The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. IN PARTICULAR, SUPERMICRO SHALL NOT HAVE LIABILITY FOR ANY
HARDWARE, SOFTW ARE, OR DA TA STORED OR USED WITH THE PRODUCT, INCLUDING THE
COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH
HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all
claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class B
digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
manufacturer’s instruction manual, may cause interference with radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, you are encouraged to try to correct the interference by one or more
of the following measures: Reorient or relocate the receiving antenna. Increase the separation
between the equipment and the receiver. Connect the equipment into an outlet on a circuit different
from that to which the receiver is connected. Consult the dealer or an experienced radio/television
technician for help.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used
in this product may expose you to lead, a chemical
known to the State of California to cause birth defects
and other reproductive harm.
Manual Revision: Rev. 1.0b
Release Date: August 4, 2009
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
This manual is written for system integrators, PC technicians, and knowledgeable
PC users. It provides information for the installation and use of the
motherboard. The
processors with a front side bus speed of 1.333 GHz/1.066 GHz/667 MHz. With two
64-bit Quad-Core and Dual-Core processors built-in, the X7DA3+ offers substantial
functionality enhancements to the motherboards based on the Intel Quad-Core/
Dual-Core architecture while remaining compatible with the IA-32 software. The
features include the Intel Virtualization Technology , Thermal Monitor 1/2 (TM1/TM2),
Enhanced Intel SpeedStep technology, Advanced Dynamic Execution, Advanced
Transfer Cache, Streaming SIMD Extensions 3 (SSE3) and Extended Memory 64
Technology (EM64T). These features allow the motherboard to operate at higher
speeds with better power management in safer thermal environments than the
traditional motherboards. The X7DA3+ is ideal for high performance quad processor or dual processor workstation and server environments. Refer to our web site
(http://www.supermicro.com/products/) for updates on supported processors. This
product is intended to be professionally installed.
X7DA3+ supports dual Intel Quad-Core and Dual-Core
X7DA3+
Preface
Manual Organization
Chapter 1 describes the features, specifi cations and performance of the mother-
board and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when in-
stalling the processor, memory modules and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes troubleshooting procedures for video, memory and system setup stored in CMOS.
Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.
Appendix A and Appendix B provide BIOS POST Messages and POST Codes.
Appendix C, Appendix D and Appendix E listHostRAID, Windows OS and Other
Software Program Installation Instructions.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:
Danger/Caution: Instructions to be strictly followed to prevent catastrophic system failure or to avoid bodily injury.
Warning: Important information given to ensure proper system installation
or to prevent damage to the components.
Note: Additional Information given to differentiate various models or to ensure correct system setup.
iii
X7DA3+ User's Manual
Table of Contents
Preface
About This Manual ...................................................................................................... iii
Manual Organization ................................................................................................... iii
Conventions Used in the Manual ..................................................................................iii
Appendix A: BIOS POST Messages ..........................................................................A-1
Appendix B: BIOS POST Codes ................................................................................ B-1
Appendix C: Installing the Adaptec HostRAID Utility and the Windows OS ............ C-1
Appendix D: Intel HostRAID and the Windows OS Setup Guidelines ...................... D-1
Appendix E: Installing Other Software Programs and Drivers ..................................E-1
vi
Chapter 1: Introduction
Chapter 1
Introduction
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance. Check
that the following items have all been included with your motherboard. If anything
listed here is damaged or missing, contact your retailer.
All the items are included in the retail box.
One (1) Supermicro Mainboard
One (1) ribbon cable for IDE devices (CBL-0036L-02)
One (1) fl oppy ribbon cable (CBL-0022L)
Four (4) SATA cables (CBL-0044L)
Two (2) I-Pass-to-4 SATA Straight Through Cables (CBL-0097L-02)
One (1) I/O backpanel shield (MCP-260-74301-0N)
One (1) Supermicro CD containing drivers and utilities
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3991
Web Site:www.supermicro.com.tw
Technical Support:
Email:support@supermicro.com.tw
Tel: 886-2-8228-1366, ext.132 or 139
1-2
X7DA3+ Image
Chapter 1: Introduction
Note:The drawings and pictures shown in this manual were based on the latest
PCB Revision available at the time of publishing of the manual. The motherboard
you’ve received may or may not look exactly the same as the graphics shown in
the manual.
