The information in this User’s Manual has been carefully reviewed and is believed to be accurate.
The vendor assumes no responsibility for any inaccuracies that may be contained in this document,
makes no commitment to update or to keep current the information in this manual, or to notify any
person or organization of the updates. Please Note: For the most up-to-date version of this
manual, please see our web site at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product
described in this manual at any time and without notice. This product, including software, if any,
and documentation may not, in whole or in part, be copied, photocopied, reproduced, translated or
reduced to any medium or machine without prior written consent.
IN NO EVENT WILL SUPERMICRO BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO
USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. IN PARTICULAR, SUPERMICRO SHALL NOT HAVE LIABILITY FOR ANY
HARDWARE, SOFTW ARE, OR DA TA STORED OR USED WITH THE PRODUCT, INCLUDING THE
COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH
HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa
Clara County in the State of California, USA. The State of California, County of Santa Clara shall
be the exclusive venue for the resolution of any such disputes. Super Micro's total liability for all
claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class
A digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful
interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your
own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate
warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate
Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate”
WARNING: Handling of lead solder materials used in this
product may expose you to lead, a chemical known to
the State of California to cause birth defects and other
reproductive harm.
Manual Revision 1.0
Release Date: March 27, 2009
Unless you request and receive written permission from Super Micro Computer, Inc., you may not
copy any part of this document.
Information in this document is subject to change without notice. Other products and companies
referred to herein are trademarks or registered trademarks of their respective companies or mark
holders.
This manual is written for system integrators, PC technicians and knowledgeable
PC users. It provides information for the installation and use of the X8DTU/
X8DTU-F motherboard.
About This Motherboard
The X8DTU/X8DTU-F supports the Intel 5500 Series processors, the
fi rst dual-processing platform that supports the Intel QuickPath Interconnect (QPI)
Technology, providing the next generation point-to-point system interface to replace
the current Front Side Bus. With the 5500 Series Processor built in, the X8DTU/
X8DTU-F substantially enhances system performance with increased bandwidth
and unprecedented scalability, optimized for High Performance Computing (HPC)/
Cluster servers and intensive applications. Please refer to our web site (http://www.
supermicro.com/products/) for updates on supported processors. This product is
intended to be installed and serviced by professional technicians.
Preface
Manual Organization
Chapter 1 describes the features, specifi cations and performance of the mother-
board and provides detailed information about the chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when in-
stalling the processor, memory modules and other hardware components into the
system. If you encounter any problems, see Chapter 3, which describes troubleshooting procedures for video, memory and system setup stored in the CMOS.
Chapter 4 includes an introduction to BIOS and provides detailed information on
running the CMOS Setup utility.
Appendix A lists BIOS POST Error Codes. Appendix B and Appendix C provide
the Windows OS and Other Software Installation Instructions.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and
to prevent damage done to the components or injury to yourself:
Warning: Important information given to ensure proper system installation
or to prevent damage to the components.
Note: Additional Information given to differentiate various models or to
ensure correct system setup.
C-2 Confi guring Supero Doctor III ......................................................................... C-2
viii
Chapter 1: Introduction
Chapter 1
Introduction
1-1 Overview
Checklist
Congratulations on purchasing your computer motherboard from an acknowledged
leader in the industry. Supermicro boards are designed with the utmost attention to
detail to provide you with the highest standards in quality and performance. Check
that the following items have all been included with your motherboard. If anything
listed here is damaged or missing, contact your retailer.
The following items are included in the retail box.
One (1) Supermicro Mainboard)
•
Six (6) Serial ATA cables (CBL-0044Lx6) •
One (1) I/O backpanel shield (CSE-PT7L) (For X8DTU)•
One (1) I/O backpanel shield (MCP-260-00027-0N) (For X8DTU-F) •
One (1) Supermicro CD containing drivers and utilities•
One (1) User's/BIOS Manual (MNL#1081)•
1-1
X8DTU/X8DTU-F User's Manual
X8DTU/X8DTU-F Image
Note: The drawings and pictures shown in this manual were based on the
latest PCB Revision available at the time of publishing of the manual. The
motherboard you’ve received may or may not look exactly the same as
the graphics shown in the manual.
