The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
and makes no commitment to update or to keep current the information in this manual, or to notify
any person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our Website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/or its licensors, and is supplied only under a license.
Any use or reproduction of this product is not allowed, except as expressly permitted by the terms
of said license.
IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between the manufacturer and the customer shall be governed by the laws of
Santa Clara County in the State of California, USA. The State of California, County of Santa Clara
shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for
all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Manual Revision 1.0c
Release Date: May 23, 2013
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
This manual is written for system integrators, PC technicians and
knowledgeable PC users. It provides information for the installation and use of the
X9DBL-i/3/iF/3F motherboard.
About This Motherboard
The Super X9DBL-i/3/iF/3F motherboard supports dual Intel E5-2400 Series
(Socket B2) processors and Intel QPI (QuickPath Interface) Technology (V.1.1),
providing point-to-point connections with transfer speeds of up to 8.0 TG/s. With
the C606/C602 chipset built in, the X9DBL-i/3/iF/3F motherboard supports Intel®
Manageability Engine (ME), Rapid Storage Technology, Digital Media Interface
(DMI), PCI-E Gen. 3.0, and DDR3 memory of up to 1600 MHz. These features
greatly enhance system performance. This motherboard is ideal for high-end server
platforms. Please refer to our Website at http://www.supermicro.com for processor
and memory support.
Preface
Manual Organization
Chapter 1 describes the features, specifi cations and performance of the mother-
board. It also provides detailed information on the Intel C606/C602 chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when in-
stalling the processor, memory modules, and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes troubleshooting procedures for video, memory, and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS, and provides detailed information
on running the CMOS Setup utility.
Appendix A provides BIOS Error Beep Codes.
Appendix B lists software installation instructions.
iii
X9DBL-i/3/iF/3F Motherboard User’s Manual
Conventions Used in the Manual
Pay special attention to the following symbols for proper system installation and to
prevent damage to the system or injury to yourself:
Warning: Important information is given to ensure proper system installation or to avoid
damaging system components
Note: Additional information is given to differentiate between various
models or to provide information for correct system setup.
iv
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel:+1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
B-2 Confi guring SuperDoctor® III .......................................................................... B-2
viii
Chapter 1: Overview
Chapter 1
Overview
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance.
Please check that the following items have all been included with your motherboard.
If anything listed here is damaged or missing, contact your retailer.
The following items are included in the retail box.
• One (1) Supermicro Mainboard
• Eight (8) Serial ATA cables (CBL-0044Lx8) (X9DBL-3F/3 Only)
• Six (6) Serial ATA cables (CBL-0044Lx6) (X9DBL-iF/i Only)
• One (1) I/O Shield (MCP-260-00027-0N)
• One (1) Quick Reference Guide (MNL-1307-QRG)
Note: For your system to work properly, please follow the links below to
download all necessary drivers/utilities and the user's manual for your
motherboard.
SMCI product manuals: http://www.supermicro.com/support/manuals/
Product Drivers and utilities: ftp://ftp.supermicro.com/
If you have any questions, please contact our support team at support@supermicro.
com.
1-1
X9DBL-i/3/iF/3F Motherboard User’s Manual
Motherboard Image
Note: All graphics shown in this manual were based upon the latest PCB
revision available at the time of publishing of the manual. The motherboard
you've received may or may not look exactly the same as the graphics
shown in this manual.
BatteryOnboard Battery (See Chpt. 4 for Used Battery Disposal)
COM1/COM2Backplane COM Port1/Front Accessible COM2 Header
FAN1~5, FANACPU/System Fan Headers
I-SATA 0~5Intel PCH SATA Connectors 0~5
JD1Power LED/Speaker (PWR LED Pins 1~3, Speaker: Pins 4~7)
JF1Front Panel Control Header
JIPMB14-pin External BMC I
2
C Header (for an IPMI Card)
JL1Chassis Intrusion
JOH1Overheat/Fan Fail LED
2
JPI
C1Power Supply SMBbus I2C Header
JPW1ATX 24-Pin Power Connector (See Warning on Pg. 1-6.)
