Supero X10SLE-DF User Manual

X10SLE-DF

USER’S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this

manual, please see our web site at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software and docu­mentation, is the property of Supermicro and/or its licensors, and is supplied only under a license.
Any use or reproduction of this product is not allowed, except as expressly permitted by the terms
of said license.

IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE, OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH
DAMAGES. IN PARTICULAR, SUPERMICRO SHALL NOT BE LIABLE FOR ANY HARDWARE,
SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF
REPAIRING, REPLACING, INTEGRATING, INSTALLING, OR RECOVERING SUCH HARDWARE,
SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara, shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for all
claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates, uses,
and can radiate radio frequency energy and, if not installed and used in accordance with the instruc­tions, may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful interfer­ence to radio or television reception, which can be determined by turning the equipment off and on,
the user is encouraged to try to correct the interference by one or more of the following measures:

•Reorient or relocate the receiving antenna.

•Increase the separation between the equipment and receiver.

•Connect the equipment to an outlet on a circuit different from that to which the receiver

is connected.

•Consult the authorized dealer or an experienced radio/TV technician for help.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warn­ing applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”

WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to the
State of California to cause birth defects and other repro­ductive harm.

Manual Revision 1.0
Release Date: Dec. 2, 2013

Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
Copyright © 2013 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

This manual is written for system integrators, PC technicians, and

knowledgeable PC users. It provides information for the installation and use of the

X10SLE-DF motherboard.

About This Motherboard

The X10SLE-DF supports the Intel® Xeon E3-1200 v3, 4th-Generation

Core i3, Pentium, or Celeron processor in the LGA1150 H3 socket. With the Intel®

C224 Express chipset built in, the X10SLE-DF motherboard offers a 24-node Micro-

Cloud platform with 1/2-HDD per node and two nodes per board. The X10SLE-DF

is optimized for high-end, high-performance, Micro-Cloud server platforms. Please

refer to our website (http://www.supermicro.com/products/) for processor and

memory support updates. This product is intended to be installed and serviced by

professional technicians.

Manual Organization

Chapter 1 describes the features, specications, and performance of the mother-

board, and provides detailed information on the Intel C224 Express chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when in-

stalling the processor, memory modules, and other hardware components into the

system. If you encounter any problems, see Chapter 3, which describes trouble-

shooting procedures for video, memory, and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information

on running the CMOS setup utility.

Appendix A provides BIOS error beep codes.

Appendix B details software program installation instructions.

Appendix C contains UEFI BIOS Recovery instructions.

Preface

iii

X10SLE-DF User’s Manual

Conventions Used in the Manual:

Special attention should be given to the following symbols for proper installation and

to prevent damage done to the components or injury to yourself:

Warning: Critical information to prevent damage to the components or injury to your-

self.

Important: Important information given to ensure proper system installa-

tion or to relay safety precautions.

Note: Additional information given to differentiate various models or to

provide information for correct system setup.

iv

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Web Site: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Contacting Supermicro

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 23511

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Web Site: www.supermicro.com.tw

Technical Support:

Email: [e-mail]

Tel: [phone]

v

X10SLE-DF User’s Manual

Table of Contents

Preface

Chapter 1 Introduction

1-1 Overview ......................................................................................................... 1-1

1-2 Chipset Overview ........................................................................................... 1-9

1-3 Special Features ........................................................................................... 1-10

1-4 PC Health Monitoring .................................................................................... 1-10

1-5 ACPI Features ................................................................................................1-11

1-6 Power Supply .................................................................................................1-11

Chapter 2 Installation

2-1 Standardized Warning Statements ................................................................. 2-1

2-2 Static-Sensitive Devices .................................................................................. 2-4

2-3 Processor and Heatsink Installation................................................................ 2-5

Installing the LGA1150 Processor .................................................................2-5

Installing a Passive CPU Heatsink ................................................................. 2-8

Removing the Heatsink ................................................................................... 2-9

2-4 Installing DDR3 Memory ............................................................................... 2-10

DIMM Installation .......................................................................................... 2-10

Removing Memory Modules ..........................................................................2-11

Memory Support .............................................................................................2-11

Memory Population Guidelines ......................................................................2-11