1-2
Fan8
(CPU2 Fan)
USB 0/1
COM1
VGA
LE2
UIOP
J10
JUIDB
Chapter 1: Introduction
X8DTU/X8DTU-F Motherboard Layout
P2-DIMM3A
KB /MS
IPMI LAN
PHY
LAN1
LAN2
LAN CTRL
JPL1
SXB2: PCI-E 2.0 x 8
J1
P2-DIMM3B
P2-DIMM2A
P2-DIMM2B
P2-DIMM1A
P2-DIMM1B
CPU2
CPU1
X8DTU/-F
Fan7(CPU1 Fan)
J2
SXB1: PCI-E 2.0 x 16
J3
P1-DIMM1B
P1-DIMM1A
P1-DIMM2B
P1-DIMM2A
P1-DIMM3B
P1-DIMM3A
SXB3: PCI-E 2.0 x 8 in x 4 Slot
JPW3
JPW1
I-SATA4
I-SATA0
I-SATA5
I-SATA3
I-SATA2
I-SATA1
Buzzer
SP1
JPW2
JPI2C
Fan1
Fan2
Battery
JBAT1
Fan3
JD1
PWRLED/SPK
Fan4
LE1
COM2
Intel I5520
North Bridge
JPB
JPG1
BMC CTRL
Fan6
JI2C1
IPMB
J13
USB6
JI2C2
Intel ICH10R
South Bridge
BIOS
T-SGP IO2
JBT1
(ME Rec.)
JP5
USB4/5
J14
USB7
ME Mode
JP3
J17
JPRST1
JTAG Of CPLD
JWD
USB2/3 JLPC1
Fan5
J12
CPLD
JOH1
FP CTRL
JF1
T-SGP IO1
JL1
Differences between X8DTU/X8DTU-F
X8DTUX8DTU
SATA (ICH10R)YesYes
IPMI 2.0/1.5 w/KVM NoYes
WPCM450 BMC NoYes
Dedicated LAN & PHY chipNoYes
-F
Note
IPMI 2.0, WPCM450 BMC Controller, the PHY chip and Dedicated LAN port
w/KVM support are available on the X8DTU-F only. For more information,
refer to the user guide posted on our website @ http://www.supermicro.com/
support/manuals/
1-3
X8DTU/X8DTU-F User's Manual
X8DTU/X8DTU-F Quick Reference
Fan8
(CPU2 Fan)
USB 0/1
COM1
VGA
LE2
UIOP
J10
JUIDB
KB /MS
IPMI LAN
PHY
LAN1
LAN2
LAN CTRL
JPL1
SXB2: PCI-E 2.0 x 8
J1
P2-DIMM3A
P2-DIMM3B
P2-DIMM2A
P2-DIMM2B
P2-DIMM1A
P2-DIMM1B
CPU2
J2
SXB1: PCI-E 2.0 x 16
Notes:
COM2
Fan7(CPU1 Fan)
JPB
X8DTU/-F
J3
SXB3: PCI-E 2.0 x 8 in x 4 Slot
Intel I5520
North Bridge
BMC CTRL
CPU1
P1-DIMM1B
P1-DIMM1A
P1-DIMM2B
P1-DIMM2A
P1-DIMM3B
P1-DIMM3A
JPG1
Fan6
I-SATA5
JPRST1
JWD
J12
JPI2C
Battery
JBAT1
Buzzer
SP1
LE1
JOH1
ME Mode
JP3
J17
JTAG Of CPLD
CPLD
USB2/3 JLPC1
Fan5
JPW2
Fan1
Fan2
Fan3
PWRLED/SPK
Fan4
FP CTRL
JF1
JL1
JD1
T-SGP IO1
JPW3
JPW1
I-SATA4
I-SATA0
I-SATA3
I-SATA2
I-SATA1
T-SGP IO2
Intel ICH10R
South Bridge
BIOS
JBT1
(ME Rec.)