JPW2~JPW312V 8-Pin Power Connectors (See Warning on Pg. 1-6.)
JSTBY1Standby Power Header
JTPM1TPM (Trusted Platform Module)/Port 80
KB/MouseKeyboard/Mouse
LAN1/2G-bit Ethernet Ports 1/2
(IPMI) LANIPMI_Dedicated LAN
S-SATA/SAS 0~3,
S-SATA/SAS Connections 0~3, SAS 4~7 (X9DBL-3F/3 Only)
SAS 4~7
S-SATA/SAS 0~3S-SATA Connections 0~3 from Intel SCU (X9DBL-iF/i Only)
SP1Internal Buzzer/Speaker
Slot1PCI 33 MHz Slot
1-5
X9DBL-i/3/iF/3F Motherboard User’s Manual
(CPU2) Slot3/4/5PCI-Exp. 3.0 x8 Slots
(CPU 1) Slot2PCI-Exp. 3.0 x4 in x8 Slot
(CPU 1) Slot6PCI-Exp. 3.0 x16 Slot
SCU-SGPIO 1Serial Link General Purpose I/O Connector 1 for SCU-SATA/
SAS 0~3 (from SCU)
SCU-SGPIO 2
(For X9DBL-3/3F)
Serial Link General Purpose I/O Connector 2 for SCU-SATA/
SAS 4~7 (from SCU)
T-SGPIO 1Serial Link General Purpose I/O Connector 1 for I-SATA 0~5
T-SGPIO 2Serial Link General Purpose I/O Connector 1 for I-SATA 4/5
TPM/Port 80TPM (Trusted Platform Module)/Port 80 Connection (JTPM)
USB 0/1 Back Panel USB 0/1
USB 2/3, 4/5Front Panel Accessible USB 2/3, 4/5 Connections
USB 6Front Panel Type A USB 6 Port
UID SwitchUID (Unit Identifi er) Switch
VGABackpanel VGA Port 1/Front Panel VGA Port2
X9DBL-i/3/iF/3F LED Indicators
LEDDescriptionStateStatus
LED1BMC Heartbeat LEDGreen: BlinkingNormal
LED2Sta ndby PWR L ED Green: OnSB Power On
LED3UID LE D
Blue: On (Windows OS)
Blinking (Linux)
Unit Identifi ed
Warning: To avoid damaging the power supply or the motherboard, please use a power
supply that contains a 24-pin, and two 8-pin power Power connectors. Be sure to connect these power supply connectors to all power connector on the motherboard. Failure
in doing so will void the manufacturer warranty on your power supply and motherboard.
1-6
Motherboard Features
Chapter 1: Overview
CPU
Memory
Chipset
• Dual Intel
to 95W); each processor supports two full-width Intel
QuickPath Interconnect (QPI) links of up to 8.0 GT/s per
QPI link with data transfer rate of up to 16 GB/s bandwidth per port
®
E5-2400 Series (Socket B2) processors (up
• Integrated memory controller supports six 240-pin DDR3
Registered/Load Reduced ECC or Unbuffered ECC/NonECC 800/1066/1333/1600 MHz memory modules with
support of up to 192 GB in three-channel memory bus
Note: For the latest CPU/memory updates, please
refer to our Website at http://www.supermicro.com/
products/motherboard.
DIMM sizes
• R_DIMM/LR_
DIMM
1GB, 2GB, 4GB, 8GB,16GB and
32GB @ 1.35V/1.5V
• Virtualization: VT-x, VT-d, and VT-c
• Intel® C606/C602 PCH
Graphics
Network
I/O
Devices
• Matrox G200eW Video Controller
• Dual Intel 82574L Gigabit Ethernet Controllers for LAN1/
LAN2 ports.
