(TE6 F M)
2SA1015-GR(TE2 F T)
2SA1015-GR(TPE2)
2SC2120-Y(TPE2)
2SC2120-Y(TE2 F T)
2SC3266-(GR,Y)(TPE2 F)
2SC3266-(GR,Y)(TPE2)
KTC3266-GR-AT/P
KTC3266-Y-AT/P
E C B
EL817A
EL817B
PQ070XF01SZ
PQ070XF01SZH
PS2561A-1(Q,W)
LTV-817B-F
1
2
1: A
4
2: K
3
3: E
4: C
1234
MM1697AJBE
9
24
13
BU4219G-TR
R3112N191A-TR-(FA,FB)
IC-PST3619NR
54
1
PT6313-S-TP(L)
SC16313G
28
1
MSP3407G-QG-B8-V3
33
34
44
1
15
14
TC4053BF(EL N F)
8
CD4053BCSJX
CD4053BNSR
TC4053BF(N)
16
1
23
11
1
9
8
MM1636XWRE
8
1
5
12
KIA431-AT/P
123
NC7WZU04P6X
5
64
2SK3566
1: R
2: A
18
4
123
3: K
123
GDS
MN101C77A FD1
MN101C77A FD2
48
49
33
32
Note:
A: Anode
1
8
MM1443XJBE
34
22
K: Cathode
E: Emitter
C: Collector
B: Base
17
R: Reference
S: Source
G: Gate
12
1
17
64
1
16
D: Drain
1-14-1E68C1LE
Page 54
Cabinet
EXPLODED VIEWS
A6
2L031
2L021
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2B8
2L031
2L031
DVD Mechanism &
DVD Main CBA
Assembly
2L021
2L021
Power Supply CBA
2B9
A2
2L021
2B11
2B15
A3
2L011
Junction CBA
SW CBA
2L019
2L011
2L081
2L081
2L012
2B1
2L081
2L021
2L021
2L081
Jack CBA
2B12
2L081
A1X
A14
A5
2B2
2B5
2B4
2B3
AV C B A
AFV CBA
2B13
A4
A5
1-15-1E68C1CEX
Page 55
Packing
S2
X7
X2
X4
S2
X1
X6A
X6B
X10A
S3
Unit
X10B
Some Ref. Numbers
are not in sequence.
X5
A13
S1
1-15-2E68C1PEX
Page 56
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTE: Parts that are not assigned part numbers
(---------) are not available.
Ref. No.DescriptionPart No.
A1XFRONT ASSEMBLY E68C7ED1VM220428
A2TOP COVER E6700UD1VM120049
A3REAR PANEL E68C1ED1VM221203
A4CHASSIS E6700ED1VM120045
A5FOOT K7010UA0VM403657A
A6FAN COVER E6800ED1VM220260
A13BARCODE LABEL UNFIGURE E9704ED or----------
BARCODE LABEL E68C1ED----------
A14LABEL(C) E6700UD----------
2B1PCB HOLDER E6700UD1VM220245
2B2CABLE COVER E6700UD1VM420969
2B4LOCKING CARD SPACER KGLS-12SXP0U024WD004
2B5POWER EARTH PLATE E6800ED1VM420990
2B8!CAUTION LABEL(PAL) E6800ED----------
2B9POWER HOLDER E6800ED1VM320541
2B13PLATE GROUND(RCA) E6800ED1VM320610
2B15FAN EARTH E6800ED1VM320812
2L011SCREW P-TIGHT M3X6 BIND HEAD+ orGBMP3060
SCREW P-TIGHT M3X6 BIND HEAD+GBJP3060
2L012SCREW B-TIGHT M3X8 BIND HEAD + orGBKB3080
SCREW B-TIGHT M3X8 BIND HEAD+GBHB3080
2L021SCREW S-TIGHT M3X6 BIND CROMGBCS3060
2L031SCREW S-TIGHT M3X10 BIND HEAD+ orGBMS3100
SCREW S-TIGHT M3X10 BIND HEAD+GBJS3100
2L081SCREW S-TIGHT M3X6 BIND HEAD+ orGBMS3060
SCREW S-TIGHT M3X6 BIND HEAD+GBJS3060
PACKING
S1GIFT BOX CARTON E68C1ED1VM321518
S2STYROFORM(UK) E6821BD1VM220397C
S3UNIT BAG E5500UD0VM411683
ACCESSORIES
X1REMOTE CONTROL UNIT E6820EDNB011ED
X2DRY BATTERY R6P/2S orXB0M451T0001
DRY BATTERY R6UW/2S orXB0M311MS001
DRY BATTERY ES-GR6M-CXB0M571GLP01
X4RF CORD PAL 1.2M orWPZ0122LG001
RF CABLE CC1001020012010WPZ0122LW001
X5ACCESSORY BAG E5700UD0VM415576
X6AQUICK GUIDE(GE) E68C1ED1VMN21374
X6BQUICK GUIDE (EN) E68C1ED1VMN21421
X721P CABLE(BYR SUPPLY) H9300ED0VMN03276
X10A!OWNERS MANUAL(GE) E68C1ED1VMN21373
X10B!OWNERS MANUAL (EN) E68C1ED1VMN21420
200508171-16-1E68C1CA
Page 57
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
DVD MECHANISM & DVD MAIN CBA
ASSEMBLY
Ref. No.DescriptionPart No.