JI2C1
IPMB
JI2C2
JP5
USB4/5
J14
J13
USB6
USB7
Jumpers not indicated are for test purposes only. 1.
See Chapter 2 for detailed information on jumpers and connectors2.
" " indicates the location of Pin 1.3.
When LE1 LED is on, the onboard power connection is on. Make sure to 4.
unplug the power cables before removing or installing components.
IPMI (Intelligent Platform Management Interface) 2.0 is supported by the 5.
X8DTU-F. For more information on IPMI confi guration, refer to the Embedded
BMC IPMI User Guide @http://www.supermicro.com/support/manuals/.
Warnings: 1. To prevent damage to the power supply or motherboard,
please use a power supply that contains a 20-pin and two 8-pin power
connectors. Be sure to connect these connectors to the 20-pin (JPW1)
and the two 8-pin (JPW2,JPW3) power connectors on the motherboard.
Failure in doing so will void the manufacturer warranty on your power supply and motherboard. 2. To provide adequate power to the add-on cards
installed on the motherboard, please connect the UIOP PWR connector
to the power supply for these cards to work properly.
COM1/COM2COM1/COM2 Serial Port/Header
FAN 1-8System/CPU Fan Headers (Fans 7~8: CPU Fans)
IPMB IPMB I
2
C Header (for an IPMI Card) (X8DTU-F)
JD1Speaker/Power LED Header (Pins 4~7: Speaker)
JF1Front Panel Control Connector
JL1Chassis Intrusion Header
JOH1Overheat LED Header
2
JPI
CPower Supply SMBbus I2C Header
JPW120-pin ATX Main Power Connector
JPW2/JPW38-pin Secondary PWR Connector (Warnings on P.1-4)
JUIDBRear Unit Identifi er Switch
LAN1/2Gigabit Ethernet (RJ45) Ports
IPMI_LANIPMI 2.0 Dedicated LAN (X8DTU-F)
I-SATA0 ~ I-SATA5(Intel South Bridge) SATA Ports
T-SGPIO-1/T-SGPIO-2Serial General Purpose Input/Output Headers
UIOPUniversal IO Riser Card Power Connector (Required
for Add-on cards) (Warnings on P.1-4)
(B/P) USB0/1(Back Panel) Universal Serial Bus (USB) Ports
F/P USB 2/3 4/5, 6, 7Fro nt Panel Ac ces sible U SB Hea ders
VGAVideo Port
LEDDescription
LE1Onboard St andby PW R warni ng LED Indi cator
LE2Unit Identifi er LED
1-5
X8DTU/X8DTU-F User's Manual
Motherboard Features
CPU
Two Intel•
full-width Intel QuickPath Interconnect (QPI) links with a total of up to 51.2 GT/s
Data Transfer Rate (6.4 GT/s per direction)
®
5500 Series (LGA 1366) processors; each processor supports two
Memory
Twelve 240-pin DIMM sockets support up to 96 GB of DDR3 Registered ECC •
Memory (RDIMM modules are supported. See Section 2-4 in Chapter 2 for
DIMM Slot Population.)
Chipset
Intel 5520 chipset, including: the 5520 (North Bridge) and the ICH10R (South •
Bridge).
Expansion Slots
One PCI-E 2.0 x16 slot (J2: SXB1)•
One PCI-E 2.0 x8 slot (J1: SXB2)•
One PCI-E 2.0 x8 in x4 slot (J3: SXB3)•
BIOS
32 Mb AMI SPI Flash ROM•
PCI 2.3, ACPI 1.0/2.0/3.0, Plug and Play (PnP), DMI 2.3, USB Keyboard support, •
Hardware BIOS Monitoring, and SMBIOS 2.3
PC Health Monitoring
Onboard voltage monitors for CPU1 Vcore, CPU2 Vcore, 1.5V, 5V, 5VSB, 12V, •
-12V, 3.3Vcc, 3.3VSB, VBAT and Vtt.