SATA/SAS Connections
• SATA PortsSix (6) SATA ports total: Two (2)
SATA 3.0 ports & four (4) SATA
2.0 ports
• RAIDRAID 0, 1, 5, 10
• SAS ConnectorsEight (8) SAS Connectors SCU-
SATA/SAS 0~3, 4~7 for X9DBL3F/3,
Four (4) SATA 2.0 Connections: SCU-SATA/SAS 0~3 for
X9DBL-iF/i
Note 1: CPU Maximum Thermal Design Power (TDP) is subject to chassis
and heatsink cooling restrictions. For proper thermal management, please
check the chassis and heatsink specifi cations for proper CPU TDP sizing.
Note 2: For IPMI Confi guration Instructions, please refer to the Embedded
IPMI Confi guration User's Guide available @ http://www.supermicro.com/
support/manuals/.
• 12.00" (L) x 10.00" (W) (304.80 mm x 254.00 mm)
1-9
X9DBL-i/3/iF/3F Motherboard User’s Manual
RJ45
RJ45
IPMI LAN
SLOT 2
PCI-E X4
GLAN 1
82574L
GLAN 2
82574L
VGA
#C-1
#B-1
#A-1
DDR3
PCI-E X4 Gen3
in X8 slot
SLOT 6
PCI-E X16
BMC
VGA
SLOT 1
#1#3#1DMI
800/1066/1333/1600
PCI-E X16 Gen3
PCI-E X1 Gen2
PCI-E X1 Gen2
PCI-E X1
PCI-32MHz
PCI-33MHz
CPU 1
DDR3
PCI-E x4
PEG0
PCI-E
#1
PCI-E
#1
PCI
SPI
BIOS
P0
DMI
4GB/s
DMI
PCH
SSB-D/A
LPC
SIO
W83527
QPI
P1
8G
#3#3#1
TPM
Header
CPU 2
DDR3
PCI-E X8 Gen3
PCI-E X8 Gen3
6.0 Gb/S
3.0 Gb/S for Ports 2~5
(SCU-SATA/SAS)
3.0 Gb/S
for Ports 0/1
USB 2.0
USB
#0~#6
#D-1
PCI-E X8 Gen3
PCI-E X8
SLOT 3
PCI-E X8
SAS
#0~#7
#0~#5
2 Rear
4 Front
1 Type-A
#F-1
#E-1
DDR3
800/1066/1333/1600
SLOT 5
PCI-E X8
SLOT 4
SATA
SCU-
SATA/SAS
COM1
External
COM2
Header
System Block Diagram
Note: This is a general block diagram and may not exactly represent
the features on your motherboard. See the Motherboard Features pages
for the actual specifi cations of each motherboard. This block diagram is
intended for your reference only.
1-10
Chapter 1: Overview
1-2 Processor and Chipset Overview
Built upo n the functio nality and th e capabilitie s of Intel E5-240 0 Series (Soc ket
B2) processor and C606/C602 chipset, the X9DBL-i/3/iF/3F motherboard provides
the performance and feature sets required for dual_processor-based high-end
system platforms.
With support of Intel QuickPath interconnect (QPI) Technology, the X9DBL-i/3/
iF/3F motherboard offers point-to-point serial interconnect interface with a transfer
speed o f up to 8.0 GT/s, prov idin g super b system p er for manc e.
The C606/C602 chipset provides extensive IO support, including the following
functions and capabilities:
• PCI-Express Rev. 2.0 support
• PCI-Express Gen. 3 uplink supported by some SKUs
• ACPI Power Management Logic Support Rev. 3.0b or Rev. 4.0
• USB host i nter face b ackpl ane and f ront ac ces s suppor t
• Intel Rapid S torag e Technol ogy supp or ted
• Intel Vir tua lizati on Technology fo r Direc ted I/O (Inte l VT-d) sup por ted
The Basic I/O System (BIOS) provides a power setting that determines how the
system will respond when AC power is lost and then restored to the system. You
can choose for the system to remain powered off (in which case you must press
the power switch to turn it back on), or for it to automatically return to the power-on
state. See the Advanced BIOS Setup section for this setting. The default setting
is Last State.
