The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/or its licensors, and is supplied only under a license.
Any use or reproduction of this product is not allowed, except as expressly permitted by the terms
of said license.
IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. IN PARTICULAR, SUPERMICRO SHALL NOT HAVE LIABILITY FOR ANY
HARDWARE, SOFTW ARE, OR DA TA STORED OR USED WITH THE PRODUCT, INCLUDING THE
COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH
HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for all
claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Manual Revision: Rev. 1.0a
Release Date: March 28, 2010
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
This manual is written for system integrators, PC technicians and knowledgeable PC
users. It provides information for the installation and use of the X8DTGQF motherboard.
About This Motherboard
The X8DTG-QF motherboard supports the Intel 5500/5600 Series Processor platform and the QuickPath Interconnect (QPI) Technology, providing the next
generation point-to-point system interface that replaces the current Front Side Bus.
With the 5500/5600 Series Processor and dual Intel 5520 IOH-36D chips built in, the
X8DTG-QF substantially enhances system performance with increased bandwidth
and unprecedented scalability optimized for HPC/Cluster and high-end 4U servers.
Please refer to our web site (http://www.supermicro.com/products/) for updates on
supported processors. This product is intended to be installed and serviced by
professional technicians.
Preface
Manual Organization
Chapter 1 describes the features, specifi cations and performance of the mother-
board and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when in-
stalling the processor, memory modules and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes troubleshooting procedures for video, memory and system setup stored in the CMOS.
Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.
Appendix A lists BIOS POST Error Codes. Appendix B and Appendix C provide
the Windows OS and Other Software Installation Instructions.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation
and to prevent product damage or bodily injury.
iii
X8DTG-QF User's Manual
Warning: Important information given to ensure proper system installation
or to prevent damage to the components.
Note: Additional Information given to differentiate various models or to
ensure correct system setup.
C-2 Confi guring Supero Doctor III ......................................................................... C-2
viii
Chapter 1: Introduction
Chapter 1
Introduction
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance. Check
that the following items have all been included with your motherboard. If anything
listed here is damaged or missing, contact your retailer.
The following items are included in the retail package.
One (1) Supermicro Mainboard
•
Six (6) Serial ATA cables (CBL-0044L) •
One (1) I/O backpanel shield (MCP-260-00025-0N) •
One (1) Supermicro CD containing drivers and utilities•
1-1
X8DTG-QF User's Manual
X8DTG-QF Motherboard Image
Note: The drawings and pictures shown in this manual were based on the
latest PCB Revision available at the time of publishing of the manual. The
motherboard you’ve received may or may not look exactly the same as
the graphics shown in the manual.
1-2
Chapter 1: Introduction
X8DTG-QF Motherboard Layout
KB/MOUSE
VGA
USB0/1
USB2/3/4/5
LAN2
J138
CD1
Audio CTRL
ALC888
JL2
IPMI
Firmware
1
D33
FAN5
FAN6
COM1
LAN1
AUDIO FP
CD-IN
LAN CTRL
JAUDIO1
LAN CTRL
JPAC
WPCM450
BMC CTRL
Memory
for IPMI
COM2
JPUSB1
IPMI_LAN
PHY
82574
82574
JPL2
JPL1
JI2C2
JI2C1
JPG1
CPU
VRM
FAN8/CPU2
Slot11 PCI-E 2.0 x4(in x8 Slot)
Slot10 PCI-E 2.0 x16
Slot8 PCI-E 2.0 x16
Slot6 PCI-E 2.0 x16
Slot5 PCI 33MHz
Slot4 PCI-E 2.0 x16
Slot3 PCI 33MHz
Slot2 PCI-E 2.0 x4(in x16 Slot)
Slot1 PCI-E x4(in x16 Slot)
P2-DIMM3A
P2-DIMM3B
P2-DIMM2A
P2-DIMM2B
P2-DIMM1A
P2-DIMM1B
ALWAYS POPULATE DIMM A FIRST
CPU2
X8DTG-QF
Rev. 2.0
JP3
1
JP6
J18
JSMB1
JWOL
JWD
Intel 5520
IOH-36D
TPM
Intel
ICH 10R
PWR I2C
FAN7/CPU1
JPI2C
JBT1
JPW2
ALWAYS POPULATE DIMM A FIRST
FAN9
BIOS
T-SGPIO1
JTPM1
P1-DIMM1B
P1-DIMM1A
P1-DIMM2B
P1-DIMM2A
P1-DIMM3B
P1-DIMM3A
Intel 5520
IOH-36D
CPU1
T-SGPIO2
JPW1
JPW3
FAN1
FAN2
JD1
FAN3
FAN10
SP1
DP1
FP CTRL
JF1
JOH1
USB7
Battery
I-SATA4
I-SATA5
I-SATA3
USB6
JPUSB2
USB8/9
FAN4
JL1
I-SATA0
I-SATA2
I-SATA1
Notes:
Jumpers not indicated are for test purposes only. For more information on 1.