1-3
X7DA3+ User's Manual
X7DA3+ Motherboard Layout
(not drawn to scale)
KB/
Mouse
USB
1/2/
CO
LAN1/2
HD
Audio
/
0
3
1
M
1NALJ
Parrallel
Port
GLAN
R
CTL
Fan5
Fan6
UPER X7DA3+
S
CD1
Audio
CTRL
Slot7
SIM LP IPMI
6
Slot
PCI-Exp x16
Slot5
PCI-33MHz
2
2
C4
JI
C3
JI
Slot4
Slot3
Slot2
JWOR
Slot1
x4
PCI-Exp
JWD
I-X 133 MHz
PC
JPL2
JPL1
PCI-X 133 MHz
JI
PCI-X 100 MHz ZCR (Green Slot)
4-Pin
PWR
JPW2
24-Pin
ATX PWR
DIMM 4B (Bank 4)
DIMM 4A (Bank 4)
DIMM 3B (Bank 3)
DIMM 3A (Bank 3)
DIMM 2B (Bank 2)
DIMM 2A (Bank
DIMM
1B (Bank 1)
DIMM 1A (Bank 1)
®
2
2
2
C
JI
C1
2)
Batter
CPU
Fan 1
JPW1
Greencreek
North Bridge
y
JL
1
SATA
SMB
0
Fan7
J3P
JB
SATA
T1
PXH
J17
JAR
1
SATA
SATA
PSF
4
2
USB4/5
SATA
SATA
CPU1
2
CPU
CPU
JCF1
h
t
ou
S
Bridge
SAS
Controller
5
3
JWOL
SAS ACT4-7 LEDs
Fan2
BIOS
Fan8
JWF
JPS1
8-pin PWR
Fan3
yp
po
1
lF
ACT4-7
AC
T
0-3
JS1
JPW3
LE
SAS4-
SAS0-3
0
1FJ
SPK
PW LED
1
SGPIO
SGPIO2
h
s
al
F t
c
apm
oC
Fan4
1n
aF
FP Control
2
na
F
JOH1
1
1
E
DI
7
Notes:
1. Jumpers not indicated are for test purposes only.
2. See Chapter 2 for detailed information on jumpers, I/O ports and JF1 front panel
connections.
3. " " indicates the location of Pin 1.
4. Please install the ZCR card on the green slot for it to work properly.
5. The drawings and pictures shown in this manual were based on the latest
PCB Revision available at the time of publishing of the manual. The motherboard
you’ve received may or may not look exactly the same as the graphics shown in
the manual.