1-4 PC Health Monitoring
This section describes the features of PC health monitoring of the motherboard.
This motherboard has an onboard System_Hardware_Monitor chip that supports
PC health monitoring. An onboard voltage monitor will scan the following onboard
voltages continuously: 1.5V, 1.8V, +3.3V, 3.3V Standby, +5V, +5V Standby and
Battery Voltage. Once a voltage becomes unstable, a warning is given, or an error
message is sent to the screen. The user can adjust the voltage thresholds to defi ne
the sensitivity of the voltage monitor.
Fan Status Monitor with Firmware Control
The PC health monitor chip can check the RPM status of a cooling fan. The onboard CPU and chassis fans are controlled by the fi rmware thermal management
under IPMI.
Environmental Temperature Control
A thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent the CPU from overheating. The onboard chassis thermal circuitry
can monitor the overall system temperature and alert the user when the chassis
temperature is too high.
Note: To avoid possible system overheating, please be sure to provide
adequate airfl ow to your system.
System Resource Alert
This feature is available when used with SuperDoctor® III in the Windows OS
1-12
Chapter 1: Overview
environment or used with SuperDoctor® II in Linux. SuperDoctor® is used to notify
the use r of certain system events. For example, you can confi gure SuperDoctor®
to provide you with warnings when system temperature, CPU temperature,
voltag es and fa n speed s go beyond a p redefi ned range.
1-5 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-
tion defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
hardware, operating system and application software. This enables the system to
automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers.
In addition to enabling operating_system-directed power management, ACPI also
provides a generic system event mechanism for Plug and Play, and an operating
system-independent interface for confi guration control. ACPI leverages the Plug and
Play BIOS data structures, while providing a processor architecture-independent
implementation that is compatible with Windows 7, Windows Vista and Windows
2008 Operating Systems.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will "wake up" and the LED will automatically stop blinking and remain on.
1-6 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.
The X9DBL-i/3/iF/3F motherboard accommodates 24-pin ATX power supplies.
Although most power supplies generally meet the specifi cations required by the
CPU, some are inadequate. In addition, two 12V 8-pin power connections (JPW2/
JPW3) are also required to ensure adequate power supply to the system. Your
power supply must also supply 1.5A for the Ethernet ports.
Warning: To avoid damaging the power supply or the motherboard, please use a power
supply that contains a 24-pin and two 8-pin power connectors. Be sure to connect
these power supply connectors to all power connectors on the motherboard. Failure
to do so will void the manufacturer warranty on your power supply and motherboard.
1-13
X9DBL-i/3/iF/3F Motherboard User’s Manual
It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.02 or above. It must also be SSI compliant. (For more
information, please refer to the website at http://www.ssiforum.org/). Additionally, in
areas where noisy power transmission is present, you may choose to install a line
fi lter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.
1-7 Super I/O
The Super I/O supports two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rates of up to 115.2 Kbps
as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.
1-8 Advanced Power Management
The new advanced power management features supported by this motherboard
include IPNM and ME. Please note that you will need to do following to use these
two new features:
• Use a power supply that supports PMBus 1.1 or 1.2.
• Install the NMView software in your system. NMView is optional and can be
purchased from Supermicro.
Intel® Intelligent Power Node Manager (IPNM)
The Intel® Intelligent Power Node Manager (IPNM) provides your system with
real-time thermal control and power management for maximum energy effi ciency.
Although IPNM is supported by the BMC (Baseboard Management Controller),
your system must also have IPNM-compatible Management Engine (ME) fi rmware
installed in your system for IPNM support.
Note: Support for IPNM Specifi cation Version 1.5 or Vision 2.0 depends
on the power supply used in the system.
1-14
Chapter 1: Overview
Management Engine (ME)
The Management Engine, which is an ARC controller embedded in the PCH, provides Server Platform Services (SPS) to your system. The services provided by
SPS are different from those provided by the ME on client platforms.