Fan status monitor with fi rmware control
•
CPU/chass is temper ature moni tors•
Platfo rm Enviro nment Co ntrol Inte rf ace (PECI) read y•
Ther mal Mo nitor 2 ( TM2) supp or t•
CPU fan auto - of f in sle ep mode•
CPU slow- dow n on tempe rature over heat•
Pulse Wi dth Mo dulati on (PW M) Fan Contr ol •
CPU ther mal tr ip supp or t for pro ces sor pr otecti on, power L ED•
Power-up mod e cont rol for r ecover y fr om AC power l oss•
Auto- switc hing vol tage r egulato r for CPU c ore s•
System over heat /Fan Fail LED I ndic ator and c ontr ol•
Chassis i ntrus ion detec tion•
1-6
Chapter 1: Introduction
System re sourc e aler t vi a Super o Doc tor III•
ACPI Features
Slow blinking LED for suspend state indicator•
Main switch override mechanism•
ACPI Pow er Ma nag eme nt•
Keyboard Wakeup from Soft-off •
Onboard I/O
Intel ICH10R supports six SATA ports (with support of RAID0, RAID1, RAID10, •
RAID5 in the Windows OS Environment, and RAID 0, RAID 1, RAID 10 for the
Linux OS)
LA N por ts (L A N 1/LA N 2)
A PHY chip su ppor ts an I PMI _D edic ated L AN on th e X8DTU -F
•
One VGA Por t sup por ted by the W inbon d WPCM 450 B MC C ontrol ler•
Two COM p or ts(1 header, 1 por t)•
PS/2 mo use and PS /2 keyboa rd por ts•
Up to eight U SB 2.0 (Univers al Serial Bus) (2 Rear Por ts, 2 Front Header s, •
and 2 Type A Headers)
Super I/ O: Winbo nd W83 527HG
•
IPMI 1.5/ 2.0 wit h full K V M supp or t (X8 DTU- F onl y) •
Note: IPMI 1.5/2.0 is supported by the X8DTU-F. For more information on
IPMI confi guration, refer to the Embedded BMC IPMI User Guide @http://
www.supermicro.com/support/manuals/.
Other
Console redirection•
Onboa rd Fan Spee d Contr ol by Ther mal Ma nagem ent via BI OS•
CD/Diskette Utilities
BIOS fl ash upgrade utility and device drivers•
Dimensions
Propr ietar y 13.05" ( L) x 12.075" (W) (331.47 mm x 306.71 mm)•
1-7
X8DTU/X8DTU-F User's Manual
C
DDR3 DIMM
B
DDR3 DIMM
A
B
PROCESSOR#0
C
DDR3 DIMM
Gen2 x16
PCI-E X16
(Lane Reversal)
Gen2 x8
PCI-E x8
in x4 Slot
PCI-E x8
(Lane Reversal)
Gen2 x8
COMA
COMB
QPI
Port1
Ports
7,8,9,10
Ports
Ports
PCI
VGA
QPI
Intel 5520
5,6
ESI
3,4
ESI
USB
BMC
PROCESSOR#1
QPI
Port0
1,2
Ports
CLINK
CLINK
Ports
8,10
RJ45
Intel ICH10R
SATA
SATA 1
SATA 2
SATA 3
SATA 4
SATA 5
SATA 6
Gen2 x4
D
E
F
Intel 82576
RJ45
RJ45
SST
25VF016
SPI
PCIE Ports 1-6
LPC
SIO
W83527HG
PS2 KB/MS
E
DDR3 DIMM
USB
USB 0/1
USB 2/3
USB 4/5
USB 6/7
F
DDR3 DIMM
DDR3 DIMM
Block Diagram of the Intel 5520 Platform
Note: This is a general block diagram. See the previous Motherboard
Features pages for details on the features of each motherboard.