SAS ACT0-3 LEDs
1-4
Chapter 1: Introduction
Quick Reference (X7DA3+)
Jumper Description Default Setting
J3P 3rd PWR Failure Detect
JAR Alarm Reset Off (Disabled)
JBT1 CMOS Clear See Chapter 2
JCF1 Compact Card Master/Slave Select On (Master)
JI2C1/JI2C2 SMB to PCI-X Slots Pins 2-3 (Disabled)
JI2C3/JI2C4 SMB to PCI-E Slots Pins 2-3 (Disabled)
JPS1 SAS Controller Enable Pins 1-2 (Enabled)
JPL1/ JPL2 GLAN1/GLAN2 Enable Pins 1-2 (Enabled)
JWD Watch Dog Pins 1-2 (Reset)
ConnectorDescription
ATX PWR (JPW1) Primary 24-Pin ATX PWR Connector
Aux. PWR/CPU PWR +12V 4-pin PWR (JWP2)/+12V 8-pin PWR(JPW3)
HD Audio (JC1) High Defi nition Audio Connector (JC1)
Chassis Intrusion (JL1) Chassis Intrusion Header
COM1 (JCOM1) COM1 Serial Port Connector
Compact PWR (JWF1) Compact Card PWR Connector
DIMM#1A-DIMM#4B Memory DDRII Fully Buffered DIMM Slots
FAN 1-8 Fans 1-8 (Fan7: CPU Fan1, Fan8: CPU Fan2)
Floppy (J22) Floppy Disk Drive Connector
FP Control (JF1) Front Control Panel Connector
GLAN 1/2 (JLAN1) G-bit Ethernet Ports
IDE1/IDE2(Note 1 Below)IDE1 Hard Drive (JIDE1)/Compact Flash Card (JIDE2)
LE1 LED (Note 2 Below) 5V Standby PWR LED Indicator
OH LED (JOH1) Overheat LED
Parallel (J21) Parallel (Printer) Port
PWR LED/SPKR (JD1) PWR LED(pins1-3)/SpeakerHeader (pins 4-7)
PWR SMB (J17) Power System Management (I
PSF Power Supply Failure (See Chapter 2)
SAS#0-#3,#4-#7(JSM1/2) SAS (Serial Attached SCSI) Connectors #0-#3, #4-#7
SATA#0-#5(JS1-JS6) Serial ATA Connectors #0-5
SGPIO 1/2(J29,J30) Serial General Purpose Input/Output Headers
SMB (J18) System Management Bus Header
Slot 7 SIM Low Profi le IPMI Connector
USB 0/1/2/3 (JUSB1) Back Panel USB 0/1/2/3(JUSB1)
USB 4/5 (JUSB2) Front Panel USB4/5 (JUSB2)
WOL (JWOL) Wake-on-LAN Header
WOR (JWOR) Wake-on-Ring Header
Notes: 1.JIDE2 is for Compact Card Use only. JCF1 is used to confi gure the com-
pact fl ash card as a master or a slave drive. Be sure to connect JWF1 to a power
supply to provide power to the compact fl ash card. 2. When LE1 is on, the Standby
Power is on. Unplug the PWR cables before changing components.
Off (Disabled)
2
C) Header
1-5
X7DA3+ User's Manual
Motherboard Features
CPU
• Dual Intel
®
64-bit LGA 771 Quad-Core/Dual-Core Xeon 5300/5100/5000 Series
processors at a front side bus speed of 1.333 GHz/1.066 GHz/667 MHz
Memory
• Eight 240-pin DIMM sockets with support up to 32 GB ECC DDR2 FBD 667/533
Memory (See Section 2-3 in Chapter 2 for DIMM Slot Population.)
Chipset
• Intel 5000X (Greencreek) chipset, including: the 5000X (Greencreek) Memory
Control Hub (MCH), the Enterprise South Bridge 2 (ESB2), and the I/O subsystem (PXH-V).