1-9 Introduction to the IPMI Controller (For X9DBL-iF/3F
only)
The Nuvoton WPCM450R Controller, a Baseboard Management Controller (BMC),
supports 2D/VGA-compatible Graphic Cores with PCI interface, creating multi-media
virtualization via Keyboard/Video/Mouse Redirection (KVMR). The WPCM450R
Controller is ideal for remote system management.
The WPCM450R Controller interfaces with the host system via PCI connections
to communicate with the graphics cores. It supports USB 2.0 and 1.1 for remote
keyboard/mouse/virtual media emulation. It also provides LPC interface support to
control Super IO functions. The WPCM450R Controller is connected to the network
via an external Ethernet PHY module or shared NCSI connections.
The WPCM450R communicates with onboard components via six SMBus interfaces, PECI (Platform Environment Control Interface) buses, and General Purpose
I/O ports.
WPCM450R DDR2 Memory Interface
The WPCM450R supports a 16-bit DDR2 memory module with a speed of up to 220
MHz. For best signal integrity, the WPCM450R provides point-to-point connection.
WPCM450R PCI System Interface
The WPCM450R provides 32-bit, 33 MHz 3.3V PCI interface, which is compliant
with the PCI Local Bus Specifi cation Rev. 2.3. The PCI system interface connects
to the onboard PCI Bridge used by the graphics controller.
Other Features Supported by the WPCM BMC Controller
The WPCM450R supports the following features:
• IPMI 2.0
• Serial over LAN
• KVM over LAN
• LAN Alerting-SNMP Trap
1-15
X9DBL-i/3/iF/3F Motherboard User’s Manual
• Event Log
• X-Bus parallel interface for I/O expansion
• Multiple ADC inputs, Analog and Digital Video outputs
• SPI Flash Host BIOS and fi rmware bootstrap program supported
• Reduced Media Independent Interface (RMII)
• OS (Operating System) Independency
• Provides remote Hardware Health Monitoring via IPMI. Key features
• Provides Network Management Security via remote access/console redirec-
tion.
• Supports the following Management tools: IPMIView, CLI (Command Line
Interface)
• RMCP+ protocol supported
Note: For more information on IPMI confi guration, please refer to the
IPMI User's Guide posted on our website at http://www.supermicro.com/
support/manuals/.
1-16
Chapter 2: Installation
Chapter 2
Installation
2-1 Standardized Warning Statements
The following statements are industry-standard warnings, provided to warn the user
of situations which have the potential for bodily injury . Should you have questions or
experience diffi culty, contact Supermicro's Technical Support department for assis-
tance. Only certifi ed technicians should attempt to install or confi gure components.
Read this section in its entirety before installing or confi guring components in the
Supermicro chassis.
Battery Handling
Warning!
There is a danger of explosion if the battery is replaced incorrectly. Replace the
battery only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer's instructions
Warnung
Bei Einsetzen einer falschen Batterie besteht Explosionsgefahr. Ersetzen Sie die
Batterie nur durch den gleichen oder vom Hersteller empfohlenen Batterietyp.
Entsorgen Sie die benutzten Batterien nach den Anweisungen des Herstellers.
2-1
X9DBL-i/3/iF/3F Motherboard User’s Manual
!הרהזא
Attention
Danger d'explosion si la pile n'est pas remplacée correctement. Ne la remplacer
que par une pile de type semblable ou équivalent, recommandée par le fabricant.
Jeter les piles usagées conformément aux instructions du fabricant.
¡Advertencia!
Existe peligro de explosión si la batería se reemplaza de manera incorrecta. Re-
emplazar la batería exclusivamente con el mismo tipo o el equivalente recomendado por el fabricante. Desechar las baterías gastadas según las instrucciones
del fabricante.
배터리가 올바르게 교체되지 않으면 폭발의 위험이 있습니다. 기존 배터리와 동일
하거나 제조사에서 권장하는 동등한 종류의 배터리로만 교체해야 합니다. 제조사
의 안내에 따라 사용된 배터리를 처리하여 주십시오.