1-8
Chapter 1: Introduction
1-2 Chipset Overview
Built upon the functionality and the capability of the Intel 5520 platform, the
X8DTU/X8DTU-F motherboard provides the performance and feature set required
for dual-processor-based high-end systems with confi guration optimized for HPC/
Cluster servers and intensive applications. The 5520 platform consists of the
5500 Series (LGA 1366) processor, the 5520 (North Bridge), and the ICH10R
(South Br idge). With t he Intel Q uic kPath i nterc onne ct (QPI) c ontr olle r built in, t he
550 0 Series Pro cessor is the fi rst d ual-proc essing platf orm that offer s the next
generation point-to-point system interconnect interface which will greatly enhance
system performance by utilizing serial link interconnections, allowing for increased
bandwidth and scalability.
The IOH connects to each processor through an independent QuickPath Interconnect (QPI) link. Each link consists of 20 pairs of unidirectional differential lanes
for data t r a ns mi s s i o n in a dd it i o n to a d iffer e nt ia l f orwar d e d c l o c k. A f ul l -widt h Q PI
link pair provides 84 signals. Each processor supports two QuickPath links, one
going to t he other p roce ssor a nd the oth er to the 5 520 Nor th B rid ge.
The 552 0 chipset s uppor ts up t o 36 PCI E xpres s Gen2 la nes, pee r-to- peer r ead
and write transactions. The ICH10R provides up to 6 PCI-Express ports, six SATA
por ts and e ight US B conn ecti ons.
In addition, the 5520 chipset also offers a wide range of RAS (Reliability, Availability and Serviceability) features. These features include memory interface ECC, x4/
x8 Single Device Data Correction (SDDC), Cyclic Redundancy Check (CRC), parity
protection, out-of- band register access via SMBus, memory mirroring, memory
sparin g, and Hot -plu g suppo rt o n the PCI - Exp ress In ter face.
Main Features of the 5500 Series Processor and the 5520
Chipset
Four processor cores in each processor with 8MB shared cache among cores•
Two full-width Intel QuickPath interconnect (QPI) links, up to 6.4 GT/s of data •
transfer rate in each direction
Point-to-point cache coherent interconnect, Fast/narrow unidirectional links, and •
Concurrent bi-directional traffi c
Error detection via CRC and Error correction via Link level retry
•
1-9
X8DTU/X8DTU-F User's Manual
1-3 Special Features
Recovery from AC Power Loss
BIOS provides a setting for you to determine how the system will respond when AC
power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back
on) or for it to automatically return to a power- on state. See the Advanced BIOS
Setup section to change this setting. The default setting is Last State.
1-4 PC Health Monitoring
This section describes the PC health monitoring features of the X8DTU/X8DTU-F.
All have an onboard System Hardware Monitor chip that supports PC health monitoring. An onboard voltage monitor will scan these onboard voltages continuously:
CPU1 Vcore, CPU2 Vcore, 1.5V, 5V, 5VSB, 12V, -12V, 3.3Vcc, 3.3VSB, VBAT and
Vtt.. Once a voltage becomes unstable, a warning is given or an error message is
sent to the screen. Users can adjust the voltage thresholds to defi ne the sensitivity
of the voltage monitor.
Fan Status Monitor with Firmware Control
The PC health monitor can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management via BIOS (under
Hardware Monitoring in the Advanced Setting).
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn
on the thermal control fan whenever the CPU temperature exceeds a user-defi ned
threshold. The overheat circuitry runs independently from the CPU. Once it detects
that the CPU temperature is too high, it will automatically turn on the thermal fan
control to prevent any overheat damage to the CPU. The onboard chassis thermal
circuitry can monitor the overall system temperature and alert users when the chassis temperature is too high.
To avoid possible system overheating, please be sure to provide adequate
airfl ow to your system.
System Resource Alert
This feature is availab le when used with S upero Doctor III in the Windows OS
environment or used with Supero Doctor II in Linux. Supero Doctor is used to
1-10
Chapter 1: Introduction
notif y the user of cer tain system events. For example, you can also confi gure
Supero Doctor to provide you with warnings when the system temperature, CPU
temperat ures, volt ages a nd fan spe eds go beyon d a pre- defi ned range.