2-5 Motherboard Installation ................................................................................ 2-13

Tools Needed ................................................................................................ 2-13

Location of Mounting Holes .......................................................................... 2-13

Installing the Motherboard ............................................................................ 2-14

2-6 Connectors/IO Ports ...................................................................................... 2-15

Front I/O Panel .............................................................................................. 2-15

Power Switch//LED Indicator .................................................................... 2-16

Node_ID Switch/KVM/LED Indicator ........................................................ 2-16

Ethernet Ports .......................................................................................... 2-17

USB 2.0 (x2)/VGA/COM Connector ......................................................... 2-18

2-7 Connecting Cables ........................................................................................ 2-19

SMC-Proprietary Add-On Card Slot ........................................................ 2-19

Port 80 Support ........................................................................................ 2-19

2-8 Jumper Settings ............................................................................................ 2-20

Explanation of Jumpers ................................................................................ 2-20

Clear CMOS (JBT1) ................................................................................. 2-20

VGA Enable .............................................................................................. 2-21

vi

Table of Contents

Watch Dog Enable/Disable ...................................................................... 2-21

ME Recovery ........................................................................................... 2-22

Manufacturer Mode Select ....................................................................... 2-22

Thermal Throttling Triggered by Power-Failure Enable (J7) .................... 2-23

2-9 Onboard Indicators ........................................................................................ 2-24

GLAN 1/2 LEDs ........................................................................................ 2-24

IPMI-LAN LEDs ........................................................................................ 2-24

PWR LED Indicators (PLED1/PLED2) ..................................................... 2-25

IPMI Heartbeat LED (LE5/LE6) ................................................................ 2-25

UID LED Indicator .................................................................................... 2-26

2-10 SATA Connections .........................................................................................2-27

SATA 3.0 Connections .............................................................................. 2-27

Chapter 3 Troubleshooting

3-1 Troubleshooting Procedures ........................................................................... 3-1

Before Power On ............................................................................................ 3-1

No Power ........................................................................................................ 3-1

No Video ......................................................................................................... 3-2

Memory Errors ............................................................................................... 3-2

Losing the System’s Setup Conguration ....................................................... 3-2

3-2 Technical Support Procedures ........................................................................ 3-3

3-3 Frequently Asked Questions ........................................................................... 3-4

3-4 Battery Removal and Installation .................................................................... 3-5

Battery Removal .............................................................................................. 3-5

Proper Battery Disposal .................................................................................. 3-5

Battery Installation ........................................................................................... 3-5

3-5 Returning Merchandise for Service................................................................. 3-6

Chapter 4 BIOS

4-1 Introduction ...................................................................................................... 4-1

Starting the BIOS Setup Utility ....................................................................... 4-1

How To Change the Conguration Data ......................................................... 4-1

How to Start the Setup Utility ......................................................................... 4-2

4-2 Main Setup ...................................................................................................... 4-2

4-3 Advanced Setup Congurations...................................................................... 4-4

4-4 Event Logs .................................................................................................... 4-23

4-5 IPMI .............................................................................................................. 4-24

4-6 Boot Settings ................................................................................................. 4-27

4-7 Security Settings ........................................................................................... 4-30

4-8 Save & Exit ................................................................................................... 4-31

vii

X10SLE-DF User’s Manual

Appendix A Software Installation Instructions

A-1 Installing Software Programs ..........................................................................A-1

A-2 Conguring SuperDoctor III ............................................................................A-2

Appendix B UEFI BIOS Recovery Instructions

B-1 An Overview to the UEFI BIOS ......................................................................B-1

B-2 How to Recover the UEFI BIOS Image (the Main BIOS Block) .....................B-1

B-3 To Recover the Boot Sector Using a USB-Attached Device .......................... B-1

viii

Chapter 1: Introduction

Chapter 1

Introduction

1-1 Overview

Checklist

Congratulations on purchasing your computer motherboard from an acknowledged

leader in the industry. Supermicro boards are designed with the utmost attention to

detail to provide you with the highest standards in quality and performance.

This motherboard was especially designed to be used in an SMC-proprietary chas-

sis only as part of an integrated server solution. A quick reference guide is included

in the shipping package.