jumpers or components, refer to Chapter 2.
" " indicates the location of Pin 1.2.
When DP1 LED is on, the onboard power connection is on. Make sure to 3.
unplug the power cables before removing or installing components.
1-3
X8DTG-QF User's Manual
X8DTG-QF Quick Reference
KB/MOUSE
VGA
USB0/1
USB2/3/4/5
LAN2
J138
CD1
Audio CTRL
ALC888
JL2
IPMI
Firmware
1
D33
FAN5
FAN6
COM1
LAN1
AUDIO FP
CD-IN
LAN CTRL
JAUDIO1
LAN CTRL
JPAC
WPCM450
BMC CTRL
Memory
for IPMI
COM2
JPUSB1
IPMI_LAN
PHY
82574
82574
JPL2
JPL1
JI2C2
JI2C1
JPG1
FAN8/CPU2
CPU
VRM
Slot11 PCI-E 2.0 x4(in x8 Slot)
Slot10 PCI-E 2.0 x16
Slot8 PCI-E 2.0 x16
Slot6 PCI-E 2.0 x16
Slot5 PCI 33MHz
Slot4 PCI-E 2.0 x16
Slot3 PCI 33MHz
Slot2 PCI-E 2.0 x4(in x16 Slot)
Slot1 PCI-E x4(in x16 Slot)
P2-DIMM3A
P2-DIMM3B
P2-DIMM2A
P2-DIMM2B
P2-DIMM1A
P2-DIMM1B
ALWAYS POPULATE DIMM A FIRST
CPU2
X8DTG-QF
Rev. 2.0
JP3
1
JP6
J18
JSMB1
JWOL
JWD
Intel 5520
IOH-36D
TPM
Intel
ICH 10R
PWR I2C
FAN7/CPU1
JPI2C
JBT1
JPW2
ALWAYS POPULATE DIMM A FIRST
FAN9
BIOS
T-SGPIO1
JTPM1
P1-DIMM1B
P1-DIMM1A
P1-DIMM2B
P1-DIMM2A
P1-DIMM3B
P1-DIMM3A
Intel 5520
IOH-36D
CPU1
T-SGPIO2
JPW1
JPW3
FAN1
FAN2
JD1
FAN3
FAN1 0
SP1
DP1
FP CTRL
JF1
JOH1
USB7
Battery
I-SATA4
I-SATA5
I-SATA3
USB6
JPUSB2
USB8/9
FAN4
JL1
I-SATA0
I-SATA2
I-SATA1
Warning: To avoid possible system overheating, please be sure to provide
adequate airfl ow to your system.
