The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTW ARE, OR DATA ST ORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for
all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Manual Revision 1.1
Release Date: April 13, 2009
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
This manual is written for system integrators, PC technicians and
knowledgeable PC users. It provides information for the installation and use of the
X7DVL-L motherboard. The X7DVL-L supports dual Intel QuadCore and Dual-Core Xeon 5300/5100/5000 Series processors with a front side bus
speed of 1.333 GHz/1.066 GHz/667 MHz (Note). With two 64-bit dual-core processors built in, the X7DVL-L offers superior performance, system reliability and power
effi ciency for embedded, storage, and communications platforms. The features
supported by this motherboard include the Intel Core Microarchitecture, dual-core
with dual-processing capabilities, ultra dense low-power platform, larger cache
with 4 MB shared L2 capacity, the Intel Virtualization Technology, the Extended
Memory 64 Technology (EM64), and the Intel I/O Acceleration Technology (Intel I/
OA T). The X7DVL-L offers a superb solution for intense computing and complex I/O
environments, and is ideal for high-end server systems. Please refer to the motherboard specifi cations pages on our web site (http://www.supermicro.com/products/
motherboard/) for updates on supported processors. This product is intended to be
professionally installed. (Note: CPUs with 90W or less are recommended.)
Preface
Manual Organization
Chapter 1 describes the features, specifi cations and performance of the mainboard
and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when
installing the processor, memory modules and other hardware components into
the system. If you encounter any problems, see Chapter 3, which describes
troubleshooting procedures for the video, the memory and the system setup stored
in CMOS.
Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.
Appendix A lists BIOS POST Error Codes.
Appendix B and Appendix C listWindows OS and Other Software Programs
Installation Instructions.
Conventions Used in the Manual:
Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:
Danger/Caution: Instructions to be strictly followed to prevent catastrophic
system failure or to avoid bodily injury.
Warning: Important information given to ensure proper system installation or
to prevent damage to the components.
Note: Additional Information given to differentiate various models or to ensure cor-
rect system setup.
iii
X7DVL-L User's Manual
Table of Contents
Preface
About This Manual ...................................................................................................... iii
Manual Organization ................................................................................................... iii
Conventions Used in the Manual ..................................................................................iii
Appendix A: BIOS POST Error Codes .......................................................................A-1
Appendix B: Installing the Windows OS .................................................................... B-1
Appendix C: Installing Other Software Programs and Drivers...................................C-1
vi
Chapter 1: Introduction
Chapter 1
Introduction
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance. Check
that the following items have all been included with your motherboard. If anything
listed here is damaged or missing, contact your retailer.
All items are included in the retail box.
One (1) Supermicro Mainboard
One (1) ribbon cable for IDE devices (CBL-036L-03)
One (1) fl oppy ribbon cable (CBL-022L) Four (4) SATA cables (CBL-0044L) One (1) I/O backpanel shield (CSE-PT07L)
One (1) CPU Retention Module (SKT-0159L)
One (1) Supermicro CD containing drivers and utilities
One (1) User's/BIOS Manual
1-1
X7DVL-L User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc. 980 Rock Ave. San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information) support@supermicro.com (Technical Support)
Web Site: www.supermicro.com
Europe
Address: Super Micro Computer B.V. Het Sterrenbeeld 28, 5215 ML 's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information) support@supermicro.nl (Technical Support) rma@supermicro.nl (Customer Support)
Asia-Pacifi c
Address: Super Micro Computer, Inc. 4F, No. 232-1 Liancheng Road Chung-Ho 235, Taipei Hsien, Taiwan, R.O.C.
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3991
Web Site: www.supermicro.com.tw
Technical Support:
Email: support@supermicro.com.tw
Tel: 886-2-8228-1366, ext.132 or 139
1-2
X7DVL-L Image
Chapter 1: Introduction
Note: The drawings and graphics shown in this manual were based on the latest
PCB Revision available at the time of publishing of the manual. The motherboard
you’ve received may or may not look exactly the same as the graphics shown
in the manual.