Waarschuwing
Er is ontploffi ngsgevaar indien de batterij verkeerd vervangen wordt. Vervang de
batterij slechts met hetzelfde of een equivalent type die door de fabrikant aanbevolen wordt. Gebruikte batterijen dienen overeenkomstig fabrieksvoorschriften
afgevoerd te worden.
2-2
Chapter 2: Installation
רצומה קוליס
Product Disposal
Warning!
Ultimate disposal of this product should be handled according to all national laws
and regulations.
製品の廃棄
この製品を廃棄処分する場合、国の関係する全ての法律・条例に従い処理する必要が
あります。
警告
本产品的废弃处理应根据所有国家的法律和规章进行。
警告
本產品的廢棄處理應根據所有國家的法律和規章進行。
Warnung
Die Entsorgung dieses Produkts sollte gemäß allen Bestimmungen und Gesetzen
des Landes erfolgen.
¡Advertencia!
Al deshacerse por completo de este producto debe seguir todas las leyes y regla-
mentos nacionales.
Attention
La mise au rebut ou le recyclage de ce produit sont généralement soumis à des
lois et/ou directives de respect de l'environnement. Renseignez-vous auprès de
l'organisme compétent.
Waarschuwing
De uiteindelijke verwijdering van dit product dient te geschieden in overeenstemming
met alle nationale wetten en reglementen.
2-2 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your system board, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic
bag.
• Handle the board by its edges only; do not touch its components, peripheral
chips, memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not
in use.
• For grounding purposes, make sure that your system chassis provides excellent
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
Unpacking
The motherboar d i s s h i p ped in antistatic packaging to avoid static damag e. When
unpacking the board, make sure that the person handling it is static-protected.
2-4
Chapter 2: Installation
2-3 Processor and Heatsink Installation
When handling the processor package, avoid placing direct pressure on the label area
of the fan.
Notes:
• Always connect the power cord last, and always remove it before adding, re-
moving, or changing any components. Make sure that you install the processor
into the CPU socket before you install the CPU heatsink.
• Make sure that the processor wattage (TDP) does not exceed the maximum
rating for the motherboard. Also, check that it is within the rating limits of the
heatsink and chassis to ensure proper cooling and operation. Refer to the
chassis manual for more information.
• Make sure to install the motherboard into the chassis before you install the
CPU heatsink and heatsink fans.
• When purchasing a motherboard without a processor pre-installed, make sure
that the CPU socket plastic cap is in place, and none of the CPU socket pins
are bent; otherwise, contact the retailer immediately.
• Refer to the M otherboar d Features secti on of the manual an d our website
for more i nform ation on C PU suppo rt a nd update s.
Installing an LGA 1356 Processor
1. Press the socket clip to release the load plate that covers the CPU socket from
its locked position.
2. Gently lift the socket clip to open the load plate.
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X9DBL-i/3/iF/3F Motherboard User’s Manual
3. Hold the plastic cap at its north and south center edges to remove it from the
CPU socket.
4. After removing the plastic cap, hold the CPU at the north and south center
edges with your thumb and index fi nger.
5. Align the CPU key, a semi-circle cutout, against the socket key, which is the
notch below the gold color dot on the side of the socket.
6. Align Pin 1 on the CPU with Pin 1 on the CPU socket.
7. Once both CPU and the socket are aligned, carefully lower the CPU straight
down into the socket. (To avoid damaging the CPU or the socket, do not rub
the CPU against the surface of the socket or its pins.)
8. With the CPU inside the socket, inspect the four corners of the CPU to make
sure that the CPU is properly installed.
9. Once the CPU is securely seated on the socket, lower the CPU load plate to
the socket.
10. Use your thumb to gently push the socket clip down to the clip lock.
Warning: Please s ave the plastic c ap. The mothe rboard mu st be shipped w ith the
plastic cap properly installed to protect CPU socket pins. Shipping without the plastic
cap pro per ly inst alled w ill cau se damag e to the so cket pins.
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