Supero Super X7DB3 User Manual

®

SUPER

X7DB3

USER’S MANUAL

Revision 1.2

The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any

person or organization of the updates. Please Note: For the most up-to-date version of this

manual, please see our web site at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT,
SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE
USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF
THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC.
SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED
WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall be
the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims
will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”

WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other

reproductive harm.

Manual Revision 1.2

Release Date: May 22, 2009

Unless you request and receive written permission from Supermicro Computer, Inc., you may not
copy any part of this document.

Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.

Copyright © 2009 by Supermicro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

About This Manual

This manual is written for system integrators, PC technicians and

knowledgeable PC users. It provides information for the installation and use of

the

core/dual core processors at a front side bus speed of 1.333 GHz/1.066 GHz/677

MHz. With dual Xeon 64-bit quad core/dual core processors, the 5000P chipset, and

eight DDR2 FBD 667/533 memory modules built-in, the X7DB3 offers substantial

functionality and performance enhancements to the motherboards based on the

quad core/dual core NetBurst microarchitecture while remaining compatible with

the 32-bit based software. Key features include Intel Hyper-Threading Technology,

Virtualization Technology, Hyper Pipelined Technology, Execution Trace Cache,

Thermal Monitor 1/2 (TM1/TM2), Enhanced Intel SpeedStep technology, Advanced

Dynamic Execution, Advanced Transfer Cache, Streaming SIMD Extensions 3

(SSE3) and Extended Memory 64 Technology (EM64T). These features allow the

motherboard to operate at much higher speeds with better power management in

much safer environments than the traditional motherboards. The X7DB3 is ideal for

high performance dual processor (DP) enterprise server/workstation environments.

This product is intended to be professionally installed.

X7DB3 motherboard. The X7DB3 supports dual Intel 64-bit quad

Preface

Manual Organization

Chapter 1 describes the features, specifi cations and performance of the mother-

board and provides detailed information about the chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when

installing the processor, memory modules and other hardware components into

the system. If you encounter any problems, see Chapter 3, which describes

troubleshooting procedures for video, memory and the system setup stored in the

CMOS.

Chapter 4 includes an introduction to BIOS and provides detailed information on

running the CMOS Setup utility.

Appendix A provides BIOS POST Codes. Appendix B and Appendix C list the

Windows OS and other software installation instructions.

Conventions Used in the Manual:

Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:

Danger/Caution: Instructions to be strictly followed to prevent catastrophic

system failure or to avoid bodily injury.

Warning: Important information given to ensure proper system installation or

to prevent damage to the components.

Note: Additional Information given to differentiate various models or to ensure cor-

rect system setup

iii

X7DB3 User's Manual

Table of Contents

Preface

About This Manual ...................................................................................................... iii

Manual Organization ................................................................................................... iii

Conventions Used in the Manual .................................................................................. iii

Chapter 1: Introduction

1-1 Overview ......................................................................................................... 1-1

Checklist ................................................................................................... 1-1

Contacting Supermicro ............................................................................. 1-2

X7DB3 Image ............................................................................. 1-3

X7DB3 Layout ............................................................................ 1-4

Quick Reference ...................................................................................... 1-5

Motherboard Features ................................................................................ 1-6

Intel 5000P Chipset: System Block Diagram ........................................... 1-8

1-2 Chipset Overview ........................................................................................... 1-9

1-3 Special Features ........................................................................................... 1-10

1-4 PC Health Monitoring .................................................................................... 1-10

1-5 ACPI Features .............................................................................................. 1-11

1-6 Power Supply ............................................................................................... 1-12

1-7 Super I/O ........................................................................................................ 1-12

Chapter 2: Installation

2-1 Static-Sensitive Devices ................................................................................. 2-1

Precautions ................................................................................................ 2-1

Unpacking ................................................................................................ 2-1

2-2 Processor and Heatsink Installation ............................................................... 2-2

2-3 Installing DIMMs ............................................................................................. 2-6

2-4 Control Panel Connectors and IO Ports ......................................................... 2-8

A. Back Panel Connectors/IO Ports .............................................................. 2-8

B. Front Control Panel ................................................................................... 2-9

C. Front Control Panel Pin Defi nitions ........................................................ 2-10

NMI Button ............................................................................................. 2-10

Power LED ............................................................................................. 2-10

HDD LED .............................................................................................. 2-11

NIC1/NIC2 LEDs ................................................................................... 2-11

Overheat/Fan Fail LED ......................................................................... 2-12

Power Fail LED ........................................................................................ 2-12

Reset Button ......................................................................................... 2-13

iv

Table of Contents

Power Button .......................................................................................... 2-13