•One (1) Quick Reference Guide

Note: For your system to work properly, please follow the links below to

download all necessary drivers/utilities and the user's manual for your

motherboard.

SMCI product manuals: http://www.supermicro.com/support/manuals/

Product Drivers and utilities: ftp://ftp.supermicro.com/

If you have any questions, please contact our support team at support@supermicro.

com.

1-1

X10SLE-DF User’s Manual

X10SLE-DF Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB Revision

available at the time of publishing of the manual. The motherboard you received

may or may not look exactly the same as the graphics shown in this manual.

1-2

Chapter 1: Introduction

P1-JWD1

X10SLE-DF Motherboard Layout

MAC CODE

P2/P1-LAN1

P2/P1-LAN2

LAN
CTRL

LAN
CTRL

BAR CODE

MAC CODE

MAC CODE

P1-JPME2

JBT2

MAC CODE

IPMI_LAN

X10SLE-DF

Rev. 1.01

CPU2

PCH

LAN
Switch

BMC
Memory

SW

NODE

SW2

J2

BMC

LE5

P1-JPME2

J3
J4

J10

BMC
Firmware

P2-JPME2

JBT1

PLED2

PLED1

LED7

USB0/1

SW1

PWR

JKVM1

BT

Battery

Node
Switch

LE6

P2-DIMMA1

BMC
Memory

P2-DIMMA2

PCH

J9

J7

BMC

P2-PORT80

Firmware

J38

P1-PORT80

BMC

J37

P2-JWD1

P2-JPG2

P1-JPG1

JPV2

P2-DIMMB2

P2-DIMMB1

P1-JPME1

CPU1

J8

(SMC-Proprietary Add-On Card Slot)

P1-DIMMB2

P1-DIMMA2

P1-DIMMA1

P1-DIMMB1

JPV1

Important Notes to the User

•See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front

panel connections.

•" " indicates the location of "Pin 1."

•Jumpers/connectors not indicated are for internal testing only.

•When a power LED indicator located at PLED1 or PLED2 is on, the sys-

tem power is on. Unplug the power cable before installing or removing any

components.

1-3

MAC CODE

MAC CODE

BAR CODE

JKVM1

LE5

LED7

LE6

JBT1

JBT2

J10

P1-JPG1

P1-JWD1

JPV1

J3
J4

P2-JPG2

J7

J2

JPV2

P1-JPME1

P1-JPME2

P2-JPME2

P1-JPME2

J38

J37

SW2

J9

P2-DIMMA2

P2-DIMMB1

P2-DIMMB2

P2/P1-LAN1

MAC CODE

MAC CODE

P1-PORT80

PLED2

PLED1

P2/P1-LAN2

SW

NODE

USB0/1

Battery

P2-PORT80

IPMI_LAN

PWR

CPU2

CPU1

P2-DIMMA1

P1-DIMMB2

P1-DIMMB1

P1-DIMMA2

P1-DIMMA1

BT

SW1

X10SLE-DF

Rev. 1.01

LAN
CTRL

LAN
CTRL

BMC

BMC

BMC
Firmware

BMC
Firmware

BMC
Memory

BMC
Memory

LAN
Switch

Node
Switch

PCH

PCH

J8

(SMC-Proprietary Add-On Card Slot)

P2-JWD1

X10SLE-DF User’s Manual

X10SLE-DF Quick Reference

1-4

Chapter 1: Introduction

X10SLE-DF Jumpers

Jumper Description Default

J7 Thermal Throttling Triggered by Power

Fail Enable

JBT1/JBT2 CMOS Clear for Node 1 (JBT1)/Node 2

(JBT2)

P1-JPG1/P2-

JPG1

P1-JPME1/P2-

JPME1

P1-JPME2/P2-

JPME2

P1-JWD1/P2-

JWD1

Connector Description

J8 SMC-proprietary Add-On Card Slot for Power/SIG SATA Interface

J37/J38 Port 80 Connector for Node 1 (J37: P1-PORT80)/Node 2 (J38: P2-PORT80)