1-4
Chapter 1: Introduction
X8DTG-QF Quick Reference (See Chapter 2 for Details)
(HD) Audio/CD-In/FP Audio7.1 Channel High Defi nition Audio (JAUDIO1)/
CD-In (CD-1)/Front Panel Audio
COM1/COM2COM1/COM2 Serial Connections
FAN#1~10System/CPU Fan Headers (Fans 7~8: CPU Fans)
I-SATA0 ~ 5(Intel South Bridge) SATA Ports 0~5
JD1PWR LED (Pins 1~3)/Speaker (Pins 4~7)
JF1Front Panel Connector
JL1Chassis Intrusion
JOH1Overheat LED Indicator
JPW1,JPW2/JPW312V 24-pin Main PWR, 8-pin PWR Connectors
JSMB1System Management Bus I
2
C Header
JTPM1TPM (Trusted Platform Module) Header
JWOLWake-On_LAN
KB/MousePS2 Keyboard/Mouse
LAN1/2, IPMI_LANGigabit Ethernet Ports 1~2, IPMI LAN
SP1Internal Speaker/Buzzer Header
T-SGPIO-0/1Serial General Purpose IO Headers
USB 0/1, 2/3/4/5Backplane USB Ports 0/1, 2/3/4/5
USB 6, 7, 8/9Front Panel USB 6, 7, 8/9
VGAVideo Port
LEDDescription
DP1O nboar d Stan dby PWR war ning LED I ndic ator
D33BMC LED Indicator
1-5
X8DTG-QF User's Manual
Motherboard Features
CPU
Two Intel•
porting two full-width Intel QuickPath Interconnect (QPI) links with a total of up
to 51.2 GT/s Data Transfer Rate (6.4 GT/s per direction)
®
5500/5600 Series (LGA 1366) processors with each processor sup-
Memory
Twelve 240-pin DIMM sockets support up to 192* GB of Registered ECC or up •
to 48 GB of Unbuffered ECC/Non-ECC DDR3 1333/1066/800 MHz Memory . (For
Unbuffered ECC/Non-ECC memory, maximum of 4 GB per DIMM is supported.
See Section 2-4 in Chapter 2 for memory Population.) (*Refer to our memory
recommendation list posted on our website at www.supermicro.com.)
Chipset
Dual Intel 5520 chip platforms, including: dual 5520 (IOH-36D) chips and the •
ICH10R (South Bridge).
Expansion Slots
Four PCI-E Gen. 2.0 x16 slots (Slot 4, Slot 6, Slot 8, Slot 10)•
One PCI-E Gen. 1.0 x4 (in x16) slot (Slot 1)•
One PCI-E Gen. 2.0 x4 (in x16) slot (Slot 2)•
One PCI-E Gen. 2.0 x4 (in x8) slot (Slot 11)•
Two PCI 33 MHz slots (Slot 3, Slot 5)•
BIOS
4 GB AMI SPI Flash ROM•
ACPI 1.0/2.0/3.0, Plug and Play (PnP), DMI 2.3, SMBIOS 2.3, RTC (Real Time-•
Clock) Wake-up, PCI 2.2, Hardware BIOS Virus protection, and USB Keyboard
support
PC Health Monitoring
Onboard voltage monitors for CPU1 VCore, CPU2 VCore, +5Vin, • 12Vcc (V),
VP1 DIMM, VP2 DIMM, +3.3Vcc (V), and Battery Voltage
Fan status monitor with fi rmware control
•
CPU/chass is temper ature moni tors•
Platfo rm Enviro nment Co ntrol Inte rf ace (PECI) read y•
CPU fan auto - of f in sle ep mode•
CPU slow- dow n on tempe rature over heat•
Pulse Wi dth Mo dulati on (PW M) Fan Contro l•
CPU ther mal tr ip supp or t for pro ces sor pr otecti on, power L ED•
Power-up mod e cont rol for r ecover y fr om AC power l oss•
1-6
Chapter 1: Introduction
Auto- switc hing vol tage r egulato r for CPU c ore s•
System over heat /Fan Fail LED I ndic ator and c ontr ol•
System re sourc e aler t vi a Super o Doc tor III•
ACPI Features
Slow blinking LED for suspend state indicator•
Main switch override mechanism•
ACPI Pow er Ma nag eme nt•
Keyboard Wakeup from Soft-off •
Onboard I/O
Intel ICH10R supports six SA T A ports (RAID0, RAID1, RAID10, RAID5 supported •
in the Windows OS Environment and RAID 0, RAID 1, RAID 10 supported by
the Linux OS)
2.0 with K V M supp or t