2-5 Connecting Cables ....................................................................................... 2-14

ATX Power Connector .......................................................................... 2-14

Processor Power Connector ................................................................. 2-14

Universal Serial Bus (USB0/1) ................................................................ 2-15

Chassis Intrusion .................................................................................... 2-15

Fan Headers .......................................................................................... 2-16

Keylock ..................................................................................................... 2-16

ATX PS/2 Keyboard and Mouse Ports ..................................................... 2-17

Serial Ports ............................................................................................. 2-17

Wake-On-Ring .......................................................................................... 2-18

Wake-On-LAN .......................................................................................... 2-18

GLAN (Ethernet Ports) ............................................................................. 2-19

Speaker/Power LED Header .................................................................. 2-19

Power Fault .............................................................................................. 2-20

Alarm Reset .............................................................................................. 2-20

Overheat LED/Fan Fail ............................................................................ 2-21

SMB Connector ........................................................................................ 2-21

SMB Power Connector ............................................................................. 2-22

VGA Connector ........................................................................................ 2-22

Compact Flash Card PWR Connector ..................................................... 2-23

SGPIO Headers ....................................................................................... 2-23

2-6 Jumper Settings ............................................................................................ 2-24

Explanation of Jumpers ......................................................................... 2-24

GLAN Enable/Disable ............................................................................ 2-24

Clear CMOS ............................................................................................. 2-25

Watch Dog ................................................................................................ 2-25

SAS Controller Enabled/Disabled ............................................................ 2-26

VGA Enable/Disable ................................................................................. 2-26

3rd PWR Supply PWR Fault .................................................................... 2-27

Compact Flash Master/Slave Enable/Disable .......................................... 2-28

2

I

C Bus to PCI-X-PCI-E Slots .................................................................. 2-28

2-7 Onboard Indicators ....................................................................................... 2-29

GLAN LEDs .............................................................................................. 2-30

Backpanel SAS Activity LED .................................................................... 2-30

Onboard SAS Activity LED ..................................................................... 2-30

2-8 Parallel Port, Floppy, Hard Disk Drive and SIMLP IPMI Connections ......... 2-31

Parallel Port Connector ........................................................................... 2-31

Floppy Connector .................................................................................... 2-32

v

X7DB3 User's Manual

SIMLP IPMI Slot ...................................................................................... 2-32

IDE Connectors ....................................................................................... 2-33

Chapter 3: Troubleshooting

3-1 Troubleshooting Procedures ........................................................................... 3-1

Before Power On ....................................................................................... 3-1

No Power ................................................................................................... 3-1

No Video .................................................................................................. 3-1

Memory Errors ........................................................................................... 3-1

Losing the System’s Setup Confi guration ................................................ 3-2

3-2 Technical Support Procedures ........................................................................ 3-2

3-3 Frequently Asked Questions ........................................................................... 3-3

3-4 Returning Merchandise for Service ................................................................. 3-4

Chapter 4: BIOS

4-1 Introduction ....................................................................................................... 4-1

4-2 Running Setup ................................................................................................. 4-2

4-3 Main BIOS Setup ............................................................................................. 4-2

4-4 Advanced Setup ............................................................................................... 4-6

4-5 Security Setup ............................................................................................... 4-24

4-6 Boot Setup ...................................................................................................... 4-25

4-7 Exit .................................................................................................................. 4-26

Appendices:

Appendix A: BIOS POST Codes ................................................................................ A-1

Appendix B: Installing the Windows OS ..................................................................B-1

Appendix C: Installing Other Software Programs and Drivers...................................C-1

vi

Chapter 1: Introduction

Chapter 1

Introduction

1-1 Overview

Checklist

Congratulations on purchasing your computer motherboard from an acknowledged

leader in the industry. Supermicro boards are designed with the utmost attention to

detail to provide you with the highest standards in quality and performance. Check

that the following items have all been included with your motherboard. If anything

listed here is damaged or missing, contact your retailer.

All the following items are included in the retail box.

One (1) Super Micro Mainboard

•

One (1) ribbon cable for IDE devices (CBL-036L-02)•

One (1) Serial Port cable (CBL-010L-01) •

One (1) USB cable (CBL-083)•

One (1) fl oppy ribbon cable (CBL-022L) •

Two (2) SAS cable (CBL-097L-01)•

Four (4) SATA cables (CBL-044L)•

One (1) I/O backpanel shield (CSE-PT07L)•

One (1) Super Micro CD containing drivers and utilities (CDR-X7)•

One (1) User's/BIOS Manual•

1-1

X7DB3 User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Web Site: www.supermicro.com

Europe

Address: Super Micro Computer, B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Asia-Pacifi c

Address: Super Micro Computer, Inc.