Battery (VBAT) Onboard Battery

IPMI-LAN IPMI-Dedicated LAN (shared between Node 1 and Node 2 supported by

JKVM1 USB 2.0(x2)/VGA (Monitor)/COM (UART) Connector for front IO support

P2/P1-LAN1 Gigabit Ethernet LAN Port 1 for Node 1 (P1-LAN1)/Node 2 (P2-LAN1)

P2/P1-LAN2 Gigabit Ethernet LAN Port 2 for Node 1 (P1-LAN2)/Node 2 (P2-LAN2)

SATA 3.0 4 SATA (3.0/6 Gb/s) Connections on the HDD backplane

SW1 Power-On/Power-Off Button for Node 1 and Node 2 (PWR BT)

SW2 Node_ID/KVM/LED Switch to provide ethernet access to multiple

USB 2.0 Front Panel USB 2.0 (See JKVM1)

VGA Enable for Node 1 (P1-JPG1)/Node

2 (P2-JPG1)

ME Recovery for Node 1 (P2-JPME1)/

Node 2 (P2-JPME1)

Manufacture Mode Select for Node 1

(P1-JPME2)/Node 2 (P2-JPME2)

Watch Dog Timer Enable for Node 1 (P1-

JWD1)/Node 2 (P2-JWD1)

X10SLE-DF Headers/Connectors

the onboard LAN Switch chip)

for remote console redirection or network interface

devices simultaneously (NODE_SW) (Green: Node 1, Orange: Node 2)

Pins 1-2 (Enabled: Thermal Throttling

Triggered by PWR-Failure)

(Off: Normal)

Pins 1-2 (Enabled)

Pins 1-2 (Normal)

Pins 1-2 (Normal)

Pins 1-2 (Reset) (Recommended for

best performance)

X10SLE-DF LED Indicators

LED Description Color/State Status

LE5 IPMI Heartbeat LED for Node 1 Green: Blinking Node 1 IPMI: Normal

LE6 IPMI Heartbeat LED for Node 2 Green: Blinking Node 2 IPMI: Normal

LED7 UID (Unit Identier) LED Blue: On Unit Identied

PLED1 Power LED for Node 1 Green: On, Orange: Standby Node 1 PWR On/Standby

PLED2 Power LED for Node 2 Green: On, Orange: Standby Node 2 PWR On/Standby

1-5

X10SLE-DF User’s Manual

Motherboard Features

CPU •Single Intel® Xeon E3-1200 v3, 4th-Generation Core

i3, Pentium, or a Celeron processor in an LGA1150

H3 socket for each node;

•Two (2) processors onboard (CPU1/CPU2)

Memory •Four (4) DIMM slots support up to 32 GB of

DDR3 VLP (Very-Low-Profile) Unbuffered ECC

1600/1333/1066 MHz memory for each node;

•Eight (8) memory modules support up to 64 GB of

DDR3 memory onboard for both nodes combined

Dual-channel memory

DIMM sizes

UDIMM 1 GB, 2 GB, 4GB, and 8GB

Chipset •Single Intel® C224 Express PCH for each node;

•Two (2) PCH chips onboard (PCH1/PCH2)

Expansion Slots One (1) SMC-proprietary Micro Add-On card slot for Power/

SIG SATA interface

I/O Devices SATA Connections

SATA 3.0 (6 Gb/s) Four (4) I-SATA 3.0 connections on

the HDD backplane supported by Intel

C224 PCH

RAID 0, 1

USB 2.0/KVM (UART) Connector on the IO Backplane

Two (2) USB 2.0 shared with KVM (VGA/COM) for front
access support (JKVM1);
KVM: VGA (Monitor)/COM (UART) connector for remote
console redirection or remote network interface

LAN Controllers

•Single Intel i350 dual-channel Gigabit-LAN control-

ler with support of two LAN-ports (LAN Ports 1/2)

for each node;

•Two (2) Intel i350 LAN controllers onboard

BMC Controllers

•Single Aspeed AST2400 BMC controller for IPMI and

graphics support for each node;

•Two (2) AST2400 BMC controllers onboard (BMC1/2)

1-6

Ethernet LAN Ports/IPMI-LAN on the IO Backplane

•Two (2) Ethernet LAN ports (LAN1/LAN2) for each

node, (P1-LAN1/LAN2 for Node 1; P2-LAN1/LAN2

for Node 2);