Dual Intel 8 2574 Dual- L A N G iga bit Eth er net Co ntr olle rs s uppo r t du al Gi ga - bit
•
LAN ports
Onboar d PHY Chip su ppor ts IP MI dedic ated L AN
•
Two seri al por t c onnec tio ns (One rear p or t and on e front C OM hea der)•
Up to ten USB 2.0 (Unive rsal Se rial Bus) con necti ons (six rear USB ports, two •
front he ader s, and t wo Type A connec tion s)
VGA por t suppo rte d by the Win bond WP CM4 50 Co ntroll er
•
High Defi nition Audio sup por ted by the A LC88 8 Contr oller•
Super I/ O: Winbo nd W83 527HG •
Other
Console redirection•
Onboa rd Fan Spee d Contr ol by Ther mal Ma nagem ent via BI OS•
CD/Diskette Utilities
BIOS fl ash upgrade utility and device drivers•
Dimensions
Propr ietar y 13.00 " (L) x 15.20 " (W ) (330. 20 mm x 3 86.0 8 mm)•
1-7
X8DTG-QF User's Manual
Slot2
PCI-E 2.0
Slot4
PCI-E 2.0
Slot6
PCI-E 2.0
LAN1
LAN2
#0-2
#0-1
DDR3
PCI-E x4
x16
PCI-Ex16
x16
PCI-Ex16
x16
#0-6
#0-5
#0-4
#0-3
800/1066/1333
Ports 1,2
Ports 7,8,9,10
Ports 3,4,5,6
Slot1
PCI-E 1.0
x16
Intel
82574L
Intel
82574L
ALC888
AUDIO
CONN
BIOS
QPI
PCI-E x4
PCI-E x1
PCI-E x1
HD
SPI
PCI Slot3
DDR
Processor1
CSI1
Intel
5520
IOH 36D
Ports 1, 2, 3, 4
Port5
Port6
PCI 33MHZ
PCI Slot5
CSI0
ESI
ESI x4
ESI
QPI
Processor2
QPI
ICH10R
USB
WPCM450
BMC
CSI1
QPI
CSI0
Intel
5520
IOH 36D
LPC BUS
#1-3
#1-2
#1-1
DDR3
800/1066/1333
Ports 1,2
Ports 7,8,9,10
Ports 3,4,5,6
#1
#0
SATA2
#1
#0
USB2.0
SIO
W82527HG
#1-4
#4
#3
#2
SATA2
#3
#2
USB2.0
#1-5
#4
#1-6
PCI-E x4
PCI-E x16
PCI-E x16
#5
#0~#5
#9
#8
#7
#6
#5
#0~#9
SLB9635TT
Slot11
PCI-E 2.0
x8
Slot8
PCI-E 2.0
x16
Slot10
PCI-E 2.0
x16
6 FRONT
+ 2 Type A
6 REAR+2 Internal
TPM
Note: This is a general block diagram. Please see the previous Motherboard Features pages for details on the features of each motherboard.
VGA1
COM1
External
COM2
External/SOL
System Block Diagram
1-8
Third LAN
RTL8201N
Mouse
Keyboard
IPMI
LAN
Chapter 1: Introduction
1-2 System Overview
Built upo n the func tional ity and t he capab ility of t he Intel 55 00/5 60 0 Serie s Process or s an d Intel 5 52 0 ch ips et, t he X8 DTG - Q F mo the r boa rd p rovi de s th e perfo rmance an d feature set requir ed for dual- processo r-base d 4U servers opt imized
for High Performance Computing (HPC)/Cluster platforms. The Intel 5520 platform
consists of the 5500/5600 Series (LGA 1366) processor, the 5520 (IOH-36D), and
the ICH10R (South B ridge). With th e I nte l Q u i c k Pat h i nte rconnect (QPI) contr o l le r
built in, t he 550 0/5 600 S eries P roces sor is th e fi rst dual-proc essor plat form th at
offers the next generation point-to-point system interconnect, replacing the current
Front Side Bus T echnology, substantially enhancing system performance by utilizing ser ial link inte rcon nect ions wi th incr eased ba ndwid th and sc alabi lity.
The IOH connects to each processor through an independent QPI (QuickPath
interconnect) link. Each link consists of 20 pairs of unidirectional differential lanes
for tra nsmis sio n and re cei ving i n addit ion t o a dif fer entia l for wa rded c lo ck. A f ull width Q PI link pair p rovide s 84 si gnals. Ea ch proc ess or suppo rt s two Q uickPat h
links, one g oing to th e other pr oce ssor, and the oth er to the 5 520 chip s.