1-3
X7DVL-L User's Manual
X7DVL-L Motherboard Layout
(not drawn to scale)
JKM1
J20
JCOM1
COM1
J15
VGA
FAN5
D31
VGA CTRL
J7B2 J7B3 J8B1
J7B1
JLAN1
JLAN2
KB/MS
USB0/1
S I/O
COM2
JCOM2
GLAN1
GLAN2
LAN CTRL
J10
J19
JWD
JPG1
J6
J22
8-Pin PWR
PWR Force
VGA Memory
JPW3
JPF
JP2
BIOS
Slot 6 PCI-Ex8
Slot 4 PCI 33MHz
Floppy
JI2C1
JI2C2
24-Pin PWR
DIMM2B
DIMM2A
DIMM1B
DIMM1A
Battery
JUSB1
USB2/3
JPL1
JPL2
JBT1
JWOL1
JPW1
North
Bridge
South
Bridge
Buzzer
SP1
SD1
JWOR1
Fan 1
J26
LE2
LE5
LE4
T-SPGIO
I-SATA1
I-SATA3
JS4
JS2
I-SATA0 I-SATA2
JS1
JS3
CPU 1
CPU 2
LE1
FP CTRL
JF1
Fan 4
Chassis.
Intrusion
Fan 3
Fan 2
LE6
IDE#1
J23
JIDE#1
Notes:
1. Jumpers not indicated are for test purposes only.
2. See Chapter 2 for detailed information on jumpers, I/O ports and
JF1 front panel connections.
3. " " indicates the location of Pin 1.
4. When LE1 is on, make sure to unplug the power cable before removing or installing components.
ConnectorDescription
ATX PWR (JPW1) Primary 24-Pin ATX PWR Connector
CPU PWR (JPW3) +12V 8-pin PWR
Chassis Intru.(J23) Chassis Intrusion Header
COM1/COM2 (JCOM1/2) COM1/COM2 Serial Port Connectors
DIMM#1A-DIMM#2B Memory DDR2 Fully Buffered DIMM Slots
FAN 1-5 Fans 3-5: System cooling/chassis fans, Fans 1-2:CPU
fans
Floppy (J22) Floppy Disk Drive Connector
FP Control (JF1) Front Control Panel Connector
GLAN 1/2 (JLAN1/2) G-bit Ethernet Ports
IDE#1 (JIDE1) IDE#1 Hard Drive
Keyboard/Mouse (JKM1) Keyboard/Mouse Connectors
PWR LED/SPKR (JD1) Power LED(pins1-3)/SpeakerHeader (pins 4-7)
PWR Force-On (JPF, JP2)Power Force-On
SATA0-SATA3 (JS1-JS4) Intel SATA 0-3 Connectors
Slot#4 (J6) PCI 33MHz Slot
Slot#6 (J10) PCI-Exp. x8 Slots
T-SGPIO (J26) Serial General Purpose Input/Output Header
USB 0/1 (J20) Back Panel USB 0/1
USB 2/3 (JUSB1) Front Panel Accessible USB 2/3
VGA (J15) VGA Port
WOL (JWOL1) Wake-on-LAN Header
WOR (JWOR1) Wake-on-Ring Header
LED IndicatorDescription
D31 Status LED (See Pg. 2-26)
LE1 Power LED (See Note 4 on the previous page.)
LE2/LE6 (See Pg. 2-27) CPU1 VRM Overheat(LE2)/CPU2 VRM Overheat (LE6)
LE4/LE5 POST-Code LED Indicators (See Pg. 2-26)
Note: Refer to Chapter 2 for more information on connectors and jumpers.
1-5
X7DVL-L User's Manual
Motherboard Features
CPU
• Dual Intel
®
64-bit LGA 771 Quad-Core/Dual-Core Xeon 5300/5100/5000 Series
processors at a front side bus speed of 1.333 GHz/1.066 GHz/667 MHz (Note:
CPUs with 90W or less are recommended.)