Expansion Slots
Two PCI-E slots (one x16 signal on x16 slot, one x4 signal on x16 slot)
Three 64-bit PCI-X slots (two: PCI-X-133 slots, one PCI-X-100 ZCR Slot)
One PCI-33 MHz slot
One Low Profi le IPMI slot
BIOS
• 8 Mb Phoenix
®
Flash ROM
• DMI 2.1, PCI 2.2, ACPI 1.0, Plug and Play (PnP), SMBIOS 2.3, PCI-X 1.0
PC Health Monitoring
• Onboard voltage monitors for CPU cores, chipset voltage, 1.8V, 3.3V, +5V,
12V, 12V, 3.3V standby and 5V standby
• Fan status monitor with fi rmware speed control
• CPU/chassis temperature monitors
• Platform Environment Control Interface (PECI)
• CPU slow-down on temperature overheat
• CPU thermal trip support for processor protection
• Power-up mode control for recovery from AC power loss
• Auto-switching voltage regulator for CPU core
• System overheat LED and control
• Chassis intrusion detection
• System resource alert
ACPI Features
• Slow blinking LED for suspend state indicator
• Main switch override mechanism
1-6
Chapter 1: Introduction
Onboard I/O
• Adaptec AIC-9410W SAS Controller w/HostRAID support (RAID 0, 1,10)
• Intel ESB-2 South Bridge supports 6 SATA connectors (w/RAID 0, 1, 5,10) (For
the Windows OS only)
• Super I/O: Winbond W83627HG w/Hardware Monitor support: W83793G
• PS/2 mouse and PS/2 keyboard ports
• Up to 6 USB 2.0 (Universal Serial Bus) (4 ports, 2 Headers)
• Super I/O
Other
• External modem ring-on
• Wake-on-LAN (WOL)
• Wake-on-Ring (WOR)
• Console redirection
• Onboard Fan Speed Control by Thermal Management via BIOS
CD/Diskette Utilities
• BIOS fl ash upgrade utility and device drivers
Dimensions
• Ext. ATX 12.08" x 13.05" (306.8 mm x 331.5 mm)
1-7
X7DA3+ User's Manual
J13
#2
PCI-X SLOT
J14
#3
PCI-X SLOT
J12
#1
PXH-V
VRM
J5
#6
J9
#4
PCI-EXP_X4_in_X16_SLOT
PCI-EXP X8
SAS
PCI-X 133
9410
PROCESSOR#2
PCI-EXP X8
PCI-EXP X8
PCI-EX_X16_SLOT
PCI-EXP X4
667/1067/
1333 MHz
Port
#1,2
Port
#4,5
Port
#6,7
Port
#2
5000X
Port
#3
Port
#4
ESB2
PROCESSOR#1
667/1067/
1333 MHz
MCH
Port
#0
PCIE X4
PCIE X4
Port
#3
FBD
CHNL0
FBD
CHNL1
FBD
CHNL2
FBD
CHNL3
1B
1A
FBD DIMM
ATA100
EXP.
BUS
3.0 Gb/S
VRM
2B
2A3A
FBD DIMM
IDE
CONN
EBUS
CONN
#3
#2
#1
#0
SATA
3B
FBD DIMM
#5
#4
4B
4A
FBD DIMM
PCI-X SLOT
zcr
FRONT
PANEL
SIMLP-IPMI
CONN
J6
PCI 32/
33MMZ
#5
PCI32_SLOT
RJ45
RJ45
PARALLEL
PORT
GB LAN
GILGAL
HD Audio
FDD
SIO
W83627
EHF
MS
KB
USB 2.0
LPC
FWH
COM1
#5
#4
#3
#2
#1
#0
USB
Block Diagram of the 5000X (Greencreek) Chipset
Note: This is a general block diagram. Please see the previous Motherboard Features
pages for details on the features of each motherboard.
1-8
Chapter 1: Introduction
1-2 Chipset Overview
Built upon the functionality and the capability of the 5000X (Greencreek) chipset,
the X7DA3+ motherboard provides the performance and feature set required for
dual processor-based workstations with confi guration options optimized for com-
munications, presentation, storage, computation or database applications. The
5000X (Greencreek) chipset supports single or dual Xeon 64-bit dual core processor
with front side bus speeds of up to 1.333 GHz. The chipset consists of the 5000X
(Greencreek) Memory Controller Hub (MCH), the Enterprise South Bridge 2 (ESB2),
and the I/O subsystem (PXH-V).
The 5000X (Greencreek) MCH chipset is designed for symmetric multiprocessing
across two independent front side bus interfaces. Each front side bus uses a 64-bit
wide, 1.333 GHz data bus that transfers data at 10.7 GB/sec. The MCH chipset connects up to 8 Fully Buffered DIMM modules, providing a total of 32.0 GB/s for DDR2
667/533 memory. The MCH chipset also provides one x8 PCI-Express and one x4
ESI interface to the ESB2. In addition, the 5000X (Greencreek) chipset offers a wide
range of RAS features, including memory interface ECC, x4/x8 Single Device Data
Correction, CRC, parity protection, memory mirroring and memory sparing.