4F, No. 232-1, Liancheng Rd.

Chung-Ho 235, Taipei County

Taiwan, R.O.C.

Tel: [phone]

Fax: [phone]

Web Site: www.supermicro.com.tw

Technical Support:

Email: [e-mail]

Tel: [phone], ext.132 or 139

1-2

X7DB3 Image

Chapter 1: Introduction

Note: The drawings and pictures shown in this manual were based on the

latest PCB Revision available at the time of publishing of the manual. The

motherboard you’ve received may or may not look exactly the same as the

graphics shown in the manual.

1-3

X7DB3 User's Manual

A

4-Pin

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Notes:

1. Jumpers not indicated are for test purposes only.

2. " " indicates the location of Pin 1.

3. SEPC: Supermicro Enhanced Power Connector, specially designed to support

Supermicro 2U Riser Card only.

4. LE 1 is the 5V Standby Power LED Indicator. When LE1 is off, the system is

off. When the green light is on, the system is on. When the yellow light is on, the

system is off, but the AC power cable is still connected. Make sure to disconnect

the power cable before removing or installing components.

5. For the ZCR card to function properly, be sure to install it in the green slot.

Act#2 SAS2:Act Act#6 SAS6:Act

Act#3 SAS3:Act Act#7 SAS7:Act

1-4

Chapter 1: Introduction

Quick Reference ( X7DB3)

Jumper Description Default Setting

27, J28 I
J3P 3rd PWR Failure Detect Open (Disabled)

JBT1 CMOS Clear See Chapter 2

JCF1 Compact Card Master/Slave Select On (Master)

JPG1 VGA Enable Pins 1-2 (Enabled)

JPL1/ JPL2 GLAN1/GLAN2 Enable Pins 1-2 (Enabled)

JPS1 SAS Controller Enable Pins 1-2 (Enabled)

JWD Watch Dog Pins 1-2 (Reset)

Connector Description

ATX PWR (JPW1) Primary 24-Pin ATX PWR Connector

Aux. PWR/CPU PWR +12V 4-pin PWR (JWP2)/+12V 8-pin PWR(JPW3)

ACT#0-ACT#7 SAS Activity LED Indicators (See Page 1-4)

Alarm Reset (JAR) Alarm Reset (*Open: normal)

BP LED Connector(JSLED1) Back Panel Activity LED Connector

Chassis Intrusion (JL1) Chassis Intrusion Header

COM1/COM2 COM1/COM2 Serial Port Connector/Header

Compact PWR(JWF1) Compact Card PWR Connector (*Used if JCF1 is on.)

DIMM#1A-DIMM#4B Memory DDRII Slots

FAN 1-8 Fans 1-8 (CPU Fans/Chassis Fans)

Floppy (J22) Floppy Disk Drive Connector

FP CTRL (JF1) Front Control Panel Connector

GLAN 1/2 (JLAN1/2) G-bit Ethernet Ports

IDE1/IDE2 (*Note) IDE1 Hard Drive (JIDE1)/Compact Flash Card (JIDE2)

Keylock (JK1) Keylock Header

OH LED (JOH1) Overheat LED

Parallel (J21) Parallel (Printer) Port

PSF Power Supply Failure (See Chapter 2)

PWR LED (LE1) PWR LED Indicator (*Note 5 on Pg.1-4)

PWR LED/SPKR (JD1) PWR LED(pins1-3)/SpeakerHeader (pins 4-7)

PWR SMB (J17) Power System Management (I

SATA0-SATA5 Intel SATA 0-5 Connectors

SAS 0-3, SAS 4-7 SAS Connectors 0-3 (JSA1), SAS 4-7 (JSA2)

SGPIO 1/2(J29,J30) Serial General Purpose Input/Output Headers

SMB (J18) System Management Bus Header

Slot 7 SIM Low Profi le IPMI Connector

USB 0/1,USB 2/3, USB4 Back Panel USB 0/1, Front Panel USB 2/3, FP USB4

VGA (J15) VGA Connector

WOL (JWOL) Wake-on-LAN Header

WOR (JWOR) Wake-on-Ring Header

2

C Bus to PCI-X/PCI-E Slots Open (Disabled)

2

C) Header

Note: JIDE2 is for Compact Card Use only. For Compact Card to work properly,

please enable JCF1 by putting cap on it and connect JWF1 to a power supply.

1-5

X7DB3 User's Manual

Motherboard Features

CPU

• Dual Intel

®

64-bit Xeon LGA 771 quad core/dual core processors at a front side

bus speed of 1.333 GHz/1.066 GHz/677 MHz with a system clock speed of

333/267/166 MHz

Memory

• Eight 240-pin DIMM sockets with support up to 32 GB DDR2 Fully Buffered

(FBD) ECC 667/533 Memory (*See Section 2-3 in Chapter 2 for DIMM Slot

Population.)