Memory
• Four 240-pin DIMM sockets with support up to 16 GB ECC FBD (Fully Buffered)
DDR2 667/533 Memory (See Section 2-3 in Chapter 2 for DIMM Slot Population.)
Chipset
• Intel 5000V (Blackford-VS) chipset, including: the 5000V Memory Control Hub
(MCH) and the Enterprise South Bridge 2 (ESB2)
Expansion Slots
• One PCI-E slot (one x8-Slot#6)
• One 32-bit PCI 33 MHz slot (Slot#4)
BIOS
• 8 Mb Phoenix
®
Flash ROM
• DMI 2.3, PCI 2.2, ACPI 1.0, Plug and Play (PnP), USB Keyboard support, Hardware BIOS Virus Protection and SMBIOS 2.3
PC Health Monitoring
• Onboard voltage monitors for CPU cores, +1.8V, +3.3V, +5V, 12V, 12V,
+3.3V standby, +5V standby and VBAT
• Fan status monitor with fi rmware control
• CPU/chassis temperature monitors
• Low noise fan speed control
• Platform Environment Control Interface (PECI) ready
• CPU fan auto-off in sleep mode
• Pulse Width Modulation (PWM) fan control
2
• I
C temperature sensing logic
• Thermal Monitor 2 (TM2) support
• CPU slow-down on temperature overheat
• CPU thermal trip support for processor protection
• Power-up mode control for recovery from AC power loss
• Chassis intrusion detection
• System resource alert via Supero Doctor III
1-6
Chapter 1: Introduction
ACPI Features
• Slow blinking LED for suspend state indicator
• Main switch override mechanism
• ACPI Power Management
• Power-on mode for power recovery
Onboard I/O
• Intel ESB2 supports four SATA ports (with RAID0, RAID1, RAID10 and RAID5
supported in the Window OS environment)
• The 82563EB supports two Giga-bit LAN ports
• One EIDE Ultra DMA/100 bus master interface
• One fl oppy port interface
• Two COM ports(1 header, 1 port)
• Up to four USB 2.0 (Universal Serial Bus) (2 ports, 1 Header)
• Xgi Z7 Graphic Controller
• Super I/O: Winbond W83627DHG
Other
• External modem ring-on
• Wake-on-LAN (WOL)
• Wake-on-Ring (WOR)
• Console redirection
• Onboard Fan Speed Control by Thermal Management via BIOS
CD/Diskette Utilities
• BIOS fl ash upgrade utility and device drivers
Dimensions
• Proprietary 10" x 9.6" (254mm x 243.8mm)
1-7
X7DVL-L User's Manual
VGA
CONN
VGA
XGI Z7
VRM
ISL6312
J10
#6
PCI-EXP_x8_SLOT
J6
#1
3.0 Gb/S
PROCESSOR#2
1067/1333
PCI-EXP x8
PCI 32/33MHz
MT/S
PORT
#1,2
PORT
#0
PORT
#4,5
PORT
#6,7
PORTPORT
#4
PROCESSOR#1
1067/1333
MCH
PORT PORT
#0
#2,3
PCIEx8
PCIEx4
#3
ESB2
MT/S
FBD CHNL0
FBD CHNL1
ATA 100
3.0 Gb/S
USB 2.0
#0
#0
VRM
ISL6312
#1B#2B
#1A#2A
FBD DIMM
IDE CONN
#3
#2
#1
SATA
#3
#2
#1
USB
FBD DIMM
SIO
DHG
MS
KB
LPC
COM1
COM2
PCI32_SLOT
RJ45
RJ45
KUMERAN
GB LANFWH
GILGAL
W83627
FDD
Block Diagram of the 5000V Chipset
Note: This is a general block diagram. Please see the previous Motherboard Features
pages for details on the features of each motherboard.