DVD MECHANISM & DVD MAIN CBA
ASSEMBLY
N78G7BEN
AV A SSE MBLY
Ref. No.DescriptionPart No.
AV ASSEMBLY
Consists of the following:
AV CBA (SUB-A)
SW CBA (SUB-B)
AV CBA
Ref. No.DescriptionPart No.
AV CBA (SUB-A)
Consists of the following:
CAPACITORS
C1205CAP ALUMINUM ELECTOLYTIC 3.3µF/50V M orCE1JMASDL3R3
ELECTROLYTIC CAP. 3.3µF/50V MCE1JMASTL3R3
C1208CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1209CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1210CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1211CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1212CAP ALUMINUM ELECTOLYTIC 3.3µF/50V M orCE1JMASDL3R3
ELECTROLYTIC CAP. 3.3µF/50V MCE1JMASTL3R3
C1214CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1215CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1216CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1217CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1218CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1220CHIP CERAMIC CAP.(1608) CH J 22pF/50V or CHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C1222ELECTROLYTIC CAP. 220µF/16V M orCE1CMASDL221
ELECTROLYTIC CAP. 220µF/16V MCE1CMASTL221
1VSA12401
----------
----------
----------
Ref. No.DescriptionPart No.
C1223CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
If C1225 is 0.015µF, then IC1206 is BU4219G-TR, R3112N191A-TR-FA or
R3112N191A-TR-FB.
C1225CHIP CERAMIC CAP.(1608) B K 0.015µF/50VCHD1JK30B153
IC1206RESET IC BU4219G-TR orQSZBA0TRM090
VOLTAGE DETECT R3112N191A-TR-FA orQSZBA0TRC021
VOLTAGE DETECT R3112N191A-TR-FBQSZBA0TRC022
If C1225 is 0.1µF, then IC 1206 is IC-PST3619NR.
C1225CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
IC1206SYSTEM RESET IC IC-PST3619NRQSZBA0TMM151
C1228CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1229CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C1230CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C1231CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1235CAP ALUMINUM ELECTOLYTIC 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C1238CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C1239CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1241CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1242CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1244CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1245CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1246CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1247CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1248CAP ALUMINUM ELECTOLYTIC 22µF/16V M or CE1CMASDL220
ELECTROLYTIC CAP. 22µF/16V MCE1CMASTL220
C1250CAP ALUMINUM ELECTOLYTIC 3.3µF/50V M orCE1JMASDL3R3
ELECTROLYTIC CAP. 3.3µF/50V MCE1JMASTL3R3
C1251CHIP CERAMIC CAP.(1608) CH J 100pF/50V or CHD1JJ3CH101
CHIP CERAMIC CAP.(1608) CG J 100pF/50VCHD1JJ3CG101
C1252CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1256CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1259CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C1260CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1261CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1262CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1263CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
200508171-17-1E68C1EL
Page 58
Ref. No.DescriptionPart No.
C1264CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1267CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1270CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1271CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1273CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1274CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1275ELECTROLYTIC CAP. 220µF/16V M orCE1CMASDL221
ELECTROLYTIC CAP. 220µF/16V MCE1CMASTL221
C1276CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1277CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1279CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1281CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1286CAP ALUMINUM ELECTOLYTIC 47µF/16V M or CE1CMASDL470
ELECTROLYTIC CAP. 47µF/16V MCE1CMASTL470
C1287CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1288CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1289CHIP CERAMIC CAP.(1608) CH J 100pF/50V or CHD1JJ3CH101
C1295CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1296CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1297CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1298CAP ALUMINUM ELECTOLYTIC 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C1299CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1300CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1301CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C1313CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1314CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1315CAP ALUMINUM ELECTOLYTIC 47µF/16V M or CE1CMASDL470
ELECTROLYTIC CAP. 47µF/16V MCE1CMASTL470
C1316CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1323CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1324CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
Ref. No.DescriptionPart No.