Chipset

• Intel 5000P chipset, including: the 5000P Memory Control Hub (MCH), the En-

terprise South Bridge 2 (ESB2), and the I/O subsystem (PXH).

Expansion Slots

• Three PCI-Express slots (*two slots at x8@4GB/sec, one slot x4@2GB/sec. on

x8 connector)

• Three 64-bit PCI-X slots (*two PCI-X-133 slots, one PCI-X-100 w/ZCR slot)

• One SPEC slot (*for Supermicro's 2U Active Riser cards)

BIOS

• 8 Mb Phoenix

®

Flash ROM

• DMI 2.3, PCI 2.2, ACPI 1.0, ACPI 2.0, Plug and Play (PnP), SMBBIOS 2.3

PC Health Monitoring

• Onboard voltage monitors for CPU cores, chipset voltage, +1.8V, +3.3V, +5V,

12V, 12V, +3.3V Standby, and +5V standby

• Fan status monitor with fi rmware control

• CPU/chassis temperature monitors

• CPU fan auto-off in sleep mode

• CPU slow-down on temperature overheat

• CPU thermal trip support for processor protection, power LED

• Power-up mode control for recovery from AC power loss

• Auto-switching voltage regulator for CPU cores

• System overheat/Fan Fail LED Indicator and control

• Chassis intrusion detection

• System resource alert via Supero Doctor III

• Low noise fan speed control

• Pulse Width Modulated (PWM) fan control

2

• I

C temperature sensing monitoring

• Thermal Monitor 2 (TM2) support

1-6

Chapter 1: Introduction

• Intel Virtualization Technology support

• PECI (Platform Enhancement Confi guration Interface) ready

ACPI Features

• Slow blinking LED for suspend state indicator

• Main switch override mechanism

• ACPI Power Management

Onboard I/O

• Adaptec AIC 9410 SAS Controller supports eight SAS ports (RAID 0, 1,10)

• Six SATA 3.0Gbps ports (RAID 0, 1,10, 5 for the Windows OS)

• One ZCR slot supports Supermicro's LPZCR2 Add-on card (*optional for SAS)

• One SIMLP IPMI Slot

• Intel 82563 Gigabit Ethernet controller supporting two Giga-bit LAN ports

• Two EIDE Ultra DMA/100 bus master interfaces supporting one IDE (the blue

slot) and one Compact Flash card (the white slot)

• Two SGPIO (Serial General Purpose Input/Output) headers with support for

ESB2 SATA

• One fl oppy port interface

• Two COM ports (1 header, 1 port)

• One EPP/ECP Parallel Port

• One VGA Port

• PS/2 mouse and PS/2 keyboard ports

• Up to fi ve USB 2.0 (Universal Serial Bus) (2 ports, 3 Headers)

• ATI 16 MB ES1000 Graphic Controller

• Super I/O: Winbond W83627HF w/Hardware Monitor support: W83793,

HECETA

Other

• External modem ring-on

• Wake-on-LAN (WOL)

• Wake-on-Ring (WOR)

• Console redirection

• Onboard Fan Speed Control by Thermal Management via BIOS

CD/Diskette Utilities

• BIOS fl ash upgrade utility and device drivers

Dimensions

• ATX Ext. 12" x 13.05" (304.8 x 331.5 mm)

1-7

X7DB3 User's Manual

J13

#2

J5
#6

PCI - EXP X8 SLOT

SEPC

PCI - EXP

PCI - EXP

PCI - X 133

PCI 3 3

PCI - EXP X8

PCI -EX

PROCESSOR#2

1333

1067/

/S

MT

PORT
#4, 5

PORT
#6, 7

P

X8

X4

PORT
#0

X8

PORT
#1, 2

MMZ

MCH

PORT PORT

PORT PORT
#4 #3

VRM

I SL6307

J6
#5

J9
#4

2

J1

#1

AIC

9410W

PCI - X SLOT

PCI - X SLOT z c r

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VGA
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B

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5000P

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FB

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USB 2.0

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#1

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#2A

DIMM

FBD

ID

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EBUS CONN

#5

#4

#3

#2

SATA

#4

#3

#2

US B

#3A

F B D DI MM

#3B

#4B

#4A

DIMM

FBD

DDR

RJ 45

RJ 45

PARALLEL

PORT

KUMERAN

GB L AN FWH

GI L GAL

FDD

SI O

W83627

HF

MS

KB

COM1

COM2

Block Diagram of the 5000P Chipset

Note: This is a general block diagram. Please see the previous Motherboard Features

pages for details on the features of each motherboard.