1-8
Chapter 1: Introduction
1-2 Chipset Overview
Built upon the functionality and the capability of the 5000V (Blackford-VS) chipset,
the X7DVL-L motherboard provides the performance and feature set required for
dual processor-based servers with confi guration options optimized for communica-
tions, presentation, storage, computation or database applications. The 5000V
®
(Blackford-VS) chipset supports a single or dual Intel
5300/5100/5000 Series processor(s) with front side bus speeds of up to 1.333 GHz.
The chipset consists of the 5000V (Blackford-VS) Memory Controller Hub (MCH),
and the Enterprise South Bridge 2 (ESB2). (Note)
The 5000V (Blackford-VS) MCH chipset is designed for symmetric multiprocessing
across two independent front side bus interfaces. Each front side bus uses a 64-bit
wide, 1333 MHz data bus that transfers data at 10.7 GB/sec. The MCH chipset connects up to four Fully Buffered DIMM modules, providing a total memory bandwidth
of up to 16.0 GB/s. The MCH chipset also provides one x8 PCI-Express and one x4
ESI interfaces to the ESB2. In addition, the 5000V (Blackford-VS) chipset offers a
wide range of RAS features, including memory interface ECC, x4/x8 Single Device
Data Correction, CRC, parity protection, memory mirroring and memory sparing.
Quad-Core/Dual-Core Xeon
The Xeon Dual Core Processor Features
Designed to be used with conjunction of the 5000V chipset, the Xeon dual core
Processor provides a feature set as follows:
The Xeon Dual Core Processors
L1 Cache Size: Instruction Cache (32KB/16KB), Data Cache (32KB/24KB)
•
L2 Cache Size: 4MB/2MB (per core)•
Data Bus Transfer Rate: 8.5 GB/s•
Package: FC-LGA6/FC-LGA4, 771 Lands•
The Xeon Quad• Core Processors
L1 Cache Size: Instruction Data Cache (32KB per core)
•
L2 Cache Size: Shared 4MB per die (8MB Total Cache per processor)•
Data Bus Transfer Rate: 8.5 GB/s•
Package: FC-LGA6/FC-LGA4, 771 Lands•
Note: CPUs with 90W or less are recommended.
1-9
X7DVL-L User's Manual
1-3 Special Features
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when AC
power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must hit the power switch to turn it back on)
or for it to automatically return to a power- on state. See the Power Lost Control
setting in the Advanced Setup section to change this setting. The default setting
is Last State.
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the X7DVL-L. All have
an onboard System Hardware Monitor chip that supports PC health monitoring.
Onboard Voltage Monitoring
An onboard voltage monitor will scan the following voltages continuously:
Onboard Voltage Monitors for the CPU Cores, Chipset Voltage, +1.8V, +3.3V,
+5V, +12V, -12V, +3.3V Standby, +5V Standby and VBAT. Once a voltage
becomes unstable, a warning is given or an error message is sent to the screen.
Users can adjust the voltage thresholds to defi ne the sensitivity of the voltage
monitor.
Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature reaches a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects that the CPU temperature is too high, it will automatically turn on the thermal
fan control to lower the CPU temperature. The onboard chassis thermal circuitry
can monitor the overall system temperature and alert the user when the chassis
temperature is too high.
1-10
Chapter 1: Introduction
System Resource Alert
This feature is available when used with Supero Doctor III in the Windows OS
environment or used with Supero Doctor II in Linux. Supero Doctor is used to
notify the user of certain system events. For example, if the system is running
low on virtual memory and there is insuffi cient hard drive space for saving the
data, you can be alerted of the potential problem. You can also confi gure Supero
Doctor to provide you with warnings when the system temperature goes beyond
a pre-defi ned range.
1-5 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi -
cation defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including its
hardware, operating system and application software. This enables the system to
automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers.
In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with Windows 2000, Windows XP and Windows
2003 Servers/Systems.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
Main Switch Override Mechanism
When an ATX power supply is used, the power button can function as a system suspend button to make the system enter a SoftOff state. The monitor will be suspended
and the hard drive will spin down. Pressing the power button again "wake-up" the
whole system. During the SoftOff state, the ATX power supply provides power to
keep the required circuitry in the system "alive." In case the system malfunctions
and you want to turn off the power, just press and hold the power button for 4 seconds. This option can be set in the Power section of the BIOS Setup routine.