The 552 0 chip set supp or ts PC I Exp ress G en2 la nes pe er-to -pe er read a nd wr ite
transactions. The ICH10R provides multiple PCI-Express SATA and USB connections.
In additi on, the 5 520 plat for m also of fers a w ide ran ge of R AS (Relia bilit y, Availability and Serviceability) features. These features include memory interface ECC,
x4/x8 S ingle Devic e Data C orrec tion (SDD C), Cyclic Redund ancy Chec k (CRC),
parity protection, out-of-band register access via SMBus, memory mirroring,
memor y spa ring, a nd Hot- plug su ppor t on t he PCI -E xpre ss Inter f ace.
Main Features of the 5500/5600 Series Processor and the
5520 Chipset
Four processor cores in each processor with 8MB shared cache among cores•
Two full-width Intel QuickPath interconnect links, up to 6.4 GT/s of data transfer •
rate in each direction
Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and •
Concurrent bi-directional traffi c
1-9
X8DTG-QF User's Manual
1-3 Special Features
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when AC
power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Advanced BIOS
Setup section to change this setting. The default setting is Last State.
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the X8DTG-QF. All have
an onboard System Hardware Monitor chip that supports PC health monitoring.
An onboard voltage monitor will scan these onboard voltages continuously: CPU1
VCore, CPU2 VCore, +5Vin, 12Vcc (V), VP1 DIMM, VP2 DIMM, +3.3Vcc (V), and
Battery Voltage. Once a voltage becomes unstable, a warning is given or an error
message is sent to the screen. Users can adjust the voltage thresholds to defi ne
the sensitivity of the voltage monitor.
Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.
To avoid possible system overheating, please be sure to provide adequate
airfl ow to your system.
System Resource Alert
This feature is available when used with Supero D octor III in the Windows OS
environment or used with Supero Doctor II in Linux. Supero Doctor is used to
notif y the user of cer tain system events. For example, you can also confi gure
1-10
Chapter 1: Introduction
Supero Doctor to provide you with warnings when the system temperature, CPU
temperat ures, volt ages a nd fan spe eds go beyon d a pre- defi ned range.
1-5 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-
tion defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers.
In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with Windows XP/Windows 2003/Windows 2008/
Windows Vista Operating Systems.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
Main Switch Override Mechanism
When an ATX power supply is used, the power button can function as a system
suspend button to make the system enter a SoftOff state. The monitor will be
suspended and the hard drive will spin down. Pressing the power button again
will cause the whole system to wake-up. During the SoftOff state, the ATX power
supply provides power to keep the required circuitry in the system "alive." In case
the system malfunctions and you want to turn off the power, just press and hold
the power button for 4 seconds. This option can be set in the Power section of the
BIOS Setup routine.
1-6 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.
It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.02 or above. It must also be SSI compliant (For more
1-11
X8DTG-QF User's Manual
information, please refer to the web site at http://www.ssiforum.org/). Additionally, in
areas where noisy power transmission is present, you may choose to install a line
fi lter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.
Note 1. For the proprietary 20-pin main power connector (JPW1) and the
8-pin PCI-Exp. Graphic card power connectors (JPW2/JPW3) to work properly , please customize your power cables based on the SMC PWR Connector Pin-Out Defi nitions listed in the tables on Page 2-20 in Chapter 2.
Note 2. For the PCI-Exp. Graphic cards to work properly, please connect
the PCI-E graphic card power connectors (JPW2/JPW3) to the power
supply.
1-7 Overview of the Winbond WPCM450 Controller
The Winbond WPCM450, a Baseboard Management Controller (BMC), supports
the 2D/VGA-compatible Graphics Core with the PCI interface, Virtual Media, and
Keyboard/Video/Mouse (KVM) Redirection modules.
The WPCM450 BMC interfaces with the host system via a PCI interface to communicate with the graphics core. It supports USB 2.0 and 1.1 for remote keyboard/
mouse/virtual media emulation. It also provides LPC interface to control Super IO
functions. The WPCM450 is connected to the network via an external Ethernet
PHY module.