•Four (4) GLAN ports onboard

One (1) shared IPMI-dedicated LAN port supported by BMC
controller chips for remote console interface. The IPMI-LAN
is shared between Node 1 and Node 2

One (1) Onboard LAN Ethernet switch that allows multiple
devices to access the Ethernet simultaneously

BIOS •One (1) 128 Mb AMI BIOS

for each node;

Chapter 1: Introduction

®

SPI Flash BIOS chip

•Two (2) AMI BIOS

Play-and-Plug (PnP), PCI 2.3, ACPI 1.0/2.0/3.0, USB/KVM,
SMBIOS 2.3, RTC (Real-Time Clock), and Node Manage­ment

Power Conguration ACPI/ACPM Power Management

Main Switch Override Mechanism

Power-On Mode for AC Power Recovery

PC Health
Monitoring

System Management PECI (Platform Environment Conguration Interface) 2.0

CD Utilities BIOS ash upgrade utility

Other ROHS (Full-Compliance, Lead-Free)

Dimensions SMC-proprietary form factor (18.5" x 4.6") (469.90 mm x

CPU Monitoring

Onboard voltage monitors for +3.3V, +5V, +12V, 3.3V
Standby, VBAT, Memory, Chipset, CPU Core

CPU 3-phase switching voltage regulator

CPU/System overheat LED and control

CPU Thermal Trip support

Thermal Monitor 2 (TM2) support

System resource alert via SuperDoctor® III

SuperDoctor® III, Watch Dog, NMI

116.84 mm)

®

SPI Flash BIOS chips onboard

1-7

X10SLE-DF User’s Manual

1N

X10SLE-DF Block Diagram

FLASH SPI

128Mb

SPI

SVID

MISC VRs
VRM 12.5

Haswell

(H3)

5.0Gb

x4 DMI II

Lynx Point

C224

PCH

NODE

DDR3 (CHA)

1600/1333MHz

DDR3 (CHB)

1600/1333MHz

PCIe 2.0 X 1

USB 2.0 X 2
480Mb/s

PCIe 1.0 X 1

6.0Gb/s

DIMM1

DIMM2(Far)

4 UDIMM

DIMM1

DIMM2(Far)

I-350-AM2

ASPEED
ASP2400

4 ports stacked

RJ45 (1Gb)

USB 2.0 X 2
(KVM Switch)

VGA

(KVM Switch)

COM

(KVM Switch)

RTL8363SB
(LAN Switch)

Dedicated LAN

AOM-BPN-MC24

4 X SATA 3.0

CONNECTORS

I-350-AM2

ASPEED
ASP2400

PCIe 2.0 X 1

USB 2.0 X 2

480Mb/s
PCIe 1.0 X 1

SATA 3.0 X 2SATA 3.0 X 2

6.0Gb/s

SVID

VRM 12.5
MISC VRs

Haswell

(H3)

x4 DMI II

Lynx Point

C224

PCH

ODE 2

1600/1333MHz

1600/1333MHz

5.0Gb

DDR3 (CHA)

DDR3 (CHB)

SPI

FLASH SPI

128Mb

DIMM1

DIMM2(Far)

4 UDIMM

DIMM1

DIMM2(Far)

System Block Diagram

Note: This is a general block diagram and may not exactly represent

the features on your motherboard. See the "Motherboard Features"

pages for the actual specications of each motherboard.

1-8

Chapter 1: Introduction

1-2 Chipset Overview

The X10SLE-DF supports the Intel® Xeon E3-1200 v3, 4th-Generation Core i3,

Pentium, or a Celeron processor in an LGA1150 H3 socket. Built upon the func-

tionality and capability of the C224 Express chipset, the X10SLE-DF is optimized

for high-end, high-performance, Micro-Cloud server platforms.

The high-speed Direct Media Interface (DMI) featured in the Intel C224 Express

chipset supports high-speed Direct Media Interface (DMI) for chip-to-chip true

isochronous communication, providing up to 4 Gb/s of software-transparent data

transfer rate on each read/write direction. In addition, the X10SLE-DF also features

a TCO timer, which allows the system to recover from a software/hardware lock

and perform tasks, including Function Disable and Intruder Detect.