1-11
X7DVL-L User's Manual
External Modem Ring-On
Wake-up events can be triggered by a device such as the external modem ringing
when the system is in the Standby or Off state. Note that external modem ring-on
can only be used with an ATX 2.01 (or above) compliant power supply.
Wake-On-LAN
Wake-On-LAN is defi ned as the ability of a management application to remotely
power up a computer that is powered off. Remote PC setup, up-dates and asset
tracking can occur after hours and on weekends so that daily LAN traffi c is kept
to a minimum and users are not interrupted. The motherboard has a 3-pin header
(WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has
WOL capability. In addition, an onboard LAN controller can also support WOL
without any connection to the WOL header. The 3-pin WOL header is to be used
with a LAN add-on card only.
Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power supply.
1-6 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.
The X7DVL-L can only accommodate 24-pin ATX power supply. Although most
power supplies generally meet the specifi cations required by the motherboard,
some are inadequate. You should use one that will supply at least 400W of power.
In addition, the 12V 8-pin is also required for adequate power supply to the CPU.
Also your power supply must supply 1.5A for the Ethernet ports.
It is strongly recommended that you use a high quality power supply that meets
ATX power supply Specifi cation 2.02 or above. It must also be SSI compliant (For
detailed information, please refer to the web site at http://www.ssiforum.org/). Additionally, in areas where noisy power transmission is present, you may choose to
install a line fi lter to shield the computer from noise. It is recommended that you also
install a power surge protector to help avoid problems caused by power surges.
1-7 Super I/O
The disk drive adapter functions of the Super I/O chip include a fl oppy disk drive
controller that is compatible with industry standard 82077/765, a data separator,
write pre-compensation circuitry , decode logic, data rate selection, a clock generator ,
drive interface control logic and interrupt and DMA logic. The wide range of functions
integrated onto the Super I/O greatly reduces the number of components required
1-12
Chapter 1: Introduction
for interfacing with fl oppy disk drives. The Super I/O supports 360 K, 720 K, 1.2
M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s or
1 Mb/s.It also provides two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps
as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.
1-13
X7DVL-L User's Manual
Notes
1-14
Chapter 2: Installation
Chapter 2
Installation
2-1 Static-Sensitive Devices
Electric-Static-Discharge (ESD) can damage electronic com ponents. To prevent
damage to your system board, it is important to handle it very carefully . The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic
bag.
• Handle the board by its edges only; do not touch its components, peripheral
chips, memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in
use.
• For grounding purposes, make sure your computer chassis provides excellent
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
• Use only the correct type of onboard CMOS battery as specifi ed by the manu-
facturer. Do not install the onboard battery upside down to avoid possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When
unpacking the board, make sure the person handling it is static protected.
2-1
X7DVL-L User's Manual
!
2-2 Processor and Heatsink Installation
When handling the processor package, avoid placing direct pressure on
the label area of the fan.
*Notes: 1. Always connect the power cord last and remove it before adding, removing or changing any components. Make sure to install the processor into the CPU
socket before you install the CPU heatsink.
2. Intel's boxed Xeon CPU package contains the CPU fan and heatsink assembly.
If you buy a CPU separately, use only Intel-certifi ed heatsink and fan.
3. Make sure to install the Heatsink Backplate and the motherboard into the chassis
before you install the CPU heatsink and fan.(*See Installation Procedures below.)
4. When purchasing a motherboard with an LGA 771 CPU Socket, make sure that
the CPU plastic cap is in place and none of the CPU Socket pins are bent; otherwise, contact the retailer immediately.
5. All graphics shown in this manual are for reference only. The components that
came with your motherboard may or may not look exactly the same as the pictures
shown in this manual.
Installation Procedures
For proper system setup, please follow
the procedure below to install the CPU,
backplate, heatsink, and motherboard
into the chassis.