Xeon Dual Core Processor Features
Designed to be used with conjunction of the 5000X (Greencreek) chipset, the Xeon
Dual Core Processors provide a feature set as follows:
The Xeon Dual Core Processors
L1 Cache Size: Instruction Cache (32KB/16KB), Data Cache (32KB/24KB)
L2 Cache Size: 2MB (per core)
Data Bus Transfer Rate: 8.5 GB/s
Package: FC-LGA6/FC-LGA4, 771 Lands
1-9
X7DA3+ User's Manual
1-3 Special Features
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when
AC power is lost and then restored to the system. You can choose for the system
to remain powered off (in which case you must hit the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Power Lost Control
setting in the Advanced BIOS Setup section (Boot Features) to change this setting.
The default setting is Last State.
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the X7DA3+. All have
an onboard System Hardware Monitor chip that supports PC health monitoring.
Onboard Voltage Monitoring
An onboard voltage monitor will scan these voltages continuously: CPU Cores,
Chipset Voltage, +3.3V, +5V, +12V, -12V, +3.3V Standby, +5V Standby and Vbat.
Once a voltage becomes unstable, a warning is given or an error message is sent
to the screen. Users can adjust the voltage thresholds to defi ne the sensitivity of
the voltage monitor.
Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.
CPU Fan Auto-Off in Sleep Mode
The CPU fan activates when the power is turned on. It continues to operate when
the system enters Standby mode. When in sleep mode, the CPU will not run at full
power, thereby generating less heat.
1-10
Chapter 1: Introduction
System Resource Alert
This feature is available when used with Supero Doctor III in the Windows OS
environment or used with Supero Doctor II in Linux. Supero Doctor is used to
notify the user of certain system events. For example, if the system is running low
on virtual memory and there is insuffi cient hard drive space for saving the data,
you can be alerted of the potential problem. You can also confi gure Supero Doctor
to provide you with warnings when the system temperature goes beyond a predefi ned range.
1-5 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-
tion defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers. This also includes consumer devices connected to the PC
such as VCRs, TVs, telephones and stereos.
In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with Windows 2000, Windows XP and Windows
2003 Server.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
Main Switch Override Mechanism
When an ATX power supply is used, the power button can function as a system suspend button to make the system enter a SoftOff state. The monitor will be suspended
and the hard drive will spin down. Pressing the power button again will "wake-up"
the system. During the SoftOff state, the ATX power supply provides power to keep
the required circuitry in the system "alive." In case the system malfunctions and you
want to turn off the power, just press and hold the power button for 4 seconds. This
option can be set in the Power section of the BIOS Setup routine.
1-11
X7DA3+ User's Manual
External Wake-On-LAN
Wake-On-LAN is defi ned as the ability of a management application to remotely
power up a computer that is powered off. Remote PC setup, up-dates and asset
tracking can occur after hours and on weekends so that daily LAN traffi c is kept
to a minimum and users are not interrupted. The motherboard has a 3-pin header
(WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has
WOL capability. In addition, an onboard LAN controller can also support WOL
without any connection to the WOL header. The 3-pin WOL header is to be used
with a LAN add-on card only.
Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power supply.
1-6 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.
The X7DA3+ can only accommodate 24-pin ATX power supply. Although most power
supplies generally meet the specifi cations required by the motherboard, some are
inadequate. You should use one that will supply at least 400W of power. In addition,
the 12V 8-pin and the 4-pin are also required for adequate power supply to the
system. Also your power supply must supply 1.5A for the Ethernet ports.
It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.01 or above. It must also be SSI compliant (For more
information, please refer to the website at http://www.ssiforum.org/). Additionally, in
areas where noisy power transmission is present, you may choose to install a line
fi lter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.