C1326CAP ALUMINUM ELECTOLYTIC 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C1328CERAMIC CAP.(AX) B K 0.1µF/25VCCA1EKT0B104
C1335CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1340CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1344CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1345CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1349CHIP CERAMIC CAP.(1608) CH J 270pF/50V or CHD1JJ3CH271
CHIP CERAMIC CAP. A J 270pF/50VCHD1JJ3CG271
C1350CHIP CERAMIC CAP.(1608) CH J 270pF/50V or CHD1JJ3CH271
CHIP CERAMIC CAP. A J 270pF/50VCHD1JJ3CG271
C1355CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C1357CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1358CHIP CERAMIC CAP.(1608) CH J 47pF/50V or CHD1JJ3CH470
CHIP CERAMIC CAP. CG J 47pF/50VCHD1JJ3CG470
C1359CHIP CERAMIC CAP.(1608) CH J 47pF/50V or CHD1JJ3CH470
CHIP CERAMIC CAP. CG J 47pF/50VCHD1JJ3CG470
C1361CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1362CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1363CAP ALUMINUM ELECTOLYTIC 4.7µF/25V M orCE1EMASDL4R7
ELECTROLYTIC CAP. 4.7µF/25V MCE1EMASTL4R7
C1364CAP ALUMINUM ELECTOLYTIC 4.7µF/25V M orCE1EMASDL4R7
ELECTROLYTIC CAP. 4.7µF/25V MCE1EMASTL4R7
C1365CAP ALUMINUM ELECTOLYTIC 4.7µF/25V M orCE1EMASDL4R7
ELECTROLYTIC CAP. 4.7µF/25V MCE1EMASTL4R7
C1366CAP ALUMINUM ELECTOLYTIC 4.7µF/25V M orCE1EMASDL4R7
ELECTROLYTIC CAP. 4.7µF/25V MCE1EMASTL4R7
C1367CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1371CHIP CERAMIC CAP.(1608) CH J 47pF/50V or CHD1JJ3CH470
CHIP CERAMIC CAP. CG J 47pF/50VCHD1JJ3CG470
C1372CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1373CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1374CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1375CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1376CAP ALUMINUM ELECTOLYTIC 22µF/25V M or CE1EMASDL220
ELECTROLYTIC CAP. 22µF/25V MCE1EMASTL220
C1378CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1379CAP ALUMINUM ELECTOLYTIC 4.7µF/25V M orCE1EMASDL4R7
ELECTROLYTIC CAP. 4.7µF/25V MCE1EMASTL4R7
C1380CAP ALUMINUM ELECTOLYTIC 4.7µF/25V M orCE1EMASDL4R7
ELECTROLYTIC CAP. 4.7µF/25V MCE1EMASTL4R7
C1382CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1383CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C1385CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
200508171-17-2E68C1EL
Page 59
Ref. No.DescriptionPart No.
C1386CHIP CERAMIC CAP.(1608) CH J 47pF/50V or CHD1JJ3CH470
CHIP CERAMIC CAP. CG J 47pF/50VCHD1JJ3CG470
C1388CERAMIC CAP.(AX) B K 0.1µF/25VCCA1EKT0B104
C1389CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
C1411CAP ALUMINUM ELECTOLYTIC 22µF/25V M or CE1EMASDL220
ELECTROLYTIC CAP. 22µF/25V MCE1EMASTL220
C1412CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1413CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1415CAP ALUMINUM ELECTOLYTIC 100µF/6.3V M orCE0KMASDL101
CHIP CERAMIC CAP. CG J 39pF/50VCHD1JJ3CG390
C1418CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1419CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1420CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1424CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1425CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C1426CHIP CERAMIC CAP. F Z 0.22µF/16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/25VCHD1EZ3FZ224
C1427CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1428CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1429CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1430CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1433CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1434CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1436CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1439CAP ALUMINUM ELECTOLYTIC 47µF/16V M or CE1CMASDL470
ELECTROLYTIC CAP. 47µF/16V MCE1CMASTL470
C1440CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1442CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
Ref. No.DescriptionPart No.