The WPCM450 communicates with onboard components via six SMBus interfaces,
fan control, Platform Environment Control Interface (PECI) buses.
Note: For more information on IPMI confi guration, please refer to the Em-
bedded IPMI User's Guide posted on our website at http://www.supermicro.
com/support/manuals/.
1-8 Super I/O
The Super I/O supports two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps
as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.
1-12
Chapter 2: Installation
Chapter 2
Installation
2-1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. T o prevent damage to your system board, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
Use a grounded wrist strap designed to prevent static discharge.•
Touch a grounded metal object before removing the board from the antistatic •
bag.
Handle the board by its edges only; do not touch its components, peripheral
•
chips, memory modules or gold contacts.
When handling chips or modules, avoid touching their pins.
•
Put the motherboard and peripherals back into their antistatic bags when not •
in use.
For grounding purposes, make sure your computer chassis provides excellent
•
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
Use only the correct type of onboard CMOS battery as specifi ed by the
•
manufacturer. Do not install the onboard battery upside down to avoid possible
explosion.
Unpacking
The motherboard is shipped in antist atic packag i n g t o avo id static da m a ge. When
unpacking the board, make sure the person handling it is static protected.
2-1
X8DTG-QF User's Manual
2-2 Motherboard Installation
All motherboards have standard mounting holes to fi t different types of chassis.
Make sure that the locations of all the mounting holes for both motherboard and
chassis match. Although a chassis may have both plastic and metal mounting
fasteners, metal ones are highly recommended because they ground the motherboard to the chassis. Make sure that the metal standoffs click in or are screwed in
tightly. Then use a screwdriver to secure the motherboard onto the motherboard
tray. Note: Some components are very close to the mounting holes. Please take
precautionary measures to prevent damage to these components when installing
the motherboard to the chassis.
Tools Needed
1. Phillips Screwdriver
2. Pan head #6 screws
Locations of Mounting Holes
X8DTG-QF
Rev. 2.0
Installation Instructions
Install the IO shield into the chassis. 1.
Locate the mounting holes on the 2.
motherboard. Refer to the layout
above for mounting hole locations.
Locate the matching mounting holes 3.
on the chassis. Align the mounting
holes on the motherboard against
the mounting holes on the chassis.
Install standoffs in the chassis as needed.4.
Install the motherboard into the chassis carefully to avoid damage to mother-5.
board components.
Warning: To avoid damaging the motherboard and its components, please
do not apply any force greater than 8 lb/sq.in (8 lbs. per square inch) when
installing a screw into a mounting hole.
Insert a Pan head #6 screw into a mounting hole on the motherboard and its 6.
matching mounting hole on the chassis, using a Phillips screwdriver.
Repeat Step 4 to insert #6 screws to all mounting holes.7.
Make sure that the motherboard is securely placed on the chassis.8.
2-2
2-3 Processor and Heatsink Installation
!
When handling the processor package, avoid placing direct pressure on
the label area of the fan.
Notes:
Always connect the power cord last and always remove it before adding, re-1.
moving or changing any hardware components. Make sure that you install the
processor into the CPU socket before you install the CPU heatsink.
Make sure to install the motherboard into the chassis before you install the 2.
CPU heatsink and heatsink fans.
When purchasing a motherboard without the 5500/5600 Series processor pre-3.
installed, make sure that the CPU socket plastic cap is in place, and none of
the CPU socket pins are bent; otherwise, contact the retailer immediately.
Chapter 2: Installation
Refer to the M B Features S ecti on for mo re deta ils on CPU s uppor t.4.
Installing an LGA 1366 Processor
Press the socket clip to release 1.
the load plate, which covers the
CPU socket, from its locking
position.
Gently lift the socket clip to 2.
open the load plate.
Hold the plastic cap at its north 3.
and south center edges to remove it from the CPU socket.
Socket Clip
Plastic Cap
Load Plate
Hold the north & south edges of
the plastic cap to remove it
2-3
X8DTG-QF User's Manual
After removing the plastic cap, using 4.
your thumb and the index fi nger,
hold the CPU at the north and south
center edges.