Intel C224 Express Chipset Features

•Direct Media Interface (up 10 Gb/s transfer, full duplex)

•Intel® Matrix Storage Technology and Intel Rapid Storage Technology

•Dual NAND Interface

•Intel I/O Virtualization (VT-d) Support

•Intel Trusted Execution Technology Support

•PCI Express 3.0 Interface (up to 8.0 GT/s)

•SATA Controller (up to 6Gb/sec)

•Advanced Host Controller Interface (AHCI)

•Intel Active Management Technology (iAMT) 9.0 and vPRO 9.0 support

1-9

X10SLE-DF User’s Manual

1-3 Special Features

Recovery from AC Power Loss

Basic I/O System (BIOS) provides a setting for you to determine how the system will

respond when AC power is lost and then restored to the system. You can choose

for the system to remain powered off, (in which case you must press the power

switch to turn it back on), or for it to automatically return to a power-on state. See

the Advanced BIOS Setup section to change this setting. The default setting is

Last State.

1-4 PC Health Monitoring

This section describes the PC health monitoring features of the board. All boards

have an onboard System Hardware Monitoring chip that supports PC health monitor-

ing. An onboard voltage monitor will scan the following onboard voltages continu-

ously: CPU Vcore, 12V, 5V, 3.3V, 3.3VSB, memory, chipset, and battery voltages.

Once a voltage becomes unstable, a warning is given, or an error message is sent

to the screen. The user can adjust the voltage thresholds to dene the sensitivity

of the voltage monitor.

Fan Status Monitor with Firmware Control

PC health monitoring in the BIOS can check the RPM status of the cooling fans.

The onboard CPU and chassis fans are controlled by Thermal Management via

IPMI Firmware.

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn

on the thermal control fan whenever the CPU temperature exceeds a user-dened

threshold. The overheat circuitry runs independently from the CPU. Once the ther-

mal sensor detects that the CPU temperature is too high, it will automatically turn

on the thermal fans to prevent the CPU from overheating. The onboard chassis

thermal circuitry can monitor the overall system temperature and alert the user when

the chassis temperature is too high.

Note: To avoid possible system overheating, please be sure to provide

adequate airow to your system.

System Resource Alert

This feature is available when the system is used with SuperDoctor® III in the

1-10

Chapter 1: Introduction

Windows OS environment or used with SuperDoctor® II in Linux. SuperDoctor

is used to notify the user of cer tain system events. For example, you can also

congure SuperDoctor to provide you with warnings when the system temperature,

CPU temperatures, voltages and fan speeds go beyond predened thresholds.

1-5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specica-

tion denes a exible and abstract hardware interface that provides a standard

way to integrate power management features throughout a PC system, including

its hardware, operating system, and application software. This enables the system

to automatically turn on and off peripherals such as CD-ROMs, network cards,

hard-disk drives, and printers.

In addition to enabling operating-system-directed power management, ACPI also

provides a generic system event mechanism for Plug-and-Play, and an operating

system-independent interface for conguration control. ACPI leverages the Plug-and

-Play BIOS data structures, while providing a processor-architecture-independent

implementation that is compatible with Windows 7, Windows 8, and Windows 2008

operating systems.

1-6 Power Supply

As with all computer products, a stable power source is necessary for proper and

reliable operation. It is even more important for processors that have high CPU

clock rates.

This motherboard accommodates SMC-proprietary power supplies. To provide

adequate power to your system, be sure to use power supplies recommended by

Supermicro for your system.

1-11

X10SLE-DF User’s Manual

Notes

1-12

Chapter 2: Installation

Chapter 2

Installation

2-1 Standardized Warning Statements

The following statements are industry-standard warnings, provided to warn the user

of situations which have the potential for bodily injury. Should you have questions or

experience difculty, contact Supermicro's Technical Support department for assis-

tance. Only certied technicians should attempt to install or congure components.

Read this section in its entirety before installing or conguring components in the

Supermicro chassis.

Battery Handling

Warning!

There is a danger of explosion if the battery is replaced incorrectly. Replace the

battery only with the same or equivalent type recommended by the manufacturer.

Dispose of used batteries according to the manufacturer's instructions.