1-7 Super I/O
The disk drive adapter functions of the Super I/O chip include a fl oppy disk drive
controller that is compatible with industry standard 82077/765, a data separator,
write pre-compensation circuitry , decode logic, data rate selection, a clock generator ,
drive interface control logic and interrupt and DMA logic. The wide range of functions
integrated onto the Super I/O greatly reduces the number of components required
for interfacing with fl oppy disk drives. The Super I/O supports 360 K, 720 K, 1.2
M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s or
1 Mb/s. It also provides two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps as
1-12
Chapter 1: Introduction
well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which support higher speed modems.
The Super I/O supports one PC-compatible printer port (SPP), Bi-directional Printer
Port (BPP), Enhanced Parallel Port (EPP) or Extended Capabilities Port (ECP).
The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.
1-13
X7DA3+ User's Manual
Notes
1-14
Chapter 2: Installation
Chapter 2
Installation
2-1 Static-Sensitive Devices
ElectroStatic-Discharge (ESD) can damage electronic com ponents. T o prevent damage to your system board, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic
bag.
• Handle the board by its edges only; do not touch its components, peripheral
chips, memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in
use.
• For grounding purposes, make sure your computer chassis provides excellent
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When
unpacking the board, make sure the person handling it is static protected.
2-2 Motherboard Installation
(Note: Be sure to mount the motherboard into the chassis before you
install the CPU onto the motherboard.)
All motherboards have standard mounting holes to fi t different types of chassis.
Make sure that the locations of all the mounting holes for both motherboard and
chassis match. Make sure that the metal standoffs click in or are screwed in
tightly. Then, use a screwdriver to secure the motherboard onto the motherboard
tray. (Note: some components are very close to the mounting holes. Please
take precautionary measures to prevent damage done to these components
when you install the motherboard into the chassis.)
2-1
X7DA3+ User's Manual
!
2-3 Processor and Heatsink Installation
When handling the processor package, avoid placing
direct pressure on the label area of the fan.
Notes: 1. Always connect the power cord last and always remove it before adding,
removing or changing any hardware components. Make sure that you install the
processor into the CPU socket before you install the CPU heatsink.
2. Intel's boxed Xeon CPU package contains the CPU fan and heatsink assembly.
If you buy a CPU separately, make sure that you use only Intel-certifi ed multi-di-
rectional heatsink and fan.
3. The Intel Xeon LGA 771 heatsink and fan comes with a push-pin design and no
tool is needed for installation.
4. Make sure to install the motherboard into the chassis before you install the CPU
heatsink and fan.
5. When purchasing an LGA 771 CPU or when receiving a motherboard with an LGA
771 CPU pre-installed, make sure that the CPU plastic cap is in place and none of
the CPU pins are bent; otherwise, contact the retailer immediately.
6. Refer to the MB Features Section for more details on CPU support.
Installing the LGA771 Processor
Load Lever
PnP Cap on
top of the
1. Press the load lever to release
the load plate, which covers the CPU
socket, from its locking position.
2. Gently lift the load lever to open the
load plate.
Load Plate
Load Plate
(with PnP Cap
attached)
2-2
3. Use your thumb and your index
!
fi nger to hold the CPU at the North
Center Edge and the South Center
Edge of the CPU.
4. Align CPU Pin1 (the CPU corner
marked with a triangle) against the
socket corner that is marked with a
triangle cutout.
5. Align the CPU key that is the semi-
circle cutout below a gold dot against
the socket key, the Notch on the
same side of the triangle cutout on
the socket.
6. Once aligned, carefully lower the
CPU straight down to the socket.
(Do not drop the CPU on the socket.
Do not move the CPU horizontally or
vertically. Do not rub the CPU against
the surface or against any pins of the
socket to avoid damage to the CPU
or the socket.)
Socket Key
(Socket Notch)
CPU Key (semicircle cutout) below the circle.
Corner with a
triangle cutout
Chapter 2: Installation
North Center Edge
South Center Edge
gold dot
CPU Pin1
7. With the CPU inside the socket,
inspect the four corners of the CPU
to make sure that the CPU is properly
installed.