1-4 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi ca-
tion defi nes a fl exible and abstract hardware interface that provides a standard
way to integrate power management features throughout a PC system, including
its hardware, operating system and application software. This enables the system
to automatically turn on and off peripherals such as CD-ROMs, network cards, hard
disk drives and printers.
In addition to enabling operating system-directed power management, ACPI
provides a generic system event mechanism for Plug and Play and an operating
system-independent interface for confi guration control. ACPI leverages the Plug
and Play BIOS data structures while providing a processor architecture-independent
implementation that is compatible with both Windows 2003 and Windows 2008Operating Systems.
Slow Blinking LED for Suspend-State Indicator
When the CPU goes into a suspend state, the chassis power LED will start blinking
to indicate that the CPU is in suspend mode. When the user presses any key, the
CPU will wake-up and the LED will automatically stop blinking and remain on.
1-5 Power Supply
As with all computer products, a stable power source is necessary for proper and
reliable operation. It is even more important for processors that have high CPU
clock rates.
The X8DTU/X8DTU-F can accommodate 20-pin ATX power supplies. Although
most power supplies generally meet the specifi cations required by the CPU, some
are inadequate. In addition, two 12V 8-pin power connections are also required to
ensure adequate power supply to the system. Also your power supply must supply
1.5A for the Ethernet ports.
Warnings: 1. To prevent damage to the power supply or motherboard,
please use a power supply that contains a 20-pin and two 8-pin power
connectors. Be sure to connect these connectors to the 20-pin (JPW1)
and the two 8-pin (JPW2,JPW3) power connectors on the motherboard.
Failure in doing so will void the manufacturer warranty on your power supply and motherboard. 2. To provide adequate power to the add-on cards
1-11
X8DTU/X8DTU-F User's Manual
installed on the motherboard, please connect the UIOP PWR connector
to the power supply.
It is strongly recommended that you use a high quality power supply that meets ATX
power supply Specifi cation 2.02 or above. It must also be SSI compliant (For more
information, please refer to the web site at http://www.ssiforum.org/). Additionally, in
areas where noisy power transmission is present, you may choose to install a line
fi lter to shield the computer from noise. It is recommended that you also install a
power surge protector to help avoid problems caused by power surges.
1-6 Super I/O
The Super I/O supports two high-speed, 16550 compatible serial communication
ports (UARTs). Each UART includes a 16-byte send/receive FIFO, a programmable
baud rate generator, complete modem control capability and a processor interrupt
system. Both UARTs provide legacy speed with baud rate of up to 115.2 Kbps
as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Confi guration
and Power Interface), which includes support of legacy and ACPI power management through an SMI or SCI function pin. It also features auto power management
to reduce power consumption.
1-7 Overview of the Winbond WPCM450 Controller (For
X8DTU-F Only)
The Winbond WPCM450 Controller is a Baseboard Management Controller (BMC)
that supports the 2D/VGA-compatible Graphics Core with the PCI interface,
Virtual Media, and Keyboard/Video/Mouse Redirection (KVMR) modules. With
blade-oriented Super I/O capability built-in, the WPCM450 Controller is ideal for
legacy-reduced server platforms.
The WPCM450 interfaces with the host system via a PCI interface to communicate
with the Graphics core. It supports USB 2.0 and 1.1 for remote keyboard/mouse/
virtual media emulation. It also provides LPC interface to control Super IO functions. The WPCM450 is connected to the network via an external Ethernet PHY
module.
The WPCM450 communicates with onboard components via six SMBus interfaces,
fan control, and Platform Environment Control Interface (PECI) buses.
Note: For more information on IPMI confi guration, please refer to the
Embedded IPMI User's Guide posted on our website @ http://www.supermicro.com/support/manuals/.
1-12
Chapter 2: Installation
Chapter 2
Installation
2-1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. T o prevent damage to your system board, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
Use a grounded wrist strap designed to prevent static discharge.•
Touch a grounded metal object before removing the board from the antistatic •
bag.
Handle the board by its edges only; do not touch its components, peripheral
•
chips, memory modules or gold contacts.
When handling chips or modules, avoid touching their pins.
•
Put the motherboard and peripherals back into their antistatic bags when not •
in use.