LPC

1-8

Chapter 1: Introduction

1-2 Chipset Overview

Built upon the functionality and the capability of the 5000P chipset, the X7DB3

motherboard provides the performance and feature set required for dual pro-

cessor-based servers with confi guration options optimized for communications,

presentation, storage, computation and database applications. The 5000P chipset

supports single or dual 64-bit quad core/dual core processor(s) with front side bus

speeds of up to 1.333 GHz/1.066 GHz/677 MHz. The chipset consists of the 5000P

Memory Controller Hub (MCH), the Enterprise South Bridge 2 (ESB2), and the I/O

subsystem (PXH).

The 5000P MCH chipset is designed for symmetric multiprocessing across two inde-

pendent front side bus interfaces. Each front side bus uses a 64-bit wide, 1333 MHz

data bus that transfers data at 10.7 GB/sec. (for a total bandwidth of 21.3GB/sec.).

The MCH chipset connects up to eight Fully Buffered DIMM modules, providing

a total memory bandwidth of 32 GB/s for DDR2 533/667. The MCH chipset also

provides one x8 PCI-Express and one x4 ESI interfaces to the ESB2. In addition,

the 5000P chipset offers a wide range of RAS features, including memory interface

ECC, x4/x8 Single Device Data Correction, CRC, parity protection, memory mirror-

ing and memory sparing.

The Xeon Quad core/dual core Processor Features

Designed to be used with conjunction of the 5000P chipset, the Xeon quad core/dual

core Processor provides a feature set as follows:

The Xeon Quad core/dual core Processors

L1 Cache Size: Instruction Cache (32KB/16KB), Data Cache (32KB/24KB)•

L2 Cache Size: 4MB/2MB (per core)•

*Data Bus Transfer Rate: 8.5 GB/s•

Package: FC-LGA6/FC-LGA4, 771 Lands•

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X7DB3 User's Manual

1-3 Special Features

Recovery from AC Power Loss

BIOS provides a setting for you to determine how the system will respond when

AC power is lost and then restored to the system. You can choose for the system

to remain powered off (in which case you must hit the power switch to turn it back

on), or for it to automatically return to power-on state, or you can also choose for

it to automatically return to the last state prior to power loss. See the Power Lost

Control setting in the Advanced BIOS Setup section (Boot Features) to change

this setting.

1-4 PC Health Monitoring

This section describes the PC health monitoring features of the X7DB3. All have

an onboard System Hardware Monitor chip that supports PC health monitoring. An

onboard voltage monitor will scan the following voltages continuously: +1.5V,+1.8V,

+3.3V, +5V, +12V, −12V, +3.3V Standby, and +5V standby. Once a voltage becomes

unstable, a warning is given or an error message is sent to the screen. Users can

adjust the voltage thresholds to defi ne the sensitivity of the voltage monitor.

Fan Status Monitor with Firmware Control

The PC health monitor can check the RPM status of the cooling fans. The onboard

CPU and chassis fans are controlled by Thermal Management via BIOS (under the

Hardware Monitoring section in the Advanced BIOS Setup section.)

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn

on the thermal control fan whenever the CPU temperature exceeds a user-defi ned

threshold. The overheat circuitry runs independently from the CPU. Once it detects

that the CPU temperature is too high, it will automatically turn on the thermal fan

control to prevent any overheat damage to the CPU. The onboard chassis thermal

circuitry can monitor the overall system temperature and alert users when the chas-

sis temperature is too high.

System Resource Alert

This feature is available when used with Supero Doctor III in the Windows OS en-

vironment or used with Supero Doctor II in Linux. Supero Doctor is used to notify

the user of certain system events. For example, if the system is running low on

virtual memory and there is insuffi cient hard drive space for saving the data, you

1-10

Chapter 1: Introduction

can be alerted of the potential problem. You can also confi gure Supero Doctor to

provide you with warnings when the system temperature goes beyond a pre-de-

fi ned range.

1-5 ACPI Features

ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-

tion defi nes a fl exible and abstract hardware interface that provides a standard

way to integrate power management features throughout a PC system, including

its hardware, operating system and application software. This enables the system

to automatically turn on and off peripherals such as CD-ROMs, network cards, hard

disk drives and printers. This also includes consumer devices connected to the PC

such as VCRs, TVs, telephones and stereos.

In addition to enabling operating system-directed power management, ACPI

provides a generic system event mechanism for Plug and Play and an operating

system-independent interface for confi guration control. ACPI leverages the Plug

and Play BIOS data structures while providing a processor architecture-indepen-

dent implementation that is compatible with both Windows 2000 and Windows

Server 2003. This setting is also located in the Advanced BIOS Setup section

(Boot Features).