1. Install the heatsink backplate onto the
chassis.
2. Install the motherboard into the chassis.
3. Install the CPU onto the motherboard.
4. Install the heatsink or/and cooling fans
(if any).
5. Connect fan and power cables (if
any).
Mounting the Backplate onto the Chassis
Mounting Hole
1. On the backplate, locate the text and
the arrow, indicating "facing front."
Heatsink
CPU
CPU Socket
Motherboard
CPU Retention
Bracket (Preinstalled)
Backplate
SKT0159 Backplate
Mounting Hole
Arrow
Facing
Front (Text)
Mounting Hole
2-2
Mounting Hole
2. Locate the front side of the chassis.
3. Locate the four backplate mounting
holes on the chassis.
4. Align the backplate with the chassis.
Make sure that the arrow on the backplate is pointing at the front side of the
chassis.
5. Once the backplate is correctly oriented, align the four heatsink mounting holes
on the backplate against their respective
mounting holes on the chassis. (*Note:
The two mounting holes on the center of
the backplate are optional.)
6. Once aligned, securely attach the
backplate onto the chassis by installing
the screws into the mounting holes.
Chapter 2: Installation
The Front Side of Chassis
Mounting
Holes
Backplate inside the Chassis
(w/Mounting holes aligned)
Mounting the Motherboard into the Chassis
All motherboards have standard mounting
holes to fi t different types of chassis. Make
sure that the locations of all the mounting
holes for both motherboard and chassis
match. Make sure that the metal standoffs
click in or are screwed in tightly . Then, use
a screwdriver to secure the motherboard
onto the motherboard tray.
*Note: some components are very close to the mounting holes. Please take
precautionary measures to prevent any damage done to these components when
you install the motherboard into the chassis.)
Mounting MB into the Chassis
Mounting Hole
Installation of the LGA771 Processor
1. Press the load lever to release the load
plate, which covers the CPU socket, from
its locking position.
Load Lever
PnP Cap on
top of the
Load Plate
2. Gently lift the load lever to open the
load plate.
2-3
Lift the Load
Lever to open
the Load Plate
X7DVL-L User's Manual
!
3. Use your thumb and index fi nger to hold
the CPU at the North Center Edge and the
South Center Edge of the CPU.
Load Plate
(w/PnP Cap
attached)
4. Align CPU Pin1 (the CPU corner marked
with a triangle) against the socket corner that
is marked with a triangle cutout.
5. Align the CPU key that is the semi-circle
cutout below a gold dot against the socket
key, the notch on the same side of the triangle cutout on the socket.
6. Once aligned, carefully lower the CPU
straight down to the socket. (**Do not drop
the CPU on the socket. Do not move the
CPU horizontally or vertically. Do not rub the
CPU against the surface or against any pins
of the socket to avoid damage done to the
CPU or the socket.)
7. With the CPU inside the socket, inspect
the four corners of the CPU to make sure
that the CPU is properly installed. Then,
close the load plate.
North Center
Edge
South Center
Edge
Socket Key
(Socket Notch)
CPU Key
(semi-circle
cutout) below
the circle.
Corner with a
triangle cutout
Load Lever
gold dot
CPU Pin1
8. Use your thumb to gently push the load
lever down to lock it.
9. If the CPU is properly installed into the
socket, the plastic cap will be automatically
released from the load plate when the clip is
pushed in the clip lock. Remove the plastic
cap from the motherboard.
(Warning: Please save the plastic PnP
cap. The motherboard must be shipped
with the PnP cap properly installed to
protect the CPU socket pins. Shipment
without the PnP cap properly installed
will cause damage to the socket pins.)
2-4
CPU in the CPU socket
Plastic cap is
released from
the load plate
if CPU properly
installed.
Chapter 2: Installation
!
Installation and Removal of the Heatsink
CEK Heatsink Installation
1. Do not apply any thermal grease to the
heatsink or the CPU die; the required amount
has already been applied.