8. Use your thumb to gently push the
load lever down to the lever lock.
9. If the CPU is properly installed into
the socket, the plastic PnP cap will be
automatically released from the load
plate when the load lever is pushed
in the lever lock. Remove the PnP cap
from the motherboard.
(Warning: Please save the plas-
tic PnP cap. The motherboard must
be shipped with the PnP cap properly
installed to protect the CPU socket
pins. Shipment without the PnP cap
properly installed will cause damage
to the socket pins.)
Load Lever
CPU in the CPU socket
Plastic cap
is released
from the
load plate
if CPU
properly
installed.
2-3
X7DA3+ User's Manual
Installing the Heatsink
CEK Heatsink Installation
1. Do not apply any thermal grease to
the heatsink or the CPU die-the required
amount has already been applied.
2. Place the heatsink on top of the CPU so
that the four mounting holes are aligned with
those on the retention mechanism.
3. Screw in two diagonal screws (ie the #1
and the #2 screws) until just snug (-do not
fully tighten the screws to avoid possible
damage to the CPU.)
CEK Passive Heatsink
Screw#1
Screw#1
Screw#2
4. Finish the installation by fully tightening
all four screws.
Screw#2
2-4
Removing the Heatsink
!
(Warning: We do not recommend
that the CPU or the heatsink be
removed. However, if you do need
to remove the heatsink, please
follow the instructions below to
uninstall the heatsink to prevent
damage done to the CPU or the
CPU socket.)
1. Unscrew and remove the heatsink screws
from the motherboard in the sequence as
shown in the picture on the right.
Chapter 2: Installation
2. Hold the heatsink as shown in the picture
on the right and gently wriggle the heatsink to
loosen it from the CPU. (Do not use excessive
force when wriggling the heatsink!!)
3. Once the CPU is loosened, remove the
heatsink from the CPU socket.
4. Clean the surface of the CPU and the
heatsink to get rid of the old thermal grease.
Reapply the proper amount of thermal grease
on the surface before you re-install the CPU
and the heatsink.
2-5
X7DA3+ User's Manual
2-4 Installing DIMMs
Note: Check the Supermicro web site for recommended memory modules.
CAUTION
Exercise extreme care when installing or removing DIMM
modules to prevent any possible damage. Also note that the
memory is interleaved to improve performance (See step 1).
DIMM Installation
1. Insert the desired number of DIMMs into the memory slots, starting with Bank
1. (For optimal memory performance, please install four modules at a time.
Please refer to the table below.)
2. Insert each DIMM module vertically into its slot. Pay attention to the notch along
the bottom of the module to prevent inserting the DIMM module incorrectly.
3. Gently press down on the DIMM module until it snaps into place in the slot.
Repeat for all modules (see step 1 above).
Memory Support
The X7DA3+ supports up to 32 GB fully buffered (FBD) ECC DDR2 533/667 in 8
DIMMs. Populating DIMM modules with a pair (or pairs) of memory modules that
are of the same size and of the same type in Bank1, Bank2, Bank3 and Bank4 will
result in interleaving memory.
Note 1: Due to the OS limitations, some operating systems may not show more
than 4 GB of memory.
(*Notes: i. DIMM slot# specified: DIMM slot to be populated; “---“: DIMM slot not to
be populated. ii. Both FBD 533 MHz and 667MHz DIMMs are supported; however,
you need to use the memory modules of the same speed and of the same type on a
motherboard. iii. Interleaved memory is supported when pairs of DIMM modules are
installed. To optimize memory performance, please install pairs of DIMMs in bothBranch 0 and Branch 1. iv. For memory to work properly, you need to follow the
restrictions listed above. )
Bank 1
(Channel 0)
Bank 2
(Channel 1)
Bank 3
(Channel 2)
Bank 4
(Channel 3)
Note 2: Due to memory allocation to system devices, memory remaining available
for operational use will be reduced when 4 GB of RAM is used. The reduction in
memory availability is disproportional. (Refer to the following Memory Availability
Table for details.)