Slow Blinking LED for Suspend-State Indicator

When the CPU goes into a suspend state, the chassis power LED will start blinking

to indicate that the CPU is in suspend mode. When the user presses any key, the

CPU will wake-up and the LED will automatically stop blinking and remain on.

Main Switch Override Mechanism

When an ATX power supply is used, the power button can function as a system

suspend button to make the system enter a SoftOff state. The monitor will be

suspended and the hard drive will spin down. Pressing the power button again

will cause the whole system to wake-up. During the SoftOff state, the ATX power

supply provides power to keep the required circuitry in the system alive. In case

the system malfunctions and you want to turn off the power, just press and hold

the power button for 4 seconds. This option can be set in the Boot section of the

Advanced BIOS Setup routine.

External Modem Ring-On

Wake-up events can be triggered by a device such as the external modem ringing

when the system is in the SoftOff state. Note that external modem ring-on can only

be used with an ATX 2.01 (or above) compliant power supply.

1-11

X7DB3 User's Manual

Wake-On-LAN (WOL)

Wake-On-LAN is defi ned as the ability of a management application to remotely

power up a computer that is powered off. Remote PC setup, up-dates and asset

tracking can occur after hours and on weekends so that daily LAN traffi c is kept

to a minimum and users are not interrupted. The motherboard has a 3-pin header

(WOL) to connect to the 3-pin header on a Network Interface Card (NIC) that has

WOL capability. In addition, an onboard LAN controller can also support WOL

without any connection to the WOL header. The 3-pin WOL header is to be used

with a LAN add-on card only.

Note: Wake-On-LAN requires an ATX 2.01 (or above) compliant power supply.

1-6 Power Supply

As with all computer products, a stable power source is necessary for proper and

reliable operation. It is even more important for processors that have high CPU

clock rates.

The X7DB3 can only accommodate 24-pin ATX power supplies. Although most

power supplies generally meet the specifi cations required by the CPU, some are

inadequate. In addition, the 12V 4-pin power supply - is also required to ensure

adequate power supply to the system. Also your power supply must supply 1.5A

for the Ethernet ports.

Note: The + 12V 8-pin Aux. Power Connector is always required. Failure to provide

this extra power will result in CPU PWR Failure. See Section 2-5 for details on

connecting the power supply.

It is strongly recommended that you use a high quality power supply that meets

ATX power supply Specifi cation 2.02 or above. It must also be SSI compliant (info

at http://www.ssiforum.org/). Additionally, in areas where noisy power transmission

is present, you may choose to install a line fi lter to shield the computer from noise.

It is recommended that you also install a power surge protector to help avoid prob-

lems caused by power surges.

1-7 Super I/O

The disk drive adapter functions of the Super I/O chip include a fl oppy disk drive

controller that is compatible with industry standard 82077/765, a data separator,

write pre-compensation circuitry, decode logic, data rate selection, a clock generator,

drive interface control logic and interrupt and DMA logic. The wide range of functions

integrated onto the Super I/O greatly reduces the number of components required

for interfacing with fl oppy disk drives. The Super I/O supports 360 K, 720 K, 1.2

M, 1.44 M or 2.88 M disk drives and data transfer rates of 250 Kb/s, 500 Kb/s or

1 Mb/s. It also provides two high-speed, 16550 compatible serial communication

1-12

Chapter 1: Introduction

ports (UARTs. Each UART includes a 16-byte send/receive FIFO, a programmable

baud rate generator, complete modem control capability and a processor interrupt

system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps as

well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which sup-

port higher speed modems.

The Super I/O supports one PC-compatible printer port (SPP), Bi-directional Printer

Port (BPP), Enhanced Parallel Port (EPP) or Extended Capabilities Port (ECP).

The Super I/O provides functions that comply with ACPI (Advanced Confi guration

and Power Interface), which includes support of legacy and ACPI power manage-

ment through an SMI or SCI function pin. It also features auto power management

to reduce power consumption.

1-13

X7DB3 User's Manual

Notes

1-14

Chapter 2: Installation

Chapter 2

Installation

2-1 Static-Sensitive Devices

Electro-Static-Discharge (ESD) can damage electronic com ponents. To prevent

damage to your system board, it is important to handle it very carefully. The following

measures are generally suffi cient to protect your equipment from ESD.

Precautions

Use a grounded wrist strap designed to prevent static discharge.•

Touch a grounded metal object before removing the board from the antistatic •

bag.

Handle the board by its edges only; do not touch its components, peripheral

•

chips, memory modules or gold contacts.