Align the CPU key, the semi-circle 5.
cutout, against the socket key, the
notch below the gold color dot on
the side of the socket.
Once both the CPU and the socket 6.
are aligned, carefully lower the CPU
straight down into the socket. (Do
not rub the CPU against the surface
of the socket or its pins to avoid
damaging the CPU or the socket.)
Socket Keys CPU CPU SocketLoad Plate
With the CPU inside the socket, in-7.
spect the four corners of the CPU to
make sure that the CPU is properly
installed.
Once the CPU is securely seated 8.
on the socket, lower the CPU load
plate to the socket.
Use your thumb to gently push the 9.
socket clip down to the clip lock.
Warning: Please save the plastic ca p. The mot her board m ust
be shipped with the plastic cap
properly installed to protect the
CPU socket pins. Shipment
without the plastic cap properly
installed will cause damage to
the socket pins.
CPU Keys
2-4
Installing a CPU Heatsink
Do not apply any thermal 1.
grease to the heatsink or the
CPU die because the required
amount has already been preapplied.
Chapter 2: Installation
Place the heatsink on top of the 2.
CPU so that the four mounting
holes are aligned with those on
the retention mechanism.
3. Install two diagonal screws (ie
the #1 and the #2 screws) and
tighten them until just snug (-do
not fully tighten the screws to
avoid possible damage to the
CPU.)
Screw#1
Screw#1
Install Screw#1
Screw#2
Screw#2
4. Finish the installation by fully
tightening all four screws.
2-5
X8DTG-QF User's Manual
Removing the Heatsink
Warni ng: We do not recommend that the CPU or the heatsink be removed. However, if you do need to remove the heatsink, please follow
the inst ructions be low to uninstall th e heatsink and prevent da mage to
the CPU or ot her co mpone nts.
Unplug the power cord from the 1.
power supply.
Disconnect the heatsink fan 2.
wires from the CPU fan header.
Using a screwdriver, loosen and 3.
remove the heatsink screws
from the motherboard in the sequence as show in the picture
on the right.
Using a screwdriver to
remove Screw#1
Hold the heatsink as shown 4.
in the picture on the right and
gently wriggle the heatsink to
loosen it from the CPU. (Do not
use excessive force when wriggling the heatsink.)
Once the heatsink is loosened, 5.
remove it from the CPU socket.
To reinstall the CPU and the 6.
heatsink, clean the surface of
the CPU and the heatsink to get
rid of the old thermal grease.
Reapply the proper amount of
thermal grease on the surface
before reinstalling them on the
motherboard.
Remove Screw#2
2-6
Chapter 2: Installation
2-4 Memory Installation
Note: Check the S uper micro we b site for r ecom mende d memor y mo dules .
CAUTION
Exercise extreme care when installing or removing DIMM
module s to prevent any po ssib le damag e. Also n ote that th e
memor y is i nterl eaved to imp rove per fo rman ce (See ste p 1).
DIMM Installation
Insert the desired number of DIMMs into the memory slots, starting with 1.
P1-DIMM 1A. For best memory performance, please install memory modules
of the same type and same speed on the memory slots as indicated on the
tables below.
Insert each DIMM module vertically into its slot. Pay attention to the notch 2.
along the bottom of the module to prevent inserting the DIMM module incorrectly.
Gently press down on the DIMM module until it snaps into place in the slot. 3.
Repeat for all modules.
The X8DTG-QF supports up to 192 GB* of Registered ECC or up to 48 GB of Unbuffered ECC/Non-ECC DDR3 1333/1066/800 MHz Memory in 12 DIMMs. (*Refer to
our memory recommendation list posted on our website at www.supermicro.com.)
Note1: For Unbuffered ECC/Non-ECC memory, maximum of 4 GB per
DIMM is supported.
Note 2: memory speed support is dependent on the type of CPU used
on the board.
DIMM Module Population Confi guration
For memor y to wor k pro perl y, follow the tab les be low for me mor y inst allati on.