C1443CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1444CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1445CAP ALUMINUM ELECTOLYTIC 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1446CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1451CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1452CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C1456CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1458CAP ALUMINUM ELECTOLYTIC 1µF/50V M or CE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1459CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
C1460ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C1461CHIP CERAMIC CAP.(1608) B K 1000pF/50VCHD1JK30B102
CONNECTORS
CN1201242 SERIES CONNECTOR 224202115W1 orJ322C15TG001
CONNECTOR BASE 15P TUC-P15P-B1J3TUA15TG001
CN1202PH CONNECTOR (WHITE) TOP 2P B2B-PH-K-
CN1209AFV PCB ASSEMBLY E6820EDE6820AFV
S(LF) or
PH CONNECTOR TOP 2P B2B-PH-K-SJ3PHC02JG001
J3PHC02JG017
DIODES
D1201DIODE 1N5397-BNDLZ001N5397
D1204SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1205DIODE 1N5397-BNDLZ001N5397
D1206SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1207ZENER DIODE DZ-7.5BSAT265 orNDTA0DZ7R5BS
ZENER DIODE MTZJT-777.5AQDTA0MTZJ7R5
D1210PCB JUMPER D0.6-P5.0JW5.0T
D1211SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1212SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1213SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1219SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1220SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1223ZENER DIODE MTZJT-774.3CQDTC0MTZJ4R3
D1224ZENER DIODE DZ-11BSBT265 orNDTB00DZ11BS
ZENER DIODE MTZJT-7711BQDTB00MTZJ11
D1226SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D1228ZENER DIODE DZ-5.6BSBT265 orNDTB0DZ5R6BS
ZENER DIODE MTZJT-775.6BQDTB0MTZJ5R6
D1237ZENER DIODE DZ-33BSDT265 orNDTD00DZ33BS
ZENER DIODE MTZJT-7733DQDTD00MTZJ33
D1238ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1239ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1241ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1243ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1244ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
200508171-17-3E68C1EL
Page 60
Ref. No.DescriptionPart No.
D1245ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1247ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1248ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1249ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1250ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
ICS
IC1205VFD DRIVER IC SC16313G orNSZBA0T0S005
VFD DRIVER/CONTROLLER IC PT6313-S-
TP(L)
If IC1206 is BU4219G-TR, R3112N191A-TR-FA or R3112N191A-TR-FB, then
C1225 is 0.015µF.
IC1206RESET IC BU4219G-TR orQSZBA0TRM090
VOLTAGE DETECT R3112N191A-TR-FA orQSZBA0TRC021
VOLTAGE DETECT R3112N191A-TR-FBQSZBA0TRC022
C1225CHIP CERAMIC CAP.(1608) B K 0.015µF/50VCHD1JK30B153
If IC1206 is IC-PST3619NR, then C1225 is 0.1µF.
IC1206SYSTEM RESET IC IC-PST3619NRQSZBA0TMM151
C1225CHIP CERAMIC CAP.(1608) B K 0.1µF/50VCHD1JK30B104
C1001! METALIZED FILM CAP. 0.068µF/250V K orCT2E683DC011
!METALIZED FILM CAP. 0.068µF/250V K orCT2E683DC014
!METALIZED FILM CAP. 0.068µF/250V MCT2E683MS037C1002! CAP ALUMINUM ELECTOLYTIC 10µF/16V M or CE1CMASDL100
!ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
CERAMIC CAP. SL J 56pF/1KVCCD3AJPSL560
C1010CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C1101CERAMIC CAP. B K 470pF/500VCCD2JKS0B471
C1104CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1106CAP ALUMINUM ELECTOLYTIC 100µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C1107CAP ALUMINUM ELECTOLYTIC 22µF/50V M or CE1JMASDL220
ELECTROLYTIC CAP. 22µF/50V MCE1JMASTL220
C1108CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1109CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1110CAP ALUMINUM ELECTOLYTIC 1000µF/6.3V
C14CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7CE1JMASSLR22
C27CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C1CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C4CHIP CERAMIC CAP. CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C5CHIP CERAMIC CAP.(1608) CH J 22pF/50V or CHD1JJ3CH220
CHIP CERAMIC CAP. CG J 22pF/50VCHD1JJ3CG220
C6CHIP CERAMIC CAP. CH J 56pF/50V orCHD1JJ3CH560
CHIP CERAMIC CAP. CG J 56pF/50VCHD1JJ3CG560
C7CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP. CH C 3pF/50V orCHD1JC3CH3R0
CHIP CERAMIC CAP. CJ C 3pF/50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP. CH D 3pF/50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
200508171-17-10E68C1EL
1VSA11126
Page 67
DR-A2635
E68C1ED
2005-09-13
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