For grounding purposes, make sure your computer chassis provides excellent
•
conductivity between the power supply, the case, the mounting fasteners and
the motherboard.
Use only the correct type of onboard CMOS battery as specifi ed by the
•
manufacturer. Do not install the onboard battery upside down to avoid possible
explosion.
Unpacking
The motherboar d is shipped i n a ntistati c pa ckaging to avoid static da mage. When
unpacking the board, make sure the person handling it is static protected.
2-1
X8DTU/X8DTU-F User's Manual
2-2 Motherboard Installation
All motherboards have standard mounting holes to fi t different types of chassis.
Make sure that the locations of all the mounting holes for both motherboard and
chassis match. Although a chassis may have both plastic and metal mounting
fasteners, metal ones are highly recommended because they ground the motherboard to the chassis. Make sure that the metal standoffs click in or are screwed in
tightly. Then use a screwdriver to secure the motherboard onto the motherboard
tray. Note: Some components are very close to the mounting holes. Please take
precautionary measures to prevent damage to these components when installing
the motherboard to the chassis.
Tools Needed
Phillips Screwdriver1.
Pan head #9 screws2.
Locations of Mounting Holes
X8DTU/-F
Installation
Instructions
Install the IO shield into the 1.
chassis.
Locate the mounting holes 2.
on the motherboard. Refer
to the layout above for
mounting hole locations.
Locate the matching mounting holes on the chassis. Align the mounting holes 3.
on the motherboard against the mounting holes on the chassis.
Install standoffs in the chassis as needed.4.
Install the motherboard into the chassis carefully to avoid damage to mother-5.
board components.
Warning: To avoid damaging the motherboard and its components, please
do not apply any force greater than 8 lb/sq.in (8 lbs. per square inch) when
installing a screw into a mounting hole.
Insert a Pan head #6 screw into a mounting hole on the motherboard and its 6.
matching mounting hole on the chassis, using a Phillips screwdriver.
Repeat Step 4 to insert #6 screws to all mounting holes.7.
Make sure that the motherboard is securely placed on the chassis.8.
2-2
2-3 Processor and Heatsink Installation
!
When handling the processor package, avoid placing direct pressure on
the label area of the fan.
Notes:
Always connect the power cord last and always remove it before adding, re-1.
moving or changing any hardware components. Make sure that you install the
processor into the CPU socket before you install the CPU heatsink.
Make sure to install the motherboard into the chassis before you install the 2.
CPU heatsink and heatsink fans.
When purchasing a 5500 Series processor or when receiving a motherboard 3.
with a 5500 Series processor pre-installed, make sure that the CPU plastic
cap is in place, and none of the CPU pins are bent; otherwise, contact the
retailer immediately.
Chapter 2: Installation
Refer to the M B Features S ecti on for mo re deta ils on CPU s uppor t.4.
Installing an LGA 1366 Processor
Press the socket clip to release 1.
the load plate, which covers the
CPU socket, from its locking
position.
Gently lift the socket clip to 2.
open the load plate.
Hold the plastic cap at its north 3.
and south center edges to remove it from the CPU socket.
Socket Clip
Plastic Cap
Load Plate
Hold the north & south edges of
the plastic cap to remove it
2-3
X8DTU/X8DTU-F User's Manual
After removing the plastic cap, 1.
using your thumb and the index
fi nger, hold the CPU at the
north and south center edges.
Align the CPU key, the semi-2.
circle cutout, against the socket
key, the notch below the gold
color dot on the side of the
socket.
Once both the CPU and the 3.
socket are aligned, carefully
lower the CPU straight down
into the socket. (Do not rub the
CPU against the surface of the
socket or its pins to avoid damaging the CPU or the socket.)
CPU CPU SocketLoad Plate
Socket Keys
With the CPU inside the socket, 4.
inspect the four corners of the
CPU to make sure that the CPU
is properly installed.
Once the CPU is securely 5.
seated on the socket, lower the
CPU load plate to the socket.
Use your thumb to gently push 6.
the socket clip down to the clip
lock.