Memory Support for the Motherboard w/5500 Processors Installed
RDIMM Population for the Motherboard with 5500 Processors Installed
DIMM
Slots per
Channel
21Reg. DDR3 ECC800,1066,1333SR or DR
21Reg. DDR3 ECC800,1066 (Note 1)QR
22Reg. DDR3 ECC800,1066 (Note 1)Mixing SR, DR
22Reg. DDR3 ECC800 (Note 2)Mixing SR, DR, QR
Note 1: 1333 RDIMMs will run at 1066 MHz (-BIOS automatic downgrading).
Note 2: 1333/1066 RDIMMs will run at 800 MHz (-BIOS automatic downgrading).
UDIMM Population for the Motherboard with 5500 Processors Installed
DIMM
Slots per
Channel
21Unb. DDR3 ECC/Non-ECC800,1066,1333SR or DR
22Unb. DDR3 ECC/Non-ECC800,1066 (Note)Mixing SR, DR
Note: 1333 UDIMMs will run at 800 MHz (-BIOS automatic downgrading)
Memory Support for the Motherboard w/5600 Processors Installed
1.5V DIMMs•
1.5V RDIMM Population for the Motherboard w/5600 Processors Installed
DIMM
Slots per
Channel
21Reg. DDR3 ECC800,1066,1333SR or DR
21Reg. DDR3 ECC800 , 1066 (Note 1)QR
22Reg. DDR3 ECC800,1066, 1333 Mixing SR, DR
22Reg. DDR3 ECC800 (Note 2)Mixing SR, DR, QR
Note 1: 1333 RDIMMs MHz will run at 1066 MHz (-BIOS automatic downgrading)
Note 2: 1333/1066 RDIMMs MHz will run at 800 MHz (-BIOS automatic downgrading)
Note 3: MIxing of 1.35V and 1.5V DIMMs is not recommended.
1.5V UDIMM Population for the Motherboard w/5600 Processors Installed
DIMM
Slots per
Channel
21Unb. DDR3 ECC/Non-ECC800,1066,1333SR or DR
22Unb. DDR3 ECC/Non-ECC800,1066, 1333Mixing SR, DR
Note 1: 1333 MHz for two DIMMs per channel is supported when Unbuf./ECC DIMMs are used.
Note 2: MIxing of 1.35V and 1.5V DIMMs is not recommended.
1.35V RDIMM Population for the Motherboard w/5600 Processors
Installed
DIMM
Slots per
Channel
21Reg. DDR3 ECC800,1066,1333SR or DR
21Reg. DDR3 ECC800 (Note 1)QR
22Reg. DDR3 ECC800,1066 (Note 2)Mixing SR, DR
22Reg. DDR3 ECC800 (Note 3)Mixing SR, DR, QR
Note 1: 1333/1066 QR RDIMMs MHz will run at 800 MHz (-BIOS automatic downgrading)
Note 2: 1333 SR/DR RDIMMs MHz will run at 800 MHz (-BIOS automatic downgrading)
Note 3: 1333 SR/DR/QR RDIMMs MHz will run at 800 MHz (-BIOS automatic downgrading)
Note 4: MIxing of 1.35V and 1.5V DIMMs is not recommended.
Note 1: Due to OS limitations, some operating systems may not show
more than 4 GB of memory.
Note 2: Due to memory allocation to system devices, the amount of mem-
ory that remains available for operational use will be reduced when 4 GB
of R AM is us ed. The r educt ion in m emor y avai labili ty is di spro por tio nal.
Possible System Memory Allocation & Availability
System DeviceSizePhysical Memory Available
Firmware Hub fl ash memory (System BIOS)1 MB3.99 GB
Local APIC4 KB3.99 GB
Area Reserved for the chipset2 MB3.99 GB
I/O APIC (4 Kbytes)4 KB3.99 GB
PCI Enumeration Area 1256 MB3.76 GB
PCI Express (256 MB)256 MB3.51 GB
PCI Enumeration Area 2 (if needed) -Aligned on 256-M
boundaryVGA Memory16 MB2.85 GB
TSEG1 MB2.84 GB
Memory available for the OS & other applications 2.84 GB
512 MB3.01 GB
(4 GB Total System Memory)
2-10
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