電池の取り扱い

電池交換が正しく行われなかった場合、破裂の危険性があります。 交換する電池はメー
カーが推奨する型、または同等のものを使用下さい。 使用済電池は製造元の指示に従

って処分して下さい。

警告
电池更换不当会有爆炸危险。请只使用同类电池或制造商推荐的功能相当的电池更
换原有电池。请按制造商的说明处理废旧电池。

警告
電池更換不當會有爆炸危險。請使用製造商建議之相同或功能相當的電池更換原有
電池。請按照製造商的說明指示處理廢棄舊電池。

Warnung

Bei Einsetzen einer falschen Batterie besteht Explosionsgefahr. Ersetzen Sie die

Batterie nur durch den gleichen oder vom Hersteller empfohlenen Batterietyp.

Entsorgen Sie die benutzten Batterien nach den Anweisungen des Herstellers.

2-1

X10SLE-DF User’s Manual

Attention

Danger d'explosion si la pile n'est pas remplacée correctement. Ne la remplacer

que par une pile de type semblable ou équivalent, recommandée par le fabricant.

Jeter les piles usagées conformément aux instructions du fabricant.

¡Advertencia!

Existe peligro de explosión si la batería se reemplaza de manera incorrecta. Re-

emplazar la batería exclusivamente con el mismo tipo o el equivalente recomen-

dado por el fabricante. Desechar las baterías gastadas según las instrucciones

del fabricante.

!הרהזא

תנכס תמייקץוציפ .הניקת אל ךרדב הפלחוהו הדימב הללוסה לש ףילחהל שי

גוסב הללוסה תא מ םאותה תרבחלמומ ןרציתצ.

תוללוסה קוליס תושמושמה עצבל שי .ןרציה תוארוה יפל









경고!

배터리가 올바르게 교체되지 않으면 폭발의 위험이 있습니다. 기존 배터리와 동일
하거나 제조사에서 권장하는 동등한 종류의 배터리로만 교체해야 합니다. 제조사
의 안내에 따라 사용된 배터리를 처리하여 주십시오.

Waarschuwing

Er is ontplofngsgevaar indien de batterij verkeerd vervangen wordt. Vervang de

batterij slechts met hetzelfde of een equivalent type die door de fabrikant aan-

bevolen wordt. Gebruikte batterijen dienen overeenkomstig fabrieksvoorschriften

afgevoerd te worden.

2-2

Chapter 2: Installation

Product Disposal

Warning!

Ultimate disposal of this product should be handled according to all national laws

and regulations.

製品の廃棄

この製品を廃棄処分する場合、国の関係する全ての法律・条例に従い処理する必要が
ありま す。

警告
本产品的废弃处理应根据所有国家的法律和规章进行。

警告
本產品的廢棄處理應根據所有國家的法律和規章進行。

Warnung

Die Entsorgung dieses Produkts sollte gemäß allen Bestimmungen und Gesetzen

des Landes erfolgen.

¡Advertencia!

Al deshacerse por completo de este producto debe seguir todas las leyes y regla-

mentos nacionales.

Attention

La mise au rebut ou le recyclage de ce produit sont généralement soumis à des

lois et/ou directives de respect de l'environnement. Renseignez-vous auprès de

l'organisme compétent.

רצומה קוליס

!הרהזא

ו תויחנהל םאתהב תויהל בייח הז רצומ לש יפוס קוליס.הנידמה יקוח

2-3

X10SLE-DF User’s Manual

 

경고!

이 제품은 해당 국가의 관련 법규 및 규정에 따라 폐기되어야 합니다.

Waarschuwing

De uiteindelijke verwijdering van dit product dient te geschieden in overeenstemming

met alle nationale wetten en reglementen.

2-2 Static-Sensitive Devices

Electrostatic-Discharge (ESD) can damage electronic com ponents. To avoid dam-

aging your system board, it is important to handle it very carefully. The following

measures are generally sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic

bag.

• Handle the board by its edges only; do not touch its components, peripheral

chips, memory modules, or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in

use.

• For grounding purposes, make sure your computer chassis provides adequate

conductivity between the power supply, the case, the mounting fasteners, and

the motherboard.