When handling chips or modules, avoid touching their pins.

•

Put the motherboard and peripherals back into their antistatic bags when not •

in use.

For grounding purposes, make sure your computer chassis provides excellent

•

conductivity between the power supply, the case, the mounting fasteners and

the motherboard.

Use only the correct type of onboard CMOS battery as specifi ed by the

•

manufacturer. Do not install the onboard battery upside down to avoid possible

explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When

unpacking the board, make sure the person handling it is static protected.

2-1

X7DB3 User's Manual

!

2-2 Processor and Heatsink Fan Installation

When handling the processor package, avoid placing

direct pressure on the label area of the fan.

Notes:

•

Always connect the power cord last and always remove it before adding, re-

moving or changing any hardware components. Make sure that you install the

processor into the CPU socket before you install the CPU heatsink.

Intel's boxed Xeon CPU package contains the CPU fan and heatsink assembly.

•

If you buy a CPU separately, make sure that you use only Intel-certifi ed multi-

directional heatsink and fan.

Make sure to install the motherboard into the chassis before you install the CPU

•

heatsink and fan.)

When purchasing an LGA 771 CPU or when receiving a motherboard with an

•

LGA 771 CPU pre-installed, make sure that the CPU plastic cap is in place and

none of the CPU pins are bent; otherwise, contact the retailer immediately.

Refer to the MB Features Section for more details on CPU support.

•

Installation of the LGA771 Processor

1. Press the socket clip to release

the load plate, which covers the CPU

socket, from its locking position.

2. Gently lift the socket clip to open

the load plate.

Socket Clip

Load Plate

Load Plate

2-2

Chapter 2: Installation

!

3. Use your thumb and your index

fi nger to hold the CPU at the North

Center Edge and the South Center

Edge of the CPU.

4. Align CPU Pin1 (the CPU corner

marked with a triangle) against the

socket corner that is marked with a

triangle cutout.

5. Align the CPU key that is the

semi-circle cutout below a gold dot

against the socket key, the notch on

the same side of the triangle cutout

on the socket.

6. Once aligned, carefully lower the

CPU straight down to the socket.

(Do not drop the CPU on the socke

or move the CPU horizontally or ver-

tically. Do not rub the CPU against

the surface or against any pins of the

socket to avoid damage to the CPU

or the socket.)

Socket Key

(Socket Notch)

CPU Key (semi-

circle cutout)

below the circle.

Corner with a

triangle cutout

North Center Edge

South Center Edge

gold dot

CPU Pin1

7. With the CPU inside the socket,

inspect the four corners of the CPU

to make sure that the CPU is prop-

erly installed.

8. Use your thumb to gently push the

socket clip down to the clip lock.

9. If the CPU is properly installed

into the socket, the plastic cap will

be automatically released from the

load plate when the clip is pushed in

the clip lock. Remove the plastic cap

from the motherboard.

(Warning: Please save the

plastic cap. The motherboard must

be shipped with the plastic cap

properly installed to protect the CPU

socket pins. Shipment without the

plastic cap properly installed will

cause damage to the socket pins.)

Socket clip

CPU in the CPU socket

Plastic cap

is released

from the

load plate

if the CPU

is properly

installed.

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X7DB3 User's Manual

!

Heatsink Installation

CEK Heatsink Installation

1. Do not apply any thermal grease to

the heatsink or the CPU die-the required

amount has already been applied.

2. Place the heatsink on top of the

CPU so that the four mounting holes

are aligned with those on the retention

mechanism.

3. Screw in two diagonal screws (ie the

#1 and the #2 screws) until just snug (-do

not fully tighten the screws to avoid pos-

sible damage to the CPU.)

4. Finish the installation by fully tightening

all four screws.

CEK Passive Heatsink

Screw#1 Screw#2

Screw#1

Screw#4

To Un-install the Heatsink

Warning: We do not recommend

that the CPU or the heatsink be

removed. However, if you do need

to uninstall the heatsink, please

follow the instructions below to

uninstall the heatsink to prevent

damage done to the CPU or the

CPU socket.

2-4

Screw#3

Screw#2

1. Unscrew and remove the heatsink screws

from the motherboard in the sequence as show

in the picture on the right.

2. Hold the heatsink as shown in the picture

on the right and gently wriggle the heatsink to

loosen it from the CPU. (Do not use excessive

force when wriggling the heatsink!!)

3. Once the CPU is loosened, remove the

heatsink from the CPU socket.

4. Clean the surface of the CPU and the

heatsink to get rid of the old thermal grease.

Reapply the proper amount of thermal grease

on the surface before you re-install the CPU

and the heatsink.