2. Place the heatsink on top of the CPU so that
the four mounting holes are aligned with those
on the retention mechanism.
3. Screw in two diagonal screws (ie the #1 and
the #2 screws) until just snug (-do not overtighten the screws to avoid possible damage
to the CPU.)
4. Finish the installation by fully tightening all
four screws.
To Un-install the Heatsink
CEK Passive Heatsink
Screw#1
Screw#2
Screw#1
Screw#2
Warning: We do not recommend that the CPU or the heatsink be removed.
However, if you do need to uninstall the heatsink, please follow the instructions on the next page to uninstall the heatsink to avoid damaging the CPU
or the CPU socket.
1. Unscrew and remove the heatsink screws
from the motherboard in the sequence as show
in the picture on the right.
2. Hold the heatsink as shown in the picture
on the right and gently wriggle the heatsink to
loosen it from the CPU. (Do not use excessive
force when wriggling the heatsink!!)
3. Once the heatsink is loosened, remove the
heatsink from the CPU socket.
4. Clean the surface of the CPU and the
heatsink to get rid of the old thermal grease.
Reapply the proper amount of thermal grease
on the surface before you re-install the CPU
and the heatsink.
Screw#1
Screw#4
Screw#3
Screw#2
2-5
X7DVL-L User's Manual
2-3 Installing DIMMs
Note: Check the Supermicro web site for recommended memory modules.
CAUTION
Exercise extreme care when installing or removing DIMM
modules to prevent any possible damage. Also note that the
memory is interleaved to improve performance (see step 1).
DIMM Installation
1. Insert the desired number of DIMMs into the memory slots, starting with DIMM
#1A. (*See the Memory Installation Table Below.)
2. Insert each DIMM module vertically into its slot. Pay attention to the notch along
the bottom of the module to prevent inserting the DIMM module incorrectly.
3. Gently press down on the DIMM module until it snaps into place in the slot.
Repeat for all modules (see step 1 above).
Memory Support
The X7DVL-L supports up to 16 GB fully buffered (FBD) ECC DDR2 667/533 in 4
DIMMs. Populating DIMM modules with (a) pair(s) of memory modules of the same
size and same type will result in better memory performance.
Note 1: Due to OS limitations, some operating systems may not show more than 4
GB of memory. (See the DIMM Population Confi gurations Table below.)
(*Notes: i. DIMM slot# specified: DIMM slot to be
populated; “---“: DIMM slot not to be populated. ii.
Both FBD 533 MHz and 667MHz DIMMs are
supported; however, you need to use the memory
modules of the same speed and of the same type
on a motherboard. iii. Interleaved memory is
supported when pairs of DIMM modules are
installed in both
Bank1 and Bank2. iv. For
memory to work properly, you need to follow the
restrictions listed above. )
Note 2: Due to memory allocation to system devices, memory remaining available for operational use will be reduced when 4 GB of RAM is used. The reduction
in memory availability is disproportional. (Refer to the Memory Availability Table
below for details.)
2-6
Possible System Memory Allocation & Availability
Chapter 2: Installation
System DeviceSizePhysical Memory
Firmware Hub fl ash memory
(System BIOS)
Local APIC4 KB3.99
Area Reserved for the chipset2 MB3.99
I/O APIC (4 Kbytes)4 KB3.99
PCI Enumeration Area 1256 MB3.76
PCI Express (256 MB)256 MB3.51
PCI Enumeration Area 2 (if
needed) -Aligned on 256-MB
boundary-
VGA Memory16 MB2.85
TSEG1 MB2.84
Memory available to OS and
other applications
1 MB3.99
512 MB3.01
Remaining (-Available)
(4 GB Total System Memory)
2.84
Installing and Removing DIMMs
To Remove:
Use your thumbs
to gently push
the release tabs
near both ends of
the module. This
should release it
from the slot.
DDR2 FBD DIMM
To Install: Insert module vertically and press down until it
snaps into place. Pay attention to the alignment notch at
the bottom.
Top View of DDR2 FBD Slot
2-7
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