• Use only the correct type of onboard CMOS battery. Do not install the onboard

battery upside down to avoid possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When

unpacking the board, make sure that the person handling it is static protected.

2-4

Chapter 2: Installation

2-3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the

label area of the fan.

Important:

•Always connect the power cord last, and always remove it before adding,

removing, or changing any hardware components. Please install the proces-

sor into the CPU socket before you install the CPU heatsink.

•If you are buying a CPU separately, make sure that you use an Intel-certied

multidirectional heatsink only.

•Please install the system board into the chassis before installing the CPU

heatsink.

•When you receive a system board without a processor pre-installed, make

sure that the plastic CPU socket cap is in place, and that none of the socket

pins are bent; otherwise, contact your retailer immediately.

•Refer to the Supermicro website for CPU updates and support.

Installing the LGA1150 Processor

1. Gently press down the load plate handle and push it outward (to the right) to

unlock it.

2. Once the load plate handle is unlocked, gently lift the handle to open the

load plate.

Load Plate

Handle Lock

Load Plate Handle

Handle Lock

Load Plate Handle

2-5

X10SLE-DF User’s Manual

3. Once the load plate is open, use your thumb and index nger to hold the

CPU at the north center edge and the south center edge of the CPU.

North Center Edge

South Center Edge

4. Align the CPU keys, which are the semicircular cutouts on the sides of the

CPU (shown below), against the socket keys, the semicircular notches on the

sides of the CPU socket. Align CPU Pin 1, the triangle at the bottom left of

the CPU, against Pin 1 of the socket, the triangle marker at the bottom left of

the CPU socket.

Socket Pin1

Socket Keys

CPU Pin1

CPU Keys

5. Once they are aligned, carefully lower the CPU straight down into the socket.

(To avoid damaging the CPU or the socket, do not drop the CPU on the

socket. Do not rub the CPU against the surface or against any pins of the

socket.)

6. With the CPU seated inside the socket, inspect the four corners of the CPU

to ensure that it is properly installed.

2-6

Chapter 2: Installation

7. Once the CPU is properly installed, use your thumb to gently push the load

plate handle down to the handle lock and lock it.

CPU properly
installed

Load Plate Handle

is locked into place

8. When the CPU is securely locked into the CPU socket, the plastic cap will be

automatically loosened from the load plate. Use your thumb and index nger

to remove the plastic cap from the socket.

The plastic cap will
pop open when the

CPU is properly

installed in the

socket. Remove the

cap from the socket.

Warning: Install the CPU inside the socket only in one direction. Make sure that it is

properly inserted into the CPU socket before closing the load plate. If it doesn't close

properly, do not force it, as that may damage your CPU. Instead, open the load plate

again and check whether the CPU is properly aligned and securely seated inside the

socket.

2-7

X10SLE-DF User’s Manual

Installing a Passive CPU Heatsink

1. Do not apply thermal grease to the heatsink or the CPU die; the required

amount has already been applied.

2. Place the heatsink on top of the CPU so that the four mounting holes are

aligned with those on the motherboard and the underlying heatsink bracket.

3. Screw in two diagonal screws (the #1 and #2 screws in the gure below)

until just snug. To avoid possible damage to the CPU, do not over-tighten the

screws.

4. Finish the installation by fully tightening all four screws.

Screw#1

Motherboard

Mounting Holes

Screw#2

Heatsink Bracket

2-8

Chapter 2: Installation

Removing the Heatsink

Warning: We do not recommend that the CPU or the heatsink be removed. However,

if you do need to uninstall the heatsink, please follow the instructions below to remove

the heatsink to avoid damaging the CPU or the CPU socket.

1. Unscrew the heatsink screws from the motherboard in the sequence as shown

in the gure below.

2. Gently wriggle the heatsink to loosen it from the CPU. (Do not use excessive

force.)

3. Once the CPU is loosened, remove the CPU from the CPU socket.

4. Clean the surface of the CPU and the heatsink, removing any thermal grease.

Reapply the proper amount of fresh thermal grease on the surface before

reinstalling the CPU and the heatsink.

Loosen screws in
sequence as shown.

Screw#4

Screw#1

Motherboard

Heatsink Bracket

Screw#2

Screw#3

2-9