Warning: Please s ave the
plastic cap. The motherboard must be shipped
with the plastic cap properly ins tal led to p rotec t the
CPU socket pins. Shipment without the plastic
cap properly installed will
cause damage to the socket pins.
CPU Keys
2-4
Installing a CPU Heatsink
Do not apply any thermal 1.
grease to the heatsink or the
CPU die because the required
amount has already been applied.
Chapter 2: Installation
Place the heatsink on top of the 2.
CPU so that the four mounting
holes are aligned with those on
the retention mechanism.
3. Install two diagonal screws (ie
the #1 and the #2 screws) and
tighten them until just snug (-do
not fully tighten the screws to
avoid possible damage to the
CPU.)
Screw#1
Screw#1
Install Screw#1
Screw#2
Screw#2
4. Finish the installation by fully
tightening all four screws.
2-5
X8DTU/X8DTU-F User's Manual
Removing the Heatsink
Warni ng: We do not recommend that the CPU or the heatsink be removed. However, if you do need to remove the heatsink, please follow
the inst ructions be low to uninstall th e heatsink and prevent da mage to
the CPU or ot her co mpone nts.
Unplug the power cord from the 1.
power supply.
Disconnect the heatsink fan 2.
wires from the CPU fan header.
Using a screwdriver, loosen and 3.
remove the heatsink screws
from the motherboard in the sequence as show in the picture
on the right.
Using a screwdriver to
remove Screw#1
Hold the heatsink as shown 4.
in the picture on the right and
gently wriggle the heatsink to
loosen it from the CPU. (Do not
use excessive force when wriggling the heatsink.)
Once the heatsink is loosened, 5.
remove it from the CPU socket.
To reinstall the CPU and the 6.
heatsink, clean the surface of
the CPU and the heatsink to get
rid of the old thermal grease.
Reapply the proper amount of
thermal grease on the surface
before reinstalling them on the
motherboard.
Remove Screw#2
2-6
Chapter 2: Installation
2-4 Memory Installation
Note: Check the S uper micro we b site for r ecom mende d memor y mo dules .
CAUTION
Exercise extreme care when installing or removing DIMM
module s to prevent any po ssib le damag e. Also n ote that th e
memor y is i nterl eaved to imp rove per fo rman ce (See ste p 1).
DIMM Installation
Insert the desired number of DIMMs into the memory slots, starting with 1.
P1-DIMM 1A. For best memory performance, please install memory modules
of the same type and same speed on the memory slots as indicated on the
tables below. (See the Memory Installation Table Below.)
Insert each DIMM module vertically into its slot. Pay attention to the notch 2.
along the bottom of the module to prevent inserting the DIMM module incorrectly.
Gently press down on the DIMM module until it snaps into place in the slot. 3.
Repeat for all modules.
Note 1: Memory speed support depends on the type of CPU used.
Note 2: Due to OS limitations, some operating systems may not show
more than 4 GB of memory.
Note 3: Due to memory allocation to system devices, the amount of
memory that r ema ins avai lab le fo r op erat io nal u se wi ll be r edu ce d wh en
4 GB of R A M is us ed. T he re duc tio n in me mor y ava ilab ili ty i s disp rop ortiona l. (See the fo llowi ng Mem or y Availabi lity Table.)
Possible System Memory Allocation & Availability
System DeviceSizePhysical Memory
Firmware Hub fl ash memory (System
BIOS)
Local APIC4 KB3.99 GB
Area Reserved for the chipset2 MB3.99 GB
I/O APIC (4 Kbytes)4 KB3.99 GB
PCI Enumeration Area 1256 MB3.76 GB
PCI Express (256 MB)256 MB3.51 GB
PCI Enumeration Area 2 (if needed)
-Aligned on 256-MB boundaryVGA Memory16 MB2.85 GB
TSEG1 MB2.84 GB
Memory available for the OS & other
applications
1 MB3.99 GB
512 MB3.01 GB
Remaining (-Available) (4 GB Total System
Memory)
2.84 GB
2-8
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