2-6
DDR2 FBD DIMM
Possible System Memory Allocation & Availability
Chapter 2: Installation
System DeviceSizePhysical Memory
Firmware Hub fl ash memory (System
BIOS)
Local APIC4 KB3.99
Area Reserved for the chipset2 MB3.99
I/O APIC (4 Kbytes)4 KB3.99
PCI Enumeration Area 1256 MB3.76
PCI Express (256 MB)256 MB3.51
PCI Enumeration Area 2 (if needed)
-Aligned on 256-MB boundaryVGA Memory16 MB2.85
TSEG1 MB2.84
Memory available to OS and other ap-
plications
1 MB3.99
512 MB3.01
Remaining (-Available)
(4 GB Total System Memory)
2.84
Installing and Removing DIMMs
1NALJ
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To Remove:
Use your thumbs
to gently push
the release tabs
near both ends of
the module. This
should release it
from the slot.
DDR2 FBD
To Install: Insert module vertically and press down until it
snaps into place. Pay attention to the alignment notch at
the bottom.
Top View of DDR2 FBD Slot
Top View of DDR2 FBD
2-7
X7DA3+ User's Manual
1
2
3
4
5
6
789
2-5 Control Panel Connectors/IO Ports
The I/O ports are color coded in conformance with the PC 99 specifi cation. See
Figure 2-3 below for the colors and locations of the various I/O ports.
Back Panel Connectors/IO Ports
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10
12
16
15
Back Panel I/O Port Locations and Defi nitions
Back Panel Connectors
1. Keyboard (Purple)
2. PS/2 Mouse (Green)
3. Back Panel USB Port 0
4. Back Panel USB Port 1
5. Back Panel USB Port 2
6. Back Panel USB Port 3
7. COM Port 1 (Turquoise)
8. Parallel Port (Printer)
9. Gigabit LAN 2
10. Gigabit LAN 1
11. Side_Surround (Grey)
12. Back_Surround (Black)
13. CEN/LFE (Orange)
14. Microphone-In (Pink)
15. Front (Green)
16. Line-In (Blue)
(See Section 2-5 for details.)
11
14
2-8
Chapter 2: Installation
Front Control Panel
JF1 contains header pins for various buttons and indicators that are normally located on a control panel at the front of the chassis. These connectors are designed
specifi cally for use with Supermicro server chassis. See the fi gure below for the
descriptions of the various control panel buttons and LED indicators. Refer to the
following section for descriptions and pin defi nitions.
JF1 Header Pins
1920
1NALJ
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UPER X7DA3+
Ground
X
Power LED
NMI
X
Vcc
HDD LED
NIC1 LED
NIC2 LED
OH/Fan Fail LED
PWR Fail LED
Ground
Ground
Vcc
Vcc
Vcc
Vcc
Vcc
Reset
PWR
2
1
Reset Button
Power Button
2-9
X7DA3+ User's Manual
Front Control Panel Pin Defi nitions
NMI Button
The non-maskable interrupt button
header is located on pins 19 and 20
of JF1. Refer to the table on the right
for pin defi nitions.
Power LED
NMI Button
Pin Defi nitions (JF1)
Pin# Defi nition
19Control
20Ground
The Power LED connection is located
on pins 15 and 16 of JF1. Refer to the
table on the right for pin defi nitions.
A. NMI
B. PWR LED
1NALJ
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B
Power LED
HDD LED
Power LED
Pin Defi nitions (JF1)
Pin# Defi nition
15+5V
16Ground
Ground
X
1920
NMI
A
X
Vcc
Vcc
2-10
NIC1 LED
NIC2 LED
OH/Fan Fail LED
PWR Fail LED
Ground
Ground
Vcc
Vcc
Vcc
Vcc
Reset
Reset Button
Power Button
PWR
2
1
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