Chapter 2: Installation

Mounting the Motherboard in the Chassis

All motherboards have standard mounting holes to fi t different types of chas-

sis. Make sure that the locations of all the mounting holes for both motherboard

and chassis match. Make sure that the metal standoffs click in or are screwed in

tightly. Then, use a screwdriver to secure the motherboard onto the motherboard
tray. (Note: some components are very close to the mounting holes. Please take

precautionary measures to prevent damage done to these components when you

install the motherboard to the chassis.)

2-5

X7DB3 User's Manual

2-3 Installing DIMMs

Note: Check the Super Micro web site for recommended memory modules.

CAUTION

Exercise extreme care when installing or removing DIMM

modules to prevent any possible damage. Also note that the

memory is interleaved to improve performance (see step 1).

DIMM Installation (See Figure 2-2)

1. Insert the desired number of DIMMs into the memory slots, starting with DIMM

#1A. The memory scheme is interleaved so you must install two modules at a

time, beginning with DIMM #1A, then DIMM #2A and so on. (Please see the

Memory Installation Table below.)

2. Insert each DIMM module vertically into its slot. Pay attention to the notch along

the bottom of the module to prevent inserting the DIMM module incorrectly.

3. Gently press down on the DIMM module until it snaps into place in the slot.

Repeat for all modules (see step 1 above).

Memory Support

The X7DB3 supports up to 32 GB fully buffered (FBD) ECC DDR2 533/667 in 8

DIMMs. Populating DIMM modules with pairs of memory modules of the same size

and same type will result in Interleaved Memory which will increase memory

performance.
Note 1: Due to OS limitations, some operating systems may not show more than

4 GB of memory.

Optimized DIMM Population Configurations

Branch0 Branch1

Number of

DIMMs

2 DIMMs 1A ------ 2A ------ ------ ------ ------ -----­4 DIMMs 1A ------ 2A ------ 3A ------ 4A -----­6 DIMMs 1A 1B 2A 2B 3A ------ 4A -----­8 DIMMs 1A 1B 2A 2B 3A 3B 4A 4B

Bank 1

(Channel 0)

Bank 2

(Channel 1)

Bank 3

(Channel 2)

Bank 4

(Channel 3)

(*Notes: i. DIMM slot# specified: DIMM slot to be populated; “---“: DIMM slot not to
be populated. ii. Both FBD 533 MHz and 667MHz DIMMs are supported; however,

you need to use the memory modules of the same speed and of the same type on a

motherboard. iii. Interleaved memory is supported when pairs of DIMM modules are
installed. To optimize memory performance, please install pairs of DIMMs in both
Branch 0 and Branch 1. iv. For memory to work properly, you need to follow the

restrictions listed above. )

Note 2: Due to memory allocation to system devices, memory remaining available

for operational use will be reduced when 4 GB of RAM is used. The reduction in

memory availability is disproportional. (Refer to the following Memory Availability

Table for details.)

2-6

Possible System Memory Allocation & Availability

Chapter 2: Installation

System Device Size Physical Memory

Remaining (-Available)
(4 GB Total System Memory)

Firmware Hub fl ash memory (System

1 MB 3.99

BIOS)

Local APIC 4 KB 3.99

Area Reserved for the chipset 2 MB 3.99

I/O APIC (4 Kbytes) 4 KB 3.99

PCI Enumeration Area 1 256 MB 3.76

PCI Express (256 MB) 256 MB 3.51

PCI Enumeration Area 2 (if needed)

512 MB 3.01

-Aligned on 256-MB boundary-

VGA Memory 16 MB 2.85

TSEG 1 MB 2.84

Memory available to OS and other ap-

2.84

plications

Installing and Removing DIMMs

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To Remove:

Use your thumbs
to gently push
the release tabs
near both ends of
the module. This
should release it
from the slot.

DDR2 FBD

To Install: Insert module vertically and press down until it

snaps into place. Pay attention to the alignment notch at
the bottom.

Top View of DDR2 FBD Slot

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X7DB3 User's Manual

123

4

5

678

9

2-4 Control Panel Connectors/IO Ports

The I/O ports are color coded in conformance with the PC 99 specifi cation. See

Figure 2-3 below for the colors and locations of the various I/O ports.

A. Back Panel Connectors/IO Ports

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Back Panel I/O Port Locations and Defi nitions

Back Panel Connectors

1. Keyboard (Purple)

2. PS/2 Mouse (Green)

3. Back Panel USB Port 0

4. Back Panel USB Port 1

5. COM Port 1 (Turquoise)

6. VGA Port (Blue)

7. Parallel Port (Printer)

8. Gigabit LAN 1

9. Gigabit LAN 2

(*See Section 2-5 for details.)

2-8